Audio processing device, microphone system and vehicle
By designing an audio processing device including a receiving module and a processing module, the problem that the prior art cannot meet the user's diverse audio processing needs, and diversified processing of audio data and a high-quality karaoke experience are achieved.
Patent Information
- Application Number
- CN202510520570.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-24
- Publication Date
- 2025-05-27
AI Technical Summary
The existing vehicle audio processing devices cannot meet the diverse audio processing needs of users, such as harmonic processing, automatic sound editing, chorus effects, etc.
An audio processing device is designed, including a receiving module and a processing module. The receiving module receives the audio data input from the microphone through multiple radio frequency chips and converts it into a suitable format. The processing module preprocesses and sound effects on the audio data, including howling suppression, echo cancellation, sound processing, etc., and transmits the processed audio data to an external device.
It realizes diversified processing of audio data, meets users' wider audio processing needs, and provides a high-quality karaoke experience.
Smart Images

Figure CN120050561A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of audio processing, and in particular to an audio processing device, a microphone system and a vehicle. Background Art
[0002] At present, most of the audio processing devices used in vehicles can only perform basic audio processing, such as howling suppression, echo cancellation, etc., but cannot meet users' growing and diverse audio processing needs, such as harmony processing, automatic tuning, chorus effects, etc. Summary of the invention
[0003] The purpose of this application is to provide an audio processing device, a microphone system and a vehicle to meet more audio processing needs of users.
[0004] In a first aspect, the present application proposes an audio processing device, comprising: a receiving module for receiving audio data input by multiple microphones; a processing module for preprocessing the audio data, performing sound effect processing on the preprocessed audio data, and transmitting the audio data after sound effect processing to an external device.
[0005] According to one embodiment of the present application, the receiving module includes: multiple RF chips, the multiple RF chips correspond one-to-one to the multiple microphones, the RF chips are used to receive audio data in the form of RF signals input by the corresponding microphones, and convert the audio data in the form of RF signals into audio data in a first format; a first interface, used to transmit the audio data in the first format to the processing module.
[0006] According to one embodiment of the present application, the processing module includes: a first processing sub-module, used to pre-process the audio data in the first format, and convert the audio data after the sound effect processing into audio data in a second format, and transmit the audio data in the second format to the external device; a second processing sub-module, used to perform sound effect processing on the preprocessed audio data.
[0007] According to one embodiment of the present application, the first processing submodule includes: a second interface for receiving audio data in the first format transmitted by the first interface; a third interface for transmitting the preprocessed audio data to the second processing submodule, and receiving the audio data processed with sound effects transmitted by the second processing submodule; a first digital processing unit for preprocessing the audio data in the first format, and converting the audio data processed with sound effects into audio data in the second format; and a fourth interface for transmitting the audio data in the second format to the external device.
[0008] According to one embodiment of the present application, the first processing submodule also includes: a fifth interface; a micro control unit, used to send configuration information to the plurality of RF chips through the fifth interface, so that each RF chip configures an operating frequency point according to the configuration information.
[0009] According to one embodiment of the present application, the first processing submodule also includes: a Bluetooth unit, used to establish a Bluetooth connection with the multiple microphones; wherein the microcontroller unit is also used to send the operating frequency of the corresponding RF chip to each microphone through the Bluetooth channel, so that the microphone configures the RF module of the microphone according to the received operating frequency.
[0010] According to one embodiment of the present application, the microcontroller unit is also used to: determine that the first identity information sent by the microphone is received before sending the working frequency to the microphone, and disconnect the corresponding Bluetooth connection when the Bluetooth misconnection is determined according to the first identity information; and / or send second identity information to the microphone so that the microphone disconnects the corresponding Bluetooth connection when the Bluetooth misconnection is determined according to the second identity information.
[0011] According to an embodiment of the present application, the transmission power of the Bluetooth unit is determined according to the spatial range of the external device.
[0012] According to one embodiment of the present application, the micro control unit is also used to: receive first upgrade data sent by the external device through the fourth interface; and send the first upgrade data to the multiple microphones through the Bluetooth channel so that the multiple microphones are upgraded according to the first upgrade data.
[0013] According to one embodiment of the present application, the second processing submodule includes: a sixth interface for receiving the preprocessed audio data transmitted by the third interface, and transmitting the audio data processed with sound effects to the third interface; a second digital processing unit for performing sound effect processing on the preprocessed audio data; and a first memory for caching intermediate data of the sound effect processing process.
[0014] According to one embodiment of the present application, the first processing submodule also includes a second memory and a seventh interface, and the second processing submodule also includes a third memory and an eighth interface; the micro control unit is also used to: receive second upgrade data issued by the external device through the fourth interface, wherein the second upgrade data includes a first upgrade package and a second upgrade package; write the first upgrade package to the second memory to achieve an upgrade of the first processing submodule, and transmit the second upgrade package to the second digital processing unit through the seventh interface and the eighth interface, so that the second digital processing unit writes the second upgrade package to the third memory to achieve an upgrade of the second processing submodule.
[0015] According to an embodiment of the present application, the pre-processing includes at least one of howling suppression, equalizer adjustment, echo cancellation, and dynamic compression.
[0016] According to one embodiment of the present application, the sound effect processing includes at least one of echo reverberation, harmony processing, automatic tuning, chorus effect, pitch correction, scoring function, original singer's vocal elimination, and vocal teaching.
[0017] According to one embodiment of the present application, the first format is an integrated circuit built-in audio bus format, the second format is a universal serial bus format, the fifth interface is an integrated circuit bus interface, and the seventh interface and the eighth interface are both universal asynchronous receive and transmit serial ports.
[0018] According to one embodiment of the present application, both the first digital processing unit and the second digital processing unit adopt digital signal processors.
[0019] In a second aspect, the present application proposes a wireless microphone system, comprising: an external device, multiple microphones, and the audio processing apparatus described in the first aspect above.
[0020] In a third aspect, the present application proposes a vehicle, comprising: external equipment, including vehicle equipment; and the audio processing device described in the first aspect above.
[0021] The audio processing device, microphone system and vehicle of the embodiments of the present application receive audio data input by multiple microphones through a receiving module, and first pre-process the audio data through a processing module to implement basic audio processing, such as howling suppression, echo cancellation, etc., and then perform sound effect processing on the pre-processed audio data, such as harmony processing, automatic tuning, chorus effect, etc., and finally transmit the audio data after sound effect processing to an external device, which can meet more audio processing needs of users.
[0022] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 is a structural block diagram of an audio processing device according to an embodiment of the present application; Figure 2 is a structural schematic diagram of an audio processing device according to an embodiment of the present application; Figure 3 It is a structural diagram of an audio data transmission process of an audio processing device according to a specific embodiment of the present application; Figure 4 is a structural diagram of a pairing process of an audio processing device according to a specific embodiment of the present application; Figure 5 is a structural diagram of an audio processing device upgrade process according to a specific embodiment of the present application; Figure 6 is a structural schematic diagram of an audio processing device according to a specific embodiment of the present application; Figure 7 It is a structural block diagram of a vehicle according to an embodiment of the present application.
[0024] Reference numerals: Vehicle 1000, audio processing device 100, microphone 200, external device 300; First interface 1, second interface 2, third interface 3, fourth interface 4, fifth interface 5, sixth interface 6, seventh interface 7, eighth interface 8, receiving module 10, processing module 20, radio frequency chip 11, first processing sub-module 21, second processing sub-module 22, first digital processing unit 211, micro control unit 212, Bluetooth unit 213, second memory 214, second digital processing unit 221, first memory 222, third memory 223. DETAILED DESCRIPTION
[0025] Embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.
[0026] The audio processing device, microphone system and vehicle according to the embodiments of the present application are described below with reference to the accompanying drawings.
[0027] like Figure 1 As shown, the audio processing device 100 includes: a receiving module 10 and a processing module 20 .
[0028] Among them, the receiving module 10 is used to receive audio data input by multiple microphones 200 (which may be wireless microphones); the processing module 20 is used to pre-process the audio data, perform sound effect processing on the pre-processed audio data, and transmit the audio data after sound effect processing to an external device 300 (such as a vehicle equipment, a computer, etc.).
[0029] Exemplarily, preprocessing includes basic audio processing, such as at least one of howling suppression, equalizer (EQ) adjustment, echo cancellation, and dynamic compression. Optionally, preprocessing may also include noise suppression, filtering, etc. Sound effect processing includes at least one of echo reverberation, harmony processing, automatic tuning, chorus effect, pitch correction, scoring function, original vocal elimination, and vocal teaching.
[0030] In one embodiment, the number of microphones 200 is 2, and the processing module 20 may include two digital signal processors, one for preprocessing the audio data, and the other for performing sound effect processing on the preprocessed audio data, so that karaoke can be played with two microphones 200 at the same time.
[0031] The audio processing device 100 receives audio data input by multiple microphones 200 through a receiving module 10, and pre-processes the audio data through a processing module 20 to implement basic audio processing, such as howling suppression, echo cancellation, etc., and then performs sound effect processing on the pre-processed audio data, such as harmony processing, automatic tuning, chorus effect, etc., and finally transmits the audio data after sound effect processing to an external device 300, which can meet more audio processing needs of users.
[0032] In some embodiments of the present application, Figure 2 As shown, the receiving module 10 includes: a plurality of radio frequency chips 11 and a first interface 1 .
[0033] See also Figure 2 The plurality of RF chips 11 correspond to the plurality of microphones 200 one by one, and the RF chip 11 is used to receive the audio data in the form of RF signals input by the corresponding microphone 200, and convert the audio data in the form of RF signals into audio data in a first format. The first interface 1 is used to transmit the audio data in the first format to the processing module 20.
[0034] Exemplarily, the first format is an Inter-IC Sound (I2S) bus format. The I2S bus uses a design in which independent wires are used to transmit clock and data signals. By separating the data and clock signals, distortion caused by time difference can be avoided. Correspondingly, the first interface 1 is an I2S interface.
[0035] In one embodiment, the number of microphones 200 is 2, and the receiving module 10 correspondingly includes two RF chips 11. The I2S format audio data sent by the two RF chips 11 share an I2S interface, occupying the I2S left channel and the right channel respectively, thereby supporting two wireless microphones for karaoke at the same time.
[0036] In some embodiments of the present application, Figure 2 As shown, the processing module 20 includes: a first processing submodule 21 and a second processing submodule 22 .
[0037] See also Figure 2 The first processing submodule 21 is used to preprocess the audio data in the first format, convert the audio data after the sound effect processing into the audio data in the second format, and transmit the audio data in the second format to the external device 300. The second processing submodule 22 is used to perform sound effect processing on the preprocessed audio data.
[0038] Exemplarily, the second format is a Universal Serial Bus (USB) format, which can be used to achieve simple and fast connection with a variety of external devices, thereby facilitating users and reducing costs.
[0039] In one embodiment, see Figure 2 After the first processing submodule 21 receives the audio data in the I2S format transmitted by the receiving module 10, it performs preprocessing such as howling suppression, EQ adjustment, echo elimination, and dynamic compression on the audio data. After the preprocessing is completed, the preprocessed audio data is sent to the second processing submodule 22 in the I2S format. After receiving the audio data, the second processing submodule 22 performs harmony processing, automatic tuning, chorus effect, pitch correction, scoring function, original vocal elimination, vocal teaching and other sound effect processing on the audio. After the sound effect processing is completed, the audio data after sound effect processing is transmitted back to the first processing submodule 21 in the I2S format. After receiving the data, the first processing submodule 21 re-encodes the data and outputs the final audio data to the external device 300 in the USB format. Taking the external device 300 as a car machine device as an example, the delay of the entire car machine system processing (including the car machine power amplifier part) can be controlled within 50ms, thereby providing users with a high-quality karaoke experience.
[0040] Exemplarily, the sound effect processing method can be selected by the user. Karaoke software can be installed on the external device 300, and the user can select the required sound effect processing method, such as harmony processing, through the Karaoke software interface. When the user inputs audio data through the microphone, the audio processing device 100 can only perform harmony processing when performing sound effect processing on the audio data. Optionally, if the user does not select a sound effect processing method, the second processing submodule 22 can select all achievable sound effect processing methods, and also select one or more default sound effect processing methods.
[0041] In some embodiments of the present application, Figure 3 As shown, the first processing submodule 21 includes: a second interface 2 , a third interface 3 , a fourth interface 4 and a first digital processing unit 211 .
[0042] See also Figure 3 The second interface 2 is used to receive the audio data of the first format transmitted by the first interface 1. The third interface 3 is used to transmit the pre-processed audio data to the second processing submodule 22, and receive the audio data after the sound effect processing transmitted by the second processing submodule 22. The first digital processing unit 211 is used to pre-process the audio data of the first format, and convert the audio data after the sound effect processing into the audio data of the second format. The fourth interface 4 is used to transmit the audio data of the second format to the external device 300.
[0043] Exemplarily, the first digital processing unit 211 may be a digital signal processor (DSP).
[0044] In one embodiment, corresponding to the first format being the I2S format, the second interface 2 and the third interface 3 can both use the I2S interface; corresponding to the second format being the USB format, the fourth interface 4 can use the USB interface, which has a hot-swappable function and can connect to a variety of external devices 300.
[0045] In some embodiments of the present application, Figure 4 As shown, the first processing submodule 21 further includes: a fifth interface 5 and a micro control unit 212 .
[0046] The micro control unit 212 is used to send configuration information to the multiple radio frequency chips 11 through the fifth interface 5, so that each radio frequency chip 11 configures the working frequency point according to the configuration information.
[0047] Exemplarily, the fifth interface 5 is an Inter-Integrated Circuit (I2C) interface, which uses a bidirectional two-wire synchronous serial bus and has a simple communication method.
[0048] In one embodiment, see Figure 4 , the micro control unit 212 is responsible for initializing the receiving module 10. When the audio processing device 100 is powered on, the micro control unit 212 can send configuration information to multiple RF chips 11 in the receiving module 10 through the I2C interface, so that each RF chip 11 configures the working frequency according to the configuration information, thereby initializing the receiving module 10.
[0049] In some embodiments of the present application, Figure 4As shown, the first processing submodule 21 further includes: a Bluetooth unit 213 for establishing Bluetooth connection with the plurality of microphones 200 .
[0050] The micro control unit 212 is further used to send the working frequency of the corresponding RF chip 11 to each microphone 200 through the Bluetooth channel, so that the microphone 200 configures the RF module of the microphone 200 according to the received working frequency.
[0051] Specifically, the Bluetooth unit 213 is used to establish a Bluetooth connection with the microphone 200, and to pair the microphone with the RF chip 11 through the Bluetooth channel. The entire pairing process can be achieved in seconds. After pairing is completed, the microphone 200 transmits the audio through a specific frequency band (determined according to the working frequency) to the corresponding RF chip 11, and the RF chip 11 converts the received audio data in the form of RF signals into audio data in I2S format.
[0052] It should be noted that, taking the case where the number of RF chips 11 is 2 as an example, the above-mentioned multiple RF chips 11 correspond one-to-one with multiple microphones 200, which means that two RF chips 11 can be connected to two microphones 200 at the same time, but the two RF chips 11 have the function of connecting to multiple different microphones 200. In other words, the microphone 200 connected to the RF chip 11 is not fixed, and any microphone 200 that has a RF module and can configure the RF module according to the working frequency of the RF chip 11 can be connected to the RF chip 11.
[0053] In one embodiment, the microcontroller unit 212 is also used to: determine that the first identity information sent by the microphone 200 is received before sending the working frequency to the microphone 200, and disconnect the corresponding Bluetooth connection when the Bluetooth connection is determined to be incorrect based on the first identity information; and / or send second identity information to the microphone 200 so that the microphone 200 disconnects the corresponding Bluetooth connection when the Bluetooth connection is determined to be incorrect based on the second identity information.
[0054] Specifically, when pairing, see Figure 4After the audio processing device 100 is powered on, the microcontroller unit 212 initializes the frequency information of the radio frequency chip 11 in the receiving module 10, and the Bluetooth unit 213 (as the master device) continuously scans the Bluetooth connection with the Bluetooth module of the microphone 200 (as the slave device) through broadcasting, so as to establish a two-way Bluetooth transmission data channel (i.e., Bluetooth channel). After the Bluetooth connection is completed, the microphone 200 immediately sends its own identity ID (i.e., the first identity information) to the microcontroller unit 212. After receiving the microphone ID, the microcontroller unit 212 can determine whether the microphone ID is in the blacklist (which can be configured by the external device 300). If so, it is determined that the Bluetooth connection is incorrect, and the Bluetooth connection is disconnected. Otherwise, the receiver ID (i.e., the second identity information) and the initialization configuration of the working frequency of the radio frequency chip 11 are sent to the microphone 200. After receiving the receiver ID and the working frequency, the microphone 200 can execute the following process: When the receiver ID exists and matches, the radio frequency module is configured with the received working frequency, thereby quickly pairing with the radio frequency chip 11; When the receiver ID exists but does not match (such as in the blacklist), disconnect the Bluetooth connection to prevent misconnection; When the receiver ID does not exist, the receiver ID information is saved and the own RF module is configured with the received working frequency, so as to quickly pair with the RF chip 11.
[0055] The entire pairing process can be completed in less than 1 second. At the same time, by setting a blacklist, malicious connections (i.e., microphones 200 that are not allowed to be connected to the external device 300, etc.) can be blocked, thereby protecting the privacy of the user of the terminal where the external device 300 is located, such as the privacy of the vehicle occupants where the vehicle equipment is located.
[0056] It should be noted that after completing the above pairing process for the first time, the microphone 200 can obtain the working frequency point. When the audio processing device 100 works next time, the microphone 200 can work based on the working frequency point, and there is no need to pair again.
[0057] Exemplarily, the transmission power of the Bluetooth unit 213 is determined according to the spatial range in which the external device 300 is located.
[0058] By attenuating the transmission power of the Bluetooth unit 213 and shrinking the Bluetooth connection range within the spatial range of the external device 300 (such as the interior range of the vehicle), hardware prevention of misconnection can be achieved.
[0059] In some embodiments of the present application, Figure 3 , Figure 5 As shown, the second processing submodule 22 includes: a sixth interface 6 , a second digital processing unit 221 and a first memory 222 .
[0060] Among them, the sixth interface 6 is used to receive the pre-processed audio data transmitted by the third interface 3, and to transmit the audio data processed with sound effects to the third interface 3; the second digital processing unit 221 is used to perform sound effect processing on the pre-processed audio data; and the first memory 222 is used to cache the intermediate data of the sound effect processing process.
[0061] Exemplarily, the third interface 3 is an I2S interface, and the sixth interface 6 is also an I2S interface. The second digital processing unit 221 may be a digital signal processor (DSP), which may communicate with the first memory 222 via a serial peripheral interface (SPI).
[0062] In one embodiment, Figure 6 As shown, the DSP used by the first digital processing unit 211 is recorded as the secondary DSP; the DSP used by the second digital processing unit 221 is recorded as the main DSP, which can be a quad-core processor and is provided with a first memory 222, such as a pseudo static random access memory (PSRAM). The introduction of the main DSP and the secondary DSP of the integrated MCU (microcontrol unit 212) and Bluetooth unit 213 together constitute a dual-DSP controlled audio processing device, which strengthens the algorithm resources and provides resource support for a more powerful karaoke system. It can add echo reverberation, harmony processing, automatic tuning, chorus effect, pitch correction, hardware scoring function, original vocal elimination, vocal teaching and other functions to the existing karaoke system functions.
[0063] In some embodiments of the present application, the micro control unit 212 is also used to: receive first upgrade data sent by the external device 300 through the fourth interface 4; send the first upgrade data to multiple microphones 200 through the Bluetooth channel, so that the multiple microphones 200 are upgraded according to the first upgrade data.
[0064] In some embodiments of the present application, Figure 5 As shown, the first processing submodule 21 further includes a second memory 214 and a seventh interface 7 , and the second processing submodule 22 further includes a third memory 223 and an eighth interface 8 .
[0065] In this embodiment, the microcontroller unit 212 is also used to: receive second upgrade data issued by the external device 300 through the fourth interface 4, wherein the second upgrade data includes a first upgrade package and a second upgrade package; write the first upgrade package to the second memory 214 to upgrade the first processing sub-module 21, and transmit the second upgrade package to the second digital processing unit 221 through the seventh interface 7 and the eighth interface 8, so that the second digital processing unit 221 writes the second upgrade package to the third memory 223 to upgrade the second processing sub-module 22.
[0066] Exemplarily, the seventh interface 7 and the eighth interface 8 are Universal Asynchronous Receiver / Transmitter (URAT) serial ports. The URAT interface only needs two lines to complete communication, which is simple and easy to implement. The second digital processing unit 221 can perform SPI communication with the third memory 223.
[0067] In one embodiment, see Figure 5 , Figure 6 The microphone 200 is provided with a flash memory, a Bluetooth module and a built-in microcontroller. When the microphone 200 is upgraded, the external device 300 sends the first upgrade data to the microcontroller unit 212, the microcontroller unit 212 sends an upgrade instruction and transmits the first upgrade data to the microphone 200 through the Bluetooth channel, and after receiving the upgrade instruction and data, the built-in microcontroller of the microphone 200 writes the first upgrade data to the flash memory to achieve the upgrade.
[0068] When upgrading the receiver (i.e., the processing module 20), the external device 300 sends the second upgrade data to the micro control unit 212. The micro control unit 212 sends the second upgrade package in the second upgrade data to the main DSP and writes it to the third memory 223 (such as a Flash memory); on the other hand, it writes the first upgrade package in the second upgrade data to the second memory 214 (such as an internal Flash). After the data is written, the micro control unit 212 sends an upgrade success message to the external device 300.
[0069] Thus, an Over-The-Air (OTA) upgrade of the microphone 200 and the processing module 20 is achieved.
[0070] In one embodiment, each structure in the first processing submodule 21, including the first digital processing unit 211, the micro control unit 212, the Bluetooth unit 213, the second memory 214, and each interface, can be integrated, such as being implemented by a single chip, thereby saving material costs.
[0071] The audio processing device of the embodiment of the present application can add higher DSP computing power to the wireless microphone karaoke system, and add functions such as harmony processing, automatic tuning, chorus effect, pitch correction, scoring function, original singer's vocal elimination, vocal teaching, etc. The dual DSP system can also simulate more usage scenarios such as KTV, concert halls, recording studios, choirs, etc., which can enrich the user experience. At the same time, it can also provide online teaching to customers, improve users' singing level, and bring users a better karaoke experience.
[0072] Based on the audio processing device 100 of the above embodiment, the present application proposes a microphone system.
[0073] See also Figure 1 The microphone system includes: an external device 300, a plurality of microphones 200, and the audio processing apparatus 100 of the above embodiment.
[0074] Based on the audio processing device 100 of the above embodiment, the present application also proposes a vehicle.
[0075] like Figure 7 As shown, the vehicle 1000 includes: external equipment 300, including vehicle equipment; and the audio processing device 100 of the above embodiment.
[0076] It should be understood that the various parts of the present application can be implemented by hardware, software, firmware or a combination thereof. In the above-mentioned embodiments, multiple steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, as in another embodiment, it can be implemented by any one of the following technologies known in the art or their combination: a discrete logic circuit having a logic gate circuit for implementing a logic function for a data signal, a dedicated integrated circuit having a suitable combination of logic gate circuits, a programmable gate array (PGA), a field programmable gate array (FPGA), etc.
[0077] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.
[0078] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0079] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0080] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0081] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0082] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.
Claims
1. An audio processing device, characterized in that: include: A receiving module, used for receiving audio data inputted by multiple microphones; The processing module is used to pre-process the audio data, perform sound effect processing on the pre-processed audio data, and transmit the audio data after the sound effect processing to an external device.
2. The audio processing device according to claim 1, characterized in that The receiving module comprises: A plurality of radio frequency chips, each of the plurality of radio frequency chips corresponds to the plurality of microphones one by one, and the radio frequency chips are used to receive audio data in the form of radio frequency signals input by the corresponding microphones, and convert the audio data in the form of radio frequency signals into audio data in a first format; The first interface is used to transmit the audio data in the first format to the processing module.
3. The audio processing device according to claim 2, characterized in that: The processing module comprises: A first processing submodule, configured to pre-process the audio data in the first format, convert the audio data after the sound effect processing into audio data in a second format, and transmit the audio data in the second format to the external device; The second processing submodule is used to perform sound effect processing on the preprocessed audio data.
4. The audio processing device according to claim 3, characterized in that: The first processing submodule includes: A second interface, used for receiving audio data in the first format transmitted by the first interface; a third interface, used for transmitting the pre-processed audio data to the second processing submodule, and receiving the audio data after the sound effect processing transmitted by the second processing submodule; A first digital processing unit, configured to pre-process the audio data in the first format, and convert the audio data after the sound effect processing into audio data in the second format; The fourth interface is used to transmit the audio data in the second format to the external device.
5. The audio processing device according to claim 4, characterized in that: The first processing submodule further includes: The fifth interface; The micro control unit is used to send configuration information to the plurality of radio frequency chips through the fifth interface, so that each radio frequency chip configures an operating frequency point according to the configuration information.
6. The audio processing device according to claim 5, characterized in that: The first processing submodule further includes: A Bluetooth unit, used for establishing a Bluetooth connection with the plurality of microphones; The micro control unit is further used to send the working frequency of the corresponding radio frequency chip to each microphone through the Bluetooth channel, so that the microphone configures the radio frequency module of the microphone according to the received working frequency.
7. The audio processing device according to claim 6, characterized in that: The micro control unit is also used for: Before sending the working frequency point to the microphone, determine that the first identity information sent by the microphone is received, and when determining that the Bluetooth connection is incorrect according to the first identity information, disconnect the corresponding Bluetooth connection; and / or The second identity information is sent to the microphone, so that the microphone disconnects the corresponding Bluetooth connection when determining that the Bluetooth connection is incorrect according to the second identity information.
8. The audio processing device according to claim 6, characterized in that: The transmission power of the Bluetooth unit is determined according to the spatial range of the external device.
9. The audio processing device according to claim 6, characterized in that: The micro control unit is also used for: receiving, through the fourth interface, first upgrade data sent by the external device; The first upgrade data is sent to the plurality of microphones through the Bluetooth channel, so that the plurality of microphones are upgraded according to the first upgrade data.
10. The audio processing device according to claim 5, characterized in that: The second processing submodule includes: A sixth interface, used for receiving the pre-processed audio data transmitted by the third interface, and transmitting the audio data after the sound effect processing to the third interface; A second digital processing unit, used for performing sound effect processing on the pre-processed audio data; The first memory is used to cache the intermediate data of the sound effect processing process.
11. The audio processing device according to claim 10, characterized in that: The first processing submodule further includes a second memory and a seventh interface, and the second processing submodule further includes a third memory and an eighth interface; the micro control unit is further used for: receiving, through the fourth interface, second upgrade data sent by the external device, wherein the second upgrade data includes a first upgrade package and a second upgrade package; The first upgrade package is written to the second memory to upgrade the first processing sub-module, and the second upgrade package is transmitted to the second digital processing unit through the seventh interface and the eighth interface, so that the second digital processing unit writes the second upgrade package to the third memory to upgrade the second processing sub-module.
12. The audio processing device according to any one of claims 1 to 11, characterized in that: The pre-processing includes at least one of howling suppression, equalizer adjustment, echo cancellation, and dynamic compression.
13. The audio processing device according to claim 12, characterized in that: The sound effect processing includes at least one of echo reverberation, harmony processing, automatic tuning, chorus effect, pitch correction, scoring function, original singer's vocal elimination, and vocal teaching.
14. The audio processing device according to claim 11, characterized in that: The first format is an integrated circuit built-in audio bus format, the second format is a universal serial bus format, the fifth interface is an integrated circuit bus interface, and the seventh interface and the eighth interface are both universal asynchronous receiver and transmitter serial ports.
15. The audio processing device according to claim 10, characterized in that: The first digital processing unit and the second digital processing unit both adopt digital signal processors.
16. A microphone system, characterized in that: include: An external device, a plurality of microphones, and the audio processing apparatus as claimed in any one of claims 1 to 15.
17. A vehicle, characterized in that: include: External equipment, including vehicle equipment; as well as An audio processing device as claimed in any one of claims 1 to 15.
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