Complementary metal oxide semiconductor (CMOS) process fully-integrated high-voltage horn driving chip

Abstract

The invention relates to the technical field of high-voltage horn driving circuits, in particular to a CMOS (complementary metal oxide semiconductor) process fully-integrated high-voltage horn driving chip, which is integrated with an LDO (low dropout regulator) module, a lock fuse module, a logic control module and a driving module, and is characterized in that the output end of the LDO module is connected with the input ends of the lock fuse module, the logic control module and the driving module; the input end of the logic control module is used for receiving an input signal from the lock fuse module, and the control end of the driving module is used for receiving a control signal generated by the logic control module, processing and converting the signal and then providing the input signal for the loudspeaker. The high-voltage CMOS circuit is integrated on a chip, compared with a traditional discrete component circuit, static power consumption is effectively reduced, burning of a driving tube under high voltage is avoided through a signal time sequence control circuit according to a built-in dead zone detection circuit, and the stability and reliability of the circuit are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of high-voltage speaker driving circuits, and in particular to a CMOS fully integrated high-voltage speaker driving chip. Background Art

[0002] In the field of high-voltage speaker drive circuits, traditional drive methods have many limitations; for example, traditional high-voltage speaker drive circuits (such as Figure 1 As shown in the figure, two discrete PNP and NPN tubes are usually used to achieve this, and in order to meet the internal 5V working voltage requirement, a high-voltage triode process has to be used to achieve speaker driving; therefore, this traditional circuit structure has some obvious disadvantages: 1. The use of discrete components makes the static power consumption of the circuit larger, which increases the energy consumption of the entire system and does not meet the requirements of modern electronic equipment for low power consumption.

[0003] 2. Due to the lack of an effective protection mechanism, under high-voltage conditions, the driver tube is prone to common-state conduction, which can easily cause the driver tube to burn out, seriously affecting the stability and reliability of the circuit, and increasing the maintenance cost and failure risk of the equipment. Summary of the invention

[0004] The present invention provides a CMOS fully integrated high-voltage speaker driver chip to solve the problems raised in the above background technology.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is: A CMOS fully integrated high-voltage speaker driver chip, the driver chip integrates an LDO module, a lasefuse module, a logic control module and a driver module, the output end of the LDO module is connected to the input ends of the lasse fuse module, the logic control module and the driver module, the input end of the logic control module is used to receive an input signal from the lasse fuse module, the control end of the driver module is used to receive a control signal generated by the logic control module, and provide an input signal to the speaker after processing and converting the signal.

[0006] Preferably, the lase fuse module selects the chip input type as single input.

[0007] Preferably, the lase fuse module selects the chip input type as dual input.

[0008] Preferably, the logic control module includes a dead zone detection circuit, which prevents the MOS tubes in the driving module from being turned on in a common state through a signal timing control circuit.

[0009] Preferably, the signal timing control circuit is a delay circuit and an overlap circuit.

[0010] Preferably, the driver chip has 6 I / O ports, including high voltage VCC, GND, a signal input terminal and three signal output terminals OUTN, OUTP, and VLDO.

[0011] Preferably, the LDO module is connected to the high voltage VCC via one of the I / O ports, and the LDO module is used to convert the high voltage into a normal voltage to supply power for the normal operation of the internal circuit.

[0012] Preferably, the logic control module is also used to receive a periodic pulse signal of a clock signal CLK.

[0013] Preferably, the driving module outputs a driving signal through OUTN and OUTP.

[0014] Preferably, the driver chip adopts sot23-6 packaging.

[0015] By adopting the above technical solution, the beneficial effects achieved by the present invention are: In the present invention, an LDO module, a laser fuse module, a logic control module and a driving module are integrated on the same chip, so that a high-voltage CMOS circuit is integrated on the chip, which effectively reduces static power consumption and reduces system energy consumption compared with a circuit of traditional discrete components; and according to a built-in dead zone detection circuit, a delay circuit and an overlap circuit are used to avoid burning of a driving tube under high voltage, thereby improving the stability and reliability of the circuit; and at the same time, a simple sot23-6 package is used to realize speaker driving and reference voltage functions, thereby reducing the use of external components, improving the integration of the circuit, meeting the requirements of modern electronic products for energy saving, compactness and integration, and improving user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of an existing high-voltage speaker driving circuit.

[0017] Figure 2 It is a schematic diagram of the circuit principle of the present invention.

[0018] In the figure: 1. LDO module; 2. Lase fuse module; 3. Logic control module; 4. Driver module. DETAILED DESCRIPTION

[0019] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0020] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments of the following disclosure.

[0021] like Figure 2 As shown, the present invention provides a CMOS process fully integrated high-voltage speaker driver chip, the driver chip integrates an LDO module 1, a laser fuse module 2, a logic control module 3 and a driver module 4, the output end of the LDO module 1 is connected to the laser fuse module 2, the logic control module 3 and the input end of the driver module 4, the chip or circuit design selected by the LDO module 1 adjusts the parameters according to the input voltage range and the voltage requirement of the internal circuit to ensure the stability and accuracy of the output voltage, the input end of the logic control module 3 is used to receive the input signal from the laser fuse module 2, the control end of the driver module 4 is used to receive the control signal generated by the logic control module 3, and provide a specific input signal to the speaker after processing and converting the signal, and the power and waveform of the input signal provided by the driver module 4 to the speaker are designed according to the characteristics and driving requirements of the speaker, which can be skillfully used by those skilled in the art.

[0022] Among them, based on the CMOS process, the LDO module 1, the lase fuse module 2, the logic control module 3 and the driving module 4 are integrated into the same chip, and the LDO module 1, the lase fuse module 2, the logic control module 3 and the driving module 4 need to be connected to the GND unit to establish a stable potential reference to ensure the correct transmission and processing of each signal in the circuit.

[0023] As a further feature, the lase fuse module 2 can select the chip input type as single input or dual input, wherein a fuse or logic circuit is set inside the chip through the lase fuse module 2 to realize the input type selection function. The user can select the chip input type as single input or dual input according to actual needs through external control signals or specific programming methods.

[0024] As a further feature, the logic control module 3 includes a dead zone detection circuit, which prevents the MOS tubes in the driving module 4 from being turned on in common mode through a signal timing control circuit, thereby preventing the driving tubes from burning out under high voltage. The signal timing control circuit includes a delay circuit and an overlap circuit, and the parameter settings of the delay circuit and the overlap circuit are optimized and adjusted according to the operating frequency and load characteristics of the circuit to ensure that the MOS tubes can be effectively turned on in common mode under different working conditions.

[0025] Furthermore, the driver chip has 6 I / O ports, including high voltage VCC, GND, signal input and three signal output terminals OUTN, OUTP and VLDO. The driver chip adopts sot23-6 package. The speaker driving and reference voltage functions are realized by using simple sot23-6 package. Therefore, this packaging method not only simplifies the circuit layout and reduces the cost, but also meets the input and output requirements of different signals, and improves the integration and versatility of the circuit.

[0026] As a further step, the LDO module 1 is connected to the high voltage VCC through one of the I / O ports. The LDO module 1 is used to convert the high voltage into a normal voltage to supply power for the normal operation of the internal circuit. As a power supply guarantee module for the entire circuit, the LDO module 1 is used to stably convert the input high voltage into a voltage suitable for the normal operation of the internal circuit, provide stable power support for other modules, and ensure that each module can operate normally under appropriate voltage conditions.

[0027] As a further feature, the logic control module 3 is also used to receive a periodic pulse signal of the clock signal CLK, wherein the periodic pulse of CLK is used to synchronize and control the operation timing of the internal circuit.

[0028] As a further feature, the driving module 4 outputs a driving signal through OUTN and OUTP.

[0029] The functional characteristics of the driver chip of the present invention are: 1) Compared with the circuit of traditional discrete components, this solution uses the integrated high-voltage CMOS circuit on the chip to replace the traditional transistor drive circuit, which effectively reduces the static power consumption and the energy consumption of the system, meets the energy-saving requirements of modern electronic equipment, and helps to extend the battery life of the equipment or reduce the overall operating cost; 2) Built-in dead zone detection circuit, through delay circuit and overlap circuit, avoids the burning of driver tube under high voltage, improves the stability and reliability of the circuit, and effectively reduces the equipment damage and maintenance times caused by driver tube failure, improving user experience; 3) The simple sot23-6 package is used to realize the speaker driving and reference voltage functions, and the 6 I / O ports of the chip are used to undertake different input and output tasks respectively. Therefore, this packaging method has the advantages of small size and low cost while realizing the functions, which meets the development trend of modern electronic products for compactness and integration.

[0030] It should be noted that after packaging is completed, the chip needs to be comprehensively tested, including functional testing, performance testing, stability testing, etc.; test the chip's working conditions under different input voltages, input types and load conditions to ensure that the chip can meet the design requirements and that various performance indicators meet the expected standards.

[0031] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A CMOS fully integrated high-voltage speaker driver chip, characterized in that: The driver chip integrates an LDO module (1), a lase fuse module (2), a logic control module (3) and a driver module (4); the output end of the LDO module (1) is connected to the input ends of the lase fuse module (2), the logic control module (3) and the driver module (4); the input end of the logic control module (3) is used to receive an input signal from the lase fuse module (2); the control end of the driver module (4) is used to receive a control signal generated by the logic control module (3), and to process and convert the signal before providing an input signal to the speaker.

2. The CMOS fully integrated high-voltage speaker driver chip according to claim 1, characterized in that: The lase fuse module (2) selects the chip input type as single input.

3. The CMOS process fully integrated high-voltage speaker driver chip according to claim 1, characterized in that: The lase fuse module (2) selects the chip input type as dual input.

4. The CMOS fully integrated high-voltage speaker driver chip according to claim 1, characterized in that: The logic control module (3) comprises a dead zone detection circuit, which prevents the MOS tubes in the driving module (4) from being turned on in a common state through a signal timing control circuit.

5. The CMOS fully integrated high-voltage speaker driver chip according to claim 4, characterized in that: The signal timing control circuit is a delay circuit and an overlap circuit.

6. The CMOS process fully integrated high-voltage speaker driver chip according to claim 1, characterized in that: The driver chip has 6 I / O ports, including high voltage VCC, GND, a signal input terminal and three signal output terminals OUTN, OUTP and VLDO.

7. The CMOS fully integrated high-voltage speaker driver chip according to claim 6, characterized in that: The LDO module (1) is connected to a high voltage VCC via one of the I / O ports, and the LDO module (1) is used to convert the high voltage into a normal voltage to supply power for normal operation of an internal circuit.

8. The CMOS fully integrated high-voltage speaker driver chip according to claim 6, characterized in that: The logic control module (3) is also used to receive a periodic pulse signal of a clock signal CLK.

9. The CMOS fully integrated high-voltage speaker driver chip according to claim 6, characterized in that: The driving module (4) outputs a driving signal via OUTN and OUTP.

10. The CMOS process fully integrated high-voltage speaker driver chip according to claim 1, characterized in that: The driver chip adopts sot23-6 package.

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