Process kit enclosure system

Abstract

A process kit enclosure system includes a surface to enclose an interior volume, a first support structure including a first fin, a second support structure including a second fin, and a front interface to engage the process kit enclosure system with a load port of a wafer processing system. The first and second fins are sized and spaced to retain the process kit ring carrier and the process kit ring in the interior volume. Each process kit ring is secured to one of the process kit ring carriers. The process kit enclosure system enables a first automated transfer of a first process kit ring carrier securing a first process kit ring from the process kit enclosure system into the wafer processing system, and a second automated transfer of a second process kit ring carrier securing a second process kit ring from the wafer processing system into the process kit enclosure system.

Description

[0001] This application is a divisional application of a Chinese patent application with an application date of May 20, 2020, an application number of 202080036984.2, and a title of "Processing Kit Enclosure System" (PCT application number PCT / US2020 / 033755). Technical Field

[0002] Embodiments of the present disclosure relate to devices and methods for process kit ring replacement in a processing chamber (such as a processing chamber used in a wafer processing system), and more particularly to an enclosure for holding a process kit ring. Background Art

[0003] Platforms are often used in semiconductor processing and other electronic component processing, which utilize robotic arms to transport objects (such as wafers) between processing chambers, from a storage area (such as a front-opening unified pod (FOUP)) to a processing chamber, from a processing chamber to a storage area, and so on. A processing system (such as a wafer processing system) has one or more processing chambers for processing a substrate. Gas can be used to etch a substrate in a processing chamber (for example, the substrate can be etched while being electrostatically clamped and positioned in an etching chamber). One or more process kit rings can surround the substrate (for example, to protect one or more parts of the processing chamber, the substrate, etc.). For example, an annular component (referred to as an edge ring or a process kit ring) is positioned immediately outside the outer diameter of the substrate to protect the upper surface of a chuck (such as an electrostatic chuck) that supports the substrate from being etched by an etching chemical. Process kit rings are made of several different materials and can have different shapes, both of which affect the process uniformity near the process kit ring. During processing, the process kit ring is etched for a long time, resulting in a shape change and also a change in processing uniformity.

[0004] To address the change in processing uniformity due to the deterioration of the process kit ring, the process kit ring is replaced as scheduled. Conventionally, to replace the process kit ring, an operator opens the processing chamber to access the internal process kit ring, manually removes and replaces the process kit ring, and closes the processing chamber. When the processing chamber is opened, the processing chamber and the processing system may be contaminated by cells, hair, dust, etc. The processing chamber and / or the processing system then undergoes a re-verification process, which can render the processing chamber and / or the processing system inoperable for several days to several weeks. This affects the production line yield, schedule, quality (such as in response to adding variables to the system), etc. Summary of the Invention

[0005] To provide a basic understanding of some aspects of the present disclosure, the following is a simplified summary of the present disclosure. This summary is not an extensive overview of the present disclosure. It is neither intended to identify key or critical elements of the present disclosure nor to delineate any scope of the specific embodiments of the present disclosure or any scope of the claims. Its sole purpose is to present some concepts of the present disclosure in a simplified form as a prelude to the more detailed description that will be presented later.

[0006] In one aspect of the present disclosure, a processing cassette housing system includes a plurality of surfaces to at least partially enclose an interior volume of the processing cassette housing system. The processing cassette housing system further includes a first support structure that includes a first plurality of substantially horizontal fins. The processing cassette housing system further includes a second support structure that includes a second plurality of substantially horizontal fins. The first plurality of substantially horizontal fins and the second plurality of substantially horizontal fins are sized and spaced to hold a plurality of processing cassette ring carriers and a plurality of processing cassette rings within the interior volume of the processing cassette housing system. Each of the plurality of processing cassette rings can be fixed to one of the plurality of processing cassette ring carriers. The processing cassette housing system further includes a front interface that is coupled to one or more of the plurality of surfaces to engage the processing cassette housing system with a load port of a wafer processing system. The processing cassette housing system enables a first automated transfer of a first processing cassette ring carrier holding a first processing cassette ring from the processing cassette housing system to the wafer processing system and a second automated transfer of a second processing cassette ring carrier holding a second processing cassette ring from the wafer processing system to the processing cassette housing system.

[0007] In another aspect of the present disclosure, a method includes engaging a front interface of a process cassette enclosure system with a load port of a wafer processing system. The process cassette enclosure system includes a plurality of process cassette ring carriers and a plurality of process cassette rings within an internal volume of the process cassette enclosure system. The internal volume is enclosed by a plurality of surfaces of the process cassette enclosure system, and the front interface is coupled to the plurality of surfaces. Each of the plurality of process cassette rings is assigned to one of the plurality of process cassette ring carriers. Each of the plurality of process cassette ring carriers is placed on a corresponding first approaching-level fin of a first plurality of approaching-level fins of a first support structure and a corresponding second approaching-level fin of a second plurality of approaching-level fins of a second support structure. The method further includes: using a robotic arm to perform a first automatic transfer of a first process cassette ring carrier securing a first process cassette ring from the process cassette enclosure system into the wafer processing system. The method further includes using the robotic arm or an additional robotic arm to perform a second automatic transfer of a second process cassette ring carrier securing a used second process cassette ring from the wafer processing system into the process cassette enclosure system.

[0008] In another aspect of the present disclosure, a process cassette enclosure system includes a plurality of surfaces to at least partially enclose an internal volume of the process cassette enclosure system. The process cassette enclosure system further includes a first support structure disposed within the internal volume. The process cassette enclosure system further includes a second support structure disposed within the internal volume. The process cassette enclosure system further includes empty process cassette ring carriers disposed on a first approaching-level fin of the first support structure and a second approaching-level fin of the second support structure. The process cassette enclosure system further includes a plurality of process cassette ring carriers disposed on corresponding approaching-level fins of the first support structure and the second support structure. The plurality of process cassette ring carriers are positionable above the empty process cassette ring carriers in the process cassette enclosure system. Corresponding process cassette rings are secured to each of the plurality of process cassette ring carriers. The process cassette enclosure system further includes a placement verification wafer disposed on a third approaching-level fin of the first support structure and a fourth approaching-level fin of the second support structure. The placement verification wafer is positioned above the plurality of process cassette ring carriers in the process cassette enclosure system. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The present disclosure is illustrated, by way of example and not limitation, in the figures of the accompanying drawings, in which like reference numerals indicate similar components. It should be noted that different references to "an" or "a" embodiment in the present disclosure are not necessarily to the same embodiment, and such references mean at least one.

[0010] Figure 1 Depicts a processing system according to an aspect of the present disclosure.

[0011] Figure 2A Depicts a front view of a processing cartridge housing system according to an embodiment.

[0012] Figure 2B Depicts a top view of a processing cartridge housing system according to an embodiment.

[0013] Figure 2C Depicts a side view of a processing cartridge housing system according to an embodiment.

[0014] Figure 2D Depicts a bottom view of a processing cartridge housing system according to an embodiment.

[0015] Figure 2E Depicts a rear view of a processing cartridge housing system according to an embodiment.

[0016] Figure 2F Depicts a support structure and a holding device of a processing cartridge housing system according to an embodiment.

[0017] Figure 3A Depicts a cross-sectional view of the contents on the fins of the support structure of a processing cartridge housing system according to an embodiment.

[0018] Figure 3B Depicts a cross-sectional view of a processing cartridge ring according to an embodiment, the processing cartridge ring being disposed on a processing cartridge ring carrier on the fins of the support structure of a processing cartridge housing system.

[0019] Figure 3C Depicts a top view of a processing cartridge ring carrier on the fins of the support structure of a processing cartridge housing system according to an embodiment.

[0020] Figure 3D Depicts a top view of a holding device and a processing cartridge ring disposed on the fins of the support structure of a processing cartridge housing system according to an embodiment.

[0021] Figure 3E Depicts a top view of a holding device for fixing a processing cartridge ring, the processing cartridge ring being disposed on the fins of the support structure of a processing cartridge housing system.

[0022] Figure 4AA cross-sectional view depicting the contents on a fin of a support structure of a process kit housing system according to an embodiment.

[0023] Figure 4B A cross-sectional view depicting a process kit ring disposed on a process kit ring carrier on a fin of a support structure of a process kit housing system.

[0024] Figure 4C A top view depicting a process kit ring carrier on a fin of a support structure of a process kit housing system according to an embodiment.

[0025] Figure 4D A top view depicting a holding device and a process kit ring disposed on a process kit ring carrier on a fin of a support structure of a process kit housing system according to an embodiment.

[0026] Figure 4E A top view depicting a holding device for fixing a process kit ring, the process kit ring being disposed on a process kit ring carrier on a fin of a support structure of a process kit housing system.

[0027] Figures 4F - 4I A cross-sectional view depicting the contents and fins of a process kit housing system according to an embodiment.

[0028] Figure 5 A method for replacing a process kit ring in a process chamber according to an embodiment. Detailed Description

[0029] The embodiments described herein relate to a process kit housing system. A process kit ring can surround multiple portions of a substrate and / or a substrate support assembly in a process chamber to protect components of the process chamber (e.g., to protect the substrate support assembly). As the substrate is etched by an etching chemical, the process kit ring may deteriorate over time. A deteriorated process kit ring causes non-uniformity in processing (e.g., non-uniformity in the processed substrate, inconsistency in processing, etc.). To avoid non-uniformity, the process kit ring is replaced regularly. Conventionally, to replace the process kit ring, the process chamber is opened. After being opened, the process chamber undergoes a long re-verification process. The re-verification process affects the production line output, schedule, quality, user time, energy used, etc.

[0030] The apparatuses, systems, and methods disclosed herein utilize a process kit enclosure system (e.g., a front-opening unified pod (FOUP) configured to house one or more process kit rings) to enable automated replacement of process kit rings (e.g., without opening a process chamber). The process kit enclosure system can include a plurality of surfaces to at least partially enclose an interior volume of the process kit enclosure system. For example, the process kit enclosure system can include sidewalls, a top cover, a bottom surface, and a door. The process kit enclosure system can include a front interface (e.g., a door frame, etc.) to engage a load port of a wafer processing system (e.g., a port of a factory interface). The door can be attached to the front interface of the process kit enclosure system for transportation, and the door can be removed to engage the front interface with the load port. The process kit enclosure system can include a first support structure and a second support structure, the first support structure including first approaching horizontal fins, and the second support structure including second approaching horizontal fins. The first approaching horizontal fins and the second approaching horizontal fins can be sized and spaced to hold contents, the contents being one or more of, such as: process kit rings, empty process kit ring carriers, process kit rings disposed on process kit ring carriers, placed verification wafers, and so on. The process kit enclosure system can enable automated transfer of contents (e.g., a new process kit ring fixed on a process kit ring carrier, etc.) into a wafer processing system, and automated transfer of contents (e.g., a used process kit ring fixed on a process kit ring carrier, etc.) from the wafer processing system into the process kit enclosure system.

[0031] The apparatuses, systems, and methods disclosed herein have advantages over conventional techniques. The process cassette enclosure system can engage with the load port of the wafer processing system and enable replacement of the process cassette ring without opening the process chamber and without subsequent process chamber re-verification procedures. The load port can be configured to accept different types of enclosure systems, such as a front-opening unified pod (FOUP). The load port can be sealed to the front interface of the process cassette enclosure system to prevent contamination from entering the wafer processing system (fab interface) and to prevent harmful gases from leaving the wafer processing system (fab interface). The process cassette enclosure system can include an empty process cassette ring carrier that can be used by the robotic arm of the wafer processing system to remove a used process cassette ring from the wafer processing system and place it in the process cassette enclosure system. The process cassette enclosure system can include a process cassette ring that can be used by the robotic arm to replace the used process cassette ring in the wafer processing system. The process cassette enclosure system can include a placement verification wafer that can be used by the robotic arm to verify the placement of the process cassette ring. The process cassette enclosure system can enable removal, replacement, and verification of the placement of the process cassette ring without opening any process chamber attached to the processing system and without undergoing conventional re-verification procedures for any process chamber. Replacing the process cassette ring using the process cassette enclosure system has less impact on fab throughput, scheduling, quality, user time, energy used, etc. compared to conventional techniques.

[0032] Figure 1 Depicts a processing system 100 (e.g., a wafer processing system) in accordance with one aspect of the present disclosure. The processing system 100 includes a fab interface 101 that includes a plurality of load ports 128 to which a cassette (e.g., FOUP) 102 can be coupled for transferring wafers and / or other substrates into and out of the processing system 100. The fab interface can also include a process cassette enclosure system 130 (e.g., a cassette, FOUP, etc.) coupled to the load port 128 for transferring contents 110, such as a process cassette ring, into and out of the processing system 100.

[0033] The load port 128 may include a front interface that forms a vertical opening. The load port 128 may also have a horizontal surface. The FOUP may have a front interface that forms a vertical opening. The front interface of the FOUP may be sized to engage with the front interface of the load port 128 (e.g., the vertical opening of the FOUP may be approximately the same size as the vertical opening of the load port 128). The FOUP may be placed on the horizontal surface of the load port 128, and the vertical opening of the FOUP may be aligned with the vertical opening of the load port 128. The front interface of the FOUP may be interconnected with the front interface of the load port 128 (e.g., the former is clamped to, fixed to, sealed to the latter). The bottom plate (e.g., the base plate) of the FOUP may have features that engage with the horizontal surface of the load port 128 (e.g., load features (such as recesses) that engage with the load port movement pin features, load port datum pin voids, and / or FOUP docking tray latch clamping features). The process kit enclosure system 130 has a front interface that is also sized to engage with the front interface of the load port 128. The process kit enclosure system 130 may be placed on the horizontal surface of the load port 128 and the vertical opening of the process kit enclosure system 130 may be aligned with the vertical opening of the load port 128. The front interface of the process kit enclosure system 130 may be interconnected with the front interface of the load port 128. The process kit enclosure system 130 has a bottom plate that has features for engaging with the horizontal surface of the load port 128. The process kit enclosure system 130 may engage with the same load port 128 that is used for the FOUP and cassette that contain wafers.

[0034] The process kit enclosure system 130 may include one or more articles of the contents 110 (e.g., one or more of a process kit ring, an empty process kit ring carrier, a process kit ring disposed on the process kit ring carrier, a placement verification wafer, etc.). For example, the process kit enclosure system 130 may be coupled to the factory interface 101 (e.g., the load port 128) to enable the automatic transfer of the process kit ring on the process kit ring carrier into the process system 100 for replacing a used process kit ring.

[0035] The processing system 100 may also include first vacuum ports 103a, 103b that couple a factory interface 101 to respective degassing chambers 104a, 104b. Second vacuum ports 105a, 105b may be coupled to the respective degassing chambers 104a, 104b and are disposed between the degassing chambers 104a, 104b and the transfer chamber 106 to facilitate transfer of wafers and contents 110 (such as a processing cassette ring) into the transfer chamber 106. In some embodiments, the processing system 100 includes and / or utilizes one or more degassing chambers 104 and a corresponding number of vacuum ports 103, 105 (e.g., the processing system 100 may include a single degassing chamber 104, a single first vacuum port 103, and a single second vacuum port 105). The transfer chamber 106 includes a plurality of processing chambers 107 (such as four processing chambers 107, a sizing processing chamber, etc.) disposed near and coupled to the transfer chamber. The processing chambers 107 are coupled to the transfer chamber 106 via respective ports 108 (such as slit valves, etc.). In some embodiments, the factory interface 101 is at a higher pressure (such as atmospheric pressure) while the transfer chamber 106 is at a lower pressure. Each degassing chamber 104 (such as a load lock chamber, a pressure chamber) may have a first door (such as the first vacuum port 103) and a second door (such as the second vacuum port 105), the first door for sealing the degassing chamber 104 from the factory interface 101, and the second door for sealing the degassing chamber 104 from the transfer chamber 106. When the first door is open and the second door is closed, the contents may be transferred from the factory interface 101 into the degassing chamber 104, the first door may be closed, the pressure in the degassing chamber 104 may be reduced to match the transfer chamber 106, the second door may be opened, and the contents may be transferred out of the degassing chamber 104. A local center finder (LCF) device may be used to align the contents in the transfer chamber 106 (such as before entering the processing chamber 107, after leaving the processing chamber 107).

[0036] The processing chambers 107 may include one or more of the following: an etch chamber, a deposition chamber (including atomic layer deposition, chemical vapor deposition, physical vapor deposition, or plasma-enhanced versions thereof), an annealing chamber, etc. Some processing chambers 107 (such as etch chambers) may include a processing cassette ring (such as an edge ring, a processing ring, a support ring, a sliding ring, a quartz ring, etc.) that may occasionally need to be replaced therein. Although conventional systems are associated with an operator disassembling the processing chamber to replace the processing cassette ring, the processing system 100 is configured to facilitate replacement of the processing cassette ring without the operator disassembling the processing chamber 107.

[0037] The factory interface 101 includes the factory interface robot 111. The factory interface robot 111 may include a robotic arm and may be (or include) a Selective Compliance Assembly Robot Arm (SCARA) robot, such as a 2-link SCARA robot, a 3-link SCARA robot, a 4-link SCARA robot, and so on. The factory interface robot 111 may include an end effector at one end of the robotic arm. The end effector may be configured to pick up and move a specific object, such as a wafer. Alternatively, the end effector may be configured to move an object such as a processing cassette ring (edge ring). The factory interface robot 111 may be configured to transfer objects between the cassette 102 (e.g., FOUP) and the stations 104a, 104b.

[0038] The transfer chamber 106 includes the transfer chamber robot 112. The transfer chamber robot 112 may include a robotic arm having an end effector at one end thereof. The end effector may be configured to move a specific object, such as a wafer. The transfer chamber robot 112 may be a SCARA robot, but in some embodiments may have fewer links and / or fewer degrees of freedom than the factory interface robot 111.

[0039] The controller 109 controls various aspects of the processing system 100. The controller 109 may be and / or include a computing device, such as a personal computer, a server computer, a programmable logic controller (PLC), a microcontroller, and so on. The controller 109 may include one or more processing devices, which may be general-purpose processing devices, such as a microprocessor, a central processing unit, and so on. More specifically, the processing device may be a Complex Instruction Set Computing (CISC) microprocessor, a Reduced Instruction Set Computing (RISC) microprocessor, a Very Long Instruction Word (VLIW) microprocessor, or a processor implementing other instruction sets or a combination of implemented instruction sets. The processing device may also be one or more dedicated processing devices, such as an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA), a Digital Signal Processor (DSP), a network processor, and so on. The controller 109 may include a data storage device (e.g., one or more disk drives and / or solid state drives), a main memory, a static memory, a network interface, and / or other components. The controller 109 may execute instructions to perform any one or more of the methods or programs described herein. The instructions may be stored on a computer-readable storage medium, which may include a main memory, a static memory, an auxiliary storage, and / or a processing device (during the execution of the instructions). In an embodiment, the controller 109 may receive signals from the factory interface robot 111 and the wafer transfer chamber robot 112 and send controls to the factory interface robot 111 and the wafer transfer chamber robot 112.

[0040] Figure 1Schematically depicts the transfer of contents 110 (e.g., a processing sleeve ring coupled to a processing sleeve ring carrier) into the processing chamber 107. In accordance with one aspect of the present disclosure, the contents 110 are removed from the processing sleeve housing system 130 via a factory interface robot 111 located in the factory interface 101. The factory interface robot 111 transfers the contents 110 into respective degassing chambers 104a, 104b through one of the first vacuum ports 103a, 103b. A transfer chamber robot 112 located in the transfer chamber 106 removes the contents 110 from one of the degassing chambers 104a, 104b via the second vacuum port 105a or 105b. The transfer chamber robot 112 moves the contents 110 into the transfer chamber 106, where the contents 110 can be transferred to the processing chamber 107 via respective ports 108. Although not shown in Figure 1 for clarity, the transfer of the contents 110 can include the transfer of a processing sleeve ring disposed on a processing sleeve ring carrier, the transfer of an empty processing sleeve ring carrier, the transfer of a placement verification wafer, and the like.

[0041] Figure 1 Depicts an example of the transfer of the contents 110, however other examples are also conceivable. For example, it is conceivable that the processing sleeve housing system 130 can be coupled to the transfer chamber 106 (e.g., via a load port in the transfer chamber 106). The contents 110 can be loaded into the processing chamber 107 from the transfer chamber 106 by the transfer chamber robot 112. Additionally, the contents 110 can be loaded in a substrate support pedestal (SSP). An additional SSP can be positioned in communication with the factory interface 101 opposite the depicted SSP. It is conceivable that the processed contents 110 (e.g., a used processing sleeve ring) can be removed from the processing system 100 in a manner opposite to any of the ways described herein. When using multiple processing sleeve housing systems 130 or a combination of a processing sleeve housing system 130 and an SSP, it is conceivable that one SSP or processing sleeve housing system 130 can be used for unprocessed contents 110 (e.g., a new processing sleeve ring), while another SSP or processing sleeve housing system 130 can be used to receive the processed contents 110 (e.g., a used processing sleeve ring).

[0042] In some embodiments, a process sleeve ring fixed to the upper surface of a process sleeve ring carrier may be stored in the process sleeve housing system 130, and the factory interface robot 111 may insert the end effector of the factory interface robot 111 under the process sleeve ring carrier in the process sleeve housing system 130, lift the process sleeve ring carrier, and withdraw it from the process sleeve housing system 130 to transport the process sleeve ring fixed to the robot-mounted process sleeve ring carrier within the processing system 100. In some embodiments, the process sleeve ring is stored within the process sleeve housing system 200 (e.g., without being fixed to a process sleeve ring carrier). The factory interface robot 111 may obtain an empty process sleeve ring carrier from within the processing system 100 or the process sleeve housing system 130, and may use the empty process sleeve ring carrier to remove the process sleeve ring from the process sleeve housing system 130 to transport the process sleeve ring fixed to the process sleeve ring carrier within the processing system 100. In some embodiments, the factory interface robot 111 may remove the process sleeve ring from the process sleeve housing system 130 and transport the process sleeve ring within the processing system 100 without using a process sleeve ring carrier.

[0043] Figure 2A Depicts a front view of a process sleeve housing system 200 according to an embodiment. The process sleeve housing system 200 may be used in a wafer processing system (e.g., Figure 1 processing system 100) to tightly hold a process sleeve ring 242 and effect replacement of the process sleeve ring 242.

[0044] The process sleeve housing system 200 includes a surface to at least partially enclose an internal volume 202 of the process sleeve housing system 200. The surface of the process sleeve housing system 200 enclosing the internal volume 202 may include one or more of the following: sidewalls 210 (e.g., right sidewall 210A, left sidewall 210B, etc.), bottom surface 212, bottom plate 214, top cover 216, door frame 250 (see Figure 2C ), and door 252 (see Figure 2C ). The door 252 of the process sleeve housing system 200 may be removable. For example, the door 252 may be attached to the process sleeve housing system 200 for transfer of the process sleeve housing system 200. The door 252 may be removed from the process sleeve housing system 200 to expose a front interface (e.g., door frame 250) of the process sleeve housing system 200 that is coupled to one or more surfaces of the process sleeve housing system 200 to engage a load port of a wafer processing system (e.g., see Figure 1 processing system 100).

[0045] The processing cassette enclosure system 200 can conform to one or more FOUP standards (such as size, weight, interface, handling clearance, etc.). For example, the processing cassette enclosure system 200 can engage with the load port of a wafer processing system that is the same as the substrate FOUP. The processing cassette enclosure system 200 can have a weight of less than 35 pounds (lb) for one-person lifting. The processing cassette enclosure system 200 can conform to one or more Semiconductor Equipment and Materials International (SEMI) standards (such as using a FOUP door according to SEMI E15.1, an access platform on the load port according to SEMI 47.1, a sits on motion pin according to SEMI E57, etc.).

[0046] One or more support structures 230 can be included in the internal volume 202 of the processing cassette enclosure system 200. In some embodiments, two support structures 230 are provided in the internal volume 202 to support the contents (such as Figure 1 the contents 110). In some embodiments, three support structures 230 are provided in the internal volume 202 to support the contents (such as Figure 1 the contents 110) (see, for example, Figures 4C - 4E ). In some embodiments, four support structures 230 are provided in the internal volume 202 to support the contents (such as Figure 1 the contents 110) (see, for example, Figures 3C - 3E ). Other numbers of support structures can also be used.

[0047] In some embodiments, the support structure 230 is a comb-like structure. The support structure 230 can be made of plastic (such as polyethylene), and reinforcing materials (such as carbon fiber fillers, one or more vertical rods of reinforcing materials passing through the support structure, etc.) can be provided within the support structure 230. Each support structure 230 can include one or more fins 232 (such as fins approaching horizontal) to support the contents. Each item of the contents can be supported by two or more fins (such as fins 232A of support structure 230A and fins 232B of support structure 230B), which are approaching horizontal and approaching parallel to each other. The support structure 230 can support the contents such that the end effector on the robotic arm of the wafer processing system can be inserted beneath the contents, lift the contents, and retract the contents from the processing cassette enclosure system 200.

[0048] In an embodiment, the processing cassette enclosure system 200 can include two, three, or four support structures 230. The upper surface of the support structure 230 can be connected by a bridging bracket 234 (see Figure 2F) are coupled to each other. The lower surface of the support structure 230 may be coupled to the bottom plate 214. The upper surface of the fin 232 may include features (such as indentations, recesses) to engage with the surface (such as the side wall, lower surface) near the outer periphery of the processing sleeve ring carrier 240. For example, the upper surface of each fin 232 may have a recess and the processing sleeve ring carrier 240 may be disposed in the recess. In some embodiments, the fins 232 support the corners of the processing sleeve ring carrier 240 (such as the positions where its outer periphery changes from curved to flat).

[0049] The fins 232 of the support structure 230 may be sized and spaced to provide a gap between the upper surface of the processing sleeve ring 242 and the lower surface of the fin 232 directly above the processing sleeve ring 242, which allows for accommodation of the fin 232 recess height, robotic arm droop and tolerances, and tolerances between the fins.

[0050] The internal volume 202 of the processing sleeve housing system 200 may include at least one processing sleeve ring 242 (such as the processing sleeve ring supported by the corresponding fins 232 of the support structure 230) for automatic transfer into the wafer processing system. A robotic arm may move the processing sleeve ring 242 out of the processing sleeve housing system 200 for automatic transfer of the processing sleeve ring 242 into the process chamber of the wafer processing system. The robotic arm may move the used processing sleeve ring out of the process chamber for automatic transfer into the processing sleeve housing system 200.

[0051] The processing sleeve ring 242 in the processing sleeve housing system 200 may be fixed to the upper surface of the processing sleeve ring carrier 240. The robotic arm may move the processing sleeve ring 242 out of the processing sleeve housing system 200 by: inserting the end effector under the processing sleeve ring carrier 240 in the processing sleeve housing system 200, lifting the processing sleeve ring carrier 240 and the processing sleeve ring 242 (such as by contacting at least a portion of the upper surface of the end effector with at least a portion of the lower surface of the processing sleeve ring carrier 240), and withdrawing the processing sleeve ring carrier 240 with the processing sleeve ring 242 fixed to the upper surface of the processing sleeve ring carrier 240. The spacing between the fins 232 of the support structure 230A and the fins 232 of the support structure 230 may allow the end effector to enter the span from the fins 232 of the support structure 230A to the fins 232 of the support structure 230B and lift the contents without contacting the fins 232.

[0052] As described herein, the processing sleeve rings 242 on the processing sleeve ring carrier 240 may refer to one or more processing sleeve rings disposed on the processing sleeve ring carrier 240. For example, the processing sleeve rings 242 may include two or more of the following disposed on the processing sleeve ring carrier 240: edge rings, processing rings, support rings, sliding rings, quartz rings, etc.

[0053] In some embodiments, the processing cartridge ring 242 can be directly disposed on the fin 232, and the robotic arm can retrieve the processing cartridge ring carrier 240 (e.g., from within the wafer processing system) to lift the processing cartridge ring 242. In some embodiments, the robotic arm can lift the processing cartridge ring 242 without using the processing cartridge ring carrier 240. One or more processing cartridge rings 242 can be disposed on each processing cartridge ring carrier 240. For example, on the processing cartridge ring carrier 240, two or three processing cartridge rings 242 can be nested within each other (e.g., the first processing cartridge ring has a first diameter, the second processing cartridge ring has a second diameter sized to fit within the first processing cartridge ring, and the third processing cartridge ring has a third diameter sized to fit within the second processing cartridge ring).

[0054] Each support structure 230 can include a plurality of fins 232 that are sized and spaced to hold the contents within the interior volume 202 of the processing cartridge housing system 200. For example, one or more sets of substantially parallel fins 232 of the support structure 230 can support an empty processing cartridge ring carrier 240 (e.g., a first set of substantially parallel fins 232 supports an empty processing cartridge ring carrier 240A, and a second set of substantially parallel fins 232 supports an empty processing cartridge ring carrier 240B). One or more sets of substantially parallel fins 232 of the support structure 230 can support a processing cartridge ring carrier 240 having a processing cartridge ring 242 fixed to the processing cartridge ring carrier 240. In some embodiments, the support structure 230 supports one, two, three, four, five, six, seven, eight, or some other number of processing cartridge ring carriers 240 having corresponding processing cartridge rings 242 fixed to the processing cartridge ring carriers 240. In some embodiments, the fins 232 of the support structure 230 support the same number of processing cartridge ring carriers 240 as there are processing chambers in the wafer processing chamber, the processing cartridge ring carriers 240 having corresponding processing cartridge rings 242 fixed to the processing cartridge ring carriers 240. For example, if the wafer processing system has six processing chambers, the processing cartridge housing system 200 can include six processing cartridge rings 242 (e.g., fixed to corresponding processing cartridge ring carriers 240). If the wafer processing system has eight processing chambers, the processing cartridge housing system 200 can include eight processing cartridge rings 242 (e.g., fixed to corresponding processing cartridge ring carriers 240).

[0055] A set of substantially parallel fins 232 of the support structure 230 can support a placement verification wafer 244 (e.g., a multi-functional wafer). In some embodiments, the placement verification wafer 244 can have a size similar to that of the wafers handled by the processing system. The placement verification wafer 244 can be located on a set of substantially parallel fins 232 to enable automatic transfer of the placement verification wafer 244 into the wafer processing system to verify the placement of the processing cassette set 242 in the wafer processing system. The fins used to support the placement verification wafer 244 can have different spacing and / or sizes from the fins used to support the processing cassette ring and / or the processing cassette ring carrier.

[0056] Each set of substantially parallel fins 232 can create a recess to support the contents. Each of one or more lower recesses (e.g., the lowest several recesses) of the processing cassette housing system 200 can support an empty processing cassette ring carrier 240. The higher recesses (e.g., the top recess) of the processing cassette housing system 200 can support the placement verification wafer 244. Each of one or more intermediate recesses (e.g., above the empty processing cassette ring carrier 240 and below the placement verification wafer 244) can support the processing cassette ring carrier 240 supporting the processing cassette ring 242. One or more sets of substantially parallel fins 232 (e.g., the recesses for the processing cassette ring 242 on the processing cassette ring carrier 240) can include corresponding processing cassette ring orientation brackets. Each processing cassette ring orientation bracket can have one or more protrusions (e.g., pins) that engage flat portions of the inner surface of the processing cassette ring 242 to restrict movement of the processing cassette ring 242 (e.g., rotation, movement in the x and y directions, etc.). One or more protrusions of the processing cassette ring orientation bracket and one or more features (e.g., pin contacts, recesses, etc.) of the processing cassette ring carrier 240 can restrict the movement of the processing cassette ring 242.

[0057] The robotic arm can remove contents (such as an empty process cassette ring carrier 240, the process cassette ring carrier 240 that holds the fixed process cassette ring 242) from the lower recess and place the used contents in the vacated lower recess to prevent contaminants from the used contents (such as a used process cassette ring from a wafer processing system) from falling onto other contents (such as a new process cassette ring 242, a placement verification wafer 244). For example, one or more robotic arms can remove the empty process cassette ring carrier 240A from the first recess, use the empty process cassette ring carrier 240A to pick up the used process cassette ring, and replace the now full process cassette ring carrier 240A and the supported used process cassette ring at the first recess. The (multiple) robotic arms can then remove the new process cassette ring 242C fixed to the process cassette ring carrier 240C from the third recess above the first and second recesses, place the process cassette ring 242C into the process chamber, and then replace the now empty process cassette ring carrier 240C back into the third recess. The process can be repeated with the process cassette ring carrier 240B, the process cassette ring 242D, and the process cassette ring carrier 240D for the next process cassette ring replacement, and so on.

[0058] The upper section of the process cassette housing system 200 can include clean process cassette rings 242 and the lower section can include dirty process cassette rings 242 and empty process cassette ring carriers 240. In some embodiments, the process cassette housing system 200 includes one or more object separators. The upper section and the lower section can be separated by a physical separator to prevent contamination. In some embodiments, the dirty process cassette rings 242 can be inserted into the process cassette housing system 200 below the clean process cassette rings 242. In some embodiments, a first process cassette housing system 200 can be used for the dirty process cassette rings 242 and the empty process cassette ring carriers 240, and a second process cassette housing system 200 can be used for the clean process cassette rings 242.

[0059] One or more handles 222 can be coupled to corresponding surfaces (such as the outer surface, sidewall 210) of the process cassette housing system 200 for transporting the process cassette housing system 200. For example, handle 222A can be coupled to sidewall 210A and handle 222B can be coupled to sidewall 210B. The handles 222 can be configured for manual lifting and transporting of the process cassette housing system 200. In some embodiments, an overhead transfer (OHT) flange is coupled to the outer surface (such as the top cover 216) of the process cassette housing system 200 for transporting the process cassette housing system 200.

[0060] The processing cassette housing system 200 may include alignment features 220 (e.g., coupled to or integral with the bottom surface 212). The alignment features 220 may be used for robotic calibration. The alignment features 220 may block a mechanical wafer mapper. The alignment features 220 may enable the processing cassette housing system 200 to be recognized as not being a wafer housing system (e.g., not a conventional FOUP that carries wafers). The alignment features 220 may enable the processing cassette housing system 200 to be recognized as the processing cassette housing system 200. The alignment features may enable the identification of a particular processing cassette housing system 200 or the type of contents of the processing cassette housing system 200. For example, the alignment features 220 may indicate that the processing cassette housing system 200 is supporting a processing cassette ring 242 disposed on a processing cassette ring carrier 240. In some embodiments, the alignment features 220 are simple labels, pegs, protrusions, etc. A factory interface robot may be configured to perform wafer mapping on the contents of a FOUP to determine the number of wafers in the FOUP, the placement of the wafers, etc. However, the processing cassette ring and the processing cassette ring carrier may be in an undesirable location different from where the wafers are typically positioned. To perform wafer mapping, a robotic arm may move an end effector or other wafer mapper head to the bottom of the processing cassette housing system 200 to begin the wafer mapping procedure. However, the end effector and / or mapper head will encounter the alignment features 220, which may terminate the wafer alignment procedure. The presence of the alignment features 220 may provide a signal to the controller 109 indicating that the processing cassette housing system 200 is being engaged to a load port rather than a conventional wafer-containing FOUP. In some embodiments, the processing cassette housing system 200 includes alignment features 220 (e.g., FOUP type identification features mapped by an FI (front interface) robot) and / or auto-calibration features (e.g., FI robot auto-calibration features). The alignment features 220 may be located near the door frame 250, and the auto-calibration features may protrude from the center of the bottom surface (e.g., near the bottom plate 214) near the interior of the processing cassette housing system 200.

[0061] In some embodiments, one or more surfaces of the processing cassette housing system 200 have transparent windows 218 that enable viewing of the processing cassette ring carrier 240 and the processing cassette ring 242. For example, the rear surface of the processing cassette housing system 200 may have a window 218 (e.g., see Figure 2A and Figure 2E ) and / or the top cover 216 of the processing cassette housing system 200 may have a window 218 (e.g., see Figure 2B ). The window may enable an operator to visually inspect the contents of the processing cassette housing system to determine, for example, that the processing cassette ring and / or the processing cassette ring carrier are properly stored therein.

[0062] The contents entering the process cassette enclosure system 200 from the wafer processing system may have corrosive substances (e.g., hydrogen bromide (HBr)) thereon. The process cassette enclosure system 200 can be sealed to the load port of the wafer processing system to prevent the escape of corrosive substances from the wafer processing system and the process cassette enclosure system 200. The process cassette enclosure system 200 can be sealed to the load port of the wafer processing system for cleaning of the process cassette enclosure system (e.g., decontamination of internal surfaces and features). Any electronic components (e.g., batteries, communications, sensors, microcontroller units (MCUs), etc.) associated with the process cassette enclosure system (e.g., disposed therein, coupled thereto) can be sealed.

[0063] The material of the process cassette enclosure system 200 can be compatible with corrosive substances (e.g., HBr). For example, the material of the process cassette enclosure system 200 can include one or more of the following: polyethylene, acrylonitrile ethylene propylene diene monomer (AEPDM), ethylene propylene diene monomer (EPDM), perfluoroelastomer (FFKM) (e.g., ), fluorocarbon elastomer material (FKM) (e.g., ), and / or polytetrafluoroethylene (PTFE) (e.g., ). The process cassette enclosure system 200 can have a purge port (e.g., in the bottom plate 214, etc.). The purge port can be used for nitrogen purging (e.g., N 2 purging). For example, after the used process cassette ring 242 is transferred to the process cassette enclosure system 200, the purge port can be utilized to remove contaminants from the process cassette enclosure system 200 (e.g., delivering nitrogen into the process cassette enclosure system 200 to evacuate HBr, etc. from the process cassette enclosure system 200). One or more first purge ports can be used to push gas into the process cassette enclosure system 200, and one or more second purge ports can be used to remove gas from the process cassette enclosure system 200. In some embodiments, the process cassette enclosure system 200 does not have any purge ports.

[0064] The bottom plate 214 of the process cassette enclosure system 200 can include features (e.g., alignment pins, mounting holes) to enable the lower surface of the support structure 230 to engage with the bottom plate 214 (e.g., the bottom surface 212 can form corresponding holes for the engagement of the support structure 230 with the bottom plate 214).

[0065] The bottom plate 214 can include features (e.g., bearing surfaces) to enable the lower surface of the holding device 260 (e.g., see Figure 2F ) to engage with the bottom plate 214 (e.g., rotatably couple).

[0066] The bottom plate 214 can include features (e.g., mounting holes) to enable the bottom surface 212 of the process cassette enclosure system 200 to engage with the bottom plate 214.

[0067] The base plate 214 may include features (such as alignment pins, mounting holes) to enable the doorframe to engage with the base plate 214 (such as enabling the sidewall of the doorframe to engage with the sidewall of the base plate 214). The base plate 214 may include features (such as auto-teaching mounting holes, FOUP docking rail latch clamping features, load port motion pin features, load port reference pin clearances, FOUP presence switch features, etc.) for docking the process cassette housing system 200 onto a wafer processing system (such as mounting the base plate 214 on a surface near the load port).

[0068] The front interface of the process cassette housing system 200 may include a doorframe 250 (see Figure 2C , Figure 2A which may not show the doorframe 250). The doorframe 250 may include features (such as recesses) to enable the doorframe 250 to engage with the base plate 214. The doorframe 250 may include features (such as threaded inserts, like screws, which are inserted into channels through the doorframe 250 to engage with the sidewall 210) to enable the doorframe 250 to engage with the sidewall 210 of the process cassette housing system 200. The doorframe 250 may have features (such as sealed load port side clamping features, recesses for receiving clamps from the loading section) to enable the process cassette housing system 200 to seal to the load port. The doorframe 250 and / or the door 252 may include features to couple to each other.

[0069] The process cassette housing system 200 may include a surface to partially enclose an internal volume 202. A portion of the surface may form a housing assembly that is a rectangular prism (such as a cube) having cutouts for a transparent window 218 and features. The housing assembly may include a bottom surface 212, sidewalls 210A - 210B, a leading edge, a top edge, and a trailing edge. The leading edge of the housing assembly may engage with the doorframe. The top edge of the housing assembly may be coupled to a top cover 216. The top edge of the housing assembly may have a cutout for inserting a support structure 230 into the internal volume 202. The trailing edge of the housing assembly may be coupled to the window 218. The bottom surface 212 may include features (such as a pivot pin under the holding device) for coupling to a holding device 260. The bottom surface 212 may include features (such as cutouts) to allow the support structure 230 to be mounted to the base plate 214. The bottom surface 212 may be coupled to alignment features 220 (such as process cassette housing system 200 identification features). In some embodiments, the alignment features 220 and the bottom surface 212 are integral with each other.

[0070] Figure 2B Depicts a top view of a process cassette housing system 200 according to an embodiment.

[0071] The top cover 216 of the processing kit enclosure system 200 may include an upper surface and one or more flanges. The top cover 216 may include docking offset flanges for docking to a loading port. The upper surface of the top cover 216 may have a window cutout for a transparent window 218. The upper surface of the top cover 216 may be coupled to the enclosure assembly by one or more fasteners (such as stationary thumb screws). The holding devices 260 may be taller than the top cover 216 and may be captured by features (such as small pits) on the upper surface of the top cover 216. The bottom (e.g., lower portion) of each holding device 260 may be pinned to allow the holding device 260 to rotate about the z-axis (e.g., and removed for docking to a loading port). Each holding device 260 may have features (such as fins approaching horizontal) to prevent contents from escaping from the recesses in the fins 232 of the support structure 230. There may be two holding devices 260, and the holding devices 260 have an angled inclination (e.g., not 180 degrees). The features (such as small pits) in the upper surface of the top cover 216 may be sized to receive the holding features in a fixed position (e.g., a first rotational state) or in an unfixed position (e.g., a second rotational state, removed, etc.).

[0072] In some embodiments, the top cover 216 has a docking position (e.g., a flange that docks on the same side as the door frame) and a shipping position (e.g., a flange that docks on the same side as the rear window 218). Fasteners may be utilized to remove the top cover 216 in a first position and attach the top cover 216 in a second position. The features (such as small pits) in the top cover 216 in the shipping position may only receive the holding devices 260 in a fixed position. The features (such as small pits) in the top cover 216 in the docking position may only receive the holding devices 260 in an unfixed position. In some embodiments, the fixed position is rotating the holding device 260 to secure the contents on the fins 232 of the support structure 230. In some embodiments, the unfixed position is rotating the holding device 260 to not secure the contents on the fins 232 of the support structure 230. In some embodiments, the unfixed position is removing the holding device 260 from the interior volume 202 of the processing kit enclosure system 200 (e.g., removing the holding device 260 before attaching the top cover 216 in the docking position).

[0073] In some embodiments, the top cover 216 includes a transparent window 218 to provide a view of the contents on the support structure. In some embodiments, the top cover 216 does not include a transparent window 218.

[0074] Figure 2CDepicts a side view of a processing cassette enclosure system 200 according to an embodiment. A door frame 250 may be coupled to a side wall 210 and a bottom plate 214. A door 252 may be coupled to the door frame 250 for transporting the processing cassette enclosure system 200. The door 252 may be removed from the processing cassette enclosure system 200 to load contents into the processing cassette enclosure system 200. The door 252 may be removed from the processing cassette enclosure system 200 to couple the processing cassette enclosure system 200 to a load port.

[0075] Figure 2D Depicts a bottom view of a processing cassette enclosure system 200 according to an embodiment. The bottom plate 214 may be disposed at the bottom of the processing cassette enclosure system 200. The bottom plate 214 may engage (e.g., have engaging features) with one or more features (such as motion pins, fixtures, etc.) of a wafer processing system near a load port. The bottom plate 214 may be coupled to one or more load port presence sensors, load port coupling interfaces, recesses, etc.

[0076] Figure 2E Depicts a rear view of a processing cassette enclosure system 200 according to an embodiment. In some embodiments, a transparent window 218 is coupled to a rear edge of an enclosure assembly of the processing cassette enclosure system 200 to provide a view of the contents on a support structure 230. In some embodiments, the rear surface of the processing cassette enclosure system 200 does not include a transparent window 218 (e.g., the enclosure assembly may include a rear side wall 210C instead of a rear edge).

[0077] Figure 2F Depicts a support structure 230 and a holding device 260 of a processing cassette enclosure system 200 according to an embodiment.

[0078] During transportation, the contents supported on the fins 232 of the support structure 230 may be restricted. For example, one or more retaining devices 260 may fix each processing sleeve ring 242 to the corresponding processing sleeve ring carrier in the processing sleeve ring carrier 240, and may further fix each processing sleeve ring carrier 240 within the processing sleeve housing system 200 during transportation of the processing sleeve housing system 200. In response to the one or more retaining devices 260 being in a fixed position, a latching feature (such as of the retaining device) may block the engagement of the processing sleeve housing system 200 with the loading port of the wafer processing system. In response to the retaining device 260 being in an unfixed position (such as being removed or not engaging the upper surface of the contents), the latching feature may allow the engagement of the processing sleeve housing system 200 with the loading port of the wafer processing system. In some embodiments, the coupling of the door 252 to the processing sleeve housing system 200 may place the retaining device 260 in a fixed position, and removing the door 252 from the processing sleeve housing system 200 may place the retaining device 260 in an unfixed position. In some embodiments, to engage (such as mate, dock, etc.) the front interface 200 of the processing sleeve housing system with the loading port, the door 252 is removed, the top cover 216 is removed, the retaining device 260 is placed in an unfixed position (such as being removed, rotated), and the top cover 216 is attached in the docking position (such as rotated from the original transportation position). The processing sleeve housing system 200 may not dock without the top cover 216 in the docking position, and the top cover 216 may not be attached in the docking position without the retaining device 260 in an unfixed position. To transport the processing sleeve housing system 200, the top cover 216 may be removed, the retaining device 260 may be placed in a fixed position (such as inserted into the internal volume 202 and / or rotated), the top cover 216 may be attached in the transportation position (such as the top cover 216 may not be able to be attached in the transportation position if the retaining device 260 is not in a fixed position), and the door 252 may be coupled to the processing sleeve housing system 200 (such as the door 252 may not be able to be attached when the top cover 216 is in the transportation position). The retaining device 260 may be rotatable to a fixed position to fix the processing sleeve ring carrier 240. The retaining device 260 may also be rotated to an unfixed position to unfix each of the plurality of processing sleeve ring carriers 240.

[0079] The processing sleeve ring carrier 240 and the processing sleeve ring 242 fixed to the processing sleeve ring carrier 240 can be held (e.g., by one or more holding devices 260) to minimize the movement of the processing sleeve ring carrier 240 and the processing sleeve ring 242. The processing sleeve ring carrier 240 and / or the processing sleeve ring 242 can be held by one or more of the following: frictional force; vacuum pads and pilot check valves; passive edge grips; passive self-alignment; semi-active edge grips (e.g., comb structures or levers rotated by a person or a machine, variable-height adjustable comb structures to support variations in the size of the processing sleeve ring (e.g., pre-determined or variable)); closing actuation of the door 252 to the holding device 260; lever-coupled fixture carriers and the processing sleeve ring 242 when the weight of the processing sleeve ring carrier 240 causes the processing sleeve ring carrier 240 to seat; one or more pneumatic fixtures; and / or holding devices 260 powered by sensors-activated levers and actuators.

[0080] In some embodiments, the processing sleeve housing system 200 (e.g., the support structure 230 and / or the holding device) can capture the six degrees of freedom of the processing sleeve ring carrier 240 and / or the processing sleeve ring 242 (e.g., x translation, y translation, z translation, x rotation, y rotation, and z rotation). The processing sleeve ring 242 can be restricted in x translation, y translation, and z rotation by features (e.g., buttons, extrusions) of the processing sleeve ring carrier 240. The processing sleeve ring 242 can be restricted in z translation, x rotation, and y rotation by gravity. In response to the processing sleeve ring 242 being effectively fully restricted on the upper surface of the processing sleeve ring carrier 240 (e.g., by features of the processing sleeve ring carrier 240 and gravity), the processing sleeve housing system 200 (e.g., the support structure 230 and / or the holding device 260) can be utilized to support and restrict the processing sleeve ring carrier 240.

[0081] The processing sleeve ring carrier 240 can have an outer periphery that includes two curved edges opposite each other and two flat edges (e.g., parallel edges, straight edges) that are substantially parallel to each other. The support structure 230 can support the processing sleeve ring carrier 240 at the flat edges.

[0082] In some embodiments, the holding device 260 can capture the six degrees of freedom of the processing sleeve ring carrier 240 and the processing sleeve ring 242. In some embodiments, the support structure 230 and the holding device 260 can capture the six degrees of freedom of the processing sleeve ring carrier 240 and the processing sleeve ring 242.

[0083] In some embodiments, the processing cartridge housing system 200 includes a microcontroller and a battery to actively secure the contents to the support structure 230. For example, the microcontroller can place the retention device 260 in a fixed position (e.g., rotated) (e.g., in response to an input that the processing cartridge housing system 200 is to be transported) and in an unfixed position (e.g., in response to an input to dock the processing cartridge housing system 200).

[0084] In some embodiments, the fins 262 of the retention device 260 can secure contents of different heights. For example, the fins 262 can secure an empty processing cartridge ring carrier 240 to the first set of fins 232 of the support structure (e.g., during transporting the processing cartridge housing system 200 to a loading port) and the fins 262 can secure a used processing cartridge ring to the processing cartridge ring carrier 240 on the first set of fins 232 of the support structure (e.g., during transporting the processing cartridge housing system 200 from the loading port after replacing one or more processing cartridge rings). For example, the fins 262 can be mass hooks that are adjusted for different heights of the contents on the fins 232 of the support structure 230.

[0085] Figure 3A A cross-sectional view depicting contents (e.g., a processing cartridge ring carrier 340 (e.g., Figure 2A the processing cartridge ring carrier 240) or a placement verification wafer 344 (e.g., Figure 2A the placement verification wafer 244)) on the fins 332 of a support structure 330 (e.g., Figure 2A the support structure 230) of a processing cartridge housing system 300 (e.g., Figure 2A the processing cartridge housing system 200) according to an embodiment. The fins 332 can form recesses and the contents can be disposed in the recesses. In some embodiments, the upper surface of the contents includes an extension to couple with a processing cartridge ring 342 (e.g., processing cartridge ring 242). Figure 2A

[0086] Figure 3B A cross-sectional view depicting a processing cartridge ring 342 on a processing cartridge ring carrier 340 disposed on the fins 332 of a support structure 330 of a processing cartridge housing system 300 according to an embodiment. The processing cartridge ring 342 can be restricted in x translation, y translation, and z rotation by extensions of the processing cartridge ring carrier 340. The processing cartridge ring 342 can be restricted by gravity in z translation, x rotation, and y rotation.

[0087] Figure 3C ​A top view of a process cartridge ring carrier 340 on a fin 332 of a support structure 330 depicting a process cartridge housing system 300 according to an embodiment. The process cartridge ring carrier 340 can be placed on the fin 332 manually or by a robotic arm. In some embodiments, the process cartridge housing system 300 can include four support structures 330, each support structure 330 including a corresponding fin 332.

[0088] Figure 3D A top view of a holding device 360 (e.g., Figure 2F the holding device 260) and a process cartridge ring carrier 340 disposed on a fin 332 of a support structure 330 of a process cartridge housing system 300. The upper surface of the process cartridge ring carrier 340 can have one or more extensions (e.g., one extension per fin 332). The one or more extensions can capture the degrees of freedom of the process cartridge ring 342 (e.g., restrict its movement).

[0089] Figure 3E A top view of a holding device 360 securing a fixed process cartridge ring 342 to a process cartridge ring carrier 340 disposed on a fin 332 of a support structure 330 of a process cartridge housing system 300. The holding device 360 can be rotated so that the lower surface of the holding device 360 (e.g., the lower surface of the fin 362 of the holding device 360) is above the contents on the fin 332. In some embodiments, the holding device 360 contacts the upper surface of the contents on the fin 332. For example, the fin 362 of the holding device 360 can contact the upper surface of the process cartridge ring 342. In some embodiments, the holding device 360 is disposed above the contents so that the contents cannot fall off the fin 332. For example, the distance between the lower surface of the fin 362 of the holding device 360 and the upper surface of the process cartridge ring 342 can be less than the height of the extension on the upper surface of the process cartridge ring carrier 340.

[0090] Figures 4A - 4IDepicts the contents disposed on one or more fins 432 of a processing cartridge housing system 400 according to an embodiment. In some embodiments, the contents (e.g., processing cartridge carrier 440, placement verification wafer 444) have a flat bottom surface in a first plane and one or more features (e.g., extensions, pads) extending from the first plane. For example, the processing cartridge carrier 440 may have one or more pads that wrap from a side surface of the processing cartridge carrier 440 to the bottom surface of the processing cartridge carrier 440. Each fin 432 may have a recess (e.g., a groove) to receive a feature (e.g., a pad) of the processing cartridge carrier 440. In some embodiments, only the features of the processing cartridge carrier 440 engage with the fins 432 (e.g., the flat bottom surface of the processing cartridge carrier 440 does not engage with the fins 432). In some embodiments, the recesses of the fins 432 that receive the pads of the processing cartridge carrier 440 limit the movement of the processing cartridge carrier 440 in the x and y directions.

[0091] Figure 4A Depicts a cross-sectional view of the contents (e.g., processing cartridge carrier 440 (e.g., Figure 2A processing cartridge carrier 240 of processing cartridge housing system 200) or placement verification wafer 444 (e.g., Figure 2A placement verification wafer 244 of processing cartridge housing system 200)) disposed on fins 432 (e.g., Figure 2A fins 232 of support structure 230 of processing cartridge housing system 200) of a support structure 430 (e.g., Figure 2A support structure 230 of processing cartridge housing system 200) of a processing cartridge housing system 400 (e.g., Figure 2A according to an embodiment. The fins 432 may form a first recess and the contents may be disposed in the first recess. The fins 432 may form a second recess to couple with a processing cartridge ring 442 (e.g., processing cartridge ring 242).

[0092] Figure 4BA cross-sectional view depicting a processing sleeve ring 442 on a processing sleeve ring carrier 440 disposed on fins 432 of a support structure 430 of a processing sleeve housing system 400 according to an embodiment. The processing sleeve ring 442 can be restricted in x-translation, y-translation, and z-rotation by a second recess of the fins 432 of the support structure 430. The processing sleeve ring 442 can be restricted by gravity in z-translation, x-rotation, and y-rotation. The processing sleeve ring carrier 440 can have a groove 452. The groove can correspond to an alignment feature of the processing sleeve ring 442 (such as a flat inner sidewall surface of the processing sleeve ring 442 or other alignment features). In some embodiments, the fins 432 can be sized and shaped (such as having corresponding features) for restricting movement of the processing sleeve ring 442. For example, the fins 432 can have a second recess sized to receive the processing sleeve ring 442. In some embodiments, the processing sleeve ring orientation bracket can have one or more protrusions (such as pins) that engage alignment features (such as a flat inner sidewall surface) of the processing sleeve ring 442 for restricting movement of the processing sleeve ring 442.

[0093] Figure 4C A top view depicting a processing sleeve ring carrier 440 on fins 432 of a support structure 430 of a processing sleeve housing system 400 according to an embodiment. The processing sleeve ring carrier 440 can be placed on the fins 432 manually or by a robotic arm. In some embodiments, the processing sleeve housing system 400 can include three support structures 430, each support structure 430 including corresponding fins 432. In some embodiments, the fins 432 of each of the support structures 430 form a first recess and the fins 432 of one of the support structures 430 can form a second recess. The processing sleeve ring carrier 800 can be disposed on one or more fins 894 (such as two fins, three fins, four fins, etc.).

[0094] Figure 4D A top view depicting a holding device 460 (such as Figure 2F the holding device 260) and a processing sleeve ring 442 on a processing sleeve ring carrier 440 disposed on fins 432 of a support structure 430 of a processing sleeve housing system 400. A portion of the processing sleeve ring 442 can be disposed within a second recess of the fins 432 of the support structure 430. The second recess formed by the fins 432 can capture degrees of freedom of the processing sleeve ring 442 (such as restricting its movement).

[0095] Figure 4EA top view depicting a holding device 460 for a processing cartridge ring 442 on a processing cartridge carrier 440 fixed to fins 432 of a support structure 430 of a processing cartridge housing system 400 according to an embodiment. In some embodiments, the rotatable holding device 460 can be such that the lower surface of the holding device 460 (e.g., the lower surface of the fins 462 of the holding device 460) is above the contents on the fins 432. In some embodiments, the holding device 460 contacts the upper surface of the contents on the fins 432. For example, the fins 462 of the holding device 460 can contact the upper surface of the processing cartridge ring 442. In some embodiments, the holding device 460 is disposed above the contents so that the contents cannot fall off the fins 432. For example, the distance between the lower surface of the fins 462 of the holding device 460 and the upper surface of the processing cartridge ring 442 can be less than the height required to overcome to remove the processing cartridge ring 242 from the second recess. In some embodiments, the holding device 460 can be placed in an unfixed position (e.g., rotated, rotated and removed, etc.) to transfer the contents (e.g., the processing cartridge carrier 440 and / or the processing cartridge ring 442 on the processing cartridge carrier 440) to a processing system. In some embodiments, in response to a portion of the processing cartridge carrier 800 engaging the holding device 460, the holding device 460 can pivot to fix the processing cartridge carrier 800 and / or the processing cartridge ring 820.

[0096] Figures 4F - 4I A cross-sectional view depicting the contents (e.g., the processing cartridge carrier 440) and the fins 432 of a processing cartridge housing system 400 according to an embodiment. In some embodiments, the holding device 460 can be a pivotable clamp. When the contents (e.g., the processing cartridge carrier 440) are not on the fins 894, the center of gravity of the holding device 896 can cause the clamping portion of the holding device 896 to be oriented to receive the contents (e.g., Figure 4F and Figure 4HAs shown, the clamping portion of the holding device 896 can be oriented upward). After the contents (e.g., the processing cartridge ring carrier 440, with or without the processing cartridge ring 442 thereon) are placed on the fins 432, the processing cartridge ring carrier 440 can engage with the holding device 460 (e.g., through the clamping portion of the holding device 460) such that the holding device 460 pivots to a fixed position (e.g., a first portion of the clamping portion of the holding device 460 is above the processing cartridge ring carrier 440, and a second portion of the clamping portion of the holding device 460 is below the processing cartridge ring carrier 440). In some embodiments, the clamping portion of the holding device 460 can be sized to receive one or more of the following: a placement verification wafer 444, a processing cartridge ring carrier 440, or a processing cartridge ring 442 (e.g., the processing cartridge ring 442 disposed on the processing cartridge ring carrier 440). The processing cartridge ring carrier 440 can have one or more features (e.g., pads, feet, etc.), where the corresponding features engage with each fin 432 (e.g., the recesses of each fin 432). The one or more features can be the only portions of the processing cartridge ring carrier 440 that engage with the fins 432.

[0097] Figure 5 Depicts a method 500 for processing cartridge ring replacement in a processing chamber according to an embodiment. Although shown in a particular sequence or order, the order of the process can be modified unless otherwise indicated. Accordingly, the illustrated embodiments should be understood as merely examples, and the illustrated processes can be performed in a different order, and some processes can be performed in parallel. Additionally, one or more processes can be omitted in different embodiments. Thus, not all processes need to be present in every embodiment.

[0098] The contents can be disposed within the internal volume of the processing cartridge housing system. The contents can be disposed on fins (e.g., a comb structure) of a support structure disposed within the internal volume of the processing cartridge housing system. The contents can include one or more of the following: a processing cartridge ring carrier (e.g., an empty one or a processing cartridge ring carrier with a processing cartridge ring disposed thereon), a processing cartridge ring (e.g., disposed on the fins of the support structure, disposed on the processing cartridge ring carrier), or a placement verification wafer. The contents can be manually loaded into the processing cartridge housing system, or the loading of the contents into the processing cartridge housing system can be automatic (e.g., using a robotic arm).

[0099] At block 502, the contents can be secured within the processing cassette housing system by placing one or more securing devices of the processing cassette housing system in a secure position. The securing device can be rotated to secure the contents to the fins of the support structure (e.g., features that prevent the contents from falling off the fins of the support structure, prevent the contents from passing over the fins of the support structure). For example, the top cover can be removed from the processing cassette housing system, the securing device can be inserted into the internal volume of the processing cassette housing system such that the bottom of the securing device engages a pin at the bottom surface (and / or bottom plate) of the internal surface, the securing device can be rotated such that the fins of the securing device are above the contents on the fins of the support structure, and the top cover can be reattached to the processing cassette housing system. The top cover may not be reattached unless the securing device is rotated to be above the contents on the support structure (e.g., an unrotated securing device may block the attachment of the top cover, a securing device in a fixed position may align with a pit in the top cover, while a securing device in an unfixed position may not align with the pit).

[0100] At block 504, the processing cassette housing system can be transported to the wafer processing system. The processing cassette housing system can be manually transported by using one or more handles. The transportation of the processing cassette housing system can be automated by using handles (e.g., sidewall handles, OHT, etc.). A cart with a mechanical fork can be used to pull the processing cassette housing system out of the load port and / or place the processing cassette housing system into the load port.

[0101] At block 506, the contents within the processing cassette housing system can be unsecured by placing one or more securing devices of the processing cassette housing system in an unfixed position. In an embodiment, the top cover is removed, the securing device is rotated to an unfixed position (e.g., not above the contents on the support structure), removed from the internal volume, and the top cover is reattached.

[0102] At block 508, the front interface of the processing cassette housing system can be engaged with the load port of the wafer processing system. For example, a clamp can fix the doorframe of the processing cassette housing system to the load port. The front interface of the processing cassette housing system and the load port can be sealed (e.g., gas tight).

[0103] At block 510, a robotic arm can remove a first processing cassette ring carrier from the processing cassette housing system. The first processing cassette ring carrier can be empty. The robotic arm can remove the first processing cassette ring carrier from a lower groove (e.g., a bottom groove or a groove above a used processing cassette ring). The first processing cassette ring carrier can be the lowest empty processing cassette ring carrier in the processing cassette housing system. The robotic arm can transfer the first processing cassette ring carrier into the wafer processing system.

[0104] At block 512, a used process kit ring from a process chamber of a wafer processing system can be placed on a first process kit ring carrier. Lift pins (such as process kit ring lift pins) in the process chamber can lift the used process kit ring, a robotic arm can place the first process kit ring carrier under the used process kit ring, and the lift pins can lower to place the used process kit ring on the first process kit ring carrier.

[0105] At block 514, the robotic arm can insert the used process kit ring fixed to the first process kit ring carrier into a process kit housing system. The robotic arm can place the used process kit ring fixed to the first process kit ring carrier into the recess (such as the lower recess) from which the first process kit ring carrier was removed.

[0106] At block 516, the robotic arm can remove a new process kit ring fixed to a second process kit ring carrier from the process kit housing system. The new process kit ring fixed to the second process kit ring carrier can be in a higher recess of the process kit housing system, which is above the lower recess corresponding to the first process kit ring carrier. The new process kit ring fixed to the second process kit ring carrier can be the lowest among all the new process kit rings in the process kit housing system (e.g., there are no new process kit rings below the new process kit ring fixed to the second process kit ring carrier).

[0107] At block 518, the new process kit ring can be placed into the process chamber. The robotic arm can transfer the new process kit ring fixed to the second process kit ring carrier into the process chamber, lift pins (such as process kit ring lift pins) in the process chamber can lift the new process kit ring off the second process kit ring carrier, the robotic arm can retract the process kit ring carrier from the process chamber, and the lift pins can lower the new process kit ring to a position within the process chamber.

[0108] At block 520, the robotic arm can insert the second process kit ring carrier (now empty) into the process kit housing system. The robotic arm can insert the second process kit ring carrier into the same recess from which the new process kit ring fixed to the second process kit ring carrier was removed.

[0109] At block 522, a placement verification wafer can be transferred from the process kit housing system to verify the placement of the new process ring in the process chamber of the wafer processing system. The placement verification wafer can be set in a recess above the used process kit ring. The placement verification wafer can be set in the uppermost recess of the process kit housing system. The robotic arm can remove the placement verification wafer for verifying the placement of the new process ring.

[0110] Before causing the process kit enclosure system to be transported away from the wafer processing system, the contents are secured within the process kit enclosure system by placing one or more retention devices of the process kit enclosure system in fixed positions. In one embodiment, the top cover is removed, the retention devices are placed into the interior volume, rotated to a fixed position (e.g., above the contents on a support structure), and the top cover is reattached. The front interface of the process kit enclosure system can be unfastened from the load port of the wafer processing system (e.g., the fixture that secures the doorframe of the process kit enclosure system to the load port can be unfastened). After unfastening the process kit enclosure system from the load port, the door of the process kit enclosure system can be attached to the doorframe.

[0111] The foregoing description sets forth several specific details, such as specific systems, components, methods, and other examples, in order to provide a good understanding of several embodiments of the present disclosure. However, it will be apparent to those of ordinary skill in the art that at least some embodiments of the present disclosure may be practiced without these specific details. In other instances, well-known components or methods have not been described in detail or are presented in a simple block diagram format in order to avoid unnecessarily obscuring the present disclosure. Accordingly, the specific details set forth are illustrative only. Specific implementations may vary from these illustrative details and still be contemplated as being within the scope of the present disclosure.

[0112] References throughout this specification to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the term "or" is intended to mean an inclusive "or" rather than an exclusive "or". When the term "about" or "substantially" is used herein, it is intended to mean within ±10% of the stated nominal value.

[0113] Although the operations of the methods herein are shown and described in a particular order, the order of operation of each method can be changed so that certain operations are performed in a reverse order, and certain operations can be performed (at least in part) synchronously with other operations. In another embodiment, the instructions or sub-operations of different operations can be intermittent and / or in an alternating manner.

[0114] It will be understood that the foregoing description is intended to be illustrative and not restrictive. Many other embodiments will be apparent to those of ordinary skill in the art upon reading and understanding the foregoing description. The scope of the present disclosure should therefore be determined with reference to the appended claims, along with the full scope of equivalents to which those claims are entitled.

Claims

1. A processing cassette housing system, comprising: a plurality of walls that at least partially enclose an interior volume of the processing cassette housing system; and a holding device structure disposed within the interior volume, the holding device structure including a holding device post and a first holding device fin extending from the holding device post, wherein: the first holding device fin in a first position is disposed above a first processing cassette ring and secures the first processing cassette ring, the first processing cassette ring being supported within the interior volume of the processing cassette housing system; rotating the first holding device fin from the first position to a second position outside the boundary of the first processing cassette ring; responsive to the holding device post being in the first position, the holding device post aligns with and is inserted into a recess formed by a top cover of the processing cassette housing system; and responsive to the holding device post of the holding device structure being in the second position, the holding device post is misaligned with the recess formed by the top cover and is prevented from being inserted into the recess.

2. The processing cassette housing system according to claim 1, wherein: the holding device post includes a first distal end and a second distal end, the first distal end being configured to be coupled to a bottom wall of the plurality of walls, and the second distal end being configured to be coupled to the top cover; and a plurality of holding device fins are fixed to the holding device post, the first holding device fin of the plurality of holding device fins being configured to secure a first processing cassette ring to a first processing cassette ring carrier to secure the first processing cassette ring and the first processing cassette ring carrier within the processing cassette housing system during transportation of the processing cassette housing system.

3. The processing cassette housing system according to claim 2, wherein: the holding device post is configured to rotate relative to the bottom wall to the first position such that the first holding device fin is located above the first processing cassette ring carrier; and the holding device post is configured to rotate relative to the bottom wall to the second position such that the first holding device fin is not located above the first processing cassette ring carrier and an upper portion of the holding device structure blocks attachment of the top cover to the plurality of walls.

4. The processing cassette housing system according to claim 1, wherein: the holding device post is rotatable to the first position to secure the first processing cassette ring on a first processing cassette ring carrier and a second processing cassette ring on a second processing cassette ring carrier; and the holding device post is rotatable to the second position such that the first processing cassette ring on the first processing cassette ring carrier and the second processing cassette ring on the second processing cassette ring carrier are not secured.

5. The processing cassette housing system according to claim 1, further comprising a protrusion extending from a bottom wall of the plurality of walls into the interior volume, wherein the protrusion is configured to enable the processing cassette housing system to be identified by a robot as not being a wafer housing system.

6. The processing cassette housing system according to claim 1, further comprising a transparent window that enables viewing of the first processing cassette ring carrier and the first processing cassette ring disposed on the first processing cassette ring carrier.

7. The processing cassette housing system according to claim 1, further comprising at least one of the following: One or more side handles coupled to one or more outer surfaces of one or more side walls of the plurality of walls of the processing cassette housing system for transporting the processing cassette housing system; or An overhead transfer (OHT) flange coupled to a first outer surface of the upper wall of the plurality of walls for transporting the processing cassette housing system.

8. The processing cassette housing system according to claim 1, further comprising: A first support structure including a first plurality of substantially horizontal fins, the first plurality of substantially horizontal fins including a first fin and a second fin; and A second support structure including a second plurality of substantially horizontal fins, the second plurality of substantially horizontal fins including a third fin and a fourth fin, wherein the first fin and the third fin are configured to support a first processing cassette ring carrier that supports the first processing cassette ring in the internal volume, and wherein the second fin and the fourth fin are configured to support a second processing cassette ring carrier that supports a second processing cassette ring in the internal volume.

9. The processing cassette housing system according to claim 8, wherein the first processing cassette ring carrier that supports the first processing cassette ring is transferred from the first fin and the third fin in the processing cassette housing system to the wafer processing system via a robot, and the second processing cassette ring carrier that supports the second processing cassette ring is transferred from the wafer processing system to the second fin and the fourth fin in the processing cassette housing system via the robot.

10. The processing cassette housing system according to claim 1, further comprising a front interface coupled to one or more of the plurality of walls, wherein the front interface is configured to engage the processing cassette housing system with a wafer processing system.

11. A holding device structure configured to be disposed in the internal volume of a processing cassette housing system, the holding device structure comprising: A holding device post; and A first holding device fin extending from the holding device post, wherein: The first holding device fin in a first position is disposed above the first processing cassette ring and secures the first processing cassette ring, the first processing cassette ring being supported in the internal volume of the processing cassette housing system; Rotating the first holding device fin from the first position to a second position outside the boundary of the first processing cassette ring; In response to the holding device post being in the first position, the holding device post is aligned with and inserted into a recess formed by a top cover of the processing sleeve housing system; and In response to the holding device post being in the second position, the holding device post is misaligned with the recess formed by the top cover and is prevented from being inserted into the recess.

12. The holding device structure according to claim 11, wherein: The holding device post includes a first distal end and a second distal end, the first distal end being configured to be coupled to a bottom wall among a plurality of walls of the processing sleeve housing system, and the second distal end being configured to be coupled to the top cover; and A plurality of holding device fins are fixed to the holding device post, and the first holding device fin among the plurality of holding device fins is configured to fix a first processing sleeve ring to a first processing sleeve ring carrier during transportation of the processing sleeve housing system.

13. The holding device structure according to claim 12, wherein: The holding device post is configured to rotate relative to the bottom wall to the first position so that the first holding device fin is located above the first processing sleeve ring carrier; and The holding device post is configured to rotate relative to the bottom wall to the second position so that the first holding device fin is not located above the first processing sleeve ring carrier and an upper portion of the holding device structure blocks attachment of the top cover to the plurality of walls.

14. The holding device structure according to claim 11, wherein: The holding device post is rotatable to the first position to fix the first processing sleeve ring on the first processing sleeve ring carrier and the second processing sleeve ring on the second processing sleeve ring carrier; and The holding device post is rotatable to the second position so that the first processing sleeve ring on the first processing sleeve ring carrier and the second processing sleeve ring on the second processing sleeve ring carrier are not fixed.

15. The holding device structure according to claim 11, wherein: The first processing sleeve ring carrier supporting the first processing sleeve ring is transferred from the processing sleeve housing system to a wafer processing system via a robot; and The second processing sleeve ring carrier supporting the second processing sleeve ring is transferred from the wafer processing system to the processing sleeve housing system via the robot.

16. A method, comprising: Remove a holding device structure from an interior volume of a process cassette housing system, wherein the holding device structure is configured to rotate between a first position and a second position, wherein a first holding device fin of the holding device structure in the first position is disposed above a first process cassette ring and secures the first process cassette ring, wherein the first holding device fin of the holding device structure rotates from the first position to the second position outside a boundary of the first process cassette ring, wherein in response to the holding device post being in the first position, the holding device post of the holding device structure is aligned with and inserted into a recess formed by a top cover of the process cassette housing system, and wherein in response to the holding device post of the holding device structure being in the second position, the holding device post of the holding device structure is misaligned with the recess formed by the top cover and is prevented from being inserted into the recess; and Utilize a robotic arm to perform a first automatic transfer of a first process cassette ring carrier supporting the first process cassette ring from the process cassette housing system to a wafer processing system.

17. The method according to claim 16, wherein: The holding device post includes a first distal end and a second distal end, the first distal end being configured to be coupled to a bottom wall of a plurality of walls of the process cassette housing system, and the second distal end being configured to be coupled to the top cover; and A plurality of holding device fins are fixed to the holding device post, and the first holding device fin of the plurality of holding device fins is configured to secure the first process cassette ring to the first process cassette ring carrier within the process cassette housing system during transportation of the process cassette housing system.

18. The method according to claim 17, wherein: The holding device post is configured to rotate relative to the bottom wall to the first position such that the first holding device fin is located above the first process cassette ring carrier; and The holding device post is configured to rotate relative to the bottom wall to the second position such that the first holding device fin blocks attachment of the top cover to the plurality of walls and the first holding device fin is not located above the first process cassette ring carrier.

19. The method according to claim 16, wherein: The holding device post is rotatable to the first position to secure the first process cassette ring on the first process cassette ring carrier and the second process cassette ring on the second process cassette ring carrier; and The holding device post is rotatable to the second position such that the first process cassette ring on the first process cassette ring carrier and the second process cassette ring on the second process cassette ring carrier are unsecured.

20. The method according to claim 16, further comprising engaging a front interface of the process kit housing system with the wafer processing system, wherein an interior volume of the process kit housing system is enclosed by a plurality of walls of the process kit housing system, the front interface being coupled to the plurality of walls of the process kit housing system, wherein a first plurality of near-horizontal fins including a first fin and a second fin are disposed in the interior volume, wherein a second plurality of near-horizontal fins including a third fin and a fourth fin are disposed in the interior volume, wherein the first fin and the third fin are configured to support the first process kit carrier, and the first process kit carrier supports the first process kit ring in the interior volume.

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