Corrosion optical fiber apparatus, method, computer apparatus, medium and program product

Abstract

The invention discloses an optical fiber corrosion device and method, a computer device, a medium and a program product, the optical fiber corrosion device is provided with a corrosion groove and two isolation grooves, the corrosion groove is used for bearing corrosion liquid, the two isolation grooves are sequentially arranged at two sides of the corrosion groove along a first direction, and the two isolation grooves and the corrosion groove are separately arranged at intervals; the two isolation grooves are symmetrically arranged along a second direction; the optical fiber corrosion device further comprises two limiting pieces, the limiting pieces are provided with a plurality of limiting grooves which are sequentially arranged in the second direction, the limiting grooves of the two limiting pieces are symmetrical in the second direction, the size of the corrosion groove in the third direction is defined as the groove depth of the corrosion groove, and the size of the limiting groove in the third direction is defined as the groove depth of the limiting groove. The ratio range of the groove depth of the corrosion groove to the groove depth of the limiting groove is [1.6, 2]. According to the embodiment of the invention, the optical fiber can be uniformly corroded, and the smoothness of the optical fiber is guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of laser processing, and particularly relates to an optical fiber corrosion device, a method, a computer device, a medium, and a program product. Background Art

[0002] The change in the corrosion diameter of an optical fiber can directly improve the output beam quality of a beam combiner, thereby affecting the matching degree and efficiency of the beam combiner in the overall optical path, affecting the stability of the temperature environment of the whole machine and the use effect of the final product. Therefore, corroding a smooth and uniform optical fiber is the basis for preparing a high-quality beam combiner. However, in the related art, the smoothness of the corroded optical fiber is poor, and the defective optical fiber affects the quality of the beam combiner. Summary of the Invention

[0003] Embodiments of the present invention provide an optical fiber corrosion device, a method, a computer device, a medium, and a program product, which can corrode the optical fiber more uniformly and ensure the smoothness of the optical fiber.

[0004] The optical fiber corrosion device proposed by the present invention is provided with a corrosion tank and two isolation tanks. Define that the first direction, the second direction, and the third direction are perpendicular to each other pairwise. The corrosion tank is used to carry the corrosion liquid. The corrosion tank is opened along the third direction. The two isolation tanks are sequentially arranged on both sides of the corrosion tank along the first direction. The two isolation tanks are respectively arranged at intervals with the corrosion tank. The two isolation tanks are symmetrically arranged along the second direction.

[0005] The optical fiber corrosion device further includes two limiting members. The two limiting members are sequentially arranged on both sides of the corrosion tank along the first direction. The limiting member separates the corrosion tank and one of the isolation tanks. The limiting member is provided with a plurality of limiting grooves. The plurality of limiting grooves are sequentially arranged along the second direction. The plurality of limiting grooves of the two limiting members are symmetric along the second direction. Define the dimension of the corrosion tank along the third direction as the depth of the corrosion tank, and the dimension of the limiting groove along the third direction as the depth of the limiting groove. The ratio range of the depth of the corrosion tank to the depth of the limiting groove is [1.6, 2).

[0006] Optionally, the ratio range of the depth of the corrosion tank to the depth of the limiting groove is [1.95, 2)

[0007] Optionally, define the dimension of the limiting groove along the second direction as the width of the limiting groove. The ratio of the depth of the limiting groove to the width of the limiting groove is greater than 2.

[0008] Optionally, the width of the limiting groove is less than or equal to 0.8 mm.

[0009] Optionally, the optical fiber etching device is further provided with two protection grooves, which are arranged on the side of the isolation groove away from the etching groove, and the two protection grooves are symmetrically arranged along the second direction, and the protection grooves are used for carrying protection liquid.

[0010] The present invention also provides an optical fiber etching method, which is applicable to the optical fiber etching device as described in any of the above embodiments. The optical fiber etching method includes:

[0011] Put the optical fiber with the coating layer removed into the two symmetrical limiting grooves.

[0012] Limit the optical fiber placed in the limiting groove.

[0013] Pour the etching liquid into the etching groove, and make the liquid level of the etching liquid exceed the groove wall of the etching groove.

[0014] Optionally, the optical fiber etching device is provided with two protection grooves, which are arranged on the side of the isolation groove away from the etching groove, and the two protection grooves are symmetrically arranged along the second direction, and the protection grooves are used for carrying protection liquid. The optical fiber etching method further includes:

[0015] Make the stripping opening of the optical fiber located on the side of the protection groove away from the etching groove.

[0016] Pour the protection liquid into the two protection grooves.

[0017] Optionally, the optical fiber etching method further includes:

[0018] Put the accompanying optical fiber into the two symmetrical limiting grooves, wherein the two limiting grooves for limiting the accompanying optical fiber are respectively located at the edges of the two limiting members.

[0019] Optionally, the limiting of the optical fiber placed in the limiting groove includes:

[0020] Use an adhesive to adhere the optical fiber to the optical fiber etching device.

[0021] And / or

[0022] Use a pressing block to press the optical fiber against the optical fiber etching device.

[0023] The present invention also provides a computer device, including a memory and a processor. A computer program is stored in the memory. When the computer program is executed by the processor, the processor executes the method as described in any of the above embodiments.

[0024] The present invention also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the method as described in any of the above embodiments is implemented.

[0025] The present invention also provides a computer program product, including a computer program which, when executed by a processor, implements the method according to any one of the above embodiments.

[0026] In the fiber optic corrosion device provided by the embodiment of the present invention, the ratio range of the groove depth of the corrosion tank to the groove depth of the limit tank is [1.6, 2), so that the optical fiber placed in the limit tank for limiting can be located at a position slightly above the middle in the corrosion tank, that is, a position is reserved for the precipitation hydrate below the optical fiber. After the reaction proceeds for a period of time to generate the precipitation hydrate, the optical fiber can still be located in the center of the corrosion liquid. In addition, two limit members are arranged on both sides of the corrosion tank to prevent the corrosion liquid in the corrosion tank from overflowing under the action of tension. When the optical fiber starts to be corroded, the corrosion liquid can be poured into the corrosion tank to a height exceeding the corrosion tank by a certain height, ensuring that the optical fiber is still in the center of the corrosion liquid at the beginning of the reaction, so as to ensure that the height of the corrosion liquid above and below the optical fiber is the same, and thus ensure the smoothness of the optical fiber.

[0027] In the fiber optic corrosion method, computer device, computer-readable storage medium and computer program product provided by the embodiment of the present invention, after the optical fiber is placed in the limit tank, the optical fiber is limited to prevent the optical fiber from shaking relative to the corrosion tank. After the optical fiber is limited, the corrosion liquid is poured in, avoiding being affected by the corrosion liquid during the process of adjusting the position of the optical fiber, and avoiding poor corrosion effect caused by the optical fiber being corroded during the process of adjusting the position. The liquid level of the corrosion liquid exceeds the tank wall of the corrosion tank, so that the height of the corrosion liquid above and below the optical fiber is consistent, keeping the optical fiber in the center of the corrosion liquid, ensuring that the corrosion effect above and below the optical fiber is always the same, and thus ensuring the smoothness of the optical fiber. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0029] Figure 1 It is a schematic structural diagram of an embodiment of the fiber optic corrosion device of the present invention;

[0030] Figure 2 It is Figure 1 The partial enlarged view at A in

[0031] Figure 3 It is a side view of an embodiment of the fiber optic corrosion device of the present invention;

[0032] Figure 4 It is Figure 3 The enlarged view at B in

[0033] Figure 5It is a schematic structural diagram of an embodiment of the fiber optic corrosion device of the present invention;

[0034] Figure 6 is Figure 5 a cross-sectional view taken along line C-C in

[0035] Figure 7 It is a schematic flowchart of an embodiment of the fiber optic corrosion method of the present invention;

[0036] Figure 8 It is a schematic flowchart of another embodiment of the fiber optic corrosion method of the present invention;

[0037] Explanation of the reference numerals in the drawings:

[0038] Fiber optic corrosion device 100;

[0039] Corrosion tank 10, isolation tank 13, protection tank 15;

[0040] Limiting member 20, limiting groove 21;

[0041] The realization, functional features and advantages of the object of the present invention will be further

[0042] described with reference to the embodiments and the accompanying drawings. Specific embodiments

[0043] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0044] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0045] It should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.

[0046] It should be understood that the term "and / or" used in the specification and appended claims of the present invention refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0047] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality of" means two or more, unless otherwise specifically defined.

[0048] Please refer to Figures 1 to 6 , an optical fiber etching device 100 is provided in an embodiment of the present invention. The optical fiber etching device 100 is provided with an etching tank 10 and two isolation tanks 13, and the optical fiber etching device 100 further includes two limiting members 20. Among them, a first direction, a second direction, and a third direction are defined to be perpendicular to each other pairwise. The etching tank 10 is used to carry the etching solution, the etching tank 10 is opened along the third direction, the two isolation tanks 13 are sequentially arranged on both sides of the etching tank 10 along the first direction, the two isolation tanks 13 are respectively arranged at intervals from the etching tank 10, and the two isolation tanks 13 are symmetrically arranged along the second direction. The two limiting members 20 are sequentially arranged on both sides of the etching tank 10 along the first direction. The limiting member 20 separates the etching tank 10 and an isolation tank 13. The limiting member 20 is provided with a plurality of limiting grooves 21, and the plurality of limiting grooves 21 are sequentially arranged along the second direction. The plurality of limiting grooves 21 of the two limiting members 20 are symmetric along the second direction. The size of the etching tank 10 along the third direction is defined as the groove depth H of the etching tank 10, and the size of the limiting groove 21 along the third direction is defined as the groove depth h of the limiting groove 21. The ratio range of the groove depth H of the etching tank 10 to the groove depth h of the limiting groove 21 is [1.6, 2).

[0049] During the process of the etching solution etching the optical fiber, precipitated hydrates will be generated. In the embodiment of the present invention, the ratio range of the groove depth H of the etching tank 10 to the groove depth h of the limiting groove 21 is [1.6, 2), so that the optical fiber placed in the limiting groove 21 for limiting can be located at a position slightly above the middle in the etching tank 10, that is, a position is reserved for the precipitated hydrates below the optical fiber. After the reaction proceeds for a period of time to generate precipitated hydrates, the optical fiber can still be located in the center of the etching solution. In addition, the two limiting members 20 are arranged on both sides of the etching tank 10 to help the etching solution in the etching tank 10 not overflow under the action of tension. When starting to etch the optical fiber, an etching solution exceeding a certain height of the etching tank 10 can be poured into the etching tank 10 to ensure that the optical fiber is still in the center of the etching solution at the beginning of the reaction, so as to ensure that the heights of the etching solutions above and below the optical fiber are the same, and thus ensure the smoothness of the optical fiber.

[0050] Specifically, in a certain embodiment, the etching tank 10 is in the shape of a cuboid. In this way, it is ensured that the optical fiber located in the etching tank 10 is in a uniform etching solution.

[0051] The isolation tank 13 is used to hold the etching solution overflowing from the etching tank 10, preventing the etching solution from flowing out and corroding other positions of the optical fiber.

[0052] It can be understood that there are many ways to form the limiting member 20. In a certain embodiment, after the etching tank 10 and the isolation tank 13 are respectively opened in the optical fiber etching device 100, the space between the etching tank 10 and the isolation tank 13 naturally forms the limiting member 20; in another embodiment, the optical fiber etching device 100 opens an entire tank body, and a partition protrusion is provided in the tank body to divide the tank body into the etching tank 10 and the isolation tank 13, and the partition protrusion forms the limiting member 20. The present application does not make specific limitations.

[0053] It can be understood that the specific ratio of the depth H of the etching tank 10 to the depth h of the limiting groove 21 can be adjusted according to factors such as the value of the depth h of the limiting groove 21, the shape of the etching tank 10, and the critical value of the surface tension of the etching solution. It is necessary to ensure that when the etching solution exceeds the etching tank 10, it can remain in a non-overflow state under the action of the liquid surface tension, and ensure that the optical fiber is located in the center of the etching solution. The present application does not make specific limitations.

[0054] In a certain embodiment, the shape of the limiting groove 21 is a U-shaped groove. In this way, while the optical fiber can be better limited, it can also avoid scratching the optical fiber.

[0055] It can be understood that the multiple limiting grooves 21 of the two limiting members 20 are symmetric along the second direction, which means that the multiple limiting grooves 21 on one limiting member 20 can correspond to the multiple limiting grooves 21 on the other limiting member 20 one by one, and the corresponding limiting grooves 21 are axisymmetric with the second direction as the axis of symmetry. In this way, it can be ensured that the optical fiber can be limited by the corresponding two limiting grooves 21 at the same time, avoiding the shaking of the optical fiber. In addition, the multiple symmetric limiting grooves 21 can also keep multiple optical fibers arranged parallel to each other, avoiding interference between the optical fibers.

[0056] Please refer to Figures 3 to 6 , in the embodiment of the present invention, the ratio range of the depth H of the etching tank 10 to the depth h of the limiting groove 21 is [1.95, 2)

[0057] In this way, it is applicable to the case where the depth H of the etching tank 10 is relatively large. When the surface tension of the etching solution is limited, the depth h of the limiting groove 21 is only a little above the middle of the etching tank 10, ensuring that the depth H of the etching tank 10 is sufficient to hold the required etching solution, and also avoiding the situation where it is necessary to set an excessive amount of etching solution outside the etching tank 10 to ensure that the optical fiber is located in the center of the etching solution, reducing the requirement for the surface tension of the etching solution.

[0058] Specifically, in a certain embodiment, the ratio of the groove depth H of the etching tank 10 to the groove depth h of the limiting groove 21 is 1.98.

[0059] Please refer to Figure 3 and Figure 4 In the embodiment of the present invention, it is defined that the dimension of the limiting groove 21 along the second direction is the groove width w of the limiting groove 21, and the ratio of the groove depth h of the limiting groove 21 to the groove width w of the limiting groove 21 is greater than 2.

[0060] In this way, the probability that the etching solution escapes from the etching tank 10 through the limiting groove 21 due to the excessive groove width w of the limiting groove 21 is reduced.

[0061] Please refer to Figure 3 and Figure 4 In the embodiment of the present invention, the groove width w of the limiting groove 21 is less than or equal to 0.8 mm.

[0062] In this way, it is avoided that the etching solution escapes from the etching tank 10 through the limiting groove 21, and the probability that the optical fiber is pinched by the limiting groove 21 is also reduced.

[0063] Specifically, through experiments, when the groove width w of the limiting groove 21 is greater than 1 mm, the etching solution easily flows out through the limiting groove 21. In this application, a redundancy of 0.2 mm is set to further prevent the etching solution from flowing out.

[0064] It can be understood that the groove width w of the limiting groove 21 should be greater than the diameter of the optical fiber. It can be understood that when the diameter of the optical fiber is 0.25 mm, the dimension range of the groove width w of the limiting groove 21 is (0.25 mm, 0.8 mm].

[0065] Please refer to Figure 1 、 Figure 5 and Figure 6 In the embodiment of the present invention, the optical fiber etching device 100 is further provided with two protection grooves 15. The protection grooves 15 are arranged on the side of the isolation groove 13 away from the etching tank 10. The two protection grooves 15 are symmetrically arranged along the second direction, and the protection grooves 15 are used to carry a protection liquid.

[0066] In this way, due to the siphon phenomenon, the etching solution will climb along the optical fiber to the optical fiber stripping port. The protection liquid is carried in the protection groove 15 to limit the etching solution flowing out due to siphon from corroding the optical fiber.

[0067] It can be understood that the protection liquid can be distilled water.

[0068] Please refer to Figure 7 The embodiment of the present invention also proposes an optical fiber etching method, which is applicable to the optical fiber etching device 100 described in any one of the above, and the method includes:

[0069] S10, placing the optical fiber with the coating layer stripped into the two symmetric limiting grooves 21;

[0070] S20, limit the optical fiber placed in the limit groove 21;

[0071] S30, pour the etching solution into the etching tank 10, and make the liquid level of the etching solution exceed the tank wall of the etching tank 10.

[0072] In the embodiment of the present invention, after the optical fiber is placed in the limit groove 21, the optical fiber is limited to prevent the optical fiber from shaking relative to the etching tank 10. After the optical fiber is limited, the etching solution is poured to avoid being affected by the etching solution during the process of adjusting the position of the optical fiber, and to avoid poor etching effect caused by the optical fiber being etched during the process of adjusting the position. Make the liquid level of the etching solution exceed the tank wall of the etching tank 10, so that the height of the etching solution above and below the optical fiber is the same, keep the optical fiber in the center of the etching solution, ensure the etching effect above and below the optical fiber is consistent, and thus ensure the smoothness of the optical fiber.

[0073] Specifically, the ratio range of the groove depth H of the etching tank 10 to the groove depth h of the limit groove 21 in the optical fiber etching device 100 is [1.6, 2), so that the optical fiber placed in the limit groove 21 for limiting can be located in the upper-middle position inside the etching tank 10, that is, a position is reserved for the precipitated hydrate below the optical fiber. Ensure that after the reaction proceeds for a period of time to generate the precipitated hydrate, the optical fiber can still be located in the center of the etching solution. In addition, the two limit members 20 are arranged on both sides of the etching tank 10 to help the etching solution in the etching tank 10 not overflow under the action of tension, so that when the optical fiber starts to be etched, the etching solution exceeding a certain height of the etching tank 10 can be poured into the etching tank 10 to ensure that the optical fiber is still in the center of the etching solution at the beginning of the reaction, thereby ensuring that the height of the etching solution above and below the optical fiber is the same, and thus ensuring the smoothness of the optical fiber.

[0074] It can be understood that the optical fiber includes a core, a cladding and a coating layer from the inside to the outside. When etching the optical fiber, it is necessary to strip the coating layer at the required etching position. The boundary between the position where the coating layer is stripped and the position where the coating layer is not stripped is the stripping port of the optical fiber.

[0075] It can be understood that the etching solution can include hydrofluoric acid. The optical fiber is located in the center of the etching solution, which can make the fluoride ion concentration above and below the optical fiber constant, so as to ensure the same etching effect above and below the optical fiber, and thus ensure the smoothness of the optical fiber.

[0076] It can be understood that in a certain embodiment, the etching solution is hydrofluoric acid diluted with distilled water. In this way, compared with using analytical pure hydrofluoric acid, the safety factor is higher, the reaction time becomes longer, and it is convenient to accurately end the etching when the optical fiber is etched to the required diameter.

[0077] It should be noted that when etching multiple optical fibers, the multiple optical fibers can be first limited and then placed in the limiting groove 21, and then the multiple optical fibers are limited to the optical fiber etching device 100, or the multiple optical fibers can be sequentially placed in the limiting groove 21, and then the multiple optical fibers and the optical fiber etching device 100 are limited. The present application does not make specific restrictions. It can be understood that the multiple optical fibers are placed parallel to each other in the limiting groove 21 in the first direction.

[0078] In a certain embodiment, the liquid level of the etching solution exceeds the etching tank 10 by 0.5 mm to 0.8 mm.

[0079] Please refer to Figure 8 , in the embodiment of the present invention, the optical fiber etching device 100 is provided with two protection grooves 15. The protection grooves 15 are arranged on the side of the isolation groove 13 away from the etching tank 10. The two protection grooves 15 are symmetrically arranged along the second direction. The protection grooves 15 are used to carry the protection liquid. The optical fiber etching method further includes:

[0080] S40, making the stripped end of the optical fiber located on the side of the protection groove 15 away from the etching tank 10;

[0081] S50, pouring the protection liquid into the two protection grooves 15.

[0082] In this way, the stripped end of the optical fiber is located on the side of the protection groove 15 away from the etching tank 10, so that the stripped end of the optical fiber is not only arranged at an interval from the etching tank 10, but also the stripped end of the optical fiber is spaced from the etching tank 10 by the isolation groove 13. The etching solution overflowing from the etching tank 10 drips into the isolation groove 13. Under the siphon phenomenon, a part of the etching solution flowing through the optical fiber can also drip in the isolation groove 13, and finally the stripped end of the optical fiber is protected by the protection liquid in the protection groove 15, further avoiding the etching solution from corroding the stripped end of the optical fiber and ensuring the quality of optical fiber etching.

[0083] It can be understood that the stripped end of the optical fiber can also be located above the protection groove 15, as long as the stripped end of the optical fiber is not located on the side of the protection groove 15 close to the etching tank 10. The present application does not make specific restrictions.

[0084] In the embodiment of the present invention, the optical fiber etching method further includes:

[0085] Put the dummy fiber into the two symmetric limiting grooves 21. Among them, the two limiting grooves 21 for limiting the dummy fiber are respectively located at the edges of the two limiting members 20.

[0086] In this way, the dummy fiber can be conveniently taken out, and the etched size of the dummy fiber can be measured, so as to infer whether the optical fiber is etched in place and the expected etching time required for the optical fiber.

[0087] In the embodiment of the present invention, S20 includes:

[0088] Using an adhesive to adhere the optical fiber to the optical fiber etching device 100.

[0089] In this way, the optical fiber can be firmly positioned on the optical fiber etching device 100 conveniently, simply and at a relatively low cost, avoiding the shaking of the optical fiber during the etching process and affecting the etching effect.

[0090] Specifically, the adhesive member may include double-sided tape. One side of the double-sided tape is adhered to the optical fiber etching device 100, and the other side of the double-sided tape is adhered to the optical fiber to position the optical fiber. The adhesive member may also include single-sided tape, and the side with adhesive of the single-sided tape adheres the optical fiber to the optical fiber etching device. It can be understood that the adhesive member may include double-sided tape and single-sided tape. The two sides of the double-sided tape are respectively adhered to the optical fiber and the optical fiber etching device 100, and the single-sided tape is located on the side of the optical fiber away from the double-sided tape. While further positioning the optical fiber, the position where the double-sided tape is not adhered to the optical fiber is covered to prevent dust and the like from adhering to the double-sided tape. It should be noted that in the embodiment with a dummy fiber, the single-sided tape can be folded and adhered to the double-sided tape and the optical fiber. In this way, it is convenient to tear off the single-sided tape to take the dummy fiber.

[0091] In the embodiment of the present invention, S20 includes:

[0092] Using a pressing block to press the optical fiber onto the optical fiber etching device 100.

[0093] In this way, pressure can be applied to the optical fiber to press the optical fiber onto the optical fiber etching device 100 and maintain the position of the optical fiber.

[0094] It can be understood that after the optical fiber is adhered to the optical fiber etching device 100 using the adhesive member, the pressing block can be used to press the optical fiber onto the optical fiber etching device 100. In this way, the optical fiber can be conveniently positioned at the desired position through the adhesive member. When etching multiple optical fibers, the adhesive member can be used to sequentially adjust the positions of the optical fibers without simultaneously adjusting the positions of multiple optical fibers to the required positions. After the adhesive member positions the optical fiber, the pressing block further positions the optical fiber, reducing the requirement for the adhesive force of the adhesive member and further ensuring the stability of the relative position between the optical fiber and the optical fiber etching device 100.

[0095] The embodiment of the present invention also provides a computer device, including a memory and a processor. A computer program is stored in the memory. When the computer program is executed by the processor, the processor executes the optical fiber etching method described in any of the above embodiments.

[0096] The embodiment of the present invention also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by the processor, the optical fiber etching method described in any of the above embodiments is implemented.

[0097] The embodiment of the present invention also provides a computer program product, including a computer program. When the computer program is executed by the processor, the optical fiber etching method described in any of the above embodiments is implemented.

[0098] In this embodiment, for the computer device, computer-readable storage medium, and computer program product, after the optical fiber is placed in the limiting groove 21, the optical fiber is limited to prevent the optical fiber from shaking relative to the corrosion groove 10. After the optical fiber is limited, the corrosive liquid is poured in to avoid being affected by the corrosive liquid during the process of adjusting the position of the optical fiber, and to avoid poor corrosion effect caused by the corrosion of the optical fiber during the process of adjusting the position. The liquid level of the corrosive liquid exceeds the groove wall of the corrosion groove 10, so that the heights of the corrosive liquid above and below the optical fiber are the same, keeping the optical fiber in the center of the corrosive liquid, ensuring the same corrosion effect on the upper and lower parts of the optical fiber, and thus ensuring the smoothness of the optical fiber.

[0099] Specifically, the ratio range of the groove depth H of the corrosion groove 10 to the groove depth h of the limiting groove 21 in the optical fiber corrosion device 100 is [1.6, 2), so that the optical fiber placed in the limiting groove 21 for limitation can be located at a position slightly above the middle inside the corrosion groove 10, that is, a position is reserved for the precipitated hydrate below the optical fiber. After the reaction proceeds for a period of time to generate the precipitated hydrate, the optical fiber can still be located in the center of the corrosive liquid. In addition, the two limiting members 20 are arranged on both sides of the corrosion groove 10 to prevent the corrosive liquid in the corrosion groove 10 from overflowing under the action of tension, which is convenient for pouring the corrosive liquid exceeding a certain height of the corrosion groove 10 into the corrosion groove 10 when the optical fiber starts to be corroded, ensuring that the optical fiber is still in the center of the corrosive liquid at the beginning of the reaction, so as to ensure that the heights of the corrosive liquid above and below the optical fiber are the same, and thus ensuring the smoothness of the optical fiber.

[0100] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, database, or other medium used in the embodiments provided in the present application can include at least one of non-volatile and volatile memories. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc. The databases involved in the embodiments provided in the present application can include at least one of relational databases and non-relational databases. Non-relational databases can include distributed databases based on blockchain, etc., without limitation. The processors involved in the embodiments provided in the present application can be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, data processing logics based on quantum computing, etc., without limitation.

[0101] The technical features of the above embodiments can be combined arbitrarily. For the sake of concise description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0102] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structural transformation made by using the description and drawings of the present invention under the inventive concept of the present invention, or direct / indirect application in other related technical fields, is included in the patent protection scope of the present invention.

Claims

1. A device for corroding an optical fiber, characterized in that: The optical fiber etching device is provided with an etching groove and two isolation grooves, defining a first direction, a second direction and a third direction which are mutually perpendicular, the etching groove is used to carry etching liquid, the etching groove is opened along the third direction, the two isolation grooves are sequentially arranged on both sides of the etching groove along the first direction, the two isolation grooves are respectively arranged with a gap from the etching groove, and the two isolation grooves are symmetrically arranged along the second direction; The etching optical fiber device also includes two limit members, which are arranged on both sides of the etching groove in sequence along the first direction, and the limit members separate the etching groove and the isolation groove. The limit member is provided with a plurality of limit grooves, and the plurality of limit grooves are arranged in sequence along the second direction. The plurality of limit grooves of the two limit members are symmetrical along the second direction. The dimension of the etching groove along the third direction is defined as the groove depth of the etching groove, the dimension of the limit groove along the third direction is the groove depth of the limit groove, and the ratio range of the groove depth of the etching groove to the groove depth of the limit groove is [1.6,2).

2. The optical fiber etching device according to claim 1, characterized in that: The ratio of the groove depth of the corrosion groove to the groove depth of the limiting groove is in the range of [1.95, 2).

3. The optical fiber etching device according to claim 1, characterized in that: The dimension of the limiting groove along the second direction is defined as the groove width of the limiting groove, and the ratio of the groove depth of the limiting groove to the groove width of the limiting groove is greater than 2.

4. The optical fiber etching device according to claim 3, characterized in that: The width of the limiting groove is less than or equal to 0.8 mm.

5. The optical fiber etching device according to claim 1, characterized in that: The optical fiber etching device is further provided with two protection grooves, wherein the protection grooves are arranged on a side of the isolation groove away from the etching groove, the two protection grooves are symmetrically arranged along the second direction, and the protection grooves are used to carry protection liquid.

6. A method for etching an optical fiber, applicable to the optical fiber etching device according to any one of claims 1 to 5, characterized in that: The optical fiber corrosion method comprises: Place the optical fiber stripped of its coating into the two symmetrical limiting grooves; Limiting the position of the optical fiber placed in the limiting groove; The etching liquid is poured into the etching tank, and the liquid level of the etching liquid exceeds the tank wall of the etching tank.

7. The method for corroding an optical fiber according to claim 6, characterized in that: The optical fiber etching device is provided with two protection grooves, the protection grooves are provided on a side of the isolation groove away from the etching groove, the two protection grooves are symmetrically arranged along the second direction, the protection grooves are used to carry protection liquid, and the optical fiber etching method further includes: The stripping end of the optical fiber is located at a side of the protection groove away from the corrosion groove; Pour the protection liquid into the two protection tanks.

8. The method for corroding an optical fiber according to claim 6, characterized in that: The optical fiber corrosion method also includes: The accompanying fiber is placed in the two symmetrical limiting grooves, wherein the two limiting grooves for limiting the accompanying fiber are respectively located at the edges of the two limiting members.

9. The method for corroding an optical fiber according to claim 6, wherein: The limiting of the optical fiber placed in the limiting groove includes: Adhere the optical fiber to the corroded optical fiber device using an adhesive; and / or The optical fiber is crimped to the corroded optical fiber device using a clamp.

10. A computer device comprising a memory and a processor, wherein a computer program is stored in the memory, and when the computer program is executed by the processor, the processor executes the method according to any one of claims 6 to 9.

11. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method according to any one of claims 6 to 9 is implemented.

12. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the method according to any one of claims 6 to 9 is implemented.

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