Vertical scrubbing device, wafer processing equipment, wafer scrubbing method and storage medium

Abstract

The invention relates to the technical field of semiconductor wafer processing, and provides a vertical scrubbing device, wafer processing equipment, a wafer scrubbing method and a storage medium. The vertical scrubbing device comprises a box body, a clamping assembly, a scrubbing assembly and a rotary check ring. The clamping assembly vertically clamps the wafer and drives the wafer to rotate, and the front face of the wafer is coated with the cleaning liquid under the action of gravity and wafer rotation; the scrubbing assembly scrubs the front surface of the wafer; the circumferential wall face of the rotating check ring surrounds the clamping assembly and gradually shrinks away from the back plate, and the clamping assembly can axially stretch and retract between the loading and unloading position and the scrubbing position. The clamping assembly comprises a fixed clamping jaw and a movable clamping jaw which are respectively used for clamping the lower half part edge and the upper half part edge of a wafer; when the clamping assembly moves towards the loading and unloading position, the radial outer part of the movable clamping jaw is stopped by the rotary check ring, so that the movable clamping jaw rotates away from the wafer and is opened; when the clamping assembly retracts towards the scrubbing position, the movable clamping jaw automatically rotates towards the wafer and retracts to clamp the wafer.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor wafer processing, and in particular to a vertical scrubbing device, wafer processing equipment, a wafer scrubbing method and a storage medium. Background Art

[0002] After the wafer has been through chemical mechanical polishing (CMP), it needs to be cleaned to remove polishing debris or other contaminants on the surface. During the cleaning process, the wafer passes through two vertical scrubbing modules and then enters the horizontal scrubbing module for scrubbing to further remove contaminants on the wafer surface. However, during horizontal scrubbing, the cleaning liquid is not easy to spread along the wafer surface, resulting in poor scrubbing effect. In addition, the liquid splashed onto the scrubbing arm easily falls back onto the wafer, causing secondary contamination of the wafer. Summary of the invention

[0003] The present application provides a vertical scrubbing device, a wafer processing equipment, a wafer scrubbing method and a storage medium to solve or alleviate at least some of the problems mentioned above.

[0004] According to one aspect of the present application, a vertical scrubbing device is provided, the vertical scrubbing device comprising a box, a clamping assembly and a scrubbing assembly mounted on a back plate of the box, and a rotating retaining ring coaxially arranged with the clamping assembly; the clamping assembly is used to vertically clamp a wafer and drive the wafer to rotate, and the cleaning liquid provided to the front side of the wafer coats the front side of the wafer under the action of gravity and wafer rotation; the scrubbing assembly is configured to scrub the front side of the wafer; the circumferential wall of the rotating retaining ring surrounds the clamping assembly and gradually shrinks away from the back plate, and the clamping assembly can be axially retracted between a loading and unloading position extending from the rotating retaining ring and a scrubbing position retracted into the rotating retaining ring; The clamping assembly includes a fixed clamping jaw arranged at its lower half and a movable clamping jaw arranged at its upper half, which are respectively used to clamp the lower half edge and the upper half edge of the wafer; when the clamping assembly moves to the loading and unloading position, the radial outer part of the movable clamping jaw is stopped by the rotating retaining ring so that the movable clamping jaw rotates away from the wafer and opens, so that the wafer can move up and down over the movable clamping jaw; when the clamping assembly shrinks to the scrubbing position, the movable clamping jaw automatically rotates toward the wafer and retracts to clamp the wafer.

[0005] Optionally, the movable clamp includes a mounting seat and a clamp body, the clamp body is configured with a clamping portion on a side thereof facing away from the mounting seat, the clamp body can rotate around a rotating axis on the mounting seat to open or retract, and when the clamping assembly moves toward the loading and unloading position, the radial outer end of the clamp body is stopped by the rotating retaining ring so that the clamp body rotates away from the wafer and opens.

[0006] Optionally, the movable jaw includes a resetter, which is configured to abut against the back of the jaw body between the radial outer end of the jaw body and the rotating shaft, and the resetter is configured to be compressed by the jaw body when the movable jaw is opened, and to push the jaw body to rotate and retract when the movable jaw is separated from the rotating retaining ring.

[0007] Optionally, a detector is provided on the circumferential wall surface of the rotating retaining ring, and the detector is configured to detect the vertical state of the wafer clamped by the clamping assembly; the detector is communicatively connected to the resetter, and the resetter is configured to reduce the pushing force on the clamp body when the detector detects that the vertical state of the wafer is non-vertical.

[0008] Optionally, the detector is a visual detector, which is configured to photograph the wafer from the side and identify the maximum distance of the wafer in its thickness direction. When the maximum distance exceeds a preset wafer thickness value, the vertical state of the wafer is determined to be non-vertical.

[0009] Optionally, the detector is a visual detector, which is configured to photograph the wafer from the side, and then identify and draw the side profile of the wafer. When the side profile of the wafer drawn is a non-vertical straight line segment, the visual detector determines that the vertical state of the wafer is non-vertical.

[0010] Optionally, the restorer is an elastic support member arranged on the mounting seat and extending toward the jaw body, the elastic support member supports the portion between the radial outer end of the jaw body and the rotating shaft, the elastic support member is compressed when the radial outer end of the jaw body is stopped by the rotating retaining ring, and pushes the jaw body to be retracted when the clamping assembly moves axially from the loading and unloading position to the scrubbing position.

[0011] Optionally, the clamping assembly includes a circular substrate, the fixed clamping jaw is arranged at the periphery of the lower half of the circular substrate, and the movable clamping jaw is arranged at the periphery of the upper half of the circular substrate; the distance between the radial outer end of the clamping jaw body and the axis of the circular substrate is greater than the opening radius of the circumferential wall of the rotating retaining ring.

[0012] Optionally, the rotating retaining ring is configured to rotate together with the clamping assembly when the wafer is scrubbed to collect liquid thrown off the surface of the wafer.

[0013] Optionally, the rotating retaining ring includes a vertical wall surface of the rotating retaining ring connected to its circumferential wall surface, the vertical wall surface of the rotating retaining ring and the circumferential wall surface of the rotating retaining ring form a accommodating space for accommodating the clamping assembly, and the circumferential edge portion of the vertical wall surface of the rotating retaining ring is constructed with one or more first through holes for discharging the liquid collected by the rotating retaining ring from the accommodating space.

[0014] Optionally, the vertical scrubbing device also includes a fixed retaining ring fixed to the box body and coaxially arranged with the clamping assembly, the circumferential wall of the fixed retaining ring surrounds at least a portion of the circumferential wall of the rotating retaining ring, and the fixed retaining ring is used to collect liquid discharged from the first through hole; the vertical bottom of the circumferential wall of the fixed retaining ring is configured with a second through hole for discharging the liquid collected by the fixed retaining ring downward.

[0015] Optionally, the scrubbing assembly includes: a swinging member, including a swinging shaft and a swinging arm, the swinging shaft rotates to drive the swinging arm to swing parallel to the front side of the wafer; a scrubbing member, arranged at the end of the swinging arm; a droplet guiding assembly, including a collecting shield and a flow guiding shield, the collecting shield wraps around the periphery of the scrubbing member, the flow guiding shield engages the end of the collecting shield close to the swinging arm and extends along the swinging arm toward the swinging shaft; the scrubbing assembly is configured to drive the swinging arm to swing in front of the wafer and make the scrubbing member contact the front side of the wafer for scrubbing, the collecting shield is used to collect liquid dripping from the scrubbing member, and the flow guiding shield is used to guide the collected liquid to the outside of the wafer.

[0016] Optionally, the scrubbing member includes a rigid wiping head base and a compressible wiping head, wherein the wiping head is configured to absorb liquid on the surface of the wafer when scrubbing the wafer, and the connection between the base and the wiping head is enclosed in the collecting shield, and the length of the wiping head extending from the collecting shield is greater than the compression caused by the wiping head pressing against the wafer when scrubbing the wafer.

[0017] Optionally, a cross-sectional dimension of the collecting shield gradually increases toward the swing arm, so that the liquid in the collecting shield flows along the inclined inner wall of the collecting shield to the guide shield.

[0018] Optionally, the flow guide shield is arranged on the side of the swing arm facing the back plate, the cross-section of the flow guide shield is configured to be U-shaped, and the surface of the flow guide shield and the swing arm form a flow channel that guides the liquid to outside the wafer.

[0019] Optionally, the droplet guiding assembly further comprises a splash shield, which is sleeved on the outer periphery of the swing shaft and is used to guide the liquid flowing out of the guide shield to slide down along its outer surface.

[0020] Optionally, the splash shield is configured with a circumferentially extending and inwardly recessed splash groove at a position corresponding to the outlet of the deflector shield, wherein the splash groove provides a velocity buffer space for droplets dripping onto the splash shield and guides them to slide down.

[0021] Optionally, the swing shaft is configured to be axially retractable, and the swing shaft is configured to: axially contract when the swing arm swings from the center of the wafer to the outer edge of the wafer, so that the scrubbing member presses against the front side of the wafer to scrub and push the scrubbed contaminants out of the wafer; and axially extend when the swing arm swings from the outer edge of the wafer to the center of the wafer, so that there is a gap between the scrubbing member and the front side of the wafer, and the gap is larger than the thickness of the liquid film formed by the cleaning liquid on the surface of the wafer.

[0022] Optionally, a droplet aspirator opening toward the wiping head is provided at the end of the wiping head base, and the droplet aspirator is used to aspirate liquid accumulated at the wiping head, and the suction force of the droplet aspirator is smaller than the surface tension of a liquid film formed by the cleaning liquid on the wafer surface.

[0023] Optionally, the swing shaft is installed at the lower side of the clamping assembly, and the scrubbing assembly also includes a self-cleaning assembly, which includes: a cleaning table installed on the back plate, the cleaning table is located vertically above the swing shaft and is opposite to the scrubbing member when the swing arm swings to a vertical position, the cleaning table is configured to spray a self-cleaning agent to clean the scrubbing member; a liquid receiving tank is arranged below the cleaning table for collecting the self-cleaning agent.

[0024] According to another aspect of the present application, a wafer processing equipment is provided, which includes a wafer processing unit and the vertical scrubbing device as described in the above aspects.

[0025] According to another aspect of the present application, a wafer scrubbing method is provided, which is used for the vertical scrubbing device as described in the above aspect, and the wafer scrubbing method comprises: Move the clamping assembly from the scrubbing position to the loading and unloading position; Move the wafer vertically downward from the inlet and outlet at the top of the box to the fixed clamping jaws of the clamping assembly; moving the clamping assembly from the loading and unloading position to the scrubbing position; Swing the swing arm of the scrubbing assembly to the front of the wafer and make the scrubbing member at the end of the swing arm contact the front side of the wafer; The clamping assembly is driven to rotate, and the swing arm is simultaneously swung to scrub the wafer.

[0026] According to another aspect of the present application, a computer storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the wafer scrubbing method as described in the above aspects is implemented.

[0027] According to the technical solution of the present application, by changing horizontal scrubbing to vertical scrubbing, under the action of gravity, the cleaning liquid in the upper half of the wafer can flow to the center of the wafer, and under the action of the rotating centrifugal force, the cleaning liquid provided to the surface of the wafer can spread radially outward, so that the cleaning liquid can be easily and quickly spread along the surface of the wafer. Compared with horizontal scrubbing, vertical scrubbing requires a lower rotation speed, which reduces energy consumption. In addition, since the coating effect of the cleaning liquid is good, a large amount of cleaning liquid is not required to make up for the shortage of cleaning liquid in the center or radial outer part of the wafer, thereby saving cleaning liquid. The present application also realizes accurate vertical placement and stable clamping of the wafer through the design of the fixed clamp and the movable clamp of the clamping assembly. The cooperation of the movable clamp and the rotating retaining ring makes full use of the rotating retaining ring to open the movable clamp, increases the functionality of the rotating retaining ring, and greatly simplifies the complexity of the structure and control of the wafer vertical scrubbing device. Through the mechanical cooperation of the movable clamp and the rotating retaining ring, the timing and accuracy and stability of the opening of the movable clamp are guaranteed, which is conducive to the efficient and accurate placement and clamping process of the wafer, and then conducive to the efficient and stable vertical scrubbing process, and improves the wafer scrubbing efficiency and cleanliness. In addition, due to the vertical setting of the clamping assembly, during the rotation of the clamping assembly, the fixed clamp and the movable clamp can be periodically in a high position and the part in contact with the wafer is facing downward, so that the contaminants in the fixed clamp and the movable clamp and the wafer contact part can fall under the action of gravity, and will not continue to accumulate and contaminate, crystallize and scratch the edge of the wafer, thereby further improving the cleanliness and yield of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0029] Figure 1 is a schematic diagram of a horizontal scrubbing module; Figure 2 is a schematic diagram of a vertical scrubbing device according to an embodiment of the present application; Figure 3 for Figure 2 A schematic diagram of another state of the vertical scrubbing device in FIG. Figure 4 for Figure 3A schematic diagram of another angle of the vertical scrubbing device in FIG. Figure 5 for Figure 2 A schematic cross-sectional view of a vertical scrubbing device in FIG. Figure 6 for Figure 2 A schematic diagram of a swing member according to an embodiment of the present invention; Figure 7 Shows Figure 2 A schematic diagram of a vertical scrubbing device in operation; Figure 8 for Figure 2 A schematic diagram of a swing member according to another embodiment of the present invention; Fig. 9 Shows Figure 8 A cross-sectional view of a swinging member in FIG. Fig.10 Shows Figure 8 A schematic diagram of the collection shield in FIG. Fig.11 Shows Figure 8 A partial schematic diagram of the swinging member in FIG. Fig.12 Shows Figure 8 A schematic diagram of a side portion of a splash shield in FIG. Fig.13 Shows Figure 8 An enlarged view of the scrubbing member in which the collection shield is omitted; Fig.14 Shows Figure 2 A schematic diagram of a clamping assembly in FIG. Fig.15 Shows Fig.14 A cross-sectional view of a movable clamping jaw of a clamping assembly; Fig.16 Shows Fig.15 A cross-sectional view of another state of the movable clamping jaw; Fig.17 Shows Fig.14 A schematic diagram of bending the wafer when the clamping assembly clamps the wafer; Fig.18 Shows Fig.14 A schematic diagram of tilting the wafer when the clamping assembly clamps the wafer; Fig.19 Shows Figure 2 A schematic diagram of another angle of the vertical scrubbing device in FIG. Fig. 20 Shows Figure 2 A schematic diagram of the top of the box of the vertical scrubbing device in FIG. Fig.21 A flow chart of a wafer scrubbing method according to an embodiment of the present application is shown; Fig. 22 A schematic diagram of a wafer processing device according to an embodiment of the present application is shown.

[0030] Reference numerals: W, wafer; 120, horizontal clamping assembly; 1, vertical scrubbing device; 10, box; 12, back plate; 13, side plate; 14, top plate; 140, inlet and outlet; 141, cover plate; 15, bottom plate; 151, drainage hole; 20, clamping assembly; 21, circular substrate; 210, injection hole; 22, fixed clamping jaw; 23, movable clamping jaw; 231, mounting seat; 2310, lug; 2311, stopper; 232, clamping jaw body; 233, clamping 234, rotating shaft; 235, elastic support member; 2351, receiving hole; 2352, supporting head; 2353, guide shaft; 24, rotating shaft of clamping assembly; 30, scrubbing assembly; 32, scrubbing member; 31, swinging member; 311, swinging shaft; 312, swing arm; 321, scrubbing head base; 322, scrubbing head; 331, cleaning table; 332, receiving tank; 333, jet pipe; 301, scrubbing member driver; 302, regulator; 40, supply liquid container; 50, rotating retaining ring; 51, circumferential wall of rotating retaining ring; 52, vertical wall of rotating retaining ring; 511, first through hole; 60, fixed retaining ring; 61, circumferential wall of fixed retaining ring; 62, second through hole; 71, collecting shield; 72, guide shield; 73, splash shield; 731, splash groove; 711, mounting flange; 712, joint; 81, first rotating motor; 82, first telescopic motor; 83, second rotating motor; 84 , second telescopic motor; 91, first synchronous belt; 92, second synchronous belt; 93, third synchronous belt; 94, fourth synchronous belt; 100, front-end module; 200, transmission unit; 201, front-end manipulator; 202, transmission manipulator; 300, wafer processing unit; 310, wafer chemical mechanical polishing device; 400, cleaning and drying unit; 410, primary scrubbing device; 420, secondary scrubbing device; 430, drying device; 440, cache device. DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the embodiments of the present application should fall within the scope of protection of the embodiments of the present application.

[0032] In the description of the present application, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0033] In addition, in the description of the present application, unless otherwise specified and limited, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the internal connection between two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.

[0034] After the wafer W is processed, it is usually necessary to clean it to remove contaminants such as debris generated by grinding or polishing. The wafer cleaning unit may include a brushing module and a scrubbing module. The existing wafer scrubbing module is usually a horizontal scrubbing module, such as Figure 1 As shown, it includes a horizontal clamping assembly 120 for horizontally clamping the wafer W and a scrubbing assembly 30, wherein the swing arm 312 of the scrubbing assembly 30 swings in a horizontal plane so that the scrubbing member 32 scrubs the surface to be cleaned of the wafer W, that is, Figure 1 The upper surface of the wafer W. The horizontal scrubbing module also includes a liquid supply device 40 to supply the cleaning liquid to the upper surface of the wafer W. However, the cleaning liquid supplied to the horizontal upper surface of the wafer W can only be spread on the surface of the wafer W by relying on the centrifugal force of rotation. In order to enable the cleaning liquid to be applied to the radially outer part of the wafer W, the clamping device needs to have a higher rotation speed to drive the wafer W and the cleaning liquid thereon to rotate, which requires more driving energy consumption, and high-speed rotation will increase the risk of unstable clamping of the wafer W and fragmentation. In addition, the cleaning liquid may splash off the surface of the wafer W and contaminate other components such as the scrubbing assembly 30. On the other hand, it is difficult for the cleaning liquid to reach the center area of ​​the wafer, resulting in insufficient cleaning liquid in the center area of ​​the wafer and poor cleaning effect. In addition, when performing horizontal scrubbing, the swing arm 312 swings above the wafer W, and the liquid splashed onto the swing arm 312 is very easy to drip onto the surface of the wafer W again, causing secondary contamination.

[0035] In order to solve at least one of the above problems, the present application provides a vertical scrubbing device 1, such as Figure 2 The vertical scrubbing device 1 may include a housing 10 having a back plate 12 and a front plate (not shown) extending vertically, two side plates 13, and a top plate 14 extending horizontally and opposite to each other (see Figure 5) and a bottom plate 15. The vertical scrubbing device 1 further comprises a clamping assembly 20 and a scrubbing assembly 30 mounted to the back plate 12 of the box body 10, and a liquid supply device 40 mounted to one of the two side plates 13 of the box body 10, for example, on the side plate 13 away from the scrubbing assembly 30 to avoid mutual interference. The clamping assembly 20 is used to vertically clamp the wafer W and drive the wafer W to rotate, and the liquid supply device 40 is used to provide cleaning liquid to the front side of the wafer W. The cleaning liquid is coated into a liquid film along the front side of the wafer W driven by gravity and the rotation of the wafer W. Thus, by changing horizontal scrubbing to vertical scrubbing, under the action of gravity, the cleaning liquid in the upper half of the wafer W can flow to the center of the wafer W, and under the action of the rotating centrifugal force, the cleaning liquid provided to the surface of the wafer W can spread radially outward, so that the cleaning liquid can be easily and quickly spread along the surface of the wafer W. Compared with horizontal scrubbing, the rotation speed required for vertical scrubbing is lower, which reduces energy consumption, and because the coating effect of the cleaning liquid is good, a large amount of cleaning liquid does not need to be accumulated to make up for the shortcomings of insufficient cleaning liquid in the center or radially outside of the wafer W, thereby saving cleaning liquid. The liquid feeder 40 can have two nozzles, one for spraying chemical liquid and the other for spraying deionized water. In addition, it should be understood that the front of the wafer W mentioned herein refers to the front plate of the wafer W facing the box 10, that is, the surface of the back plate 12 facing away from the box 10, and the back of the wafer W refers to the surface of the back plate 12 of the wafer W facing the box 10.

[0036] The scrubbing assembly 30 mainly includes an oscillating member 31 and a scrubbing member 32 . Figure 2 The main structure of the swing member 31 is shown, including a swing shaft 311 and a swing arm 312 arranged at the lower side of the clamping assembly 20. The swing shaft 311 can rotate to drive the swing arm 312 to swing parallel to the front side of the wafer W. The scrubbing member 32 is arranged at the end of the swing arm 312, that is, the end opposite to the end of the swing arm 312 connected to the swing shaft 311. Figure 6 The scrubbing member 32 mainly includes a rigid scrubbing head base 321 and a compressible scrubbing head 322. The scrubbing head 322 is preferably a sponge with good hydrophilicity, such as PU (polyurethane) or PVA (polyvinyl alcohol). Figure 2 , the swing member 31 has a working state, in which the swing member 31 swings parallel to the front side of the wafer W to scrub the wafer W. Figure 3 and Figure 4 The swing member 31 has a rest state. In the rest state, the swing arm 312 is in a vertical position, away from the clamping assembly 20 and the wafer W. The swing arm 312 can perform self-cleaning at the cleaning table 331, or wait for the wafer W to be scrubbed to be placed in the vertical scrubbing device 1.

[0037] In a preferred embodiment, the swing shaft 311 is configured to be axially retractable, specifically, it is configured to: axially contract during the process of the swing arm 312 swinging from the center of the wafer W to the outer edge of the wafer W, so that the scrubbing member 32 presses against the front side of the wafer W for scrubbing and pushes the scrubbed contaminants to the outside of the wafer W along with the cleaning liquid; and axially extend during the process of the swing arm 312 swinging from the outer edge of the wafer W to the center of the wafer W, so that there is a gap between the scrubbing member 32 and the front side of the wafer W, and the gap is larger than the thickness of the liquid film on the surface of the wafer W. By controlling the extension and retraction of the swing shaft 311, in the process of the swing arm 312 swinging from the center of the wafer W to the outer edge of the wafer W, the scrubbing member 32 scrubs the wafer W from the inside to the outside in the radial direction of the wafer W, and at the same time pushes the liquid film on the surface of the wafer W outward, so that the scrubbed pollutants can flow to the outside of the wafer W with the liquid film, thereby improving the pollutant removal effect; in the process of the swing arm 312 swinging from the outer edge of the wafer W to the center of the wafer W, by making the gap between the scrubbing member 32 and the front side of the wafer W greater than the thickness of the liquid film, the liquid film will not be pushed from the outside to the inside in the radial direction of the wafer W, effectively preventing the pollutants in the liquid film from being pushed back to the center part of the wafer W.

[0038] Also like Figure 2-Figure 5 The vertical scrubbing device 1 further comprises a rotating retaining ring 50 coaxially arranged with the clamping assembly 20, and a circumferential wall surface 51 of the rotating retaining ring surrounds the outer periphery of the clamping assembly 20. In order to facilitate the wafer W to enter the box body 10 from the top of the box body 10 for clamping, the clamping assembly 20 is constructed to be axially retractable, and has a loading and unloading position axially extending from the rotating retaining ring 50 for loading or unloading the wafer W, and a scrubbing position axially retracted into the rotating retaining ring 50 for scrubbing the wafer W. When scrubbing the wafer W, the rotating retaining ring 50 rotates together with the clamping assembly 20 to collect the liquid thrown out from the surface of the wafer W. The synchronous rotation of the rotating retaining ring 50 and the clamping assembly 20 makes the two relatively stationary, thereby making the relative speed between the liquid thrown out from the surface of the wafer W and the rotating retaining ring 50 significantly smaller than the relative speed between the two when the rotating retaining ring 50 is fixedly arranged, which significantly reduces the situation where the liquid thrown out from the surface of the wafer W hits the rotating retaining ring 50 and splashes back, thereby avoiding secondary contamination of the wafer W.

[0039] In a preferred embodiment, the rotating retaining ring 50 includes a vertical wall surface 52 of the rotating retaining ring connected to the circumferential wall surface 51 of the rotating retaining ring, and the vertical wall surface 52 of the rotating retaining ring and the circumferential wall surface 51 of the rotating retaining ring enclose a storage space for accommodating the clamping assembly 20. The circumferential edge portion of the vertical wall surface 52 of the rotating retaining ring is configured with one or more first through holes 511, such as six first through holes 511 uniformly distributed circumferentially, for discharging the liquid collected by the rotating retaining ring 50 from the storage space. The vertical scrubbing device 1 may also include a fixed retaining ring 60 fixed to the housing 10 and coaxially arranged with the clamping assembly 20, the circumferential wall surface 61 of the fixed retaining ring surrounds at least a portion of the circumferential wall surface 51 of the rotating retaining ring, and the fixed retaining ring 60 is used to collect the liquid thrown out from the first through holes 511; the vertical bottom of the circumferential wall surface 61 of the fixed retaining ring is configured with a second through hole 62, for discharging the liquid collected by the fixed retaining ring 60 downward.

[0040] Figure 6 A schematic diagram of a swing member 31 according to an embodiment of the present application is shown. Figure 7 The schematic diagram of the vertical scrubbing device 1 when scrubbing the wafer W is shown. It can be seen that the scrubbing member 32 collides with the liquid film on the surface of the wafer W when scrubbing the wafer W, and liquid accumulation is easily formed at the scrubbing member 32, and the accumulated liquid drips on the rotating retaining ring 50 and the bottom of the box body 10, and the mutual pressure between the scrubbing member 32 and the surface of the wafer W also causes the wiping head 322 and the wiping head base 321 to squeeze each other, so that the cleaning liquid absorbed by the wiping head 322 is partially squeezed out and drips, and the dripping droplets may splash back onto the wafer W, secondary contamination of the wafer W, and reduce the scrubbing effect and cleanliness of the wafer W. For this reason, in a further embodiment of the present application, as Figure 8 , Fig. 9As shown, a droplet guiding assembly is provided to guide these dripping droplets to flow smoothly to the bottom of the box 10 and reduce the occurrence of back splashing. The droplet guiding assembly mainly includes a collecting shield 71, a flow guide shield 72 and a splash shield 73. The collecting shield 71 is wrapped around the outer periphery of the scrubbing member 32, and the connection between the wiping head base 321 and the wiping head 322 is wrapped in the collecting shield 71, so that the collecting shield 71 can collect the accumulated liquid dripping from the scrubbing member 32 and the liquid dripping due to the squeezing of the wiping head 322 and the wiping head base 321. The length of the wiping head 322 extending from the collecting shield 71 is greater than the compression caused by the wiping head 322 pressing against the wafer W when scrubbing the wafer W, so as to ensure that the collecting shield 71 will not contact the wafer W and scratch the wafer W or interfere with the wiping head 322 scrubbing the wafer W. The splash shield 73 is sleeved on the outer periphery of the swing shaft 311. The guide shield 72 is engaged with the end of the collection shield 71 close to the swing arm 312, and the guide shield 72 extends along the swing arm 312 toward the splash shield 73. The guide shield 72 is arranged on the side of the swing arm 312 facing the wafer W. The guide shield 72 is not directly connected to the splash shield 73, but has a gap to avoid interfering with the swing of the swing arm 312 around the swing axis 311. When scrubbing, the scrubbing assembly 30 drives the swing arm 312 to swing to the front of the wafer W and makes the scrubbing member 32 contact the front of the wafer W for scrubbing. The collection shield 71 is used to collect the liquid dripping from the scrubbing member 32, and the guide shield 72 is used to guide the collected liquid to the outside of the wafer W, that is, to the outside of the space directly facing the front of the wafer W. The splash shield 73 is used to guide the liquid flowing out of the guide shield 72 to slide along its outer surface. By providing a droplet guiding assembly, it is possible to prevent liquid from directly dripping from a high place and causing splashing to contaminate the wafer W, thereby improving the cleaning effect and yield rate of the wafer W.

[0041] In a preferred embodiment, Figure 8-Figure 10 As shown, the cross-section of the collecting shield 71 (i.e., the cross-section perpendicular to its axial direction) gradually increases toward the swing arm 312, so that the liquid in the collecting shield 71 flows along the inclined inner wall of the collecting shield 71 to the guide shield 72. The rate of increase of the cross-section of the collecting shield 71 can be uniform, or as shown in FIG. Fig. 9 As shown, the increasing rates are inconsistent and two sections with different slopes are formed. The end of the collecting shield 71 facing the swing arm 312 is configured with a mounting flange 711, and the mounting flange 711 is fitted to the outer shell of the swing arm 312. The joint 712 where the mounting flange 711 is joined with the flow guide shield 72 is configured to be in a shape that matches the flow guide shield 72. For example, in an embodiment where the flow guide shield 72 is U-shaped in cross section, the cross section of the joint 712 is also configured to be a matching U-shape, and the joint 712 is joined inside the flow guide shield 72 to prevent droplets from flowing out of the flow guide shield 72. The flow guide shield 72 with a U-shaped cross section referred to herein includes both Fig.11The three plates forming the rectangular grooves shown in the figure have obvious folded edges, including the folded edges of the shroud 72, and the shroud 72 with the middle plate bent and arched. Fig.12 As shown, in an optional embodiment, the splash shield 73 is constructed with an inwardly recessed splash groove 731 at a position corresponding to the outlet of the guide shield 72, and the edge or the entire contour of the splash groove 731 can be rounded so that the droplets dripping onto the splash shield 73 can have a larger speed buffer space and can be guided by the splash groove 731 to slide down the splash shield 73, thereby reducing backsplash contamination.

[0042] In a preferred embodiment, Fig.13 FIG. 3 shows a partial schematic diagram of the scrubbing member 32, wherein the collecting shield 71 is omitted, and a droplet aspirator opening toward the scrubbing head 322 is provided at the end of the scrubbing head base 321. Fig.13 The opening of the droplet aspirator is schematically shown by a black dot in the figure, and is arranged at the periphery of the end of the wiper head base 321 not covered by the wiper head 322. In an optional embodiment, the opening of the droplet aspirator can be arranged at the entire end surface of the wiper head base 321 that is connected to the wiper head 322. The droplet aspirator is used to aspirate the liquid accumulated at the wiper head 322. Fig.13 The arrow in the figure shows the possible suction direction of the liquid accumulated around the wiping head 322. The suction force of the droplet aspirator is set to be smaller than the surface tension of the liquid film formed by the cleaning liquid on the wafer surface, so that it only aspirates the droplets accumulated around the wiping head 322 and covering the opening of the droplet aspirator. When too many droplets are not accumulated around the wiping head 322, the suction force will not affect the normal liquid film on the wafer surface, ensuring the normal progress of the scrubbing process.

[0043] In a preferred embodiment, returning to Figure 2 , Figure 3The scrubbing assembly 30 also includes a self-cleaning assembly, which includes a cleaning table 331 and a liquid receiving tank 332. The cleaning table 331 is installed on the back plate 12, and the cleaning table 331 is located vertically above the swing shaft 311, and is opposite to the scrubbing member 32 when the swing arm 312 swings to a vertical position. The cleaning table 331 is configured to contact the wiping head 322 and spray a self-cleaning agent to clean the scrubbing member 32. A jet pipe 333 can also be provided above the cleaning table 331 to spray the self-cleaning agent downward to rinse the wiping head 322. The liquid receiving tank 332 is provided below the cleaning table 331 for collecting the self-cleaning agent. By providing the self-cleaning assembly, the scrubbing member can be self-cleaned when the swing member 31 is in a resting state or intermittently during the scrubbing process, thereby ensuring the cleanliness of the scrubbing member 32 itself, preventing the scrubbing member 32 from adsorbing pollutants or debris and contaminating or scratching the wafer, and effectively ensuring the wafer scrubbing effect. The bottom plate 15 of the housing 10 is configured with a drain hole 151 to drain the liquid from the housing 10 , and the upper surface of the bottom plate 15 of the housing 10 is configured to be inclined toward the drain hole 151 to facilitate the liquid to flow to the drain hole 151 .

[0044] like Fig.14 A schematic diagram of a clamping assembly 20 is shown, and the clamping assembly 20 includes a circular substrate 21, and at least two fixed jaws 22 are arranged on the periphery of the lower half of the circular substrate 21. The at least two fixed jaws 22 are respectively arranged on both sides of the center of the circular substrate 21. The fixed jaws 22 are used to clamp the lower half of the wafer W. The setting of the fixed jaws 22 can provide a limiting effect for the downward movement of the wafer W, thereby ensuring the accuracy of the wafer W being clamped on the clamping assembly 20. At least one movable jaw 23 is provided on the periphery of the upper half of the circular substrate 21, which can be away from the wafer W, that is, opened toward the back plate 12 of the box body 10 when loading and unloading the wafer W (that is, when the clamping assembly 20 is extended to the loading and unloading position). Specifically, when loading the wafer W, the movable jaw 23 rotates and opens away from the wafer W to avoid space allowing the wafer W to move vertically downward, and after the wafer W moves vertically downward to the fixed jaw 22, it rotates and retracts toward the wafer W to clamp the wafer W. When unloading the wafer W, the movable jaw 23 opens away from the wafer W to allow the wafer W to move vertically upward. Fig.14 The figure shows four fixed jaws 22 and two movable jaws 23 symmetrically arranged on both sides of the circular substrate 21. In other embodiments, other numbers may be set. Through the opening and retracting of the fixed jaws 22 at the bottom and the movable jaws 23 at the top, the wafer W can be loaded from the top to the clamping assembly 20 from the entrance and exit at the top of the box 10, so as to realize the vertical limit and clamping of the wafer W, ensure the accuracy and stability of the clamping, and avoid the need to increase the size of the box 10 when the side opening is to avoid interference with the swing member 31 or the liquid feeder 40, and also avoid the large opening area when the front plate of the box 10 is opened, which may introduce more external pollution.

[0045] In such Fig.15 , Fig.16 In the illustrated embodiment, the movable clamp 23 includes a mounting base 231 fixed to the circular substrate 21 and a clamp body 232. The clamp body 232 is configured with a clamping portion 233 on a side thereof facing away from the circular substrate 21. The clamp body 232 can rotate around a rotation axis 234 on the mounting base 231 to open away from the wafer W or retract toward the wafer W, as shown in FIG. Fig.14 As shown, the rotating shaft 234 is rotatably mounted to two opposite lugs 2310 of the mounting seat 231 and passes through the clamping jaw body 232 arranged between the two lugs 2310. The projection of the rotating shaft 234 to the circular substrate 21 is perpendicular to the radial direction of the circular substrate 21. The clamping jaw body 232 extends perpendicular to the rotating shaft 234. The clamping portion 233 is used to clamp the wafer W.

[0046] In one embodiment of the present application, the mobility of the movable clamping jaw 23 is achieved by cooperating with the rotating retaining ring 50. Figure 5 It can be seen that the circumferential wall surface 51 of the rotating retaining ring gradually shrinks (i.e., gradually shrinks) in the direction away from the back plate 12, that is, gradually shrinks toward the clamping assembly 20. Gradually shrinking means that the diameter of the circumferential wall surface 51 of the rotating retaining ring gradually decreases. Fig.15 , Fig.16 , which shows the circumferential wall surface 51 of the rotating retaining ring, the radial outer portion of the movable clamping jaw 23, specifically the radial outer end (upper end in the figure) of the clamping jaw body 232 can be stopped by the circumferential wall surface 51 of the rotating retaining ring so that the movable clamping jaw 23 rotates away from the wafer W and opens. The distance between the radial outer end of the clamping jaw body 232 and the axis of the circular substrate 21 is greater than the opening radius of the circumferential wall surface 51 of the rotating retaining ring, so that the radial outer end of the clamping jaw body 232 is always located in the rotating retaining ring 50. Fig.15 It is shown that when the clamping assembly 20 is axially moved from the scrubbing position to the loading and unloading position, the radial outer end of the clamping jaw body 232 is stopped by the rotating retaining ring 50, so that the clamping jaw body 232 rotates around the rotating shaft 234 to open.

[0047] The movable jaw 23 also includes a resetter, which is configured to rest against the back of the jaw body 232 between the radial outer end of the jaw body 232 and the rotating shaft. The resetter is contracted by the pressure of the jaw body 232 when the movable jaw 23 is opened, and pushes the jaw body 232 to rotate and retract when the movable jaw 23 is separated from the rotating retaining ring 50.

[0048] exist Fig.15 , Fig.16In the illustrated embodiment, the resetter is an elastic support member 235 provided on the mounting seat 231 and extending toward the clamp body 232. The elastic support member 235 supports the portion between the radial outer end of the clamp body 232 and the rotating shaft 234. When the radial outer end of the clamp body 232 is stopped by the rotating retaining ring 50, the elastic support member 235 is compressed. Fig.16 It is shown that when the clamping assembly 20 is axially moved from the loading and unloading position to the scrubbing position, the elastic support member 235 is extended to push the jaw body 232 to reset, and the clamping portion 233 on the jaw body 232 clamps the wafer W. A stopper 2311 may be provided on the mounting seat 231 to limit the maximum pushing distance of the elastic support member 235 on the jaw body 232, thereby preventing the jaw body 232 from excessively retracting and causing the wafer to tilt excessively, bend, or crush the wafer. In a specific embodiment, the elastic support member 235 includes a receiving hole 2351 and a support head 2352 provided on the mounting seat 231, the support head 2352 is at least partially provided in the receiving hole 2351, a spring is provided between the support head 2352 and the bottom of the receiving hole 2351, and the support head 2352 can move axially along the receiving hole 2351 under the action of the spring. More preferably, one end of the support head 2352 disposed in the receiving hole 2351 is configured with an inner concave hole, and the spring partially abuts against the inner concave hole. The spring can also be sleeved on a guide shaft 2353 extending from the bottom of the receiving hole 2351 toward the inner concave hole to ensure that the spring can be linearly extended along the axial direction of the guide shaft 2353 to avoid the support head 2352 from being stuck due to the spring deflection. One end of the support head 2352 disposed in the receiving hole 2351 is configured with a radially outwardly extending anti-slip flange, which can abut against the radially inwardly contracted orifice of the receiving hole 2351 to prevent the support head 2352 from slipping out of the receiving hole 2351.

[0049] Through the active clamping jaw 23 of the present application and its matching design with the rotating retaining ring 50, the active clamping jaw 23 can be conveniently opened and retracted, the functionality of the rotating retaining ring 50 is increased, and no additional actuator of the active clamping jaw 23 is required, which greatly simplifies the complexity of the structure and control of the vertical scrubbing device 1. In addition, through the resetter design, the flexibility of the active clamping jaw 23 is improved, and buffering during clamping can be achieved to prevent rigid collision with the edge of the wafer W to cause fragments, and adaptive clamping of the wafer W can be achieved to fully adapt to the size error of the wafer W manufacturing, and avoid insufficient clamping due to size errors of different wafers W, resulting in instability of the wafer W, or excessive clamping, resulting in damage or fragments of the edge of the wafer W. In addition, due to the vertical setting of the clamping assembly 20, during the rotation of the clamping assembly 20, the fixed jaw and the movable jaw can be periodically in a high position with the parts in contact with the wafer facing downward, so that contaminants in the fixed jaw 22 and the movable jaw 23 in contact with the wafer (for example, the recess of the clamping portion 233) can fall off under the action of gravity, and will not continue to accumulate and contaminate, crystallize and scratch the edge of the wafer, thereby further improving the cleanliness and yield of the wafer.

[0050] In another optional embodiment, the resetter can be constructed in the form of an electrically driven telescopic device, which can automatically retract due to the pressure of the jaw body 232 when the movable jaw 23 is opened without applying a driving force, and apply a driving force to push the jaw body 232 to rotate and retract when the movable jaw 23 is separated from the rotating retaining ring 50. In a preferred embodiment, a detector is provided on the circumferential wall 51 of the rotating retaining ring toward the wafer W, and its position in the front-to-back direction of the box body 10 can be consistent with the wafer W, and the detector is configured to detect the vertical state of the wafer W clamped by the clamping assembly 20. The detector is communicatively connected to the resetter, and the resetter is configured to reduce the driving force on the jaw body 232 when the detector detects that the vertical state of the wafer W is non-vertical. The vertical state includes vertical and non-vertical. When "vertical", the wafer W is clamped completely vertically, and when "non-vertical", the wafer W is clamped to be tilted or bent. Fig.17 The wafer W is shown in a state where it is clamped in a curved state. Fig.18 It shows that wafer W is clamped in a tilted state. These two situations may be caused by the movable clamp 23 rotating and retracting too much toward wafer W. At this time, the resetter is adjusted, specifically to reduce the pushing force on the clamp body 232, to alleviate or eliminate the non-vertical situation of wafer W, so that wafer W is clamped in a vertical state, so that the scrubbing member 32 forms a uniform and good contact with the entire front surface of wafer W to improve the scrubbing effect, and avoid the wafer W from rotating unsteadily due to bending or tilting, resulting in vibration of the clamped part or even fragmentation.

[0051] In an optional embodiment, the detector is a visual detector configured to photograph the wafer W from the side and identify the maximum distance T of the wafer W in its thickness direction (eg, Fig.17 , Fig.18 As shown), when the maximum distance T exceeds a preset wafer thickness value, the vertical state of the wafer W is determined to be non-vertical. In another embodiment, the visual detector is configured to photograph the wafer W from the side, and then identify and draw the side profile of the wafer. When the side profile of the drawn wafer is a non-vertical line segment, the visual detector determines that the vertical state of the wafer W is non-vertical. In a further embodiment, the visual detector is surrounded by a movable detector cover, and the movable detector cover is configured to open before the scrubbing process is performed so that the visual detector is exposed toward the wafer W for detection, and to close during the scrubbing process to surround the visual detector to prevent liquids such as cleaning fluid during the scrubbing process from splashing onto the visual detector and affecting the detection effect.

[0052] In a preferred embodiment, Fig.15 , Fig.16 As shown, the clamping portion 233 is constructed to be roughly V-shaped and recessed on the side facing the wafer W away from the wafer W, so that when the reset device applies appropriate pushing force to the clamp body 232, the clamping force of the clamping portion 233 on the wafer W is appropriate, that is, the clamping force is neither too large to cause the wafer W to be stuck in an inclined or bent state, nor too small to hold the wafer W, so that the wafer W can automatically slide along the inclined surface of the V-shaped recess to the deepest part of the V-shaped recess, thereby automatically adjusting to be vertically clamped in place.

[0053] In an optional embodiment, if Fig.14 A spray hole 210 is configured at the center of the circular substrate 21 , and the spray hole 210 is configured to spray a rinse liquid to rinse the surface of the wafer W facing the circular substrate 21 .

[0054] like Fig.19A schematic diagram of the vertical scrubbing device 1 at another angle is shown, in which a driving mechanism is provided on one side of the back plate 12 facing the outside of the box body 10. The driving mechanism mainly includes a first rotating motor 81 for driving the clamping assembly 20 and the rotating retaining ring 50 to rotate synchronously and a first telescopic motor 82 for driving the clamping assembly 20 to axially extend and retract. The first rotating motor 81 is connected to the rotating shaft 24 of the clamping assembly via a first synchronous belt 91, and the first telescopic motor 82 is connected to the rotating shaft 24 of the clamping assembly via a second synchronous belt 92. Specifically, the rotating shaft 24 of the clamping assembly can be configured as a spline screw, and the first telescopic motor 82 is configured to drive the first nut on the spline screw to rotate via the second synchronous belt 92. The first nut is spirally matched with the spiral groove of the spline screw to convert the rotational motion of the first nut into the linear motion of the spline screw through the spiral groove of the spline screw, thereby realizing the axial precise movement of the spline screw. When the first telescopic motor 82 rotates alone, the clamping assembly 20 is controlled to axially extend and retract. The first rotating motor 81 is configured to drive the second nut on the spline screw to rotate via the first synchronous belt 91. The second nut is spline-connected to the spline groove on the spline screw to drive the spline screw to rotate through the spline groove. The first rotating motor 81 and the first telescopic motor 82 rotate synchronously so that the movement of the first nut is offset by the second nut, thereby controlling the clamping assembly 20 and the rotating retaining ring 50 to rotate synchronously when the first rotating motor 81 and the first telescopic motor 82 rotate synchronously. The spline screw motion formed between the first telescopic motor 82, the first rotating motor 81 and the rotating shaft 24 of the clamping assembly ensures the accuracy of the axial telescopic extension and the rotational stability of the clamping assembly 20, while realizing the integrated design and coordinated control of the telescopic drive and the rotational drive. Compared with respectively setting independent telescopic mechanisms and rotational mechanisms at the end portions of the clamping assembly 20, the structural complexity and control difficulty can be greatly simplified. Moreover, the first telescopic motor 82 and the first rotating motor 81 are set on the side of the rotating shaft 24 of the clamping assembly, which can make full use of the space on the back of the back plate 12, significantly reduce the size of the vertical scrubbing device 1 in the front-to-back direction, and provide more layout space for the wafer processing equipment where the vertical scrubbing device 1 is located.

[0055] The driving mechanism also includes a second rotating motor 83 for driving the swing member 31 to swing and a second telescopic motor 84 for driving the swing shaft 311 of the swing member 31 to axially extend and retract. The second rotating motor 83 is connected to the swing shaft 311 via a third synchronous belt 93, and the second telescopic motor 84 is connected to the swing shaft 311 via a fourth synchronous belt 94. In a specific embodiment, the swing shaft 311 can also be designed as a spline screw, and the second rotating motor 83, the second telescopic motor 84 and the swing shaft 311 also form a similar spline screw drive form through a third nut and a fourth nut similar to the first nut and the second nut, so that when the second telescopic motor 84 rotates alone, the swing shaft 311 is controlled to axially extend and retract, and when the second rotating motor 83 and the second telescopic motor 84 rotate synchronously, the swing shaft 311 is controlled to rotate, that is, the swing arm 312 is controlled to swing. The specific driving mode is similar to the driving mode of the first telescopic motor 82 and the first rotating motor 81, and also plays the effects of integrated design and coordinated control, which will not be repeated here.

[0056] In a preferred embodiment, Fig. 9 As shown, the swing arm 312 is provided with a scrubbing member driver 301 juxtaposed with the scrubbing member 32 along the length direction of the swing arm 312, which drives the scrubbing member 32 to rotate through a synchronous belt. The scrubbing member driver 301 and the scrubbing member 32 are non-coaxially and offsetly arranged, so that the thickness of the swing arm 312 is reduced, thereby reducing the size of the vertical scrubbing device 1. In addition, an adjuster 302 may be provided at one end of the scrubbing member 32 opposite to the scrubbing head 322, so as to fine-tune the axial telescopic distance of the scrubbing member 32, thereby fine-tuning the contact force between the scrubbing member 32 and the wafer W.

[0057] Combination Figure 5 and Fig. 20 It can be seen that the top plate 14 of the box body 10 is provided with an inlet and outlet 140 for the wafer W to enter and exit, and the position of the inlet and outlet 140 is adapted to the loading and unloading position of the clamping assembly 20; the box body 10 also includes a cover plate 141 covering the inlet and outlet 140, and the cover plate 141 is slidably mounted to the top plate 14 via a guide rail assembly, so as to slide away from the inlet and outlet 140 when the wafer W enters and exits, and slide to cover the inlet and outlet 140 when the wafer W is scrubbed.

[0058] Fig.21 A wafer W scrubbing method of the present application is shown, which is used in the aforementioned vertical scrubbing device 1, and the method comprises: S1: moving the clamping assembly 20 from the scrubbing position to the loading and unloading position; S2: Move the wafer W vertically downward from the inlet and outlet 140 at the top of the box 10 to the fixed clamping claw 22 of the clamping assembly 20; S3: moving the clamping assembly 20 from the loading and unloading position to the scrubbing position; S4: Swing the swing arm 312 to the front of the wafer W and make the scrubbing member 32 contact the front side of the wafer W; S5: Drive the clamping assembly 20 to rotate and swing the swing arm 312 to scrub the wafer W.

[0059] The above execution order is only an example, and the execution order can be adjusted appropriately according to actual operation requirements. For example, S1 and S2 can be exchanged in order or executed synchronously.

[0060] The present application also provides a computer storage medium, on which a computer program is stored. When the computer program is executed by a processor, the aforementioned wafer W scrubbing method is implemented.

[0061] Fig. 22A schematic diagram of a wafer processing device according to an embodiment of the present application is shown, and the wafer processing device mainly includes a front-end module 100, a transmission unit 200, a wafer processing unit 300, and a cleaning and drying unit 400. Among them, the front-end module 100 is used to provide a wafer W to be processed or receive a processed wafer W. The wafer processing unit 300, for example, includes a wafer chemical mechanical polishing device 310, which uses a chemical mechanical polishing process to achieve atomic-level surface flatness of the wafer W. The cleaning and drying unit 400 may include a primary scrubbing device 410, a secondary scrubbing device 420, the aforementioned vertical scrubbing device 1, and a drying device 430. The primary scrubbing device 410 and the secondary scrubbing device 420 respectively use a cleaning roller brush of the same or different material, hardness, or brush body texture to scrub the surface of the wafer W. The vertical scrubbing device 1 scrubs the wafer W after scrubbing the wafer W twice, further improving the cleanliness of the surface of the wafer W. After scrubbing, the wafer W can be dried in the drying device 430, and the dry-in and dry-out of the wafer processing device is generally achieved. Optionally, a buffer device 440 may be added between any two of the primary scrubbing device 410, the secondary scrubbing device 420, the vertical scrubbing device 1, and the drying device 430 to temporarily buffer the wafer W, thereby adjusting the processing rhythm and improving the overall processing efficiency. The transmission unit 200 is used to transmit the wafer W between the front-end module 100, the wafer processing unit 300, and the cleaning and drying unit 400, and mainly includes a front-end robot 201 and a transmission robot 202. The wafer processing equipment shown in the figure includes four wafer chemical mechanical polishing devices 310 in a square array, two groups of cleaning and drying units 400 parallel and juxtaposed between the front-end module 100 and the wafer processing unit 300, the transmission robot 202 can move along the track between the two groups of cleaning and drying units 400, and the front-end robot 201 can slide transversely to the two groups of cleaning and drying units 400 to realize the interaction of wafers W between the transmission unit 200 and each unit. The layout of the wafer processing equipment shown in the figure can realize at least two parallel wafer W processing routes, thereby improving the processing efficiency of the wafer W. In an optional embodiment, the wafer processing equipment may also have other numbers of sub-units or layouts.

[0062] The above implementation methods are only used to illustrate the embodiments of the present application, and are not limitations on the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application. The scope of patent protection of the embodiments of the present application should be limited by the claims.

Claims

1. A vertical scrubbing device, characterized in that: The vertical scrubbing device comprises a box body, a clamping assembly and a scrubbing assembly mounted on a back plate of the box body, and a rotating retaining ring coaxially arranged with the clamping assembly; the clamping assembly is used to vertically clamp a wafer and drive the wafer to rotate, and the cleaning liquid provided to the front side of the wafer is coated on the front side of the wafer under the action of gravity and the rotation of the wafer; the scrubbing assembly is configured to scrub the front side of the wafer; the circumferential wall of the rotating retaining ring surrounds the clamping assembly and gradually shrinks away from the back plate, and the clamping assembly can be axially retracted between a loading and unloading position extending from the rotating retaining ring and a scrubbing position retracted into the rotating retaining ring; The clamping assembly includes a fixed clamping jaw arranged at its lower half and a movable clamping jaw arranged at its upper half, which are respectively used to clamp the lower half edge and the upper half edge of the wafer; when the clamping assembly moves to the loading and unloading position, the radial outer part of the movable clamping jaw is stopped by the rotating retaining ring so that the movable clamping jaw rotates away from the wafer and opens; when the clamping assembly shrinks to the scrubbing position, the movable clamping jaw automatically rotates toward the wafer and retracts to clamp the wafer.

2. The vertical scrubbing device according to claim 1, characterized in that The movable clamp includes a mounting seat and a clamp body. The clamp body is configured with a clamping portion on a side of the clamp body facing away from the mounting seat. The clamp body can rotate around a rotating axis on the mounting seat to open or retract. When the clamping assembly moves toward the loading and unloading position, the radial outer end of the clamp body is stopped by the rotating retaining ring to enable the clamp body to rotate away from the wafer and open.

3. The vertical scrubbing device according to claim 2, characterized in that The movable jaw includes a resetter, which is configured to abut against the back of the jaw body between the radial outer end of the jaw body and the rotating shaft. The resetter is configured to be compressed by the jaw body when the movable jaw is opened, and to push the jaw body to rotate and retract when the movable jaw is separated from the rotating retaining ring.

4. The vertical scrubbing device according to claim 3, characterized in that A detector is provided on the circumferential wall surface of the rotating retaining ring, and the detector is configured to detect the vertical state of the wafer clamped by the clamping assembly; the detector is communicatively connected with the resetter, and the resetter is configured to reduce the pushing force on the clamp body when the detector detects that the vertical state of the wafer is non-vertical.

5. The vertical scrubbing device according to claim 4, characterized in that The detector is a visual detector, which is configured to photograph the wafer from the side and identify the maximum distance of the wafer in its thickness direction. When the maximum distance exceeds a preset wafer thickness value, the vertical state of the wafer is determined to be non-vertical.

6. The vertical scrubbing device according to claim 4, characterized in that The detector is a visual detector, which is configured to photograph the wafer from the side, thereby identifying and drawing the side profile of the wafer. When the side profile of the wafer drawn is a non-vertical line segment, the visual detector determines that the vertical state of the wafer is non-vertical.

7. The vertical scrubbing device according to claim 3, characterized in that The restorer is an elastic support member arranged on the mounting seat and extending toward the jaw body. The elastic support member supports the portion between the radial outer end of the jaw body and the rotating shaft. The elastic support member is compressed when the radial outer end of the jaw body is stopped by the rotating retaining ring, and pushes the jaw body to be retracted when the clamping assembly moves axially from the loading and unloading position to the scrubbing position.

8. A vertical scrubbing device as claimed in any one of claims 2 to 7, characterized in that: The clamping assembly includes a circular substrate, the fixed clamping jaw is arranged at the periphery of the lower half of the circular substrate, and the movable clamping jaw is arranged at the periphery of the upper half of the circular substrate; the distance between the radial outer end of the clamping jaw body and the axis of the circular substrate is greater than the opening radius of the circumferential wall of the rotating retaining ring.

9. The vertical scrubbing device according to any one of claims 1 to 7, characterized in that: The rotating retaining ring is configured to rotate together with the clamping assembly when the wafer is scrubbed to collect liquid thrown off the surface of the wafer.

10. The vertical scrubbing device according to claim 9, characterized in that The rotating retaining ring includes a vertical wall surface of the rotating retaining ring connected to its circumferential wall surface, the vertical wall surface of the rotating retaining ring and the circumferential wall surface of the rotating retaining ring form a receiving space for accommodating the clamping assembly, and the circumferential edge portion of the vertical wall surface of the rotating retaining ring is constructed with one or more first through holes for discharging the liquid collected by the rotating retaining ring from the receiving space.

11. The vertical scrubbing device according to claim 10, characterized in that The vertical scrubbing device also includes a fixed retaining ring fixed to the box body and coaxially arranged with the clamping assembly, the circumferential wall of the fixed retaining ring surrounds at least a portion of the circumferential wall of the rotating retaining ring, and the fixed retaining ring is used to collect liquid discharged from the first through hole; a second through hole is constructed at the vertical bottom of the circumferential wall of the fixed retaining ring for discharging the liquid collected by the fixed retaining ring downward.

12. The vertical scrubbing device according to any one of claims 1 to 7, characterized in that: The scrubbing assembly comprises: A swing member, comprising a swing shaft and a swing arm, wherein the swing shaft rotates to drive the swing arm to swing parallel to the front side of the wafer; a scrubbing member, disposed at the end of the swing arm; A droplet guide assembly, comprising a collection shield and a flow guide shield, wherein the collection shield surrounds the outer periphery of the scrubbing member, and the flow guide shield engages an end of the collection shield close to the swing arm and extends along the swing arm toward the swing shaft; The scrubbing assembly is configured to drive the swing arm to swing to the front of the wafer and make the scrubbing member contact the front side of the wafer for scrubbing, the collecting shield is used to collect liquid dripping from the scrubbing member, and the guide shield is used to guide the collected liquid to the outside of the wafer.

13. The vertical scrubbing device according to claim 12, characterized in that The scrubbing member includes a rigid wiping head base and a compressible wiping head, wherein the wiping head is configured to absorb liquid on the surface of the wafer when scrubbing the wafer, and the connection between the base and the wiping head is wrapped in the collecting shield, and the length of the wiping head extending from the collecting shield is greater than the compression caused by the wiping head pressing against the wafer when scrubbing the wafer.

14. The vertical scrubbing device according to claim 12, characterized in that The cross-sectional dimension of the collecting shield gradually increases toward the swing arm, so that the liquid in the collecting shield flows along the inclined inner wall of the collecting shield to the guide shield.

15. The vertical scrubbing device according to claim 12, characterized in that The flow guide shield is arranged on the side of the swing arm facing the back plate, the cross section of the flow guide shield is configured to be U-shaped, and the surface of the flow guide shield and the swing arm form a flow channel that guides the liquid to outside the wafer.

16. The vertical scrubbing device according to claim 12, characterized in that The droplet guiding assembly also includes a splash shield, which is sleeved on the outer periphery of the swing shaft and is used to guide the liquid flowing out of the guide shield to slide down along its outer surface.

17. The vertical scrubbing device according to claim 16, characterized in that The splash shield is configured with a circumferentially extending and inwardly recessed splash groove at a position corresponding to the outlet of the guide shield, and the splash groove provides a speed buffer space for the liquid droplets dripping onto the splash shield and guides them to slide down.

18. The vertical scrubbing device of claim 12, wherein: The swing shaft is configured to be axially retractable, and the swing shaft is configured to axially retract during the swing arm swinging from the center of the wafer to the outer edge of the wafer, so that the scrubbing member presses against the front side of the wafer to scrub and push the scrubbed contaminants out of the wafer; And the swing arm extends axially during the process of swinging from the outer edge of the wafer to the center of the wafer, so that there is a gap between the scrubbing member and the front side of the wafer, and the gap is larger than the thickness of the liquid film formed by the cleaning liquid on the surface of the wafer.

19. The vertical scrubbing device of claim 13, wherein: A droplet aspirator opening toward the wiping head is disposed at the end of the wiping head base, and the droplet aspirator is used to aspirate liquid accumulated at the wiping head, and the suction force of the droplet aspirator is smaller than the surface tension of the liquid film formed by the cleaning liquid on the wafer surface.

20. The vertical scrubbing device of claim 12, wherein: The swing shaft is installed at the lower side of the clamping assembly. The scrubbing assembly also includes a self-cleaning assembly, which includes: a cleaning station mounted on the back plate, the cleaning station being located vertically above the swing shaft and opposite to the scrubbing member when the swing arm swings to a vertical position, the cleaning station being configured to spray a self-cleaning agent to clean the scrubbing member; A liquid receiving tank is arranged below the cleaning table and is used for collecting the self-cleaning agent.

21. A wafer processing equipment, characterized in that: The wafer processing equipment includes a wafer processing unit and a vertical scrubbing device as described in any one of claims 1-20.

22. A wafer scrubbing method, used in the vertical scrubbing device according to any one of claims 1 to 20, characterized in that: The wafer scrubbing method comprises: Move the clamping assembly from the scrubbing position to the loading and unloading position; Move the wafer vertically downward from the inlet and outlet at the top of the box to the fixed clamping jaws of the clamping assembly; moving the clamping assembly from the loading and unloading position to the scrubbing position; Swing the swing arm of the scrubbing assembly to the front of the wafer and make the scrubbing member at the end of the swing arm contact the front side of the wafer; The clamping assembly is driven to rotate, and the swing arm is simultaneously swung to scrub the wafer.

23. A computer storage medium, characterized in that The computer storage medium stores a computer program, which, when executed by a processor, implements the wafer scrubbing method as claimed in claim 22.

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