Chip clamping device and chip clamping method

Abstract

The invention discloses a chip clamping device and a chip clamping method.The chip clamping device comprises a supporting assembly, a plurality of clamping jaw assemblies, a plurality of first pushing assemblies, a sliding assembly and a driving assembly, each first pushing assembly is connected with the corresponding clamping jaw assembly, and when the driving assembly moves to any one of the first pushing assemblies, the clamping jaw assemblies are connected with the sliding assembly; and the driving assembly drives the first pushing assembly, so that the clamping jaw assembly corresponding to the first pushing assembly performs chip clamping. According to the chip clamping device, the multiple clamping jaw assemblies and the corresponding first pushing assemblies are used, accurate control over the single chip is achieved, the operation accuracy of clamping the single chip is improved, and the overall reliability and flexibility of the chip clamping device are improved.

Description

Technical Field

[0001] The present application relates to the field of chips, and in particular to a chip clamping device and a chip clamping method. Background Art

[0002] In the field of semiconductor chip manufacturing and testing, bare chips refer to chips that have not been packaged after the wafers produced in the wafer factory have been tested and cut. Bare chips are easily damaged by external environments such as temperature, impurities and physical forces. Therefore, bare chips need to be carefully clamped and handled to avoid damage and failure.

[0003] Existing chip clamping devices usually operate by moving multiple clamps simultaneously, which has some limitations. When multiple clamps move simultaneously, the accuracy of clamping a single chip is low, and the overall reliability and flexibility of the chip clamping device are low. Summary of the invention

[0004] The present application mainly provides a chip clamping device and a chip clamping method to solve the problem of low accuracy in clamping a single chip when multiple clamps move simultaneously.

[0005] The present application provides a chip clamping device, comprising:

[0006] Support components;

[0007] A plurality of clamping jaw assemblies are arranged on the support assembly at intervals along a first direction;

[0008] A plurality of first pushing assemblies, each of which is connected to a corresponding clamping jaw assembly and is used to push the corresponding clamping jaw assembly to move in a second direction of the supporting assembly, wherein the second direction is perpendicular to the first direction;

[0009] A sliding assembly, fixed on the supporting assembly and located on a side of the first pushing assembly away from the clamping jaw assembly;

[0010] A driving assembly, disposed on the sliding assembly, and configured to drive the driving assembly to move along the first direction relative to the plurality of first pushing assemblies;

[0011] When the driving component moves to any one of the first pushing components, the driving component drives the first pushing component to move in a direction away from the sliding component, so that the clamping claw component corresponding to the first pushing component clamps the chip.

[0012] In which, the supporting component has a first surface and a second surface arranged opposite to each other, the multiple clamping jaw components are respectively arranged on the first surface and the second surface, the driving component includes a driving member and a first pressing member, the driving member is arranged on the sliding component, the first pressing member is connected to the driving member, is located on one side of the first surface, and is located between the driving member and the multiple first pushing components arranged on the first surface, and the driving member is used to drive the first pressing member to move in a direction close to the first pushing component.

[0013] In which, the driving component also includes a second pressing member, which is connected to the driving member, located on one side of the second surface, and located between the driving member and a plurality of the first pushing members arranged on the second surface. The first pressing member is arranged parallel to the second pressing member, and the driving member is used to drive the first pressing member and the second pressing member to move in a direction close to the first pushing member.

[0014] When the first pressing member moves to the top of any one of the first pushing components, the driving member drives the first pressing member and the second pressing member to move toward the direction close to the first pushing component, and the first pressing member presses the corresponding first pushing component to control the corresponding clamping claw component to clamp the chip through the first pushing component.

[0015] When the second pressing member moves to the top of any one of the first pushing components, the driving member drives the first pressing member and the second pressing member to move toward the direction close to the first pushing component, the first pressing member presses the corresponding first pushing component, and the second pressing member presses the corresponding first pushing component, so as to control the corresponding clamping claw component to clamp the chip through the first pushing component.

[0016] Wherein, the chip clamping device also includes a second pushing component and a third pushing component, the second pushing component is arranged on the first surface and connected to multiple first pushing components on the first surface, the third pushing component is arranged on the second surface and connected to multiple first pushing components on the second surface, the second pushing component and the third pushing component are arranged in parallel, when the first pressing member and the second pressing member move to the second pushing member and the third pushing member respectively, the driving member drives the first pressing member and the second pressing member, the first pressing member presses the second pushing component, and the second pressing member presses the third pushing component, so as to control the corresponding clamping claw assembly through the second pushing component and the third pushing component to clamp the chip.

[0017] Wherein, the chip clamping device comprises a plurality of limiting parts, each of the first pushing components is correspondingly provided with the limiting part, and the limiting part is located at one end of the first pushing component close to the clamping claw component;

[0018] The second pushing assembly includes a first pushing member and a first limiting member, the first limiting member is arranged on the first surface, the first pushing member is fixed on the first limiting member, one end of a plurality of the first pushing members on the first surface away from the clamping jaw assembly is passed through the first limiting member, and the limiting portions of the plurality of the first pushing members are connected to the first limiting member;

[0019] The third pushing component includes a second pushing member and a second limiting member, the second limiting member is arranged on the second surface, the second pushing member is fixed on the second limiting member, one end of multiple first pushing components on the second surface away from the clamping jaw assembly is passed through the second limiting member, and the limiting parts of multiple first pushing components are connected to the second limiting member.

[0020] Wherein, when the first pressing member and the second pressing member move to the first pushing member and the second pushing member respectively, the driving member drives the first pressing member and the second pressing member to press the first pushing member and the second pushing member respectively, the first pushing member simultaneously pushes the multiple first pushing components located on the first surface, and the second pushing member simultaneously pushes the multiple first pushing components located on the second surface, so that the multiple clamping claw components can clamp the chip.

[0021] Wherein, the chip clamping device further comprises a carrying component, which is arranged below the supporting component and is used for carrying the chip clamped by the clamping claw component.

[0022] The present application also provides a chip clamping method, which is applied to the above-mentioned chip clamping device and includes:

[0023] Obtaining position information of the chip, and controlling the clamping jaw assembly to move above the position of the chip based on the position information of the chip;

[0024] Move the driving assembly to the first pushing assembly corresponding to the clamping jaw assembly through the sliding assembly;

[0025] The first pushing component is driven by the driving component, and the clamping claw component corresponding to the first pushing component clamps the chip.

[0026] The beneficial effects of the present application are as follows: the chip clamping device of the present application includes a support component, a plurality of clamping claw components, a plurality of first pushing components, a sliding component and a driving component, each first pushing component is connected to a corresponding clamping claw component, and when the driving component moves to any first pushing component, the driving component drives the first pushing component so that the clamping claw component corresponding to the first pushing component performs chip clamping. By using a plurality of clamping claw components and corresponding first pushing components, precise control of a single chip is achieved, the operational accuracy of clamping a single chip is improved, and the overall reliability and flexibility of the chip clamping device are improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0028] Figure 1 is a front view of an embodiment of a chip clamping device provided by the present application;

[0029] Figure 2 It is a rear view of an embodiment of a chip clamping device provided by the present application;

[0030] Figure 3 It is a left view of an embodiment of a chip clamping device provided by the present application;

[0031] Figure 4 yes Figure 1 A magnified schematic diagram of the middle A area;

[0032] Figure 5 yes Figure 1 A magnified schematic diagram of the middle B area;

[0033] Figure 6 yes Figure 2 Enlarged schematic diagram of the middle C area;

[0034] Figure 7 It is a top view of an embodiment of the bearing assembly provided in the present application. DETAILED DESCRIPTION

[0035] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0037] In the description of the embodiments of the present application, technical terms such as "first" and "second" are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features.

[0038] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0039] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0040] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0041] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0042] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be connected between, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0043] Existing chip clamping devices usually operate by moving multiple clamps simultaneously, which has some limitations. When multiple clamps move simultaneously, the accuracy of clamping a single chip is low, and the overall reliability and flexibility of the chip clamping device are low.

[0044] This application provides a chip clamping device, see Figure 1-Figure 3 As shown, Figure 1 is a front view of an embodiment of a chip clamping device provided by the present application; Figure 2 It is a rear view of an embodiment of a chip clamping device provided by the present application; Figure 3 It is a left view of an embodiment of a chip clamping device provided in the present application; the chip clamping device 1 of this embodiment includes a supporting component 10, a plurality of clamping claw components 20, a plurality of first pushing components 30, a sliding component 40 and a driving component 50.

[0045] The supporting assembly 10 refers to a part or device in the chip clamping device 1 for supporting or fixing an object.

[0046] Optionally, the support assembly 10 is a support plate for supporting a plurality of jaw assemblies 20 , a plurality of first pushing assemblies 30 , a sliding assembly 40 and a driving assembly 50 .

[0047] The clamping jaw assembly 20 is an important end effector in the field of industrial automation, and is mainly used in robots or other automation equipment to achieve accurate clamping and handling of objects. Optionally, the clamping jaw assembly 20 is used in the chip clamping device 1 to achieve accurate clamping of the chip.

[0048] A plurality of clamping jaw assemblies 20 are disposed on the supporting assembly 10 at intervals along the first direction.

[0049] Optionally, the first direction is the d1 direction, that is, the plurality of clamping jaw assemblies 20 are arranged on the support assembly 10 at intervals along the d1 direction. In other embodiments, the first direction is the d2 direction.

[0050] The first pushing assembly 30 refers to a component used to push or move an object.

[0051] Optionally, the first pushing component 30 is a push rod, one end of which is connected to the clamping jaw component 20, and the connection method includes but is not limited to a bolt, a pin and a keyway; the other end of the push rod is a driven end, and when the driven end is driven, the first pushing component 30 pushes the connected clamping jaw component 20 to move. In other embodiments, the first pushing component 30 is a push block or a push plate.

[0052] In this embodiment, the first pushing assembly 30 is connected to the clamping jaw assembly 20, and is used to push the clamping jaw assembly 20 to move in the second direction of the supporting assembly 10. The second direction is perpendicular to the first direction.

[0053] Optionally, the first direction is the d1 direction, and the second direction is the d2 direction. In other embodiments, the first direction is the d2 direction, and the second direction is the d1 direction.

[0054] Specifically, a plurality of the clamping jaw assemblies 20 are connected to a plurality of the first pushing assemblies 30, that is, each first pushing assembly 30 is connected to a corresponding clamping jaw assembly 20. Each first pushing assembly 30 is used to push the corresponding clamping jaw assembly 20 to move in the second direction of the supporting assembly 10.

[0055] The sliding assembly 40 refers to a component or structure that allows or implements relative sliding motion. The sliding assembly 40 is fixed to the support assembly 10 and is located on a side of the first pushing assembly 30 away from the clamping jaw assembly 20 .

[0056] Optionally, the sliding assembly 40 is a slide rail, fixedly connected to the support assembly 10, and located on a side of the plurality of first push assemblies 30 away from the clamping jaw assembly 20. The connection method between the sliding assembly 40 and the support assembly 10 includes but is not limited to bolts, welding and pins. In other embodiments, the sliding assembly 40 is a slide table or a sliding bearing.

[0057] The driving assembly 50 refers to a component or system that provides power and motion to the chip gripping device 1 .

[0058] Optionally, the drive assembly 50 is a motor. In other embodiments, the drive assembly 50 is a cylinder, a pneumatic motor or a pneumatic valve.

[0059] The driving assembly 50 is disposed on the sliding assembly 40 , and the sliding assembly 40 is used to drive the driving assembly 50 to move along the first direction relative to the plurality of first pushing assemblies 30 .

[0060] Optionally, the sliding assembly 40 may be a slide rail and is located on a side of the plurality of first pushing assemblies 30 away from the clamping jaw assembly 20. The driving assembly 50 is disposed on the sliding assembly 40, that is, the driving assembly 50 is located on a side of the plurality of first pushing assemblies 30 away from the clamping jaw assembly 20, and the driving assembly 50 can move relative to the plurality of first pushing assemblies 30 along the first direction through the sliding assembly 40.

[0061] Optionally, a slider (not marked in the figure) is provided on the sliding assembly 40, and the slider can move along the first direction on the sliding assembly 40 relative to the multiple first pushing assemblies 30. The driving assembly 50 can be connected to the slider by means of bolts, pins or keyways, and the slider drives the driving assembly 50 to move along the first direction on the sliding assembly 40 relative to the multiple first pushing assemblies 30.

[0062] When the driving assembly 50 moves to any one of the first pushing assemblies 30 , the driving assembly 50 drives the first pushing assembly 30 to move away from the sliding assembly 40 , so that the clamping claw assembly 20 corresponding to the first pushing assembly 30 clamps the chip.

[0063] Specifically, the driving assembly 50 moves relative to the plurality of first pushing assemblies 30 along the first direction through the sliding assembly 40, and when the driving assembly 50 moves to any first pushing assembly 30, the driving assembly 50 drives the first pushing assembly 30 to move away from the sliding assembly 40. At this time, the clamping claw assembly 20 corresponding to the first pushing assembly 30 moves synchronously with the first pushing assembly 30 and performs chip clamping.

[0064] In this embodiment, the chip clamping device 1 includes a support component 10, a plurality of clamping claw components 20, a plurality of first pushing components 30, a sliding component 40 and a driving component 50. Each first pushing component 30 is connected to a corresponding clamping claw component 20. When the driving component 50 moves to any first pushing component 30 through the sliding component 40, the driving component 50 drives the first pushing component 30 so that the clamping claw component 20 corresponding to the first pushing component 30 performs chip clamping. By using a plurality of clamping claw components 20 and corresponding first pushing components 30, precise control of a single chip is achieved, the operational accuracy of clamping a single chip is improved, and the overall reliability and flexibility of the chip clamping device are improved.

[0065] According to some embodiments of the present application, the support assembly 10 has a first surface 101 and a second surface 102 that are oppositely disposed, and a plurality of clamping jaw assemblies 20 are disposed on the first surface 101 and the second surface 102 , respectively.

[0066] Optionally, the first surface 101 is one side of the support assembly 10 , and the second surface 102 is the other side of the support assembly 10 , and the first surface 101 and the second surface 102 are arranged opposite to each other.

[0067] A plurality of clamping jaw assemblies 20 are respectively disposed on the first surface 101 and the second surface 102 of the supporting assembly 10 , for example Figure 1-Figure 3 As shown, eight clamping jaw assemblies 20 are respectively disposed on the first surface 101 and the second surface 102 of the supporting assembly 10 , and there are four clamping jaw assemblies 20 on each of the first surface 101 and the second surface 102 .

[0068] Correspondingly, a plurality of first pushing assemblies 30 connected to the plurality of clamping jaw assemblies 20 are respectively disposed on the first surface 101 and the second surface 102 of the supporting assembly 10 .

[0069] See also Figure 4 As shown, Figure 4 yes Figure 1 The driving assembly 50 includes a driving member 51 and a first pressing member 52 . The driving member 51 is disposed on the sliding assembly 40 , and the first pressing member 52 is connected to the driving member 51 .

[0070] Optionally, the driving member 51 is a motor, the first pressing member 52 is a pressing rod, one end of the first pressing member 52 is connected to the driving member 51, and the connection method includes but is not limited to screw drive or coupling, and the other end of the first pressing member 52 acts on the first pushing assembly 30. In other embodiments, the driving member 51 is a cylinder, a pneumatic motor or a pneumatic valve, and the first pressing member 52 is a pressing block or a pressing plate.

[0071] Specifically, the first pressing member 52 is located on one side of the first surface 101 of the supporting assembly 10 and between the driving member 51 and a plurality of first pushing assemblies 30 arranged on the first surface 101. The driving member 51 is used to drive the first pressing member 52 to move toward the direction of the first pushing assembly 30 close to the first surface 101.

[0072] According to some embodiments of the present application, the driving component 50 also includes a second pressing member 53, which is connected to the driving member 51, located on one side of the second surface 102, and located between the driving member 51 and multiple first pushing components 30 arranged on the second surface 102. The first pressing member 52 is arranged in parallel with the second pressing member 53, and the driving member 51 is used to drive the first pressing member 52 and the second pressing member 53 to move in a direction close to the first pushing component 30.

[0073] Optionally, the second pressing member 53 is a pressing rod. In other embodiments, the second pressing member 53 is a pressing block or a pressing plate.

[0074] Specifically, the first pressing member 52 is located on one side of the first surface 101 of the support assembly 10, and the second pressing member 53 is located on one side of the second surface 102 of the support assembly 10, and the first pressing member 52 is arranged in parallel with the second pressing member 53. The first pressing member 52 and the second pressing member 53 are both connected to the driving member 51, and the connection method between the second pressing member 53 and the driving member 51 is the same as that of the first pressing member 52, which will not be repeated here.

[0075] The driving member 51 drives the first pressing member 52 and the second pressing member 53 . The first pressing member 52 moves toward the first pushing assembly 30 close to the first surface 101 , and the second pressing member 53 moves toward the first pushing assembly 30 close to the second surface 102 .

[0076] In this embodiment, a plurality of clamping jaw assemblies 20 are respectively arranged on the first surface 101 and the second surface 102 of the supporting assembly 10, and a first pressing member 52 and a second pressing member 53 are respectively arranged on the first surface 101 and the second surface 102, and the driving member 51 drives the first pressing member 52 and the second pressing member 53 to move toward the direction close to the first pushing assembly 30. By respectively arranging a plurality of clamping jaw assemblies 20 on the first surface 101 and the second surface 102, the operating range of the clamping jaw assemblies 20 is increased, thereby improving the flexibility of the clamping jaw assemblies 20 and improving the efficiency of clamping chips.

[0077] According to some embodiments of the present application, when the first pressing member 52 moves to the top of any first pushing component 30, the driving member 51 drives the first pressing member 52 and the second pressing member 53 to move toward the direction close to the first pushing component 30, and the first pressing member 52 presses the corresponding first pushing component 30 to control the corresponding clamping claw component 20 to clamp the chip through the first pushing component 30.

[0078] A plurality of jaw assemblies 20 are respectively disposed on the first surface 101 and the second surface 102, and a plurality of first pushing assemblies 30 are respectively disposed on the first surface 101 and the second surface 102. Optionally, the first pushing assemblies 30 of the first surface 101 are staggered with the first pushing assemblies 30 of the second surface 102. In other embodiments, the first pushing assemblies 30 of the first surface 101 are correspondingly disposed with the first pushing assemblies 30 of the second surface 102.

[0079] Specifically, the first pressing member 52 is located at one side of the first surface 101. When the first pressing member 52 moves to any first pushing assembly 30 on the first surface 101, the driving member 51 simultaneously drives the first pressing member 52 and the second pressing member 53 to move toward the direction close to the first pushing assembly 30. At this time, the first pressing member 52 presses the corresponding first pushing assembly 30 on the first surface 101, and the first pushing assembly 30 pushes the corresponding clamping claw assembly 20 to clamp the chip. When the first pushing assembly 30 on the first surface 101 and the first pushing assembly 30 on the second surface 102 are arranged alternately, the second pressing member 53 does not press the first pushing assembly 30 on the second surface 102, and the clamping claw assembly 20 on the second surface 102 does not clamp the chip.

[0080] According to some embodiments of the present application, when the second pressing member 53 moves to the top of any first pushing component 30, the driving member 51 drives the first pressing member 52 and the second pressing member 53 to move toward the direction close to the first pushing component 30, and the first pressing member 52 presses the corresponding first pushing component 30, and the second pressing member 53 presses the corresponding first pushing component 30, so as to control the corresponding clamping claw assembly 20 to clamp the chip through the first pushing component 30.

[0081] Specifically, when the second pressing member 53 moves to any first pushing assembly 30 on the second surface 102, the driving member 51 simultaneously drives the first pressing member 52 and the second pressing member 53 to move in a direction close to the first pushing assembly 30. At this time, the second pressing member 53 presses the corresponding first pushing assembly 30 on the second surface 102, and the first pushing assembly 30 pushes the corresponding clamping claw assembly 20 to clamp the chip. When the first pushing assembly 30 on the first surface 101 and the first pushing assembly 30 on the second surface 102 are arranged alternately, the first pressing member 52 does not press the corresponding first pushing assembly 30 on the first surface 101, and the first pushing assembly 30 on the first surface 101 does not clamp the chip; when the first pushing assembly 30 on the first surface 101 and the first pushing assembly 30 on the second surface 102 are arranged correspondingly, the first pressing member 52 presses the corresponding first pushing assembly 30 on the first surface 101, and the first pushing assembly 30 pushes the corresponding clamping claw assembly 20 to clamp the chip.

[0082] In this embodiment, the first pressing member 52 and the second pressing member 53 work together to ensure that the clamping jaw assembly 20 can accurately locate and clamp the chip, thereby improving the accuracy of the operation. The first pressing member 52 and the second pressing member 53 operate on the first surface 101 and the second surface 102 of the support assembly 10 respectively, and can quickly and alternately clamp the chip, thereby improving production efficiency.

[0083] According to some embodiments of this application, see Figure 5-Figure 6 As shown, Figure 5 yes Figure 1 A magnified schematic diagram of the middle B area; Figure 6 yes Figure 2 The enlarged schematic diagram of the middle C area. The chip clamping device 1 of this embodiment also includes a second pushing component 60 and a third pushing component 70. The second pushing component 60 is arranged on the first surface 101 and connected to the multiple first pushing components 30 of the first surface 101. The third pushing component 70 is arranged on the second surface 102 and connected to the multiple first pushing components 30 of the second surface 102. The second pushing component 60 and the third pushing component 70 are arranged in parallel. When the first pressing member 52 and the second pressing member 53 move to the second pushing component 60 and the third pushing component 70 respectively, the driving member 51 drives the first pressing member 52 and the second pressing member 53, the first pressing member 52 presses the second pushing component 60, and the second pressing member 53 presses the third pushing component 70, so as to control the corresponding clamping claw assembly 20 through the second pushing component 60 and the third pushing component 70 to clamp the chip.

[0084] The second pushing component 60 is used to push the multiple first pushing components 30 on the first surface 101 ; the third pushing component 70 is used to push the multiple first pushing components 30 on the second surface 102 .

[0085] Specifically, the second pushing assembly 60 is connected to the plurality of first pushing assemblies 30 on the first surface 101 , the third pushing assembly 70 is connected to the plurality of first pushing assemblies 30 on the second surface 102 , and the second pushing assembly 60 and the third pushing assembly 70 are arranged in parallel.

[0086] Since the first pressing member 52 and the second pressing member 53 are arranged in parallel, when the first pressing member 52 moves to the second pushing assembly 60 on the first surface 101, the second pressing member 53 moves synchronously to the third pushing assembly 70 on the second surface 102, and the driving member 51 drives the first pressing member 52 and the second pressing member 53. At this time, the first pressing member 52 presses the second pushing assembly 60, and the second pressing member 53 presses the third pushing assembly 70. The second pushing assembly 60 controls the multiple first pushing assemblies 30 connected to the second pushing assembly 60 on the first surface 101, and the third pushing assembly 70 controls the multiple first pushing assemblies 30 connected to the third pushing assembly 70 on the second surface 102. The multiple first pushing assemblies 30 on the first surface 101 and the second surface 102 push the multiple clamping claw assemblies 20 to clamp the chip.

[0087] In this embodiment, a second pushing assembly 60 connected to the plurality of first pushing assemblies 30 of the first surface 101 is provided on the first surface 101, and a third pushing assembly 70 connected to the plurality of first pushing assemblies 30 of the second surface 102 is provided on the second surface 102, and the second pushing assembly 60 and the third pushing assembly 70 are provided in parallel; when the first pressing member 52 and the second pressing member 53 move to the second pushing assembly 60 and the third pushing assembly 70 respectively, the driving member 51 drives the first pressing member 52 and the second pressing member 53, and the plurality of clamping jaw assemblies 20 perform chip clamping. By providing the second pushing assembly 60 and the third pushing assembly 70, the plurality of clamping jaw assemblies 20 can perform chip clamping at the same time, thereby improving the overall working efficiency.

[0088] According to some embodiments of the present application, the chip clamping device 1 includes a plurality of limiting portions 31 , each first pushing component 30 is correspondingly provided with a limiting portion 31 , and the limiting portion 31 is located at one end of the first pushing component 30 close to the clamping jaw component 20 .

[0089] Optionally, the limiting portion 31 is a raised protruding structure.

[0090] The limiting portion 31 refers to a structure for limiting the positions of the second pushing assembly 60 and the third pushing assembly 70 .

[0091] The second pushing component 60 includes a first pushing member 61 and a first limiting member 62. The first limiting member 62 is arranged on the first surface 101. The first pushing member 61 is fixed on the first limiting member 62. One end of multiple first pushing components 30 on the first surface 101 away from the clamping jaw component 20 is passed through the first limiting member 62. The limiting parts 31 of multiple first pushing components 30 are connected to the first limiting member 62.

[0092] Optionally, the first pushing member 61 is a push rod, the first limiting member 62 is a limiting block, and the first pushing member 61 is connected to the first limiting member 62 by means of bolts or pins, so that the first pushing member 61 is fixed to the first limiting member 62.

[0093] Optionally, the first stopper 62 is provided with a plurality of through holes (not shown in the figure), and the diameter of the through holes is larger than the diameter of the first pushing assembly 30 and smaller than the diameter of the stopper 31 of the first pushing assembly 30. One end of the plurality of first pushing assemblies 30 on the first surface 101 away from the clamping jaw assembly 20 is penetrated through the first stopper 62 through the plurality of through holes. Since the diameter of the through hole is smaller than the diameter of the stopper 31, the stopper 31 cannot pass through the through hole of the first stopper 62. At this time, the first stopper 62 contacts the stopper 31 of the plurality of first pushing assemblies 30, and the stopper 31 limits the position of the second pushing assembly 60.

[0094] Since the diameter of the through hole on the first limiting member 62 is larger than the diameter of the first pushing assembly 30 , when the first pressing member 52 presses any first pushing assembly 30 , the first pushing assembly 30 can move in the through hole to achieve the clamping of a single chip.

[0095] The third pushing assembly 70 includes a second pushing member 71 and a second limiting member 72. The second limiting member 72 is arranged on the second surface 102. The second pushing member 71 is fixed on the second limiting member 72. One end of multiple first pushing assemblies 30 on the second surface 102 away from the clamping jaw assembly 20 is passed through the second limiting member 72. The limiting parts 31 of multiple first pushing assemblies 30 are connected to the second limiting member 72.

[0096] Optionally, the second pushing member 71 is a push rod, the second limiting member 72 is a limiting block, and the second pushing member 71 is connected to the second limiting member 72 by means of bolts or pins, so that the second pushing member 71 is fixed to the second limiting member 72.

[0097] Optionally, the second limiting member 72 is provided with a plurality of through holes (not shown in the figure), and the diameter of the through holes is larger than the diameter of the first pushing assembly 30 and smaller than the diameter of the limiting portion 31 of the first pushing assembly 30. One end of the plurality of first pushing assemblies 30 on the second surface 102 away from the clamping jaw assembly 20 is penetrated through the second limiting member 72 through a plurality of through holes. Since the diameter of the through hole is smaller than the diameter of the limiting portion 31, the limiting portion 31 cannot pass through the through hole of the second limiting member 72. At this time, the second limiting member 72 contacts the limiting portions 31 of the plurality of first pushing assemblies 30, and the limiting portion 31 limits the position of the third pushing assembly 70.

[0098] Since the diameter of the through hole on the second limiting member 72 is larger than the diameter of the first pushing assembly 30 , when the second pressing member 53 presses any first pushing assembly 30 , the first pushing assembly 30 can move in the through hole to achieve the clamping of a single chip.

[0099] According to some embodiments of the present application, when the first pressing member 52 and the second pressing member 53 move to the first pushing member 61 and the second pushing member 71 respectively, the driving member 51 drives the first pressing member 52 and the second pressing member 53 to press the first pushing member 61 and the second pushing member 71 respectively, and the first pushing member 61 simultaneously pushes the multiple first pushing components 30 located on the first surface 101, and the second pushing member 71 simultaneously pushes the multiple first pushing components 30 located on the second surface 102, so that the multiple clamping claw components 20 can clamp the chip.

[0100] Optionally, the second pushing assembly 60 is arranged in parallel with the third pushing assembly 70 , and the first pushing member 61 is arranged in parallel with the second pushing member 71 .

[0101] Specifically, when the first pressing member 52 moves to the first pushing member 61 and the second pressing member 53 moves to the second pushing member 71, the driving member 51 drives the first pressing member 52 and the second pressing member 53. The first pressing member 52 presses the first pushing member 61, and through the first limiting member 62 and the limiting portions 31 of the multiple first pushing components 30 on the first surface 101, the first pushing member 61 simultaneously pushes the multiple first pushing components 30 on the first surface 101; the second pressing member 53 presses the second pushing member 71, and through the second limiting member 72 and the limiting portions 31 of the multiple first pushing components 30 on the second surface 102, the second pushing member 71 simultaneously pushes the multiple first pushing components 30 on the second surface 102; the multiple clamping jaw components 20 on the first surface 101 and the second surface 102 perform chip clamping.

[0102] Since the first pusher 61 and the second pusher 71 can be driven simultaneously, this design allows the chip clamping device 1 to complete more chip clamping tasks in a shorter time, thereby improving the operation efficiency.

[0103] According to some embodiments of this application, see Figure 7 As shown, Figure 7 The chip clamping device 1 of this embodiment further comprises a bearing assembly 80, which is arranged below the support assembly 10 and is used to bear the chip (not shown) clamped by the clamping claw assembly 20.

[0104] The carrying assembly 80 refers to a component in the chip clamping device 1 for supporting, carrying or fixing the chip.

[0105] The present application also provides a chip clamping method, which is applied to the above-mentioned chip clamping device 1, including: obtaining the position information of the chip, and controlling the clamping claw assembly to move above the position of the chip based on the position information of the chip; moving the driving assembly to the first pushing assembly corresponding to the clamping claw assembly through the sliding assembly; driving the first pushing assembly through the driving assembly, and the clamping claw assembly corresponding to the first pushing assembly clamps the chip.

[0106] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A chip clamping device, characterized in that: include: Support components; A plurality of clamping jaw assemblies are arranged on the support assembly at intervals along a first direction; A plurality of first pushing assemblies, each of which is connected to a corresponding clamping jaw assembly and is used to push the corresponding clamping jaw assembly to move in a second direction of the supporting assembly, wherein the second direction is perpendicular to the first direction; A sliding assembly, fixed on the supporting assembly and located on a side of the first pushing assembly away from the clamping jaw assembly; A driving assembly, disposed on the sliding assembly, and configured to drive the driving assembly to move along the first direction relative to the plurality of first pushing assemblies; When the driving component moves to any one of the first pushing components, the driving component drives the first pushing component to move in a direction away from the sliding component, so that the clamping claw component corresponding to the first pushing component clamps the chip.

2. The chip clamping device according to claim 1, characterized in that: The supporting component has a first surface and a second surface arranged opposite to each other, the multiple clamping jaw components are respectively arranged on the first surface and the second surface, the driving component includes a driving member and a first pressing member, the driving member is arranged on the sliding component, the first pressing member is connected to the driving member, is located on one side of the first surface, and is located between the driving member and the multiple first pushing components arranged on the first surface, and the driving member is used to drive the first pressing member to move in a direction close to the first pushing component.

3. The chip clamping device according to claim 2, characterized in that: The driving component also includes a second pressing member, which is connected to the driving member, located on one side of the second surface, and located between the driving member and a plurality of the first pushing members arranged on the second surface. The first pressing member is arranged parallel to the second pressing member, and the driving member is used to drive the first pressing member and the second pressing member to move in a direction close to the first pushing member.

4. The chip clamping device according to claim 3, characterized in that: When the first pressing member moves to the top of any one of the first pushing components, the driving member drives the first pressing member and the second pressing member to move toward the direction close to the first pushing component, and the first pressing member presses the corresponding first pushing component to control the corresponding clamping claw component to clamp the chip through the first pushing component.

5. The chip clamping device according to claim 3, characterized in that: When the second pressing member moves to the top of any one of the first pushing components, the driving member drives the first pressing member and the second pressing member to move toward the direction close to the first pushing component, the first pressing member presses the corresponding first pushing component, and the second pressing member presses the corresponding first pushing component, so as to control the corresponding clamping claw component to clamp the chip through the first pushing component.

6. The chip clamping device according to claim 3, characterized in that: The chip clamping device also includes a second pushing component and a third pushing component. The second pushing component is arranged on the first surface and connected to multiple first pushing components on the first surface. The third pushing component is arranged on the second surface and connected to multiple first pushing components on the second surface. The second pushing component and the third pushing component are arranged in parallel. When the first pressing member and the second pressing member move to the second pushing member and the third pushing member respectively, the driving member drives the first pressing member and the second pressing member, the first pressing member presses the second pushing component, and the second pressing member presses the third pushing component, so as to control the corresponding clamping claw assembly through the second pushing member and the third pushing member to clamp the chip.

7. The chip clamping device according to claim 6, characterized in that: The chip clamping device comprises a plurality of limiting parts, each of the first pushing components is correspondingly provided with the limiting part, and the limiting part is located at one end of the first pushing component close to the clamping claw component; The second pushing assembly includes a first pushing member and a first limiting member, the first limiting member is arranged on the first surface, the first pushing member is fixed on the first limiting member, one end of a plurality of the first pushing members on the first surface away from the clamping jaw assembly is passed through the first limiting member, and the limiting portions of the plurality of the first pushing members are connected to the first limiting member; The third pushing component includes a second pushing member and a second limiting member, the second limiting member is arranged on the second surface, the second pushing member is fixed on the second limiting member, one end of multiple first pushing components on the second surface away from the clamping jaw assembly is passed through the second limiting member, and the limiting parts of multiple first pushing components are connected to the second limiting member.

8. The chip clamping device according to claim 7, characterized in that: When the first pressing member and the second pressing member move to the first pushing member and the second pushing member respectively, the driving member drives the first pressing member and the second pressing member to press the first pushing member and the second pushing member respectively, the first pushing member simultaneously pushes the multiple first pushing components located on the first surface, and the second pushing member simultaneously pushes the multiple first pushing components located on the second surface, so that the multiple clamping claw components can clamp the chip.

9. The chip clamping device according to any one of claims 1 to 8, characterized in that: The chip clamping device further comprises a carrying component, which is arranged below the supporting component and is used for carrying the chip clamped by the clamping claw component.

10. A chip clamping method, characterized in that: The method is applied to the chip clamping device according to any one of claims 1 to 9, comprising: Obtaining position information of the chip, and controlling the clamping jaw assembly to move above the position of the chip based on the position information of the chip; Move the driving assembly to the first pushing assembly corresponding to the clamping jaw assembly through the sliding assembly; The first pushing component is driven by the driving component, and the clamping claw component corresponding to the first pushing component clamps the chip.

Images