Substrate processing apparatus

Abstract

The present invention relates to a substrate processing apparatus for performing processing on a substrate using plasma, comprising: a process chamber (100) in which a sealed processing space (S1) is formed; the substrate supporting part (200) is arranged in the process chamber (100) in a liftable manner and is used for supporting a substrate (10); a side surface grounding part (300) which is connected to the inner surface of the process chamber (100) or the substrate supporting part (200), and which is connected to the space between the process chamber (100) and the substrate supporting part (200) in a grounding manner as the substrate supporting part (200) rises; and a cover part (400) provided on the inner surface of the process chamber (100) so as to cover at least a part of the side surface of the side surface grounding part (300) in a state in which the process chamber (100) and the substrate support part (200) are connected to each other through the side surface grounding part (300).

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus that performs processing on a substrate using plasma. Background Art

[0002] A substrate processing apparatus, which is a device for performing substrate processing such as deposition and etching on the surface of a substrate, generally includes: a process chamber that forms a sealed processing space; a substrate support unit that is disposed in the process chamber to support the substrate; and a gas injection unit that is disposed above the substrate support unit to inject a gas for performing a process.

[0003] At this time, in the substrate processing apparatus, according to the type of substrate processing, a power source can be applied in the use of plasma or the like. For this reason, the substrate support unit and the process chamber are grounded together, and a potential difference can be generated.

[0004] On the other hand, an existing substrate processing apparatus includes a side grounding unit that ground-connects the process chamber and the substrate support unit on the side of the substrate support unit to ground the substrate support unit. However, there is a problem in that particles are generated at the position where contact occurs for the ground connection.

[0005] In particular, due to the driving of the substrate support unit that moves up and down, the side grounding unit repeatedly makes contact and separation for ground connection. Therefore, there is a problem in that particles are generated at the moment of contact and the moment of separation when the contact is released.

[0006] Accordingly, in the existing substrate processing apparatus, the generated particles are scattered toward the processing space side, which affects the process and reduces the uniformity of substrate processing. Summary of the Invention

[0007] Problems to be Solved

[0008] An object of the present invention is to provide a substrate processing apparatus that can prevent the generation and diffusion of particles during the grounding process in order to solve the above-described problems.

[0009] Means for Solving the Problems

[0010] The present invention is proposed to achieve the object of the present invention as described above. The present invention discloses a substrate processing apparatus, including: a process chamber 100, forming a sealed processing space S1 therein; a substrate support portion 200, disposed in the process chamber 100 in a liftable manner, and supporting a substrate 10; a side grounding portion 300, connected to the inner surface of the process chamber 100 or the substrate support portion 200, and grounded to connect between the process chamber 100 and the substrate support portion 200 as the substrate support portion 200 rises; a cover portion 400, disposed on the inner surface of the process chamber 100 to cover at least a part of the side surface of the side grounding portion 300 in a state where the process chamber 100 and the substrate support portion 200 are grounded and connected through the side grounding portion 300.

[0011] The cover portion 400 may include: a cover bracket 410, protruding from the inner surface of the process chamber 100; a cover plate 420, extending downward from the cover bracket 410 to cover at least a part of the side surface of the side grounding portion 300.

[0012] The cover plate 420 may be disposed along the edge of the cover bracket 410 to form a cover space S2 for disposing the side grounding portion 300 together with the inner surface of the process chamber 100.

[0013] In order to cover the surface of the side grounding portion 300 facing the substrate support portion 200, the cover plate 420 may be disposed downward at a corresponding position on the edge of the cover bracket 410.

[0014] The substrate processing apparatus may further include a shadow frame 30, which is placed on the cover portion 400 and located above the edge of the substrate 10 as the substrate support portion 200 rises.

[0015] The side grounding portion 300 is disposed on the cover portion 400 and can contact the substrate support portion 200 as the substrate support portion 200 rises.

[0016] The side grounding portion 300 is connected and disposed on the substrate support portion 200, and rises integrally as the substrate support portion 200 rises, and can thus contact the cover portion 400.

[0017] The substrate processing apparatus may further include a grounding connection portion 500, one end of which is coupled to the edge of the substrate support portion 200, and the other end of which is coupled to the side grounding portion 300, thereby connecting the side grounding portion 300 and the substrate support portion 200.

[0018] The grounding connection part 500 may include a protruding cover part 501 which protrudes upward to cover at least a part of the side surface of the side grounding part 300.

[0019] The protruding cover part 501 may be configured such that when the substrate support part 200 rises, at least a part of it overlaps with the cover part 400 in the horizontal direction.

[0020] The cover plate 420 and the protruding cover part 501 may be sequentially arranged starting from the inner surface of the process chamber 100.

[0021] The protruding cover part 501 and the cover plate 420 may be sequentially arranged starting from the inner surface of the process chamber 100.

[0022] The substrate support part 200 may include: a support plate 210 which forms a placement surface for placing the substrate 10; a guide frame 220 which is arranged at the edge of the support plate 210 and extends towards the inner surface of the process chamber 100.

[0023] The protruding cover part 501 may be arranged on the inner surface side of the process chamber 100 compared to the edge of the guide frame 220 in a plane.

[0024] The upper end of the protruding cover part 501 may be higher than the edge of the guide frame 220.

[0025] The side grounding part 300 may include: a contact shaft part 310 which includes a contact plate 311 and a shaft 312, the contact plate 311 forms a contact surface, and the shaft 312 extends from the contact plate 311; a side grounding main body part 320 which surrounds the shaft 312; an elastic part 330, one end of which is supported by the contact plate 311 and the other end is supported by the side grounding main body part 320, and can be compressed and elongated with relative movement of the contact shaft part 310 with respect to the side grounding main body part 320.

[0026] The side grounding part 300 may further include a strip part 350, one end of which is coupled to the contact plate 311 and the other end is coupled to the side grounding main body part 320 to conduct electricity between the contact plate 311 and the side grounding main body part 320.

[0027] The side grounding part 300 may include a conductive sheet, and the contact surface for grounding of the conductive sheet is made of rubber material.

[0028] Effects of the Invention

[0029] The substrate processing apparatus according to the present invention has a lid portion that covers at least a part of the side surface of the side ground portion, thereby preventing particles generated during the process of contact and separation for grounding from spreading to the process space side. Therefore, it has the advantage of minimizing the impact of particles on the process.

[0030] In particular, the substrate processing apparatus according to the present invention prevents the spread of particles generated during the grounding process through the side ground portion. Therefore, it has the advantage of improving the uniformity of substrate processing.

[0031] In addition, the substrate processing apparatus according to the present invention applies a conductive sheet, which can prevent the generation of particles on the contact surface where contact and separation occur for grounding, minimizing the generation of particles. Therefore, it has the advantage of improving the substrate processing performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 FIG. schematically shows a substrate processing apparatus according to the present invention.

[0033] Figure 2 FIG. shows Figure 1 a perspective view of a cross-section of a side ground portion and a lid portion in the substrate processing apparatus.

[0034] Figure 3 FIG. shows Figure 1 a perspective view of a side ground portion and a lid portion in the substrate processing apparatus.

[0035] Figure 4 FIG. shows Figure 1 a perspective view of a side ground portion and a ground connection portion in the substrate processing apparatus.

[0036] (DESCRIPTION OF REFERENCE NUMERALS)

[0037] 100: Process chamber 200: Substrate support portion

[0038] 300: Side ground portion 400: Lid portion DETAILED DESCRIPTION

[0039] Hereinafter, a description of the substrate processing apparatus of the present invention will be given with reference to the accompanying drawings as follows.

[0040] As Figure 1As shown, the substrate processing apparatus according to the present invention includes: a process chamber 100 that forms a sealed processing space S1 inside; a substrate support portion 200 that is disposed in the process chamber 100 in a liftable manner and supports a substrate 10; a side grounding portion 300 that is connected to the inner surface of the process chamber 100 or the substrate support portion 200, and ground-connects between the process chamber 100 and the substrate support portion 200 as the substrate support portion 200 rises; a cover portion 400 that is disposed on the inner surface of the process chamber 100 to cover at least a part of the side surface of the side grounding portion 300 in a state where the process chamber 100 and the substrate support portion 200 are ground-connected through the side grounding portion 300.

[0041] In addition, the substrate processing apparatus according to the present invention may further include a ground connection portion 500. One end of the ground connection portion 500 is coupled to the edge of the substrate support portion 200, and the other end is coupled to the side grounding portion 300 to connect the side grounding portion 300 and the substrate support portion 200.

[0042] In addition, the substrate processing apparatus according to the present invention may further include a shadow frame 30. The shadow frame 30 is mounted on the cover portion 400 and is located above the edge of the substrate 10 as the substrate support portion 200 rises.

[0043] In addition, the substrate processing apparatus according to the present invention may further include a bottom grounding portion 40. One end of the bottom grounding portion 40 is coupled to the bottom surface of the substrate support portion 200, and the other end is coupled to the bottom surface of the process chamber 100 to perform a ground connection for the substrate support portion 200.

[0044] In addition, the substrate processing apparatus according to the present invention may include a gas injection portion 20. The gas injection portion 20 is disposed above the substrate support portion 200 to inject a process gas for substrate processing.

[0045] Here, the substrate 10 to be processed as a substrate for performing substrate processing such as etching and deposition may be any substrate as long as its planar shape is a right-angled quadrilateral, such as a substrate for manufacturing an LCD, a substrate for manufacturing an OLED, a substrate for manufacturing a solar cell, etc.

[0046] Then, the substrate processing performed by the substrate processing apparatus according to the present invention is a process for performing substrate processing such as deposition and etching by applying power in a sealed processing space S1, and any process may be applicable, for example, including a PECVD process using plasma.

[0047] On the other hand, the substrate processing can be performed with a mask placed on the substrate 10. At this time, the mask can form various structures. In order to perform deposition, etching, etc. in a preset pattern, the mask can form one or more openings of a preset pattern, etc.

[0048] For example, the mask can be a structure including a mask gasket forming one or more openings for process gas passage and a mask frame supporting the edge of the mask gasket, or it can also be a structure omitting a separate mask gasket.

[0049] The process chamber 100, as a structure forming a sealed processing space S1 inside, can be configured in various structures.

[0050] For example, the process chamber 100 can include: a chamber body 110, which is open at the upper side and formed with one or more gates 130; an upper cover 120, which covers the upper side opening of the chamber body 110 to form a sealed processing space S1.

[0051] At this time, the chamber body 110, as a structure that is open at the upper side and formed with one or more gates 130, can have various planar shapes according to the combined structure with other modules such as a transfer module.

[0052] In addition, the chamber body 110 can have a structure for forming process conditions for the processing space S1, for example, an exhaust system for controlling pressure, etc.

[0053] The upper cover 120, as a structure that covers the opening of the chamber body 110 to form a sealed processing space S1 separated from the outside, can be configured in various structures.

[0054] The substrate support part 200, as a structure that is liftably arranged in the process chamber 100 and supports the substrate 10, can be configured in various structures.

[0055] For example, the substrate support part 200 can include: a support plate 210, which forms a substrate placement surface for placing the substrate 10; a support shaft, which is connected to the support plate 210 at the lower part of the support plate 210; a guide frame 220, which is arranged to extend towards the inner surface direction of the process chamber 100 at the edge of the support plate 210.

[0056] At this time, the guide frame 220 can be a structure arranged to extend towards the inner surface direction of the process chamber 100 at the edge of the support plate 210 to adjust the spacing between the inner surface of the process chamber 100 and the edge of the substrate support part 200.

[0057] On the other hand, the substrate support portion 200 is configured such that the side grounding portion 300 described later is provided at the edge and moves up and down, and the side grounding portion 300 moves up and down integrally therewith. Thus, when rising for substrate processing, the side grounding portion 300 rises, and when the cover portion 400 described later contacts the side grounding portion 300, it can be grounded to the process chamber 100.

[0058] In addition, as another example, the substrate support portion 200 rises as the side grounding portion 300 described later moves up and down while being provided on the cover portion 400 and contacts the side grounding portion 300. Furthermore, the substrate support portion 200 can also be grounded to the process chamber 100.

[0059] In this case, the substrate support portion 200 may further include a contact member (not shown), and the contact member extends in the lateral direction toward the edge to contact the side grounding portion provided on the cover portion 400.

[0060] In addition, the substrate support portion 200 is configured such that at least one bottom grounding portion 40 is provided on the bottom surface, and thus it can be grounded to the bottom surface of the process chamber 100. At this time, in order to maintain the connection state with the bottom grounding portion 40 even when the substrate support portion 200 moves up and down, the bottom grounding portion 40 can be a structure that can change in length, such as having an elastic material.

[0061] On the other hand, the substrate support portion 200 can be provided with a plurality of bottom grounding portions 40 and side grounding portions 300 respectively, such that the plurality of bottom grounding portions 40 and side grounding portions 300 are symmetric with respect to the center on the plane, thereby maintaining a uniform grounding connection and grounding state.

[0062] The gas injection portion 20, which is a structure provided above the substrate support portion 200 to inject process gas for substrate processing, can be configured in various forms.

[0063] For example, the gas injection portion 20 can adopt the form of a shower head, with an upper cover 120 combined with a back plate, and a spray plate with a plurality of spray holes formed on the lower side of the back plate.

[0064] At this time, the gas injection portion 20 is applied with an RF power supply and can perform the function of an electrode that guides a potential difference between the substrate support portion 200 located at the opposite position and kept grounded.

[0065] The shadow frame 30, which is a structure that is mounted on the cover portion 400 and is located above the edge of the substrate 10 as the substrate support portion 200 rises, can be configured in various forms.

[0066] That is, the shadow frame 30, which is a structure located on the upper side around the edge of the substrate 10 as the substrate support part 200 rises during substrate processing, can be configured in various structures.

[0067] The shadow frame 30 can be a structure that interferes as the substrate support part 200 rises while being mounted in the processing space S1 within the process chamber 100, and can thus be supported in a state around the upper side edge of the substrate 10.

[0068] At this time, the shadow frame 30 covers a part of the edge of the substrate 10, and can prevent the edge of the substrate 10 from being exposed to the gas.

[0069] On the other hand, the shadow frame 30 can be directly supported on the edge of the substrate 10. Taking another example, it can also be supported on the above-mentioned mask corresponding to the periphery of the edge of the substrate 10.

[0070] In addition, the shadow frame 30 is such that when it is mounted in the process chamber 100 as the substrate support part 200 descends, it can be supported on the cover part 400 provided on the inner surface of the process chamber 100 described later, more specifically, on the cover bracket 410.

[0071] The side grounding part 300, which is a structure connected to the inner surface of the process chamber 100 or the substrate support part 200 and grounded to connect between the process chamber 100 and the substrate support part 200 as the substrate support part 200 rises, can be configured in various structures.

[0072] On the other hand, the following description is based on an embodiment in which the side grounding part 300 is provided on the side of the substrate support part 200 and moves integrally with the up and down movement of the substrate support part 200 to contact and separate from the cover part 400. However, of course, a structure in which it is fixedly provided on the cover part 400 described later and contacts and separates from the contact part of the substrate support part 200 as the substrate support part 200 moves up and down can also be applied.

[0073] As Figure 2 shown, the side grounding part 300 is connected and provided to the substrate support part 200, and as the substrate support part 200 rises, it rises integrally with the substrate support part 200 and can contact the cover part 400.

[0074] For this purpose, as Figure 2As shown, the side grounding portion 300 may include: a contact shaft portion 310 including a contact plate 311 and a shaft 312, the contact plate 311 forming a contact surface, and the shaft 312 extending from the contact plate 311; a side grounding main body portion 320 surrounding the shaft 312; and an elastic portion 330 supported at one end by the contact plate 311 and at the other end by the side grounding main body portion 320 to be compressed and elongated with respect to the relative movement of the contact shaft portion 310 with respect to the side grounding main body portion 320.

[0075] In addition, the side grounding portion 300 may further include a strip portion 350, one end of the strip portion 350 being coupled to the contact plate 311 and the other end being coupled to the side grounding main body portion 320 to electrically connect the contact plate 311 and the side grounding main body portion 320.

[0076] The contact shaft portion 310 may be a structure including a contact plate 311 forming a contact surface and a shaft 312 extending from the contact plate 311.

[0077] At this time, the contact plate 311 may include a conductive sheet made of a rubber material to prevent generation of particles during the contact and separation of the contact surface in contact with the cover portion 400.

[0078] The contact plate 311, which forms a contact surface including a conductive sheet made of a rubber material on one side and has a shaft 312 disposed on the other side, may be made of a conductive material such as metal to form a grounding path.

[0079] The shaft 312 extends from the contact plate 311, penetrates the side grounding main body portion 320, and can thus move relative to the side grounding main body portion 320.

[0080] At this time, the shaft 312 has an elastic portion 330 provided on its outer peripheral surface, with one end of the elastic portion 330 supported by the contact plate 311, and the elastic portion 330 can be guided to be compressed and elongated by the relative movement of the side grounding main body portion 320 that supports the other end of the elastic portion 330.

[0081] On the other hand, at this time, a fastening bolt 340 is coupled to the end of the shaft 312, and the shaft 312 interferes with the side grounding main body portion 320 described later, and can thus prevent it from being completely inserted into the side grounding main body portion 320.

[0082] The side grounding main body portion 320, which is a structure surrounding the shaft 312, is a structure that supports the other end of the elastic portion 330 so that the elastic portion 330 is compressed and elongated with the relative movement of the contact shaft portion 310, and can be configured in various structures.

[0083] For example, when the side grounding portion 300 is provided at the grounding connection portion 500 described below, the side grounding main body portion 320 is combined and provided on the bottom surface of the grounding connection portion 500, and the other end of the end support elastic portion 330 can be supported.

[0084] In addition, as another example, when the side grounding portion 300 is provided on the cover portion 400, the side grounding main body portion 320 is combined and provided on the cover bracket 410, and the other end of the elastic portion 330 can be supported.

[0085] One end of the elastic portion 330 is supported by the contact plate 311, and the other end is supported by the side grounding main body portion 320. With the structure of compressing and stretching relative to the relative movement of the contact shaft portion 310 with respect to the side grounding main body portion 320, various structures can be formed.

[0086] That is, the elastic portion 330 surrounds the shaft 312, and can further compress and stretch along the relative movement of the contact shaft portion 310 with respect to the side grounding main body portion 320.

[0087] At this time, when the substrate support portion 200 rises and the cover portion 400 contacts the contact plate 311, the elastic portion 330 is pressed and contacted using the elastic force, thereby strengthening the contact force and guiding and maintaining a strong and stable contact state.

[0088] One end of the strip portion 350 is combined with the contact plate 311, and the other end is combined with the side grounding main body portion 320. With the structure of electrically connecting the contact plate 311 and the side grounding main body portion 320, various structures can be formed.

[0089] For this purpose, the strip portion 350 is made of an elastic material or a deformable material as a conductive material, and can change in length corresponding to the relative movement of the contact shaft portion 310 with respect to the side grounding main body portion 320.

[0090] At this time, one end of the strip portion 350 is combined with the contact plate 311, and the other end is connected to the side grounding main body portion 320. The substrate support portion 200 and the cover portion 400 can be electrically connected through the grounding connection portion 500 that contacts the side grounding main body portion 320.

[0091] In addition, as another example, the other end of the strip portion 350 can be combined with the grounding connection portion 500, and when the side grounding portion 300 is provided on the cover portion 400, the other end can also be combined with the cover portion 400.

[0092] As Figure 3As shown, the cover portion 400 is configured to cover at least a part of the side surface of the side ground portion 300 while being grounded to connect the process chamber 100 and the substrate support portion 200 through the side ground portion 300, and can be configured in various structures.

[0093] For example, the cover portion 400 may include: a cover bracket 410 protruding from the inner surface of the process chamber 100; and a cover plate 420 extending downward from the cover bracket 410 to cover at least a part of the side surface of the side ground portion 300.

[0094] The cover bracket 410, which is a structure protruding from the inner surface of the process chamber 100, may be a structure that energizes between the process chamber 100 and the substrate support portion 200 by contacting the contact plate 311.

[0095] At this time, the cover bracket 410 may include a vertical frame 411 and a horizontal frame 412. The vertical frame 411 is coupled to the inner surface of the process chamber 100, and the horizontal frame 412 protrudes from the vertical frame 411 in a horizontal direction to form a contact surface. A shadow frame 30 may also be placed on the upper surface of the horizontal frame 412.

[0096] The cover plate 420 may be a structure that extends downward from the horizontal frame 412 to cover at least a part of the side surface of the side ground portion 300 with the side ground portion 300 contacting the horizontal frame 412 as a reference.

[0097] For example, the cover plate 420 may be disposed along the edge of the cover bracket 410 to form a cover space S2 for the side ground portion 300 together with the inner surface of the process chamber 100. Thus, three sides of the cover space S2 that surrounds the side ground portion 300 and is formed as a quadrilateral on a plane are formed, and the remaining one side may be formed by the inner surface of the process chamber 100.

[0098] On the other hand, as another example, in order to cover the surface of the side ground portion 300 facing the substrate support portion 200 among the side surfaces of the side ground portion 300, the cover plate 420 may be disposed downward at a position corresponding to the surface on the edge of the cover bracket 410.

[0099] That is, the cover plate 420 may be configured to extend downward at a corresponding position in the horizontal frame 412 in order to cover the side surface of the side ground portion 300 facing the substrate support portion 200.

[0100] As Figure 4 shown, the ground connection portion 500 may be a structure having one end coupled to the edge of the substrate support portion 200 and the other end coupled to the side ground portion 300 to connect the side ground portion 300 and the substrate support portion 200.

[0101] To this end, the ground connection portion 500 may include: a connection bridge 510, one end of which is coupled to the substrate support portion 200 and has a length in a direction from the substrate support portion 200 toward the inner surface of the process chamber 100; and a coupling portion 520 that surrounds and couples the side ground portion 300 at the end of the connection bridge 510.

[0102] At this time, the ground connection portion 500 may include a protruding cover portion 501 that is formed to protrude upward on the connection bridge 510 to cover at least a part of the side surface of the side ground portion 300.

[0103] The protruding cover portion 501 is formed to protrude upward at a preset position in the connection bridge 510 in a state where the side ground portion 300 is coupled to the end of the connection bridge 510, and thus can horizontally cover a part of the side surface of the ground portion 300 facing the substrate support portion 200.

[0104] Furthermore, the protruding cover portion 501 may of course also be coupled to the connection bridge 510 and formed to entirely surround and cover the side surface of the side ground portion 300.

[0105] In addition, in order to cover the lower side of the side ground portion 300, the protruding cover portion 501 may also be configured to extend downward from the bottom surface of the connection bridge 510.

[0106] At this time, the protruding cover portion 501 may be configured such that at least a part thereof overlaps with the cover portion 400 in a horizontal direction when the substrate support portion 200 rises. More preferably, as Figure 2 shown, the cover plate 420 and the protruding cover portion 501 are matched with each other to overlap in a horizontal direction, which can prevent particles generated in the cover space S2 from diffusing toward the substrate support portion 200 side.

[0107] To this end, the cover plate 420 and the protruding cover portion 501 may be sequentially arranged starting from the inner surface of the process chamber 100, or, conversely, the protruding cover portion 501 and the cover plate 420 may be sequentially arranged starting from the inner surface of the process chamber 100.

[0108] In addition, in order to prevent particle diffusion through the relationship with the above-described guide frame 220, the protruding cover portion 501 may be arranged on the inner surface side of the process chamber 100 in a plane compared to the edge of the guide frame 220, and the upper end is higher than the edge of the guide frame 220, and thus particle penetration into the space below the guide frame 220 can also be prevented.

[0109] On the other hand, different from the above, the upper end of the protruding cover portion 501 is lower than the bottom surface of the guide frame 220. Accordingly, the protruding cover portion 501 may of course also be located on the substrate support portion 200 side in a plane compared to the edge of the guide frame 220.

[0110] The above is only a description of a part of the preferred embodiments that can be achieved by the present invention. As is well known, the scope of the present invention is not limited to the above-described embodiment explanations. The technical idea of the present invention described above and its fundamental technical idea should be regarded as being entirely included within the scope of this specification.

Claims

1. A substrate processing device, characterized in that: include: A process chamber (100) forms a sealed processing space (S1) inside; A substrate support part (200) is movably disposed in the process chamber (100) and supports the substrate (10); A side grounding portion (300) is connected to the inner surface of the process chamber (100) or the substrate supporting portion (200), and is grounded to connect the process chamber (100) and the substrate supporting portion (200) as the substrate supporting portion (200) rises; The cover part (400) is arranged on the inner surface of the process chamber (100) to cover at least a portion of the side surface of the side grounding part (300) in a state where the process chamber (100) and the substrate supporting part (200) are grounded through the side grounding part (300).

2. The substrate processing device according to claim 1, characterized in that: The cover (400) comprises: A cover bracket (410) is protrudingly disposed on the inner surface of the process chamber (100); and a cover plate (420) extends downward from the cover bracket (410) to cover at least a portion of the side surface of the side grounding portion (300).

3. The substrate processing device according to claim 2, characterized in that: The cover plate (420) is arranged along the edge of the cover bracket (410) to form a cover space (S2) for setting the side grounding portion (300) together with the inner surface of the process chamber (100).

4. The substrate processing device according to claim 2, characterized in that: In order to cover the surface of the side surface of the side grounding portion (300) facing the substrate supporting portion (200), the cover plate (420) is arranged downward at a corresponding position on the edge of the cover bracket (410).

5. The substrate processing apparatus according to claim 1, wherein: Also includes: The shadow frame (30) is mounted on the cover (400) and is located on the upper side of the edge of the substrate (10) as the substrate supporting portion (200) rises.

6. The substrate processing apparatus according to claim 1, wherein: The side grounding portion (300) is provided on the cover portion (400) and contacts the substrate supporting portion (200) as the substrate supporting portion (200) rises.

7. The substrate processing device according to claim 2, characterized in that: The side grounding portion (300) is connected to and provided on the substrate supporting portion (200), and integrally rises with the rise of the substrate supporting portion (200), and further contacts the cover portion (400).

8. The substrate processing device according to claim 7, characterized in that: Also includes: The grounding connection part (500) has one end coupled to the edge of the substrate support part (200) and the other end coupled to the side grounding part (300), thereby connecting the side grounding part (300) and the substrate support part (200).

9. The substrate processing device according to claim 8, characterized in that: The ground connection portion (500) comprises a protruding cover portion (501), The protruding cover portion (501) is formed to protrude upward to cover at least a portion of the side surface of the side grounding portion (300).

10. The substrate processing apparatus according to claim 9, wherein: The protruding cover portion (501) is configured so that at least a portion overlaps with the cover portion (400) in a horizontal direction when the substrate supporting portion (200) rises.

11. The substrate processing apparatus according to claim 9, wherein: The cover plate (420) and the protruding cover portion (501) are arranged in sequence starting from the inner surface of the process chamber (100).

12. The substrate processing apparatus according to claim 9, wherein: The protruding cover portion (501) and the cover plate (420) are arranged in sequence starting from the inner surface of the process chamber (100).

13. The substrate processing apparatus according to claim 9, wherein: The substrate supporting part (200) comprises: The support plate (210) forms a placement surface for placing the substrate (10); and the guide frame (220) is arranged on the edge of the support plate (210) so as to extend toward the inner surface of the process chamber (100).

14. The substrate processing apparatus according to claim 13, wherein: The protruding cover portion (501) is arranged on the inner surface side of the process chamber (100) compared to the edge of the guide frame (220) in a plane.

15. The substrate processing apparatus according to claim 14, wherein: The protruding cover portion (501) has an upper end that is higher than the edge of the guide frame (220).

16. The substrate processing apparatus according to claim 1, wherein: The side grounding portion (300) comprises: The contact shaft portion (310) comprises a contact plate (311) and a shaft (312), wherein the contact plate (311) forms a contact surface, and the shaft (312) extends from the contact plate (311); a side grounding body portion (320) surrounding the shaft (312); and an elastic portion (330) having one end supported by the contact plate (311) and the other end supported by the side grounding body portion (320), and capable of being compressed and extended by the relative movement of the contact shaft portion (310) with respect to the side grounding body portion (320).

17. The substrate processing apparatus according to claim 16, wherein: The side grounding portion (300) further includes a strip portion (350), One end of the strip portion (350) is combined with the contact plate (311), and the other end is combined with the side grounding main body portion (320) to electrically connect the contact plate (311) and the side grounding main body portion (320).

18. The substrate processing apparatus according to claim 1, wherein: The side grounding portion (300) comprises a conductive sheet, and a contact surface of the conductive sheet for grounding is made of rubber material.

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