Anti-condensation regulation and control method, heat pump system, device and storage medium

Abstract

The invention discloses an anti-condensation regulation and control method, a heat pump system, a device and a storage medium. The anti-condensation regulation and control method comprises the steps that the dew point temperature is obtained according to the dry-bulb temperature and the relative humidity; according to the dew point temperature, the heat dissipation refrigerant temperature is formulated; according to the heat dissipation refrigerant temperature, the heat dissipation refrigerant flow is obtained based on a preset heat dissipation temperature and flow relation model; the control module controls the second valve element to operate according to the heat dissipation refrigerant flow so as to adjust the second hot air flow. According to the heat dissipation refrigerant temperature and the heat dissipation refrigerant flow, the second air inlet temperature of the refrigerant needed at the second air inlet is obtained, and the heat release output refrigerant temperature is obtained; the first hot air flow of the first hot air port is obtained according to the first air inlet temperature and the second air inlet temperature; according to the design, the risk generated by condensation is reduced, the heat dissipation requirement of the control module is guaranteed, energy consumption does not need to be increased, and use is safe and reliable.

Description

Technical Field

[0001] The present invention relates to the field of computer control of heat pump equipment, and particularly to a method for preventing condensation regulation, a heat pump system, a device, and a storage medium. Background Art

[0002] Existing heat pump systems generally include a heat release device, a compressor module, a heat absorption device, and a control module. A refrigerant transmission pipeline for gas can be provided between the heat release device, the compressor module, and the heat absorption device. When the refrigerant at a lower temperature passes through the heat absorption device, heat can be absorbed from the heat source through the heat absorption device. The refrigerant carrying heat is pressurized by the compressor module to form a high-temperature and high-pressure state. At this time, when the refrigerant passes through the heat release device placed indoors, heat can be released to heat the room. After passing through the heat release device, the refrigerant becomes a lower temperature state again. A control board and a power board are provided in the control module to provide electrical energy for the compressor module and control the operation of the compressor module. Thus, the control module itself will also generate heat and needs to be cooled in time. In the past, the ambient air flow was used to cool the control module. However, the cooling effect has limitations.

[0003] Later, some manufacturers provided a cooling refrigerant pipe fitting in the control module. After passing through the heat release device, the refrigerant is input into the cooling refrigerant pipe fitting and then output to the compressor module. Since the temperature of the refrigerant is lower after passing through the heat release device, it can just cool the control module. However, when the ambient temperature is high or the ambient humidity is high, the dew point temperature will be high. The temperature of the refrigerant passing through the cooling refrigerant pipe fitting is higher than the dew point temperature and exceeds a certain range, and the cooling refrigerant pipe fitting will condense or even frost, which easily causes the components on the surface of the control board and the power board to short-circuit and be damaged. Therefore, in the past, manufacturers needed to set up a complex condensation diversion structure, but the effect was not good, and there was still a great risk of condensation dripping, or set up a complex control logic to adjust the temperature of the refrigerant input into the cooling refrigerant pipe fitting, but the energy consumption of the heat pump system increased significantly, and there was also a problem that the cooling effect could not meet the requirements. Summary of the Invention

[0004] The present invention aims to at least solve one of the technical problems existing in the prior art. For this purpose, the present invention provides a method for preventing condensation regulation, a heat pump system, a device, and a storage medium, which can reduce the risk of condensation generation, ensure the heat dissipation requirements of the control module, without increasing energy consumption, and is safe and reliable to use.

[0005] A method for preventing condensation regulation according to an embodiment of the first aspect of the present invention is applied to a heat pump system. The heat pump system includes a heat release device, a compressor module, a heat absorption device, a first eddy current pipe fitting, a second eddy current pipe fitting, a first temperature detection component, a second temperature detection component, and a control module. The control module is respectively connected to the compressor module, the first temperature detection component, and the second temperature detection component. A heat dissipation refrigerant pipe fitting is arranged in the control module, and the refrigerant in the heat dissipation refrigerant pipe fitting can dissipate heat for the control module. The first temperature detection component is used to detect the heat release output refrigerant temperature of the refrigerant at the output end of the heat release device, and the second temperature detection component is used to detect the dry bulb temperature of the environment where the control module is located. A first eddy current pipe is arranged in the first eddy current pipe fitting, and the first eddy current pipe fitting is provided with a first air inlet, a first hot air outlet, and a first cold air outlet that communicate with the first eddy current pipe. Among them, the refrigerant entering the first eddy current pipe from the first air inlet is separated into a higher temperature refrigerant and a lower temperature refrigerant. The higher temperature refrigerant is output from the first hot air outlet, and the lower temperature refrigerant is output from the first cold air outlet. The first eddy current pipe fitting is provided with a first valve core in the first eddy current pipe, and the first valve core can change the first hot air flow rate of the refrigerant output from the first hot air outlet. A second eddy current pipe is arranged in the second eddy current pipe fitting, and the second eddy current pipe fitting is provided with a second air inlet, a second hot air outlet, and a second cold air outlet that communicate with the second eddy current pipe. Among them, the refrigerant entering the second eddy current pipe from the second air inlet is separated into a higher temperature refrigerant and a lower temperature refrigerant. The higher temperature refrigerant is output from the second hot air outlet, and the lower temperature refrigerant is output from the second cold air outlet. The second eddy current pipe fitting is provided with a second valve core in the second eddy current pipe, and the second valve core can change the second hot air flow rate of the refrigerant output from the second hot air outlet. The output end of the heat release device is docked with the first air inlet, the first hot air outlet is docked with the second air inlet, the second hot air outlet is docked with the head end of the heat dissipation refrigerant pipe fitting, the input end of the heat absorption device is respectively docked with the first cold air outlet, the second cold air outlet, and the tail end of the heat dissipation refrigerant pipe fitting, the output end of the heat absorption device is connected to the input end of the compressor module, and the output end of the compressor module is connected to the input end of the heat release device. The control module is respectively connected to the first eddy current pipe fitting and the second eddy current pipe fitting to control the operation of the first valve core and the second valve core. The method for preventing condensation regulation includes:

[0006] Obtain the dry bulb temperature and relative humidity, and obtain the dew point temperature according to the dry bulb temperature and relative humidity;

[0007] Formulate a heat dissipation refrigerant temperature according to the dew point temperature, where the heat dissipation refrigerant temperature is the temperature of the refrigerant output from the second hot air outlet to the heat dissipation refrigerant pipe fitting;

[0008] The cooling refrigerant flow rate is obtained based on the cooling refrigerant temperature according to a preset relationship model of cooling temperature and flow rate. Among them, the higher the cooling refrigerant temperature, the greater the cooling refrigerant flow rate. The cooling refrigerant flow rate is the flow rate of the refrigerant output from the second hot gas port to the cooling refrigerant pipe fitting.

[0009] The control module controls the operation of the second valve core according to the cooling refrigerant flow rate to adjust the second hot gas flow rate.

[0010] The second intake temperature of the refrigerant required at the second intake port is obtained based on the cooling refrigerant temperature and the cooling refrigerant flow rate.

[0011] The heat release output refrigerant temperature is obtained, where the heat release output refrigerant temperature is the first intake temperature of the refrigerant at the first intake port.

[0012] The first hot gas flow rate of the first hot gas port is obtained based on the first intake temperature and the second intake temperature.

[0013] The control module controls the operation of the first valve core to adjust the first hot gas flow rate.

[0014] A method for preventing condensation regulation according to an embodiment of the present invention has at least the following

[0015] Beneficial effects:

[0016] In the method for preventing condensation regulation of the present invention, the dew point temperature is obtained according to the real-time dry bulb temperature and relative humidity, and thus a suitable cooling refrigerant temperature is formulated, so that condensation is not likely to occur on the surface of the cooling refrigerant pipe fitting. According to different cooling refrigerant temperatures, different cooling refrigerant flow rates are obtained. When the cooling refrigerant temperature is low, the cooling effect of the refrigerant on the control module is good, and a large cooling refrigerant flow rate is not required to meet the cooling demand. When the cooling refrigerant temperature is high, the cooling effect of the refrigerant on the control module is relatively poor. At this time, the cooling refrigerant flow rate can be increased as much as possible within a suitable range. Although the cooling refrigerant temperature is high, the relatively increased cooling refrigerant flow rate can also ensure a suitable cooling effect. By setting the first eddy current pipe fitting and the second eddy current pipe fitting, the heat release output refrigerant temperature of the refrigerant flowing out of the heat release device can be detected. According to the cooling refrigerant temperature and the cooling refrigerant flow rate of the refrigerant input to the cooling refrigerant pipe fitting, the second intake temperature of the refrigerant required at the second intake port can be obtained, and the first hot gas flow rate can be deduced in turn. The control module only needs to control the operation of the first valve core to adjust the first hot gas flow rate and control the operation of the second valve core to adjust the second hot gas flow rate, so as to control the cooling refrigerant temperature and the cooling refrigerant flow rate, cool the control module, and finally the refrigerant will converge into the compressor module. This design reduces the risk of condensation, ensures the cooling demand of the control module, does not require an increase in energy consumption, and is safe and reliable to use.

[0017] According to some embodiments of the present invention, in obtaining the dew point temperature based on the dry bulb temperature and relative humidity, the dew point temperature T d = U*(A + B*t) + C*t - 19.2, where A, B, and C are all calculation coefficients, t is the dry bulb temperature, and U is the relative humidity.

[0018] According to some embodiments of the present invention, in obtaining the cooling refrigerant flow rate based on the cooling refrigerant temperature according to a preset cooling temperature and flow rate relationship model, the cooling temperature and flow rate relationship model is C s = K*T S , where C s is the cooling refrigerant flow rate, T s is the cooling refrigerant temperature, and K is a linear conversion coefficient.

[0019] According to some embodiments of the present invention, in obtaining the second intake temperature of the refrigerant required at the second intake port based on the cooling refrigerant temperature and the cooling refrigerant flow rate, the second intake temperature of the refrigerant required at the second intake port is calculated based on the cooling refrigerant temperature and the cooling refrigerant flow rate according to the second eddy current heat exchange model of the second eddy current pipe fitting. The second eddy current heat exchange model is:

[0020] T h2 = T i2 + Q 2 / C p *C h2 ;

[0021] where T h2 is the second hot gas temperature of the refrigerant at the second hot gas port, T h2 = T s , T i2 is the second intake temperature of the refrigerant required at the second intake port, Q 2 is the refrigeration capacity characteristic parameter of the second eddy current pipe fitting, C p is the specific heat at constant pressure of the refrigerant, C h2 is the second hot gas flow rate of the refrigerant output from the second hot gas port, C h2 = C s .

[0022] According to some embodiments of the present invention, in obtaining the first hot gas flow rate of the first hot gas port based on the first intake temperature and the second intake temperature, the first hot gas flow rate is calculated based on the first intake temperature and the second intake temperature according to the first eddy current heat exchange model of the first eddy current pipe fitting. The second eddy current heat exchange model is:

[0023] T h1 = T i1 + Q 1 / C p *C h1 ;

[0024] Among them, T h1 is the first hot gas temperature of the refrigerant at the first hot gas port, T h1 = T i2 , T j1 is the first intake temperature of the refrigerant at the first intake port, Q 1 is the refrigerating capacity characteristic parameter of the first eddy current pipe fitting, C p is the specific heat at constant pressure of the refrigerant, C h1 is the first hot gas flow rate.

[0025] According to some embodiments of the present invention, the refrigerating capacity characteristic parameter Q 1 of the first eddy current pipe fitting is greater than the refrigerating capacity characteristic parameter Q 2 of the second eddy current pipe fitting.

[0026] According to some embodiments of the present invention, in the heat dissipation refrigerant temperature formulated according to the dew point temperature, the heat dissipation refrigerant temperature is greater than or equal to the dew point temperature.

[0027] A heat pump system according to an embodiment of the second aspect of the present invention includes a heat release device, a compressor module, a heat absorption device, a first eddy current pipe fitting, a second eddy current pipe fitting, a first temperature detection component, a second temperature detection component, and a control module. The control module is respectively connected to the compressor module, the first temperature detection component, and the second temperature detection component. A heat dissipation refrigerant pipe fitting is arranged in the control module, and the refrigerant in the heat dissipation refrigerant pipe fitting can dissipate heat for the control module. The first temperature detection component is used to detect the heat release output refrigerant temperature of the refrigerant at the output end of the heat release device, and the second temperature detection component is used to detect the dry bulb temperature of the environment where the control module is located. A first eddy current pipe is arranged in the first eddy current pipe fitting, and the first eddy current pipe fitting is provided with a first air inlet, a first hot air outlet, and a first cold air outlet that communicate with the first eddy current pipe. Among them, the refrigerant entering the first eddy current pipe from the first air inlet is separated into a higher temperature refrigerant and a lower temperature refrigerant. The higher temperature refrigerant is output from the first hot air outlet, and the lower temperature refrigerant is output from the first cold air outlet. The first eddy current pipe fitting is provided with a first valve core in the first eddy current pipe, and the first valve core can change the first hot air flow rate of the refrigerant output from the first hot air outlet. A second eddy current pipe is arranged in the second eddy current pipe fitting, and the second eddy current pipe fitting is provided with a second air inlet, a second hot air outlet, and a second cold air outlet that communicate with the second eddy current pipe. Among them, the refrigerant entering the second eddy current pipe from the second air inlet is separated into a higher temperature refrigerant and a lower temperature refrigerant. The higher temperature refrigerant is output from the second hot air outlet, and the lower temperature refrigerant is output from the second cold air outlet. The second eddy current pipe fitting is provided with a second valve core in the second eddy current pipe, and the second valve core can change the second hot air flow rate of the refrigerant output from the second hot air outlet. The output end of the heat release device is docked with the first air inlet, the first hot air outlet is docked with the second air inlet, the second hot air outlet is docked with the head end of the heat dissipation refrigerant pipe fitting, the input ends of the heat absorption device are respectively docked with the first cold air outlet, the second cold air outlet, and the tail end of the heat dissipation refrigerant pipe fitting, the output end of the heat absorption device is connected to the input end of the compressor module, the output end of the compressor module is connected to the input end of the heat release device, and the control module is respectively connected to the first eddy current pipe fitting and the second eddy current pipe fitting to control the operation of the first valve core and the second valve core according to the anti-condensation regulation method disclosed in any of the above embodiments.

[0028] The heat pump system according to an embodiment of the present invention has at least the following beneficial effects:

[0029] The heat pump system of the present invention executes the anti-condensation regulation method disclosed in any of the above embodiments to control the operation of the first valve core and the second valve core, thereby controlling the heat dissipation refrigerant temperature and the heat dissipation refrigerant flow rate, and performing heat dissipation treatment on the control module. This design reduces the risk of condensation, ensures the heat dissipation requirements of the control module, does not require increasing energy consumption, and is safe and reliable to use.

[0030] The control device according to the third - aspect embodiment of the present invention, the control device includes a memory and a processor, the memory stores a computer program, and when the processor executes the computer program, the anti - condensation regulation method disclosed in any of the above embodiments is implemented.

[0031] The computer - readable storage medium according to the fourth - aspect embodiment of the present invention, the computer - readable storage medium stores a computer program, and is characterized in that when the computer program is executed by a processor, the anti - condensation regulation method disclosed in any of the above embodiments is implemented.

[0032] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. Description of the Drawings

[0033] The above - mentioned and / or additional aspects and advantages of the present invention will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, where:

[0034] Figure 1 is the principle structure diagram of one embodiment of the heat - pump system of the present invention;

[0035] Figure 2 is the internal structure schematic diagram of one embodiment of the first eddy - current pipe fitting;

[0036] Figure 3 is the internal structure schematic diagram of one embodiment of the second eddy - current pipe fitting;

[0037] Figure 4 is the flowchart of one embodiment of the anti - condensation regulation method of the present invention;

[0038] Figure 5 is the principle structure block diagram of one embodiment of the control device of the present invention.

[0039] Reference Signs:

[0040] Heat - releasing device 110; Compressor module 120; Heat - absorbing device 130; First eddy - current pipe fitting 200; First eddy - current pipeline 210; First air inlet 220; First hot - air port 230; First cold - air port 240; First valve core 250; Second eddy - current pipe fitting 300; Second eddy - current pipeline 310; Second air inlet 320; Second hot - air port 330; Second cold - air port 340; Second valve core 350; First temperature detection element 410; Second temperature detection element 420; Control module 430; Processor 610; Memory 620; Input / output interface 630; Communication interface 640; Bus 650. Detailed Embodiments

[0041] In order to make the objectives, technical solutions and advantages of the present application more clear and understandable, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0042] It should be noted that although the functional modules are divided in the device schematic diagram and the logical order is shown in the flowchart, in some cases, the steps shown or described may be executed in a different module division in the device or a different order in the flowchart. Terms such as "first" and "second" in the specification, claims and the above-mentioned drawings are used to distinguish similar objects and do not necessarily need to describe a specific order or sequence.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which this application belongs. The terms used herein are only for the purpose of describing the embodiments of this application and are not intended to limit this application.

[0044] Such as Figure 1 、 2As shown in FIGS. 3, a method for controlling anti-condensation according to an embodiment of the first aspect of the present invention is applied to a heat pump system. The heat pump system includes a heat release device 110, a compressor module 120, a heat absorption device 130, a first eddy current pipe fitting 200, a second eddy current pipe fitting 300, a first temperature detector 410, a second temperature detector 420, and a control module 430. The control module 430 is respectively connected to the compressor module 120, the first temperature detector 410, and the second temperature detector 420. A heat dissipation refrigerant pipe fitting is provided in the control module 430, and the refrigerant in the heat dissipation refrigerant pipe fitting can dissipate heat for the control module 430. The first temperature detector 410 is used to detect the heat release output refrigerant temperature of the refrigerant at the output end of the heat release device 110. The second temperature detector 420 is used to detect the dry bulb temperature of the environment where the control module 430 is located. A first eddy current pipe 210 is provided in the first eddy current pipe fitting 200. The first eddy current pipe fitting 200 is provided with a first air inlet 220, a first hot air outlet 230, and a first cold air outlet 240 that communicate with the first eddy current pipe 210. Among them, the refrigerant entering the first eddy current pipe 210 from the first air inlet 220 is separated into a higher temperature refrigerant and a lower temperature refrigerant. The higher temperature refrigerant is output from the first hot air outlet 230, and the lower temperature refrigerant is output from the first cold air outlet 240. The first eddy current pipe fitting 200 is provided with a first valve core 250 in the first eddy current pipe 210. The first valve core 250 can change the first hot air flow rate of the refrigerant output from the first hot air outlet 230. A second eddy current pipe 310 is provided in the second eddy current pipe fitting 300. The second eddy current pipe fitting 300 is provided with a second air inlet 320, a second hot air outlet 330, and a second cold air outlet 340 that communicate with the second eddy current pipe 310. Among them, the refrigerant entering the second eddy current pipe 310 from the second air inlet 320 is separated into a higher temperature refrigerant and a lower temperature refrigerant. The higher temperature refrigerant is output from the second hot air outlet 330, and the lower temperature refrigerant is output from the second cold air outlet 340. The second eddy current pipe fitting 300 is provided with a second valve core 350 in the second eddy current pipe 310. The second valve core 350 can change the second hot air flow rate of the refrigerant output from the second hot air outlet 330. The output end of the heat release device 110 is docked with the first air inlet 220. The first hot air outlet 230 is docked with the second air inlet 320. The second hot air outlet 330 is docked with the head end of the heat dissipation refrigerant pipe fitting. The input end of the heat absorption device 130 is respectively docked with the first cold air outlet 240, the second cold air outlet 340, and the tail end of the heat dissipation refrigerant pipe fitting. The output end of the heat absorption device 130 is connected to the input end of the compressor module 120. The output end of the compressor module 120 is connected to the input end of the heat release device 110. The control module 430 is respectively connected to the first eddy current pipe fitting 200 and the second eddy current pipe fitting 300 to control the operation of the first valve core 250 and the second valve core 350.

[0045] It should be noted that in this design, the first eddy current pipe fitting 200 and the second eddy current pipe fitting 300 are provided. The refrigerant is selected as a gas. Drive components such as adjusting cylinders and servo motors are provided on both the first eddy current pipe fitting 200 and the second eddy current pipe fitting 300, which are respectively used to drive the first valve core 250 and the second valve core 350 to act to adjust the magnitude of the refrigerant flow rate.

[0046] Both the first eddy current pipe fitting 200 and the second eddy current pipe fitting 300 can be selected from conventional eddy current heat exchange pipes. Taking the first eddy current pipe fitting 200 as an example, as Figure 2 shown, the first eddy current pipe fitting 200 is in a strip-shaped tubular form. The first eddy current pipeline 210 is arranged in a spiral shape inside the first eddy current pipe fitting 200. The first air inlet 220 is on the circumferential wall of the spiral first eddy current pipeline 210, so that the refrigerant entering from the first air inlet 220 enters the first eddy current pipeline 210 in a tangential direction. The first hot air outlet 230 and the first cold air outlet 240 are respectively located at both ends of the first eddy current pipeline 210. The first air inlet 220 is located between the first hot air outlet 230 and the first cold air outlet 240. The refrigerant entering the first eddy current pipeline 210 flows in a spiral shape and is separated. Generally speaking, the first valve core 250 is arranged inside the first eddy current pipeline 210 and at a position close to the first hot air outlet 230. The drive component can drive the first valve core 250 to move to adjust the diameter of the refrigerant flowing through the first hot air outlet 230, thereby adjusting the flow rate of the refrigerant flowing out from the first hot air outlet 230. It can be understood that C 01 is the first air inlet flow rate of the refrigerant entering the first air inlet, C h1 is the first hot air flow rate of the refrigerant output from the first hot air outlet; C c1 is the first cold air flow rate of the refrigerant output from the first cold air outlet, then C 01 = C c1 + C h1 .

[0047] Similarly, the positions of the second air inlet, the second hot air outlet, the second cold air outlet and the second valve core in the second eddy current pipe fitting are basically the same as those in the first eddy current pipe fitting. Specifically, as Figure 3 shown, it will not be repeated here.

[0048] The heat-releasing device 110, the compressor module 120, and the heat-absorbing device 130 are all conventional components in an existing heat pump system and will not be specifically described here. The control module 430 includes an electrical box, a control board, and a power board. The control board may be provided with controllers such as an MCU and a CPU and their associated circuits. The control board is connected to the compressor module 120, the driving member of the first eddy current pipe fitting 200, and the driving member of the second eddy current pipe fitting 300. The power board may be provided with multiple semiconductor power switching tubes. The control board controls the operation of the power board to adjust and output a suitable power supply to the compressor module 120. The heat-dissipating refrigerant pipe fitting is arranged in the electrical box. A heat-exchanging plate member is arranged on the heat-dissipating refrigerant pipe fitting. The control board and the power board can both be in heat-exchanging contact with the heat-exchanging plate member, and the heat-dissipating refrigerant pipe fitting is meanderingly arranged in the heat-exchanging plate member to improve the heat-exchanging efficiency.

[0049] Among them, the second temperature detection member 420 can be a conventional dry bulb thermometer, and the relative humidity can be detected by a hygrometer arranged on the control module 430 or obtained from a meteorological cloud platform. The first temperature detection member 410 can be a conventional temperature sensor, which is arranged in the pipe fitting for outputting refrigerant of the heat-releasing device 110 to detect the temperature of the heat-releasing output refrigerant.

[0050] As Figure 4 shown, the anti-condensation regulation method includes:

[0051] S510. Obtain the dry bulb temperature and the relative humidity, and obtain the dew point temperature according to the dry bulb temperature and the relative humidity;

[0052] S520. Determine the heat-dissipating refrigerant temperature according to the dew point temperature, where the heat-dissipating refrigerant temperature is the temperature of the refrigerant output from the second hot gas port 330 to the heat-dissipating refrigerant pipe fitting;

[0053] S530. Obtain the heat-dissipating refrigerant flow rate according to the heat-dissipating refrigerant temperature based on a preset heat-dissipating temperature and flow rate relationship model. The higher the heat-dissipating refrigerant temperature, the greater the heat-dissipating refrigerant flow rate. The heat-dissipating refrigerant flow rate is the flow rate of the refrigerant output from the second hot gas port 330 to the heat-dissipating refrigerant pipe fitting;

[0054] S540. The control module 430 controls the operation of the second valve core 350 according to the heat-dissipating refrigerant flow rate to adjust the second hot gas flow rate;

[0055] S550. Obtain the second intake temperature of the refrigerant required at the second intake port 320 according to the heat-dissipating refrigerant temperature and the heat-dissipating refrigerant flow rate;

[0056] S560. Obtain the heat-releasing output refrigerant temperature, where the heat-releasing output refrigerant temperature is the first intake temperature of the refrigerant at the first intake port 220;

[0057] S570. Obtain the first hot gas flow rate of the first hot gas port 230 based on the first intake air temperature and the second intake air temperature;

[0058] S580. The control module 430 controls the operation of the first valve core 250 to adjust and output the first hot gas flow rate.

[0059] It should be noted that in the refrigerant circulation loop of the heat pump system, the total refrigerant flow rate output from the output end of the heat release device 110 is fixed. The refrigerant output from the output end of the heat release device 110 enters through the first intake port 220 of the first eddy current pipe fitting 200 and is separated into a higher-temperature refrigerant and a lower-temperature refrigerant. The higher-temperature refrigerant is output from the first hot gas port 230, and the lower-temperature refrigerant is output from the first cold gas port 240. The control module 430 can adjust the first hot gas flow rate of the refrigerant by controlling the first valve core 250. In fact, the first hot gas flow rate is much smaller than the total refrigerant flow rate. Most of the refrigerant will directly enter the heat absorption device 130 through the first cold gas port 240 to absorb heat, and only a small part of the refrigerant is provided to the second eddy current pipe fitting 300 for further adjustment and then dissipates heat for the control module 430.

[0060] In the anti-condensation regulation method of the present invention, the dew point temperature is obtained based on the real-time dry bulb temperature and relative humidity, and then a suitable heat dissipation refrigerant temperature is formulated, so that it is not easy to generate a condensation phenomenon on the surface of the heat dissipation refrigerant pipe fitting. According to the different heat dissipation refrigerant temperatures, different heat dissipation refrigerant flow rates are obtained. When the heat dissipation refrigerant temperature is relatively low, the heat dissipation effect of the refrigerant on the control module 430 is better, and a relatively large heat dissipation refrigerant flow rate is not required to meet the heat dissipation demand. When the heat dissipation refrigerant temperature is relatively high, the heat dissipation effect of the refrigerant on the control module 430 is relatively poor. At this time, the heat dissipation refrigerant flow rate can be increased as much as possible within a suitable range. Although the heat dissipation refrigerant temperature is relatively high, the relatively increased heat dissipation refrigerant flow rate can also ensure a suitable heat dissipation effect. By setting the first eddy current pipe fitting 200 and the second eddy current pipe fitting 300, the heat release output refrigerant temperature of the refrigerant flowing out of the heat release device 110 can be detected. According to the heat dissipation refrigerant temperature and the heat dissipation refrigerant flow rate of the refrigerant input to the heat dissipation refrigerant pipe fitting, the second intake air temperature of the refrigerant required at the second intake port 320 can be obtained, and the first hot gas flow rate can be deduced in sequence. The control module 430 only needs to control the operation of the first valve core 250 to adjust and output the first hot gas flow rate, and control the operation of the second valve core 350 to adjust the second hot gas flow rate, so as to control the heat dissipation refrigerant temperature and the heat dissipation refrigerant flow rate, dissipate heat for the control module 430, and finally the refrigerant will converge into the compressor module 120. This design reduces the risk of condensation generation, ensures the heat dissipation demand of the control module 430, does not require an increase in energy consumption, and is safe and reliable to use.

[0061] In some embodiments of the present invention, in the step of obtaining the dew point temperature based on the dry bulb temperature and the relative humidity, the dew point temperature T d= U * (A + B * t) + C * t - 19.2, where A, B, and C are all calculation coefficients, t is the dry-bulb temperature, and U is the relative humidity. Specifically, A = 0.1980, B = 0.0017, and C = 0.8400.

[0062] In some embodiments of the present invention, in the determination of the heat dissipation refrigerant temperature based on the dew point temperature, the heat dissipation refrigerant temperature is greater than or equal to the dew point temperature.

[0063] Thus, it can be ensured that condensation basically does not occur on the surface of the heat dissipation refrigerant pipe fittings. In some embodiments of the present invention, the heat dissipation refrigerant temperature can also be slightly lower than the dew point temperature, that is, the sum of the heat dissipation refrigerant temperature and the adaptive temperature value is equal to the dew point temperature. The adaptive temperature value is specified by the designer. A lower heat dissipation refrigerant temperature can improve the heat dissipation effect, and the heat dissipation refrigerant temperature will not be too much lower than the dew point temperature, so that excessive condensation will not occur on the surface of the heat dissipation refrigerant pipe fittings.

[0064] In some embodiments of the present invention, in the determination of the heat dissipation refrigerant flow rate based on the preset heat dissipation temperature and flow rate relationship model according to the heat dissipation refrigerant temperature, the heat dissipation temperature and flow rate relationship model is C s = K * T s , where C s is the heat dissipation refrigerant flow rate, T s is the heat dissipation refrigerant temperature, and K is a linear conversion coefficient.

[0065] Among them, the linear conversion coefficient K is specified by the designer according to the actual situation. The heat dissipation temperature and flow rate relationship model is a linear model. The higher the heat dissipation refrigerant temperature, the greater the heat dissipation refrigerant flow rate.

[0066] In some embodiments of the present invention, the designer can also set the heat dissipation refrigerant flow rate corresponding to different heat dissipation refrigerant temperatures in the database, and the control module obtains the heat dissipation refrigerant flow rate by querying the database.

[0067] In some embodiments of the present invention, in the determination of the second intake temperature of the refrigerant required at the second intake port based on the heat dissipation refrigerant temperature and the heat dissipation refrigerant flow rate, the second intake temperature of the refrigerant required at the second intake port is calculated based on the heat dissipation refrigerant temperature and the heat dissipation refrigerant flow rate according to the second eddy current heat exchange model of the second eddy current pipe fitting. The second eddy current heat exchange model is:

[0068] T h2 = T i2 + Q 2 / C p * C h2 ;

[0069] Among them, T h2 is the second hot gas temperature of the refrigerant at the second hot gas port, Th2 = T s , T i2 is the second intake temperature of the refrigerant required at the second intake port, Q 2 is the refrigeration capacity characteristic parameter of the second eddy current pipe fitting, C p is the specific heat at constant pressure of the refrigerant, C h2 is the second hot gas flow rate of the refrigerant output from the second hot gas port, C h2 = C s .

[0070] In some embodiments of the present invention, in the process of obtaining the first hot gas flow rate of the first hot gas port based on the first intake temperature and the second intake temperature, the first hot gas flow rate is calculated according to the first intake temperature and the second intake temperature based on the first eddy current heat exchange model of the first eddy current pipe fitting. The second eddy current heat exchange model is:

[0071] T h1 = T i1 + Q 1 / C p * C h1 ;

[0072] Wherein, T h1 is the first hot gas temperature of the refrigerant at the first hot gas port, T h1 = T i2 , T i1 is the first intake temperature of the refrigerant at the first intake port, Q 1 is the refrigeration capacity characteristic parameter of the first eddy current pipe fitting, C p is the specific heat at constant pressure of the refrigerant, C h1 is the first hot gas flow rate.

[0073] Based on the heat dissipation temperature and flow rate relationship model C s = K * T s , after organizing the first eddy current heat exchange model and the second eddy current heat exchange model, we can get:

[0074] C h1 = C p * T s - Q 2 * K * T s / Q 1 , and C h1 > K * T s ;

[0075] Therefore, when designing K, Q 1 and Q 2 , it is necessary to satisfy

[0076] 1 > (Q 1 + Q 2 ) * K / C p .

[0077] Specifically, the refrigerating capacity characteristic parameter Q of the first eddy current pipe fitting 1 is greater than the refrigerating capacity characteristic parameter Q of the second eddy current pipe fitting 2 , thereby broadening the adjustable space of the second hot gas flow rate of the refrigerant output from the second hot gas port for easy control.

[0078] A heat pump system according to an embodiment of the second aspect of the present invention includes a heat release device 110, a compressor module 120, a heat absorption device 130, a first eddy current pipe fitting 200, a second eddy current pipe fitting 300, a first temperature detection component 410, a second temperature detection component 420, and a control module 430. The control module 430 is respectively connected to the compressor module 120, the first temperature detection component 410, and the second temperature detection component 420. A heat dissipation refrigerant pipe fitting is provided in the control module 430, and the refrigerant in the heat dissipation refrigerant pipe fitting can dissipate heat for the control module 430. The first temperature detection component 410 is used to detect the heat release output refrigerant temperature of the refrigerant at the output end of the heat release device 110, and the second temperature detection component 420 is used to detect the dry bulb temperature of the environment where the control module 430 is located. A first eddy current pipe 210 is provided in the first eddy current pipe fitting 200. The first eddy current pipe fitting 200 is provided with a first air inlet 220, a first hot air outlet 230, and a first cold air outlet 240 that communicate with the first eddy current pipe 210. Among them, the refrigerant entering the first eddy current pipe 210 from the first air inlet 220 is separated into a higher temperature refrigerant and a lower temperature refrigerant. The higher temperature refrigerant is output from the first hot air outlet 230, and the lower temperature refrigerant is output from the first cold air outlet 240. The first eddy current pipe fitting 200 is provided with a first valve core 250 in the first eddy current pipe 210, and the first valve core 250 can change the first hot air flow rate of the refrigerant output from the first hot air outlet 230. A second eddy current pipe 310 is provided in the second eddy current pipe fitting 300. The second eddy current pipe fitting 300 is provided with a second air inlet 320, a second hot air outlet 330, and a second cold air outlet 340 that communicate with the second eddy current pipe 310. Among them, the refrigerant entering the second eddy current pipe 310 from the second air inlet 320 is separated into a higher temperature refrigerant and a lower temperature refrigerant. The higher temperature refrigerant is output from the second hot air outlet 330, and the lower temperature refrigerant is output from the second cold air outlet 340. The second eddy current pipe fitting 300 is provided with a second valve core 350 in the second eddy current pipe 310, and the second valve core 350 can change the second hot air flow rate of the refrigerant output from the second hot air outlet 330; the output end of the heat release device 110 is docked with the first air inlet 220, the first hot air outlet 230 is docked with the second air inlet 320, the second hot air outlet 330 is docked with the head end of the heat dissipation refrigerant pipe fitting, the input end of the heat absorption device 130 is respectively docked with the first cold air outlet 240, the second cold air outlet 340, and the tail end of the heat dissipation refrigerant pipe fitting. The output end of the heat absorption device 130 is connected to the input end of the compressor module 120, and the output end of the compressor module 120 is connected to the input end of the heat release device 110. The control module 430 is respectively connected to the first eddy current pipe fitting 200 and the second eddy current pipe fitting 300 to control the operation of the first valve core 250 and the second valve core 350 according to the anti-condensation regulation method disclosed in any of the above embodiments.

[0079] The heat pump system of the present invention controls the operation of the first valve core and the second valve core by implementing the anti-condensation regulation method disclosed in any of the above embodiments, thereby controlling the temperature and flow rate of the heat dissipation refrigerant, dissipating heat from the control module. This design reduces the risk of condensation, ensures the heat dissipation requirements of the control module, and does not require increased energy consumption, making it safe and reliable to use.

[0080] According to the control device of the third aspect embodiment of the present invention, the control device includes a memory 620 and a processor 610. The memory 620 stores a computer program, and when the processor 610 executes the computer program, it implements the anti-condensation regulation method disclosed in any of the above embodiments.

[0081] As Figure 5 shown, Figure 5 The hardware structure of the control device of another embodiment is also schematically shown. The control device includes:

[0082] The processor 610 can be implemented in the form of a general-purpose central processing unit 610 (CPU), a microprocessor 610, an application-specific integrated circuit (ASIC), or one or more integrated circuits, etc., and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application;

[0083] The memory 620 can be implemented in the form of a read-only memory 620 (ROM), a static storage device, a dynamic storage device, or a random access memory 620 (RAM), etc. The memory 620 can store an operating system and other application programs. When implementing the technical solutions provided in the embodiments of this specification through software or firmware, the relevant program codes are stored in the memory 620, and the processor 610 is called to execute the anti-condensation regulation method of the embodiments of the present application;

[0084] The input / output interface 630 is used to implement information input and output;

[0085] The communication interface 640 is used to implement communication interaction between this device and other devices, and can implement communication through a wired method (such as USB, network cable, etc.) or through a wireless method (such as mobile network, WIFI, Bluetooth, etc.);

[0086] The bus 650 transmits information between the various components of the device (such as the processor 610, the memory 620, the input / output interface 630, and the communication interface 640);

[0087] Among them, the processor 610, the memory 620, the input / output interface 630, and the communication interface 640 are communicatively connected to each other inside the device through the bus 650.

[0088] According to the computer-readable storage medium of the fourth aspect embodiment of the present invention, the computer-readable storage medium stores a computer program, and is characterized in that when the computer program is executed by the processor 610, it implements the anti-condensation regulation method disclosed in any of the above embodiments.

[0089] The memory 620, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. In addition, the memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one magnetic disk storage device, a flash memory device, or other non-transitory solid-state storage devices. In some embodiments, the memory 620 may optionally include a memory remotely disposed relative to the processor, and these remote memories may be connected to the processor through a network. Examples of the above network include but are not limited to the Internet, an enterprise intranet, a local area network, a mobile communication network, and combinations thereof.

[0090] The embodiments described in the embodiments of the present application are for more clearly illustrating the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided by the embodiments of the present application. Those skilled in the art will know that with the evolution of technology and the emergence of new application scenarios, the technical solutions provided by the embodiments of the present application are equally applicable to similar technical problems.

[0091] Those skilled in the art can understand that the technical solutions shown in the figures do not constitute a limitation on the embodiments of the present application, and may include more or fewer steps than shown in the figures, or combine certain steps, or different steps.

[0092] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separated, that is, they may be located in one place, or may be distributed to multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0093] Those of ordinary skill in the art can understand that all or some of the steps in the methods disclosed above, and the functional modules / units in the systems and devices, can be implemented as software, firmware, hardware, and appropriate combinations thereof.

[0094] The terms "first", "second", "third", "fourth", etc. (if any) in the description of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances so that the embodiments of the present application described herein can be implemented in an order different from those illustrated or described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that comprises a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products, or devices.

[0095] The preferred embodiments of the embodiments of the present application have been described above with reference to the drawings, and thus do not limit the scope of the rights of the embodiments of the present application. Any modifications, equivalent replacements, and improvements made by those skilled in the art without departing from the scope and essence of the embodiments of the present application shall be within the scope of the rights of the embodiments of the present application.

Claims

1. A method for controlling condensation prevention, applied to a heat pump system, wherein the heat pump system comprises a heat releasing device, a compressor module, a heat absorbing device, a first vortex tube, a second vortex tube, a first temperature detecting member, a second temperature detecting member and a control module, wherein the control module is respectively connected to the compressor module, the first temperature detecting member and the second temperature detecting member, wherein a heat dissipation refrigerant tube is provided in the control module, and the refrigerant in the heat dissipation refrigerant tube can dissipate heat for the control module, wherein the first temperature detecting member is used to detect the heat release output refrigerant temperature of the refrigerant at the output end of the heat releasing device, and the second temperature detecting member is used to detect the dry bulb temperature of the environment in which the control module is located, wherein a first vortex pipe is provided in the first vortex pipe, and the first vortex pipe is provided with a first air inlet, a first hot air outlet and a first cold air outlet connected to the first vortex pipe, wherein: The refrigerant entering the first vortex duct from the first air inlet is separated into a higher temperature refrigerant and a lower temperature refrigerant, the higher temperature refrigerant is output from the first hot air port, and the lower temperature refrigerant is output from the first cold air port. The first vortex tube component is provided with a first valve core in the first vortex duct, and the first valve core can change the first hot air flow rate of the refrigerant output from the first hot air port. The second vortex tube component is provided with a second vortex duct, and the second vortex tube component is provided with a second air inlet, a second hot air port and a second cold air port connected to the second vortex tube, wherein the refrigerant entering the second vortex tube from the second air inlet is separated into a higher temperature refrigerant and a lower temperature refrigerant, the higher temperature refrigerant is output from the second hot air port, and the lower temperature refrigerant is output from the second cold air port. The second vortex tube component is provided with a second air inlet, a second hot air port and a second cold air port connected to the second vortex tube. A second valve core is arranged inside, and the second valve core can change the second hot air flow rate of the refrigerant outputted from the second hot air port; the output end of the heat release device is connected to the first air inlet, the first hot air port is connected to the second air inlet, the second hot air port is connected to the head end of the heat dissipation refrigerant pipe fitting, the input end of the heat absorption device is respectively connected to the first cold air port, the second cold air port and the tail end of the heat dissipation refrigerant pipe fitting, the output end of the heat absorption device is connected to the input end of the compressor module, the output end of the compressor module is connected to the input end of the heat release device, and the control module is respectively connected to the first vortex pipe fitting and the second vortex pipe fitting to control the operation of the first valve core and the second valve core; characterized in that the anti-condensation control method comprises: Get the dry bulb temperature and relative humidity, and calculate the dew point temperature based on the dry bulb temperature and relative humidity; The heat dissipation refrigerant temperature is determined according to the dew point temperature, wherein the heat dissipation refrigerant temperature is the temperature of the refrigerant output from the second hot air outlet to the heat dissipation refrigerant pipe; The heat dissipation refrigerant flow rate is obtained according to the heat dissipation refrigerant temperature based on a preset heat dissipation temperature and flow rate relationship model, wherein the higher the heat dissipation refrigerant temperature, the greater the heat dissipation refrigerant flow rate, and the heat dissipation refrigerant flow rate is the flow rate of the refrigerant output from the second hot air port to the heat dissipation refrigerant pipe fitting; The control module controls the operation of the second valve core according to the heat dissipation refrigerant flow to adjust the second hot gas flow; Determining the second air inlet temperature of the refrigerant required at the second air inlet according to the heat dissipation refrigerant temperature and the heat dissipation refrigerant flow rate; Obtaining a heat release output refrigerant temperature, wherein the heat release output refrigerant temperature is a first air inlet temperature of the refrigerant at the first air inlet; Determining a first hot air flow rate of the first hot air outlet according to a first intake air temperature and a second intake air temperature; The control module controls the operation of the first valve core to adjust a first hot gas flow rate.

2. The anti-condensation control method according to claim 1, characterized in that: In the dew point temperature obtained from the dry bulb temperature and relative humidity, the dew point temperature T d =U*(A+B*t)+C*t-19.2, where A, B and C are calculation coefficients, t is the dry bulb temperature, and U is the relative humidity.

3. The anti-condensation control method according to claim 1, characterized in that: In the method of obtaining the heat dissipation refrigerant flow rate based on the heat dissipation refrigerant temperature based on the preset heat dissipation temperature and flow rate relationship model, the heat dissipation temperature and flow rate relationship model is C s =K*T s , where C s is the cooling refrigerant flow rate, T s is the heat dissipation refrigerant temperature, and K is the linear conversion coefficient.

4. The anti-condensation control method according to claim 1, characterized in that: In the step of obtaining the second air intake temperature of the refrigerant required at the second air inlet according to the heat dissipation refrigerant temperature and the heat dissipation refrigerant flow rate, the second air intake temperature of the refrigerant required at the second air inlet is calculated based on the second vortex heat exchange model of the second vortex tube according to the heat dissipation refrigerant temperature and the heat dissipation refrigerant flow rate, and the second vortex heat exchange model is: T h2 =T i1 +Q2 / C p *C h2 ; Among them, T h2 is the second hot gas temperature of the refrigerant at the second hot gas outlet, T h2 =T s , T i2 is the second inlet temperature of the refrigerant required at the second inlet, Q2 is the refrigeration capacity characteristic parameter of the second vortex tube, C p is the constant pressure specific heat of the refrigerant, C h2 The second hot gas flow rate of the refrigerant output from the second hot gas outlet, C h2 =C s .

5. The anti-condensation control method according to claim 4, characterized in that: In the step of obtaining the first hot air flow rate of the first hot air port according to the first intake air temperature and the second intake air temperature, the first hot air flow rate is calculated based on the first vortex heat exchange model of the first vortex tube according to the first intake air temperature and the second intake air temperature, and the second vortex heat exchange model is: T h1 =T i1 +Q1 / C p *C h1 ; Among them, T h1 is the first hot gas temperature of the refrigerant at the first hot gas outlet, T h1 =T i2 , T i1 is the first inlet temperature of the refrigerant at the first inlet, Q1 is the refrigeration capacity characteristic parameter of the first vortex tube, C p is the constant pressure specific heat of the refrigerant, C h1 is the first hot gas flow rate.

6. The anti-condensation control method according to claim 5, characterized in that: The refrigeration capacity characteristic parameter Q1 of the first vortex tube component is greater than the refrigeration capacity characteristic parameter Q2 of the second vortex tube component.

7. The anti-condensation control method according to claim 1, characterized in that: In the step of determining the heat dissipation refrigerant temperature according to the dew point temperature, the heat dissipation refrigerant temperature is greater than or equal to the dew point temperature.

8. A heat pump system, characterized in that: The invention comprises a heat releasing device, a compressor module, a heat absorbing device, a first vortex tube, a second vortex tube, a first temperature detecting member, a second temperature detecting member and a control module. The control module is respectively connected to the compressor module, the first temperature detecting member and the second temperature detecting member. A heat dissipation refrigerant tube is arranged in the control module. The refrigerant in the heat dissipation refrigerant tube can dissipate heat for the control module. The first temperature detecting member is used to detect the heat release output refrigerant temperature of the refrigerant at the output end of the heat releasing device. The second temperature detecting member is used to detect the dry bulb temperature of the environment in which the control module is located. The first vortex tube A first vortex duct is provided in the component, and the first vortex duct is provided with a first air inlet, a first hot air outlet and a first cold air outlet connected to the first vortex duct, wherein the refrigerant entering the first vortex duct from the first air inlet is separated into a higher-temperature refrigerant and a lower-temperature refrigerant, the higher-temperature refrigerant is output from the first hot air outlet, and the lower-temperature refrigerant is output from the first cold air outlet, the first vortex duct is provided with a first valve core in the first vortex duct, and the first valve core can change the first hot air flow rate of the refrigerant output from the first hot air outlet, the second vortex duct is provided in the second ... The second vortex pipe is provided with a second air inlet, a second hot air outlet and a second cold air outlet connected to the second vortex pipe, wherein the refrigerant entering the second vortex pipe from the second air inlet is separated into a higher temperature refrigerant and a lower temperature refrigerant, the higher temperature refrigerant is output from the second hot air outlet, and the lower temperature refrigerant is output from the second cold air outlet, and the second vortex pipe is provided with a second valve core in the second vortex pipe, and the second valve core can change the second hot air flow rate of the refrigerant output from the second hot air outlet; the output end of the heat release device is connected to the first air inlet, and the first hot air outlet is connected to the second air inlet. The first and second hot air ports are connected to each other, the second hot air port is connected to the head end of the heat dissipation refrigerant pipe fitting, the input end of the heat absorption device is connected to the first cold air port, the second cold air port and the tail end of the heat dissipation refrigerant pipe fitting respectively, the output end of the heat absorption device is connected to the input end of the compressor module, the output end of the compressor module is connected to the input end of the heat release device, and the control module is connected to the first vortex pipe fitting and the second vortex pipe fitting respectively to control the operation of the first valve core and the second valve core according to the anti-condensation control method according to any one of claims 1 to 7.

9. A control device, characterized in that: The control device includes a memory and a processor, the memory stores a computer program, and the processor implements the anti-condensation control method according to any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the anti-condensation control method according to any one of claims 1 to 7 is implemented.

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