Ceramic heater

Abstract

The present invention relates to a ceramic heater comprising: a plate having a heating element and a first channel, a shaft having a hollow portion, and a thermocouple inserted into the first channel; the heating element has a plurality of concentric arc portions and a plurality of connecting portions for connecting the arc portions, and a partition region formed by partitioning and facing the plurality of connecting portions extends in the radial direction of the plate, and the first channel is formed adjacent to the partition region.

Description

Technical Field

[0001] The present invention relates to a ceramic heater, and more particularly, to a ceramic heater with an improved insertion structure of a temperature sensor. Background Art

[0002] Generally, in order to manufacture a flat panel display panel or a semiconductor device, a series of layers including a dielectric layer and a metal layer are sequentially stacked on a substrate (a glass substrate, a flexible substrate, a semiconductor substrate, etc.) and a patterning process is performed. At this time, a series of layers including a dielectric layer and a metal layer are deposited on the substrate by a process such as chemical vapor deposition (CVD) or physical vapor deposition (PVD).

[0003] In order to uniformly form these layers, the substrate needs to be heated at a uniform temperature, so a substrate heating device for heating and supporting the substrate is used. The substrate heating device can be used to heat the substrate in the etching process of the dielectric layer or metal layer formed on the substrate, the firing process of the photoresist, etc.

[0004] The ceramic heater used as such a substrate heating device has a heating element and a thermocouple for measuring the temperature of the heating element. The thermocouple is inserted into a thermocouple channel formed inside the ceramic heater, and the heat generated in the heating element can be released through the thermocouple channel. When such heat loss occurs, the problem of reduced temperature uniformity of the substrate placed on the ceramic heater arises. Summary of the invention

[0005] Problem that the invention aims to solve

[0006] The problem to be solved by the present invention is to prevent heat loss caused by a channel in which a temperature sensor such as a thermocouple is inserted.

[0007] Another problem to be solved by the present invention is to prevent cracks from being generated in the plate of the ceramic heater due to expansion and contraction of the heating element.

[0008] In addition, the problem to be solved by the present invention is to measure the temperature of the heating element more accurately.

[0009] In addition, the problem to be solved by the present invention is to minimize the space volume of a thermocouple channel used for arranging a temperature sensor such as a thermocouple, so that the thermocouple can be easily inserted and the insertion success rate can be improved.

[0010] Means used to solve problems

[0011] A ceramic heater based on an embodiment of the present invention includes: a plate having a heating element and a first channel, an axis having a hollow portion, and a thermocouple inserted into the first channel; the heating element has a plurality of concentric arc portions and a plurality of connecting portions for connecting the arc portions, and a separation area formed by the plurality of separated and opposite connecting portions extends along the radial direction of the plate, and the first channel is formed to be adjacent to the separation area.

[0012] The plurality of connection portions are aligned parallel to each other and form the separation area extending in the radial direction of the plate.

[0013] The plate includes a first heat-generating portion and a second heat-generating portion connected to the first heat-generating portion and line-symmetrical to the first heat-generating portion, and the separation area is formed between the first heat-generating portion and the second heat-generating portion.

[0014] The first channel does not overlap with the heat generating body in the thickness direction of the plate.

[0015] The number of the separated area and the number of the first channel may be plural.

[0016] The plurality of first channels may include more than two first channels with different lengths.

[0017] A ceramic heater according to another embodiment of the present invention includes: a plate having a heating element and a first channel, an axis having a hollow portion, and a thermocouple inserted into the first channel; the first channel includes an Ath channel portion parallel to the first surface of the plate and a Bth channel portion inclined relative to the first surface.

[0018] The plate includes a first plate portion and a second plate portion, the Ath channel portion is located on the first plate portion, and the Bth channel portion is located on the second plate portion.

[0019] The B-th channel portion is inclined toward the heating element.

[0020] The B-th channel portion is located at an end portion of the first channel in the circumferential direction.

[0021] The outlet area of ​​the Ath channel portion is smaller than the inlet area of ​​the Bth channel portion.

[0022] The temperature measuring portion of the thermocouple is located in the B-th channel portion.

[0023] A ceramic heater based on another embodiment of the present invention includes: a plate having a heating element and a first channel, a shaft having a hollow portion, and a thermocouple inserted into the first channel; the first channel includes an A channel portion and a C channel portion, the A channel portion is parallel to the upper end surface of the plate, the C channel portion is located between the A channel portion and the upper end portion of the shaft and gradually narrows from the upper end portion of the shaft to the A channel portion.

[0024] The ceramic heater further includes a thermocouple guide, which is disposed in the hollow portion of the shaft and whose upper end is in contact with the Cth channel portion. The thermocouple is located inside the thermocouple guide, the Cth channel portion, and the Ath channel portion.

[0025] The end of the thermocouple guide may be inserted into and fixed in a groove of the plate connected to the C-th channel portion.

[0026] The flat portion of the end of the thermocouple guide may be inserted into and fixed in the groove of the plate connected to the C-th channel portion.

[0027] The filling protrusion at the end of the thermocouple guide can be inserted into and fixed in the groove of the C-th channel portion and the plate.

[0028] The protrusion at the end of the thermocouple guide may be inserted into and fixed in the groove of the plate connected to the C-th channel portion.

[0029] The groove portion at the end of the thermocouple guide may be inserted into and fixed in the groove of the plate connected to the C-th channel portion.

[0030] The threaded portion of the end portion of the thermocouple guide may be fastened and fixed to the threaded portion of the groove of the plate connected to the C-th channel portion.

[0031] Effects of the Invention

[0032] According to the embodiment of the present invention, the channel into which the temperature sensor is inserted is disposed in an area where the heating elements are not densely distributed, thereby preventing heat loss and cracks in the ceramic plate.

[0033] In addition, by placing the temperature measuring portion of the temperature sensor close to the heating element, the temperature of the heating element can be measured more accurately.

[0034] In addition, a fixed thermocouple guide is installed in the shaft, and a channel with a curvature of the plate that minimizes the spatial volume of the thermocouple channel is used, thereby minimizing the spatial volume of the thermocouple channel used to set a temperature sensor such as a thermocouple, while making it easy to insert the thermocouple and significantly improving the insertion success rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a perspective view of a ceramic heater according to an embodiment of the present invention.

[0036] Figure 2 This is a cross-sectional view of a plate according to an embodiment of the present invention cut horizontally along the heat generating element and viewed from above.

[0037] Figure 3 This is a cross-sectional view of a plate according to another embodiment of the present invention cut horizontally along the heating element and observed from above.

[0038] Figure 4 yes Figure 2 A partial enlarged view of part P.

[0039] Figure 5 This is a cross-sectional view of a plate according to another embodiment of the present invention cut horizontally along the heating element and observed from above.

[0040] Figure 6 yes Figure 2 CC cross-sectional view.

[0041] Figure 7 This is a diagram showing a comparative example of heat loss generated when the first passage is formed in a region where heat generating elements are densely packed.

[0042] Figure 8 This is a diagram showing a comparative example of fine cracks generated when the first channel is formed in a region where heat generating elements are densely packed.

[0043] Fig. 9 4 is a CC cross-sectional view of a plate according to still another embodiment of the present invention.

[0044] Fig.10 It is used to illustrate Fig. 9 Diagram of the board manufacturing process.

[0045] Fig.11 yes Fig. 9 A local enlarged view of section Z.

[0046] Fig.12 yes Fig.11 EE cross-sectional view.

[0047] Fig.13 yes Figure 1 A section view of a portion of the BB.

[0048] Fig.14 yes Figure 1 An enlarged view of another embodiment of the joining portion of the plate and the shaft in the BB section.

[0049] Fig.15 yes Figure 1 An enlarged view of yet another embodiment of the joining portion of the plate and the shaft in the BB section.

[0050] Fig.16 yes Figure 1 An enlarged view of another embodiment of the joining portion between the plate and the shaft in the BB section.

[0051] Fig.17 yes Figure 1 An enlarged view of another embodiment of the joining portion between the plate and the shaft in the BB section.

[0052] Fig.18 yes Figure 1 An enlarged view of another embodiment of the joining portion between the plate and the shaft in the BB section.

[0053] Fig.19 yes Figure 1 An enlarged view of another embodiment of the joining portion between the plate and the shaft in the BB section.

[0054] Fig. 20 This is an enlarged view of an example of a joint portion between the plate and the shaft when the thermocouple guide is not fixed.

[0055] Description of Reference Numerals

[0056] 10: Ceramic heater

[0057] 20: Plate

[0058] 23: Heat generating element

[0059] 26: Separate Area

[0060] 27: First channel

[0061] 27a: Channel A

[0062] 27b: Channel B

[0063] 27c: Channel C

[0064] 50: Axis DETAILED DESCRIPTION

[0065] Hereinafter, the embodiments described in this specification will be described in detail with reference to the accompanying drawings, and the same or similar components will be given the same figure numbers regardless of the figure numbers, and repeated descriptions thereof will be omitted. Hereinafter, in the process of describing the embodiments of the present invention, when each layer (film), region, pattern or structure is described as being formed "on" or "under" of a substrate, each layer (film), region, pad or pattern, it includes being formed "directly" on "on" or "under" or "through other layers (indirectly)" on "on" or "under". In addition, the reference of the upper / above or lower / below of each layer is described with reference to the accompanying drawings. In the accompanying drawings, for the convenience and clarity of the description, the thickness or size of each layer is enlarged, omitted or schematically shown. In addition, the size of each component does not fully reflect its actual size.

[0066] In the present description, expressions such as "including", "having" or "comprising" are used to indicate certain characteristics, numbers, steps, actions, elements, parts of these or combinations thereof, and should not be interpreted as excluding the existence or possibility of one or more other characteristics, numbers, steps, actions, elements, parts of these or combinations thereof than those described.

[0067] In addition, terms such as “first” and “second” may be used to describe a plurality of components, but the components are not limited to the terms, and the terms are only used to distinguish one component from other components.

[0068] In addition, in the process of describing the embodiments disclosed in this specification, when it is determined that the detailed description of the related known technology unnecessarily obscures the gist of the embodiments disclosed in this specification, the detailed description thereof will be omitted.

[0069] The drawings are only used to facilitate understanding of the embodiments disclosed in this specification. The technical ideas disclosed in this specification are not limited to the drawings, and should be understood to include all changes, equivalents and substitutes included in the ideas and technical scope of the present invention.

[0070] Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0071] Figure 1 It is a perspective view of a ceramic heater according to an embodiment of the present invention.

[0072] The ceramic heater 10 is a device for supporting a heat treatment target object (a semiconductor wafer, a glass substrate, a flexible substrate, etc.) for various purposes and heating the heat treatment target object at a predetermined temperature.

[0073] The ceramic heater 10 is composed of a plate 20 for placing a heat treatment object (such as a semiconductor wafer W) and a shaft 50 coupled to the lower surface 20b of the plate. The plate 20 has a placement surface (first surface) 20a as a flat upper end surface for placing the heat treatment object and a lower surface (second surface) 20b coupled to the shaft 50.

[0074] The plate 20 is a disk-shaped plate 20 made of a ceramic material (such as aluminum nitride or aluminum oxide). Similar to the plate 20, the shaft 50 can be formed of ceramics (such as aluminum nitride and aluminum oxide).

[0075] Figure 2 This is a cross-sectional view of a plate of an embodiment of the present invention cut horizontally along the heating element and observed from above. Figure 3 is a cross-sectional view of a plate of another embodiment of the present invention cut horizontally along the heating element and observed from above, Figure 4 yes Figure 2 A partial enlarged view of part P.

[0076] Reference Figures 2 to 4 , the plate 20 is formed of a ceramic material and may be Al 2 O 3 , Y 2 O 3 、Al 2 O 3 / Y 2 O 3 、ZrO 2 , AlC, TiN, AlN, TiC, MgO, CaO, CeO 2 、TiO 2 、BxCy、BN、SiO 2 , SiC, YAG, Mullite and AlF 3 Or two or more of them may be used in combination.

[0077] The board 20 may include a heating element 23. The heating element 23 performs a function of heating a heat treatment target object located on the board placement surface 20a at a constant temperature in order to perform a smooth deposition process and an etching process in a semiconductor manufacturing process or the like.

[0078] The heating element 23 may be embedded in the plate 20 corresponding to the position of the heat treatment object. In order to uniformly heat the heat treatment object as a whole by generating heat, the heating element 23 may not only uniformly control the heating temperature according to the position, but also be embedded in the plate 20 in parallel with the placement surface 20a of the plate, so that the distance of heat transfer to the heat treatment object is kept constant at almost all positions.

[0079] The heating element 23 may be formed in a shape corresponding to the shape of the object to be heat treated. In addition, the heating element 23 may be formed in a plate-shaped coil form based on a heating wire (or a resistance wire) or in a flat plate shape. The heating element 23 may be made of tungsten (W), molybdenum (Mo), molybdenum carbide (Mo 2 C, MoC, Mo 3 C 2 ), silver (Ag), gold (Au), platinum (Pt), niobium (Nb), titanium (Ti) or alloys thereof. The heating element 23 can be electrically connected to the terminals 21 and 22 via the conductive connection portion 28 .

[0080] A pair of first terminals 21 and a pair of second terminals 22 may be formed in the center of the plate 20. The first terminal 21 electrically connects the internal region heating element 24 formed in the internal region of the plate 20 and the power supply rod inside the shaft 50, and the second terminal 22 electrically connects the external region heating element 25 formed in the external region of the plate 20 and the power supply rod inside the shaft 50.

[0081] In the present invention, in order to heat the divided multiple zones, the heating element 23 may be composed of two or more heating elements. For example, Figure 2 The heating element 23 is shown in which the plate is divided into an inner area and an outer area and is composed of an inner area heating element 24 and an outer area heating element 25 for heating each area. Hereinafter, a heater divided into an inner area and an outer area will be described, but the present invention is not limited thereto. For example, of course, the present invention can also be applied to a multi-area heater in which a plate of a ceramic heater is divided into sectors of a predetermined angle and has heating elements corresponding to each of the divided areas.

[0082] The inner area heating element 24 forms a certain pattern (such as concentric circles) from the first terminal 21a and is connected to the first terminal 21b after being continuously wired in the inner area of ​​the board 20. In this process, the inner area heating element 24 can be folded at multiple connection parts 23' and take the shape of multiple concentric circle patterns.

[0083] The multiple concentric circle patterns of the inner region heating element 24 may include multiple concentric arc portions 24a-1, 24a-2, 24b-1, 24b-2 extending in the circumferential direction of the plate 20. In addition, multiple connecting portions 23' for connecting adjacent arc portions 24a-1, 24a-2, 24b-1, 24b-2 among the multiple concentric arc portions 24a-1, 24a-2, 24b-1, 24b-2 may be included. Adjacent arc portions 24a-1, 24a-2, 24b-1, 24b-2 may be connected by connecting portions 23' extending in the diameter direction.

[0084] The concentric arc portions 24a-1, 24a-2, 24b-1, 24b-2 may have different diameters. In addition, the connecting portions 23' may be aligned parallel to each other, and a spaced area 26 extending in the radial direction of the plate 20 is formed between the connecting portions 23'.

[0085] The inner region heat generating body 24 may include a first inner heat generating portion 24a and a second inner heat generating portion 24b. The first inner heat generating portion 24a and the second inner heat generating portion 24b may be configured to form a line symmetrical structure with the diameter direction of the plate 20 as the center and be connected to each other.

[0086] The arc portion 24a-1 of the first internal heating portion 24a and the arc portion 24b-1 of the second internal heating portion 24b are arc portions of the same diameter. The arc portion 24a-2 of the first internal heating portion 24a and the arc portion 24b-2 of the second internal heating portion 24b are also arc portions of the same diameter and are arc portions with diameters greater than the arc portions 24a-1 and the arc portion 24b-1. The arc portion 24a-1 is connected to the arc portion 24a-2 through the connecting portion 23'. The arc portion 24b-1 is connected to the arc portion 24b-2 through the connecting portion 23'.

[0087] The connection portion 23' of the first internal heat generating portion 24a and the connection portion 23' of the second internal heat generating portion 24b may be arranged to be spaced apart by a certain distance E and to face each other. In the board 20, a spaced region 26 where the internal region heat generating body 24 is not wired may be formed in the region formed by the virtual line I formed by the spaced connection portions 23'. The spaced region 26 may extend in the radial direction of the board 20.

[0088] The separation area 26 may be formed between the first internal heat generating portion 24a and the second internal heat generating portion 24b, and preferably, may be formed in an area where a plurality of connection portions 23' are aligned parallel to each other and extend in the radial direction of the plate 20. The separation area 26 may be formed from the center of the plate 20 in the circumferential direction.

[0089] The outer region heating element 25 starts from the second terminal 22a, forms a certain pattern (such as concentric circles) and is connected to the second terminal 22b after being continuously wired in the outer region of the board 20. In this process, the outer region heating element 25 can also be folded at a certain position in the form of surrounding the inner region heating element 24 and forming a concentric circle pattern (refer to Figure 2 ), multiple connecting portions 23' may be folded to form multiple concentric circle patterns (refer to Figure 3 ).

[0090] The plurality of concentric circular patterns of the outer region heating element 25 may include a plurality of concentric arc portions 25a-1, 25a-2, 25b-1, 25b-2 extending in the circumferential direction of the plate 20. In addition, a plurality of connecting portions 23' for connecting adjacent arc portions 25a-1, 25a-2, 25b-1, 25b-2 among the plurality of concentric arc portions 25a-1, 25a-2, 25b-1, 25b-2 may be included. Adjacent arc portions 25a-1, 25a-2, 25b-1, 25b-2 may be connected by connecting portions 23' extending in the diameter direction.

[0091] The concentric arc portions 25a-1, 25a-2, 25b-1, 25b-2 may have different diameters. In addition, the connecting portions 23' may be aligned parallel to each other, and a spaced area 26 extending in the radial direction of the plate 20 is formed between the connecting portions 23'.

[0092] The outer region heat generating body 25 may include a first outer heat generating portion 25a and a second outer heat generating portion 25b. The first outer heat generating portion 25a and the second outer heat generating portion 25b may be configured to form a line symmetrical structure with the diameter direction of the plate 20 as the center and be connected to each other.

[0093] The arc portion 25a-1 of the first external heating portion 25a and the arc portion 25b-1 of the second external heating portion 25b are arc portions of the same diameter. The external area heating body 25 may also include an arc portion 25a-2 of the first external heating portion 25a and an arc portion 25b-2 of the second external heating portion 25b. The arc portion 25a-2 and the arc portion 25b-2 are arc portions of the same diameter and are arc portions with diameters greater than the arc portion 25a-1 and the arc portion 25b-1. The arc portion 25a-1 is connected to the arc portion 25a-2 through the connecting portion 23'. The arc portion 25b-1 is connected to the arc portion 25b-2 through the connecting portion 23'.

[0094] The connection portion 23' of the first external heat generating portion 25a and the connection portion 23' of the second external heat generating portion 25b may be arranged to be spaced apart and opposite to each other by a certain distance E. In the board 20, a spaced region 26 where the external region heat generating body 25 is not wired may be formed in the region formed by the virtual line I formed by the spaced connection portions 23'. The spaced region 26 may extend in the radial direction of the board 20.

[0095] The separation area 26 may be formed between the first external heat generating portion 25a and the second external heat generating portion 25b, and preferably, may be formed in an area formed by aligning a plurality of connection portions 23' in parallel with each other and extending in the radial direction of the board 20. In addition, the separation area 26 may also be formed between the conductive connection portion 28 connected to the second terminal 22a and the conductive connection portion 28 connected to the second terminal 22b. The separation area 26 may be formed to extend from the central portion of the board 20 in the circumferential direction, extending from the separation area 26 formed in the inner area.

[0096] The inner region heating element 24 and the outer region heating element 25 can be driven independently of each other by being electrically separated.

[0097] A first channel 27 in which a temperature sensor 60 such as a thermocouple is inserted may be formed on the board 20. The first channel 27 may be formed along the partition area 26 adjacent to the partition area 26. In addition, the first channel 27 may be formed parallel to the placement surface 20a of the board.

[0098] like Figures 2 to 4 As shown, when viewed from above the board 20 in the thickness direction of the board 20, the first channel 27 may be formed adjacent to the separation area 26 in a manner that does not overlap with the heat generating body 23. In addition, the first channel 27 may also be formed adjacent to the separation area 26 formed between the conductive connection portion 28 connected to the second terminal 22a and the conductive connection portion 28 connected to the second terminal 22b.

[0099] like Figure 2 and Figure 3 As shown, in the plate 20, a plurality of heating elements (for example, two heating elements 24, 25) can be arranged independently of each other, such as Figure 5 As shown, a single heat generating body 23 is provided in all regions of the plate 20 .

[0100] In addition, the plate 20 may include a plurality of partitioned areas 26 and a plurality of first channels 27. The partitioned areas 26 and the first channels 27 may be formed at a plurality of angular positions along the circumferential direction. In this case, the lengths of the plurality of first channels 27 in the longitudinal direction may be the same, but may be formed to have different lengths in the longitudinal direction according to the design.

[0101] Figure 6 yes Figure 2 CC cross-sectional view.

[0102] Reference Figure 6 , the first channel 27 is formed along the separation area 26 adjacent to the separation area 26, so that Figure 6As shown, the heating element 23 may not be disposed above the first channel 27. By forming the first channel 27 in an area where the heating element 23 is not densely packed, the heat generated in the heating element 23 can be prevented from being lost through the first channel 27, thereby improving the temperature uniformity of the heater. In addition, cracks generated in the fragile portion of the plate 20 due to expansion and contraction of the heating element 23 can be prevented.

[0103] on the other hand, Figure 7 and Figure 8 This is a diagram for illustrating the heat loss and microcracks that occur when the first channel is formed in a region where heat generating elements are densely packed.

[0104] like Figure 7 As shown, when the first passage 27 is formed adjacent to the heat generating body 23 , heat generated in the heat generating body 23 may be lost through the first passage 27 .

[0105] In addition, if Figure 8 As shown, when the first passage 27 is formed adjacent to the heat generating body 23 , fine cracks may occur in the thin portion of the plate 20 due to expansion and contraction of the heat generating body 23 .

[0106] Fig. 9 4 is a CC cross-sectional view of a plate according to still another embodiment of the present invention.

[0107] The temperature sensor 60 (eg, a thermocouple) is inserted into the first channel 27 of the board 20. The first channel 27 may be composed of an Ath channel portion 27a formed parallel to the mounting surface 20a of the board and a Bth channel portion 27b inclined relative to the mounting surface 20a.

[0108] The B-th channel portion 27b may be located at the end portion in the circumferential direction of the first channel 27, and the temperature measuring portion of the temperature sensor 60 may be provided at the B-th channel portion 27b. The B-th channel portion 27b may be formed to be inclined toward the heating element 23 to minimize the distance between the temperature measuring portion of the temperature sensor 60 and the heating element 23. In addition, the circumferential end portion of the B-th channel portion 27b may be located at the same height (i.e., on the same plane) as the heating element 23 in the thickness direction of the plate 20, so as to more accurately measure the temperature of the area between the connection portions 23' of the heating element.

[0109] Fig.10 It is used to illustrate Fig. 9 FIG. 20 is a diagram of the manufacturing process of the plate 20, Fig.11 yes Fig. 9 A partial enlarged view of the Z part, Fig.12 yes Fig.11 Cross-sectional view in the EE direction.

[0110] The plate 20 may be composed of an upper plate P2 and a lower plate P1. The B-th channel portion 27b may be formed in the upper plate P2, and the A-th channel portion 27a may be formed in the lower plate P1.

[0111] The A-th channel portion 27a and the B-th channel portion 27b may be in the form of slots or holes extending in a strip shape along the circumferential direction of the plate 20 so that the temperature sensor 60 (such as a thermocouple) can be inserted. The A-th channel portion 27a and the B-th channel portion 27b may have various cross-sectional shapes such as a circle or a quadrilateral.

[0112] The plate 20 can be manufactured by bonding the lower plate P1 and the upper plate P2 formed with the A-th channel portion 27a and the B-th channel portion 27b. At this time, if the A-th channel portion 27a and the B-th channel portion 27b are not accurately aligned, the space through which the temperature sensor 60 can pass is reduced, making it difficult or impossible to insert the temperature sensor 60 into the B-th channel portion 27b.

[0113] In order to facilitate alignment when joining the upper plate P2 and the lower plate P1, as Fig.11 As shown, the B channel portion 27b can be processed into a cone or a polygonal pyramid (such as a triangular pyramid or a quadrangular pyramid), or into a truncated cone or a truncated polygonal pyramid. As described above, since the cross-sectional area of ​​the end portion of the B channel portion 27b is reduced, the temperature measuring portion of the thermocouple inserted into the B channel portion 27b does not shake, thereby improving the temperature measurement accuracy.

[0114] When the upper plate P2 is joined to the lower plate P1, an outlet of the A-th channel portion 27a (a hole through which the temperature sensor 60 can pass) can be formed at one end of the A-th channel portion 27a formed in the lower plate P1. In addition, an inlet of the B-th channel portion 27b (a hole through which the temperature sensor 60 can pass) can be provided at a position connected to the outlet of the A-th channel portion 27a.

[0115] When the outlet of the A-th channel portion 27a is connected to the inlet of the B-th channel portion 27b, the A-th channel portion 27a and the B-th channel portion 27b may integrally form the first channel 27. At this time, the inlet area D2 of the B-th channel portion 27b may be formed to be larger than the outlet area D1 of the A-th channel portion 27a, so that even if the A-th channel portion 27a and the B-th channel portion 27b are not accurately aligned, the space through which the temperature sensor 60 passes is not reduced.

[0116] In addition, the margin space (i.e., the space corresponding to D2-D1) of the inlet area D2 of the B-th channel portion 27b is set to extend in a direction away from the center of the plate 20, so that the temperature sensor 60 (such as a thermocouple) can be easily inserted into the B-th channel portion 27b. That is, the thermocouple inserted through the A-th channel portion 27a can be easily inserted along the inner side wall of the B-th channel portion 27b without hitting the upper plate P2 at the inlet of the B-th channel portion 27b.

[0117] In addition, the B-th channel portion 27 b may be in a form in which the cross-sectional area decreases in a direction away from the center of the plate 20 .

[0118] As described above, the inlet area D2 of the B-th channel portion 27b is formed to be larger than the outlet area D1 of the A-th channel portion 27a, so that when the plate 20 is assembled, the radial direction ( Fig.10 In addition, if Fig.12 As shown, the width of the B-th channel portion 27b is formed to be larger than the width of the A-th channel portion 27a, so that the plate 20 can be assembled by allowing an alignment error in the rotation direction (circumferential direction of the plate).

[0119] Fig.13 yes Figure 1 Among them, the cross-sectional view PC and the plan view PU of the joint portion of the reference plate 20 and the shaft 50 will be referred to.

[0120] Reference Fig.13 The shaft 50 may be formed of a wall having a predetermined thickness and may be formed in a cylindrical shape having a space (hollow portion) 55 inside. A plurality of power supply rods (not shown) connected to the terminals of the plate 20 may be provided in the internal space of the shaft 50. A predetermined mounting member 90 may be provided on the lower side of the shaft 50, whereby a plurality of power supply rods (not shown) and the thermocouple guide 70 may be fixed on the lower side.

[0121] The following, such as Figures 1 to 13 As shown, the plate 20 including the heating element 23 and the first channel 27, the shaft 50, the thermocouple 60 and the like can be applied as described above.

[0122] As described above, the plate 20 may be composed of the upper plate P2 and the lower plate P1 as described above. Fig.10 As shown, a B-th channel portion 27b (which may be omitted) may be formed on the upper plate P2, and an A-th channel portion 27a may be formed on the lower plate P1.

[0123] In addition, if Fig.13 As shown, the first channel 27 may include a C-th channel portion 27c, which is located between the A-th channel portion 27a and the upper end portion of the shaft 50 and gradually narrows from the upper end portion of the shaft 50 to the A-th channel portion 27a. The C-th channel portion 27c may be formed on the plate 20. When the lower plate P1 is distinguished from the upper plate P2, the C-th channel portion 27c may also be formed on the lower plate P1, and may also be formed in a manner extending from the lower plate P1 to a portion of the upper plate P2.

[0124] By gradually narrowing the C channel portion 27c from the upper end of the shaft 50 to the A channel portion 27a, the space volume of the thermocouple channel in the C channel portion 27c can be minimized compared to the case where the C channel portion 27c is formed by a hexahedral channel through the channel having a curvature of such a plate 20. Since the temperature measuring portion of the terminal portion of the temperature sensor 60 contacts along the curved surface of the C channel portion 27c and is inserted in a manner of being pushed into the A channel portion 27a side, the curved surface portion is made of a circular surface such as a disc, a sphere, an ellipse, etc. from the upper end of the shaft 50 to the A channel portion 27a to facilitate its insertion. That is, the space of the C channel portion 27c can be in a partial shape having a curved surface such as a disc, a sphere, an ellipse, etc.

[0125] The temperature sensor 60 (such as a thermocouple) can be inserted into the first channel 27 of the plate 20 through the thermocouple guide 70 having a through hole provided in the hollow portion 55 of the shaft 50. The thermocouple guide 70 is provided in the hollow portion 55 of the shaft 50 and its upper end portion is provided to contact the C-th channel portion 27c. That is, the temperature sensor 60 (such as a thermocouple) can be located inside the thermocouple guide 70, the C-th channel portion 27c, and the A-th channel portion 27a. As described above, the temperature measuring portion of the terminal portion of the temperature sensor 60 can be pushed and inserted into the terminal portion of the A-th channel portion 27a. In addition, when the B-th channel portion 27b is provided, the temperature measuring portion of the terminal portion of the temperature sensor 60 can be pushed and inserted into the terminal portion of the B-th channel portion 27b.

[0126] The end of the thermocouple guide 70 can be inserted and fixed in the groove connected to the C-th channel portion 27c of the plate 20 or the lower plate P1. Fig. 20 As shown, when the thermocouple guide 70 is not fixed, when the temperature sensor 60 is pushed and inserted into the inside of the thermocouple guide 70, the C-th channel portion 27c, and the A-th channel portion 27a, the insertion success rate is reduced due to the shaking of the thermocouple guide 70.

[0127] Conventionally, there is a method of manufacturing the thermocouple guide in a curved shape (not shown) and making the end thereof close to the A-th channel portion 27a, but in this case, there is a problem that it is difficult to bring the end of the thermocouple guide close to the A-th channel portion 27a and the thermocouple guide is not fixed, so in the process of inserting and pushing the thermocouple, the insertion success rate is also reduced due to the shaking of the thermocouple, etc. Furthermore, in order to insert the conventional curved thermocouple guide as described above into the shaft, it is necessary to ensure a large processing space in the plate 20 so that the end of the thermocouple guide can be close to the A-th channel portion 27a, so this processing space may cause the temperature uniformity of the plate to decrease, and heat loss may also occur through the installed thermocouple guide, which is a factor that causes cracks in the plate and hinders the maintenance of temperature uniformity.

[0128] Therefore, in the present invention, the linear thermocouple guide 70 is fixed in the shaft 50, so that the thermocouple can be easily inserted. In addition, by gradually narrowing the C channel portion 27c from the upper end of the shaft 50 to the A channel portion 27a, the space volume of the thermocouple channel in the C channel portion 27c can be minimized compared with the case where the C channel portion 27c is formed of a hexahedral channel through the channel having a curvature of such a plate 20. The C channel portion 27c having a curvature as described above contacts the temperature measuring portion of the terminal end of the temperature sensor 60 along its curved surface and is pushed into the A channel portion 27a side, so the insertion success rate can be significantly improved.

[0129] The advantages of the structure of fixing the linear thermocouple guide 70 in the shaft 50 and utilizing the curved surface of the C-th channel portion 27c of the present invention are summarized in more detail as follows:

[0130] 1) Effect of reducing the volume of the thermocouple channel

[0131] -Compared with the structure of the prior art, the improved structure of the present invention can not only improve the thermocouple insertion effect, but also effectively reduce the volume of the thermocouple channel.

[0132] - In addition, by reducing the volume of the thermocouple passages, the temperature uniformity and durability of the plate 20 can be improved.

[0133] 2) Effect of removing the thermocouple guide

[0134] - The improved structure of the present invention can minimize the insertion of the thermocouple guide 70.

[0135] - In addition, heat loss through the thermocouple guide 70 can be minimized, thereby improving the temperature uniformity of the plate 20 and preventing cracks caused by rapid heat loss.

[0136] 3) Improvement of thermocouple insertion stability

[0137] In the improved structure of the present invention, when the thermocouple is inserted, the thermocouple is bent due to the curvature of the plate 20 . At this time, the fixed thermocouple guide 70 can play a supporting role so that the thermocouple can bend along the curvature of the plate 20 .

[0138] - In addition, the success rate of thermocouple insertion can be improved by increasing the fixing force of the thermocouple guide 70 .

[0139] - In addition, the smaller the radius of curvature of the curved surface portion of the plate 20, the greater the force acting on the plate 20 during insertion. Since the fixing force of the thermocouple guide 70 is improved, the same effect can be achieved even if the radius of curvature of the insertable plate 20 is reduced compared to the case where the thermocouple guide 70 is not fixed.

[0140] - In addition, when the ceramic heater is used in the semiconductor process, there has been a problem in the past that the position of the thermocouple is moved due to the thermocouple guide 70 not being fixed. However, in the present invention, by fixing the thermocouple guide 70, the position of the thermocouple is fixed so as not to move during use, thereby improving the durability of use.

[0141] On the other hand, in the present invention, the end of the thermocouple guide 70 as described above can be inserted and fixed in the groove connected to the C-th channel portion 27c of the plate 20, and the lower side thereof can be fixed to a predetermined mounting member 90. Fig.13 As shown, the thermocouple guide 70, which may be made of a ceramic material or the like as described above, may be made of a straight pipe or tube form and its ends may be inserted and fixed in corresponding grooves of the plate 20. However, as described below, according to various embodiments, the thermocouple guide 70 may be inserted and fixed in the grooves of the plate 20 or the lower plate P1 by various methods.

[0142] Fig.14 yes Figure 1 FIG. 2 is an enlarged view of another embodiment of the joint portion of the plate 20 and the shaft 50 in the BB section of FIG.

[0143] Reference Fig.14 , the flat portion 71 at the end of the thermocouple guide 70 can be inserted and fixed in the groove 31 of the plate 20 connected to the C channel portion 27c. The flat portion 71 is inserted into the groove 31 of the plate 20 to fix the thermocouple guide 70, and the flat portion 71 having a predetermined shape (quadrilateral plate shape, etc.) corresponding to the shape of the groove 31 can improve the fixing force by increasing the insertion area. Among them, the quadrilateral plate-shaped flat portion 71 has a portion extending longer toward the other side at the end of the thermocouple guide 70 than the portion extending toward one side in a manner greater than the diameter of the body of the thermocouple guide 70. The flat portion 71 can be an integral type manufactured into a corresponding shape by processing the end of the thermocouple guide 70 material, or it can be manufactured separately and bonded to the end of the thermocouple guide 70 by welding or ceramic bonding.

[0144] Fig.15 yes Figure 1 FIG. 2 is an enlarged view of another embodiment of the joint portion of the plate 20 and the shaft 50 in the BB section of FIG.

[0145] Reference Fig.15, the filling protrusion 71-1 at the end of the thermocouple guide 70 can be inserted and fixed in the C channel portion 27c and the groove 31 of the plate 20. The filling protrusion 71-1 in the form of filling the insertion groove 31 of the plate 20 and the C channel portion 27c can increase the insertion area and be inserted into the inner side of the C channel portion 27c, thereby improving the fixing force and improving the insertion success rate. The filling protrusion 71-1 can be an integrated type manufactured into a corresponding shape by processing the end of the thermocouple guide 70 material, or it can be manufactured separately and combined to the end of the thermocouple guide 70 by welding or ceramic bonding.

[0146] Fig.16 yes Figure 1 FIG. 2 is an enlarged view of another embodiment of the joint portion of the plate 20 and the shaft 50 in the BB section of FIG.

[0147] Reference Fig.16 , the flat portion 72 at the end of the thermocouple guide 70 can be inserted and fixed in the groove 32 of the plate 20 connected to the C channel portion 27c. The flat portion 72 is inserted into the groove 32 of the plate 20 to fix the thermocouple guide 70, and the flat portion 72 having a predetermined shape (quadrilateral plate shape, etc.) corresponding to the shape of the groove 32 can improve the fixing force by increasing the insertion area. Among them, the quadrilateral plate-shaped flat portion 72 has a square plate shape. The flat portion 72 can be an integrated type manufactured into a corresponding shape by processing the end of the thermocouple guide 70 material, or it can be manufactured separately and combined to the end of the thermocouple guide 70 by welding or ceramic bonding.

[0148] Apart from Fig.14 and Fig.16 In addition to the embodiment of the present invention, the flat portion can be implemented in various shapes at the end of the thermocouple guide 70, such as a disc shape, various quadrilateral plates, an elliptical plate shape, and a star plate shape. The flat portion 71 / flat portion 72 of the thermocouple guide 70 can improve the fixing force by increasing the area of ​​the insertion plate 20.

[0149] Fig.17 yes Figure 1 An enlarged view of another embodiment of the joint portion of the plate and the shaft in the BB section of FIG. Among them, reference will be made to the sectional view PC and the plan view PU.

[0150] Reference Fig.17 The protrusion 73 at the end of the thermocouple guide 70 can also be inserted and fixed in the groove 33 of the plate 20 connected to the C channel portion 27c. The cross-sectional shape of the protrusion 73 and the corresponding groove 33 of the plate 20 can be realized in various shapes, such as circular, various quadrilaterals, elliptical and star-shaped. The protrusion 73 of the thermocouple guide 70 can also improve the fixing force in a way of reducing shaking.

[0151] Fig.18 yes Figure 1 An enlarged view of another embodiment of the joint portion of the plate and the shaft in the BB section of FIG. Among them, reference will be made to the sectional view PC and the plan view PU.

[0152] Reference Fig.18 , the groove portion 74 at the end of the thermocouple guide 70 can also be inserted and fixed in the groove (portion) 34 of the plate 20 connected to the C channel portion 27c. Among them, the cross-sectional shape of the groove portion 74 and the corresponding groove 34 of the plate 20 can be realized in various shapes, such as circular, various quadrilaterals, elliptical and star-shaped. The groove portion 74 of the thermocouple guide 70 can also improve the fixing force in a way of reducing shaking.

[0153] Fig.19 yes Figure 1 An enlarged view of another embodiment of the joint portion of the plate and the shaft in the BB section of FIG. Among them, reference will be made to the sectional view PC and the plan view PU.

[0154] Reference Fig.19 The threaded portion 75 (e.g., male thread) at the end of the thermocouple guide 70 can also be tightened (threadedly tightened) and fixed to the threaded portion 39 (e.g., female thread) of the groove 35 connected to the C-th channel portion 27c of the plate 20. The threaded portion 75 of the thermocouple guide 70 can also improve the fixing force in a manner that reduces shaking.

[0155] As described above, in the present invention, specific matters such as specific constituent elements and limited embodiments and drawings are used for explanation, but this is only provided for a more comprehensive understanding of the present invention, and the present invention is not limited to the embodiments, and as long as the ordinary technicians in the technical field to which the present invention belongs can make various modifications and deformations within the scope of the essential characteristics of the present invention. Therefore, the idea of ​​the present invention should not be limited to the illustrated embodiments, and not only the attached claims, but all technical ideas that are equivalent to or have equivalent deformations with the claims should be interpreted as included in the scope of the rights of the present invention. In addition, the various embodiments can be combined and used with each other as needed.

Claims

1. A ceramic heater, in, include: A plate having a heating element and a first channel, a shaft having a hollow portion, and a thermocouple inserted into the first channel; The first channel includes an Ath channel portion parallel to the first surface of the plate and a Bth channel portion inclined relative to the first surface.

2. The ceramic heater according to claim 1, wherein The plate includes a first plate portion and a second plate portion, The Ath channel portion is located on the first plate portion, and the Bth channel portion is located on the second plate portion.

3. The ceramic heater according to claim 1, wherein The B-th channel portion is inclined toward the heating element.

4. The ceramic heater according to claim 1, wherein The B-th channel portion is located at an end portion of the first channel in the circumferential direction.

5. The ceramic heater according to claim 1, wherein The outlet area of ​​the Ath channel portion is smaller than the inlet area of ​​the Bth channel portion.

6. The ceramic heater according to claim 1, wherein The temperature measuring portion of the thermocouple is located in the B-th channel portion.

7. A ceramic heater, wherein: include: A plate having a heating element and a first channel, a shaft having a hollow portion, and a thermocouple inserted into the first channel; The first channel includes an Ath channel portion and a Cth channel portion, the Ath channel portion is parallel to the upper end surface of the plate, and the Cth channel portion is located between the Ath channel portion and the upper end portion of the shaft and gradually narrows from the upper end portion of the shaft to the Ath channel portion.

8. The ceramic heater according to claim 7, wherein: The thermocouple guide is also included, the thermocouple guide is disposed in the hollow portion of the shaft and the upper end portion of the thermocouple guide is in contact with the C channel portion, The thermocouple is located inside the thermocouple guide, the Cth channel portion, and the Ath channel portion.

9. The ceramic heater according to claim 8, wherein: The end of the thermocouple guide is inserted into and fixed in the groove of the plate connected to the C-th channel portion.

10. The ceramic heater according to claim 8, wherein The flat portion of the end of the thermocouple guide is inserted into and fixed in the groove of the plate connected to the C-th channel portion.

11. The ceramic heater according to claim 8, wherein The filling protrusion at the end of the thermocouple guide is inserted into and fixed in the groove of the C-th channel portion and the plate.

12. The ceramic heater according to claim 8, wherein: The protrusion at the end of the thermocouple guide is inserted into and fixed in the groove of the plate connected to the C-th channel portion.

13. The ceramic heater according to claim 8, wherein The groove portion at the end of the thermocouple guide is inserted into and fixed in the groove of the plate connected to the C-th channel portion.

14. The ceramic heater according to claim 8, wherein The threaded portion of the end portion of the thermocouple guide is fastened and fixed to the threaded portion of the groove of the plate connected to the C-th channel portion.

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