Clip for vertical interconnection

Abstract

Disclosed herein are clips for use as vertical interconnects. In some embodiments, an electronic assembly, such as an electronic module, includes a first circuit board and an electronic component attached to the first circuit board. The electronic component includes a dielectric body and at least one clip secured to the dielectric body. The clip is electrically connected to the first circuit board to operate as a vertical interconnect.

Description

Technical Field

[0001] Embodiments of the present invention relate to electronic systems, and more particularly, to vertical interconnections in electronic components. Background Art

[0003] An electronic module includes passive devices, active devices, and / or semiconductor dies interconnected to perform a specific function. Such an electronic module may also include pins for providing an electrical interface to connect the electronic module to a larger electronic system.

[0004] One example of an electronic module is a power module, which may include one or more switching regulators that operate in conjunction with one or more inductors to provide power regulation. For example, a switching regulator may employ a switch (e.g., a power transistor) coupled in series and / or in parallel with an output terminal that provides an output voltage to a load through an inductor. Additionally, a controller turns the switch on and off to control the transfer of current pulses through the inductor to the output terminal, and the inductor converts the switching pulses into a steady load current. The power module may include a semiconductor die on which metal-oxide-semiconductor field-effect transistor (MOSFET) switches and drivers are formed. Such a semiconductor die is referred to as a driver and MOSFET (DrMOS) die or an integrated circuit (IC). Summary of the Invention

[0005] Clips used as vertical interconnections are disclosed herein. In certain embodiments, an electronic component, such as an electronic module, includes a first circuit board and an electronic element attached to the first circuit board. The electronic element includes a dielectric and at least one clip fixed to the dielectric. The clip is electrically connected to the first circuit board to operate as a vertical interconnection. For example, the clip can be used to electrically connect the first circuit board to a second circuit board attached to the electronic element and opposite the first circuit board. By using the clip as a vertical interconnection, limitations on the vertical interconnection aspect ratio are avoided. Additionally, since the clip is firmly fixed by the dielectric, the clip is not subject to tilting and / or twisting like conventional vertical interconnections. Further, the clips can be implemented with a tight pitch.

[0006] In one aspect, an electronic component includes a first circuit board and an electronic element attached to the first circuit board. The electronic element includes a dielectric and a first clip fixed to the dielectric. The first clip is electrically connected to the first circuit board to operate as a vertical interconnection.

[0007] In another aspect, a method of providing an electrical connection in an electronic component is provided. The method includes fixing a first clip to a dielectric of an electronic element, attaching the electronic element to a first circuit board, and using the first clip as a vertical interconnection.

[0008] In another aspect, an electronic component includes a dielectric body having a first surface, a second surface opposite the first surface, and side surfaces. The electronic component further includes a first clip fixed to the dielectric body to serve as a vertical interconnection, the first clip providing an electrical connection from the first surface to the second surface along the side surfaces. Description of the Drawings

[0009] Figure 1 is a perspective view of an embodiment of an electronic component having a clip serving as a vertical interconnection.

[0010] Figure 2A is a Figure 1 side view of an embodiment of an electronic assembly in which the electronic component provides a vertical interconnection.

[0011] Figure 2B is a Figure 1 side view of another embodiment of an electronic assembly in which the electronic component provides a vertical interconnection.

[0012] Figure 3 is a perspective view of an embodiment of an inductor component having a clip serving as a vertical interconnection.

[0013] Figure 4 is a perspective view of another embodiment of an inductor component having a clip serving as a vertical interconnection.

[0014] Figure 5 is a perspective view of another embodiment of an inductor component having a clip serving as a vertical interconnection.

[0015] Figure 6 is a perspective view of another embodiment of an inductor component having a clip serving as a vertical interconnection.

[0016] Figure 7 is a perspective view of another embodiment of an inductor component having a clip serving as a vertical interconnection.

[0017] Figure 8 is a Figure 7 perspective view of an embodiment of a power module using the inductor component as a vertical interconnection.

[0018] Figure 9 is a circuit diagram of a power module according to an embodiment. Detailed Description

[0019] The following detailed description of the embodiments presents various descriptions of specific embodiments of the present invention. However, the present invention can be embodied in many different ways. In this specification, reference is made to the accompanying drawings, in which like reference numerals may represent the same or functionally similar elements. It should be understood that the elements shown in the drawings are not necessarily drawn to scale. In addition, it should be understood that some embodiments may include more elements than shown in the drawings and / or a subset of the elements shown in the drawings. Further, some embodiments may incorporate any suitable combination of features from two or more of the drawings.

[0020] Vertical interconnections can be used to provide vertical electrical connections in various electronic components. For example, an electronic component, such as an electronic module, can include a first circuit board and a second circuit board that are electrically connected to each other through a vertical interconnection.

[0021] Existing vertical interconnections have various drawbacks. For example, certain vertical interconnections have limitations on the aspect ratio, such as an aspect ratio of 2:1 or less. Therefore, in order to achieve higher vertical interconnections, the footprint of the vertical interconnection increases to maintain the aspect ratio. This increase in footprint results in the vertical interconnection occupying more space.

[0022] Another limitation of existing vertical interconnections is that they may be subject to tilting and / or twisting due to the stress generated during the assembly process. In addition, such vertical interconnections can be considered components of certain assembly processes, and thus are limited by the component-to-component spacing and the corresponding reduction in the number of vertical interconnections per unit area. Further, certain assembly processes specify that all vertical interconnections have the same size, and thus vertical interconnections of a common size are required for power and signals.

[0023] There is a need to improve the vertical interconnections of electronic components, including power modules that are desired to grow in the vertical direction to increase power density and / or reduce thermal resistance.

[0024] Clips used as vertical interconnections are disclosed herein. In certain embodiments, an electronic component, such as an electronic module, includes a first circuit board and an electronic component attached to the first circuit board. The electronic component includes a dielectric and at least one clip fixed to the dielectric. The clip is electrically connected to the first circuit board to operate as a vertical interconnection.

[0025] For example, the clip can be used to electrically connect the first circuit board to a second circuit board attached to the electronic component and opposite the first circuit board.

[0026] By using the clip as a vertical interconnection, the limitation on the aspect ratio of the vertical interconnection is avoided. In addition, since the clip is firmly fixed by the dielectric, the clip is not subject to tilting and / or twisting like traditional vertical interconnections. Further, the clips can be implemented with a close spacing.

[0027] In some embodiments, two or more clips are fixed to the dielectric and used as vertical interconnections. When multiple clips are included, the clips can be the same size or different sizes, depending on the application.

[0028] For example, when used to carry power and signals, the clips can have different power connection sizes relative to the signal connection. For example, relative to the signal connection, the power voltage connection may be associated with higher transient currents and thus can be implemented with a larger size and lower resistivity. Thus, the clips can have different power and signal sizes, with each clip sized to be tailored to the specific electrical connection provided by the clip.

[0029] In some embodiments, each clip includes a top on the top surface of the dielectric, a bottom on the bottom surface of the dielectric, and a side connecting the top to the bottom along the side of the dielectric.

[0030] Thus, the clip wraps around one side of the dielectric to provide an electrical connection from above the dielectric to below the dielectric. The clip can be made of metal, such as copper. The clip is also referred to herein as a staple.

[0031] The clips can be connected to a wide variety of electronic components to facilitate providing vertical electrical connections in electronic assemblies, such as electronic modules.

[0032] In some embodiments, the electronic component corresponds to an inductor component. For example, the inductor component can include a dielectric (such as a ferrite core) through which one or more inductors (such as copper coils) are formed, and the clip can be fixed to the dielectric to provide a vertical interconnection. In such an implementation, a more compact and efficient power module is achieved by providing a vertical interconnection along the side of the inductor component to allow the inductor to have a larger volume within the body.

[0033] The clip can be attached to the dielectric of the electronic component in any suitable manner. In a first example, the clip is fixed to the dielectric using an adhesive. In a second example, the clip is plated on the dielectric using any suitable plating process. In a third example, the clip is soldered to the dielectric. In a fourth example, a recess is formed in the dielectric and the clip is placed in the recess. Placing the clip in the recess of the dielectric is particularly useful for embodiments where the clips have different thicknesses and it is desired for the clips to be coplanar with each other to provide a flat electrical interface to the circuit board. Thus, for example, a thicker clip for carrying power can be placed in the groove to be flush with a thinner clip for carrying signals.

[0034] In some embodiments, at least one semiconductor die is attached to a first circuit board. When implemented as a power module, at least one semiconductor die (e.g., one or more DrMOS dies) can operate in conjunction with an inductor of an inductor element to form a power module. For example, the number of inductors included in the inductor element can correspond to the number of phases required for power regulation, and thus a single-phase power module, a two-phase (2-phase) power module, a four-phase (4-phase) power module, or other desired power modules can be implemented.

[0035] Surface-mounted components, such as capacitors, can also be connected at various locations of the electronic assembly. Such surface-mounted components can be included not only on the circuit board but also on electronic components including clips. For example, surface-mounted components can be included on the top, bottom, and / or sides of the electronic component. Such surface-mounted components can be electrically connected to one or more clips to assist in achieving the desired circuit operation.

[0036] Figure 1 is a perspective view of an embodiment of an electronic component 10. The electronic component 10 includes a dielectric 1 and clips 2. Each clip 2 is fixed to the dielectric to serve as a vertical interconnect.

[0037] In the illustrated embodiment, the dielectric 1 is substantially in the shape of a rectangular prism. Additionally, each clip 2 wraps around the side of the dielectric 1 from the top surface to the bottom surface of the dielectric 1. Although an example of a dielectric in the shape of a rectangular prism is shown, the teachings herein apply to dielectrics of other shapes.

[0038] The clip 2 is conductive, while the dielectric 1 is non-conductive and is formed of any suitable dielectric. In some embodiments, the clip 2 is formed of a metal, such as copper.

[0039] In the illustrated embodiment, three of the clips 2 are fixed to the left side of the dielectric 1, while another three of the clips 2 are fixed to the right side of the dielectric 1. Although an example with six clips is shown, the electronic component 10 can include more or fewer clips. Additionally, the clips 2 can be arranged on the dielectric 1 in other ways, such as on more or fewer sides of the dielectric, or in a different arrangement along the sides. Thus, other embodiments are possible.

[0040] The clip 2 can be attached to the dielectric 1 in any suitable manner, such as using an adhesive. In some embodiments, the clip 2 is plated onto the dielectric 1 and / or placed in a recess of the dielectric 1 using a plating process.

[0041] Figure 2A is used Figure 1A side view of an embodiment of an electronic component providing a vertically interconnected electronic assembly 20. The electronic assembly 10 includes a first circuit board 11, a second circuit board 12, a first electronic component 10a, and a second electronic component 10b.

[0042] In the illustrated embodiment, a clip 2a is fixed to the first electronic component 10a, and a clip 2b is fixed to the second electronic component 10b. The clips 2a / 2b are used to provide an electrical connection from the first circuit board 11 to the second circuit board 12. For example, the clips 2a / 2b can be used to transfer power (e.g., power voltage and / or ground) and / or signals between the circuit boards 11 / 12 as needed.

[0043] By using clips as vertical interconnections, limitations on the vertical interconnect aspect ratio are avoided. Additionally, since the clips are firmly fixed by the dielectric, the clips are not subject to tilting and / or twisting like traditional vertical interconnections. Furthermore, the clips can be implemented with a close pitch.

[0044] In some embodiments, each clip includes a top on the top surface of the dielectric, a bottom on the bottom surface of the dielectric, and a side portion connecting the top to the bottom along the side surface of the dielectric. For example, clip 2a includes a top 2a1, a bottom 2a2, and a side portion 2a3. Thus, the clip can wrap around the side surface of the dielectric to provide an electrical connection from above the dielectric to below the dielectric.

[0045] As Figure 2A shown, the top 2a1 is inserted between the dielectric 1a and the first circuit board 11, while the bottom 2a2 is inserted between the dielectric 1a and the second circuit board 12. The top 2a1 is electrically connected (e.g., welded) to the corresponding electrical terminals of the first circuit board 11, and the bottom 2a2 is electrically connected (e.g., welded) to the corresponding electrical terminals of the second circuit board 12.

[0046] Figure 2B is a side view of another embodiment of an electronic component providing a vertically interconnected electronic assembly 30 using Figure 1 .

[0047] Figure 2B The electronic module 30 is similar to Figure 2A the electronic assembly 20, except that the electronic assembly depicts various semiconductor dies 3, surface mount components 4, and electrical connectors 5 included on the circuit boards 11 / 12 as shown. The electronic circuits on the first circuit board 11 can be electrically connected to the electronic circuits on the second circuit board 12 using the clips 2a / 2b. Thus, the semiconductor dies 3, surface mount components 4, and electrical connectors 5 can be interconnected as needed to achieve a specific function.

[0048] Although an example of the electronic circuits of each circuit board is shown, the circuit boards can include electronic circuits implemented in various ways. Thus, other embodiments are possible.

[0049] Any electronic component in this document can be included in an electronic assembly to provide vertical interconnections. In some embodiments, the electronic assembly is an electronic module, such as a power module.

[0050] Figure 3 is a perspective view of an embodiment of an inductor element 100 having a clip serving as a vertical interconnection. The inductor element 100 includes a dielectric 91 (e.g., a ferrite core) through which an inductor 92 (e.g., a copper coil) has been formed. The dielectric 91 also includes a groove 93 passing through the dielectric 91 to help achieve the desired inductance characteristics of the inductor element 100.

[0051] As Figure 3 shown, the clip 2 has been fixed to one side of the dielectric 91 of the inductor element 100.

[0052] Fixing the clip 2 to the inductor element to provide vertical interconnections can offer several advantages. For example, providing vertical interconnections along the side of the inductor element 100 allows the inductor to have a larger volume. Additionally, when used to provide vertical interconnections in a power module, the clip 2 improves the compactness and / or efficiency of the power module.

[0053] Figure 4 is a perspective view of another embodiment of an inductor element 110 having a clip serving as a vertical interconnection.

[0054] In the embodiment shown, the inductor element 110 includes a dielectric 101 (e.g., a ferrite core) that includes four inductors 102a / 102b / 102c / 102d (e.g., copper coils) formed through the dielectric 101. Thus, four inductors 102a / 102b / 102c / 102d are provided, which makes the inductor element 110 well-suited for 4-phase power regulation applications.

[0055] The inductor element 110 includes a first clip 112 fixed to the dielectric 101 and having a first size (e.g., suitable for carrying signals) and a second clip 114 fixed to the dielectric 101 and having a second size (e.g., suitable for carrying power).

[0056] In certain embodiments, clips of different sizes are fixed to the dielectric of the electronic component.

[0057] For example, when used to carry power and signals, the clips can have different power connection sizes relative to the signal connection. For example, relative to the signal connection, the power voltage connection may be associated with higher transient currents, and thus can be implemented with larger sizes and lower resistivity. Accordingly, the clips can have different power and signal sizes, with each clip sized to be tailored to the specific electrical connection provided by the clip.

[0058] Figure 5 is a perspective view of another embodiment of an inductor element 120 having clips used as vertical interconnects.

[0059] Figure 5 The inductor element 120 of Figure 4 is similar to the inductor element 110 of Figure 5 except that the inductance assembly 120 of

[0060] includes a first clip 122 plated on a dielectric 101. The first clip 122 can be used to carry signals and / or provide other desired electrical connections.

[0061] Figure 6 is a perspective view of another embodiment of an inductor element 130 having clips used as vertical interconnects.

[0062] In the illustrated embodiment, the inductor element 130 includes a dielectric 121 (e.g., a ferrite core) that includes two inductors 102a / 102b (e.g., copper coils) formed through the dielectric 121. The inductor element 130 can be used to provide two-phase power regulation.

[0063] The inductor element 130 includes clips 112 / 114 fixed to the dielectric 121. As Figure 6 shown, surface mount elements 124 (such as capacitors) are bridged across some of the clips 112.

[0064] By implementing the inductor element 130 in this way, a more compact electronic assembly can be achieved. For example, in a power regulation application, surface mount capacitors can be placed on the clips of the inductor element to achieve a more compact power module. In some embodiments, the surface mount element 124 is soldered to the clip 112. In such an embodiment, epoxy resin can be added to fix the element 124 to prevent it from falling off during the reflow process, and / or high-temperature solder can be used.

[0065] Although shown as attached to the side surface of the inductor element 130, the surface mount element 124 can be included on any surface of the dielectric 121.

[0066] When included on the top or bottom surface of the dielectric, recesses can be formed within the dielectric and / or in the circuit board to provide clearance for the surface mount element when the electronic component is attached to the circuit board.

[0067] Figure 7 is a perspective view of another embodiment of an inductor element 150 having clips that serve as vertical interconnects.

[0068] The inductor element 150 includes a dielectric 141 (e.g., a ferrite core) that includes two inductors 102a / 102b (e.g., copper coils) formed through the dielectric 141.

[0069] The inductor element 110 includes a first clip 132 fixed to the dielectric 141 and having a first size (e.g., suitable for carrying signals) and a second clip 134 fixed to the dielectric 141 and having a second size (e.g., suitable for carrying power).

[0070] Figure 8 is a perspective view of a power module 160 using Figure 7 the inductor element as a vertical interconnect. For example, the power module 160 includes a circuit board 151, a first inductor element 150a attached to the bottom surface of the circuit board 151, and a second inductor element 150b attached to the bottom surface of the circuit board 151.

[0071] Figure 8 The power module 160 of Figure 7 includes two inductor elements. Since each inductor element includes two inductors, in this example, the power module 160 includes four inductors and thus operates as a 4-phase power regulation module.

[0072] In the illustrated embodiment, the top side of the circuit board 151 includes surface mount elements 4 and first semiconductor die 3a, second semiconductor die 3b, third semiconductor 3c, and fourth semiconductor die 3d. In some implementations, each of the semiconductor dies 3a - 3d corresponds to a DrMOS die that includes a regulator that regulates the current through a respective one of the inductors in the inductor elements 150a / 150b.

[0073] The clips 132 / 134 are used to transfer signals and power between the circuits on the circuit board 151 and another circuit board (e.g., a customer circuit board to which the power module 160 is soldered when deployed for a given application).

[0074] Figure 9It is a circuit diagram of a power module 620 according to an embodiment.

[0075] The circuit diagram depicts an example of a power regulation circuit for single-phase power regulation. However, the power regulation circuit can be replicated to provide multi-phase regulation. For example, the circuit can be replicated four times to provide regulation in a 4-phase power module, such as Figure 8 the power module 160.

[0076] Therefore, although an example of a single-phase power module is depicted, the power module can include more phases according to the needs of a specific application. Additionally, although one example of a circuit suitable for power regulation is shown, the circuit of the power module can be implemented in other ways.

[0077] In the illustrated embodiment, the power module 620 includes a DrMOS die 603a that regulates the current through inductor 608a. The DrMOS die 603a includes a first high-side power MOSFET 611a, a first low-side power MOSFET 612a, a first high-side driver 613a, a first low-side driver 614a, and driver logic circuit 615a.

[0078] Although an example of a DrMOS die is shown, the DrMOS die can be implemented in other ways. Thus, other embodiments are possible. Additionally, although certain circuits of the DrMOS die are depicted, the DrMOS die can include other circuits and / or other pin configurations.

[0079] In the illustrated embodiment, an input control signal INa is provided to logic 615a. The logic 615a controls the driver signals sent to the high-side driver 613a and the low-side driver 614a, which respectively control the high-side power MOSFET 611a and the low-side power MOSFET 612a. The high-side power MOSFET 611a and the low-side power MOSFET 612a are coupled to a first terminal VSWa of inductor 608a to form a half-bridge circuit of a switching regulator (such as a buck converter). The MOSFET 612a / 612b is turned on and off to control the current provided to inductor 608a. A second terminal of inductor 608a is electrically connected to the output voltage pin VOUTa.

[0080] Application

[0081] Devices employing the above scheme can be implemented in various electronic devices in various applications, including but not limited to bus converters, high-current distributed power systems, telecommunication systems, data communication systems, storage systems, and automotive systems. Therefore, examples of electronic devices that can be implemented with the power module herein include but are not limited to communication systems, consumer electronics, electronic test equipment, communication infrastructure, servers, automobiles, etc.

[0082] Conclusion

[0083] The foregoing description may refer to an element or feature as being “connected” or “coupled” together. As used herein, unless otherwise expressly stated, “connected” means that one element / feature is directly or indirectly connected to another element or feature, and not necessarily a mechanical connection. Similarly, unless otherwise expressly stated, “coupled” means that one element / feature is directly or indirectly coupled to another element or feature, and not necessarily a mechanical coupling. Thus, although the various schematic diagrams shown in the figures depict example arrangements of elements and components, additional intervening elements, devices, features, or components may be present in a practical embodiment (assuming that the functionality of the depicted circuitry is not adversely affected).

[0084] Although certain embodiments have been described, these embodiments are presented by way of example only and are not intended to limit the scope of the disclosure. In fact, the novel devices, methods, and systems described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions, and changes in the form of the methods and systems described herein may be made without departing from the spirit of the disclosure. For example, although the disclosed embodiments are presented in a given arrangement, alternative embodiments may perform similar functions using different components and / or circuit topologies, and some elements may be deleted, moved, added, subdivided, combined, and / or modified. Each of these elements may be implemented in a variety of different ways. Any suitable combination of the elements and acts of the various embodiments described above may be combined to provide further embodiments. Accordingly, the scope of the invention is defined only by reference to the appended claims.

[0085] Although the claims presented herein are filed with the United States Patent and Trademark Office in single-dependent format, it should be understood that any claim may depend on any previous claim of the same type, unless this is clearly technically infeasible.

Claims

1. An electronic component comprising: a first circuit board; and an electronic component attached to the first circuit board, the electronic component comprising a dielectric body and a first clip fixed to the dielectric body, Wherein the first clip is electrically connected to the first circuit board to operate as a vertical interconnect.

2. The electronic assembly of claim 1, further comprising a second circuit board attached to the electronic component opposite the first circuit board, wherein the first clip electrically connects the first circuit board to the second circuit board. The electronic assembly according to claim 1 , wherein the electronic component is an inductor component.

4. The electronic assembly of claim 3, wherein the dielectric is a ferrite core and the inductor element comprises one or more inductors formed through the ferrite core. The electronic assembly of claim 1 , wherein the first clip comprises metal. The electronic component of claim 5 , wherein the metal is copper.

7. The electronic assembly of claim 1 further comprising a second clip secured to the electronic component and electrically connected to the first circuit board to operate as a vertical interconnect.

8. The electronic assembly of claim 7, wherein the first clip carries a signal and the second clip carries a power source.

9. The electronic assembly of claim 8, wherein the first clip and the second clip have different sizes.

10. The electronic assembly of claim 8, further comprising a member mounted across the first clip and the second clip.

11. The electronic assembly of claim 1, wherein the first clip is plated on the dielectric body.

12. The electronic assembly of claim 1, wherein the first clip is attached to the dielectric body by an adhesive.

13. A method of providing an electrical connection in an electronic assembly, the method comprising: securing a first clip to a dielectric body of an electronic component; attaching the electronic component to a first circuit board; and Use the first clip as a vertical interconnect.

14. The method of claim 13, further comprising attaching a second circuit board to the electronic component opposite the first circuit board and using the first clip as a vertical interconnect between the first circuit board and the second circuit board.

15. The method of claim 13, wherein the electronic component is an inductor component including at least one inductor formed through the dielectric body.

16. The method of claim 13, wherein the first clip comprises metal.

17. The method of claim 13, further securing a second clip to the electronic component and using the second clip as a vertical interconnect.

18. The method of claim 17, further comprising using the first clip to carry a signal and using the second clip to carry power.

19. An electronic component comprising: A dielectric body having a first surface, a second surface opposite to the first surface, and a side surface; as well as A first clip is secured to the dielectric body to serve as a vertical interconnect, the first clip providing an electrical connection from the first surface to the second surface along the side surface.

20. The electronic component according to claim 19, further comprising an inductor formed through the dielectric body.

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