LED lamp sheet production equipment and LED lamp sheet production process

Abstract

The invention relates to the technical field of LED lamp sheets, in particular to LED lamp sheet production equipment and an LED lamp sheet production process, a transmission track mechanism used for transmitting LED lamp sheets is arranged among dispensing equipment, curing equipment and detection stripping equipment, so that a user can convey the LED lamp sheets to all the equipment through the transmission track mechanism, manual intervention is reduced, and the production efficiency is improved. The LED lamp sheet production line is beneficial for improving the automation degree of the LED lamp sheet production process, and effectively solves the problems that the existing LED lamp sheet processing flow mostly depends on manual work, the LED lamp sheet is manually placed below a dispensing machine for dispensing, then the LED lamp sheet subjected to dispensing is manually placed on curing equipment for curing, and the production efficiency is high. And finally, the cured LED lamp sheet is manually placed on a cutting machine to be cut, a large number of manpower resources are consumed, and the production efficiency is seriously affected.

Description

Technical Field

[0001] The present invention relates to the technical field of LED lamp chips, specifically to LED lamp chip production equipment and LED lamp chip production processes. Background Art

[0002] With the rapid development of technology, LED lamp chips, as an efficient and energy-saving lighting technology, have been widely used in many fields. LED lamp chips generally refer to a thin-type LED lighting product, which can be designed into various shapes and sizes to adapt to different application scenarios. LED lamp chips can not only provide uniform light distribution, but also achieve dimming and color change through intelligent control to meet diverse lighting needs.

[0003] In the production process of LED lamp chips, the dispensing process is a key step, in which glue needs to be accurately dispensed on the LED lamp chips to fix the LED chips. After dispensing, the LED lamp chips need to be placed in a curing device for glue curing. After the curing process is completed, the LED lamp chips are then placed on a cutting machine to cut the whole LED lamp chips into individual finished lamp beads. However, the existing operation processes mostly rely on manual labor. Workers place the LED lamp chips under the dispensing machine for dispensing, then manually place the dispensed LED lamp chips on the curing device for curing, and finally manually place the cured LED lamp chips on the cutting machine for cutting. This not only consumes a large amount of human resources, but also seriously affects the production efficiency.

[0004] The present invention is studied and proposed in view of the deficiencies of the existing technology. Summary of the Invention

[0005] In view of the problem that the existing LED lamp chip processing process mostly relies on manual labor, where workers place the LED lamp chips under the dispensing machine for dispensing, then manually place the dispensed LED lamp chips on the curing device for curing, and finally manually place the cured LED lamp chips on the cutting machine for cutting, which not only consumes a large amount of human resources but also seriously affects the production efficiency, the technical solution adopted by the present invention to solve its technical problems is as follows: LED lamp chip production equipment, including: A curing device, which is arranged on one side of the dispensing device and is used for curing the glue on the LED lamp chips; A detection and stripping device, which is arranged on one side of the curing device, and the detection and stripping device is used for cutting the qualified LED lamp chips into single finished lamp beads; A transmission track mechanism, which is arranged between the dispensing device, the curing device and the detection and stripping device and is used for transmitting the LED lamp chips.

[0006] Further, the dispensing device includes a dispenser located above the transfer track mechanism. The dispenser includes an air pump for providing pressure, a glue cylinder for storing UV glue, an air pipe located between the air pump and the glue cylinder, a dispensing head for dispensing glue onto the LED lamp chips, and a glue inlet block connecting the glue cylinder and the dispensing head.

[0007] Further, the dispensing device includes a dispenser feeding mechanism located on one side of the dispenser. The dispenser feeding mechanism includes a feeding drive motor that can lift and lower in the third direction, a feeding lifting frame connected to the feeding drive motor, and a feeding push rod passing through the feeding lifting frame and connected to the transfer track mechanism.

[0008] Further, the curing device includes a UV light lamp located above the transfer track mechanism and capable of providing ultraviolet light.

[0009] Further, the curing device includes a light box body and a mounting frame for placing the light box body. The light box body includes a placement part for placing the LED lamp chips, a curing part connected to the placement part, a transfer component located between the placement part and the curing part, and an ultraviolet light source. The LED lamp chips on the placement part are transported to the curing part through the transfer component so that the ultraviolet light source can irradiate the LED lamp chips in the curing part.

[0010] Further, the curing device includes a dehumidifying oven for heating and baking the LED lamp chips.

[0011] Further, the curing device further includes a baking tunnel furnace connected to the transfer track mechanism. The baking tunnel furnace includes a furnace body, a baking material transfer mechanism passing through the furnace body, a heating device, a ventilation device, and a tunnel furnace control system provided inside the furnace body.

[0012] Further, the inspection and stripping device includes an AOI inspection device. The AOI inspection device includes an optical imaging system for inspecting the quality of the LED lamp chips, an AOI mechanical motion system for placing the LED lamp chips and stripping defective products, and an image processing system for controlling the operation of the AOI mechanical motion system.

[0013] Further, the inspection and stripping device further includes a leg cutting machine for cutting the LED lamp chips into single finished lamp beads. The leg cutting machine includes a feeding mechanism connected to the transfer track mechanism, a cutting table connected to the feeding mechanism, a limit cutting mechanism for fixing the LED lamp chips on the cutting table, a cutting mechanism for cutting the LED lamp chips, a discharging mechanism, and a cutting control host.

[0014] The present invention also provides an LED lamp chip production process, including the following steps: S1: Convey the LED lamp chips to the position below the dispensing machine through the said transmission track mechanism, and the dispensing machine drips UV glue onto the LED lamp chips, thus completing the dispensing process; S2: Place the dispensed LED lamp chips on the curing equipment, and cure the UV glue on the LED lamp chips through the curing equipment; S3: Place the cured LED lamp chips on the detection and stripping equipment. The detection and stripping equipment identifies the quality of the LED lamp chips, strips the defective products, and the remaining non-defective LED lamp chips are cut into single finished lamp beads by a lead cutting machine.

[0015] The beneficial effects of the present invention are as follows: By arranging a transmission track mechanism for conveying LED lamp chips between the dispensing equipment, the curing equipment and the detection and stripping equipment, the present invention enables users to convey the LED lamp chips to each equipment through the transmission track mechanism, which is beneficial to reducing manual intervention, helps to improve the automation degree of the LED lamp chip production process, and effectively solves the problem that the existing LED lamp chip processing process mostly relies on manual operation. Manually place the LED lamp chips under the dispensing machine for dispensing, then manually place the dispensed LED lamp chips on the curing equipment for curing, and finally manually place the cured LED lamp chips on the cutting machine for cutting, which not only consumes a large amount of human resources but also seriously affects the production efficiency.

[0016] The following will further illustrate the present invention in conjunction with the drawings and specific embodiments. Description of the Drawings

[0017] Figure 1 One of the flowcharts of the LED lamp chip production process of the present invention; Figure 2 Another flowchart of the LED lamp chip production process of the present invention; Figure 3 Another flowchart of the LED lamp chip production process of the present invention; Figure 4 Another flowchart of the LED lamp chip production process of the present invention; Figure 5 One of the structural schematic diagrams of the light box of the present invention; Figure 6 Exploded view of the light box of the present invention; Figure 7 Another structural schematic diagram of the light box of the present invention; Figure 8 Another structural schematic diagram of the light box of the present invention; Figure 9 Structural schematic diagram of the second transmission mechanism of the present invention; Figure 10One of the schematic structural diagrams of the light box body of the present invention on the mounting frame; Figure 11 Another schematic structural diagram of the light box body of the present invention on the mounting frame. Specific embodiments

[0018] The following will describe in detail the embodiments of the present invention with reference to the accompanying drawings.

[0019] As Figures 1 to 11 The LED chip production equipment shown includes: a dispensing device for dispensing the LED chips; a curing device disposed on one side of the dispensing device and used for curing the glue on the LED chips; a detection and stripping device disposed on one side of the curing device, and the detection and stripping device is used for cutting the qualified LED chips into single finished lamp beads; a transfer track mechanism 5 disposed between the dispensing device, the curing device and the detection and stripping device and used for transferring the LED chips; The present invention sets a transfer track mechanism for transferring LED chips between the dispensing device, the curing device and the detection and stripping device, so that the user can convey the LED chips to each device through the transfer track mechanism, which is beneficial to reducing manual intervention, helping to improve the automation degree of the LED chip production process, and effectively solving the problem that the existing LED chip processing process mostly relies on manual operation. Manually place the LED chips under the dispenser for dispensing, then manually place the dispensed LED chips on the curing device for curing, and finally manually place the cured LED chips on the cutting machine for cutting, which not only consumes a large amount of human resources but also seriously affects the production efficiency.

[0020] Further, the first direction corresponds to the X-axis direction (front-back direction), the second direction corresponds to the Y-axis direction (left-right direction), and the third direction corresponds to the Z-axis direction (up-down direction).

[0021] Specifically, in the dispensing process, the epoxy glue or silicone glue traditionally used has limited product performance due to poor bonding effect and insufficient toughness. In order to improve the toughness of the glue layer and the overall performance of the LED chips, the industry has started to use UV glue as a substitute material. The dispensed LED chips need to be cured by ultraviolet light irradiation.

[0022] Specifically, the production equipment includes a dispensing device, a curing device, an inspection and stripping device, and a transfer track mechanism 5 for connecting the dispensing device, the curing device, and the inspection and stripping device. The dispensing device is used for dispensing the LED lamp chips. The dispensed LED lamp chips can be transported to the curing device through the transfer track mechanism 5 for curing. The cured LED lamp chips are transported to the inspection and stripping device through the transfer track mechanism 5. The inspection and stripping device can quickly and accurately identify the quality of the LED lamp chips and strip the defective products. The non-defective LED lamp chips are then cut into single finished lamp beads.

[0023] As Figures 1 to 11 shown, the dispensing device includes a dispenser 6 located above the transfer track mechanism 5. The dispenser 6 includes an air pump for providing pressure, a glue cylinder for storing UV glue, an air pipe located between the air pump and the glue cylinder, a dispensing head for dispensing the LED lamp chips, and a glue inlet block connecting the glue cylinder and the dispensing head. Further, an air pump is connected to a plurality of glue cylinders through a plurality of air pipes respectively, and a plurality of glue cylinders are connected to a plurality of dispensing heads through a glue inlet block. An air pump can provide power for multiple glue cylinders simultaneously. Compared with equipping each glue cylinder with an air pump, connecting an air pump to multiple glue cylinders through a plurality of air pipes is beneficial to reducing the number of air pumps, helping to reduce the equipment cost, and saving space. Secondly, since the UV glue supply for all dispensing heads needs to pass through the same glue inlet block, it helps to ensure that the UV glue coming out of each dispensing head has high consistency in terms of flow rate, pressure, etc., which is beneficial to ensuring the uniform stability of the dispensing effect and effectively reducing the defective rate of the LED lamp chips.

[0024] Specifically, one end of the glue cylinder is connected to the air pump through an air pipe, and the other end of the glue cylinder is connected to the dispensing head through a glue inlet block. The glue cylinder is used for storing UV glue. After the air pump is turned on, the air pressure generated by the air pump is transported to the upper part of the glue cylinder through the air pipe and applies pressure to the UV glue in the glue cylinder, so that the UV glue enters the glue inlet block. The glue inlet block can initially control the flow direction and flow rate of the UV glue, and has a certain restricting and guiding effect on the UV glue. The UV glue is transported to the dispensing head under the action of the glue inlet block, and under the continuous pushing of the air pressure, the UV glue is extruded from the dispensing head and finally drops on the position where the LED lamp chip needs to be dispensed.

[0025] Optionally, in some other embodiments, the dispensing device further includes a dispenser discharging mechanism 62 located on one side of the dispenser 6. The dispenser discharging mechanism 62 includes a discharging driving motor that can lift along the Z-axis direction and a discharging lifting frame connected to the discharging driving motor. A material box for installing the LED lamp chips is provided inside the discharging lifting frame. The transfer track mechanism 5 can transport the dispensed LED lamp chips to the material box one by one.

[0026] As Figures 1 to 11The dispensing device shown includes a dispensing machine feeding mechanism 61 located on one side of the dispensing machine 6. The dispensing machine feeding mechanism 61 includes a feeding drive motor that can lift and lower in the third direction, a feeding lifting frame connected to the feeding drive motor, and a feeding push rod that passes through the feeding lifting frame and is connected to the transfer track mechanism 5. Specifically, a material box is provided inside the feeding lifting frame. The material box contains LED lamp chips to be dispensed. The LED lamp chips to be dispensed are arranged at intervals in the material box along the Z-axis direction. The feeding push rod in the dispensing machine feeding mechanism 61 pushes the LED lamp chips in the material box to the transfer track mechanism 5. The feeding drive motor drives the feeding lifting frame to lift and lower along the Z-axis direction, and the material box inside the feeding lifting frame lifts and lowers synchronously, so that the feeding push rod conveys the LED lamp chips to the transfer track mechanism 5 one by one. The transfer track mechanism 5 conveys each LED lamp chip to the lower part of the dispensing machine 6 for the dispensing machine 6 to dispense glue on the LED lamp chip.

[0027] As Figures 1 to 11 The curing device shown includes a UV light illumination lamp 71 located above the transfer track mechanism 5 and capable of providing ultraviolet light. Specifically, the UV light illumination lamp 71 includes a mounting integrated board and a number of UV lamps located on the side of the mounting integrated board close to the transfer track mechanism. The UV lamps are arranged along the extension direction of the mounting integrated board. When the LED lamp chips completed with dispensing by the dispensing machine 6 are transferred to the lower part of the UV light illumination lamp 71 under the action of the transfer track mechanism 5, the ultraviolet light can quickly irradiate the glue on the LED lamp chips, realizing rapid curing. This can not only improve production efficiency but also ensure the curing quality of the UV glue, thereby enhancing the overall performance of the LED lamp chips. Secondly, the UV lamps are arranged along the extension direction of the mounting integrated board. When the LED lamp chips pass under the UV light illumination lamp 71 under the action of the transfer track mechanism 5, they can receive ultraviolet light irradiation more evenly, which helps to uniformly cure the glue at the dispensing position of the LED lamp chips on the entire lamp chip, avoiding the situation of incomplete local curing or over-curing. Finally, by setting the UV light illumination lamp 71 above the transfer track mechanism 5, the vertical space is fully utilized, avoiding the occupation of floor space.

[0028] As Figures 1 to 11 The curing device shown includes a lighting box body 1 and a mounting frame 70 for placing the lighting box body 1. The lighting box body 1 includes a placement part 2 for placing LED lamp chips, a curing part 3 connected to the placement part 2, a transfer component 4 located between the placement part 2 and the curing part 3, and an ultraviolet light source. The LED lamp chips on the placement part 2 are conveyed to the curing part 3 through the transfer component 4, so that the ultraviolet light source can irradiate the LED lamp chips in the curing part 3. Further, a plurality of lighting boxes 1 can be placed in the installation frame 70 simultaneously in the vertical direction. The installation frame 70 not only provides a placement space for the plurality of lighting boxes 1, but also supplies power to each lighting box 1. After the LED lamp chips are dispensed by the dispenser 6, the material boxes are collected manually and placed on each lighting box 1. The lighting box 1 can automatically convey the LED lamp chips in the material box into the lighting box 1 for light irradiation, so as to cure the UV glue. After the irradiation is completed, the lighting box 1 automatically conveys out the LED lamp chips laid flat in the lighting box 1. The LED lamp chips return to the material box one by one, and finally are collected and processed uniformly by the operator.

[0029] Specifically, in the production process of the LED lamp chips, first, the LED lamp chips are dispensed with UV glue, and then, the dispensed LED lamp chips are placed on the placement part 2 on the lighting box 1. Under the action of the transmission assembly 4, the LED lamp chips on the placement part 2 are conveyed one by one and laid flat on the curing part 3, so that the ultraviolet light source on the lighting box 1 can irradiate the LED lamp chips laid flat on the curing part 3, thereby curing the dispensed LED lamp chips. Then, after the irradiation of the ultraviolet light source is completed, the transmission assembly can automatically convey the LED lamp chips laid flat on the curing part back to the placement part one by one. Finally, the operator can collect the LED lamp chips located on the placement part.

[0030] Further, the cover plate 11 is hinged to the curing part 3. A handle block 10 is further provided on the side of the cover plate 11 away from the curing part 3. The operator can lift the cover plate 11 upward along the Z-axis direction through the handle block 10, so that one side of the cover plate 11 is separated from the curing part 3, thereby forming an opening, which is beneficial for the operator to clean and maintain the lighting box 1.

[0031] Further, the ultraviolet light source is located on the side of the cover plate 11 close to the curing part 3, and the layout area of the ultraviolet light source is equal to the cross-sectional area of the cover plate 11, which is beneficial to improving the irradiation effect of the ultraviolet light source on the LED lamp chips and effectively improving the curing efficiency.

[0032] Further, the curing part 3 includes a first curing part 31 arranged in the first direction. The transmission assembly 4 includes a first transmission mechanism 41 extending along the length direction of the first curing part 31, and an auxiliary pushing mechanism 40 located between the placement part 2 and the first curing part 31 and connected to the first transmission mechanism 41. The first curing part 31 is arranged along the X-axis direction, the first transmission mechanism 41 is arranged at intervals along the extending direction of the first curing part 31, and the auxiliary pushing mechanism 40 is arranged between the placement part 2 and the first curing part 31, so that the LED lamp chips after dispensing and located on the placement part 2 can be conveyed to the first transmission mechanism 41 on the first curing part 31 through the auxiliary pushing mechanism 40.

[0033] Further, the curing part 3 includes a second curing part 32 arranged along the second direction. The transmission component 4 includes a second transmission mechanism 42 extending along the length direction of the second curing part 32 and connected to the first transmission mechanism 41. The second curing part 32 is arranged along the Y-axis direction, the second transmission mechanism 42 is arranged along the extending direction of the second curing part 32, and the first transmission mechanism 41 is located at the middle position of the curing part. The second transmission mechanisms 42 are respectively located on both sides of the first transmission mechanism 41. One first transmission mechanism 41 corresponds to two second transmission mechanisms 42 on the left and right sides of the same Y-axis. There is a gap between the first transmission mechanism 41 and the second transmission mechanism 42.

[0034] Further, the auxiliary pushing mechanism 40 includes an auxiliary lifting mechanism located on the placing part 2 and capable of lifting relative to the placing part 2 along the third direction, a push rod 401 capable of moving relative to the placing part 2 along the first direction and passing through the auxiliary lifting mechanism, and an auxiliary conveyor belt 402 located between the push rod 401 and the first transmission mechanism 41. The auxiliary lifting mechanism includes an auxiliary lifting motor and an auxiliary lifting frame connected to the auxiliary lifting motor. The material box is located inside the auxiliary lifting frame. When the auxiliary lifting motor operates, the auxiliary lifting frame can move up and down along the Z-axis direction, thereby driving the material box to move up and down along the Z-axis direction. The LED light sheets are arranged at intervals along the Z-axis direction inside the material box. The auxiliary lifting frame penetrates the placing part 2 along the Z-axis direction. When it is necessary to push the LED light sheets onto the auxiliary conveyor belt 402, the push rod 401 ejects towards the side close to the curing part along the X-axis, thereby pushing the bottommost LED light sheet in the material box onto the auxiliary conveyor belt 402. At this time, under the action of the auxiliary lifting motor, the auxiliary lifting frame descends one layer along the Z-axis, and the material box descends one layer along the Z-axis direction, so that the push rod 401 can sequentially convey the LED light sheets in the material box to the auxiliary conveyor belt 402 one by one; after the light curing is completed, the LED light sheets are sequentially conveyed to the auxiliary conveyor belt 402. Under the action of the auxiliary conveyor belt 402, the LED light sheets are conveyed back into the material box. At this time, the LED light sheets are located at the top layer of the material box. Under the action of the auxiliary lifting motor, the material box ascends one layer along the Z-axis direction, so that the LED light sheets located on the auxiliary conveyor belt 402 can sequentially return to the material box. Finally, the user can take away the material box.

[0035] Further, the first transfer mechanisms 41 are arranged at intervals along the first direction. Each first transfer mechanism 41 includes a bottom plate 411 located above the first curing part 31, an electric roller 412 that penetrates the bottom plate 411 and can rotate along the first direction, a first top block mechanism 413 that can move along the second direction and lift along the third direction relative to the bottom plate 411, a second top block mechanism 414 that can move along the first direction and lift along the third direction relative to the bottom plate 411, and a roller conveyor support 415 located on the side of the bottom plate 411 away from the placing part 2. The bottom plate 411 is located above the first curing part 31, and the electric rollers 412 penetrate the bottom plate 411 and are arranged at intervals. The cross-sections of several electric rollers 412 are rectangular and can rotate forward or backward along the X-axis direction. Similarly, the roller conveyor support 415 can also rotate forward or backward along the X-axis direction.

[0036] Optionally, a connecting shaft and a driving motor for connecting several electric rollers 412 are provided at the bottom of the curing part. The output end of the driving motor is connected to the connecting shaft. When the driving motor operates normally, the connecting shaft drives the electric rollers to rotate; a connecting shaft and a driving motor are also provided below the roller conveyor support 415. When the driving motor operates normally, the connecting shaft drives the roller conveyor support 415 to roll; the first top block mechanism 413 includes a first top block, a first cylinder that can expand and contract along the Z-axis direction, and a second cylinder that is connected to the first cylinder and can expand and contract along the Y-axis direction. The first top block can lift along the Z-axis direction through the first cylinder and move along the Y-axis direction through the second cylinder; similarly, the second top block mechanism 414 includes a second top block, a first cylinder that can expand and contract along the Z-axis direction, and a third cylinder that is connected to the first cylinder and can expand and contract along the X-axis direction. The second top block can lift along the Z-axis direction through the first cylinder and move along the X-axis direction through the third cylinder.

[0037] Further, the second transfer mechanisms 42 are arranged at intervals along the second direction and are correspondingly arranged with the first transfer mechanisms 41. Each second transfer mechanism 42 includes a conveyor belt mechanism 421 and a limiting top pin mechanism 422 for restricting the movement of the LED lamp chips and capable of lifting along the third direction relative to the second curing part 32. The conveyor belt mechanism 421 includes a first conveyor belt mechanism 4211 and a second conveyor belt mechanism 4212 correspondingly arranged with the first conveyor belt mechanism 4211. An installation gap 4213 is provided between the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212. The limiting top pin mechanisms 422 are arranged at intervals along the extending direction of the installation gap 4213. There are voids on both sides of the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212 close to the first transfer mechanism 41.

[0038] Optionally, a connecting shaft and a driving motor for connecting the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212 are provided at the bottom of the curing part. The output end of the driving motor is connected to the connecting shaft. When the driving motor operates normally, the connecting shaft drives the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212 to rotate synchronously left or right along the Y-axis direction; the limit ejector pin mechanism 422 includes a plurality of first cylinders that can be telescoped along the Z-axis direction located on the installation gap 4213, and limit ejector pins connected to the first cylinders. The limit ejector pins can be lifted and lowered along the Z-axis direction through the first cylinders, thereby restricting the movement of the LED lamp sheet.

[0039] Further, the first top block mechanism 413 includes a first lateral top block mechanism 4131 and a second lateral top block mechanism 4132 symmetrically arranged with the first lateral top block mechanism 4131. The first lateral top block mechanism 4131 and the second lateral top block mechanism 4132 are respectively located on both sides of the bottom plate 411. A lateral notch 4111 for the first lateral top block mechanism 4131 and the second lateral top block mechanism 4132 to move along the second direction is provided on the bottom plate 411; the second top block mechanism 414 includes a first longitudinal top block mechanism 4141 and a second longitudinal top block mechanism 4142 symmetrically arranged with the first longitudinal top block mechanism 4141. The first longitudinal top block mechanism 4141 and the second longitudinal top block mechanism 4142 are respectively located on the other two sides of the bottom plate 411. A longitudinal notch 4112 for the first longitudinal top block mechanism 4141 and the second longitudinal top block mechanism 4142 to move along the first direction is provided on the bottom plate 411.

[0040] Specifically, the first lateral top block mechanism 4131, the second lateral top block mechanism 4132, the first longitudinal top block mechanism 4141, and the second longitudinal top block mechanism 4142 are all located outside the bottom plate 411 and respectively correspond to the four sides of the bottom plate 411. When the first lateral top block mechanism 4131, the second lateral top block mechanism 4132, the first longitudinal top block mechanism 4141, and the second longitudinal top block mechanism 4142 rise along the Z-axis direction, they will not lift the LED lamp sheet on the bottom plate 411. When either one of the first lateral top block mechanism 4131 and the second lateral top block mechanism 4132 moves closer to the lateral notch 4111 along the Y-axis direction to push the LED lamp sheet towards the second transmission mechanism 42, the other one of the first lateral top block mechanism 4131 and the second lateral top block mechanism 4132 will not rise along the Z-axis direction; similarly, when either one of the first longitudinal top block mechanism 4141 and the second longitudinal top block mechanism 4142 moves closer to the longitudinal notch 4112 along the X-axis direction to push the LED lamp sheet to move, the other one of the first longitudinal top block mechanism 4141 and the second longitudinal top block mechanism 4142 will not rise along the Z-axis direction.

[0041] Further, an exhaust hole 12 communicating with the outside is also provided on the light box body 1.

[0042] Specifically, there are several exhaust holes 12 communicating with the outside inside the light box body 1. The arrangement of the exhaust holes 12 allows the air inside the light box body 1 to exchange with the outside air. When the ultraviolet light source irradiates the LED lamp sheet, the UV glue reacts with ultraviolet light to generate glue gas. If these gases are not discharged in time, they will accumulate inside the light box body 1, affecting the irradiation effect of ultraviolet light and the curing quality of the UV glue. By setting the exhaust holes 12, these harmful gases can be effectively discharged, thus maintaining the air circulation and freshness inside the light box body 1. Secondly, during the curing process of the UV glue, good air circulation helps to accelerate the curing speed and improve the curing quality. The arrangement of the exhaust holes 12 can accelerate the air flow inside the light box body 1, promote the reaction of the UV glue with oxygen in the air, and thus accelerate the curing process.

[0043] Optionally, in some other embodiments, the transmission assembly includes an auxiliary pushing mechanism 40 and a second transmission mechanism 42. The second transmission mechanism 42 is located inside the curing part and is arranged at intervals. Each second transmission mechanism 42 corresponds to an auxiliary pushing mechanism 40. Each auxiliary pushing mechanism 40 includes an auxiliary lifting mechanism located on the placing part 2 and capable of lifting along the Z-axis direction relative to the placing part 2, a push rod 401 capable of moving along the X-axis direction relative to the placing part 2 and passing through the auxiliary lifting mechanism, and an auxiliary conveyor belt 402. A material box for placing LED lamp sheets is provided on the auxiliary lifting mechanism. The LED lamp sheets are arranged at intervals along the Z-axis direction in the material box. Each second transmission mechanism 42 includes a first conveyor belt mechanism 4211, a second conveyor belt mechanism 4212 symmetrically arranged with the first conveyor belt mechanism 4211, and a limit ejector pin mechanism 422. There is an installation gap 4213 between the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212. The limit ejector pin mechanism 422 is arranged at intervals along the extending direction of the installation gap 4213. When the push rod 401 pushes the LED lamp sheets in the material box onto the auxiliary conveyor belt 402 one by one, under the action of the auxiliary conveyor belt 402, the LED lamp sheets can be transported between the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212, and move to the corresponding positions on the curing part under the action of the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212. The limit ejector pin mechanism 422 rises along the Z-axis direction, and two adjacent limit ejector pin mechanisms 422 can limit the movement of the LED lamp sheets, thereby fixing the LED lamp sheets at the corresponding positions on the curing part. When the LED lamp sheets cover the surface of the curing part, the LED lamp sheets are irradiated with an ultraviolet light source to cure the LED lamp sheets after dispensing. After the irradiation, the limit ejector pin mechanism 422 descends along the Z-axis direction, the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212 transport the LED lamp sheets back to the auxiliary conveyor belt 402 in sequence, the auxiliary conveyor belt 402 transports the LED lamp sheets back to the material box in sequence, and finally they are taken away by the user uniformly.

[0044] Optionally, in some other embodiments, the transmission component includes an auxiliary pushing mechanism 40 and a first transmission mechanism 41. The first transmission mechanisms 41 are located inside the curing part and are spaced apart. One auxiliary pushing mechanism 40 is correspondingly provided for each first transmission mechanism 41. Each auxiliary pushing mechanism 40 includes an auxiliary lifting mechanism located on the placement part 2 and capable of lifting relative to the placement part 2 along the Z-axis, a push rod 401 capable of moving relative to the placement part 2 along the X-axis and passing through the auxiliary lifting mechanism, and an auxiliary conveyor belt 402 located between the push rod 401 and the first transmission mechanism 41. A material box for placing LED lamp chips is provided on the auxiliary lifting mechanism. The LED lamp chips are spaced apart along the Z-axis in the material box. Each first transmission mechanism 41 includes a bottom plate 411, an electric roller 412 passing through the bottom plate 411 and capable of rotating along the X-axis, a second top block mechanism 414, and a roller conveyor support 415. The second top block mechanism 414 can lift and move along the X-axis relative to the bottom plate 411. The second top block mechanism 414 includes a first longitudinal top block mechanism 4141 and a second longitudinal top block mechanism 4142 symmetrically arranged with the first longitudinal top block mechanism 4141. The second longitudinal top block mechanism 4142 is located between the bottom plate 411 and the roller conveyor support 415. When the push rod 401 pushes the LED lamp chips in the material box onto the auxiliary conveyor belt 402 one by one, under the action of the auxiliary conveyor belt 402, the LED lamp chips can be transmitted onto the bottom plate 411. The second longitudinal top block mechanism 4142 can rise along the Z-axis to limit the movement of the LED lamp chips. When the LED lamp chips need to be conveyed from one bottom plate 411 to the next bottom plate 411, the first longitudinal top block mechanism 4141 rises along the Z-axis and moves along the X-axis closer to the side of the bottom plate 411, so as to push the LED lamp chips in the direction of the roller conveyor support 415. At this time, the second longitudinal top block mechanism 4142 does not rise along the Z-axis, and the roller conveyor support 415 rolls, cooperating with the electric roller 412, so as to convey the LED lamp chips from one bottom plate 411 to the next bottom plate 411. At this time, the first longitudinal top block mechanism 4141 on the next bottom plate 411 does not rise along the Z-axis, and the second longitudinal top block mechanism 4142 rises along the Z-axis to limit the movement of the LED lamp chips. When the curing part surface is covered with LED lamp chips, the LED lamp chips are irradiated with an ultraviolet light source to cure the LED lamp chips after dispensing. After the irradiation is completed, the rolling directions of the roller conveyor support 415 and the electric roller 412 are opposite, so that the LED lamp chips on the next bottom plate 411 move in the direction of the previous bottom plate 411. During this process, the second longitudinal top block mechanism 4142 on the next bottom plate 411 rises along the Z-axis and moves along the X-axis closer to the previous bottom plate 411 direction, and the first longitudinal top block mechanism 4141 does not rise along the Z-axis. The roller conveyor support 415 rolls, cooperating with the rolling of the electric roller 412, so as to convey the irradiated LED lamp chips from the next bottom plate 411 to the previous bottom plate 411.The second longitudinal top block mechanism 4142 on the previous bottom plate 411 rises in the Z-axis direction and moves in the direction close to the auxiliary conveyor belt 402 along the X-axis, and the first longitudinal top block mechanism 4141 does not rise in the Z-axis direction. The LED lamp sheets are successively conveyed back onto the auxiliary conveyor belt 402, and the auxiliary conveyor belt 402 successively conveys the LED lamp sheets back to the material box, and finally the user can take them away uniformly.

[0045] Optionally, in some other embodiments, the transmission component 4 includes an auxiliary pushing mechanism 40, a first transmission mechanism 41, and a second transmission mechanism 42. The auxiliary pushing mechanism 40 is connected to the first transmission mechanism 41. The first transmission mechanism 41 is located on one side of the curing part and is arranged at intervals along the X-axis direction. The second transmission mechanism 42 is arranged at intervals along the Y-axis direction and is correspondingly arranged with the first transmission mechanism 41. The auxiliary pushing mechanism 40 includes an auxiliary lifting mechanism located on the placing part 2 and capable of lifting relative to the placing part 2 along the Z-axis direction, a push rod 401 capable of moving relative to the placing part 2 along the X-axis direction and passing through the auxiliary lifting mechanism, and an auxiliary conveyor belt 402 located between the push rod 401 and the first transmission mechanism 41. A material box for placing LED lamp chips is provided on the auxiliary lifting mechanism, and the LED lamp chips are arranged at intervals along the Z-axis direction in the material box. The first transmission mechanism 41 includes a bottom plate 411, an electric roller 412 passing through the bottom plate 411 and capable of rotating along the X-axis direction, a first top block mechanism 413, a second top block mechanism 414, and a roller transmission bracket 415. The first top block mechanism 413 is located on the side away from the second transmission mechanism 42, and the first top block mechanism 413 can lift along the Z-axis direction and move along the Y-axis direction. The second top block mechanism 414 includes a first longitudinal top block mechanism 4141 and a second longitudinal top block mechanism 4142 symmetrically arranged with the first longitudinal top block mechanism 4141. The second longitudinal top block mechanism 4142 is located between the bottom plate 411 and the roller transmission bracket 415. Both the first longitudinal top block mechanism 4141 and the second longitudinal top block mechanism 4142 can lift along the Z-axis direction and move along the X-axis direction. The second transmission mechanism 42 includes a first conveyor belt mechanism 4211, a second conveyor belt mechanism 4212 symmetrically arranged with the first conveyor belt mechanism 4211, and a limit ejector pin mechanism 422. An installation gap 4213 is provided between the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212. The limit ejector pin mechanism 422 is arranged at intervals along the extending direction of the installation gap 4213. When the push rod 401 pushes the LED lamp chips in the material box onto the auxiliary conveyor belt 402 one by one, under the action of the auxiliary conveyor belt 402, the LED lamp chips can be transmitted onto the bottom plate 411. When the LED lamp chips are conveyed from the bottom plate 411 between the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212, the first top block mechanism 413 rises along the Z-axis direction and moves along the Y-axis direction close to the second transmission mechanism 42, so as to push the LED lamp chips to move between the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212, and move to the corresponding position on the second curing part 32 under the action of the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212. The limit ejector pin mechanism 422 rises along the Z-axis direction, and two adjacent limit ejector pin mechanisms 422 can limit the movement of the LED lamp chips;When the LED lamp sheet is conveyed from one bottom plate 411 to the next bottom plate 411, the first longitudinal top block mechanism 4141 rises along the Z-axis and moves closer to one side of the bottom plate 411 along the X-axis, so as to push the LED lamp sheet to move towards the roller conveying bracket 415. At this time, the second longitudinal top block mechanism 4142 does not rise along the Z-axis, and the roller conveying bracket 415 rolls, cooperating with the electric roller 412, so as to convey the LED lamp sheet from one bottom plate 411 to the next bottom plate 411. At this time, the first longitudinal top block mechanism 4141 on the next bottom plate 411 does not rise along the Z-axis, and the second longitudinal top block mechanism 4142 rises along the Z-axis to limit the movement of the LED lamp sheet. When the LED lamp sheet covers the surface of the curing part, the LED lamp sheet is irradiated with an ultraviolet light source to cure the LED lamp sheet after dispensing.

[0046] Further, as a preferred embodiment of the present invention rather than a limitation, the auxiliary pushing mechanism 40 is connected to the first transmission mechanism 41 and both are located in the middle position of the curing part. The second transmission mechanism 42 is respectively located on both sides of the first transmission mechanism 41 and is arranged at intervals along the Y-axis direction. The auxiliary pushing mechanism 40 includes an auxiliary lifting mechanism located on the placement part 2 and capable of lifting relative to the placement part 2 along the Z-axis direction, a push rod 401 capable of moving relative to the placement part 2 along the X-axis direction and passing through the auxiliary lifting mechanism, and an auxiliary conveyor belt 402 located between the push rod 401 and the first transmission mechanism 41. A material box for placing LED lamp chips is provided on the auxiliary lifting mechanism, and the LED lamp chips are arranged at intervals along the Z-axis direction in the material box. The first transmission mechanism 41 includes a bottom plate 411, an electric roller 412 passing through the bottom plate 411 and capable of rotating along the X-axis direction, a first top block mechanism 413, a second top block mechanism 414, and a roller conveyor bracket 415. The first top block mechanism 413 includes a first horizontal top block mechanism 4131 and a second horizontal top block mechanism 4132. The second top block mechanism 414 includes a first longitudinal top block mechanism 4141 and a second longitudinal top block mechanism 4142. The second transmission mechanism 42 includes a first conveyor belt mechanism 4211, a second conveyor belt mechanism 4212 symmetrically arranged with the first conveyor belt mechanism 4211, and a limit ejector pin mechanism 422. An installation gap 4213 is provided between the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212. The limit ejector pin mechanism 422 is arranged at intervals along the extending direction of the installation gap 4213. When the push rod 401 pushes the LED lamp chips in the material box one by one onto the auxiliary conveyor belt 402, under the action of the auxiliary conveyor belt 402, the LED lamp chips can be transmitted onto the bottom plate 411. If the LED lamp chips are conveyed from the bottom plate 411 between the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212 on the left side, the first horizontal top block mechanism 4131 rises along the Z-axis direction and moves along the Y-axis close to the second transmission mechanism 42 on the left side, and the second horizontal top block mechanism 4132 does not rise along the Z-axis direction, thereby pushing the LED lamp chips towards the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212 on the left side; if the LED lamp chips are conveyed from the bottom plate 411 between the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212 on the right side, the second horizontal top block mechanism 4132 rises along the Z-axis direction and moves along the Y-axis close to the second transmission mechanism 42 on the right side, and the first horizontal top block mechanism 4131 does not rise along the Z-axis direction, thereby pushing the LED lamp chips towards the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212 on the right side;When the LED lamp chip is conveyed from one bottom plate 411 to the next bottom plate 411, the first longitudinal top block mechanism 4141 rises along the Z-axis and moves closer to the side of the bottom plate 411 along the X-axis, so as to push the LED lamp chip to move towards the roller conveying bracket 415. At this time, the second longitudinal top block mechanism 4142 does not rise along the Z-axis, and the roller conveying bracket 415 rolls, cooperating with the electric roller 412, so as to convey the LED lamp chip from one bottom plate 411 to the next bottom plate 411. At this time, the first longitudinal top block mechanism 4141 on the next bottom plate 411 does not rise along the Z-axis, and the second longitudinal top block mechanism 4142 rises along the Z-axis to limit the movement of the LED lamp chip.;

[0047] As Figures 1 to 11 shown, the curing device includes a dehumidifying oven 72 for heating and baking the LED lamp chip; Specifically, the LED lamp chip irradiated by the light box body 1 is collected by an artificial collection box, and the boxes are uniformly placed into the dehumidifying oven 72 for dehumidifying and heating. The dehumidifying oven 72 can effectively remove the residual moisture in the LED lamp chip to ensure that the dryness of the LED lamp chip meets the standard. Secondly, the dehumidifying oven 72 has an efficient energy utilization and heat energy recovery system, which can minimize energy consumption while ensuring the dehumidifying effect. In addition, since the dehumidifying oven 72 can process multiple LED lamp chips at the same time, batch processing can be realized, further reducing the production cost.

[0048] As Figures 1 to 11 shown, the curing device further includes a baking tunnel furnace 73 connected to the transmission track mechanism 5. The baking tunnel furnace 73 includes a furnace body, a baking material transmission mechanism penetrating the furnace body, a heating device, a air supply device, and a tunnel furnace control system provided inside the furnace body; Specifically, both sides of the baking material transmission mechanism are respectively connected to the transmission track mechanism 5 with a gap, so that the LED lamp chip is conveyed into the furnace body for baking and heating, and the baked and heated LED lamp chip is conveyed out of the furnace body. The baking material transmission mechanism can be a conveyor belt or a roller path, etc. The heating device can adopt one of electric heating, gas, or natural gas, and preferably adopts the electric heating method. The air supply device includes a fan, an air inlet pipe, and an air outlet pipe. The air supply device is used to introduce external air into the furnace body and discharge the waste gas inside the furnace body. The tunnel furnace control system includes a tunnel furnace control host. The user can accurately adjust parameters such as the temperature inside the furnace body, the rotation speed of the baking material transmission mechanism, and the air volume through the tunnel furnace control host to ensure the baking and heating effect of the LED lamp chip.

[0049] As Figures 1 to 11The described detection and stripping equipment shown includes an AOI detection device 81. The AOI detection device 81 includes an optical imaging system for detecting the quality of LED lamp chips, an AOI mechanical motion system for placing LED lamp chips and stripping defective products, and an image processing system for controlling the operation of the AOI mechanical motion system; Specifically, the optical imaging system includes a light source for detecting the quality of LED lamp chips, an optical lens for collecting the reflected light on the surface of the LED lamp chips, and an image sensor. The AOI mechanical motion system includes a stage for placing the LED lamp chips to be detected and a stripping mechanism for stripping defective products. The image processing system includes an image acquisition card and an AOI computer. The stage is connected to the transmission track mechanism 5 with a gap. Under the action of the transmission track mechanism 5, the LED lamp chips are conveyed to the stage. The stage can move precisely in the horizontal and vertical directions to comprehensively detect different areas of the LED lamp chips. Usually, high-precision motors, lead screws, guide rails and other components are used in cooperation so that the stage can move relatively. The light source provides the light required for detection, and the optical lens is used to collect the light reflected from the surface of the LED lamp chips and focus it on the image sensor. The image sensor can convert the optical signal into a digital signal. Under the action of the image acquisition card, the digital signal is transmitted to the AOI computer. The AOI computer has functions such as image analysis, feature extraction, and defect recognition. By comparing the collected image with a pre-set standard image or model through an algorithm, it is judged whether there is an abnormality in the LED lamp chips. If there is an abnormality, the AOI computer will control the stripping mechanism to move to a specified position and apply an appropriate force to strip the defective lamp chips from the substrate. The stripping mechanism can be a mechanical mechanism such as a suction cup or a gripper, and finally the LED lamp chips without abnormalities are output.

[0050] As Figures 1 to 11 The described detection and stripping equipment shown also includes a leg cutting machine 82 for cutting LED lamp chips into single finished lamp beads. The leg cutting machine 82 includes a feeding mechanism connected to the transmission track mechanism 5, a cutting table connected to the feeding mechanism, a limiting cutting mechanism for fixing the LED lamp chips on the cutting table, a cutting mechanism for cutting the LED lamp chips, a discharging mechanism, and a cutting control host; Specifically, there is a gap between the transfer track mechanism 5 and the feeding mechanism, and the transfer track mechanism 5 can transfer the LED lamp chips to the feeding mechanism. The feeding mechanism can ensure that the LED lamp chips enter the cutting table continuously and stably. The limiting cutting mechanism is located on the cutting table and is used to ensure the accuracy of the position of the LED lamp chips during the cutting process. The limiting cutting mechanism is formed by combining a cutting limiting plate and a cutting limiting ejector pin. The cutting control host is used to realize the automatic operation and precise control of the equipment. The cutting control host realizes the precise control of parameters such as cutting speed and cutting depth through programming, so as to control the cutting mechanism to cut the LED lamp chips. The cutting mechanism is formed by the cooperation of components such as a cutting motor, a cutting tool, and a bracket. Finally, the single finished lamp beads are conveyed to the outside of the cutting table by the discharging mechanism for the user to collect. In addition, the waste treatment mechanism includes a waste channel connected to the cutting table and a waste box connected to the waste channel. The waste generated during the cutting process of the LED lamp chips enters the waste box through the waste channel, which is beneficial to ensuring the cleanliness and safety of the working environment of the lead cutting machine.

[0051] As Figures 1 to 11 shown in the LED lamp chip production process, includes the following steps: S1: The transfer track mechanism 5 conveys the LED lamp chips to the lower part of the dispensing machine 6, and the dispensing machine 6 drips the UV glue onto the LED lamp chips, thus completing the dispensing process; S2: Place the dispensed LED lamp chips on the curing equipment, and cure the UV glue on the LED lamp chips through the curing equipment; S3: Place the cured LED lamp chips on the detection and stripping equipment. The detection and stripping equipment identifies the quality of the LED lamp chips, strips the abnormal products, and the remaining non-abnormal LED lamp chips are cut into single finished lamp beads by the lead cutting machine 82.

[0052] Optionally, in some other embodiments, step S1 further includes the following steps: S11: The feeding push rod in the feeding mechanism 61 of the dispensing machine pushes the LED lamp chips in the material box to the transfer track mechanism 5. The feeding drive motor drives the feeding lifting frame to lift and lower along the Z-axis direction, and the material box in the feeding lifting frame is lifted and lowered synchronously, so that the feeding push rod conveys the LED lamp chips to the transfer track mechanism 5 one by one. The transfer track mechanism 5 conveys each LED lamp chip to the lower part of the dispensing machine 6 for the dispensing machine 6 to dispense glue on the LED lamp chips. The average dispensing time of the dispensing machine 6 for a single LED lamp chip is 8 seconds - 10 seconds. The LED lamp chips after dispensing are conveyed to the curing equipment in turn under the action of the transfer track mechanism 5; Step S2 further includes the following steps: S21: The curing equipment is a UV light lamp 71. The UV light lamp 71 provides ultraviolet light to irradiate the LED lamp chips located on the transfer track mechanism 5 for 20 seconds - 30 seconds. The irradiated LED lamp chips are conveyed to the detection and stripping equipment in turn through the transfer track mechanism 5; Step S3 further includes the following steps: S31: The stripping device includes an AOI detection device 81 and a lead cutting machine 82. Under the action of the transmission track mechanism 5, the LED lamp chips are conveyed to the loading platform. The light source in the AOI detection device 81 irradiates the surface of the LED lamp chips, and the optical lens collects the light reflected from the surface of the LED lamp chips and focuses it on the image sensor. The image sensor can convert the optical signal into a digital signal. Under the action of the image acquisition card, the digital signal is transmitted to the AOI computer. The AOI computer identifies and determines whether the quality of the LED lamp chips is abnormal, and controls the stripping mechanism to strip the abnormal lamp chips. The remaining LED lamp chips with qualified quality are conveyed to the lead cutting machine 82 through the transmission track mechanism 5; S32: The transmission track mechanism 5 conveys the LED lamp chips to the loading mechanism in the lead cutting machine 82. The LED lamp chips are conveyed to the cutting table through the loading mechanism. The limit cutting mechanism restricts the position of the LED lamp chips on the cutting table. The cutting control host controls the cutting mechanism to cut the LED lamp chips to form single finished lamp beads.

[0053] Further, compared with the traditional method of using epoxy glue or silicone glue for dispensing and then using an oven to heat and cure the LED lamp chips, the traditional method requires heating in an oven for 5 hours, including baking for 1 hour at 80 °C and baking for 4 hours at 160 °C. In the present invention, after using UV glue for dispensing, UV light is used for irradiation and curing by the UV light lamp 71. It only takes about 40 seconds from dispensing to curing, greatly shortening the curing time. Moreover, heating in an oven for 5 hours consumes a large amount of electric energy, while irradiation and curing by the UV light lamp 71 only takes 20 seconds - 30 seconds, which is beneficial to reducing energy consumption.

[0054] Optionally, in some other embodiments, step S1 further includes the following steps: S11: The feeding push rod in the feeding mechanism 61 of the dispensing machine pushes the LED lamp chips in the cartridge to the transmission track mechanism 5. The feeding drive motor drives the feeding lifting frame to lift along the Z-axis direction, and the cartridge in the feeding lifting frame synchronously lifts, so that the feeding push rod conveys the LED lamp chips to the transmission track mechanism 5 one by one. The transmission track mechanism 5 conveys each LED lamp chip to the lower part of the dispensing machine 6 for the dispensing machine 6 to dispense glue on the LED lamp chips. The average dispensing time for a single LED lamp chip by the dispensing machine 6 is 8 seconds - 10 seconds. The LED lamp chips after dispensing are conveyed to the curing device in sequence under the action of the transmission track mechanism 5; Step S2 further includes the following steps: S21: The curing device includes a UV light lamp 71, and the UV light lamp 71 provides ultraviolet light to irradiate the LED lamp chips located on the transmission track mechanism 5 for 20 seconds - 30 seconds; S22: The curing device includes a baking tunnel furnace 73. The LED lamp chips after the irradiation are transported to the baking material transport mechanism in the baking tunnel furnace 73 through the transport track mechanism 5. The baking material transport mechanism penetrates the furnace body, so that the LED lamp chips can be heated in the furnace body for 3 to 10 minutes to further improve the quality of the lamp chips. Step S3 further includes the following steps: S31: The detection and stripping device includes an AOI detection device 81 and a lead cutting machine 82. Under the action of the transport track mechanism 5, the LED lamp chips after baking and heating are transported to the loading platform. The light source in the AOI detection device 81 irradiates the surface of the LED lamp chips, the optical lens collects the light reflected from the surface of the LED lamp chips, and focuses it on the image sensor. The image sensor can convert the optical signal into a digital signal. Under the action of the image acquisition card, the digital signal is transmitted to the AOI computer. The AOI computer identifies and determines whether the quality of the LED lamp chips is abnormal, and controls the stripping mechanism to strip the abnormal lamp chips. The remaining LED lamp chips with qualified quality are transported to the lead cutting machine 82 through the transport track mechanism 5. S32: The transport track mechanism 5 transports the LED lamp chips to the loading mechanism in the lead cutting machine 82. The LED lamp chips are transported to the cutting table through the loading mechanism. The limit cutting mechanism restricts the position of the LED lamp chips on the cutting table. The cutting control host controls the cutting mechanism to cut the LED lamp chips to form single finished lamp beads.

[0055] Further, compared with the traditional method of using epoxy glue or silicone glue for dispensing and then using an oven to heat and cure the LED lamp chips, the traditional method requires heating in an oven for 5 hours, including baking at 80 °C for 1 hour and baking at 160 °C for 4 hours. In the present invention, by using UV glue for dispensing and then irradiating with a UV light 71 and cooperating with heating and baking in the baking tunnel furnace 73, it only takes 10 to 11 minutes from dispensing to curing, greatly shortening the curing time required, effectively improving the production efficiency of the LED lamp chips. In addition, heating in an oven for 5 hours consumes a large amount of electric energy. The UV light 71 irradiation for curing only takes 20 to 30 seconds, and the heating and baking in the baking tunnel furnace 73 only takes 3 to 10 minutes, which is beneficial to reducing energy consumption and lowering the energy cost in the production process.

[0056] Optionally, in some other embodiments, step S1 further includes the following steps: S11: The dispensing device includes a dispensing machine feeding mechanism 61. The feeding push rod in the dispensing machine feeding mechanism 61 pushes the LED lamp chips in the material box to the transport track mechanism 5. The feeding drive motor drives the feeding lifting frame to lift along the Z-axis direction, and the material box in the feeding lifting frame is lifted synchronously, so that the feeding push rod transports the LED lamp chips to the transport track mechanism 5 one by one. S12: The dispensing device includes a dispenser 6. The conveying track mechanism 5 conveys each LED lamp sheet to be dispensed to the position below the dispenser 6, and the dispenser dispenses glue on the LED lamp sheet; S13: The dispensing device includes a discharge mechanism 62 of the dispenser. The LED lamp sheets after dispensing are conveyed into the material box in the discharge lifting frame under the action of the conveying track mechanism 5. For each LED lamp sheet entering the material box, the discharge drive motor drives the discharge lifting frame to rise one layer along the Z-axis direction, and the material box rises one layer along the Z-axis direction, so that the LED lamp sheets after dispensing can enter the material box in sequence and be arranged at intervals along the Z-axis direction; Step S2 further includes the following steps: S21: The curing device includes a plurality of light boxes 1 arranged at intervals along the Z-axis direction in the installation frame 70. The operator collects the material boxes in the discharge lifting frame uniformly and places them on each light box 1; S211: The material box is placed in the auxiliary lifting frame. The push rod 401 on the light box 1 ejects towards the side close to the curing part along the X-axis, so as to push the lowermost LED lamp sheet in the material box onto the auxiliary conveyor belt 402. At this time, the auxiliary lifting motor drives the auxiliary lifting frame to descend one layer along the Z-axis direction, and the material box descends one layer, so that the push rod 401 can sequentially convey the LED lamp sheets in the material box to the auxiliary conveyor belt 402 one by one; S212: The auxiliary conveyor belt 402 conveys the LED lamp sheet to the bottom plate 411. When the LED lamp sheet is conveyed between the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212 on the left side from the bottom plate 411, the first transverse top block mechanism 4131 rises along the Z-axis direction and moves along the Y-axis towards the second conveying mechanism 42 on the left side. The second transverse top block mechanism 4132 does not rise along the Z-axis direction, so as to push the LED lamp sheet towards the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212 on the left side. When the LED lamp sheet moves to the corresponding position, the limit ejector pin mechanism 422 rises along the Z-axis direction, and two adjacent limit ejector pin mechanisms 422 can limit the movement of the LED lamp sheet; When the LED lamp sheet is conveyed between the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212 on the right side from the bottom plate 411, the second transverse top block mechanism 4132 rises along the Z-axis direction and moves along the Y-axis towards the second conveying mechanism 42 on the right side. The first transverse top block mechanism 4131 does not rise along the Z-axis direction, so as to push the LED lamp sheet towards the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212 on the right side. When the LED lamp sheet moves to the corresponding position, the limit ejector pin mechanism 422 rises along the Z-axis direction, and two adjacent limit ejector pin mechanisms 422 can limit the movement of the LED lamp sheet; When the LED lamp sheet is conveyed from the first bottom plate 411 to the second bottom plate 411 (the first bottom plate is close to the placement part 2, and the second bottom plate is far from the placement part 2), the first longitudinal jacking mechanism 4141 on the first bottom plate 411 rises along the Z-axis and moves closer to the side of the bottom plate 411 along the X-axis, and the second longitudinal jacking mechanism 4142 does not rise along the Z-axis. The roller conveying bracket 415 rolls and cooperates with the electric roller 412 to convey the LED lamp sheet from the first bottom plate 411 to the second bottom plate 411. At this time, the first longitudinal jacking mechanism 4141 on the second bottom plate 411 does not rise along the Z-axis, and the second longitudinal jacking mechanism 4142 rises along the Z-axis to limit the movement of the LED lamp sheet; S213: The ultraviolet light source in the light box body 1 irradiates the LED lamp sheet for 10 to 15 minutes; S214: After the illumination ends, the limit ejector pin mechanism 422 descends along the Z-axis. Under the action of the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212, the LED lamp sheets return to the bottom plate 411 one by one. The electric roller 412 rotates in the reverse direction, and the LED lamp sheets return to the auxiliary conveyor belt 402; When the LED lamp sheet on the second bottom plate 411 returns to the first bottom plate 411, the second longitudinal jacking mechanism 4142 on the second bottom plate 411 rises along the Z-axis and moves closer to the second bottom plate along the X-axis, and the first longitudinal jacking mechanism 4141 does not rise along the Z-axis. The roller conveying bracket 415 on the second bottom plate 411 cooperates with the electric roller 412 to convey the LED lamp sheet on the second bottom plate 411 back to the first bottom plate 411; S215: The auxiliary conveyor belt 402 rotates in the reverse direction, and the LED lamp sheets move towards the material box one by one. For each LED lamp sheet entering the material box, the auxiliary lifting motor drives the auxiliary lifting frame to rise one layer along the Z-axis, and the material box rises one layer so that the LED lamp sheets can enter the material box in sequence and be arranged at intervals along the Z-axis; Step S3 further includes the following steps: S31: Manually identify the quality of the LED lamp sheets in the material box uniformly, and manually strip the LED lamp sheets with abnormal quality; S32: The stripping and feeding equipment includes a leg cutting machine 82. Manually place the LED lamp sheets with normal quality on the feeding mechanism in the leg cutting machine 82. The LED lamp sheets are transmitted to the cutting table through the feeding mechanism, and the limit cutting mechanism restricts the position of the LED lamp sheets on the cutting table. The cutting control host controls the cutting mechanism to cut the LED lamp sheets to form single finished lamp beads.

[0057] Furthermore, compared with the traditional method of using epoxy glue or silicone glue for dispensing and then using an oven to heat-cure the LED lamp chips, the traditional method requires heating in an oven for 5 hours, including baking for 1 hour at 80 °C and an additional 4 hours at 160 °C. In contrast, in the present invention, after UV glue is dispensed, the dispensed LED lamp chips are cured by irradiating with the light box 1. It only takes about 15 minutes from dispensing to curing, greatly shortening the curing time. In addition, heating in an oven for 5 hours consumes a large amount of electric energy, while irradiating and curing with the light box 1 only takes 10 to 15 minutes, which is beneficial to reducing energy consumption. Secondly, compared with the combination of the dispenser 6 and the UV light 71, since the transfer track mechanism 5 is used to uniformly convey the LED lamp chips, the dispenser 6 needs to cooperate with the irradiation time of the UV light, so the dispensing time for each single LED lamp chip is on average 8 to 10 seconds. In the combination of the dispenser 6 and the light box 1 in this embodiment, since the dispensed LED lamp chips are uniformly collected by hand and placed on the light box 1, the dispenser 6 can shorten the dispensing time, thereby improving the dispensing efficiency.

[0058] Optionally, in some other embodiments, step S1 further includes the following steps: S11: The dispensing device includes a dispenser feeding mechanism 61. The feeding push rod in the dispenser feeding mechanism 61 pushes the LED lamp chips in the material box to the transfer track mechanism 5. The feeding drive motor drives the feeding lifting frame to lift along the Z-axis direction, and the material box in the feeding lifting frame is lifted synchronously, so that the feeding push rod conveys the LED lamp chips to the transfer track mechanism 5 one by one; S12: The dispensing device includes a dispenser 6. The transfer track mechanism 5 conveys each LED lamp chip to be dispensed under the dispenser 6, and the dispenser dispenses the LED lamp chips; S13: The dispensing device includes a dispenser discharging mechanism 62. The dispensed LED lamp chips are conveyed into the material box in the discharging lifting frame under the action of the transfer track mechanism 5. Each time a LED lamp chip enters the material box, the discharging drive motor drives the discharging lifting frame to rise one layer along the Z-axis direction, and the material box rises one layer along the Z-axis direction, so that the dispensed LED lamp chips can enter the material box in sequence and be spaced along the Z-axis direction; Step S2 further includes the following steps: S21: The curing device includes a plurality of light boxes 1 spaced along the Z-axis direction in the mounting frame 70. The material boxes in the discharging lifting frame are uniformly collected by hand and placed on each light box 1; S211: The material box is placed inside the auxiliary lifting frame. The push rod 401 on the light box body 1 ejects towards the side close to the curing part along the X-axis, thereby pushing the bottommost LED lamp sheet in the material box towards the auxiliary conveyor belt 402. At this time, the auxiliary lifting motor drives the auxiliary lifting frame to descend one layer along the Z-axis, and the material box descends one layer, so that the push rod 401 can sequentially convey the LED lamp sheets in the material box to the auxiliary conveyor belt 402 one by one; S212: The auxiliary conveyor belt 402 conveys the LED lamp sheet to the bottom plate 411. When the LED lamp sheet is conveyed between the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212 on the left side from the bottom plate 411, the first transverse top block mechanism 4131 rises along the Z-axis and moves along the Y-axis towards the second conveying mechanism 42 on the left side. The second transverse top block mechanism 4132 does not rise along the Z-axis, thereby pushing the LED lamp sheet towards the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212 on the left side. When the LED lamp sheet moves to the corresponding position, the limit ejector pin mechanism 422 rises along the Z-axis, and two adjacent limit ejector pin mechanisms 422 can limit the movement of the LED lamp sheet; When the LED lamp sheet is conveyed between the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212 on the right side from the bottom plate 411, the second transverse top block mechanism 4132 rises along the Z-axis and moves along the Y-axis towards the second conveying mechanism 42 on the right side. The first transverse top block mechanism 4131 does not rise along the Z-axis, thereby pushing the LED lamp sheet towards the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212 on the right side. When the LED lamp sheet moves to the corresponding position, the limit ejector pin mechanism 422 rises along the Z-axis, and two adjacent limit ejector pin mechanisms 422 can limit the movement of the LED lamp sheet; When the LED lamp sheet is conveyed from the first bottom plate 411 to the second bottom plate 411 (the first bottom plate 411 is close to the placement part 2, and the second bottom plate 411 is far from the placement part 2), the first longitudinal top block mechanism 4141 on the first bottom plate 411 rises along the Z-axis and moves along the X-axis towards the side close to the bottom plate 411, and the second longitudinal top block mechanism 4142 does not rise along the Z-axis. The roller conveyor bracket 415 rolls, cooperating with the electric roller 412, thereby conveying the LED lamp sheet from the first bottom plate 411 to the second bottom plate 411. At this time, the first longitudinal top block mechanism 4141 on the second bottom plate 411 does not rise along the Z-axis, and the second longitudinal top block mechanism 4142 rises along the Z-axis to limit the movement of the LED lamp sheet; S213: The ultraviolet light source in the light box body 1 irradiates the LED lamp sheet for 10 - 15 minutes; S214: After the illumination ends, the limit ejector mechanism 422 descends along the Z-axis. Under the action of the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212, the LED lamp chips return to the bottom plate 411 one by one. The electric roller 412 rotates in the reverse direction, and the LED lamp chips return to the auxiliary conveyor belt 402; When the LED lamp chips on the second bottom plate 411 return to the first bottom plate 411, the second longitudinal top block mechanism 4142 on the second bottom plate 411 rises along the Z-axis and moves closer to the second bottom plate along the X-axis, while the first longitudinal top block mechanism 4141 does not rise along the Z-axis. The roller conveyor bracket 415 on the second bottom plate 411 cooperates with the electric roller 412 to convey the LED lamp chips on the second bottom plate 411 back to the first bottom plate 411; S215: The auxiliary conveyor belt 402 rotates in the reverse direction, and the LED lamp chips move towards the material box one by one. Each time a LED lamp chip enters the material box, the auxiliary lifting motor drives the auxiliary lifting frame to rise one layer along the Z-axis, and the material box rises one layer, so that the LED lamp chips can enter the material box in sequence and be arranged at intervals along the Z-axis; Step S3 further includes the following steps: S31: The detection and stripping equipment includes an AOI detection device 81 and a lead cutting machine 82. The cured LED lamp chips are manually placed on the AOI detection device 81 uniformly. The light source in the AOI detection device 81 irradiates the surface of the LED lamp chips, and the optical lens collects the light reflected from the surface of the LED lamp chips and focuses it on the image sensor. The image sensor can convert the optical signal into a digital signal. Under the action of the image acquisition card, the digital signal is transmitted to the AOI computer. The AOI computer identifies and determines whether the quality of the LED lamp chips is abnormal, and controls the stripping mechanism to strip the abnormal lamp chips. The remaining qualified LED lamp chips are transmitted to the lead cutting machine 82 through the transmission track mechanism 5; S32: The transmission track mechanism 5 transmits the LED lamp chips to the feeding mechanism in the lead cutting machine 82. The LED lamp chips are transmitted to the cutting table through the feeding mechanism. The limit cutting mechanism restricts the position of the LED lamp chips on the cutting table, and the cutting control host controls the cutting mechanism to cut the LED lamp chips to form single finished lamp beads.

[0059] Optionally, in some other embodiments, step S1 further includes the following steps: S11: The dispensing equipment includes a dispensing machine feeding mechanism 61. The feeding push rod in the dispensing machine feeding mechanism 61 pushes the LED lamp chips in the material box to the transmission track mechanism 5. The feeding drive motor drives the feeding lifting frame to lift and lower along the Z-axis, and the material box in the feeding lifting frame rises and falls synchronously, so that the feeding push rod conveys the LED lamp chips to the transmission track mechanism 5 one by one; S12: The dispensing device includes a dispenser 6. The transfer track mechanism 5 conveys each LED lamp sheet to be dispensed to the position below the dispenser 6, and the dispenser dispenses glue on the LED lamp sheet. S13: The dispensing device includes a discharge mechanism 62 of the dispenser. The LED lamp sheets after dispensing are conveyed to the material box in the discharge lifting frame under the action of the transfer track mechanism 5. For each LED lamp sheet entering the material box, the discharge drive motor drives the discharge lifting frame to rise one layer along the Z-axis direction, and the material box rises one layer along the Z-axis direction, so that the LED lamp sheets after dispensing can enter the material box in sequence and be arranged at intervals along the Z-axis direction. Step S2 further includes the following steps: S21: The curing device includes a plurality of light boxes 1 arranged at intervals along the Z-axis direction in the installation frame 70. Workers collect the material boxes in the discharge lifting frame uniformly and place them on each light box 1. S211: The material box is placed in the auxiliary lifting frame. The push rod 401 on the light box 1 ejects towards the curing part side along the X-axis, so as to push the lowermost layer of LED lamp sheets in the material box onto the auxiliary conveyor belt 402. At this time, the auxiliary lifting motor drives the auxiliary lifting frame to descend one layer along the Z-axis direction, and the material box descends one layer, so that the push rod 401 can sequentially convey the LED lamp sheets in the material box to the auxiliary conveyor belt 402 one by one. S212: The auxiliary conveyor belt 402 conveys the LED lamp sheet to the bottom plate 411. When the LED lamp sheet is conveyed between the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212 on the left side from the bottom plate 411, the first transverse jacking mechanism 4131 rises along the Z-axis direction and moves along the Y-axis towards the second conveyor mechanism 42 on the left side. The second transverse jacking mechanism 4132 does not rise along the Z-axis direction, so as to push the LED lamp sheet towards the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212 on the left side. When the LED lamp sheet moves to the corresponding position, the limit ejector pin mechanism 422 rises along the Z-axis direction, and two adjacent limit ejector pin mechanisms 422 can limit the movement of the LED lamp sheet. When the LED lamp sheet is conveyed between the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212 on the right side from the bottom plate 411, the second transverse jacking mechanism 4132 rises along the Z-axis direction and moves along the Y-axis towards the second conveyor mechanism 42 on the right side. The first transverse jacking mechanism 4131 does not rise along the Z-axis direction, so as to push the LED lamp sheet towards the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212 on the right side. When the LED lamp sheet moves to the corresponding position, the limit ejector pin mechanism 422 rises along the Z-axis direction, and two adjacent limit ejector pin mechanisms 422 can limit the movement of the LED lamp sheet. When the LED lamp sheet is conveyed from the first bottom plate 411 to the second bottom plate 411 (the first bottom plate 411 is close to the placing part 2, and the second bottom plate 411 is far from the placing part 2), the first longitudinal top block mechanism 4141 on the first bottom plate 411 rises along the Z-axis and moves close to one side of the bottom plate 411 along the X-axis, and the second longitudinal top block mechanism 4142 does not rise along the Z-axis. The roller conveyor bracket 415 rolls and cooperates with the electric roller 412 to convey the LED lamp sheet from the first bottom plate 411 to the second bottom plate 411. At this time, the first longitudinal top block mechanism 4141 on the second bottom plate 411 does not rise along the Z-axis, and the second longitudinal top block mechanism 4142 rises along the Z-axis to limit the movement of the LED lamp sheet; S213: The ultraviolet light source in the light box body 1 irradiates the LED lamp sheet for 2 to 3 minutes; S214: After the illumination is over, the limit ejector pin mechanism 422 descends along the Z-axis. The LED lamp sheets return to the bottom plate 411 one by one under the action of the first conveyor belt mechanism 4211 and the second conveyor belt mechanism 4212. The electric roller 412 rotates in the reverse direction, and the LED lamp sheets return to the auxiliary conveyor belt 402; When the LED lamp sheet on the second bottom plate 411 returns to the first bottom plate 411, the second longitudinal top block mechanism 4142 on the second bottom plate 411 rises along the Z-axis and moves close to the second bottom plate along the X-axis, and the first longitudinal top block mechanism 4141 does not rise along the Z-axis. The roller conveyor bracket 415 on the second bottom plate 411 cooperates with the electric roller 412 to convey the LED lamp sheet on the second bottom plate 411 back to the first bottom plate 411; S215: The auxiliary conveyor belt 402 rotates in the reverse direction, and the LED lamp sheets move one by one towards the material box. Every time a LED lamp sheet enters the material box, the auxiliary lifting motor drives the auxiliary lifting frame to rise one layer along the Z-axis, and the material box rises one layer so that the LED lamp sheets can enter the material box in sequence and be arranged at intervals along the Z-axis; S22: The curing device includes a dehumidifying oven 72. The LED lamp sheets after illumination are uniformly placed in the dehumidifying oven 72 by workers for heating and baking. The LED lamp sheets are baked in an environment of 160 °C for 0.5 hours, and the baked LED lamp sheets are collected by workers again; Step S3 also includes the following steps: S31: The stripping equipment includes an AOI inspection device 81 and a lead cutting machine 82. Workers uniformly place the LED lamp chips after curing on the AOI inspection device 81. The light source in the AOI inspection device 81 irradiates the surface of the LED lamp chips, and the optical lens collects the light reflected from the surface of the LED lamp chips and focuses it on the image sensor. The image sensor can convert the optical signal into a digital signal. Under the action of the image acquisition card, the digital signal is transmitted to the AOI computer. The AOI computer identifies and determines whether the quality of the LED lamp chips is abnormal, and controls the stripping mechanism to strip the abnormal lamp chips. The remaining LED lamp chips with qualified quality are transmitted to the lead cutting machine 82 through the transmission track mechanism 5; S32: The transmission track mechanism 5 transmits the LED lamp chips to the feeding mechanism in the lead cutting machine 82. The LED lamp chips are transmitted to the cutting table through the feeding mechanism. The limit cutting mechanism restricts the position of the LED lamp chips on the cutting table. The cutting control host controls the cutting mechanism to cut the LED lamp chips to form single finished lamp beads.

[0060] Further, compared with the traditional method of using epoxy glue or silicone glue for dotting and then using an oven to heat and cure the LED lamp chips, the traditional method requires heating in an oven for 5 hours, including baking for 1 hour at 80°C and additionally baking for 4 hours at 160°C. In this invention, by using UV glue for dotting and then using the light box 1 to irradiate the dotting LED lamp chips with light, and cooperating with heating and baking in the dehumidifying oven 72 at 160°C for 0.5 hours, it only takes about 0.5 hours from dotting to curing. While greatly shortening the curing time, it can further improve the quality of the LED lamp chips. In addition, heating in the oven for 5 hours consumes a large amount of electrical energy, while the light box 1 only needs 2 to 3 minutes for irradiation and the dehumidifying oven 72 needs 0.5 hours for baking and heating, which is beneficial to reducing energy consumption.

[0061] The above only uses examples to further illustrate the technical content of the present invention to make it easier for readers to understand, but it does not mean that the implementation mode of the present invention is limited to this. Any technical extension or re-creation based on the present invention is protected by the present invention. The protection scope of the present invention is subject to the claims.

Claims

1. LED lamp production equipment, characterized by: include: Glue dispensing equipment, which is used to dispense glue to LED light sheets; A curing device, which is arranged on one side of the glue dispensing device and is used to cure the glue on the LED light sheet; A detection and stripping device, which is arranged on one side of the curing device, and is used to cut qualified LED lamp sheets into single finished lamp beads; A transmission track mechanism (5) is provided between the glue dispensing device, the curing device and the detection and stripping device and is used for transmitting the LED light sheet.

2. The LED light sheet production equipment according to claim 1, characterized in that: The glue dispensing device comprises a glue dispensing machine (6) located above the transmission track mechanism (5), the glue dispensing machine (6) comprising an air pump for providing pressure, a glue cartridge for storing UV glue, an air pipe located between the air pump and the glue cartridge, a glue dispensing head for dispensing glue on the LED light sheet, and a glue feed block connecting the glue cartridge and the glue dispensing head.

3. The LED light sheet production equipment according to claim 2, characterized in that: The glue dispensing device comprises a glue dispensing machine feeding mechanism (61) located on one side of the glue dispensing machine (6), and the glue dispensing machine feeding mechanism (61) comprises a feeding drive motor that can be raised and lowered along a third direction, a feeding lifting frame connected to the feeding drive motor, and a feeding push rod that passes through the feeding lifting frame and is connected to the transmission track mechanism (5).

4. The LED light sheet production equipment according to claim 1, characterized in that: The curing device comprises a UV light lamp (71) located above the transport track mechanism (5) and capable of providing ultraviolet light.

5. The LED light sheet production equipment according to claim 1, characterized in that: The curing device comprises an illumination box body (1) and a mounting frame (70) for placing the illumination box body (1); the illumination box body (1) comprises a placement portion (2) for placing an LED light sheet, a curing portion (3) connected to the placement portion (2), a transmission component (4) located between the placement portion (2) and the curing portion (3), and an ultraviolet light source; the LED light sheet on the placement portion (2) is transported to the curing portion (3) via the transmission component (4), so that the ultraviolet light source can irradiate the LED light sheet on the curing portion (3).

6. The LED light sheet production equipment according to claim 1, characterized in that: The curing equipment comprises a dehumidification oven (72) for heating and baking the LED light sheet.

7. The LED light sheet production equipment according to claim 1, characterized in that: The curing equipment further comprises a baking tunnel furnace (73) connected to the transmission track mechanism (5), the baking tunnel furnace (73) comprising a furnace body, a baking material transmission mechanism penetrating the furnace body, a heating device and an air supply device arranged inside the furnace body, and a tunnel furnace control system.

8. The LED light sheet production equipment according to claim 1, characterized in that: The detection and stripping equipment comprises an AOI detection equipment (81), wherein the AOI detection equipment (81) comprises an optical imaging system for detecting the quality of LED light sheets, an AOI mechanical motion system for placing LED light sheets and stripping abnormal products, and an image processing system for controlling the operation of the AOI mechanical motion system.

9. The LED light sheet production equipment according to claim 1, characterized in that: The detection and stripping equipment also includes a foot cutting machine (82) for cutting the LED lamp piece into single finished lamp beads, and the foot cutting machine (82) includes a feeding mechanism connected to the transmission track mechanism (5), a cutting table connected to the feeding mechanism, a limiting cutting mechanism for fixing the LED lamp piece on the cutting table, a cutting mechanism for cutting the LED lamp piece, a discharging mechanism, and a cutting control host.

10. The LED lamp production process is characterized by: The steps include: S1: The LED light sheet is transported to the bottom of the glue dispensing machine (6) through the transmission track mechanism (5), and the glue dispensing machine (6) drips UV glue onto the LED light sheet, thereby completing the glue dispensing process; S2: Place the glued LED light sheet on the curing device, and use the curing device to cure the UV glue on the LED light sheet; S3: The solidified LED lamp pieces are placed on a detection and stripping device, which identifies the quality of the LED lamp pieces and strips off abnormal ones. The remaining normal LED lamp pieces are cut into single finished lamp beads by a foot cutting machine (82).

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