Ultrathin Mini LED display device and module preparation method thereof

Abstract

The invention discloses an ultrathin Mini LED display device and a module preparation method thereof, and relates to the technical field of semiconductor display, and the ultrathin Mini LED display device comprises a PCB support plate, an inverted FC RGB chip, a second solder paste, a third solder paste, an LED display assembly and a driving device. The LED display assembly comprises a carrier plate, first solder paste, an inverted FC RGB chip and transparent epoxy resin. The front surface of the carrier plate is provided with three concave cavities, the concave cavities are internally provided with metal coatings used for fixing inverted FC RGB chips, and the concave cavities are internally provided with two chip loading areas used for fixing the inverted FC RGB chips; the flip FC RGB chip is welded on the upper chip area in the concave cavity through solder paste I; the front surface of the PCB support plate is provided with a front surface bonding pad used for fixing the LED display assembly. The LED display assembly is welded to the front face of the PCB carrier plate through the second solder paste, the flip FCRGB chip is accurately welded in the rectangular groove of the carrier plate, the color missing phenomenon caused by accidental collision in the production process is effectively avoided, and therefore the yield and the quality stability of products are remarkably improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor displays, and more specifically, to an ultra-thin Mini LED display device and a method for preparing a module thereof. Background Art

[0002] With the rapid development of science and technology, display technology, as an important medium for information presentation, is crucial to user experience. Consumers have increasing requirements for display devices, pursuing higher resolution, better color performance and thinner and lighter appearance design. Mini LED display technology, as a new type of display technology that has emerged in recent years, has received widespread attention and favor from the market due to its significant advantages of high brightness, high contrast and high color saturation. However, the existing Mini LED display devices and modules still have great limitations in thickness control, and it is difficult to meet the market's urgent demand for ultra-thin and lightweight display products. Therefore, the development of an ultra-thin Mini LED display device and a method for preparing its module to achieve a more compact structural design and better display effects has become a problem that needs to be solved in the current field of display technology. Summary of the invention

[0003] In order to solve the problems raised in the above background technology, the present invention provides an ultra-thin Mini LED display device and a module preparation method thereof.

[0004] The present invention provides an ultra-thin Mini LED display device and a method for preparing a module thereof using the following technical solutions:

[0005] An ultra-thin Mini LED display device comprises a PCB carrier, a flip-chip FC RGB chip, a second solder paste, a third solder paste, an LED display component and a driver; the LED display component comprises a carrier, a first solder paste, a flip-chip FC RGB chip and a transparent epoxy resin; three concave cavities are arranged on the front side of the carrier, a metal plating layer for fixing the flip-chip FC RGB chip is arranged inside the concave cavities, and two upper core areas for fixing the flip-chip FC RGB chip are arranged inside the concave cavities; the flip-chip FC RGB chip is soldered to the upper core areas in the concave cavities by the first solder paste; a front soldering pad for fixing the LED display component is arranged on the front side of the PCB carrier; the LED display component is soldered to the front side of the PCB carrier by the second solder paste; a back soldering pad for fixing the driver is arranged on the back side of the PCB carrier; the driver is soldered to the back side of the PCB carrier by the third solder paste; the LED display component and the driver can be electrically interconnected through internal wiring of the PCB carrier.

[0006] By adopting the above technical solutions, the color deficiency caused by accidental bumps during the production process is effectively avoided, thereby significantly improving the product yield and quality stability; the dual packaging structure of transparent epoxy resin and rectangular grooves is adopted to provide a more solid protective barrier for the flip-chip FC RGB light-emitting chip, further enhancing the reliability and durability of the product; it effectively solves the problem of lamp beads falling off the pad, and also significantly improves the thrust performance of the lamp beads, ensuring the stability and reliability of the module in long-term use; through the comprehensive sealing treatment of transparent epoxy resin, the risk of module lamp beads falling off due to external bumps is effectively prevented, further improving the overall reliability and service life of the module.

[0007] Preferably, a direction mark and a plurality of circular cavity pads are provided on the back side of the carrier.

[0008] Preferably, the cavity is sealed with a transparent epoxy resin, and the outer surface of the transparent epoxy resin after sealing the cavity is flush with the front side of the carrier; the upper core area can be electrically connected to the circular cavity pad on the back side through electrical connecting wires and conductive holes.

[0009] Preferably, black solder resist ink is provided on the front and back sides of the carrier board, and direction markings are provided on the back side of the PCB carrier board.

[0010] Preferably, the cross-section of the cavity is rectangular.

[0011] By adopting the above technical solution, the independent rectangular groove designed on the front of the carrier board not only effectively isolates the mutual interference of the three RGB colors during light emission, but also avoids the tilting or rotation problems that may occur during the reflow soldering process of the flip-chip FC RGB chip, thereby ensuring the excellent consistency and clarity of the display effect.

[0012] Preferably, black solder resist ink is provided on the front and back sides of the PCB carrier board.

[0013] Preferably, the carrier plate has a thickness of 0.12 mm to 0.48 mm.

[0014] Preferably, the carrier board is made of one of ceramic, glass and BT substrate.

[0015] Preferably, the carrier board and the PCB carrier board are both provided with a metal layer, and the metal layer is an electrical connection circuit formed by Cu+Ni+Ag+Au through electroplating and electrochemical deposition process.

[0016] A method for preparing an ultra-thin Mini LED display device module is applicable to the above-mentioned ultra-thin Mini LED display device. The method for preparing the ultra-thin Mini LED display device module comprises:

[0017] S1, fix the flip-chip FC RGB chip to the core area of ​​the cavity of the carrier board through solder paste, and realize the electrical interconnection between the flip-chip FC RGB chip and the electrical connection wire through reflow soldering;

[0018] S2. Pour transparent epoxy resin on the front of the carrier board so that the surface is highly flush with the black solder resist ink after the resin is cured, forming a sealing protective layer;

[0019] S3, printing solder paste 2 on the front pad of the PCB carrier, mounting the LED display component and reflow soldering it to achieve electrical connection with the PCB carrier;

[0020] S4, pouring transparent epoxy resin on the lamp bead mounting surface of the PCB carrier to form a sealing protective layer covering the LED display component;

[0021] S5, printing solder paste on the back pad of the PCB carrier, mounting the driver components and performing reflow soldering;

[0022] S6. Establish an electrical connection path between the LED display component and the driver device through the internal wiring network of the PCB carrier board.

[0023] In summary, the present invention includes the following beneficial technical effects:

[0024] 1. By precisely soldering the flip-chip FC RGB chip in the rectangular groove of the carrier board, the color deficiency caused by accidental bumps during the production process is effectively avoided, thereby significantly improving the product yield and quality stability.

[0025] 2. The ultra-thin Mini LED display device (LED display component) adopts a dual packaging structure of transparent epoxy resin and rectangular grooves, providing a more solid protective barrier for the flip-chip FC RGB light-emitting chip, further enhancing the reliability and durability of the product.

[0026] 3. By setting a circular concave solder pad on the back of the LED display component, the present invention not only effectively solves the problem of lamp beads falling off the solder pad, but also significantly improves the thrust performance of the lamp beads, ensuring the stability and reliability of the module in long-term use.

[0027] 4. The independent rectangular groove designed on the front of the carrier board not only effectively isolates the mutual interference of the three-color RGB light emission, but also avoids the tilt or rotation problem that may occur during the reflow soldering process of the flip-chip FC RGB chip, thereby ensuring the excellent consistency and clarity of the display effect.

[0028] 5. After the LED display component is mounted on the front of the PCB carrier, it is fully sealed with transparent epoxy resin, which effectively prevents the risk of the module lamp beads falling off due to external collisions, further improving the overall reliability and service life of the module.

[0029] 6. The comprehensive sealing of transparent epoxy resin not only solves the problem of module lamp beads falling off, but also greatly enhances the protection performance of the module, so that the LED display components can still maintain a good working condition in harsh environments, thereby extending the service life of the module.

[0030] 7. By independently packaging the RGB three-color chips in the LED display component and mounting them on the PCB carrier, the module achieves high color consistency and excellent display effect, bringing users a more realistic and vivid visual experience.

[0031] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present invention will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a structural schematic diagram of the front side of an unfixed chip of an ultra-thin Mini LED display device in an embodiment of the present invention;

[0033] Figure 2 It is a schematic diagram of the three-dimensional structure of an unfixed chip of an ultra-thin Mini LED display device in an embodiment of the present invention;

[0034] Figure 3 It is a structural schematic diagram of the front side of a chip fixed to an ultra-thin Mini LED display device according to an embodiment of the present invention;

[0035] Figure 4 It is a schematic diagram of the three-dimensional structure of an ultra-thin Mini LED display device with a fixed chip in an embodiment of the present invention;

[0036] Figure 5 is a schematic diagram of a three-dimensional structure of a concave cavity after glue dispensing in an embodiment of the present invention;

[0037] Figure 6 is a schematic structural diagram of a cross-section of an ultra-thin Mini LED display device in an embodiment of the present invention;

[0038] Figure 7 is a structural schematic diagram of the back side of an ultra-thin Mini LED display device in an embodiment of the present invention;

[0039] Figure 8 is a schematic diagram of the three-dimensional structure of an LED display assembly in an embodiment of the present invention;

[0040] Fig. 9 It is a schematic structural diagram of the cross section of an LED display component in an embodiment of the present invention.

[0041] Explanation of the accompanying drawings: 1. carrier board; 2. electrical connection line; 3. upper core area; 4. through hole; 5. black solder resist ink; 6. flip-chip FC RGB chip; 7. solder paste one; 9. transparent epoxy resin; 10. cavity; 11. circular cavity pad; 12. direction mark; 13. PCB carrier board; 14. LED display component; 15. solder paste two; 16. front pad; 17. back pad; 18. solder paste three; 19. driver device; 20. driver device pad. DETAILED DESCRIPTION

[0042] The following is combined with Figures 1 to 9 The present invention is described in further detail.

[0043] It should be noted that the drawings are schematic and not to scale. For the sake of clarity and convenience, the relative sizes and proportions of the parts shown in the drawings are exaggerated or reduced in size, and any size is only illustrative and not restrictive. In addition, the same reference symbol is used for the same structure, element or accessory appearing in more than two figures to reflect similar features.

[0044] Embodiment 1

[0045] The embodiment of the present invention discloses an ultra-thin Mini LED display device. Figures 1 to 9 , an ultra-thin MiniLED display device, including a PCB carrier board 13, a flip-chip FC RGB chip 6, a second solder paste 15, a third solder paste 18, an LED display component 14 and a driving device 19; the LED display component 14 includes a carrier board 1, a solder paste 7, a flip-chip FC RGB chip 6 and a transparent epoxy resin 9; three concave cavities 10 are arranged on the front of the carrier board 1, a metal plating layer for fixing the flip-chip FC RGB chip 6 is arranged inside the concave cavity 10, and two upper core areas 3 for fixing the flip-chip FC RGB chip 6 are arranged in the concave cavity 10; the flip-chip FC The RGB chip 6 is soldered to the upper core area 3 in the cavity 10 through solder paste one 7; a front solder pad 16 for fixing the LED display component 14 is provided on the front side of the PCB carrier 13; the LED display component 14 is soldered to the front side of the PCB carrier 13 through solder paste two 15; a back solder pad 17 for fixing the driver 19 is provided on the back side of the PCB carrier 13; the driver 19 is soldered to the back side of the PCB carrier 13 through solder paste three 18, and the driver 19 is equipped with a corresponding driver solder pad 20; the LED display component 14 and the driver 19 can be electrically functionally interconnected through the internal wiring of the PCB carrier 13.

[0046] Specifically, by precisely welding the flip-chip FC RGB chip 6 in the cavity 10 of the carrier board, the color deficiency phenomenon caused by accidental bumps during the production process is effectively avoided, thereby significantly improving the yield rate and quality stability of the product;

[0047] The double packaging structure of transparent epoxy resin 9 and cavity 10 provides a more solid protection barrier for the flip-chip FC RGB light-emitting chip, further enhancing the reliability and durability of the product;

[0048] The circular concave solder pad 11 is provided. The present invention not only effectively solves the problem of the lamp bead falling off the solder pad, but also significantly improves the thrust performance of the lamp bead, ensuring the stability and reliability of the module in long-term use;

[0049] The independent cavity 10 designed on the front side of the carrier board 1 not only effectively isolates the mutual interference of the RGB three-color light emission, but also avoids the tilting or rotation problem that may occur during the reflow soldering process of the flip-chip FC RGB chip 6, thereby ensuring excellent consistency and clarity of the display effect;

[0050] After the LED display component 14 is mounted on the front of the PCB carrier board 13, it is fully sealed by transparent epoxy resin 9, which effectively prevents the risk of the module lamp beads falling off due to external collisions, further improving the overall reliability and service life of the module;

[0051] The comprehensive sealing of the transparent epoxy resin 9 not only solves the problem of module lamp beads falling off, but also greatly enhances the protection performance of the module, so that the LED display component 14 can still maintain a good working condition in harsh environments, thereby extending the service life of the module;

[0052] By independently packaging the RGB three-color chips in the LED display component 14 and mounting it on the PCB carrier board 13, a high degree of module color consistency and excellent display effect are achieved, bringing users a more realistic and vivid visual experience.

[0053] like Figure 7 As shown, a direction mark 12 and a plurality of circular cavity pads 11 are provided on the back of the carrier 1 .

[0054] Specifically, the cavity 10 is sealed by a transparent epoxy resin 9, and the outer surface of the transparent epoxy resin 9 after sealing the cavity 10 is flush with the front side of the carrier 1; the upper core area 3 can be electrically connected to the circular cavity pad 11 on the back through the electrical connection line 2 and the through hole 4.

[0055] like Figure 1 , Figure 8 , Fig. 9 As shown, black solder resist ink 5 is provided on the front and back of the carrier 1, and a direction mark is provided on the back of the PCB carrier 13. This ink not only helps to prevent accidental short circuits of electrical connecting wires, but also improves the insulation performance and corrosion resistance of the device.

[0056] like Figure 2As shown, the cross section of the cavity 10 is arranged in a rectangular shape. This design structure is not only convenient for installing and fixing the chip, but also helps to improve the overall heat dissipation performance.

[0057] like Figure 1 and Figure 3 As shown, black solder resist ink 5 is provided on the front and back of the PCB carrier 13. This ink not only helps to prevent accidental short circuits of electrical connecting wires, but also improves the insulation performance and corrosion resistance of the device.

[0058] Specifically, the thickness of the carrier board 1 is 0.12 mm-0.48 mm. This design structure not only meets the demand for ultra-thinness, but also ensures the strength and stability of the device.

[0059] Specifically, the material of the carrier board 1 is one of ceramic, glass and BT substrate, and these materials have good thermal conductivity and electrical insulation properties.

[0060] Specifically, a metal layer is provided on both the carrier 1 and the PCB carrier 13. The metal layer is an electrical connection circuit formed by Cu+Ni+Ag+Au through electroplating and electrochemical deposition processes. This design structure not only provides good electrical connection performance, but also enhances the corrosion resistance and reliability of the device.

[0061] Embodiment 2

[0062] A method for preparing an ultra-thin Mini LED display device module is applicable to the above-mentioned ultra-thin Mini LED display device. The method for preparing an ultra-thin Mini LED display device module comprises:

[0063] S1, fix the flip-chip FC RGB chip 6 to the core area 3 of the cavity 10 of the carrier 1 through solder paste 7, and realize the electrical interconnection between the flip-chip FC RGB chip 6 and the electrical connection line 2 through reflow soldering;

[0064] S2, pouring transparent epoxy resin 9 on the front of the carrier board 1, so that the surface of the resin is highly flush with the black solder resist ink 5 after curing, forming a sealing protective layer;

[0065] S3, printing solder paste 15 on the front pad 16 of the PCB carrier 13, mounting the LED display component 14 and reflow soldering it to achieve electrical connection with the PCB carrier 13;

[0066] S4, pouring transparent epoxy resin 9 on the lamp bead mounting surface of the PCB carrier board 13 to form a sealing protection layer covering the LED display component 14;

[0067] S5, printing solder paste 18 on the back pad 17 of the PCB carrier 13, mounting the driver component 19 and performing reflow soldering;

[0068] S6. Establish an electrical connection path between the LED display component 14 and the driving device 19 through the internal wiring network of the PCB carrier board 13.

[0069] Specifically, the preparation method of the ultra-thin Mini LED display device module has multiple beneficial effects such as high-precision assembly, double sealing protection, high integration and ultra-thinness, improved production efficiency and reduced costs, enhanced electrical performance and stability, and easy maintenance and upgrading. These advantages make the module have broad application prospects and market competitiveness in the field of display devices.

[0070] The standard parts used in the present invention can all be purchased from the market, and special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part adopt conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here.

[0071] In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0072] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0073] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0074] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0075] In the drawings of the embodiments disclosed in the present invention, only the structures related to the embodiments disclosed in the present invention are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present invention can be combined with each other.

[0076] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An ultra-thin Mini LED display device, characterized in that: include: PCB carrier board (13), flip-chip FC RGB chip (6), solder paste 2 (15), solder paste 3 (18), LED display component (14) and driving device (19); The LED display component (14) comprises a carrier board (1), solder paste (7), a flip-chip FC RGB chip (6) and a transparent epoxy resin (9); The carrier board (1) is provided with three concave cavities (10) on the front side, the concave cavities (10) are provided with metal coatings for fixing the flip-chip FC RGB chip (6), and the concave cavities (10) are provided with two upper core areas (3) for fixing the flip-chip FC RGB chip (6); The flip-chip FC RGB chip (6) is soldered to the upper core area (3) in the cavity (10) by solder paste (7); The front side of the PCB carrier board (13) is provided with a front side soldering pad (16) for fixing the LED display component (14); The LED display component (14) is soldered to the front side of the PCB carrier board (13) through solder paste 2 (15); The back side of the PCB carrier board (13) is provided with a back side soldering pad (17) for fixing the driving device (19); The driving device (19) is soldered to the back side of the PCB carrier board (13) through solder paste three (18); The LED display component (14) and the driving device (19) can be electrically interconnected through internal wiring of the PCB carrier board (13).

2. The ultra-thin Mini LED display device according to claim 1, characterized in that: The back side of the carrier board (1) is provided with a direction mark (12) and a plurality of circular cavity pads (11).

3. The ultra-thin Mini LED display device according to claim 1, characterized in that: The concave cavity (10) is sealed by a transparent epoxy resin (9), and the outer surface of the transparent epoxy resin (9) after sealing the concave cavity (10) is flush with the front surface of the carrier board (1); The upper core area (3) can be electrically connected to the circular concave cavity pad (11) on the back side through the electrical connection line (2) and the through hole (4).

4. The ultra-thin Mini LED display device according to claim 1, characterized in that: The front and back sides of the carrier board (1) are both provided with black solder resist ink (5), and the back side of the PCB carrier board (13) is provided with a direction mark.

5. The ultra-thin Mini LED display device according to claim 1, characterized in that: The concave cavity (10) is arranged in a rectangular cross section.

6. The ultra-thin Mini LED display device according to claim 1, characterized in that: Black solder resist ink (5) is provided on the front and back sides of the PCB carrier board (13).

7. The ultra-thin Mini LED display device according to claim 1, characterized in that: The carrier plate (1) has a thickness of 0.12 mm to 0.48 mm.

8. The ultra-thin Mini LED display device according to claim 1, characterized in that: The material of the carrier board (1) is one of ceramic, glass and BT substrate.

9. The ultra-thin Mini LED display device according to claim 1, characterized in that: The carrier board (1) and the PCB carrier board (13) are both provided with a metal layer, wherein the metal layer is an electrical connection circuit formed by Cu+Ni+Ag+Au through electroplating and electrochemical deposition processes.

10. A method for preparing an ultra-thin Mini LED display device module, characterized in that: An ultra-thin Mini LED display device applicable to any one of claims 1 to 9, wherein the method for preparing the ultra-thin Mini LED display device module comprises: S1, fixing the flip-chip FC RGB chip (6) on the core area (3) of the cavity (10) of the carrier (1) by solder paste (7), and realizing electrical interconnection between the flip-chip FC RGB chip (6) and the electrical connection wire (2) by reflow soldering; S2, pouring transparent epoxy resin (9) on the front side of the carrier board (1), so that after the resin is cured, the surface is highly flush with the black solder resist ink (5), thereby forming a sealing protective layer; S3, printing solder paste 2 (15) on the front solder pad (16) of the PCB carrier (13), mounting the LED display component (14) and performing reflow soldering to achieve electrical connection with the PCB carrier (13); S4, pouring transparent epoxy resin (9) on the lamp bead mounting surface of the PCB carrier board (13) to form a sealing protection layer covering the LED display component (14); S5, printing solder paste three (18) on the back pad (17) of the PCB carrier (13), mounting the driver component (19) and performing reflow soldering; S6. Establishing an electrical connection path between the LED display component (14) and the driving device (19) through the internal wiring network of the PCB carrier board (13).

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