Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component, which may include: a body including a dielectric layer and having first and second surfaces opposite to each other in a first direction, third and fourth surfaces opposite to each other, and fifth and sixth surfaces opposite to each other; the first side edge part and the second side edge part are respectively arranged on the fifth surface and the sixth surface; and first and second external electrodes disposed on the third and fourth surfaces, respectively. The main body may include an active portion including internal electrodes alternately disposed with the dielectric layers, and upper and lower cover portions disposed above and below the active portion in a first direction, respectively. At least one of the first side edge portion and the second side edge portion may include an inner edge portion covering at least a portion of the effective portion and an outer edge portion disposed on the inner edge portion and in contact with the upper cover portion and the lower cover portion.

Description

[0001] This application claims the benefit of priority of Korean Patent Application No. 10-2023-0161418, filed on Nov. 20, 2023, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a multi-layer electronic component. Background Art

[0003] A multi-layer ceramic capacitor (MLCC), which is a multi-layer electronic component, may be a chip capacitor for charging or discharging any electronic product mounted on a printed circuit board of any electronic product such as an imaging device including a liquid crystal display (LCD) or a plasma display panel (PDP), a computer, a smart phone, or a mobile phone.

[0004] Such a multi-layer ceramic capacitor has a small size, enables high capacitance, and is easily mounted on a circuit board, and thus can be used as a component of various electronic devices. As various electronic devices such as computers and mobile devices have smaller sizes and higher outputs, there is an increasing demand for multi-layer ceramic capacitors having smaller sizes and higher capacitances.

[0005] In addition, as the attention to electronic components for automobiles has recently increased, multi-layer ceramic capacitors are required to have high reliability and high strength characteristics for use in automobiles or infotainment systems.

[0006] In order to achieve miniaturization and high capacitance in a multi-layer ceramic capacitor, it is necessary to maximize the electrode effective area (increase the effective volume fraction required to achieve capacitance).

[0007] In order to implement a multi-layer ceramic capacitor having the above-described small size and high capacitance, when manufacturing a multi-layer ceramic capacitor, by exposing an inner electrode in the width direction of a body, maximizing the size of the inner electrode in the width direction through a non-edge design, and attaching a side edge portion to an exposed surface of the electrode in the width direction of the sheet in an operation before sintering after manufacturing such a sheet, a multi-layer ceramic capacitor is completed.

[0008] However, due to foreign substances present on the surface of the cut body and a shrinkage rate difference between the body and the side edge portion during a plasticizing and / or sintering operation, the side edge portion may not be properly bonded to the body, which may cause a problem in that a gap between the side edge portion and the body becomes wider. Summary of the Invention

[0009] One aspect of the present disclosure is to improve the reliability of a multi-layer electronic component.

[0010] One aspect of the present disclosure is to solve the problem of widening of the gap between the side edge portion and the main body.

[0011] However, the object of the present disclosure is not limited to the above, and can be more easily understood during the description of the specific embodiments of the present disclosure.

[0012] According to one aspect of the present disclosure, a multilayer electronic component may include: a main body including a plurality of dielectric layers, the main body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; a first side edge portion and a second side edge portion respectively provided on the fifth surface and the sixth surface; and a first outer electrode and a second outer electrode respectively provided on the third surface and the fourth surface. The main body may include an effective portion, an upper covering portion, and a lower covering portion. The effective portion includes inner electrodes alternately arranged with the dielectric layers in the first direction. The upper covering portion is provided above the effective portion in the first direction. The lower covering portion is provided below the effective portion in the first direction. And at least one of the first side edge portion and the second side edge portion may include an inner edge portion and an outer edge portion. The inner edge portion covers at least a part of the effective portion on the corresponding surface of the fifth surface and the sixth surface. The outer edge portion is provided on the inner edge portion and is provided to contact the upper covering portion and the lower covering portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Through the following specific embodiments in conjunction with the drawings, the above and other aspects, features, and advantages of the present disclosure will be more clearly understood.

[0014] Figure 1 A perspective view of a multilayer electronic component according to an embodiment of the present disclosure is schematically shown.

[0015] Figure 2 is Figure 1 a perspective view of the multilayer electronic component without the outer electrodes.

[0016] Figure 3 is a perspective view showing the Figure 1 multilayer electronic component without the outer electrodes and the side edge portions.

[0017] Figure 4 is Figure 1 a cross-sectional view taken along line I-I' of

[0018] Figure 5 is Figure 1 a cross-sectional view taken along line II-II' of

[0019] Figure 6 is Figure 5 an enlarged view of the K1 region in

[0020] Figure 7 is Figure 5 an enlarged view of the K2 region in

[0021] Figure 8 is a diagram corresponding to Figure 7 according to another embodiment.

[0022] Figure 9 is a diagram corresponding to Figure 7 according to another embodiment.

[0023] Figure 10 and Figure 11 are diagrams for showing a method of manufacturing a multilayer electronic component according to an embodiment of the present disclosure, Figure 10 showing a diagram before attaching a side edge portion, Figure 11 showing a diagram after attaching a side edge portion. DETAILED DESCRIPTION

[0024] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. However, the present disclosure can be illustrated in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art. Therefore, for clear description, the shapes and dimensions of the elements in the drawings may be exaggerated, and the elements indicated by the same reference numerals in the drawings are the same elements.

[0025] In the drawings, irrelevant descriptions will be omitted to clearly describe the present disclosure, and the thickness may be exaggerated to clearly show multiple layers and regions. The same reference numerals will be used to describe the same elements having the same functions within the scope of the same concept. Throughout the specification, unless otherwise specifically stated, when a component is referred to as "including" or "comprising", it means that it may further include other components, rather than excluding other components.

[0026] In the drawings, the first direction may refer to the stacking direction or the thickness direction, the second direction may refer to the length direction, and the third direction may refer to the width direction.

[0027] Multi-layer electronic component Figure 1 A perspective view of a multilayer electronic component according to an embodiment of the present disclosure is schematically shown.

[0028] Figure 2 is Figure 1 a perspective view of the multilayer electronic component without an external electrode.

[0029] Figure 3 is a perspective view of a multi-layer electronic component that does not include outer electrodes and side edge portions. Figure 1

[0030] Figure 4 is Figure 1 a cross-sectional view taken along line I-I' of

[0031] Figure 5 is Figure 1 a cross-sectional view taken along line II-II' of

[0032] Figure 6 is Figure 5 an enlarged view of region K1 in

[0033] Figure 7 is Figure 5 an enlarged view of region K2 in

[0034] Hereinafter, a multi-layer electronic component according to an embodiment of the present disclosure will be described in detail with reference to Figures 1 to 7

[0035] According to an embodiment of the present disclosure, the multi-layer electronic component 100 may include: a main body 110 including a plurality of dielectric layers 111, the main body having a first surface 1 and a second surface 2 opposite to each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 to the fourth surface 4 and opposite to each other in a third direction; side edge portions 114 and 115 provided on the fifth surface 5 and the sixth surface 6; and outer electrodes 131 and 132 provided on the third surface 3 and the fourth surface 4. The main body may include an effective portion Ac, an upper covering portion 112, and a lower covering portion 113. The effective portion Ac includes inner electrodes 121 and 122 alternately arranged with the dielectric layers 111 in the first direction. The upper covering portion 112 is provided above the effective portion Ac in the first direction. The lower covering portion 113 is provided below the effective portion Ac in the first direction. And the side edge portions may include inner edge portions 114a and 115a and outer edge portions 114b and 115b. The inner edge portions 114a and 115a cover at least a part of the effective portion Ac on the fifth surface 5 and the sixth surface 6. The outer edge portions 114b and 115b are provided on the inner edge portions 114a and 115a and are arranged to contact the upper covering portion 112 and the lower covering portion 113.

[0036] In order to realize a multilayer ceramic capacitor with a small size and a high capacitance, when manufacturing a multilayer ceramic capacitor, by exposing the inner electrode in the width direction of the main body, maximizing the size of the inner electrode in the width direction through a non-edge design, and attaching the side edge portion separately to the exposed surface of the electrode in the width direction of the sheet during an operation before sintering after manufacturing such a sheet, a multilayer ceramic capacitor is completed.

[0037] However, due to foreign matters on the surface of the cut main body and the shrinkage rate difference between the main body and the side edge portion during the plasticizing and / or sintering operation, the side edge portion may not be properly bonded to the main body, which may cause a problem that the gap between the side edge portion and the main body becomes wider.

[0038] According to an embodiment of the present disclosure, since the side edge portions 114 and 115 include inner edge portions 114a and 115a and outer edge portions 114b and 115b, the inner edge portions 114a and 115a cover at least a part of the effective portion Ac on the fifth surface 5 and the sixth surface 6, and the outer edge portions 114b and 115b are provided on the inner edge portions 114a and 115a and are arranged to contact the upper covering portion 112 and the lower covering portion 113, the bonding force between the side edge portion and the main body can be improved, thereby suppressing the problem that the gap between the side edge portion and the main body becomes wider. In addition, when one of the side edge portions 114 and 115 satisfies the above description, the effect of improving the bonding force between the corresponding side edge portion and the main body can also be achieved.

[0039] Hereinafter, each component included in the multilayer electronic component 100 according to an embodiment of the present disclosure will be described.

[0040] The main body 110 has dielectric layers 111 and inner electrodes 121 and 122 alternately stacked therein.

[0041] The main body 110 is not limited to a specific shape, and as shown in the figure, it may have a hexahedron shape or a shape similar to a hexahedron shape. The main body 110 may not have a perfect straight hexahedron shape because the ceramic powder particles included in the main body 110 shrink in the process of sintering the main body. However, the main body 110 may have a substantially hexahedron shape.

[0042] The main body 110 may have a first surface 1 and a second surface 2 opposite to each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and opposite to each other in a third direction.

[0043] The plurality of dielectric layers 111 forming the main body 110 may be in a sintered state, and adjacent dielectric layers 111 may be integrated with each other such that the boundary therebetween may not be easily distinguishable without using a scanning electron microscope (SEM).

[0044] According to an embodiment of the present disclosure, the raw material for forming the dielectric layer 111 is not particularly limited as long as a sufficient electrostatic capacitance can be obtained therefrom. For example, the raw material for forming the dielectric layer 111 may be a barium titanate (BaTiO 3 )-based material, a lead composite perovskite-based material, a strontium titanate (SrTiO 3 )-based material, etc. The barium titanate-based material may include BaTiO 3 -based ceramic powder, and the ceramic powder may be, for example, BaTiO 3 , in which calcium (Ca), zirconium (Zr), etc. are partially solid-solved in BaTiO 3 , etc., such as (Ba 1- x Ca x )TiO 3 (0 < x < 1), Ba(Ti 1-y Ca y )O 3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O 3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1- y Zr y )O 3 (0 < y < 1).

[0045] For the purpose of the present disclosure, the material for forming the dielectric layer 111 may include various ceramic additives, organic solvents, binders, dispersants, etc. added to powder particles such as barium titanate (BaTiO 3 ) powder particles, etc.

[0046] The inner electrodes 121 and 122 may be alternately disposed with the dielectric layer 111.

[0047] The inner electrodes 121 and 122 may include a first inner electrode 121 and a second inner electrode 122. The first inner electrode 121 and the second inner electrode 122 may be alternately disposed opposite to each other, and the dielectric layer 111 forming the main body 110 may be interposed between the first inner electrode 121 and the second inner electrode 122, and may be respectively exposed to the third surface 3 and the fourth surface 4 of the main body 110.

[0048] In an embodiment, the inner electrodes 121 and 122 may include a first inner electrode 121 and a second inner electrode 122 alternately arranged in a first direction, and a dielectric layer 111 may be interposed between the first inner electrode 121 and the second inner electrode 122. The first inner electrode 121 may be exposed to the third surface 3, the fifth surface 5, and the sixth surface 6, and the second inner electrode 122 may be exposed to the fourth surface 4, the fifth surface 5, and the sixth surface 6.

[0049] Referring to Figure 3 , the first inner electrode 121 may be spaced apart from the fourth surface 4 and exposed through the third surface 3, and the second inner electrode 122 may be spaced apart from the third surface 3 and exposed through the fourth surface 4. Additionally, the first inner electrode 121 may be exposed through the third surface 3, the fifth surface 5, and the sixth surface 6, and the second inner electrode 122 may be exposed through the fourth surface 4, the fifth surface 5, and the sixth surface 6.

[0050] In this case, the first inner electrode 121 and the second inner electrode 122 may be electrically isolated from each other by the dielectric layer 111 provided between the first inner electrode 121 and the second inner electrode 122.

[0051] The inner electrodes 121 and 122 may include at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), and titanium (Ti) and their alloys.

[0052] The average thickness td of the dielectric layer 111 is not particularly limited. For example, the average thickness td of the dielectric layer 111 may be 0.1 μm to 10 μm. The average thickness te of the inner electrodes 121 and 122 is not particularly limited and may be, for example, 0.4 μm to 2.0 μm. Additionally, the average thickness td of the dielectric layer 111 and the average thickness te of the inner electrodes 121 and 122 may be arbitrarily set according to desired characteristics or purposes. For example, in the case of a small information technology (IT) electronic component, in order to achieve miniaturization and high capacitance, the average thickness td of the dielectric layer 111 may be 0.5 μm or less, and the average thickness te of the inner electrodes 121 and 122 may be 0.5 μm or less.

[0053] The average thickness td of the dielectric layer 111 and the average thickness te of the inner electrodes 121 and 122 can respectively represent the dimensions of the dielectric layer 111 and the inner electrodes 121 and 122 in the first direction. The average thickness td of the dielectric layer 111 and the average thickness te of the inner electrodes 121 and 122 can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average value can be measured by measuring the thickness of one dielectric layer 111 at multiple points (for example, 30 equally spaced points in the second direction). The 30 equally spaced points can be specified in the effective portion Ac. In addition, if the average value measurement is extended to 10 dielectric layers 111 and 10 inner electrodes 121 and 122 to measure the average value, the average thickness td of the dielectric layer 111 and the average thickness te of the inner electrodes 121 and 122 can be more generalized.

[0054] The main body 110 may include: an effective portion Ac provided in the main body 110 and including a first inner electrode 121 and a second inner electrode 122, the first inner electrode 121 and the second inner electrode 122 being arranged opposite to each other and a dielectric layer 111 being interposed between the first inner electrode 121 and the second inner electrode 122 and having a capacitor formed therein; and covering portions 112 and 113 formed above and below the effective portion Ac in the first direction.

[0055] In addition, the effective portion Ac is a portion that contributes to the formation of the capacitance of the capacitor, and can be formed by repeatedly stacking a plurality of first inner electrodes 121 and a plurality of second inner electrodes 122 and interposing the dielectric layer 111 between the plurality of first inner electrodes 121 and the plurality of second inner electrodes 122.

[0056] The upper covering portion 112 and the lower covering portion 113 can be formed by stacking a single dielectric layer or two or more dielectric layers on the upper surface and the lower surface of the effective portion Ac in the thickness direction, respectively, and the upper covering portion 112 and the lower covering portion 113 can be mainly used to prevent damage to the inner electrodes due to physical stress or chemical stress.

[0057] The upper covering portion 112 and the lower covering portion 113 do not include inner electrodes and can include the same material as the dielectric layer 111.

[0058] That is, the upper covering portion 112 and the lower covering portion 113 can include a ceramic material, for example, a barium titanate (BaTiO 3 )-based ceramic material.

[0059] In addition, the thickness of the covering portions 112 and 113 is not particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the thickness tc of the covering portions 112 and 113 can be 30 μm or less.

[0060] The average thickness tc of the covering parts 112 and 113 can represent the dimension of the covering parts 112 and 113 in the first direction, and can be a value obtained by averaging the dimensions of the covering parts 112 and 113 in the first direction measured at five points with equal intervals above or below the effective part Ac.

[0061] In addition, the side edge parts 114 and 115 can be provided on the side surfaces of the effective part Ac.

[0062] The side edge parts 114 and 115 can include a first side edge part 114 provided on the fifth surface 5 of the main body 110 and a second side edge part 115 provided on the sixth surface 6 of the main body 110. That is, the side edge parts 114 and 115 can be provided on the two side surfaces of the main body 110 in the third direction.

[0063] The side edge parts 114 and 115 can be mainly used to prevent the inner electrodes from being damaged due to physical stress or chemical stress.

[0064] The side edge parts 114 and 115 can include inner edge parts 114a and 115a and outer edge parts 114b and 115b. The inner edge parts 114a and 115a cover at least a part of the effective part Ac on the fifth surface and the sixth surface, and the outer edge parts 114b and 115b are provided on the inner edge parts and are arranged to contact the upper covering part 112 and the lower covering part 113. Therefore, the bonding force between the side edge parts 114 and 115 and the main body 110 can be improved, thereby preventing the gap between the side edge parts 114 and 115 and the main body 110 from widening.

[0065] Since the main body 110 includes the effective part Ac and the covering parts 112 and 113, and the effective part Ac includes not only the dielectric layer 111 but also the inner electrodes 121 and 122, when forming the side edge parts by attaching only one type of sheet as in the prior art, it is difficult to improve the bonding force between the side edge parts and the effective part Ac and the bonding force between the side edge parts and the covering parts 112 and 113 at the same time. On the contrary, in the present disclosure, since the inner edge parts 114a and 115a are used to increase the bonding force between the side edge parts 114 and 115 and the effective part Ac, and the outer edge parts 114b and 115b are used to increase the bonding force between the side edge parts 114 and 115 and the covering parts 112 and 113, the bonding force between the side edge parts 114 and 115 and the effective part Ac and the bonding force between the side edge parts 114 and 115 and the covering parts 112 and 113 can be improved at the same time.

[0066] In an embodiment, the outer edge portions 114b and 115b may be arranged to cover the upper and lower ends of the inner edge portions 114a and 115a in a first direction. Accordingly, a step difference may be formed in the regions where the outer edge portions 114b and 115b cover the upper and lower ends of the inner edge portions 114a and 115a in the first direction.

[0067] In an embodiment, the inner edge portions 114a and 115a may be arranged to completely cover the active portion Ac on the fifth and sixth surfaces. Accordingly, the contact area between the inner edge portions 114a and 115a and the active portion may be increased to further improve the bonding strength between the side edge portions 114 and 115 and the main body 110.

[0068] However, the inner edge portions 114a and 115a are not limited to covering only the active portion Ac. In an embodiment, the upper ends of the inner edge portions 114a and 115a in the first direction may contact the upper covering portion 112 on the fifth and sixth surfaces, and the lower ends of the inner edge portions 114a and 115a in the first direction may contact the lower covering portion 113 on the fifth and sixth surfaces.

[0069] In an embodiment, a step difference may be formed in the regions where the outer edge portions 114b and 115b cover the upper and lower ends of the inner edge portions 114a and 115a in the first direction. This is because, since the outer edge portions 114b and 115b cover the inner edge portions 114a and 115a, the width of the side edge portion in a third direction is correspondingly reduced in the regions where the inner edge portions 114a and 115a are not provided.

[0070] In an embodiment, the outer edge portions 114b and 115b may be arranged to completely cover the inner edge portions 114a and 115a. That is to say, the outer edge portions 114b and 115b may be arranged to cover not only both ends of the inner edge portions 114a and 115a in the first direction but also both ends of the inner edge portions 114a and 115a in a second direction to completely cover the inner edge portions 114a and 115a.

[0071] Referring to Figure 7 , the upper ends of the outer edge portions 114b and 115b in the first direction may be arranged in the same plane as the second surface, and the lower ends of the outer edge portions in the first direction may be arranged in the same plane as the first plane.

[0072] However, considering manufacturing errors and the like in the side edge portion, the outer edge portion does not necessarily have to have such a shape.

[0073] For example, according to another embodiment of the present disclosure, as Figure 8As shown, the upper end of the outer edge portion 114b' in the first direction may be set to be lower than the second surface in the first direction, and the lower end of the outer edge portion 114b' in the first direction may be set to be higher than the first surface in the first direction. In this case, the upper end of the outer edge portion 114b' in the first direction may contact the upper covering portion 112 on the fifth surface 5, and the lower end of the outer edge portion 114b' in the first direction may contact the lower covering portion 113 on the fifth surface 5. The outer edge portion on the sixth surface 6 may be similarly configured, and the corresponding description will be omitted to avoid redundancy.

[0074] In addition, according to another embodiment of the present disclosure, as Figure 9 shown, the upper end of the outer edge portion 114b'' in the first direction may be set above the second surface 2 in the first direction, and the lower end of the outer edge portion 114b'' in the first direction may be set below the first surface 1 in the first direction. In this case, at least a part of the outer edge portion 114b'' may be provided on the first surface 1 and the second surface 2. The outer edge portion mainly provided on the sixth surface 6 may be similarly configured, and the corresponding description will be omitted to avoid redundancy.

[0075] In an embodiment, the average width Tma of the inner edge portions 114a and 115a in the third direction may be greater than or equal to 0.5 μm and less than or equal to 5 μm. When the average width Tma is less than 0.5 μm, it may be difficult to stably form the inner edge portions 114a and 115a. When the average width Tma exceeds 5 μm, due to the increase in the size of the step difference caused by the inner edge portions 114a and 115a, there is a concern that the outer edge portions 114b and 115b may not be properly combined.

[0076] In an embodiment, the average width Tmb of the outer edge portions 114b and 115b in the third direction may be greater than or equal to 15 μm and less than or equal to 40 μm. When the average width Tmb is less than 15 μm, the capacitance per unit volume may decrease or the reliability may be reduced due to external shocks, moisture penetration, etc. When the average width Tmb exceeds 40 μm, there is a risk that the capacitance per unit volume may decrease.

[0077] In an embodiment, when the average width of the inner edge portions 114a and 115a in the third direction is Tma and the average width of the outer edge portions 114b and 115b in the third direction is Tmb, Tmb / Tma may be greater than or equal to 3 and less than or equal to 80. Therefore, the following effects can be further improved: while improving the bonding force between the side edge portions 114 and 115 and the main body 110, reliability is ensured.

[0078] In an embodiment, the widths of the side edge portions 114 and 115 in the third direction at their centers in the first direction are Tm1, and the widths of the side edge portions 114 and 115 in the third direction at their upper ends in the first direction are Tm2. Tm1 - Tm2 may be greater than or equal to 0.5 μm and less than or equal to 5 μm. This is because the inner edge portions 114a and 115a are not provided at the upper ends of the side edge portions 114 and 115 in the first direction. Therefore, the widths of the side edge portions 114 and 115 in the third direction at their upper ends in the first direction are equivalent to the amounts obtained by subtracting the widths of the inner edge portions 114a and 115a in the third direction.

[0079] In addition, the widths of the side edge portions 114 and 115 in the third direction in the regions where the inner edge portions 114a and 115a are provided may be substantially the same, and the width deviation may be within 5%. When referring Figure 5 to a more detailed description, the widths of the side edge portions 114 and 115 in the third direction measured from the outermost inner electrodes 121 and 122 in the first direction may be substantially equal to the widths of the side edge portions 114 and 115 in the third direction at their centers in the first direction, and the width deviation may be within 5%.

[0080] The average widths Tma, Tmb, Tm1, and Tm2 may be measured through a cross-section of the main body in the first and third directions intercepted from the center of the main body 110 in the second direction. The average widths Tma and Tmb may be values obtained by averaging the respective width values measured at five points equally spaced on the side surfaces of the side edge portions 114 and 115 in the effective portion Ac.

[0081] In an embodiment, the inner edge portions 114a and 115a may have compositions different from those of the outer edge portions 114b and 115b. When the inner edge portions 114a and 115a and the outer edge portions 114b and 115b have the same composition, it may be difficult to simultaneously improve the bonding strength between the side edge portion and the effective portion Ac and the bonding strength between the side edge portion and the covering portions 112 and 113.

[0082] The inner edge portions 114a and 115a may have compositions the same as or similar to those of the dielectric layer of the effective portion Ac to ensure the bonding strength with the effective portion Ac. In addition, the content of the binder included in the materials for forming the inner edge portions 114a and 115a may be higher than the content of the binder included in the materials for forming the outer edge portions 114b and 115b.

[0083] The outer edge portions 114b and 115b may have the same composition as the dielectric layer used to form the covering portions 112 and 113. Additionally, since the outer edge portions 114b and 115b are exposed to the outside, the outer edge portions 114b and 115b may include additives to prevent external impacts, moisture infiltration, etc.

[0084] In an embodiment, the porosity of the inner edge portions 114a and 115a may be higher than the porosity of the outer edge portions 114b and 115b. When the content of the binder included in the material for forming the inner edge portions 114a and 115a is set higher than the content of the binder included in the material for forming the outer edge portions 114b and 115b to ensure the bonding force to the effective portion Ac, the binder may be removed during the firing and sintering processes, and pores may be formed at the positions where the binder was located. Therefore, the porosity of the inner edge portions 114a and 115a may be higher than the porosity of the outer edge portions 114b and 115b. Additionally, when one of the side edge portions 114 and 115 satisfies the above descriptions regarding structure, material, dimensions, etc., the effect of improving the bonding force between the corresponding side edge portion and the main body while ensuring reliability can also be achieved.

[0085] Furthermore, the method of forming the side edge portions 114 and 115 is not particularly limited.

[0086] Figure 10 and Figure 11 are diagrams for showing a method of manufacturing a multilayer electronic component according to an embodiment of the present disclosure, Figure 10 showing a diagram before attaching the side edge portions, Figure 11 showing a diagram after attaching the side edge portions. As a preferred example, referring to Figure 10 , the main body 10 before sintering may be attached to the upper plate 60 with a space therebetween, and the sheets 14b for forming the outer edge portions 114b and 115b and the sheets 14a for forming the inner edge portions 114a and 115a may be provided on the lower plate 50. The upper plate 60 may include upper supports 61 and 62 and an adhesive member 63, and the lower plate 50 may include lower supports 51 and an elastic member 52. The fifth surface or the sixth surface of the main body 10 before sintering may be attached through the adhesive member 63. In this case, the sheets 14a for forming the inner edge portions 114a and 115a may be provided spaced apart on the sheets 14b for forming the outer edge portions 114b and 115b to be bonded only to the effective portion, and may be manufactured to have the same dimensions as the dimensions of the effective portion to be attached on the surface of the main body 10 before sintering.

[0087] After that, when as Figure 11When pressing as shown, the sheet 14a for forming the inner edge portions 114a and 115a can be attached to the effective portion by pressure, and a part of the sheet 14b for forming the outer edge portions 114b and 115b can be cut. Thereafter, the same process can be performed on the surface of the body 10 before sintering attached to the bonding member 63, and then the body 110 and the side edge portions 114 and 115 can be formed by a sintering process.

[0088] However, the present disclosure is not limited thereto, and the inner edge portions 114a and 115a can also be manufactured by coating the material for forming the inner edge portions 114a and 115a on the effective portion of the body 10 before sintering.

[0089] The outer electrodes 131 and 132 can be provided on the third surface 3 and the fourth surface 4 of the body 110.

[0090] The outer electrodes 131 and 132 can include a first outer electrode 131 provided on the third surface 3 of the body 110 and connected to the first inner electrode 121, and a second outer electrode 132 provided on the fourth surface 4 of the body 110 and connected to the second inner electrode 122.

[0091] Referring to Figure 1 , the outer electrodes 131 and 132 can be provided to cover the two end surfaces of the side edge portions 114 and 115 in the second direction.

[0092] In this embodiment, a structure in which the multilayer electronic component 100 has two outer electrodes 131 and 132 is described. However, the number and shape of the outer electrodes 131 and 132 can be changed according to the shape of the inner electrodes 121 and 122 or other purposes.

[0093] In the embodiment, the outer electrodes 131 and 132 can include a first outer electrode 131 provided on the third surface 3 of the body 110 and a second outer electrode 132 provided on the fourth surface 4 of the body 110. The first outer electrode 131 can cover one end of the side edge portions 114 and 115 in the second direction, and the second outer electrode 132 can cover the other end of the side edge portions 114 and 115 in the second direction.

[0094] In the embodiment, the inner electrodes 121 and 122 can include a first inner electrode 121 in contact with the first outer electrode 131 and a second inner electrode 122 in contact with the second outer electrode 132, and both ends of the first inner electrode 121 and the second inner electrode 122 in the third direction can be in contact with the side edge portions 114 and 115.

[0095] In addition, the outer electrodes 131 and 132 can be formed of any material as long as it has conductivity, such as a metal, and the specific material can be determined by considering electrical characteristics, structural stability, etc., and the outer electrodes 131 and 132 can have a multilayer structure.

[0096] For example, the outer electrodes 131 and 132 may include electrode layers 131a and 132a provided on the main body 110 and plating layers 131b and 132b formed on the electrode layers 131a and 132a.

[0097] As a more specific example of the electrode layers 131a and 132a, the electrode layers may be fired electrodes including a conductive metal and glass or resin-based electrodes including a conductive metal and a resin.

[0098] In addition, the electrode layers 131a and 132a may be formed by sequentially forming a fired electrode and a resin-based electrode on the main body. In addition, the electrode layers 131a and 132a may be formed by transferring a sheet including a conductive metal onto the main body, or by transferring a sheet including a conductive metal onto the fired electrode.

[0099] As the conductive metal included in the electrode layers 131a and 132a, a material having excellent conductivity may be used, and there is no particular limitation. For example, the conductive metal may include at least one selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0100] The plating layers 131b and 132b are used to improve the mounting characteristics. The type of the plating layers 131b and 132b is not particularly limited, and may be a plating layer including at least one of Ni, Sn, Pd, and alloys thereof, and may be formed of multiple layers.

[0101] As a more specific example of the plating layers 131b and 132b, the plating layers 131b and 132b may be Ni plating layers or Sn plating layers, may have a form in which the Ni plating layer and the Sn plating layer are sequentially formed on the electrode layers 131a and 132a, and may have a form in which the Sn plating layer, the Ni plating layer, and the Sn plating layer are sequentially formed. In addition, the plating layers 131b and 132b may include multiple Ni plating layers and / or multiple Sn plating layers.

[0102] The size of the multilayer electronic component 100 does not need to be particularly limited.

[0103] However, in order to achieve both miniaturization and high capacitance, the number of stacked layers should be increased by thinning the dielectric layer and the inner electrodes. In the multilayer electronic component 100 having a size of 1005 (length × width, 1.0 mm × 0.5 mm) or less, the reliability improvement effect according to the present disclosure may become more significant.

[0104] When the length of the multilayer electronic component 100 is 1.1 mm or less and the width is 0.55 mm or less in consideration of manufacturing errors and the size of the outer electrode, the effects of improving reliability and capacitance per unit volume according to the present disclosure can be more significant. Here, the length of the multilayer electronic component 100 may refer to the maximum dimension of the multilayer electronic component 100 in the second direction, and the width of the multilayer electronic component 100 may refer to the maximum dimension of the multilayer electronic component 100 in the third direction.

[0105] As described above, as one of many effects of the present disclosure, the reliability of the multilayer electronic component can be improved.

[0106] As one of many effects of the present disclosure, the bonding force between the side edge portion and the main body can be improved.

[0107] Although the embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above embodiments and the accompanying drawings, and is intended to be limited by the appended claims. Therefore, within the scope of the technical spirit of the present disclosure described in the claims, those skilled in the art will be able to make various forms of substitutions, modifications, and changes, which also fall within the scope of the present disclosure.

[0108] In addition, the expression "one embodiment" used in the present disclosure does not mean the same embodiment, and is provided to emphasize and describe different unique features. However, the combination of the features of one embodiment presented above with those of another embodiment is not excluded. For example, even if the content described in a specific embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description contradictory to the content in the other embodiment.

[0109] The terms used in the present disclosure are only for describing one embodiment and are not intended to limit the present disclosure. In this case, unless the context clearly indicates otherwise, the singular expression includes the plural expression.

[0110] Although the exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations can be made without departing from the scope of the present disclosure defined by the appended claims.

Claims

1. A multilayer electronic component comprising: a body including a plurality of dielectric layers, the body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; A first side edge portion and a second side edge portion are respectively disposed on the fifth surface and the sixth surface; and The first external electrode and the second external electrode are respectively arranged on the third surface and the fourth surface, wherein the main body comprises an effective portion, an upper covering portion and a lower covering portion, the effective portion comprises inner electrodes alternately arranged with the dielectric layer in the first direction, the upper covering portion is arranged above the effective portion in the first direction, and the lower covering portion is arranged below the effective portion in the first direction, and At least one of the first side edge portion and the second side edge portion includes an inner edge portion and an outer edge portion, the inner edge portion covering at least a portion of the effective portion on a corresponding surface of the fifth surface and the sixth surface, and the outer edge portion is arranged on the inner edge portion and is arranged to contact the upper covering portion and the lower covering portion.

2. The multilayer electronic component according to claim 1, wherein The outer edge portion is provided to cover the upper end and the lower end of the inner edge portion in the first direction.

3. The multilayer electronic component according to claim 1, wherein: The inner edge portion is provided to completely cover the effective portion on the corresponding surface of the fifth surface and the sixth surface.

4. The multilayer electronic component according to claim 1, wherein: The upper end of the inner edge portion in the first direction contacts the upper cover portion on the corresponding surface among the fifth surface and the sixth surface, and the lower end of the inner edge portion in the first direction contacts the lower cover portion on the corresponding surface among the fifth surface and the sixth surface.

5. The multilayer electronic component according to claim 1, wherein A step is formed in a region of the outer edge portion that covers an upper end or a lower end of the inner edge portion in the first direction.

6. The multilayer electronic component according to claim 1, wherein: In a first direction-third direction cross section of the multilayer electronic component, the outer edge portion continuously extends to cover the inner edge portion.

7. The multilayer electronic component according to claim 1, wherein: An upper end of the outer edge portion in the first direction is disposed on the same plane as the second surface, and a lower end of the outer edge portion in the first direction is disposed on the same plane as the first surface.

8. The multilayer electronic component according to claim 1, wherein An upper end of the outer edge portion in the first direction is disposed below the second surface in the first direction, and a lower end of the outer edge portion in the first direction is disposed above the first surface in the first direction.

9. The multilayer electronic component according to claim 1, wherein: The upper end of the outer edge portion in the first direction contacts the upper cover portion on the corresponding surface among the fifth surface and the sixth surface, and the lower end of the outer edge portion in the first direction contacts the lower cover portion on the corresponding surface among the fifth surface and the sixth surface.

10. The multilayer electronic component according to claim 1, wherein An upper end of the outer edge portion in the first direction is disposed above the second surface in the first direction, and a lower end of the outer edge portion in the first direction is disposed below the first surface in the first direction.

11. The multilayer electronic component according to claim 1, wherein At least a portion of the outer edge portion is disposed on the first surface and the second surface.

12. The multilayer electronic component according to claim 1, wherein The average width of the inner edge portion in the third direction is greater than or equal to 0.5 μm and less than or equal to 5 μm.

13. The multilayer electronic component according to claim 1, wherein The average width of the outer edge portion in the third direction is greater than or equal to 15 μm and less than or equal to 40 μm.

14. The multilayer electronic component according to claim 1, wherein The average width of the inner edge portion in the third direction is Tma, the average width of the outer edge portion in the third direction is Tmb, and Tmb / Tma is greater than or equal to 3 and less than or equal to 80.

15. The multilayer electronic component according to claim 1, wherein The average width of at least one of the first side edge portion and the second side edge portion in the third direction at the center of the at least one of the first side edge portion and the second side edge portion in the first direction is Tm1, the average width of at least one of the first side edge portion and the second side edge portion in the third direction at the upper end of the at least one of the first side edge portion and the second side edge portion in the first direction is Tm2, ​​and Tm1-Tm2 is greater than or equal to 0.5μm and less than or equal to 5μm.

16. The multilayer electronic component according to claim 1, wherein The inner edge portion has a different composition than the outer edge portion.

17. The multilayer electronic component according to claim 1, wherein: The porosity of the inner edge portion is higher than the porosity of the outer edge portion.

18. The multilayer electronic component according to claim 1, wherein The inner electrode includes first inner electrodes and second inner electrodes alternately arranged in the first direction, and the dielectric layer is interposed between the first inner electrodes and the second inner electrodes, and The first inner electrode is exposed to the third surface, the fifth surface, and the sixth surface, and the second inner electrode is exposed to the fourth surface, the fifth surface, and the sixth surface.

19. The multilayer electronic component according to claim 1, wherein: The first external electrode covers one end of at least one of the first side margin portion and the second side margin portion in the second direction, and the second external electrode covers the other end of at least one of the first side margin portion and the second side margin portion in the second direction.

20. The multilayer electronic assembly of claim 1, wherein: In a first direction-third direction cross section of the multilayer electronic component, the inner edge portion continuously extends on the corresponding surface of the fifth surface and the sixth surface to cover the effective portion.

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