High-porosity ceramic-bonded diamond micron abrasives, their preparation methods and applications

Abstract

This invention provides a high-porosity ceramic-bonded diamond micropowder abrasive, its preparation method, and its application. The preparation method includes: preparing a ceramic-bonded diamond micropowder composite powder using a sol-gel method; preparing porous agglomerated diamond microspheres using an atomization granulation method with the ceramic-bonded diamond micropowder composite powder and an organic pore-forming agent as raw materials; preparing a calcium alginate aqueous solution using a multiple emulsion method and an atomization granulation method with sodium alginate and calcium salt as raw materials; and preparing a ceramic-bonded diamond micropowder abrasive using a gel casting method with the porous agglomerated diamond microspheres and calcium alginate aqueous spheres as the main raw materials. The above-mentioned diamond micropowder abrasive utilizes the organic pore-forming agent and sodium alginate aqueous spheres as pore-forming agents, allowing for precise control of the particle size and ratio of pores in the prepared diamond micropowder abrasive. It exhibits high porosity, good self-sharpening properties, and low grinding resistance, making it suitable for efficient and high-quality processing of semiconductor materials.

Description

Technical Field

[0001] This invention relates to the field of superhard materials, specifically to a high-porosity ceramic-bonded diamond micron powder abrasive, its preparation method, and its application. Background Technology

[0002] Diamond micron powder is a new type of superhard and ultrafine abrasive formed by processing synthetic diamond single crystals through a special process. It is an ideal material for grinding and polishing high-hardness materials. Diamond micron powder has good toughness, maintaining high grinding force during grinding and polishing while being less prone to scratches. It is widely used in the processing of hard and brittle materials.

[0003] Ceramic-bonded diamond grinding wheels are widely used in the processing of semiconductor electronic components due to their excellent properties such as long life, stability, and self-sharpening properties, especially in the processing of second-generation semiconductor silicon wafers. Currently, the demand for ceramic-bonded grinding wheels in third-generation semiconductor silicon carbide is increasingly strong. However, diamond thinning wheels manufactured using traditional methods suffer from problems such as poor self-sharpening properties, leading to short dressing cycles, poor wafer surface quality, and high current values. The self-sharpening property of a grinding wheel refers to the phenomenon where "after the abrasive grains become dull, they break or detach under the action of grinding force and thermal shock, thus forming new cutting edges and maintaining the grinding wheel's grinding capability." Porosity is an important component of ceramic-bonded diamond grinding wheels, and its size and porosity significantly affect the grinding wheel's processing performance. Porosity in the grinding wheel can make the abrasive grains sharper, increasing grinding efficiency. When the grinding wheel rotates, the pores draw in surrounding air and expel dust, ensuring the grinding wheel surface remains clean. Simultaneously, these pores can carry away grinding debris, facilitating debris accumulation and wheel clogging. Furthermore, frictional heat is generated between the grinding wheel and the workpiece during grinding. Without pores, the temperature at the grinding point will rise, affecting grinding efficiency and wheel life. Currently, ceramic-bonded diamond grinding wheels are pore-forming wheels by adding pore-forming agents. However, excessive pore-forming agents can lead to wheel agglomeration, blackening, and cracking, making it difficult to produce high-porosity grinding wheels with high self-sharpening capabilities using this method.

[0004] Chinese patent application CN 111331527 A discloses an ultra-high porosity ceramic-bonded diamond ultra-precision grinding wheel and its preparation method. The method mainly employs a coagulation molding process, using surfactants as pore-forming agents combined with high-speed stirring and foaming to prepare the ultra-high porosity ceramic-bonded diamond ultra-precision grinding wheel. This method can solve the problems of black core and cracking found in traditional diamond grinding wheels and can achieve a porosity of over 75% in the grinding wheel, significantly improving the grinding performance of the ceramic-bonded diamond ultra-precision grinding wheel. However, because the particle size and position of the pores prepared by the foaming method are randomly distributed, it is difficult to maintain the consistency of the grinding wheel's performance. Therefore, it is difficult to accurately control the particle size and proportion of pores in the ultra-precision grinding wheel, resulting in the grinding performance of the grinding wheel and the processing quality of semiconductor wafers needing further improvement. Summary of the Invention

[0005] In view of this, in order to solve the above problems, the present invention provides a high-porosity ceramic-bonded diamond micron powder abrasive, its preparation method and application. By using an organic pore-forming agent and sodium alginate water balls as pore-forming agents, the particle size and ratio of pores in the prepared diamond micron powder abrasive can be precisely controlled, and it has the characteristics of high porosity, good self-sharpening and low grinding resistance. It can be used for efficient and high-quality processing of semiconductor materials such as silicon carbide, silicon wafers, and gallium nitride.

[0006] Specifically, the first aspect of the present invention provides a high-porosity ceramic-bonded diamond micro powder abrasive, comprising a diamond micro powder abrasive body, large atmospheric pores densely and uniformly distributed in the diamond micro powder abrasive body, and small pores distributed between adjacent large atmospheric pores, wherein the pore diameter of the large atmospheric pores is 80 to 1000 μm, and the pore diameter of the small pores is 1.0 to 10 μm.

[0007] Furthermore, the raw materials for the ceramic-bonded diamond micropowder abrasive include: porous agglomerated diamond microspheres and calcium alginate water spheres in a mass ratio of (1-5):(5-15), wherein the porous agglomerated diamond microspheres have a particle size of 5-150 μm and a porosity of 0-60%. Preferably, the mass ratio of the porous agglomerated diamond microspheres to the calcium alginate water spheres is (2-3):(5-10).

[0008] The porous agglomerated diamond microspheres are mainly prepared by atomization granulation using ceramic-bonded diamond micropowder composite powder and organic pore-forming agent as raw materials, followed by sintering in a muffle furnace to remove the organic pore-forming agent. The mass ratio of the ceramic-bonded diamond micropowder composite powder to the organic pore-forming agent is (6-10):(0-4), and the particle size of the organic pore-forming agent is not less than 1.0 μm. The raw material of the ceramic-bonded diamond micropowder composite powder includes 0-5 wt% nanofiller.

[0009] Preferably, the organic pore-forming agent has a particle size of 1.0-500 μm. Specifically, the organic pore-forming agent with a particle size of 1.0-10 μm is mainly used as a small pore-forming agent to form small pores in the grinding wheel. The organic pore-forming agent with a particle size of 80-500 μm, together with the calcium alginate water balls, is used as a large pore-forming agent to form large pores in the grinding wheel, thereby reducing or avoiding the black core problem in the manufacturing process of high-porosity diamond micron powder grinding wheels.

[0010] To improve the precision of diamond micro powder abrasives, the preferred mass ratio of the ceramic-bonded diamond micro powder composite powder to the organic pore-forming agent is (6-8): (2-4), the preferred particle size of the ceramic-bonded diamond micro powder composite powder is 0.5-3 μm, and the preferred particle size of the organic pore-forming agent is 1.0-10 μm.

[0011] To further improve the precision of diamond micro powder abrasives, the proportion of nanofiller is 0.5-5%, and the particle size of the nanofiller is 50-100 nm.

[0012] Furthermore, the raw materials for the ceramic binder diamond micron powder composite powder also include 40-60% diamond micron powder, with the remainder being ceramic binder raw materials prepared by the sol-gel method. The ceramic binder raw materials prepared by the sol-gel method include boric acid and metal nitrates.

[0013] The raw materials for the calcium alginate water balls include a sodium alginate solution with a mass percentage concentration of 1% to 5% and a calcium salt solution with a mass percentage concentration of 0.5% to 5%, wherein the calcium salt is calcium chloride or calcium lactate. The particle size of the calcium alginate water balls is 80 to 600 μm.

[0014] A second aspect of this invention provides a method for preparing the above-mentioned ceramic-bonded diamond micron abrasive, comprising the steps of:

[0015] Preparation of ceramic-bonded diamond micron composite powder: Ceramic-bonded diamond micron composite powder is prepared by sol-gel method, wherein the proportion of nanofiller in the raw materials of the ceramic-bonded diamond micron composite powder is 0-5%;

[0016] Preparation of agglomerated diamond microspheres: Using the ceramic binder diamond micro powder composite powder and organic pore-forming agent as raw materials, porous agglomerated diamond microspheres are prepared by atomization granulation method, wherein the mass ratio of the ceramic binder diamond micro powder composite powder to the organic pore-forming agent is (6-10): (0-4).

[0017] Preparation of calcium alginate water balls: Calcium alginate water ball solution was prepared using sodium alginate and calcium salt as raw materials via multiple emulsion method and atomization granulation method.

[0018] Preparation of ceramic-bonded diamond micropowder abrasives: Ceramic-bonded diamond micropowder abrasives are prepared using the porous aggregated diamond microspheres and calcium alginate water spheres as the main raw materials by gel casting method.

[0019] The steps for preparing agglomerated diamond microspheres include: first, mixing the ceramic binder diamond micro powder composite powder and an organic pore-forming agent, and preparing a ceramic slurry with a solid content of 25-40%; then, placing the ceramic slurry into an atomizing granulator for granulation, wherein the atomization frequency is 30-50 Hz and the atomization temperature is 180℃-230℃, to obtain diamond micro powder ceramic composite particles; and then subjecting the diamond ceramic composite particles to a second sintering treatment to obtain the porous agglomerated diamond microspheres.

[0020] The steps for preparing calcium alginate water balls include: adding a sodium alginate solution with a mass percentage concentration of 1-5% to a calcium salt solution with a mass percentage concentration of 0.5-5% using an atomizing nozzle or dropper to prepare a calcium alginate water ball solution.

[0021] A third aspect of this invention provides an application of the above-mentioned ceramic-bonded diamond micron abrasive in semiconductor material processing. The semiconductor material includes sapphire, silicon wafers, silicon carbide wafers, gallium nitride wafers, etc. Preferably, the above-mentioned ceramic-bonded diamond micron abrasive is used in the grinding of semiconductor materials.

[0022] Therefore, the ceramic-bonded diamond micron abrasive provided by this invention, in its preparation process, combines the sol-gel method, spray granulation method, and gel casting method. This allows the small-particle-size organic pore-forming agent to form small pores, while the large-particle-size organic pore-forming agent and calcium alginate water spheres form large pores. By controlling the amount and particle size of the organic pore-forming agent and alginate spheres, the particle size and ratio of the pores in the prepared diamond micron abrasive can be precisely controlled, resulting in a high porosity of over 60%, even exceeding 75%. Furthermore, the nanofiller is not removed during multiple sintering processes, but its low hardness allows it to detach during subsequent grinding, reducing the holding force of the diamond micron powder and increasing the self-sharpening property of the grinding wheel. In addition, due to the high porosity and reasonable particle size distribution, the diamond micron abrasive exhibits low grinding resistance.

[0023] In summary, the diamond micron abrasive provided by this invention has the characteristics of high porosity, good self-sharpening and low grinding resistance, and can be used for efficient and high-quality processing of semiconductor materials such as silicon carbide single crystal, silicon single crystal, and gallium nitride single crystal. Attached Figure Description

[0024] Figure 1This is a SEM image of the porous aggregated diamond microspheres prepared in Embodiment 1 of the present invention;

[0025] Figure 2 This is a SEM image of the diamond grinding wheel provided in Embodiment 1 of the present invention;

[0026] Figure 3 SEM image of the diamond grinding wheel provided for Comparative Example 1;

[0027] Figure 4 The photograph shows the phenomena observed during the preparation of the diamond grinding wheel, which serves as a comparative example. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention.

[0029] The endpoints and any values ​​of the ranges disclosed in this invention are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoint values ​​of the various ranges, the endpoint values ​​of the various ranges and individual point values, and individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed in this invention.

[0030] In this invention, unless otherwise specified and / or stated, all values ​​related to the amount, concentration, content, etc. of components or raw materials are "by weight". Unless otherwise specified, the terminology used in this invention is common in the relevant field. Unless otherwise specified, the preparation processes, testing methods, etc., used in the various embodiments are conventional methods well known to those skilled in the art, and the raw materials and equipment used can be obtained from publicly available commercial sources.

[0031] This invention first utilizes the sol-gel method to prepare ceramic-bonded diamond micropowder composite powder containing nanofillers in situ; then, using the ceramic-bonded diamond micropowder composite powder containing nanofillers and organic pore-forming agents as raw materials, it prepares spherical agglomerated diamond microspheres with high porosity using an atomization granulation method; next, it first prepares calcium alginate water spheres using a multiple emulsion method and an atomization granulation method, and then uses agglomerated diamond microspheres, calcium alginate water spheres, etc. as main raw materials to prepare ceramic agglomerates using a gel casting method, thereby obtaining a ceramic-bonded diamond micropowder abrasive with high porosity; wherein, by controlling the amount and particle size of organic pore-forming agents and alginate spheres, the pore size and ratio in the diamond micropowder abrasive can be precisely controlled.

[0032] Specifically, the first aspect of the present invention provides a ceramic-bonded diamond micro-powder abrasive, comprising a diamond micro-powder abrasive body, large atmospheric pores densely and uniformly distributed in the diamond micro-powder abrasive body, and small atmospheric pores distributed between adjacent large atmospheric pores. The diameter of the large atmospheric pores is 80–1000 μm, and the diameter of the small atmospheric pores is 1.0–10 μm. Both the large atmospheric pores and the small atmospheric pores are closed pores. To further improve the precision of the ceramic-bonded diamond micro-powder abrasive, the diameter of the large atmospheric pores is 200–800 μm, and the diameter of the small atmospheric pores is 1.8–5 μm.

[0033] The raw materials for the ceramic-bonded diamond micro powder abrasive include: porous aggregated diamond microspheres and calcium alginate water spheres in a mass ratio of (1-5): (5-15), wherein the porous aggregated diamond microspheres have a particle size of 5-150 μm and a porosity of 0-60%.

[0034] To further improve the precision of ceramic-bonded diamond micron abrasives, the particle size of the porous agglomerated diamond microspheres is 15–100 μm. For obtaining high-precision grinding wheels, the particle size of the porous agglomerated diamond microspheres is preferably 20–70 μm.

[0035] The porous agglomerated diamond microspheres are mainly prepared by atomization granulation using ceramic-bonded diamond micropowder composite powder and organic pore-forming agent as raw materials, followed by sintering in a muffle furnace to remove the organic pore-forming agent. The mass ratio of the ceramic-bonded diamond micropowder composite powder to the organic pore-forming agent is (6-10):(0-4), such as 6:4, 6.5:3.5, 7:3, 7.5:2.5, 8:2, 8.5:1.5, 9:1, 9.5:0.5, 10:0, etc. The particle size of the organic pore-forming agent is not less than 1.0 μm. The organic pore-forming agent can be PMMA microspheres, PS microspheres, etc.

[0036] In one embodiment, the organic pore-forming agent is mainly used to form small pores in the abrasive and is used as a small pore pore-forming agent. Preferably, the organic pore-forming agent has a particle size of 1.0-10 μm.

[0037] In another embodiment, the organic pore-forming agent has a particle size of 1.0-500 μm. Part of the organic pore-forming agent is used as a small pore-forming agent, and another part, together with the calcium alginate water balls, is used as a large pore-forming agent to form large pores in the abrasive, thereby reducing or avoiding the black core problem in the manufacturing process of high-porosity diamond micron powder abrasives. Preferably, the organic pore-forming agent includes a small-particle-size organic pore-forming agent with a particle size of 1.0-10 μm and a large-particle-size organic pore-forming agent with a particle size of 80-500 μm.

[0038] To further improve the precision of diamond micro powder abrasives, the preferred mass ratio of the ceramic-bonded diamond micro powder composite powder to the organic pore-forming agent is (6-8): (2-4), the preferred particle size of the ceramic-bonded diamond micro powder composite powder is 0.5-3 μm, and the preferred particle size of the organic pore-forming agent is 1.0-10 μm.

[0039] The raw materials of the ceramic-bonded diamond micron powder composite powder include 0-5 wt% nanofillers. To further improve the precision of the diamond micron powder abrasive, the nanofillers account for 0.5-5 wt%, and the particle size of the nanofillers is 50-100 nm. The nanofillers are not removed during multiple sintering processes, but due to their low hardness, they can reduce the holding force of the diamond micron powder and increase the self-sharpening property of the grinding wheel. Therefore, the nanofillers include at least one of nano-carbon powder, nano-graphite powder, and nano-hexagonal boron nitride.

[0040] The raw materials for the ceramic binder diamond micron powder composite powder also include 40-60 wt% diamond micron powder, with the balance being ceramic binder raw materials prepared by the sol-gel method. The D50 particle size of the diamond micron powder is 30-1500 nm, such as 30 nm, 50 nm, 100 nm, 200 nm, 300 nm, 400 nm, 450 nm, 500 nm, 550 nm, 600 nm, 700 nm, 800 nm, 900 nm, 1000 nm, 1100 nm, 1200 nm, 1300 nm, 1400 nm, 1500 nm, etc. The ceramic binder raw materials prepared by the sol-gel method include boric acid and metal nitrates. Specifically, the ceramic binder raw materials include orthosilicates, boric acid, and metal nitrates, wherein the metal nitrates are nitrates corresponding to the metal elements in the ceramic binder, such as sodium nitrate, potassium nitrate, calcium nitrate, zinc nitrate, barium nitrate, magnesium nitrate, zirconium nitrate, lithium nitrate, etc. The orthosilicates include ethyl orthosilicate, methyl orthosilicate, etc.

[0041] In one embodiment, the ceramic binder raw material, by weight, comprises: 200-300 g of tetraethyl orthosilicate, 50-80 g of boric acid, 30-50 g of aluminum nitrate nonahydrate, 50-90 g of sodium nitrate, 5-10 g of potassium nitrate, 5-15 g of calcium nitrate tetrahydrate, 5-15 g of zinc nitrate hexahydrate, 5-15 g of magnesium nitrate hexahydrate, 5-15 g of barium nitrate, 5-10 g of lithium nitrate, and 5-10 g of zirconium nitrate. The ceramic binder raw material further comprises 3-5 g of acetylacetone, 1-3 g of dispersant, and 10-15 ml of pH adjuster. The dispersant is one or more of sodium dodecylbenzenesulfonate, hexadecyl ammonium chloride, sodium hexametaphosphate, sodium pyrophosphate, hexadecyl ammonium chloride, polyoxyethylene ether, etc. The pH adjuster is nitric acid, hydrochloric acid, ammonia, etc.

[0042] The calcium alginate water spheres primarily function to form large pores on the diamond micron abrasive body. These calcium alginate water spheres are soft spheres; although they may deform under pressure or two adjacent spheres may stick together during subsequent use, they are unlikely to break. The particle size of the calcium alginate water spheres is 80–600 μm. Preferably, the particle size is 100–550 μm. To further improve the precision of the diamond micron abrasive, the calcium alginate water spheres are composed of different particle sizes, including 80–250 μm and 270–550 μm. The main raw materials for the calcium alginate water spheres are sodium alginate and calcium salts, prepared through a multiple emulsion method and atomization granulation method. The calcium salts include calcium chloride, calcium lactate, calcium nitrate, etc. The raw materials for the calcium alginate water spheres include a sodium alginate solution with a mass percentage concentration of 1%–5% and a calcium salt solution with a mass percentage concentration of 0.5%–5%. The amounts of sodium alginate solution and calcium salt solution used affect the amount of calcium alginate water balls used. The concentration of the sodium alginate solution can be 1%, 1.5%, 2%, 3%, 3.5%, 4%, 4.5%, and 5%, etc. The concentration of the calcium salt can be 0.5%, 1%, 1.5%, 2%, 3%, 3.5%, 4%, 4.5%, and 5%, etc. Preferably, the raw materials for the calcium alginate water balls include a sodium alginate solution with a mass percentage concentration of 1.5% to 2% and a calcium salt solution with a mass percentage concentration of 1% to 2%.

[0043] Furthermore, the raw materials for the ceramic-bonded diamond micron powder abrasive also include: an amide mixture with a concentration of 3-10 wt%, an initiator solution with a concentration of 10-15 wt%, and a catalyst solution with a concentration of 0.5-2 wt%. The amide mixture comprises nitrogen-, nitrogen-methylenebisacrylamide and acrylamide in a mass ratio of 0.5-1:25-29, such as 0.5:29, 0.5:25, 0.5:27, 0.5:28, 1:25, 1:26, 1:27, 1:28, 1:29, etc. The concentration of the amide mixture can be 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, etc. The initiator can be a commonly used initiator such as ammonium persulfate, and the concentration of the initiator solution can be 10%, 11%, 12%, 13%, 14%, 15%, etc. The catalyst can be tetramethylethylenediamine, etc., and the concentration of the catalyst can be 0.5%, 0.8%, 1.0%, 1.2%, 1.5%, etc.

[0044] A second aspect of this invention provides a method for preparing the above-mentioned ceramic-bonded diamond micron abrasive, comprising the steps of:

[0045] Preparation of ceramic-bonded diamond micron composite powder: Ceramic-bonded diamond micron composite powder is prepared by sol-gel method, wherein the proportion of nanofiller in the raw materials of the ceramic-bonded diamond micron composite powder is 0-5%;

[0046] Preparation of agglomerated diamond microspheres: Agglomerated diamond microspheres are prepared by atomization granulation using the ceramic binder diamond micro powder composite powder and organic pore-forming agent as raw materials, wherein the mass ratio of the ceramic binder diamond micro powder composite powder to the organic pore-forming agent is (6-10): (0-4).

[0047] Preparation of calcium alginate water balls: Calcium alginate water ball solution was prepared using sodium alginate and calcium salt as raw materials via multiple emulsion method and atomization granulation method.

[0048] Preparation of ceramic-bonded diamond micropowder abrasives: Ceramic-bonded diamond micropowder abrasives are prepared using the porous aggregated diamond microspheres and calcium alginate water spheres as the main raw materials by gel casting method.

[0049] The steps for preparing the ceramic-bonded diamond micro powder composite powder include: first preparing a ceramic-bonded diamond gel containing nanofillers, then subjecting the ceramic-bonded diamond gel containing nanofillers to a first sintering treatment, followed by ball milling to obtain the ceramic-bonded diamond micro powder composite powder.

[0050] The first sintering process includes: first, drying the ceramic-bonded diamond gel containing nanofillers, then sintering it at 480℃~550℃ for 4~8 h to obtain a calcined ceramic-bonded diamond product; then, ball milling the calcined ceramic-bonded diamond product using a three-dimensional mixer to obtain a ceramic-bonded diamond micro-powder composite powder with a particle size of 1~3 μm. The drying temperature of the ceramic-bonded diamond gel containing nanofillers is 120~180 ℃, and the drying time is 20~36 h.

[0051] In one embodiment, the step of preparing the ceramic-bonded diamond gel containing nanofillers includes:

[0052] Mix 50–100 g of diamond micro powder, 200–300 g of tetraethyl orthosilicate, 500–800 ml of anhydrous ethanol solution, 3–5 g of acetylacetone chelating agent, 1–3 g of dispersant, 10–15 ml of pH adjuster, and 0–100 g of 20–300 nm nanofiller using ultrasonic mechanical stirring for 30–60 min to obtain sol solution A;

[0053] Dissolve 50–80 g boric acid, 30–50 g aluminum nitrate nonahydrate, 50–90 g sodium nitrate, 5–10 g potassium nitrate, 5–15 g calcium nitrate tetrahydrate, 5–15 g zinc nitrate hexahydrate, 5–15 g magnesium nitrate hexahydrate, 5–15 g barium nitrate, 5–10 g lithium nitrate, and 5–10 g zirconium nitrate completely in a mixed solution of anhydrous ethanol and deionized water to form a homogeneous salt mixture B.

[0054] The sol solution A was placed in a water bath and stirred at 60℃~80℃. The salt mixture B was added to the sol solution A in 3~5 portions and stirred until the sol solution A was transformed into a gel. Then, it was allowed to stand at room temperature for 20~36 h to obtain the ceramic binder diamond gel containing nanofillers.

[0055] The steps for preparing agglomerated diamond microspheres include: first, mixing the ceramic binder diamond micro powder composite powder and an organic pore-forming agent, and then preparing a ceramic slurry with a solid content of 25-40%; then, subjecting the ceramic slurry to atomization granulation treatment to obtain diamond ceramic composite particles; and then subjecting the diamond ceramic composite particles to a second sintering treatment to obtain porous agglomerated diamond microspheres with a particle size of 5-150 μm.

[0056] The atomization granulation process includes: placing the ceramic mixture slurry into an atomization granulator for granulation, wherein the atomization frequency is 30-50 Hz and the atomization temperature is 180℃-230℃, to obtain diamond ceramic composite particles with a particle size of 10-150μm.

[0057] The second sintering process includes: placing the diamond ceramic composite particles in a muffle furnace and holding them at 300℃~350℃ for 1.5~3 h, and then holding them at 580℃~630℃ for 1.5~3 h to obtain porous aggregated diamond microspheres of 10~100 μm.

[0058] The steps for preparing calcium alginate water balls include: adding a sodium alginate solution with a mass percentage concentration of 1-5% to a calcium salt solution with a mass percentage concentration of 0.5-5% using an atomizing nozzle or a dropper to prepare a calcium alginate water ball solution, wherein the particle size of the calcium alginate water balls is 80-600 μm. The particle size of the calcium alginate water balls can be controlled and adjusted by the rotation speed of the atomizing nozzle or the orifice diameter of the dropper.

[0059] The steps for preparing ceramic-bonded diamond micropowder abrasives include: using the porous agglomerated diamond microspheres, calcium alginate water spheres, N,N-methylenebisacrylamide, acrylamide, initiator, and catalyst as raw materials, and preparing ceramic-bonded diamond micropowder abrasives using a gel casting method. Specifically, the steps for preparing ceramic-bonded diamond micropowder abrasives include: first, uniformly mixing the acrylamide and N,N-methylenebisacrylamide to prepare an amide mixed solution with a mass percentage concentration of 3–10 wt%; then, uniformly mixing 30–50 ml of the amide mixed solution, 10–50 g of the porous agglomerated diamond microspheres, and 50–150 g of the calcium alginate water sphere solution to form a diamond microsphere mixed slurry.

[0060] First, add 2-5 g of an initiator solution with a concentration of 10-15 wt% and 1-3 g of a catalyst solution with a concentration of 0.5-2 wt% to the diamond microsphere mixture slurry, and stir evenly to form a blank slurry; then pour the blank slurry into a mold, and freeze-dry it until it is completely dry, demold it, and obtain a diamond micron powder abrasive blank;

[0061] The diamond micro powder abrasive blank is subjected to a third sintering treatment to obtain a ceramic-bonded diamond micro powder abrasive.

[0062] The mold is made of materials such as acrylic sheet, glass sheet, and ceramic.

[0063] The third sintering process includes: first, placing the diamond micro powder abrasive blank in a muffle furnace and sintering it at 600℃~700℃ for 2~3 hours; then, cutting it according to the abrasive wheel drawing and bonding it to the abrasive wheel substrate; and after correction, the diamond micro powder abrasive product can be obtained.

[0064] A third aspect of this invention provides an application of the above-mentioned ceramic-bonded diamond micron abrasive in semiconductor material processing. The semiconductor material includes sapphire, silicon wafers, silicon carbide wafers, etc. Preferably, the application of the above-mentioned ceramic-bonded diamond micron abrasive in semiconductor material grinding is such that the ceramic-bonded diamond micron abrasive can be used as a silicon carbide thinning wheel for thinning silicon carbide wafers.

[0065] Therefore, the high-porosity ceramic-bonded diamond micro powder abrasive provided by this invention uses a sol-gel method to prepare a ceramic-bonded diamond micro powder composite powder containing nanofillers. The nanofillers are not removed during multiple sintering processes, but the nanofillers have low hardness and can fall off during subsequent grinding, which can reduce the holding force of the diamond micro powder, increase the self-sharpening property of the abrasive, and facilitate lower grinding resistance of the diamond micro powder abrasive, thereby improving processing efficiency and processing quality. This invention employs a spray granulation method to prepare agglomerated diamond microspheres using ceramic-bonded diamond micropowder composite powder and organic pore-forming agents as raw materials. The organic pore-forming agent is used to pre-create pores. Then, calcium alginate water spheres are prepared using a combination of multiple emulsion and atomization granulation methods. Diamond micropowder abrasives are then prepared using gel casting as the main raw materials, with the agglomerated diamond microspheres and calcium alginate water spheres as the main raw materials. The calcium alginate water spheres, acting as a macroporous pore-forming agent, combined with the pre-pore-creating effect of the organic pore-forming agent, avoids the problems of poor volatility, such as blackening and cracking, that arise when directly adding organic pore-forming agents in existing technologies. The calcium alginate water spheres also prevent cracking and high carbon emission problems in diamond micropowder abrasives, resulting in ceramic-bonded diamond micropowder abrasives with high porosity, reaching over 60% and even over 75%. By controlling the particle size and dosage of small-particle-size organic pore-forming agents, the particle size and distribution density of small pores in diamond micron powder abrasives can be controlled. By controlling the particle size and dosage of calcium alginate water balls and large-particle-size organic pore-forming agents, the particle size and distribution density of large pores in diamond micron powder abrasives can be controlled. This allows for precise control of the particle size and proportion of pores in diamond micron powder abrasives. This method is also applicable to the preparation of other high-porosity ceramics.

[0066] The ceramic-bonded diamond micro powder abrasive provided by this invention has a uniform distribution of large and small pores, and the high porosity results in a small contact area between the workpiece and the abrasive. Therefore, the diamond micro powder abrasive has a low grinding resistance. Thus, the diamond mold provided by this invention can achieve efficient and high-quality processing of semiconductor materials such as silicon carbide single crystals.

[0067] The technical solution of the present invention will be further described in detail below with reference to the embodiments. Process parameters not specifically specified in the embodiments are generally performed under conventional conditions.

[0068] Example 1

[0069] This embodiment provides a high-porosity ceramic-bonded diamond micron powder grinding wheel and its preparation method, which includes the following steps:

[0070] Preparation of sol solution A: Weigh 50 g of diamond micro powder with a D50 particle size of 500 nm and place it in a solution containing 200 g of tetraethyl orthosilicate and 700 ml of anhydrous ethanol. Add 5 g of acetylacetone, 3 g of sodium dodecylbenzenesulfonate, 12 ml of nitric acid and 10 g of 100 nm carbon nanoparticles. Mix thoroughly by ultrasonic mechanical stirring for 45 min to obtain sol solution A.

[0071] Preparation of salt mixture B: Weigh 50 g boric acid, 30 g aluminum nitrate nonahydrate, 60 g sodium nitrate, 7 g potassium nitrate, 8 g calcium nitrate tetrahydrate, 7 g zinc nitrate hexahydrate, 7 g magnesium nitrate hexahydrate, 7 g barium nitrate, 7 g lithium nitrate and 7 g zirconium nitrate and dissolve them in a mixed solution of anhydrous ethanol and deionized water. Mix evenly until completely dissolved to obtain salt mixture B.

[0072] Preparation of ceramic-bonded diamond micron powder gel: The sol solution A was placed in a magnetically stirred water bath and stirred at 70°C. Salt mixture B was added to sol solution A in 5 portions and stirred until the solution turned into a gel. Then, it was allowed to stand at room temperature for 24 h to obtain the ceramic-bonded diamond gel.

[0073] Preparation of ceramic-bonded diamond micro powder composite powder: The ceramic-bonded diamond gel was dried in an oven for 24 h at a drying temperature of 180 ℃; then the dried powder was calcined in a muffle furnace at 500 ℃ for 6 h to obtain the ceramic-bonded diamond calcined product; then the ceramic-bonded diamond micro powder calcined product was ball-milled to 2 μm using a three-dimensional mixer to obtain the ceramic-bonded diamond micro powder composite powder.

[0074] Preparation of diamond micron ceramic composite particles: First, the ceramic binder diamond composite powder and PMMA microspheres with a particle size of 1-5 μm are mixed at a mass ratio of 7:3, and then a ceramic slurry with a solid content of 30% is prepared; the ceramic slurry is granulated using an atomizing granulator with a frequency of 50 Hz and an internal temperature of 200 ℃ to obtain diamond ceramic composite particles with a particle size of 25-60 μm;

[0075] Preparation of agglomerated diamond microspheres: The diamond ceramic composite particles were calcined in a muffle furnace and held at 320 °C and 600 °C for 2 h respectively to obtain the following results: Figure 1 The porous aggregated diamond microspheres shown have a particle size of 20–50 μm, and the porous aggregated diamond microspheres have multiple micropores uniformly distributed in them, with the pore size of the micropores concentrated in the range of 1–5 μm;

[0076] Preparation of calcium alginate water spheres: 2 g of sodium alginate was dissolved in 98 g of deionized water to prepare a 2% sodium alginate solution, and 2 g of calcium lactate was weighed to prepare a 2% calcium chloride solution. The sodium alginate solution was added dropwise to the calcium lactate solution using an atomizing nozzle to prepare calcium alginate microspheres. Calcium alginate water spheres with particle sizes of 250 μm and 500 μm were separated by sieving, and the mass ratio of the two particle sizes of calcium alginate water spheres was 1:1.

[0077] Preparation of diamond grinding wheel blanks: Acrylamide and N,N-methylenebisacrylamide were weighed at a mass ratio of 29:1, and an amide mixed solution with a mass fraction of 4% was prepared; 50 ml of the amide mixed solution was weighed and 30 g of the porous aggregated diamond microspheres and 90 g of calcium alginate water spheres were added and stirred evenly to form a diamond microsphere mixed slurry; 3.5 g of ammonium persulfate solution with a mass percentage of 12.5% ​​and 2 g of tetramethylethylenediamine solution with a mass percentage of 1% were added to the above diamond microsphere mixed slurry and stirred evenly to form a blank slurry; the blank slurry was poured into a glass mold and dried in a freeze dryer for more than 48 hours to ensure complete drying, and then demolded to obtain the diamond grinding wheel blank;

[0078] Preparation of diamond micronized grinding wheels: The diamond grinding wheel blank was placed in a muffle furnace and sintered at 650 °C for 2.5 h. Subsequently, it was cut according to the grinding wheel design and bonded to the grinding wheel matrix. After modification, the diamond grinding wheel product was obtained. The SEM image of the diamond grinding wheel product is shown below. Figure 2 As shown, the diamond grinding wheel includes a diamond grinding wheel body, large atmospheric pores closely distributed on the diamond grinding wheel body, and small pores formed between adjacent large atmospheric pores, wherein the diameter of the large atmospheric pores is 250-900 μm, and the diameter of the small pores is 1-5 μm.

[0079] Example 2

[0080] This embodiment provides a high-porosity ceramic-bonded diamond micron powder grinding wheel and its preparation method, including the following steps:

[0081] Preparation of sol solution A: Weigh 80 g of diamond with a D50 particle size of 800 nm and place it in a solution containing 250 g of tetraethyl orthosilicate and 600 ml of anhydrous ethanol. Add 4.5 g of acetylacetone, 3 g of sodium hexametaphosphate, 12 ml of nitric acid and 10 g of 150 nm nano-graphite powder. Mix thoroughly by ultrasonic mechanical stirring for 45 min to obtain sol solution A.

[0082] Preparation of salt mixture B: Weigh 65 g boric acid, 40 g aluminum nitrate nonahydrate, 60 g sodium nitrate, 7 g potassium nitrate, 8 g calcium nitrate tetrahydrate, 7 g zinc nitrate hexahydrate, 8 g magnesium nitrate hexahydrate, 8 g barium nitrate, 7 g lithium nitrate and 7 g zirconium nitrate and dissolve them in a mixed solution of anhydrous ethanol and deionized water. Mix evenly until completely dissolved to obtain salt mixture B;

[0083] Preparation of ceramic-bonded diamond gel: The steps are the same as in Example 1;

[0084] Preparation of ceramic binder diamond micro powder composite powder: The steps are basically the same as those in Example 1, the main difference being: drying temperature 150℃, sintering temperature 520℃, and ball milling to obtain ceramic binder diamond micro powder composite powder with a particle size of 1 μm.

[0085] Preparation of diamond ceramic composite particles: The steps are basically the same as those in Example 1, the main difference being that 5-8 μm PS microspheres are used as organic pore-forming agents, the frequency of the atomizer is 40 Hz, and diamond ceramic composite particles with a particle size of 30-80 μm are obtained.

[0086] Preparation of aggregated diamond microspheres: The diamond ceramic composite particles were placed in a muffle furnace for calcination and kept at 320 ℃ and 600 ℃ for 2 h respectively to obtain porous aggregated diamond microspheres with a particle size of 40-50 μm.

[0087] Preparation of calcium alginate water balls: The steps are basically the same as those in Example 1, the main difference being that the concentrations of sodium alginate solution and calcium chloride solution are both 1.5%, and calcium alginate water balls with particle sizes of 100 μm and 300 μm are obtained by sieving, with a mass ratio of 3:1 for the two particle sizes of calcium alginate water balls.

[0088] Preparation of diamond grinding wheel blanks: Acrylamide and N,N-methylenebisacrylamide were weighed at a mass ratio of 27:0.8 to prepare an amide mixed solution with a mass fraction of 7%; 40 ml of the amide mixed solution was weighed and 20 g of the porous aggregated diamond microspheres and 50 g of calcium alginate water spheres were added and stirred evenly to form a diamond microsphere mixed slurry; 5 g of ammonium persulfate solution with a mass percentage of 12.5% ​​and 2 g of tetramethylethylenediamine solution with a mass percentage of 1.5% were added to the above diamond microsphere mixed slurry and stirred evenly to form a blank slurry; the blank slurry was poured into a glass mold and dried in a freeze dryer for more than 48 hours to ensure complete drying, and then demolded to obtain the diamond grinding wheel blank;

[0089] Preparation of diamond grinding wheel: The steps are basically the same as those in Example 1. Finally, a diamond grinding wheel product is obtained. The main difference between this diamond grinding wheel and the diamond grinding wheel provided in Example 1 is that the large pores are concentrated in the range of 100-550 μm, and the small pores are concentrated in the range of 5-8 μm.

[0090] Example 3

[0091] This embodiment provides a high-porosity ceramic-bonded diamond micron powder grinding wheel and its preparation method, including the following steps:

[0092] Preparation of sol solution A: Weigh 100 g of diamond with a D50 particle size of 1200 nm and place it in a solution containing 300 g of tetraethyl orthosilicate and 800 ml of anhydrous ethanol. Add 3 g of acetylacetone, 3 g of polyoxyethylene ether, 15 ml of hydrochloric acid and 10 g of 300 nm nano-hexagonal boron nitride. Mix thoroughly by ultrasonic mechanical stirring for 45 min to obtain sol solution A.

[0093] Preparation of salt mixture B: Weigh 80 g boric acid, 50 g aluminum nitrate nonahydrate, 90 g sodium nitrate, 10 g potassium nitrate, 12 g calcium nitrate tetrahydrate, 7 g zinc nitrate hexahydrate, 8 g magnesium nitrate hexahydrate, 8 g barium nitrate, 7 g lithium nitrate and 7 g zirconium nitrate and dissolve them in a mixed solution of anhydrous ethanol and deionized water. Mix evenly until completely dissolved to obtain salt mixture B.

[0094] Preparation of ceramic-bonded diamond gel: The steps are the same as in Example 1;

[0095] Preparation of ceramic-bonded diamond micro powder composite powder: The steps are basically the same as those in Example 1, the main difference being: drying temperature 150℃, sintering temperature 500℃, and ball milling to obtain ceramic-bonded diamond micro powder composite powder with a particle size of 3 μm.

[0096] Preparation of diamond ceramic composite particles: The steps are basically the same as those in Example 1, the main difference being that 4-8 μm PS microspheres are used as organic pore-forming agents, the frequency of the atomizer is 40 Hz, and diamond ceramic composite particles with a particle size of 70-110 μm are obtained.

[0097] Preparation of agglomerated diamond microspheres: The diamond ceramic composite particles were placed in a muffle furnace for calcination and kept at 320 ℃ and 600 ℃ for 2 h respectively to obtain agglomerated diamond microspheres with a particle size of 70-100 μm.

[0098] Preparation of calcium alginate water balls: The steps are basically the same as those in Example 1, the main difference being that the concentrations of sodium alginate solution and calcium chloride solution are both 1.5%, and calcium alginate water balls with particle sizes of 200 μm and 400 μm are obtained by sieving, with a mass ratio of 1:3 for the two particle sizes of calcium alginate water balls.

[0099] Preparation of diamond grinding wheel blanks: Acrylamide and N,N-methylenebisacrylamide were weighed at a mass ratio of 25:0.8, and an amide mixed solution with a mass fraction of 7% was prepared; 40 ml of the amide mixed solution was weighed and 20 g of the agglomerated diamond microspheres and 50 g of calcium alginate water spheres were added and stirred evenly to form a diamond microsphere mixed slurry; 5 g of ammonium persulfate solution with a mass percentage of 12.5% ​​and 2 g of tetramethylethylenediamine solution with a mass percentage of 1.5% were added to the above diamond microsphere mixed slurry and stirred evenly to form a blank slurry; the blank slurry was poured into a glass mold and dried in a freeze dryer for more than 48 hours to ensure complete drying, and then demolded to obtain the diamond grinding wheel blank;

[0100] Preparation of diamond grinding wheel: The steps are basically the same as those in Example 1. Finally, a diamond grinding wheel product is obtained. The main difference between this diamond grinding wheel and the diamond grinding wheel provided in Example 1 is that the large pores are concentrated in the range of 200-750 μm, and the small pores are concentrated in the range of 4-8 μm.

[0101] Example 4

[0102] This embodiment provides a ceramic-bonded diamond grinding wheel and its preparation method, which is basically the same as the diamond grinding wheel and its preparation method provided in Embodiment 1. The main difference is that in this embodiment, no nanofiller is added in the "preparation of sol solution A" step, and the remaining steps and parameters are the same.

[0103] Example 5

[0104] This embodiment provides a ceramic-bonded diamond grinding wheel and its preparation method, which is basically the same as the diamond grinding wheel and its preparation method provided in Embodiment 1. The main difference is that in this embodiment, no organic pore-forming agent is added in the "preparation of diamond ceramic composite particles" step, and the remaining steps and parameters are the same.

[0105] Comparative Example 1

[0106] This comparative example provides a ceramic-bonded diamond grinding wheel and its preparation method, which is basically the same as the diamond grinding wheel and its preparation method provided in Example 1. The main difference is that in this example, no nanofiller is added in the "preparation of sol solution A" step, the "preparation of calcium alginate water spheres" step is omitted, and calcium alginate water spheres are not added in the "preparation of diamond grinding wheel blank". The PMMA microspheres used have a pore size of 30-50 μm. The remaining steps are the same. Thus, the diamond grinding wheel is prepared as follows. Figure 3 As shown, the diamond grinding wheel body has multiple micropores with a diameter of 30-50 μm.

[0107] Comparative Example 2

[0108] This comparative example provides a ceramic-bonded diamond grinding wheel and its preparation method, which is basically the same as the diamond grinding wheel and its preparation method provided in Example 1. The main difference is that in this comparative example, PMMA microspheres with a pore size of 500 μm of equal mass are used instead of calcium alginate water spheres. During the preparation of the diamond micro powder grinding wheel, agglomeration may occur, such as... Figure 4 The images show phenomena such as blackened core (left) or clumped, dried, and cracked areas (right).

[0109] This invention also provides the diamond grinding wheels provided in the above embodiments and Comparative Example 1 as silicon carbide thinning grinding wheels, and their application in the processing of silicon carbide wafers. Specifically, the diamond grinding wheels were used on an OKAMOTO grinding machine to grind 4-inch silicon carbide wafers (roughness 180 nm), silicon wafers (roughness 130 nm), and gallium nitride (roughness 150 nm). The grinding wheel speed was 1500 rpm, and the grinding wheel was used at different feed rates for 20 minutes while maintaining a current value of 14 A. Then, the processing efficiency was calculated, and the surface roughness of the silicon carbide wafers after grinding was tested using a SuperViewW1 series white light interferometer. The results are shown in Table 1. The porosity of the diamond grinding wheels provided in each embodiment and comparative example is shown in Table 1.

[0110] Porosity determination method: Weigh the cut sample strip (m1). Place the sample in a vacuum chamber and add distilled water until it completely covers the sample. Turn on the vacuum extractor until the residual pressure is less than 0.0013 MPa. Evacuate the air until no air bubbles appear on the sample, then remove the sample. Place the saturated sample on the instrument and quickly weigh the saturated sample in air (m2) (when using the boiling method, use multiple layers of water-saturated gauze to wipe away the moisture adhering to the sample surface), accurate to 0.0001 g. Place the saturated sample in water and weigh it in water (m3), accurate to 0.0001 g. Porosity (%) = (m3 - m1 / (m3 - m2) × 100.

[0111] Table 1. Results of Porosity and Machining Performance of Diamond Grinding Wheels

[0112]

[0113] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them; although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications can still be made to the specific implementation of the present invention or equivalent substitutions can be made to some technical features without departing from the scope of this case.

Claims

1. A method for preparing a high-porosity ceramic-bonded diamond micron abrasive, comprising the following steps: Preparation of ceramic-bonded diamond micron powder composite powder: Ceramic-bonded diamond micron powder composite powder was prepared using the sol-gel method, wherein, The raw materials of the ceramic binder diamond micro powder composite powder include 0-5 wt% nanofiller and diamond micro powder; Preparation of agglomerated diamond microspheres: Using the ceramic-bonded diamond micro powder composite powder and organic pore-forming agent as raw materials, porous agglomerated diamond microspheres are prepared by atomization granulation method, wherein the mass ratio of the ceramic-bonded diamond micro powder composite powder to the organic pore-forming agent is (6-10): (0-4), and the particle size of the organic pore-forming agent is not less than 1.0 μm; Preparation of calcium alginate water balls: Calcium alginate water ball solution was prepared using sodium alginate and calcium salt as raw materials via multiple emulsion method and atomization granulation method. Preparation of ceramic-bonded diamond micropowder abrasives: Ceramic-bonded diamond micropowder abrasives are prepared using the porous aggregated diamond microspheres and calcium alginate water spheres as the main raw materials by gel casting method.

2. The preparation method according to claim 1, characterized in that, The nanofiller accounts for 0.5-5 wt% and has a particle size of 50-100 nm.

3. The preparation method according to claim 2, characterized in that, The raw materials for the ceramic binder diamond micro powder composite powder also include 40-60 wt% diamond micro powder, with the remainder being ceramic binder raw materials prepared by the sol-gel method.

4. The preparation method according to claim 1, characterized in that, The steps for preparing agglomerated diamond microspheres include: first, mixing the ceramic binder diamond micro powder composite powder and an organic pore-forming agent, and preparing a ceramic slurry with a solid content of 25-40%; then, placing the ceramic slurry into an atomizing granulator for granulation, wherein the atomization frequency is 30-50 Hz and the atomization temperature is 180℃-230℃, to obtain diamond ceramic composite particles; and then, sintering the diamond ceramic composite particles to obtain the porous agglomerated diamond microspheres.

5. The preparation method according to any one of claims 1 to 4, characterized in that, The organic pore-forming agent includes organic pore-forming agents with particle sizes of 1.0-10 μm and 80-500 μm.

6. The preparation method according to any one of claims 1 to 4, characterized in that, The organic pore-forming agent has a particle size of 1.0-10 μm.

7. The preparation method according to claim 6, characterized in that, The mass ratio of the ceramic binder diamond micro powder composite powder to the organic pore-forming agent is (6-8): (2-4), and the particle size of the ceramic binder diamond micro powder composite powder is 0.5-3 μm.

8. The preparation method according to any one of claims 1 to 4 or 7, characterized in that, The steps for preparing calcium alginate water balls include: adding 1-5 wt% sodium alginate solution to 0.5-5 wt% calcium salt solution using an atomizing nozzle or dropper to prepare calcium alginate water ball solution.

9. The preparation method according to claim 8, characterized in that, The calcium salt is calcium chloride or calcium lactate.

10. A raw material for a high-porosity ceramic-bonded diamond micron powder abrasive, characterized in that, The product comprises porous aggregated diamond microspheres and calcium alginate water spheres in a mass ratio of (1-5):(5-15). The porous aggregated diamond microspheres have a particle size of 5-150 μm. The porous aggregated diamond microspheres are mainly prepared by atomization granulation and sintering in a muffle furnace to remove the organic pore-forming agent, using ceramic-bonded diamond micro powder composite powder and organic pore-forming agent as raw materials. The raw materials of the ceramic-bonded diamond micro powder composite powder include 0-5 wt% nanofiller. The calcium alginate water spheres have a particle size of 80-600 μm.

11. The raw material according to claim 10, characterized in that, The raw materials for the ceramic binder diamond micro powder composite powder include 40-60 wt% diamond micro powder, with the remainder being ceramic binder raw materials prepared by the sol-gel method.

12. The raw material according to claim 10 or 11, characterized in that, The raw materials for the calcium alginate water balls include 1-5 wt% sodium alginate solution and 0.5-5 wt% calcium salt solution, wherein the calcium salt is calcium chloride or calcium lactate.

13. A high-porosity ceramic-bonded diamond micron abrasive prepared by the preparation method according to any one of claims 1 to 9, characterized in that, Its porosity reaches over 60%, and it includes a diamond micro powder abrasive body, large atmospheric pores tightly and uniformly distributed in the diamond micro powder abrasive body, and small pores distributed between adjacent large atmospheric pores, wherein the pore diameter of the large atmospheric pores is 80-1000 μm, and the pore diameter of the small pores is 1.0-10 μm.

14. The application of the high-porosity ceramic-bonded diamond micron abrasive as described in claim 13 in semiconductor material processing.

Images