Cmp polishing pad conditioner automated assembly apparatus with planarized tip

Abstract

The CMP polishing pad trimmer automatic assembly equipment with a flattening tip comprises a rack; the side of the rack is provided with a large disc feeding module, a small ingot feeding module and a presser holding module; the large disc feeding module and the small ingot feeding module are respectively used for conveying the large disc and the small ingot to the designated position to wait for being grabbed; the presser holding module is provided with the presser which can be grabbed, and the presser is provided with a group of pressure heads corresponding to the assembly holes on the large disc; the rack is provided with a glue coating module; the glue coating module comprises a first operation platform and a reference plate arranged on the first operation platform; the glue coating module further comprises a material moving and glue coating device. The CMP polishing pad trimmer automatic assembly equipment with a flattening tip is used for automatically installing the small ingot with the diamond particles arranged on the surface into the assembly hole of the large disc to obtain the CMP polishing pad trimmer with the flattening tip, and the production efficiency and the product quality of the CMP polishing pad trimmer are effectively improved through the specific working modules and the cooperative work of the working modules.

Description

Technical Field

[0001] This invention relates to equipment for manufacturing grinding pad dressers for wafer chemical mechanical polishing (CMP), and more specifically to automated assembly equipment for CMP grinding pad dressers with planarized tips. Background Technology

[0002] Chemical mechanical polishing (CMP) is a key process in chip manufacturing that enables semiconductor wafers to achieve globally planar surfaces. To meet the demands of mass production and maintain consistent quality, a dresser is used to dress the polishing pad during CMP. The more tips a CMP dresser can penetrate the polishing pad, the better the dressing effect. This requires that the height difference between the diamond particles on the dresser's tips not be too large. Furthermore, if the height difference between the diamond particles' tips is too large, individual protruding diamond particles can easily damage the CMP polishing pad. Therefore, the CMP dresser needs to have planarized tips.

[0003] Patent document CN 116494130 A discloses a diamond dressing tool, which includes a large disk and a group of small ingots arranged on the large disk, with diamond particles disposed on the ingots. During manufacturing, after the small ingots are drilled, the large disk is placed on a reference plane, and then the drilled surface of the small ingots is placed face down into the corresponding mounting holes on the large disk. The large disk is then raised and shimmed, and epoxy resin is injected into the through-holes for curing, thus forming the diamond dressing tool. This diamond dressing tool has the advantage of good diamond tip height consistency, and its drilled surface has a flattened tip. However, the process of mounting the small ingots onto the large disk currently relies on manual labor due to the lack of specialized automated equipment. This results in low efficiency and difficulty in quality control, causing both production volume and quality to fall short of commercial requirements. Therefore, it is necessary to develop automated assembly equipment for automatically mounting small ingots with diamond particles on their surface onto a large disk to form a CMP polishing pad dressing tool with a flattened tip. Summary of the Invention

[0004] This invention provides an automated assembly device for CMP polishing pad dressers with planarized tips, used to install small ingots with diamond particles on their surface into the assembly holes of a large disc. This automated assembly device for CMP polishing pad dressers with planarized tips utilizes specific working modules that work collaboratively to automatically install small ingots with diamond particles on their surface into the assembly holes of a large disc, thereby obtaining CMP polishing pad dressers with planarized tips, effectively improving the production efficiency and product quality of CMP polishing pad dressers.

[0005] The technical solution of this invention is as follows:

[0006] An automated assembly device for CMP polishing pad dressers with planarized tips includes a frame; the side of the frame is equipped with a large disc feeding module, a small ingot feeding module, and a pressure device holding module; the large disc feeding module and the small ingot feeding module are used to transport the large disc and the small ingot to designated positions for gripping, respectively; the pressure device holding module has a gripping pressure device, and the pressure device is equipped with a set of pressure heads corresponding to the assembly holes on the large disc; the frame is equipped with an adhesive application module; the adhesive application module includes a first operating platform and a reference plate disposed on the first operating platform; the upper surface of the reference plate is a reference plane. A set of raised platforms for elevating the large plate is provided on the reference plane; the glue application module also includes a material transfer and glue application device. During operation, the material transfer and glue application device first grabs the large plate and places it on the reference plate, then grabs the small ingot and places it in the assembly hole on the large plate, and then applies glue in the gap between the small ingot and the large plate to form a trimmer; after the glue application is completed, the material transfer and glue application device grabs the pressure device and places it on the trimmer, using the pressure head of the pressure device to press down the small ingot. After the glue has cured, the material transfer and glue application device removes the pressure device from the trimmer and puts it back into the pressure device receiving module, and then grabs the trimmer and places it in the designated glue application and unloading station.

[0007] The automatic assembly equipment for CMP polishing pad dressers of the present invention comprises a large-disc feeding module, a small-spindle feeding module, a pressure device holding module, and an adhesive application module that work in concert. The large-disc feeding module and the small-spindle feeding module are used to transport the large disk and small ingots to designated positions to await being gripped, respectively. The pressure device holding module has a pressure device that can be gripped. During operation, the material transfer and adhesive application device in the adhesive application module grips the large disk from the large-disc feeding module and places it on a reference plate. Then, the small ingot is gripped from the small-spindle feeding module and placed into the assembly hole of the large disk. Adhesive is applied to the gap between the small ingot and the large disk. Then, the pressure device is gripped from the pressure device holding module and pressed onto the small ingot. After the adhesive has cured, the pressure device is returned to the pressure device holding module. The resulting CMP polishing pad dresser is then transported to the designated unloading station. This achieves the automatic installation of small ingots with diamond particles on their surface into the assembly holes of the large disk, and the assembly process is not affected by human factors, thus improving the production efficiency and product quality of CMP polishing pad dressers.

[0008] Furthermore, in the aforementioned automated assembly equipment for CMP grinding pad dressers with planarized tips, the large disc feeding module and the small ingot feeding module are belt conveyors equipped with material arrival sensors at the conveying ends. During the feeding process of the large disc and small ingots, after the material arrival sensor detects material, the corresponding belt conveyor stops. After the material at the conveying end is picked up, the belt conveyor restarts. The use of belt conveyors in the large disc feeding module and the small ingot feeding module, with material arrival sensors at the conveying ends, can meet the feeding requirements of the large disc and small ingots, and is highly reliable and easy to implement.

[0009] Furthermore, in the aforementioned automatic assembly equipment for CMP abrasive pad dressers with planarized tips, the pressurizer placement module is a belt conveyor that can run in reverse and has a material arrival sensor at the conveying end; a group of pressurizers is placed on the conveyor belt of the pressurizer placement module, and correspondingly, the first operating platform has a group of the same number of reference plates; during operation, the material transfer and adhesive application device picks up one pressurizer from the end of the belt conveyor for each dresser made, until all pressurizers have been picked up and used; after the adhesive has cured, the material transfer and adhesive application device returns the pressurizers one by one to the end of the belt conveyor for recycling; during the recycling process, after the material arrival sensor detects the pressurizer, the belt conveyor starts to run in reverse, conveying the pressurizer backward a certain distance, making room at the end of the conveyor to receive the next pressurizer; when the last pressurizer is received, the belt conveyor does not start. With the above setup, a batch of trimmers can be produced on the first operating platform. After one trimmer is produced, the next trimmer is produced immediately, avoiding idleness of the material transfer and coating equipment due to waiting for the adhesive to cure, thereby further improving production efficiency. In addition, the pressure vessel receiving module uses a belt conveyor that can run in reverse and is equipped with a material arrival sensor at the end of the conveyor, which meets functional requirements, is easy to implement, and has high reliability.

[0010] Furthermore, in the aforementioned automated assembly equipment for CMP polishing pad dressers with planarized tips, the material transfer and adhesive application device includes a three-axis slide table. The Z-axis of the three-axis slide table is equipped with an adhesive application component, a material gripping component, and a vision positioning component. The adhesive application component is used to mix the adhesive and curing agent in a set ratio and then quantitatively apply it to the gap between the small ingot and the large disc. The material gripping component includes a large vacuum suction cup and a small vacuum suction cup. The large vacuum suction cup is used to grip the large disc and the pressure device, and the small vacuum suction cup is used to grip the small ingot. The large vacuum suction cup is connected to the Z-axis of the three-axis slide table via an electric turntable. The vision positioning component includes an industrial camera and a light source. During operation, the circumferential orientation of the large disc and the pressure device is determined based on the vision positioning information. After the material gripping component grips the pressure device from the pressure device receiving module, the electric turntable adjusts the circumferential orientation of the pressure device to correspond to the large disc, so that the pressure head can be aligned with the assembly hole on the large disc. The material transfer and gluing device adopts the above-mentioned setup. During operation, the camera is used to position the material to be gripped, and the circumferential posture can be adjusted by the electric turntable. Therefore, there is no precise position requirement for the large plate, small ingot and pressure device to be gripped, and there is no need to regulate the circumferential posture. There will be no problem of automatic operation being affected by inaccurate material position or circumferential posture. The equipment is easy to use and highly reliable.

[0011] Furthermore, in the aforementioned automated assembly equipment for CMP polishing pad dressers with planarized tips, the adhesive application module further includes a tablet stacking fixture. This fixture has slots for stacking tablets. After adhesive application, the material transfer and adhesive application device first picks up a tablet from the slots of the tablet stacking fixture and places it in the assembly hole of the large tray. Then, it picks up a pressure device from the pressure device receiving module to apply pressure to the small ingot. Thus, the pressure head of the pressure device acts on the tablet, rather than directly on the small ingot, resulting in more uniform force on the small ingot and preventing slight displacement caused by uneven force. This improves assembly accuracy and contributes to higher product quality.

[0012] Furthermore, in the aforementioned automated assembly equipment for CMP polishing pad dressers with planarized tips, a glue application module is provided on the frame. This module includes a first feeding device, a second operating platform, a material transfer and glue application device, and a first flipping device. The first feeding device has a glue application and feeding station for receiving the dresser and conveying it to a designated position to await gripping. The first flipping device flips the dresser on the first feeding device. The material transfer and glue application device moves the flipped dresser from the first feeding device to the second operating platform to apply glue to the gap between the small ingot and the large disc. After glue application, the material transfer and glue application device moves the dresser to the designated glue application and feeding station. Thus, after glue application, the glue application module flips the dresser and applies glue to the gap between the small ingot and the large disc, improving the bonding strength between them. The glue application module, with the above-described configuration, is easy to implement and highly reliable.

[0013] Furthermore, the first feeding device is a belt conveyor, with two sets of material arrival sensors installed at the front and rear of the conveying end. Corresponding to the first set of material arrival sensors, the first flipping device is located on the side of the belt conveyor. When the material arrival sensor detects the trimmer, the belt conveyor stops, the first flipping device grabs the trimmer, flips it over, and puts it back, then the belt conveyor restarts. When the second set of material arrival sensors detects the trimmer, the belt conveyor stops and waits for the trimmer to be grabbed by the material transfer and glue application device. The first feeding device adopts the above design, which is easy to implement, highly reliable, and contributes to the compact structure of the entire machine.

[0014] Furthermore, in the aforementioned automated assembly equipment for CMP grinding pad dressers with planarized tips, a sealing module is provided on the frame. The sealing module includes a second feeding device, a third operating platform, a material transfer and sealing device, and a second flipping device. The second feeding device has a glue-filling feeding station for receiving the dresser and conveying it to a designated position to await picking. The second flipping device flips the dresser on the second feeding device. The material transfer and sealing device transports the flipped dresser from the second feeding device to the third operating platform for sealing the assembly holes of the large disc. After sealing, the material transfer and sealing device transports the dresser to the designated sealing feeding station. Thus, after glue replenishment, the sealing module seals the assembly holes of the large disc (i.e., the glue covers the entire assembly hole). After sealing, the bonding strength between the small ingot and the large disc is further improved, and the non-woven drill surface of the dresser is more aesthetically pleasing, which is beneficial for industrialization.

[0015] Furthermore, the second feeding device is a belt conveyor, with two sets of material arrival sensors installed at the front and rear of the conveying end. Corresponding to the first set of material arrival sensors, the second flipping device is located on the side of the belt conveyor. When the material arrival sensor detects the trimmer, the belt conveyor stops, the second flipping device grabs the trimmer, flips it over, and puts it back, then the belt conveyor restarts. When the second set of material arrival sensors detects the trimmer, the belt conveyor stops and waits for the trimmer to be grabbed by the material transfer and sealing device. The second feeding device, with the above design, is easy to implement, highly reliable, and contributes to the compact structure of the entire machine.

[0016] The aforementioned automated assembly equipment for CMP abrasive pad dressers with planarized tips also includes a drying module located on one side of the frame; the drying module includes an oven and a belt conveyor running through the oven, with a sealing and unloading station at the starting end of the belt conveyor. By setting up the drying module, the curing of the adhesive can be accelerated, and the dresser can be packaged after passing through the drying device.

[0017] In the aforementioned automated assembly equipment for CMP polishing pad dressers with planarized tips, the first flipping device includes a fixedly mounted telescopic cylinder and a finger cylinder connected to the telescopic cylinder, as well as grippers mounted on the finger cylinder; the structure of the second flipping device is the same as that of the first flipping device. The flipping device, with the above-described structural design, is easy to implement and highly reliable.

[0018] In the aforementioned automated assembly equipment for CMP abrasive pad dressers with planarized tips, the first, second, and third operating platforms are constant-temperature heating platforms. Therefore, during operation, the materials can be heated to accelerate adhesive curing, which is beneficial for improving production efficiency. Furthermore, by using constant-temperature heating platforms, the production environment remains uniform, and the products are not affected by thermal expansion and contraction, resulting in high consistency between different batches of products.

[0019] In the aforementioned automated assembly equipment for CMP polishing pad dressing devices with planarized tips, the transfer and glue application device is identical in structure to the transfer and glue application device, except that it lacks a small vacuum suction cup; the transfer and glue sealing device is identical in structure to the transfer and glue application device, except that the glue application needle has a larger diameter. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of an automated assembly device for a CMP polishing pad dresser with planarized tips according to an embodiment of the present invention;

[0021] Figure 2 This is a top view of an automated assembly device for a CMP polishing pad dresser with planarized tips according to an embodiment of the present invention.

[0022] Figure 3 yes Figure 2 A magnified view of a portion of the center view;

[0023] Figure 4 This is a schematic diagram of the pressurizer in an embodiment of the present invention;

[0024] Figure 5 This is a schematic diagram of the structure of the reference plate in an embodiment of the present invention;

[0025] Figure 6 This is a top view of the tablet stacking fixture in an embodiment of the present invention;

[0026] Figure 7 This is a schematic diagram (orthographic projection) of the material transfer and adhesive application device in an embodiment of the present invention.

[0027] Figure 8 This is a schematic diagram of the structure of the glue application component, the material gripping component, and the vision positioning component in an embodiment of the present invention.

[0028] Reference numerals: 1-Frame; 2-Large tray feeding module; 3-Small ingot feeding module; 4-Pressure press holding module; 5-First operating platform; 6-Base plate, 601-Base plane, 602-Elevation platform; 7-Large tray; 8-Small ingot; 9-Transfer and glue application device, 901-Three-axis slide table, 902-Large vacuum suction cup, 903-Small vacuum suction cup, 904-Electric turntable, 905-Industrial camera, 906-Light source, 907-AB dispensing machine; 10-Pressure press, 1001-Pressure head; 11-Tablet stacking fixture; 12-Tablet; 13-First unloading device; 14-Second operating platform; 15-Transfer and glue application device; 16-First flipping device; 17-Second unloading device; 18-Third operating platform; 19-Transfer and sealing device; 20-Second flipping device; 21-Oven. Detailed Implementation

[0029] The present invention will be further described below with reference to the accompanying drawings and embodiments, but this should not be construed as limiting the invention. Contents not described in detail in the following embodiments are all common knowledge in the art.

[0030] Example:

[0031] See Figure 1 The automatic assembly equipment for CMP polishing pad dressers with planarized tips in this embodiment includes a frame 1; the side of the frame 1 is provided with a large disc feeding module 2, a small ingot feeding module 3, and a pressure device holding module 4; the large disc feeding module 2 and the small ingot feeding module 3 are respectively used to transport the large disc 7 and the small ingot 8 to designated positions to wait for being gripped; the pressure device holding module 4 has a pressure device 10 that can be gripped, and the pressure device 10 is provided with a set of pressure heads 1001 corresponding to the assembly holes on the large disc 7; the frame 1 is provided with an adhesive application module; the adhesive application module includes a first operating platform 5 and a reference plate 6 provided on the first operating platform 5; the upper surface of the reference plate 6 is a reference plane 6. 01. A set of jacking platforms 602 for raising the large plate 7 is provided on the reference plane 601; the glue application module also includes a material transfer and glue application device 9. During operation, the material transfer and glue application device 9 first grabs the large plate 7 and places it on the reference plate 6, then grabs the small ingot 8 and places it in the assembly hole on the large plate 7, and then applies glue in the gap between the small ingot 8 and the large plate 7 to form a trimmer; after the glue application is completed, the material transfer and glue application device 9 grabs the pressure device 10 and places it on the trimmer, using the pressure head 1001 of the pressure device 10 to press the small ingot 8. After the glue has cured, the material transfer and glue application device 9 removes the pressure device 10 from the trimmer and puts it back into the pressure device holding module 4, and then grabs the trimmer and places it in the designated glue application and unloading station. Among them, the first operating platform 5 is a constant temperature operating table. The constant temperature operating table ensures that the working environment is always uniform and will not be affected by room temperature, resulting in good product consistency. In addition, the use of a constant temperature operating table for heating can accelerate the curing of the adhesive and improve work efficiency.

[0032] In this embodiment, the large-disc feeding module 2 and the small-spindle feeding module 3 are belt conveyors equipped with material arrival sensors at the conveying ends. During the feeding process of the large disc 7 and the small spindle 8, after the material arrival sensor detects material, the corresponding belt conveyor stops. After the material at the conveying end is grabbed, the belt conveyor restarts. During operation, after the material (large disc 7 and small spindle 8) is grabbed, the corresponding belt conveyor starts, conveying the next material to the end to wait for grabbing. The material arrival sensor is a photoelectric sensor.

[0033] In this embodiment, the pressurizer receiving module 4 is a belt conveyor that can run in reverse and has a material arrival sensor at the end of the conveyor. A group of pressurizers 10 are placed on the conveyor belt of the pressurizer receiving module 4. Correspondingly, the first operating platform 5 has a group of the same number of reference plates 6. During operation, the material transfer and gluing device 9 picks up one pressurizer 10 from the end of the belt conveyor as each trimmer is made, until all pressurizers 10 have been picked up and used. After the glue has cured, the material transfer and gluing device 9 puts the pressurizers 10 back to the end of the belt conveyor one by one for recycling. During the recycling of the pressurizers 10, after the material arrival sensor detects the pressurizer 10, the belt conveyor starts to run in reverse, conveying the pressurizers 10 backward a certain distance, leaving the position at the end of the conveyor for receiving the next pressurizer 10. When the last pressurizer 10 is received, the belt conveyor does not start. Therefore, during the operation, the pressurizer 10 is repeatedly used and returned in batches on the conveyor belt, which helps to improve production efficiency, is easy to implement, and has high reliability.

[0034] In this embodiment, the material transfer and coating device 9 includes a three-axis slide 901. The Z-axis of the three-axis slide 901 is equipped with a coating component, a material gripping component, and a vision positioning component. The coating component is used to mix the adhesive and curing agent according to a set ratio and then quantitatively apply it to the gap between the small ingot 8 and the large tray 7 (the coating component is an AB dispensing machine 907 purchased commercially). The material gripping component includes a large vacuum suction cup 902 and a small vacuum suction cup 903. The large vacuum suction cup 902 is used to grip the large tray 7 and the pressure device 10, and the small vacuum suction cup 903 is used to grip the small ingot 8. The large vacuum suction cup 902 is connected to the Z-axis of the three-axis slide table 901 via an electric turntable 904. The vision positioning component includes an industrial camera 905 and a light source 906. During operation, the circumferential orientation of the large plate 7 and the pressure device 10 is determined based on the vision positioning information. After the material gripping component grips the pressure device 10 from the pressure device receiving module 4, it moves it above the large plate 7. The electric turntable 904 adjusts the circumferential orientation of the pressure device 10 to correspond with the large plate 7, aligning the pressure head 1001 with the mounting hole on the large plate 7. Then, the pressure device 10 is released, causing the pressure head 1001 to press onto the small ingot 8. Before gripping the material from the conveyor belt, the material gripping component determines the material position based on the vision positioning information. During adhesive application, the adhesive application path is determined based on the vision positioning information. Therefore, precise placement of the material is not required.

[0035] In this embodiment, the adhesive coating module further includes a tablet stacking fixture 11. The tablet stacking fixture 11 has slots for stacking tablets 12. During operation, the worker first stacks the tablets 12 in the slots of the tablet stacking fixture 11. After adhesive coating, the material transfer and adhesive coating device 9 first picks up the tablets 12 from the slots of the tablet stacking fixture 11 and places them in the assembly holes of the large tray 7. Then, it picks up the pressure press 10 from the pressure press receiving module 4 to apply pressure to the small ingot 8. Thus, the pressure from the pressure head 1001 is applied to the small ingot 8 through the tablets 12, and the pressure is effectively dispersed.

[0036] In this embodiment, the frame 1 is equipped with a glue application module. The glue application module includes a first feeding device 13, a second operating platform 14, a material transfer and glue application device 15, and a first flipping device 16. The first feeding device 13 has a glue application and feeding station for receiving the trimmer and conveying it to a designated position to await being picked up. The first flipping device 16 flips the trimmer on the first feeding device 13. The material transfer and glue application device 15 transports the flipped trimmer from the first feeding device 13 to the second operating platform 14 (a constant temperature operating platform) to apply glue to the gap between the small ingot 8 and the large disc 7. After glue application, the material transfer and glue application device 15 transports the trimmer to the designated glue application and feeding station. After glue application, flipping the trimmer for glue application increases the bonding strength between the small ingot 8 and the large disc 7. The material transfer and glue application device 15 is identical in structure to the material transfer and glue application device 9, except for the absence of a small vacuum suction cup. When applying glue, use visual positioning information to determine the glue application path.

[0037] In this embodiment, the first feeding device 13 is a belt conveyor, with two sets of material arrival sensors installed at the end of the conveyor belt, one before and one after. Corresponding to the first set of material arrival sensors, the first flipping device 16 is located on the side of the belt conveyor. When the material arrival sensor detects the trimmer, the belt conveyor stops, the first flipping device 16 grabs the trimmer, flips it over, and puts it back, then the belt conveyor restarts. When the second set of material arrival sensors detects the trimmer, the belt conveyor stops and waits for the trimmer to be grabbed by the material transfer and glue application device 15. In this embodiment, two sets of material arrival sensors are installed at the end of the conveyor belt, one before and one after. The trimmer is flipped before reaching the end of the conveyor belt, so that the flipping action of the first flipping device 16 and the grabbing action of the material transfer and glue application device 15 can be performed simultaneously without interfering with each other, which is beneficial to improving work efficiency. The first flipping device 16 includes a fixed telescopic cylinder and a finger cylinder connected to the telescopic cylinder, as well as a gripper on the finger cylinder; the material arrival sensor is a photoelectric sensor.

[0038] In this embodiment, the frame 1 is equipped with a sealing module. The sealing module includes a second feeding device 17, a third operating platform 18, a material transfer and sealing device 19, and a second flipping device 20. The second feeding device 17 has a glue replenishing and feeding station for receiving the trimmer and conveying it to a designated position to await being picked up. The second flipping device 20 is used to flip the trimmer on the second feeding device 17. The material transfer and sealing device 19 is used to transport the flipped trimmer on the second feeding device 17 to the third operating platform 18 (a constant temperature operating platform) to seal the assembly holes of the large tray 8. After sealing, the material transfer and sealing device 19 transports the trimmer to the designated sealing and feeding station. After the glue replenishing is completed, sealing is performed, which not only further improves the bonding strength but also makes the product more aesthetically pleasing. The material transfer and sealing device 19 is the same as the material transfer and glue replenishing device 15, except that the diameter of the glue application needle is larger. During the sealing process, visual positioning information is used to determine the position of the mounting holes on the large plate 8.

[0039] In this embodiment, the second feeding device 17 is a belt conveyor, with two sets of material arrival sensors installed at the end of the conveyor belt, one before and one after. Corresponding to the first set of material arrival sensors, the second flipping device 20 is located on the side of the belt conveyor. When the material arrival sensor detects the trimmer, the belt conveyor stops, the second flipping device 20 grabs the trimmer, flips it over, and puts it back, then the belt conveyor restarts. When the second set of material arrival sensors detects the trimmer, the belt conveyor stops and waits for the trimmer to be grabbed by the material transfer and sealing device 19. In this embodiment, two sets of material arrival sensors are installed at the end of the conveyor belt, one before and one after. The trimmer is flipped before reaching the end of the conveyor belt, allowing the flipping action of the first flipping device 16 and the grabbing action of the material transfer and sealing device 15 to be performed simultaneously without interfering with each other, which is beneficial to improving work efficiency. The structure of the second flipping device 20 is the same as that of the first flipping device 16; the material arrival sensor is a photoelectric sensor.

[0040] In this embodiment, the automated assembly equipment for CMP polishing pad dressers with planarized tips also includes a drying module located on one side of the frame 1. The drying module includes an oven 21 and a belt conveyor running through the oven 21, with a sealing and unloading station at the starting end of the belt conveyor. After sealing, the dresser is placed on the conveyor belt and passes through the oven 21. After exiting the oven 21, the adhesive has cured and can be directly used in the packaging process.

[0041] The foregoing general description of the invention and its specific embodiments should not be construed as a limitation on the technical solution of the invention. Those skilled in the art, based on the disclosure of this application, can add, reduce, or combine the disclosed technical features in the foregoing general description and / or specific embodiments (including examples) without departing from the constituent elements of the invention, to form other technical solutions within the scope of protection of this invention.

Claims

1. An automated assembly device for CMP polishing pad dressers with planarized tips, characterized in that: Including rack (1); The side of the frame (1) is provided with a large plate feeding module (2), a small ingot feeding module (3) and a pressure device holding module (4); the large plate feeding module (2) and the small ingot feeding module (3) are respectively used to transport the large plate (7) and the small ingot (8) to the designated position to wait for being grabbed; the pressure device holding module (4) has a pressure device (10) that can be grabbed, and the pressure device (10) is provided with a set of pressure heads (1001) corresponding to the assembly holes on the large plate (7). The frame (1) is provided with a gluing module; the gluing module includes a first operating platform (5) and a reference plate (6) on the first operating platform (5); the upper surface of the reference plate (6) is a reference plane (601), and a set of jacking platforms (602) for raising the large plate (7) is provided on the reference plane (601); the gluing module also includes a material transfer and gluing device (9). During operation, the material transfer and gluing device (9) first grabs the large plate (7) and places it on the reference plate (6), and then grabs the small ingot ( 8) Place it in the assembly hole on the large plate (7), and then apply glue to the gap between the small ingot (8) and the large plate (7) to form a trimmer; after the glue is applied, the material transfer and glue application device (9) grabs the pressure device (10) and places it on the trimmer, and uses the pressure head (1001) of the pressure device (10) to press the small ingot (8). After the glue is cured, the material transfer and glue application device (9) removes the pressure device (10) from the trimmer and puts it back into the pressure device holding module (4), and then grabs the trimmer and places it in the designated glue application and unloading station.

2. The automatic assembly equipment for a CMP polishing pad dresser with planarized tips according to claim 1, characterized in that: The large pan feeding module (2) and the small spindle feeding module (3) are belt conveyors equipped with material arrival sensors at the end of the conveying process. During the feeding process of the large pan (7) and the small spindle (8), after the material arrival sensor detects the material, the corresponding belt conveyor stops. After the material at the end of the conveying process is grabbed, the belt conveyor restarts.

3. The automatic assembly equipment for a CMP polishing pad dresser with planarized tips according to claim 1, characterized in that: The pressurizer receiving module (4) is a belt conveyor that can run in reverse and has a material arrival sensor at the end of the conveyor. A set of pressurizers (10) is placed on the conveyor belt of the pressurizer receiving module (4). Correspondingly, the first operating platform (5) is equipped with a set of reference plates (6) of the same number. During operation, the material transfer and gluing device (9) grabs a pressurizer (10) from the end of the belt conveyor for each trimmer made until all pressurizers (10) are grabbed and used. After the glue has cured, the material transfer and gluing device (9) puts the pressurizers (10) back to the end of the belt conveyor one by one for recycling. During the recycling of pressurizers (10), after the material arrival sensor detects the pressurizer (10), the belt conveyor starts to run in reverse and conveys the pressurizer (10) a distance backward, leaving the position at the end of the conveyor to receive the next pressurizer (10). When the last pressurizer (10) is received, the belt conveyor does not start.

4. The automatic assembly equipment for a CMP polishing pad dresser with planarized tips according to claim 1, characterized in that: The material transfer and gluing device (9) includes a three-axis slide (901), and the three-axis slide (901) is equipped with a gluing component, a material gripping component and a vision positioning component on the Z-axis. The adhesive application assembly is used to mix the adhesive and the curing agent in a set ratio and then apply a quantitative amount of the mixture to the gap between the small ingot (8) and the large plate (7). The material gripping assembly includes a large vacuum suction cup (902) and a small vacuum suction cup (903); the large vacuum suction cup (902) is used to grip the large plate (7) and the pressure device (10), and the small vacuum suction cup (903) is used to grip the small ingot (8); the large vacuum suction cup (902) is connected to the Z-axis of the three-axis slide table (901) via an electric turntable (904); The visual positioning component includes an industrial camera (905) and a light source (906). During operation, the circumferential orientation of the large plate (7) and the pressurizer (10) is determined based on visual positioning information. After the material gripping component grips the pressurizer (10) from the pressurizer holding module (4), the electric turntable (904) adjusts the circumferential orientation of the pressurizer (10) to correspond with the large plate (7), so that the pressure head (1001) can be aligned with the mounting hole on the large plate (7).

5. The automated assembly equipment for a CMP polishing pad dresser with planarized tips according to claim 1, characterized in that: The adhesive coating module also includes a tablet stacking fixture (11); the tablet stacking fixture (11) is provided with a slot for stacking tablets (12); after adhesive coating, the material transfer and adhesive coating device (9) first grabs the tablet (12) from the slot of the tablet stacking fixture (11), places it in the assembly hole of the large plate (7), and then grabs the pressure device (10) from the pressure device receiving module (4) to pressurize the small ingot (8).

6. The automated assembly equipment for a CMP polishing pad dresser with planarized tips according to claim 1, characterized in that: The frame (1) is equipped with a glue-applying module; the glue-applying module includes a first feeding device (13), a second operating platform (14), a material transfer and glue-applying device (15), and a first flipping device (16); the first feeding device (13) has a glue-applying feeding station for receiving the trimmer and conveying it to a designated position to wait for it to be picked up; the first flipping device (16) is used to flip the trimmer on the first feeding device (13); the material transfer and glue-applying device (15) is used to move the trimmer after it has been flipped on the first feeding device (13) to the second operating platform (14) to apply glue to the gap between the small ingot (8) and the large plate (7); after the glue-applying is completed, the material transfer and glue-applying device (15) moves the trimmer to the designated glue-applying feeding station.

7. The automated assembly equipment for a CMP polishing pad dresser with planarized tips according to claim 6, characterized in that: The first feeding device (13) is a belt conveyor. Two sets of material arrival sensors are provided at the conveying end of the belt conveyor, one in front and one behind. Corresponding to the first set of material arrival sensors, the first flipping device (16) is located on the side of the belt conveyor. When the material arrival sensor detects the trimmer, the belt conveyor stops, the first flipping device (16) grabs the trimmer, flips it over and puts it back, and then the belt conveyor restarts. When the second set of material arrival sensors detects the trimmer, the belt conveyor stops and waits for the trimmer to be grabbed by the material transfer and glue replenishment device (15).

8. The automated assembly equipment for a CMP polishing pad dresser with planarized tips according to claim 6 or 7, characterized in that: The frame (1) is equipped with a sealing module; the sealing module includes a second feeding device (17), a third operating platform (18), a material transfer and sealing device (19), and a second flipping device (20); the second feeding device (17) has a glue-filling feeding station for receiving the trimmer and transporting it to a designated position to wait for it to be picked up; the second flipping device (20) is used to flip the trimmer on the second feeding device (17); the material transfer and sealing device (19) is used to transport the trimmer after flipping on the second feeding device (17) to the third operating platform (18) to seal the assembly holes of the large plate (7); after sealing, the material transfer and sealing device (19) transports the trimmer to the designated sealing feeding station.

9. The automated assembly equipment for a CMP polishing pad dresser with planarized tips according to claim 8, characterized in that: The second feeding device (17) is a belt conveyor. Two sets of material arrival sensors are provided at the conveying end of the belt conveyor, one in front and one behind. Corresponding to the first set of material arrival sensors, the second flipping device (20) is located on the side of the belt conveyor. When the material arrival sensor detects the trimmer, the belt conveyor stops, the second flipping device (20) grabs the trimmer, flips it over and puts it back, and then the belt conveyor restarts. When the second set of material arrival sensors detects the trimmer, the belt conveyor stops and waits for the trimmer to be grabbed by the material transfer and sealing device (19).

10. The automated assembly equipment for a CMP polishing pad dresser with planarized tips according to claim 8, characterized in that: It also includes a drying module located on one side of the frame (1); the drying module includes an oven (21) and a belt conveyor that passes through the oven (21), the starting end of which has a sealing and unloading station.

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