Electronic device including heat dissipation structure

Abstract

An electronic device according to an embodiment of the present disclosure includes: a heating unit including an electronic component that generates heat during operation of the electronic device; and a heat dissipation structure supporting the heating unit, in which the heat dissipation structure includes: a first frame including a first metal; and a second frame, at least a portion of which is disposed inside the first frame, at least a portion of which is exposed to the outside through one surface of the first frame, and which includes a second metal, the second frame including a heat transfer portion in contact with the heating unit and a heat dissipation portion disposed at a distance from the heating unit, and the second frame may extend from the heat transfer portion to the heat dissipation portion.

Description

Technical Field

[0001] The present disclosure relates to an electronic device including a heat dissipation structure. Background Art

[0002] A mechanism (e.g., a bracket) inside a portable electronic device that contacts a heat generating component (e.g., a printed circuit board, a processor, a battery) can be manufactured using a single metal material by die casting. For example, the mechanism that contacts the heat generating component can be made of a non-ferrous metal such as aluminum, magnesium, or zinc. Aluminum, magnesium, or zinc can be applied using a die casting method and are easy to process, making them suitable for use as a mechanism in a portable electronic device. Summary of the invention

[0003] As the performance and integration of portable electronic devices increase, the heat generated by electronic components inside the electronic devices may increase. In order to reduce the heat transferred to the user of the portable electronic device, it is necessary to quickly dissipate the heat generated by the electronic components to the surrounding environment. Mechanisms made of a single material of metal may have limitations in quickly dissipating the heat generated by the electronic components to the surrounding environment.

[0004] In order to improve the thermal conductivity of the mechanism, a graphite sheet, a copper sheet, etc. may be attached. However, when such a method is applied, the rigidity of the mechanism may be reduced or the thickness of the electronic device may be increased. When the mechanism is made of only copper or a copper alloy to improve the thermal conductivity of the mechanism, the weight and manufacturing cost of the electronic device may increase.

[0005] Problem Solution

[0006] An electronic device according to an embodiment of the present disclosure may include: a heating unit including an electronic element that generates heat during operation of the electronic device; and a heat dissipation structure that supports the heating unit.

[0007] In an embodiment, the heat dissipation structure may include: a first frame including a first metal; a second frame including a second metal, wherein at least a portion of the second frame is disposed within the first frame, and at least a portion of the second frame is exposed to the outside through a surface of the first frame.

[0008] In an embodiment, the second frame may include: a heat transfer portion in contact with the heating unit; and a heat dissipation portion disposed at a distance from the heating unit.

[0009] In an embodiment, the second frame may extend from the heat transfer portion to the heat dissipation portion.

[0010] Advantageous Effects of the Invention

[0011] An electronic device including a heat dissipation structure according to an embodiment of the present disclosure can quickly dissipate heat generated by electronic components without increasing the thickness of the electronic device or reducing its mechanical strength.

[0012] The electronic device including the heat dissipation structure according to the embodiment of the present invention may include a material having improved mechanical strength compared to a material used for die casting. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a block diagram of an electronic device in a network environment according to an embodiment.

[0014] Figure 2 is a conceptual diagram of an electronic device according to an embodiment of the present disclosure.

[0015] Figure 3 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0016] Figure 4a , Figure 4b and FIG. 4c is a view showing an electronic device according to an embodiment of the present disclosure.

[0017] Figure 5a , Figure 5b , Figure 5c and Figure 5d 2 is a view showing a first frame and a second frame according to an embodiment of the present disclosure.

[0018] Figure 6a , Figure 6b and Figure 6c is a view showing a second frame according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0019] Figure 1 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. Figure 1, the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (eg, display module 160).

[0020] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent or combined with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0021] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 180 or a communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0022] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0023] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0024] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0025] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0026] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0027] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0028] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. Depending on the embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0029] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0030] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0031] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0032] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0033] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0034] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0035] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0036] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). Depending on the embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0037] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.

[0038] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0039] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0040] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the function or service requested, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request in the case of further processing the result or without further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0041] Figure 2 is a conceptual diagram of an electronic device 200 according to an embodiment of the present disclosure.

[0042] When describing the electronic device 200 according to an embodiment of the present disclosure, a width direction of the electronic device 200 may refer to an x-axis direction, and a height direction of the electronic device 200 may refer to a z-axis direction.

[0043] The electronic device 200 according to an embodiment of the present disclosure may include a heating unit 201 and / or a heat dissipation structure 202. The heating unit 201 may refer to a region where heat is generated inside the electronic device 200. The heat dissipation structure 202 may refer to a region where the heating unit 201 is disposed and supported. The heat dissipation structure 202 may be used to receive and dissipate the heat generated by the heating unit 201.

[0044] In an implementation, the heating unit 201 may include a printed circuit board 210 , an electronic component 220 , a shielding can 230 , and / or a heat transfer member 240 .

[0045] In an implementation, the electronic component 220 may be disposed on the printed circuit board 210. For example, the electronic component 220 may be disposed on a surface of the printed circuit board 210 facing the direction of the heat dissipation structure 202 (eg, the positive z-axis direction).

[0046] In an embodiment, the electronic component 220 may be a component that generates heat during operation of the electronic device 200. For example, the electronic component 220 may refer to a processor (eg, Figure 1 processor 120) and / or memory (e.g., Figure 1 The processor included in the electronic component 220 (e.g., Figure 1 The processor 120 in may be an application processor.

[0047] In an embodiment, the shielding can 230 may be provided to surround the outer circumference of the electronic component 220. The shielding can 230 may be used to shield noise generated by the electronic component 220. The noise from the electronic component 220 may cause electromagnetic interference (EMI) that degrades the radio frequency (RF) signal performance of the electronic device 200. The shielding can 230 may shield the noise generated from the electronic component 220 to reduce electromagnetic interference caused by the noise.

[0048] In an embodiment, the heat generated by the electronic component 220 may be transferred to the heat dissipation structure 202 through the heat transfer member 240. For example, the heat generated by the electronic component 220 may be transferred to the second frame 260 of the heat dissipation structure 202 through the heat transfer member 240.

[0049] In an embodiment, the heat transfer member 240 may include a first heat transfer member 241 and / or a second heat transfer member 242. The first heat transfer member 241 and the second heat transfer member 242 may include a solid material and / or a liquid material. For example, the first heat transfer member 241 may include a silicon TIM (silicone thermal interface material). The second heat transfer member may include a nano TIM (nano thermal interface material).

[0050] In an embodiment, two first heat transfer members 241 may be provided with the second heat transfer member 242 interposed therebetween. For example, one of the first heat transfer members 241 may be provided on a surface of the second heat transfer member 242 facing the negative z-axis direction, and the other first heat transfer member 241 may be provided on a surface of the second heat transfer member 242 facing the positive z-axis direction.

[0051] refer to Figure 2 Although the electronic component 220 of the heating unit 201 is shown as not in direct contact with the heat dissipation structure 202, and the heat transfer member 240 of the heating unit 201 is in contact with the heat dissipation structure 202, this is only exemplary, and the contact form between the heating unit 201 and the heat dissipation structure 202 is not limited thereto. For example, the electronic component 220 of the heating unit 201 and the heat dissipation structure 202 may be in direct contact, thereby allowing heat from the electronic component 220 to be transferred to the heat dissipation structure 202.

[0052] In an implementation, the heat dissipation structure 202 of the electronic device 200 may include a first frame 250 and / or a second frame 260 .

[0053] In an embodiment, the first frame 250 may form an outer shape of the heat dissipation structure 202. The first frame 250 may extend along a width direction (e.g., x-axis direction), a height direction (e.g., z-axis direction), and a length direction (e.g., a direction perpendicular to both the x-axis and the z-axis) of the electronic device 200.

[0054] In an implementation, the second frame 260 may be disposed inside the first frame 250. For example, the first frame 250 may be disposed to surround at least a portion of the second frame 260.

[0055] In an implementation, the second frame 260 may include a heat transfer portion 261 and / or a heat dissipation portion 262. The heat transfer portion 261 may be a region that directly contacts the heating unit 201 and receives heat generated by the heating unit 201.

[0056] In an embodiment, at least a portion of the second frame 260 may be exposed to the outside of the first frame 250. At least a portion of the heat transfer portion 261 of the second frame 260 may be exposed to the outside of the first frame 250 and contact the heating unit 201. For example, the heat transfer portion 261 may contact the heat transfer member 240 of the heating unit 201 on a surface facing a direction (e.g., a negative z-axis direction) of the electronic component 220.

[0057] In an embodiment, the heat dissipation portion 262 may be a region that dissipates the transferred heat. The heat dissipation portion 262 may be positioned at a distance from the heating unit 201 and the heat transfer portion 261. For example, referring to Figure 2The heat dissipation portion 262 may be positioned at a predetermined distance relative to the heating unit 201 and the heat transfer portion 261 in a width direction (eg, x-axis direction) of the electronic device 200 .

[0058] In an embodiment, the heat generated by the electronic component 220 can be transferred to the heat dissipation portion 262 through the heat transfer portion 261. For example, the heat generated by the electronic component 220 can be transferred to the heat dissipation portion 262 along the heat transfer portion 261. Figure 2 The heat transfer path H shown in FIG. 2 is diffused and transferred to the heat dissipation portion 262. The heat transfer path H may extend from the heat transfer portion 261 toward the heat dissipation portion 262 along the width direction (eg, x-axis direction) of the electronic device 200.

[0059] In an embodiment, the first frame 250 may include a first metal, and the second frame 260 may include a second metal. The first metal may include aluminum, magnesium, and / or zinc, and the die casting method may be applied to these metals. The second metal may include a metal having a higher thermal conductivity than the first metal. For example, the second frame 260 may include copper and / or a copper alloy.

[0060] Figure 3 is an exploded perspective view of an electronic device 200 according to an embodiment of the present disclosure.

[0061] refer to Figure 3 , the electronic device 200 according to an embodiment of the present disclosure may include a printed circuit board 210 , an electronic component 220 , a shielding can 230 , a heat transfer member 240 , a first frame 250 , and / or a second frame 260 .

[0062] In an embodiment, the electronic component 220 may be disposed in one direction of the printed circuit board 210. For example, with respect to the printed circuit board 210, the electronic component 220 may be disposed in a direction toward the first frame 250 and the second frame 260 (eg, a positive z-axis direction).

[0063] exist Figure 2 and Figure 3 In the embodiment, the electronic component 220 is shown as a single component disposed on the printed circuit board 210, but this is exemplary, and the number of electronic components 220 disposed on the printed circuit board 210 is not limited thereto. For example, a plurality of electronic components 220 may be disposed on the printed circuit board 210.

[0064] In an embodiment, the shielding can 230 may be disposed to surround the outer circumference of the electronic component 220. The shielding can 230 may be used to shield noise generated by the electronic component 220.

[0065] In an embodiment, the shielding can 230 may include a shielding can opening 231 in at least a portion thereof. The shielding can opening 231 may be formed at a position overlapping with the electronic component 220. For example, based on the width direction (e.g., x-axis direction) and the length direction (e.g., y-axis direction) of the electronic device 200, the position where the shielding can opening 231 is formed may be substantially the same as the position where the electronic component 220 is disposed.

[0066] In an embodiment, the heat transfer member 240 may include a first heat transfer member 241 and / or a second heat transfer member 242 .

[0067] In an embodiment, the first heat transfer member 241 may be disposed on one surface of the electronic component 220. For example, the first heat transfer member 241 may be disposed on a surface facing the direction of the first and second frames 250 and 260 (eg, the positive z-axis direction) with respect to the electronic component 220.

[0068] In an embodiment, the first heat transfer member 241 may be disposed at a position overlapping with a position where the shielding can opening 231 is formed. The first heat transfer member 241 may be formed to be smaller than the length of the shielding can opening 231, which extends in the width direction (e.g., x-axis direction) and the length direction (e.g., y-axis direction) of the electronic device 200.

[0069] In an embodiment, the second heat transfer member 242 may be disposed in one direction of the shielding can 230. For example, the second heat transfer member 242 may be disposed in an opposite direction (e.g., a positive z-axis direction) to the direction in which the printed circuit board 210 is located relative to the shielding can 230. The second heat transfer member 242 may be disposed in contact with at least a portion of the shielding can 230.

[0070] In an embodiment, the second heat transfer member 242 may be disposed to cover the shielding can opening 231. For example, at least a portion of the second heat transfer member 242 may be positioned in a direction opposite to the direction in which the printed circuit board 210 is positioned relative to the shielding can opening 231 (e.g., the positive z-axis direction), and disposed to cover the shielding can opening 231.

[0071] In an embodiment, one surface of the second heat transfer member 242 may refer to a surface of the second heat transfer member 242 facing the negative z-axis direction. The other surface of the second heat transfer member 242 may refer to a surface of the second heat transfer member 242 facing the positive z-axis direction.

[0072] In an embodiment, the electronic device 200 may include two first heat transfer members 241. When the electronic device 200 includes two first heat transfer members 241, the two first heat transfer members 241 may be disposed with the second heat transfer member 242 interposed therebetween. For example, one of the first heat transfer members 241 may be disposed on one surface of the second heat transfer member 242, and the other first heat transfer member 241 may be disposed on the other surface of the second heat transfer member 242.

[0073] In an embodiment, the first frame 250 may include a first installation space 251 and / or a second installation space 252. The first installation space 251 may be a space for installing the printed circuit board 210, the electronic component 220, the shielding can 230 and / or the heat transfer member 240. The second installation space 252 may be a space for installing the battery 189 (see FIG. 1 ) for supplying power to the electronic device 200. Figure 1 ) space.

[0074] In an embodiment, at least a portion of the second frame 260 may be disposed inside the first frame 250. The first frame 250 may be disposed to surround at least a portion of the outer circumference of the second frame 260. At least a portion of the second frame 260 may be exposed to the outside of the first frame 250.

[0075] Figure 4a , Figure 4b and FIG. 4 c is a view showing an electronic device 200 according to an embodiment of the present disclosure.

[0076] Figure 4a 2 is a view of the electronic device 200 according to an embodiment of the present disclosure obtained by cutting the electronic device 200 along a width direction (eg, an x-axis direction) of the electronic device 200 . Figure 4b yes Figure 4a Figure 4c is an enlarged view of the A region shown in FIG. Figure 4a Magnified view of area B shown in FIG.

[0077] refer to Figure 4a and Figure 4b , the electronic component 220 may be disposed on one surface of the printed circuit board 210. For example, the electronic component 220 may be disposed on a surface of the printed circuit board 210 facing the first frame 250 and the second frame 260.

[0078] In an implementation, the heat transfer member 240 may be disposed on one surface of the electronic component 220. For example, the heat transfer member 240 may be disposed on a surface of the electronic component 220 facing the first frame 250 and the second frame 260.

[0079] Figure 4a and Figure 4bThe heat transfer member 240 shown in FIG. 2 may include Figure 3 The first heat transfer member 241 shown in FIG. Figure 3 ) and / or the second heat transfer member 242 (see Figure 3 ).

[0080] In an embodiment, one surface of the heat transfer member 240 may refer to a surface of the heat transfer member 240 facing the negative z-axis direction. The other surface of the heat transfer member 240 may refer to a surface of the heat transfer member 240 facing the positive z-axis direction.

[0081] refer to Figure 4a and Figure 4b The heat transfer member 240 may contact the electronic component 220 on one surface of the heat transfer member 240. The heat transfer member 240 may contact the heat transfer portion 261 of the second frame 260 on the other surface of the heat transfer member 240.

[0082] In an implementation, at least a portion of the second frame 260 may be exposed to the outside of the first frame 250. Figure 4b , the heat transfer portion 261 of the second frame 260 may be exposed to the outside of the first frame 250 and contact the heat transfer member 240 .

[0083] In an implementation, the heat transfer portion 261 may be formed by extending a portion of the second frame 260 in a direction toward the electronic component 220 (eg, a negative z-axis direction).

[0084] In an embodiment, the heat generated by the electronic component 220 may be transferred to the heat transfer portion 261 of the second frame 260 through the heat transfer member 240. The heat transfer portion 261 may be used to receive the heat generated by the electronic component 220 and transfer the heat to the heat dissipation portion 262.

[0085] refer to Figure 4a , the heat dissipation portion 262 of the second frame 260 may be positioned at a distance from the electronic component 220. For example, the heat dissipation portion 262 may be positioned at a distance from the electronic component 220 along the width direction (e.g., x-axis direction) of the electronic device 200. The second frame 260 may be formed by extending in a direction from the electronic component 220 toward the heat dissipation portion 262.

[0086] exist Figure 4a In the figure, the heat dissipation portion 262 of the second frame 260 and the electronic component 220 are shown as being positioned at a certain distance in the width direction (e.g., the x-axis direction) of the electronic device 200, but this is exemplary, and the heat dissipation portion 262 and the electronic component 220 may also be positioned at a certain distance in the length direction (e.g., the y-axis direction) of the electronic device 200.

[0087] In an implementation, the heat generated by the electronic component 220 may be diffused toward the heat dissipation portion 262 along a direction in which the second frame 260 extends.

[0088] In an embodiment, the heat dissipation portion 262 may be used to dissipate the transferred heat to the outside of the heat dissipation portion 262. The heat dissipation portion 262 of the second frame 260 may be formed to have a larger surface area in contact with the outside than other regions of the second frame 260, thereby making it easier to dissipate heat. For example, based on the same unit length (e.g., the second frame 260 extends a predetermined amount of length in the length direction of the electronic device 200), the heat dissipation portion 262 of the second frame 260 may be formed to have a larger surface area in contact with the outside than other regions of the second frame 260.

[0089] refer to Figure 4a 4C , the heat dissipation portion 262 may include a first protruding region 2621. The first protruding region 2621 may refer to a region where a portion of the heat dissipation portion 262 protrudes and extends in a height direction (eg, z-axis direction) of the electronic device 200.

[0090] refer to Figure 4a 4c, a plurality of first protruding regions 2621 may be formed in the heat dissipation portion 262. Figure 4a FIG. 4 c shows that four first protruding regions 2621 are formed, but this is exemplary, and the number of the first protruding regions 2621 is not limited thereto.

[0091] In an embodiment, the heat dissipation portion 262 of the second frame 260 may include a first protruding area 2621, thereby increasing the surface area in contact with the outside. For example, when the heat dissipation portion 262 includes the first protruding area 2621, the surface area of ​​the heat dissipation portion 262 in contact with the first frame 250 may increase the surface area formed by the first protruding area 2621. The surface area of ​​the heat dissipation portion 262 in contact with the first frame 250 increases, and the heat dissipation portion 262 can easily dissipate the heat transferred from the electronic component 220.

[0092] Figure 5a , Figure 5b , Figure 5c and Figure 5d 2 is a view showing a first frame 250 and a second frame 260 according to an embodiment of the present disclosure.

[0093] Figure 5a 2 is a view showing a first frame 250 and a second frame 260 according to an embodiment. Figure 5b is along Figure 5a 2 is a cross-sectional view of the first frame 250 and the second frame 260 taken along line AA′ shown in FIG. Figure 5c is along Figure 5a0 is a cross-sectional view of the first frame 250 and the second frame 260 taken along line BB′ shown in FIG. Figure 5d is along Figure 5a 2 is a cross-sectional view of the first frame 250 and the second frame 260 taken along line CC′ shown in FIG.

[0094] In an implementation, the heat dissipation structure 202 may include a first frame 250 and / or a second frame 260. The first frame 250 may be a frame forming an exterior of the heat dissipation structure 202. The second frame 260 may be a frame disposed inside the first frame 250.

[0095] When describing the first frame 250 according to an embodiment of the present disclosure, the width direction, length direction, and height direction of the first frame 250 may be respectively parallel to the width direction, length direction, and height direction of the electronic device 200. For example, the width direction of the first frame 250 may refer to the x-axis direction, the length direction of the first frame 250 may refer to the y-axis direction, and the height direction of the first frame 250 may refer to the z-axis direction.

[0096] refer to Figure 5a , Figure 5b , Figure 5c and Figure 5d The first frame 250 may extend along a width direction (eg, an x-axis direction), a length direction (eg, a y-axis direction), and a height direction (eg, a z-axis direction) of the electronic device 200 .

[0097] refer to Figure 5a , Figure 5b , Figure 5c and Figure 5d , the first frame 250 may be disposed to surround at least a portion of the second frame 260 .

[0098] refer to Figure 5a , Figure 5b , Figure 5c and Figure 5d , at least a portion of the second frame 260 may be exposed to the outside of the first frame 250. For example, the heat transfer portion 261 of the second frame 260 may be exposed to the outside of the first frame 250. The second frame 260 may be in contact with the electronic component 220 (see Figure 4b ) or set in the electronic component 220 (see Figure 4b ) on the heat transfer member 240 (see Figure 4b )touch.

[0099] refer to Figure 5b and Figure 5c, the heat dissipation portion 262 may be positioned at a distance from the heat transfer portion 261. For example, the heat dissipation portion 262 may be disposed at a position a predetermined length away from the heat transfer portion 261 along the width direction (eg, x-axis direction) of the electronic device 200.

[0100] In an embodiment, the second frame 260 may include a plurality of heat dissipation portions 262. For example, referring to Figure 5b , Figure 5c and Figure 5d When the second frame 260 includes two heat dissipation parts 262, one of the heat dissipation parts 262 can be positioned at a certain distance in the width direction of the first frame 250 (for example, the x-axis direction) based on the heat transfer part 261, and the other heat dissipation part 262 can be positioned at a certain distance in the length direction of the first frame 250 (for example, the y-axis direction) based on the heat transfer part 261.

[0101] refer to Figure 5b , Figure 5c and Figure 5d , each heat dissipation portion 262 may include a first protruding area 2621 and / or a second protruding area 2622. The first protruding area 2621 may be located at a certain distance in the width direction (e.g., x-axis direction) of the first frame 250 based on the heat transfer portion 261. The second protruding area 2622 may be located at a certain distance in the length direction (e.g., y-axis direction) of the first frame 250 based on the heat transfer portion 261.

[0102] In an embodiment, the first protruding region 2621 and / or the second protruding region 2622 may each be a region where a portion of the heat dissipation portion 262 protrudes and extends in a height direction (e.g., z-axis direction) of the first frame 250. For example, when the heat transfer portion 261 forms one surface parallel to the width direction (e.g., x-axis direction) and the length direction (e.g., y-axis direction) of the first frame 250, the first protruding region 2621 and / or the second protruding region 2622 may extend from one surface of the heat transfer portion 261 to protrude in the height direction (e.g., z-axis direction) of the first frame 250.

[0103] refer to Figure 5b and Figure 5c The number of first protruding regions 2621 may be formed differently depending on the position of the heat dissipation portion 262. For example, the number of first protruding regions 2621 formed at the AA' cross-sectional position of the second frame 260 may be greater than the number of first protruding regions 2621 formed at the BB' cross-sectional position.

[0104] In an embodiment, the length of the first protruding area 2621 and the length of the second protruding area 2622 may be formed differently from each other. For example, the length of the second protruding area 2622 protruding and extending in the height direction (e.g., z-axis direction) of the first frame 250 may be longer than the length of the first protruding area 2621 protruding and extending.

[0105] In an embodiment, the extension length of the first protruding area 2621 and / or the second protruding area 2622 may vary based on the shape of the first frame 250 in which the heat dissipation portion 262 is provided. For example, the heat dissipation portion 262 provided in a region of the first frame 250 that is formed longer in the height direction (e.g., z-axis direction) may be formed with a longer extension of the first protruding area 2621 and / or the second protruding area 2622 than the heat dissipation portion 262 provided in another region of the first frame 250.

[0106] In an implementation, a plurality of first protruding regions 2621 and / or a plurality of second protruding regions 2622 may be formed on a portion of the heat dissipation portion 262. Figure 5b , Figure 5c and Figure 5d Although the number of the first protruding regions 2621 is shown to be greater than the number of the second protruding regions 2622, this is exemplary, and the numbers of the first protruding regions 2621 and the second protruding regions 2622 are not limited thereto.

[0107] In an embodiment, the first frame 250 may include a material having a lower melting point than the second frame 260. For example, the second metal of the second frame 260 may include copper or a copper alloy, and the first metal of the first frame 250 may include aluminum, magnesium, or zinc, which has a lower melting point than the second metal.

[0108] In an implementation, the first frame 250 may include a material having lower thermal conductivity than the second frame 260 .

[0109] In an embodiment, the first frame 250 may be manufactured using a die casting method. For example, after manufacturing the second frame 260, the first frame 250 may be manufactured using a die casting method outside the second frame 260. Since the first metal included in the first frame 250 may have a lower melting point than the second metal included in the second frame 260, the first frame 250 may be formed outside the second frame 260 by the die casting method while the second frame 260 is set.

[0110] In an implementation, the first metal of the first frame 250 may include a metal to which a die casting method may be applied.

[0111] In an embodiment, the first frame 250 may be manufactured using a metal injection molding (MIM) method.

[0112] In an implementation, the first metal of the first frame 250 may include a metal to which a metal injection molding (MIM) method may be applied.

[0113] In an embodiment, after the first frame 250 is formed outside the second frame 260, additional processes may be performed on both the first frame 250 and the second frame 260. For example, a process of forming a film on the surface of the first frame 250 (e.g., anodizing, chromating), a process of fine-finishing the outer surfaces of the first frame 250 and the second frame 260 (e.g., polishing), and / or a process of surface protection and aesthetic formation of the first frame 250 and the second frame 260 (e.g., painting) may be performed.

[0114] although Figure 5a , Figure 5b and Figure 5c Only the heat transfer portion 261 of the second frame 260 is shown to be exposed to the outside of the first frame 250, but this is exemplary, and the portion of the second frame 260 exposed to the outside of the first frame 250 is not limited thereto. For example, the heat dissipation portion 262 of the second frame 260 may not only be positioned inside the first frame 250, but may also be exposed to the outside through one surface of the first frame 250. The heat dissipation portion 262 may be exposed to the outside of the first frame 250 through a surface of the first frame 250 facing the negative z-axis direction or a surface facing the positive z-axis direction.

[0115] In an embodiment, when the heat dissipation portion 262 is exposed to the outside of the first frame 250 , a cooling member (not shown) may be provided on the heat dissipation portion 262 exposed to the outside. The cooling member (not shown) may be used to cool the heat of the heat dissipation portion 262 .

[0116] Figure 6a , Figure 6b and Figure 6c is a view showing the second frame 260 according to an embodiment of the present disclosure.

[0117] Figure 6a is a view of the second frame 260 according to an embodiment of the present disclosure viewed along the positive z-axis direction. Figure 6b is a view of the second frame 260 according to an embodiment of the present disclosure viewed along the negative y-axis direction. Figure 6c is a view of the second frame 260 according to an embodiment of the present disclosure viewed along the positive x-axis direction.

[0118] When describing the second frame 260 according to an embodiment of the present disclosure, the width direction of the second frame 260 may refer to the x-axis direction, the length direction may refer to the y-axis direction, and the height direction of the second frame 260 may refer to the z-axis direction.

[0119] In an embodiment, the second frame 260 may include a plate shape. For example, the second frame 260 may have a thickness in a height direction (eg, z-axis direction) and may be formed to extend in a width direction (eg, x-axis direction) and a length direction (eg, y-axis direction).

[0120] refer to Figure 6a , Figure 6b and Figure 6c , the second frame 260 according to an embodiment of the present disclosure may include a heat transfer portion 261 and / or a heat dissipation portion 262 .

[0121] refer to Figure 6a , Figure 6b and Figure 6c , a partial region of the second frame 260 may be formed thicker than other regions. For example, the heat transfer portion 261 of the second frame 260 may be formed thicker than other regions.

[0122] In an embodiment, the heat dissipation portion 262 may include a first protruding area 2621 and / or a second protruding area 2622. The first protruding area 2621 and the second protruding area 2622 may refer to an area where a portion of the heat dissipation portion 262 protrudes and extends in a height direction (eg, z-axis direction) of the second frame 260.

[0123] refer to Figure 6a , Figure 6b and Figure 6c The first protruding region 2621 may extend in a direction substantially parallel to the length direction (eg, y-axis direction) of the second frame 260. The second protruding region 2622 may extend in a direction substantially parallel to the width direction (eg, x-axis direction) of the second frame 260.

[0124] In an embodiment, the heat transfer portion 261 may be positioned at a predetermined length from the heat dissipation portion 262. For example, the first protruding region 2621 of the heat transfer portion 261 may be positioned at a distance from the heat transfer portion 261 along the width direction (e.g., x-axis direction) of the second frame 260. The second protruding region 2622 of the heat transfer portion 261 may be positioned at a distance from the heat transfer portion 261 along the length direction (e.g., y-axis direction) of the second frame 260.

[0125] refer to Figure 6a, the second frame 260 may include a shape that is at least partially bent and extended. For example, the second frame 260 may extend in a width direction (e.g., x-axis direction) of the second frame 260 in a direction from the heat transfer portion 261 toward the first protruding area 2621 of the heat dissipation portion 262, while being bent in at least a portion in a length direction (e.g., y-axis direction) of the second frame 260. The bent and extended shape of the second frame 260 may vary based on the shape of the first frame 250 and the shapes of other components of the electronic device 200 (e.g., the printed circuit board 210).

[0126] refer to Figure 6b and Figure 6c , the extension lengths of the first protruding region 2621 and the second protruding region 2622 may be formed differently from each other. For example, the length by which the second protruding region 2622 protrudes and extends in the height direction (e.g., z-axis direction) of the first frame 250 may be longer than the length by which the first protruding region 2621 protrudes and extends. The extension lengths of the first protruding region 2621 and the second protruding region 2622 may vary based on the shape of the first frame 250 (see Figure 5b ).

[0127] In an embodiment, the cross-section of the first protruding region 2621 and the second protruding region 2622 may refer to a cross-section formed substantially perpendicular to the z-axis direction in the first protruding region 2621 and the second protruding region 2622 .

[0128] exist Figure 6a , Figure 6b and Figure 6c , the cross-section of the first protruding area 2621 and the second protruding area 2622 is shown as a rectangular shape, however, this is exemplary and the cross-section of the first protruding area 2621 and the second protruding area 2622 is not limited thereto. For example, the cross-section of the first protruding area 2621 and / or the second protruding area 2622 may include a circular shape or a non-rectangular polygonal shape.

[0129] exist Figure 6a , Figure 6b and Figure 6c , the first protruding region 2621 and the second protruding region 2622 are shown as protruding and extending from one surface of the second frame 260 in the negative z-axis direction, but this is exemplary, and the direction in which each protruding region 2621 or 2622 extends is not limited thereto. For example, the first protruding region 2621 and the second protruding region 2622 may protrude and extend from the other surface of the second frame 260 in the positive z-axis direction. Alternatively, the first protruding region 2621 and the second protruding region 2622 may protrude and extend from one surface of the second frame 260 in the negative z-axis direction, and protrude and extend from the other surface of the second frame 260 in the positive z-axis direction.

[0130] In an implementation, the second frame 260 may include a metal having higher thermal conductivity than the metal included in the first frame 250. For example, the second frame 260 may include copper and / or a copper alloy.

[0131] In an embodiment, the second frame 260 may further include nanomaterials for improving thermal conductivity. For example, the second frame 260 may include graphite and / or graphene nanopowder based on copper and / or copper alloy to enhance thermal conductivity.

[0132] The electronic device 200 according to an embodiment of the present disclosure may include a heating unit 201 including an electronic component 220 that generates heat during operation of the electronic device 200 , and a heat dissipation structure 202 that supports the heating unit 201 .

[0133] In an embodiment, the heat dissipation structure 202 may include a first frame 250 including a first metal and a second frame 260 including a second metal, wherein at least a portion of the second frame 260 is disposed inside the first frame 250 , and at least a portion of the second frame 260 is exposed to the outside through a surface of the first frame 250 .

[0134] In an implementation, the second frame 260 may include a heat transfer portion 261 in contact with the heating unit 201 and a heat dissipation portion 262 disposed at a distance from the heating unit 201 .

[0135] In an embodiment, the heat transfer portion 261 may be used to receive heat generated by the electronic component 220 and transfer the heat to the heat dissipation portion 262 .

[0136] In an implementation, the second frame 260 may extend from the heat transfer portion 261 to the heat dissipation portion 262 .

[0137] In an implementation, the heating unit 201 may include a heat transfer member 240 that contacts the electronic component 220 on one surface and contacts the heat dissipation structure 202 on another surface, thereby transferring heat generated by the electronic component 220 to the heat dissipation structure 202 .

[0138] In an embodiment, the heating unit 201 may include a printed circuit board 210 on which the electronic component 220 is disposed, and a shielding can 230 including a shielding can opening 231 disposed at a position overlapping the electronic component 220 and disposed to surround the circumference of the electronic component 220 .

[0139] In an implementation, the heating unit 201 may include a heat transfer member 240 that transfers heat generated by the electronic component 220 to the heat dissipation structure 202 .

[0140] In an embodiment, the heat transfer member 240 may include: a first heat transfer member 241, which contacts the electronic component 220 at a position overlapping with the shielding can opening 231; and a second heat transfer member 242, which contacts the shielding can 230 and the first heat transfer member 241 on one surface and contacts the heat dissipation structure 202 on another surface.

[0141] In an embodiment, the heat dissipation part 262 of the second frame 260 may be formed with a larger surface area contacting the outside compared to other regions of the second frame 260 based on the same unit length.

[0142] In an embodiment, the surface area of ​​the heat dissipation portion 262 in contact with the outside is increased, and the heat dissipation portion 262 can easily dissipate the heat transferred from the electronic component 220 .

[0143] In an implementation, the heat dissipation portion 262 may include a plurality of protruding areas 2621 and 2622 that protrude and extend from one surface of the heat dissipation portion 262 in the height direction of the electronic device 200 .

[0144] In an embodiment, the heat dissipation portion 262 may include protruding regions 2621 and 2622 to increase a surface area in contact with the outside. In an embodiment, a plurality of protruding regions 2621 and 2622 may be provided to be spaced apart from each other.

[0145] In an implementation, the protruding regions 2621 and 2622 may include a rectangular shaped cross-section.

[0146] In an embodiment, the protruding areas 2621 and 2622 of the heat dissipation portion 262 may include a first protruding area 2621 positioned at a certain distance from the heat transfer portion 261 along the width direction of the electronic device 200 and a second protruding area 2622 positioned at a certain distance from the heat transfer portion 261 along the length direction of the electronic device 200.

[0147] In an embodiment, a length by which the first protruding region 2621 protrudes and extends in the height direction of the electronic device 200 and a length by which the second protruding region 2622 protrudes and extends in the height direction of the electronic device 200 may be formed differently from each other.

[0148] In an implementation, the first protruding region 2621 may extend in a length direction of the electronic device 200 , and the second protruding region 2622 may extend in a width direction of the electronic device 200 .

[0149] In an implementation, the thermal conductivity of the first metal may be formed to be lower than the thermal conductivity of the second metal.

[0150] In an implementation, the melting point of the first metal may be formed to be lower than the melting point of the second metal.

[0151] In an embodiment, the first frame 250 may be manufactured on the outer circumference of the second frame 260 using a die casting method.

[0152] In an embodiment, since the first metal included in the first frame 250 may have a lower melting point than the second metal included in the second frame 260 , the first frame 250 may be formed outside the second frame 260 by die casting while the second frame 260 is provided.

[0153] In an embodiment, the first frame 250 may be manufactured using metal injection molding.

[0154] In an embodiment, the first metal may include aluminum, magnesium, or zinc, and the second metal may include copper or a copper alloy.

[0155] In an implementation, the second frame 260 may include graphene nano powder to improve thermal conductivity.

[0156] In an embodiment, the heat dissipation structure 202 may include a first frame 250 including a first metal and a second frame 260 including a second metal, wherein at least a portion of the second frame 260 is disposed inside the first frame 250 , and at least a portion of the second frame 260 is exposed to the outside through a surface of the first frame 250 .

[0157] In an implementation, the second frame 260 may include a heat transfer portion 261 receiving heat generated by an external heat source and a heat dissipation portion 262 disposed at a distance from the external heat source.

[0158] The electronic device according to the embodiment of the present disclosure may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. The electronic device according to the embodiment of the present disclosure is not limited to the above-mentioned devices.

[0159] The embodiments of the present disclosure and the terms used in the embodiments are not intended to limit the technical features disclosed in the present disclosure to specific embodiments, but should be understood to include various changes, equivalents or replacements of the corresponding embodiments. In conjunction with the description of the accompanying drawings, similar reference numerals can be used for similar or related constituent elements. The nouns in the singular form corresponding to the term may include one or more items, unless the relevant context clearly indicates otherwise. As used herein, each phrase in the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding phrases in the multiple phrases. Terms such as "1st" and "2nd" or "first" and "second" can be used to simply distinguish the corresponding constituent element from another constituent element, and do not limit the constituent element in other aspects (e.g., importance or order). When a constituent element (e.g., a first constituent element) is referred to as being “combined with another constituent element (e.g., the second constituent element)”, “combined to another constituent element (e.g., the second constituent element)”, “connected with another constituent element (e.g., the second constituent element)”, or “connected to another constituent element (e.g., the second constituent element)”, with or without the terms “operably” or “communicatively”, it means that the constituent element may be directly (e.g., wired) connected to the other constituent element, wirelessly connected to the other constituent element, or connected to the other constituent element via a third constituent element.

[0160] The term "module" used in the embodiments of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "component," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, depending on the embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0161] The embodiments described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call and execute at least one of the one or more instructions stored in the storage medium. This enables the machine to operate to perform at least one function according to at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include a signal (e.g., an electromagnetic wave), but the term does not distinguish between data being semi-permanently stored in a storage medium and data being temporarily stored in a storage medium.

[0162] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be published in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be published online (e.g., downloaded or uploaded) via an application store (e.g., Play StoreTM), or may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). In the case of online publishing, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a manufacturer's server, an application store's server, or a memory of a forwarding server).

[0163] According to an embodiment, each constituent element (e.g., module or program) among the above-mentioned constituent elements may include a single object or multiple objects, and some of the multiple objects may be detachably arranged in different constituent elements. According to various embodiments, one or more constituent elements or operations among the above-mentioned constituent elements may be omitted, or one or more other constituent elements or operations may be added. Alternatively or additionally, multiple constituent elements (e.g., module or program) may be integrated into a single constituent element. In this case, the integrated constituent element may perform the one or more functions of each of the multiple constituent elements in the same or similar manner as the corresponding one of the multiple constituent elements before integration. According to an embodiment, the operations performed by a module, program or another constituent element may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

Claims

1. An electronic device (200), comprising: A heating unit (201) comprising an electronic component (220) in which heat is generated during operation of the electronic device; a heat dissipation structure (202) supporting the heating unit, The heat dissipation structure comprises: A first frame (250) comprising a first metal; as well as a second frame (260), at least a portion of which is disposed within the first frame and at least a portion of which is exposed to the outside through a surface of the first frame, and the second frame comprises a second metal, and The second frame includes a heat transfer portion (261) in contact with the heating unit and a heat dissipation portion (262) arranged at a certain distance from the heating unit, and the second frame extends from the heat transfer portion to the heat dissipation portion.

2. The electronic device according to claim 1, wherein the heating unit further comprises a heat transfer member (240) which contacts the electronic component on one surface and contacts the heat dissipation structure on another surface to transfer heat generated by the electronic component to the heat dissipation structure.

3. The electronic device according to any one of claims 1 or 2, wherein the heating unit further comprises: a printed circuit board (210), the electronic components being arranged on the printed circuit board; as well as The shielding can (230) comprises a shielding can opening (231), wherein the shielding can opening is arranged at a position overlapping with the electronic component and arranged to surround the outer circumference of the electronic component.

4. The electronic device according to claim 3, wherein the heating unit further comprises: a heat transfer member (240) configured to transfer heat generated by the electronic component to the heat dissipation structure, and Wherein the heat transfer member comprises: a first heat transfer member (241) in contact with the electronic component at a position overlapping with the opening of the shielding can; A second heat transfer member (242) contacts the shielding can and the first heat transfer member on one surface and contacts the heat dissipation structure on another surface. 5 . The electronic device according to claim 1 , wherein the heat dissipation portion of the second frame is formed with a larger surface area in contact with the outside than other areas of the second frame based on the same unit length.

6. The electronic device according to any one of claims 1 to 5, wherein the heat dissipation portion comprises a plurality of protruding areas (2621, 2622) protruding and extending from a surface of the heat dissipation portion in a height direction of the electronic device, and the plurality of protruding areas are arranged to be spaced apart from each other. The electronic device of claim 6 , wherein the protruding area comprises a rectangular shaped cross section.

8. The electronic device according to claim 6, wherein the protruding area of ​​the heat dissipation portion comprises: a first protruding area (2621) positioned at a distance from the heat transfer portion in a width direction of the electronic device; as well as A second protruding area (2622) is positioned at a distance from the heat transfer portion along the length direction of the electronic device. 9 . The electronic device according to claim 8 , wherein a length by which the first protruding region protrudes and extends in the height direction of the electronic device and a length by which the second protruding region protrudes and extends in the height direction of the electronic device are formed differently from each other. 10 . The electronic device according to claim 8 , wherein the first protruding region extends along the length direction of the electronic device, and the second protruding region extends along the width direction of the electronic device. 11 . The electronic device according to claim 1 , wherein the thermal conductivity of the first metal is formed to be lower than the thermal conductivity of the second metal, and the melting point of the first metal is formed to be lower than the melting point of the second metal. 12 . The electronic device according to claim 1 , wherein the first frame is manufactured on an outer circumference of the second frame using a die casting method. 13 . The electronic device according to claim 1 , wherein the first frame is manufactured using a metal injection molding method. 14 . The electronic device according to claim 1 , wherein the first metal comprises aluminum, magnesium, or zinc, and the second metal comprises copper or a copper alloy. 15 . The electronic device according to claim 1 , wherein the second frame comprises graphene nanopowder for improving thermal conductivity.

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