Resin composition and lighting device including the same

Abstract

The resin composition according to an embodiment includes an oligomer, a monomer, a photoinitiator, and an additive, in which the content of the oligomer is 10 wt% to 25 wt% with respect to the total weight of the resin composition, in which the content of the monomer is 60 wt% to 70 wt% with respect to the total weight of the resin composition, in which the content of the photoinitiator is 0.5 wt% to 1.2 wt% with respect to the total weight of the resin composition, and in which the content of the photoinitiator is 0.5 wt% to 1.2 wt% with respect to the total weight of the resin composition. Wherein the additives include a first additive including a free radical remover and a second additive including a peroxide decomposer, the photoinitiator includes phosphorus (P), the second additive includes phosphorus (P), and a weight percentage of the photoinitiator is greater than a weight percentage of each of the first additive and the second additive.

Description

Technical Field

[0001] The embodiment relates to a resin composition and a lighting device including the resin composition. Background Art

[0002] Lighting applications include not only vehicle lighting but also backlighting for displays and signage.

[0003] Compared with conventional light sources such as fluorescent lamps and incandescent lamps, light emitting devices such as light emitting diodes (LEDs) have advantages such as low power consumption, semi-permanent life, fast response speed, safety, and environmental friendliness. Light emitting diodes are applied to various lighting devices such as various display devices, indoor lamps, and outdoor lamps.

[0004] Recently, a lamp (i.e., a lighting device) using a light emitting diode as a vehicle light source has been proposed. Compared with an incandescent lamp, a light emitting diode has the advantage of low power consumption. However, since the emission angle of light emitted from a light emitting diode is small, it is necessary to increase the light emitting area of ​​the lamp using the light emitting diode when using the light emitting diode as a vehicle lamp.

[0005] Light emitting diodes can increase the freedom of lamp design due to their small size, and are economical due to their semi-permanent lifespan.

[0006] On the other hand, since the lamp is applied to a vehicle, heat may be generated to a temperature above a set temperature during operation of the lamp. The heat may cause the optical resin forming the lamp to turn yellow. Such yellowing may reduce the reliability of the optical resin, and thus, may also reduce the reliability of the lamp.

[0007] Therefore, there is a need for a resin composition that can solve the above problems and a lighting device including the resin composition. Summary of the invention

[0008] Technical issues

[0009] The embodiment provides a resin composition having improved reliability by suppressing yellowing, and a lighting device including the same.

[0010] Technical Solution

[0011] The resin composition according to the embodiment includes an oligomer, a monomer, a photoinitiator and an additive, wherein the content of the oligomer is 10wt% to 25wt% relative to the total weight of the resin composition, wherein the content of the monomer is 60wt% to 70wt% relative to the total weight of the resin composition, wherein the content of the photoinitiator is 0.5wt% to 1.2wt% relative to the total weight of the resin composition, wherein the additive includes a first additive including a free radical scavenger and a second additive including a peroxide decomposer, wherein the photoinitiator includes phosphorus (P), wherein the second additive includes phosphorus (P), wherein the weight percentage (wt%) of the photoinitiator is greater than the weight percentage of each of the first additive and the second additive.

[0012] The resin composition according to the embodiment includes an oligomer, a monomer, a photoinitiator, a first additive, and a second additive, wherein the content of the oligomer is 10 wt % to 25 wt % relative to the total weight of the resin composition, wherein the content of the monomer is 60 wt % to 70 wt % relative to the total weight of the resin composition, wherein the content of the photoinitiator is 0.5 wt % to 1.2 wt % relative to the total weight of the resin composition, wherein the sum of the weight percentage of the first additive and the weight percentage of the second additive is 0.5 wt % to 1.6 wt % based on the total weight of the resin composition, wherein the first additive includes a free radical scavenger, wherein the second additive includes a peroxide decomposer, wherein the photoinitiator includes phosphorus (P), and the second additive includes phosphorus (P), wherein the second additive 31 The P-NMR peak area is the photoinitiator 31 10% to 90% of the P-NMR peak area.

[0013] Beneficial Effects

[0014] The resin composition according to the embodiment can improve the reliability of a resin layer formed by curing the resin composition.

[0015] In detail, the photoinitiator of the resin composition can have a decomposition temperature within a set size range. Therefore, the photoinitiator can have improved heat resistance. Therefore, when the lighting device including the resin layer is applied to a vehicle or the like and works, the photoinitiator can be reduced from being decomposed by the heat generated. That is, the embodiment can prevent the photoinitiator from decomposing to form free radicals. Therefore, the embodiment can reduce the yellowing of the resin layer.

[0016] In addition, the photoinitiator of the resin composition can absorb wavelengths within a set size range. Therefore, the embodiment can minimize the absorption of light in the infrared wavelength band by the photoinitiator. Therefore, the embodiment can prevent the photoinitiator from absorbing blue light emitted from the light-emitting device, thereby preventing the brightness of the lighting device from being reduced.

[0017] Furthermore, the resin composition may include additives. Thus, yellowing of the resin layer may be reduced.

[0018] The resin composition according to the embodiment may include a first additive for removing free radicals formed by the residual photoinitiator. In addition, the resin composition may include a second additive for removing peroxides formed by free radicals formed by the residual photoinitiator. Therefore, the resin composition according to the embodiment can reduce the yellowing of the resin layer and improve the reliability of the lighting module. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a diagram showing a top view of a lighting device according to an embodiment.

[0020] Figure 2 It is shown Figure 1 Figure 2 is a partial enlarged view of .

[0021] Figure 3 It is shown along Figure 1 FIG. 5 is a cross-sectional view taken along line AA.

[0022] Figure 4 It is shown Figure 3 A partial enlarged view of the image and a diagram illustrating the light path.

[0023] Figure 5 It is shown Figure 3 FIG. 1 is a diagram of the detailed configuration of the reflective member.

[0024] Figure 6 It is shown Figure 5 Figure 4 shows the removal of the reflective member.

[0025] Figure 7 : is a diagram showing a mechanism of yellowing occurring in the resin layer of the lighting device according to the embodiment.

[0026] Figures 8 to 10 It is shown by 31 A graph showing the relative ratio of the peak areas of the photoinitiator and the peroxide decomposer in the resin layer measured by P-NMR.

[0027] Fig.11 is a diagram illustrating another cross-sectional view of the lighting device according to the embodiment.

[0028] Fig.12 is a diagram showing a front view of a light emitting device provided on a substrate of a lighting device according to an embodiment.

[0029] Fig.13 yes Fig.12 A side view of a light emitting element.

[0030] Fig.14 It is a top view of the vehicle with the lights applied. DETAILED DESCRIPTION

[0031] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. However, the spirit and scope of the present disclosure are not limited to a part of the described embodiments, and may be implemented in various other forms, and within the spirit and scope of the present disclosure, one or more elements of the embodiments may be selectively combined and rearranged.

[0032] In addition, unless otherwise explicitly defined and described, the terms (including technical terms and scientific terms) used in the embodiments of the present disclosure may be interpreted as having the same meaning as that generally understood by a person of ordinary skill in the art to which the present disclosure belongs, and the terms (for example, terms defined in a commonly used dictionary) may be interpreted as having a meaning consistent with its meaning in the context of the relevant technology. In addition, the terms used in the embodiments of the present disclosure are used to describe the embodiments and are not intended to limit the present disclosure.

[0033] In this specification, the singular form may also include the plural form unless otherwise specified in the phrase, and when described as "at least one (or more) of A (and), B and C", it may include at least one of all combinations that can be combined with A, B and C.

[0034] In addition, when describing the elements of the embodiments of the present disclosure, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish an element from other elements, and the terms are not limited to the nature, order, or sequence of the elements.

[0035] In addition, when an element is described as being “connected,” “combined” or “in contact with” another element, it may include not only the case where the element is directly “connected,” “combined” or “in contact with” another element, but also the case where the element is “connected,” “combined” or “in contact with” another element between the element and the other element.

[0036] In addition, when described as being formed or arranged “on (above)” or “under (below)” each element, “on (above)” or “under (below)” may include not only the case where two elements are directly connected to each other, but also the case where one or more other elements are formed or arranged between the two elements.

[0037] Furthermore, when expressed as “upper” or “lower”, not only an upper direction based on one element but also a lower direction based on one element may be included.

[0038] The lighting device described below can be applied to various lighting devices that require lighting, such as vehicle lamps, household lighting devices, and industrial lighting devices. For example, when the lighting device is applied to vehicle lamps, the lighting device can be applied to headlights, rearview mirror lamps, side marker lamps, fog lamps, turn signal lamps, tail lamps, brake lights, daytime running lights, vehicle interior lighting, door scuffs, rear combination lamps, and reverse lights. The lighting device of the present invention can be applied to indoor and outdoor advertising devices, display devices, and various types of electric vehicles. In addition, the lighting device can be applied to all lighting-related fields or advertising-related fields that are currently being developed and commercialized or can be realized according to future technological developments.

[0039] Reference Figures 1 to 6 , the lighting device 400 according to the embodiment may include a light emitting device 100 or a light emitting chip and a resin layer 420 covering the light emitting device 100 or the light emitting chip. The lighting device 400 may include a substrate 401 disposed under the light emitting device 100 or the light emitting chip, and the resin layer 420. The lighting device 400 may include at least one of a diffusion layer 430, a light blocking portion 425, and / or a light transmission layer on the resin layer 420. The lighting device 400 may include a reflective member 410 disposed between the substrate 401 and the resin layer 420.

[0040] The lighting device 400 according to the embodiment may emit light emitted from the light emitting device 100 as a surface light source. The lighting device 400 may be defined as a light emitting unit or a light source module. The lighting device 400 may include one light emitting unit or a plurality of light emitting units on a substrate 401.

[0041] The resin layer 420 according to the embodiment may be disposed around the light emitting device 100 or the light emitting chip The resin layer 420 guides light emitted from the light emitting device 100 or the light emitting chip and may emit the guided light in the form of a surface light source through an exit surface.

[0042] The resin layer 420 may be formed of a resin composition. In detail, the resin layer 420 may be formed of a resin composition that is photocured. More specifically, the resin layer 420 may be formed of a resin composition that is cured by ultraviolet (UV) rays.

[0043] The resin composition may include oligomers, monomers, photoinitiators, and additives. The oligomers and monomers may be related to physical properties and / or chemical properties of the resin layer 420 formed by curing the resin composition.

[0044] In addition, a photoinitiator can be used to initiate photopolymerization of oligomers and monomers. That is, when ultraviolet rays are incident on the resin composition, oligomers and monomers can initiate polymerization reactions through the photoinitiator.

[0045] The additive may include an antioxidant. Specifically, the additive may prevent the denaturation of the resin layer 420 formed by curing the resin composition. For example, the additive may be used to prevent the intermolecular bonds of the resin layer 420 from breaking or the resin layer 420 from yellowing due to an intermediate product.

[0046] The resin layer 420 formed by curing the resin composition may contain a photoinitiator remaining after curing. The photoinitiator may generate free radicals through heat, and these free radicals may break the intermolecular bonds of the resin layer or form intermediate products that react with the free radicals to form. Therefore, yellowing may occur in the resin layer 420, which may reduce the reliability of the resin layer.

[0047] Therefore, the resin composition that can reduce the yellowing phenomenon of the resin layer 420 will be described in detail below.

[0048] The resin composition may include oligomers, monomers, photoinitiators, and additives.

[0049] The oligomer may be associated with the properties of the resin layer 420 such as ductility, smoothness, tensile strength, and adhesive strength.

[0050] The oligomer may include polyurethane acrylate. In detail, the oligomer may include at least one oligomer of a first oligomer and a second oligomer. For example, the oligomer may include a first oligomer of polyurethane acrylate including a tetramethylene glycol series. In addition, the oligomer may include a second oligomer of polyurethane acrylate including an ethylene glycol series.

[0051] The content of the oligomer can be in a weight percentage range set relative to the total weight of the resin composition. Specifically, the content of the oligomer can be 8wt% or more relative to the total weight of the resin composition. More specifically, the content of the oligomer can be 10wt% to 25wt% relative to the total weight of the resin composition.

[0052] If the content of the oligomer is less than 10wt% relative to the gross weight of the resin composition, at least one of the properties of the resin layer achieved by the oligomer, such as ductility, smoothness, tensile strength and adhesive strength, may be reduced. In addition, if the content of the oligomer exceeds 25wt% relative to the gross weight of the resin composition, the properties of the resin layer achieved by the oligomer can be maintained. However, this may affect the composition ratio of other compositions, and in general, the properties of the resin layer for optical applications may be reduced.

[0053] The first oligomer and the second oligomer may be included in different weight percentages. For example, the weight percentage of the second oligomer may be less than the weight percentage of the second oligomer. In detail, the weight percentage of the second oligomer may be more than 10% of the weight percentage of the first oligomer. More specifically, the weight percentage of the second oligomer may be 10% to 70% of the weight percentage of the first oligomer.

[0054] For example, the content of the first oligomer may be 8% or more of the total weight of the resin composition. In detail, the content of the first oligomer may be 8% to 20% of the total weight of the resin composition.

[0055] In addition, the content of the second oligomer may be 1% or more of the total weight of the resin composition. In detail, the content of the second oligomer may be 1% to 5% of the total weight of the resin composition.

[0056] By setting the weight percentages of the first oligomer and the second oligomer as described above, the characteristics of ductility, smoothness, tensile strength, and adhesive strength of the resin composition can be stably formed.

[0057] The monomer may be related to the characteristics of hardness, transparency, adhesiveness, and heat resistance of the resin layer 420 .

[0058] The monomer may include an acrylate monomer. Specifically, the monomer may include a first monomer, a second monomer, a third monomer, and a fourth monomer. For example, the above-mentioned monomer may include a first monomer including IBOA (isopropyl acrylate). In addition, the monomer may include a second monomer including at least one of EHA (2-ethylhexyl acrylate) and LA (lauryl acrylate). In addition, the monomer may include a third monomer including at least one of CA (caprolactone acrylate) and 2-(2-ethoxyethoxy)ethyl acrylate. In addition, the monomer may include a fourth monomer including at least one of glycidyl methacrylate (GMA) and 3,4-epoxycyclohexyl methyl methacrylate.

[0059] The content of the monomer may be in a weight percentage range set relative to the total weight of the resin composition. In detail, the content of the monomer may be 60wt% or more relative to the total weight of the resin composition. More specifically, the content of the monomer may be 60wt% to 70wt% relative to the total weight of the resin composition.

[0060] If the content of the monomer is less than 60wt% relative to the total weight of the resin composition, at least one of the hardness, transparency, adhesion and heat resistance as the characteristics of the resin layer achieved by the monomer may be reduced. In addition, if the content of the monomer is greater than 70wt% relative to the total weight of the resin composition, the characteristics of the resin layer achieved by the monomer can be maintained. However, this may affect the composition ratio of other compositions, and the characteristics of the resin layer for optical applications may decrease as a whole.

[0061] The first monomer, the second monomer, the third monomer, and the fourth monomer may be included in different weight percentages. For example, the first monomer may be included in a larger weight percentage than the second monomer, the third monomer, and the fourth monomer. In addition, the third monomer may be included in a larger weight percentage than the second monomer and the fourth monomer.

[0062] For example, the content of the first monomer may be 40 wt % or more relative to the total weight of the resin composition. Specifically, the content of the first monomer may be 40 wt % to 50 wt % relative to the total weight of the resin composition.

[0063] In addition, the content of the second monomer may be 3 wt % or more relative to the total weight of the resin composition. Specifically, the content of the second monomer may be 3 wt % to 18 wt % relative to the total weight of the resin composition.

[0064] In addition, the content of the third monomer may be 15 wt % or more relative to the total weight of the resin composition. Specifically, the content of the third monomer may be 15 wt % to 30 wt % relative to the total weight of the resin composition.

[0065] In addition, the content of the fourth monomer may be 7 wt % or more relative to the total weight of the resin composition. Specifically, the content of the fourth monomer may be 7 wt % to 14 wt % relative to the total weight of the resin composition.

[0066] By setting the weight percentages of the first monomer, the second monomer, the third monomer, and the fourth monomer as described above, the hardness, transparency, adhesiveness, and heat resistance characteristics of the resin composition can be stably formed.

[0067] On the other hand, the monomer may further include a polymerization inhibitor. The polymerization inhibitor may be used to prevent the resin composition from being polymerized again after the resin composition is cured to form a resin layer.

[0068] Photoinitiators are used to initiate the polymerization of oligomers and monomers.

[0069] The photoinitiator may have a decomposition temperature (TD) of a set size. In detail, the decomposition temperature of the photoinitiator may be 150° C. or higher. In more detail, the decomposition temperature of the photoinitiator may be 170° C. or higher. In more detail, the decomposition temperature of the photoinitiator may be 150° C. to 250° C.

[0070] If the decomposition temperature of the photoinitiator is lower than 150° C., yellowing may occur in the resin layer due to the photoinitiator. That is, since the photoinitiator has low thermal stability, the photoinitiator may easily generate free radicals due to heat generated during operation of the lighting device including the resin layer. Therefore, yellowing occurring in the resin layer may increase due to free radicals generated from the photoinitiator.

[0071] The photoinitiator may include a long wavelength photoinitiator. That is, the photoinitiator may have a large peak in the wavelength range of the ultraviolet region. In detail, the photoinitiator may absorb light of a wavelength band of a set range. In detail, the photoinitiator may absorb light of a wavelength band above 250 nm. More specifically, the photoinitiator may absorb light of a wavelength band of 250 nm to 400 nm.

[0072] If the photoinitiator absorbs light of a wavelength band less than 250 nm, the photoinitiator may become a short-wavelength photoinitiator, and thus the overall absorption wavelength band of the photoinitiator may be widened to the infrared region. Therefore, since the photoinitiator can absorb light of the lighting device, it can absorb light emitted from the light-emitting device of the lighting device, and the brightness of the lighting device may be reduced.

[0073] Furthermore, if the photoinitiator absorbs light in a wavelength band exceeding 400 nm, the photoinitiator absorbs light in the infrared region, and thus the brightness of the lighting device may decrease.

[0074] The photoinitiator may include phosphorus (P). The photoinitiator may include a phosphorus-based photoinitiator. In detail, the photoinitiator may include a photoinitiator represented by the following structural formula 1. That is, the photoinitiator may include diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide.

[0075] [Structural Formula 1]

[0076]

[0077] The content of the photoinitiator can be a weight percentage range set relative to the total weight of the resin composition. Specifically, the content of the photoinitiator can be 0.5wt% or more relative to the total weight of the resin composition. More specifically, the content of the photoinitiator can be 0.5wt% to 1.2wt% relative to the total weight of the resin composition.

[0078] If the content of the photoinitiator is less than 0.5wt% relative to the total weight of the resin composition, the polymerization reaction of the monomer and the oligomer may be reduced due to the photoinitiator, so that the resin composition may not be partially cured. In addition, if the content of the photoinitiator is greater than 1.2wt% relative to the total weight of the resin composition, the residual photoinitiator after the resin composition is cured may increase. Therefore, yellowing formed in the resin layer due to the residual photoinitiator may increase.

[0079] The additive may include an antioxidant.The additive may include a first additive and a second additive.

[0080] The first additive may include a free radical remover. Specifically, the first additive can remove free radicals generated from the photoinitiator or the inhibitor. For example, the first additive can form an alcohol by combining with free radicals generated from the photoinitiator or the inhibitor.

[0081] The first additive may include an additive represented by at least one of Structural Formulas 2, 3, and 4 below.

[0082] For example, the first additive may be bis(1,2,2,6,6-pentamethyl-4-piperidinyl) sebacate of the following structural formula 2.

[0083] [Structural Formula 2]

[0084]

[0085] Alternatively, the first additive may be bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate of the following structural formula 3.

[0086] [Structural Formula 3]

[0087]

[0088] Alternatively, the first additive may be bis(1-octyloxy-2,2,6,6-tetramethyl-4-piperidinyl) sebacate of the following structural formula 4.

[0089] [Structural Formula 4]

[0090]

[0091] The content of the first additive may be a weight percentage of a set range. Specifically, the content of the first additive may be 0.3 wt % or more relative to the total weight of the resin composition. The content of the first additive may be 0.3 wt % to 0.9 wt % relative to the total weight of the resin composition.

[0092] If the content of the first additive is less than 0.3wt% relative to the total weight of the resin composition, the free radical removal effect based on the first additive is reduced. Therefore, yellowing may occur in the resin layer, thereby reducing the light transmittance of the resin layer. In addition, if the content of the first additive exceeds 0.9wt% relative to the total weight of the resin composition, the light transmittance of the resin layer may be reduced due to the color of the first additive. In other words, the color (e.g., yellow) of the free radical remover may affect the color of the resin layer. Therefore, the transparency of the resin layer may be reduced, thereby reducing the light transmittance of the resin layer.

[0093] The second additive may include a peroxide decomposer. Specifically, the second additive may remove peroxides, which are intermediate products formed by free radicals generated from a photoinitiator or an inhibitor. For example, the second additive may react with peroxides to remove peroxides, wherein the peroxides are intermediate products formed by combining with free radicals generated from a photoinitiator or an inhibitor.

[0094] The second additive may include phosphorus (P). The second additive may include a phosphorus-based additive. The second additive may include an additive represented by at least one of the following structural formulas 5, 6, 7, 8, and 9.

[0095] That is, the second additive may be bis(2,4-di-tert-butylphenol)pentaerythritol diphosphate of the following structural formula 5.

[0096] [Structural Formula 5]

[0097]

[0098] Alternatively, the second additive may be bis(2,6-di-tert-butyl-4-methylphenyl)pentaerythritol diphosphate of the following structural formula 6.

[0099] [Structural Formula 6]

[0100]

[0101] Alternatively, the second additive may be 3,9-bis(octadecyloxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane of the following structural formula 7.

[0102] [Structural Formula 7]

[0103]

[0104] Alternatively, the second additive may be 2,2′-methylenebis(4,6-di-tert-butylphenyl)isooctanol phosphate of the following structural formula 8.

[0105] [Structural Formula 8]

[0106]

[0107] Alternatively, the second additive may be tris(2,4-di-tert-butylphenyl)phosphite of the following structural formula 9.

[0108] [Structural Formula 9]

[0109]

[0110] The content of the second additive may be a weight percentage range set relative to the total weight of the resin composition. Specifically, the content of the second additive may be 0.2wt% or more relative to the total weight of the resin composition. More specifically, the content of the second additive may be 0.2wt% to 0.7wt% relative to the total weight of the resin composition.

[0111] If the content of the second additive is less than 0.2 wt% relative to the total weight of the resin composition, the peroxide cannot be effectively removed by the second additive. In addition, if the content of the second additive exceeds 0.7 wt% relative to the total weight of the resin composition, the residual additive may form phosphoric acid after the resin composition is cured, thereby causing yellowing in the resin layer.

[0112] Therefore, the total weight of the additives including the first additive and the second additive may be 0.5wt% to 1.6wt% relative to the total weight of the resin composition. In addition, the weight percentage of the additive and the weight percentage of the photoinitiator may be different. Specifically, the weight percentage of the photoinitiator may be greater than the weight percentage of each of the first additive and the second additive.

[0113] As the weight percentage of the photoinitiator is included in an amount greater than the weight percentage of the additive, the reliability of the resin layer can be improved. Specifically, as the weight percentage of the photoinitiator is included in an amount greater than the weight percentage of the additive, the heat resistance and moisture resistance of the resin layer can be improved.

[0114] In addition, the weight percentage of the first additive and the weight percentage of the second additive may be different. Specifically, the weight percentage of the first additive may be greater than the weight percentage of the second additive. For example, within the weight percentage range of the first additive and the second additive, the weight percentage of the first additive may be greater than the weight percentage of the second additive.

[0115] As the weight percentage of the first additive is included in an amount greater than the weight percentage of the second additive, the reliability of the resin layer can be improved. In detail, as the weight percentage of the first additive is included in an amount greater than the weight percentage of the second additive, the heat resistance and moisture resistance of the resin layer can be improved.

[0116] The resin composition can improve the reliability of a resin layer formed by curing the resin composition.

[0117] In detail, the photoinitiator of the resin composition can have a decomposition temperature of a set size range. Therefore, the photoinitiator can have improved heat resistance. Therefore, when the lighting device including the resin layer is applied to a vehicle or the like and works, the decomposition of the photoinitiator due to the generated heat can be reduced. That is, the photoinitiator can be prevented from being decomposed to form free radicals. Therefore, the occurrence of yellowing of the resin layer can be reduced.

[0118] In addition, the photoinitiator of the resin composition can absorb wavelengths of a set size range. Therefore, the photoinitiator can minimize the absorption of light in the infrared wavelength band. Therefore, it is possible to prevent the photoinitiator from absorbing blue light emitted from the light-emitting device, thereby preventing the brightness of the lighting device from being reduced.

[0119] Furthermore, the resin composition may include additives. Therefore, yellowing in the resin layer may be reduced.

[0120] Figure 7 : is a diagram showing a mechanism of yellowing occurring in the resin layer of the lighting device according to the embodiment.

[0121] Figure 7 (a) is a diagram for explaining yellowing that occurs due to the breaking of intermolecular bonds in the resin layer after the resin composition is cured, Figure 7 (b) is a diagram for explaining yellowing caused by a polymerization inhibitor contained in a monomer.

[0122] Reference Figure 7 (a), the residual photoinitiator may be decomposed when heat is applied at a temperature higher than a set range. The residual photoinitiator may form free radicals while being decomposed. The bonds of the polymerized resin composition may be decomposed by these free radicals, and as a result, yellowing may occur in the resin layer.

[0123] Furthermore, an intermediate product may be generated due to the reaction of the radicals, and yellowing may occur in the resin layer due to this intermediate product.

[0124] In addition, refer to Figure 7 (b), when radicals generated from the residual photoinitiator react with the polymerization inhibitor, the polymerization inhibitor is decomposed, and thus yellowing may occur in the resin layer.

[0125] The resin composition according to the embodiment may include a first additive that removes free radicals formed by the residual photoinitiator. In addition, the resin composition may include a second additive that removes peroxides formed by free radicals formed by the residual photoinitiator. Therefore, the resin composition according to the embodiment can reduce the yellowing of the resin layer and improve the reliability of the lighting module.

[0126] Hereinafter, the present invention will be described in more detail by the resin composition according to the embodiments and comparative examples. These embodiments are presented only as examples to describe the present invention in more detail. Therefore, the present invention is not limited to these embodiments.

[0127] Resin compositions of Examples and Comparative Examples 1 to 4 having the compositions shown in Table 1 below were prepared.

[0128] Next, the resin composition was cured to form a resin layer, and then reliability in high temperature operation, thermal shock, and high temperature / high humidity operation was measured.

[0129] Furthermore, after only the weight percentages of the photoinitiator and the additives in the resin composition according to the examples of Table 1 were changed, the reliability in high temperature operation, thermal shock, and high temperature / high humidity operation was measured.

[0130] The reliability in high temperature operation was evaluated after 1000 hours at a temperature of 105°C, the reliability in heat shock was evaluated after 1000 hours at temperatures of -40°C and 105°C, and the reliability in high temperature / high humidity operation was evaluated after 1000 hours at a temperature of 85°C and a humidity of 85%.

[0131]

Table 1

[0132]

[0133]

[0134] (IrgacureTPO: diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide,

[0135] First additive: bis(1,2,2,6,6-pentamethyl-4-piperidinyl) sebacate,

[0136] Second additive: bis-(2,4-di-tert-butylphenol) pentaerythritol diphosphate)

[0137]

Table 2

[0138] High temperature operation Thermal shock High temperature / high humidity operation Example 1 Pass Pass Pass Comparative Examples 1, 2 Pass Pass 750 hours Comparative Examples 3 and 4 Pass Pass 900 hours

[0139] Referring to Table 2, it can be seen that the resin layer cured from the resin composition according to Example 1 has improved reliability compared to the resin layers cured from the resin compositions according to Comparative Examples 1 to 4.

[0140] That is, the resin layer cured from the resin composition according to the embodiment may have stable reliability in high temperature operation, thermal shock, and high temperature / high humidity operation because the weight percentages of the photoinitiator and additives of the resin composition satisfy the set ranges.

[0141] On the other hand, the resin layers cured from the resin compositions according to Comparative Examples 1 to 4 cannot have stable reliability in high temperature / high humidity operations because the weight percentages of the photoinitiator and additives of the resin compositions satisfy the set ranges.

[0142]

Table 3

[0143]

[0144] (Photoinitiator: diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide,

[0145] Additive 1: bis(1,2,2,6,6-pentamethyl-4-piperidinyl) sebacate,

[0146] Additive 2: bis-(2,4-di-tert-butylphenol) pentaerythritol diphosphate

[0147] Referring to Table 3, it can be seen that the resin layer cured from the resin composition according to the embodiment has improved reliability within the set weight percentage range of the photoinitiator and the additive.

[0148] That is, referring to Table 3, it can be seen that the resin layer cured from the resin composition according to the embodiment has improved reliability when the weight percentage of the photoinitiator of the resin composition is included more than the total weight percentage of the additives.

[0149] In addition, it can be seen that the resin layer cured by the resin composition according to the embodiment has improved reliability when the weight percentage of the additive 1 of the resin composition is included at more than the weight percentage of the additive 2. That is, it can be seen that the resin layer cured by the resin composition according to the embodiment has improved reliability when the weight percentage of the radical scavenger of the resin composition is included at more than the weight percentage of the peroxide decomposer.

[0150] Figures 8 to 10 It is shown by 31 A graph showing the relative ratio of the peak areas of the photoinitiator and the peroxide decomposer in the resin layer measured by P-NMR.

[0151] Figures 8 to 10 It is measured while the weight percentage of the photoinitiator in the resin layer is fixed and the weight percentage of the second additive is varied. 31 Peak data of P-NMR.

[0152] In detail, Figure 8 It is relative peak data when the photoinitiator of the resin layer is included in an amount of 1 wt % and the second additive is included in an amount of 0.1 wt %. Fig. 9It is relative peak data when the photoinitiator of the resin layer is included in an amount of 1 wt % and the second additive is included in an amount of 0.3 wt %. Fig.10 is the relative peak data when the photoinitiator of the resin layer is contained in an amount of 1 wt% and the second additive is contained in an amount of 0.7 wt%. Here, the relative peak data refers to the relative position of the second additive detected by chemical shift based on the photoinitiator peak position and the relative data of the area of ​​the second additive detected with the area of ​​the photoinitiator peak as 100 as a reference. Specifically, refer to Figure 8 , the photoinitiator peak position is 13.10, thus the position of the second additive detected by chemical shift is 116.5, and the area of ​​the second additive is 14.26% of the area of ​​the photoinitiator.

[0153] Resin layer 31 P-NMR is measured using an equal amount of sample after dissolving the resin layer in a CDCl3 solvent or a trifluoroacetic acid solvent to form a sample. Then, the peaks and peak areas of the photoinitiator and the second additive are measured.

[0154] Reference Figures 8 to 10 , the photoinitiator and the second additive of the resin composition according to the embodiment may have different peak areas. Specifically, the peak area of ​​the photoinitiator with a large peak height of the resin composition may be larger than the peak area of ​​the second additive with a small peak height.

[0155] The peak area of ​​the photoinitiator and the peak area of ​​the second additive may have a ratio within a set range. Specifically, the peak area of ​​the second additive may be more than 10% of the peak area of ​​the photoinitiator. More specifically, the peak area of ​​the second additive may be more than 40% of the peak area of ​​the photoinitiator. More specifically, the peak area of ​​the second additive may be less than 90% of the peak area of ​​the photoinitiator.

[0156] For example, the peak area of ​​the second additive may be 10% or more to 90% of the peak area of ​​the photoinitiator.

[0157] If the peak area of ​​the second additive is less than 10% of the peak area of ​​the photoinitiator, yellowing of the resin layer may increase. As a result, the reliability of the lighting device to which the resin layer is applied may decrease. In addition, if the peak area of ​​the second additive exceeds 90% of the peak area of ​​the photoinitiator, the second additive may form phosphoric acid, and yellowing of the resin layer may increase. As a result, the reliability of the lighting device to which the resin layer is applied may decrease.

[0158] Below, we will refer to Figures 1 to 6 Other configurations of the lighting device are described in detail.

[0159] Substrate 401

[0160] Reference Figures 1 to 4 , the substrate 401 may include a printed circuit board (PCB). The substrate 410 may include, for example, at least one of a resin-based printed circuit board (PCB), a PCB with a metal core, a flexible PCB, a ceramic PCB, or a FR-4 substrate. When the substrate 401 is set to a metal core PCB with a metal layer provided on the bottom, the heat dissipation efficiency of the light emitting device 100 may be improved.

[0161] The substrate 401 may be electrically connected to the light emitting device 100. A wiring layer (not shown) is included on the substrate 401, and the wiring layer may be electrically connected to the light emitting device 100. When a plurality of light emitting devices 100 are arranged on the substrate 401, the plurality of light emitting devices 100 may be connected in series, in parallel, or in series and parallel through the wiring layer. The substrate 401 may function as a base member or a support member disposed below the light emitting device 100 and the resin layer 420.

[0162] The upper surface of the substrate 401 may have an XY plane. The upper surface of the substrate 401 may be flat or have a curved surface. The thickness of the substrate 401 may be a height in a vertical direction or in a Z direction. Here, in the XY plane, the X direction may be a first direction and the Y direction may be a second direction. The Z direction may be a direction orthogonal to the first direction and the second direction. The length of the substrate 401 in the first direction may be greater than the width in the second direction. The length of the substrate 401 in the first direction may be more than twice, for example, more than four times, the width Y1 in the second direction. A plurality of light emitting devices 100 may be arranged on the substrate 401 at predetermined intervals in the first direction. The substrate 401 may be arranged in a straight line or a curved strip shape along the longitudinal direction. The substrate 401 may include a light-transmitting material through which light is transmitted through the upper and lower surfaces. The light-transmitting material may include at least one of polyethylene terephthalate (PET), polystyrene (PS), and polyimide (PI).

[0163] The substrate 401 may include, for example, a reflective member 410. The reflective member 410 may be an insulating layer for protecting a circuit pattern having a pad provided on the substrate 401 or a layer of a reflective material.

[0164] Light emitting device 100

[0165] Reference Figures 1 to 4 , the light emitting device 100 is disposed on the substrate 401 and emits light in a first direction. The light emitting device 100 emits light having the highest intensity in the first direction. The light emitting device 100 may have an exit surface 81 from which light is emitted, and the exit surface 81 is disposed in a third direction or a vertical direction, for example, relative to the horizontal upper surface of the substrate 401. The exit surface 81 may be a vertical plane, or may include a concave surface or a convex surface. Figure 7 and Figure 8 As shown, the light emitting device 100 may be disposed on a substrate 401 and electrically connected to pads 403 and 405 of the substrate 401 through conductive bonding members 203 and 205. The conductive bonding members 203 and 205 may be made of a solder material or a metal material.

[0166] As another example, the light emitting devices 100 may be arranged in at least one row on the substrate 401 along the second direction, or may be arranged in two or more rows, and one or more rows of light emitting devices 100 may be disposed in the first direction of the substrate 401 or may be disposed in different directions. The light emitting devices 100 may be arranged in an M×N matrix, and M and N may be integers greater than 2.

[0167] As another example, the light emitting device 100 may be provided as a first light emitting device starting from one end of the substrate 401 and a second light emitting device in the emission direction of the first light emitting device. The first light emitting device and the second light emitting device emit light toward the other end direction of the substrate 401 or the first direction. That is, the first light emitting device radiates light toward the direction of the second light emitting device, and the second light emitting device radiates light toward the direction opposite to the other end of the substrate 401 or the direction in which the first light emitting device is provided.

[0168] The light emitting device 100 may include a device having a light emitting chip 71 in the body or a package in which the light emitting chip 71 is packaged. The light emitting chip 71 may be molded by a molding member 80. The exit surface 81 may be the surface of the molding member 80. The molding member 80 may be made of a transparent resin material (e.g., silicone or epoxy). The light emitting chip 71 may emit at least one of blue light, red light, green light, ultraviolet (UV) light, and infrared light, and the light emitting device 100 may emit at least one of white light, blue light, red light, green light, and infrared light. The light emitting device 100 may be a side-view type having a bottom electrically connected to the substrate 401, but is not limited thereto. As another example, the light emitting device 100 may be an LED chip or a top-view package.

[0169] The exit surface 81 of the light emitting device 100 may be disposed on at least one side of the light emitting device 100 instead of the upper surface. The exit surface 81 may be a side portion of the side surface of the light emitting device 100 adjacent to the substrate 401 or a side portion perpendicular to the upper surface of the substrate 401. The exit surface 81 is disposed on the side surface between the bottom surface and the upper surface of the light emitting device 100, and emits light of the highest intensity to the first direction. The exit surface 81 of the light emitting device 100 may be a surface adjacent to the reflective member 410 or a surface perpendicular to the upper surface of the substrate 401 or the upper surface of the reflective member 410.

[0170] A portion of the light emitted through the exit surface 81 of the light emitting device 100 travels in a direction parallel to the top surface of the substrate 401, is reflected by the reflective member 410, or may travel in the direction of the upper surface of the resin layer 420. The thickness of the light emitting device 100 may be, for example, 3 mm or less, for example, in the range of 0.8 mm to 2 mm. The length ( Figure 2 D1) may be more than 1.5 times the thickness of the light emitting device 100. In the light emitting device 100, the distribution of light emitted in the X direction may have a light directivity angle in the ±Y direction that is wider than the light directivity angle in the ±Z direction. The light directivity angle of the light emitting device 100 in the second direction may be more than 110 degrees, for example, 120 to 160 degrees or more than 140 degrees. The light directivity angle of the light emitting device 100 in the third direction may be more than 110 degrees, for example, in the range of 120 to 140 degrees.

[0171] Reflection member 410

[0172] Reference Figures 1 to 4 , the reflective member 410 may be a layer provided separately on the substrate 401 or a layer protecting the upper part of the substrate 401. The reflective member 410 may be provided, for example, between the substrate 401 and the resin layer 420. The reflective member 410 may be provided in the form of a film having a metallic material or a non-metallic material. The reflective member 410 may be adhered to the upper surface of the substrate 401. The reflective member 410 may have an area smaller than that of the upper surface of the substrate 401. The reflective member 410 may be spaced apart from the edge of the substrate 401, and the resin layer 420 may be attached to the substrate 401 in the spaced apart region. In this case, it is possible to prevent the edge portion of the reflective member 410 from peeling off.

[0173] The reflective member 410 may include an opening 417 in which the lower portion of the light emitting device 100 is disposed. In the opening 417 of the reflective member 410, the upper surface of the substrate 401 may be exposed, and a portion engaged with the lower portion of the light emitting device 100 may be disposed. The size of the opening 417 may be the same as or larger than the size of the light emitting device 100, but is not limited thereto. The reflective member 410 may contact the upper surface of the substrate 401 or may be adhered between the resin layer 420 and the substrate 401, but is not limited thereto. Here, the reflective member 410 may be removed when a high reflective material is coated on the upper surface of the substrate 401.

[0174] The reflective member 410 may be formed to have a thickness smaller than that of the light emitting device 100. The thickness of the reflective member 410 may include a range of 0.2 mm ± 0.02 mm. The lower portion of the light emitting device 100 may penetrate the opening 417 of the reflective member 410 and the upper portion of the light emitting device 100 may protrude. The exit surface 81 of the light emitting device 100 may be disposed in a direction perpendicular to the upper surface of the reflective member 410.

[0175] The reflective member 410 may include a metal material or a non-metal material. The metal material may include a metal such as aluminum, silver or gold. The non-metal material may include a plastic material or a resin material. The plastic material may be any one selected from the group consisting of polyethylene, polypropylene, polystyrene, polyvinyl chloride, polybiphenyl chloride, polyethylene terephthalate, polyvinyl alcohol, polycarbonate, polybutylene terephthalate, polyethylene naphthalate, polyamide, polyacetal, polyphthalic acid, polyamide-imide, polyetherimide, polyetheretherketone, polyimide, polytetrafluoroethylene, liquid crystal polymer, fluororesin, its copolymer and its mixture. As a resin material, a reflective material such as a metal oxide of TiO2, Al2O3 or SiO2 may be added to a silicone resin or an epoxy resin. The reflective member 410 may be implemented as a single layer or multiple layers, and the light reflection efficiency may be improved by such a layer structure. The reflective member 410 according to an embodiment of the present invention reflects incident light, thereby increasing the amount of light so that the light is emitted in a uniform distribution.

[0176] Reference Figure 5 , the reflective member 410 may include an adhesive layer L1, a reflective layer L2, and a dot layer L3. The adhesive layer L1 may attach the reflective member 410 to the upper surface of the substrate 401. The adhesive layer L1 is a transparent material and may be an adhesive such as a UV adhesive, a silicone resin, or an epoxy resin.

[0177] The reflective layer L2 may include a plurality of reflectors La in a resin material. The reflector La may be a bubble such as air or a medium having the same refractive index as air. The resin material of the reflective layer L2 may be a material such as silicone resin or epoxy resin, and the reflector La may be formed by injecting bubbles into the resin material. The reflective layer L2 may reflect incident light or refract it in different directions through a plurality of reflectors La. The thickness of the reflective layer L2 may be more than 80% of the thickness of the reflective member 410. A dot layer L3 in which a plurality of dots are arranged may be included on the reflective layer L2. The dot layer L3 may be formed on the reflective layer L2 by printing. The dot layer L3 may include reflective ink. The dot layer L3 may be printed with a material containing any one of TiO2, CaCO3, BaSO4, Al2O3, silicon, or PS. The individual dots of the dot layer L3 may have a hemispherical or polygonal shape in a side profile. The density of the dot pattern of the dot layer L3 may increase as the distance from the exit surface 81 of the light emitting device 100 increases. The material of the dot layer L3 may be white.

[0178] Since the dot layer L3 is disposed on the upper surface of the reflective layer L2 along the emission direction of the light emitting device 100 , the light reflectivity can be improved, the light loss can be reduced, and the brightness of the surface light source can be improved.

[0179] As another example of the lighting device, the reflective member 410 may be removed from the substrate 401. Figure 6 As shown, the resin layer 420 may be disposed on the substrate 401 without a reflective member, and the resin layer 420 may be in contact with the upper surface of the substrate 401. In the absence of a reflective member, metal oxidation problems may occur when the pads 403 and 405 are exposed on the substrate 401, and the resin layer 420 may suppress metal oxidation in which the metal material is combined with oxygen. That is, the resin layer 420 may suppress metal oxidation caused by moisture by removing acrylate having a hydroxyl group.

[0180] Resin layer 420

[0181] The resin layer 420 may be formed by curing the above-mentioned resin composition. The resin layer 420 may be disposed on the substrate 401. The resin layer 420 may face the substrate 401 or adhere to the substrate 401. The resin layer 420 may be disposed on all or part of the upper surface of the substrate 401. The area of ​​the lower surface of the resin layer 420 may be the same as or smaller than the area of ​​the upper surface of the substrate 401. The resin layer 420 may be formed of a transparent material and may guide light or diffuse light. The resin layer 420 may be used instead of a light guide plate, which facilitates adjustment of the refractive index and thickness.

[0182] Since the resin layer 420 is provided as a layer guiding light through a resin material, it can be provided to be thinner than that of glass and can be provided as a flexible board. The resin layer 420 can emit a point light source emitted from the light emitting device 100 in the form of a line light source or a surface light source.

[0183] Beads (not shown) may be included in the resin layer 420, and the beads may diffuse and reflect incident light to increase the amount of light. The beads may be provided in an amount of 0.01% to 0.3% based on the weight of the resin layer 420. The beads may be composed of any one selected from silicon, silicon dioxide, glass bubbles, polymethyl methacrylate (PMMA), urethane, Zn, Zr, A12O3, and acrylic resin (acryl), and the particle size of the beads may be in the range of about 1 μm to about 20 μm, but is not limited thereto.

[0184] Since the resin layer 420 is disposed on the light emitting device 100, it is possible to protect the light emitting device 100 and reduce the loss of light emitted from the light emitting device 100. The light emitting device 100 may be buried under the resin layer 420.

[0185] The resin layer 420 may be in contact with the surface of the light emitting device 100 and may be in contact with the exit surface 81 of the light emitting device 100. A portion of the resin layer 420 may be disposed in the opening 417 of the reflective member 410. A portion of the resin layer 420 may be in contact with the upper surface of the substrate 401 through the opening 417 of the reflective member 410. Therefore, a portion of the resin layer 420 may be in contact with the substrate 401, thereby fixing the reflective member 410 between the resin layer 420 and the substrate 401.

[0186] Reference Figure 4 , the thickness Z1 of the resin layer 420 may be 1.8 mm or more, for example, in the range of 1.8 mm to 2.5 mm. When the thickness Z1 of the resin layer 420 is thicker than the above range, the luminous intensity may be reduced, and it may be difficult to provide a flexible module due to the increase in the thickness of the module. When the thickness Z1 of the resin layer 420 is less than the above range, it is difficult to provide a surface light source with uniform luminous intensity.

[0187] The length of the resin layer 420 in the first direction X may be the same as the length of the substrate 401 in the first direction, and the width of the resin layer 420 in the second direction Y may be the same as the width Y1 of the substrate 401 in the second direction. Therefore, each side surface of the resin layer 420 may be disposed on the same plane as each side surface of the substrate 401. For example, the first side surface S1 and the second side surface S2 of the substrate 401 may be disposed on the same vertical surface as both side surfaces of the resin layer 420.

[0188] The resin layer 420 may be provided in a size covering a plurality of light emitting devices 100 or may be connected to each other. The resin layer 420 may be divided into a size covering each light emitting device 100 and may be divided into a light emitting unit having each light emitting device 100 / each resin layer 420.

[0189] The upper surface of the resin layer 420 may have a first adhesive force. The upper surface of the resin layer 420 may have a first adhesive force and may be adhered to the light transmitting layer 415 .

[0190] Light transmission layer 415

[0191] The light transmission layer 415 may be an adhesive material such as silicone or epoxy, or may include a diffusion material. The diffusion material may include at least one of polyester (PET), polymethyl methacrylate (PMMA), or polycarbonate (PC). The light transmission layer 415 may include an adhesion region that adheres to the upper surface of the resin layer 420 and a non-adhesion region that does not adhere to the upper surface of the resin layer 420 or is spaced apart from the upper surface of the resin layer 420. The light transmission layer 415 is disposed at more than 60% of the upper surface area of ​​the resin layer 420, for example, more than 80%, so that the diffusion layer 430 can be in close contact with the resin layer 420 or the lower diffusion layer (not shown).

[0192] Light blocking portion 425

[0193] The light blocking part 425 may face the upper surface of the resin layer 420. The light blocking part 425 may overlap the light emitting device 100 in the vertical direction or the third direction Z. Each of the plurality of light blocking parts 425 may overlap each of the plurality of light emitting devices 100 in the vertical direction. The light blocking part 425 may be disposed between the resin layer 420 and the diffusion layer 430. When the diffusion layer 430 is provided in plurality, the light blocking part 425 may be disposed between the plurality of diffusion layers.

[0194] The light blocking portion 425 may be disposed in the light transmitting layer 415. The light blocking portion 425 may pass through the light transmitting layer 415 and may contact at least one of the resin layer 425 and the diffusion layer 430. The light blocking portion 425 may include a gap portion 427 spaced apart from the inner surface of the light transmitting layer 415 and / or the upper surface of the resin layer 420. The gap portion 427 may provide a refractive index different from that of the light blocking portion 425, thereby improving light diffusion efficiency. The lower surface S13 of the light blocking portion 425 may be spaced apart from or out of contact with the upper surface of the lower layer, such as the upper surface of the resin layer 420. The gap portion 427 may be an air region or a vacuum region.

[0195] The interval B1 between the light blocking parts 425 may be smaller than the interval X1 between the light emitting devices 100. The light blocking parts 425 may be spaced apart from the outer surface of the resin layer 420. A plurality of light blocking parts 425 may be arranged along the first direction. A plurality of light blocking parts 425 may have the same shape as each other. The light blocking parts 425 may be disposed on each of the light emitting devices 100. Each of the light blocking parts 425 may be disposed in a direction perpendicular to each of the light emitting devices 100 and in a peripheral region thereof.

[0196] The light blocking portion 425 may be disposed higher than the upper surface of the resin layer 420. The light blocking portion 425 may be more than 50% of the upper surface area of ​​the light emitting device 100 on the light emitting device 100, or may be in the range of 50% to 200%. The light blocking portion 425 may be an area printed with a white material. The light blocking portion 425 may be printed, for example, using a reflective ink including any one of TiO2, A12O3, CaCO3, BaSO4, and silicon. The light blocking portion 425 reflects light emitted through the exit surface of the light emitting device 100, thereby reducing the occurrence of hot spots on the light emitting device 100. The light blocking portion 425 may be printed with a light blocking pattern using light blocking ink. The light blocking portion 425 may be formed by printing on the lower surface of the diffusion layer 430. The light blocking portion 425 is a material that does not 100% block incident light, may have a transmittance lower than a reflectance, and may perform the functions of blocking and diffusing light. The light blocking portion 425 may be formed as a single layer or multiple layers and may have the same pattern shape or different pattern shapes. The light blocking portion 425 may have the same thickness. The thickness of the light blocking portion 425 may be formed to have different thicknesses according to regions. For the thickness of the light blocking portion 425, the central region may be the thickest and the edge region may be thinner than the central region. The thickness of the light blocking portion 425 may be proportional to the incident light intensity.

[0197] The size of the light blocking portion 425 can be arranged to be more than 50% of the upper surface area of ​​the light emitting device 100, for example, in the range of 50% to 200%, to block the incident light. Therefore, it is possible to reduce the problem of the light emitting device 100 being visible from the outside, and reduce hot spots on the area of ​​the light emitting device 100, thereby providing uniform light distribution over the entire area.

[0198] As another example, the light blocking portion 425 may be an air region in a concave portion formed by an etching process on the upper surface of the resin layer 420, or may include a light blocking layer provided with a light blocking material. The etching region may cover the emission surface of the light emitting device 100 by disposing the light emitting device 100 in the range of 50% to 200% of the upper surface area of ​​the etching region like the region of the light blocking portion. The light blocking portion 425 may be provided in a hemispherical, elliptical, or circular shape relative to the light emitting device 100.

[0199] Reference Figure 2 and Figure 4 , the width C1 of the area adjacent to the light-emitting device 100 in the light-blocking portion 425 in the second direction Y is small and gradually increases toward the center of the light-blocking portion 425, and the width (e.g., C3) from the center along the second direction Y can be maximized. The width in the second direction Y can gradually decrease as it moves away from the center of the light-blocking portion 425 to the light-emitting device 100. The maximum width C3 in the second direction Y is the largest at the center of the light-blocking portion 425, and the width in the second direction Y can gradually narrow as it moves away from the center of the light-blocking portion 425 in the first direction X. In the light-blocking portion 425, the area overlapping with the light-emitting device 100 in the vertical direction has a flat outer surface, and the width C1 of the flat outer surface in the second direction Y is greater than the length D1 of the light-emitting device 100 in the second direction. The second direction width C1 of the light-blocking portion 425 is set to be greater than the length D1 of the light-emitting device 100 by more than 0.8 mm, so that the light-blocking portion 425 can cover both sides of the light-emitting device 100 and prevent hot spots caused by the light emitted by the light-emitting device 100.

[0200] The maximum length B3 of the light blocking portion 425 in the first direction X may be equal to or less than the maximum width C3 in the second direction Y. The maximum width C3 may be 13 mm or more, for example, in the range of 13 mm to 17 mm. The maximum width C3 of the light blocking portion 425 in the second direction Y may be changed according to the length D1 of the light emitting device 100 in the second direction Y. The maximum width C3 of the light blocking portion 425 in the second direction Y may be 50% or more of the length Y1 of the substrate 401 in the second direction Y, for example, in the range of 50% to 90%.

[0201] Here, the distance X1 between the light emitting devices 100 may be 25 mm or more, for example, in the range of 25 mm to 30 mm, and may be changed according to the characteristics of the light emitting device 100. The light blocking portion 425 provides a maximum length B3 in the first direction X and a maximum width C3 in the second direction Y passing through the center of the light blocking portion 425 within the above range, so that hot spots on the light emitting device 100 can be reduced and light uniformity can be improved.

[0202] like Figure 4As shown, the thickness Z3 of the light blocking portion 425 may be less than 0.1 times the thickness Z1 of the resin layer 420, for example, in the range of 0.05 times to 0.1 times. The thickness Z3 of the light blocking portion 425 may be more than 100 μm, for example, in the range of 100 μm to 200 μm. When the thickness Z3 of the light blocking portion 425 is less than the above range, there is a limitation in reducing hot spots, and when the thickness Z3 is greater than the above range, the light uniformity may be reduced. The distance Z4 between the upper surface of the light emitting device 100 and the lower surface of the light blocking portion 425 may be more than 0.4 mm, for example, in the range of 0.4 mm to 0.6 mm. The distance Z0 between the upper surface of the light emitting device 100 and the upper surface of the reflective member 410 may be more than 0.8 mm, for example, in the range of 0.8 mm to 1.4 mm. The area of ​​the light blocking portion 425 may not overlap with the area of ​​the light transmitting layer 415 in the vertical direction.

[0203] The light blocking portion 425 may be disposed on each of the light emitting devices 100, and its size or area is sufficient to prevent hot spots caused by light emitted in the emission direction of the light emitting device 100. In addition, the light blocking portion 425 causes the light emitting device 100 to emit light in a side direction, i.e., in the first direction, so that it covers an area capable of increasing light blocking efficiency due to the light orientation distribution and reflective characteristics of the light emitting device 100.

[0204] Diffusing layer 430

[0205] The diffusion layer 430 may be disposed on the resin layer 420. The lower surface of the diffusion layer 430 may include a first area S11 provided with the light transmission layer 415 and a second area S12 provided with the light blocking part 425. The diffusion layer 430 may have the light blocking part 425 printed thereon and may be fixed on the resin layer 420 by the light transmission layer 415.

[0206] Here, when a lower diffusion layer (not shown) is disposed between the light transmission layer 415 and the resin layer 420, the lower diffusion layer may be adhered to the resin layer 420, for example, the upper surface of the resin layer 420 may be adhered to the lower diffusion layer by a first adhesive force having microciliary hairs. In this case, the diffusion layer 430 and / or the lower diffusion layer may be attached to the resin layer 420 by applying a predetermined pressure or pressure / heat.

[0207] The diffusion layer 430 may include at least one of a polyester (PET) film, a polymethyl methacrylate (PMMA) material, or a polycarbonate (PC) material. The diffusion layer 430 may be provided as a film made of a resin material such as silicone or epoxy. The diffusion layer 430 may include a single layer or multiple layers.

[0208] The thickness Z2 of the diffusion layer 430 is 25 micrometers or more, and may be, for example, in the range of 25 micrometers to 250 micrometers or in the range of 100 micrometers to 250 micrometers. The diffusion layer 430 may provide incident light having the above thickness range as a uniform surface light source.

[0209] The diffusion layer 430 and / or the lower diffusion layer may include at least one or more than two of a diffuser such as beads, a phosphor and ink particles. The phosphor may include, for example, at least one of a red phosphor, an amber phosphor, a yellow phosphor, a green phosphor and a white phosphor. The ink particles may include at least one of a metal ink, a UV ink and a curing ink. The size of the ink particles may be smaller than the size of the phosphor. The surface color of the ink particles may be any one of green, red, yellow and blue. The ink type may be selectively applied in PVC (polyvinyl chloride) ink, PC (polycarbonate) ink, ABS (acrylonitrile butadiene styrene copolymer) ink, UV resin ink, epoxy resin ink, silicone resin ink, PP (polypropylene) ink, water-based ink, plastic ink, PMMA (polymethyl methacrylate) ink and PS (polystyrene) ink. The ink particles may include at least one of a metal ink, a UV ink and a curing ink.

[0210] In an embodiment of the present invention, light diffused by the resin layer 420 may be transmitted through the light transmission layer 415 and may be emitted as a surface light source through the diffusion layer 430. In this case, the light blocking part 425 may prevent hot spots caused by incident light.

[0211] In another example of the present invention, a reflective layer or an upper substrate may be disposed on the resin layer 420. The layer of reflective material or the upper substrate may face the upper surface of the resin layer 420, the light emitting devices 100 are arranged in at least one row or column, and the respective exit surfaces 81 of the light emitting devices 100 may be arranged at the same pitch as one side of the resin layer 420, and light may be emitted through one side of the resin layer 420.

[0212] On the other hand, in the above description, it is described that the light emitting device emits light in the lateral direction of the resin layer, but the embodiment is not limited thereto. That is, the light emitting device can be connected to the substrate 410 in the top view direction. Therefore, the light emitting device can emit light in the upper direction of the resin layer 401.

[0213] Alternatively, refer to Fig.11 , a plurality of light emitting devices 100 may be disposed on the substrate 401. The plurality of light emitting devices 100 may be top-view types electrically connected to the substrate 401. The plurality of light emitting devices 100 may be disposed on the substrate 401 at set intervals. For example, the plurality of light emitting devices 100 may be disposed at equal intervals in the first direction. In addition, the plurality of light emitting devices 100 may be disposed at equal intervals in the second direction.

[0214] Therefore, the lighting module 400 including the plurality of light emitting devices 100 can emit light as a surface light source. The lighting module 400 can emit light toward the open upper direction of the housing 300.

[0215] Fig.12 is a front view showing a light emitting device on a substrate in the lighting device according to the embodiment. Fig.13 yes Fig.12 A side view of a light emitting element.

[0216] Reference Fig.12 and Fig.13 The light emitting device 100 includes a body 10 having a cavity 20, a plurality of lead frames 30 and 40 in the cavity 20, and a light emitting chip 71 disposed on at least one of the plurality of lead frames 30 and 40. The light emitting device 100 may be implemented as a side-emitting type package.

[0217] The body 10 may include a cavity 20 at the bottom where the lead frames 30 and 40 are exposed. The plurality of lead frames 30 and 40 are separated into, for example, first and second lead frames 30 and 40 and coupled to the body 10.

[0218] The main body 10 may be formed of an insulating material. The main body 10 may be formed of a reflective material. The main body 10 may be formed of a material having a reflectivity higher than the transmittance for the wavelength emitted from the light-emitting chip, for example, a material having a reflectivity of more than 70%. When the reflectivity is more than 70%, the main body 10 may be defined as a non-transmissive material or a reflective material. The main body 10 may be formed of a resin-based insulating material, for example, a resin material such as polyphthalamide (PPA: polyphtalamide). The main body 10 may be formed of a silicone-based resin, an epoxy-based resin, or a thermosetting resin including a plastic material, or a highly heat-resistant and light-resistant material. The main body 10 includes a white-based resin. In the main body 10, anhydrides, antioxidants, demolding materials, light reflectors, inorganic fillers, curing catalysts, light stabilizers, lubricants, and titanium dioxide may be selectively added. The main body 10 may be molded by at least one selected from the group consisting of epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylic resin, and urethane resin. For example, epoxy resin composed of triglycidyl isocyanurate, hydrogenated bisphenol A diglycidyl ether, etc., and acid anhydrides composed of hexahydrophthalic anhydride, 3-methylhexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, etc., DBU (1,8-diazabicyclo (5,4,0) undecene-7) as a curing accelerator, ethylene glycol as a co-catalyst, titanium oxide pigment, and glass fiber are added to the epoxy resin, and the B stage is partially cured by heating, but not limited to this. The body 10 can appropriately mix at least one selected from the group consisting of a dispersant, a pigment, a fluorescent material, a reflective material, a light blocking material, a light stabilizer, and a lubricant into the thermosetting resin.

[0219] The body 10 may include a reflective material, such as a resin material to which a metal oxide is added, and the metal oxide may include at least one of TiO2, SiO2, and Al2O3. The body 10 may effectively reflect incident light. As another example, the body 10 may be formed of a translucent resin material or a resin material having a phosphor for converting the wavelength of incident light. The bottom of the body 10 may be a side surface corresponding to the substrate 401.

[0220] The first lead frame 30 includes a first lead portion 31 disposed on the bottom of the cavity 20, a first bonding portion 32 extending to the outside of the body 10, and a first heat dissipation portion 33. The first bonding portion 32 is bent from the first lead portion 31 in the body 10 and protrudes to the outside of the body, and the first heat dissipation portion 33 can be bent from the first bonding portion 32.

[0221] The second lead frame 40 includes a second lead portion 41 disposed on the bottom of the cavity 20, a second bonding portion 42 disposed on the outer area of ​​the body 10, and a second heat dissipation portion 43. The second bonding portion 42 may be bent from the second lead portion 41 within the body 10, and the second heat dissipation portion 43 may be bent from the second bonding portion 42.

[0222] Here, the light emitting chip 71 may be disposed on the first lead portion 31 of the first lead frame 30 and connected to the first lead portion 31 and the second lead portion 41 by a wire, or may be connected to the first lead portion 31 by an adhesive and connected to the second lead portion 41 by a wire. The light emitting chip 71 may be a horizontal chip, a vertical chip, or a chip having a through-hole structure. The light emitting chip 71 may be mounted in a flip chip manner. The light emitting chip 71 may selectively emit light in the wavelength range from ultraviolet light to visible light. The light emitting chip 71 may, for example, emit ultraviolet light or a blue peak wavelength. The light emitting chip 71 may include at least one of a II-VI compound and a III-V compound. The light emitting chip 71 may, for example, be formed of a compound selected from the group consisting of GaN, AlGaN, InGaN, AlInGaN, GaP, AlN, GaAs, AlGaAs, InP, and mixtures thereof.

[0223] One or more light emitting chips 71 may be disposed in the cavity 20 and emit light with maximum intensity in the direction of the central axis X0 .

[0224] One or more of the light emitting chips provided in the cavity 20 of the light emitting device 100 according to the embodiment may be provided. The light emitting chip may be selected from, for example, a red LED chip, a blue LED chip, a green LED chip, and a yellow-green LED chip.

[0225] The molding member 80 is disposed in the cavity 20 of the body 11, and the molding member 80 includes a light-transmitting resin such as a silicone resin or an epoxy resin, and may be formed as a single layer or multiple layers. A phosphor for changing the wavelength of the emitted light may be included in the molding member 80 or the light-emitting chip 71, and the phosphor excites a portion of the light emitted from the light-emitting chip 71 to emit light of different wavelengths. The phosphor may be selectively formed of quantum dots, YAG, TAG, silicates, nitrides, and oxynitride-based materials. The phosphor may include at least one of a red phosphor, a yellow phosphor, and a green phosphor, but is not limited thereto. The exit surface 81 of the molding member 80 may be formed in a flat shape, a concave shape, a convex shape, etc., but is not limited thereto. As another example, a light-transmitting film having a phosphor may be disposed on the cavity 20, but the present disclosure is not limited thereto.

[0226] A lens may be further formed on an upper portion of the body 10 , and the lens may include a structure of a concave lens and / or a convex lens and control light distribution of light emitted by the light emitting device 100 .

[0227] Semiconductor devices such as a light receiving device and a protection device may be mounted on the body 10 or any one of the lead frames, and the protection device may be implemented as a thyristor, a Zener diode or a TVS (transient voltage suppression), and the Zener diode protects the light emitting chip from electrostatic discharge (ESD).

[0228] At least one or more light emitting devices 100 are disposed on the substrate 401, and the reflective member 410 is disposed around the lower portion of the light emitting device 100. The first and second lead portions 33 and 43 of the light emitting device 100 are bonded to the pads 403 and 405 of the substrate 401 through solder or conductive tape as the conductive adhesive members 203 and 205.

[0229] Fig.14 It is an application Fig. 9 Top view of a vehicle with headlights.

[0230] Reference Fig.14 , the vehicle lighting may include a first lamp unit 812, a second lamp unit 814, a third lamp unit 816 and a housing 810. Here, each lamp unit may be a light source for functions such as a headlamp, a rearview mirror lamp, a side marker lamp, a fog lamp, a turn signal lamp, a tail lamp, a brake lamp, a daytime running lamp, a rear combination lamp, a reverse lamp, etc., but is not limited thereto.

[0231] The housing 810 accommodates the first to third lamp units 812, 814, and 816 and may be made of a light-transmitting material. In this case, the housing 810 may have a curve according to the design of the vehicle body, and the first to third lamp units 812, 814, and 816 may implement a surface light source having a curved surface according to the shape of the housing 810.

[0232] The features, structures, effects, etc. described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to one embodiment. In addition, the features, structures, effects, etc. shown in the various embodiments can be combined or modified by a person skilled in the art of the embodiment for other embodiments. Therefore, the contents related to such combinations and modifications should be interpreted as being included within the scope of the present invention.

[0233] In addition, although the embodiments have been described above, they are only examples and do not limit the present invention, and are illustrated above in the scope of the essential features of the present embodiment to the ordinary technicians in the field to which the present invention belongs. It can be seen that various modifications and applications that have not yet been made are possible. For example, the various components specifically shown in the embodiments can be implemented by modification. Differences related to these modifications and applications should be interpreted as being included in the scope of the present invention as defined by the appended claims.

Claims

1. A resin composition comprising: Oligomers, monomers, photoinitiators and additives, in, The content of the oligomer is 10 wt % to 25 wt % relative to the total weight of the resin composition. Wherein, the content of the monomer is 60wt% to 70wt% relative to the total weight of the resin composition, Wherein, the content of the photoinitiator is 0.5wt% to 1.2wt% relative to the total weight of the resin composition. wherein the additive comprises a first additive comprising a free radical remover and a second additive comprising a peroxide decomposer, Wherein, the photoinitiator comprises phosphorus (P), wherein the second additive comprises phosphorus (P), and Wherein, the weight percentage of the photoinitiator is greater than the weight percentage of each of the first additive and the second additive.

2. The resin composition according to claim 1, wherein The content of the additive is 0.5 wt % to 1.6 wt % relative to the total weight of the resin composition.

3. The resin composition according to claim 2, wherein The weight percentage of the first additive is greater than the weight percentage of the second additive.

4. The resin composition according to claim 3, wherein The content of the first additive is 0.3wt% to 0.9wt% relative to the total weight of the resin composition, and The content of the second additive is 0.2 wt % to 0.7 wt % relative to the total weight of the resin composition.

5. The resin composition according to claim 4, wherein The oligomers are a first oligomer comprising a polyurethane acrylate of a tetramethylene glycol series, and a second oligomer comprising a polyurethane acrylate of an ethylene glycol series, wherein the content of the first oligomer is 8wt% to 20wt% relative to the total weight of the resin composition, and The content of the second oligomer is 2 wt % to 5 wt % relative to the total weight of the resin composition.

6. The resin composition according to claim 5, wherein The monomers include: a first monomer including isopropyl acrylate (IBOA), a second monomer including at least one of 2-ethylhexyl acrylate (EHA) and lauryl acrylate (LA), a third monomer including at least one of caprolactone acrylate (CA) and ethyl 2-(2-ethoxyethoxy)acrylate, and a fourth monomer including at least one of glycidyl methacrylate (GMA) and 3,4-epoxycyclohexyl methyl methacrylate, Wherein, the content of the first monomer is 40wt% to 50wt% relative to the total weight of the resin composition. Wherein, the content of the second monomer is 3wt% to 18wt% relative to the total weight of the resin composition. wherein the content of the third monomer is 15wt% to 30wt% relative to the total weight of the resin composition, and The content of the fourth monomer is 7 wt % to 14 wt % relative to the total weight of the resin composition.

7. The resin composition according to claim 1, wherein The decomposition temperature of the photoinitiator is 50°C to 250°C.

8. The resin composition according to claim 1, wherein The photoinitiator absorbs light in the wavelength band of 50 nm to 400 nm.

9. A resin composition comprising: oligomer, monomer, photoinitiator, first additive and second additive, in, The content of the oligomer is 10 wt % to 25 wt % relative to the total weight of the resin composition. Wherein, the content of the monomer is 60wt% to 70wt% relative to the total weight of the resin composition, Wherein, the content of the photoinitiator is 0.5wt% to 1.2wt% relative to the total weight of the resin composition. The sum of the weight percentage of the first additive and the weight percentage of the second additive relative to the total weight of the resin composition is 0.5wt% to 1.6wt%. wherein the first additive comprises a free radical scavenger, Wherein, the second additive comprises a peroxide decomposer, Wherein, the photoinitiator comprises phosphorus (P), wherein the second additive comprises phosphorus (P), and Wherein, the second additive 31 The P-NMR peak area is the 31 10% to more than 90% of the P-NMR peak area.

10. A lighting device, comprising: substrate; A light emitting device, wherein the light emitting device is disposed on the substrate; as well as a resin layer disposed on the substrate around the light emitting device, and Wherein, the resin layer comprises the resin composition according to any one of claims 1 to 9.

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