Micro-nano bubble integrated photocatalysis assisted chemical mechanical polishing method

Abstract

The invention discloses a chemical mechanical polishing method assisted by micro-nano bubble integrated photocatalysis. The chemical mechanical polishing method comprises the following steps: adjusting the height of a sample carrying table; conveying the polishing solution to a sample hose, and dripping the polishing solution on a polishing experiment table; exciting the photocatalyst; the motor is started to drive the polishing experiment table to rotate or move, and the polishing experiment table and the to-be-polished sample are polished; adjusting polishing parameters as required; polishing waste liquid is discharged through the waste liquid outlet, and a polished sample is taken out from the sample outlet. The polishing device has the following beneficial effects that the polishing efficiency is greatly improved, the oxidability is higher, the polishing efficiency is improved, the machining time is shortened, the surface quality is more excellent, the product quality is improved, operation is easy and convenient, control is easy, the device design structure is simple, operation is convenient and rapid, and the application range is wide; and the method can be suitable for various materials and scenes with different polishing requirements, has very high flexibility and adaptability, and provides powerful support for precision machining in different fields.

Description

Technical Field

[0001] The invention belongs to the technical field of precision machining and surface treatment, and particularly relates to a chemical mechanical polishing method assisted by micro-nano bubble integrated photocatalysis. Background Art

[0002] Chemical mechanical polishing (CMP) plays a vital role as a key process in the field of semiconductor and precision manufacturing. It not only enables efficient material removal, but also ensures a high degree of surface flatness, laying a solid foundation for subsequent manufacturing processes. However, although the traditional CMP method meets the process requirements to a certain extent, its inherent limitations cannot be ignored.

[0003] Traditional CMP methods mainly rely on the combined effects of mechanical grinding and chemical corrosion to achieve polishing effects. In this process, abrasive particles in the polishing liquid remove the material surface through mechanical force, while the chemical components in the polishing liquid play a role in accelerating removal and surface modification. However, this method often has problems such as low polishing efficiency and uneven surface quality. Low polishing efficiency will lead to extended production cycles and increased costs, while uneven surface quality may affect product performance and reliability.

[0004] In order to overcome the limitations of traditional CMP methods, researchers have been continuously exploring new polishing techniques and devices. In this process, micro-nano bubble technology, as an emerging surface treatment technology, has attracted much attention due to its unique physical and chemical properties. Micro-nano bubbles have extremely small sizes and high specific surface areas, which enable them to interact more effectively with the chemical components in the polishing liquid, thereby enhancing the dispersibility and oxidizability of the polishing liquid. In addition, micro-nano bubbles can also form a thin bubble layer on the surface of the material. This bubble layer can reduce the direct contact between the material and the polishing pad during the polishing process, thereby reducing friction and wear and protecting the material surface.

[0005] At the same time, photocatalytic technology has also become the focus of researchers due to its efficient oxidation ability. Photocatalytic technology uses ultraviolet light to excite photocatalysts to produce strong oxidizing substances, which can accelerate the oxidation and removal process of the material surface. Introducing photocatalytic technology into the CMP device can further improve the polishing efficiency and surface quality. The present invention combines micro-nano bubble technology with photocatalytic technology and integrates them into the CMP device, which is expected to achieve a more efficient and more precise polishing effect. This new polishing technology and device can not only improve polishing efficiency and surface quality, but also reduce production costs and extend the service life of equipment, and has important application value and development prospects. Summary of the invention

[0006] The technical problem to be solved by the present invention is to propose a micro-nano bubble integrated photocatalytic assisted chemical mechanical polishing method in view of the deficiencies in the above-mentioned prior art.

[0007] In order to solve the above problems, the present invention provides a micro-nano bubble integrated photocatalytic assisted chemical mechanical polishing method, comprising:

[0008] Place the sample to be polished on the sample stage and adjust the height of the sample stage;

[0009] The polishing liquid is delivered to the sample hose through a pump and a micro-nano bubble generator, and dripped onto the polishing laboratory table through the sample rod;

[0010] Adjust the height and angle of the light source rod, as well as the light source intensity, so that the ultraviolet light shines on the polished laboratory table to excite the photocatalyst;

[0011] Start the motor to drive the polishing laboratory table to rotate or move, and perform polishing operations on the sample to be polished;

[0012] Observe the polishing process through the visual window and adjust the polishing parameters as needed;

[0013] After polishing is completed, the polishing waste liquid is discharged through the waste liquid outlet, and the polished sample is taken out from the sample outlet.

[0014] Also includes:

[0015] The polishing process is accommodated by the reaction chamber.

[0016] Also includes:

[0017] The flow rate range of the adjustable pump is 5mL / min-50mL / min;

[0018] The pressure range of the sample pump was adjusted to 0.1 MPa-1 MPa to adjust the speed at which the polishing liquid dripped onto the polishing laboratory table.

[0019] Also includes:

[0020] Micro-nano bubbles with a diameter of 10nm-1000nm are generated in the polishing liquid by a micro-nano bubble generator.

[0021] Also includes:

[0022] Storing polishing liquid in a polishing liquid storage tank;

[0023] Output the sample through the sample outlet and input the sample through the sample inlet;

[0024] The operating parameters of the control device are received through the control panel.

[0025] Also includes:

[0026] By adjusting the height and angle of the sample rod, a sample hose is built into the sample rod, and the inner diameter of the hose ranges from 0.5mm to 5mm.

[0027] Also includes:

[0028] By adjusting the height and angle of the light source rod and adjusting the light source intensity of the light source panel to a range of 100W to 1000W, the distance between the light source of the light source panel and the polishing experimental table can be adjusted to a range of 1cm to 20cm.

[0029] Also includes:

[0030] The height of the sample loading platform 16 is adjusted by adjusting the retracting rod, and the adjustment range of the retracting rod is 0cm-20cm;

[0031] Place the sample to be polished on the sample carrier;

[0032] The waste liquid generated during the polishing process is collected through the polishing waste liquid tank.

[0033] Also includes:

[0034] The motor power is adjusted, and the power range of the motor is 50W-500W.

[0035] Also includes:

[0036] The light source emitted by the control light source panel is an ultraviolet light source with a wavelength of 200nm-400nm, so that the ultraviolet light source excites the photocatalyst to produce strong oxidizing substances.

[0037] The beneficial effects of the present invention are:

[0038] The polishing efficiency is greatly improved. The device uses micro-nano bubble technology to make the polishing liquid more evenly dispersed and more oxidizing, thereby significantly improving the polishing efficiency and shortening the processing time. The surface quality is more superior. Combined with photocatalytic technology, strong oxidizing substances are produced through ultraviolet light excitation, which work together with mechanical grinding to make the surface of the polished material smoother and flatter, improving the product quality. It is easy to operate and easy to control. The device has a simple design structure. Users can easily adjust parameters such as light source intensity and polishing liquid flow through the control panel to achieve precise control of the polishing process. The operation is convenient and fast. Wide range of applications. The device can be applied to a variety of materials and scenes with different polishing requirements. It has strong flexibility and adaptability, and provides strong support for precision processing in different fields. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0040] Figure 1 It is a structural schematic diagram of a micro-nano bubble integrated photocatalytic assisted chemical mechanical polishing device provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0041] In order to clearly explain the purpose, technical solutions and advantages of the embodiments of the present invention, this section will provide a detailed and complete explanation of the technical solutions of the embodiments of the present invention based on the accompanying drawings. Obviously, the embodiments described here are only some examples of the present invention, not all. Based on the embodiments disclosed in the present invention, all other embodiments that can be obtained by those skilled in the art without creative work should be regarded as the scope covered by the present invention.

[0042] A micro-nano bubble integrated photocatalytic assisted chemical mechanical polishing method provided in an embodiment of the present invention comprises steps S1-S6:

[0043] S1. Place the sample to be polished on the sample stage and adjust the height of the sample stage;

[0044] S2, the polishing liquid is transported to the sample hose through a pump and a micro-nano bubble generator, and dripped onto the polishing laboratory table through the sample rod;

[0045] S3, adjusting the height and angle of the light source rod, as well as the light source intensity, so that the ultraviolet light is irradiated on the polished experimental table to excite the photocatalyst;

[0046] S4, start the motor to drive the polishing test table to rotate or move, and perform polishing operation on the sample to be polished;

[0047] S5. Observe the polishing process through the visual window and adjust the polishing parameters as needed;

[0048] S6. After polishing is completed, the polishing waste liquid is discharged through the waste liquid discharge port, and the polished sample is taken out from the sample outlet.

[0049] Preferably, the micro-nano bubble integrated photocatalytic assisted chemical mechanical polishing method further comprises step S7-S:

[0050] S7. The polishing process is accommodated by the reaction chamber.

[0051] S8, adjust the flow range of the pump to 5mL / min-50mL / min;

[0052] S9. Adjust the pressure range of the sample pump to 0.1 MPa-1 MPa to adjust the speed at which the polishing liquid drips onto the polishing laboratory table.

[0053] S10, generating micro-nano bubbles with a diameter of 10nm-1000nm in the polishing liquid through a micro-nano bubble generator.

[0054] S11, storing the polishing liquid in a polishing liquid storage tank;

[0055] S12, outputting the sample through the sample outlet, and inputting the sample through the sample inlet;

[0056] S13. Receive operating parameters of the control device through the control panel.

[0057] S14. By adjusting the height and angle of the sample rod, a sample hose is built into the sample rod, and the inner diameter of the hose ranges from 0.5mm to 5mm.

[0058] S15. By adjusting the height and angle of the light source rod and adjusting the light source intensity of the light source panel to a range of 100W to 1000W, the distance between the light source of the light source panel and the polishing test bench can be adjusted to a range of 1cm to 20cm.

[0059] S16. Adjust the height of the sample loading platform by adjusting the retracting rod, and the adjustment range of the retracting rod is 0cm-20cm;

[0060] S17 places the sample to be polished on the sample carrier;

[0061] S18. Collecting waste liquid generated during the polishing process through a polishing waste liquid tank.

[0062] S19, adjusting the motor power, the power range of the motor is 50W-500W.

[0063] S20, controlling the light source panel to emit an ultraviolet light source with a wavelength of 200nm-400nm, so as to excite the photocatalyst to produce a strong oxidizing substance.

[0064] See also Figure 1 , Figure 11 is a schematic diagram of the structure of a micro-nano bubble integrated photocatalytically assisted chemical mechanical polishing device provided by an embodiment of the present invention. The micro-nano bubble integrated photocatalytically assisted chemical mechanical polishing method is implemented by the micro-nano bubble integrated photocatalytically assisted chemical mechanical polishing device. The micro-nano bubble integrated photocatalytically assisted chemical mechanical polishing method includes a reaction chamber 1, a sample carrier base 2, a visual window 3, a waste liquid discharge port 4, a pump 5, a micro-nano bubble generator 6, a polishing liquid sample storage tank 7, a sample outlet 8, a sample inlet 9, a control panel 10, a sample pump 11, a sample rod 12, a light source rod 13, a light source panel 14, a retractable rod 15, a sample carrier 16, a polishing experimental table 17, a polishing waste liquid tank 18 and a motor 19. The sample carrier base 2 is fixed above the reaction chamber 1 and is connected to the retractable rod 15. The retractable rod 15 for adjusting the height of the sample carrier 16 is connected to the sample carrier 16. The sample rod 12 with adjustable height and angle has a built-in sample hose. The polishing liquid is taken out of the polishing liquid storage tank by the pump 5. 7 is transmitted to the sample hose and drips onto the polishing test bench 17, a light source panel 14 is placed on a light source rod 13 with adjustable height and angle, the distance between the light source panel 14 and the polishing test bench 17 is adjusted by adjusting the height of the light source rod 13, the light source panel 14 is electrically connected to the control panel 10 so that the parameters of the light source panel 14 can be adjusted by adjusting the control panel 10, a visual window 3 is arranged on the side wall of the reaction chamber 1 to facilitate observation of the polishing process, a waste liquid discharge port 4 for discharging polishing waste liquid is arranged at the bottom of the reaction chamber 1, a micro-nano bubble generator 6 is connected to the pump 5, a polishing liquid storage tank 7 for storing polishing liquid is respectively connected to the sample outlet 8 and the sample inlet 9, the sample outlet 8 and the sample inlet 9 are respectively arranged on both sides of the polishing test bench 17, a sample pump 12 for adjusting the speed at which the polishing liquid drips onto the polishing test bench 17 is connected to the light source rod 13, a polishing waste liquid tank 18 is arranged below the polishing test bench 17, and a motor 19 is driven and connected to the polishing test bench 17 to drive the polishing test bench 17 to work. The sample stage base 2, pump 5, micro-nano bubble generator 6, polishing liquid sample storage tank 7, sample pump 11, sample rod 12, light source rod 13, light source panel 14, retracting rod 15, sample stage 16, polishing experimental table 17, polishing waste liquid tank 18 and motor 19 are all arranged in the reaction chamber 1. The visual window 3, waste liquid discharge port 4, sample outlet 8, sample inlet 9 and control panel 10 are all arranged on the surface of the reaction chamber 1.

[0065] The capacity of the polishing liquid sample storage tank 7 is not less than 500 mL.

[0066] The distance between the light source panel 14 and the polishing test platform 17 can be adjusted in a range of 1 cm to 20 cm.

[0067] The length adjustment range of the retractable rod 15 is 0-20 cm.

[0068] The reaction chamber 1 is used to accommodate the polishing process.

[0069] The viewing window 3 is convenient for observing the polishing process.

[0070] The waste liquid discharge port 4 is used to discharge polishing waste liquid.

[0071] The flow rate range of pump 5 is 5 mL / min to 50 mL / min, and it is used to transport polishing liquid.

[0072] The pressure range of the sample pump 11 is 0.1 MPa to 1 MPa, and is used to adjust the speed at which the polishing liquid drops onto the polishing experimental table 17 .

[0073] The micro-nano bubble generator 6 is used to generate micro-nano bubbles with a diameter of 10 nm to 1000 nm in the polishing liquid.

[0074] The polishing liquid sample storage tank 7 is used to store the polishing liquid.

[0075] The sample outlet 8 and the sample inlet 9 are used for the sample to enter and exit.

[0076] The control panel 10 is used to control the operating parameters of the device.

[0077] The height and angle of the sample rod 12 are adjustable, and a sample hose is built in, and the inner diameter of the hose is 0.5 mm to 5 mm.

[0078] The height and angle of the light source rod 13 are adjustable, and a light source panel 14 is placed on it. The light source intensity ranges from 100W to 1000W, and the distance between the light source of the light source panel 14 and the polishing test bench can be adjusted from 1cm to 20cm.

[0079] The retractable rod 15 is used to adjust the height of the sample loading platform 16, and the adjustment range is 0 cm to 20 cm.

[0080] The sample carrier 16 is used to place the sample to be polished.

[0081] The polishing test bench 17 is used for performing polishing operations.

[0082] The polishing waste liquid tank 18 is used to collect waste liquid generated during the polishing process.

[0083] The power of the motor 19 is in the range of 50W to 500W, and is used to drive the polishing experimental table 17 to rotate or move.

[0084] The light source emitted by the light source panel 14 is an ultraviolet light source with a wavelength of 200nm to 400nm, which is used to excite the photocatalyst to produce strong oxidizing substances.

[0085] The following provides a method for using the equipment of the micro-nano bubble integrated photocatalytic assisted chemical mechanical polishing method when in use:

[0086] Preparation stage: First, place the diamond sample to be polished on the sample stage 16 and ensure that the sample is fixed and stable. Then, set the light source intensity, polishing liquid flow rate and other parameters through the control panel 10.

[0087] Polishing liquid supply: Start the pump 5 to transfer the polishing liquid from the polishing liquid storage tank 7 to the end of the sample rod 12 through the sample hose, and then drip it onto the polishing experimental table 17 at a certain speed. At this time, the micro-nano bubble generator 6 starts to work, generating micro-nano bubbles to enhance the dispersibility and oxidizability of the polishing liquid.

[0088] Photocatalytic assistance: adjust the height and angle of the light source rod 13 to keep the light source 14 at an appropriate distance from the polishing experimental table 17. Turn on the light source and use ultraviolet light to excite the photocatalyst in the polishing liquid to produce strong oxidizing substances.

[0089] Polishing process: start the motor 19 to drive the polishing experimental table 17 to rotate, and the sample stage 16 can also be adjusted in height as needed. Under the combined action of mechanical grinding and photocatalytic oxidation, the surface of the diamond sample is gradually polished.

[0090] Observation and adjustment: Observe the polishing process through the visual window 3 and adjust the polishing parameters as needed to achieve the best polishing effect.

[0091] End and clean up: After polishing is completed, turn off all equipment and power supplies, discharge the polishing waste liquid through the waste liquid outlet 4, and clean the polishing experimental table 17 and the sample loading table 16.

[0092] And provide the following embodiments:

[0093] Taking a diamond sample with a diameter of 10 mm and a thickness of 2 mm as an example, the micro-nano bubble integrated photocatalytic assisted efficient chemical mechanical polishing method of the present invention was used for polishing. The light source intensity was set to 2000 W / m 2 , the polishing liquid flow rate is 5mL / min, and the polishing time is 30min. During the polishing process, the surface changes of the diamond sample were observed through the visual window, and it was found that its surface gradually became smooth and had no obvious scratches. The surface gloss of the diamond sample was significantly improved, and no obvious scratches or damage appeared. Finally, the equipment was turned off and the polishing site was cleaned up. At the same time, the entire polishing process is easy to operate, does not require complicated manual intervention, and the polishing waste liquid is easy to handle, which meets environmental protection requirements.

[0094] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A micro-nano bubble integrated photocatalytic assisted chemical mechanical polishing method, characterized in that: include: Place the sample to be polished on the sample stage and adjust the height of the sample stage; The polishing liquid is delivered to the sample hose through a pump and a micro-nano bubble generator, and dripped onto the polishing laboratory table through a sample rod; Adjust the height and angle of the light source rod, as well as the light source intensity, so that the ultraviolet light shines on the polished laboratory table to excite the photocatalyst; Start the motor to drive the polishing laboratory table to rotate or move, and perform polishing operations on the sample to be polished; Observe the polishing process through the visual window and adjust the polishing parameters as needed; After polishing is completed, the polishing waste liquid is discharged through the waste liquid outlet, and the polished sample is taken out from the sample outlet.

2. The chemical mechanical polishing method according to claim 1, characterized in that: Also includes: The polishing process is accommodated by the reaction chamber.

3. The chemical mechanical polishing method according to claim 1, characterized in that: Also includes: The flow rate range of the adjustable pump is 5mL / min-50mL / min; The pressure range of the sample pump was adjusted to 0.1MPa-1MPa to adjust the speed at which the polishing liquid dripped onto the polishing laboratory table.

4. The chemical mechanical polishing method according to claim 1, characterized in that: Also includes: Micro-nano bubbles with a diameter of 10nm-1000nm are generated in the polishing liquid by a micro-nano bubble generator.

5. The chemical mechanical polishing method according to claim 1, characterized in that: Also includes: Storing polishing liquid in a polishing liquid storage tank; Output the sample through the sample outlet and input the sample through the sample inlet; The operating parameters of the control device are received through the control panel.

6. The chemical mechanical polishing method according to claim 1, characterized in that: Also includes: By adjusting the height and angle of the sample rod, a sample hose is built into the sample rod, and the inner diameter of the hose ranges from 0.5mm to 5mm.

7. The chemical mechanical polishing method according to claim 1, characterized in that: Also includes: By adjusting the height and angle of the light source rod and adjusting the light source intensity of the light source panel to a range of 100W to 1000W, the distance between the light source of the light source panel and the polishing experimental table can be adjusted to a range of 1cm to 20cm.

8. The chemical mechanical polishing method according to claim 1, characterized in that: Also includes: The height of the sample loading platform can be adjusted by adjusting the retracting rod, and the adjustment range of the retracting rod is 0cm-20cm; Place the sample to be polished on the sample carrier; The waste liquid generated during the polishing process is collected through the polishing waste liquid tank.

9. The chemical mechanical polishing method according to claim 1, characterized in that: Also includes: The motor power is adjusted, and the power range of the motor is 50W-500W.

10. The chemical mechanical polishing method according to claim 1, characterized in that: Also includes: The light source emitted by the control light source panel is an ultraviolet light source with a wavelength of 200nm-400nm, so that the ultraviolet light source excites the photocatalyst to produce strong oxidizing substances.

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