Laterally-placed lower image wafer cutting device

Abstract

The invention relates to a laterally-placed lower image wafer cutting device which comprises a wafer rotary cutting mechanism, a supporting mechanism, an X-axis movement module and a Y-axis movement module. The X-axis movement module and the Y-axis movement module which are located below the cross beam drive the wafer rotary cutting mechanism to move in the left-right direction and the front-back direction correspondingly. The left side of the supporting stand column is provided with a side laying-down image mechanism, and the side laying-down image mechanism is located below the wafer rotary cutting mechanism. The device comprises a mechanism capable of obtaining the contour of the lower surface of the wafer and also comprises a lifting mechanism capable of transferring the wafer, all the mechanisms are matched together to complete cutting machining of the polymer surface of the wafer and transferring of the wafer, and normal production of the next working procedure is guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field related to wafer cutting processing, and in particular to a side-placed bottom-image wafer cutting device. Background Art

[0002] One of the steps in wafer processing requires boundary cutting. During the processing, the wafer needs to be placed according to the following requirements, that is, the upper surface of the wafer is a polymer surface and the lower surface is a glass surface. The glass surface of the lower surface cannot be seen from the polymer surface of the upper surface. Before cutting the wafer, it is necessary to obtain the contour data of the cut wafer. Because the center of the polymer packaging surface used in the wafer packaging process is not concentric with the center of the glass surface, in order to ensure that the next process has a better peeling effect, it is necessary to accurately find the center of the polymer packaging surface and the center of the glass surface of the wafer. Therefore, it is necessary to obtain the center of the glass surface of the wafer. According to the center of the glass surface and the center of the polymer surface, a difference between the two can be given. By compensating for this interpolation during the cutting process, the accuracy of the cutting can be ensured, which is convenient for separation in the next process. Therefore, a mechanism is needed to obtain the contour of the lower surface of the wafer. At the same time, when the wafer is placed on the wafer cutting carrier, it is also necessary to provide a lifting mechanism in the wafer carrier that can supply wafer transfer.

[0003] In view of the above-mentioned defects, the designer actively conducts research and innovation in order to create a side-mounted bottom-image wafer cutting device to make it more valuable for industrial use. Summary of the invention

[0004] In order to solve any of the above technical problems, the object of the present invention is to provide a side-mounted bottom-image wafer cutting device.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] A side-mounted bottom-image wafer cutting device comprises a wafer rotating cutting mechanism, a supporting mechanism, an X-axis motion module and a Y-axis motion module; the supporting mechanism comprises a bottom fixing plate, a supporting column and a crossbeam, and supporting columns are installed on both left and right sides of the bottom of the crossbeam, and the bottom of the supporting column is connected to the bottom fixing plate installed below through an adapter plate, and the X-axis motion module and the Y-axis motion module located below the crossbeam respectively drive the wafer rotating cutting mechanism to move in the left-right direction and the front-back direction;

[0007] A side-down imaging mechanism is installed on the left side of the supporting column, and the side-down imaging mechanism is located below the wafer rotating cutting mechanism;

[0008] The side-down imaging mechanism includes a bottom support plate installed on a supporting column. A slide module installed on the bottom support plate drives the lens support plate to move in the front-rear direction. A lens and a light source are installed on the lens support plate in sequence from back to front. A camera is installed at the rear end of the lens, and a reflector is installed on the bottom support plate in front of the light source.

[0009] As a further improvement of the present invention, a front pressure plate and a rear pressure plate are respectively installed at the front and rear ends of the lens, and the light source is installed on the bottom support plate in front of the front pressure plate through a light source adapter plate.

[0010] As a further improvement of the present invention, the reflector is mounted on an adjustment frame, and the adjustment frame is obliquely mounted on the bottom support plate through an adjustment frame support plate.

[0011] As a further improvement of the present invention, the wafer rotary cutting mechanism includes a torque motor installed on the carrier base, and the torque motor drives the upper adsorption carrier to rotate.

[0012] As a further improvement of the present invention, a slide plate is installed at the bottom of the carrier base, and the carrier base is installed on the slide plate below through a plurality of carrier adjustment screws.

[0013] As a further improvement of the present invention, an adsorption lifting platform mechanism for loading and unloading wafers on the wafer rotating cutting mechanism is installed on the right side of the wafer rotating cutting mechanism.

[0014] As a further improvement of the present invention, the adsorption lifting platform mechanism includes an adsorption lifting base installed on the wafer rotating cutting mechanism, and a screw motor is installed in the middle of the bottom of the adsorption lifting base through a motor fixing plate. The screw motor drives the lifting table above the adsorption lifting base to move in the vertical direction, and a mechanical finger is installed on the lifting table through a mechanical arm pressure plate.

[0015] As a further improvement of the present invention, a plurality of guide shafts are installed on the adsorption lifting base through linear bearings, and the tops of the guide shafts are installed on the bottom of the lifting table through guide rod fixing plates.

[0016] As a further improvement of the present invention, a lifting sensor is installed on one side of the adsorption lifting base through a pad, and a lifting sensing plate compatible with the above-mentioned lifting sensor is installed on the bottom of the lifting table; a proximity sensor is installed on the side of the adsorption lifting base close to the wafer rotation cutting mechanism through a sensor fixing plate.

[0017] By means of the above scheme, the present invention has at least the following advantages:

[0018] The present invention includes a mechanism capable of acquiring the contour of the lower surface of the wafer, and also includes a lifting mechanism capable of supplying wafer transfer. The various mechanisms cooperate together to complete the cutting process of the wafer polymer surface and the transfer of the wafer, thereby ensuring the normal production of the next process.

[0019] The adsorption carrier of the present invention can rotate and move to a suitable position through the movement of an X-axis motion module and a Y-axis motion module, and then the carrier rotates to identify the back side parameters of the wafer.

[0020] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 It is a structural schematic diagram of a side-placed bottom-image wafer cutting device of the present invention;

[0023] Figure 2 yes Figure 1 The structural diagram of the imaging mechanism is shown in the middle side;

[0024] Figure 3 yes Figure 1 A schematic diagram of the structure of the wafer rotary cutting mechanism;

[0025] Figure 4 yes Figure 1 The structural diagram of the adsorption lifting platform mechanism;

[0026] Figure 5 yes Figure 4 The structural diagram of the other side;

[0027] Figure 6 yes Figure 1 Schematic diagram of the structure of the middle support mechanism.

[0028] The meanings of the various reference numerals in the figures are as follows.

[0029] Side-down imaging mechanism 1, wafer rotation cutting mechanism 2, adsorption lifting platform mechanism 3, support mechanism 4, X-axis motion module 5, Y-axis motion module 6;

[0030] Camera 101, lens 102, rear pressure plate 103, front pressure plate 104, light source adapter plate 105, lens support plate 106, reflector 107, adjustment frame 108, adjustment frame support plate 109, bottom support plate 110, light source 111, slide module 112;

[0031] Stage base 201, torque motor 202, adsorption stage 203, slide plate 204, stage adjustment screw 205;

[0032] Guide shaft 301, robot finger 302, lifting sensor 303, lifting sensor sheet 304, cushion block 305, lifting table 306, robot pressure plate 307, pipe joint 308, motor fixing plate 309, guide rod fixing plate 310, screw motor 311, adsorption lifting base 312, proximity sensor 313, sensor fixing plate 314, fixing screw 315, linear bearing 316;

[0033] Bottom fixing plate 401 , adapter plate 402 , supporting columns 403 , and cross beam 404 . DETAILED DESCRIPTION

[0034] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0035] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. Obviously, the described embodiment is only a part of the embodiment of the present invention, rather than all the embodiments. The components of the embodiment of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiment of the present invention provided in the drawings is not intended to limit the scope of the invention claimed for protection, but merely represents the selected embodiment of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present invention.

[0036] Example

[0037] like Figure 1 to Figure 6 As shown,

[0038] A side-placed bottom-image wafer cutting device mainly comprises a side-placed bottom-image mechanism 1, a wafer rotation cutting mechanism 2, an adsorption lifting platform mechanism 3, a supporting mechanism 4, an X-axis motion module 5 and a Y-axis motion module 6.

[0039] 1. The support mechanism 4 serves as the bottom support mechanism of the overall device, and mainly includes a bottom fixed plate 401, a support column 403 and a crossbeam 404. Support columns 403 are installed on both left and right sides of the bottom of the crossbeam 404. The bottom of the support column 403 is connected to the bottom fixed plate 401 installed below through an adapter plate 402. The X-axis motion module 5 and the Y-axis motion module 6 located below the crossbeam 404 respectively drive the wafer rotation cutting mechanism 2 to move in the left and right directions and the front and back directions.

[0040] 2. A side-down imaging mechanism 1 is installed on the left side of the supporting column 403 , and the side-down imaging mechanism 1 is located below the wafer rotating cutting mechanism 2 . The side-down imaging mechanism 1 is mainly used to obtain the contour of the lower surface of the wafer on the adsorption stage 203 .

[0041] The side-down imaging mechanism 1 includes a bottom support plate 110 mounted on a support column 403, a slide module 112 mounted on the bottom support plate 110 drives the lens support plate 106 to move in the front-back direction, a lens 102 and a light source 111 are mounted on the lens support plate 106 from back to front, a camera 101 is mounted on the rear end of the lens 102, a front pressure plate 104 and a rear pressure plate 103 are mounted on the front and rear ends of the lens 102, respectively, and the light source 111 is mounted on the bottom support plate 110 in front of the front pressure plate 104 through a light source adapter plate 105. A reflector 107 is mounted on the bottom support plate 110 in front of the light source 111. The reflector 107 is mounted on an adjustment frame 108, and the adjustment frame 108 is tiltedly mounted on the bottom support plate 110 through an adjustment frame support plate 109.

[0042] 3. The wafer rotation cutting mechanism 2 includes a torque motor 202 mounted on the stage base 201, and the torque motor 202 drives the upper adsorption stage 203 to rotate. A slide plate 204 is mounted at the bottom of the stage base 201, and the stage base 201 is mounted on the lower slide plate 204 through a plurality of stage adjustment screws 205. The installation condition of the stage base 201 on the slide plate 204 can be adjusted by adjusting the stage adjustment screws 205.

[0043] 4. An adsorption lifting platform mechanism 3 for loading and unloading wafers on the wafer rotating cutting mechanism 2 is installed on the right side of the wafer rotating cutting mechanism 2.

[0044] The adsorption lifting platform mechanism 3 includes an adsorption lifting base 312 installed on the wafer rotary cutting mechanism 2. A screw motor 311 is installed in the middle of the bottom of the adsorption lifting base 312 through a motor fixing plate 309. The screw motor 311 drives the lifting table 306 located above the adsorption lifting base 312 to move in the vertical direction. A pipe joint 308 is installed on the lifting table 306. The motor fixing plate 309 is installed on the adsorption lifting base 312 through a plurality of fixing screws 315. A mechanical finger 302 is installed on the lifting table 306 through a manipulator pressing plate 307. The mechanical finger 302 is used for loading and unloading wafers. A vacuum suction cup and other grasping structures can be installed on the mechanical finger 302.

[0045] Guide structure: A plurality of guide shafts 301 are installed on the adsorption lifting base 312 through linear bearings 316 , and the top of the guide shaft 301 is installed on the bottom of the lifting table 306 through a guide rod fixing plate 310 .

[0046] Sensor structure: A lifting sensor 303 is installed on one side of the adsorption lifting base 312 through a pad 305, and a lifting sensing sheet 304 compatible with the above-mentioned lifting sensor 303 is installed at the bottom of the lifting table 306; a proximity sensor 313 is installed on the side of the adsorption lifting base 312 close to the wafer rotation cutting mechanism 2 through a sensor fixing plate 314.

[0047] The working process of the present invention is briefly described as follows:

[0048] When cutting the border of the wafer, it is first necessary to obtain the upper and lower surface contour data, place the wafer with the polymer on the adsorption stage 203, turn on the vacuum adsorption of the wafer, and move it by the X-axis motion module 5 and the Y-axis motion module 6 to drive the wafer rotation cutting mechanism 2 to the appropriate position of the side-down imaging mechanism 1, and then the torque motor 202 in the wafer rotation cutting mechanism 2 rotates to drive the upper adsorption stage 203 to rotate, thereby driving the wafer to rotate, and at the same time, the camera 101 in the side-down imaging mechanism 1 obtains the back glass data of the wafer through the lens 102 and the light source 111 via the reflector 107, and the software obtains the center of circle data through calculation. After the cutting is completed, the screw motor 311 in the adsorption lifting platform mechanism 3 drives the lifting table 306 to move up and down, thereby driving the mechanical finger 302 to move up and down, and driving the wafer and the robot to load and unload materials interactively.

[0049] The X-axis direction described in this article is as follows Figure 1 The left and right directions shown in the figure are the Y-axis directions described in this article. Figure 1 The Z-axis direction in this article is as shown in the front-to-back direction. Figure 1 The up and down directions shown in .

[0050] The present invention includes a mechanism capable of acquiring the contour of the lower surface of the wafer, and also includes a lifting mechanism capable of supplying wafer transfer. The various mechanisms cooperate together to complete the cutting process of the wafer polymer surface and the transfer of the wafer, thereby ensuring the normal production of the next process.

[0051] The adsorption carrier of the present invention can rotate and move to a suitable position through the movement of an X-axis motion module and a Y-axis motion module, and then the carrier rotates to identify the back side parameters of the wafer.

[0052] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implying the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0053] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0054] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principles of the present invention, and these improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A side-mounted bottom-image wafer cutting device, comprising a wafer rotating cutting mechanism (2), a supporting mechanism (4), an X-axis motion module (5) and a Y-axis motion module (6); the supporting mechanism (4) comprises a bottom fixing plate (401), a supporting column (403) and a crossbeam (404); supporting columns (403) are installed on both left and right sides of the bottom of the crossbeam (404); the bottom of the supporting column (403) is connected to the bottom fixing plate (401) installed below through an adapter plate (402); the X-axis motion module (5) and the Y-axis motion module (6) located below the crossbeam (404) respectively drive the wafer rotating cutting mechanism (2) to move in the left-right direction and the front-back direction; Features: A side-down imaging mechanism (1) is installed on the left side of the supporting column (403), and the side-down imaging mechanism (1) is located below the wafer rotary cutting mechanism (2); The side-down imaging mechanism (1) comprises a bottom support plate (110) mounted on a support column (403); a slide module (112) mounted on the bottom support plate (110) drives a lens support plate (106) to move in a front-to-rear direction; a lens (102) and a light source (111) are mounted on the lens support plate (106) in sequence from back to front; a camera (101) is mounted at the rear end of the lens (102); and a reflector (107) is mounted on the bottom support plate (110) in front of the light source (111).

2. The side-mounted bottom-image wafer cutting device according to claim 1, characterized in that: A front pressing plate (104) and a rear pressing plate (103) are respectively installed at the front and rear ends of the lens (102), and the light source (111) is installed on a bottom support plate (110) in front of the front pressing plate (104) via a light source adapter plate (105).

3. The side-mounted bottom-image wafer cutting device according to claim 1, characterized in that: The reflector (107) is mounted on an adjustment frame (108), and the adjustment frame (108) is tiltedly mounted on a bottom support plate (110) via an adjustment frame support plate (109).

4. The side-mounted bottom-image wafer cutting device according to claim 1, characterized in that: The wafer rotary cutting mechanism (2) comprises a torque motor (202) mounted on a carrier base (201), and the torque motor (202) drives an upper adsorption carrier (203) to rotate.

5. The side-mounted bottom-image wafer cutting device as claimed in claim 4, characterized in that: A slide plate (204) is installed at the bottom of the platform base (201), and the platform base (201) is installed on the slide plate (204) below via a plurality of platform adjustment screws (205).

6. The side-mounted bottom-image wafer cutting device according to claim 1, characterized in that: An adsorption lifting platform mechanism (3) for loading and unloading wafers on the wafer rotating cutting mechanism (2) is installed on the right side of the wafer rotating cutting mechanism (2).

7. The side-mounted bottom-image wafer cutting device according to claim 6, characterized in that: The adsorption lifting platform mechanism (3) comprises an adsorption lifting base (312) mounted on the wafer rotary cutting mechanism (2), a screw motor (311) is mounted in the middle of the bottom of the adsorption lifting base (312) via a motor fixing plate (309), the screw motor (311) drives a lifting platform (306) located above the adsorption lifting base (312) to move in a vertical direction, and a mechanical finger (302) is mounted on the lifting platform (306) via a mechanical hand pressure plate (307).

8. The side-mounted bottom-image wafer cutting device according to claim 7, characterized in that: A plurality of guide shafts (301) are installed on the adsorption lifting base (312) via linear bearings (316), and the tops of the guide shafts (301) are installed on the bottom of the lifting table (306) via guide rod fixing plates (310).

9. The side-mounted bottom-image wafer cutting device according to claim 7, characterized in that: A lifting sensor (303) is installed on one side of the adsorption lifting base (312) through a pad (305), and a lifting induction sheet (304) compatible with the lifting sensor (303) is installed at the bottom of the lifting table (306); a proximity sensor (313) is installed on the side of the adsorption lifting base (312) close to the wafer rotating cutting mechanism (2) through a sensor fixing plate (314).

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