Liquid cooling assembly and server cabinet

By designing a liquid-cooled assembly with a bottom wall and a peripheral wall, ensuring that the cooling medium can still fill the bottom wall and contact the server when the cooling housing is inclined, the problem of uneven distribution of coolant in the existing cooling components is solved and the uniformity of the cooling effect is improved.

CN120018448AActive Publication Date: 2025-05-16INSPUR SUZHOU INTELLIGENT TECH CO LTD
View PDF 11 Cites 0 Cited by

Patent Information

Application Number
CN202510081387.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-17
Publication Date
2025-05-16
Estimated Expiration
2045-01-17

AI Technical Summary

Technical Problem

When the existing plate cooling components are inclined, the coolant is distributed unevenly, which affects the cooling effect, especially in the cooling components below the server.

Method used

A liquid cooling assembly is designed, and the cooling housing includes a bottom wall and a peripheral wall. A first cavity is provided in the bottom wall and a second cavity extending in the circumferential direction. The two cavity are connected. The inlet and outlet of the medium are in communication with the cooling chamber to ensure that the cooling medium can still fill the position where the bottom wall contacts the server when the cooling housing is inclined.

Benefits of technology

Through this design, the liquid-cooled component can still ensure the contact between the bottom wall and the server when tilted, improve the uniformity of the cooling effect and enhance the cooling performance of the server.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN120018448A_ABST
    Figure CN120018448A_ABST
Patent Text Reader

Abstract

The invention belongs to the technical field of servers, and particularly discloses a liquid cooling assembly and a server cabinet. The liquid cooling assembly comprises a cooling part, the cooling part comprises a cooling shell, the cooling shell comprises a bottom wall and a peripheral wall, the peripheral wall is arranged on the outer periphery of the bottom wall, a containing cavity is defined by the peripheral wall and the bottom wall, the cooling shell is provided with a cooling cavity, the cooling cavity comprises a first cavity and a second cavity which communicate with each other, and the first cavity is formed in the bottom wall; the second cavity is formed in the peripheral wall and extends by a circle in the circumferential direction of the peripheral wall, a medium inlet and a medium outlet are formed in the cooling shell and communicate with the cooling cavity, and therefore a cooling medium is conveyed into the cooling cavity through the medium inlet and discharged out of the cooling cavity through the medium outlet. According to the invention, the cooling consistency of the server can be improved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The invention belongs to the technical field of servers, and in particular relates to a liquid cooling component and a server cabinet. Background Art

[0002] The cooling of servers is crucial to ensuring the performance, reliability and safety of servers. When the plate cooling assembly in the related art cools the server, if the plate cooling assembly is tilted, the cooling liquid on the higher side will be less than the cooling liquid on the lower side, which will affect the uniformity of cooling, especially when the cooling assembly is located under the server. Summary of the invention

[0003] The present invention aims to solve one of the technical problems in the related art at least to a certain extent. To this end, an embodiment of the present invention provides a liquid cooling assembly that can improve the consistency of cooling a server.

[0004] The invention also provides a server cabinet.

[0005] In this embodiment, the liquid cooling component includes a cooling component, which includes a cooling shell, and the cooling shell includes a bottom wall and a peripheral wall. The peripheral wall is arranged on the outer peripheral edge of the bottom wall and forms an accommodating cavity with the bottom wall. The cooling shell has a cooling cavity, and the cooling cavity includes a first cavity and a second cavity that are connected to each other. The first cavity is arranged in the bottom wall, and the second cavity is arranged in the peripheral wall and extends around the circumference of the peripheral wall. The cooling shell has a medium inlet and a medium outlet, and the medium inlet and the medium outlet are both connected to the cooling cavity, so as to transport the cooling medium into the cooling cavity through the medium inlet and discharge the cooling medium in the cooling cavity through the medium outlet.

[0006] It can be understood that the cooling shell in this embodiment includes a bottom wall and a peripheral wall, a first cavity is set in the bottom wall, a second cavity is set in the peripheral wall, and the first cavity and the second cavity are connected to each other. When the cooling medium is transported into the cooling cavity through the medium inlet, the cooling medium can flow to the first cavity and the second cavity. As the cooling medium is continuously transported, the cooling medium flows to the cooling medium outlet and then flows out from the cooling medium outlet, so that the cooling medium in the cooling cavity is replaced in time, thereby improving the cooling effect. Since the bottom and the peripheral wall of the cooling shell are filled with cooling medium, under the action of gravity, the cooling medium will flow to the first cavity of the bottom wall, so that the first cavity is first filled with cooling medium. When the cooling shell is tilted, the cooling medium in the second cavity will flow into the first cavity, thereby ensuring that the first cavity of the bottom wall is filled with cooling medium. There is no gap in the position corresponding to the server inside the bottom wall, and the bottom wall contacts the server to better perform heat exchange, thereby improving the uniformity of cooling of the server by the cooling component.

[0007] In this embodiment, the medium inlet and the medium outlet are both arranged on the peripheral wall, and the medium inlet and the medium outlet are located on two opposite sides of the peripheral wall.

[0008] In this embodiment, the peripheral wall includes a first section, a second section, a third section and a fourth section, the first section is arranged opposite to the third section, the second section and the fourth section are arranged opposite to each other, the medium inlet is arranged in the first section, the medium outlet is arranged in the third section, and the heights of the first section and the third section are higher than those of the second section and the fourth section.

[0009] In this embodiment, the bottom wall and the peripheral wall are integrally formed.

[0010] In this embodiment, the cooling component further includes a mounting member, which is disposed on the cooling shell and is used to mount the cooling shell.

[0011] In this embodiment, the liquid cooling component also includes a connecting component, and two cooling components are arranged at intervals in an upper and lower manner. The space formed between the upper and lower cooling components is used to accommodate the server, and the upper and lower cooling components are connected by the connecting component so that the lower cooling component supports the upper cooling component through the connecting component.

[0012] In this embodiment, the connecting component includes a first connecting seat, a second connecting seat and a connecting support member, the first connecting seat is arranged at the lower cooling shell; the second connecting seat is arranged at the upper cooling shell; the first connecting portion of the connecting support member is connected to the first connecting seat, and the second connecting portion of the connecting support member is connected to the second connecting seat.

[0013] In this embodiment, the connection support member is adjustably connected to the first connection seat; and / or the connection support member is adjustably connected to the second connection seat.

[0014] The server cabinet in this embodiment includes a cabinet body, the above-mentioned liquid cooling component and a server, wherein the liquid cooling component is arranged in the cabinet body; the server is arranged in the cabinet body and contacts the bottom wall.

[0015] In this embodiment, the server cabinet further includes a main liquid inlet pipe and a main liquid outlet pipe arranged on the cabinet body, the main liquid inlet pipe is connected to the medium inlet through a branch liquid inlet pipe, and the main liquid outlet pipe is connected to the medium outlet through a branch liquid outlet pipe. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a three-dimensional diagram of a liquid cooling assembly according to an embodiment of the present invention;

[0017] Figure 2 is a three-dimensional diagram of a cooling component according to an embodiment of the present invention;

[0018] Figure 3 sectional view of a cooling component according to an embodiment of the present invention Figure 1 ;

[0019] Figure 4 sectional view of a cooling component according to an embodiment of the present invention Figure 2 ;

[0020] Figure 5 sectional view of a cooling component according to an embodiment of the present invention Figure 3 ; Figure 6 It is a schematic diagram of the structure of a server cabinet according to an embodiment of the present invention.

[0021] 100. Liquid cooling assembly; 10. Cooling component; 1. Cooling shell; 11. Cooling chamber; 111. First chamber; 112. Second chamber; 12. Medium inlet; 13. Medium outlet; 14. Bottom wall; 15. Peripheral wall; 151. First section; 152. Second section; 153. Third section; 154. Fourth section; 16. Accommodating chamber; 2. Heat dissipation fins; 3. Mounting member; 4. Connecting member; 41. First connecting seat; 42. Second connecting seat; 43. Connecting support member.

[0022] 200, cabinet body; 201, mounting bracket; 300, main liquid inlet pipe; 400, main liquid outlet pipe; 500, server. DETAILED DESCRIPTION

[0023] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to be used to explain the present invention, but should not be understood as limiting the present invention.

[0024] In this embodiment, if Figures 1 to 4 As shown, the liquid cooling component 100 includes a cooling component 10, and the cooling component 10 includes a cooling shell 1. The cooling shell 1 includes a bottom wall 14 and a peripheral wall 15. The peripheral wall 15 is arranged on the outer periphery of the bottom wall 14 and forms a receiving cavity 16 with the bottom wall 14. The cooling shell 1 has a cooling cavity 11. The cooling cavity 11 includes a first cavity 111 and a second cavity 112 that are interconnected. The first cavity 111 is arranged in the bottom wall 14, and the second cavity 112 is arranged in the peripheral wall 15 and extends around the circumference of the peripheral wall 15. The cooling shell 1 has a medium inlet 12 and a medium outlet 13. The medium inlet 12 and the medium outlet 13 are both connected to the cooling cavity 11, so as to transport the cooling medium into the cooling cavity 11 through the medium inlet 12 and discharge the cooling medium in the cooling cavity 11 through the medium outlet 13.

[0025] like Figure 5As shown, when the cooling component 10 is disposed under the server 500, the bottom of the server 500 can be disposed in the accommodating cavity 16, the bottom of the server 500 contacts the bottom wall 14 of the accommodating cavity 16, and the bottom of the side wall of the server 500 contacts the side wall of the accommodating cavity 16, thereby increasing the contact range between the server 500 and the cooling component 10, which is beneficial to improving the cooling effect of the cooling component 10 on the server 500.

[0026] Specifically, a first connector may be provided at the medium inlet 12 , and a second connector may be provided at the medium outlet 13 , so as to facilitate the connection of the infusion pipeline with the medium inlet 12 and the medium outlet 13 .

[0027] When the cooling component 10 cools the server 500 , the bottom wall 14 is placed downward and the surrounding wall 15 is placed upward. The cooling component 10 can be set below the server 500 , or above the server 500 , or both above and below the server 500 .

[0028] It can be understood that the cooling shell 1 in this embodiment includes a bottom wall 14 and a surrounding wall 15, a first cavity 111 is arranged in the bottom wall 14, and a second cavity 112 is arranged in the surrounding wall 15, and the first cavity 111 and the second cavity 112 are connected to each other. When the cooling medium is transported into the cooling cavity 11 through the medium inlet 12, the cooling medium can flow to the first cavity 111 and the second cavity 112. As the cooling medium is continuously transported, the cooling medium flows to the cooling medium outlet 13 and then flows out from the cooling medium outlet 13, so that the cooling medium in the cooling cavity 11 can be replaced in time, thereby improving the cooling effect. Since the bottom and the surrounding wall 15 of the cooling shell 1 are filled with cooling medium, under the action of gravity, the cooling medium will flow to the first cavity 111 of the bottom wall 14, so that the first cavity 111 is first filled with cooling medium. When the cooling shell 1 is tilted, the cooling medium in the second cavity 112 will flow into the first cavity 111, thereby ensuring that the first cavity 111 of the bottom wall 14 is filled with cooling medium. There is no gap at the position corresponding to the server 500 inside the bottom wall 14, and the bottom wall 14 can better perform heat exchange by contacting the server, thereby improving the uniformity of cooling the server 500 by the cooling component 10.

[0029] In this embodiment, the medium inlet 12 and the medium outlet 13 are both disposed on the peripheral wall 15 , and the medium inlet 12 and the medium outlet 13 are located on two opposite sides of the peripheral wall 15 .

[0030] For example, the medium inlet 12 and the medium outlet 13 are both located at one end of the peripheral wall 15 away from the bottom wall 14, so that when the bottom wall 14 is placed downward and the peripheral wall 15 is placed upward, more cooling medium can be filled into the cooling cavity 11 to reduce dead space.

[0031] It can be understood that after the cooling medium is input from the medium inlet 12, it flows from the medium interface side to the medium outlet 13 side. The medium inlet 12 and the medium outlet 13 are arranged relatively to each other, so that the flow of the cooling medium can cross the cooling shell 1, and the cooling medium can be fully utilized for heat exchange, while the heated cooling medium can be discharged in time.

[0032] In this embodiment, if Figure 2 As shown, the peripheral wall 15 includes a first section 151, a second section 152, a third section 153 and a fourth section 154, the first section 151 and the third section 153 are arranged opposite to each other, the second section 152 and the fourth section 154 are arranged opposite to each other, the medium inlet 12 is arranged at the first section 151, the medium outlet 13 is arranged at the third section 153, and the heights of the first section 151 and the third section 153 are higher than the heights of the second section 152 and the fourth section 154.

[0033] For example, when the bottom wall 14 is a square, the positions of the first section 151, the second section 152, the third section 153 and the fourth section 154 correspond to the four sides of the bottom wall 14. Generally, the server 500 is a rectangular parallelepiped, and the bottom wall 14 is set to be a square, which can facilitate the matching of the cooling housing 1 and the server 500 and the installation of the cooling housing 1. It should be noted that the bottom wall 14 can be set to a square or a polygon such as a pentagon, hexagon, heptagon or octagon, and the outer peripheral contour of the peripheral wall 15 matches the outer peripheral contour of the bottom wall 14. Therefore, the number of sections constituting the peripheral wall 15 is not used to limit the present invention.

[0034] It can be understood that since the heights of the first section 151 and the third section 153 are higher than those of the second section 152 and the fourth section 154, when the cooling shell 1 is tilted, the cooling medium in the cooling cavity 11 will flow from high to low, and the position of the peripheral wall 15 adjacent to the bottom wall 14 can be preferentially filled with the cooling medium, thereby improving the uniformity of cooling of the server 500 by the bottom of the peripheral wall 15.

[0035] In this embodiment, the bottom wall 14 and the peripheral wall 15 are integrally formed.

[0036] For example, the bottom wall 14 and the peripheral wall 15 can be integrally formed by 3D printing. Of course, the bottom wall 14 and the peripheral wall 15 can also be integrally formed by other methods, which are not limited here.

[0037] It is understandable that by integrally forming the bottom wall 14 and the peripheral wall 15, it is beneficial to improve the sealing effect of the cooling chamber 11, reduce the leakage of the cooling medium during use, and thus improve the safety of using the cooling component 10. It should be noted that the purpose of setting the bottom wall 14 and the peripheral wall 15 as an integral molding is to improve the sealing effect of the cooling chamber 11, and the bottom wall 14 and the peripheral wall 15 can also be formed in a split manner to achieve good sealing. Therefore, the bottom wall 14 and the peripheral wall 15 can also be processed in a split molding manner, and the method of integrally forming the bottom wall 14 and the peripheral wall 15 is not used to limit the present invention.

[0038] In this embodiment, if Figure 1 As shown, the cooling component 10 further includes heat dissipation fins 2 , which are arranged on a surface of the cooling housing 1 facing away from the server 500 .

[0039] For example, when the cooling component is disposed below the server 500, the heat dissipation fins 2 are disposed on the side of the bottom wall 14 away from the peripheral wall 15, and the side of the bottom wall 14 facing the wall 15 contacts the server 500. After the heat of the server 500 is transferred to the cooling housing 1, the heat dissipation can be assisted by the heat dissipation fins 2, thereby improving the cooling effect of the cooling component. Specifically, a plurality of heat dissipation fins 2 are disposed, and the plurality of heat dissipation fins 2 are arranged at a time.

[0040] When the cooling component is disposed above the server 500, the heat dissipation fins 2 are disposed in the accommodation cavity 16, and the side of the bottom wall 14 away from the peripheral wall 15 contacts the server 500, and the heat dissipation fins 2 can dissipate heat from the cooling housing 1, which is beneficial to improving the cooling effect of the cooling component. Similarly, a plurality of heat dissipation fins 2 are provided, and the plurality of heat dissipation fins 2 are arranged in sequence.

[0041] When the cooling component 10 is installed inside the server cabinet to dissipate heat for the server 500 , a blowing assembly may be provided inside the server cabinet to dissipate heat from the heat dissipating fins 2 by convection to further improve the heat dissipation effect.

[0042] It can be understood that by arranging the heat dissipation fins 2 on the surface of the cooling shell 1 facing away from the server 500, the arrangement of the heat dissipation fins 2 does not affect the contact between the cooling shell 1 and the server 500. The heat dissipation fins 2 can improve the heat dissipation efficiency by expanding the surface area. The heat of the cooling shell 1 can be transferred to the surrounding environment to dissipate the heat of the cooling shell 1, which is beneficial to improve the cooling effect of the cooling component 10.

[0043] In this embodiment, if Figure 1 As described above, the cooling component 10 further includes a mounting member 3 , which is disposed on the cooling housing 1 , and is used to mount the cooling housing 1 .

[0044] The mounting member 3 may be provided as one or multiple mounting members 3. When multiple mounting members 3 are provided, multiple mounting members 3 are spaced apart and arranged on the cooling housing 1. By providing multiple mounting members 3 to install the cooling housing 1, the support points for the cooling housing 1 are increased, which is beneficial to improving the reliability of the connection of the cooling components. For example, four mounting members 3 are provided, and the four mounting members 3 are distributed at the four corners of the cooling housing 1. Of course, the number and specific location of the mounting members 3 can be set according to actual installation needs, and are not limited here.

[0045] For example, the mounting member 3 may be an L-shaped connecting plate, one side of the mounting member 3 is connected to the cooling housing 1, and the other side may be installed in the cabinet body 200 of the server 500 cabinet. Both ends of the mounting member 3 are provided with mounting holes, so that the mounting member 3 can be connected to the cooling housing 1 by screws, or connected to the cabinet body 200 of the server 500 cabinet by screws. The mounting member 3 may also be connected to the cabinet body 200 of the server cabinet by means of snap-fit ​​connection or the like, and those skilled in the art may set the specific structure of the mounting member 3 according to the actual installation scenario, which is not limited here.

[0046] It can be understood that by arranging the mounting member 3 on the cooling shell 1 and fixing the cooling shell 1 through the mounting member 3 , the installation of the cooling shell 1 can be facilitated, which is beneficial to improving the installation efficiency.

[0047] In this embodiment, if Figure 1 As shown, the liquid cooling assembly 100 also includes a connecting component 4. Two cooling components 10 are arranged at intervals in the upper and lower parts. The space formed between the upper and lower cooling components 10 is used to accommodate the server 500. The upper and lower cooling components 10 are connected by the connecting component 4 so that the lower cooling component 10 supports the upper cooling component 10 through the connecting component 4.

[0048] Specifically, one or more connecting components 4 may be provided. When multiple connecting components 4 are provided, the multiple connecting components 4 are distributed around the cooling component 10. By providing multiple connecting components 4, the firmness of the connection between the lower cooling component 10 and the upper cooling component 10 can be improved. For example, four connecting components 4 are provided, and the four connecting components 4 are provided at the four corners of the upper cooling component 10 and the lower cooling component 10.

[0049] It can be understood that when the server 500 is not set in the cabinet, the connecting component 4 is provided to support the upper cooling component 10 using the lower cooling component 10, so that the bottom and top of the server 500 can be cooled by the cooling component 10, and the upper cooling component 10 can be in contact with the top of the server 500 without causing excessive pressure on the server 500 to damage the server 500, which is beneficial to improving the cooling effect of the server 500.

[0050] In this embodiment, if Figure 1 As shown, the connecting component 4 includes a first connecting seat 41, a second connecting seat 42 and a connecting support 43. The first connecting seat 41 is arranged on the lower cooling shell 1; the second connecting seat 42 is arranged on the upper cooling shell 1; the first connecting portion of the connecting support 43 is connected to the first connecting seat 41, and the second connecting portion of the connecting support 43 is connected to the second connecting seat 42.

[0051] When there are multiple connecting components 4, multiple first connecting seats 41 are provided on the lower cooling shell 1, multiple second connecting seats 42 are provided on the upper cooling shell 1, and connecting supports 43 are connected between the first connecting seats 41 and the corresponding second connecting seats 42. For example, the four corners of the lower cooling shell 1 are respectively provided with first connecting seats 41, and the four corners of the upper cooling shell 1 are respectively provided with second connecting seats 42, the positions of the four first connecting seats 41 and the four second connecting seats 42 correspond one to one, four corresponding connecting supports 43 are provided, and connecting supports 43 are connected between the first connecting seats 41 and the second connecting seats 42 at corresponding positions.

[0052] It can be understood that by setting the first connecting seat 41, a support point can be formed on the lower cooling shell 1. Similarly, by setting the second connecting seat 42 on the upper cooling shell 1, a support point can be formed on the upper cooling shell 1. By connecting the first connecting seat 41 and the second connecting seat 42 through the connecting support member 43, support can be formed for the upper cooling component 10.

[0053] In this embodiment, the connection support member 43 is connected to the first connection seat 41 in an adjustable manner. And / or, the connection support member 43 is connected to the second connection seat 42 in an adjustable manner.

[0054] In detail, the connection support 43 is connected to the first connection seat 41 in an adjustable manner and is connected to the second connection seat 42 in an unadjustable manner. The connection support 43 can also be connected to the first connection seat 41 in an unadjustable manner and connected to the second connection seat 42 in an adjustable manner. The connection support 43 can also be connected to the first connection seat 41 and the second connection seat 42 in an adjustable manner. The above connection methods of the connection support 43 can all adjust the distance between the cooling component 10 below and the cooling component 10 above.

[0055] For example, Figure 1As shown, the connection support 43 includes a bolt, a first threaded hole is provided on the first connection seat 41, and a second threaded hole is provided on the second connection seat 42, and the bolt is threadedly connected with the first threaded hole and the second threaded hole respectively. By rotating the bolt, the distance between the upper cooling component 10 and the lower cooling component 10 can be adjusted, so that it can be adapted to the servers 500 of different heights, which is conducive to improving the cooling effect of the server 500. In addition, the connection support 43 can also be set as a support plate, on which a plurality of first connection holes are sequentially arranged at intervals, and the second connection holes are respectively arranged on the first connection seat 41 and the second connection seat 42, and the first connection holes at different positions on the support plate are connected to the first connection seat 41 or the second connection The second connection hole, the distance between the lower cooling component 10 and the upper cooling component 10 can still be adjusted. Of course, those skilled in the art can also set the specific structures of the first connection seat 41, the second connection seat 42 and the connection support 43 to other forms as needed, which is not limited here.

[0056] It can be understood that by adjustably connecting the connecting support 43 to the first connecting seat 41 and / or the second connecting seat 42, the distance between the lower cooling component 10 and the upper cooling component 10 can be adjusted by adjusting the connection position of the connecting support 43 and the first connecting seat 41 and / or the second connecting seat 42, so that the liquid cooling component 100 can be suitable for cooling services at different heights, thereby expanding the application range of the liquid cooling component 100.

[0057] When using the liquid cooling assembly 100 in this embodiment, when a server 500 is provided with a cooling component 10, the cooling component can be provided below or above the server 500; when a server 500 is provided with two cooling components 10, the two cooling components 10 are respectively located above and below the server 500; the heat dissipation fins 2 of the cooling component 10 located below the server 500 are provided on the surface of the cooling shell 1 facing away from the server 500; the heat dissipation fins 2 of the cooling component 10 located above the server 500 are provided on the surface of the cooling shell facing away from the server 500; and the lower cooling component and the upper cooling component 10 are connected via a connecting component 4. When the cooling component 10 is used for heat dissipation, the cooling medium is input into the cooling cavity 11 through the cooling medium inlet, the first cavity 111 of the bottom wall 14 can be filled with the cooling medium, and there is no gap at the position corresponding to the server 500 inside the bottom wall 14. The bottom wall 14 contacts the server to better perform heat exchange, thereby improving the uniformity of the cooling of the server 500 by the cooling component 10. At the same time, as the cooling medium after heat exchange continuously flows out from the cooling medium outlet 13, the cooling medium in the cooling shell 1 is continuously replaced to ensure the heat exchange effect.

[0058] In this embodiment, if Figure 5As shown, the server 500 cabinet includes a cabinet body 200 , a liquid cooling assembly 100 and a server 500 . The liquid cooling assembly 100 is disposed in the cabinet body 200 ; and the server 500 is disposed in the accommodating cavity 16 of the liquid cooling assembly 100 .

[0059] Specifically, the cabinet body 200 has an installation cavity and an openable cabinet door, so that the liquid cooling component 100 and the server 500 can be installed in the installation cavity by opening the cabinet door. Further, in order to facilitate the installation of the liquid cooling component 100 and the server 500, a mounting bracket 201 can be provided in the installation cavity, and the server 500 and the liquid cooling component 100 can be installed on the mounting bracket 201. In detail, the cooling component 10 is installed on the mounting bracket 201 through the mounting member 3.

[0060] The server 500 cabinet may include one or more servers 500 . When there are multiple servers 500 , the number of corresponding liquid cooling components 100 is also adaptively increased, so that each server 500 can be cooled by the liquid cooling component 100 to improve the cooling effect of the server 500 .

[0061] In this embodiment, the liquid cooling assembly 100 may include one or two cooling components 10. When one cooling component 10 is provided, the cooling component 10 is disposed at the bottom of the server 500. When two cooling components 10 are provided, one cooling component 10 is disposed above and one cooling component 10 is disposed below a server 500 respectively.

[0062] The cabinet body 200 in this embodiment is provided with the above-mentioned liquid cooling assembly 100, so that the server 500 can contact the bottom wall 14 of the cooling shell 1 filled with coolant, thereby improving the uniformity of cooling of the server 500 by the cooling assembly, thereby improving the reliability and safety of the server 500 cabinet.

[0063] In this embodiment, if Figure 5 As shown, the server cabinet 500 further includes a main liquid inlet pipe 300 and a main liquid outlet pipe 400 disposed on the cabinet body 200 . The main liquid inlet pipe 300 is connected to the medium inlet 12 through a branch liquid inlet pipe, and the main liquid outlet pipe 400 is connected to the medium outlet 13 through a branch liquid outlet pipe.

[0064] It should be noted that when the liquid cooling assembly 100 includes a plurality of cooling components 10 or is provided with a plurality of liquid cooling assemblies 100, the main liquid inlet pipe 300 is connected to a plurality of branch liquid inlet pipes, and the main liquid outlet pipe 400 is connected to a plurality of branch liquid outlet pipes, each medium inlet 12 is connected to a branch liquid inlet pipe, and each medium outlet 13 is connected to a branch liquid outlet pipe. The main liquid inlet pipe 300 is connected to the liquid outlet of the refrigeration unit, and the main liquid outlet pipe 400 is connected to the liquid inlet of the refrigeration unit. Thus, the cooling medium output by the refrigeration unit enters the cooling assembly through the main liquid inlet pipe 300, and after cooling the server 500 through the cooling assembly, it flows to the main liquid outlet pipe 400 through the cooling medium outlet 13, and the heated cooling medium flowing out of the main liquid outlet pipe 400 flows back to the refrigeration unit again, and is refrigerated and recycled by the refrigeration unit. The refrigeration unit is a conventional prior art, and its specific structure and working principle are not described in detail here.

[0065] It can be understood that by arranging a main liquid inlet pipe 300 and a main liquid outlet pipe 400 in the cabinet body 200, and connecting the main liquid inlet pipe 300 to the medium inlet 12 through a branch liquid inlet pipe, and connecting the main liquid outlet pipe 400 to the medium outlet 13 through a branch liquid outlet pipe, it is beneficial to simplify the pipeline structure and facilitate the infusion and drainage of different cooling components 10.

[0066] In the description of the present invention, it needs to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0067] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0068] In the present invention, unless otherwise clearly defined and specified, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0069] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" and "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0070] In the present invention, the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples and features of different embodiments or examples described in this specification without contradiction.

[0071] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A liquid cooling component, characterized in that: The invention comprises a cooling component, wherein the cooling component comprises a cooling shell, wherein the cooling shell comprises a bottom wall and a peripheral wall, wherein the peripheral wall is arranged at the outer peripheral edge of the bottom wall and forms an accommodating cavity with the bottom wall, wherein the cooling shell has a cooling cavity, wherein the cooling cavity comprises a first cavity and a second cavity which are connected to each other, wherein the first cavity is arranged in the bottom wall, and the second cavity is arranged in the peripheral wall and extends for one circle along the circumference of the peripheral wall, wherein the cooling shell has a medium inlet and a medium outlet, wherein the medium inlet and the medium outlet are both connected to the cooling cavity so as to transport the cooling medium into the cooling cavity through the medium inlet and discharge the cooling medium in the cooling cavity through the medium outlet.

2. The liquid cooling assembly according to claim 1, characterized in that: The medium inlet and the medium outlet are both arranged on the peripheral wall, and the medium inlet and the medium outlet are located on two opposite sides of the peripheral wall.

3. The liquid cooling assembly according to claim 1, characterized in that: The peripheral wall includes a first section, a second section, a third section and a fourth section, the first section is arranged opposite to the third section, the second section is arranged opposite to the fourth section, the medium inlet is arranged at the first section, the medium outlet is arranged at the third section, and the heights of the first section and the third section are higher than those of the second section and the fourth section.

4. The liquid cooling assembly according to claim 1, characterized in that: The bottom wall and the peripheral wall are integrally formed.

5. The liquid cooling assembly according to any one of claims 1 to 4, characterized in that: The cooling component further includes a mounting member, which is disposed on the cooling shell and is used to mount the cooling shell.

6. The liquid cooling assembly according to any one of claims 1 to 4, characterized in that: It also includes a connecting component, wherein two cooling components are arranged at intervals in an upper and lower manner, and the space formed between the upper and lower cooling components is used to accommodate the server. The upper and lower cooling components are connected by the connecting component so that the lower cooling component supports the upper cooling component through the connecting component.

7. The liquid cooling assembly according to claim 6, characterized in that: The connecting component comprises: A first connecting seat, wherein the first connecting seat is arranged at the cooling shell below; A second connecting seat, the second connecting seat is arranged on the upper cooling shell; A connecting support, wherein the first connecting portion of the connecting support is connected to the first connecting seat, and the second connecting portion of the connecting support is connected to the second connecting seat.

8. The liquid cooling assembly according to claim 7, characterized in that: The connection support is adjustably connected to the first connection seat; And / or, the connection support is connected to the second connection seat in an adjustable manner.

9. A server cabinet, characterized in that: include: Cabinet body; The liquid cooling assembly according to any one of claims 1 to 8, wherein the liquid cooling assembly is arranged in the cabinet body; A server is arranged in the cabinet body and contacts the bottom wall.

10. The server cabinet according to claim 9, characterized in that: It also includes a main liquid inlet pipe and a main liquid outlet pipe arranged on the cabinet body, wherein the main liquid inlet pipe is connected to the medium inlet through a branch liquid inlet pipe, and the main liquid outlet pipe is connected to the medium outlet through a branch liquid outlet pipe.

Citation Information

Patent Citations

  • Water-cooling heat radiation device and method

    CN107241890A

  • Low-thermal-resistance phase change cold plate and radiator

    CN112954970A

  • Three-dimensional liquid cooling heat dissipation device

    CN114340317A

  • Battery thermal management device with strong temperature uniformity maintaining capability

    CN115986266A

  • Flow channel separation type liquid cooling plate

    CN118890871A