Rotary mechanism for semiconductor heat treatment apparatus and semiconductor heat treatment apparatus

Abstract

The application provides a rotary mechanism for a semiconductor heat treatment equipment and the semiconductor heat treatment equipment, and the semiconductor heat treatment equipment further comprises a wafer boat, and the rotary mechanism comprises: a support part for bearing the wafer boat, the support part being provided with a first limiting part; a driving shaft for driving the support part to rotate, the driving shaft being provided with a second limiting part, the first limiting part and the second limiting part being detachably inserted and matched, the inserted and matched first limiting part and second limiting part are used for achieving driving matching in the circumferential direction; and a stopper being inserted and matched with the support part and the driving shaft simultaneously to limit the position of the first limiting part and the second limiting part from being separated from the inserted and matched position. The rotary mechanism of the application realizes installation and dismounting between the support part and the driving shaft through detachable insertion, and through the use of the inserted and matched mode of a large size, the originally small size threaded matching connection mode is replaced, the stability of the matching relationship can be ensured, and the jamming can be effectively avoided.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing, and more specifically, to a rotary mechanism for semiconductor heat treatment equipment and semiconductor heat treatment equipment. Background Technology

[0002] Semiconductor heat treatment equipment is a core component of integrated circuit manufacturing, suitable for various processes such as oxidation, annealing, and thin film growth during integrated circuit manufacturing. Among these, the vertical reactor is a type of semiconductor heat treatment equipment.

[0003] like Figure 1 As shown, the vertical reactor includes a chamber body, a process gate assembly, a rotary mechanism, and a wafer boat. The chamber body is fastened to the process gate assembly and encloses a process space. The rotary mechanism is rotatably mounted on the process gate assembly and is used to place the wafer boat. During the processing, the wafer boat is placed on the rotary mechanism, which drives the wafer boat to rotate within the process space, thereby ensuring that the wafers on the wafer boat are heated uniformly.

[0004] The existing vertical reactor's rotary mechanism mainly consists of a drive shaft and a support plate. The support plate is located within the process space, and the drive shaft and support plate are fixedly connected by bolts and threaded holes, allowing the drive shaft to drive the support plate to rotate. During the process, the temperature inside the process chamber repeatedly rises and falls. This causes the external threads of the bolts and the internal threads of the threaded holes to repeatedly expand and contract with the temperature changes, leading to jamming or adhesion between the internal and external threads. This makes it impossible to separate the drive shaft and support plate, requiring forced separation, resulting in damage or scrapping of components and causing significant difficulties for equipment maintenance. Summary of the Invention

[0005] The present invention aims to at least solve the problem in the prior art that components of the rotary mechanism stick together during use and cannot be disassembled normally, which easily causes damage or scrap of the components. The present invention proposes a rotary mechanism for semiconductor heat treatment equipment and semiconductor heat treatment equipment.

[0006] To achieve the objectives of this invention, a rotary mechanism for a semiconductor heat treatment apparatus is provided. The semiconductor heat treatment apparatus further includes a crystal boat. The rotary mechanism includes: a support portion for supporting the crystal boat, the support portion having a first limiting portion; a drive shaft for driving the support portion to rotate, the drive shaft having a second limiting portion, the first limiting portion and the second limiting portion being detachably inserted into each other, the insertion and engagement of the first limiting portion and the second limiting portion being used to achieve a circumferential driving engagement; and a stop member that is simultaneously inserted into the support portion and the drive shaft to limit the position where the first limiting portion and the second limiting portion disengage from the insertion and engagement.

[0007] Optionally, the support portion has a bearing surface for supporting the crystal boat, and the first limiting portion is disposed on the side of the support portion away from the bearing surface. The first limiting portion includes a plurality of limiting teeth, which are circumferentially spaced. The drive shaft has a first end face facing the support portion, and the second limiting portion includes a plurality of limiting grooves disposed on the first end face. The limiting grooves match the limiting teeth, and the limiting grooves and limiting teeth are configured in a one-to-one correspondence.

[0008] Optionally, the stop is detachably connected to the support and the drive shaft; when the stop is disengaged from the support and the drive shaft, the support and the drive shaft are rotatable relative to each other; the support rotates relative to the drive shaft to drive the limiting tooth to move, so that the limiting tooth can engage or disengage from the limiting groove.

[0009] Optionally, the support portion has a first rotation direction and a second rotation direction relative to the drive shaft, the first rotation direction being opposite to the second rotation direction; the support portion rotates relative to the drive shaft along the first rotation direction to make the limiting tooth engage with the limiting groove; the support portion rotates relative to the drive shaft along the second rotation direction to make the limiting tooth disengage from the limiting groove.

[0010] Optionally, the support portion has a first rotation direction and a second rotation direction relative to the drive shaft, the first rotation direction being opposite to the second rotation direction; the limiting groove has a first limiting surface that engages with the limiting tooth; at the position where the limiting tooth engages with the limiting groove, the limiting tooth and the first limiting surface abut against each other to restrict the limiting tooth from rotating in the first rotation direction; when the drive shaft rotates along the second rotation direction, the first limiting surface applies a driving force along the second rotation direction to the limiting tooth to drive the support portion to rotate in the same direction.

[0011] Optionally, the limiting groove has a first groove wall, the surface of the first groove wall forms the first limiting surface, and the first limiting surface forms an acute angle α with the bottom surface of the limiting groove.

[0012] Optionally, the limiting groove also has a second groove wall corresponding to the first groove wall in the circumferential direction, the second groove wall and the bottom of the limiting groove forming an obtuse angle β, and the surface of the second groove wall forming a guide surface for guiding the limiting tooth to engage or disengage from the limiting groove.

[0013] Optionally, the limiting tooth is a ratchet, and the ratchet has a second limiting surface that matches the first limiting surface. At the position where the limiting tooth and the limiting groove are inserted and engaged, the first limiting surface and the second limiting surface abut against each other.

[0014] Optionally, the support portion is provided with a first limiting hole, which extends axially from the bearing surface to the side of the support portion away from the bearing surface; a second limiting hole corresponding to the first limiting hole is provided on the first end face of the drive shaft connection end, and the stop member is simultaneously inserted into the first limiting hole and the second limiting hole to restrict the relative rotation of the support portion and the drive shaft.

[0015] Optionally, the first limiting hole and the second limiting hole are located on the rotation axis of the drive shaft, and the radial section of the stop is non-circular. The radial sections of the first limiting hole and the second limiting hole match the radial section of the stop to restrict the relative rotation of the support part and the drive shaft.

[0016] Optionally, the support portion has a bearing surface for supporting the crystal boat, and the first limiting portion is disposed on the side of the support portion away from the bearing surface. The first limiting portion includes a plurality of limiting grooves, which are circumferentially spaced. The drive shaft has a connecting end facing the support portion, and the second limiting portion includes a plurality of limiting teeth disposed on the end face of the connecting end. The limiting grooves match the limiting teeth, and the limiting grooves and limiting teeth are configured in a one-to-one correspondence.

[0017] According to a second aspect of the present invention, a semiconductor thermal processing apparatus is also disclosed, comprising: a reaction chamber having an opening structure; a process gate assembly disposed at the opening structure for sealing the reaction chamber; a crystal boat disposed within the reaction chamber; and the aforementioned rotary mechanism, wherein the rotary mechanism is rotatably disposed on the process gate assembly, the crystal boat is disposed on the rotary mechanism, and the rotary mechanism is used to drive the crystal boat to rotate.

[0018] The rotary mechanism of this invention, by providing a first limiting part and a second limiting part, detachably inserts and engages with each other, enabling the installation and disassembly of the support part and the drive shaft. Because the mating surfaces of the first and second limiting parts are relatively smooth after insertion and engagement, and there are no small-sized mating threads, both the first and second limiting parts expand at high temperatures and contract when the temperature decreases. Therefore, under high temperatures and repeated temperature fluctuations, the first and second limiting parts will not repeatedly compress against each other, effectively preventing them from sticking and jamming. Furthermore, by providing a stop, the stability of the first and second limiting parts in the insertion and engagement position is ensured, thereby improving the reliability of the connection between the drive shaft and the support part. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of a semiconductor heat treatment device in the prior art;

[0020] Figure 2 This is a schematic diagram of the structure of the rotary mechanism according to an embodiment of the present invention;

[0021] Figure 3 This is a schematic diagram of the structure of the support portion of the rotary mechanism according to an embodiment of the present invention;

[0022] Figure 4 This is a perspective view of the support portion of the rotary mechanism according to an embodiment of the present invention;

[0023] Figure 5 This is a schematic diagram of the drive shaft of the rotary mechanism according to an embodiment of the present invention;

[0024] Figure 6 This is a schematic diagram of the structure of the support portion of the rotary mechanism in an embodiment of the present invention, showing the limiting teeth in the first position.

[0025] Figure 7 This is a schematic diagram of the structure of the support portion of the rotary mechanism in an embodiment of the present invention, showing the limiting teeth in the second position.

[0026] Figure 8a This is a schematic diagram illustrating the installation process of the support portion and drive shaft of the rotary mechanism according to an embodiment of the present invention. Figure 1 ;

[0027] Figure 8b This is a schematic diagram illustrating the installation process of the support portion and drive shaft of the rotary mechanism according to an embodiment of the present invention. Figure 2 ;

[0028] Figure 8c This is a schematic diagram illustrating the installation process of the support portion and drive shaft of the rotary mechanism according to an embodiment of the present invention. Figure 3 ;

[0029] Figure 9a This is a schematic diagram illustrating the disassembly process of the support portion and drive shaft of the rotary mechanism according to an embodiment of the present invention. Figure 1 ;

[0030] Figure 9b This is a schematic diagram illustrating the disassembly process of the support portion and drive shaft of the rotary mechanism according to an embodiment of the present invention. Figure 2 ;

[0031] Figure 9c This is a schematic diagram illustrating the disassembly process of the support portion and drive shaft of the rotary mechanism according to an embodiment of the present invention. Figure 3 ;

[0032] Figure 10 for Figure 6 A magnified view of part A in the middle;

[0033] Figure 11This is a schematic diagram of the limiting groove of the drive shaft of the rotary mechanism according to an embodiment of the present invention;

[0034] Figure 12 for Figure 11 A magnified view of part B in the middle section;

[0035] Figure 13 This is a schematic diagram of the structure of the stop member of the rotary mechanism according to an embodiment of the present invention;

[0036] Figure 14 This is a schematic diagram of the structure of a semiconductor heat treatment device according to an embodiment of the present invention;

[0037] List of reference numerals in the attached diagram:

[0038] 10. Support part; 11. Bearing surface; 12. First limiting hole; 13. Bottom surface; 14. Connecting boss; 20. First limiting part; 21. Limiting tooth; 211. Second limiting surface; 30. Drive shaft; 31. First end face; 32. Second limiting hole; 40. Second limiting part; 41. Limiting groove; 411. First limiting surface; 412. Guide surface; 413. Groove bottom surface; 50. Stop; 51. Body; 52. Limiting boss; 53. Handle; 100. Reaction chamber; 200. Process door assembly; 210. Process door; 220. Support arm; 300. Crystal boat. Detailed Implementation

[0039] To enable those skilled in the art to better understand the technical solution of the present invention, the rotary mechanism and the semiconductor heat treatment equipment provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0040] Semiconductor heat treatment equipment is a core piece of equipment in integrated circuit manufacturing. It is suitable for various processes such as oxidation, annealing, and thin film growth in integrated circuit manufacturing. Among them, the vertical reactor is a type of semiconductor heat treatment equipment.

[0041] like Figure 1 As shown, the vertical reactor includes: a chamber body 1, a process door assembly 2, a rotary mechanism 3, and a crystal boat 4. The chamber body 1 is fastened to the process door assembly 2 and forms a process space. The rotary mechanism 3 is rotatably mounted on the process door assembly 2 and is used to drive the crystal boat 4 to rotate. In use, the crystal boat 4 is placed on the rotary mechanism 3, and the rotary mechanism 3 can drive the crystal boat 4 to rotate within the process space, thereby ensuring that the wafers on the crystal boat 4 are heated uniformly.

[0042] The process door assembly 2 includes a process door 5 and a support arm 6 connected below the process door 5. The rotary mechanism 3 mainly includes a drive shaft 7 and a support plate 8. The drive shaft 7 is rotatably connected to the support arm 6 and extends through to the top of the process door 5, and is fixedly connected to the support plate 8 located above the process door 5, so that the drive shaft 7 drives the support plate 8 to rotate.

[0043] It should be noted that in conventional vertical reactors, to ensure reliable connections, the drive shaft 7 and the support plate 8 are provided with threaded holes, and a fixed connection is achieved by connecting the two threaded holes with bolts. However, during the heat treatment process, the temperature inside the chamber body 1 can reach 700℃ to 1000℃, and in some cases, the temperature inside the chamber body 1 can even reach 1200℃. Under such high temperature conditions, in addition to testing the materials of the components, higher requirements are also placed on the connection method between the components inside the chamber body 1.

[0044] During the process within chamber 1, repeated temperature increases and decreases cause the connections between components to expand and contract repeatedly with these temperature fluctuations. This is especially true for small-sized threaded connections, where the external thread rotates into the gap between the internal and external threads to form a fit. Therefore, when the temperature inside chamber 1 is high, the external thread of the bolt and the internal thread of the bolt hole expand due to the high temperature, reducing the gap between the internal threads and thus compressing the external thread. Similarly, the gap between the external threads also decreases, simultaneously compressing the internal threads. In other words, the internal and external threads deform against each other. After the process is completed, the temperature inside chamber 1 decreases, causing the external thread of the bolt and the internal thread of the bolt hole to contract due to the cooling. With the repeated temperature increases and decreases within chamber 1, the external thread of the bolt and the internal thread of the bolt hole repeatedly expand and contract, resulting in repeated compression between the threads. Ultimately, this alters the fit between the internal and external threads, leading to jamming and inability to disassemble. Once components are jammed or stuck, they can only be removed by destructive methods, causing damage or scrapping of the components and creating significant difficulties for equipment maintenance. During equipment maintenance, the quartz boat support plate 8 and the slewing device could not be disassembled.

[0045] To avoid the above problems, such as Figure 2 The embodiment of the present invention shown discloses a rotary mechanism for a semiconductor heat treatment apparatus. The semiconductor heat treatment apparatus can be a vertical reactor and also includes a crystal boat 300. The rotary mechanism includes a support portion 10, a drive shaft 30, and a stop member 50. The support portion 10 is used to support the crystal boat 300. Figure 2(Not shown in the image), the support part 10 has a first limiting part 20; the drive shaft 30 is used to drive the support part 10 to rotate, and the drive shaft 30 has a second limiting part 40. The first limiting part 20 and the second limiting part 40 are detachably inserted and engaged. The support part 10 and the drive shaft 30 achieve a circumferential drive engagement through the insertion of the first limiting part 20 and the second limiting part 40; the stop member 50 is detachably inserted and engaged with both the support part 10 and the drive shaft 30 to limit the position where the first limiting part 20 and the second limiting part 40 are disengaged from the insertion engagement.

[0046] During assembly, the first limiting part 20 and the second limiting part 40 are inserted into each other, forming a driving engagement between the support part 10 and the drive shaft 30 in the circumferential direction. This allows the support part 10 to rotate via the drive shaft 30. Simultaneously, the stop 50 keeps the first limiting part 20 and the second limiting part 40 in the inserted engagement position to prevent them from disengaging, thus ensuring the reliability of the connection between the support part 10 and the drive shaft 30. When disassembly is required, the stop 50 is removed to release its locking mechanism on the first limiting part 20 and the second limiting part 40, allowing them to disengage from the inserted engagement position and thus separating the support part 10 from the drive shaft 30.

[0047] It should be noted that plug-in mating refers to the mating method between structures such as holes and pins, grooves and teeth, and grooves and protrusions. Unlike threaded connections, the above structures are all large-sized mating surfaces that mate with each other after plugging in, and the surfaces of the mating surfaces are relatively smooth. There are no small-sized mating structures like those in threads. Therefore, even in high-temperature and repeated temperature rise and fall environments, the problem of high-temperature jamming and sticking will not occur as with threaded mating.

[0048] The rotary mechanism of the present invention, by providing a first limiting part 20 and a second limiting part 40, allows for detachable insertion and connection between the first limiting part 20 and the second limiting part 40, enabling the installation and disassembly of the support part 10 and the drive shaft 30. Since the mating surfaces of the first limiting part 20 and the second limiting part 40 are relatively smooth after insertion, and there are no small-sized threaded connections, both the first limiting part 20 and the second limiting part 40 expand at high temperatures and contract when the temperature decreases. Therefore, under high temperatures and repeated temperature fluctuations, the first limiting part 20 and the second limiting part 40 will not repeatedly press against each other, effectively preventing them from sticking and jamming together. Furthermore, by providing a stop 50, the stability of the first limiting part 20 and the second limiting part 40 in the insertion and connection position is ensured, thereby improving the reliability of the connection between the drive shaft 30 and the support part 10.

[0049] The following is combined with Figures 2 to 13 The rotary mechanism for semiconductor heat treatment equipment of the present invention will be described in detail below.

[0050] like Figure 3 As shown, the support portion 10 is a support disk, and has a axial section for supporting the crystal boat 300. Figure 3 The bearing surface 11 (not shown) and the lower bottom surface 13 are shown, with the lower bottom surface 13 facing away from the bearing surface 11. Please refer to [link / reference]. Figure 3 A connecting boss 14 is provided at the rotation center position of the lower bottom surface 13 of the support part 10. The connecting boss 14 extends axially, and a first limiting part 20 is provided on the connecting boss 14. Figure 4 As shown, in this embodiment, the first limiting part 20 includes a plurality of limiting teeth 21, each limiting tooth 21 extending axially and connected to the connecting boss 14. The plurality of limiting teeth 21 are circumferentially spaced.

[0051] like Figure 5 As shown, the drive shaft 30 has a first end face 31 facing the support portion 10. The second limiting portion 40 includes a plurality of limiting grooves 41 disposed on the first end face 31. The limiting grooves 41 match the limiting teeth 21, and the limiting grooves 41 and the limiting teeth 21 are arranged in a one-to-one correspondence. By adopting a one-to-one correspondence between multiple limiting teeth 21 and limiting grooves 41 and their mutual insertion and engagement, the disassembly and assembly process is simplified while the stability of the connection is improved. Moreover, the design of large-sized limiting teeth and limiting grooves ensures the stability of the structural dimensions and prevents jamming problems caused by temperature rise and fall.

[0052] The stop 50 is detachably connected to the support 10 and the drive shaft 30. The stop 50 can be simultaneously engaged with the support 10 and the drive shaft 30, or simultaneously disengaged from the support 10 and the drive shaft 30.

[0053] When the stop 50 is simultaneously engaged with the support 10 and the drive shaft 30, the first limiting part 20 and the second limiting part 40 can be kept in the engaged position to prevent them from disengaging from the limiting position, thereby improving the reliability of the connection between the support 10 and the drive shaft 30.

[0054] When the stop 50 is disengaged from both the support 10 and the drive shaft 30, the support 10 and the drive shaft 30 are rotatable relative to each other. The support 10 rotates relative to the drive shaft 30 to move the limiting tooth 21 so that the limiting tooth 21 can engage or disengage from the limiting groove 41.

[0055] Therefore, when disassembly is required, the stop 50 can be removed first to release the stop 50 from limiting and locking the first limiting part 20 and the second limiting part 40, so that the first limiting part 20 and the second limiting part 40 can be disengaged from the insertion and engagement position, thereby disengaging the first limiting part 20 and the second limiting part 40 from each other, and thus separating the support part 10 from the drive shaft 30.

[0056] Specifically, the limiting tooth 21 has a first position and a second position on its moving path. For example... Figure 6 As shown, at the first position on the moving path of the limiting tooth 21, the limiting tooth 21 is inserted into and limited by the limiting groove 41. The limiting tooth 21 and the limiting groove 41, through the limiting engagement, cause the drive shaft 30 to drive the support part 10 to rotate. Figure 7 As shown, at the second position on the moving path of the limiting tooth 21, the limiting tooth 21 disengages from the limiting groove 41, and in the axial direction of the drive shaft 30, the support part 10 moves away from the drive shaft 30. Figure 7 Moving the first axis direction can disengage the limiting tooth 21 from the limiting groove 41.

[0057] like Figures 8a to 8c As shown, during assembly, the support part 10 rotates relative to the drive shaft 30 in the first rotation direction, causing the limiting tooth 21 to engage with the limiting groove 41. The specific assembly process is as follows:

[0058] like Figure 8a As shown, first align the limiting tooth 21 with the limiting groove 41, and then, in the axial direction of the drive shaft 30, move the support part 10 towards the drive shaft 30. Figure 8a Move along the second axis direction to position the limiting tooth 21 as shown. Figure 8b The second position is shown. After the limiting tooth 21 is in the second position, the support part 10 moves along the relative drive shaft 30. Figure 8b The first rotation direction is rotated, and at the same time, the support part 10 will continue to rotate along... Figure 8b The second axis direction is moved, causing the limiting tooth 21 to move from the second position to the position shown. Figure 8c The first position is shown. After the limiting tooth 21 is in the second position, the stop 50 is inserted and engaged with the support part 10 and the drive shaft 30 to complete the axial limiting and complete the assembly.

[0059] like Figures 9a to 9c As shown, during disassembly, the support part 10 rotates relative to the drive shaft 30 in the second rotation direction, causing the limiting tooth 21 to disengage from the limiting groove 41. The specific disassembly process is as follows:

[0060] First, remove the stop 50 to release its restriction on the axis of the support 10 and the drive shaft 30, allowing the support 10 to move relative to the drive shaft 30 along... Figure 9aThe second rotation direction is rotated. After removing the stop 50, as... Figure 9a As shown, the support portion 10 rotates relative to the drive shaft 30 in a second rotational direction, and simultaneously, in the direction of the axis of the drive shaft 30, the support portion 10 moves away from the drive shaft 30. Figure 9a The first axis direction is moved, causing the limiting tooth 21 to move from the first position to the position shown. Figure 9b As shown in the second position, after moving to the second position, continue to move the support part 10 along... Figure 9b The first axis direction is moved, so that the limiting tooth 21 and the limiting groove 41 are completely disengaged (e.g., Figure 9c (As shown) Disassembly is complete.

[0061] It is understood that in the above embodiments, the first rotation direction is opposite to the second rotation direction, the first rotation direction is counterclockwise, and the second rotation direction is clockwise; the first axis direction and the second axis direction are opposite. It is easy to see from the installation and disassembly process of the support part 10 and the drive shaft 30 that during assembly, the support part 10 needs to be rotated relative to the drive shaft 30 in the first rotation direction. Since the rotation directions of the support part 10 and the drive shaft 30 are opposite, the drive shaft 30 can also be rotated relative to the support part 10 in the second rotation direction during assembly. Correspondingly, during disassembly, the support part 10 needs to be rotated relative to the drive shaft 30 in the second rotation direction, or the drive shaft 30 can be rotated in the first rotation direction. In the heating process of semiconductor heat treatment equipment, the rotary mechanism mostly rotates clockwise, which is the second rotation direction in this invention. Therefore, during the rotation of the drive shaft 30, the limiting tooth 21 and the limiting groove 41 form a self-locking mechanism, thereby ensuring that the drive shaft 30 and the support part 10 always maintain a driving engagement during the operation of the rotary mechanism.

[0062] like Figure 10 As shown, the limiting groove 41 has a first limiting surface 411 that cooperates with the limiting tooth 21. In the first position of the limiting tooth 21, the limiting tooth 21 abuts against the first limiting surface 411. The limiting groove 41 restricts the limiting tooth 21 from rotating in the first rotation direction through the first limiting surface 411. When the drive shaft 30 rotates in the second rotation direction, the limiting groove 41 applies a driving force in the second rotation direction to the limiting tooth 21 through the first limiting surface 411, so as to drive the support part 10 to rotate in the same direction.

[0063] Please combine Figure 5 and Figure 12The limiting groove 41 has a first groove wall and a groove bottom. The groove bottom surface (i.e., groove bottom surface 413) of the limiting groove 41 is parallel to the radial surface of the drive shaft 30. The direction of the first groove wall intersects the direction of the outer peripheral wall of the drive shaft 30. The surface of the first groove wall forms a first limiting surface 411, and the first limiting surface 411 and the groove bottom surface 413 of the limiting groove 41 form an acute angle α. At the first position of the limiting tooth 21, since the first limiting surface 411 and the groove bottom surface 413 form an acute angle α, the first limiting surface 411 can not only limit the limiting tooth 21 along... Figure 12 The first rotation direction of the middle can be rotated, and at the same time, the limiting tooth 21 can be restricted along the direction. Figure 12 The first axis direction is moved. That is, by making the first limiting surface 411 form an acute angle α with the groove bottom surface 413, the first limiting surface 411 on the first groove wall can apply force to the limiting tooth 21. Figure 12 The force in the second rotational direction and the second axial direction can achieve circumferential limiting as well as axial limiting, while the bottom surface 413 of the groove can move along... Figure 12 The first axis direction provides stable support to the limiting tooth 21. Using this limiting method, it can be seen that if the limiting tooth 21 moves along... Figure 12 To move along the first axis direction, the limiting tooth 21 must be positioned relative to the limiting groove 41 along... Figure 12 The second direction of rotation, that is, the support part 10 rotates relative to the drive shaft 30 along... Figure 12 The second direction of rotation is controlled by the stop 50, which precisely restricts the relative rotation between the support 10 and the drive shaft 30, thereby effectively ensuring the stability of the insertion and engagement of the limiting tooth 21 and the limiting groove 41.

[0064] It should be noted that although the included angle α is an acute angle in this embodiment, this is not limiting. In some other embodiments not shown in the figure, the included angle α can also be a right angle. As long as it is an angle that allows the limiting tooth 21 to form a limiting angle in the first rotation direction after it abuts against the first limiting surface 411, it is within the protection scope of this invention.

[0065] like Figure 12 As shown, the limiting groove 41 also has a second groove wall corresponding to the first groove wall in the circumferential direction. An obtuse angle β is formed between the second groove wall and the bottom of the limiting groove 41. The surface of the second groove wall forms a guide surface 412 that guides the limiting tooth 21 to move between the first and second position components, thereby guiding the limiting tooth 21 to engage or disengage from the limiting groove 41. Specifically, by providing the guide surface 412, during assembly, the guide surface 412 can guide the limiting tooth 21 along... Figure 12The first rotation direction of the limiting tooth 21 is rotated, thereby moving the limiting tooth 21 from the second position to the first position. Correspondingly, during disassembly, the guide surface 412 can guide the limiting tooth 21 from the first position to the second position, thus facilitating the disengagement of the limiting tooth 21 from the limiting groove 41. By setting the guide surface 412, the limiting tooth 21 can be guided, making the assembly and disassembly process of the limiting tooth 21 and the limiting groove 41 smoother and improving assembly efficiency. Moreover, since the guide surface 412 forms an obtuse angle with the bottom of the groove, the size of the groove opening can be larger, facilitating the insertion of the limiting tooth 21.

[0066] like Figure 10 As shown, the limiting tooth 21 is a ratchet, which has a second limiting surface 211 that matches the first limiting surface 411. At the first position of the limiting tooth 21, which is the position where the limiting tooth 21 engages with the limiting groove 41, the first limiting surface 411 and the second limiting surface 211 abut against each other. The limiting tooth 21 is a ratchet, and through the abutment of the second limiting surface 211 of the ratchet with the first limiting surface 411, the first limiting surface 411 and the second limiting surface 211 interact, allowing the first limiting surface 411 to limit the second limiting surface 211 in both the first rotational direction and the first axial direction. Simultaneously, through action and reaction forces, the first limiting surface 411 can also apply a force in the second rotational direction to the second limiting surface 211, so that when the drive shaft 30 rotates in the second direction, it drives the support part 10 to rotate in the same direction. By setting the second limiting surface 211, the limiting tooth 21 and the limiting groove 41 can fit more closely, thereby improving the stability and reliability of the connection.

[0067] like Figure 4 As shown, the support portion 10 is provided with a first limiting hole 12, which extends axially from the bearing surface 11 to the side of the support portion 10 opposite to the bearing surface 11. Figure 5 As shown, a second limiting hole 32 corresponding to the first limiting hole 12 is provided on the first end face 31 of the drive shaft 30 connection end. The stop member 50 is simultaneously inserted into the first limiting hole 12 and the second limiting hole 32 to restrict the relative rotation of the support part 10 and the drive shaft 30. By restricting the relative rotation of the support part 10 and the drive shaft 30, the limiting groove 41 and the limiting tooth 21 can be fixed in the first position, thereby making the fit between the limiting groove 41 and the limiting tooth 21 more secure and reliable.

[0068] The first limiting hole 12 and the second limiting hole 32 are located on the rotation axis of the drive shaft 30. The radial cross-section of the stop 50 is non-circular. The radial cross-sections of the first limiting hole 12 and the second limiting hole 32 match the radial cross-section of the stop 50 to restrict the relative rotation between the support part 10 and the drive shaft 30. In this embodiment, the radial cross-section of the stop 50 is elongated, with arc-shaped ends in the length direction, thereby forming a limiting structure in the circumferential direction. However, this is not limiting. In some other embodiments not shown in the figure, the cross-section of the stop 50 can also be rectangular, triangular, polygonal, or irregularly shaped. Any structure that can restrict the relative circumferential rotation between the drive shaft 30 and the support part 10 is within the protection scope of this invention.

[0069] like Figure 13 As shown, to facilitate the installation and removal of the stop 50, in this embodiment, the stop 50 is a limiting pin, which includes a body 51, a limiting boss 52, and a handle 53. The body 51 is disposed within the first limiting hole 12 and the second limiting hole 32, and forms a circumferential limiting fit with the first limiting hole 12 and the second limiting hole 32 through the body 51. The limiting boss 52 is disposed at one end of the body 51 and abuts against the support part 10 to prevent the limiting pin from being completely inserted into the first limiting hole 12 and unable to be removed. The handle is connected to the limiting boss 52 to facilitate installation and removal operations.

[0070] It should be noted that in the above embodiments, the first limiting part 20 comprises a plurality of limiting teeth 21, and the second limiting part 40 comprises limiting grooves 41 corresponding one-to-one with the limiting teeth 21. However, this is not limiting. In some other embodiments not shown in the figures, the structure is the same as the above embodiments, except that in other embodiments, the first limiting part 20 includes a plurality of limiting grooves 41, which are circumferentially spaced; the second limiting part 40 includes a plurality of limiting teeth 21 disposed on the end face of the connecting end, the limiting grooves 41 match the limiting teeth 21, and the limiting grooves 41 and the limiting teeth 21 are disposed one-to-one. Without departing from the inventive concept and working principle of the present invention, the above structure also falls within the protection scope of the present invention.

[0071] like Figure 14As shown, the present invention also discloses a semiconductor thermal processing apparatus, including: a reaction chamber 100, a process gate assembly 200, a crystal boat 300, and the aforementioned rotary mechanism. The reaction chamber 100 has an opening at its bottom; the process gate assembly 200 is disposed at the opening and is used to seal the reaction chamber 100; the rotary mechanism is rotatably disposed on the process gate assembly 200, and the crystal boat 300 is disposed on the rotary mechanism, which drives the crystal boat 300 to rotate. The process gate assembly 200 includes: a process gate 210 and a support arm 220. The support part 10 is located above the process door 210. The process door 210 has a through hole. The drive shaft 30 passes through the through hole of the process door 210 and is rotatable relative to the process door 210. One end of the drive shaft 30 is connected to the support part 10, and the other end of the drive shaft 30 is driven and connected to the output shaft of the motor. The support arm 220 is located below the process door 210 and is fixedly connected to the process door 210. The support arm 220 has a hollow structure. The drive shaft 30 passes through the support arm 220 and is rotatably connected to the support arm 220 through a bearing.

[0072] During assembly, the first limiting part 20 of the support part 10 is inserted into the second limiting part 40 of the drive shaft 30, so that the first limiting part 20 and the second limiting part 40 form a self-locking mechanism in the rotation direction of the drive shaft 30. Therefore, when the drive shaft 30 rotates, it can drive the support part 10 to rotate in the same direction, thereby driving the crystal boat 300 to rotate via the support part 10. By providing a stop member 50, relative rotation between the support part 10 and the drive shaft 30 is prevented, ensuring the stability and reliability of the insertion and engagement of the first limiting part 20 and the second limiting part 40.

[0073] The semiconductor heat treatment equipment of the present invention, through a rotary mechanism, enables the installation and disassembly of the support part 10 and the drive shaft 30 by detachably inserting and engaging the first limiting part 20 and the second limiting part 40. Since the mating surfaces of the first limiting part 20 and the second limiting part 40 are relatively smooth after insertion, and there are no small-sized threaded connections, both the first limiting part 20 and the second limiting part 40 expand at high temperatures and contract when the temperature decreases. Therefore, under high temperatures and repeated temperature fluctuations, the first limiting part 20 and the second limiting part 40 will not repeatedly squeeze against each other, effectively preventing them from sticking and jamming together. Furthermore, by providing a stop member 50, the stability of the first limiting part 20 and the second limiting part 40 in the insertion and engagement position is ensured, thereby improving the reliability of the connection between the drive shaft 30 and the support part 10.

[0074] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A rotary mechanism for a semiconductor heat treatment apparatus, characterized in that, The semiconductor heat treatment equipment further includes a crystal boat (300), and the rotation mechanism is disposed in the process chamber of the semiconductor heat treatment equipment where the temperature is repeatedly raised and lowered, and includes: A support portion (10) is used to support the crystal boat (300), and the support portion (10) has a first limiting portion (20). A drive shaft (30) is used to drive the support (10) to rotate. The drive shaft (30) has a second limiting part (40). The first limiting part (20) and the second limiting part (40) are detachably plugged into each other. The plugging and engaging of the first limiting part (20) and the second limiting part (40) is used to realize the driving engagement in the circumferential direction. The stop (50) is simultaneously engaged with the support (10) and the drive shaft (30) to limit the first limiting part (20) from disengaging from the second limiting part (40). The first limiting part (20) includes a plurality of limiting teeth (21), which are circumferentially spaced. The drive shaft (30) has a first end face (31) facing the support (10), and the second limiting part (40) includes a plurality of limiting grooves (41) disposed on the first end face (31). The limiting grooves (41) and the limiting teeth (21) are matched to form a surface fit, and the limiting grooves (41) and the limiting teeth (21) are arranged in a one-to-one correspondence.

2. The rotary mechanism according to claim 1, characterized in that, The support portion (10) has a bearing surface (11) for supporting the crystal boat (300), and the first limiting portion (20) is disposed on the side of the support portion (10) away from the bearing surface (11).

3. The rotary mechanism according to claim 2, characterized in that, The stop (50) is detachably connected to the support (10) and the drive shaft (30); When the stop (50) is disengaged from the support (10) and the drive shaft (30), the support (10) and the drive shaft (30) are rotatable relative to each other; The support (10) rotates relative to the drive shaft (30) to drive the limiting tooth (21) to move, so that the limiting tooth (21) can be engaged or disengaged from the limiting groove (41).

4. The rotary mechanism according to claim 3, characterized in that, The support (10) has a first rotation direction and a second rotation direction relative to the drive shaft (30), wherein the first rotation direction is opposite to the second rotation direction; The support part (10) rotates relative to the drive shaft (30) in the first rotation direction, so that the limiting tooth (21) and the limiting groove (41) are engaged. The support part (10) rotates relative to the drive shaft (30) in the second rotation direction, causing the limiting tooth (21) to disengage from the limiting groove (41).

5. The rotary mechanism according to claim 3, characterized in that, The support (10) has a first rotation direction and a second rotation direction relative to the drive shaft (30), wherein the first rotation direction is opposite to the second rotation direction; The limiting groove (41) has a first limiting surface (411) that cooperates with the limiting tooth (21). At the position where the limiting tooth (21) and the limiting groove (41) are inserted and engaged, the limiting tooth (21) and the first limiting surface (411) abut against each other to restrict the limiting tooth (21) from rotating in the first rotation direction. When the drive shaft (30) rotates in the second rotation direction, the first limiting surface (411) applies a driving force in the second rotation direction to the limiting tooth (21) to drive the support part (10) to rotate in the same direction.

6. The rotary mechanism according to claim 5, characterized in that, The limiting groove (41) has a first groove wall, and the surface of the first groove wall forms the first limiting surface (411). The first limiting surface (411) and the bottom surface (413) of the limiting groove (41) form an acute angle α.

7. The rotary mechanism according to claim 6, characterized in that, The limiting groove (41) also has a second groove wall corresponding to the first groove wall in the circumferential direction. The second groove wall forms an obtuse angle β with the bottom of the limiting groove (41). The surface of the second groove wall forms a guide surface (412) for guiding the limiting tooth (21) to engage or disengage from the limiting groove (41).

8. The rotary mechanism according to claim 5, characterized in that, The limiting tooth (21) is a ratchet, and the ratchet has a second limiting surface (211) that matches the first limiting surface (411). At the position where the limiting tooth (21) and the limiting groove (41) are inserted and engaged, the first limiting surface (411) and the second limiting surface (211) abut against each other.

9. The rotary mechanism according to claim 2, characterized in that, The support part (10) is provided with a first limiting hole (12), which extends axially from the bearing surface (11) to the side of the support part (10) away from the bearing surface (11); The first end face (31) of the drive shaft (30) is provided with a second limiting hole (32) corresponding to the first limiting hole (12). The stop (50) is inserted into both the first limiting hole (12) and the second limiting hole (32) to restrict the relative rotation of the support (10) and the drive shaft (30).

10. The rotary mechanism according to claim 9, characterized in that, The first limiting hole (12) and the second limiting hole (32) are located on the rotation axis of the drive shaft (30). The radial section of the stop (50) is non-circular. The radial sections of the first limiting hole (12) and the second limiting hole (32) match the radial section of the stop (50) to restrict the relative rotation of the support (10) and the drive shaft (30).

11. The rotary mechanism according to claim 1, characterized in that, The support portion (10) has a bearing surface (11) for bearing the crystal boat (300), and the first limiting portion (20) is disposed on the side of the support portion (10) away from the bearing surface (11). The first limiting portion (20) includes a plurality of limiting grooves (41), and the plurality of limiting grooves (41) are circumferentially spaced. The drive shaft (30) has a connecting end facing the support (10), and the second limiting part (40) includes a plurality of limiting teeth (21) disposed on the end face of the connecting end. The limiting groove (41) matches the limiting teeth (21), and the limiting groove (41) and the limiting teeth (21) are respectively configured to correspond one-to-one.

12. A semiconductor heat treatment apparatus, characterized in that, include: The reaction chamber (100) has an open structure; A process gate assembly (200) is disposed at the opening structure location for sealing the reaction chamber (100). A crystal boat (300) is disposed within the reaction chamber (100); According to any one of claims 1 to 11, the rotary mechanism is rotatably disposed on the process gate assembly (200), the crystal boat (300) is disposed on the rotary mechanism, and the rotary mechanism is used to drive the crystal boat (300) to rotate.

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