Manufacturing method of multi-purpose radio frequency electrical product PCB

Abstract

The invention provides a manufacturing method of a multi-purpose radio frequency electrical product PCB, which comprises the steps that a to-be-processed PCB is preprocessed to obtain a standard PNL, the standard PNL is provided with a first processing layer and a second processing layer, a prepreg is arranged between the first processing layer and the second processing layer, and the second processing layer is provided with a blind groove; drilling the standard PNL plate to form a blind hole; processing the inner layer pattern of the standard PNL board, completing the manufacturing of the inner layer pattern of the standard PNL board, and forming an internal circuit; carrying out laser cutting on the standard PNL plate after the circuit is formed, and hollowing out the blind grooves and the blind holes; connecting, stacking and pressing the copper foil, the first processing layer and the second processing layer to form a three-layer plate; carrying out laser cutting on the three-layer plate, and carrying out conduction drilling; manufacturing an external circuit pattern of the three-layer board; and performing pattern processing and detection on the three-layer board to obtain a qualified PCB. According to the technical scheme of the embodiment, the output stability of the radio frequency signal can be improved, and the quality of the PCB is improved.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board manufacturing, and in particular to a manufacturing method of a PCB board for a multi-purpose radio frequency electrical product. Background Art

[0002] Radio frequency electrical products are mostly used in public places such as stations, hotels, large conference rooms and schools. As a result, the processing capacity and integration requirements of radio frequency electrical appliances are relatively high, and the use of PCB boards is also increasing. In order to achieve long-term and stable signal transmission for the antenna, the PCB circuit board usually makes the signal circuit layer on the inner layer, and connects the inner and outer layers through a large number of blind holes. In the prior art, the end of the drill bit commonly used in the drilling process of PCB circuit boards is relatively flat, and the bottom of the blind holes drilled on the circuit board is mostly flat. The conventional blind hole electroplating method is to deposit copper once and then conduct full-board electroplating. Since the fluidity of the solution in the blind hole is poor, after copper plating, the bottom of the blind hole and the corners at the bottom are prone to copper-free or thin copper thickness, resulting in poor output stability of the RF signal. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a method for manufacturing a PCB board of a multi-purpose radio frequency electrical product, which can improve the radio frequency signal output stability of the radio frequency electrical product.

[0004] In a first aspect, an embodiment of the present invention provides a method for manufacturing a PCB board of a multi-purpose radio frequency electrical product, comprising:

[0005] Performing a pretreatment operation on the PCB board to be processed to obtain a standard PNL board, wherein the standard PNL board is provided with a first processing layer and a second processing layer, a prepreg is provided between the first processing layer and the second processing layer, and the second processing layer is provided with a blind groove;

[0006] Drilling the first processed layer and the second processed layer to obtain blind holes of the standard PNL board;

[0007] Performing a first pattern processing on the inner layers of the first processing layer and the second processing layer to complete the production of the inner layer pattern of the standard PNL board and form the internal circuit of the standard PNL board;

[0008] Performing a first laser cutting on the standard PNL board after the circuit is formed, forming the semi-cured sheet required for laminating the standard PNL board, and hollowing out the blind groove and the blind hole;

[0009] Connecting and stacking the copper foil with the first treatment layer and the second treatment layer respectively and pressing them together to form the standard PNL board into a three-layer board;

[0010] Performing a second laser cutting on the three-layer board, and conducting drilling on the first processed layer, the second processed layer and the copper foil;

[0011] Plasma treatment is performed on the three-layer board after the conduction drilling, and an external circuit pattern of the three-layer board is produced;

[0012] The three-layer board forming the external circuit pattern is subjected to second pattern processing and detection to obtain a qualified PCB board.

[0013] In some embodiments of the present invention, it is characterized in that the pre-processing operation on the PCB board to be processed includes:

[0014] The PCB board to be processed is cut according to a preset size so that the PCB board to be processed forms a plurality of standard PNL boards.

[0015] In some embodiments of the present invention, performing a first graphic processing on the first processing layer and the second processing layer includes:

[0016] Copper plating is performed on the blind hole, and the copper surface of the blind hole after copper plating is thickened;

[0017] A photosensitive dry film is attached to the surface of the standard PNL plate, and the photosensitive dry film is irradiated with ultraviolet light to transfer the pattern on the negative film to the surface of the photosensitive dry film;

[0018] Chemically etching the standard PNL board, etching the surface of the standard PNL board not requiring the copper surface to be covered, so that the first processing layer and the second processing layer are exposed from the substrate, forming the circuit and pattern of the PNL board;

[0019] Defect detection is performed on the standard PNL board after the etching is completed.

[0020] In some embodiments of the present invention, after hollowing out the blind groove and the blind hole, the method further includes:

[0021] The surface of the PNL plate is subjected to browning treatment to form a browning film on the surface of the copper portion of the PCN plate.

[0022] In some embodiments of the present invention, after forming an external circuit pattern on the three-layer board, the method further comprises:

[0023] Identify the welding positions and non-welding positions of the three-layer board, and cover the non-welding positions with solder mask ink;

[0024] The ink characters of the welding component numbers required for the three-layer board are silk-screened on the welding positions.

[0025] In some embodiments of the present invention, the second pattern processing and detection of the three-layer board forming the external circuit pattern includes:

[0026] Coppering the blind grooves, blind holes and drilled holes of the three-layer board, and thickening the copper layer after coppering;

[0027] Covering the surface of the three-layer board with a photosensitive dry film, and transferring the pattern on the negative film to the surface of the photosensitive dry film by ultraviolet light;

[0028] The unexposed photosensitive dry film is removed by developing with a chemical solution to expose the copper surface;

[0029] The copper surface is chemically etched to expose the substrate of the three-layer board, thereby forming the external circuit and outer layer pattern of the three-layer board.

[0030] In some embodiments of the present invention, after forming the external circuits and external graphics of the three-layer board, the method further includes:

[0031] Connecting a test device to a plurality of test points of the three-layer board;

[0032] Applying a preset high voltage and a low current between the plurality of test points, measuring the current value and the voltage value between the plurality of test points, and calculating the first resistance values ​​of the plurality of test points according to the current value and the voltage value;

[0033] The first resistance value is compared with a preset second resistance value. When the first resistance value is less than the second resistance value, the three-layer board is qualified. When the first resistance value is greater than or equal to the second resistance value, the three-layer board is unqualified.

[0034] In some embodiments of the present invention, after performing second pattern processing and detection on the three-layer board forming the external circuit pattern, the method further includes:

[0035] Forming a nickel-phosphorus alloy layer on the surface of the copper foil exposed on the three-layer board, and plating gold on the surface of the nickel-phosphorus alloy layer according to a replacement reaction;

[0036] The three-layer board after gold plating is subjected to stamping.

[0037] In some embodiments of the present invention, the blind hole has a diameter of 0.5 mm and a depth of 0.1 mm.

[0038] In some embodiments of the present invention, the browning film has a thickness of 1 to 2 micrometers.

[0039] The method for manufacturing a PCB board for a multi-purpose radio frequency electrical product according to an embodiment of the present invention has at least the following beneficial effects:

[0040] The PCB board to be processed is pre-processed to obtain a standard PNL board, wherein the standard PNL board is provided with a first processing layer and a second processing layer, a semi-cured sheet is provided between the first processing layer and the second processing layer, and the second processing layer is provided with a blind groove; the first processing layer and the second processing layer are drilled to obtain the blind hole of the standard PNL board; the inner layers of the first processing layer and the second processing layer are subjected to a first graphic processing to complete the production of the inner layer graphics of the standard PNL board and form the internal circuit of the standard PNL board; the standard PNL board after the circuit is formed is subjected to a first laser cutting, the semi-cured sheet required for laminating the standard PNL board is formed, and the blind groove and the blind hole are hollowed out; the copper foil is connected and stacked with the first processing layer and the second processing layer respectively and pressed to form a three-layer board of the standard PNL board; the three-layer board is subjected to a second laser cutting, and the first processing layer, the second processing layer and the copper foil are conducted through drilling; the three-layer board after the conduction drilling is subjected to plasma processing, and the external circuit pattern of the three-layer board is produced; the three-layer board with the external circuit pattern formed is subjected to a second graphic processing and detection to obtain a qualified PCB board. According to the technical solution of this embodiment, the output stability of the radio frequency signal can be improved and the quality of the radio frequency PCB board can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 It is a flow chart of a method for manufacturing a multi-purpose radio frequency electrical product PCB board provided by one embodiment of the present invention;

[0042] Figure 2 It is a flow chart of pre-processing operation of a PCB board to be processed provided by one embodiment of the present invention;

[0043] Figure 3 is a flow chart of performing first graphic processing on a first processing layer and a second processing layer provided by an embodiment of the present invention;

[0044] Figure 4 is a flow chart after hollowing out blind grooves and blind holes provided by an embodiment of the present invention;

[0045] Figure 5 It is a flow chart after the three-layer board forms the external circuit pattern provided by one embodiment of the present invention;

[0046] Figure 6 It is a flow chart of performing second pattern processing and detection on a three-layer board forming an external circuit pattern provided by an embodiment of the present invention;

[0047] Figure 7 It is a flow chart after forming external circuits and external graphics of a three-layer board provided by an embodiment of the present invention;

[0048] Figure 8It is a flow chart after performing second pattern processing and detection on a three-layer board forming an external circuit pattern provided by an embodiment of the present invention;

[0049] Fig. 9 The present invention is a schematic structural diagram of a PCB board for a multi-purpose radio frequency electrical product provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0050] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0051] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0052] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0053] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific content of the technical solution.

[0054] The embodiment of the present invention provides a method for manufacturing a PCB board of a multi-purpose radio frequency electrical product, comprising performing a pretreatment operation on a PCB board to be processed to obtain a standard PNL board, wherein the standard PNL board is provided with a first processing layer and a second processing layer, a semi-cured sheet is provided between the first processing layer and the second processing layer, and the second processing layer is provided with a blind groove; drilling holes in the first processing layer and the second processing layer to obtain blind holes of the standard PNL board; performing a first graphic processing on the inner layers of the first processing layer and the second processing layer to complete the production of the inner layer graphics of the standard PNL board and form the internal circuit of the standard PNL board; The standard PNL board after the circuit is formed is subjected to the first laser cutting, the semi-cured sheet required for laminating the standard PNL board is formed, and the blind grooves and blind holes are hollowed out; the copper foil is connected, stacked and pressed with the first processing layer and the second processing layer respectively, so that the standard PNL board forms a three-layer board; the three-layer board is subjected to the second laser cutting, and the first processing layer, the second processing layer and the copper foil are subjected to conduction drilling; the three-layer board after the conduction drilling is subjected to plasma treatment, so that the three-layer board forms an external circuit pattern; the three-layer board with the external circuit pattern formed is subjected to the second pattern processing and detection to obtain a qualified PCB board.

[0055] Reference Fig. 9 It should be noted that, in this embodiment, the main circuit layer is set on the second processing layer, and blind holes are set to connect the first processing layer with the second processing layer. In order to prevent the copper foil of the second processing layer at the bottom of the blind holes and blind grooves from being damaged due to precision deviation in conventional depth-controlled drilling, the core board of the first processing layer is first drilled, and then connected to the second processing layer by pressing, and the cover is removed after pressing.

[0056] It should be noted that the second processing layer is the signal layer, using RO4350B-LOPRO sheet. The characteristics of the sheet are: this sheet is a woven glass cloth reinforced hydrocarbon resin system / ceramic filler material. Its electrical properties are very close to PTFE / woven glass cloth materials and its processability is similar to epoxy resin / glass cloth materials. It can provide strictly controlled dielectric constants and losses (dielectric constant (Dk) 3.48 (+ / -0.05); dielectric loss (Df) 0.0037@10GHz). The reverse copper foil used in the sheet has a high bonding strength and corrosion resistance with the dielectric, and the reverse copper foil helps reduce signal transmission resistance.

[0057] The control method of the embodiment of the present invention is further described below based on the accompanying drawings.

[0058] Reference Figure 1 , Figure 1 A flowchart of a method for manufacturing a PCB board for a multi-purpose radio frequency electrical product provided by an embodiment of the present invention, the method for manufacturing a PCB board for a multi-purpose radio frequency electrical product includes but is not limited to the following steps:

[0059] Step S11, performing a pretreatment operation on the PCB board to be processed to obtain a standard PNL board, wherein the standard PNL board is provided with a first processing layer and a second processing layer, a prepreg is provided between the first processing layer and the second processing layer, and the second processing layer is provided with a blind groove;

[0060] Step S12, drilling the first processed layer and the second processed layer to obtain blind holes of a standard PNL board;

[0061] It should be noted that the first and second processed layers are drilled by mechanical drilling according to the drill belt designed by the engineering, that is, the blind holes of the finished PCB board. The drilled blind holes are copper plated by chemical reaction, and the copper surface is thickened.

[0062] Step S13, performing a first pattern processing on the inner layers of the first processing layer and the second processing layer, completing the production of the inner layer pattern of the standard PNL board and forming the internal circuit of the standard PNL board;

[0063] It should be noted that after the inner layer circuit of the standard PNL board is manufactured, the optical principle is used to detect common defects of the etched PNL standard board.

[0064] Step S14, performing a first laser cutting on the standard PNL board after the circuit is formed, forming the prepreg required for laminating the standard PNL board, and hollowing out the blind grooves and blind holes;

[0065] It should be noted that the semi-cured sheet required for pressure reduction and bonding is formed by laser cutting, and the blind groove position of the second processing layer is hollowed out, and the openings of the semi-cured sheet at the blind hole and the step groove are retracted by 3mil.

[0066] Step S15, connecting and stacking the copper foil with the first treatment layer and the second treatment layer respectively and pressing them together to form a three-layer board from the standard PNL board;

[0067] It should be noted that after typesetting, a press is used to tightly bond the first treated layer, the prepreg, the second treated layer and the copper foil together through high temperature and high pressure heat fusion to form a three-layer board.

[0068] Step S16, performing a second laser cutting on the three-layer board, and conducting drilling on the first processed layer, the second processed layer and the copper foil;

[0069] It should be noted that the copper foil on the blind groove and blind opening of the laminated three-layer board is cut by laser cutting to expose the substrate, and the first treatment layer, the second treatment layer and the copper foil are drilled by a drilling machine in a mechanical drilling manner according to the drill belt designed by the engineering.

[0070] Step S17, plasma treatment is performed on the three-layer board after the conduction drilling, and an external circuit pattern of the three-layer board is produced;

[0071] It should be noted that the "activation effect" of active particles in the plasma generated in the vacuum chamber is used to remove the drilling dirt on the board surface and in the hole. The specific cleaning process usually includes the following processes: inorganic gas is excited into a plasma state; gas phase substances are adsorbed on the board surface and the hole wall; the adsorbed groups react with molecules on the board surface and the hole wall to generate product molecules; the product molecules are decomposed to form a gas phase; the reaction residues are separated from the board surface and the hole wall.

[0072] Step S18, performing second pattern processing and detection on the three-layer board with the external circuit pattern formed thereon to obtain a qualified PCB board.

[0073] It should be noted that the three-layer board is processed and tested by inspection and testing equipment, and the quality is confirmed to obtain qualified PCB boards, which are then packaged.

[0074] It should be noted that, in this embodiment, the first treatment layer, the second treatment layer and the prepreg are layered in advance so that the inner layer of the blind hole can be drilled, the blind groove of the second treatment layer is drilled in advance, and the second treatment layer is drilled and copper-plated through the blind hole of the first treatment layer. The blind groove and blind hole positions corresponding to the prepreg between the first treatment layer and the second treatment layer are also cut off in advance by laser cutting, and unilateral indentation is performed to prevent overflow glue from covering the bottom of the groove and the copper block at the bottom of the blind hole during lamination. After lamination, the covering copper foil of the blind hole and the blind groove surface is cut by laser cutting, and the cover is removed. A separate blind hole copper deposition program is used to extend the copper deposition time to 2010s. The electroplating adopts the guide clamping point method. The first electroplating is 17ASF*20min, and the electroplating is 17ASF*50min after rotating 180° to ensure the copper thickness requirements of the blind hole and the uniform copper thickness of the board surface.

[0075] In addition, in one embodiment, referring to Figure 2 ,exist Figure 1 Step S11 of the illustrated embodiment also includes but is not limited to the following steps:

[0076] Step S21, cutting the PCB board to be processed according to a preset size so that the PCB board to be processed forms a plurality of standard PNL boards.

[0077] It should be noted that, in this embodiment, the PCB board to be processed is RO4350B-LOPRO H / H sheet material, and the PCB board to be processed is cut into standard PNL sheets with a size of 300*400 mm.

[0078] In addition, in one embodiment, referring to Figure 3 ,exist Figure 1Step S13 of the illustrated embodiment also includes but is not limited to the following steps:

[0079] Step S31, copper plating the blind hole, and thickening the copper surface of the copper-plated blind hole;

[0080] Step S32, attaching a photosensitive dry film to the surface of the standard PNL plate, and irradiating the photosensitive dry film with ultraviolet light to transfer the pattern on the film to the surface of the photosensitive dry film;

[0081] Step S33, chemically etching the standard PNL board, etching the surface of the standard PNL board where no copper surface coverage is required, so that the first treatment layer and the second treatment layer are exposed from the substrate, forming the circuit and pattern of the PNL board;

[0082] Step S34, performing defect detection on the standard PNL board after etching.

[0083] It should be noted that the drilled holes are plated with copper through chemical reaction, and the copper on the surface is thickened. A photosensitive dry film is attached to the standard PNL board, and the pattern on the film is transferred to the dry film through ultraviolet light exposure. The copper layer is etched away where it is not needed through chemical etching with liquid medicine to expose the substrate, forming a circuit to complete the pattern production of the first processing layer and the second processing layer.

[0084] In addition, in one embodiment, referring to Figure 4 ,exist Figure 1 Step S11 of the illustrated embodiment also includes but is not limited to the following steps:

[0085] Step S41, performing browning treatment on the surface of the PNL board to form a browning film on the surface of the copper portion of the PCN board.

[0086] It should be noted that a layer of brown film will be deposited on the copper position through the chemical reaction of the solution, which is conducive to the close bonding of the semi-cured sheet and the copper surface during pressing.

[0087] In addition, in one embodiment, referring to Figure 5 ,exist Figure 1 Step S11 of the illustrated embodiment also includes but is not limited to the following steps:

[0088] Step S51, confirming the welding positions and non-welding positions of the three-layer board, and covering the non-welding positions with solder mask ink;

[0089] Step S52, silk-screening the ink characters of the welding component numbers required for the three-layer board at the welding positions.

[0090] It should be noted that the positions where components do not need to be welded are covered with solder mask ink by screen printing, and the character ink serving as the welding component numbers is screen printed at the corresponding positions by screen printing.

[0091] In addition, in one embodiment, referring to Figure 6 ,exist Figure 1 Step S11 of the illustrated embodiment also includes but is not limited to the following steps:

[0092] Step S61, copper is deposited on the blind grooves, blind holes and drilled holes of the three-layer board, and the copper layer after copper deposition is thickened;

[0093] Step S62, covering the surface of the three-layer board with a photosensitive dry film, and transferring the pattern on the film to the surface of the photosensitive dry film by ultraviolet light;

[0094] Step S63, removing the unexposed photosensitive dry film by developing with a chemical solution to expose the copper surface;

[0095] Step S64, chemically etching the copper surface to expose the substrate of the three-layer board and form the external circuit and outer layer pattern of the three-layer board.

[0096] It should be noted that thin copper is deposited on the walls of the drilled through holes, blind holes and blind grooves through chemical reactions, and then the copper is thickened by electroplating. A photosensitive dry film is pasted on the production board, and the pattern on the film is transferred to the dry film through ultraviolet light exposure. The unexposed dry film is then removed through chemical development to expose the copper surface for etching. The copper layer in places where it is not needed is etched away through chemical etching with chemicals to expose the substrate, forming a circuit to complete the outer layer pattern.

[0097] In addition, in one embodiment, referring to Figure 7 ,exist Figure 1 Step S11 of the illustrated embodiment also includes but is not limited to the following steps:

[0098] Step S71, connecting the test device to multiple test points of the three-layer board;

[0099] Step S72, applying a preset high voltage and low current between the multiple test points, measuring the current value and the voltage value between the multiple test points, and calculating the first resistance values ​​of the multiple test points according to the current value and the voltage value;

[0100] Step S73, comparing the first resistance value with a preset second resistance value, when the first resistance value is less than the second resistance value, the three-layer board is qualified, and when the first resistance value is greater than or equal to the second resistance value, the three-layer board is unqualified.

[0101] It should be noted that the probe or flying probe directly contacts the PCB and applies a known level of high voltage or low current between the test points. The system measures the current or voltage between the corresponding test points and calculates the resistance value based on Ohm's law R+U / I. The resistance value is compared with the set resistance value to determine the continuity of the circuit and ensure the performance of the circuit board.

[0102] In addition, in one embodiment, referring to Figure 8 ,exist Figure 1 Step S11 of the illustrated embodiment also includes but is not limited to the following steps:

[0103] Step S81, forming a nickel-phosphorus alloy layer on the exposed copper foil surface of the three-layer board, and plating gold on the surface of the nickel-phosphorus alloy layer according to a replacement reaction;

[0104] Step S82, stamping the gold-plated three-layer board.

[0105] It should be noted that a layer of nickel-phosphorus alloy is plated on the copper surface through chemical reaction, and then a layer of gold is plated on the surface of nickel through replacement reaction. When the gold plating of the three-layer board is completed, a special mold uses high-speed stamping equipment to shape the three-layer board into a finished product to obtain the final PCB board.

[0106] The above is a specific description of the preferred implementation of the present invention, but the present invention is not limited to the above-mentioned implementation mode. Technical personnel familiar with the field can also make various equivalent deformations or substitutions under the shared conditions without violating the spirit of the present invention. These equivalent deformations or substitutions are all included in the scope defined by the claims of the present invention.

Claims

1. A method for manufacturing a PCB board for a multi-purpose radio frequency electrical product, characterized in that: include: Performing a pretreatment operation on the PCB board to be processed to obtain a standard PNL board, wherein the standard PNL board is provided with a first processing layer and a second processing layer, a prepreg is provided between the first processing layer and the second processing layer, and the second processing layer is provided with a blind groove; Drilling the first processed layer and the second processed layer to obtain blind holes of the standard PNL board; Performing a first pattern processing on the inner layers of the first processing layer and the second processing layer to complete the production of the inner layer pattern of the standard PNL board and form the internal circuit of the standard PNL board; Performing a first laser cutting on the standard PNL board after the circuit is formed, forming the semi-cured sheet required for laminating the standard PNL board, and hollowing out the blind groove and the blind hole; Connecting and stacking the copper foil with the first treatment layer and the second treatment layer respectively and pressing them together to form the standard PNL board into a three-layer board; Performing a second laser cutting on the three-layer board, and conducting drilling on the first processed layer, the second processed layer and the copper foil; Plasma treatment is performed on the three-layer board after the conduction drilling, and an external circuit pattern of the three-layer board is produced; The three-layer board forming the external circuit pattern is subjected to second pattern processing and detection to obtain a qualified PCB board.

2. The method for manufacturing a PCB board for a multi-purpose radio frequency electrical product according to claim 1, characterized in that: The pre-processing operation of the PCB board to be processed includes: The PCB board to be processed is cut according to a preset size so that the PCB board to be processed forms a plurality of standard PNL boards.

3. The method for manufacturing a PCB board for a multi-purpose radio frequency electrical product according to claim 1, characterized in that: The performing first graphic processing on the first processing layer and the second processing layer includes: Copper plating is performed on the blind hole, and the copper surface of the blind hole after copper plating is thickened; A photosensitive dry film is attached to the surface of the standard PNL plate, and the photosensitive dry film is irradiated with ultraviolet light to transfer the pattern on the negative film to the surface of the photosensitive dry film; Chemically etching the standard PNL board, etching the surface of the standard PNL board where the copper surface does not need to be covered, so that the first processing layer and the second processing layer are exposed from the substrate, forming the circuit and pattern of the PNL board; Defect detection is performed on the standard PNL board after the etching is completed.

4. The method for manufacturing a PCB board for a multi-purpose radio frequency electrical product according to claim 1, characterized in that: After hollowing out the blind groove and the blind hole, the method further includes: The surface of the PNL plate is subjected to browning treatment to form a browning film on the surface of the copper portion of the PCN plate.

5. The method for manufacturing a PCB board for a multi-purpose radio frequency electrical product according to claim 1, characterized in that: After forming an external circuit pattern on the three-layer board, the method further comprises: Identify the welding positions and non-welding positions of the three-layer board, and cover the non-welding positions with solder mask ink; The ink characters of the welding component numbers required for the three-layer board are silk-screened on the welding positions.

6. The method for manufacturing a PCB board for a multi-purpose radio frequency electrical product according to claim 1, characterized in that: The second pattern processing and detection of the three-layer board forming the external circuit pattern includes: Coppering the blind grooves, blind holes and drilled holes of the three-layer board, and thickening the copper layer after coppering; Covering the surface of the three-layer board with a photosensitive dry film, and transferring the pattern on the negative film to the surface of the photosensitive dry film by ultraviolet light; The unexposed photosensitive dry film is removed by developing with a chemical solution to expose the copper surface; The copper surface is chemically etched to expose the substrate of the three-layer board, thereby forming the external circuit and outer layer pattern of the three-layer board.

7. The method for manufacturing a PCB board for a multi-purpose radio frequency electrical product according to claim 6, characterized in that: After forming the external circuits and external graphics of the three-layer board, the method further comprises: Connecting a test device to a plurality of test points of the three-layer board; Applying a preset high voltage and a low current between the plurality of test points, measuring the current value and the voltage value between the plurality of test points, and calculating the first resistance values ​​of the plurality of test points according to the current value and the voltage value; The first resistance value is compared with a preset second resistance value. When the first resistance value is less than the second resistance value, the three-layer board is qualified. When the first resistance value is greater than or equal to the second resistance value, the three-layer board is unqualified.

8. The method for manufacturing a PCB board for a multi-purpose radio frequency electrical product according to claim 1, characterized in that: After performing second pattern processing and detection on the three-layer board forming the external circuit pattern, the method further comprises: Forming a nickel-phosphorus alloy layer on the surface of the copper foil exposed on the three-layer board, and plating gold on the surface of the nickel-phosphorus alloy layer according to a replacement reaction; The three-layer board after gold plating is subjected to stamping.

9. The method for manufacturing a PCB board for a multi-purpose radio frequency electrical product according to claim 1, characterized in that: The blind hole has a diameter of 0.5 mm and a depth of 0.1 mm.

10. The method for manufacturing a PCB board for a multi-purpose radio frequency electrical product according to claim 4, characterized in that: The brown film has a thickness of 1 to 2 microns.

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