Liquid cooling radiator and electronic equipment comprising same

Abstract

The invention discloses a liquid cooling radiator and an electronic device comprising the liquid cooling radiator, the liquid cooling radiator comprises at least one liquid cooling plate, at least one micropump and a uniform temperature plate, the uniform temperature plate is connected with each liquid cooling plate, so that one side of each liquid cooling plate and one side of the uniform temperature plate are coplanar, and a fluid channel is respectively formed; each micropump is provided with a water inlet and a water outlet, each fluid channel is correspondingly connected with one micropump, a first interface end of each fluid channel is communicated with the water inlet of the corresponding micropump, and a second interface end of each fluid channel is communicated with the water outlet of the corresponding micropump. A fluid channel capable of containing a liquid cooling working medium is formed through connection of a temperature uniforming plate and a liquid cooling plate, the liquid cooling working medium in the fluid channel circularly flows through driving of a micropump, and the circularly flowing liquid cooling working medium is in direct contact with the temperature uniforming plate, so that the liquid cooling working medium is not prone to falling off. Therefore, the heat conduction path of the vapor chamber-liquid cooling working medium-liquid cooling plate can fully take away heat, and efficient heat dissipation of the electronic equipment is realized.

Description

Technical Field

[0001] The present invention relates to the technical field of radiators, and in particular to a liquid-cooled radiator and an electronic device comprising the liquid-cooled radiator. Background Art

[0002] VC (Vapor Chamber) achieves rapid lateral heat conduction through the phase change heat transfer principle (liquid evaporation-vapor diffusion-condensation reflux) and is widely used in heat dissipation modules of electronic devices (such as mobile phones, laptops, and host servers). With the improvement of the performance of electronic devices (such as mobile phones, laptops, and host servers) (such as high-computing chips, 5G modules, etc.), the heat flux density per unit area is growing exponentially.

[0003] In the traditional heat dissipation solution, the Fig.12 As shown in the figure, the temperature spreader and the fins are usually combined by solder paste welding to fill the gap between the temperature spreader and the fins, and the electronic equipment is cooled by forced air cooling of the fan, but there are the following problems:

[0004] 1. The vapor chamber transfers heat to the fins through solder paste, which makes the interface thermal resistance between the vapor chamber and the fins high, making it difficult to meet the requirements of efficient heat dissipation, resulting in limited equipment performance or even downtime due to high temperature.

[0005] 2. The fan makes a lot of noise when it is running, making it difficult to balance efficient heat dissipation and user experience.

[0006] 3. The internal space of electronic devices (such as laptops, mobile phones, etc.) is compact. With the requirements for electronic devices to be thinner and lighter, the existing heat dissipation module of temperature vapor chamber + fins is difficult to take into account both thinness and efficient heat dissipation. For example, by increasing the height of the fins to increase the contact area with the airflow, more heat can be taken away. However, if the fins are too high, the thickness of the heat dissipation module will be too thick, affecting its thinness and portability.

[0007] The present invention solves at least one of the above problems. Summary of the invention

[0008] The object of the present invention is to provide a liquid-cooled radiator, which is based on a temperature equalizing plate for liquid cooling design to solve at least one of the above-mentioned problems existing in traditional heat dissipation solutions. The radiator of the present application reduces the thermal transfer resistance by directly exchanging heat conducted out of the temperature equalizing plate with the liquid-cooling medium, so that the heat conduction path of the temperature equalizing plate-liquid-cooling medium-liquid-cooling plate can fully carry away the heat, improve the heat exchange efficiency, and realize efficient heat dissipation and lightweight application of electronic equipment.

[0009] The purpose of the present invention is achieved by the following technical solutions:

[0010] A first aspect of the present invention provides a liquid cooling radiator, comprising:

[0011] at least one liquid cooling plate;

[0012] A temperature averaging plate connected to each of the liquid cooling plates so that one side of each of the liquid cooling plates is coplanar with one side of the temperature averaging plate, and a fluid channel is formed respectively, wherein the fluid channel has a first interface end and a second interface end that are connected;

[0013] At least one micro pump, each of the micro pumps has a water inlet and a water outlet, and each of the fluid channels is respectively connected to a corresponding micro pump, wherein the first interface end of the fluid channel is connected to the water inlet of the micro pump, and the second interface end of the fluid channel is connected to the water outlet of the micro pump.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: by connecting the temperature equalizing plate and the liquid cooling plate, one side of each liquid cooling plate is made coplanar with one side of the temperature equalizing plate, and a fluid channel that can accommodate the liquid cooling medium is formed respectively; the liquid cooling medium in the fluid channel is made to circulate by the driving of the micro pump; since the circulating liquid cooling medium is in direct contact with the temperature equalizing plate, the heat conducted out by the temperature equalizing plate can be directly exchanged with the liquid cooling medium, thereby reducing the thermal transfer resistance, so that the heat conduction path of the temperature equalizing plate-liquid cooling medium-liquid cooling plate can fully take away the heat, improve the heat exchange efficiency, and realize efficient heat dissipation of the electronic equipment; at the same time, compared with the fan, the working noise of the micro pump is smaller, so it can well take into account both efficient heat dissipation and user experience; compared with the height of the fins, due to liquid cooling, the liquid cooling plate can be made thinner and lighter, taking into account both thinness and efficient heat dissipation.

[0015] In some possible implementations of the first aspect, the temperature homogenizing plate includes two cover plates, an upper cover plate and a lower cover plate;

[0016] The upper cover plate and the lower cover plate are connected to form a cavity, and the cavity is used to accommodate a heat-conducting medium;

[0017] A capillary structure is disposed in the cavity, one side of the capillary structure abuts against the upper cover plate, and the other side of the capillary structure abuts against the lower cover plate;

[0018] At least one of the cover plates is connected to one or more of the liquid cooling plates.

[0019] In some possible implementations of the first aspect, the liquid cooling plate has a first through groove, and the cover plate and the first through groove of the liquid cooling plate form the fluid channel.

[0020] In some possible implementations of the first aspect, a plurality of first protrusions located in the fluid channel are disposed at the bottom of the first through groove.

[0021] In some possible implementations of the first aspect, at least one of the cover plates is provided with a second through groove, and the liquid cooling plate and the second through groove of the cover plate form the fluid channel.

[0022] In some possible implementations of the first aspect, a plurality of second protrusions located in the fluid channel are disposed at the bottom of the second through groove.

[0023] In some possible implementations of the first aspect, the liquid cooling plate has a first through groove, and the second through groove of the cover plate corresponds to the first through groove of the liquid cooling plate and forms the fluid channel.

[0024] In some possible implementations of the first aspect, the capillary structure is a copper mesh, a mesh fabric, or sintered copper powder.

[0025] In some possible implementations of the first aspect, the fluid channel is in a "V" shape or a serpentine shape.

[0026] A second aspect of the present invention provides an electronic device, comprising the above-mentioned liquid-cooled radiator. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the three-dimensional structure of the liquid cooling radiator in the laptop usage scenario of this embodiment;

[0028] Figure 2 This is a schematic diagram of the exploded structure of the liquid cooling radiator in the laptop usage scenario of this embodiment;

[0029] Figure 3 This is a schematic diagram of the three-dimensional structure of the liquid cooling radiator in the mobile phone usage scenario of this embodiment;

[0030] Figure 4 This is a schematic diagram of the exploded structure of the liquid cooling radiator in the mobile phone usage scenario of this embodiment;

[0031] Figure 5 This is a schematic diagram of the three-dimensional structure of a liquid cooling radiator in the host server usage scenario of this embodiment;

[0032] Figure 6 This is a schematic diagram of the exploded structure of the liquid cooling radiator in the host server usage scenario of this embodiment;

[0033] Figure 7 This is a schematic diagram of a three-dimensional structure in which a first protrusion is provided in a first through groove of a liquid cooling plate in a laptop usage scenario according to this embodiment;

[0034] Figure 8 This is a schematic diagram of an exploded structure in which a second protrusion is provided in the second through slot of the lower cover in a laptop usage scenario according to this embodiment;

[0035] Fig. 9It is a schematic diagram of the three-dimensional structure of the first through slot of the liquid cooling plate provided with the first protrusion and the first through slot of the liquid cooling plate provided with the first protrusion in the laptop usage scenario of this embodiment;

[0036] Fig.10 This is a schematic diagram of the three-dimensional structure of the "V"-shaped fluid channel in the laptop usage scenario of this embodiment;

[0037] Fig.11 This is a schematic diagram of the exploded structure of a "V"-shaped fluid channel in the laptop usage scenario of this embodiment;

[0038] Fig.12 This is a schematic diagram of a traditional heat dissipation solution where the temperature equalizer and fins are mostly connected by soldering with solder paste.

[0039] In the figure, 1, liquid cooling plate; 11, first through groove; 110, first protrusion; 2, temperature balancing plate; 20, cover plate; 21, capillary structure; 22, second through groove; 220, second protrusion. DETAILED DESCRIPTION

[0040] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make the present invention more comprehensive and complete and to fully convey the concepts of example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted.

[0041] In a first aspect of the present embodiment, a liquid cooling radiator is provided, comprising at least one liquid cooling plate 1, a temperature averaging plate 2 and at least one micro pump (not shown in the figure). The liquid cooling radiator of the present application can be used in electronic devices, such as mobile phones, laptop computers, and host servers, etc., and the present application does not limit this. Figure 1-6 As shown, this embodiment takes a laptop usage scenario, a mobile phone usage scenario, and a host server usage scenario as examples.

[0042] The temperature averaging plate 2 is connected to each liquid cooling plate 1 so that one side of each liquid cooling plate 1 is coplanar with one side of the temperature averaging plate 2, and a fluid channel is formed respectively. Specifically, the fluid channel has a first interface end and a second interface end that are connected. Exemplarily, the material of the liquid cooling plate 1 is copper, and the present application does not limit the material of the liquid cooling plate 1.

[0043] In some specific implementations, the temperature homogenizing plate 2 includes two cover plates 20 , namely an upper cover plate and a lower cover plate.

[0044] The upper cover plate and the lower cover plate are connected to each other and form a cavity, which is used to accommodate a heat-conducting medium. The heat-conducting medium is a liquid phase change material, such as liquid water, ethanol, and acetone. Exemplarily, the material of the cover plate 20 is copper, and the present application does not limit the material of the cover plate 20.

[0045] A capillary structure 21 is disposed in the cavity, one side of the capillary structure 21 abuts against the upper cover plate 20, and the other side of the capillary structure 21 abuts against the lower cover plate 20. Exemplarily, the capillary structure 21 can be a copper mesh, a mesh fabric, or sintered copper powder, and the present application does not limit the structure and material of the capillary structure 21.

[0046] Through the transformation process of the heat-conducting medium in the temperature-averaging plate 2 from liquid to gas and then to liquid, the heat is quickly dissipated, thereby exerting the heat-conducting and heat-dissipating effect of the temperature-averaging plate 2. In order to ensure that the transformation process of the heat-conducting medium from liquid to gas and then to liquid is not affected by impurities, the cavity is generally in a closed vacuum state, thereby improving the heat-conducting and heat-dissipating effect of the temperature-averaging plate 2. The heat dissipation principle of the temperature-averaging plate 2 is well known to those skilled in the art and will not be described in detail here.

[0047] It should be noted that at least one cover plate 20 is connected to one or more liquid cooling plates 1 to meet different usage scenarios.

[0048] Further, as a preferred embodiment of the present application, the liquid cooling plate 1 has a first through groove 11, and the cover plate 20 and the first through groove 11 of the liquid cooling plate 1 form a fluid channel. The first through groove 11 is not only used to form a fluid channel, but also to increase the contact surface area between the liquid cooling plate 1 and the liquid cooling medium, so that the heat conduction path between the liquid cooling medium and the liquid cooling plate 1 transfers more heat, further improving the heat dissipation efficiency.

[0049] The material of the temperature averaging plate 2 and the liquid cooling plate 1 can be copper, aluminum, stainless steel or other metals with good thermal conductivity, and the present application does not limit the material thereof. The temperature averaging plate 2 and the liquid cooling plate 1 can be combined together by welding.

[0050] Each micro pump has a water inlet and a water outlet, and each fluid channel is connected to a corresponding micro pump, wherein the first interface end of the fluid channel is connected to the water inlet of the micro pump, and the second interface end of the fluid channel is connected to the water outlet of the micro pump.

[0051] It should be noted that one end of the fluid channel is connected to the water inlet of the micropump through a first connecting pipe (not shown in the figure), and the other end of the fluid channel is connected to the water outlet of the micropump through a second connecting pipe (not shown in the figure).

[0052] The first connecting tube and the second connecting tube can be made of nylon, PVC, PU, ​​PTEE or PI, or stainless steel, copper or aluminum, which is not limited in the present application. The first connecting tube and the second connecting tube are adapted to the interfaces at both ends of the fluid channel to facilitate communication with the micro pump and ensure sealing.

[0053] By connecting the temperature averaging plate 2 and the liquid cooling plate 1, one side of each liquid cooling plate 1 is made coplanar with one side of the temperature averaging plate 2, and a fluid channel that can accommodate the liquid cooling medium is formed respectively. The liquid cooling medium in the fluid channel is circulated by the drive of the micro pump. Since the circulating liquid cooling medium is in direct contact with the temperature averaging plate 2, the heat conducted out by the temperature averaging plate 2 can be directly exchanged with the liquid cooling medium, thereby reducing the thermal transfer resistance, so that the heat conduction path of the temperature averaging plate 2-liquid cooling medium-liquid cooling plate 1 can fully take away the heat, improve the heat exchange efficiency, and achieve efficient heat dissipation of the electronic equipment.

[0054] It should be noted that the liquid cooling medium is a liquid phase change material, such as liquid water, ethanol and acetone.

[0055] It should be further explained that, compared with the fan, the micro pump has lower working noise, so it can well balance efficient heat dissipation and user experience. Compared with the height of the fins, due to liquid cooling, the liquid cooling plate 1 can be made thinner and lighter, taking into account both thinness and efficient heat dissipation.

[0056] In some specific embodiments, in combination with Figure 1-2 As shown in 10-11, the shape of the fluid channel (equivalent to the shape of the first through groove 11 and the second through groove 22) is "V"-shaped or serpentine. The "V"-shaped or serpentine flow channel can further increase the contact surface area between the liquid cooling plate 1 and / or the temperature equalizing plate 2 and the liquid cooling medium, so that the heat conduction path of the temperature equalizing plate 2-liquid cooling medium-liquid cooling plate 1 can transfer more heat, further improving the heat dissipation efficiency.

[0057] Further, taking the laptop usage scenario as an example, combined with the attached Figure 7 As shown, the bottom of the first through groove 11 is provided with a plurality of first protrusions 110 located in the fluid channel. The first protrusions 110 are used to increase the contact surface area between the liquid cooling plate 1 and the liquid cooling medium, so that the liquid cooling plate 1 can take away more heat from the liquid cooling medium and improve the heat dissipation efficiency.

[0058] Or a protrusion is provided on the outer side of the cover plate 20, and the protrusion is located in the fluid channel. The protrusion is used to increase the contact surface area between the cover plate 20 and the liquid cooling medium, so that the liquid cooling medium can take away more heat from the temperature homogenizing plate 2, thereby improving the heat dissipation efficiency.

[0059] As another preferred embodiment of the present application, taking the laptop usage scenario as an example, combined with the attached Figure 8As shown, at least one cover plate 20 (for example, an upper cover plate) is provided with a second through groove 22, and the liquid cooling plate 1 and the second through groove 22 of the cover plate 20 form a fluid channel. The second through groove 22 is not only used to form a fluid channel, but also to increase the contact surface area between the temperature averaging plate 2 and the liquid cooling medium, so that the liquid cooling medium can take away more heat from the temperature averaging plate 2, thereby improving the heat dissipation efficiency.

[0060] Furthermore, a plurality of second protrusions 220 located in the fluid channel are disposed at the bottom of the second through groove 22 .

[0061] The second protrusion 220 is used to increase the contact surface area between the temperature averaging plate 2 and the liquid cooling medium, so that the liquid cooling medium can take away more heat from the temperature averaging plate 2, thereby improving the heat dissipation efficiency.

[0062] As another preferred implementation of the present application, taking the laptop usage scenario as an example, combined with the attached Fig. 9 As shown, the second through groove 22 of the cover plate 20 corresponds to the first through groove 11 of the liquid cooling plate 1, and forms a fluid channel. The fluid channel formed by the first through groove 11 and the second through groove 22 not only increases the space of the fluid channel to accommodate more liquid cooling medium, but also increases the contact surface area between the liquid cooling medium and the temperature averaging plate 2 and the liquid cooling plate 1, so that the heat conduction path of the temperature averaging plate 2-liquid cooling medium-liquid cooling plate 1 can transfer more heat and improve the heat dissipation efficiency.

[0063] It should be noted that the first through groove 11 and the second through groove 22 may be formed by etching or punching.

[0064] According to a second aspect of the present embodiment, an electronic device is provided. The electronic device includes the above-mentioned liquid-cooled radiator.

[0065] The electronic device may be a mobile phone, a laptop or a host server. The liquid cooling radiator used in the electronic device can not only achieve efficient heat dissipation, but also take into account the application of lightness and thinness.

[0066] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, substitute and modify the above embodiments within the scope of the invention without departing from the principles and purpose of the present invention. All such changes should fall within the scope of protection of the claims of the present invention.

Claims

1. Liquid cooling radiator, characterized in that: include: at least one liquid cooling plate; A temperature homogenizing plate connected to each of the liquid cooling plates so that one side of each of the liquid cooling plates is coplanar with one side of the temperature homogenizing plate and a fluid channel is formed respectively, wherein the fluid channel has a first interface end and a second interface end that are connected; At least one micro pump, each of the micro pumps has a water inlet and a water outlet, and each of the fluid channels is respectively connected to a micro pump, wherein the first interface end of the fluid channel is connected to the water inlet of the micro pump, and the second interface end of the fluid channel is connected to the water outlet of the micro pump.

2. The liquid cooling radiator according to claim 1, characterized in that: The temperature homogenizing plate comprises two cover plates, an upper cover plate and a lower cover plate; The upper cover plate and the lower cover plate are connected to form a cavity, and the cavity is used to accommodate a heat-conducting medium; A capillary structure is disposed in the cavity, one side of the capillary structure abuts against the upper cover plate, and the other side of the capillary structure abuts against the lower cover plate; At least one of the cover plates is connected to one or more of the liquid cooling plates.

3. The liquid cooling radiator according to claim 2, characterized in that: The liquid cooling plate has a first through groove, and the cover plate and the first through groove of the liquid cooling plate form the fluid channel.

4. The liquid cooling radiator according to claim 3, characterized in that: The bottom of the first through groove is provided with a plurality of first protrusions located in the fluid channel.

5. The liquid cooling radiator according to claim 2, characterized in that: At least one of the cover plates is provided with a second through groove, and the liquid cooling plate and the second through groove of the cover plate form the fluid channel.

6. The liquid cooling radiator according to claim 5, characterized in that: The bottom of the second through groove is provided with a plurality of second protrusions located in the fluid channel.

7. The liquid cooling radiator according to claim 2, characterized in that: The liquid cooling plate has a first through groove, and the second through groove of the cover plate corresponds to the first through groove of the liquid cooling plate and forms the fluid channel.

8. The liquid cooling radiator according to claim 4, characterized in that: The capillary structure is a copper mesh, a mesh fabric or sintered copper powder.

9. The liquid cooling radiator according to any one of claims 1 to 8, characterized in that: The shape of the fluid channel is "V" shape or serpentine shape.

10. An electronic device, characterized in that: The electronic device comprises the liquid cooling radiator according to any one of claims 1-9.

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