Optical module

Abstract

An optical module disclosed by the present application comprises a coherent optical assembly, the coherent optical assembly comprises a cover shell and a substrate, the substrate is fixed on a circuit board, the substrate is electrically connected with the circuit board, the cover shell covers the coherent substrate to form a storage cavity, and an optical chip, an optical matching chip and an electric switching fixing piece are arranged in the storage cavity. The first surfaces of the optical chip and the optical matching chip are provided with bonding pads, and the second surfaces of the optical chip and the optical matching chip are attached to the cover shell. The electric switching fixing piece is fixed on the substrate, the electric switching piece is electrically connected with the substrate, and the electric switching fixing piece is in routing connection with bonding pads of the optical chip and the optical matching chip. The electric switching fixing piece is provided with a plurality of hollowed-out areas, the optical chip and the optical matching chip are placed in the corresponding hollowed-out areas, and gaps are formed between the first faces of the optical chip and the optical matching chip and the substrate. According to the invention, the bonding pads are arranged on the first surfaces of the optical chip and the optical matching chip, and the second surfaces of the optical chip and the optical matching chip are mounted on the cover shell, so that the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0002] The coherent optical module includes a light source and a coherent optical component, and the light source is connected to the coherent optical component. The light emitted by the light source is incident on the coherent optical component, and the light emitted by the light source is split inside the coherent optical component. One beam is used as the transmission light to enter the coherent modulation chip inside the coherent optical component to realize the electro-optical signal conversion, and the converted high-speed optical signal is output from the optical transmission interface; the other beam is used as the local oscillator light, and the high-speed optical signal input from the optical receiving interface into the coherent optical component is coherently demodulated to complete the optical-electrical signal conversion.

[0003] The optical chip and the optical matching chip are mounted in the storage cavity in the form of BGA packaging using a positive mounting process. That is, the second side of the optical chip and the optical matching chip is mounted on the coherent substrate, and the first side of the optical chip and the optical matching chip is provided with a wire bonding pad. There is a gap between the first side of the optical chip and the optical matching chip and the first cover shell, and the first side of the optical chip and the optical matching chip is connected to the coherent substrate through wire bonding. The main heat dissipation path of the optical chip and the optical matching chip is the first side of the optical chip and the optical matching chip-air-first cover shell-thermal conductive pad-upper shell of the optical module. However, there are wire bonding pads on the first side of the optical chip and the optical matching chip, and the area available for heat dissipation on the first side of the optical chip and the optical matching chip is small, and the optical chip and the optical matching chip are still a certain distance from the first cover shell, and the thermal conductivity of the air is small, resulting in only a very small part of the heat of the optical chip and the optical matching chip being conducted to the outside of the optical module, and the heat dissipation efficiency is low. Summary of the invention

[0004] The present application provides an optical module to improve heat dissipation efficiency.

[0005] An optical module, comprising:

[0006] Circuit boards;

[0007] A coherent optical component is arranged on a circuit board; the coherent optical component includes a cover shell and a substrate, the substrate is fixed on the circuit board, the substrate is electrically connected to the circuit board, and the cover shell is arranged on the substrate to form a storage cavity; an optical chip, an optical matching chip and an electrical switching fixture are arranged in the storage cavity, the first surfaces of the optical chip and the optical matching chip are provided with a first soldering pad, and the second surfaces of the optical chip and the optical matching chip are both mounted on the inner top wall of the cover shell; the electrical switching fixture is fixed on the substrate, and the electrical switching substrate is electrically connected to the substrate; the electrical switching fixture has a plurality of hollowed-out areas, the optical chip and the optical matching chip are placed in the corresponding hollowed-out areas, a second soldering pad is arranged on a side of the electrical switching fixture that is away from the cover shell, the second soldering pad is located around the hollowed-out area, there is a gap between the second soldering pad and the substrate, and the first soldering pad is wired to the second soldering pad so that there is a gap between the first surfaces of the optical chip and the optical matching chip and the substrate.

[0008] An optical module, comprising:

[0009] Circuit boards;

[0010] A coherent optical component is arranged on a circuit board; the coherent optical component includes a cover shell and a substrate, the substrate is fixed on the circuit board, the substrate is electrically connected to the circuit board, and the cover shell is arranged on the substrate to form a storage cavity; an optical chip, an optical matching chip and an electrical switching fixture are arranged in the storage cavity, the first surfaces of the optical chip and the optical matching chip are provided with a first soldering pad, and the second surfaces of the optical chip and the optical matching chip are both mounted on the inner top wall of the cover shell; the electrical switching fixture is fixed on the substrate, and the electrical switching substrate is electrically connected to the substrate; the electrical switching fixture has a plurality of hollowed-out areas and storage recesses, the storage recesses are located around the hollowed-out areas, the optical chip and the optical matching chip are placed in the corresponding hollowed-out areas, there is a gap between the storage recess and the substrate, the first soldering pad is wired to the second soldering pad of the storage recess, so that there is a gap between the first surface of the optical chip and the optical matching chip and the substrate respectively.

[0011] Beneficial effects: The present application provides an optical module, including a circuit board and a coherent optical component, the coherent optical component is arranged on the circuit board, and the coherent optical component is used to realize the modulation and demodulation of optical signals. The coherent optical component includes a cover shell and a substrate, the substrate is fixed on the circuit board, the substrate is electrically connected to the circuit board, the cover shell is arranged on the substrate to form a storage cavity, and an optical chip, an optical matching chip and an electrical transfer fixture are arranged in the storage cavity, the first surface of the optical chip and the optical matching chip is provided with a first solder pad, and the second surface of the optical chip and the optical matching chip has no solder pad, and the second surface of the optical chip and the optical matching chip is mounted on the inner top wall of the cover shell, and the heat generated by the optical chip and the optical matching chip is directly conducted to the cover shell, without being conducted to the cover shell through the air, thereby improving the heat dissipation efficiency. The heat generated by the optical chip and the optical matching chip is directly conducted to the cover shell, and no longer enters the circuit board, so it will not cause thermal interference to the electrical components on the circuit board. In order to make the optical chip and the optical matching chip work normally, the electrical transfer fixture is fixed on the substrate, the electrical transfer fixture is electrically connected to the substrate, and the electrical transfer fixture is wired to the first solder pad of the optical chip and the optical matching chip. The electrical signals on the circuit board are transmitted to the optical chip and the optical matching chip in turn through the substrate and the electrical transfer fixture. The electrical signals of the optical chip and the optical matching chip are transmitted to the circuit board in turn through the electrical transfer fixture and the substrate, so that the optical chip and the optical matching chip can work normally. Since the gold wire between the electrical transfer fixture and the first pads of the optical chip and the optical matching chip is easily damaged, in order to protect the gold wire, there is a gap between the first surface of the optical chip and the optical matching chip and the substrate. There is a gap between the first surface of the optical chip and the optical matching chip and the substrate to prevent the gold wire from colliding with the device in the storage cavity, thereby protecting the gold wire. In order to shorten the gold wire, the electrical transfer fixture has a plurality of hollowed-out areas and second pads. The second pads are arranged on the side of the electrical transfer fixture that is away from the cover shell. The second pads are located around the hollowed-out areas. The optical chip and the optical matching chip are placed in the corresponding hollowed-out areas. The first pads of the optical chip and the optical matching chip are wired to the second pads. The second pad is located around the hollowed-out area, and the optical chip and the optical matching chip are placed in the corresponding hollowed-out area, so that the first pads of the optical chip and the optical matching chip are flush with the second pad, thereby shortening the gold wire between the first pad and the second pad. There is a gap between the second pad and the substrate, and the first pad and the second pad are connected by wire bonding, so that there is a gap between the first surface of the optical chip and the optical matching chip and the substrate.In the present application, a first solder pad is provided on the first side of the optical chip and the optical matching chip, and the second sides of the optical chip and the optical matching chip are both mounted on the inner top wall of the cover shell to improve the heat dissipation efficiency; the electrical adapter fixture is electrically connected to the substrate, the substrate is electrically connected to the circuit board, and the electrical adapter fixture is wired to the first solder pad of the optical chip and the optical matching chip to ensure the normal operation of the optical chip and the optical matching chip; the electrical adapter fixture has multiple hollowed-out areas, and the optical chip and the optical matching chip are both placed in the corresponding hollowed-out areas, and a second solder pad is provided in the area around the hollowed-out area in the electrical adapter fixture, so that the first solder pads of the optical chip and the optical matching chip are flush with the second solder pad, thereby shortening the gold wire between the first solder pad and the second solder pad. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0013] Figure 1 is a partial structural diagram of an optical communication system provided according to some embodiments;

[0014] Figure 2 A partial structural diagram of a host computer provided according to some embodiments;

[0015] Figure 3 A structural diagram of an optical module provided according to some embodiments;

[0016] Figure 4 is an exploded view of an optical module provided according to some embodiments;

[0017] Figure 5 is a structural diagram of a coherent optical component provided according to some embodiments;

[0018] Figure 6 is an exploded view of a coherent optical assembly according to some embodiments;

[0019] Figure 7 is a cross-sectional view of a coherent optical assembly according to some embodiments;

[0020] Figure 8 An assembly diagram of a cover shell and a bottom shell provided according to some embodiments;

[0021] Fig. 9 An exploded view of a cover shell and a bottom shell provided according to some embodiments;

[0022] Fig.10An exploded view of a coherent optical assembly without a cover shell and a bottom shell according to some embodiments;

[0023] Fig.11 A cross-sectional view of a coherent optical assembly with a cover shell and a bottom shell removed according to some embodiments;

[0024] Fig.12 An assembly diagram of an optical chip, an optical matching chip, and a coherent substrate provided according to some embodiments;

[0025] Fig.13 An assembly diagram of an optical chip, an optical matching chip, and a coherent substrate provided according to some embodiments at another viewing angle;

[0026] Fig.14 An exploded view of an optical chip, an optical matching chip, and a coherent substrate provided according to some embodiments;

[0027] Fig.15 A structural diagram of an electrical switching fixture provided according to some embodiments;

[0028] Fig.16 A structural diagram of an electrical switching fixture provided in accordance with some embodiments at another viewing angle;

[0029] Fig.17 An assembly diagram of an electrical transfer fixture, an optical chip, and an optical matching chip provided according to some embodiments;

[0030] Fig.18 A structural diagram of an optical module excluding a housing according to some embodiments;

[0031] Fig.19 A diagram showing the relationship between an MCU, an adjustable voltage source, a DSP, and a coherent optical component according to some embodiments;

[0032] Fig. 20 A structural diagram of a DSP provided according to some embodiments;

[0033] Fig.21 A structural diagram of an MCU provided according to some embodiments;

[0034] Fig. 22 is a structural diagram of an adjustable voltage source provided according to some embodiments;

[0035] Fig.23 A schematic diagram of a coherent optical component according to some embodiments;

[0036] Fig.24 An assembly diagram of a coherent optical component and an MCU according to some embodiments;

[0037] Fig.25Another assembly diagram of a coherent optical component and an MCU according to some embodiments;

[0038] Fig.26 1 is a splitting ratio curve provided according to some embodiments. DETAILED DESCRIPTION

[0039] Some embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. However, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0040] Unless the context requires otherwise, throughout the specification and claims, the term "comprising" is to be interpreted as having an open, inclusive meaning, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" implies open and inclusive language, which does not exclude devices that are suitable for or configured to perform additional tasks or steps; descriptions such as "parallel", "perpendicular", "same", "consistent", and "flush" are not limited to absolute mathematical theoretical relationships, but also include an acceptable error range generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0041] In optical communication technology, in order to establish information transmission between information processing devices, it is necessary to load information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When optical signals are transmitted in information transmission equipment, the loss of optical power can be reduced, so high-speed, long-distance, and low-cost information transmission can be achieved. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment usually includes optical network terminals (Optical Network Unit, ONU), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment usually includes optical fibers and optical waveguides.

[0042] The optical module can realize the mutual conversion between optical signals and electrical signals between information processing equipment and information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; the first optical signal from the optical fiber is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since multiple information processing devices can transmit information through electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, and all information processing devices do not need to be directly connected to the optical module. Here, the information processing device directly connected to the optical module is called the upper computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be called an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be called an electrical port.

[0043] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system provided according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0044] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal undergoes multiple total reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.

[0045] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 are detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the working state of the optical module 200.

[0046] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

[0047] The host computer 100 also includes an external electrical interface, which can be connected to an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104, and the network cable interface 104 is configured to access the network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, the third electrical signal sent by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, and the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101. For example, the first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to the optical module 200, and the optical module 200 converts the first optical signal into a first electrical signal, and the optical module 200 transmits the first electrical signal to the host computer 100, and the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that the optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between the optical signals and electrical signals, the information does not change, but the encoding and decoding methods of the information can change.

[0048] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0049] Figure 2 FIG. 1 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. Figure 2 As shown, the host computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0050] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 establishes a bidirectional electrical signal connection with the host computer 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101.

[0051] Figure 3 is a structural diagram of an optical module provided according to some embodiments, Figure 4 FIG. 1 is an exploded view of an optical module provided according to some embodiments. Figure 3 and Figure 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, a light source 901 and a coherent optical component 902 .

[0052] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square body.

[0053] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0054] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0055] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold finger of the circuit board 300 extends from the electrical port and is inserted into the electrical connector of the host computer 100; the opening 205 is an optical port, which is configured to access the external optical fiber 101, so that the optical fiber 101 connects the light source 900 and the coherent optical component 902 in the optical module 200.

[0056] The upper housing 201 and the lower housing 202 are combined to facilitate the installation of the circuit board 300, the light source 900, the coherent optical component 902, etc. into the housing, and the upper housing 201 and the lower housing 202 can encapsulate and protect the above components. In addition, when assembling the circuit board 300, the light source 900, the coherent optical component 902, etc., it is convenient to deploy the positioning components, heat dissipation components, and electromagnetic shielding components of these components, which is conducive to automated production.

[0057] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0058] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0059] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the fixation of the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0060] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, transistors, metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET), etc. The chips may include microcontroller units (Microcontroller Unit, MCU), laser driver chips, transimpedance amplifiers (Transimpedance Amplifier, TIA), limiting amplifiers (Limiting Amplifier, LIA), clock and data recovery chips (Clock and Data Recovery, CDR), power management chips, and digital signal processing (Digital Signal Processing, DSP) chips.

[0061] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0062] The circuit board 300 also includes a gold finger formed on the end surface thereof, and the gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106. The gold finger can be provided on the surface of only one side of the circuit board 300 (for example, Figure 4 The upper surface shown in the figure) can also be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, so as to adapt to occasions where the number of pins is large. The gold finger is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0063] The light source 901 is connected to the circuit board 300 and is used for emitting light.

[0064] The optical module further includes a transmitting optical fiber adapter 700 and a receiving optical fiber adapter 701. The transmitting optical fiber adapter 700 is used to transmit high-frequency optical signals, and the receiving optical fiber adapter 701 is used to receive high-frequency optical signals.

[0065] The coherent optical component 902 is placed on the circuit board and is used to realize the conversion of high-speed photoelectric signals. Specifically, the coherent optical component 902 includes an optical transmission interface, an optical receiving interface and a local oscillator optical interface. The optical transmission interface extends a first optical fiber, the optical receiving interface extends a second optical fiber, and the local oscillator optical interface extends a third optical fiber. The optical transmission interface is connected to the transmission optical fiber adapter 700, the optical receiving interface is connected to the receiving optical fiber adapter 701, and the local oscillator optical interface is connected to the light source 901. The first optical fiber, the second optical fiber and the third optical fiber form an optical fiber array. The coherent optical component is respectively connected to the transmission optical fiber adapter, the receiving optical fiber adapter and the light source 901 through the optical fiber array. The coherent optical component 902 is also connected to the DSP chip 301.

[0066] The light emitted by the light source 901 is input into the coherent optical component 902 through the local oscillator optical interface, and the laser is split into beams inside the coherent optical component 902. One beam is used as the transmitting light beam and enters the coherent modulation chip inside the coherent optical component. The electric-optical signal conversion is realized under the drive of the high-frequency electrical signal of the DSP chip 301. The converted high-frequency optical signal is output from the optical transmitting interface of the module; the other beam is used as the local oscillator light beam and is coherently demodulated with the high-frequency optical signal input into the coherent optical component 902 from the optical receiving port of the module. The demodulated electrical signal enters the DSP chip 301 for signal processing, thereby completing the optical-electrical signal conversion.

[0067] Figure 5 A structural diagram of a coherent optical component provided according to some embodiments. Figure 6 FIG. 1 is an exploded view of a coherent optical assembly according to some embodiments. Figure 5 and Figure 6 As shown, the coherent optical component 902 includes a cover 921 and a substrate 923, the substrate 923 is fixed on the circuit board 300, and the cover 921 is covered on the substrate 923 to form a first storage cavity, in which an optical chip and an optical matching chip are arranged, the optical chip includes a coherent modulation chip 925, the optical matching chip includes a driver chip 926 and a transimpedance amplifier chip 924, the coherent modulation chip 925 is used for modulation and demodulation of optical signals, the driver chip 926 is used to provide modulation current to the coherent modulation chip 925, so that the coherent modulation chip 925 can realize the modulation of optical signals, and the transimpedance amplifier chip 924 is used to amplify electrical signals. The electrical signal is obtained by demodulating the received optical signal by the coherent modulation chip 925.

[0068] The substrate 923 is a circuit adapter board, which is used to transfer the electrical signal on the circuit board 300 to the first storage cavity, and also transfer the electrical signal in the first storage cavity to the circuit board 300. In some embodiments, the substrate 923 includes circuit traces, etc., and the circuit board 300 is connected to the optical chip and the optical matching chip in the first storage cavity through the circuit traces.

[0069] In some embodiments, the optical chip and the optical matching chip are both mounted in the first storage cavity in the form of a BGA package using a positive mounting process. That is, the second side of the optical chip and the optical matching chip is mounted on the substrate, the first side of the optical chip and the optical matching chip is provided with a wire bonding pad, there is a gap between the first side of the optical chip and the optical matching chip and the cover 921, and the first side of the optical chip and the optical matching chip is connected to the substrate through wire bonding.

[0070] Under the normal mounting process, the heat dissipation of the optical chip and the optical matching chip becomes a difficult point. First, the heat dissipation performance of the substrate is poor. The substrate is welded on the circuit board, and the heat conducted to the substrate will also cause thermal interference to other devices on the circuit board. Secondly, the main heat dissipation path of the optical chip and the optical matching chip is the first side of the optical chip and the optical matching chip-air-cover shell 921-thermal conductive gasket-upper shell of the optical module. However, there are wire bonding pads on the first side of the optical chip and the optical matching chip, and the area available for heat dissipation on the first side of the optical chip and the optical matching chip is small, and the optical chip and the optical matching chip are still a certain distance from the cover shell 921, and the thermal conductivity of the air is small, resulting in only a very small part of the heat of the optical chip and the optical matching chip being conducted to the outside of the optical module, and the heat dissipation efficiency is low.

[0071] In order to solve this problem, in some embodiments, the optical chip and the optical matching chip are mounted in the first placement cavity in the form of a flip chip process. That is, the second surface of the optical chip and the optical matching chip is mounted on the inner top wall of the cover shell 921, the first surface of the optical chip and the optical matching chip is provided with a pad, there is a gap between the first surface of the optical chip and the optical matching chip and the substrate, and the first surface of the optical chip and the optical matching chip is connected to the substrate through wire bonding.

[0072] The packaging process of the coherent optical component is to first mount the optical chip and the optical matching chip on the inner top wall of the cover shell 921, then fix the cover shell 921 on the substrate 923, and finally connect the pads of the optical chip and the optical matching chip with the pad area on the substrate 923 by wire bonding. However, after the cover shell 921 is fixed on the substrate 923, the wire bonding tool cannot enter the first storage cavity surrounded by the cover shell 921 and the substrate 923, and cannot perform wire bonding on the pads of the optical chip and the optical matching chip and the pad area on the substrate 923. Therefore, it is necessary to set an electrical transfer fixture 922 in the first storage cavity to transfer the electrical signals of the optical chip and the optical matching chip to the circuit board, and also transfer the electrical signals on the circuit board to the optical chip and the optical matching chip.

[0073] The electrical transfer fixture 922 is a circuit transfer board, which is used to transfer the electrical signals on the circuit board 300 to the optical chip and the optical matching chip, and also transfer the electrical signals of the optical chip and the optical matching chip to the circuit board 300. In some embodiments, the electrical transfer fixture 922 includes circuit traces, etc., and the circuit board 300 is connected to the optical chip and the optical matching chip through the circuit traces.

[0074] Figure 7 is a cross-sectional view of a coherent optical component provided according to some embodiments. Figure 7 As shown, in some embodiments, the cover shell 921 and the substrate 923 form a first storage cavity, and an electrical adapter fixture 922 is disposed in the first storage cavity. The electrical adapter fixture 922 is provided with a solder pad area and a solder ball area. The solder pad area is wire-bonded to the optical chip and the optical matching chip, and the solder ball area is connected to the substrate 923.

[0075] like Figure 6 and Figure 7 As shown, the coherent optical assembly further includes an optical fiber array 927, one end of which is located in the second storage cavity, and the other end of the optical fiber array 927 extends out of the second storage cavity, and the three optical fibers of the optical fiber array 927 extending out of the second storage cavity are respectively connected to the light source, the transmitting optical fiber adapter 700 and the receiving optical fiber adapter 701, so that the optical fiber array 927 receives the light emitted by the light source 901, the optical signal sent by the receiving optical fiber adapter 701, and transmits the optical signal to the transmitting optical fiber adapter 700. The first storage cavity and the second storage cavity enclose the storage cavity.

[0076] Figure 8 The figure is an assembly diagram of a cover shell and a bottom shell according to some embodiments. Fig. 9 FIG. 1 is an exploded view of a cover shell and a bottom shell according to some embodiments. Figure 8 and Fig. 9 As shown, the coherent optical assembly further includes a bottom shell 928, and the cover shell 921 and the bottom shell 928 enclose a second storage cavity 9218 having a through hole 9217, so as to fix the optical fiber array 927 in the second storage cavity 9218. That is, one end of the optical fiber array 927 is located in the second storage cavity 9218, and the other end of the optical fiber array 927 extends out of the second storage cavity 9218 through the through hole 9217.

[0077] like Fig. 9 As shown, in some embodiments, the cover shell 921 is provided with a first protrusion 9215 and a second protrusion 9216, the first protrusion 9215 is provided corresponding to the transimpedance amplifier chip 924, the second protrusion 9216 is provided corresponding to the driver chip 926, the first protrusion 9215 is in contact with the transimpedance amplifier chip 924, and the second protrusion 9216 is in contact with the driver chip 926. The first protrusion 9215 and the second protrusion 9216 can not only compensate for the height difference between the transimpedance amplifier chip 924 and the driver chip 926 and the coherent modulation chip 925, so that the first surface heights of the transimpedance amplifier chip 924, the driver chip 926 and the coherent modulation chip 925 are flush, but also can dissipate heat. The first protrusion 9215 and the second protrusion 9216 increase the thickness of the cover shell 921 to improve the heat dissipation efficiency of the cover shell 921.

[0078] like Fig. 9As shown, in some embodiments, the cover shell 921 includes a cover shell bottom plate 9213 and a cover shell side plate 9214, the upper surface of the cover shell side plate 9214 is in contact with and connected to the cover shell bottom plate 9213, and the lower surface of the cover shell side plate 9214 is in contact with and connected to the substrate 923, the cover shell bottom plate 9213 and the cover shell side plate 9214 form a first storage groove 9211 and a second storage groove 9212, the second storage groove 9212 and the bottom shell 928 form a second storage cavity 9218, the first storage groove is arranged corresponding to the optical chip and the optical matching chip, the first storage groove 9211 and the second storage groove 9212 are connected, and the first storage groove 9211 is provided with a first protrusion 9215 and a second protrusion 9216.

[0079] One end of the cover shell side plate 9214 has a through hole 9217, one end of the bottom shell 928 is in contact with the side wall of the through hole 9217, and the two oppositely disposed side walls of the other end of the bottom shell 928 are respectively in contact with the side walls of the second storage cavity 9218. That is, the bottom shell 928 includes a first bottom shell portion 9281 and a second bottom shell portion 9282, and the width dimension of the first bottom shell portion 9281 is smaller than the width dimension of the second bottom shell portion 9282, so that the first bottom shell portion 9281 is in contact with the side wall of the through hole 9217, and the two oppositely disposed side walls of the second bottom shell portion 9282 are respectively in contact with the side walls of the second storage groove.

[0080] Fig.10 An exploded view of a coherent optical assembly without a cover and a bottom housing according to some embodiments. Fig.11 FIG. 4 is a cross-sectional view of a coherent optical assembly without a cover shell and a bottom shell according to some embodiments. Fig.10 and Fig.11 As shown, in some embodiments, the optical fiber array 927 is connected to the coherent modulation chip 925 so that the coherent modulation chip 925 receives the light and received optical signals transmitted by the optical fiber array 927 and also sends transmitted optical signals to the optical fiber array 927.

[0081] In order to prevent the light in the optical fiber array 927 and the transmitted optical signal from being reflected at the connection between the end face of the optical fiber array 927 and the end face of the coherent modulation chip 925, thereby affecting the optical power, the central axis of the optical fiber array 927 and the central axis of the optical port of the coherent modulation chip 925 are at an angle of 6° to 8°, thereby reducing the light and the transmitted optical signal from being reflected at the connection between the end face of the optical fiber array 927 and the end face of the coherent modulation chip 925.

[0082] In some embodiments, the optical fiber array 927 and the coherent modulation chip 925 are directly bonded by glue, that is, the end face of the optical fiber array 927 and the end face of the coherent modulation chip 925 are directly connected by glue.

[0083] In some embodiments, the optical fiber array 927 is connected to the coherent modulation chip 925 via a connector 929. That is, the end surface of one end of the connector 929 is connected to the end surface of the optical fiber array 927 via glue, and the upper surface of the other end of the connector 929 is connected to the first surface of the coherent modulation chip 925 via glue, thereby increasing the bonding surface between the connector 929 and the optical fiber array 927 to improve the connection stability between the optical fiber array 927 and the coherent modulation chip 925.

[0084] Fig.12 The figure is an assembly diagram of an optical chip, an optical matching chip and a coherent substrate according to some embodiments. Fig.13 The figure is an assembly diagram of an optical chip, an optical matching chip and a coherent substrate provided according to some embodiments from another perspective. Fig.14 FIG. 1 is an exploded view of an optical chip, an optical matching chip, and a coherent substrate provided according to some embodiments. Fig.12 , Fig.13 and Fig.14 As shown, the electrical transfer fixture 922 is fixed on the substrate 923, the electrical transfer fixture 922 is electrically connected to the substrate 923, and the coherent modulation chip 925, the driving chip 926 and the transimpedance amplifier chip 924 are wired to the electrical transfer fixture 922, so as to transmit the electrical signals of the coherent modulation chip 925, the driving chip 926 and the transimpedance amplifier chip 924 to the substrate 923 via the electrical transfer fixture 922, and also transmit the electrical signals on the substrate 923 to the coherent modulation chip 925, the driving chip 926 and the transimpedance amplifier chip 924 via the electrical transfer fixture 922.

[0085] In some embodiments, the electrical transfer fixture 922 is soldered to the substrate 923 via solder balls, which not only fixes the electrical transfer fixture 922 to the substrate 923 , but also enables electrical connection between the electrical transfer fixture 922 and the substrate 923 .

[0086] In order to protect the gold wire, in some embodiments, there is a gap between the first surface of the optical chip and the optical matching chip and the substrate, respectively. There is a gap between the first surface of the optical chip and the optical matching chip and the substrate, respectively, to prevent the gold wire from colliding with the device in the storage cavity, thereby protecting the gold wire.

[0087] In order to reduce the wire bonding distance between the coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 and the electrical transfer fixture 922, in some embodiments, the electrical transfer fixture 922 is provided with a plurality of hollowed-out areas, and the areas around the hollowed-out areas in the electrical transfer fixture 922 are provided with second pads, and the coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 are all placed in the corresponding hollowed-out areas, and the first pads of the coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 are all wired and connected to the second pads. The areas around the hollowed-out areas in the electrical transfer fixture 922 are provided with second pads, and the coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 are all placed in the corresponding hollowed-out areas, so that the first pads of the coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 are all flush with the second pads, thereby shortening the gold wire between the first pad and the second pad.

[0088] In some embodiments, the length dimension of the substrate 923 is greater than the length dimension of the electrical transfer fixture 922, and the width dimension of the substrate 923 is greater than the width dimension of the electrical transfer fixture 922. If the length dimension of the substrate 923 is greater than the length dimension of the electrical transfer fixture 922, and the width dimension of the substrate 923 is greater than the width dimension of the electrical transfer fixture 922, then the electrical transfer fixture 922 can be located in the second storage cavity surrounded by the cover shell 921 and the substrate 923.

[0089] In some embodiments, the second surface of the coherent modulation chip 925 protrudes relative to the second surface of the driver chip 926 and the transimpedance amplifier chip 924. The second surface of the coherent modulation chip 925 protrudes relative to the second surface of the driver chip 926 and the transimpedance amplifier chip 924 to compensate for the height difference between the coherent modulation chip 925 and the driver chip 926 and the transimpedance amplifier chip 924, so that the first surface of the coherent modulation chip 925, the driver chip 926 and the transimpedance amplifier chip 924 are flush. For example, the second surface of the coherent modulation chip 925 is flush with the upper surface of the electrical transfer fixture 922, and the second surfaces of the driver chip 926 and the transimpedance amplifier chip 924 are recessed relative to the upper surface of the electrical transfer fixture 922; the second surface of the coherent modulation chip 925 protrudes relative to the upper surface of the electrical transfer fixture 922; the second surface of the coherent modulation chip 925 is recessed relative to the upper surface of the electrical transfer fixture 922.

[0090] Fig.15 The figure is a structural diagram of an electrical switching fixture provided according to some embodiments. Fig.16 The present invention is a structural diagram of an electrical switching fixture provided in accordance with some embodiments from another perspective. Fig.17 FIG. 1 is an assembly diagram of an electrical transfer fixture, an optical chip, and an optical matching chip according to some embodiments. Fig.15 , Fig.16 and Fig.17 As shown, the electrical switching fixture 922 includes a substrate body 9221, and a plurality of hollow areas are provided on a side of the substrate body 9221 facing the optical fiber array 927. The plurality of hollow areas include a first hollow area 9224, a second hollow area 9222 and a third hollow area 9223. The first hollow area 9224 is closer to the optical fiber array 927 than the second hollow area 9222 and the third hollow area 9223. The first hollow area 9224 is the opening of the electrical switching fixture 922. A coherent modulation chip 925 is placed in the first hollow area 9224. The second hollow area 9222 is connected to the first hollow area 9224. A transimpedance amplifier chip 924 is placed in the second hollow area 9222. The third hollow area 9223 is connected to the first hollow area 9224. A barrier 9225 is provided between the third hollow area 9223 and the second hollow area 9222. A driver chip 926 is placed in the third hollow area 9223.

[0091] like Fig.16 As shown, in some embodiments, the lower surface of the substrate body 9221 is provided with a pad area and a solder ball area, the pad area is connected to the solder ball area, the pad area is surrounded by the solder ball area, and the solder ball area is the area of ​​the lower surface of the substrate body 9221 except the pad area, the coherent modulation chip 925, the driving chip 926 and the transimpedance amplifier chip 924 are all connected to the pad area by wire bonding, and the electrical transfer fixture 922 is connected to the substrate 923 through the solder ball area. Among them, the wires used when the coherent modulation chip 925, the driving chip 926 and the transimpedance amplifier chip 924 are respectively connected to the pad area by wire bonding are gold wires.

[0092] In some embodiments, the pad area of ​​the electrical transfer fixture 922 is flush with the first surface of the coherent modulation chip 925, the driver chip 926 and the transimpedance amplifier chip 924 to shorten the gold wire distance between the pad area of ​​the electrical transfer fixture 922 and the first surface of the coherent modulation chip 925, the driver chip 926 and the transimpedance amplifier chip 924.

[0093] In some embodiments, the pad area and the solder ball area are flush with each other, that is, the distance from the pad area to the substrate 923 is equal to the distance from the solder ball area to the substrate 923 .

[0094] In some embodiments, the pad area is recessed relative to the solder ball area, that is, the distance from the pad area to the substrate 923 is greater than the distance from the solder ball area to the substrate 923, thereby increasing the gap height between the pad area and the substrate 923, and then increasing the vertical distance between the gold wire and the substrate 923, thereby further protecting the gold wire.

[0095] The signal line of the solder ball area extends upward to the pad area, so that the electrical signal of the pad area is transmitted to the substrate 923, and the electrical signal of the substrate 923 is also transmitted to the pad area. Since the pad area is recessed upward relative to the solder ball area, the signal line of the solder ball area extends upward to the second pad of the pad area.

[0096] like Fig.16 and Fig.17 As shown, in some embodiments, the substrate body 9221 includes a first electrical transfer fixing portion 9226 and a second electrical transfer fixing portion 9227, the first electrical transfer fixing portion 9226 is a solder ball area, and the second electrical transfer fixing portion 9227 is a solder pad area, the first electrical transfer fixing portion 9226 and the second electrical transfer fixing portion 9227 are respectively located in two extension directions of the electrical transfer fixing member 922, the first electrical transfer fixing portion 9226 is located around the second electrical transfer fixing portion 9227, the first electrical transfer fixing portion 9226 is connected to the second electrical transfer fixing portion 9227, the vertical distance between the first electrical transfer fixing portion 9226 and the substrate 923 is smaller than the vertical distance between the second electrical transfer fixing portion 9227 and the substrate 923, and the first electrical transfer fixing portion 9226 is fixed to the substrate 923 through the solder ball to realize the electrical connection between the electrical transfer fixing member 922 and the substrate 923. The second electrical switching fixing part 9227 is provided with a plurality of hollowed-out areas, and the area around the hollowed-out area in the second electrical switching fixing part 9227 is provided with a second soldering pad, which is wire-bonded to the first soldering pad to realize electrical connection between the electrical switching fixing part 922 and the optical chip and the optical matching chip.

[0097] In some embodiments, the first power transfer fixing portion 9226 and the second power transfer fixing portion 9227 are respectively located in two extending directions of the power transfer fixing member 922. For example, the first power transfer fixing portion 926 extends downward along the vertical direction of the power transfer fixing member 922, so that the first power transfer fixing portion 926 is vertically arranged with the substrate 923, and the second power transfer fixing portion 9227 extends leftward along the horizontal direction of the power transfer fixing member 922, so that the second power transfer fixing portion 9227 is parallel to the substrate 923, and the first power transfer fixing portion 926 and the second power transfer fixing portion 9227 are vertically arranged.

[0098] In some embodiments, the first electrical transfer fixing portion 9226 includes two first arms, which are connected to form an L-shaped first open slot with an opening, and an optical chip and an optical matching chip are arranged in the first open slot, and the opening is far away from the optical matching chip, and the optical fiber array 927 crosses the opening and is connected to the coherent modulation chip 925 in the U-shaped slot. A second electrical transfer fixing portion 9227 is arranged in the first open slot. The second electrical transfer fixing portion 9227 is connected to the first electrical transfer fixing portion 9226, that is, the second arm of the second electrical transfer fixing portion 9227 is connected to the first arm of the first electrical transfer fixing portion 9226 to form an L-shaped second open slot, and the second open slot has a hollow area, and the coherent modulation chip 925, the transimpedance amplifier chip 924 and the driver chip 926 are arranged in the hollow area. Since there is at least one second arm around the hollowed-out area to limit the positions of the coherent modulation chip 925, the transimpedance amplifier chip 924 and the driver chip 926; the area around the hollowed-out area in the second electrical transfer fixing part 9227 (i.e., the second arm of the second opening groove) is provided with a second solder pad, and the first solder pads of the coherent modulation chip 925, the transimpedance amplifier chip 924 and the driver chip 926 are all wired connected to the second solder pad to realize the electrical connection between the coherent modulation chip 925, the transimpedance amplifier chip 924 and the driver chip 926 and the electrical transfer fixing part 922.

[0099] like Fig.16 As shown, in some embodiments, the first electrical transfer fixing portion 9226 includes three first arms, which are connected in sequence to form a U-shaped first open slot with an opening, and an optical chip and an optical matching chip are arranged in the first open slot, and the opening is far away from the optical matching chip, and the optical fiber array 927 crosses the opening and is connected to the coherent modulation chip 925 in the U-shaped slot. A second electrical transfer fixing portion 9227 is arranged in the first open slot, and the second electrical transfer fixing portion 9227 is connected to the first electrical transfer fixing portion 9226, that is, the second arm of the second electrical transfer fixing portion 9227 is connected to the first arm of the first electrical transfer fixing portion 9226 to form a U-shaped second open slot, and the second open slot has a hollow area, and the coherent modulation chip 925, the transimpedance amplifier chip 924 and the driver chip 926 are arranged in the hollow area. Since there are at least two second arms around the hollowed-out area, the positions of the coherent modulation chip 925, the transimpedance amplifier chip 924 and the driver chip 926 are further limited; the area around the hollowed-out area in the second electrical transfer fixing part 9227 (i.e., the second arm of the second opening groove) is provided with a second solder pad, and the first solder pads of the coherent modulation chip 925, the transimpedance amplifier chip 924 and the driver chip 926 are all wired connected to the second solder pad to realize the electrical connection between the coherent modulation chip 925, the transimpedance amplifier chip 924 and the driver chip 926 and the electrical transfer fixing part 922.

[0100] In some embodiments, the second electrical transfer fixing portion 9227 includes a first pad portion 92271, a second pad portion 92272, a third pad portion 92273, a fourth pad portion 92274, and a fifth pad portion 92275, which are sequentially connected to form a U-shaped placement recess. There is a gap between the placement recess and the substrate 923, and a second pad is disposed in the placement recess. The second pad in the placement recess is wire-bonded to the first pad of the optical chip and the optical matching chip, so that there is a gap between the first pad of the optical chip and the optical matching chip and the substrate 923, thereby protecting the gold wire between the first pad and the second pad.

[0101] In some embodiments, the second electrical switching fixing portion 9227 also includes a sixth pad portion, which is the side of the barrier 9225 facing the substrate 923, and is connected to the middle area of ​​the third pad portion 92273 so that the sixth pad portion is located between the transimpedance amplifier chip 924 and the driver chip 926.

[0102] The first solder pad portion 92271 and the fifth solder pad portion 92275 are both arranged corresponding to the coherent modulation chip 925. The first solder pad portion 92271 is located behind the coherent modulation chip 925, and the fifth solder pad portion 92275 is located in front of the coherent modulation chip 925. The second solder pads of the first solder pad portion 92271 and the fifth solder pad portion 92275 are both wire-bonded to the first solder pad of the coherent modulation chip 925 to electrically connect the coherent modulation chip 925 to the electrical adapter fixture 922.

[0103] The second pad portion 92272 is arranged corresponding to the transimpedance amplifier chip 924, the second pad portion 92272 is located behind the transimpedance amplifier chip 924, the sixth pad portion is located between the transimpedance amplifier chip 924 and the driving chip 926, and the transimpedance amplifier chip 924 is located between the coherent modulation chip 925 and the third pad portion 92273. Then, the first pad of the transimpedance amplifier chip 924 is respectively connected with the second pad portion 92272, the third pad portion 92273 and the second pad of the sixth pad portion by wire bonding, so that the transimpedance amplifier chip 924 is electrically connected to the electrical adapter fixture 922; the first pad of the transimpedance amplifier chip 924 is also connected with the first pad of the coherent modulation chip 925 by wire bonding, so that the transimpedance amplifier chip 924 is electrically connected to the coherent modulation chip 925.

[0104] The fourth pad portion 92274 is arranged corresponding to the driver chip 926. The fourth pad portion 92274 is located at the front end of the driver chip 926. The driver chip 926 is also located between the coherent modulation chip 925 and the third pad portion 92273. Then, the first pad of the driver chip 926 is respectively connected with the fourth pad portion 92274, the third pad portion 92273 and the second pad of the sixth pad portion by wires, so that the driver chip 926 is electrically connected to the electrical adapter fixture 922; the first pad of the driver chip 926 is also connected with the first pad of the coherent modulation chip 925 by wires, so that the driver chip 926 is electrically connected to the coherent modulation chip 925.

[0105] In some embodiments, the optical module includes a circuit board and a coherent optical component, the coherent optical component is arranged on the circuit board, and the coherent optical component is used to realize the modulation and demodulation of the optical signal. The coherent optical component includes a cover shell and a substrate, the substrate is fixed on the circuit board, the substrate is electrically connected to the circuit board, the cover shell is arranged on the substrate to form a storage cavity, and an optical chip, an optical matching chip and an electrical transfer fixture are arranged in the storage cavity, the first surface of the optical chip and the optical matching chip is provided with a first solder pad, and the second surface of the optical chip and the optical matching chip has no solder pad, and the second surface of the optical chip and the optical matching chip is mounted on the inner top wall of the cover shell, and the heat generated by the optical chip and the optical matching chip is directly conducted to the cover shell, without being conducted to the cover shell through the air, thereby improving the heat dissipation efficiency. The heat generated by the optical chip and the optical matching chip is directly conducted to the cover shell, and no longer enters the circuit board, so it will not cause thermal interference to the electrical components on the circuit board. In order to make the optical chip and the optical matching chip work normally, the electrical transfer fixture is fixed on the substrate, the electrical transfer fixture is electrically connected to the substrate, and the electrical transfer fixture is wired to the first solder pad of the optical chip and the optical matching chip. The electrical signals on the circuit board are transmitted to the optical chip and the optical matching chip in turn through the substrate and the electrical transfer fixture. The electrical signals of the optical chip and the optical matching chip are transmitted to the circuit board in turn through the electrical transfer fixture and the substrate, so that the optical chip and the optical matching chip can work normally. Since the gold wire between the electrical transfer fixture and the first pads of the optical chip and the optical matching chip is easily damaged, in order to protect the gold wire, there is a gap between the first surface of the optical chip and the optical matching chip and the substrate. There is a gap between the first surface of the optical chip and the optical matching chip and the substrate to prevent the gold wire from colliding with the device in the storage cavity, thereby protecting the gold wire. In order to shorten the gold wire, the electrical transfer fixture has a plurality of hollowed-out areas and second pads. The second pads are arranged on the side of the electrical transfer fixture that is away from the cover shell. The second pads are located around the hollowed-out areas. The optical chip and the optical matching chip are placed in the corresponding hollowed-out areas. The first pads of the optical chip and the optical matching chip are wired to the second pads. The second pad is located around the hollowed-out area, and the optical chip and the optical matching chip are placed in the corresponding hollowed-out area, so that the first pads of the optical chip and the optical matching chip are flush with the second pad, thereby shortening the gold wire between the first pad and the second pad. There is a gap between the second pad and the substrate, and the first pad and the second pad are connected by wire bonding, so that there is a gap between the first surface of the optical chip and the optical matching chip and the substrate.In some embodiments, a first solder pad is provided on the first side of the optical chip and the optical matching chip, and the second sides of the optical chip and the optical matching chip are both mounted on the inner top wall of the cover shell to improve heat dissipation efficiency; the electrical adapter fixture is electrically connected to the substrate, the substrate is electrically connected to the circuit board, and the electrical adapter fixture is wired to the first solder pad of the optical chip and the optical matching chip to ensure the normal operation of the optical chip and the optical matching chip; the electrical adapter fixture has multiple hollowed-out areas, and the optical chip and the optical matching chip are both placed in the corresponding hollowed-out areas, and a second solder pad is provided in the area around the hollowed-out area in the electrical adapter fixture, so that the first solder pads of the optical chip and the optical matching chip are flush with the second solder pad, thereby shortening the gold wire between the first solder pad and the second solder pad.

[0106] In some embodiments, a DSP chip, a voltage source, an MCU and a coherent optical component are disposed on the circuit board 300. The DSP chip and the MCU are both connected to the coherent optical component. The voltage source is respectively connected to the MCU and the DSP chip, and the voltage source provides a fixed voltage to the DSP chip.

[0107] The DSP chip requires different minimum voltages for different processes, and the voltage provided by the voltage source to the DSP chip is a fixed voltage, resulting in high power consumption of the optical module. To solve this problem, the MCU reads the power supply related parameters of the DSP chip in real time, and adjusts the output voltage of the adjustable voltage source in real time according to the power supply related parameters to provide the minimum voltage required by the DSP chip. This can minimize the power consumption of the optical module without affecting the performance of the optical module. Among them, the power supply related parameters include the voltage regulation status flag and the voltage regulation feedback flag.

[0108] Fig.18 A structural diagram of an optical module excluding a housing according to some embodiments. Fig.19 FIG. 4 is a diagram showing the relationship between an MCU, an adjustable voltage source, a DSP, and a coherent optical component according to some embodiments. Fig.18 and Fig.19As shown, a DSP chip 301, an adjustable voltage source 302, an MCU 303 and a coherent optical component 902 are arranged on the circuit board 300. The DSP chip 301 and the MCU 303 are both connected to the coherent optical component 902. The adjustable voltage source 302 is respectively connected to the MCU 303 and the DSP chip 301. The adjustable voltage source 302 is used to provide an adjustable voltage to the DSP chip. The coherent optical component is used to realize the modulation and demodulation of the optical signal. That is, the DSP chip includes an electrical input pin, an electrical input and output pin and an electrical output pin. The electrical input pin of the DSP chip is connected to the voltage output pin of the adjustable voltage source, the electrical input and output pin of the DSP chip is connected to the first electrical input and output pin of the MCU, the electrical output pin of the DSP chip is connected to the coherent optical component 902, the electrical output pin of the MCU is connected to the control pin of the adjustable voltage source 302, and the second electrical input and output pin of the MCU is connected to the coherent optical component 902.

[0109] Fig. 20 FIG. 4 is a structural diagram of a DSP provided according to some embodiments. Fig. 20 As shown, the DSP chip includes a first register and a second register, the first register is used to store a voltage regulation state flag, and the second register is used to store a voltage regulation feedback flag. The voltage regulation state flag is used to indicate whether the voltage regulation feedback flag is valid. The voltage regulation state flag is a first value, and the digital signal processing chip has completed the calculation. At this time, the voltage regulation feedback flag is valid; the voltage regulation state flag is a second value, and the digital signal processing chip has not completed the calculation. At this time, the voltage regulation feedback flag is invalid. The adaptive voltage regulation control feedback flag is used to indicate the voltage compensation direction of the digital signal processing chip. The voltage regulation feedback flag is a first value, indicating that compensation is required in the low voltage direction; the voltage regulation feedback flag is a second value, indicating that no voltage compensation is required; the voltage regulation feedback flag is a third value, indicating that compensation is required in the high voltage direction. The MCU reads the voltage regulation feedback flag according to the read voltage regulation state flag, and adjusts the output voltage of the MCU according to the read voltage regulation feedback flag to adjust the output voltage of the adjustable voltage source.

[0110] Fig.21 FIG. 1 is a structural diagram of an MCU provided according to some embodiments. Fig.21 As shown, in some embodiments, the MCU includes a third register, a fourth register and a fifth register, the third register is used to store the step voltage, the fourth register is used to store the initial voltage, the fifth register is used to store the real-time voltage, and the sixth register is used to store the adaptive voltage regulation control loop switch flag.

[0111] The initial voltage is the maximum working voltage required by the DSP chip to ensure that the DSP chip can start normally. After the optical module is powered on, the MCU transmits the initial voltage to the adjustable voltage source, and the adjustable voltage source outputs the maximum working voltage required by the DSP chip corresponding to the initial voltage to ensure that the DSP chip can start normally. For example, the initial voltage is 0.65V.

[0112] The real-time voltage includes the initial voltage. After the optical module is powered on, the MCU copies the initial voltage in the fourth register to the fifth register. At this time, the real-time voltage in the fifth register is the initial voltage.

[0113] The MCU determines the voltage compensation direction according to the voltage regulation feedback flag bit read, and calculates the first output voltage according to the voltage compensation direction, the step voltage and the real-time voltage. For example, when the MCU reads the voltage regulation feedback flag bit as a first value, the first output voltage = real-time voltage - step voltage; when the MCU reads the voltage regulation feedback flag bit as a second value, the first output voltage = real-time voltage; when the MCU reads the voltage regulation feedback flag bit as a third value, the first output voltage = real-time voltage + step voltage.

[0114] like Fig.21 As shown, the MCU also includes a sixth register, which is used to store an adaptive voltage regulation control loop switch flag. The adaptive voltage regulation control loop switch flag is a first value, indicating that the adaptive voltage regulation control loop is started; the adaptive voltage regulation control loop switch flag is a second value, indicating that the adaptive voltage regulation control loop is not started.

[0115] After reading that the adaptive voltage regulation control loop switch flag is a first value, the MCU reads the voltage regulation state flag. When reading that the voltage regulation state flag is a first value, the MCU reads the voltage regulation feedback flag and adjusts the output voltage of the MCU according to the voltage regulation feedback flag.

[0116] like Fig.21 As shown, the MCU also includes a seventh register, which is used to store the power compensation ratio. After reading that the adaptive voltage regulation control loop switch flag is a first value, the MCU transmits the power compensation ratio to the DSP chip, and the DSP chip adjusts the voltage regulation feedback flag according to the power compensation ratio.

[0117] The specific process of the power compensation ratio calculation method is as follows: the MCU controls the first output voltage to be output at equal intervals, collects multiple DSP parameters, calculates the average values ​​of the multiple DSP parameters at one voltage value, and then calculates the average values ​​of the multiple DSP parameters at multiple voltage values ​​to obtain the power compensation ratio. For example, the power compensation ratio is 4.3%, and considering the margin, the power compensation margin set to the seventh register of the MCU is 4.5%.

[0118] Since the optical module is a small package product, the current required by the DSP chip reaches 30A, so a large-sized adjustable voltage source cannot be selected to power the DSP chip. In order to provide 30A to the DSP chip within the limited space of the optical module, in some embodiments, the adjustable voltage source is a multi-phase power supply chip that can meet the voltage and current required for the DSP to work.

[0119] Fig. 22 FIG. 1 is a structural diagram of an adjustable voltage source provided according to some embodiments. Fig. 22 As shown, the adjustable voltage source includes a first power chip, a second power chip and a third power chip, which are connected in parallel, and the sum of the phase current of the first power chip, the phase current of the second power chip and the phase current of the third power chip is equal to the output current of the adjustable voltage source, which can meet the voltage and current required for DSP operation.

[0120] The input pin (IN) of the first power chip is connected to the input voltage, and the input pins of the second power chip and the third power chip are both connected to the input pin of the first power chip to connect to the power voltage. For example, the power voltage is 3.3V.

[0121] The output pin (SW) of the first power chip is connected to the DSP chip through the ninth resistor R 9 The output pins of the second power chip and the third power chip are connected to the input pins of the first power chip to provide output voltage to the DSP chip.

[0122] The multi-phase mode / synchronous control pin (Mode / Sync) of the first power chip is connected to the multi-phase mode / synchronous control pin of the second power chip and the multi-phase mode / synchronous control pin of the third power chip respectively.

[0123] The feedback pin (FB) of the first power chip is connected to the MCU through the seventh resistor R 7 The feedback pin of the first power chip is also connected through the sixth resistor R 6 The feedback pin of the first power chip is connected to the DSP chip through the eighth resistor R 8 The timing resistor pin (RT) of the first power chip is connected through the fifth resistor R 5 Ground.

[0124] The feedback pin of the second power chip is connected to the input voltage, and the timing resistor pin of the second power chip and the feedback pin of the second power chip are connected through the third resistor R 3 The timing resistor pin of the second power chip is also connected through the fourth resistor R 4 Ground, the voltage ratio between FB and RT received by the second power chip is R 3 : R 4 .

[0125] The feedback pin of the third power chip is connected to the input voltage, and the timing resistor pin of the third power chip and the feedback pin of the third power chip are connected through the first resistor R 1 The timing resistor pin of the third power chip is also connected through the second resistor R 2 Ground, the voltage ratio between FB and RT received by the third power chip is R 1 : R 2 .

[0126] The first power chip is a main phase power chip, and the phase of the first power chip is 0°. The second power chip and the third power chip are slave phase power chips, and the phase of the second power chip is 120°, and the phase of the third power chip is 240°, so that the adjustable voltage source is a three-phase power chip, and the three phase currents of the three-phase power chip are equal to the output current of the three-phase power chip.

[0127] The multi-phase mode / synchronous control pin (Mode / Sync) sets the clock of the master phase power chip as the output in the multi-phase power chip. At the same time, after the FB of the slave phase power chip is directly connected to the input voltage, the clock of the slave phase power chip is configured as the input to receive the clock output of the master phase power chip.

[0128] The function of the timing resistor pin (RT) of the master phase power chip is to set the switching frequency of the master phase power chip. After the FB of the slave phase power chip is directly connected to the input voltage, the Mode / Sync of the master phase power chip outputs the switching frequency to the Mode / Sync of the slave phase power chip so that the master phase power chip and the slave phase power chip have the same switching frequency.

[0129] In some embodiments, the third resistor R 3 With the fourth resistor R 4 The ratio of the third resistor R is a first preset value, so that the phase of the second power chip is 120°. For example, the first preset value is 7:5, that is, the third resistor R 3 With the fourth resistor R 4 The ratio is 7:5.

[0130] In some embodiments, the first resistor R 1With the second resistor R 2 The ratio of the first resistor R is a second preset value, so that the phase of the third power chip is 240°. For example, the second preset value is 5:7, that is, the first resistor R 1 With the second resistor R 2 The ratio is 5:7.

[0131] The output voltage of the MCU is the first output voltage, the output voltage of the adjustable voltage source is the second output voltage, and the first output voltage and the second output voltage are in a preset relationship. The output voltage of the adjustable voltage source can be adjusted by simply adjusting the output voltage of the MCU.

[0132] The default relationship is: V out =0.6424-0.1424*V mcu , where V out is the second output voltage, V mcu is the first output voltage.

[0133] According to the current flowing into FB is equal to the current flowing out of FB, that is (V out- V FB ) / R 8 +(V out- V mcu ) / R 7＝ V FB / R 6。 R 8 =4.7k,R 6＝ R 7 =33k, V FB =5, V out =0.6424-0.1424*V mcu。

[0134] In some embodiments, the optical module includes a digital signal processing chip, an adjustable voltage source and an MCU, the digital signal processing chip includes an electrical input pin and an electrical input output pin, the electrical input output pin of the MCU is connected to the electrical input output pin of the digital signal processing chip, the electrical output pin of the MCU is connected to the control pin of the adjustable voltage source, the voltage output pin of the adjustable voltage source is connected to the electrical input pin of the digital signal processing chip, and the MCU adjusts the output voltage of the voltage output pin of the adjustable voltage source to power the digital signal processing chip. The digital signal processing chip includes a register, and the register is used to store a voltage regulation feedback flag. The adaptive voltage regulation control state feedback flag is used to characterize the voltage compensation direction of the digital signal processing chip, the voltage regulation feedback flag is a first value, indicating that compensation is required in the low voltage direction; the voltage regulation feedback flag is a second value, indicating that no voltage compensation is required; the voltage regulation feedback flag is a third value, indicating that compensation is required in the high voltage direction. The MCU reads the voltage regulation feedback flag, and adjusts the output voltage of the voltage output pin of the adjustable voltage source according to the voltage regulation feedback flag to provide the minimum voltage required by the digital signal processing chip. In some embodiments, the MCU reads the voltage regulation feedback flag of the digital signal processing chip in real time, and adjusts the output voltage of the voltage output pin of the adjustable voltage source in real time according to the voltage regulation feedback flag to provide the minimum voltage required by the digital signal processing chip. The power consumption of the optical module can be minimized while ensuring that the performance of the optical module is not affected.

[0135] Fig.23 is a schematic diagram of a coherent optical component according to some embodiments. Fig.24 FIG. 1 is an assembly diagram of a coherent optical component and an MCU according to some embodiments. Fig.23 and Fig.24 As shown, in some embodiments, the coherent optical component includes a storage cavity, in which a coherent modulation chip, a transimpedance amplifier chip and a driver chip are arranged, the coherent modulation chip includes a spectrometer, a modulation area, a demodulation area and a photodetector (MPD), the driver chip is connected to the modulation area, the transimpedance amplifier chip is connected to the demodulation area, the spectrometer is respectively connected to the modulation area, the demodulation area and the photodetector, the spectrometer is used to divide the light emitted by the light source into emission light and local oscillation light according to the working current, the modulation area modulates the emission light into an emission light signal under the modulation current of the driver chip, the demodulation area uses the local oscillation light to realize the demodulation of the received light signal to obtain an electrical signal, and the transimpedance amplifier chip (TIA) amplifies the electrical signal. The light source emits light, and the light is divided into emission light and local oscillation light by the spectrometer, the emission light is modulated into an emission light signal in the modulation area and emitted, and the local oscillation light and the received light signal are demodulated in the demodulation area to obtain an electrical signal.

[0136] The optical splitter includes an optical input interface, an optical output interface and an electrical input interface. The optical input interface receives light from the light source. One optical output interface is connected to the modulation area to transmit the emitted light to the modulation area for modulation. The other optical output interface is respectively connected to the demodulation area and the photodetector to transmit most of the local oscillation light to the demodulation area for demodulation, and also transmits a small part of the local oscillation light to the photodetector to monitor the local oscillation light flowing through the demodulation area.

[0137] like Fig.23 and Fig.24 As shown, in some embodiments, an MCU is provided on the circuit board 300, and the MCU is respectively connected to the electrical input interface of the spectrometer and the photodetector. The MCU controls the working current of the electrical input interface of the spectrometer according to the sampling voltage, wherein the sampling voltage corresponds to the sampling current of the photodetector.

[0138] In some embodiments, the beam splitter includes a first interference arm and a second interference arm, and heaters are provided on the first interference arm and the second interference arm, and the MCU is connected to the two heaters respectively. The MCU changes the refractive index of the first interference arm and the second interference arm by adjusting the working current of the two heaters to change the phase difference of the light passing through the first interference arm and the second interference arm, thereby adjusting the splitting ratio of the beam splitter.

[0139] In some embodiments, the spectrometer includes a first interference arm and a second interference arm, a heater is provided on the first interference arm or the second interference arm, the heater is connected to the electrical input interface of the spectrometer, and the MCU is connected to the heater. The MCU changes the refractive index of the interference arm provided with the heater by adjusting the working current of a heater to change the phase difference of the light passing through the first interference arm and the second interference arm, thereby adjusting the splitting ratio of the spectrometer.

[0140] In some embodiments, one end of the photodetector is connected to the optical output interface of the optical splitter, and the other end of the photodetector is connected to the MCU to monitor the local oscillator light flowing through the demodulation region.

[0141] A sampling resistor is provided between the other end of the photodetector and the MCU, one end of the sampling resistor is connected to the other end of the photodetector, and the other end of the sampling resistor is connected to the MCU, so that the MCU collects the sampling voltage across the two ends of the sampling resistor.

[0142] In some embodiments, the MCU includes an eighth register, and a plurality of splitting ratio functions are stored in the eighth register.

[0143] In some embodiments, the plurality of splitting ratio functions include a plurality of splitting ratio functions corresponding to wavelengths, and one wavelength corresponds to one splitting ratio function. The MCU calls the splitting ratio function according to the wavelength, and adjusts the working current of the electrical input interface of the splitter according to the sampling voltage and the splitting ratio function. For example, the wavelength λ 1When the split ratio function is Y λ1 ; Wavelength λ 2 When the split ratio function is Y λ2 ; Wavelength λ 3 When the split ratio function is Y λ3 .

[0144] In some embodiments, the optical module further includes a temperature measuring component, and the temperature measuring component is used to measure the temperature of the optical module.

[0145] In some embodiments, the temperature measuring component is located in the coherent optical component, that is, the temperature measuring component is located in the storage cavity of the coherent optical component, the temperature measuring component is connected to the MCU, and the temperature measuring component is located around the coherent modulation chip to measure the temperature around the coherent modulation chip, and then measure the temperature of the optical module. For example, the temperature measuring component includes a thermistor, the thermistor is sensitive to temperature, and exhibits different resistance values ​​at different temperatures. The MCU obtains the temperature around the coherent modulation chip according to the resistance value of the thermistor.

[0146] In some embodiments, the temperature measuring element is integrated into the MCU, and the temperature measuring element is used to measure the temperature around the MCU, and then measure the temperature of the optical module. For example, the temperature measuring element is a temperature sensor integrated into the MCU, and the MCU obtains the temperature around the MCU according to the temperature sensor.

[0147] In some embodiments, the plurality of splitting ratio functions include a plurality of splitting ratio functions corresponding to temperatures, and one temperature corresponds to one splitting ratio function. The MCU retrieves the splitting ratio function according to the temperature, and controls the operating current of the electrical input interface of the splitter according to the sampled voltage and the splitting ratio function corresponding to the temperature. For example, the temperature T 1 When the split ratio function is Y T1 Temperature T 2 When the split ratio function is Y T2 Temperature T 3 When the split ratio function is Y T3 .

[0148] In some embodiments, the multiple splitting ratio functions include multiple splitting ratio functions that have corresponding relationships with temperature and wavelength, and one temperature and one wavelength together correspond to one splitting ratio function. The MCU calls the splitting ratio function corresponding to the temperature and wavelength according to the temperature and wavelength, and controls the working current of the electrical input interface of the splitter according to the sampling voltage and the splitting ratio function. For example, the temperature T 1 , wavelength λ 1 When the split ratio function is Y 1 Temperature T 1 , wavelength λ 2 When the split ratio function is Y 2 Temperature T 2 , wavelength λ 1When the split ratio function is Y 3 .

[0149] Without considering controlling the temperature of the coherent modulation chip to be relatively stable, the coherent modulation chip can be Figure 7 As shown, it is mounted on the inner top wall of the cover shell. When considering controlling the temperature of the coherent modulation chip to be relatively stable, the coherent modulation chip can be placed on a semiconductor refrigerator (TEC), a conductor refrigerator is placed in the storage cavity, and a temperature measuring device is placed on the semiconductor refrigerator. The temperature measuring device is used to measure the temperature of the coherent optical component. The semiconductor refrigerator is connected to a power chip, which supplies power to the semiconductor refrigerator. The power chip is also connected to the MCU. The MCU adjusts the electrical signal sent to the power chip according to the resistance value of the temperature measuring device, and the power chip dynamically adjusts the current transmitted to the semiconductor refrigerator according to the received electrical signal, so as to keep the temperature of the semiconductor refrigerator constant, and then the temperature of the coherent modulation chip constant.

[0150] The temperature is relatively stable within the preset time. The MCU calls the splitting ratio function according to the temperature and controls the working current of the electrical input interface of the splitter according to the sampled voltage and the splitting ratio function. For example, the temperature T 1 When the split ratio function is Y T1 Temperature T 2 When the split ratio function is Y T2 Temperature T 3 When the split ratio function is Y T3 .

[0151] Alternatively, the temperature is relatively stable within a preset time, and the MCU calls the splitting ratio function according to the temperature and wavelength, and controls the working current of the electrical input interface of the splitter according to the sampled voltage and the splitting ratio function. 1 , wavelength λ 1 When the split ratio function is Y 1 Temperature T 1 , wavelength λ 2 When the split ratio function is Y 2 Temperature T 2 , wavelength λ 1 When the split ratio function is Y 3 Among them, relatively stable temperature means that the difference between two adjacent temperatures is within the error range.

[0152] In some embodiments, a current source is arranged between the MCU and the electrical input interface of the spectrometer, the input interface of the current source is connected to the MCU, and the output interface of the current source is connected to the electrical input interface of the windshield device. The MCU obtains a control signal based on the sampling voltage and the splitting ratio function, and the current source adjusts the operating current output to the electrical input interface of the spectrometer according to the control signal.

[0153] Fig.25FIG. 1 is another assembly diagram of a coherent optical component and an MCU according to some embodiments. Fig.25 As shown, in some embodiments, a digital-to-analog converter (DAC) is provided between the MCU and the electrical input interface of the spectrometer, the digital-to-analog converter is located on the circuit board 300, one end of the digital-to-analog converter is connected to the MCU, and the other end of the digital-to-analog converter is connected to the electrical input interface of the spectrometer, the MCU obtains a digital current signal according to the sampling voltage and the splitting ratio function, and the digital-to-analog converter converts the digital current signal into an analog current signal. For example, the digital-to-analog converter is a current-type digital-to-analog converter, which converts the digital current signal into an analog current signal to provide an analog current signal to the heater of the spectrometer. Among them, the analog current signal of the heater is the analog current signal of the spectrometer, and the analog current signal is the working current.

[0154] In some implementations, the splitting ratio function is used to characterize the corresponding relationship between the control signal and the sampling voltage. For example, the abscissa of the splitting ratio curve corresponding to the splitting ratio function is the control signal, and the ordinate of the splitting ratio curve corresponding to the splitting ratio function is the sampling voltage.

[0155] In some embodiments, the splitting ratio function is used to characterize the corresponding relationship between the working current and the sampling voltage. For example, the horizontal coordinate of the splitting ratio curve corresponding to the splitting ratio function is the working current, and the vertical coordinate of the splitting ratio curve corresponding to the splitting ratio function is the sampling voltage.

[0156] Fig.26 is a splitting ratio curve provided according to some embodiments. Fig.26 As shown, the horizontal axis is the working current of the splitter, the vertical axis is the sampling current of the photodetector, the splitting ratio curve is a relationship diagram between the working current of the splitter and the sampling current of the photodetector, and the splitting ratio function is a function obtained by fitting multiple points of the splitting ratio curve.

[0157] like Fig.26 As shown, in some embodiments, the splitting ratio function is used to characterize the corresponding relationship between the working current and the sampling current. For example, the horizontal coordinate of the splitting ratio curve corresponding to the splitting ratio function is the working current, and the vertical coordinate of the splitting ratio curve corresponding to the splitting ratio function is the sampling current. The MCU controls the working current of the splitter to increase the output at equal intervals from zero, and synchronously collects the sampling current of the photodetector to obtain the splitting ratio curve, and then obtains the splitting ratio function.

[0158] In some embodiments, the coherent optical component includes a coherent modulation chip. The coherent modulation chip includes a spectrometer, a modulation area and a demodulation area. The spectrometer includes an optical input interface, two optical output interfaces and an electrical input interface. The optical input interface receives light from a light source, one optical output interface is connected to the modulation area, and the other optical output interface is respectively connected to the demodulation area and the photodetector. The spectrometer is used to divide the light of the light source into emitted light and local oscillator light according to the working current. The modulation area is used to modulate the emitted light into an emitted light signal, and the demodulation area uses the local oscillator light to realize the demodulation of the received light signal. The MCU is respectively connected to the photodetector and the electrical input interface of the spectrometer, and the MCU adjusts the working current of the spectrometer according to the sampling voltage. The MCU includes a register, and the register stores a plurality of light ratio functions corresponding to the temperature. The MCU divides the light ratio function according to the temperature, and controls the working current of the electrical input interface of the spectrometer with the light ratio function and the sampling voltage. In the present application, the MCU calls the light ratio function according to the temperature, and controls the working current of the electrical input interface of the spectrometer according to the light ratio function and the sampling voltage, so that the spectrometer can achieve light splitting.

[0159] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An optical module, It is characterized in that include: Circuit boards; A coherent optical component is arranged on the circuit board; the coherent optical component comprises a cover shell and a substrate, the substrate is fixed on the circuit board, the substrate is electrically connected to the circuit board, and the cover shell is arranged on the substrate to form a storage cavity; an optical chip, an optical matching chip and an electrical switching fixture are arranged in the storage cavity, a first solder pad is arranged on the first surface of the optical chip and the optical matching chip, and the second surfaces of the optical chip and the optical matching chip are both mounted on the inner top wall of the cover shell; The electrical transfer fixture is fixed on the substrate, and the electrical transfer substrate is electrically connected to the substrate; The electrical transfer fixture has a plurality of hollowed-out areas, the optical chip and the optical matching chip are placed in the corresponding hollowed-out areas, a second solder pad is provided on a side of the electrical transfer fixture facing away from the cover shell, the second solder pad is located around the hollowed-out area, a gap is formed between the second solder pad and the substrate, and the first solder pad is connected to the second solder pad by wire bonding, so that there is a gap between the first surfaces of the optical chip and the optical matching chip and the substrate.

2. The optical module according to claim 1, It is characterized in that The electrical transfer fixture includes a first electrical transfer fixing portion and a second electrical transfer fixing portion, the first electrical transfer fixing portion is connected to the second electrical transfer fixing portion, the second electrical transfer fixing portion and the first electrical transfer fixing portion are respectively located in two extending directions of the electrical transfer fixture, the first electrical transfer fixing portion is located around the second electrical transfer fixing portion, the vertical distance between the first electrical transfer fixing portion and the substrate is smaller than the vertical distance between the second electrical transfer fixing portion and the substrate, the first electrical transfer fixing portion is fixed to the substrate through solder balls to achieve electrical connection between the electrical transfer fixture and the substrate; the second electrical transfer fixing portion is provided with the multiple hollow areas, the area around the hollow areas in the second electrical transfer fixing portion is provided with the second soldering pad, the second soldering pad is wired to the first soldering pad to achieve electrical connection between the electrical transfer fixture and the optical chip and the optical matching chip.

3. The optical module according to claim 1, It is characterized in that The multiple hollowed-out areas include a first hollowed-out area, a second hollowed-out area and a third hollowed-out area, the first hollowed-out area is located at the opening of the electrical switching fixture, the first hollowed-out area is connected to the second hollowed-out area, the first hollowed-out area is connected to the third hollowed-out area, a blocking plate is provided between the second hollowed-out area and the third hollowed-out area, the optical chip is placed in the first hollowed-out area, the driver chip of the optical matching chip is placed in the second hollowed-out area, the transimpedance amplifier chip of the optical matching chip is placed in the third hollowed-out area, and the blocking plate is located between the driver chip and the transimpedance amplifier chip.

4. The optical module according to claim 2, It is characterized in that The second electrical connection and fixing part includes a first pad part, a second pad part, a third pad part, a fourth pad part and a fifth pad part, and the first pad part, the second pad part, the third pad part, the fourth pad part and the fifth pad part are connected in sequence; The first pad part and the fifth pad part are respectively arranged corresponding to the optical chip, and the first pad part and the fifth pad part are respectively wire-bonded to the optical chip; The second pad part is arranged corresponding to one of the optical matching chips, and the fourth pad part is arranged corresponding to the other optical matching chip. The two optical matching chips are respectively located between the optical chip and the third pad part. The second pad, the optical chip and the third pad part are all wire-bonded to one of the optical matching chips, and the fourth pad part, the optical chip and the third pad part are all wire-bonded to the other optical matching chip.

5. The optical module according to claim 1, wherein, One side of the electrical connection and fixing member facing the cover shell is connected to the inner top wall of the cover shell; The cover shell includes a coherent bottom plate and coherent side plates. The coherent bottom plate is connected to the coherent side plates. The lower surface of the coherent side plates is connected to the substrate, and the lower surface of the coherent bottom plate is connected to the upper surface of the electrical connection and fixing member.

6. The optical module according to claim 2, wherein, The first electrical connection and fixing part includes three support arms, and the three support arms are connected in sequence to form an opening groove with an opening. The optical chip and the optical matching chip are arranged in the opening groove, and the opening is far away from the optical matching chip. The fiber array crosses the opening so that the fiber array is connected to the optical chip.

7. The optical module according to claim 1, wherein, The second surface of the optical chip protrudes relative to the second surface of the optical matching chip. The second surface of the optical chip is flush with the upper surface of the electrical connection and fixing member. The second surface of the optical matching chip is recessed relative to the upper surface of the electrical connection and fixing member. A protrusion is arranged on the inner top wall of the cover shell, and the protrusion is arranged corresponding to the optical matching chip.

8. The optical module according to claim 1, wherein, The coherent optical component further includes a bottom shell, and the bottom shell covers the cover shell to form a second storage cavity. The fiber array is placed in the second storage cavity, and the fiber array is connected to the coherent modulation chip.

9. An optical module, wherein, including: A circuit board; A coherent optical component, arranged on the circuit board; the coherent optical component includes a cover shell and a substrate. The substrate is fixed on the circuit board, and the substrate is electrically connected to the circuit board. The cover shell covers the substrate to form a storage cavity; an optical chip, an optical matching chip and an electrical connection and fixing member are arranged in the storage cavity. The first surfaces of the optical chip and the optical matching chip are provided with first pads, and the second surfaces of the optical chip and the optical matching chip are both mounted on the inner top wall of the cover shell; The electrical connection and fixing member is fixed on the substrate, and the electrical connection substrate is electrically connected to the substrate; The electrical transfer fixing member has a plurality of hollow areas and a placement recess. The placement recess is located around the hollow areas. The optical chip and the optical matching chip are placed in corresponding hollow areas. There is a gap between the placement recess and the substrate. The first pad is wire-bonded to the second pad of the placement recess, so that there are gaps between the first surfaces of the optical chip and the optical matching chip and the substrate respectively.

10. The optical module according to claim 9, wherein, the second surface of the optical chip is flush with the upper surface of the electrical transfer fixing member, the second surface of the optical matching chip is recessed relative to the upper surface of the electrical transfer fixing member, and a protrusion is provided on the lower surface of the coherent base plate. The protrusion is correspondingly arranged with the optical matching chip.

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