Optical module

Abstract

The optical module provided by the invention comprises an optical fiber adapter, an optical accommodating component and a light emitting component. The optical accommodation component includes a first housing and an optical assembly disposed within the first housing. A first connecting hole and a second connecting hole are formed in one side of the first shell; the first connecting hole is connected with the first light receiving component, and the second connecting hole is connected with the second light receiving component. The optical assembly comprises a first displacement prism, a reflector, a first optical filter, a wavelength division multiplexer and a second displacement prism, so that corresponding devices in the optical assembly can be utilized to correspondingly transmit optical receiving signals with different wavelengths input through the optical fiber adapter to the first optical receiving component or the second optical receiving component; and transmitting a light emitting signal generated by the light emitting component to the optical fiber adapter by using a corresponding device in the optical assembly, and outputting the light emitting signal through the optical fiber adapter. In this way, the optical module integrates receiving and transmitting of multi-wavelength optical signals, and the requirement for multiple transmission channels in the optical module is met.

Description

[0001] This application claims the priority of the Chinese Patent Application No. 2023115424975, filed with the Chinese Patent Office on November 17, 2023, the entire content of which is incorporated herein by reference; this application also claims the priority of the Chinese Patent Application No. 2024107656867, filed with the Chinese Patent Office on June 13, 2024, the entire content of which is incorporated herein by reference. Technical Field

[0002] The present disclosure relates to the field of optical fiber communication technologies, and particularly to an optical module. Background Art

[0003] With the development of new services and application models such as cloud computing, mobile Internet, and video, the development and progress of optical communication technologies have become increasingly important. In optical communication technologies, an optical module is a tool for realizing the mutual conversion between optical and electrical signals, and is one of the key components in optical communication devices. Moreover, with the development needs of optical communication technologies, the transmission rate of optical modules has been continuously increasing.

[0004] Currently, to improve the transmission rate of an optical module, multiple transmission channels are provided in the optical module, that is, the transmission capacity is increased through a multi-channel design in the optical module. However, when the number of transmission channels in the optical module increases, the number of involved components also increases, posing higher requirements for the packaging of the optical module. Summary of the Invention

[0005] Some embodiments provide an optical module that facilitates controlling the volume of the optical module and meets the requirements of multiple transmission channels of the optical module.

[0006] In some embodiments, an optical module is provided, including: an optical fiber adapter for transmitting optical emission signals and optical reception signals;

[0007] An optical accommodation component, including a first housing and an optical component disposed in the first housing, one end of the first housing being connected to the optical fiber adapter; a first connection hole and a second connection hole are formed on the first housing; the first connection hole is connected to a first optical reception component, and the second connection hole is connected to a second optical reception component;

[0008] An optical emission component, one end of which is connected to the other end of the first housing; the optical emission signal generated by the optical emission component is transmitted to the optical fiber adapter through the first housing;

[0009] Wherein, the optical component includes:

[0010] A first displacement prism, the first reflection surface of the first displacement prism being located on the transmission optical path of the optical fiber adapter;

[0011] A first filter, located on the reflection optical path of the reflected light from the second reflection surface of the first displacement prism;

[0012] The first reflector, located on the reflection optical path of the first filter;

[0013] The wavelength division multiplexer has an incident light port formed on the first side and a first output end and a second output end formed on the second side; the incident light port is located on the reflection optical path of the reflector;

[0014] The second displacement prism, the first emission surface of the second displacement prism is located on the output optical path of the first output end;

[0015] The first optical receiving component is located on the reflection optical path of the second emission surface of the second displacement prism; the second optical receiving component is located on the output optical path of the second output end.

[0016] One of the above technical solutions has the following advantages or beneficial effects: One end of the first housing is connected to the fiber optic adapter, the side of the first housing is connected to the first optical receiving component and the second optical receiving component, and the receiving optical paths of the first optical receiving component and the second optical receiving component are not parallel to the output optical path of the fiber optic adapter. An optical component including a first displacement prism, a reflector, a first filter, a wavelength division multiplexer and a second displacement prism is arranged inside the first housing. The incident light port of the wavelength division multiplexer faces away from the first optical receiving component and the second optical receiving component, and the output ends of the wavelength division multiplexer face the first optical receiving component and the second optical receiving component. The optical receiving signal is input into the first housing through the fiber optic adapter, transmitted to the first filter through the first displacement prism, reflected by the first filter and transmitted to the first reflector, and then reflected by the first reflector and transmitted to the wavelength division multiplexer. The wavelength division multiplexer transmits the optical receiving signal corresponding to the wavelength to the first optical receiving component or the second optical receiving component according to the wavelength of the optical receiving signal. The optical emission signal generated by the optical emission component is transmitted to the first housing and then transmitted to the fiber optic adapter through the first housing, so that the fiber optic adapter can transmit the optical receiving signal and the optical emission signal.

[0017] When the optical receiving signal includes a fourth wavelength optical signal and a fifth wavelength optical signal, the wavelength division multiplexer outputs the fourth wavelength optical signal through the first output end, and the wavelength division multiplexer outputs the fifth wavelength optical signal through the second output end. The fourth wavelength optical signal is transmitted to the first optical receiving component through the second displacement prism, and the fifth wavelength optical signal is transmitted to the second optical receiving component. The optical emission component can generate a first wavelength optical signal and a second wavelength optical signal. In this way, the optical module can integrate the reception and emission of multi-wavelength optical signals to meet the requirements of multiple transmission channels in the optical module.

[0018] In some embodiments, an optical module is provided, and a first accommodation cavity, a second accommodation cavity and a third accommodation cavity are formed inside the first housing;

[0019] The second accommodation cavity extends along one side of the first housing. A first baffle is provided between the first accommodation cavity and the second accommodation cavity. A first through cavity is formed in the first baffle. The first accommodation cavity communicates with the second accommodation cavity through the first through cavity. The first connection hole and the second connection hole are respectively connected to the second accommodation cavity, and the second displacement prism is located in the second accommodation cavity;

[0020] The third accommodation cavity is located on the side of the other end of the first housing. A second baffle is provided between the first accommodation cavity and the third accommodation cavity. A second through cavity is formed in the second baffle. A fifth connection hole is formed on the side wall of the other end of the first housing, and the fifth connection hole communicates with the third accommodation cavity;

[0021] The optical component further includes a fourth displacement prism, and the fourth displacement prism is disposed in the third accommodation cavity. One end of the fourth displacement prism is located on the side of the fifth connection hole, and the other end of the fourth displacement prism is located on the side of the first filter.

[0022] One of the above technical solutions has the following advantages or beneficial effects: The first baffle and the second baffle divide the inner cavity of the first housing into a first accommodation cavity, a second accommodation cavity and a third accommodation cavity, which is convenient for assembling corresponding devices in the optical component into the first housing. The first baffle and the second baffle can be used for optical isolation to reduce optical crosstalk.

[0023] In some embodiments, an optical module is provided. The optical transmitting component includes a second housing, a first laser component and a second laser component, a first adapter board and a second adapter board disposed in the second housing. A plurality of rows of pins are provided on the third side wall of the second housing. The bottom row of pins on the third side wall includes a first high-frequency pin and a second high-frequency pin. One end of the first high-frequency pin and one end of the second high-frequency pin pass through the third side wall and extend into the second housing. The first laser component generates a first-wavelength optical signal, and the second laser component generates a second-wavelength optical signal;

[0024] The first adapter board and the second adapter board are disposed on the side of the third side wall. The first laser component is located on the side of the first adapter board, the second laser component is located on the side of the second adapter board, and the first laser component and the second laser component are distributed on the sides of two connected side walls of the second housing;

[0025] A first high-frequency transmission line is provided on the first adapter board, and a second high-frequency transmission line is provided on the second adapter board. The first laser component and the first high-frequency pin are respectively electrically connected to the first high-frequency transmission line, and the second laser component and the second high-frequency pin are respectively electrically connected to the second high-frequency transmission line.

[0026] One of the above technical solutions has the following advantages or beneficial effects: The first laser component and the second laser component are arranged in the second housing. The first high-frequency pin and the second high-frequency pin are arranged on the side wall of the second housing. The first laser component is connected to the first high-frequency pin through the first adapter board, and the second laser component is connected to the second high-frequency pin through the second adapter board. It is convenient to realize the electrical connection between the laser component and the high-frequency pin, and it is convenient to realize the impedance continuity of the high-frequency transmission link through the first adapter board and the second adapter board.

[0027] In some embodiments, an optical module is provided. A plurality of rows of pins are arranged on the fourth side wall of the second housing, and the second laser component is arranged on the side of the fourth side wall;

[0028] A third adapter board is further arranged in the second housing. The third adapter board is arranged between the second laser component and the second adapter board and the third adapter board is located at the edge of the connection of two adjacent side walls of the second housing. A third high-frequency transmission line is arranged on the third adapter board. One end of the third high-frequency transmission line is wire-bonded to the second laser component, and the other end of the third high-frequency transmission line is wire-bonded to the second high-frequency transmission line.

[0029] One of the above technical solutions has the following advantages or beneficial effects: A plurality of rows of pins are arranged on the fourth side wall, and the second laser component is arranged on the side of the fourth side wall, which is convenient to realize the electrical connection between the second laser component and the pins. A third adapter board is arranged between the second laser component and the second adapter board to realize the connection between the second laser component and the second adapter board through the third adapter board, which is convenient to control the wire-bonding length between the second laser component and the second adapter board to reduce the parasitic inductance and ensure the high-frequency signal transmission quality.

[0030] In some embodiments, an optical module is provided. The third side wall is provided with a first step surface and a first side surface. The bottom of the first side surface is connected to the first step surface. The first adapter board and the second adapter board are arranged on the first step surface. One end of the first high-frequency pin passes through the first side surface and extends above the first adapter board, and one end of the second high-frequency pin passes through the first side surface and extends above the second adapter board;

[0031] The first high-frequency pin is soldered to the first high-frequency transmission line, and the second high-frequency pin is soldered to the second high-frequency transmission line.

[0032] One of the above technical solutions has the following advantages or beneficial effects: A first stepped surface and a first side surface are formed on the side wall of the second housing to facilitate the arrangement of the first adapter board and the second adapter board in the second housing. The first adapter board and the second adapter board are arranged on the first stepped surface, which can be close to the first high-frequency pin and the second high-frequency pin, facilitating the electrical connection between the first high-frequency pin and the first adapter board, and facilitating the electrical connection between the second high-frequency pin and the second adapter board. Moreover, it can reduce the distance between the first high-frequency pin and the first adapter board and reduce the distance between the second high-frequency pin and the second adapter board, ensuring the quality of high-frequency signal transmission.

[0033] In some embodiments, an optical module is provided. A first ground layer and a second ground layer are arranged on the front surface of the first adapter board, and a ground layer is arranged on the back surface of the first adapter board; the first ground layer is arranged on one side of the first high-frequency transmission line, and the second ground layer is arranged on the other side of the first high-frequency transmission line; the first ground layer and the second ground layer are respectively connected to the ground layer through vias, and the ground layer is electrically connected to the first stepped surface.

[0034] One of the above technical solutions has the following advantages or beneficial effects: The first ground layer and the second ground layer on the front surface of the first adapter board and the ground layer on the back surface of the first adapter board enable the first high-frequency transmission line to have sufficient ground, so as to reduce the interference suffered by the first high-frequency transmission line when transmitting high-frequency signals.

[0035] In some embodiments, an optical module is provided. A TEC, a support plate, and a fourth adapter board are further arranged in the second housing. The bottom of the TEC is connected to the bottom plate of the second housing, and the support plate is arranged on the top of the TEC. The support plate supports the first laser assembly, the second laser assembly, and the fourth adapter board;

[0036] A first TEC pad and a second TEC pad are arranged on the TEC, and the first TEC pad and the second TEC pad are arranged on the side of the second side wall of the second housing;

[0037] A first metal layer and a second metal layer are arranged on the fourth adapter board. A first TEC pin and a second TEC pin are further arranged on the third side wall. The first metal layer is respectively wire-bonded to the first TEC pad and the first TEC pin, and the second metal layer is respectively wire-bonded to the second TEC pad and the second TEC pin.

[0038] One of the above technical solutions has the following advantages or beneficial effects: A first metal layer and a second metal layer are arranged on the fourth adapter board to realize the electrical connection from the TEC pad to the TEC pin through the fourth adapter board, reduce the wire-bonding length from the TEC pad to the TEC pin, and improve the electrical connection stability from the TEC pad to the TEC pin.

[0039] In some embodiments, an optical module is provided, including: an optical fiber adapter for transmitting an optical emission signal and an optical reception signal;

[0040] an optical accommodating component including a first housing and an optical component disposed within the first housing, one end of the first housing being connected to the optical fiber adapter; a second connection hole and a third connection hole are formed on the first housing; the second connection hole is connected to a second optical reception component, and the third connection hole is connected to a third optical reception component;

[0041] an optical emission component, one end of which is connected to the other end of the first housing; the optical emission signal generated by the optical emission component is transmitted to the optical fiber adapter through the first housing;

[0042] wherein, the optical component includes:

[0043] a first displacement prism, a first reflection surface of the first displacement prism being located on the transmission optical path of the optical fiber adapter;

[0044] a first filter, being located on the reflection optical path of the second reflection surface of the first displacement prism;

[0045] a first mirror, being located on the reflection optical path of the first filter;

[0046] a wavelength division multiplexer, having an incident light port formed on a first side, and a second output end and a third output end formed on a second side; the incident light port is located on the reflection optical path of the mirror;

[0047] a third displacement prism, a first reflection surface of the third displacement prism being located on the output optical path of the third output end;

[0048] the second optical reception component is located on the output optical path of the second output end, and the third optical reception component is located on the reflection optical path of the second reflection surface of the third displacement prism.

[0049] One of the above technical solutions has the following advantages or beneficial effects: One end of the first housing is connected to an optical fiber adapter, and the side of the first housing is connected to a second optical receiving component and a third optical receiving component. The receiving optical paths of the second optical receiving component and the third optical receiving component are not parallel to the output optical path of the optical fiber adapter. An optical component including a first displacement prism, a first mirror, a first filter, a wavelength division multiplexer, and a third displacement prism is disposed inside the first housing. The light input port of the wavelength division multiplexer faces away from the second optical receiving component and the third optical receiving component, and the output end of the wavelength division multiplexer faces the second optical receiving component and the third optical receiving component. The received optical signal is input into the first housing through the optical fiber adapter, transmitted to the first filter through the first displacement prism, reflected and transmitted to the first mirror through the first filter, and reflected and transmitted to the wavelength division multiplexer through the first mirror. The wavelength division multiplexer transmits the received optical signal corresponding to the wavelength to the first optical receiving component or the second optical receiving component according to the wavelength of the received optical signal. The optical emission signal generated by the optical emission component is transmitted to the first housing and then transmitted to the optical fiber adapter through the first housing, so that the optical fiber adapter can transmit the received optical signal and the optical emission signal.

[0050] When the received optical signal includes a fifth wavelength optical signal and a sixth wavelength optical signal, the wavelength division multiplexer outputs the fifth wavelength optical signal through the second output end, and the wavelength division multiplexer outputs the sixth wavelength optical signal through the third output end. The fifth wavelength optical signal is transmitted to the second optical receiving component, and the fourth wavelength optical signal is transmitted to the third optical receiving component through the third displacement prism. The optical emission component can generate a first wavelength optical signal and a third wavelength optical signal. In this way, multiple wavelength optical signal reception and emission can be integrated in the optical module to meet the requirements of multiple transmission channels in the optical module.

[0051] In some embodiments, an optical module is provided, including: an optical fiber adapter for transmitting an optical emission signal and a received optical signal;

[0052] An optical accommodating component, including a first housing and an optical component disposed inside the first housing; a fourth connection hole is formed at one end of the first housing, and the fourth connection hole communicates with the optical fiber adapter; a fifth connection hole is formed at the other end of the first housing; a first connection hole and a second connection hole are formed on the first housing; the first connection hole is connected to a first optical receiving component, and the second connection hole is connected to a second optical receiving component;

[0053] Wherein, the optical component includes:

[0054] A wavelength division multiplexer, having a light input port and a fifth output end formed on a first side, and a light port and a fourth output end formed on a second side; the light input port is on the transmission optical path of the fourth connection hole, and the light port is on the transmission optical path of the fifth connection hole;

[0055] The second reflector is located on the output optical path of the fourth output end;

[0056] The third reflector is located on the output optical path of the fifth output end;

[0057] The optical transmitting component is connected to the other end of the first housing at one end; the optical transmission signal generated by the optical transmitting component is transmitted to the first housing through the fifth connection hole and then transmitted to the fiber optic adapter through the wavelength division multiplexer;

[0058] The first optical receiving component is located on the reflected optical path of the second reflector, and the second optical receiving component is located on the reflected optical path of the third reflector.

[0059] One of the above technical solutions has the following advantages or beneficial effects: One end of the first housing is connected to the fiber optic adapter, the sides of the first housing are connected to the first optical receiving component and the second optical receiving component, and the receiving optical paths of the first optical receiving component and the second optical receiving component are not parallel to the output optical path of the fiber optic adapter. An optical component including a wavelength division multiplexer, a second reflector, and a third reflector is disposed inside the first housing. The first side of the wavelength division multiplexer faces the fiber optic adapter, the second side of the wavelength division multiplexer faces away from the fiber optic adapter, and neither the first optical receiving component nor the second optical receiving component is on the side of the first side or the second side. The optical receiving signal is input into the first housing through the fiber optic adapter and then transmitted to the wavelength division multiplexer. The wavelength division multiplexer transmits the optical receiving signal corresponding to the wavelength to the first optical receiving component or the second optical receiving component according to the wavelength of the optical receiving signal. The optical transmission signal generated by the optical transmitting component is transmitted to the first housing and then transmitted to the fiber optic adapter through the wavelength division multiplexer, so that the fiber optic adapter can transmit the optical receiving signal and the optical transmission signal.

[0060] When the optical receiving signal includes a fourth wavelength optical signal and a fifth wavelength optical signal, the wavelength division multiplexer outputs the fourth wavelength optical signal through the fourth output end, and the wavelength division multiplexer outputs the fifth wavelength optical signal through the fifth output end. The fourth wavelength optical signal is reflected by the third reflector and transmitted to the first optical receiving component, and the fifth wavelength optical signal is reflected by the second reflector and transmitted to the second optical receiving component. The optical transmitting component can generate a first wavelength optical signal and a second wavelength optical signal. In this way, the optical module can integrate the reception and transmission of multi-wavelength optical signals to meet the requirements of multi-transmission channels in the optical module.

[0061] In some embodiments, an optical module is provided, including: a fiber optic adapter for transmitting an optical transmission signal and an optical receiving signal;

[0062] An optical accommodation component, comprising a first housing and an optical component disposed within the first housing; one end of the first housing is formed with a fourth connection hole, and the fourth connection hole communicates with the fiber optic adapter; the other end of the first housing is formed with a fifth connection hole; the first housing is formed with a first connection hole and a second connection hole; the first connection hole is connected to a first optical receiving component, and the second connection hole is connected to a second optical receiving component;

[0063] Wherein, the optical component includes:

[0064] A wavelength division multiplexer, having an incident light port and a seventh output end formed on a first side, and an eighth output end formed on a second side; the first side is close to one end of the first housing;

[0065] A first filter, located on the side of the first side and on the transmission optical path of the fourth connection hole;

[0066] A first reflector, located on the side of the first side and on the reflection optical path of the first filter;

[0067] A fifth reflector, located on the side of the first side and on the reflection optical path of the first reflector; the incident light port is located on the reflection optical path of the fifth reflector;

[0068] A sixth reflector, located on the output optical path of the seventh output end;

[0069] A beam splitting prism, located on the output optical path of the eighth output end;

[0070] An optical transmitting component, one end of which is connected to the other end of the first housing; the optical transmission signal generated by the optical transmitting component passes through the first housing, and the optical transmission signal passes through the first filter and is transmitted to the fiber optic adapter;

[0071] The first optical receiving component is located on the reflection optical path of the sixth reflector, and the second optical receiving component is located on the reflection optical path of the beam splitting prism.

[0072] One of the above technical solutions has the following advantages or beneficial effects: One end of the first housing is connected to an optical fiber adapter, and the sides of the first housing are connected to a first optical receiving component and a second optical receiving component. The receiving optical paths of the first optical receiving component and the second optical receiving component are not parallel to the output optical path of the optical fiber adapter. An optical component including a wavelength division multiplexer, a first filter, a first mirror, a fifth mirror, a sixth mirror, and a beam splitter prism is disposed inside the first housing. The first side of the wavelength division multiplexer faces the optical fiber adapter, and the second side of the wavelength division multiplexer faces away from the optical fiber adapter. Neither the first optical receiving component nor the second optical receiving component is on the side of the first side or the second side. The received optical signal is input into the first housing through the optical fiber adapter and reaches the first filter, is reflected by the first filter and transmitted to the first mirror, is reflected by the first mirror and transmitted to the fifth mirror, and is reflected by the fifth mirror and transmitted to the wavelength division multiplexer. The wavelength division multiplexer transmits the received optical signal corresponding to the wavelength to the first optical receiving component or the second optical receiving component according to the wavelength of the received optical signal. The optical transmission signal generated by the optical transmission component is transmitted to the first housing and then transmitted to the optical fiber adapter through the wavelength division multiplexer, so that the optical fiber adapter can transmit the received optical signal and the optical transmission signal.

[0073] When the received optical signal includes a fourth wavelength optical signal and a fifth wavelength optical signal, the wavelength division multiplexer outputs the fourth wavelength optical signal through a seventh output end, and the wavelength division multiplexer outputs the fifth wavelength optical signal through an eighth output end. The fourth wavelength optical signal is reflected by the sixth mirror and transmitted to the first optical receiving component, and the fifth wavelength optical signal is reflected by the beam splitter prism and transmitted to the second optical receiving component. The optical transmission component can generate a first wavelength optical signal and a second wavelength optical signal. In this way, the optical module can integrate the reception and transmission of multi-wavelength optical signals to meet the requirements of multiple transmission channels in the optical module. Brief Description of the Drawings

[0074] To more clearly illustrate the technical solutions in the present disclosure, the drawings required for some embodiments will be briefly introduced below. Obviously, the drawings in the following description are only the drawings of some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams and are not limitations on the actual sizes of the products, the actual processes of the methods, the actual timings of the signals, etc. involved in the embodiments of the present disclosure.

[0075] Figure 1 It is a partial architecture diagram of an optical communication system according to some embodiments;

[0076] Figure 2 It is a partial structure diagram of a host computer according to some embodiments;

[0077] Figure 3Structural diagram of an optical module according to some embodiments;

[0078] Figure 4 Exploded view of an optical module according to some embodiments;

[0079] Figure 5A Internal structure of an optical module according to some embodiments Figure 1 ;

[0080] Figure 5B Internal structure of an optical module according to some embodiments Figure 2 ;

[0081] Figure 6 Internal structural diagram of another optical module according to some embodiments;

[0082] Figure 7A Exploded view of the internal structure of an optical module according to some embodiments;

[0083] Figure 7B Exploded view of the internal structure of another optical module according to some embodiments;

[0084] Figure 8A Exploded view of an optical fiber adapter and a first housing according to some embodiments;

[0085] Figure 8B Cross-sectional view of the internal structure of an optical module according to some embodiments;

[0086] Figure 9A Structure of a first housing according to some embodiments Figure 1 ;

[0087] Figure 9B Exploded view of a first housing according to some embodiments;

[0088] Figure 9C Structure of a first housing according to some embodiments Figure 2 ;

[0089] Figure 9D Usage state of a first housing according to some embodiments Figure 1 ;

[0090] Figure 9E Usage state of a first housing according to some embodiments Figure 2 ;

[0091] Figure 10A Cross-sectional view of an optical accommodation component according to some embodiments;

[0092] Figure 10BCross-sectional view of another optical housing component according to some embodiments;

[0093] Figure 11A Exploded view of the internal structure of an optical module according to some embodiments;

[0094] Figure 11B Exploded view of another internal structure of an optical module according to some embodiments;

[0095] Figure 12A Structural diagram of another first housing according to some embodiments;

[0096] Figure 12B Cross-sectional view of another first housing according to some embodiments;

[0097] Figure 13A Diagram of the usage state of another first housing according to some embodiments;

[0098] Figure 13B Usage state of the optical component within another first housing according to some embodiments Figure 1 ;

[0099] Figure 13C Usage state of the optical component within another first housing according to some embodiments Figure 2 ;

[0100] Figure 14A Cross-section of another optical housing component according to some embodiments Figure 1 ;

[0101] Figure 14B Cross-section of another optical housing component according to some embodiments Figure 2 ;

[0102] Figure 15A Diagram of the usage state of another first housing according to some embodiments;

[0103] Figure 15B Diagram of the usage state of the optical component within another optical module according to some embodiments;

[0104] Figure 16A Structure of an optical emission component according to some embodiments Figure 1 ;

[0105] Figure 16B Structure of an optical emission component according to some embodiments Figure 2 ;

[0106] Figure 16C Exploded view of an optical emission component according to some embodiments;

[0107] Figure 17A The partial structure of an optical emission component according to some embodiments Figure 1 ;

[0108] Figure 17B The partial structure of an optical emission component according to some embodiments Figure 2 ;

[0109] Figure 17C The partial structure of an optical emission component according to some embodiments Figure 3 ;

[0110] Figure 17D The cross-section of an optical emission component according to some embodiments Figure 1 ;

[0111] Figure 17E The cross-section of an optical emission component according to some embodiments Figure 2 ;

[0112] Figure 17F The cross-section of an optical emission component according to some embodiments Figure 3 ;

[0113] Figure 18A The transmission optical path diagram of an optical emission signal according to some embodiments;

[0114] Figure 18B Another transmission optical path diagram of an optical emission signal according to some embodiments;

[0115] Figure 19A The structure of a mounting bracket according to some embodiments Figure 1 ;

[0116] Figure 19B The second illustration of the structure of a mounting bracket according to some embodiments;

[0117] Figure 20A Another partial structure of an optical emission component according to some embodiments Figure 1 ;

[0118] Figure 20B Another partial structure of an optical emission component according to some embodiments Figure 2 ;

[0119] Figure 21A The exploded view of another optical emission component according to some embodiments;

[0120] Figure 21B The structure diagram of another multiplexing component according to some embodiments;

[0121] Figure 21C The cross-sectional view of another multiplexing component according to some embodiments. Detailed implementation manners

[0122] The following will clearly and in detail describe some embodiments of the present disclosure with reference to the accompanying drawings. However, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided by the present disclosure fall within the scope of protection of the present disclosure.

[0123] Unless otherwise required by the context, throughout the specification and claims, the term "comprising" is interpreted in an open, inclusive sense, i.e., "including, but not limited to"; the terms "first" and "second" cannot be construed as indicating or implying relative importance or an upper limit on quantity; the term "plurality" means two or more; the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or integrated, can be directly connected, or indirectly connected through an intermediate medium; the use of the term "adapted to" or "configured to" implies open and inclusive language, which does not exclude a device adapted to or configured to perform additional tasks or steps; descriptions such as "parallel", "perpendicular", "same", "consistent", "flush", etc. do not limit to absolute mathematical theory relationships, but also include an acceptable error range in practice, and also include differences formed due to manufacturing reasons based on the same design concept.

[0124] In optical communication technology, in order to establish information transmission between information processing devices, information is loaded onto light and the information is transmitted using the propagation speed of light. This light loaded with information is an optical signal. When the optical signal is transmitted in an optical information transmission device, the loss of optical power can be reduced, and long-distance transmission of the optical signal can be achieved. At the same time, the cost of optical information transmission devices such as optical fibers is lower than that of electrical information transmission devices such as copper wires. Therefore, optical communication technology can achieve high-speed, long-distance, and low-cost information transmission.

[0125] Information processing devices generally include an Optical Network Unit (ONU), a gateway, a router, a switch, a mobile phone, a computer, a server, a tablet computer, a television, etc. Optical information transmission devices generally include optical fibers and optical waveguides, etc. The signals that information processing devices can recognize and process are electrical signals, while optical communication technology uses optical signals for transmission and requires an optical module to convert optical signals and electrical signals with each other.

[0126] An optical module can implement the mutual conversion between optical signals and electrical signals between an information processing device and an optical information transmission device. In some embodiments, at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; the first optical signal from the optical fiber is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber.

[0127] Since information can be transmitted between multiple information processing devices through electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all the information processing devices being directly connected to the optical module. Here, the information processing device directly connected to the optical module is also referred to as the host computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module is called an optical port, and the electrical signal input end or the electrical signal output end of the optical module is called an electrical port.

[0128] Figure 1 It is a partial structural diagram of an optical communication system according to some embodiments. As Figure 1 shown, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100 of the optical module, an optical module 200, an optical fiber 101, and a network cable 103, where the optical fiber 101 belongs to an optical information transmission device and the network cable 103 belongs to an electrical information transmission device.

[0129] In some embodiments, one end of the optical fiber 101 extends in the direction of the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. Optical signals can undergo total internal reflection in the optical fiber 101, and the propagation of optical signals in the direction of total internal reflection can almost maintain the original optical power. The optical signals undergo multiple total internal reflections in the optical fiber 101 to transmit the optical signals from the remote information processing device 1000 to the optical module 200, or to transmit the optical signals from the optical module 200 to the remote information processing device 1000, thereby achieving long-distance information transmission based on low power loss.

[0130] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fiber 101 is detachably connected to the optical module 200; in some embodiments, the optical fiber 101 is non-detachably connected to the optical module 200.

[0131] The host computer 100 is configured to provide a data signal to the optical module 200, or receive a data signal from the optical module 200, or monitor or control the working state of the optical module 200.

[0132] The host computer 100 includes a housing for accommodating the optical module 200, and an optical module interface 102 provided on the housing. The optical module 200 is inserted into the housing through the optical module interface 102, so that a unidirectional or bidirectional electrical signal connection is established between the host computer 100 and the optical module 200.

[0133] The host computer 100 further includes an external electrical interface, which can access an electrical signal network. In some embodiments, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access the network cable 103, so that a unidirectional or bidirectional electrical signal connection is established between the host computer 100 and the network cable 103.

[0134] One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. In some embodiments, the third electrical signal sent by the local information processing device 2000 is transmitted into the host computer 100 through the network cable 103, the host computer 100 generates a second electrical signal according to the third electrical signal, the second electrical signal from the host computer 100 is transmitted to the optical module 200, the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted in the optical fiber 101 to the remote information processing device 1000.

[0135] In some embodiments, the first optical signal from the remote information processing device 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted to the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal to the host computer 100, the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal into the local information processing device 2000.

[0136] In some embodiments, the optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the above conversion process of optical signals and electrical signals, the information does not change, but the encoding or decoding method of the information changes.

[0137] In addition to including an optical network terminal, the host computer 100 further includes an Optical Line Terminal (OLT), an Optical Network Terminal (ONT), or a data center server, etc.

[0138] Figure 2It is a partial structure diagram of a host computer according to some embodiments. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 only the structure of the host computer 100 related to the optical module 200 is shown. As Figure 2 shown, in some embodiments, the host computer 100 further includes a PCB circuit board 105 disposed in the accommodation cavity, and a cage 106 disposed on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and fixed by the cage 106;

[0139] In some embodiments, a heat sink 107 is disposed on the cage 106, which can dissipate heat for the optical module; in some embodiments, the heat sink 107 has raised structures such as fins to increase the heat dissipation area.

[0140] In some embodiments, an electrical connector is disposed inside the cage 106, and the electrical connector is configured to access the electrical port of the optical module 200.

[0141] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the heat sink 107.

[0142] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so as to establish an electrical signal connection between the optical module 200 and the host computer 100.

[0143] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101, so as to establish an optical signal connection between the optical module 200 and the optical fiber 101.

[0144] Figure 3 It is a structure diagram of an optical module according to some embodiments, Figure 4 It is an exploded view of an optical module according to some embodiments. As Figure 3 and Figure 4 shown, in some embodiments, the optical module 200 includes a shell, and the shell includes an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202 to form two openings 204 and 205, one of which is an electrical port and the other is an optical port. In some embodiments, the shell forms an opening, which is both an electrical port and an optical port.

[0145] In some embodiments, the upper shell 201 and the lower shell 202 are made of a metal material, which is beneficial to realizing electromagnetic shielding and heat dissipation.

[0146] Adopting the assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the optical emission component 400, the optical reception component 500, etc. into the above-mentioned housing, and the upper housing 201 and the lower housing 202 can encapsulate and protect the above-mentioned devices.

[0147] The direction of the line connecting the two openings 203 and 204 can be the same as the length direction of the optical module 200, or can be different from the length direction of the optical module 200. For example, the opening 203 is located at the end of the optical module 200 ( Figure 3 at the right end), and the opening 204 is also located at the end of the optical module 200 ( Figure 3 at the left end). Or, the opening 203 is located at the end of the optical module 200, while the opening 204 is located at the side of the optical module 200.

[0148] In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower housing 202 to form the above-mentioned housing.

[0149] In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to realize the upper housing 201 covering the lower housing 202.

[0150] Such as Figure 3 and Figure 4As shown, in some embodiments, the optical module includes a circuit board 300 disposed within a housing. The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. The electronic components may include, for example, capacitors, resistors, triodes, and Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs). The chips may include a Microcontroller Unit (MCU), a laser driver chip, a Transimpedance Amplifier (TIA), a Limiting Amplifier (LA), a Clock and Data Recovery (CDR) chip, a power management chip, and a Digital Signal Processing (DSP) chip.

[0151] In some embodiments, the circuit board may include a rigid circuit board. Due to its relatively rigid material, the rigid circuit board can also achieve a bearing function. For example, the rigid circuit board can stably bear the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into an electrical connector in the cage 106 of the host computer 100.

[0152] In some embodiments, the circuit board may further include a flexible circuit board. The flexible circuit board can be used independently; it can also be used in cooperation with the rigid circuit board.

[0153] In some embodiments, a gold finger is formed on the surface of the end of the circuit board 300. The gold finger is composed of a plurality of independent pins.

[0154] In some embodiments, the gold finger 310 is disposed on the surface of one side of the circuit board 300 (such as Figure 4 the upper surface shown); in some implementations, the gold finger 301 is disposed on the surfaces of both the upper and lower sides of the circuit board 300 to provide a larger number of pins, so as to adapt to occasions with a large demand for the number of pins.

[0155] In some implementations, the gold finger of the circuit board extends out from the electrical port 204 and is inserted into the electrical connector of the host computer 100; the circuit board is inserted into the cage 106, and the gold finger 301 is electrically connected to the electrical connector within the cage 106. The gold finger 301 is configured to establish an electrical connection with the host computer and can achieve electrical connection functions such as power supply, grounding, Inter-Integrated Circuit (I2C) signal transmission, and data signal transmission.

[0156] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0157] For example, the unlocking component 600 is located outside the two lower side plates 2022 of the lower housing 202 and includes an engaging component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the optical module 200 is fixed in the cage 106 by the engaging component of the unlocking component 600; when the unlocking component 600 is pulled, the engaging component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the engaging component and the host computer to release the fixation of the optical module 200 to the host computer, so that the optical module 200 can be withdrawn from the cage 106.

[0158] In some embodiments, the optical module 200 includes an optical receiving component that may be provided on the optical accommodating component 500. Exemplarily, one or more optical receiving components may be provided on the optical accommodating component 500.

[0159] In some embodiments, the optical module 200 includes an optical transmitting component 400. The optical transmitting component 400 may be connected to the optical accommodating component 500.

[0160] In some embodiments, the optical transmitting component 400 and the optical accommodating component 500 are physically separated from the circuit board 300 respectively, and the optical transmitting component 400 and the optical accommodating component 500 may be electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors respectively.

[0161] In some embodiments, one end of the optical accommodating component 500 may be connected to the fiber optic adapter 700, and the other end of the optical accommodating component 500 may be connected to the optical transmitting component 400. The transmitted optical signal generated by the optical transmitting component 400 is first transmitted into the optical accommodating component 500, then transmitted to the fiber optic adapter 700 through the optical accommodating component 500, and finally output through the fiber optic adapter 700; the received optical signal input from the outside is input into the optical accommodating component 500 through the fiber optic adapter 700, so that both the transmitted optical signal and the received optical signal pass through the fiber optic adapter 700, and further the upstream optical signal and the downstream optical signal of the optical module share the optical fiber 101.

[0162] In some embodiments, the optical emission component 400 can generate optical emission signals of multiple wavelengths and can combine the optical emission signals of multiple wavelengths into a single optical emission signal; multiple optical reception components can be disposed on the optical accommodation component 500, enabling the optical accommodation component 500 to receive optical reception signals including multiple wavelengths. Exemplarily, the optical emission component 400 generates optical emission signals of three wavelengths, and the rates of the optical emission signals of the three wavelengths are different, such as a first-wavelength optical signal, a second-wavelength optical signal, and a third-wavelength optical signal with different rates; the optical accommodation component 500 can receive optical reception signals of three wavelengths, and the rates of the optical reception signals of the three wavelengths are different, such as a fourth-wavelength optical signal, a fifth-wavelength optical signal, and a sixth-wavelength optical signal with different rates.

[0163] In some embodiments, the wavelength range of the first-wavelength optical signal is 1340 - 1344 nm, such as the wavelength of the first-wavelength optical signal being 1342 nm; the wavelength range of the second-wavelength optical signal is 1575 - 1580 nm, such as the wavelength of the second-wavelength optical signal being 1577 nm; the wavelength range of the third-wavelength optical signal is 1480 - 1500 nm, such as the wavelength of the third-wavelength optical signal being 1490 nm; the wavelength range of the fourth-wavelength optical signal is 1260 - 1280 nm, such as the wavelength of the fourth-wavelength optical signal being 1270 nm; the wavelength range of the fifth-wavelength optical signal is 1284 - 1288 nm, such as the wavelength of the fifth-wavelength optical signal being 1286 nm; the wavelength range of the sixth-wavelength optical signal is 1290 - 1330 nm, such as the wavelength of the sixth-wavelength optical signal being 1310 nm.

[0164] In some embodiments, the optical emission component 400 can generate optical emission signals of two wavelengths, and the rates of the optical emission signals of the two wavelengths can be different. For example, the optical emission component 400 can generate a first-wavelength optical signal and a second-wavelength optical signal with different rates, or the optical emission component 400 can generate a first-wavelength optical signal and a third-wavelength optical signal with different rates, or the optical emission component 400 can generate a second-wavelength optical signal and a third-wavelength optical signal with different rates.

[0165] In some embodiments, the optical accommodation component 500 can receive optical reception signals of two wavelengths, and the rates of the optical reception signals of the two wavelengths can be different. For example, the optical accommodation component 500 can receive a fourth-wavelength optical signal and a fifth-wavelength optical signal with different rates, or the optical accommodation component 500 can receive a fourth-wavelength optical signal and a sixth-wavelength optical signal with different rates, or the optical accommodation component 500 can receive a fifth-wavelength optical signal and a sixth-wavelength optical signal with different rates.

[0166] Figure 5A is the internal structure of an optical module according to some embodiments Figure 1 , Figure 5B is the internal structure of an optical module according to some embodimentsFigure 2 As shown in Figure 5A and Figure 5B In some embodiments, as shown, the optical housing component 500 may include a first housing 510 and a first upper cover 520. The first housing 510 and the first upper cover 520 are connected in a covering manner to form a first cavity. A first optical receiving component 530, a second optical receiving component 540, and a third optical receiving component 550 are provided on the side wall of the first housing 510. An accommodation cavity is formed inside the first cavity, and the accommodation cavity is used to accommodate devices and to realize the connection or communication between the devices. Exemplarily, a displacement prism, a mirror, etc. are provided in the accommodation cavity.

[0167] In some embodiments, an inner cavity is provided on the first housing 510, so that the first upper cover 520 covers the first housing 510 to form an accommodation cavity; the first upper cover 520 is located on the side of the first housing 510 facing the cover plate 2011.

[0168] In some embodiments, the first optical receiving component 530, the second optical receiving component 540, and the third optical receiving component 550 may be provided on the same side of the first housing 510. Of course, in some embodiments, the first optical receiving component 530, the second optical receiving component 540, and the third optical receiving component 550 may be located on different sides of the first housing 510.

[0169] In some embodiments, one end of the first housing 510 is connected to the fiber optic adapter 700, the other end of the first housing 510 is connected to the optical transmitting component 400, and the first optical receiving component 530, the second optical receiving component 540, and the third optical receiving component 550 are provided on one side of the first housing 510, so as to realize the encapsulation of the fiber optic adapter 700, the optical transmitting component 400, the first optical receiving component 530, the second optical receiving component 540, and the third optical receiving component 550 through the first housing 510, and to realize the optical connection between the fiber optic adapter 700, the optical transmitting component 400, the first optical receiving component 530, the second optical receiving component 540, and the third optical receiving component 550 and the first accommodation inner cavity respectively. The optical transmitting component 400, the first optical receiving component 530, the second optical receiving component 540, and the third optical receiving component 550 may be electrically connected to the circuit board 300 through flexible circuit boards respectively.

[0170] In some embodiments, the optical transmitting component 400 includes a second housing 410 and a second upper cover 420. The second upper cover 420 is connected in a covering manner to the second housing 410 to form a second cavity. A plurality of pins 430 are provided on the side wall of the second housing 410, and devices for generating and transmitting optical emission signals are provided inside the second housing 410. The pins 430 are connected to the flexible circuit board to be electrically connected to the circuit board 300 through the flexible circuit board. Exemplarily, one end of the second housing 410 is connected to the other end of the first housing 510; the second upper cover 420 is located on the side of the second housing 410 facing the bottom plate 2021.

[0171] In some embodiments, multiple rows of pins are respectively disposed on two connected side walls of the second housing 410, and high-frequency pins are included among the pins in the bottom row on the two connected side walls.

[0172] In some embodiments, an inclined surface 510a is provided at the bottom of the first housing 510. The inclined surface 510a inclines from the bottom surface of the first housing 510 towards the other end of the first housing 510 to facilitate the avoidance of tooling related to the assembly of the optical emission component 400. Exemplarily, when the second upper cover 420 is connected to the second housing 410 by seam welding, the inclined surface 510a avoids the seam welder.

[0173] In some embodiments, multiple flexible circuit boards are included inside the optical module. Exemplarily, the optical emission component 400 is electrically connected to the circuit board 300 through two flexible circuit boards, and the first optical receiving component 530, the second optical receiving component 540, and the third optical receiving component 550 are respectively electrically connected to the circuit board 300 through corresponding flexible circuit boards.

[0174] Figure 6 FIG. is an internal structure diagram of another optical module according to some embodiments. As Figure 6 shown, the first optical receiving component 530 and the second optical receiving component 540 can be disposed on one side of the first housing 510 to implement the encapsulation of the fiber optic adapter 700, the optical emission component 400, the first optical receiving component 530, and the second optical receiving component 540 through the first housing 510. Of course, in some embodiments, the first optical receiving component 530 and the third optical receiving component 550 can be disposed on one side of the first housing 510, or the second optical receiving component 540 and the third optical receiving component 550 can be disposed on one side of the first housing 510.

[0175] Figure 7A FIG. is an exploded view of the internal structure of an optical module according to some embodiments, Figure 7B FIG. is an exploded view of the internal structure of another optical module according to some embodiments. As Figure 7A and Figure 7B shown, the first optical receiving component 530, the second optical receiving component 540, and the third optical receiving component 550 can be coaxially encapsulated.

[0176] In some embodiments, a first connection hole 511 can be formed on the side wall of the first housing 510. The first connection hole 511 communicates with the first accommodation cavity. The first optical receiving component 530 is embedded and connected to the first connection hole 511.

[0177] In some embodiments, a second connection hole 512 may be formed on the side wall of the first housing 510. The second connection hole 512 communicates with the first accommodation cavity. The second optical receiving component 540 is embedded and connected to the second connection hole 512. The second connection hole 512 may be located on the side of the first connection hole 511.

[0178] In some embodiments, a third connection hole 513 may be formed on the side wall of the first housing 510. The third connection hole 513 communicates with the first accommodation cavity. The third optical receiving component 550 is embedded and connected to the second connection hole 512. The third connection hole 513 may be located on the side of the second connection hole 512.

[0179] In some embodiments, if two optical receiving components are assembled on the first housing 510, one connection hole may be sealed during the molding of the first housing 510 or sealed with a seal after molding.

[0180] In some embodiments, a cut corner 510b is formed at the other end of the first housing 510. The cut corner 510b may be located on the side of the third connection hole 513. A connection seat 5101 is formed in the cut corner 510b. One end of the connection seat 5101 is connected to the side wall of the first housing 510, and the other end of the connection seat 5101 is connected to the second housing 410. Exemplarily, the connection seat 5101 is integrally formed with the first housing 510. A fifth connection hole 5102 is provided on the connection seat 5101. The fifth connection hole 5102 communicates with the first housing 510 and the second housing 410.

[0181] Figure 8A FIG. is an exploded view of an optical fiber adapter and a first housing according to some embodiments, Figure 8B FIG. is a cross-sectional view of the internal structure of an optical module according to some embodiments, Figure 8B showing the cross-sectional structure of the optical fiber adapter. As Figure 8A and Figure 8B shown, a fourth connection hole 514 is formed on the side wall at one end of the first housing 510. The fourth connection hole 514 communicates with the first accommodation cavity. A connection sleeve 515 is provided at one end of the first housing 510. The connection sleeve 515 communicates with the fourth connection hole 514. One end of the connection sleeve 515 is connected to the optical fiber adapter 700, and the other end of the connection sleeve 515 is connected to the outer side wall of the first housing 510.

[0182] In some embodiments, a first lens 516 may be disposed in the fourth connection hole 514. The first lens 516 is used to converge the optical emission signal and collimate the optical reception signal. Exemplarily, the fourth connection hole 514 includes a lens mounting hole 5141, and the lens mounting hole 5141 is a stepped hole formed on the fourth connection hole 514. A lens mounting seat 5161 is disposed on the first lens 516, and the lens mounting seat 5161 is embedded in the lens mounting hole 5141 to fixedly connect the first lens 516 and the first housing 510 through the lens mounting seat 5161. A step is formed on the outer side of one end of the lens mounting seat 5161 to facilitate moving and clamping, thereby facilitating the assembly of the first lens 516.

[0183] Figure 9A The structure of a first housing according to some embodiments Figure 1 , Figure 9B is an exploded view of a first housing according to some embodiments, Figure 9C The structure of a first housing according to some embodiments Figure 2 . As Figure 9A - Figure 9C shown, an accommodation cavity 517 is formed inside the first housing 510, and the first connection hole 511, the second connection hole 512, the third connection hole 513, and the fourth connection hole 514 are respectively communicated with the accommodation cavity 517.

[0184] In some embodiments, a first displacement prism 561, a first mirror 562, a first filter 563, a wavelength division multiplexer 564, a second displacement prism 565, a third displacement prism 566, or a fourth displacement prism 567, etc. may be disposed in the accommodation cavity 517. A first mounting surface 518 may be formed on the top of the first housing 510, and the first mounting surface 518 supports and connects the first upper cover 520.

[0185] Figure 9D The usage state of a first housing according to some embodiments Figure 1 , Figure 9E The usage state of a first housing according to some embodiments Figure 2 . As Figure 9A - Figure 9E shown, the accommodation cavity 517 may include a first accommodation cavity 5171, a second accommodation cavity 5172, and a third accommodation cavity 5173. The first accommodation cavity 5171, the second accommodation cavity 5172, and the third accommodation cavity 5173 divide the accommodation cavity 517 to facilitate the assembly of devices such as the first displacement prism 561 in the accommodation cavity 517. For example, the first displacement prism 561, the first mirror 562, the first filter 563, and the wavelength division multiplexer 564 are disposed in the first accommodation cavity 5171, the second displacement prism 565 and the third displacement prism 566 are disposed in the second accommodation cavity 5172, and the fourth displacement prism 567 is disposed in the third accommodation cavity 5173.

[0186] In some embodiments, the wavelength division multiplexer 564 includes a first side 5641 and a second side 5642 opposite to the first side 5641. An incident light port may be formed on the first side 5641, and the incident light port is used for inputting a received optical signal. A filter may be disposed on the second side 5642. The filter may transmit the received optical signal of a preset wavelength and reflect the received optical signals of other wavelengths, so as to form an output end of the wavelength division multiplexer 564 by using the filter. Exemplarily, a plurality of filters may be disposed on the second side 5642, and each filter may transmit the received optical signal of a preset wavelength and reflect the received optical signals of other wavelengths. Of course, in one embodiment, a filter may also be disposed on the first side 5641, and the filter may transmit the received optical signal of a preset wavelength and reflect the received optical signals of other wavelengths.

[0187] In some embodiments, the wavelength division multiplexer 564 is longitudinally disposed in the first accommodation cavity 5171, such that the first side 5641 faces the side wall of the first housing 510 that is not connected to the fiber optic adapter 700, and the second side 5642 faces the side wall of the first housing 510 that is not connected to the fiber optic adapter 700, that is, neither the first side 5641 nor the second side 5642 faces the side wall of the first housing 510 that is connected to the fiber optic adapter 700.

[0188] In some embodiments, the first side 5641 is located on the side where the first mirror 562 is located, and the incident light port of the wavelength division multiplexer 564 is located on the reflection optical path of the first mirror 562, so that the received optical signal reflected by the first mirror 562 is input into the wavelength division multiplexer 564. Based on the wavelength of the received optical signal input into the wavelength division multiplexer 564, the wavelength division multiplexer 564 outputs the received optical signals of different wavelengths from the output ends formed by the corresponding filters. Exemplarily, three filters are disposed on the second side 5642, so that the wavelength division multiplexer 564 forms three output ends on the second side 5642, which are successively referred to as a first output end, a second output end, and a third output end. The first output end may be used to output a fourth-wavelength optical signal, the second output end may be used to output a fifth-wavelength optical signal, and the third output end may be used to output a fifth-wavelength optical signal.

[0189] In some embodiments, the first side of the first accommodation cavity 5171 communicates with the fourth connection hole 514. A second accommodation cavity 5172 is disposed on the second side of the first accommodation cavity 5171. A first baffle 5174 is disposed between the second accommodation cavity 5172 and the first accommodation cavity 5171. A first through cavity 5175 is formed on the first baffle 5174, and the first through cavity 5175 communicates the first accommodation cavity 5171 and the second accommodation cavity 5172; the top of the first baffle 5174 is supported and connected to the first upper cover 520.

[0190] In some embodiments, a third accommodation cavity 5173 is provided on the third side of the first accommodation cavity 5171. A second baffle 5176 is provided between the first accommodation cavity 5171 and the third accommodation cavity 5173. A second through cavity 5177 is formed in the second baffle 5176, and the second through cavity 5177 communicates with the first accommodation cavity 5171 and the third accommodation cavity 5173.

[0191] In some embodiments, the second accommodation cavity 5172 extends from one end of the first housing 510 to the other end of the first housing 510, and the other end of the second accommodation cavity 5172 extends to the side of the missing corner 510b; the third accommodation cavity 5173 is located on the side of the fifth connection hole 5102, and the third accommodation cavity 5173 communicates with the fifth connection hole 5102.

[0192] In some embodiments, the sides of the second displacement prism 565 and the third displacement prism 566 abut against and are connected to the side wall of the first baffle 5174, and the first baffle 5174 fixedly supports the second displacement prism 565 and the third displacement prism 566; the first filter 563 is disposed on the second baffle 5176, and the second baffle 5176 fixedly supports the first filter 563.

[0193] In some embodiments, the first reflection surface of the second displacement prism 565 is located on the output optical path of the first output end of the demultiplexer 564, and the second reflection surface of the second displacement prism 565 is located on the input optical path of the first optical receiving component 530.

[0194] In some embodiments, the first reflection surface of the third displacement prism 566 is located on the output optical path of the third output end of the demultiplexer 564, and the second reflection surface of the third displacement prism 566 is located on the input optical path of the third optical receiving component 550.

[0195] In some embodiments, there is a gap between the second displacement prism 565 and the third displacement prism 566, and the output optical path of the first output end of the demultiplexer 564 passes through this gap, and the first output end of the demultiplexer 564 is located on the input optical path of the second optical receiving component 540.

[0196] In some embodiments, the fourth displacement prism 567 is used to adjust the optical path of the optical emission signal, so as to make the fifth connection hole 5102 closer to the center line of the first housing 510 to adapt to the optical emission component 400, and make the assembly of the optical emission component 400 and the optical accommodation component 500 more concentrated, so as to facilitate reducing the space occupied by the assembly of the optical emission component 400 and the optical accommodation component 500 in the optical module and meet the requirements of multiple transmission channels of the optical module.

[0197] In some embodiments, a mounting base 568 may be disposed in the accommodation cavity 517. The bottom of the mounting base 568 is connected to the bottom of the first accommodation cavity 5171, and the side of the mounting base 568 fixedly supports the first reflector 562. Exemplarily, the first reflector 562 is first fixed to the mounting base 568, and the first reflector 562 is set to a preset position through optical path coupling, and then the mounting base 568 is fixed. The mounting base 568 facilitates moving the first reflector 562 and fixing the first reflector 562 in the first accommodation cavity 5171.

[0198] In some embodiments, an opening 519 may be formed on the fourth side of the first accommodation cavity 5171. The opening 519 is located on the side of the mounting base 568, and a sealing plate 5191 is disposed in the opening 519. The opening 519 is provided on the fourth side of the first accommodation cavity 5171, which facilitates the fixed installation of the mounting base 568, and further facilitates fixing the first reflector 562 in the first accommodation cavity 5171. When the first reflector 562 is set to a preset position through optical path coupling, the light fixing device irradiates the light for light fixing on the mounting base 568 through the opening 519 to fix the mounting base 568 on the bottom plate of the first accommodation cavity 5171; after the mounting base 568 is light-fixed to the first accommodation cavity 5171, the sealing plate 5191 is fixed on the opening 519.

[0199] Figure 10A is a cross-sectional view of an optical accommodation component according to some embodiments, Figure 10B is a cross-sectional view of another optical accommodation component according to some embodiments, Figure 10A which shows a transmission optical path of a light receiving signal and a light emitting signal in the optical accommodation component, Figure 10B which shows another transmission optical path of a light receiving signal and a light emitting signal in the optical accommodation component. In some embodiments, the light emitting signal output by the light emitting component 400 is transmitted to the incident surface of the fourth displacement prism 567 through the fifth connection hole 5102, transmitted through the incident surface of the fourth displacement prism 567 to the first reflection surface of the fourth displacement prism 567, reflected by the first reflection surface of the fourth displacement prism 567 to the second reflection surface of the fourth displacement prism 567 and then transmitted to the light emitting surface of the fourth displacement prism 567, transmitted through the light emitting surface of the fourth displacement prism 567 to the first filter 563, transmitted through the first filter 563, transmitted to the first displacement prism 561 and output from the fourth connection hole 514 along the output optical path of the first displacement prism 561, and converged by the first lens 516 and transmitted to the fiber optic adapter 700.

[0200] In some embodiments, the optical received signal is transmitted to the first lens 516 through the fiber optic adapter 700, collimated by the first lens 516 and transmitted to the incident light surface of the first displacement prism 561, transmitted through the incident light surface of the first displacement prism 561 to the first reflection surface of the first displacement prism 561, reflected by the first reflection surface of the first displacement prism 561 and transmitted to the second reflection surface of the first displacement prism 561, reflected by the second reflection surface of the first displacement prism 561 and transmitted to the exit light surface of the first displacement prism 561, transmitted through the exit light surface of the first displacement prism 561 to the first filter 563, reflected by the first filter 563 and transmitted to the first mirror 562, and reflected by the first mirror 562 and transmitted to the wavelength division multiplexer 564. If the optical received signal includes a fourth wavelength optical signal, the fourth wavelength optical signal is transmitted to the first reflection surface of the second displacement prism 565 through the first output end of the wavelength division multiplexer 564, reflected by the first reflection surface of the second displacement prism 565 and transmitted to the second reflection surface of the second displacement prism 565, and finally emitted and transmitted to the first optical receiving component 530 through the second reflection surface of the second displacement prism 565. If the optical received signal includes a fifth wavelength optical signal, the fifth wavelength optical signal is transmitted to the second optical receiving component 540 through the second output end of the wavelength division multiplexer 564. If the optical received signal includes a sixth wavelength optical signal, the sixth wavelength optical signal is transmitted to the first reflection surface of the third displacement prism 566 through the wavelength division multiplexer 564, reflected by the first reflection surface of the third displacement prism 566 and transmitted to the second reflection surface of the third displacement prism 566, and finally reflected and transmitted to the third optical receiving component 550 through the second reflection surface of the third displacement prism 566.

[0201] In some embodiments, when the second optical receiving component 540 and the third optical receiving component 550 are provided on the first housing 510, the fifth wavelength optical signal output by the wavelength division multiplexer 564 is transmitted to the second optical receiving component 540, and the sixth wavelength optical signal output by the wavelength division multiplexer 564 is transmitted to the third optical receiving component 550 through the third displacement prism 566.

[0202] In some embodiments, when the first optical receiving component 540 and the third optical receiving component 550 are provided on the first housing 510, the fourth wavelength optical signal output by the wavelength division multiplexer 564 is transmitted to the first optical receiving component 540 through the second displacement prism 565, and the sixth wavelength optical signal output by the wavelength division multiplexer 564 is transmitted to the third optical receiving component 550 through the third displacement prism 566.

[0203] In some embodiments, the receiving rates of the photodetectors in the first optical receiving component 530, the second optical receiving component 540, and the third optical receiving component 550 are different. Exemplarily, the receiving rate of the photodetector in the second optical receiving component 540 is greater than that of the photodetector in the first optical receiving component 530, and the receiving rate of the photodetector in the second optical receiving component 540 is greater than that of the photodetector in the third optical receiving component 550, such that the optical transmission path of the fifth-wavelength optical signal with the maximum transmission rate from the output of the wavelength division multiplexer 564 to the photodetector is relatively the shortest and the optical path is the simplest, so as to facilitate the photodetector in the second optical receiving component 540 to receive the optical signal with high coupling efficiency. For example, the receiving rate of the photodetector in the first optical receiving component 530 is 10G, the receiving rate of the photodetector in the second optical receiving component 540 is 50G, and the receiving rate of the photodetector in the third optical receiving component 550 is 2.5G.

[0204] In some embodiments, a filter 541 may be provided at the light-incident front end of the second optical receiving component 540. The filter 541 is used to filter out the clutter in the optical signal to be incident on the second optical receiving component 540, and improve the quality of the optical signal incident on the second optical receiving component 540.

[0205] In some embodiments, an isolator 569 may be provided in the fifth connection hole 5102. The isolator 569 is used to prevent the optical emission signal reflected back by the fourth displacement prism 567 from re-entering the second housing 410, so as to reduce the influence of the reflected optical emission signal on the optical emission signal generated by the optical emission component 400.

[0206] Figure 11A It is an exploded view of the internal structure of an optical module according to some embodiments. Figure 11B It is an exploded view of another internal structure of an optical module according to some embodiments. In some embodiments, as Figure 11A and Figure 11B shown, a first optical receiving component 530 and a second optical receiving component 540 may be provided on one side of the first housing 510.

[0207] In some embodiments, as Figure 11A shown, a third optical receiving component 550 may be provided on the other side of the first housing 510. Of course, as Figure 11B shown, the third optical receiving component 550 may not be provided on the other side of the first housing 510.

[0208] In some embodiments, a first light receiving component 530 may be provided on one side of the first housing 510, and a third light receiving component 550 may not be provided on the other side of the first housing 510; alternatively, a second light receiving component 540 may be provided on one side of the first housing 510, and a third light receiving component 550 may not be provided on the other side of the first housing 510.

[0209] Figure 12A Another structural diagram of a first housing according to some embodiments Figure 12B Another cross-sectional view of a first housing according to some embodiments. In some embodiments, as Figure 12A and Figure 12B shown, the first housing 510 includes a fifth side wall 5103, a sixth side wall 5104, a seventh side wall 5105, and an eighth side wall 5106. The fifth side wall 5103, the sixth side wall 5104, the seventh side wall 5105, and the eighth side wall 5106 surround and form the side walls of the accommodation cavity 517.

[0210] In some embodiments, a fourth connection hole 514 may be formed on the fifth side wall 5103.

[0211] In some embodiments, a first connection hole 511 and a second connection hole 512 may be formed on the sixth side wall 5104. Of course, in one embodiment, a third connection hole 513 may be formed on the sixth side wall 5104.

[0212] In some embodiments, a fifth connection hole 5102 may be formed on the seventh side wall 5105.

[0213] In some embodiments, a third connection hole 513 may be formed on the eighth side wall 5106. Of course, in one embodiment, a first connection hole 511 and a second connection hole 512 may be formed on the eighth side wall 5106.

[0214] Figure 13A Another usage state diagram of a first housing according to some embodiments Figure 13B Another usage state of the optical component within a first housing according to some embodiments Figure 1 , Figure 13C Another usage state of the optical component within a first housing according to some embodiments Figure 2 , Figure 13A - Figure 13C showing the arrangement of another optical component.

[0215] In some embodiments, the first lens 516 is disposed within the accommodation cavity 517, at the edge of the fourth connection hole 514.

[0216] In some embodiments, the wavelength division multiplexer 564 is horizontally disposed in the accommodation cavity 517, with the first side 5641 facing the fifth side wall 5103 and the second side 5642 facing the seventh side wall 5105. The light input port of the wavelength division multiplexer 564 is located on the transmission optical path of the first lens 516.

[0217] In some embodiments, a filter 5643 may be disposed on the first side 5641. The filter 5643 can transmit the fifth wavelength optical signal, so as to form a fifth output end on the first side 5641 through the filter 5643.

[0218] In some embodiments, a filter 5644 may be disposed on the second side 5642. The filter 5644 can transmit the fourth wavelength optical signal, so as to form a fourth output end on the second side 5642 through the filter 5644.

[0219] In some embodiments, a filter 5645 may be disposed on the second side 5642. The filter 5645 can transmit the sixth wavelength optical signal, so as to form a sixth output end on the second side 5642 through the filter 5645.

[0220] In some embodiments, a filter 5646 may be disposed on the second side 5642. The filter 5646 can transmit the optical emission signal, so as to form an optical port on the second side 5642 through the filter 5646. The optical emission signal can be incident on the wavelength division multiplexer 564 through this optical port, and the optical emission signal can be output from the light input port on the first side 5641.

[0221] In some embodiments, a second reflector 5601 may be disposed in the accommodation cavity 517. The second reflector 5601 is located on the transmission optical path of the filter 5644 and on the input optical path of the first light receiving component 530.

[0222] In some embodiments, a third reflector 5602 may be disposed in the accommodation cavity 517. The third reflector 5602 is located on the transmission optical path of the filter 5643 and on the input optical path of the second light receiving component 540.

[0223] In some embodiments, a fourth reflector 5603 may be disposed in the accommodation cavity 517. The fourth reflector 5603 is located on the transmission optical path of the filter 5645 and on the input optical path of the third light receiving component 550.

[0224] In some embodiments, a filter 531 is disposed on the first light receiving component 530. The filter 531 is located on the reflection optical path of the second reflector 5601.

[0225] In some embodiments, the filter 541 is located on the reflection optical path of the third reflector 5602.

[0226] In some embodiments, a filter 5604 may be disposed in the accommodation cavity 517. The filter 5604 is located between the fourth mirror 5603 and the filter 5645, and the filter 5604 filters the received optical signal output by the filter 5645. Exemplarily, the filter 5604 is connected to the fourth mirror 5603.

[0227] Figure 14A Cross-section of another optical accommodation component according to some embodiments Figure 1 , Figure 14A showing an optical path for transmitting a received optical signal and an emitted optical signal in the optical accommodation component; Figure 14B Cross-section of another optical accommodation component according to some embodiments Figure 2 , Figure 14B showing an optical path for transmitting a received optical signal and an emitted optical signal in the optical accommodation component.

[0228] In some embodiments, as Figure 13B , Figure 13C , Figure 14A and Figure 14B shown, the optical emission signal output by the optical emission component 400 is transmitted through the fifth connection hole 5102 to the filter 5646, enters the filter 5646 and then enters the wavelength division multiplexer 564, is output from the light input port of the wavelength division multiplexer 564 and transmitted to the first lens 516, and is converged by the first lens 516 and transmitted to the fiber optic adapter 700.

[0229] In some embodiments, as Figure 13B and Figure 14A shown, a first optical receiving component 530, a second optical receiving component 540, and a third optical receiving component 550 are disposed on the first housing 510. The received optical signal is transmitted through the fiber optic adapter 700 to the first lens 516, collimated by the first lens 516 and transmitted to the light input port of the wavelength division multiplexer 564, and enters the wavelength division multiplexer 564 through the light input port of the wavelength division multiplexer 564. If the received optical signal includes a fourth wavelength optical signal, the fourth wavelength optical signal is output from the fourth output end of the wavelength division multiplexer 564 and transmitted to the second mirror 5601, and is reflected by the second mirror 5601 and transmitted to the first optical receiving component 530. If the received optical signal includes a fifth wavelength optical signal, the fifth wavelength optical signal is output from the fifth output end of the wavelength division multiplexer 564 and transmitted to the third mirror 5602, and is reflected by the third mirror 5602 and transmitted to the second optical receiving component 540. If the received optical signal includes a sixth wavelength optical signal, the sixth wavelength optical signal is output from the sixth output end of the wavelength division multiplexer 564 and transmitted to the fourth mirror 5603, and is reflected by the fourth mirror 5603 and transmitted to the third optical receiving component 550.

[0230] In some embodiments, as Figure 13C andFigure 14B As shown in the figure, a first optical receiving component 530 and a second optical receiving component 540 are provided on the first housing 510. The optical receiving signal is transmitted to the first lens 516 through the fiber optic adapter 700, collimated by the first lens 516 and transmitted to the light input port of the wavelength division multiplexer 564, and enters the wavelength division multiplexer 564 through the light input port of the wavelength division multiplexer 564. If the optical receiving signal includes a fourth-wavelength optical signal, the fourth-wavelength optical signal is output from the fourth output end of the wavelength division multiplexer 564 and transmitted to the second mirror 5601, and is reflected by the second mirror 5601 and transmitted to the first optical receiving component 530. If the optical receiving signal includes a fifth-wavelength optical signal, the fifth-wavelength optical signal is output from the fifth output end of the wavelength division multiplexer 564 and transmitted to the third mirror 5602, and is reflected by the third mirror 5602 and transmitted to the second optical receiving component 540.

[0231] In some embodiments, when a second optical receiving component 540 and a third optical receiving component 550 are provided on the first housing 510, if the optical receiving signal includes a fifth-wavelength optical signal, the fifth-wavelength optical signal is output from the fifth output end of the wavelength division multiplexer 564 and transmitted to the third mirror 5602, and is reflected by the third mirror 5602 and transmitted to the second optical receiving component 540; if the optical receiving signal includes a sixth-wavelength optical signal, the sixth-wavelength optical signal is output from the sixth output end of the wavelength division multiplexer 564 and transmitted to the fourth mirror 5603, and is reflected by the fourth mirror 5603 and transmitted to the third optical receiving component 550.

[0232] Figure 15A It is a usage state diagram of another first housing according to some embodiments. Figure 15B It is a usage state diagram of optical components in another optical module according to some embodiments. In some embodiments, as Figure 15A and Figure 15B shown, the layout of another optical component is shown.

[0233] In some embodiments, the wavelength division multiplexer 564 is horizontally disposed in the receiving cavity 517, and the first mirror 562 and the first filter 563 are disposed between the first side 5641 and the first lens 516. The first filter 563 is located on the transmission optical path of the first lens 516, and the first mirror 562 is located on the reflection optical path of the first filter 563.

[0234] In some embodiments, a filter 5647 may be provided on the first side 5641. The filter 5647 can transmit the fourth-wavelength optical signal to form a seventh output end on the first side 5641 through the filter 5647.

[0235] In some embodiments, a filter 5648 may be disposed on the second side 5642. The filter 5648 may transmit the fifth-wavelength optical signal to form an eighth output end on the second side 5642 through the filter 5648.

[0236] In some embodiments, a filter 5649 may be disposed on the second side 5642. The filter 5649 may transmit the fifth-wavelength optical signal to form a ninth output end on the second side 5642 through the filter 5649.

[0237] In some embodiments, a fifth mirror 5605 may be disposed in the accommodation cavity 517. The fifth mirror 5605 is located on the reflection optical path of the first mirror 562 and on the input optical path of the wavelength division multiplexer 564. The light input port of the wavelength division multiplexer 564 is located on the reflection optical path of the fifth mirror 5605.

[0238] In some embodiments, a sixth mirror 5607 may be disposed in the accommodation cavity 517. The sixth mirror 5607 is located on the side of the first side 5641, on the transmission optical path of the filter 5647, and on the input optical path of the first optical receiving component 530.

[0239] In some embodiments, a beam splitting prism 5606 may be disposed in the accommodation cavity 517. The beam splitting prism 5606 is disposed on the side of the second side 5642. Exemplarily, the beam splitting prism 5606 includes a first reflecting surface and a second reflecting surface. The first reflecting surface of the beam splitting prism 5606 is located on the transmission optical path of the filter 5648 and on the input optical path of the second optical receiving component 540 to reflect and transmit the received optical signal passing through the filter 5648 to the second optical receiving component 540. The second reflecting surface of the beam splitting prism 5606 is located on the projection optical path of the filter 5649 and on the input optical path of the third optical receiving component 550 to reflect and transmit the received optical signal passing through the filter 5649 to the third optical receiving component 550. The beam splitting prism 5606 may transmit the received optical signals of two wavelengths output by the wavelength division multiplexer 564 to different directions.

[0240] In some embodiments, the optical emission signal output by the optical emission component 400 is transmitted to the first filter 563 through the fifth connection hole 5102, transmitted through the first filter 563 to the first lens 516, and converged by the first lens 516 and then transmitted to the fiber optic adapter 700.

[0241] In some embodiments, the received optical signal is transmitted to the first lens 516 through the fiber optic adapter 700, and then transmitted to the first filter 563 through the first lens 516. After being reflected by the first filter 563, it is transmitted to the first mirror 562, and then transmitted to the fifth mirror 5605 after being reflected by the first mirror 562. After being reflected by the fifth mirror 5605, it is transmitted to the wavelength division multiplexer 564. If the received optical signal includes a fourth-wavelength optical signal, the fourth-wavelength optical signal is transmitted to the sixth mirror 5607 through the seventh output terminal of the wavelength division multiplexer 564, and then transmitted to the first optical receiving component 530 after being reflected by the sixth mirror 5607. If the received optical signal includes a fifth-wavelength optical signal, the fifth-wavelength optical signal is transmitted to the first reflecting surface of the beam splitter prism 5606 through the eighth output terminal of the wavelength division multiplexer 564, and then transmitted to the second optical receiving component 540 after being reflected by the first reflecting surface of the beam splitter prism 5606. If the received optical signal includes a sixth-wavelength optical signal, the sixth-wavelength optical signal is transmitted to the second reflecting surface of the beam splitter prism 5606 through the ninth output terminal of the wavelength division multiplexer 564, and then transmitted to the third optical receiving component 550 after being reflected by the second reflecting surface of the beam splitter prism 5606.

[0242] In some embodiments, a filter 5608 is disposed between the first reflecting surface of the beam splitter prism 5606 and the filter 5648. The filter 5608 can filter out the stray light in the fifth-wavelength optical signal and improve the quality of the optical signal received by the second optical receiving component 540.

[0243] In some embodiments, a filter 5609 is disposed between the second reflecting surface of the beam splitter prism 5606 and the filter 5649. The filter 5609 can filter out the stray light in the sixth-wavelength optical signal and improve the quality of the optical signal received by the third optical receiving component 550.

[0244] Figure 16A The structure of an optical transmitting component according to some embodiments Figure 1 , Figure 16B The structure of an optical transmitting component according to some embodiments Figure 2 , Figure 16C is an exploded view of an optical transmitting component according to some embodiments. As Figure 16A - Figure 16C shown, the optical transmitting component 400 includes a second housing 410 and a second upper cover 420. The second upper cover 420 is cover-connected to the second housing 410 to form a second cavity.

[0245] In some embodiments, the second housing 410 includes a bottom plate 411, a first side wall 412, a second side wall 413, a third side wall 414, and a fourth side wall 415. The first side wall 412, the second side wall 413, the third side wall 414, and the fourth side wall 415 are sequentially connected and their bottoms are respectively connected to the bottom plate 411 to form a second inner cavity. The tops of the first side wall 412, the second side wall 413, the third side wall 414, and the fourth side wall 415 are supported and connected to the second upper cover 420; the bottom plate 411 is used to support the device. In some embodiments, the second housing 410 is a housing integrally formed of a metal material. The third side wall 414 is disposed along the width direction of the second housing 410, and the fourth side wall 415 is disposed along the length direction of the second housing 410.

[0246] In some embodiments, the first side wall 412 is located at one end of the second housing 410. A sixth connection hole 4121 is provided on the first side wall 412. The sixth connection hole 4121 communicates with the second inner cavity, and the sixth connection hole 4121 serves as the light outlet of the second cavity. The sixth connection hole 4121 is connected to the first housing 510, so that the second housing 410 communicates with the accommodation cavity 517 through the sixth connection hole 4121. Exemplarily, the other end of the connection seat 5101 is embedded and connected to the sixth connection hole 4121. In some embodiments, a boss 4122 is provided on the outer side of the first side wall 412. One end of the sixth connection hole 4121 penetrates through the boss 4122, and the end of the connection seat 5101 is embedded and connected to the boss 4122.

[0247] In some embodiments, the second side wall 413 is located within the cutout 510b and is the side wall of the second side wall 413 close to the first housing 510.

[0248] In some embodiments, the third side wall 414 is located at the other end of the first housing 510, and the third side wall 414 is close to the circuit board 300.

[0249] In some embodiments, a plurality of pins are provided on the third side wall 414, and the plurality of pins are connected to the circuit board 300 through a flexible circuit board.

[0250] In some embodiments, a plurality of pins are respectively provided on the third side wall 414 and the fourth side wall 415. For example, two rows of pins are respectively provided on the third side wall 414 and the fourth side wall 415, and each row of pins includes a plurality of pins 430. For the convenience of description, the row of pins on the third side wall 414 and the fourth side wall 415 close to the bottom plate 411 is the bottom row of pins on the third side wall 414 and the fourth side wall 415. The pins 430 on the third side wall 414 and the pins 430 on the fourth side wall 415 are respectively electrically connected to the circuit board 300 through corresponding flexible circuit boards.

[0251] In some embodiments, a first laser assembly 440 may be disposed within the second housing 410. The first laser assembly 440 may be configured to generate a first wavelength optical signal. The first laser assembly 440 may be located at a side of the junction of the second sidewall 413 and the third sidewall 414.

[0252] In some embodiments, a second laser assembly 450 may be disposed within the second housing 410. The second laser assembly 450 may be configured to generate a second wavelength optical signal. The second laser assembly 450 may be located at a side of the fourth sidewall 415.

[0253] In some embodiments, a third laser assembly 460 may be disposed within the second housing 410. The third laser assembly 460 may be configured to generate a third wavelength optical signal. The third laser assembly 460 may be located at a side of the fourth sidewall 415. For example, the third laser assembly 460 may be located at a side of the junction of the fourth sidewall 415 and the first sidewall 412.

[0254] In some embodiments, a first laser assembly 440, a second laser assembly 450, and a third laser assembly 460 are disposed within the second housing 410. The first laser assembly 440 is located at a side of the second sidewall 413 and the third sidewall 414; the second laser assembly 450 and the third laser assembly 460 are located at a side of the fourth sidewall 415, and the third laser assembly 460 is located on a side away from the third sidewall 414 of the second laser assembly 450. The third laser assembly 460 is located at a side of the first sidewall 412, such that the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460 are distributed at sides of two connected sidewalls of the second housing 410, and the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460 are in a triangular distribution state, so as to facilitate reducing the package volume of the optical transmitting component 400.

[0255] In some embodiments, the first laser assembly 440 is disposed in the width direction within the second housing 410, which is conducive to reducing the size in the width direction of the second housing 410. In combination with disposing the second laser assembly 450 or the third laser assembly 460 in the length direction within the second housing 410, a sufficient number of laser assemblies can be disposed within the second housing 410, and the overall size of the second housing 410 can also be reduced, which is conducive to reducing the size of the optical transmitting component 400.

[0256] In some embodiments, the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460 have different transmission rates. Exemplarily, the transmission rate of the first laser assembly 440 is greater than that of the second laser assembly 450, and the transmission rate of the second laser assembly 450 is greater than that of the third laser assembly 460. For example, the transmission rate of the first laser assembly 440 is 50G, the transmission rate of the second laser assembly 450 is 10G, and the transmission rate of the third laser assembly 460 is 2.5G, etc.

[0257] In some embodiments, a second filter 416 may be disposed on the side of the light exit of the second housing 410, and the second filter 416 is located on the side of the sixth connection hole 4121. The second filter 416 may be located on the output optical path of the first laser assembly 440, the second laser assembly 450, or the third laser assembly 460, and the second filter 416 is used to adjust the transmission direction of the first wavelength optical signal, the second wavelength optical signal, or the third wavelength optical signal. For example, the second filter 416 transmits the first wavelength optical signal and the second wavelength optical signal to translate the first wavelength optical signal and the second wavelength optical signal in the width direction of the second housing 410; the second filter 416 reflects the third wavelength optical signal to change the transmission direction of the third wavelength optical signal.

[0258] In some embodiments, a third filter 417 may be disposed on the side of the light exit of the second housing 410, and the third filter 417 is located on the side of the sixth connection hole 4121. The third filter 417 may be located on the output optical path of the first laser assembly 440 or the second laser assembly 450. The third filter 417 transmits the first wavelength optical signal to translate the first wavelength optical signal in the width direction of the second housing 410; the third filter 417 reflects the second wavelength optical signal to change the transmission direction of the second wavelength optical signal.

[0259] In some embodiments, a second filter 416 and a third filter 417 may be disposed on the side of the light exit of the second housing 410, and the second filter 416 and the third filter 417 are arranged side by side on the side of the sixth connection hole 4121. The second filter 416 and the third filter 417 are used to change the transmission optical paths of the first wavelength optical signal, the second wavelength optical signal, and the third wavelength optical signal, so that the first wavelength optical signal, the second wavelength optical signal, and the third wavelength optical signal can pass through the sixth connection hole 4121.

[0260] In some embodiments, the second filter 416 and the third filter 417 may be disposed on the side at the junction of the first side wall 412 and the second side wall 413, so that the second filter 416, the third filter 417, and the first laser assembly 440 are arranged compactly, facilitating the control of the dimension in the length direction of the second housing 410.

[0261] In some embodiments, the second filter 416 is located at the junction of the output optical paths of the first laser assembly 440 and the third laser assembly 460; the third filter 417 is located at the junction of the output optical paths of the first laser assembly 440 and the second laser assembly 450. The first laser assembly 440 is located on the transmission side of the third filter 417, the second laser assembly 450 is located on the reflection side of the third filter 417, and the third laser assembly 460 is located on the reflection side of the second filter 416. Exemplarily, the second filter 416 includes a first optical surface and a second optical surface, and the first optical surface and the second optical surface are the main optical surfaces of the second filter 416; the third filter 417 includes a third optical surface and a fourth optical surface, and the third optical surface and the fourth optical surface are the main optical surfaces of the third filter 417. The first optical surface faces the third laser assembly 460, the second optical surface faces the third filter 417, the third optical surface faces the second laser assembly 450, and the fourth optical surface faces the first laser assembly 440.

[0262] In some embodiments, a mounting bracket 470 can be arranged in the second housing 410. The mounting bracket 470 is arranged on the side of the sixth connection hole 4121 and fixed in the second housing 410. The mounting bracket 470 supports and connects the second filter 416 and the third filter 417. The second filter 416 and the third filter 417 are fixed in the second housing 410 through the mounting bracket 470, which facilitates fixing the second filter 416 and the third filter 417 in the second housing 410.

[0263] In some embodiments, a second lens 4181 is arranged on the transmission optical path from the first laser assembly 440 to the third filter 417, and the second lens 4181 collimates the first wavelength optical signal.

[0264] In some embodiments, a third lens 4182 is arranged on the transmission optical path from the second laser assembly 450 to the third filter 417, and the third lens 4182 collimates the second wavelength optical signal.

[0265] In some embodiments, a fourth lens 4183 is arranged on the transmission optical path from the third laser assembly 460 to the second filter 416, and the fourth lens 4183 collimates the third wavelength optical signal.

[0266] Figure 17A is a partial structure of an optical emission component according to some embodiments Figure 1 , Figure 17B is a partial structure of an optical emission component according to some embodiments Figure 2 , Figure 17C is a partial structure of an optical emission component according to some embodiments Figure 3 , Figure 17D is a cross-section of an optical emission component according to some embodiments Figure 1, Figure 17E Cross-section of a light-emitting component according to some embodiments Figure 2 , Figure 17F Cross-section of a light-emitting component according to some embodiments Figure 3 ; Figure 17A - Figure 17F Displays the internal structure of a light-emitting component.

[0267] In some embodiments, the first laser assembly 440 includes a first substrate 441 and a first laser chip 442. The first laser chip 442 is mounted on the first substrate 441. The first laser chip 442 integrates an electro-absorption modulated laser and a semiconductor optical amplifier. A ground layer 4410, a first high-frequency pad 4411, a first LD pad 4412, and a first SOA pad 4413 may be formed on the first substrate 441. The first laser chip 442 is mounted on the ground layer 4410. The first high-frequency pad 4411, the first LD pad 4412, and the first SOA pad 4413 are located on the sides of the first laser chip 442. The first high-frequency pad 4411, the first LD pad 4412, and the first SOA pad 4413 are respectively wire-bonded to the first laser chip 442.

[0268] In some embodiments, a first high-frequency pin 4301, a first SOA pin 4302, and a first LD pin 4303 may be provided on the third sidewall 414. The first high-frequency pin 4301, the first SOA pin 4302, and the first LD pin 4303 are embedded in the third sidewall 414 and their ends respectively extend into the inner cavity of the second housing 410. The first high-frequency pin 4301, the first SOA pin 4302, and the first LD pin 4303 are respectively insulated from the third sidewall 414 through an insulating layer. The first high-frequency pin 4301 is located among the pins in the bottom row on the third sidewall 414. The first high-frequency pin 4301 is electrically connected to the first high-frequency pad 4411, the first SOA pin 4302 is electrically connected to the first SOA pad 4413, and the first LD pin 4303 is electrically connected to the first LD pad 4412.

[0269] In some embodiments, one end of the first high-frequency pin 4301 is wire-bonded to the first high-frequency pad 4411, one end of the first SOA pin 4302 is wire-bonded to the first SOA pad 4413, and one end of the first LD pin 4303 is wire-bonded to the first LD pad 4412; the other ends of the first high-frequency pin 4301, the first SOA pin 4302, and the first LD pin 4303 are electrically connected to the circuit board 300 through a flexible circuit board.

[0270] In some embodiments, the height position of the first high-frequency pin 4301 on the third sidewall 414 is lower than the height positions of the first SOA pin 4302 and the first LD pin 4303 on the third sidewall 414, that is, the first high-frequency pin 4301 is closer to the bottom plate 411. A first ground pin 4304 may be provided on the third sidewall 414. The first ground pin 4304 is located on the side of the first high-frequency pin 4301 and the first ground pin 4304 is electrically connected to the third sidewall 414.

[0271] In some embodiments, a first adapter board 481 may be disposed in the second housing 410. Circuit patterns are provided on the first adapter board 481 to achieve electrical connection between the first high-frequency pin 4301 and the first laser assembly 440 through the first adapter board 481. The first adapter board 481 can also be used to impedance-match the first laser chip 442 to ensure impedance continuity of the high-frequency transmission link.

[0272] In some embodiments, a first high-frequency transmission line 4811 may be formed on the front surface of the first adapter board 481. A first ground layer 4812 is disposed on one side of the first high-frequency transmission line 4811, and a second ground layer 4813 is disposed on the other side of the first high-frequency transmission line 4811. One end of the first high-frequency transmission line 4811 is electrically connected to the first high-frequency pad 4411, and the other end of the first high-frequency transmission line 4811 is electrically connected to the first high-frequency pin 4301. Exemplarily, one end of the first high-frequency transmission line 4811 is wire-bonded to the first high-frequency pad 4411, and the other end of the first high-frequency transmission line 4811 is soldered to the first high-frequency pin 4301; the ground layer 4110 is wire-bonded to the first ground layer 4812 and the second ground layer 4813.

[0273] In some embodiments, a ground layer may be formed on the back surface of the first adapter board 481. Via holes are respectively provided on the first ground layer 4812 and the second ground layer 4813, and the first ground layer 4812 and the second ground layer 4813 are respectively connected to the ground layer on the back surface of the first adapter board 481 through the via holes.

[0274] In some embodiments, the second laser assembly 450 may include a second substrate 451 and a second laser chip 452. The second laser chip 452 is mounted on the second substrate 451, and the second laser chip 452 may integrate an electro-absorption modulated laser and a semiconductor optical amplifier.

[0275] In some embodiments, a ground layer 4510, a second high-frequency pad 4511, a second LD pad 4512, and a second SOA pad 4513 may be formed on the second substrate 451. The second high-frequency pad 4511, the second LD pad 4512, and the second SOA pad 4513 are located on the sides of the second laser chip 452. The second laser chip 452 is mounted on the ground layer 4510, and the second high-frequency pad 4511, the second LD pad 4512, and the second SOA pad 4513 are wire-bonded to the second laser chip 452 respectively.

[0276] In some embodiments, the pin 430 may include a second high-frequency pin 4305, a second SOA pin 4306, and a second LD pin 4307. The second high-frequency pin 4305 is located among the pins at the bottom row on the third sidewall 414. The second high-frequency pin 4305 is electrically connected to the second high-frequency pad 4511, the second SOA pin 4306 is electrically connected to the second SOA pad 4513, and the second LD pin 4307 is electrically connected to the second LD pad 4512.

[0277] In some embodiments, a second adapter board 482 may be disposed in the second housing 410. A circuit board pattern is provided on the second adapter board 482. The second adapter board 482 is used to realize the electrical connection between the second high-frequency pin 4305 and the second laser assembly 450. The second adapter board 482 can also be used to impedance-match the second laser chip 452 to ensure the impedance continuity of the high-frequency transmission link.

[0278] In some embodiments, the second high-frequency pin 4305 is embedded and connected to the third sidewall 414. The second high-frequency pin 4305 is insulated from the third sidewall 414 through an insulating layer. The second adapter board 482 is disposed on the side of the third sidewall 414.

[0279] In some embodiments, the second SOA pin 4306 and the second LD pin 4307 are embedded and connected to the fourth sidewall 415. The second SOA pin 4306 and the second LD pin 4307 are insulated from the fourth sidewall 415 through insulating layers respectively. The second SOA pin 4306 is wire-bonded to the second SOA pad 4513, and the second LD pin 4307 is wire-bonded to the second LD pad 4512.

[0280] In some embodiments, a second ground pin 4308 may be provided on the third sidewall 414. The second ground pin 4308 is located on the side of the second high-frequency pin 4305. The second ground pin 4308 is electrically connected to the third sidewall 414. Exemplarily, the second ground pin 4308 is located on the side of the second high-frequency pin 4305 close to the first high-frequency pin 4301.

[0281] In some embodiments, the second adapter board 482 and the first adapter board 481 are located on the same side wall side of the second housing 410, facilitating the assembly of the second adapter board 482 and helping to increase the assembly density of the components within the second housing 410, thereby contributing to reducing the size of the second housing 410.

[0282] In some embodiments, a second high-frequency transmission line 4821 may be formed on the front surface of the second adapter board 482. A third ground layer 4822 is disposed on one side of the second high-frequency transmission line 4821, and a fourth ground layer 4823 is disposed on the other side of the second high-frequency transmission line 4821. One end of the second high-frequency transmission line 4821 is used for electrically connecting to the second high-frequency pad 4511, and the other end of the second high-frequency transmission line 4821 is used for electrically connecting to the second high-frequency pin 4305. Exemplarily, one end of the second high-frequency transmission line 4821 is wire-bonded to the second high-frequency pad 4511, and the other end of the second high-frequency transmission line 4821 is soldered to the second high-frequency pin 4305; the ground layer 4510 is electrically connected to the third ground layer 4822 and the fourth ground layer 4823.

[0283] In some embodiments, a ground layer may be formed on the back surface of the second adapter board 482. Via holes are respectively provided on the third ground layer 4822 and the fourth ground layer 4823, and the third ground layer 4822 and the fourth ground layer 4823 are respectively connected to the ground layer on the back surface of the second adapter board 482 through the via holes.

[0284] In some embodiments, a third adapter board 483 may be disposed within the second housing 410, and a circuit pattern is provided on the third adapter board 483. The third adapter board 483 is disposed between the second laser assembly 450 and the second adapter board 482, and the side edge of the third adapter board 483 is close to the first laser assembly 440. The third adapter board 483 is used to achieve the electrical connection between the second laser assembly 450 and the second adapter board 482, and the third adapter board 483 can also be used for impedance matching of the second laser chip 452 to ensure the impedance continuity of the high-frequency transmission link. The third adapter board 483 helps to reduce the wire-bonding length between the second laser assembly 450 and the second adapter board 482, so as to reduce the parasitic inductance and ensure the high-frequency signal transmission quality.

[0285] In some embodiments, a third high-frequency transmission line 4831 may be formed on the front surface of the third adapter board 483. A fifth ground layer 4832 is disposed on one side of the third high-frequency transmission line 4831, and a sixth ground layer 4833 is disposed on the other side of the third high-frequency transmission line 4831. One end of the third high-frequency transmission line 4831 is used for electrically connecting to the second high-frequency pad 4511, and the other end of the third high-frequency transmission line 4831 is used for electrically connecting to the second high-frequency transmission line 4821. Exemplarily, one end of the second high-frequency transmission line 4821 is wire-bonded to the second high-frequency pad 4511, and the other end of the third high-frequency transmission line 4831 is wire-bonded to one end of the second high-frequency transmission line 4821; the fifth ground layer 4832 is wire-bonded to the third ground layer 4822, the sixth ground layer 4833 is wire-bonded to the fourth ground layer 4823, and the fifth ground layer 4832 and the sixth ground layer 4833 are respectively wire-bonded to the ground layer 4510.

[0286] In some embodiments, a third LD pad 4834 and a third SOA pad 4835 may be formed on the front surface of the third adapter board 483. The third LD pad 4834 and the third SOA pad 4835 are close to the first laser assembly 440. The first LD pad 4412 and the first LD pin 4303 are respectively electrically connected to the third LD pad 4834, and the first SOA pad 4413 and the first SOA pin 4302 are respectively electrically connected to the third SOA pad 4835, so as to electrically connect the first laser assembly 440, the first LD pin 4303 and the first SOA pin 4302 through the third adapter board 483, facilitating the control of the wire-bonding arc height and thus facilitating wire-bonding.

[0287] In some embodiments, capacitors are respectively mounted on the third LD pad 4834 and the third SOA pad 4835. The first LD pad 4412 and the first LD pin 4303 are respectively provided with capacitors on the third LD pad 4834, and the first SOA pad 4413 and the first SOA pin 4302 are respectively wire-bonded to the capacitors provided on the third SOA pad 4835. The third adapter board 483 is disposed on the side at the connection of the third side wall 414 and the fourth side wall 415, so that the third adapter board 483 can serve both the first laser assembly 440 and the second laser assembly 450, facilitating the coordinated use of the space within the second housing 410.

[0288] In some embodiments, the third laser assembly 460 may include a third substrate 461 and a third laser chip 462. A negative electrode pad 4611 and a positive electrode pad 4612 may be provided on the third substrate 461. The third laser chip 462 is mounted on the negative electrode pad 4611, and the third laser chip 462 is wire-bonded to the positive electrode pad 4612. The pins 430 may include a third LD pin 4309 and a fourth LD pin 4310. The third LD pin 4309 is wire-bonded to the positive electrode pad 4612, and the fourth LD pin 4310 is wire-bonded to the negative electrode pad 4611. Exemplarily, the third LD pin 4309 and the fourth LD pin 4310 are embedded and connected to the fourth sidewall 415. The end portions of the third LD pin 4309 and the fourth LD pin 4310 respectively extend into the inner cavity of the second housing 410, and the third LD pin 4309 and the fourth LD pin 4310 are insulated from the fourth sidewall 415 through an insulating layer.

[0289] In some embodiments, the third laser assembly 460 may include a backlight detector 463. The backlight detector 463 is disposed on the third substrate 461 and on the backlight side of the third laser chip 462. The backlight detector 463 is configured to receive the backlight of the third laser chip 462 for monitoring the third-wavelength optical signal.

[0290] In some embodiments, the pins 430 may include an MPD pin 4311. The MPD pin 4311 is wire-bonded to the backlight detector 463. Exemplarily, the MPD pin 4311 is embedded and connected to the fourth sidewall 415. The end portion of the MPD pin 4311 extends into the inner cavity of the second housing 410, and the MPD pin 4311 is insulated from the fourth sidewall 415 through an insulating layer.

[0291] In some embodiments, a thermoelectric cooler (TEC) 490 may be disposed in the second housing 410. The bottom of the TEC 490 is connected to the bottom plate 411, and the top of the TEC 490 may support the first laser assembly 440, the second laser assembly 450, the third laser assembly 460, etc. The sides of the TEC 490 include a first TEC pad 491 and a second TEC pad 492. The first TEC pad 491 and the second TEC pad 492 are located on the side of the second sidewall 413.

[0292] In some embodiments, the pins 430 may include a first TEC pin 4312 and a second TEC pin 4313. The first TEC pin 4312 is electrically connected to the first TEC pad 491, and the second TEC pin 4313 is electrically connected to the second TEC pad 492. Exemplarily, the first TEC pin 4312 and the second TEC pin 4313 are embedded in the third sidewall 414, and their end portions respectively extend into the inner cavity of the second housing 410 and are insulated from the third sidewall 414 through an insulating layer.

[0293] In some embodiments, a support plate 419 may be disposed within the second housing 410. The support plate 419 is disposed on top of the TEC 490. The bottom of the support plate 419 is connected to the top of the TEC 490, and the top of the support plate 419 may be supportingly connected to the first laser assembly 440, the second laser assembly 450, the third laser assembly 460, etc. In some embodiments, the support plate 419 is electrically connected to the ground layer on the front side of the third adapter board 483.

[0294] In some embodiments, a fourth adapter board 484 may be disposed within the second housing 410. The fourth adapter board 484 is disposed on the support plate 419. A circuit pattern is disposed on the fourth adapter board 484. The fourth adapter board 484 is used for electrically connecting the TEC pads and the TEC pins. Exemplarily, the fourth adapter board 484 may include a fourth substrate 4841. A first metal layer 4842 and a second metal layer 4843 are disposed on the fourth substrate 4841. The first metal layer 4842 and the second metal layer 4843 respectively extend along the length direction of the fourth substrate 4841. The fourth adapter board 484 is disposed on the side of the second sidewall 413 and is located on the side of the first laser assembly 440. One end of the first metal layer 4842 is wire-bonded to the first TEC pad 491, and the other end of the first metal layer 4842 is wire-bonded to the first TEC pin 4312. One end of the second metal layer 4843 is wire-bonded to the second TEC pad 492, and the other end of the second metal layer 4843 is wire-bonded to the second TEC pin 4313.

[0295] In some embodiments, a temperature sensor 4836 is further disposed on the third adapter board 483. Exemplarily, the temperature sensor 4836 is a thermistor.

[0296] In some embodiments, the pin 430 further includes an RTH pin 4314. The RTH pin 4314 is embedded in the third sidewall 414. One end of the RTH pin 4314 extends into the inner cavity of the second housing 410. The RTH pin 4314 is insulated from the third sidewall 414 through an insulating layer. One end of the RTH pin 4314 is electrically connected to the temperature sensor 4836.

[0297] In some embodiments, an adapter pad 4837 may be formed on the third adapter board 483. The adapter pad 4837 is located on the side of the temperature sensor 4836. The adapter pad 4837 is respectively wire-bonded to the temperature sensor 4836 and the RTH pin 4314. The adapter pad 4837 realizes the transfer between the temperature sensor 4836 and the RTH pin 4314, so as to reduce the heat being transmitted to the RTH pin 4314 through the wire bonding when the temperature sensor 4836 is directly wire-bonded to the RTH pin 4314, resulting in inaccurate detection of the temperature within the second cavity by the temperature sensor 4836.

[0298] In some embodiments, a first side surface 4141, a second side surface 4142, a first stepped surface 4143, and a second stepped surface 4144 may be formed on the inner side of the third side wall 414. The first side surface 4141 is connected to the first stepped surface 4143. One end of the second stepped surface 4144 is connected to the first side surface 4141, and the other end of the second stepped surface 4144 is connected to the second side surface 4142. The first stepped surface 4143 is closer to the bottom plate 411 than the second stepped surface 4144, that is, the height position of the first stepped surface 4143 in the second housing 410 is lower than the height position of the second stepped surface 4144 in the second housing 410.

[0299] The first stepped surface 4143 supports and connects the first adapter board 481 and the second adapter board 482. One end of the first high-frequency pin 4301 and one end of the second high-frequency pin 4305 may respectively pass through the first side surface 4141. One end of the first high-frequency pin 4301 extends above the first adapter board 481, and one end of the second high-frequency pin 4305 extends to the second adapter board 482. One end of the RTH pin 4314 passes through the first side surface 4141. One end of the first SOA pin 4302, one end of the first LD pin 4303, one end of the first TEC pin 4312, and one end of the second TEC pin 4313 may respectively pass through the second side surface 4142. The second ground pin 4308 is located between the first high-frequency pin 4301 and the second high-frequency pin 4305, and the first ground pin 4304 is located on the side of the first high-frequency pin 4301 away from the second high-frequency pin 4305.

[0300] In some embodiments, the pins passing through the first side surface 4141 form a first row of pins 430a, and the pins passing through the second side surface 4142 form a second row of pins 430b, that is, the pins provided on the third side wall 414 are arranged in two rows. The pins in the first row of pins 430a and the pins in the second row of pins 430b are arranged staggeredly, which facilitates wire bonding of the pins and adaptation to the flexible circuit board, and reduces the risk of air leakage caused by deformation of the insulating layer for pin fixing.

[0301] In some embodiments, the MPD pin 4311 and the second SOA pin 4306 are in one row, and the second LD pin 4307, the third LD4309 pin, and the fourth LD pin 4310 are in one row.

[0302] In some embodiments, the sixth connection hole 4121 is a stepped through hole, which gradually becomes smaller from one side of the boss 4122 toward the inner side of the second housing 410. A sealing window 4123 is provided in the sixth connection hole 4121 at the boss 4122, and the sealing window 4123 seals the sixth connection hole 4121.

[0303] Figure 18A It is a transmission optical path diagram of an optical emission signal according to some embodiments. Figure 18AA transmission optical path for an optical emission signal is shown. Figure 18B It is a transmission optical path diagram for another optical emission signal according to some embodiments. Figure 18B Another transmission optical path for an optical emission signal is shown. As Figure 18A and Figure 18B shown, the first wavelength optical signal generated by the first laser component 440 is transmitted to the second lens 4181, collimated by the second lens 4181 and then transmitted to the third filter 417, passes through the third filter 417 and is transmitted to the second filter 416, passes through the second filter 416 and is transmitted to the sixth connection hole 4121; the second wavelength optical signal generated by the second laser component 450 is transmitted to the third lens 4182, collimated by the third lens 4182 and then transmitted to the third filter 417, is reflected by the third filter 417 and transmitted to the second filter 416, passes through the second filter 416 and is transmitted to the sixth connection hole 4121; the third wavelength optical signal generated by the third laser component 460 is transmitted to the fourth lens 4183, collimated by the fourth lens 4183 and then transmitted to the second filter 416, is reflected by the second filter 416 and transmitted to the sixth connection hole 4121. The second filter 416 and the third filter 417 make the first wavelength optical signal, the second wavelength optical signal and the third wavelength optical signal share the same optical path when outputting from the second housing 410.

[0304] Figure 19A It is the structure of a mounting bracket according to some embodiments Figure 1 , Figure 19B It is the second showing of the structure of a mounting bracket according to some embodiments. As Figure 19A - Figure 19B shown, the mounting bracket 470 includes a bracket body 471, and a first support body 472 and a second support body 473 are arranged on the side of the bracket body 471. The bottom of the bracket body 471 is used to connect the support plate 419; one end of the first support body 472 is connected to the bracket body 471, and the other end of the first support body 472 extends in a direction away from the bracket body 471; one end of the second support body 473 is connected to the bracket body 471, and the other end of the second support body 473 extends in a direction away from the bracket body 471; a gap 474 is formed between the first support body 472 and the second support body 473. The gap 474 is used to transmit the first wavelength optical signal and the third wavelength optical signal.

[0305] In some embodiments, a first support surface 4721 is provided on one side of the first support body 472, and a second support surface 4722 is provided on the other side of the first support body 472. A third support surface 4731 is provided on one side of the second support body 473, and a fourth support surface 4732 is provided on the other side of the second support body 473. The first support surface 4721 and the third support surface 4731 are inclined at a first preset angle, and the second support surface 4722 and the fourth support surface 4732 are inclined at a second preset angle. The first support surface 4721 and the third support surface 4731 support and connect the second filter 416, and the second support surface 4722 and the fourth support surface 4732 support and connect the third filter 417, facilitating the fixation of the second filter 416 and the third filter 417.

[0306] In some embodiments, a first limiting surface 4711 and a second limiting surface 4712 are further provided on the bracket body 471. The first limiting surface 4711 and the second limiting surface 4712 are respectively located on the side edges of the bracket body 471. The first limiting surface 4711 is located at one end of the first support surface 4721, and the second limiting surface 4712 is located at one end of the second support surface 4722. Exemplarily, one end of the first limiting surface 4711 and one end of the second limiting surface 4712 respectively extend to the top of the bracket body 471, and the other end of the first limiting surface 4711 and the other end of the second limiting surface 4712 respectively extend to the bottom of the bracket body 471. The first limiting surface 4711 is in limiting connection with the second filter 416, and the second limiting surface 4712 is in limiting connection with the third filter 417. The first limiting surface 4711 and the second limiting surface 4712 facilitate the precise assembly of the second filter 416 and the third filter 417.

[0307] In some embodiments, a first driving chip 320, a second driving chip 330, a third driving chip 340, and an MCU 350 are provided on the circuit board 300. The first driving chip 320 is electrically connected to the first laser assembly 440 and the second light receiving component 540. The first driving chip 320 is used to drive the first laser assembly 440 to generate a first wavelength optical signal and receive and process the electrical signal output by the second light receiving component 540 when receiving a fifth wavelength optical signal. The second driving chip 330 is electrically connected to the second laser assembly 450 and the first light receiving component 530. The second driving chip 330 is used to drive the second laser assembly 450 to generate a second wavelength optical signal and receive and process the electrical signal output by the first light receiving component 530 when receiving a fourth wavelength optical signal. The third driving chip 340 is electrically connected to the third laser assembly 460 and the third light receiving component 550. The third driving chip 340 is used to drive the second laser assembly 450 to generate a third wavelength optical signal and receive and process the electrical signal output by the third light receiving component 550 when receiving a sixth wavelength optical signal. The MCU 350 is connected to the gold finger 310 and is controllably connected to the first driving chip 320, the second driving chip 330, and the third driving chip 340.

[0308] Figure 20A A partial view of another light emitting component according to some embodiments Figure 1 , Figure 20B A partial view of another light emitting component according to some embodiments Figure 2 . In some embodiments, as shown in Figure 20A and Figure 20B , an opening 4100 is formed in the second housing 410, and the opening 4100 faces the first side wall 412. The light emitting component 400 may include an electrical connector 401, and the electrical connector 401 is embedded and connected to the opening 4100, so that one end of the electrical connector 401 is located inside the second housing 410 and the other end is located outside the second housing 420. A pad is formed at one end of the electrical connector 401, and the pad is used for electrically connecting the electrical components inside the second housing 410; a pad is formed at the other end of the electrical connector 401, and the pad is used for electrically connecting the flexible circuit board to electrically connect to the circuit board 300 through the flexible circuit board.

[0309] In some embodiments, the first laser assembly 440 is disposed at the edge of one end of the electrical connector 401. The first laser assembly 440 can be wire-bonded to the electrical connector 401. Exemplarily, one side of the first laser assembly 440 can be close to the fourth side wall 415, and the backlight side of the first laser assembly 440 is close to the edge of one end of the electrical connector 401.

[0310] In some embodiments, the second laser assembly 450 is disposed at the edge of one end of the electrical connector 401. The second laser assembly 450 can be wire-bonded to the electrical connector 401. Exemplarily, one side of the second laser assembly 450 can be close to the second side wall 413, and the backlight side of the second laser assembly 450 is close to the edge of one end of the electrical connector 401.

[0311] In some embodiments, the third laser assembly 460 is disposed at the edge of one end of the electrical connector 401. The third laser assembly 460 can be wire-bonded to the electrical connector 401. Exemplarily, the third laser assembly 460 is located between the first laser assembly 440 and the third laser assembly 460, and the backlight side of the third laser assembly 460 is close to the edge of one end of the electrical connector 401.

[0312] In some embodiments, the light emitting component 400 may include a multiplexing component 402. The multiplexing component 402 is disposed on the transmission optical path from the first laser assembly 440 to the sixth connection hole 4121, and is used to adjust the transmission optical path of the optical emission signals generated by the first laser assembly 440, etc., so that the optical emission signals generated by the first laser assembly 440, etc. are collinear when output from the second housing 410.

[0313] In some embodiments, the multiplexing component 402 may include a wavelength division multiplexer, a polarization component, a polarization multiplexing component, etc.

[0314] In some embodiments, the multiplexing component 402 may include a fourth filter 4021, and the fourth filter 4021 is located on the output optical path of the first laser component 440. Exemplarily, the fourth filter 4021 includes an incident surface and a filtering surface.

[0315] In some embodiments, the multiplexing component 402 may include a fifth filter 4022, and the fifth filter 4022 is located on the output optical path of the third laser component 460. Exemplarily, the fifth filter 4022 includes an incident surface, a first filtering surface, a second filtering surface, and an output surface.

[0316] In some embodiments, the multiplexing component 402 may include a sixth filter 4023, and the sixth filter 4023 is located on the output optical path of the second laser component 450. Exemplarily, the sixth filter 4023 includes an incident surface, a first filtering surface, and a second filtering surface.

[0317] In some embodiments, the filtering surface of the fourth filter 4021 is connected to the second filtering surface of the fifth filter 4022, and the first filtering surface of the fifth filter 4022 is connected to the second filtering surface of the sixth filter 4023.

[0318] In some embodiments, the optical emission component 400 may include a first isolator 403, and the first isolator 403 is disposed on the transmission optical path from the first laser component 440 to the fourth filter 4021. The first isolator 403 is configured to prevent the optical signal reflected back by the fourth filter 4021 from being transmitted back to the first laser component 440. Exemplarily, the first isolator 403 is located on the transmission optical path from the second lens 4181 to the fourth filter 4021.

[0319] In some embodiments, the optical emission component 400 may include a second isolator 404, and the second isolator 404 is disposed on the transmission optical path from the second laser component 450 to the sixth filter 4023. The second isolator 404 is configured to prevent the optical signal reflected back by the sixth filter 4023 from being transmitted back to the second laser component 450. Exemplarily, the second isolator 404 is located on the transmission optical path from the third lens 4182 to the sixth filter 4023.

[0320] In some embodiments, the optical emission component 400 may include a third isolator 405, and the third isolator 405 is disposed on the transmission optical path from the third laser component 460 to the fifth filter 4022. The third isolator 405 is configured to prevent the optical signal reflected back by the fifth filter 4022 from being transmitted back to the third laser component 460. Exemplarily, the third isolator 405 is located on the transmission optical path from the fourth lens 4183 to the fifth filter 4022.

[0321] In some embodiments, the first-wavelength optical signal generated by the first laser assembly 440 is collimated by the second lens 4181 and then transmitted to the first isolator 403. It passes through the first isolator 403 and is transmitted to the incident surface of the fourth filter 4021. It is transmitted through the incident surface of the fourth filter 4021 to the filtering surface of the fourth filter 4021, and successively passes through the filtering surface of the fourth filter 4021 and the second filtering surface of the fifth filter 4022, and is output through the light-emitting surface of the fifth filter 4022.

[0322] In some embodiments, the second-wavelength optical signal generated by the second laser assembly 450 is collimated by the third lens 4182 and then transmitted to the second isolator 404. It passes through the second isolator 404 and is transmitted to the incident surface of the sixth filter 4023. It is transmitted through the incident surface of the sixth filter 4023 to the first filtering surface of the sixth filter 4023, and is reflected by the first filtering surface of the sixth filter 4023 and transmitted to the second filtering surface of the sixth filter 4023. It successively passes through the second filtering surface of the sixth filter 4023 and the first filtering surface of the fifth filter 4022 and is transmitted to the second filtering surface of the fifth filter 4022. It is reflected by the second filtering surface of the fifth filter 4022 and transmitted to the light-emitting surface of the fifth filter 4022, and is output through the light-emitting surface of the fifth filter 4022.

[0323] In some embodiments, the third-wavelength optical signal generated by the third laser assembly 460 is collimated by the fourth lens 4183 and then transmitted to the third isolator 405. It passes through the third isolator 405 and is transmitted to the incident surface of the fifth filter 4022. It is transmitted through the incident surface of the fifth filter 4022 to the first filtering surface of the fifth filter 4022, and is reflected by the first filtering surface of the fifth filter 4022 and then transmitted to the second filtering surface of the fifth filter 4022. It is reflected by the second filtering surface of the fifth filter 4022 and transmitted to the light-emitting surface of the fifth filter 4022, and is output through the light-emitting surface of the fifth filter 4022.

[0324] Figure 21A is an exploded view of another optical emission component according to some embodiments. In some embodiments, as Figure 21A shown, a first mounting hole 4145 may be formed on the third side wall 414, and the first mounting hole 4145 communicates with the inner cavity of the second housing 410. The optical emission component 400 may include a first laser assembly 440a, and the front end of the first laser assembly 440a is connected to the first mounting hole 4145, so that the light-emitting end of the first laser assembly 440a is located inside the second housing 410.

[0325] In some embodiments, a second mounting hole 413 may be formed on the second sidewall 413, and the second mounting hole 413 communicates with the inner cavity of the second housing 410. The light emitting component 400 may include a second laser assembly 450a, and the front end of the second laser assembly 450a is connected to the second mounting hole 413, so that the light emitting end of the second laser assembly 450a is located inside the second housing 410.

[0326] In some embodiments, a third mounting hole 4151 may be formed on the fourth sidewall 415, and the third mounting hole 4151 communicates with the inner cavity of the second housing 410. The light emitting component 400 may include a third laser assembly 460a, and the front end of the third laser assembly 460a is connected to the third mounting hole 4151, so that the light emitting end of the third laser assembly 460a is located inside the second housing 410.

[0327] In some embodiments, a multiplexing component 402a is disposed inside the second housing 410, and the output end of the multiplexing component 402a is located on the input optical path of the sixth connection hole 4121, so that the optical emission signals generated by the first laser assembly 440a, etc., share the same optical path when outputting from the second housing 410.

[0328] Figure 21B It is a structural diagram of another multiplexing component according to some embodiments. Figure 21C It is a cross-sectional view of another multiplexing component according to some embodiments. In some embodiments, the multiplexing component 402 may include a seventh filter 4025. The seventh filter 4025 is located on the output optical path of the second laser assembly 450a and is also located on the input optical path of the sixth connection hole 4121. The seventh filter 4025 is used to reflect and transmit the second wavelength optical signal generated by the second laser assembly 450a to the sixth connection hole 4121, so that the light transmitted along the direction perpendicular to the input optical path of the sixth connection hole 4121 can be input into the sixth connection hole 4121.

[0329] In some embodiments, the multiplexing component 402 may include an eighth filter 4024. The eighth filter 4024 is located on the output optical path of the third laser assembly 460a and is also located on the input optical path of the sixth connection hole 4121. The eighth filter 4024 is used to reflect and transmit the third wavelength optical signal generated by the third laser assembly 460a to the sixth connection hole 4121, so that the light transmitted along the direction perpendicular to the input optical path of the sixth connection hole 4121 can be input into the sixth connection hole 4121.

[0330] In some embodiments, the first wavelength optical signal generated by the first laser assembly 440a passes through the seventh filter 4025 and the eighth filter 4024 in sequence and is transmitted to the sixth connection hole 4121.

[0331] In some embodiments, the multiplexing component 402 may include a connecting member 4026, and the connecting member 4026 supports and connects the seventh filter 4025 and the eighth filter 4024 to facilitate the fixation of the seventh filter 4025 and the eighth filter 4024 in the second housing 420.

[0332] In some embodiments, a first connection surface 4026a is formed on the connecting member 4026, and the first connection surface 4026a supports and connects the eighth filter 4024.

[0333] In some embodiments, a second connection surface 4026b is formed on the connecting member 4026, and the second connection surface 4026b supports and connects the seventh filter 4025.

[0334] In some embodiments, a third connection surface 4026c is formed on the connecting member 4026, and the third connection surface 4026c faces the second laser component 450a.

[0335] In some embodiments, a through hole 4026d may be formed on the connecting member 4026, and the through hole 4026d penetrates through the first connection surface 4026a, the second connection surface 4026b, and the third connection surface 4026c. The through hole 4026d can reduce the loss of the first wavelength optical signal and the like by the connecting member 4026.

[0336] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them; although the present disclosure has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module, characterized in that: include: Optical fiber adapter, transmitting optical transmission signal and optical reception signal; The optical receiving component comprises a first housing and an optical component arranged in the first housing, wherein one end of the first housing is connected to the optical fiber adapter; a first connecting hole and a second connecting hole are formed on the first housing; the first connecting hole is connected to the first light receiving component, and the second connecting hole is connected to the second light receiving component; A light emitting component, one end of which is connected to the other end of the first housing; The optical transmission signal generated by the optical transmission component is transmitted to the optical fiber adapter through the first housing; Wherein, the optical component comprises: a first displacement prism, wherein a first reflection surface of the first displacement prism is located on a transmission light path of the optical fiber adapter; A first filter is located on the reflected light path of the second reflecting surface of the first displacement prism; A first reflector, located on the reflected light path of the first filter; A wavelength division multiplexer, wherein a light input port is formed on a first side, and a first output end and a second output end are formed on a second side; the light input port is located on a reflection light path of the reflector; A second displacement prism, wherein the first emitting surface of the second displacement prism is located on the output light path of the first output end; the first light receiving component is located on the reflected light path of the second emitting surface of the second displacement prism; and the second light receiving component is located on the output light path of the second output end.

2. The optical module according to claim 1, characterized in that: A first accommodating chamber, a second accommodating chamber and a third accommodating chamber are formed inside the first shell; The second accommodating cavity extends along one side of the first shell, a first baffle is provided between the first accommodating cavity and the second accommodating cavity, a first through cavity is provided on the first baffle, and the first accommodating cavity is connected to the second accommodating cavity through the first through cavity; the first connecting hole and the second connecting hole are respectively connected to the second accommodating cavity, and the second displacement prism is located in the second accommodating cavity; The third accommodating cavity is located at the side of the other end of the first housing, a second baffle is arranged between the first accommodating cavity and the third accommodating cavity, and a second through cavity is formed on the second baffle; a fifth connecting hole is formed on the side wall of the other end of the first housing, and the fifth connecting hole is connected to the third accommodating cavity; The optical component further includes a fourth displacement prism, which is disposed in the third accommodating cavity; one end of the fourth displacement prism is located on a side of the fifth connecting hole, and the other end is located on a side of the first filter.

3. The optical module according to claim 1, characterized in that: The optical emitting component comprises a second shell and a first laser assembly and a second laser assembly, a first adapter board and a second adapter board arranged in the second shell; a plurality of rows of pins are arranged on a third side wall of the second shell, the pins in the bottom row on the third side wall comprise a first high-frequency pin and a second high-frequency pin, one end of the first high-frequency pin and one end of the second high-frequency pin pass through the third side wall and extend into the second shell; the first laser assembly generates a first wavelength optical signal, and the second laser assembly generates a second wavelength optical signal; The first adapter plate and the second adapter plate are arranged on the side of the third side wall, the first laser assembly is located on the side of the first adapter plate, the second laser assembly is located on the side of the second adapter plate, and the first laser assembly and the second laser assembly are distributed on the sides of two connected side walls of the second housing; A first high-frequency transmission line is arranged on the first adapter board, and a second high-frequency transmission line is arranged on the second adapter board; the first laser component and the first high-frequency pin are electrically connected to the first high-frequency transmission line respectively, and the second laser component and the second high-frequency pin are electrically connected to the second high-frequency transmission line respectively.

4. The optical module according to claim 3, characterized in that: A plurality of rows of pins are arranged on the fourth side wall of the second housing, and the second laser assembly is arranged on the side of the fourth side wall; A third adapter plate is also provided in the second shell, and the third adapter plate is provided between the second laser assembly and the second adapter plate and is located at the edge of the connection between two connected side walls of the second shell; a third high-frequency transmission line is provided on the third adapter plate, and one end of the third high-frequency transmission line is connected to the second laser assembly by bonding, and the other end of the third high-frequency transmission line is connected to the second high-frequency transmission line by bonding.

5. The optical module according to claim 3, characterized in that: The third side wall is provided with a first step surface and a first side surface, the bottom of the first side surface is connected to the first step surface; the first adapter board and the second adapter board are provided on the first step surface, one end of the first high-frequency pin passes through the first side surface and extends to the top of the first adapter board, and one end of the second high-frequency pin passes through the first side surface and extends to the top of the second adapter board; The first high-frequency pin is connected to the first high-frequency transmission line by soldering, and the second high-frequency pin is connected to the second high-frequency transmission line by soldering.

6. The optical module according to claim 5, characterized in that: A first ground layer and a second ground layer are arranged on the front side of the first adapter board, and a ground layer is arranged on the back side of the first adapter board; the first ground layer is arranged on one side of the first high-frequency transmission line, and the second ground layer is arranged on the other side of the first high-frequency transmission line; the first ground layer and the second ground layer are respectively connected to the ground layers through vias, and the ground layers are electrically connected to the first step surface.

7. The optical module according to claim 4, characterized in that: A TEC, a support plate and a fourth adapter plate are also arranged in the second housing, the bottom of the TEC is connected to the bottom plate of the second housing, the support plate is arranged on the top of the TEC, and the support plate supports the first laser assembly, the second laser assembly and the fourth adapter plate; A first TEC pad and a second TEC pad are disposed on the TEC, and the first TEC pad and the second TEC pad are disposed on the side of the second side wall of the second housing; The first metal layer and the second metal layer are arranged on the fourth adapter board, and the first TEC pin and the second TEC pin are also arranged on the third side wall. The first metal layer is respectively connected with the first TEC pad and the first TEC pin by wires, and the second metal layer is respectively connected with the second TEC pad and the second TEC pin by wires.

8. An optical module, characterized in that: include: Optical fiber adapter, transmitting optical transmission signal and optical reception signal; The optical receiving component comprises a first housing and an optical component arranged in the first housing, wherein one end of the first housing is connected to the optical fiber adapter; a second connecting hole and a third connecting hole are formed on the first housing; the second connecting hole is connected to the second light receiving component, and the third connecting hole is connected to the third light receiving component; A light emitting component, one end of which is connected to the other end of the first housing; The optical transmission signal generated by the optical transmission component is transmitted to the optical fiber adapter through the first housing; Wherein, the optical component comprises: a first displacement prism, wherein a first reflection surface of the first displacement prism is located on a transmission light path of the optical fiber adapter; A first filter is located on the reflected light path of the second reflecting surface of the first displacement prism; A first reflector, located on the reflected light path of the first filter; A wavelength division multiplexer, wherein a light input port is formed on a first side, and a second output port and a third output port are formed on a second side; the light input port is located on a reflection light path of the reflection mirror; A third displacement prism, wherein the first reflection surface of the third displacement prism is located on the output light path of the third output end; the second light receiving component is located on the output light path of the second output end, and the third light receiving component is located on the reflection light path of the second reflection surface of the third displacement prism.

9. An optical module, characterized in that: Optical fiber adapter, transmitting optical transmission signal and optical reception signal; The optical housing component comprises a first housing and an optical component arranged in the first housing; a fourth connection hole is formed at one end of the first housing, the fourth connection hole is connected to the optical fiber adapter; a fifth connection hole is formed at the other end of the first housing; The first shell is formed with a first connection hole and a second connection hole; The first connection hole is connected to the first light receiving component, and the second connection hole is connected to the second light receiving component; Wherein, the optical component comprises: A wavelength division multiplexer, wherein a light input port and a fifth output port are formed on the first side, and a light port and a fourth output port are formed on the second side; the light input port is located on the transmission light path of the fourth connection hole, and the light port is located on the transmission light path of the fifth connection hole; A second reflector, located on the output light path of the fourth output end; A third reflector, located on the output light path of the fifth output end; A light emitting component, one end of which is connected to the other end of the first housing; a light emitting signal generated by the light emitting component is transmitted to the first housing through the fifth connecting hole and is transmitted to the optical fiber adapter through the wavelength division multiplexer; The first light receiving component is located on the reflected light path of the second reflecting mirror, and the second light receiving component is located on the reflected light path of the third reflecting mirror.

10. An optical module, characterized in that: Optical fiber adapter, transmitting optical transmission signal and optical reception signal; The optical housing component comprises a first housing and an optical component arranged in the first housing; a fourth connection hole is formed at one end of the first housing, the fourth connection hole is connected to the optical fiber adapter; a fifth connection hole is formed at the other end of the first housing; The first shell is formed with a first connection hole and a second connection hole; The first connection hole is connected to the first light receiving component, and the second connection hole is connected to the second light receiving component; Wherein, the optical component comprises: A wavelength division multiplexer, wherein a light input port and a seventh output end are formed on a first side, and an eighth output end is formed on a second side; the first side is close to an end of the first housing; A first optical filter, located at a side of the first side and located on a transmission light path of the fourth connecting hole; A first reflector, located at a side of the first side and on a reflection light path of the first filter; a fifth reflector, located at a side of the first side and on a reflection light path of the first reflector; the light entrance is located on the reflection light path of the fifth reflector; A sixth reflector, located on the output light path of the seventh output end; A beam splitter prism, located on the output light path of the eighth output end; A light emitting component, one end of which is connected to the other end of the first housing; a light emitting signal generated by the light emitting component passes through the first housing, and the light emitting signal passes through the first filter and is transmitted to the optical fiber adapter; The first light receiving component is located on the reflected light path of the sixth reflecting mirror, and the second light receiving component is located on the reflected light path of the beam splitter prism.

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