CGA forward column planting method

Abstract

The invention discloses a CGA forward column planting method, and relates to the technical field of column planting. According to the CGA forward column planting method, the bottom of the welding hole is limited through the gasket, the welding column is assembled in the positioning plate firstly, the gasket is conveniently disassembled and assembled through matched arrangement of the extension groove, the extension plate, the insertion plate, the insertion groove and the inner hexagon bolt, and then convenient conditions are provided for cleaning of the welding hole; and then under the cooperation of the assembling groove, the ceramic limiting piece and the implanting groove, forward assembling of the device to be implanted with the column after being coated with the welding flux is carried out, after reflow soldering, the welded device to be implanted with the column and the welding column can be directly taken out together and assembled again, batched column implanting is carried out, the requirement for the heating efficiency of welding equipment is low, and the cost is low. The automatic production condition is achieved, operation is easy, meanwhile, the structure is simple, the machining cost is reduced, and effective and reliable support is provided for CGA batch efficient machining.

Description

Technical Field

[0001] The invention relates to the technical field of column planting, in particular to a CGA forward column planting method. Background Art

[0002] With the development of electronic technology, the requirements for high density, high reliability and low cost of electronic components are constantly increasing. Traditional packaging methods are increasingly unable to meet the requirements, forcing the continuous improvement of packaging technology. CGA (column grid array) is a connection method developed based on BGA (ball grid array). CGA uses higher solder columns to replace the solder balls of BGA. When the ceramic substrate is welded to the PCB board, the higher solder columns can better adapt to the thermal stress between the substrate and the PCB board than the solder balls, thereby improving the thermal fatigue life and reliability of the device.

[0003] CGA is widely used in aviation, aerospace and military industry because of its high temperature resistance, high voltage resistance, high reliability and more I / O ports. CGA devices are gradually developing towards convenience, intelligence and high performance, and have high requirements for their reliability. Conventional CGA packaging is complex. In the conventional column planting method, the bottom layer is CGA, and the upper layer is the installation of column planting limit fixtures and columns. During the production process, the columns fall toward the device. CGA has the disadvantages of difficult column planting, high cost, poor stability and low efficiency. Therefore, a CGA forward column planting method is proposed to achieve simple, fast and efficient CGA column planting. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides a method for positive CGA column planting, which solves the problems of conventional CGA packaging being complex, difficult to plant, high cost, poor stability and low efficiency.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: A method for positive CGA column planting, specifically comprising the following steps: S1. After fixing the gasket to the bottom of the positioning plate, transfer the welding column to the positioning plate through the transfer plate; S2, select a ceramic limiter that matches the device to be planted, and place the ceramic limiter on the top of the positioning plate; S3, after coating the solder on the welding surface of the device to be implanted, the device to be implanted is placed in the ceramic limiting plate, so that the device to be implanted contacts the solder column, and then reflow soldering is performed; S4. After welding is completed, the ceramic limiting plate is first taken out from the positioning plate, and then the component to be planted is taken out. At this time, the component to be planted is separated from the positioning plate together with the welding column, and the pillar planting process of the component to be planted is completed.

[0006] The present invention is further configured as follows: a groove is provided at the bottom of the positioning plate, and the groove is used in conjunction with a gasket.

[0007] The present invention is further configured as follows: both sides of the gasket are fixedly connected with extension plates, one side of the top of the two extension plates is fixedly installed with an insert plate, the bottom of the positioning plate is provided with an extension groove connected with the groove, and the top of the extension groove is provided with a slot; The extension plate is used in conjunction with the extension slot, the insert plate is used in conjunction with the slot, and the insert plate and the positioning plate are fixed by means of hexagon socket bolts.

[0008] The present invention is further configured as follows: a mounting groove is provided on the top of the positioning plate, a plurality of welding holes are provided on the bottom of the mounting groove, the welding holes are used in conjunction with welding columns, and the plurality of welding holes are connected to the groove.

[0009] The present invention is further configured as follows: the ceramic limiting piece is used in conjunction with the assembly groove, and hand grooves are provided on both sides of the assembly groove.

[0010] The present invention is further configured as follows: an implantation groove is provided on the top of the ceramic limiting plate, and the implantation groove is used in conjunction with the column device to be implanted.

[0011] The present invention is further configured as follows: both sides of the top of the ceramic limiting plate are provided with access grooves, the two sides of the access groove are respectively connected to the hand groove and the implantation groove, and a pick-and-place block is integrally formed at the bottom of the inner cavity of the access groove and on one side close to the hand groove.

[0012] The present invention is further configured such that: a positioning notch is also provided on the periphery of the ceramic limiting plate.

[0013] The present invention provides a method for positive CGA column planting, which has the following beneficial effects: (1) The present invention uses a gasket to limit the bottom of the welding hole, first assembles the solder column in the positioning plate, and then, with the cooperation of the assembly groove, the ceramic limit plate and the implantation groove, performs forward assembly of the component to be implanted after coating with solder. After reflow soldering, the component to be implanted and the solder column that have been welded can be directly taken out together and assembled again for batch implantation. It has low requirements on the heating efficiency of the welding equipment, has the conditions for automated production, is simple to operate, has a simple structure, and reduces processing costs, providing effective and reliable support for batch and efficient processing of CGA.

[0014] (2) The present invention realizes convenient disassembly and assembly of the gasket through the coordinated arrangement of the extension groove, the extension plate, the plug plate, the slot and the hexagon socket bolt, thereby providing convenient conditions for cleaning the welding hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the external structure of the present invention; Figure 2It is a schematic diagram of the external structure of the present invention from a vertical viewing angle; Figure 3 An exploded view of the structure of the present invention; Figure 4 It is a schematic diagram of the structure of the positioning plate, the groove, the extension groove, the slot, the welding hole, the gasket, the extension plate and the plug plate of the present invention; Figure 5 It is a structural schematic diagram of the positioning plate of the present invention; Figure 6 It is a cross-sectional view of the present invention.

[0016] In the figure: 1. Positioning plate; 101. Groove; 102. Extension groove; 103. Slot; 104. Assembly groove; 105. Welding hole; 106. Hand groove; 2. Gasket; 201. Extension plate; 202. Insert plate; 3. Welding column; 4. Devices to be planted; 5. Ceramic limit piece; 501. Implantation groove; 502. Access groove; 503. Pick-and-place block; 504. Positioning missing corner. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0018] See also Figure 1-6 , the embodiment of the present invention provides the following technical solutions: Embodiment 1: A method for positive CGA column planting includes a positioning plate 1, which is used for welding positioning of a column device 4 to be planted and a welding column 3. In order to achieve the positioning of the welding column 3, an assembly groove 104 is opened on the top of the positioning plate 1, and hand grooves 106 are opened on both sides of the assembly groove 104. A plurality of welding holes 105 are opened at the bottom of the assembly groove 104, and the welding holes 105 are used in conjunction with the welding column 3.

[0019] Further explanation, in order to achieve convenient sealing of the welding hole 105 and provide convenient conditions for cleaning the welding hole 105, a groove 101 is opened at the bottom of the positioning plate 1, and several welding holes 105 are connected to the groove 101. A gasket 2 is slidably installed inside the groove 101. The overall coplanarity of the gasket 2 is less than 10μm. Extension plates 201 are fixedly connected on both sides of the gasket 2, and an insert plate 202 is fixedly installed on one side of the top of the two extension plates 201. An extension groove 102 connected to the groove 101 is opened at the bottom of the positioning plate 1, the extension plate 201 is used in conjunction with the extension groove 102, and a slot 103 is opened at the top of the extension groove 102, the insert plate 202 is used in conjunction with the slot 103, and the insert plate 202 and the positioning plate 1 are fixed by hexagon socket bolts. Specifically, two hexagon socket bolts are provided, and the two hexagon socket bolts are respectively penetrated and threadedly installed on both sides of the positioning plate 1.

[0020] The specific method of using the above device includes the following steps: S1, place the gasket 2 in the groove 101 at the bottom of the positioning plate 1, make the extension plate 201 fall into the extension groove 102, insert the insert plate 202 into the slot 103, and then tighten the hexagon socket bolts. After the gasket 2 is fixed, transfer the welding column 3 to the several welding holes 105 of the positioning plate 1 through the transfer plate; S2, after coating the solder on the soldering surface of the device 4 to be implanted, the device 4 to be implanted is brought into contact with the soldering column 3, and then reflow soldering is performed; S3, after the welding is completed, the component 4 to be planted is taken out, and at this time, the component 4 to be planted is separated from the positioning plate 1 together with the welding column 3, and the planting process of the component 4 to be planted is completed.

[0021] Embodiment 2. This embodiment is an improvement on the previous embodiment. A method for positive column planting of CGA also includes a ceramic limit plate 5. Specifically, the ceramic limit plate 5 is used in conjunction with the assembly groove 104. An implantation groove 501 is provided on the top of the ceramic limit plate 5. The implantation groove 501 is used in conjunction with the column device 4 to be planted. According to the difference of the implantation groove 501, convenient positioning is provided for the column planting processing of different column devices 4 to be planted. In order to achieve accurate placement of the column device 4 to be planted, a positioning notch 504 is also provided on the periphery of the ceramic limit plate 5.

[0022] To further illustrate, both sides of the top of the ceramic limiting plate 5 are provided with access grooves 502, the two sides of the access groove 502 are respectively connected to the hand groove 106 and the implantation groove 501, and a pick-up and placement block 503 is integrally formed at the bottom of the inner cavity of the access groove 502 and on one side close to the hand groove 106.

[0023] The advantages of the second embodiment over the first embodiment are: the ceramic limit plate 5 is used to provide precise limiting for the stable placement of the component 4 to be planted, thereby ensuring the stability of the component 4 to be planted during the reflow soldering process, and by providing the ceramic limit plate 5 with different implantation grooves 501, the positioning plate 1 provides convenient conditions for the pillar processing of the component 4 to be planted with different sizes, and has good generalization ability.

[0024] In summary, the method for using the above device specifically includes the following steps: S1, place the gasket 2 in the groove 101 at the bottom of the positioning plate 1, make the extension plate 201 fall into the extension groove 102, insert the insert plate 202 into the slot 103, and then tighten the hexagon socket bolts. After the gasket 2 is fixed, transfer the welding column 3 to the several welding holes 105 of the positioning plate 1 through the transfer plate; S2, selecting a ceramic limiting piece 5 corresponding to the implantation groove 501 adapted to the device 4 to be implanted, and placing the ceramic limiting piece 5 on the top of the positioning plate 1; S3, after applying solder on the welding surface of the component 4 to be planted, observe and locate the missing corner 504, put the component 4 to be planted into the implantation groove 501, make the component 4 to be planted contact with the welding column 3, and then perform reflow soldering; S4, after welding is completed, the component 4 to be planted is taken out from the two taking grooves 502, and the component 4 to be planted is separated from the positioning plate 1 together with the welding column 3, and the planting process of the component 4 to be planted is completed.

[0025] It should be noted that when the component 4 to be planted cannot be taken out from the taking groove 502 , the ceramic limiting piece 5 is first taken out from the hand groove 106 , and then the component 4 to be planted is taken out.

[0026] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0027] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A method for CGA positive column planting, characterized in that: The specific steps include: S1, after fixing the gasket (2) on the bottom of the positioning plate (1), transferring the welding column (3) to the positioning plate (1) through the transfer plate; S2, selecting a ceramic limiting piece (5) that is compatible with the column device (4) to be planted, and placing the ceramic limiting piece (5) on the top of the positioning plate (1); S3, after coating the solder on the welding surface of the component to be planted (4), placing the component to be planted (4) into the ceramic limiting plate (5), making the component to be planted (4) contact with the welding column (3), and then performing reflow soldering; S4. After the welding is completed, the ceramic limiting plate (5) is first removed from the positioning plate (1), and then the component to be planted (4) is removed. At this time, the component to be planted (4) is separated from the positioning plate (1) together with the welding column (3), and the column planting process of the component to be planted (4) is completed.

2. A CGA positive column planting method according to claim 1, characterized in that: The bottom of the positioning plate (1) is provided with a groove (101), and the groove (101) is used in conjunction with the gasket (2).

3. A CGA positive column planting method according to claim 2, characterized in that: Extension plates (201) are fixedly connected to both sides of the gasket (2), and plug plates (202) are fixedly installed on one side of the top of the two extension plates (201); an extension groove (102) communicating with the groove (101) is provided at the bottom of the positioning plate (1), and a slot (103) is provided at the top of the extension groove (102); The extension plate (201) is used in conjunction with the extension slot (102), the insertion plate (202) is used in conjunction with the slot (103), and the insertion plate (202) and the positioning plate (1) are fixed by means of hexagon socket bolts.

4. The method for positive CGA column implantation according to claim 2, characterized in that: The top of the positioning plate (1) is provided with an assembly groove (104), the bottom of the assembly groove (104) is provided with a plurality of welding holes (105), the welding holes (105) are used in conjunction with welding columns (3), and the plurality of welding holes (105) are all arranged in communication with the groove (101).

5. A CGA positive column planting method according to claim 4, characterized in that: The ceramic limiting plate (5) is used in conjunction with the assembly groove (104), and hand grooves (106) are provided on both sides of the assembly groove (104).

6. A CGA positive column implantation method according to claim 5, characterized in that: An implantation groove (501) is provided on the top of the ceramic limiting plate (5), and the implantation groove (501) is used in conjunction with the column device (4) to be implanted.

7. A CGA positive column implantation method according to claim 6, characterized in that: Both sides of the top of the ceramic limiting plate (5) are provided with access grooves (502), the two sides of the access groove (502) are respectively connected to the hand groove (106) and the implantation groove (501), and a pick-and-place block (503) is integrally formed at the bottom of the inner cavity of the access groove (502) and on one side close to the hand groove (106).

8. The method for positive CGA column implantation according to claim 1, characterized in that: The outer periphery of the ceramic limiting plate (5) is also provided with a positioning notch (504).

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