A wafer alignment system, a wafer bonding apparatus, and a wafer bonding alignment method.

Abstract

This application provides a wafer alignment system, a wafer bonding apparatus, and a wafer bonding alignment method. The wafer alignment system includes a hot plate, a limiting mechanism passing through the hot plate, and at least two auxiliary alignment mechanisms disposed on both sides of the hot plate. The limiting alignment mechanism includes at least two support components that together form a limiting region to support and limit the wafer. The support components can move up and down in a direction perpendicular to the hot plate. The auxiliary alignment mechanisms include a first support cantilever and a second support cantilever that support the wafer. The first support cantilever and the second support cantilever can rotate synchronously in opposite directions to enter and exit the limiting region. Through the design of the limiting mechanism and the auxiliary alignment mechanisms, this application can perform alignment operations on two wafers of the same size, facilitating the complete removal of air between the two wafers during vacuuming operations, thereby preventing the generation of air bubbles between the two wafers.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and in particular to a wafer alignment system, wafer bonding equipment and wafer bonding alignment method. Background Technology

[0002] Wafer bonding is a wafer-level packaging technology used in the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics, and optoelectronics to ensure mechanically stable and hermetically sealed packages. Typically, wafer bonding involves aligning the wafer with a substrate before bonding; therefore, ensuring reliable alignment between the wafer and substrate is a critical preliminary step in the wafer bonding process.

[0003] For wafers and carriers of the same size, during the alignment process in the bonding equipment's process chamber, multiple ejector pins with arc-shaped limiting parts on their inner sides typically hold the lower edge of the carrier. Then, a vacuum suction robot transfers the wafer above the carrier, and after calibration, the wafer is placed on the carrier surface. However, in traditional methods, the air between the wafer and the carrier cannot be completely removed during vacuuming, easily leading to the formation of air bubbles. Summary of the Invention

[0004] This application discloses a wafer alignment system, comprising: a hot plate; a limiting mechanism disposed on the hot plate, wherein the limiting mechanism includes at least two support components that together form a limiting region to support and limit the wafer, the support components being capable of vertical movement in a direction perpendicular to the hot plate; and at least two auxiliary alignment mechanisms symmetrically arranged on both sides of the hot plate, wherein the auxiliary alignment mechanisms include a first support cantilever and a second support cantilever for supporting the wafer, the first support cantilever and the second support cantilever being capable of synchronously rotating in opposite directions to enter and exit the limiting region.

[0005] The wafer alignment system disclosed in this application may further include a first driving mechanism, wherein the first driving mechanism drives the support assembly to move up and down in a direction perpendicular to the hot plate.

[0006] The wafer alignment system disclosed in this application has a support component including a support member and a pillar connected thereto, wherein the support member includes a sidewall that limits the wafer and a step that supports the wafer.

[0007] The wafer alignment system disclosed in this application further includes a second driving mechanism, wherein the second driving mechanism drives the first support cantilever and the second support cantilever to rotate.

[0008] The wafer alignment system disclosed in this application includes a second driving mechanism comprising: a first power unit, a fixed base, a movable block driven by the first power unit and moving vertically, a drive shaft connected to the movable block, a first rotating shaft and a second rotating shaft that respectively drive the first support cantilever and the second support cantilever to rotate, and a synchronization block; the sidewalls of the first rotating shaft and the second rotating shaft are symmetrically formed with helical guide grooves, and the synchronization block is symmetrically formed with guide ends extending into the helical guide grooves; the first rotating shaft and the second rotating shaft remain parallel during rotation.

[0009] The wafer alignment system disclosed in this application includes a synchronization block forming a passive shaft axially aligned with a drive shaft, and a connecting sleeve axially sleeved between the drive shaft and the passive shaft. The first drive mechanism further includes a retaining bracket that keeps the height of the first rotating shaft and the second rotating shaft constant in the vertical direction during rotation. The retaining bracket includes a support plate and two vertical plates arranged perpendicularly to and parallel to the support plate. A positioning block is formed on the opposing inner sides of the two vertical plates for the first rotating shaft and the second rotating shaft to pass through perpendicularly. The first bottom end of the first rotating shaft away from the first support cantilever and the second bottom end of the second rotating shaft away from the second support cantilever extend into the support plate. Bearings are sleeved between the first bottom end and the second bottom end and the support plate.

[0010] Based on the aforementioned wafer alignment system, this application also discloses a wafer bonding apparatus, comprising: a cavity, and a cover connected to the cavity, wherein the cavity and the cover house the wafer alignment system as described in any of the above embodiments. For example, wafer bonding apparatus for various wafer sizes such as 4-inch, 6-inch, 8-inch, and 12-inch.

[0011] Based on the aforementioned wafer bonding equipment, this application also discloses a wafer bonding alignment method, including:

[0012] The support assembly is raised to a first preset height, and the first support cantilever and the second support cantilever are rotated synchronously to outside the limiting area. The first wafer is placed on the support assembly, and the first wafer is located in the limiting area, wherein the support assembly supports and limits the first wafer.

[0013] The first and second support arms are rotated synchronously to the limiting area, and the second wafer is placed on the first and second support arms, such that the second wafer is located in the limiting area, wherein the first and second support arms support the second wafer, and the support assembly limits the second wafer.

[0014] The support assembly is lowered to a second preset height, so that the hot plate heats the first wafer and evacuates the cavity;

[0015] The support assembly is raised to a third preset height, which is less than or equal to the first preset height. Simultaneously, the first and second support cantilever arms are rotated to outside the limiting area, so that the second wafer falls onto the first wafer.

[0016] Compared with the prior art, the beneficial effects of this application are:

[0017] In this application, the wafer alignment system, through the design of a limiting mechanism and an auxiliary alignment mechanism, can perform alignment operations on two wafers of the same size. For two wafers to be bonded, it facilitates the removal of air between the two wafers during the vacuuming operation, thus preventing the generation of air bubbles between the two wafers. Based on the wafer alignment system, the wafer bonding equipment and corresponding bonding method can significantly improve the bonding quality. The first support arm and the second support arm rotate synchronously in opposite directions, thus creating two opposing frictional forces between the first and second support arms and the wafer placed on them. These two frictional forces cancel each other out, preventing the wafer from becoming airborne during the movement.

[0018] This application is applicable to wafer bonding equipment for various wafer sizes, such as 4-inch, 6-inch, 8-inch, and 12-inch. Attached Figure Description

[0019] Figure 1 This is a perspective view of a wafer alignment system according to an embodiment of this application.

[0020] Figure 2 This is a top view of a wafer alignment system according to an embodiment of this application.

[0021] Figure 3 This is a perspective view of a limiting mechanism according to an embodiment of this application.

[0022] Figure 4 This is a perspective view of a support column according to an embodiment of this application.

[0023] Figure 5 This is a perspective view of a wafer alignment system according to an embodiment of this application.

[0024] Figure 6 This is a perspective view of the second drive mechanism according to an embodiment of this application.

[0025] Figure 7 This is a partial perspective view of an auxiliary alignment mechanism according to an embodiment of this application.

[0026] Figure 8 This is a perspective view of a support component according to an embodiment of this application.

[0027] Figure 9 This is a schematic diagram of a wafer alignment system for placing a first wafer according to an embodiment of this application.

[0028] Figure 10 This is a schematic diagram of placing a first wafer and a second wafer in a wafer alignment system according to an embodiment of this application.

[0029] Figure 11 for Figure 10 A magnified view of a portion of the first and second support cantilever arms isolating the first and second wafers.

[0030] Figure 12 This is a schematic diagram of placing a first wafer and a second wafer in a wafer alignment system according to an embodiment of this application.

[0031] Figure 13 This is a schematic diagram of placing a first wafer and a second wafer in a wafer alignment system according to an embodiment of this application.

[0032] Figure 14 This is a schematic diagram of a wafer bonding apparatus including a wafer alignment system according to an embodiment of this application. Detailed Implementation

[0033] The present application will now be described in detail with reference to the embodiments shown in the accompanying drawings. However, it should be noted that these embodiments are not intended to limit the present application. All equivalent changes or substitutions in function, method, or structure made by those skilled in the art based on these embodiments are within the scope of protection of the present application.

[0034] It should be understood that in this application, the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," and "radial," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this technical solution and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this technical solution.

[0035] This application discloses a wafer alignment system, referring to... Figure 1 and Figure 2 As shown, the wafer alignment system includes: a hot plate 20, a limiting mechanism 30 passing through the hot plate 20, and at least two auxiliary alignment mechanisms 40 symmetrically arranged on both sides of the hot plate 20.

[0036] The limiting mechanism 30 includes at least two mechanisms that together form a limiting area 200 (see reference). Figure 2 The system includes a support assembly 32 for positioning and supporting the wafer, and a first drive mechanism 31 for driving the support assembly 32 to move up and down in a direction perpendicular to the hot plate 20. The positioning area 200 is for matching the wafer, preferably circular.

[0037] The auxiliary alignment mechanism 40 includes a first support cantilever 42 and a second support cantilever 43 that support the wafer, and a second drive mechanism 41 that drives the first support cantilever 42 and the second support cantilever 43 to rotate synchronously in opposite directions. The first support cantilever 42 and the second support cantilever 43 can move in and out of the limiting region 200 by rotation. Those skilled in the art will understand that when the first support cantilever 42 and the second support cantilever 43 move in and out of the limiting region 200, they naturally do not interfere with the limiting mechanism 30.

[0038] The number of auxiliary alignment mechanisms 40 in this application is preferably two, but of course, three or more auxiliary alignment mechanisms 40 can be designed according to design requirements, as long as the first support cantilever 42 and the second support cantilever 43 rotate into and out of the limiting area 200 and do not interfere with the limiting mechanism 30.

[0039] Figure 2 The first support arm 42 and the second support arm 43 of the auxiliary alignment mechanism 40 are in an open state, and the first support arm 42 and the second support arm 43 are outside the limiting area. Figure 1 The first support cantilever 42 and the second support cantilever 43 of the auxiliary alignment mechanism 40 are in a closed state, and the first support cantilever 42 and the second support cantilever 43 are within the limiting area. (See reference...) Figure 2 As shown, when the first support cantilever 42 moves from the closed state to the open state, it rotates along the direction of the dashed arrow b1; when the second support cantilever 43 moves from the closed state to the open state, it moves along the direction of the dashed line b2. That is, when the first support cantilever 42 and the second support cantilever 43 move from the closed state to the open state, they rotate along the direction of the dashed arrow b1. Figure 1 The state shown Figure 2 When the wafer moves as shown, it moves in opposite directions, creating two opposing frictional forces between the first support cantilever 42 and the second support cantilever 43 and the wafer. These two frictional forces cancel each other out, preventing the wafer from shifting during the movement. Similarly, when the first support cantilever 42 moves from the open state to the closed state, it rotates along the direction of the dashed arrow a1, and when the second support cantilever 43 moves from the open state to the closed state, it moves along the direction of the dashed line a2. The first support cantilever 42 and the second support cantilever 43 rotate synchronously in opposite directions, generating mutually canceling frictional forces.

[0040] Those skilled in the art should understand that the definition of opposite directions here is for the convenience of describing the motion state of the first support cantilever 42 and the second support cantilever 43. It can be understood that in the same plane, when one of them moves clockwise, the other moves counterclockwise, thereby forming two mutually canceling frictional forces to avoid causing wafer displacement during rotation.

[0041] The wafer alignment system of the present application is preferably applicable to a wafer bonding device. Referring to Figure 1 , it can be disposed, for example, in the cavity 10 of the wafer bonding device and penetrate through the support plate 11 in the cavity 10.

[0042] Refer to Figure 1 and Figure 3 shown. In this embodiment, the limiting mechanism 30 includes: four support components 32 that hold and support the wafer and are vertically arranged, a pallet 319 connecting the support components, and a first driving mechanism 31 that drives the pallet 319 to move up and down in the vertical direction. The entire first driving mechanism 31 drives the pallet 319 and the support components 32 to move up and down in the vertical direction of the double-headed arrow d in Figure 14 .

[0043] Refer to Figure 1 , Figure 3 and Figure 4 shown. The support component 32 includes a column 331 fixedly connected to the pallet 319, a supporting member 332 movably connected to the column 331. The supporting member 332 includes a side wall 3321 and a step 3322. The side wall 3321 can limit the wafer, so that the wafer falls within the limiting area 200. Those skilled in the art can understand that the side wall 3321 faces the center O of the limiting area 200 (refer to Figure 2 ), so that multiple support components 32 can form the limiting area 200. The step 3322 can support the wafer. When the wafer is placed on the support component 32, it is supported by the step 3322. The side wall 3321 is preferably an arc-shaped side wall to better limit the wafer. The steps 3322 respectively formed at the tops of the support components 32 are preferably located on the same horizontal plane, and the lengths of the columns 331 of the support components 32 to the support columns 36 are equal.

[0044] Those skilled in the art should understand that the shape of the supporting member 332 of the support component 32 in the present application can be variable, that is, the supporting member 332 at least includes a step 3322 for supporting the wafer and a side wall 3321 for limiting the wafer.

[0045] As an optional implementation manner, refer to Figure 8 shown. The present application also discloses another specific embodiment of the wafer alignment system. The main difference from the wafer alignment systems disclosed in the foregoing embodiments is that in this embodiment, only two support components 32 are required to implement the limiting area 200. The support component 32 includes a supporting member 342 and a column 341. The supporting member 342 includes a side wall 3421 and a step 3422. The bottom of the supporting member 342 is connected to two columns 341, and the lengths of the multiple columns 341 are equal and are connected to the pallet 319 as shown in Figure 3 .

[0046] Those skilled in the art will understand that Figure 8 Support component 342 and Figure 4 The support components 341 in the design can all provide support and limit the wafer, but their specific forms can be quite different. The support component 32 of the limiting mechanism 30 in this application is intended to provide support and limit the wafer. Support can be achieved through steps, while limiting can be achieved through sidewalls. The specific shape and arrangement can be flexibly set.

[0047] Similarly, those skilled in the art will understand that the specific number of columns can be flexibly varied according to actual design requirements, for example... Figure 8 The number of columns can also be adjusted to 1.

[0048] Regarding the specific number of support components 32, those skilled in the art should know that when the sidewall 3321 is preferably arc-shaped, at least two support components 32 are needed to enclose the limiting area; when the sidewall 3321 is planar, at least three support components 32 are needed to enclose the limiting area. In this application, a preferred number of four support components 32 is used, which balances cost with the desired wafer limiting and support functions.

[0049] Continue to refer to Figure 3 As shown, the first drive mechanism 31 may exemplarily include a first drive unit 311 (e.g., a cylinder or linear motor), a fixed seat 312, a sliding seat 313, a track and a slider (not shown) that moves linearly along the track are provided between the fixed seat 312 and the sliding seat 313. Since the sliding connection technology configured between the fixed seat 312 and the sliding seat 313 is a mature existing technology, it is not described in detail in this embodiment. Meanwhile, a bent portion 3121 is formed at the top of the fixed seat 312, and the bent portion 3121 is installed to the bottom of the support plate 11 by screws. A horizontally arranged mounting plate 314 is provided at the top of the sliding seat 313. A vertically arranged column 316 is provided on the mounting plate 314, and a column 317 is formed at the bottom of the support plate 319. The column 317 extends through the support plate 319 and is fixed by screws 3171. A connecting sleeve 3173 is axially sleeved between the column 316 and the column 317. When the first drive mechanism 31 moves in the vertical direction, it drives the sliding seat 313 to perform lifting and lowering motion relative to the fixed seat 312, and finally drives the pallet 319 to move in the vertical direction, so as to synchronously drive the four support columns to move in the vertical direction.

[0050] Reference Figure 1 and Figure 3 As shown, those skilled in the art will understand that the support component 3 continuously penetrates the hot plate 20 and the support plate 11 located below the hot plate 20, thereby allowing the support component 32 to the support column 36 to protrude from the upper surface of the hot plate 20.

[0051] Reference Figure 5 、 Figure 6 and Figure 7 As shown, in this embodiment, the second driving mechanism 41 includes: a first power unit 411 (such as a cylinder or a linear motor, etc.), a fixed seat 415, a moving block 412 driven by the first power unit 411 and performing a lifting action in the vertical direction, a driving shaft 417 connecting the moving block 412, a first rotating shaft 461 and a second rotating shaft 462 respectively driving the first support cantilever 42 and the second support cantilever 43 to rotate, and a synchronization block 48. Spiral guiding grooves 460 are symmetrically formed on the side walls of the first rotating shaft 461 and the second rotating shaft 462, and guiding ends 473 extending into the spiral guiding grooves 460 are symmetrically formed on the synchronization block 48. The first rotating shaft 461 and the second rotating shaft 462 remain parallel during rotation. Exemplarily, the first power unit 411 forms an air inlet interface 4116 and an air outlet interface 4117. Compressed air is introduced into the first power unit 411, which drives the moving block 412 to perform a linear motion along the shaft 440.

[0052] The fixed seat 415 performs a linear motion along Figure 4 the direction of the central axis 410 to drive the moving block 412 to perform a linear motion along the direction of the axis 410. A bending portion 4151 is formed at the top of the fixed seat 415, and the bending portion 4151 is fixedly connected to the bottom plate 15 by screws, and the bottom plate 15 is part of the base 10; a baffle 4152 is formed at the bottom of the fixed seat 415. The moving block 412 is slidably connected to a guide rail 414 which is perpendicular to the side of the fixed seat 415 facing the slider 413 through a slider 413. The moving block 412 is connected to the driving shaft 417, and a diameter-reduced end 4171 longitudinally inserted into the mounting seat 418 is formed at the free end of the driving shaft 417. The driving shaft 417 sleeves the mounting seat 418, and the mounting seat 418 is fixed to the support plate 11 by screws. A corrugated pipe 416 is axially clamped between the mounting seat 418 and the moving block 412. The driving shaft 417 vertically extends out of the mounting seat 418, and a retaining ring 4172 is embedded in the mounting seat 418 to limit the axial displacement of the driving shaft 417 along the direction of the axis 410.

[0053] As Figure 7As shown, the synchronizing block 48 forms a passive shaft 419 axially aligned with the drive shaft 417, and a connecting sleeve 4173 is axially sleeved between the drive shaft 417 and the passive shaft 419. The passive shaft 419 extends vertically through the synchronizing block 48 and is fixed by a nut 4191. The synchronizing block 48 is connected to the guide end 473 extending into the spiral guide groove 460 by two bending members 47. The first rotating shaft 461 and the second rotating shaft 462 symmetrically form a spiral guide groove 460 in the vertical direction. The bending member 47 includes a first bending portion 471 connecting the first rotating shaft 461 (or the second rotating shaft 462) and a second bending portion 472 connecting the synchronizing block 48. The first bending portion 471 forms a pin (not shown) axially connected to the guide end 473. When the first power unit 411 drives the drive shaft 417 to move up and down along the shaft 410, the guide end 473 is driven to move in the spiral guide groove 460 in a synchronized manner through the synchronizing block 48, so as to drive the first support cantilever 42 and the second support cantilever 43 to open or close synchronously.

[0054] For example, the reference Figure 7 As shown, the first rotating shaft 461 and the second rotating shaft 462 have the same structure, and the first support cantilever 42 and the second support cantilever 43 have the same structure. Therefore, in this embodiment, the first rotating shaft 461 and the first support cantilever 42 are used as examples. The top of the first rotating shaft 461 forms a notch 422, and the first support cantilever 42 includes a sheet-like body 420. The end of the first support cantilever 42 away from the tapered end forms a mounting end that fits into the notch 422. The first support cantilever 42 and the first rotating shaft 461 are movably mounted, and the first support cantilever 42 and the second support cantilever 43 can be replaced as needed.

[0055] The second drive mechanism 41 further includes a retaining bracket that keeps the height of the first rotating shaft 461 and the second rotating shaft 462 constant in the vertical direction during rotation. The retaining bracket includes: a support plate 45; two upright plates 451 perpendicular to the support plate 45 and parallel to and perpendicular to the horizontal plane; positioning blocks 4511 are formed on the opposing inner sides of the two upright plates 451 for the first rotating shaft 461 and the second rotating shaft 462 to pass vertically through them; the two positioning blocks 4511 are opposite each other and located inside the first rotating shaft 461 and the second rotating shaft 462. The bottom free end 4611 of the first rotating shaft 461 away from the first supporting cantilever 42 and the bottom free end 4621 of the second rotating shaft 462 away from the second supporting cantilever 43 extend into the support plate 45. Bearings 466 are sleeved between the bottom free ends 4611 and 4621 and the support plate 45, thereby allowing the first rotating shaft 461 and the second rotating shaft 462 to rotate within the two support plates 45. It should be noted that... Figure 13 The two supporting plates 45 can also form an integral structure.

[0056] Based on the specific implementation of the wafer alignment system disclosed in the foregoing embodiments, the present application also discloses a wafer bonding device.

[0057] As shown in Figure 1 That is, Figure 14 the present application discloses a wafer bonding device, including a cavity 10 and an openable and closable cover 70 connected to the cavity, which houses the wafer alignment system disclosed in any of the foregoing specific embodiments. The wafer bonding device described in the present application can be a wafer bonding device of various sizes such as 4 inches, 6 inches, 8 inches, 12 inches, etc.

[0058] The present application Figure 14 [[ID=​​​​​​​​​​​​​​​​​​​​​​​​​​​​ Figure 1 As shown and Figure 9 As shown, the second drive mechanism 41 drives the first support cantilever 42 and the second support cantilever 43 to rotate synchronously to the second state; as Figure 10 As shown, the second wafer 60 is placed on the first support cantilever 42 and the second support cantilever 43 on both sides of the hot plate, and the second wafer is ensured to be located in the circular limiting area 200 enclosed by the limiting mechanism 30, so that the first wafer 50 and the second wafer 60 are distributed in a concentric circle shape when viewed from above.

[0065] The second state here can be a closed state, that is, the first support cantilever 42 and the second support cantilever 43 should rotate synchronously to within the limit area 200 so as to provide support for the second wafer 60.

[0066] Reference Figure 11 As shown, the limiting component 32 of the limiting mechanism 30 simultaneously limits both the first wafer 50 and the second wafer 60, thus ensuring that the first wafer 50 and the second wafer 60 are concentrically arranged; the limiting component 32 of the limiting mechanism 30 only supports the first wafer 50, and the second support cantilever 43 only supports the second wafer 60, thereby creating a partial space between the first wafer 50 and the second wafer 60.

[0067] Step 3, refer to Figure 12 The limiting component 32 of the limiting mechanism 30 descends synchronously to the second preset height under the drive of the first driving mechanism 31, and preheats the first wafer 50 through the hot plate 20. At the same time, a vacuuming action is performed to extract the air in the bonding cavity 10 to form a vacuum state in the bonding cavity 10. Here, those skilled in the art should know that the cover 7 and the cavity 10 should be in a closed state at this time in order to perform the vacuuming action.

[0068] Here, those skilled in the art should understand that the second preset height can be adjusted according to actual conditions, as long as it ensures that the first wafer 50 descends to a certain height and can be well heated by the heating plate 20. Preferably, the second preset height allows the first wafer 50 to fully contact the heating plate 20, thereby obtaining the best heating effect.

[0069] In this step, the hot plate 20 preheats the first wafer 50. The first wafer 50 and / or the second wafer 60 to be bonded have been pre-coated with bonding adhesive before the aforementioned steps one to three. Preheating the first wafer 50 can reduce the generation of bubbles in the bonding adhesive in the subsequent bonding process and improve the bonding quality.

[0070] Step four, refer to Figure 13The limiting component 12 of the limiting mechanism 30 rises synchronously to a third preset height under the drive of the first driving mechanism 31. The third preset height is less than or equal to the first preset height. The second driving mechanism 41 synchronously drives the first support cantilever 42 and the second support cantilever 43 to rotate to the first state, that is, to enter the limiting area, so that the second wafer 60 falls on the first wafer 50 and the second wafer 60 and the first wafer 50 are in a close fit state.

[0071] Subsequently, bonding operations can be performed on the first wafer 50 and the second wafer 60.

[0072] Here, the third preset height is preferably equal to the first preset height, so that the second wafer 60 is always in the limiting area defined by the limiting mechanism 30 during the falling process, thereby ensuring that the centers of the first wafer 50 and the second wafer 60 can remain concentric.

[0073] Optionally, the first wafer 50 is a semiconductor wafer, such as a silicon-based wafer or a gallium nitride wafer; the second wafer 60 is a carrier wafer, such as glass, sapphire, or silicon carbide. The second wafer 60 serves as a substrate to provide support for the first wafer 50. Optionally, the first wafer 50 and the second wafer 60 can also be homogeneous wafers, that is, both the first wafer 50 and the second wafer 60 are semiconductor wafers; furthermore, both the first wafer 50 and the second wafer 60 can be standard-thickness silicon-based wafers, or both can be thinned silicon-based wafers, or the first wafer 50 can be a thinned silicon-based wafer while the second wafer 60 is a standard-thickness silicon-based wafer, etc.

[0074] The detailed descriptions listed above are merely specific descriptions of feasible implementation methods of this application and are not intended to limit the scope of protection of this application. All equivalent implementation methods or modifications made without departing from the spirit of the art of this application should be included within the scope of protection of this application.

[0075] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this application. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0076] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A wafer alignment system, characterized in that, include: Hot plate; A limiting mechanism is provided on the hot plate, wherein the limiting mechanism includes at least two support components that together form a limiting area to support and limit the wafer, and the support components can move up and down in a direction perpendicular to the hot plate; At least two auxiliary alignment mechanisms are symmetrically arranged on both sides of the hot plate. The auxiliary alignment mechanism includes a first support cantilever and a second support cantilever for supporting the wafer. The first support cantilever and the second support cantilever can rotate synchronously in opposite directions to enter and exit the limiting area.

2. The wafer alignment system according to claim 1, characterized in that, The limiting mechanism further includes a first driving mechanism, wherein the first driving mechanism drives the support component to move up and down in a direction perpendicular to the hot plate.

3. The wafer alignment system according to claim 1, characterized in that, The support assembly includes a support member and a column connected thereto, wherein the support member includes a sidewall that limits the wafer and a step that supports the wafer.

4. The wafer alignment system according to claim 2, characterized in that, The auxiliary alignment mechanism further includes a second drive mechanism, wherein the second drive mechanism drives the first support cantilever and the second support cantilever to rotate.

5. The wafer alignment system according to claim 4, characterized in that, The second drive mechanism includes: A first power unit, a fixed base, a movable block driven by the first power unit to move up and down in the vertical direction, a drive shaft connected to the movable block, a first rotating shaft and a second rotating shaft that drive the first support cantilever and the second support cantilever to rotate respectively, and a synchronization block; The first rotating shaft and the second rotating shaft have symmetrical spiral guide grooves formed on their sidewalls, and the synchronizing block has symmetrical guide ends extending into the spiral guide grooves. The first rotating shaft and the second rotating shaft remain parallel during rotation.

6. The wafer alignment system according to claim 5, characterized in that, The synchronizing block forms a passive shaft that is axially connected to the drive shaft, and a connecting sleeve is axially sleeved between the drive shaft and the passive shaft; The first drive mechanism further includes a retaining bracket that keeps the height of the first rotating shaft and the second rotating shaft constant in the vertical direction during rotation; The retaining bracket includes: a support plate, two upright plates perpendicular to and parallel to the support plate, and positioning blocks formed on the opposing inner sides of the two upright plates for the first rotating shaft and the second rotating shaft to pass through perpendicularly. The first bottom end of the first rotating shaft away from the first supporting cantilever and the second bottom end of the second rotating shaft away from the second supporting cantilever extend into the support plate. Bearings are sleeved between the first bottom end and the second bottom end and the support plate.

7. A wafer bonding apparatus, characterized in that, include: A cavity, and a cover connected to the cavity, wherein the cavity and the cover house the wafer alignment system as described in any one of claims 1 to 6.

8. A wafer bonding alignment method using the wafer bonding equipment of claim 7, characterized in that, include: The support assembly is raised to a first preset height, and the first support cantilever and the second support cantilever are rotated synchronously to outside the limiting area. The first wafer is placed on the support assembly, and the first wafer is located in the limiting area, wherein the support assembly supports and limits the first wafer. The first support cantilever and the second support cantilever are rotated synchronously to the limiting area, and the second wafer is placed on the first support cantilever and the second support cantilever, such that the second wafer is located in the limiting area, wherein the first support cantilever and the second support cantilever support the second wafer, and the support assembly limits the second wafer; The support assembly is lowered to a second preset height, so that the hot plate heats the first wafer and evacuates the cavity; The support assembly is raised to a third preset height, which is less than or equal to a first preset height. Simultaneously, the first support cantilever and the second support cantilever are rotated outside the limiting area, so that the second wafer falls onto the first wafer.

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