Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component. The multilayer electronic component includes a first internal electrode layer, a second internal electrode layer, and two or more third internal electrode layers including third internal electrodes spaced apart from the first and second external electrodes, the third internal electrode layer is disposed between a first internal electrode layer having the first internal electrode and the first dummy electrode and a second internal electrode layer having the second internal electrode and the second dummy electrode.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2023-0160216 filed on November 20, 2023, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a multilayer electronic assembly. Background Art

[0003] Multilayer ceramic capacitors (a type of multilayer electronic component) are chip capacitors mounted on printed circuit boards of various electronic products (such as display devices including, for example, liquid crystal displays (LCDs), plasma display panels (PDPs), and computers, smartphones, mobile phones, etc.) for charging or discharging.

[0004] Multilayer ceramic capacitors, which have advantages such as small size, high capacitance, and easy mounting, can be used as components in various electronic devices, and as various electronic devices such as computers and mobile devices become smaller and have higher output, the demand for miniaturization and high capacitance of multilayer ceramic capacitors is increasing.

[0005] To improve the withstand voltage characteristics of multilayer ceramic capacitors, a voltage-dividing structure using floating electrodes has been developed. However, in the prior art floating electrode structure, the longitudinal gap between the floating electrodes results in a reduced overlap area, which significantly reduces the capacitance. Summary of the Invention

[0006] One aspect of the present disclosure provides a highly reliable multilayer electronic assembly.

[0007] Another aspect of the present disclosure provides a multilayer electronic component having improved capacitance per unit volume.

[0008] Another aspect of the present disclosure provides a multilayer electronic component having improved withstand voltage characteristics.

[0009] Another aspect of the present disclosure provides a multilayer electronic component having a structure that allows for efficient production.

[0010] However, the purpose of the present disclosure is not limited to the above and may be more easily understood in the course of describing specific exemplary embodiments of the present disclosure.

[0011] According to one aspect of the present disclosure, a multilayer electronic component includes: a body including a first internal electrode layer, a second internal electrode layer, and at least one third internal electrode layer, the first internal electrode layer including a first dielectric layer and a first internal electrode and a first dummy electrode arranged on the first dielectric layer and spaced apart from each other, the second internal electrode layer including a second dielectric layer and a second internal electrode and a second dummy electrode arranged on the second dielectric layer and spaced apart from each other, the at least one third internal electrode layer including a third dielectric layer and a third internal electrode arranged on the third dielectric layer, the body including a first surface and a second surface opposite to each other in a first direction, a third surface connected to the first surface and the second surface and opposite to each other in a second direction a third surface and a fourth surface, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; a first external electrode, arranged on the third surface and connected to the first internal electrode and the second dummy electrode; and a second external electrode, arranged on the fourth surface and connected to the second internal electrode and the first dummy electrode, wherein the third internal electrode is arranged to be spaced apart from the third surface and the fourth surface, the first internal electrode layers and the second internal electrode layers are alternately arranged in the first direction, and the at least one third internal electrode layer includes two or more third internal electrode layers arranged between the first internal electrode layer and the second internal electrode layer.

[0012] According to another aspect of the present disclosure, a multilayer electronic component includes: a body including a first internal electrode layer, a second internal electrode layer, and at least one third internal electrode layer, the first internal electrode layer including a first dielectric layer and a first internal electrode and a first dummy electrode arranged on the first dielectric layer and spaced apart from each other, the second internal electrode layer including a second dielectric layer and a second internal electrode and a second dummy electrode arranged on the second dielectric layer and spaced apart from each other, the at least one third internal electrode layer including a third dielectric layer and a third internal electrode arranged on the third dielectric layer, the body including a first surface and a second surface opposite to each other in a first direction, and a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction , and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; a first external electrode, arranged on the third surface and connected to the first internal electrode and the second dummy electrode; and a second external electrode, arranged on the fourth surface and connected to the second internal electrode and the first dummy electrode, wherein the third internal electrode is arranged to be spaced apart from the third surface and the fourth surface, the first internal electrode layer and the second internal electrode layer are alternately arranged in the first direction, and when the sizes of the first internal electrode, the first dummy electrode and the third internal electrode in the second direction are Li1, Ld1 and Li3 respectively, Li3 is substantially equal to Li1+Ld1. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description taken in conjunction with the accompanying drawings, in which: Figure 1 is a perspective view schematically illustrating a multilayer electronic component according to an exemplary embodiment of the present disclosure; Figure 2 It is along Figure 1 A schematic cross-sectional view taken along line II'; Figure 3 It is along Figure 1 A schematic cross-sectional view taken along line II-II'; Figure 4 shows a plan view of a first internal electrode layer, a second internal electrode layer, and a third internal electrode layer; Figure 5 A first sheet for manufacturing a multilayer electronic component according to an exemplary embodiment of the present disclosure is shown; Figure 6 is a diagram illustrating a stacking method of a multilayer electronic component according to an exemplary embodiment of the present disclosure; Figure 7 A cross section of a prior art multilayer electronic component having a suspended electrode structure in a first direction and a second direction is shown; Figure 8 is a diagram illustrating a capacitance forming region of a multilayer electronic component according to an exemplary embodiment of the present disclosure; and Figure 9 FIG. 1 is a diagram illustrating a capacitor forming region of a related art multilayer electronic component having a floating electrode structure. DETAILED DESCRIPTION

[0014] Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention may be exemplified in many different forms and should not be construed as being limited to the specific exemplary embodiments set forth herein. Rather, these exemplary embodiments are provided so that this disclosure will be thorough and complete and will fully convey the scope of the present invention to those skilled in the art. In the accompanying drawings, the shapes and sizes of elements may be exaggerated for clarity, and the same reference numerals will be used throughout to represent the same or similar elements.

[0015] In order to clarify the present disclosure, parts not related to the description are omitted throughout the specification, and the same reference numerals represent the same elements. In the drawings, the thickness of layers, films, panels, regions, etc. is exaggerated for clarity. In addition, in the drawings, the same reference numerals represent the same elements even though they are shown in different drawings. Throughout the specification, unless explicitly described to the contrary, the word "include" and variations such as "contain" or "comprise" will be understood to imply the inclusion of the elements stated but not the exclusion of any other elements.

[0016] In the drawings, a first direction may be defined as a stacking direction or a thickness (T) direction, a second direction may be defined as a length (L) direction, and a third direction may be defined as a width (W) direction. Multilayer electronic components

[0017] Figure 1 is a perspective view schematically illustrating a multilayer electronic component according to an exemplary embodiment of the present disclosure.

[0018] Figure 2 It is along Figure 1 Schematic cross-sectional view taken along line II'.

[0019] Figure 3 It is along Figure 1 Schematic cross-sectional view taken along line II-II'.

[0020] Figure 4 A plan view showing a first internal electrode layer, a second internal electrode layer, and a third internal electrode layer.

[0021] In the following, reference is made to Figures 1 to 4The multilayer electronic component 100 according to an exemplary embodiment of the present disclosure is described in detail. In addition, a multilayer ceramic capacitor (MLCC) is described as an example of the multilayer electronic component, but the present disclosure is not limited thereto.

[0022] A multilayer electronic component 100 according to an exemplary embodiment of the present disclosure includes a body 110, a first external electrode 131, and a second external electrode 132. The body 110 includes a first internal electrode layer EL1, a second internal electrode layer EL2, and a third internal electrode layer EL3. The first internal electrode layer EL1 includes a first dielectric layer 111-1, a first internal electrode 121 and a first dummy electrode 121d disposed on the first dielectric layer 111-1 and spaced apart from each other. The second internal electrode layer EL2 includes a second dielectric layer 111-2, a second internal electrode 122 and a second dummy electrode 122d disposed on the second dielectric layer 111-2 and spaced apart from each other. The third internal electrode layer EL3 includes a third dielectric layer 111-3 and a third internal electrode 123 disposed on the third dielectric layer 111-3. The body 110 may include a first surface 1 and a second surface 2 opposing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first and second surfaces and opposing each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first to fourth surfaces and opposing each other in a third direction. The first external electrode 131 is provided on the third surface 3 and connected to the first internal electrode 121 and the second dummy electrode 122d; and the second external electrode 132 is provided on the fourth surface 4 and connected to the second internal electrode 122 and the first dummy electrode 121d. The third internal electrode 123 may be provided spaced apart from the third surface 3 and the fourth surface 4. The first internal electrode layers EL1 and the second internal electrode layers EL2 are alternately arranged in the first direction, and two or more third internal electrode layers EL3 may be provided between the first internal electrode layers EL1 and the second internal electrode layers EL2.

[0023] In order to improve the withstand voltage characteristics, a structure using floating electrodes to divide the voltage has been developed. However, in the prior art floating electrode structure, the longitudinal gap between the floating electrodes results in a reduction in the overlap area, which significantly reduces the capacitance.

[0024] Reference Figure 7, shows cross-sections in the first and second directions of a multilayer electronic component 10 having a floating electrode structure in the prior art. The multilayer electronic component 10 in the prior art has a structure in which first electrode portions and second electrode portions are alternately arranged in the stacking direction. In the first electrode portion, the first inner electrode 21 a connected to the first outer electrode 131, the second inner electrode 21 b connected to the second outer electrode 132, and the first floating electrode 21 c arranged between the first inner electrode 21 a and the second inner electrode 21 b are arranged on the same plane. In the second electrode portion, the second floating electrode 22 a and the third floating electrode 22 b are arranged on the same plane.

[0025] Conventional floating electrode structures aim to improve withstand voltage characteristics by reducing the voltage applied to the ends of electrodes 21a, 21b, 21c, 22a, and 22b. However, the gaps between electrodes 21a, 21b, 21c, 22a, and 22b reduce the area where capacitance is formed, and the capacitance per unit volume decreases. To compensate for this, increasing the number of stacked electrodes can lead to an excessive increase in the number of electrode ends, which in turn degrades the withstand voltage characteristics.

[0026] In contrast, in the present disclosure, two or more third internal electrode layers EL3 including a third internal electrode 123 spaced apart from the first external electrode 131 and the second external electrode 132 are arranged between the first internal electrode layer EL1 including the first internal electrode 121 and the second internal electrode layer EL2 including the second internal electrode 122, thereby improving the capacitance per unit volume while improving the withstand voltage characteristics of the multilayer electronic component 100.

[0027] Figure 8 is a diagram illustrating a capacitance forming region of a multilayer electronic component according to an exemplary embodiment in the present disclosure. Figure 9 FIG. 1 is a diagram showing a capacitor forming region of a multilayer electronic component having a floating electrode structure in the prior art. Figure 8 and Figure 9 , it can be seen that the capacitance forming areas A1, A2, and A3 indicated by the hatching of the multilayer electronic component 100 according to the exemplary embodiment of the present disclosure are much larger than the capacitance forming area A' of the multilayer electronic component 10 of the prior art. Therefore, the multilayer electronic component 100 according to the exemplary embodiment of the present disclosure has an improved capacitance per unit volume compared to the multilayer electronic component 10 of the prior art, and when designed to have the same capacitance as the multilayer electronic component 10 of the prior art, the multilayer electronic component 100 according to the exemplary embodiment of the present disclosure can be manufactured to be smaller than the multilayer electronic component 10 of the prior art.

[0028] Furthermore, the greatest electrostrictive stress generally occurs at the ends of electrodes, and degradation of withstand voltage characteristics also occurs first at the ends of electrodes. According to the exemplary embodiment of the present disclosure, the number of electrode ends is reduced to approximately 25% compared to the conventional multilayer electronic component 10. Consequently, not only is the number of vulnerable areas where withstand voltage characteristics deteriorate reduced, but cracks generated at the electrode ends also propagate over a greater distance to cause leakage current, thereby delaying withstand voltage breakdown.

[0029] Hereinafter, each component included in the multilayer electronic component 100 according to the exemplary embodiment in the present disclosure is described.

[0030] Although there is no particular limitation on the specific shape of the body 110, the body 110 may have a hexahedral shape or the like as shown. Due to the shrinkage of the ceramic powder particles included in the body 110 during the sintering process, the body 110 may not have a completely straight hexahedral shape, but may have a substantially hexahedral shape.

[0031] The main body 110 may have a first surface 1 and a second surface 2 opposite to each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2 and connected to the third surface 3 and the fourth surface 4 and opposite to each other in a third direction.

[0032] Because edge regions where the internal electrodes 121, 122, and 123 are not provided overlap on the dielectric layer 111, steps due to the thickness of the internal electrodes 121, 122, and 123 occur, and thus, when viewed from the first surface 1 or the second surface 2, corners connecting the first surface 1 to the third surface 3 and the fourth surface 4 and / or corners connecting the second surface 2 to the third surface 3 and the fourth surface 4 may shrink in the first direction toward the center of the body 110. Alternatively, due to shrinkage behavior occurring during the sintering process of the body 110, when viewed from the first surface 1 or the second surface 2, corners connecting the first surface 1 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 and / or corners connecting the second surface 2 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 may shrink in the first direction toward the center of the body 110. Optionally, in order to prevent chipping defects, the corners of each surface of the connecting body 110 can be rounded by performing a separate process, so that the corners connecting the first surface 1 to the third surface 3, the fourth surface 4, the fifth surface 5 and the sixth surface 6 and / or the corners connecting the second surface 2 to the third surface 3, the fourth surface 4, the fifth surface 5 and the sixth surface 6 can have a rounded shape.

[0033] The multiple dielectric layers 111 constituting the main body 110 are in a sintered state, and adjacent dielectric layers 111 may be integral, such that the boundary between them may not be easily distinguishable without using a scanning electron microscope (SEM). The number of stacked dielectric layers is not particularly limited and can be determined in consideration of the size of the multilayer electronic component. For example, the main body can be formed by stacking 400 or more dielectric layers.

[0034] The dielectric layer 111 can be formed by preparing a ceramic slurry including ceramic powder, an organic solvent, and a binder, coating the slurry on a carrier film and drying it to prepare a green ceramic sheet, and then sintering the green ceramic sheet. The ceramic powder is not particularly limited as long as sufficient electrostatic capacitance can be obtained using it. For example, a barium titanate (BaTiO3)-based powder can be used as the ceramic powder. For a more specific example, the ceramic powder can be a barium titanate (BaTiO3)-based powder, a CaZrO3-based paraelectric powder, etc. For a more specific example, the barium titanate (BaTiO3)-based powder can be BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1- y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1), and the CaZrO3-based paraelectric powder can be (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1).

[0035] Therefore, the dielectric layer 111 can include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), and (Ca 1-x Sr x )(Zr 1-y Tiy )One or more of O3 (0 < x < 1, 0 < y < 1). In an exemplary embodiment, the dielectric layer 111 may include (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1) as a main component.

[0036] The dielectric layer 111 may include a first dielectric layer 111-1, a second dielectric layer 111-2, and a third dielectric layer 111-3. Here, the first dielectric layer 111-1, the second dielectric layer 111-2, and the third dielectric layer 111-3 may be formed of the same material.

[0037] The main body 110 may include a capacitance forming portion Ac, and cover portions 112 and 113. The capacitance forming portion Ac is disposed inside the main body 110 and includes a first inner electrode layer EL1, a second inner electrode layer EL2, and a third inner electrode layer EL3 to form a capacitance. The cover portions 112 and 113 are formed on the upper surface and the lower surface of the capacitance forming portion Ac.

[0038] The cover portions 112 and 113 may include an upper cover portion 112 disposed above the capacitance forming portion Ac in a first direction and a lower cover portion 113 disposed below the capacitance forming portion Ac in the first direction.

[0039] The upper cover portion 112 and the lower cover portion 113 may be formed by stacking a single dielectric layer or two or more dielectric layers on the upper surface and the lower surface of the capacitance forming portion Ac in the thickness direction, and may be mainly used to prevent damage to the inner electrodes due to physical stress or chemical stress.

[0040] The upper cover portion 112 and the lower cover portion 113 may not include inner electrodes and may include the same material as that of the dielectric layer 111.

[0041] That is, the upper cover portion 112 and the lower cover portion 113 may include a ceramic material, for example, a barium titanate (BaTiO3)-based ceramic material.

[0042] In addition, edge portions 114 and 115 may be disposed on the side surface of the capacitance forming portion Ac.

[0043] The edge portions 114 and 115 may include a first edge portion 114 disposed on one side surface of the capacitance forming portion Ac and a second edge portion 115 disposed on the other side surface. That is, the edge portions 114 and 115 may be disposed on two side surfaces of the capacitance forming portion Ac in the width direction.

[0044] As Figure 3As shown, the edge portions 114 and 115 may refer to regions between both ends of the internal electrodes 121 , 122 , and 123 and a boundary surface of the body 110 in a cross section of the body 110 taken in a width-thickness (WT) direction.

[0045] In the width-thickness (WT) direction cross section of the body 110 , edge portions 114 and 115 are formed at both ends of the internal electrodes 121 , 122 , and 123 .

[0046] The edge portions 114 and 115 may mainly serve to prevent the inner electrodes from being damaged due to physical stress or chemical stress.

[0047] The edge portions 114 and 115 may be formed by not coating the conductive paste for the internal electrodes in regions on the ceramic green sheets where the edge portions are to be formed.

[0048] The first internal electrode layer EL1 may include a first dielectric layer 111-1, and a first internal electrode 121 and a first dummy electrode 121 d disposed on the first dielectric layer 111-1 and spaced apart from each other. The second internal electrode layer EL2 may include a second dielectric layer 111-2, and a second internal electrode 122 and a second dummy electrode 122 d disposed on the second dielectric layer 111-2 and spaced apart from each other. The third internal electrode layer EL3 may include a third dielectric layer 111-3 and a third internal electrode 123 disposed on the third dielectric layer 111-3.

[0049] The first internal electrode layers EL1 and the second internal electrode layers EL2 may be alternately arranged in the first direction, and two or more third internal electrode layers EL3 may be provided between the first internal electrode layers EL1 and the second internal electrode layers EL2. When two or more third internal electrode layers EL3 are provided, withstand voltage characteristics can be improved, and even if cracks occur at the ends of the electrodes, the cracks can be delayed from causing a leakage current path.

[0050] The first internal electrode 121 may be spaced apart from the fourth surface 4 and exposed through the third surface 3 , the second internal electrode 122 may be spaced apart from the third surface 3 and exposed through the fourth surface 4 , and the third internal electrode 123 may be disposed spaced apart from the third and fourth surfaces 3 and 4 .

[0051] The first external electrode 131 may be disposed on the third surface 3 of the body 110 and connected to the first internal electrode 121 , and the second external electrode 132 may be disposed on the fourth surface 4 of the body 110 and connected to the second internal electrode 122 .

[0052] That is, the first internal electrode 121 is not connected to the second external electrode 132 but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131 but is connected to the second external electrode 132. Therefore, the first internal electrode 121 may be formed at a certain distance from the fourth surface 4, and the second internal electrode 122 may be formed at a certain distance from the third surface 3. In addition, the first internal electrode 121 and the second internal electrode 122 may be arranged to be spaced apart from the fifth surface 5 and the sixth surface 6 of the body 110.

[0053] The first dummy electrode 121d may be connected to the second external electrode 132, and the second dummy electrode 122d may be connected to the first external electrode 131. The first and second dummy electrodes 121d and 122d may not contribute to forming capacitance but may serve to compensate for a step caused by an internal electrode.

[0054] The conductive metal included in the internal electrodes 121, 122, and 123 and the dummy electrodes 121d and 122d may be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and alloys thereof, but the present disclosure is not limited thereto.

[0055] In an exemplary embodiment, the first internal electrode 121, the second internal electrode 122, and the third internal electrode 123 overlap in at least a portion of the first direction, and the first dummy electrode 121d, the second dummy electrode 122d, and the third internal electrode 123 may not overlap in the first direction. Therefore, the first internal electrode 121, the second internal electrode 122, and the third internal electrode 123 may contribute to the formation of capacitance, while the first dummy electrode 121d and the second dummy electrode 122d may not contribute to the formation of capacitance.

[0056] In an exemplary embodiment, three or more third internal electrode layers EL3 may be provided between the first internal electrode layer EL1 and the second internal electrode layer EL2. Therefore, withstand voltage characteristics may be further improved, and even if cracks are generated at the ends of the electrodes, the leakage current path may be further delayed.

[0057] In an exemplary embodiment, when the dimensions of the first, second, and third internal electrodes in the second direction are Li1, Li2, and Li3, respectively, Li3>Li1 and Li3>Li2 may be satisfied. Therefore, a structure capable of efficient production may be provided, and even when two or more third internal electrode layers EL3 are provided between the first and second internal electrode layers EL1 and EL2, the multilayer electronic component 100 may be manufactured using only the printed sheet GS1 on which one type of printed pattern is printed.

[0058] Specifically, refer to Figure 5 and Figure 6, showing a method of manufacturing a multilayer electronic component according to an exemplary embodiment of the present disclosure, a multilayer electronic component 100 according to an exemplary embodiment of the present disclosure can be manufactured using only a printed sheet GS1 on which one type of pattern 120 is printed. Since the cover portions 112 and 113 are formed by stacking ceramic green sheets GS on which no printed pattern is printed, the multilayer electronic component 100 can be manufactured without wasting extra sheets.

[0059] If the printing pattern B for forming the third internal electrode 123 is printed separately from the printing pattern A for forming the first and second internal electrodes 121 and 122 on the ceramic green sheet, and the printing pattern A and the printing pattern B are repeatedly printed, the printing pattern A printed between the printing patterns B cannot be used and is wasted. For example, the printing pattern A, the printing pattern B, the printing pattern A, and the printing pattern B are sequentially printed, and in order to manufacture a structure in which two or more third internal electrodes 123 are stacked between the first and second internal electrodes 121 and 122, the printing pattern A printed between the printing patterns B cannot be used and is wasted.

[0060] However, in this application, reference is made to Figure 6 , when stacking, after stacking some printed sheets GS1, the printed sheets GS1 can be stacked to be offset by specific distances D1 and D2 based on the cutting line CL, so that only the printed sheets GS1 are used to realize a structure having the first internal electrode 121, the second internal electrode 122 and the third internal electrode 123 and the first dummy electrode 121d and the second dummy electrode 122d, therefore, Li3>Li1 and Li3>Li2.

[0061] In an exemplary embodiment, when the distances between the third inner electrode 123 and the third and fourth surfaces 3 and 4 are LG3a and LG3b, respectively, and the sizes of the first and second dummy electrodes 121d and 122d in the second direction are Ld1 and Ld2, respectively, LG3a>Ld2 and LG3b>Ld1 may be satisfied.

[0062] Here, Ld1 may be greater than or equal to 85 μm and less than or equal to 115 μm, and Ld2 may be greater than or equal to 85 μm and less than or equal to 115 μm.

[0063] In addition, LG3a may be greater than or equal to 190 μm and less than or equal to 275 μm, and LG3b may be greater than or equal to 190 μm and less than or equal to 275 μm.

[0064] In an exemplary embodiment, the distance between the first inner electrode 121 and the first dummy electrode 121d is LG1, the distance between the second inner electrode 122 and the second dummy electrode 122d is LG2, and the distances between the third inner electrode 123 and the third surface 3 and the fourth surface 4 are LG3a and LG3b, respectively, which may satisfy LG1>LG3a, LG1>LG3b, LG2>LG3a, and LG2>LG3b.

[0065] Here, LG1 may be greater than or equal to 380 μm and less than or equal to 550 μm, LG2 may be greater than or equal to 380 μm and less than or equal to 550 μm, LG3a may be greater than or equal to 190 μm and less than or equal to 275 μm, and LG3b may be greater than or equal to 190 μm and less than or equal to 275 μm.

[0066] In addition, when the dimension of the body 110 in the second direction is Lb, LG1 / Lb may be greater than or equal to 0.12 and less than or equal to 0.18, but is not limited thereto. In addition, LG2 / Lb may be greater than or equal to 0.12 and less than or equal to 0.18, but is not limited thereto.

[0067] As described above, when stacking is performed using only the printed sheets GS1 on which one type of printed pattern 120 is printed, in the case where some of the printed sheets GS1 are stacked such that they are offset by specific distances D1 and D2 based on the cutting line CL after stacking, the sum of the distances (LG3a+LG3b) between the third internal electrode 123 and the third surface 3 and the fourth surface 4 may be substantially the same as the distance LG1 between the first internal electrode 121 and the first dummy electrode 121d. However, the present disclosure is not limited thereto, and deviations may occur due to manufacturing errors, differences in shrinkage rates by position during sintering, and the like.

[0068] Similarly, when the sizes of the first internal electrode 121, the first dummy electrode 121d, and the third internal electrode 123 in the second direction are Li1, Ld1, and Li3, respectively, Li3 may be substantially equal to Li1+Ld1. Furthermore, Li3 may be substantially equal to Li2+Ld2. However, the present disclosure is not limited thereto, and deviations may occur due to manufacturing errors, differences in shrinkage rates by position during sintering, and the like.

[0069] As used herein, the expression "substantially equal" may refer to being approximately the same as one another between the objects being compared. In one or more aspects, the terms "about," "substantially," and "approximately" may provide an industry-accepted tolerance for relativity between their corresponding terms and / or items, such as a tolerance of ±1%, ±5%, or ±10% of the actual value, as well as other suitable tolerances.

[0070] In an exemplary embodiment, when the space between the first inner electrode 121 and the first dummy electrode 121d is the first space G1 and the space between the second inner electrode 122 and the second dummy electrode 122d is the second space G2, one end of the third inner electrode 123 in the second direction may be set to overlap with the first space G1 in the first direction, and the other end of the third inner electrode 123 in the second direction may be set to overlap with the second space G2 in the first direction.

[0071] In an exemplary embodiment, when the spaces between the third inner electrode 123 and the third and fourth surfaces 3 and 4 are the 3a space G3a and the 3b space G3b, respectively, one end of the first dummy electrode 121d in the body 110 may be disposed to overlap with the 3b space G3b in the first direction, and one end of the second dummy electrode 122d in the body 110 may be disposed to overlap with the 3a space G3a in the first direction.

[0072] In exemplary embodiments, in the second direction, one end of the first internal electrode 121 and one end of the second internal electrode 122 may each be disposed closer to the center of the body 110 than both ends of the third internal electrode 123 .

[0073] In addition, the average thickness of the dielectric layer 111 is not particularly limited, but can be, for example, 0.1 μm to 10 μm. The average thickness of the internal electrodes 121, 122, and 123 is not particularly limited, but can be, for example, 0.05 μm to 2.0 μm. In addition, the average thickness of the dielectric layer 111 and the average thickness of the internal electrodes 121, 122, and 123 can be arbitrarily set according to the desired characteristics or purpose. For example, to achieve miniaturization and high capacitance, in the case of an electronic component for a high-voltage power device, the average thickness of the dielectric layer 111 can be less than 2.8 μm and the average thickness of the internal electrodes 121, 122, and 123 can be less than 1 μm. In addition, to achieve miniaturization and high capacitance, in the case of an electronic component for a small IT device, the average thickness of the dielectric layer 111 can be less than or equal to 0.4 μm and the average thickness of the internal electrodes 121, 122, and 123 can be less than or equal to 0.4 μm.

[0074] The average thickness of the dielectric layer 111 and the average thickness of the internal electrodes 121, 122, and 123 may refer to the average dimensions of the dielectric layer 111 and the internal electrodes 121, 122, and 123, respectively, in the first direction. The average thickness of the dielectric layer 111 and the average thickness of the internal electrodes 121 and 122 may be measured by scanning a cross-section of the body 110 in the first and second directions using a scanning electron microscope (SEM) at a magnification of 10,000x. More specifically, for the average thickness of the dielectric layer 111, the thickness may be measured at multiple points (e.g., 30 points equally spaced in the second direction) on the dielectric layer 111, and the average value may be calculated. Furthermore, for the average thickness of the internal electrodes 121 and 122, the thickness may be measured at multiple points (e.g., 30 points equally spaced in the second direction) on the internal electrode 121 or 122, and the average value may be calculated. These 30 equally spaced points may be specified in the capacitor-forming portion Ac. Additionally, average values ​​of ten dielectric layers 111 and ten internal electrodes 121 and 122 may be measured, respectively, and then averaged to further generalize the average thickness of the dielectric layer 111 and the average thickness of the internal electrodes 121 and 122 .

[0075] The first external electrode 131 may be disposed on the third surface 3 of the body 110 and may be connected to the first internal electrode 121 and the second dummy electrode 122 d . The second external electrode 132 may be disposed on the fourth surface 4 of the body 110 and may be connected to the second internal electrode 122 and the first dummy electrode 121 d .

[0076] In addition, the external electrodes 131 and 132 may be formed using any material having conductivity, such as metal, and a specific material may be determined in consideration of electrical characteristics, structural stability, etc., and may further have a multi-layered structure.

[0077] For example, the external electrodes 131 and 132 may include electrode layers 131 a and 132 a disposed on the body 110 , and plating layers 131 b and 132 b formed on the electrode layers 131 a and 132 a , respectively.

[0078] For a more specific example of the electrode layers 131 a and 132 a , the electrode layers 131 a and 132 a may be sintered electrodes including a conductive metal and glass or may be resin-based electrodes including a conductive metal and resin.

[0079] In addition, the electrode layers 131a and 132a can be formed by sequentially forming a sintered electrode and a resin-based electrode on the main body. In addition, the electrode layers 131a and 132a can be formed by transferring a sheet including a conductive metal onto the main body or by transferring a sheet including a conductive metal onto a sintered electrode.

[0080] As the conductive metal included in the electrode layers 131a and 132a, a material having excellent conductivity may be used without particular limitation. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and alloys thereof.

[0081] The plating layers 131b and 132b are used to improve mounting characteristics. The plating layers 131b and 132b are not particularly limited in type, and may be plating layers including one or more of Ni, Sn, Pd, and alloys thereof, and may be formed of a plurality of layers.

[0082] For a more specific example of the plating layers 131b and 132b, the plating layers 131b and 132b may include a Ni plating layer or a Sn plating layer, may include a Ni plating layer and a Sn plating layer sequentially formed on the electrode layers 131a and 132a, and may include a Sn plating layer, a Ni plating layer, and a Sn plating layer sequentially formed. In addition, the plating layers 131b and 132b may include multiple Ni plating layers and / or multiple Sn plating layers.

[0083] The size of the multilayer electronic component 100 is not particularly limited. For example, the length (L) of the multilayer electronic component 100 may be 2900 μm to 3100 μm, the thickness (T) of the multilayer electronic component 100 may be 1500 μm to 1700 μm, and the width of the multilayer electronic component 100 may be 1450 μm to 1550 μm.

[0084] Here, the length (L) of the multilayer electronic component 100 may refer to the maximum dimension of the multilayer electronic component 100 in the second direction, the thickness (T) of the multilayer electronic component 100 may refer to the maximum dimension of the multilayer electronic component 100 in the first direction, and the width (W) of the multilayer electronic component 100 may refer to the maximum dimension of the multilayer electronic component 100 in the third direction.

[0085] As one of various effects of the present disclosure, capacitance per unit volume of a multilayer electronic component can be improved while improving withstand voltage characteristics.

[0086] As one of various effects of the present disclosure, a multilayer electronic component having a structure capable of achieving efficient production can be provided.

[0087] While exemplary embodiments have been shown and described above, it will be readily apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component comprising: a body, comprising a first inner electrode layer, a second inner electrode layer, and at least one third inner electrode layer, the first inner electrode layer comprising a first dielectric layer and a first inner electrode and a first dummy electrode disposed on the first dielectric layer to be spaced apart from each other, the second inner electrode layer comprising a second dielectric layer and a second inner electrode and a second dummy electrode disposed on the second dielectric layer to be spaced apart from each other, each of the at least one third inner electrode layer comprising a third dielectric layer and a third inner electrode disposed on the third dielectric layer, the body comprising a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; a first outer electrode disposed on the third surface and connected to the first inner electrode and the second dummy electrode; as well as a second outer electrode disposed on the fourth surface and connected to the second inner electrode and the first dummy electrode, wherein the third inner electrode is arranged to be spaced apart from the third surface and the fourth surface, The first internal electrode layers and the second internal electrode layers are alternately arranged in the first direction, and The at least one third internal electrode layer includes two or more third internal electrode layers disposed between the first internal electrode layer and the second internal electrode layer.

2. The multilayer electronic component according to claim 1, wherein The first to third internal electrodes overlap in at least a partial region in the first direction, and the first dummy electrode and the second dummy electrode do not overlap with the third internal electrode in the first direction.

3. The multilayer electronic component according to claim 1, wherein: The at least one third internal electrode layer includes three or more third internal electrode layers disposed between the first internal electrode layer and the second internal electrode layer.

4. The multilayer electronic component according to claim 1, wherein: Li3>Li1 and Li3>Li2, wherein Li1, Li2 and Li3 are sizes of the first internal electrode, the second internal electrode and the third internal electrode in the second direction, respectively.

5. The multilayer electronic component according to claim 1, wherein LG3a>Ld2 and LG3b>Ld1, wherein LG3a and LG3b are distances between the third inner electrode and the third and fourth surfaces, respectively, and Ld1 and Ld2 are sizes of the first and second dummy electrodes in the second direction, respectively.

6. The multilayer electronic component according to claim 5, wherein: Ld1 is equal to or greater than 85 μm and equal to or less than 115 μm, and Ld2 is equal to or greater than 85 μm and equal to or less than 115 μm.

7. The multilayer electronic component according to claim 5, wherein: LG3a is greater than or equal to 190 μm and less than or equal to 275 μm, and LG3b is greater than or equal to 190 μm and less than or equal to 275 μm.

8. The multilayer electronic component according to claim 1, wherein LG1>LG3a, LG1>LG3b, LG2>LG3a, and LG2>LG3b, wherein LG1 is the distance between the first inner electrode and the first dummy electrode, LG2 is the distance between the second inner electrode and the second dummy electrode, and LG3a and LG3b are the distances between the third inner electrode and the third surface and the fourth surface, respectively.

9. The multilayer electronic component according to claim 8, wherein: LG1 is equal to or larger than 380 μm and equal to or smaller than 550 μm, and LG2 is equal to or larger than 380 μm and equal to or smaller than 550 μm.

10. The multilayer electronic component according to claim 9, wherein LG3a is greater than or equal to 190 μm and less than or equal to 275 μm, and LG3b is greater than or equal to 190 μm and less than or equal to 275 μm.

11. The multilayer electronic component according to claim 1, wherein When the space between the first inner electrode and the first dummy electrode is a first space and the space between the second inner electrode and the second dummy electrode is a second space, One end of the third internal electrode in the second direction is disposed to overlap the first space in the first direction, and the other end of the third internal electrode in the second direction is disposed to overlap the second space in the first direction.

12. The multilayer electronic component according to claim 1, wherein When the spaces between the third inner electrode and the third surface and the fourth surface are 3a space and 3b space respectively, One end of the first dummy electrode close to the center of the body is disposed to overlap the 3b space in the first direction and one end of the second dummy electrode close to the center of the body is disposed to overlap the 3a space in the first direction.

13. The multilayer electronic component according to claim 1, wherein A sum of distances between the third inner electrode and the third surface and the fourth surface is equal to a distance between the first inner electrode and the first dummy electrode.

14. The multilayer electronic component according to claim 1, wherein When the sizes of the first internal electrode, the first dummy electrode, and the third internal electrode in the second direction are Li1, Ld1, and Li3, respectively, Li3 is equal to Li1+Ld1.

15. The multilayer electronic component according to claim 1, wherein In the second direction, one end of the first internal electrode and one end of the second internal electrode are both disposed closer to the center of the body than both ends of the third internal electrode.

16. A multilayer electronic component comprising: a body, comprising a first inner electrode layer, a second inner electrode layer, and at least one third inner electrode layer, the first inner electrode layer comprising a first dielectric layer and a first inner electrode and a first dummy electrode disposed on the first dielectric layer to be spaced apart from each other, the second inner electrode layer comprising a second dielectric layer and a second inner electrode and a second dummy electrode disposed on the second dielectric layer to be spaced apart from each other, each of the at least one third inner electrode layer comprising a third dielectric layer and a third inner electrode disposed on the third dielectric layer, the body comprising a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; a first outer electrode disposed on the third surface and connected to the first inner electrode and the second dummy electrode; as well as a second outer electrode disposed on the fourth surface and connected to the second inner electrode and the first dummy electrode, wherein the third inner electrode is arranged to be spaced apart from the third surface and the fourth surface, The first internal electrode layers and the second internal electrode layers are alternately arranged in the first direction, and When the sizes of the first internal electrode, the first dummy electrode, and the third internal electrode in the second direction are Li1, Ld1, and Li3, respectively, Li3 is equal to Li1+Ld1.

17. The multilayer electronic component according to claim 16, wherein: The first to third internal electrodes overlap in at least a partial region in the first direction, and the first dummy electrode and the second dummy electrode do not overlap with the third internal electrode in the first direction.

18. The multilayer electronic component according to claim 16, wherein: When the space between the first inner electrode and the first dummy electrode is a first space and the space between the second inner electrode and the second dummy electrode is a second space, One end of the third internal electrode in the second direction is disposed to overlap with the first space in the first direction, and the other end of the third internal electrode in the second direction is disposed to overlap with the second space in the first direction.

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