Electronic device

Abstract

The invention discloses electronic equipment, and relates to the field of electronic products. The electronic equipment comprises a display screen, a frame body and a conductive part, the display screen is arranged on one side of the frame body, a reinforcing piece is arranged on the side, facing the frame body, of the display screen, and the conductive piece is arranged between the display screen and the frame body; wherein at least one side of the conductive part is provided with an insulating part. The application at least can solve the problems of PIM and the like.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic products, and specifically relates to an electronic device. Background Art

[0002] At present, there is a gap between the metal back panel and the frame of some mobile phone screens, forming a resonant cavity and generating a cavity resonance effect. When the antenna is close to the resonant cavity and the resonant frequency falls within the antenna operating frequency range, the antenna is affected by the resonant cavity and generates clutter, affecting the antenna efficiency. Therefore, it is necessary to add a grounding point between the screen back panel and the frame near the antenna to destroy the resonance effect and improve the antenna performance.

[0003] To improve grounding reliability, the grounding point needs to be elastically connected with an elastic part. In this case, the elastic part exerts a large elastic force on the screen module, which can easily damage the screen module. Reducing the grounding elastic force to protect the screen will introduce passive inter-modulation (PIM) problems, affecting user experience and product quality. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide an electronic device that can at least solve the problem in the related art that grounding stability and screen safety cannot be taken into account at the same time.

[0005] In order to solve the above technical problems, this application is implemented as follows: The embodiment of the present application provides an electronic device comprising: a display screen, a frame and a conductive member; The display screen is arranged on one side of the frame body, a reinforcing piece is arranged on the side of the display screen facing the frame body, and the conductive piece is arranged between the display screen and the frame body, wherein at least one side of the conductive piece is provided with an insulating piece.

[0006] In the embodiment of the present application, by providing an insulating member on at least one side of the conductive member, the conductive member can be separated from at least one of the display screen and the frame, so that a capacitor is formed between at least one of the display screen and the frame and the conductive member. In this way, high-frequency conduction can be achieved through high-frequency coupling between at least one of the display screen and the frame and the conductive member, further improving the reliability of grounding. Moreover, compared with the related art, the embodiment of the present application can ensure the reliability of grounding without providing a large elastic force by providing an elastic member, thereby effectively preventing the display screen from being damaged by the elastic force of the elastic member. Moreover, the conduction impedance in the high-frequency conduction mode is low, and even under high-power excitation, it basically does not cause an increase in harmonic components and intermodulation products. Therefore, the embodiment of the present application can ensure the reliability of grounding without introducing PIM problems and ensuring that the display screen is not damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 It is a schematic diagram of the electrical connection between two materials; Figure 2 Schematic diagram of the generation of multi-order intermodulation products for signal excitation; Figure 3 Schematic diagram of the equivalent circuit for grounding electronic equipment; Figure 4 A schematic diagram of the copper foil, the conductive member, the insulating member and the aluminum alloy frame disclosed in the embodiment of the present application; Figure 5 An equivalent circuit diagram of the copper foil, conductive member, insulating member and aluminum alloy frame disclosed in the embodiment of the present application; Figure 6 A schematic diagram of a titanium alloy sheet or a stainless steel sheet, a conductive member, an insulating member and an aluminum alloy frame disclosed in an embodiment of the present application; Figure 7 An equivalent circuit diagram of a titanium alloy sheet or a stainless steel sheet, a conductive member, an insulating member and an aluminum alloy frame disclosed in an embodiment of the present application; Figure 8 A schematic diagram of a titanium alloy sheet or a stainless steel sheet, a conductive member, an insulating member, and a magnesium alloy frame disclosed in an embodiment of the present application; Fig. 9 An equivalent circuit diagram of a titanium alloy sheet or a stainless steel sheet, a conductive member, an insulating member, and a magnesium alloy frame disclosed in an embodiment of the present application; Fig.10 Schematic diagram of simulation results of the capacitance of the flat plate capacitor disclosed in the embodiment of the present application.

[0008] Description of reference numerals: 11-copper foil; 12-titanium alloy sheet or stainless steel sheet; 21-aluminum alloy frame; 22-magnesium alloy frame; 30-conductive member; 40-Insulation parts. DETAILED DESCRIPTION

[0009] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0010] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0011] The embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0012] From a microscopic perspective, the electrical connection between two materials is achieved through the contact of several micro-convex bodies. Among them, micro-convex bodies mainly include three forms: Figure 1 As shown, region (1) is an interference region. In this way, the two materials are in close contact, so that the conduction impedance between the two materials is relatively low, so that the current mainly passes through this interference region. Therefore, this method can be regarded as an effective contact between the two materials, which can achieve good electrical conduction.

[0013] The two materials in region (2) are only overlapped on the surface, so that the contact area between the two materials is small, resulting in relatively large impedance. It can be seen that although the contact between the two materials can achieve electrical connection, the reliability of the electrical connection is poor, resulting in the inability to achieve good electrical conduction between the two materials.

[0014] In region (3), the surfaces of the two materials are spaced apart from each other so that they are not actually in contact with each other, resulting in a parasitic capacitance effect between the two materials, that is, a capacitor is formed between the two materials.

[0015] Based on the above situation, it can be seen that when the area (1) accounts for a larger proportion in the electrical connection between the two materials, the electrical connection between the two materials is relatively tight, so that the current can pass stably, and the surface impedance is low, so that the RF transmission power of the electronic device is below 2W, and there will be no PIM or RSE problems.

[0016] On the contrary, when the number of regions (1) is small and regions (2) and (3) are dominant, the electrical connection between the two materials is poor, resulting in a high on-resistance, which makes it impossible for the current to pass stably. Under high-power excitation, distortion and nonlinearity occur during signal transmission, leading to an increase in harmonic components and intermodulation products, and ultimately causing problems such as PIM.

[0017] The mechanism of PIM problem is: when two or more signals of different frequencies are mixed and input into a nonlinear device or nonlinear system, additional intermodulation signals will be generated at other frequencies. Assume that the input signals are f 1 and f 2 , the intermodulation distortion frequency generated by nonlinear devices or nonlinear systems can be expressed as follows: f=mf 1 +nf 2 , becoming (M+N) order intermodulation. An unreliable grounding point can be regarded as a typical nonlinear system. Under high power excitation, harmonic components are generated and intermodulation occurs, generating intermodulation products.

[0018] refer to Figure 2 When a frequency division duplex (FDD) band bandwidth signal excites a nonlinear grounding point, the multi-order intermodulation products generated are superimposed and fall on the Rx band, which will cause serious TRx interference and a 20dB drop in receiving sensitivity, seriously affecting the user experience. In addition, when the grounding point is nonlinear, the harmonic components of the Tx band will also increase significantly, generating additional harmonic spurious signals that are integer multiples of the working frequency band, leading to radiated spurious emission (RSE) problems. In severe cases, the regulatory standards may not be met, resulting in a ban on the sale of the product and significant losses.

[0019] To overcome the above problems, in the related art, foam grounding is added between the back of the screen and the metal frame of the electronic device. Since the foam has a small rebound force, in order to ensure reliable conduction, it is necessary to plate gold on the surface of the screen or metal frame, or spot weld the gold-plated gasket by laser, ultrasound, etc., and weld the gold-plated gasket to the metal to achieve a stable connection. Since gold has low activity and is not easily oxidized, and because of its excellent conductive properties and low surface resistance, it is an ideal grounding method for electronic devices.

[0020] However, gold is a rare and precious metal and is expensive. In addition, gold plating or spot welding of gold-plated gaskets on metal surfaces requires adding gold plating or spot welding steps after metal processing, which further increases manpower and process costs and easily causes waste of resources. In addition, the spot welding process is prone to problems such as gold-plated gaskets burning through, dirt, warping, deviation, and falling off, resulting in unreliable grounding.

[0021] Based on the above situation, an embodiment of the present application proposes an improvement solution, which achieves high-frequency conduction through high-frequency coupling without using a gold-plating process or a gold-plated gasket, thereby solving problems such as passive intermodulation caused by unreliable grounding.

[0022] refer to Figures 3 to 10An embodiment of the present application discloses an electronic device, and the disclosed electronic device includes a display screen (not shown in the figure), a frame (not shown in the figure) and a conductive member 30.

[0023] The frame is a basic component, which can provide a mounting base for components such as the display screen and the conductive member 30; the display screen is used for display and can be operated by the user; the conductive member 30 is used for grounding. In some embodiments, the display screen is arranged on one side of the frame, and the conductive member 30 is arranged between the display screen and the frame.

[0024] It should be noted here that due to the spacing between the display screen and the frame, a resonant cavity is formed between the display screen and the frame, which easily produces a cavity resonance effect. When the antenna of the electronic device is located around the resonant cavity, since the resonant frequency is within the working frequency range of the antenna, the quality and efficiency of the antenna transmission signal are affected by the resonance effect, which ultimately affects the normal operation of the antenna.

[0025] Based on the above situation, the embodiment of the present application can destroy the resonant cavity by setting a conductive member 30 between the display screen and the frame, thereby helping to reduce the impact of the cavity resonance on the antenna performance, improve the antenna efficiency, and improve the radiation performance of the entire device.

[0026] Optionally, at least a region of the display screen may have a conductive property; the frame may be a metal frame. In addition, the display screen may be an OLED flexible screen, a TFT LCD screen, or the like.

[0027] In some embodiments, a reinforcing member may be provided on the side of the display screen facing the frame. By providing the reinforcing member, on the one hand, the overall strength of the display screen can be improved, and on the other hand, it can also have good electrical conductivity to facilitate good grounding. Optionally, the reinforcing member may be a reinforcing plate, a reinforcing sheet, a reinforcing layer, etc., and of course, it may also be in other forms, which are not specifically limited here.

[0028] In order to achieve high-frequency conduction and adapt to high-frequency signals related to the antenna, an insulating member 40 may be provided on at least one side of the conductive member 30. The insulating member may separate the conductive member from at least one of the display screen and the frame to form a parallel plate capacitor. In this way, high-frequency conduction between the display screen and at least one of the conductive member 30 and the conductive member 30 may be achieved through the capacitor to facilitate the transmission of high-frequency signals, thereby facilitating the improvement of the reliability of grounding between the display screen and the frame and close to the antenna, and alleviating the problem of cavity resonance effect between the display screen and the frame affecting the antenna performance.

[0029] In some embodiments, an insulating member 40 may be provided on the side of the conductive member 30 facing the display screen, so that the conductive member 30 can be separated from the display screen by the insulating member 40 to form a capacitor between the display screen and the conductive member 30, thereby realizing high-frequency signal transmission between the display screen and the conductive member 20.

[0030] In other embodiments, an insulating member 40 may be provided on the side of the conductive member 30 facing the frame, so that the conductive member 30 can be separated from the frame by the insulating member 40 to form a capacitor between the frame and the conductive member 30, thereby realizing high-frequency signal transmission between the frame and the conductive member 30.

[0031] In some further embodiments, insulating members 40 may be provided on the opposite sides of the conductive member 30 facing the display screen and the frame, respectively. In this way, one side of the conductive member 30 may be separated from the display screen by the insulating member 40, and the other side of the conductive member 30 may be separated from the frame by the insulating member 40, respectively. Thus, capacitors may be formed between the display screen and one side of the conductive member 30, and between the frame and the other side of the conductive member 30, respectively, thereby realizing high-frequency signal transmission between the display screen and the conductive member 30, and high-frequency signal transmission between the frame and the conductive member 30.

[0032] Based on the above configuration, the embodiment of the present application can separate the conductive member 30 from at least one of the display screen and the frame and the conductive member 30 by setting an insulating member 40 on at least one side of the conductive member 30, so that a capacitor is formed between at least one of the display screen and the frame and the conductive member 30. In this way, high-frequency conduction can be achieved through high-frequency coupling between at least one of the display screen and the frame and the conductive member 30, further improving the reliability of grounding. Moreover, compared with the related art, the embodiment of the present application can ensure the reliability of grounding without providing a large elastic force by setting an elastic member, thereby effectively preventing the display screen from being damaged by the elastic force of the elastic member. Moreover, the conduction impedance in the high-frequency conduction mode is low, and even under high-power excitation, it basically does not cause an increase in harmonic components and intermodulation products. Therefore, the embodiment of the present application can ensure the reliability of grounding without introducing problems such as PIM and ensuring that the display screen is not damaged.

[0033] In some embodiments, the conductive member 30 may be a conductive foam, wherein the conductive foam can achieve good conductive connection through built-in conductive particles or coatings, which is conducive to reducing electromagnetic interference and static electricity accumulation, and can have better shielding effectiveness. For example, in the high frequency band (20MHz-10GHz), it can reach more than 100dB, and the surface resistivity is as low as 0.07 ohms. In addition, the conductive foam also has the advantages of good softness, compression resistance, corrosion resistance, etc., and has low cost and strong adaptability. Of course, the conductive member 30 can also be in other forms, which are not specifically limited here.

[0034] Optionally, the shape of the conductive member 30 may be a polygon (eg, square, rectangle, etc.), a circle, an ellipse, or a special shape. In addition, the conductive member 30 may be in other shapes.

[0035] Optionally, the area of ​​the conductive member 30 may be not less than 100 mm 2 , for example, including, 100mm 2 、150mm 2 , 200mm 2 By setting the area of ​​the conductive member 30, it can be ensured that it has a sufficiently large conductive area, and that the current can flow smoothly in the conductive member 30. It should be noted here that the area of ​​the conductive member 30 is the area facing the display screen, or the area facing the frame, which can also be understood as the cross-sectional area of ​​the conductive member 30.

[0036] Optionally, the thickness of the conductive member 30 may range from 0.01 mm to 0.03 mm, including, for example, 0.01 mm, 0.02 mm, 0.03 mm, etc. Of course, other thickness values ​​are also possible, which are not specifically limited here.

[0037] It should be noted here that since the thickness of an electronic device is too large, the entire electronic device will be bulky, which will affect both the overall appearance and performance of the electronic device and the user experience. Therefore, when designing an electronic device, the overall thickness of the electronic device needs to be considered.

[0038] Since the overall thickness of the electronic device is limited, the spacing between the display screen and the frame will be limited. At the same time, it is necessary to add an insulating member 40 on at least one side of the conductive member 30, so that the thickness of the conductive member 30 will not be too large. In the embodiment of the present application, the thickness range of the conductive member 30 is set to 0.01 mm ~ 0.03 mm to optimize the overall thickness of the electronic device.

[0039] Of course, the thickness of the conductive member 30 is not limited thereto. Exceeding the range will affect the conduction frequency and conduction impedance. In this case, the thickness can be adjusted according to simulation or actual test results.

[0040] Considering that the insulating member 40 is disposed on at least one side of the conductive member 30 , the shape of the insulating member 40 may be similar to that of the conductive member 30 , so as to facilitate the insulating member 40 to adapt to the conductive member 30 .

[0041] Optionally, the insulating member 40 may be in a polygonal shape (eg, square, rectangle, etc.), circular, elliptical, or irregular shape. In addition, the insulating member 40 may be in other shapes.

[0042] In addition, the area of ​​the insulating member 40 is not less than 100 mm 2 , for example, including, 100mm 2 、150mm 2 , 200mm 2 By setting the area of ​​the insulating member 40, it can be ensured that it has a sufficiently large insulating area to separate the conductive member 30 from the display screen or the frame. It should be noted here that the area of ​​the insulating member 40 is the area facing the display screen, or the area facing the frame, which can also be understood as the cross-sectional area of ​​the insulating member 40.

[0043] Optionally, the thickness of the insulating member 40 may range from 0.01 mm to 0.03 mm, including, for example, 0.01 mm, 0.02 mm, 0.03 mm, etc. Of course, other thickness values ​​are also possible, which are not specifically limited here.

[0044] It should be noted here that since the insulating member 40 is located between one side of the separator conductive member 30 and the display screen, and / or between the other side of the conductive member 30 and the frame, when the overall thickness of the electronic device is limited, the thickness of the insulating member 40 is also reduced accordingly, and the thickness of the surface insulating member 40 is too large to affect the overall thickness of the electronic device.

[0045] In some embodiments, the area of ​​the insulating member 40 may be not less than the area of ​​the conductive member 30 , so that the conductive member 30 can be completely separated from the display screen or the frame by the insulating member 40 to ensure insulation between the conductive member 30 and the display screen or the frame.

[0046] In some embodiments, the insulating member 40 may be at least one of insulating adhesive tape, anodized film, electroplated insulating film, and insulating adhesive. In addition, it may be in other forms, which are not specifically limited here. Optionally, the insulating adhesive tape may be insulating plastic adhesive tape (PET) or the like.

[0047] In the embodiment of the present application, since the insulating member 40 is disposed on at least one side of the conductive member 30 , a parallel plate capacitor can be formed between the conductive member 30 and at least one of the display screen and the frame, so as to achieve high frequency conduction.

[0048] Among them, the capacitance formula of the parallel plate capacitor is: C = ε*ε 0 *A / d. Wherein, capacitance C, unit F; ε relative dielectric constant; ε 0 The dielectric constant of vacuum is 8.86×10 -12 , unit F / m; plate area A, unit square meter; plate spacing d, unit meter.

[0049] The formula for the capacitance reactance of a capacitor is: Zc = 1 / (ωC). Among them, Zc represents the capacitance impedance, ω represents the angular frequency, and C represents the capacitance.

[0050] Based on the above content, it can be known that in a parallel plate capacitor with an area of ​​100mm, an equivalent capacitance of about 100pF can be formed under the condition of a plate spacing of 0.01~0.03mm. Bringing the above conditions into the simulation, in the frequency range of 700MHz~6GHz, the on-resistance is less than 2Ω, such as Fig.10 shown.

[0051] According to the above formula and simulation results, 100mm 2 The conductive foam with a size of 0.01~0.03mm thickness, the insulating member 40, and the metal plate can provide an ideal return path within the RF working frequency band (700MHz~6GHz), and its on-resistance is <2Ω, which meets the grounding requirements of mobile phone products. The equivalent circuit is as follows: Figure 3 shown.

[0052] In order to achieve high-frequency signal transmission between the conductive member 30 and at least one of the display screen and the frame, the present application provides the following multiple implementation methods, specifically: The first embodiment mode is as follows: Figure 4 and Figure 5 As shown: The display screen is an OLED screen, the reinforcement is a copper foil 11, and one side of the conductive member 30 is attached to the copper foil 11. Among them, the copper foil has good conductivity and low surface contact impedance. The conductive member 30 can achieve good grounding through contact with the copper foil 11 to meet product requirements. Therefore, the contact surface between the conductive member 30 and the copper foil 11 does not need additional gold plating, and stable signal transmission can be guaranteed.

[0053] The frame is an aluminum alloy frame 21, and an insulating member 40 is provided on the other side of the conductive member 30, and the insulating member 40 is bonded to the aluminum alloy frame 21. Among them, the activity of metal aluminum is relatively strong, and it will oxidize quickly when exposed to the air, and a dense aluminum oxide film will be formed on its surface. Since the molecular structure of aluminum oxide is relatively stable and belongs to a corundum structure, the Mohs hardness can reach 8.8, and a lot of pressure is required to pierce the oxide film to form an effective contact between the internal metals. In the area under the screen of the display screen, because the display screen is relatively fragile and cannot withstand the pressure that can pierce the aluminum oxide film, it is impossible to form a reliable and effective grounding for the aluminum alloy in the area under the screen by using a direct electrical connection.

[0054] In addition, because the aluminum oxide structure is dense, it can isolate the air and prevent the metal aluminum from being further oxidized, so the thickness of the aluminum oxide film is relatively thin, not exceeding 3nm. Aluminum oxide itself is not conductive, but when the aluminum oxide film is not punctured, the conductive auxiliary material of the aluminum alloy is isolated by the aluminum oxide film, and a micro-discharge effect is generated under high-power excitation, resulting in abnormal conduction of the two materials, forming a nonlinear current and introducing PIM problems.

[0055] In some embodiments, the aluminum alloy frame 21 is welded with the gold-plated gasket and the aluminum alloy by laser or ultrasonic spot welding to form a stable connection. The copper foil 11 and the gold-plated gasket are electrically connected through the conductive member 30, and the two sides of the conductive member 30 are in contact with the copper foil 11 and the aluminum alloy frame 21 respectively, and the conduction impedance is low, which can meet the grounding requirements of electronic equipment. However, this method has disadvantages such as high cost, low yield, and waste of resources.

[0056] In other embodiments, an insulating member 40 may be provided between the other side of the conductive member 30 and the aluminum alloy frame 21. The insulating member 40 can reliably insulate the conductive member 30 from the aluminum alloy frame 21, and no nonlinear current is generated. In addition, the area of ​​the conductive member 30 can be increased so that the conductive member 30 and the aluminum alloy frame 21 form a parallel plate capacitor. The insulating member 40 serves as an insulating medium and controls the distance between the electrodes to achieve a high-frequency conduction effect, and can provide a return path to the ground in the frequency band range of 700MHz~6GHz.

[0057] In the first embodiment described above, the other side of the conductive part 30 is not in direct contact with the two conductive bodies of the aluminum alloy frame 21, and a high-frequency linear return path is provided through the capacitor, which effectively avoids the PIM problem caused by the nonlinear electrical connection caused by aluminum oxide, which is beneficial to improving the grounding reliability of the electronic equipment, and further can be beneficial to the antenna performance of the electronic equipment; this embodiment can also save the cost of gold plating and spot welding process; in addition, the mounting process of the insulating part 40 is relatively simple, and no spot welding is required, which is beneficial to improving the yield.

[0058] The second implementation method, such as Figure 6 and Figure 7 As shown: The display screen is a flexible screen. Since the flexible screen needs to have a bendable property, the reinforcement piece can be a titanium alloy sheet or a stainless steel sheet 12. Of course, it can also be a carbon fiber sheet, etc., which is not specifically limited here. Among them, the surface contact impedance of titanium alloy or stainless steel is not as ideal as that of gold or copper. Under different pressures, the on-resistance fluctuates greatly. Therefore, it is easy to generate nonlinearity and cause PIM problems. In addition, the frame can be made of aluminum alloy, which may have grounding nonlinearity.

[0059] Based on the above situation, in the related art, the surface of the conductive member 30 facing the display screen is gold plated, and the gold-plated pad is spot welded on the surface of the conductive member 30 facing the frame, so that the flexible screen and the frame can be electrically connected through the conductive member 30. In this way, the two sides of the conductive member 30 are in contact with the flexible screen and the frame respectively, so that the connection is reliable, however, there are disadvantages such as high cost.

[0060] To alleviate the above problems, in the embodiment of the present application, the reinforcement member can be a titanium alloy sheet or a stainless steel sheet 12, the frame can be an aluminum alloy frame 21, and insulating members 40 can be respectively provided on both sides of the conductive member 30, and the insulating members 40 on both sides are respectively bonded to the reinforcement member and the aluminum alloy frame 21.

[0061] Based on the above configuration, one side of the conductive member 30 can be reliably insulated from the titanium alloy sheet or stainless steel sheet 12 by the insulating member 40, so that one side of the conductive member 30 and the titanium alloy sheet or stainless steel sheet 12 form a parallel plate capacitor; the other side of the conductive member 30 can also be reliably insulated from the aluminum alloy frame 21 by the insulating member 40, so that the other side of the conductive member 30 and the aluminum alloy frame 21 form a parallel plate capacitor. Based on this, high-frequency energy is transferred from the titanium alloy sheet or stainless steel sheet 12 to the conductive member 30 through the capacitor, and then transferred to the capacitor through the conductive member 30, and finally transferred to the aluminum alloy frame 21 through the capacitor, thereby forming a return path. The above-mentioned second embodiment solves the nonlinear PIM problem caused by the poor surface conduction impedance of the titanium alloy sheet or stainless steel sheet 12, and does not require an additional gold plating process, saving the gold plating process cost and material cost. In addition, two capacitors are used between the display screen and the frame to provide a stable and linear return to ground method, thereby alleviating the PIM problem and further improving the antenna performance of the electronic device.

[0062] In some embodiments, the insulating members 40 on both sides of the conductive member 30 may have the same size, and the area of ​​the insulating member 40 is not less than the area of ​​the conductive member 30. Based on this configuration, it can be ensured that the insulating members 40 on both sides of the conductive member 30 have a sufficiently large insulating area to achieve good insulation between one side of the conductive member 30 and the display screen and between the other side of the conductive member 30 and the frame.

[0063] The third implementation method, such as Figure 8 and Fig. 9 As shown: The display screen may be a liquid crystal display screen (LCD, such as TFT LCD, etc.), the reinforcing member may be a titanium alloy sheet or a stainless steel sheet 12 ; and the frame may be a magnesium alloy frame 22 .

[0064] It should be noted here that magnesium alloy can be used in thin, mid-to-low-end electronic devices due to its light weight and low cost. After oxidation, magnesium alloy generates loosely structured magnesium oxide, which has low hardness and is easy to puncture. Because its oxide film is insulating and thick, it does not produce micro-discharge effect. Therefore, under a certain Z-direction pressure, its conduction is linear, and the PIM risk is low. Using the conductive member 30 to directly contact the magnesium alloy frame 22 can meet the grounding requirements of the electronic equipment.

[0065] Considering that LCD screens can be used in low-end and mid-range electronic devices, the cost pressure is relatively high. Due to the high cost of gold plating of stainless steel sheets, gold plating is not used, and the probability of PIM problems is minimized by increasing the area of ​​the conductive part 30. However, in the area where the FDD antenna field strength is strong near the electronic device, the antenna return current is large, and there is still a high PIM risk under high-power excitation, and the PIM problem cannot be completely avoided.

[0066] Based on the above situation, in the embodiment of the present application, an insulating part 40 can be provided on one side of the conductive part 30, and the other side of the conductive part 30 is bonded to the magnesium alloy frame 22, and the insulating part 40 is bonded to the reinforcement part. In this way, one side of the conductive part 30 and the titanium alloy sheet or the stainless steel sheet 12 can be insulated by the insulating part 40, so that one side of the conductive part 30 is not in direct contact with the titanium alloy sheet or the stainless steel sheet 12. In this way, the titanium alloy sheet or the stainless steel sheet 12 and the conductive part 30 can form a parallel plate capacitor, and a linear return ground path is provided by capacitor coupling grounding, thereby avoiding the risk of PIM problems without increasing the cost of gold plating.

[0067] Optionally, the area of ​​the insulating member 40 is not less than the area of ​​any side (i.e., one side or the other side) of the conductive member 30, so that the insulating member 40 can completely separate one side of the conductive member 30 from the display screen, or the other side of the conductive member 30 from the frame, to achieve reliable insulation, so as to achieve a high-frequency conduction effect through the formed capacitance.

[0068] In some specific embodiments, the other side of the conductive member 30 can be pressed and fixed to the magnesium alloy frame 22 to ensure a good conduction effect. Specifically, the other side of the conductive member 30 is in direct contact with the magnesium alloy frame 22, and is conducted through Z-direction pressure to form a return path.

[0069] The third embodiment described above can address the difficulty of grounding the conductive member 30 in the case of a liquid crystal display screen, provide a stable and linear conduction path without increasing the gold plating cost, effectively alleviate the PIM problem, and further improve the antenna performance of the electronic device.

[0070] In summary, the embodiment of the present application utilizes the principle of a flat plate capacitor and sets an insulating member 40 between the conductive member 30 and at least one of the display screen and the frame to form a capacitor effect, thereby achieving a high-frequency conduction effect between the display screen and at least one of the frame and the conductive member 30, thereby providing a stable return path to the ground and alleviating the PIM problem.

[0071] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. An electronic device, characterized in that: include: A display screen, a frame and a conductive member, wherein the display screen is arranged on one side of the frame, a reinforcing member is arranged on the side of the display screen facing the frame, and the conductive member is arranged between the display screen and the frame; wherein an insulating member is arranged on at least one side of the conductive member.

2. The electronic device according to claim 1, characterized in that: The display screen is an OLED screen, the reinforcing member is a copper foil, and the frame is an aluminum alloy frame; One side of the conductive member is bonded to the copper foil, and the other side of the conductive member is provided with the insulating member, and the insulating member is bonded to the aluminum alloy frame.

3. The electronic device according to claim 1, characterized in that: The display screen is a flexible screen, the reinforcing member is a titanium alloy sheet or a stainless steel sheet, and the frame is an aluminum alloy frame; The insulating members are respectively arranged on both sides of the conductive member, and the insulating members on both sides are respectively attached to the reinforcing member and the aluminum alloy frame.

4. The electronic device according to claim 3, characterized in that: The insulating members on both sides of the conductive member have the same size, and the area of ​​the insulating members is not less than the area of ​​the conductive member.

5. The electronic device according to claim 1, characterized in that: The display screen is a liquid crystal display screen, the reinforcing member is a titanium alloy sheet or a stainless steel sheet, and the frame is a magnesium alloy frame; The insulating component is provided on one side of the conductive component, the other side of the conductive component is bonded to the magnesium alloy frame, and the insulating component is bonded to the reinforcing component.

6. The electronic device according to claim 2 or 5, characterized in that: The area of ​​the insulating member is not less than the area of ​​any side of the conductive member.

7. The electronic device according to any one of claims 1 to 5, characterized in that: The area of ​​the conductive part is not less than 100 mm², and the thickness of the insulating part is in the range of 0.01 mm to 0.03 mm.

8. The electronic device according to claim 1, characterized in that: The conductive element is conductive foam.

9. The electronic device according to claim 1, characterized in that: The insulating member is at least one of insulating adhesive tape, anodized film, electroplated insulating film, and insulating adhesive.

10. The electronic device according to claim 1, characterized in that: The insulating member has a shape of polygon, circle, ellipse or special shape.

Images