Exposure device

Abstract

The purpose of the present invention is to detect, when a substrate is disposed on a substrate holder that holds the substrate, the positions of substrates disposed in various forms, such as when the substrate is disposed by changing the direction of the substrate or when a plurality of substrates are disposed. An exposure device is provided with: a holding unit (201) that holds a plurality of substrates; a plurality of first sensors (210) that detect the position of each of the plurality of substrates with respect to the holding unit (201); a stage part (121) on which the plurality of substrates are arranged; and a plurality of second sensors (150) that detect the position of each of the plurality of substrates with respect to the stage part (121), the number of the plurality of second sensors (150) being smaller than the number of the plurality of first sensors (210).

Description

Technical Field

[0001] The present invention relates to an exposure device. Background Art

[0002] In the photolithography process of manufacturing semiconductor elements and liquid crystal display elements, for example, a projection exposure device using a step-and-repeat method (so-called a stepper) or a projection exposure device using a step-and-scan method (so-called a scanning stepper (also called a scanner)) is mainly used.

[0003] In such an exposure device, when placing a substrate on a substrate holder that holds the substrate, the substrate may be placed in a different direction or multiple substrates may be placed (for example, Patent Document 1). It is required to detect the positions of substrates placed in various forms.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2020-194007 Summary of the invention

[0007] According to the disclosed embodiment, the exposure device comprises: a holding portion for holding a plurality of substrates; a plurality of first sensors for detecting the positions of each of the plurality of substrates relative to the holding portion; a stage portion for configuring the plurality of substrates; and a plurality of second sensors for detecting the positions of each of the plurality of substrates relative to the stage portion, the number of the plurality of second sensors being less than the number of the plurality of first sensors.

[0008] According to another disclosed embodiment, the exposure device comprises: a holding portion for holding a substrate; a plurality of first sensors for detecting a position of the substrate relative to the holding portion; a stage portion for configuring the substrate; and a plurality of second sensors for detecting the position of the substrate relative to the stage portion, the number of the plurality of second sensors being less than the number of the plurality of first sensors.

[0009] In addition, the structure of the embodiment described later may be appropriately improved, and at least a part of it may be replaced by other structures. Furthermore, the structural elements whose configuration is not particularly limited are not limited to the configuration disclosed in the embodiment, and may be configured at a position where their functions can be realized. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] [ Figure 1 ] Figure 1 (A) is a schematic diagram of the exposure apparatus according to the first embodiment as viewed from above, Figure 1 (B) is a schematic diagram of the exposure device viewed from the side.

[0011] [ Figure 2 ] Figure 2 (A)~ Figure 2 (C) is a diagram showing the arrangement of the substrate on the holding portion in the first embodiment.

[0012] [ Figure 3 ] Figure 3 It is a diagram showing the arrangement of line sensors in the first embodiment.

[0013] [ Figure 4 ] Figure 4 (A) is Figure 2 (A) is a diagram for explaining a line sensor for detecting the position of a substrate when the substrate is arranged on a holding portion, Figure 4 (B) is Figure 2 (B) is a diagram for explaining a line sensor for detecting the position of a substrate when the substrate is arranged on a holding portion as shown in FIG. Figure 4 (C) is Figure 2 (C) is a diagram for explaining a line sensor that detects the positions of the substrates when two substrates are arranged on a holding portion as shown.

[0014] [ Figure 5 ] Figure 5 (A) and Figure 5 (B) is a diagram for explaining a problem caused by detecting the position of an end face of a substrate on a holding portion that corresponds to a side other than a reference side.

[0015] [ Figure 6 ] Figure 6 (A)~ Figure 6 (D) is a diagram showing a combination of two substrates placed on a holding portion.

[0016] [ Figure 7 ] Figure 7 It is a diagram showing the arrangement of potentiometers in the first embodiment.

[0017] [ Figure 8 ] Figure 8 (A) is Figure 2 (A) is a diagram for explaining a potentiometer for detecting the position of a substrate when the substrate is arranged on a substrate holder, Figure 8 (B) is Figure 2 (B) is a diagram for explaining a potentiometer for detecting the position of a substrate when the substrate is arranged as shown in FIG. Figure 8 (C) is Figure 2 (C) is a diagram for explaining a potentiometer for detecting the position of each substrate when two substrates are arranged on a substrate holder as shown.

[0018] [ Fig. 9 ] Fig. 9 (A) and Fig. 9(B) is a diagram for explaining the method of detecting the rotation amount of the substrate in the θz direction in the first embodiment.

[0019] [ Fig.10 ] Fig.10 (A) is a diagram showing the arrangement of line sensors in the second embodiment. Fig.10 (B) is a diagram for explaining a line sensor that detects the position of each substrate when two substrates are placed on the holding portion.

[0020] [ Fig.11 ] Fig.11 (A) is a diagram showing the arrangement of a potentiometer in the second embodiment. Fig.11 (B) is a diagram for explaining a potentiometer for detecting the position of each substrate when two substrates are placed on a substrate holder.

[0021] [ Fig.12 ] Fig.12 (A) and Fig.12 (B) is a diagram for explaining a method for detecting the amount of rotation of the substrate in the θz direction in the second embodiment.

[0022] [ Fig.13 ] Fig.13 (A) and Fig.13 (B) is a diagram showing the arrangement of the line sensor and the potentiometer according to the first modification.

[0023] [ Fig.14 ] Fig.14 (A)~ Fig.14 (F) is a diagram showing the arrangement of the line sensor and the potentiometer according to the second modification.

[0024] [ Fig.15 ] Fig.15 (A)~ Fig.15 (F) is a diagram showing another example of the arrangement of the line sensor and the potentiometer in the second modification.

[0025] [ Fig.16 ] Fig.16 (A)~ Fig.16 (F) is a diagram showing the arrangement of the line sensor and the potentiometer according to the third modification.

[0026] [ Fig.17 ] Fig.17 (A)~ Fig.17 (F) is a diagram showing the arrangement of the line sensor and the potentiometer according to the fourth modification.

[0027] [ Fig.18 ] Fig.18 (A)~ Fig.18 (F) is a diagram showing another example of the arrangement of the line sensor and the potentiometer in the fourth modification.

[0028] [ Fig.19 ] Fig.19 (A)~ Fig.19 (F) is a diagram showing the arrangement of the line sensor and the potentiometer according to the fifth modification.

[0029] [ Fig. 20 ] Fig. 20 (A)~ Fig. 20 (F) is a diagram showing the arrangement of the line sensor and the potentiometer according to the sixth modification.

[0030] [ Fig.21 ] Fig.21 (A)~ Fig.21 (F) is a diagram showing the arrangement of the line sensor and the potentiometer according to the seventh modification.

[0031] [ Fig. 22 ] Fig. 22 (A)~ Fig. 22 (F) is a diagram showing the arrangement of the line sensor and the potentiometer according to Modification 8.

[0032] [ Fig.23 ] Fig.23 (A)~ Fig.23 (F) is a diagram showing the arrangement of the line sensor and the potentiometer in the third embodiment.

[0033] [ Fig.24 ] Fig.24 (A) and Fig.24 (B) is a diagram showing the arrangement of the line sensor and the potentiometer according to the ninth modification. DETAILED DESCRIPTION

[0034] 《First Implementation Mode》

[0035] Figure 1 (A) is a schematic diagram of the exposure apparatus EX according to the first embodiment as viewed from above, Figure 1 (B) is a schematic diagram of the exposure apparatus EX viewed from the side.

[0036] The exposure device EX is used, for example, when manufacturing an organic electroluminescence (EL) display, or when forming a touch panel (TP) circuit or a color filter (CF) circuit on the upper surface of the substrate P. The substrate P is, for example, a substrate on which a thin film transistor (TFT) is formed by vapor deposition or the like on a glass plate and sealed, but is not limited thereto.

[0037] like Figure 1 (A) and Figure 1As shown in (B), the exposure apparatus EX includes a main body 100 , a transport device 200 , a first control device 300 , and a second control device 400 .

[0038] In the following, the scanning directions of the photomask M and the substrate P described later relative to the projection optical system 116 during exposure are set as the X-axis direction, the direction orthogonal to the X-axis in the horizontal plane is set as the Y-axis direction, the direction orthogonal to the X-axis and the Y-axis is set as the Z-axis direction, and the rotation (tilt) directions around the X-axis, Y-axis and Z-axis are set as θx, θy and θz directions, respectively.

[0039] <Conveying device 200>

[0040] The conveying device 200 delivers the substrate P between the external device 1000 such as a coater / developer and the main body 100 . The external device 1000 has, for example, a fork-shaped robot RH, and can convey the substrate P placed on the robot RH from the external device 1000 to the conveying device 200 .

[0041] The conveying device 200 includes a holding unit 201, a conveying mechanism 202, an alignment mechanism 203, a base unit 204, and a first sensor 210. Figure 1 (A) shows a part of the first sensor 210 provided in the conveying device 200. Figure 1 In (B), the first sensor 210 is omitted from illustration.

[0042] The holding unit 201 is placed on the base unit 204 . The substrate P placed on the robot RH is conveyed from the external device 1000 into the transfer device 200 , and is placed on the holding unit 201 placed on the base unit 204 .

[0043] The holding part 201 is a conveying tool used when conveying and placing the substrate P inside the main body part 100, and the substrate P is placed on the upper surface thereof. The holding part 201 is, for example, a grid-shaped member.

[0044] The holding portion 201 has, for example, a size that allows a substrate P of a G6 (1850×1500 mm) size to be placed without protruding from the holding portion 201. That is, the holding portion 201 has a size that allows two substrates P of a half-G6 size to be placed, which are substrates P of a G6 (1850×1500 mm) size divided in half. In addition, the size of the substrate P placed on the holding portion 201 is not limited to the G6 size, and may be a size larger than the G6 size, or may be a size smaller than the G6 size. In addition, in the case where the size of the substrate P placed on the holding portion 201 is larger than the G6 size, the size of the holding portion 201 is designed so that the substrate P can be placed without protruding from the holding portion 201. Furthermore, the number of substrates P placed on the holding portion 201 is not limited to one or two, and may be three or more.

[0045] The first sensor 210 detects the position of the substrate P relative to the holding portion 201. Specifically, the first sensor 210 detects the position of the end surface of the substrate P placed on the holding portion 201, thereby detecting the position of the substrate P relative to the holding portion 201. In addition, the position of the substrate P includes the position of the substrate P in the X-axis direction (the offset amount of the substrate P in the X-axis direction), the position of the substrate P in the Y-axis direction (the offset amount of the substrate P in the Y-axis direction), and the rotation amount of the substrate P in the θz direction.

[0046] The first sensor 210 is, for example, provided on the holding portion 201. The first sensor 210 may also be provided on the base portion 204 on which the holding portion 201 is placed. In the present embodiment, the first sensor 210 is a non-contact sensor, for example, a line sensor. Hereinafter, the first sensor 210 is assumed to be a line sensor, and the first sensor 210 is described as a line sensor LS for explanation. By using the non-contact line sensor LS, the position of the substrate P on the holding portion 201 can be detected without contacting the substrate P, thereby preventing the position of the substrate P from deviating on the holding portion 201 when the position of the substrate P is detected.

[0047] When the line sensor LS is provided on the holding portion 201, the substrate P is directly aligned with the holding portion 201. In this case, the line sensor LS is transported to the inside of the main body 100 by the transport mechanism 202 together with the holding portion 201. Therefore, for the line sensor LS, for example, a wireless line sensor is preferably used.

[0048] When the line sensor LS is provided on the base 204, the substrate P is positioned relative to the base 204. Here, the holding portion 201 is held at a predetermined position of the base 204. Therefore, when the line sensor LS is provided on the base 204, the substrate P is also indirectly positioned relative to the holding portion 201.

[0049] Next, the arrangement of the line sensor LS in the first embodiment will be described. Figure 2 (A)~ Figure 2 (C) The configuration of the substrate on the holding part 201 in this embodiment is described. In addition, as described above, the holding part 201 is transported into the main body 100, and the substrate transported by the holding part 201 is placed on the substrate holder 121 of the main body 100 described later, so Figure 2 (A)~ Figure 2 (C) is also a configuration form of the substrate on the substrate holder 121 .

[0050] In this embodiment, as Figure 2 (A) shows a case where a substrate P is placed on the holding portion 201, Figure 2(B) Figure 2 (A) is a state where the substrate P is rotated 90 degrees clockwise and placed on the holding portion 201 , and further, a state where the substrate P1 and the substrate P2 divided into half the size are placed on the holding portion 201 .

[0051] In this embodiment, whether Figure 2 (A)~ Figure 2 In any of the arrangements shown in (C), the line sensor LS is arranged in the transport device 200 so as to be able to detect the position of each substrate relative to the holding unit 201 .

[0052] Figure 3 Schematic diagram showing the configuration of the line sensor LS in the first embodiment. Figure 3 As shown in the first embodiment, eleven line sensors LS-1 to LS-11 are provided. Here, how to use the eleven line sensors LS-1 to LS-11 to detect Figure 2 (A)~ Figure 2 (C) The position of the substrate arranged as shown.

[0053] Figure 4 (A) is Figure 2 (A) is a diagram for explaining a line sensor LS that detects the position of the substrate P when the substrate P is arranged on the holding portion 201. Figure 4 In (A), the line sensor LS for detecting the position of the substrate P is indicated by black. The same is true in the following figures. Figure 2 The position of a substrate P placed as shown in (A) can be detected by the line sensor LS-1 and the line sensor LS-2 provided with respect to the reference side S1 of the substrate P, and the line sensor LS-3 provided with respect to the reference side S4 of the substrate P. In addition to the line sensor LS-1, the line sensor LS-2, and the line sensor LS-3, the line sensor LS-9 provided with respect to the reference side S4 of the substrate P can also be used to detect the position of the substrate P.

[0054] The so-called reference side refers to a side among the sides S1 to S4 of the rectangular substrate P, whose true straightness is smaller (e.g., 20 μm to 40 μm) than the true straightness of the side that is not the reference side (e.g., 500 μm). That is, the flatness of the end face of the substrate P corresponding to the reference side is higher than the flatness of the end face corresponding to the side that is not the reference side. Figure 4 In (A), the reference side is indicated by a bold line, and the symbol indicating the reference side is underlined. The same applies to the subsequent figures.

[0055] The line sensor LS-1 and the line sensor LS-2 can detect the position of the end surface of the substrate P corresponding to the reference side S1 in the Y-axis direction, that is, the offset of the substrate P in the Y-axis direction. Here, when using two line sensors LS-1 and LS-2 to detect the position of the end surface of the substrate P corresponding to the reference side S1, it is sufficient to set the average value of the positions detected by the line sensor LS-1 and the line sensor LS-2 as the position of the end surface corresponding to the reference side S1. In addition, for example, the position detected by one of the line sensor LS-1 and the line sensor LS-2 can also be set as the position of the end surface corresponding to the reference side S1. The same applies to other situations.

[0056] Furthermore, the line sensor LS-3 can detect the position of the end face of the substrate P corresponding to the reference side S4 in the X-axis direction, that is, the offset of the substrate P in the X-axis direction. Furthermore, the line sensor LS-1 and the line sensor LS-2 can detect the rotation amount of the substrate P around the Z-axis (θz direction). In addition, for example, the line sensor LS-10 and the line sensor LS-11 provided relative to the reference side S1 can also be used to detect the rotation amount of the substrate P around the Z-axis (θz direction), but the longer the distance between the line sensors LS that detect the rotation amount, the more accurately the rotation amount can be detected, so it is preferred to use the line sensor LS-1 and the line sensor LS-2 to detect the rotation amount of the substrate P around the Z-axis (θz direction).

[0057] Figure 4 (B) is Figure 2 (B) As shown Figure 2 FIG. 1 is a diagram for explaining a line sensor LS for detecting the position of a substrate P when the substrate P in the state of (A) is rotated 90 degrees clockwise and arranged. Figure 2 The position of the substrate P configured as shown in (B) can be detected by the line sensor LS-4 and the line sensor LS-5 provided relative to the reference side S1 of the substrate P, and the line sensor LS-6 provided relative to the reference side S4 of the substrate P.

[0058] Specifically, the line sensor LS-4 and the line sensor LS-5 can detect the position of the end surface of the substrate P corresponding to the reference side S1 in the X-axis direction, that is, the offset amount of the substrate P in the X-axis direction. Furthermore, the line sensor LS-6 can detect the position of the end surface of the substrate P corresponding to the reference side S4 in the Y-axis direction, that is, the offset amount of the substrate P in the Y-axis direction. Furthermore, the line sensor LS-4 and the line sensor LS-5 can detect the rotation amount of the substrate P in the θz direction.

[0059] Figure 4 (C) is Figure 2(C) is a diagram for explaining the line sensor LS that detects the positions of the substrates P1 and P2 when the two substrates P1 and P2 are arranged on the holding unit 201.

[0060] The position of the substrate P1 can be detected by the line sensor LS-1 and the line sensor LS-10 provided with respect to the reference side S11 of the substrate P1, and the line sensor LS-7 and the line sensor LS-8 provided with respect to the side S12.

[0061] Specifically, the position of the end surface of the substrate P1 corresponding to the reference side S11 in the Y-axis direction, that is, the offset of the substrate P1 in the Y-axis direction, can be detected by the line sensor LS-1 and the line sensor LS-10. In addition, the position of the end surface of the substrate P1 corresponding to the side S12 that is not the reference side in the X-axis direction, that is, the offset of the substrate P1 in the X-axis direction, can be detected by the line sensor LS-7 and the line sensor LS-8.

[0062] Furthermore, the rotation amount in the θz direction of the substrate P1 can be detected by the line sensor LS-1 and the line sensor LS-10. Here, the reason why the rotation amount in the θz direction of the substrate P1 is detected by the line sensor LS-1 and the line sensor LS-10 provided relative to the reference side S11 instead of by the line sensor LS-7 and the line sensor LS-8 provided relative to the non-reference side S12 is described.

[0063] Figure 5 (A) and Figure 5 (B) is a diagram for explaining a problem caused by detecting the position of the end surface of the substrate P on the holding unit 201 corresponding to the side S12 which is not the reference side. Figure 5 (A) shows the line sensor LS- 7 and the line sensor LS- 8 provided with respect to the side S12 of the substrate P1 on the holding unit 201 which is not the reference side. Figure 5 (B) indicates that Figure 5 The substrate P1 shown in (A) is a substrate P1 when it is positioned by the alignment mechanism 203 based on the rotation amount in the θz direction detected by the line sensor LS-7 and the line sensor LS-8 and placed on the substrate holder 121. Figure 5 (A) and Figure 5 In (B), the pattern PTN formed in advance on the substrate P1 is shown by hatching.

[0064] The true straightness of the side S12 which is not the reference side is greater than the true straightness of the reference side S11. That is, the flatness of the end face corresponding to the side S12 is lower than the flatness of the end face corresponding to the reference side S11. Therefore, if the rotation amount of the substrate P1 in the θz direction is calculated based on the position detection results of the end face corresponding to the side S12 by the line sensor LS-7 and the line sensor LS-8, and the substrate P1 is positioned based on the rotation amount, then even if Figure 5 As shown in (A), the actual rotation amount of the substrate P1 in the θz direction is almost 0, but it is possible that Figure 5 As shown in (B), the substrate P1 is arranged on the substrate holder 121 described later in a state of being rotated in the θz direction. Figure 5 As shown in (B), by detecting the position of the end face corresponding to the side S12 by the potentiometer PM-7 and the potentiometer PM-8 described later, the rotation amount of the substrate P1 in the θz direction is detected as 0, so the substrate P1 is positioned while being rotated in the θz direction. In this way, if the substrate P1 is positioned based on the position detection result of the end face corresponding to the side S12 which is not the reference side, the positioning accuracy of the substrate P1 will deteriorate.

[0065] Therefore, the rotation amount of the substrate P1 in the θz direction is calculated based on the detection results of the line sensor LS- 1 and the line sensor LS- 10 provided with respect to the reference side S11 .

[0066] The position of the substrate P2 can be detected by the line sensor LS-2 and the line sensor LS-11 provided with respect to the reference side S21, and the line sensor LS-3 and the line sensor LS-9 provided with respect to the side S24.

[0067] Specifically, the position of the end surface of the substrate P2 corresponding to the reference side S21 in the Y-axis direction, that is, the offset amount of the substrate P2 in the Y-axis direction, can be detected by the line sensor LS-2 and the line sensor LS-11, and the position of the end surface of the substrate P2 corresponding to the reference side S24 in the X-axis direction, that is, the offset amount of the substrate P2 in the X-axis direction, can be detected by the line sensor LS-3 and the line sensor LS-9. In addition, the rotation amount of the substrate P2 in the θz direction can be detected by the line sensor LS-2 and the line sensor LS-11.

[0068] also, Figure 4 The side S24 of the substrate P2 shown in (C) is the reference side, so the rotation amount of the substrate P2 in the θz direction is considered to be detected by the line sensor LS-3 and the line sensor LS-9, but the side detected by the line sensor LS-3 and the line sensor LS-9 is not necessarily always the reference side. That is, as a combination of two substrates placed on the holding part 201, as Figure 6 (A)~ Figure 6Consider four combinations as shown in (D), but Figure 6 (B) and Figure 6 As shown in (D), there is a case where the edge detected by the line sensor LS-3 and the line sensor LS-9 is not the reference edge. Therefore, for the substrate P2, the rotation amount of the substrate P2 in the θz direction is also detected by the line sensors LS-2 and LS-11 set relative to the reference edge S21. In addition, Figure 6 (A)~ Figure 6 In (D), illustration of the line sensor LS-4, the line sensor LS-5, and the line sensor LS-6 is omitted.

[0069] return Figure 1 (B) The alignment mechanism 203 positions the substrate P or the substrate P1 and the substrate P2 relative to the holding portion 201 based on the position of the substrate P or the substrate P1 and the substrate P2 detected by the line sensor LS. The substrate P or the substrate P1 and the substrate P2 are transported to the inside of the main body 100 while being arranged on the holding portion 201. At this time, if the position of the substrate P or the substrate P1 and the substrate P2 deviates from the holding portion 201, the alignment process of the substrate P or the substrate P1 and the substrate P2 in the main body 100 cannot be performed normally, resulting in the stoppage of the exposure process or the reduction of productivity due to the re-entry process of the substrate P or the substrate P1 and the substrate P2. In order to prevent this situation, the alignment mechanism 203 has the function of aligning the substrate P or the substrate P1 and the substrate P2 relative to the holding portion 201.

[0070] As described above, a plurality of substrates may be arranged in the holding portion 201, so the alignment mechanism 203 has at least a function of individually adjusting the positions of the plurality of substrates arranged on the holding portion 201. As the alignment mechanism 203, for example, the structure described in Japanese Patent Application No. 2022-058723 may be adopted, but other structures may also be adopted.

[0071] The conveying mechanism 202 conveys the holding part 201 holding the positioned substrate P or the substrate P1 and the substrate P2 to the main body 100. Alternatively, the holding part 201 disposed inside the main body 100 is taken out from the main body 100. The conveying mechanism 202 grasps the holding part 201 from both sides of the Y-axis direction, for example. In this state, the conveying mechanism 202 moves along the X-axis direction by a moving mechanism not shown. Thus, the holding part 201 is conveyed by the conveying mechanism 202.

[0072] The position detection of the substrate P or the substrate P1 and the substrate P2 by the line sensor LS, the positioning by the alignment mechanism 203 , and the conveyance of the holding portion 201 by the conveyance mechanism 202 are controlled by the second control device 400 .

[0073] <Main part 100>

[0074] Next, the structure of the main body 100 will be described. Figure 1 As shown in (B), the main body 100 includes an illumination system 112, a photomask stage 114 for holding a photomask M having a circuit pattern formed thereon, a projection optical system 116, an optical platen 118, and a substrate stage device 120 for holding a substrate P or substrates P1 and P2.

[0075] The illumination system 112 is configured similarly to the illumination system disclosed in the specification of U.S. Patent No. 5,729,331, etc. The illumination system 112 irradiates the photomask M with light emitted from a light source (e.g., a mercury lamp) not shown in the figure as exposure illumination light (illumination light) IL via respective reflectors, beam splitters, shutters, wavelength selection filters, various lenses, etc. not shown in the figure.

[0076] The photomask stage 114 holds a light-transmitting photomask M. The photomask stage 114 drives the photomask M by a predetermined stroke in the X-axis direction (scanning direction) relative to the illumination system 112 (illumination light IL) via a drive system (not shown) including a linear motor, and slightly drives the photomask M in the Y-axis direction and the θz direction. The position information of the photomask M in the horizontal plane is obtained, for example, by a photomask stage position measurement system (not shown) including a laser interferometer or an encoder.

[0077] The projection optical system 116 is disposed below the photomask stage 114. The projection optical system 116 is a so-called multi-lens projection optical system having the same structure as the projection optical system disclosed in the specification of U.S. Patent No. 6,552,775, etc., and includes, for example, a plurality of optical systems that form an erect erect image with equal-magnification systems with telecentricity on both sides.

[0078] In the main body 100, when the illumination area on the photomask M is illuminated by the illumination light IL from the illumination system 112, a projection image (partial erect image) of the circuit pattern of the photomask M in the illumination area is formed on the illumination area (exposure area) of the illumination light conjugate with the illumination area on the substrate P or the substrates P1 and P2 via the projection optical system 116 using the illumination light that has passed through the photomask M. In addition, the photomask M moves relative to the illumination area (illumination light IL) along the scanning direction, and the substrate P or the substrates P1 and P2 move relative to the exposure area (illumination light IL) along the scanning direction, thereby performing scanning exposure of an illumination area on the substrate P or the substrates P1 and P2, and the pattern formed on the photomask M is transferred to the illumination area.

[0079] The optical platen 118 supports the photomask stage 114 and the projection optical system 116 .

[0080] The substrate stage device 120 is a device for positioning the substrate P or the substrate P1 and the substrate P2 with high precision relative to the projection optical system 116 (illumination light IL), driving the substrate P or the substrate P1 and the substrate P2 along the horizontal plane (X-axis direction and Y-axis direction) by a predetermined stroke, and slightly driving the substrate P or the substrate P1 and the substrate P2 in the six degrees of freedom directions. The structure of the substrate stage device 120 is not particularly limited, and for example, it is preferred to use a stage device of a so-called coarse and fine motion structure including a gantry-type two-dimensional coarse motion stage and a fine motion stage slightly driven relative to the two-dimensional coarse motion stage, as disclosed in Japanese Patent Laid-Open No. 2004-14915 or U.S. Patent Application Publication No. 2012 / 0057140.

[0081] The substrate stage device 120 includes a substrate holder 121 for holding the substrate P or the substrate P1 and the substrate P2. An X movable mirror (columnar mirror) 124X having a reflection surface orthogonal to the X axis is fixed to the side surface on the -X side of the substrate holder 121, and a Y movable mirror 124Y having a reflection surface orthogonal to the Y axis is fixed to the side surface on the +Y side.

[0082] The optical platen 118 is provided with a first laser interferometer and a second laser interferometer (not shown) for respectively measuring the position in the X-axis direction and the Y-axis direction of the substrate holder 121 holding the substrate P or the substrates P1 and P2.

[0083] The first laser interferometer irradiates the X movable mirror 124X and an X fixed mirror (not shown) fixed near the projection optical system 116 with a measurement beam. The first laser interferometer measures the position information of the substrate holder 121 in the X-axis direction with reference to the position of the X fixed mirror.

[0084] The second laser interferometer irradiates the measurement beam to the Y movable mirror 124Y and a Y fixed mirror (not shown) fixed near the projection optical system 116. The second laser interferometer measures the position information of the substrate holder 121 in the Y-axis direction based on the position of the Y fixed mirror.

[0085] The substrate holder 121 has a receiving portion 121a. The receiving portion 121a is a groove provided in the substrate holder 121, which receives the holding portion 201. Thus, by receiving the holding portion 201 holding the substrate P or the substrate P1 and the substrate P2 in the receiving portion 121a, the substrate P or the substrate P1 and the substrate P2 are arranged on the upper surface of the substrate holder 121. The upper surface of the substrate holder 121 is substantially parallel to the XY plane, and the direction orthogonal to the upper surface of the substrate holder 121 is substantially parallel to the Z-axis direction. In addition, the so-called direction orthogonal to the upper surface of the substrate holder 121 is substantially parallel to the Z-axis direction, which means that when the substrate holder 121 is slightly driven in the θx direction and the θy direction, the upper surface of the substrate holder 121 is allowed to tilt relative to the XY plane.

[0086] like Figure 2 (A)~ Figure 2 As described in (C), in this embodiment, there are cases where one substrate P is placed on the substrate holder 121, Figure 2 (A) shows a case where the substrate P is rotated 90 degrees and mounted on the substrate holder 121 , and a case where the substrate P1 and the substrate P2 which are divided into half the size of the substrate P are mounted on the substrate holder 121 .

[0087] In this embodiment, whether Figure 2 (A)~ Figure 2 In any of the configurations shown in (C), the second sensor 150 is arranged on the substrate holder 121 so as to be able to detect the position of each substrate relative to the substrate holder 121. Figure 1 In (A), a portion of the second sensor 150 is shown. Figure 1 In (B), the second sensor 150 is omitted from illustration.

[0088] In this embodiment, the second sensor 150 is a contact type sensor, such as a potentiometer. In the following description, the second sensor 150 is assumed to be a potentiometer, and the second sensor 150 is described as a potentiometer PM.

[0089] Figure 7 1 shows the configuration of the potentiometer PM in the first embodiment. Figure 7 In FIG. 1 , the housing portion 121a is omitted from the illustration. The same applies to the subsequent figures.

[0090] like Figure 7As shown, in the present embodiment, nine potentiometers PM-1 to PM-9 are provided for the substrate holder 121. Thus, the number of potentiometers PM provided for the substrate holder 121 is less than the number of line sensors LS provided for the holding portion 201. Furthermore, the potentiometers PM-1 to PM-9 are configured so that the positions of the potentiometers PM-1 to PM-9 correspond to the positions of the line sensors LS-1 to LS-9, respectively. More specifically, the configuration is such that when the potentiometers PM-1 to PM-9 and the line sensors LS-1 to LS-9 are virtually configured on a predetermined coordinate system, the positions of the potentiometers PM-1 to PM-9 correspond to the positions of the line sensors LS-1 to LS-9, respectively.

[0091] Here we explain how to use nine potentiometers PM to detect Figure 2 (A)~ Figure 2 (C) The position of the substrate arranged as shown.

[0092] Figure 8 (A) is Figure 2 (A) is a diagram for explaining a potentiometer PM for detecting the position of the substrate P when the substrate P is arranged on the substrate holder 121. Figure 8 In (A), the potentiometer PM for detecting the position of the substrate P is represented by a black circle. The same is true in the following figures. Figure 2 The position of a substrate P arranged as shown in (A) can be detected by the potentiometer PM-1 and the potentiometer PM-2 provided with respect to the reference side S1 of the substrate P, and the potentiometer PM-3 provided with respect to the reference side S4.

[0093] Specifically, the position of the end surface of the substrate P corresponding to the reference side S1 in the Y-axis direction (the offset of the substrate P in the Y-axis direction) can be detected by the potentiometer PM-1 and the potentiometer PM-2. In addition, the position of the end surface of the substrate P corresponding to the reference side S4 in the X-axis direction (the offset of the substrate P in the X-axis direction) can be detected by the potentiometer PM-3. Furthermore, the rotation amount of the substrate P in the θz direction can be detected by the potentiometer PM-1 and the potentiometer PM-2.

[0094] Figure 8 (B) Figure 8 (A) is a diagram for explaining a potentiometer PM for detecting the position of a substrate P when a substrate P is rotated 90 degrees clockwise. Figure 8 The position of the substrate P arranged as shown in (B) can be detected by the potentiometer PM-4 and the potentiometer PM-5 provided with respect to the reference side S1, and the potentiometer PM-6 provided with respect to the reference side S4.

[0095] Specifically, the position of the end surface of the substrate P corresponding to the reference side S1 in the X-axis direction (the offset of the substrate P in the X-axis direction) can be detected by the potentiometer PM-4 and the potentiometer PM-5. Furthermore, the position of the end surface of the substrate P corresponding to the reference side S4 in the Y-axis direction (the offset of the substrate P in the Y-axis direction) can be detected by the potentiometer PM-6. Furthermore, the rotation amount of the substrate P in the θz direction can be detected by the potentiometer PM-4 and the potentiometer PM-5.

[0096] Figure 8 (C) is Figure 2 (C) is a diagram illustrating a potentiometer PM for detecting the positions of the substrates P1 and P2 when the two substrates P1 and P2 are arranged on the substrate holder 121. The positions of the substrates P1 and P2 on the substrate holder 121 are detected by the potentiometer PM-1, the potentiometer PM-7, the potentiometer PM-8, the potentiometer PM-2, the potentiometer PM-3, and the potentiometer PM-9. Here, the positions of the substrates P1 and P2 on the holding portion 201 are detected by the line sensor LS-1, the line sensor LS-10, the line sensor LS-7, the line sensor LS-8, the line sensor LS-2, the line sensor LS-11, the line sensor LS-3, and the line sensor LS-9. In this way, the number of potentiometers PM for detecting the positions of the substrates P1 and P2 on the substrate holder 121 is less than the number of line sensors LS for detecting the positions of the substrates P1 and P2 on the holding portion 201.

[0097] The position of the substrate P1 in the X-axis direction and the Y-axis direction can be detected by the potentiometer PM- 1 provided with respect to the reference side S11 and the potentiometers PM- 7 and PM- 8 provided with respect to the side S12 .

[0098] Specifically, the potentiometer PM-1 can detect the position of the end surface of the substrate P1 corresponding to the reference side S11 in the Y-axis direction (the offset of the substrate P1 in the Y-axis direction). The potentiometers PM-7 and PM-8 can detect the position of the end surface of the substrate P1 corresponding to the side S12 that is not the reference side in the X-axis direction (the offset of the substrate P1 in the X-axis direction).

[0099] In this embodiment, the rotation amount of the substrate P1 in the θz direction is calculated as follows. Figure 5 (A) and Figure 5 As described in (B), if the sensor provided for the side that is not the reference side is used to detect the rotation amount of the substrate P1 in the θz direction, the accurate rotation amount of the substrate P1 in the θz direction cannot be detected. That is, when the potentiometer PM-7 and the potentiometer PM-8 provided for the side S12 that is not the reference side are used, the rotation amount of the substrate P1 in the θz direction cannot be accurately detected.

[0100] Therefore, it is considered that two potentiometers PM are provided relative to the reference side S11 to detect the rotation amount of the substrate P1 in the θz direction. Figure 8 In (C), the potentiometer PM-21 is arranged at the position indicated by the dotted line. In this way, the rotation amount of the substrate P1 in the θz direction can be detected using the potentiometer PM-1 and the potentiometer PM-21 provided with respect to the reference side S11.

[0101] However, the substrate holder 121 may be rotated 90 degrees ( Figure 8 (B) state) substrate P is placed, so the potentiometer PM-21 cannot be set. The reason is that Figure 8 The substrate P arranged as shown in (B) will interfere with the potentiometer PM-21.

[0102] Therefore, in the present embodiment, the rotation amount of the substrate P1 on the substrate holder 121 in the θz direction is detected using the position of the substrate P1 detected by the line sensor LS in the conveying device 200 .

[0103] Fig. 9 (A) and Fig. 9 (B) is a diagram for explaining a method of detecting the amount of rotation of the substrate P1 in the θz direction on the substrate holder 121 in the first embodiment.

[0104] Fig. 9 In (A), the amount of rotation of the substrate P1 in the θz direction detected by the line sensor LS-7 and the line sensor LS-8 provided relative to the side S12, that is, the amount of rotation of the substrate P1 in the θz direction based on the detection position DP7 and the detection position DP8 of the end face corresponding to the side S12 is set as θcut. Furthermore, the amount of rotation of the substrate P in the θz direction detected by the line sensor LS-1 and the line sensor LS-10 provided relative to the reference side S11, that is, the amount of rotation of the substrate P1 in the θz direction based on the detection position DP1 and the detection position DP10 of the end face corresponding to the reference side S11 is set as θbase. Furthermore, Fig. 9 In (B), the rotation amount of the substrate P1 in the θz direction detected by the potentiometers PM-7 and PM-8 provided relative to the side S12, that is, the rotation amount of the substrate P1 in the θz direction based on the detection position DP17 and the detection position DP18 of the end surface corresponding to the side S12 is set as φcut. Here, in the substrate holder 121, since only one potentiometer PM-1 is provided relative to the reference side S11, the rotation amount φbase of the substrate P1 cannot be detected based on the detection position of the end surface corresponding to the reference side S11. The reason is that in order to detect the rotation amount φbase, it is necessary to detect the positions of at least two locations in the end surface corresponding to the reference side S11.

[0105] Therefore, in the first embodiment, φbase is calculated as follows. When there is no measurement error in each of the line sensor LS and the potentiometer PM,

[0106] θcut-θbase=φcut-φbase···(1)

[0107] Established.

[0108] According to the formula (1),

[0109] φbase=φcut-(θcut-θbase)

[0110] =(φcut-θcut)+θbase.

[0111] Here, since line sensor LS-7, line sensor LS-8 and line sensor LS-1 and potentiometer PM-7, potentiometer PM-8 and potentiometer PM-1 are respectively arranged at corresponding positions (same positions), the influence of the straightness of edge S12 which is not the reference edge is eliminated by (φcut-θcut).

[0112] If you set

[0113] Δθ=φcut-θcut,

[0114] but

[0115] φbase=θbase+Δθ。

[0116] Δθ is the mounting error.

[0117] In this way, the rotation amount of the substrate P1 in the θz direction on the substrate holder 121 can be calculated based on the position detection results of the substrate P1 obtained by the four line sensors LS in the conveying device 200 and the position detection results of the substrate P1 obtained by the three potentiometers PM on the substrate holder 121. That is, even if there is only one potentiometer PM provided with respect to the reference side S11, the rotation amount of the substrate P1 in the θz direction can be calculated.

[0118] The same is true for substrate P2. Figure 8 As shown in (C), if the potentiometer PM-22 is arranged relative to the reference side S21 of the substrate P2, the rotation amount of the substrate P2 in the θz direction can be detected by the potentiometer PM-2 and the potentiometer PM-22. Figure 8(B) The substrate P configured as shown will interfere with the potentiometer PM-22, so the potentiometer PM-22 cannot be configured. Therefore, for the substrate P2, similarly to the substrate P1, the rotation amount of the substrate P2 in the θz direction on the substrate holder 121 is calculated based on the position detection results of the substrate P2 obtained by the four line sensors LS-3, LS-9, LS-2 and LS-11 in the conveying device 200 and the position detection results of the substrate P2 obtained by the three potentiometers PM-3, PM-9 and PM-2 on the substrate holder 121. In addition, in Figure 8 As shown in (C), when the side S24 of the substrate P2 detected by the potentiometer PM-3 and the potentiometer PM-9 is the reference side, it is considered to use the potentiometer PM-3 and the potentiometer PM-9 to detect the rotation amount of the substrate P2 on the substrate holder 121 in the θz direction. Figure 6 (B) and Figure 6 As shown in (D), the side detected by the potentiometer PM-3 and the potentiometer PM-9 is not necessarily the reference side. Therefore, the rotation amount of the substrate P2 on the substrate holder 121 in the θz direction is calculated by the same method as the substrate P1.

[0119] In addition, the calculation of the rotation amount of the substrate P1 and the substrate P2 in the θz direction based on the position detection result of the substrate P1 and the substrate P2 on the holding part 201 obtained by the line sensor LS and the position detection result of the substrate P1 and the substrate P2 on the substrate holder 121 obtained by the potentiometer PM is performed by the first control device 300. At this time, the first control device 300 only needs to obtain the detection result of the position of the substrate P1 and the substrate P2 by the line sensor LS from the second control device 400. In addition, the first control device 300 and the second control device 400 can also be one control device. The first control device 300 is an example of the first calculation unit, the second calculation unit, and the third calculation unit.

[0120] The substrate stage device 120 positions the substrate P or the substrate P1 and the substrate P2 with respect to the projection optical system 116 (illumination light IL) based on the position detection result of the substrate P or the substrate P1 and the substrate P2.

[0121] Subsequently, the optical device (e.g., microscope) provided in the main body 100 detects the position of the alignment mark formed on the substrate P or the substrates P1 and P2. The substrate stage device 120 drives the substrate holder 121 based on the detection result of the alignment mark to transfer the pattern formed on the photomask M to a predetermined area of ​​the substrate P or the substrates P1 and P2.

[0122] The first control device 300 performs drive control of the substrate holder 121 by the substrate stage device 120 , control of scanning exposure processing, and the like, in addition to detecting the position of the substrate P or the substrates P1 and P2 on the substrate holder 121 .

[0123] As described in detail above, according to the first embodiment, the exposure device EX includes: a holding portion 201 that holds a plurality of substrates P1 and P2; a plurality of line sensors LS that detect the positions of the plurality of substrates P1 and P2 relative to the holding portion 201; a substrate holder 121 that is provided with the plurality of substrates P1 and P2; and a plurality of potentiometers PM that detect the positions of the plurality of substrates P1 and P2 relative to the substrate holder 121, wherein the number of the plurality of potentiometers PM is less than the plurality of line sensors LS. Thus, the positions of the substrates P or the substrates P1 and P2 that are provided in various forms on the substrate holder 121 can be detected.

[0124] Furthermore, according to the first embodiment, the positions of the plurality of potentiometers PM correspond to the positions of any of the plurality of line sensors LS. Thus, when calculating the rotation amounts of the two substrates P1 and P2 disposed on the substrate holder 121 in the θz direction, the influence of the straightness of the sides S12 and S24 that are not the reference sides can be eliminated.

[0125] Furthermore, according to the first embodiment, the exposure apparatus EX includes a first control device 300, and the first control device 300 calculates the rotation amount φbase of each of the plurality of substrates P1 and P2 on the substrate holder 121 around the direction (Z-axis direction) orthogonal to the upper surface of the substrate holder 121, based on the detection results of the positions of each of the plurality of substrates P1 and P2 on the holding portion 201 relative to the holding portion 201 obtained by the plurality of line sensors LS and the detection results of the positions of the plurality of substrates P1 and P2 on the substrate holder 121 relative to the substrate holder 121 obtained by the plurality of potentiometers PM. Thus, even when the number of potentiometers PM provided for the substrate holder 121 is less than the number of line sensors LS provided for the holding portion 201, the rotation amount φbase of each of the substrates P1 and P2 arranged on the substrate holder 121 can be calculated.

[0126] Furthermore, according to the first embodiment, the exposure apparatus EX includes: an alignment mechanism 203 for positioning each of the plurality of substrates P1 and P2 relative to the holding portion 201 based on the detection results of the positions of each of the plurality of substrates P1 and P2 on the holding portion 201 relative to the holding portion 201 obtained by the plurality of line sensors LS; a projection optical system 116 for projecting a pattern onto each of the plurality of substrates P1 and P2; and a substrate stage device 120 for positioning each of the plurality of substrates P1 and P2 relative to the projection optical system 116 based on the detection results of the positions of each of the plurality of substrates P1 and P2 on the substrate holder 121 relative to the substrate holder 121 obtained by the plurality of potentiometers PM and the calculated rotation amounts of each of the plurality of substrates P1 and P2. Thus, the substrates P1 and P2 arranged on the substrate holder 121 can be positioned relative to the projection optical system 116.

[0127] Furthermore, according to the first embodiment, the plurality of line sensors LS include: four line sensors LS-1, LS-10, LS-7, and LS-8 for detecting the position of the substrate P1 on the holding portion 201 relative to the holding portion 201; and four line sensors LS-2, LS-11, LS-3, and LS-9 for detecting the position of the substrate P2 relative to the holding portion 201. The two line sensors LS-1 and LS-10 are provided relative to the reference side S11 of the substrate P1, and the two line sensors LS-7 and LS-8 are provided relative to the side S12 of the substrate P1 intersecting the reference side S11. Furthermore, the two line sensors LS-2 and LS-11 are provided relative to the reference side S21 of the substrate P2, and the two line sensors LS-3 and LS-9 are provided relative to the side S24 of the substrate P2 intersecting the reference side S21. Furthermore, the plurality of potentiometers PM include: three potentiometers PM-1, PM-7, and PM-8 for detecting the position of the substrate P1 on the substrate holder 121 relative to the substrate holder 121; and three potentiometers PM-2, PM-3, and PM-9 for detecting the position of the substrate P2 relative to the substrate holder 121. One potentiometer PM-1 is provided relative to the reference side S11 of the substrate P1, and two potentiometers PM-7 and PM-8 are provided relative to the side S12 of the substrate P1 intersecting with the reference side S11. Furthermore, one potentiometer PM-2 is provided relative to the reference side S21 of the substrate P2, and two potentiometers PM-3 and PM-9 are provided relative to the side S24 of the substrate P2 intersecting with the reference side S21. By configuring the line sensor LS and the potentiometer PM in this way, the substrates can be configured in various forms on the substrate holder 121, and the position of each substrate can be detected regardless of the configuration form.

[0128] Furthermore, in the first embodiment, the first control device 300 calculates the rotation amount of the substrate P1 on the substrate holder 121 in the θz direction based on the detection results of the position of the substrate P1 on the holding portion 201 relative to the holding portion 201 obtained by the line sensor LS-1, the line sensor LS-10, the line sensor LS-7, and the line sensor LS-8 and the detection results of the position of the substrate P1 on the substrate holder 121 relative to the substrate holder 121 obtained by the potentiometer PM-1, the potentiometer PM-7, and the potentiometer PM-8. Furthermore, the first control device 300 calculates the rotation amount of the substrate P2 on the substrate holder 121 in the θz direction based on the detection results of the position of the substrate P1 on the holding portion 201 relative to the holding portion 201 obtained by the line sensor LS-2, the line sensor LS-11, the line sensor LS-3, and the line sensor LS-9 and the detection results of the position of the substrate P2 on the substrate holder 121 relative to the substrate holder 121 obtained by the potentiometer PM-2, the potentiometer PM-3, and the potentiometer PM-9. Thus, even when only one potentiometer PM is provided with respect to each of the reference side S11 of the substrate P1 and the reference side S21 of the substrate P2, the rotation amount of each of the substrates P1 and P2 in the θz direction can be calculated (detected).

[0129] Second Implementation Method

[0130] On the premise that the offset in the X-axis direction and the offset in the Y-axis direction can be ignored as errors, in the second embodiment, the number of line sensors LS in the conveying device 200 and the number of potentiometers PM in the main body 100 are reduced compared to the first embodiment.

[0131] Fig.10 (A) is a diagram showing the arrangement of the line sensor LS in the second embodiment. Fig.10 (A) In the second embodiment, the Figure 3 The line sensor LS-8 and the line sensor LS-9 are configured with a total of nine line sensors LS.

[0132] For Figure 2 (A) and Figure 2 Since the position detection of the substrates P arranged as shown in (B) is the same as that of the first embodiment, detailed description is omitted, and the position detection of the substrates P1 and P2 will be described.

[0133] Fig.10 (B) is a diagram for explaining position detection of the substrates P1 and P2 when two substrates P1 and P2 are arranged on the holding portion 201 .

[0134] The position of the substrate P1 can be detected by the line sensor LS-1 and the line sensor LS-10 provided with respect to the reference side S11, and the line sensor LS-7 provided with respect to the side S12. Specifically, the position of the end surface corresponding to the reference side S11 in the Y-axis direction can be detected by the line sensor LS-1 and the line sensor LS-10, and the position of the end surface corresponding to the side S12 in the X-axis direction can be detected by the line sensor LS-7. Furthermore, the rotation amount of the substrate P1 in the θz direction can be detected by the line sensor LS-1 and the line sensor LS-10.

[0135] Furthermore, the position of the substrate P2 can be detected by the line sensor LS-2 and the line sensor LS-11 provided with respect to the reference side S21, and the line sensor LS-3 provided with respect to the side S24. Specifically, the position of the end surface corresponding to the reference side S21 in the Y-axis direction can be detected by the line sensor LS-2 and the line sensor LS-11, and the position of the end surface corresponding to the side S24 in the X-axis direction can be detected by the line sensor LS-3. Furthermore, the rotation amount of the substrate P2 in the θz direction can be detected by the line sensor LS-2 and the line sensor LS-11.

[0136] Fig.11 (A) is a diagram showing the arrangement of the potentiometers PM in the second embodiment. In the second embodiment, the potentiometers PM-8 and the potentiometers PM-9 are omitted, and a total of seven potentiometers PM are arranged.

[0137] For Figure 2 (A) and Figure 2 Since the position detection of the substrates P arranged as shown in (B) is the same as that of the first embodiment, detailed description is omitted, and the position detection of the substrates P1 and P2 will be described.

[0138] Fig.11 (B) is a diagram for explaining position detection of the substrates P1 and P2 when two substrates P1 and P2 are arranged on the substrate holder 121 .

[0139] The position of the substrate P1 in the X-axis direction and the Y-axis direction can be detected by the potentiometer PM-1 provided relative to the reference side S11 and the potentiometer PM-7 provided relative to the side S12. Specifically, the position of the end surface corresponding to the reference side S11 in the Y-axis direction can be detected by the potentiometer PM-1, and the position of the end surface corresponding to the side S12 in the X-axis direction can be detected by the potentiometer PM-7.

[0140] Next, the detection of the rotation amount of the substrate P1 in the θz direction is described. Fig.10As shown in (B), only one line sensor LS-7 is provided with respect to the side S12, so the rotation amount θcut of the substrate P1 on the holding portion 201 in the θz direction cannot be calculated based on the position detection result of the end surface corresponding to the side S12. Fig.11 As shown in (B), only one potentiometer PM-7 is provided relative to the side S12, so the rotation amount φcut of the substrate P1 in the θz direction on the substrate holder 121 cannot be calculated based on the position detection result of the end surface corresponding to the side S12. Therefore, the rotation amount φbase of the substrate P1 in the θz direction on the substrate holder 121 cannot be calculated based on the above formula (1).

[0141] Therefore, in the second embodiment, the rotation amount φbase of the substrate P1 in the θz direction on the substrate holder 121 is calculated by the method described below.

[0142] Fig.12 (A) and Fig.12 (B) is a diagram for explaining a method of detecting the amount of rotation of the substrate P1 in the θz direction on the substrate holder 121 in the second embodiment. Fig.12 (A) is a diagram for explaining the position detection of the substrate P1 on the holding portion 201. Fig.12 (B) is a diagram for explaining calculation of the rotation amount of the substrate P1 on the substrate holder 121 in the θz direction.

[0143] In the second embodiment, the potentiometer PM-7 and the potentiometer PM-1 are also provided at positions corresponding to the line sensor LS-7 and the line sensor LS-1, respectively. Therefore, the triangle TR1 formed by connecting the detection position DP7, the detection position DP1, and the detection position DP10 of the end surface of the substrate P1 obtained by the line sensor LS-7, the line sensor LS-1, and the line sensor LS-10, and the triangle TR2 formed by connecting the detection position DP17 and the detection position DP11 of the end surface of the substrate P1 obtained by the potentiometer PM-7 and the potentiometer PM-1 and the detection position VP1 of the end surface of the substrate P1 obtained when the potentiometer PM-10 is virtually provided at the position corresponding to the line sensor LS-10 should be the same (congruent).

[0144] Therefore, by calculating the position of the virtual detection position VP1 at which the triangle TR2 becomes the same as the triangle TR1 , the rotation amount φbase of the substrate P1 on the substrate holder 121 in the θz direction can be calculated.

[0145] Similarly, for substrate P2, the triangle formed by connecting the detection positions of the end surface of substrate P2 obtained by line sensor LS-3, line sensor LS-2, and line sensor LS-11 is the same as the triangle formed by connecting the detection position of the end surface of substrate P2 obtained when potentiometer PM-3, potentiometer PM-2, and a potentiometer is virtually provided at a position corresponding to line sensor LS-11. Therefore, the rotation amount φbase of substrate P2 in the θz direction on substrate holder 121 can be calculated based on the detection position of the end surface of substrate P2 obtained by line sensor LS-3, line sensor LS-2, and line sensor LS-11 and the detection position of the end surface of substrate P2 obtained by potentiometer PM-3 and potentiometer PM-2.

[0146] As described in detail above, according to the second embodiment, the plurality of line sensors LS include: three line sensors LS-1, LS-10, and LS-7 for detecting the position of the substrate P1 on the holding portion 201 relative to the holding portion 201; and three line sensors LS-2, LS-11, and LS-3 for detecting the position of the substrate P2 relative to the holding portion 201. The two line sensors LS-1 and LS-10 are provided relative to the reference side S11 of the substrate P1, and the one line sensor LS-7 is provided relative to the side S12 of the substrate P1 intersecting the reference side S11. Furthermore, the two line sensors LS-2 and LS-11 are provided relative to the reference side S21 of the substrate P2, and the one line sensor LS-3 is provided relative to the side S24 of the substrate P2 intersecting the reference side S21. Furthermore, the plurality of potentiometers PM include: two potentiometers PM-1 and PM-7 for detecting the position of the substrate P1 on the substrate holder 121 relative to the substrate holder 121; and two potentiometers PM-2 and PM-3 for detecting the position of the substrate P2 relative to the substrate holder 121. One potentiometer PM-1 is provided relative to the reference side S11 of the substrate P1, and one potentiometer PM-7 is provided relative to the side S12 of the substrate P1 intersecting with the reference side S11. Furthermore, one potentiometer PM-2 is provided relative to the reference side S21 of the substrate P2, and one potentiometer PM-3 is provided relative to the side S24 of the substrate P2 intersecting with the reference side S21. By configuring the line sensor LS and the potentiometer PM in this way, the substrate can be configured in various forms on the substrate holder 121, and the position of each substrate can be detected regardless of the configuration form. Furthermore, the number of the line sensors LS and the potentiometers PM can be reduced compared to the first embodiment, so the parts cost of the exposure device EX can be reduced.

[0147] In addition, in the second embodiment, the offset in the X-axis direction and the offset in the Y-axis direction are assumed to be negligible as errors, but the present invention is not limited thereto. The second embodiment may also be applied when the offset in the X-axis direction and the offset in the Y-axis direction of the substrate P or the substrate P1 and the substrate P2 are determined by a measurement system different from the measurement system including the potentiometer provided on the substrate holder 121, and the rotation amount in the θz direction is obtained by the potentiometer provided on the substrate holder 121.

[0148] (Variant 1)

[0149] In addition, in the second embodiment, when detecting Figure 2 Even in the case of determining the position (rotation amount in the θz direction) of the substrate P disposed on the substrate holder 121 as shown in (B), the detection method of the second embodiment can be used. Fig.13 (A) and Fig.13 (B) shows the arrangement of the line sensor LS and the potentiometer PM according to Modification 1. The arrangement of the line sensor LS is the same as that of the second embodiment, and thus the description thereof is omitted. Fig.13 (B) , the potentiometer PM-5 in the second embodiment is omitted. Even if the potentiometer PM-5 is omitted in this way, the rotation amount of the substrate P on the substrate holder 121 in the θz direction can be detected using the detection method of the second embodiment based on the detection position of the end surface of the substrate P on the holding portion 201 obtained by the line sensor LS-4, the line sensor LS-5, and the line sensor LS-6 and the detection position of the end surface of the substrate P on the substrate holder 121 obtained by the potentiometer PM-4 and the potentiometer PM-6. Since the potentiometer PM-5 is omitted, the parts cost of the exposure device EX can be reduced compared with the second embodiment.

[0150] In addition, in the first and second embodiments, the second sensor 150 provided in the main body 100 is described as a contact sensor, that is, a potentiometer PM, but the second sensor 150 may be a non-contact sensor. In the case of a non-contact sensor, the second sensor 150 may be provided at a position corresponding to the line sensor LS-10 and the line sensor LS-11, but by configuring the second sensor 150 as in the first and second embodiments, the number of the second sensors 150 can be reduced, and the parts cost of the exposure apparatus EX can be reduced.

[0151] The arrangement of the substrate to the holding portion 201 and the substrate holder 121 and the arrangement of the line sensor LS and the potentiometer PM are not limited to those in the first and second embodiments. In Modifications 2 to 8, other arrangement examples of the line sensor LS and the potentiometer PM are described below.

[0152] (Variant 2)

[0153] Fig.14 (A)~ Fig.14 (F) is a diagram showing the arrangement of the line sensor LS and the potentiometer PM of Modification 2. Fig.14 (E) and Fig.14 As shown in (F), the substrate P1 and the substrate P2 are arranged side by side along the Y-axis direction. Fig.14 (A)~ Fig.14 The method for detecting the position of the substrate P in (D) is the same as that in the first embodiment, and therefore detailed description thereof will be omitted.

[0154] In the second modification, the line sensor LS-4 and the line sensor LS-42 are provided with respect to the reference side S11 of the substrate P1 on the holding portion 201, and the line sensor LS-41 is provided with respect to the side S12. Furthermore, the line sensor LS-5 and the line sensor LS-43 are provided with respect to the reference side S21 of the substrate P2 on the holding portion 201, and the line sensor LS-6 is provided with respect to the side S24.

[0155] Furthermore, a potentiometer PM-4 is provided for the reference side S11 of the substrate P1 on the substrate holder 121, and a potentiometer PM-41 is provided for the side S12. Furthermore, a potentiometer PM-5 is provided for the reference side S21 of the substrate P2 on the substrate holder 121, and a potentiometer PM-6 is provided for the side S24.

[0156] In the second modification, the position of the substrate P1 on the substrate holder 121 in the Y-axis direction can be detected by the potentiometer PM-41 provided relative to the side S12 of the substrate P1, and the position of the substrate P1 on the substrate holder 121 in the X-axis direction can be detected by the potentiometer PM-4 provided relative to the reference side S11. In addition, based on the detected position of the end surface of the substrate P1 on the holding portion 201 obtained by the line sensor LS-41 provided relative to the side S12 of the substrate P1 and the line sensors LS-4 and LS-42 provided relative to the reference side S11, and the detected position of the end surface of the substrate P1 on the substrate holder 121 obtained by the potentiometer PM-41 and the potentiometer PM-4, the rotation amount of the substrate P1 on the substrate holder 121 in the θz direction can be detected by the detection method of the second embodiment.

[0157] Furthermore, the position of the substrate P2 on the substrate holder 121 in the Y-axis direction can be detected by the potentiometer PM-6 provided relative to the side S24 of the substrate P2, and the position of the substrate P2 on the substrate holder 121 in the X-axis direction can be detected by the potentiometer PM-5 provided relative to the reference side S21. Furthermore, based on the detected position of the end face of the substrate P2 on the holding portion 201 obtained by the line sensor LS-6 provided relative to the side S24 of the substrate P2 and the line sensor LS-43 and the line sensor LS-5 provided relative to the reference side S21, and the detected position of the end face of the substrate P2 on the substrate holder 121 obtained by the potentiometer PM-6 and the potentiometer PM-5, the rotation amount of the substrate P2 on the substrate holder 121 in the θz direction can be detected by the detection method of the second embodiment.

[0158] Fig.15 (A)~ Fig.15 (F) is a diagram showing another example of the arrangement of the line sensor LS and the potentiometer PM in the modification example 2. Fig.14 (A)~ Fig.14 In addition to the line sensor LS and potentiometer PM shown in (F), Fig.15 As shown in (E), line sensor LS-44 and line sensor LS-45 are respectively provided with respect to side S12 and side S24. Fig.15 (F) As shown, the potentiometer PM-44 and the potentiometer PM-45 are respectively provided with respect to the side S12 and the side S24. In this case, based on the detection position of the end surface of the substrate P1 obtained by the line sensor LS-41 and the line sensor LS-44 provided with respect to the side S12 and the line sensor LS-4 and the line sensor LS-42 provided with respect to the reference side S11, and the detection position of the end surface of the substrate P1 obtained by the potentiometer PM-41 and the potentiometer PM-44 provided with respect to the side S12 and the potentiometer PM-4 provided with respect to the reference side S11, the rotation amount of the substrate P1 in the θz direction on the substrate holder 121 can be detected by the detection method of the first embodiment. Furthermore, the rotation amount of the substrate P2 in the θz direction on the substrate holder 121 can be detected based on the detection position of the end surface of the substrate P2 obtained by the line sensor LS-43 and the line sensor LS-5 provided relative to the reference edge S21 and the line sensor LS-45 and the line sensor LS-6 provided relative to the edge S24, and the detection position of the end surface of the substrate P2 obtained by the potentiometer PM-5 provided relative to the reference edge S21 and the potentiometer PM-45 and the potentiometer PM-6 provided relative to the edge S24, and the detection method of the first embodiment.

[0159] (Variant 3)

[0160] Fig.16 (A)~ Fig.16(F) is a diagram showing the arrangement of the line sensor LS and the potentiometer PM of Modification 3. The arrangement of the substrate P, the substrate P1, and the substrate P2 is the same as that of Modification 2. In Modification 3, the potentiometer PM-2 in Modification 2 is omitted. Therefore, the detection method of the second embodiment is used to detect the Fig.16 (A) and Fig.16 (B) The rotation amount of the substrate P in the θz direction on the substrate holder 121 configured as shown. Specifically, based on the detection position of the end surface of the substrate P on the holding portion 201 obtained by the line sensor LS-1, the line sensor LS-2 and the line sensor LS-3 and the detection position of the end surface of the substrate P on the substrate holder 121 obtained by the potentiometer PM-1 and the potentiometer PM-3, the rotation amount of the substrate P in the θz direction on the substrate holder 121 is detected by the detection method of the second embodiment. Since the number of potentiometers PM can be reduced, the parts cost of the exposure device EX can be reduced compared with the modified example 2. The position detection of the substrate in other configuration forms is the same as that in the modified example 2, so the description is omitted.

[0161] (Variant 4)

[0162] Fig.17 (A)~ Fig.17 (F) is a diagram showing the arrangement of the line sensor LS and the potentiometer PM of Modification 4. Fig.17 (E) and Fig.17 As shown in (F), four substrates P1 to P4 are arranged. Fig.17 (A)~ Fig.17 The method for detecting the position of the substrate P in (D) is the same as that in the first embodiment, and therefore detailed description thereof will be omitted.

[0163] In modification example 4, line sensors LS-51 and LS-52 are provided with respect to side S13 of substrate P1 on the holding portion 201, and line sensor LS-53 is provided with respect to side S12. Furthermore, line sensor LS-59 is provided with respect to side S23 of substrate P2 on the holding portion 201, and line sensor LS-3 and line sensor LS-58 are provided with respect to reference side S24. Furthermore, line sensor LS-54 is provided with respect to side S32 of substrate P3 on the holding portion 201, and line sensor LS-1 and line sensor LS-55 are provided with respect to reference side S31. Furthermore, line sensors LS-2 and LS-56 are provided with respect to reference side S41 of substrate P4 on the holding portion 201, and line sensor LS-57 is provided with respect to reference side S44.

[0164] Furthermore, a potentiometer PM-52 is provided with respect to the side S13 of the substrate P1 on the substrate holder 121, and a potentiometer PM-53 is provided with respect to the side S12. Furthermore, a potentiometer PM-3 and a potentiometer PM-58 are provided with respect to the reference side S24 of the substrate P2 on the substrate holder 121. Furthermore, a potentiometer PM-54 is provided with respect to the side S32 of the substrate P3 on the substrate holder 121, and a potentiometer PM-1 is provided with respect to the reference side S31. Furthermore, a potentiometer PM-2 is provided with respect to the reference side S41 of the substrate P4 on the substrate holder 121, and a potentiometer PM-57 is provided with respect to the reference side S44.

[0165] In the modification example 4, the position of the substrate P1 on the substrate holder 121 in the X-axis direction can be detected by the potentiometer PM-53 provided relative to the side S12 of the substrate P1, and the position of the substrate P1 on the substrate holder 121 in the Y-axis direction can be detected by the potentiometer PM-52 provided relative to the side S13. In addition, based on the detected position of the end surface of the substrate P1 on the holding portion 201 obtained by the line sensor LS-51 and the line sensor LS-52 provided relative to the side S13 of the substrate P1 and the line sensor LS-53 provided relative to the side S12, and the detected position of the end surface of the substrate P1 on the substrate holder 121 obtained by the potentiometer PM-52 and the potentiometer PM-53, the rotation amount of the substrate P1 on the substrate holder 121 in the θz direction can be detected by the detection method of the second embodiment.

[0166] Furthermore, the position of the substrate P2 in the X-axis direction on the substrate holder 121 can be detected by the potentiometer PM-3 and the potentiometer PM-58 provided with respect to the side S24 of the substrate P2. Furthermore, based on the detected position of the end surface of the substrate P2 on the holding portion 201 obtained by the line sensor LS-3 and the line sensor LS-58 provided with respect to the side S24 of the substrate P2 and the line sensor LS-59 provided with respect to the side S23 and the detected position of the end surface of the substrate P2 on the substrate holder 121 obtained by the potentiometer PM-3 and the potentiometer PM-58, the position of the substrate P2 in the Y-axis direction and the rotation amount in the θz direction on the substrate holder 121 can be detected by the detection method of the second embodiment.

[0167] Furthermore, the position of the substrate P3 on the substrate holder 121 in the Y-axis direction can be detected by the potentiometer PM-1 provided relative to the side S31 of the substrate P3, and the position of the substrate P3 on the substrate holder 121 in the X-axis direction can be detected by the potentiometer PM-54 provided relative to the side S32. Furthermore, based on the detected position of the end face of the substrate P3 on the holding portion 201 obtained by the line sensor LS-1 and the line sensor LS-55 provided relative to the side S31 of the substrate P3 and the line sensor LS-54 provided relative to the side S32, and the detected position of the end face of the substrate P3 on the substrate holder 121 obtained by the potentiometer PM-1 and the potentiometer PM-54, the rotation amount of the substrate P3 on the substrate holder 121 in the θz direction can be detected by the detection method of the second embodiment.

[0168] Furthermore, the position of the substrate P4 on the substrate holder 121 in the Y-axis direction can be detected by the potentiometer PM-2 provided relative to the side S41 of the substrate P4, and the position of the substrate P4 on the substrate holder 121 in the X-axis direction can be detected by the potentiometer PM-57 provided relative to the side S44. Furthermore, based on the detected position of the end face of the substrate P4 on the holding portion 201 obtained by the line sensor LS-2 and the line sensor LS-56 provided relative to the side S41 of the substrate P4 and the line sensor LS-57 provided relative to the side S44, and the detected position of the end face of the substrate P4 on the substrate holder 121 obtained by the potentiometer PM-2 and the potentiometer PM-57, the rotation amount of the substrate P4 on the substrate holder 121 in the θz direction can be detected by the detection method of the second embodiment. In this way, the number of substrates arranged on the holding portion 201 and the substrate holder 121 is not limited to two, and may be three or more. Even in such a case, the position of each substrate can be detected by appropriately arranging the line sensor LS and the potentiometer PM.

[0169] Fig.18 (A)~ Fig.18 (F) is a diagram showing another example of the arrangement of the line sensor LS and the potentiometer PM in the modification example 4. Fig.17 (A)~ Fig.17 In addition to the line sensor LS and potentiometer PM shown in (F), Fig.18 As shown in (E), line sensors LS-71, LS-72, LS-73, and LS-74 are provided for the side S12, side S32, side S44, and side S23, respectively. Fig.18As shown in (F), the potentiometer PM-71, the potentiometer PM-72, the potentiometer PM-73 and the potentiometer PM-74 are respectively provided with respect to the side S12, the side S32, the side S44 and the side S23. At this time, based on the detection position of the end surface of the substrate P1 obtained by the line sensor LS-51 and the line sensor LS-52 provided with respect to the side S13 and the line sensor LS-71 and the line sensor LS-53 provided with respect to the side S12 and the detection position of the substrate P1 obtained by the potentiometer PM-52 provided with respect to the side S13 and the potentiometer PM-71 and the potentiometer PM-53 provided with respect to the side S12, the rotation amount of the substrate P1 in the θz direction on the substrate holder 121 can be detected by the detection method of the first embodiment. Furthermore, the rotation amount of the substrate P2 in the θz direction on the substrate holder 121 can be detected based on the detection position of the end surface of the substrate P2 obtained by the line sensor LS-59 and the line sensor LS-74 provided relative to the edge S23 and the line sensor LS-3 and the line sensor LS-58 provided relative to the edge S24, and the detection position of the end surface of the substrate P2 obtained by the potentiometer PM-74 provided relative to the edge S23 and the potentiometer PM-3 and the potentiometer PM-58 provided relative to the edge S24, and the detection method of the first embodiment. Furthermore, the rotation amount of the substrate P3 in the θz direction on the substrate holder 121 can be detected based on the detection position of the end surface of the substrate P3 obtained by the line sensor LS-54 and the line sensor LS-72 provided relative to the edge S32 and the line sensor LS-1 and the line sensor LS-55 provided relative to the edge S31, and the detection position of the end surface of the substrate P3 obtained by the potentiometer PM-54 and the potentiometer PM-72 provided relative to the edge S32 and the potentiometer PM-1 provided relative to the edge S31, and by the detection method of the first embodiment. Furthermore, the rotation amount of the substrate P4 in the θz direction on the substrate holder 121 can be detected based on the detection position of the end surface of the substrate P4 obtained by the line sensor LS-56 and the line sensor LS-2 relative to the edge S41 and the line sensor LS-57 and the line sensor LS-73 relative to the edge S44, and the detection position of the end surface of the substrate P4 obtained by the potentiometer PM-2 relative to the edge S41 and the potentiometer PM-57 and the potentiometer PM-73 relative to the edge S44, and the detection method of the first embodiment.

[0170] (Variant 5)

[0171] Fig.19 (A)~ Fig.19 (F) is a diagram showing the arrangement of the line sensor LS and the potentiometer PM of Modification 5. The arrangement of the substrate P and the substrates P1 to P4 is the same as that of Modification 4. In Modification 5, the potentiometer PM-5 in Modification 4 is omitted. Therefore, the detection method of the second embodiment is used to detect the Fig.19 (A) and Fig.19 (B) The rotation amount of the substrate P in the θz direction on the substrate holder 121 configured as shown. Specifically, based on the detection position of the end surface of the substrate P on the holding portion 201 obtained by the line sensor LS-4, the line sensor LS-5 and the line sensor LS-6 and the detection position of the end surface of the substrate P on the substrate holder 121 obtained by the potentiometer PM-4 and the potentiometer PM-6, the rotation amount of the substrate P in the θz direction on the substrate holder 121 is detected by the detection method of the second embodiment. In Modification Example 5, the number of potentiometers PM can be reduced compared with Modification Example 4, so the parts cost of the exposure device EX can be reduced compared with Modification Example 4.

[0172] (Variant 6)

[0173] Modification 6 is an example in which the line sensor LS for detecting the positions of the substrate P1 and the substrate P2 on the holding unit 201 is used in common in Modification 1. Fig. 20 (A)~ Fig. 20 (F) is a diagram showing the arrangement of the line sensor LS and the potentiometer PM of Modification 6. In Modification 6, the line sensor LS-10 and the line sensor LS-11 (see FIG. 1 ) of Modification 1 are omitted. Fig.13 (A)), and Fig. 20 As shown in (E), a line sensor LS-61 is provided so as to overlap with both substrate P1 and substrate P2. Line sensor LS-61 detects the position of the end surface corresponding to side S14 of substrate P1 and the position of the end surface corresponding to side S22 of substrate P2. The configuration of potentiometer PM is the same as that of modification example 1.

[0174] In variant example 6, the rotation amount in the θz direction of the substrate P1 on the substrate holder 121 can be detected based on the detection position of the end surface of the substrate P1 on the holding portion 201 obtained by the line sensor LS-7, the line sensor LS-1 and the line sensor LS-61 and the detection position of the end surface of the substrate P1 on the substrate holder 121 obtained by the potentiometer PM-7 and the potentiometer PM-1.

[0175] Furthermore, based on the detected position of the end surface of the substrate P2 on the holding portion 201 obtained by the line sensor LS-3, the line sensor LS-2, and the line sensor LS-61 and the detected position of the end surface of the substrate P2 on the substrate holder 121 obtained by the potentiometer PM-3 and the potentiometer PM-2, the rotation amount of the substrate P2 on the substrate holder 121 in the θz direction can be detected by the detection method of the second embodiment. In Modification 6, the number of line sensors LS can be reduced compared with Modification 1, so the parts cost of the exposure apparatus EX can be reduced compared with Modification 1.

[0176] (Variant 7)

[0177] Modification 7 is an example in which the line sensor LS for detecting the positions of the substrate P1 and the substrate P2 on the holding unit 201 is used in common in Modification 3. Fig.21 (A)~ Fig.21 (F) is a diagram showing the arrangement of the line sensor LS and the potentiometer PM of Modification 7. In Modification 7, the line sensor LS-42 and the line sensor LS-43 (see FIG. 1 ) of Modification 3 are omitted. Fig.16 (E)), and Fig.21 As shown in (E), a line sensor LS-62 is provided so as to overlap with both substrate P1 and substrate P2. Line sensor LS-62 detects the position of the end surface corresponding to side S14 of substrate P1 and the position of the end surface corresponding to side S22 of substrate P2. The configuration of potentiometer PM is the same as that of modification example 3.

[0178] In variant example 7, the rotation amount in the θz direction of the substrate P1 on the substrate holder 121 can be detected based on the detection position of the end surface of the substrate P1 on the holding portion 201 obtained by the line sensor LS-41, the line sensor LS-4 and the line sensor LS-62 and the detection position of the end surface of the substrate P1 on the substrate holder 121 obtained by the potentiometer PM-41 and the potentiometer PM-4. The detection method of the second embodiment can be used.

[0179] Furthermore, based on the detected position of the end surface of the substrate P2 on the holding portion 201 obtained by the line sensor LS-6, the line sensor LS-5, and the line sensor LS-62 and the detected position of the end surface of the substrate P2 on the substrate holder 121 obtained by the potentiometer PM-6 and the potentiometer PM-5, the rotation amount of the substrate P2 on the substrate holder 121 in the θz direction can be detected by the detection method of the second embodiment. In Modification 7, the number of line sensors LS can be reduced compared with Modification 3, so the parts cost of the exposure apparatus EX can be reduced compared with Modification 3.

[0180] (Variant 8)

[0181] Modification 8 is an example in which the line sensor LS for detecting the positions of the substrates P1 to P4 on the holding unit 201 is used in common in Modification 5. Fig. 22 (A)~ Fig. 22 (F) is a diagram showing the arrangement of the line sensor LS and the potentiometer PM of Modification 8. In Modification 8, the line sensor LS-51, the line sensor LS-59, the line sensor LS-55, and the line sensor LS-56 (see FIG. 5 ) of Modification 5 are omitted. Fig.19 (E)), and Fig. 22As shown in (E), a line sensor LS-63 is provided so as to overlap with the substrates P1 and P2, and a line sensor LS-64 is provided so as to overlap with the substrates P3 and P4. The line sensor LS-63 detects the position of the end surface corresponding to the side S14 of the substrate P1 and the position of the end surface corresponding to the side S22 of the substrate P2. In addition, the line sensor LS-64 detects the position of the end surface corresponding to the side S34 of the substrate P3 and the position of the end surface corresponding to the side S42 of the substrate P4. The configuration of the potentiometer PM is the same as that of the modified example 5.

[0182] In variant example 8, the rotation amount in the θz direction of the substrate P1 on the substrate holder 121 can be detected based on the detection position of the end surface of the substrate P1 on the holding portion 201 obtained by the line sensor LS-52, the line sensor LS-53 and the line sensor LS-63 and the detection position of the end surface of the substrate P1 on the substrate holder 121 obtained by the potentiometer PM-52 and the potentiometer PM-53.

[0183] In addition, based on the detection position of the end surface of the substrate P2 on the holding portion 201 obtained by the line sensor LS-3, the line sensor LS-58 and the line sensor LS-63 and the detection position of the end surface of the substrate P2 on the substrate holder 121 obtained by the potentiometer PM-3 and the potentiometer PM-58, the rotation amount of the substrate P2 in the θz direction on the substrate holder 121 can be detected by the detection method of the second embodiment.

[0184] In addition, based on the detection position of the end surface of the substrate P3 on the holding portion 201 obtained by the line sensor LS-54, the line sensor LS-1 and the line sensor LS-64 and the detection position of the end surface of the substrate P3 on the substrate holder 121 obtained by the potentiometer PM-54 and the potentiometer PM-1, the rotation amount of the substrate P3 in the θz direction on the substrate holder 121 can be detected by the detection method of the second embodiment.

[0185] Furthermore, based on the detected position of the end surface of the substrate P4 on the holding portion 201 obtained by the line sensor LS-2, the line sensor LS-57, and the line sensor LS-64 and the detected position of the end surface of the substrate P4 on the substrate holder 121 obtained by the potentiometer PM-2 and the potentiometer PM-57, the rotation amount of the substrate P4 on the substrate holder 121 in the θz direction can be detected by the detection method of the second embodiment. In Modification 8, the number of line sensors LS can be reduced compared to Modification 5, so the parts cost of the exposure apparatus EX can be reduced compared to Modification 5.

[0186] 《Third Implementation Mode》

[0187] In the first embodiment and the second embodiment, in the Figure 8When the substrate P is arranged on the substrate holder 121 as shown in (A), the reference side S1 of the substrate P does not coincide with the end of the -Y side of the substrate holder 121. Figure 8 When the substrate P is arranged on the substrate holder 121 as shown in (B), the reference side S4 of the substrate P does not coincide with the end of the -Y side of the substrate holder 121. Figure 8 When the substrate P1 and the substrate P2 are arranged on the substrate holder 121 as shown in (C), the reference side S11 of the substrate P1 and the reference side S21 of the substrate P2 do not coincide with the end of the −Y side of the substrate holder 121 .

[0188] In the third embodiment, the substrate P or the substrates P1 and P2 are arranged on the substrate holder 121 in such a manner that at least one of the reference sides of the substrate P and the reference sides of the substrates P1 and P2 coincide with the ends on the -Y side of the substrate holder 121 .

[0189] In addition, any method may be used to arrange the substrate P or the substrate P1 and the substrate P2 on the substrate holder 121 so that the reference sides of the substrate P, the substrate P1 and the substrate P2 coincide with the ends on the -Y side of the substrate holder 121.

[0190] Fig.23 (A)~ Fig.23 (F) shows the arrangement of the line sensor LS and the potentiometer PM for detecting the position of each substrate in the third embodiment.

[0191] In the third embodiment, any one of the reference side S1 and the reference side S4 of the substrate P, the reference side S11 of the substrate P1, and the reference side S21 of the substrate P2 are configured in a manner consistent with the end on the -Y side of the holding portion 201 and the end on the -Y side of the substrate holder 121. Therefore, a potentiometer PM-37 for detecting the rotation amount of the substrate P1 in the θz direction and a potentiometer PM-38 for detecting the rotation amount of the substrate P2 in the θz direction, which cannot be configured in the first and second embodiments, can be provided.

[0192] Again, we can compare Fig.23 The line sensor LS-31 and the line sensor LS-32 are provided for detecting the position of the end surface of the substrate P corresponding to the reference edge S1 and the rotation amount of the substrate P in the θz direction, and are used to detect the Fig.23 (B) The line sensors LS are arranged as shown in FIG. 1 and 1 and 1 and 1. The position of the end surface of the substrate P corresponding to the reference side S2 and the rotation amount of the substrate P in the θz direction. This can reduce the number of line sensors LS compared to the first embodiment. The same is true for the potentiometer PM.

[0193] In the third embodiment, the potentiometer PM-37 and the potentiometer PM-38 may be omitted, and the rotation amounts of the substrates P1 and P2 on the substrate holder 121 in the θz direction may be calculated by the method of the first embodiment.

[0194] In the third embodiment, the line sensor LS-36 and the line sensor LS-39 and the potentiometer PM-37 and the potentiometer PM-38 may be omitted, and the rotation amount of the substrate P1 and the substrate P2 on the substrate holder 121 in the θz direction may be calculated by the method of the second embodiment.

[0195] (Variant 9)

[0196] Furthermore, in the first to third embodiments, for example, Figure 2 In the case where only one substrate P is arranged on the holding portion 201 or the substrate holder 121 without any other arrangement as shown in (A), Fig.24 Line sensors LS-1 to LS-3 are arranged as shown in (A), and Fig.24 As shown in (B), the potentiometer PM-1 and the potentiometer PM-3 (the potentiometer PM-2 is omitted) are arranged, and the rotation amount of the substrate P in the θz direction is calculated by the method of the second embodiment.

[0197] Furthermore, in the first to third embodiments, the exposure apparatus EX is described as an exposure apparatus using the photomask M. However, the exposure apparatus EX may be a so-called maskless exposure apparatus that forms a pattern using, for example, a spatial light modulator instead of the photomask M.

[0198] The above-described embodiments are preferred examples of the present invention, but are not limited thereto, and various modifications can be made without departing from the gist of the present invention.

[0199] Description of Figure Numbers

[0200] 100: Body part

[0201] 120: Substrate carrier device

[0202] 121: Substrate holder

[0203] 200: Transport device

[0204] 201: Maintenance Department

[0205] 203: Alignment mechanism

[0206] 300: First control device

[0207] LS, LS-1~LS-11: Line sensor

[0208] PM, PM-1~PM-9: Potentiometer

[0209] EX: Exposure device

[0210] P, P1, P2: Substrate

[0211] S1, S11, S21: Base edge

[0212] S12, S24: Edge

Claims

1. An exposure device, characterized in that: include: A holding portion that holds a plurality of substrates; a plurality of first sensors for detecting positions of each of the plurality of substrates relative to the holding portion; A stage portion, configured with the plurality of substrates; as well as a plurality of second sensors for detecting positions of each of the plurality of substrates relative to the stage portion; in, The number of the plurality of second sensors is less than the number of the plurality of first sensors.

2. The exposure device according to claim 1, characterized in that A position of each of the plurality of second sensors corresponds to a position of any one of the plurality of first sensors.

3. The exposure device according to claim 2, characterized in that Each of the plurality of second sensors is arranged so that, when the plurality of second sensors and the corresponding plurality of first sensors are virtually arranged on a predetermined coordinate system, positions of the plurality of second sensors coincide with positions of the corresponding plurality of first sensors.

4. The exposure device according to any one of claims 1 to 3, characterized in that Also includes: A first calculation unit calculates the rotation amount of each of the multiple substrates on the holding portion around a direction orthogonal to the upper surface of the holding portion based on the detection results of the positions of each of the multiple substrates on the holding portion relative to the holding portion obtained by the multiple first sensors and the detection results of the positions of each of the multiple substrates on the stage portion relative to the stage portion obtained by the multiple second sensors.

5. The exposure device according to claim 4, characterized in that Also includes: a first alignment mechanism for positioning each of the plurality of substrates relative to the holding portion based on detection results of the positions of each of the plurality of substrates on the holding portion relative to the holding portion obtained by the plurality of first sensors; a projection optical system to project a pattern onto each of the plurality of substrates; as well as The second alignment mechanism positions each of the plurality of substrates relative to the projection optical system based on the detection results of the positions of each of the plurality of substrates on the stage portion relative to the stage portion obtained by the plurality of second sensors and the calculated rotation amount of each of the plurality of substrates.

6. The exposure device according to any one of claims 1 to 5, characterized in that: Each of the plurality of first sensors is a non-contact sensor, Each of the plurality of second sensors is a contact sensor.

7. The exposure device according to claim 6, characterized in that Each of the plurality of first sensors is a line sensor, Each of the plurality of second sensors is a potentiometer.

8. The exposure apparatus according to any one of claims 1 to 7, characterized in that: The plurality of substrates at least include a first substrate and a second substrate. The plurality of first sensors include at least three third sensors for detecting a position of the first substrate on the holding portion relative to the holding portion, and at least three fourth sensors for detecting a position of the second substrate on the holding portion relative to the holding portion. The plurality of second sensors include at least two fifth sensors for detecting a position of the first substrate on the stage relative to the stage, and at least two sixth sensors for detecting a position of the second substrate on the stage relative to the stage. The number of the fifth sensors is less than the number of the third sensors, The number of the sixth sensors is less than the number of the fourth sensors.

9. The exposure device according to claim 8, characterized in that At least two of the third sensors are arranged relative to a reference edge of the first substrate, At least two of the fourth sensors are disposed relative to a reference edge of the second substrate.

10. The exposure device according to claim 8 or 9, characterized in that: The number of the third sensors is four, two of which are arranged relative to the first side of the first substrate, and the other two are arranged relative to the second side of the first substrate intersecting the first side. The number of the fourth sensors is four, two of which are arranged relative to the third side of the second substrate, and the other two are arranged relative to the fourth side of the second substrate intersecting the third side. The number of the fifth sensors is three, one of which is arranged relative to the first side of the first substrate, and the other two are arranged relative to the second side of the first substrate intersecting the first side. The number of the sixth sensors is three, one is arranged relative to the third side of the second substrate, and the other two are arranged relative to the fourth side of the second substrate intersecting the third side.

11. The exposure device according to claim 8 or 9, characterized in that: The number of the third sensors is three, two of which are arranged relative to the first side of the first substrate, and the other is arranged relative to the second side of the first substrate intersecting the first side. The number of the fourth sensors is three, two of which are arranged relative to the third side of the second substrate, and the other is arranged relative to the fourth side of the second substrate intersecting the third side. The number of the fifth sensors is two, one is arranged relative to the first side of the first substrate, and the other is arranged relative to the second side of the first substrate intersecting the first side. The number of the sixth sensors is two, one is arranged relative to the third side of the second substrate, and the other is arranged relative to the fourth side of the second substrate intersecting the third side.

12. The exposure device according to claim 10 or 11, characterized in that: The first side of the first substrate is a reference side of the first substrate, The third side of the second substrate is a reference side of the second substrate.

13. The exposure apparatus according to any one of claims 8 to 12, characterized in that: Also includes: a second calculating unit, calculating a rotation amount of the first substrate on the stage portion around a direction orthogonal to an upper surface of the stage portion, based on a detection result of the position of the first substrate on the holding portion relative to the holding portion obtained by the third sensor and a detection result of the position of the first substrate on the stage portion relative to the stage portion obtained by the fifth sensor; as well as The third calculation unit calculates the rotation amount of the second substrate on the carrier part around the direction orthogonal to the upper surface of the carrier part based on the detection result of the position of the second substrate on the holding part relative to the holding part obtained by the fourth sensor and the detection result of the position of the second substrate on the carrier part relative to the carrier part obtained by the sixth sensor.

14. An exposure device, characterized in that: include: A holding portion for holding a substrate; a plurality of first sensors for detecting a position of the substrate relative to the holding portion; A stage portion, configured with the substrate; as well as A plurality of second sensors detect the position of the substrate relative to the stage portion, wherein: The number of the plurality of second sensors is less than the number of the plurality of first sensors.

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