Grinding machining parameter determination method, electronic equipment and storage medium

Abstract

The invention discloses a grinding machining parameter determination method, electronic equipment and a storage medium. The method comprises the steps that contour data of a to-be-machined workpiece under a workpiece coordinate system are obtained; wherein the workpiece coordinate system is a coordinate system constructed with the reference rotation center of the to-be-machined workpiece as the original point; according to the contour data and the grinding tool parameters, a grinding tool center movement track is determined; dispersing the contour data to obtain a contour point position set; determining an actual grinding tool center position set corresponding to the contour point position set according to the contour point position set, the reference rotation center of the to-be-machined workpiece and the grinding tool center movement track; according to the actual grinding tool center position set and the rotation center offset, a grinding machining parameter set of the to-be-machined workpiece is determined; wherein the rotation center offset is the offset of the actual rotation center relative to the reference rotation center under the workpiece coordinate system.

Description

Technical Field

[0001] The invention relates to the field of grinding manufacturing of numerically controlled grinding machines, and in particular to a method for determining grinding parameters, electronic equipment and a storage medium. Background Art

[0002] During the grinding process, the motion of the tool is a combination of rotational motion and feed motion, that is, the tool rotates at high speed around its rotation axis on the one hand, and performs linear feed motion along the feed linear axis on the other hand. Therefore, for workpieces with complex curved contours such as camshafts and crankshafts, a corresponding grinding motion relationship schematic diagram (that is, the relationship between the geometric model of the workpiece and the motion path of the tool) can be established. Based on the established schematic diagram, an analytical algorithm is developed to calculate the precise position of the tool and the workpiece axis during the grinding process (that is, the grinding processing parameters).

[0003] However, the calculation process of this method is cumbersome, the scope of application is small, and it cannot meet the processing requirements of internal and external contour grinding of various special-shaped workpieces. Summary of the invention

[0004] One purpose of an embodiment of the present invention is to provide a new technical solution for determining grinding processing parameters of a workpiece.

[0005] According to a first aspect of the present invention, a method for determining grinding process parameters is provided, comprising:

[0006] Acquire contour data of the workpiece to be processed in a workpiece coordinate system; wherein the workpiece coordinate system is a coordinate system constructed with a reference rotation center of the workpiece to be processed as the origin;

[0007] Determine the center motion trajectory of the mold according to the profile data and the mold parameters;

[0008] Discretize the contour data to obtain a contour point set;

[0009] Determine an actual mold center position set corresponding to the contour point set according to the contour point set, the reference rotation center of the workpiece to be processed and the mold center motion trajectory;

[0010] The grinding processing parameter set of the workpiece to be processed is determined according to the actual grinding tool center position set and the rotation center offset; wherein the rotation center offset is the offset of the actual rotation center of the workpiece to be processed relative to the reference rotation center in the workpiece coordinate system.

[0011] Optionally, determining the actual mold center position set corresponding to the contour point set according to the contour point set, the reference rotation center of the workpiece to be processed and the mold center motion trajectory includes:

[0012] Determining a radial vector set of the workpiece to be processed according to a reference rotation center of the workpiece to be processed and the contour point set;

[0013] For any radial vector in the radial vector set, the intersection of the radial vector and the center motion trajectory of the mold is determined as the actual mold center position corresponding to the radial vector, and the actual mold center position set corresponding to the radial vector set is obtained.

[0014] Optionally, determining the grinding processing parameter set of the workpiece to be processed according to the actual grinding tool center position set and the rotation center offset includes:

[0015] For any actual grinding tool center position in the actual grinding tool center position set, calculating a first grinding process parameter corresponding to the actual grinding tool center position;

[0016] Determining a second grinding parameter corresponding to the actual grinding tool center position according to the rotation center offset and the first grinding parameter corresponding to the actual grinding tool center position;

[0017] The grinding parameter set of the workpiece to be machined is determined according to the second grinding parameter corresponding to each actual grinding tool center position in the actual grinding tool center position set.

[0018] Optionally, the grinding process parameter includes a rotation parameter, the rotation center offset includes a rotation center angle offset, and determining the second grinding process parameter corresponding to the actual grinding tool center position according to the rotation center offset and the first grinding process parameter corresponding to the actual grinding tool center position includes:

[0019] A second rotation parameter corresponding to the actual center position of the grinding tool is determined according to the rotation center angle offset and the first rotation parameter corresponding to the actual center position of the grinding tool.

[0020] Optionally, the grinding process parameter includes a lateral parameter, the rotation center offset includes a lateral offset of the rotation center, and determining the second grinding process parameter corresponding to the actual grinding tool center position according to the rotation center offset and the first grinding process parameter corresponding to the actual grinding tool center position includes:

[0021] According to the lateral offset of the rotation center and the first lateral parameter corresponding to the actual center position of the grinding tool, a second lateral parameter corresponding to the actual center position of the grinding tool is determined.

[0022] Optionally, the rotation center offset is determined according to the position coordinates of the actual rotation center of the workpiece to be processed in the workpiece coordinate system.

[0023] Optionally, the grinding tool parameters include the characteristic dimensions of the grinding tool. Determining the center movement trajectory of the grinding tool according to the profile data and the grinding tool parameters includes:

[0024] Offsetting the profile data according to the characteristic dimensions of the grinding tool to obtain the center movement trajectory of the grinding tool.

[0025] Optionally, obtaining the profile data of the workpiece to be machined in the workpiece coordinate system includes:

[0026] Obtaining the geometric data of the workpiece to be machined;

[0027] Determining the profile data of the workpiece to be machined in the workpiece coordinate system according to the geometric data of the workpiece to be machined.

[0028] According to a second aspect of the present disclosure, there is provided an electronic device including a memory and a processor. The memory is used to store executable instructions; the processor is used to operate under the control of the instructions to execute the method as described in the first aspect.

[0029] According to a third aspect of the present disclosure, there is provided a computer-readable storage medium having computer-executable instructions stored thereon. When the executable instructions are executed by a processor, the method for determining grinding process parameters as described in the first aspect is implemented.

[0030] One beneficial effect of the present invention is that the center movement trajectory of the grinding tool can be obtained through simple calculations based on the profile data of the workpiece to be machined in the workpiece coordinate system, and then the set of grinding process parameters of the workpiece to be machined can be obtained. Compared with the related art, the technical solution provided by the present application does not need to establish a schematic diagram of the motion relationship between the geometric model of the workpiece and the motion path of the grinding tool, and can simply and efficiently obtain high-precision grinding process parameters. Moreover, it is applicable to any workpiece to be machined and can meet the machining requirements for grinding the inner and outer contours of various special-shaped workpieces. By determining the set of actual grinding tool center positions corresponding to the set of profile points according to the set of profile points, the reference rotation center of the workpiece to be machined, and the center movement trajectory of the grinding tool, the exact position of the grinding tool center when the grinding tool contacts the workpiece to be machined can be calculated more accurately, improving the accuracy of determining the grinding tool center position, and further improving the accuracy of determining the grinding process parameters. By determining the set of grinding process parameters of the workpiece to be machined according to the set of actual grinding tool center positions and the rotation center offset amount, it is convenient for the numerical control machine tool to perform grinding processing on the workpiece to be machined according to the grinding process parameters. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The drawings incorporated in the specification and constituting a part of the specification illustrate embodiments of the present invention and, together with the description, are used to explain the principles of the present invention.

[0032] Figure 1 is a schematic diagram of the hardware structure of an electronic device according to an embodiment of the present invention;

[0033] Figure 2 is a schematic flow chart of a method for determining grinding process parameters according to an embodiment of the present invention;

[0034] Figure 3 is a schematic diagram of a contour curve corresponding to contour data of a workpiece to be processed in a workpiece coordinate system according to an example of the present invention;

[0035] Figure 4 is a center motion trajectory of a grinding tool according to an example of the present invention;

[0036] Figure 5 is a schematic diagram of a contour point set according to an example of the present invention;

[0037] Figure 6 is an actual center position of the grinding tool when grinding the outer contour of the workpiece to be processed according to an example of the present invention;

[0038] Figure 7 is an actual center position of the grinding tool when grinding the inner contour of a workpiece to be machined according to an example of the present invention;

[0039] Figure 8 is a schematic diagram of grinding process parameters according to an example of the present invention;

[0040] Fig. 9 is a principle block diagram of an electronic device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0041] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0042] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0043] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0044] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0045] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0046] <Hardware Configuration>

[0047] Figure 1 is a block diagram of a hardware configuration of an electronic device 1000 according to an embodiment of the present invention.

[0048] The electronic device 1000 may be, for example, a notebook computer, a PC, etc., which is not limited here.

[0049] The electronic device 1000 is used to obtain the contour data of the workpiece to be processed in the workpiece coordinate system, and determine a set of grinding processing parameters of the workpiece to be processed according to the contour data.

[0050] The electronic device 1000 may include a processor 1100 , a memory 1200 , an interface device 1300 , a communication device 1400 , a display device 1500 , an input device 1600 , a speaker 1700 , a microphone 1800 , and the like.

[0051] The processor 1100 may be a mobile version processor. The memory 1200 may include, for example, a ROM (read-only memory), a RAM (random access memory), a non-volatile memory such as a hard disk, etc. The interface device 1300 may include, for example, a USB interface, a headphone interface, etc. The communication device 1400 may, for example, be capable of wired or wireless communication. The communication device 1400 may include a short-range communication device, for example, any device for short-range wireless communication based on short-range wireless communication protocols such as Hilink protocol, WiFi (IEEE 802.11 protocol), Mesh, Bluetooth, ZigBee, Thread, Z-Wave, NFC, UWB, LiFi, etc. The communication device 1400 may also include a remote communication device, for example, any device for WLAN, GPRS, 2G / 3G / 4G / 5G remote communication. The display device 1500 may, for example, be a liquid crystal display, a touch display, etc. The input device 1600 may include, for example, a touch screen, a keyboard, etc. The user may input / output voice information through the speaker 1700 and the microphone 1800.

[0052] In this embodiment, the memory 1200 of the electronic device 1000 is used to store instructions, and the instructions are used to control the processor 1100 to operate to at least execute the grinding process parameter determination method performed by the electronic device 1000 according to any embodiment of the present invention. The technician can design the instructions according to the scheme disclosed in the present invention. How the instructions control the processor to operate is well known in the art, so it will not be described in detail here.

[0053] Despite Figure 1 , multiple devices of the electronic device 1000 are shown; however, the present invention may only involve some of the devices, for example, the electronic device 1000 only involves the memory 1200 and the processor 1100 .

[0054] In this embodiment, the electronic device 1000 determines a set of grinding processing parameters of the workpiece to be processed based on the contour data of the workpiece to be processed in the workpiece coordinate system.

[0055] <Method Example>

[0056] Figure 2 1 is a flow chart of a method for determining grinding process parameters according to an embodiment of the present invention, which can be implemented by an electronic device 1000 .

[0057] according to Figure 2 As shown, the method for determining grinding process parameters in this embodiment may include the following steps S2100 to S2500:

[0058] Step S2100, obtaining contour data of the workpiece to be processed in the workpiece coordinate system.

[0059] In this embodiment, the workpiece coordinate system is a coordinate system constructed with the reference rotation center of the workpiece to be processed as the origin. The reference rotation center of the workpiece to be processed can be the center point of the fixed axis around which all points of the designed workpiece rotate when rotating.

[0060] The reference rotation center may be the center of mass of the workpiece to be processed, or may be other design center of the workpiece to be processed except the center of mass, which is not limited here.

[0061] For example, the reference rotation center is the center of mass of the workpiece to be processed. When the contour of the workpiece to be processed is a circle, the reference rotation center of the workpiece to be processed is the center of the circle.

[0062] In one example, the reference rotation center of the workpiece to be processed can be expressed as (Centerx, Centery). Centerx is the X-axis coordinate of the reference rotation center of the workpiece to be processed in the workpiece coordinate system, and Centery is the Y-axis coordinate of the reference rotation center of the workpiece to be processed in the workpiece coordinate system. Since the working coordinate system of the workpiece to be processed is a coordinate system constructed with the reference rotation center as the origin, the coordinate values ​​of Centerx and Centery are both 0.

[0063] The contour data may be a set of position coordinates of points on the surface boundary of the workpiece to be processed in the workpiece coordinate system. The contour data may be presented in a variety of representations, for example, it may be represented by a spline curve. The contour data may also be obtained in a variety of ways, which are not limited here.

[0064] For example, Figure 3 As shown, it is a schematic diagram of a contour curve of an example of a workpiece to be processed when the contour data is represented by a spline curve, wherein the workpiece coordinate system is a coordinate system constructed with the reference rotation center of the workpiece to be processed as the origin, the horizontal direction as the X-axis, and the vertical direction as the Y-axis.

[0065] In some embodiments, step S2100 acquires contour data of a workpiece to be processed in a workpiece coordinate system, including: step S2100.1 and step S2100.2.

[0066] Step S2100.1, obtaining geometric data of the workpiece to be processed.

[0067] In this embodiment, the geometric data of the workpiece to be processed can be the design data of the workpiece to be processed, for example, data in the DXF file format (which is a widely used CAD data file format that can store two-dimensional and three-dimensional design data), or it can be two-dimensional profilometer measurement data of the workpiece to be processed, or it can be data that can characterize the geometric shape of the workpiece to be processed, which is not limited here.

[0068] It should be noted that the geometric data of the workpiece to be processed obtained in step S2100.1 includes the position data of the reference rotation center of the workpiece to be processed, that is, the DXF file format data of the workpiece to be processed and the two-dimensional profiler measurement data both include the position data of the reference rotation center.

[0069] Step S2100.2, determining the contour data of the workpiece to be processed in the workpiece coordinate system according to the geometric data of the workpiece to be processed.

[0070] In this embodiment, a three-dimensional geometric model of the workpiece to be processed can be constructed according to the geometric data of the workpiece to be processed, and then the contour data can be extracted from the three-dimensional geometric model of the workpiece to be processed.

[0071] Those skilled in the art should understand that the method of determining the contour data of the workpiece to be processed in the workpiece coordinate system according to the geometric data of the workpiece to be processed is well known in the art and will not be described in detail here.

[0072] Step S2200, determining the center motion trajectory of the mold according to the contour data and the mold parameters.

[0073] In this embodiment, the grinding tool can be a grinding wheel, a grinding disc, etc., which is not limited here.

[0074] The tool parameters may include characteristic dimensions of the tool (eg, tool diameter), etc.

[0075] The center motion trajectory of the grinding tool may be a trajectory curve formed by the position coordinates of the geometric center point of the grinding tool in the workpiece coordinate system when machining the workpiece to be machined.

[0076] Continuing with the above Figure 3 example, in the case of the contour curve of the contour data of the workpiece to be machined shown by Figure 3 if the grinding tool is a grinding wheel and the characteristic dimension of the grinding tool is the grinding wheel diameter, then according to the grinding wheel diameter, Figure 3 the contour curve shown by Figure 4 (i.e., curve 1 in Figure 4 ) can be offset, that is, the contour data of the workpiece to be machined is offset inward (for inner contour) or outward (for outer contour) to obtain a series of new points, and connecting these new points can obtain the movement trajectory of the grinding tool center corresponding to the inner contour, that is, Figure 4 curve 2 in

[0077] and the movement trajectory of the grinding tool center corresponding to the outer contour, that is,

[0078] Curve 3 in

[0079] In this embodiment, since the grinding tool has a certain characteristic dimension (for example, when the grinding tool is a grinding wheel, the characteristic dimension is the grinding wheel diameter), therefore, the center point of the grinding tool does not directly move along the contour of the workpiece to be machined during grinding, but moves at a certain offset distance on one side of the contour of the workpiece to be machined. Among them, the offset distance can be determined according to the characteristic dimension of the grinding tool.

[0080] For example, the grinding tool is a grinding wheel, the characteristic dimension of the grinding tool is the grinding tool diameter, and the offset distance is the grinding tool radius.

[0081] This step is specifically: based on the contour data of the workpiece to be machined, move the offset distance along the normal direction of the contour curve corresponding to the contour data (i.e., the spline curve corresponding to the contour data) (i.e., perpendicular to the tangent direction of the spline curve) to obtain a series of grinding tool center positions, and then determine the movement trajectory of the grinding tool center according to this series of grinding tool center positions.

[0082] Step S2300, discretize the contour data to obtain a contour point set.

[0083] In this embodiment, the contour curve corresponding to the contour data of the workpiece to be machined is discretized to obtain a contour point set. Among them, the contour point set can be an ordered point sequence, that is, the contour point set refers to a set of points arranged in the machining order.

[0084] The discretization method can be equal angle, equal arc length, equal chord length, and equal number of discrete strategies, which are not limited here.

[0085] Those skilled in the art should understand that these discrete strategies are well known in the art, and the specific discrete methods are not described in detail here.

[0086] For example, Figure 3 The contour curve of the workpiece to be processed in is discretized, and the obtained contour point set is as follows Figure 5 shown.

[0087] Step S2400, determining an actual mold center position set corresponding to the contour point set according to the contour point set, the reference rotation center of the workpiece to be processed and the mold center motion trajectory.

[0088] In this embodiment, since the contour point set includes the position coordinates of multiple contour points in the workpiece coordinate system, and the motion trajectory of the mold center is also the motion trajectory of the mold center determined in the workpiece coordinate system, the reference rotation center position coordinates of the workpiece to be processed are also the position coordinates of the workpiece to be processed in the workpiece coordinate system, which facilitates calculation.

[0089] The actual tool center position may be the position that the tool center actually reaches during the grinding process.

[0090] In one example, when grinding the outer contour of a workpiece, the actual center position of the grinding tool can be as follows: Figure 6 As shown, Figure 6 The left side is the workpiece to be processed, and the right side is the grinding tool.

[0091] In another example, when grinding the inner contour of a workpiece, the actual center position of the grinding tool can be as follows: Figure 7 As shown, Figure 7 The workpiece to be processed is located on the periphery, and the grinding tool is located on the inside.

[0092] Exemplarily, the actual mold center position set can be represented by Pvec, and the actual mold center position can be represented by (PIntervec[0], PIntervec[1]), where PIntervec[0] is the X-axis coordinate of the actual mold center position in the workpiece coordinate system, and PIntervec[1] is the Y-axis coordinate of the actual mold center position in the workpiece coordinate system. It should be noted that if the machine tool coordinate system and the workpiece coordinate system coincide, then the position coordinates of the actual mold center in the workpiece coordinate system can be used as the position coordinates of the actual mold center in the machine tool coordinate system.

[0093] In some embodiments, in step S2400, the actual mold center position set is determined according to the contour point set, the reference rotation center of the workpiece to be processed and the mold center motion trajectory, including: step S2400.1 and step S2400.2.

[0094] Step S2400.1, determining a radial vector set of the workpiece to be processed based on the reference rotation center of the workpiece to be processed and the contour point set.

[0095] In this embodiment, the reference rotation center of the workpiece to be processed can be used as the starting point, and a radial vector can be determined along the direction of each contour point in the contour point set to obtain a radial vector set. The modulus of each radial vector in the radial vector set is greater than the radial distance corresponding to the radial vector. The radial distance corresponding to the radial vector is the distance between the reference rotation center corresponding to the radial vector and the contour point.

[0096] In one example, twice the maximum radial distance in the radial distance set corresponding to the radial vector set is used as the modulus of the radial vector set.

[0097] The radial vector set of the workpiece to be machined can characterize the position change of the abrasive tool relative to the reference rotation center of the workpiece to be machined during the grinding process. Through these radial vector sets, the exact position where the abrasive tool contacts the workpiece to be machined can be calculated more accurately.

[0098] Step S2400.2: for any radial vector in the radial vector set, determine the intersection of the radial vector and the center motion trajectory of the mold as the actual mold center position corresponding to the radial vector, and obtain the actual mold center position set corresponding to the radial vector set.

[0099] In this embodiment, since the radial vector is a vector extending from the reference rotation center of the workpiece to be processed along the contour point direction, it must have an intersection with the motion trajectory of the center of the tool, and the intersection is the actual position of the center of the tool during the grinding process. Therefore, by determining the intersection of each radial vector in the radial vector set and the motion trajectory of the center of the tool, the actual tool center position set corresponding to the radial vector set can be obtained.

[0100] Since the actual center position of the grinding tool is the key point in the grinding process, which determines the accuracy and efficiency of grinding, the accuracy and efficiency of grinding can be improved by solving the actual center position set of the grinding tool.

[0101] Step S2500: determining a set of grinding processing parameters for the workpiece to be processed according to the actual grinding tool center position set and the rotation center offset.

[0102] In this embodiment, the rotation center offset is the offset of the actual rotation center of the workpiece to be processed relative to the reference rotation center in the workpiece coordinate system. The actual rotation center of the workpiece to be processed can be the center point of the fixed axis around which all points of the workpiece actually rotate when the workpiece is rotating.

[0103] The actual rotation center of the workpiece to be processed can be determined by mechanical measurement, tool setting operation, etc., and is not limited here.

[0104] In one example, the position coordinates of the actual rotation center of the workpiece to be processed in the workpiece coordinate system can be expressed as (offsetx, offsety).

[0105] In some embodiments, the rotation center offset is determined according to the position coordinates of the actual rotation center of the workpiece to be processed in the workpiece coordinate system.

[0106] In one example, the rotation center offset includes the rotation center angle offset Basec. When the position coordinates of the actual rotation center of the workpiece to be processed in the workpiece coordinate system are (offsetx, offsety), the rotation center angle offset can be expressed as: Basec=ArcTan2(offsety, offsetx).

[0107] In another example, the rotation center offset includes the rotation center lateral offset Basex. When the position coordinates of the actual rotation center of the workpiece to be processed in the workpiece coordinate system are (offsetx, offsety), the rotation center lateral offset can be expressed as: Basex=Sqrt(offsetx*offsetx+offsety*offsety).

[0108] By determining the grinding processing parameter set of the workpiece to be processed based on the actual mold center position set and the rotation center offset, the problem of inaccurate determination of grinding processing parameters due to inconsistency between the actual rotation center and the reference rotation center can be avoided, thereby improving the accuracy of determining the grinding processing parameters.

[0109] In some embodiments, in step S2500, a grinding processing parameter set of the workpiece to be processed is determined according to the actual grinding tool center position set and the rotation center offset, including: steps S2500.1 to S2500.3.

[0110] Step S2500.1, for any actual grinding tool center position in the actual grinding tool center position set, calculate a first grinding process parameter corresponding to the actual grinding tool center position.

[0111] In this embodiment, since the actual center position of the grinding tool is the center position of the grinding tool in the workpiece coordinate system, the first grinding process parameter corresponding to the actual center position of the grinding tool is also the grinding process parameter in the workpiece coordinate system.

[0112] In one example, the grinding process parameters include rotation parameters, and the first rotation parameter corresponding to the actual center position of the grinding tool can be solved by the following formula: ArcTan2(PIntervec[1], PIntervec[0]). The first rotation parameter is the rotation angle of the actual center position of the grinding tool relative to the reference rotation center of the workpiece to be processed.

[0113] In another example, the grinding process parameters include transverse parameters, and the first transverse parameter corresponding to the actual center position of the grinding tool can be solved by the following formula: Sqrt((PIntervec[0]-Centerx) 2 +(PIntervec[1]-Centery) 2 ). Wherein, Centerx is the X-axis coordinate of the reference rotation center of the workpiece to be processed in the workpiece coordinate system, and Centery is the Y-axis coordinate of the reference rotation center of the workpiece to be processed in the workpiece coordinate system. The first lateral parameter is the distance between the actual center position of the abrasive tool and the reference rotation center of the workpiece to be processed.

[0114] In another example, since the grinding process can be regarded as a combination of the rotational motion of the workpiece to be processed and the feed motion of the grinding tool, the grinding process parameters include rotational parameters (i.e., used to describe the rotational motion of the workpiece to be processed) and transverse parameters (i.e., used to describe the feed motion of the grinding tool). Then, the first grinding parameter includes a first rotational parameter and a first transverse parameter, wherein the first rotational parameter can be expressed as ArcTan2(PIntervec[1], PIntervec[0]), and the first transverse parameter can be expressed as: Sqrt((PIntervec[0]-Centerx) 2 +(PIntervec[1]-Centery) 2 ).

[0115] Step S2500.2, determining a second grinding parameter corresponding to the actual grinding tool center position according to the rotation center offset and the first grinding parameter corresponding to the actual grinding tool center position.

[0116] In one embodiment, the grinding process parameter includes a rotation parameter, the rotation center offset includes a rotation center angle offset, and step S2500.2 determines the second grinding process parameter corresponding to the actual grinding tool center position according to the rotation center offset and the first grinding process parameter corresponding to the actual grinding tool center position, including:

[0117] A second rotation parameter corresponding to the actual center position of the grinding tool is determined according to the rotation center angle offset and the first rotation parameter corresponding to the actual center position of the grinding tool.

[0118] In this embodiment, the second rotation parameter may be the rotation angle of the actual center position of the abrasive tool relative to the actual rotation center of the workpiece to be processed, which may be represented by C, which is calculated by the following formula:

[0119] C=ArcTan2(PIntervec[1],PIntervec[0])+Basec

[0120] Among them, Basec is the rotation center angle offset.

[0121] In another embodiment, the grinding process parameter includes a lateral parameter, the rotation center offset includes a lateral rotation center offset, and step S2500.2 determines the second grinding process parameter corresponding to the actual grinding tool center position according to the rotation center offset and the first grinding process parameter corresponding to the actual grinding tool center position, including:

[0122] A second lateral parameter corresponding to the actual center position of the grinding tool is determined according to the lateral offset of the rotation center and the first lateral parameter corresponding to the actual center position of the grinding tool.

[0123] In this embodiment, the second transverse parameter may be the distance between the actual center position of the abrasive tool and the actual rotation center of the workpiece to be processed, which may be represented by X, and is calculated by the following formula:

[0124] X=Sqrt((PIntervec[0]-Centerx) 2 +(PIntervec[1]-Centery) 2 )+Basex

[0125] Among them, Basex is the lateral offset of the rotation center.

[0126] In another embodiment, the grinding process parameters include rotation parameters and lateral parameters. In step S2500.2, the second grinding process parameters corresponding to the actual grinding tool center position are determined based on the rotation center offset and the first grinding process parameters corresponding to the actual grinding tool center position, including: step S2500.21 and step S2500.22.

[0127] Step S2500.21, determining a second rotation parameter corresponding to the actual center position of the mold according to the rotation center angle offset and the first rotation parameter corresponding to the actual center position of the mold.

[0128] In this embodiment, the second rotation parameter is calculated by the following formula:

[0129] C=ArcTan2(PIntervec[1],PIntervec[0])+Basec

[0130] Step S2500.22, determining a second lateral parameter corresponding to the actual center position of the mold according to the lateral offset of the rotation center and the first lateral parameter corresponding to the actual center position of the mold.

[0131] In this embodiment, the second transverse parameter can be calculated by the following formula:

[0132] X=Sqrt((PIntervec[0]-Centerx) 2 +(PIntervec[1]-Centery) 2 )+Basex

[0133] Step S2500.3, determining the grinding parameter set of the workpiece to be machined according to the second grinding parameter corresponding to each actual grinding tool center position in the actual grinding tool center position set.

[0134] Exemplarily, the grinding processing parameters include rotation parameters and lateral parameters. After calculating the corresponding second rotation parameter and second lateral parameter for each actual grinding tool center position in the actual grinding tool center position set, the corresponding second rotation parameter and second lateral parameter are calculated for each actual grinding tool center position as the grinding parameter set of the workpiece to be processed.

[0135] In one example, if Figure 8 As shown, it is a schematic diagram of the grinding processing parameters of a workpiece to be processed, wherein the horizontal axis Co represents the rotation angle of the actual center position of the grinding tool relative to the actual rotation center of the workpiece to be processed during the grinding process, and the vertical axis Xo represents the distance between the actual center position of the grinding tool and the actual rotation center of the workpiece to be processed during the grinding process.

[0136] In some embodiments, after determining the grinding processing parameter set of the workpiece to be processed, the method further includes: steps S3100 to S3400.

[0137] Step S3100, performing simulated grinding on the workpiece to be processed according to the grinding processing parameter set of the workpiece to be processed to obtain a simulated grinding trajectory.

[0138] Step S3200, determining grinding contact data according to the contour data and the simulated grinding trajectory.

[0139] In this embodiment, the grinding contact data is data reflecting the contact situation between the contour data of the workpiece to be processed and the simulated grinding trajectory.

[0140] In one example, the contour data may be represented in the form of a contour curve. In this case, the grinding contact data may be determined as grinding contact line segments based on the simulated grinding trajectory and the contour curve.

[0141] In another example, the contour data includes position coordinates of multiple contour points in a workpiece coordinate system, the simulated grinding trajectory is obtained by the position coordinates of the multiple simulated grinding points in the workpiece coordinate system, and the multiple contour points and the multiple simulated grinding points are one-to-one corresponding, then the grinding contact data is the grinding contact points.

[0142] Step S3300: Determine, based on the grinding contact data, whether the processing parameter set can be used as an actual processing parameter set.

[0143] In the example where the grinding contact data is a grinding contact line segment, it can be determined whether the grinding contact line segment matches the contour curve, that is, whether the grinding contact line segment is completely identical to the contour curve. If it does not match, that is, the grinding contact line segment is not completely identical to the contour curve, then the processing parameter set obtained in step S2500 cannot be used as the actual processing parameter set. If it matches, that is, the grinding contact line segment is completely identical to the contour curve, then the set of parameters to be processed obtained in step S2500 can be used as the actual processing parameter set.

[0144] In the example where the grinding contact data is a grinding contact point, it can be determined whether the grinding contact point matches the contour point included in the contour data, that is, whether the grinding contact point completely coincides with the contour point in the contour data. If it does not match, that is, the grinding contact point does not completely coincide with the contour point in the contour data, then the processing parameter set obtained in step S2500 cannot be used as the actual processing parameter set. If it matches, that is, the grinding contact point completely coincides with the contour point in the contour data, then the set of parameters to be processed obtained in step S2500 can be used as the actual processing parameter set.

[0145] Step S3400: output the processing parameter set if the processing parameter set can be used as the actual processing parameter set.

[0146] In this embodiment, by outputting the processing parameter set to the CNC machine tool when the processing parameter set can be used as the actual processing parameter set, the CNC machine tool can grind the workpiece to be processed according to the processing parameter set to improve the grinding accuracy.

[0147] According to the embodiment of the present application, the motion trajectory of the mold center can be obtained by performing a simple calculation based on the contour data of the workpiece to be processed in the workpiece coordinate system, and then the grinding processing parameter set of the workpiece to be processed can be obtained, which can achieve simple and efficient acquisition of high-precision grinding processing parameters, and is applicable to any workpiece to be processed, and can meet the processing requirements of internal and external contour grinding of various special-shaped workpieces. By determining the actual mold center position set corresponding to the contour point set according to the contour point set, the reference rotation center of the workpiece to be processed and the motion trajectory of the mold center, the exact position of the mold center when the mold contacts the workpiece to be processed can be calculated more accurately, the accuracy of the determination of the mold center position can be improved, and then the accuracy of the determination of the grinding processing parameters can be improved. By determining the grinding processing parameter set of the workpiece to be processed according to the actual mold center position set and the rotation center offset, it is convenient for the data machine tool to grind the workpiece to be processed according to the grinding processing parameters.

[0148] <Equipment Embodiment>

[0149] Fig. 9 is a principle block diagram of an electronic device 900 according to an embodiment of the present invention.

[0150] In this embodiment, if Fig. 9 As shown, the electronic device 900 includes a memory 910 and a processor 920, wherein the memory 910 is used to store executable instructions; the processor 920 is used to operate according to the control of the instructions to execute the method described in any of the above method embodiments.

[0151] In some embodiments, the electronic device 900 may be Figure 1 An electronic device 1000 is shown.

[0152] According to an embodiment of the present disclosure, a computer-readable storage medium is further provided, on which computer-executable instructions are stored. When the executable instructions are executed by a processor, the method for determining grinding process parameters as described in any of the above method embodiments is implemented.

[0153] The present invention may be a system, a method and / or a computer program product. The computer program product may include a computer-readable storage medium carrying computer-readable program instructions for causing a processor to implement various aspects of the present invention.

[0154] A computer-readable storage medium may be a tangible device that can hold and store instructions used by an instruction execution device. A computer-readable storage medium may be, for example, but not limited to, an electrical storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination of the foregoing. More specific examples of computer-readable storage media (a non-exhaustive list) include: a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a static random access memory (SRAM), a portable compact disk read-only memory (CD-ROM), a digital versatile disk (DVD), a memory stick, a floppy disk, a mechanical encoding device, such as a punch card or a raised structure in a groove on which instructions are stored, and any suitable combination of the foregoing. As used herein, a computer-readable storage medium is not to be interpreted as a transient signal per se, such as a radio wave or other freely propagating electromagnetic wave, an electromagnetic wave propagating through a waveguide or other transmission medium (e.g., a light pulse through a fiber optic cable), or an electrical signal transmitted through a wire.

[0155] The computer-readable program instructions described herein can be downloaded from a computer-readable storage medium to each computing / processing device, or downloaded to an external computer or external storage device via a network, such as the Internet, a local area network, a wide area network, and / or a wireless network. The network can include copper transmission cables, optical fiber transmissions, wireless transmissions, routers, firewalls, switches, gateway computers, and / or edge servers. The network adapter card or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards the computer-readable program instructions for storage in the computer-readable storage medium in each computing / processing device.

[0156] The computer program instructions for performing the operation of the present invention may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-related instructions, microcode, firmware instructions, state setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages, such as Smalltalk, C++, etc., and conventional procedural programming languages, such as "C" language or similar programming languages. Computer-readable program instructions may be executed entirely on a user's computer, partially on a user's computer, as an independent software package, partially on a user's computer, partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., using an Internet service provider to connect via the Internet). In some embodiments, an electronic circuit, such as a programmable logic circuit, a field programmable gate array (FPGA), or a programmable logic array (PLA), may be personalized by utilizing the state information of the computer-readable program instructions, and the electronic circuit may execute the computer-readable program instructions, thereby realizing various aspects of the present invention.

[0157] Various aspects of the present invention are described herein with reference to the flow charts and / or block diagrams of the methods, devices (systems) and computer program products according to embodiments of the present invention. It should be understood that each box of the flow chart and / or block diagram and the combination of each box in the flow chart and / or block diagram can be implemented by computer-readable program instructions.

[0158] These computer-readable program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, thereby producing a machine, so that when these instructions are executed by the processor of the computer or other programmable data processing device, a device that implements the functions / actions specified in one or more boxes in the flowchart and / or block diagram is generated. These computer-readable program instructions can also be stored in a computer-readable storage medium, and these instructions cause the computer, programmable data processing device, and / or other equipment to work in a specific manner, so that the computer-readable medium storing the instructions includes a manufactured product, which includes instructions for implementing various aspects of the functions / actions specified in one or more boxes in the flowchart and / or block diagram.

[0159] Computer-readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device so that a series of operating steps are performed on the computer, other programmable data processing apparatus, or other device to produce a computer-implemented process, thereby causing the instructions executed on the computer, other programmable data processing apparatus, or other device to implement the functions / actions specified in one or more boxes in the flowchart and / or block diagram.

[0160] The flow charts and block diagrams in the accompanying drawings show the possible architecture, functions and operations of the systems, methods and computer program products according to multiple embodiments of the present invention. In this regard, each box in the flow chart or block diagram can represent a part of a module, a program segment or an instruction, and a part of the module, a program segment or an instruction contains one or more executable instructions for realizing the specified logical function. In some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented by a dedicated hardware-based system that performs the specified function or action, or can be implemented by a combination of dedicated hardware and computer instructions. It is well known to those skilled in the art that it is equivalent to implement it by hardware, implement it by software, and implement it by combining software and hardware.

[0161] Embodiments of the present invention have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or technical improvements in the marketplace, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein. The scope of the present invention is defined by the appended claims.

Claims

1. A method for determining grinding process parameters, characterized in that: The method comprises: Acquire contour data of the workpiece to be processed in a workpiece coordinate system; wherein the workpiece coordinate system is a coordinate system constructed with a reference rotation center of the workpiece to be processed as the origin; Determine the center motion trajectory of the mold according to the profile data and the mold parameters; Discretize the contour data to obtain a contour point set; Determine an actual mold center position set corresponding to the contour point set according to the contour point set, the reference rotation center of the workpiece to be processed and the mold center motion trajectory; The grinding processing parameter set of the workpiece to be processed is determined according to the actual grinding tool center position set and the rotation center offset; wherein the rotation center offset is the offset of the actual rotation center of the workpiece to be processed relative to the reference rotation center in the workpiece coordinate system.

2. The method according to claim 1, characterized in that: The step of determining the actual mold center position set corresponding to the contour point set according to the contour point set, the reference rotation center of the workpiece to be processed, and the mold center motion trajectory comprises: Determining a radial vector set of the workpiece to be processed according to a reference rotation center of the workpiece to be processed and the contour point set; For any radial vector in the radial vector set, the intersection of the radial vector and the center motion trajectory of the mold is determined as the actual mold center position corresponding to the radial vector, and the actual mold center position set corresponding to the radial vector set is obtained.

3. The method according to claim 1, characterized in that Determining the grinding processing parameter set of the workpiece to be processed according to the actual grinding tool center position set and the rotation center offset includes: For any actual grinding tool center position in the actual grinding tool center position set, calculating a first grinding process parameter corresponding to the actual grinding tool center position; Determining a second grinding parameter corresponding to the actual grinding tool center position according to the rotation center offset and the first grinding parameter corresponding to the actual grinding tool center position; The grinding parameter set of the workpiece to be machined is determined according to the second grinding parameter corresponding to each actual grinding tool center position in the actual grinding tool center position set.

4. The method according to claim 3, characterized in that The grinding process parameter includes a rotation parameter, the rotation center offset includes a rotation center angle offset, and determining the second grinding process parameter corresponding to the actual grinding tool center position according to the rotation center offset and the first grinding process parameter corresponding to the actual grinding tool center position includes: A second rotation parameter corresponding to the actual center position of the grinding tool is determined according to the rotation center angle offset and the first rotation parameter corresponding to the actual center position of the grinding tool.

5. The method according to claim 3, characterized in that: The grinding process parameter includes a lateral parameter, the rotation center offset includes a lateral offset of the rotation center, and determining the second grinding process parameter corresponding to the actual grinding tool center position according to the rotation center offset and the first grinding process parameter corresponding to the actual grinding tool center position includes: According to the lateral offset of the rotation center and the first lateral parameter corresponding to the actual center position of the grinding tool, a second lateral parameter corresponding to the actual center position of the grinding tool is determined.

6. The method according to claim 1, characterized in that The rotation center offset is determined according to the position coordinates of the actual rotation center of the workpiece to be processed in the workpiece coordinate system.

7. The method according to claim 1, characterized in that The tool parameters include characteristic dimensions of the tool, and determining the center motion trajectory of the tool according to the profile data and the tool parameters includes: According to the characteristic size of the grinding tool, the contour data is offset to obtain the center motion trajectory of the grinding tool.

8. The method according to claim 1, characterized in that The step of obtaining the contour data of the workpiece to be processed in the workpiece coordinate system includes: Acquiring geometric data of the workpiece to be processed; According to the geometric data of the workpiece to be processed, contour data of the workpiece to be processed in a workpiece coordinate system is determined.

9. An electronic device comprising a memory and a processor, wherein the memory is used to store executable instructions; and the processor is used to operate according to the control of the instructions to execute the method according to any one of claims 1 to 8.

10. A computer-readable storage medium having computer-executable instructions stored thereon, characterized in that: When the executable instructions are executed by the processor, the method for determining grinding process parameters according to any one of claims 1 to 8 is implemented.

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