Heating vacuum adsorption clamp for semiconductor laser

Abstract

The invention relates to the technical field of semiconductor laser automatic debugging equipment, and provides a heating vacuum adsorption clamp for a semiconductor laser, which comprises a mounting base, a vacuum heating jig, a limiting block, a sliding rod and a compression spring, the vacuum heating jig is fixedly arranged at the top of the mounting base, the top surface of the vacuum heating jig is provided with a vacuum air hole, a front limiting strip, a left limiting strip and a right limiting strip, the side surface of the vacuum heating jig is provided with an air pipe connecting hole and a heating wire connecting hole, and the air pipe connecting hole is communicated with the vacuum air hole; the limiting block is located on the top face of the vacuum heating jig, and the clamping face of the limiting block faces the front limiting strip. According to the technical scheme, the vacuum heating jig has the advantages that the vacuum adsorption function and the heating function are achieved, the bottom of the semiconductor laser is adsorbed to the top face of the vacuum heating jig through the vacuum air holes, and the clamping stability is improved; the vacuum heating jig is used for heating the semiconductor laser, so that the temperature of the semiconductor laser is increased, and glue curing is accelerated.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor laser automatic debugging equipment, and specifically relates to a heating vacuum adsorption fixture for semiconductor lasers. Background Art

[0002] With the continuous development of production technology, the debugging conditions of semiconductor lasers are becoming increasingly strict. Since a variety of external accessories need to be connected during the debugging process of semiconductor lasers, the main body of the semiconductor laser is affected by external forces, resulting in an unstable fixing situation. Therefore, during the debugging process, a fixture is usually used to clamp the semiconductor laser.

[0003] The components used in the assembly of semiconductor lasers are usually fixed with glue. After applying the glue, it is necessary to wait for the glue to cure, which takes a long time, and then the semiconductor laser is debugged.

[0004] The glue used in the assembly of semiconductor lasers can be heated to accelerate the curing of the glue and save the time for waiting for the glue to cure. However, traditional fixtures can only meet the simple clamping function of semiconductor lasers. Traditional fixtures lack a heating function, and the clamping stability is relatively low, and the semiconductor laser is prone to shaking during the debugging process.

[0005] When the production debugging process requires heating the glue and clamping the semiconductor laser more stably, traditional fixtures cannot meet the needs of production debugging. Therefore, there is an urgent need in this technical field for a heating vacuum adsorption fixture for semiconductor lasers. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide a heating vacuum adsorption fixture for semiconductor lasers.

[0007] The present invention is implemented as follows: A heating vacuum adsorption fixture for semiconductor lasers includes:

[0008] An installation base, a vacuum heating jig, a limit block, a sliding rod, and a compression spring;

[0009] The vacuum heating jig is fixedly arranged on the top of the installation base. The top surface of the vacuum heating jig has a vacuum hole, a front limit strip, a left limit strip, and a right limit strip. The side surface of the vacuum heating jig has an air pipe connection hole and a heating wire connection hole, and the air pipe connection hole communicates with the vacuum hole;

[0010] The limiting block is located above the top surface of the vacuum heating fixture. The clamping surface of the limiting block faces the front limiting strip. The top of the mounting base has a rear convex block, and the rear convex block is provided with a through hole. The sliding rod passes through the through hole, and the front end of the sliding rod is fixedly connected to the limiting block. The compression spring of the sliding rod is sleeved on the sliding rod and is located between the limiting block and the rear convex block.

[0011] Further, it further includes: a fastening bolt, and the vacuum heating fixture and the mounting base are connected by the fastening bolt.

[0012] Further, the plurality of vacuum holes are evenly spaced.

[0013] Further, there is a first edge avoidance groove between the front limiting strip and the left limiting strip, and a second edge avoidance groove between the front limiting strip and the right limiting strip.

[0014] Further, the rear end of the sliding rod has a handle.

[0015] Compared with the background art, the beneficial effects of the technical solution of the present invention:

[0016] It has a vacuum adsorption function, and adsorbs the semiconductor laser on the top surface of the vacuum heating fixture through the air pipe connection hole and the vacuum holes; it also has a heating function, and transfers heat to the vacuum heating fixture through the heating wire connection hole; the front limiting strip, the left limiting strip and the right limiting strip are provided to facilitate positioning the semiconductor laser on the vacuum heating fixture and improve the positioning accuracy; the characteristics of the compression spring are used in cooperation with the limiting block to make the clamping and picking of the semiconductor laser convenient and fast; the vacuum holes adsorb the bottom of the semiconductor laser on the top surface of the vacuum heating fixture to improve the stability of clamping; the vacuum heating fixture heats the semiconductor laser to increase the temperature of the semiconductor laser, accelerate the curing of the glue, and save the time for waiting for the glue to cure. Description of the Drawings

[0017] The following further describes the present invention with reference to the accompanying drawings in conjunction with embodiments.

[0018] Figure 1 It is a schematic structural diagram of a heating vacuum adsorption fixture for a semiconductor laser of the present invention.

[0019] Figure 2 is Figure 1 the exploded view of the parts.

[0020] Figure 3 It is a schematic structural diagram of the vacuum heating fixture in the present invention.

[0021] Reference numerals: mounting base 1; rear bump 11; vacuum heating jig 2; vacuum hole 21; front limiting strip 22; left limiting strip 23; right limiting strip 24; air pipe connection hole 25; heating wire connection hole 26; first edge avoidance groove 27; second edge avoidance groove 28; limiting block 3; sliding rod 4; handle 41; compression spring 5; fastening bolt 6. Detailed implementation mode

[0022] An embodiment of the present invention provides a heating vacuum adsorption jig for a semiconductor laser, which overcomes the disadvantages in the background technology that the traditional jig lacks a heating function and has low clamping stability; and realizes the technical effects of having a vacuum adsorption function and a heating function, improving the positioning accuracy and the clamping stability.

[0023] The general idea of the technical solution of the embodiment of the present invention is as follows:

[0024] The jig of the present invention obtains higher clamping accuracy, stability and can be heated at the same time. Before debugging, place the semiconductor laser within the front limiting strip, left limiting strip and right limiting strip of the vacuum heating jig for positioning; operate the sliding rod to make the limiting block lean against the semiconductor laser, and the limiting block cooperates with the front limiting strip and then uses the characteristics of the compression spring to clamp the semiconductor laser for clamping; the air pipe of the vacuum generating device is connected to the air pipe connection hole of the vacuum heating jig to provide a vacuum adsorption force to adsorb the semiconductor laser on the top surface of the vacuum heating jig, improving the clamping stability; when it is necessary to heat the glue, the heating wire of the heater is connected to the heating wire connection hole of the vacuum heating jig, and the heat is transferred to the vacuum heating jig to heat the semiconductor laser, so that the temperature of the semiconductor laser rises, thereby heating the glue and accelerating the curing of the glue, saving the time for waiting for the glue to cure.

[0025] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the specification drawings and specific implementation modes.

[0026] Refer to Figures 1 to 3 , a preferred embodiment of the present invention.

[0027] A heating vacuum adsorption jig for a semiconductor laser, comprising:

[0028] Mounting base 1, vacuum heating jig 2, limiting block 3, sliding rod 4 and compression spring 5;

[0029] The vacuum heating fixture 2 is fixedly arranged on the top of the mounting base 1. The top surface of the vacuum heating fixture 2 has a vacuum hole 21, a front limiting strip 22, a left limiting strip 23 and a right limiting strip 24. The side surface of the vacuum heating fixture 2 has an air pipe connection hole 25 and a heating wire connection hole 26, and the air pipe connection hole 25 communicates with the vacuum hole 21;

[0030] The limiting block 3 is located above the top surface of the vacuum heating fixture 2. The clamping surface of the limiting block 3 faces the front limiting strip 22. The top of the mounting base 1 has a rear convex block 11. The rear convex block 11 is provided with a through hole. The sliding rod 4 passes through the through hole. The front end of the sliding rod 4 is fixedly connected to the limiting block 3. The compression spring 5 is sleeved on the sliding rod 4 and is located between the limiting block 3 and the rear convex block 11.

[0031] The beneficial effects of the technical solution of the present invention: It has a vacuum adsorption function, and the semiconductor laser is adsorbed on the top surface of the vacuum heating fixture 2 through the air pipe connection hole 25 and the vacuum hole 21; it also has a heating function, and heat is transferred to the vacuum heating fixture 2 through the heating wire connection hole 26; the front limiting strip 22, the left limiting strip 23 and the right limiting strip 24 are provided to facilitate positioning the semiconductor laser on the vacuum heating fixture 2 and improve the positioning accuracy; by utilizing the characteristics of the compression spring 5 in cooperation with the limiting block 3, the clamping, taking and placing of the semiconductor laser are convenient and fast; the vacuum hole 21 adsorbs the bottom of the semiconductor laser on the top surface of the vacuum heating fixture 2 to improve the stability of clamping; the vacuum heating fixture 2 heats the semiconductor laser to increase the temperature of the semiconductor laser and accelerate the curing of the glue, saving the time for waiting for the glue to cure.

[0032] There are two debugging methods: one is to vacuum-adsorb the semiconductor laser device without starting the heating function; the other is to vacuum-adsorb the semiconductor laser device and heat it to 85°C.

[0033] Both the air pipe connection hole 25 and the heating wire connection hole 26 are provided with internal threads, and the air pipe of the vacuum generating device is provided with external threads, which is convenient for operating and locking the air pipe of the vacuum generating device in the air pipe connection hole 25; the heating wire of the heater is provided with external threads, which is convenient for operating and locking the heating wire of the heater in the heating wire connection hole 26.

[0034] The vacuum heating fixture 2 is equipped with a temperature sensor, and the temperature sensor is connected to the heater through a signal wire; the temperature sensor feeds back the detected temperature signal of the vacuum heating fixture 2 to the heater, which helps the vacuum heating fixture 2 to be at a specified temperature, such as 85°C.

[0035] Furthermore, it further includes: a fastening bolt 6, and the vacuum heating fixture 2 is connected to the mounting base 1 through the fastening bolt 6.

[0036] Advantages of this technical solution: By using the fastening bolt 6, it is convenient to disassemble and install the vacuum heating fixture 2 and the mounting base 1.

[0037] Furthermore, multiple said vacuum holes 21 are evenly spaced.

[0038] Advantages of this technical solution: Provide a stable adsorption force, so that the contact position between the bottom surface of the semiconductor laser and the top surface of the vacuum heating fixture 2 is evenly stressed, which helps to improve the stability of clamping.

[0039] Furthermore, there is a first edge avoidance groove 27 between the front limiting strip 22 and the left limiting strip 23, and a second edge avoidance groove 28 between the front limiting strip 22 and the right limiting strip 24.

[0040] Advantages of this technical solution: When placing the semiconductor laser for positioning, it can avoid positioning deviation caused by the shell edge of the semiconductor laser when contacting the vacuum heating fixture, and also play a role in protecting the shell edge of the semiconductor laser.

[0041] Furthermore, the rear end of the sliding rod 4 has a handle 41.

[0042] Advantages of this technical solution: The debugger can conveniently operate the sliding rod 4 using the handle 41.

[0043] Working mode of the present invention:

[0044] Before placing the semiconductor laser on the vacuum heating fixture 2, first operate the sliding rod 4 to move the limiting block 3 away from the front limiting strip 22. At this time, the compression spring 5 is in a compressed state. Then place the semiconductor laser on the vacuum heating fixture 2 for positioning. The bottom of the semiconductor laser covers the vacuum holes 21. Then release the sliding rod 4, and the compression spring 5 resets. The limiting block 3 clamps the semiconductor laser. Start the vacuum generating device of the prior art. The vacuum heating fixture 2 adsorbs the semiconductor laser through the vacuum holes 21 to improve the stability of clamping. When it is necessary to accelerate the curing of the glue, start the heater of the prior art. The heat is transferred to the vacuum heating fixture 2 to heat the semiconductor laser, so that the temperature of the semiconductor laser rises, thereby heating the glue and accelerating the curing of the glue, saving the waiting time for the glue to cure.

[0045] Although the specific embodiments of the present invention have been described above, those skilled in the art of this technology should understand that the specific embodiments we described are illustrative rather than used to limit the scope of the present invention. Equivalent modifications and changes made by those skilled in the art in accordance with the spirit of the present invention should be covered within the scope protected by the claims of the present invention.

Claims

1. A semiconductor laser using a heated vacuum adsorption fixture, characterized in that: include: Install the base, vacuum heating fixture, limit block, sliding rod and compression spring; The vacuum heating jig is fixedly arranged on the top of the mounting base, the top surface of the vacuum heating jig is provided with a vacuum air hole, a front limit bar, a left limit bar and a right limit bar, the side surface of the vacuum heating jig is provided with an air pipe connection hole and a heating wire connection hole, and the air pipe connection hole is communicated with the vacuum air hole; The limit block is located on the top surface of the vacuum heating jig, the clamping surface of the limit block faces the front limit strip, the top of the mounting base is provided with a rear protrusion, the rear protrusion is provided with a through hole, the sliding rod passes through the through hole, the front end of the sliding rod is fixedly connected to the limit block, and the compression spring of the sliding rod is sleeved on the sliding rod and is located between the limit block and the rear protrusion.

2. A semiconductor laser heating vacuum adsorption fixture according to claim 1, characterized in that: Also includes: The vacuum heating fixture is connected to the mounting base by means of the fastening bolts.

3. A semiconductor laser heating vacuum adsorption fixture according to claim 1, characterized in that: The plurality of vacuum air holes are evenly spaced and distributed.

4. A semiconductor laser heating vacuum adsorption fixture according to claim 1, characterized in that: A first edge avoidance groove is provided between the front limit strip and the left limit strip, and a second edge avoidance groove is provided between the front limit strip and the right limit strip.

5. A semiconductor laser heating vacuum adsorption fixture according to claim 1, characterized in that: The rear end of the sliding rod is provided with a handle.

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