Array substrate and display device

Abstract

The invention discloses an array substrate and a display device, the array substrate comprises a substrate, a first organic insulating layer and a first metal block, the first organic insulating layer is located on the substrate, and the first metal block is arranged on the first organic insulating layer in a contact mode; the first organic insulating layer comprises a first hollow area, and the first metal block comprises a second hollow area. According to the scheme, the voltage drop generated when the first metal block is used for transmitting signals can be reduced.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to an array substrate and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) is an active light-emitting display device with the advantages of self-luminescence, wide viewing angle, high contrast, low power consumption, and light weight. With the continuous development of display technology, display devices using OLED as a light-emitting device have been widely used.

[0003] As the size of OLED display devices continues to increase, the voltage drop (IR drop) of the signal lines on the array substrate continues to increase. The large voltage difference between the far end and the near end of the display device will cause uneven brightness of the display device. Summary of the invention

[0004] The present invention aims at at least providing an array substrate and a display device.

[0005] In a first aspect, the present invention provides an array substrate, comprising: a base substrate, a first organic insulating layer and a first metal block, wherein the first organic insulating layer is located on the base substrate, and the first metal block is contactingly arranged on the first organic insulating layer; the first organic insulating layer includes a first hollow area, and the first metal block includes a second hollow area.

[0006] A first organic insulating layer is disposed on the substrate, and the first organic insulating layer includes a first hollow area; a first metal block is disposed on the first organic insulating layer in contact, and the first metal block includes a second hollow area. Since the first organic insulating layer includes the first hollow area, the area of ​​the first organic insulating layer located below the first metal block is reduced, and the amount of water vapor released by the first organic insulating layer is reduced, so the area of ​​the second hollow area can be reduced accordingly. When the area of ​​the second hollow area is reduced, the metal area of ​​the first metal block is increased, so the resistance of the first metal block can be reduced, thereby reducing the voltage drop of the signal transmitted by the first metal block.

[0007] Optionally, the first hollow area includes N discontinuously distributed sub-areas, and adjacent sub-areas are separated by the first metal block; N is a positive integer and N≥2.

[0008] Optionally, the N sub-regions extend along a first direction and are spaced apart along a second direction; and the first direction is perpendicular to the second direction.

[0009] Optionally, the N sub-regions extend along a first direction and are divided into a plurality of rows of sub-regions that are spaced apart; wherein each row of sub-regions is spaced apart along the first direction, and adjacent rows of sub-regions are staggered in the second direction; and the first direction is perpendicular to the second direction.

[0010] Optionally, the first metal block includes a portion of a power supply line.

[0011] Optionally, the array substrate further includes: a second organic insulating layer and a second metal block, wherein: the second organic insulating layer is contacted and arranged on the first metal block, including a third hollow area; the second metal block is contacted and arranged on the second organic insulating layer, including a fourth hollow area.

[0012] Optionally, in the thickness direction of the array substrate, the first metal block covers the first hollow area.

[0013] Optionally, in a thickness direction of the array substrate, the second hollow area overlaps with the first hollow area.

[0014] Optionally, the area of ​​the second hollow region is smaller than the area of ​​the first hollow region.

[0015] In a second aspect, based on the same inventive concept, the present invention further provides a display device, comprising any of the array substrates described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a top view of a related array substrate;

[0017] Figure 2 yes Figure 1 A schematic cross-sectional view of the array substrate taken along line AA';

[0018] Figure 3 is a cross-sectional schematic diagram of an array substrate in an embodiment of the present invention;

[0019] Figure 4 is a cross-sectional schematic diagram of another array substrate in an embodiment of the present invention;

[0020] Figure 5 is a top view of a first organic insulating layer in an embodiment of the present invention;

[0021] Figure 6 is a top view of another first organic insulating layer in an embodiment of the present invention;

[0022] Figure 7 is a cross-sectional schematic diagram of another array substrate in an embodiment of the present invention;

[0023] Figure 8It is a cross-sectional schematic diagram of a related array substrate. DETAILED DESCRIPTION

[0024] It is obvious to those skilled in the art that various modifications and changes can be made in the present invention without departing from the spirit or scope of the present invention. Therefore, the present invention is intended to cover modifications and changes of the present invention that fall within the scope of the corresponding claims (technical solutions claimed for protection) and their equivalents. It should be noted that the implementation methods provided in the embodiments of the present invention can be combined with each other without contradiction.

[0025] Reference Figure 1 , a top view of a related array substrate is given. Figure 2 , which gives Figure 1 AA' cross-sectional schematic diagram of the array substrate in .

[0026] Figure 1 In the embodiment, the array substrate includes a base substrate, a metal layer M1, a first organic insulating layer and a metal layer M2. In the thickness direction, the base substrate is located at the bottom layer of the array substrate, the metal layer M1 is arranged on the array substrate, the first organic insulating layer is arranged in contact with the metal layer M1, and the metal layer M2 is arranged in contact with the organic insulating layer. The metal layer M2 includes a part of the signal line. The metal layer M2 is provided with a hollow area to release the water vapor of the first organic insulating layer.

[0027] However, the hollowed-out area of ​​the metal layer M2 will reduce the effective metal area, thereby increasing the routing resistance of the signal line, resulting in a larger voltage drop of the signal line.

[0028] In the embodiment of the present invention, the first organic insulating layer includes a first hollow area, so the area of ​​the first organic insulating layer located below the first metal block is reduced, which reduces the amount of water vapor released by the first organic insulating layer, so the area of ​​the second hollow area can be reduced accordingly. When the area of ​​the second hollow area is reduced, the effective metal area of ​​the first metal block is increased, so the resistance of the first metal block can be reduced, thereby reducing the voltage drop of the signal line.

[0029] In order to make the above-mentioned objects, features and beneficial effects of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0030] The embodiment of the present invention provides an array substrate. Figure 3 , a cross-sectional schematic diagram of an array substrate provided in an embodiment of the present invention is given.

[0031] In an embodiment of the present invention, the array substrate may include a base substrate, a first organic insulating layer and a first metal block, wherein:

[0032] The first organic insulating layer is located on the base substrate;

[0033] The first metal block is contact-disposed on the first organic insulating layer; the first organic insulating layer includes a first hollow region, and the first metal block includes a second hollow region.

[0034] In a specific implementation, there may be one or more first hollow areas, and there may be one or more second hollow areas. The number of first hollow areas and the number of second hollow areas may be preset based on specific water vapor release requirements, requirements for voltage drop of signal lines, etc. By reasonably setting the second hollow area, a water vapor release channel is provided to release the water vapor generated by the first organic insulating layer.

[0035] In some embodiments, the first hollow area and the second hollow area may at least partially overlap in the thickness direction of the array substrate. In other embodiments, the first hollow area and the second hollow area may not overlap in the thickness direction of the array substrate.

[0036] Provide a specific example, such as Figure 3 As shown, the first organic insulating layer includes three discontinuous first organic insulating regions BPL1, and a first hollow region H1 is disposed between two adjacent first organic insulating regions BPL1. The first metal block includes three second hollow regions H2. A second hollow region H2 is disposed above each first organic insulating region BPL1.

[0037] Thus, the water vapor generated in the first organic insulating region BPL1 may be released through the second hollow region H2.

[0038] Figure 3 The first organic insulating region BPL1 and the second hollow region H2 shown in FIG. 1 are in a one-to-one correspondence relationship. It can be understood that the first organic insulating region BPL1 and the second hollow region H2 may not be in a one-to-one correspondence relationship.

[0039] In some embodiments, the second hollow region H2 may be disposed only above a portion of the first organic insulating region BPL1 , and no second hollow region H2 may be disposed above the remaining portion of the first organic insulating region BPL1 .

[0040] For example, among two adjacent first organic insulating regions BPL1 , only one of the first organic insulating regions BPL1 has the second hollow region H2 disposed on it, and the other first organic insulating region BPL1 has no second hollow region H2 disposed on it.

[0041] In addition, the number of the second hollow regions H2 disposed above the first organic insulating region BPL1 is not limited to 1. In some embodiments, two or more second hollow regions H2 may be disposed above one or more first organic insulating regions.

[0042] In some embodiments, Figure 3 As shown, in the thickness direction of the array substrate, the first hollow area of ​​the first organic insulating layer can be covered by the first metal block.

[0043] In a specific implementation, the above-mentioned base substrate may be a substrate made of an inorganic material, such as a substrate made of silicon material, a substrate made of silicon nitride material, etc. The material of the above-mentioned first organic insulating layer may be organic glue.

[0044] In a specific implementation, the areas of different first hollow regions may be equal or different, and the areas of different second hollow regions may be equal or different.

[0045] In some embodiments, the areas of any first hollow regions are equal, and the areas of any second hollow regions are also equal, and the area of ​​any second hollow region is smaller than the area of ​​any first hollow region.

[0046] That is to say, compared with the first metal block, the area of ​​the opening (first hollow area) on the first organic insulating layer is larger, which can be understood as opening large holes on the first organic insulating layer and opening small holes on the first metal block.

[0047] The array substrate provided in the embodiment of the present invention reduces the water vapor release of the first organic insulating layer by providing the first hollow region in the first organic insulating layer to reduce the area of ​​the first organic insulating layer. Since the water vapor release is reduced, the area of ​​the second hollow region of the first metal block can be reduced accordingly, and accordingly, the effective metal area of ​​the first metal block is increased, thereby reducing the wiring resistance of the signal transmitted by the first metal block.

[0048] In the embodiment of the present invention, the first metal block may be a part of the power line, that is, the power line includes the first metal block. Therefore, when the resistance of the first metal block decreases, the total resistance of the power line decreases accordingly, thereby reducing the voltage drop on the power line.

[0049] In summary, relative to Figure 1 and Figure 2 In the existing array substrate provided in, when the area of ​​the array substrate is the same, the area of ​​the second hollow area in the array substrate provided in the embodiment of the present invention can be smaller than the area of ​​the hollow area of ​​the metal layer M2 in the existing array substrate, thereby reducing the wiring resistance of the signal transmitted by the first metal block, and further reducing the voltage drop on the power wiring.

[0050] To provide a specific example, in the existing array substrate, the size of each hollow area is 23μm×23μm, and the metal effective area accounts for 68.34% of the total area. However, using the array substrate provided in the embodiment of the present invention, the size of each second hollow area can be 8μm×8μm, and the metal effective area of ​​the first metal block accounts for 95.74% of the total area, and the metal effective area increases by 27.4%.

[0051] In a specific implementation, a third metal block may be further provided between the base substrate and the first organic insulating layer, that is, the first organic insulating layer is not directly provided on the base substrate, but is provided in contact with the third metal block. The third metal block is provided in contact with the base substrate. Thus, in the thickness direction of the base substrate, the structure includes the base substrate, the third metal block, the first organic insulating layer, and the first metal block in order from bottom to top.

[0052] Reference Figure 4 , a cross-sectional schematic diagram of another array substrate in an embodiment of the present invention is given. Figure 4 The corresponding array substrate is Figure 3 A third metal block is additionally added on the basis of the corresponding array substrate.

[0053] like Figure 4 As shown, a third metal block is disposed on the base substrate, and the first organic insulating layer is contact-disposed on the third metal block.

[0054] In the embodiment of the present invention, the first hollow region of the first organic insulating layer may include N discontinuously distributed sub-regions, and adjacent sub-regions are separated by the first metal block; N is a positive integer and N≥2.

[0055] In some embodiments, the N sub-regions may extend along a first direction and be spaced apart along a second direction, wherein the first direction is perpendicular to the second direction.

[0056] Reference Figure 5 , a top view of a first organic insulating layer in an embodiment of the present invention is given. Figure 5 The cross-sectional schematic diagram of the first organic insulating layer in the AA' direction provided in the embodiment may refer to the above Figure 3 .

[0057] Figure 5In the embodiment, the first hollow region of the first organic insulating layer includes three sub-regions, namely, sub-region 1, sub-region 2, and sub-region 3. Sub-region 1, sub-region 2, and sub-region 3 extend along the first direction and are spaced apart along the second direction. A plurality of second hollow regions are provided on the organic insulating region extending along the first direction between sub-region 1 and sub-region 2; a plurality of second hollow regions are also provided on the organic insulating region extending along the first direction between sub-region 2 and sub-region 3 to release water vapor generated in the corresponding organic insulating region.

[0058] like Figure 5 The first organic insulating layer shown in the figure is provided with a first organic insulating region between the first hollow regions that are spaced apart, and the first organic insulating region is raised relative to the first hollow regions, thereby forming a concave-raised-concave structure. When performing inkjet printing (IJP), the ink will be blocked by the concave-raised-concave structure, which has a certain limiting effect on the position of the IJP. The above-mentioned protrusion is the organic insulating region extending along the first direction between sub-region 1 and sub-region 2, or the organic insulating region extending along the first direction between sub-region 2 and sub-region 3.

[0059] In other embodiments, the N sub-regions may extend along the first direction and include multiple rows of sub-regions spaced apart; wherein each row of sub-regions is spaced apart along the second direction, adjacent rows of sub-regions are staggered in the second direction, and the first direction is perpendicular to the second direction.

[0060] Reference Figure 6 , a top view of another first organic insulating layer in an embodiment of the present invention is given.

[0061] Figure 6 In the embodiment, the first hollow region of the first organic insulating layer includes 7 sub-regions, which are sub-region 1 to sub-region 7, wherein: sub-region 1 to sub-region 7 extend along the first direction and are divided into 7 rows of sub-regions distributed at intervals. Sub-region 1, sub-region 3, sub-region 5, and sub-region 7 are distributed at intervals along the first direction, and sub-region 2, sub-region 4, and sub-region 6 are distributed at intervals along the first direction. Sub-region 1 and sub-region 2 are staggered in the second direction, and sub-region 2 and sub-region 3 are staggered in the second direction, and so on.

[0062] In the organic insulating region between adjacent sub-regions (such as the organic insulating region between sub-region 1 and sub-region 3), a plurality of second hollow regions may be provided to release water vapor generated in the corresponding organic insulating regions.

[0063] In the embodiment of the present invention, the array substrate may further include a second organic insulating layer and a second metal block, wherein:

[0064] The second organic insulating layer is contacted and arranged on the first metal block, and includes a third hollow area; the second metal block is contacted and arranged on the second organic insulating layer, and includes a fourth hollow area.

[0065] In a specific implementation, the number of the third hollow area can be one or more, and the number of the fourth hollow area can be one or more. The number of the third hollow area and the fourth hollow area can be pre-set based on the specific water vapor release amount, the voltage drop requirement of the signal line, etc.

[0066] In a specific implementation, in the thickness direction of the array substrate, the fourth hollow area may at least partially overlap with the third hollow area. Alternatively, in the thickness direction of the array substrate, the fourth hollow area does not overlap with the third hollow area. By providing the fourth hollow area, a water vapor release channel is provided to release the water vapor generated by the second organic insulating layer.

[0067] In a specific implementation, the areas of different third hollow regions may be equal or different. The areas of different fourth hollow regions may be equal or different.

[0068] In some embodiments, the areas of any third hollow regions are equal, and the areas of any fourth hollow regions are also equal, and the area of ​​any fourth hollow region is smaller than the area of ​​any third hollow region.

[0069] That is to say, compared with the fourth hollow area in the second metal block, the area of ​​the opening on the second organic insulating layer (the third hollow area) is larger, which can be understood as opening large holes on the second organic insulating layer and opening small holes on the second metal block.

[0070] In a specific implementation, in the thickness direction of the array substrate, the fourth hollow area and the second hollow area may overlap, and the water vapor of the first organic insulating layer passes through the second organic insulating layer and is released through the fourth hollow area. Alternatively, in the thickness direction of the array substrate, the fourth hollow area and the second hollow area do not overlap, and the water vapor of the first organic insulating layer is released to the second organic insulating layer, and then released through the fourth hollow area.

[0071] Reference Figure 7 , a cross-sectional schematic diagram of another array substrate in an embodiment of the present invention is given.

[0072] like Figure 7 As shown, the second organic insulating layer includes a plurality of discontinuous second organic insulating regions BPL2, and a third hollow region H3 is provided between two adjacent second organic insulating regions BPL2. The third hollow region H3 may be covered by a second metal block. The second metal block includes a fourth hollow region H4. A fourth hollow region H4 is provided above the second organic insulating region BPL2 in the middle portion.

[0073] Thus, the water vapor generated in the second organic insulating region BPL2 located in the middle portion can be released through the fourth hollow region H4.

[0074] It is understandable that a fourth hollow region H4 may be provided above the second organic insulating region BPL2 located at the edge portion (ie, the second organic insulating region BPL2 on the left and the second organic insulating region BPL2 on the right) to release water vapor.

[0075] In addition, the number of the fourth hollow regions H4 disposed above the second organic insulating region BPL2 is not limited to 1. In some embodiments, two or more fourth hollow regions H4 may be disposed above one or more second organic insulating regions.

[0076] In some embodiments, when the fourth hollow area overlaps with the second hollow area in the thickness direction of the array substrate, the area of ​​the fourth hollow area can be set equal to the second hollow area; or the area of ​​the fourth hollow area can be set smaller than the second hollow area. Figure 7 As shown in , the area of ​​the fourth hollow region is equal to the area of ​​the second hollow region.

[0077] In some embodiments, in the thickness direction of the array substrate, the area of ​​the first hollow region of the first organic insulating layer may be smaller than the area of ​​the third hollow region of the second organic insulating layer. Alternatively, in the thickness direction of the array substrate, the area of ​​the first hollow region of the first organic insulating layer may be equal to the area of ​​the third hollow region of the second organic insulating layer.

[0078] In a specific implementation, the second metal block may be a part of a cathode power supply (VSS) signal line. The second metal block may be disposed in the same layer as the anode.

[0079] The array substrate provided in the embodiment of the present invention reduces the area of ​​the second organic insulating layer below the second metal block, thereby reducing the amount of water vapor released from the second organic insulating layer. Since the amount of water vapor released is reduced, the area of ​​the fourth hollow region of the second metal block can be reduced accordingly, and accordingly, the metal effective area of ​​the second metal block is increased, thereby reducing the wiring resistance of the signal transmitted by the second metal block. When the wiring resistance of the signal transmitted by the second metal block is reduced, the total resistance of the VSS signal wiring is reduced accordingly, so the voltage drop on the VSS signal wiring will become smaller.

[0080] In some embodiments, Figure 7 As shown, the second organic insulating layer can be disposed on a portion of the first metal block in contact with the second metal block. The second metal block can cover the third hollow region of the second organic insulating layer to achieve contact between the second metal block and the first metal block.

[0081] In some embodiments, in the thickness direction of the array substrate, a third organic insulating layer may be further disposed above the second metal block, and a third metal block is disposed above the third organic insulating layer in contact therewith, and the third metal block serves as a cathode layer. The third organic insulating layer includes a hollow region, and the third metal block is connected to the second metal block in the hollow region of the third organic insulating layer. Therefore, when the metal effective area of ​​the second metal block increases, the overlap area of ​​the second metal block and the cathode layer increases, thereby reducing the wiring resistance of the VSS signal transmitted by the second metal block.

[0082] In an embodiment of the present invention, the third hollow area may include M discontinuous sub-areas, and the specific distribution of the M discontinuous sub-areas may be: the M sub-areas extend along the first direction and are distributed at intervals along the second direction, and the first direction is perpendicular to the second direction.

[0083] Alternatively, the specific distribution of the M discontinuous sub-regions may be: the M sub-regions extend along the first direction and include multiple rows of sub-regions that are spaced apart; wherein each row of sub-regions is spaced apart along the second direction, and adjacent rows of sub-regions are staggered in the second direction, and the first direction is perpendicular to the second direction.

[0084] In a specific implementation, the specific distribution of the M discontinuous sub-areas included in the third hollow area can be referred to above. Figure 5 and Figure 6 The description of the N discontinuous sub-areas in the first hollow area will not be repeated here.

[0085] In a specific implementation, the material of the second organic insulating layer may be organic glue. The material of the second organic insulating layer may be the same as that of the first organic insulating layer, or may be different from that of the first organic insulating layer.

[0086] Reference Figure 8 , a cross-sectional schematic diagram of a related array substrate is given. Figure 8 is Figure 1 A metal layer M3 and a second organic insulating layer are added on the basis of the metal layer M2. The second organic insulating layer is disposed on the metal layer M2 in contact, the metal layer M3 is disposed on the second organic insulating layer in contact, and the metal layer M3 includes a second hollow region.

[0087] Relative to Figure 8 In the existing array substrate provided in the embodiment of the present invention, when the array substrate has the same area, the area of ​​the fourth hollow area in the array substrate provided in the embodiment of the present invention is smaller than the area of ​​the hollow area of ​​the metal layer M3 in the existing array substrate. Thus, the voltage drop of the signal transmitted by the second metal block is reduced.

[0088] It is understandable that, in an actual array substrate, other organic insulating layers and metal layers may be provided above the second metal block to realize corresponding circuit functions, and are not limited to the description in the above embodiments.

[0089] An embodiment of the present invention further provides a display device, comprising the array substrate provided by any of the above embodiments.

[0090] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. An array substrate, characterized in that: include: A base substrate, a first organic insulating layer and a first metal block, wherein the first organic insulating layer is located on the base substrate, and the first metal block is disposed in contact with the first organic insulating layer; The first organic insulating layer includes a first hollow region, and the first metal block includes a second hollow region.

2. The array substrate according to claim 1, characterized in that: The first hollow area includes N discontinuously distributed sub-areas, and adjacent sub-areas are separated by the first metal block; N is a positive integer and N≥2.

3. The array substrate according to claim 2, characterized in that: The N sub-regions extend along a first direction and are spaced apart along a second direction; the first direction is perpendicular to the second direction.

4. The array substrate according to claim 2, characterized in that: The N sub-regions extend along a first direction and are divided into a plurality of rows of sub-regions that are spaced apart. Each row of sub-regions is spaced apart along the first direction, and adjacent rows of sub-regions are staggered in a second direction. The first direction is perpendicular to the second direction.

5. The array substrate according to claim 1, characterized in that: The first metal block includes a portion of a power supply line.

6. The array substrate according to any one of claims 1 to 5, characterized in that: Also includes: A second organic insulating layer and a second metal block, wherein: The second organic insulating layer is disposed in contact with the first metal block and includes a third hollow area; The second metal block is contact-disposed on the second organic insulating layer and includes a fourth hollow region.

7. The array substrate according to claim 1, wherein: In the thickness direction of the array substrate, the first metal block covers the first hollow area.

8. The array substrate according to claim 1, wherein: In a thickness direction of the array substrate, the second hollow area overlaps with the first hollow area.

9. The array substrate according to claim 1, wherein: The area of ​​the second hollow region is smaller than that of the first hollow region.

10. A display device, characterized in that: Comprising the array substrate as described in any one of claims 1 to 9.

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