Self-adaptive thermal switch temperature control device

Abstract

The self-adaptive thermal switch temperature control device comprises a heat preservation layer, a heat dissipation circuit board, a heat conduction device, a pressing plate and a heat dissipation plate, and an opening penetrating through the inside and the outside is formed in the surface of one side of the heat preservation layer; the heat dissipation circuit board and the heat conduction device are fixedly installed in the heat preservation layer, the heat conduction device is located between the heat dissipation circuit board and the opening, and the upper side of the heat conduction device is attached to the heat dissipation circuit board. The heat dissipation plate is located on one side of the heat preservation layer and connected with the heat conduction device through the contraction assembly. The pressing plate is located between the heat dissipation plate and the heat preservation layer and connected with the heat conduction device through a heating expansion piece, and the pressing plate can move to be attached to the heat dissipation plate under the action of the heating expansion piece. The device has the beneficial effects that the structure is simple, the design is reasonable, and the electronic equipment can meet the high-temperature working condition heat dissipation condition and the low-temperature working condition heat preservation condition in the near space; under the condition that the working temperature required by the electronic equipment is met, power consumption required by equipment temperature control can be greatly saved, and the requirement for zero power consumption of the temperature control device is met.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of electronic devices, and particularly relates to an adaptive thermal switch temperature control device. Background Art

[0002] The environmental conditions of electronic devices operating in the near space are extremely harsh, with the temperature range reaching -90°C to 55°C. At the same time, the electronic devices also face strict power consumption limitations. Summary of the Invention

[0003] The present invention provides an adaptive thermal switch temperature control device, aiming to solve the problems in the prior art.

[0004] The technical solution of the present invention for solving the above technical problems is as follows:

[0005] An adaptive thermal switch temperature control device includes a heat insulation layer, a heat dissipation circuit board, a heat conductor, a pressing plate, and a heat dissipation plate. One side surface of the heat insulation layer is provided with an opening that penetrates inside and outside; the heat dissipation circuit board and the heat conductor are respectively fixedly installed in the heat insulation layer. The heat conductor is located between the heat dissipation circuit board and the opening, and its upper side is attached to the heat dissipation circuit board;

[0006] The heat dissipation plate is located on one side of the heat insulation layer and is connected to the heat conductor through a contraction component; the pressing plate is located between the heat dissipation plate and the heat insulation layer and is connected to the heat conductor through a heat expansion component. The pressing plate can be moved to be attached to the heat dissipation plate under the action of the heat expansion component.

[0007] The beneficial effect of the present invention is that during use, the heating chip on the heat dissipation circuit board transfers heat to the heat expansion component through the heat conductor. The heat expansion component is heated, causing the pressing plate to move to be attached to the heat dissipation plate for heat dissipation operation, which is convenient for heat dissipation.

[0008] The structure of the present invention is simple and reasonably designed, enabling the electronic device to meet both the heat dissipation conditions under high-temperature working conditions and the heat insulation conditions under low-temperature working conditions in the near space; this invention can also greatly save the power consumption required for device temperature control and meet the requirement of zero power consumption for the temperature control device while meeting the required working temperature conditions of the electronic device.

[0009] On the basis of the above technical solution, the present invention can be further improved as follows.

[0010] Further, the heat conductor includes a heat conduction structure member. The heat conduction structure member is installed in the heat insulation layer, and one side of it is attached to the heat dissipation circuit board; the contraction component and the heat expansion component are respectively connected to the heat conduction structure member.

[0011] The beneficial effect of adopting the above further solution is that during use, the heating chips on the heat dissipation circuit board transfer heat to the heat-expandable member through the heat conduction structural member. The heat-expandable member expands due to heat, causing the pressing plate to move into contact with the heat dissipation plate for heat dissipation operation, which is convenient for heat dissipation.

[0012] Furthermore, a plurality of bosses are evenly spaced on the side of the heat conduction structural member close to the heat dissipation circuit board, and the plurality of bosses are respectively connected to the heat dissipation circuit board.

[0013] The beneficial effect of adopting the above further solution is that the structure is simple and the design is reasonable. The heating chips on the heat dissipation circuit board transfer heat to the heat-expandable member through the plurality of bosses, which is convenient for heat conduction.

[0014] Furthermore, the heat conductor further includes a graphene film, which is fixedly installed at the opening and is attached to the side of the heat conduction structural member away from the heat dissipation circuit board; the contraction assembly and the heat-expandable member are respectively connected to the graphene film.

[0015] The beneficial effect of adopting the above further solution is that during use, the heating chips on the heat dissipation circuit board transfer heat to the graphene film through the heat conduction structural member, and the graphene film then transfers the heat to the heat-expandable member. The heat-expandable member expands due to heat, causing the pressing plate to move into contact with the heat dissipation plate for heat dissipation operation, which is convenient for heat dissipation.

[0016] Furthermore, the heat-expandable member includes at least one thermal switch, and each thermal switch includes a housing and a piston rod. One end of the housing is fixedly connected to the heat conductor, and the other end is provided with a through hole; the piston rod is installed at the through hole, and one end of it is fixedly connected to the pressing plate; the housing is filled with an expansion liquid, and the expansion liquid expands due to heat to push the piston rod to move.

[0017] The beneficial effect of adopting the above further solution is that during use, the heating chips on the heat dissipation circuit board transfer heat to the graphene film through the heat conduction structural member, and the graphene film then transfers the heat to the thermal switch. The expansion liquid in the thermal switch expands due to heat, causing the piston rod to move, and the piston rod drives the pressing plate to move into contact with the heat dissipation plate for heat dissipation operation, which is convenient for heat dissipation.

[0018] Furthermore, the piston rod has a structure with one end thin and the other end thick, and a liquid injection channel is provided inside the piston rod; a liquid injection hole is provided at the other end of the piston rod, and a liquid injection screw is installed at the liquid injection hole.

[0019] The beneficial effect of adopting the above further solution is that the structure is simple, the shape of the piston rod is reasonably designed, which is convenient for assembly, and it can ensure that the piston rod will not slip off the housing;

[0020] In addition, the expansion liquid can be injected into the housing through the liquid injection hole and the liquid injection channel described above.

[0021] Furthermore, the heat-expandable member includes two of the thermal switches, and two stoppers are relatively fixedly mounted on the pressing plate; one ends of the two piston rods are respectively connected to the two stoppers.

[0022] The beneficial effect of adopting the above further solution is that the structure is simple and reasonable in design. One ends of the two piston rods are respectively connected to the pressing plate by using the stoppers, which is convenient for assembly.

[0023] Furthermore, slots are respectively provided on the two stoppers, and a pair of insertion holes are respectively provided in the two slots; one ends of the two piston rods are respectively inserted into the two slots, and through holes are respectively provided thereon. The two through holes are respectively communicated with the two pairs of insertion holes; two pins are respectively inserted into the two through holes and the two pairs of insertion holes to connect one ends of the two piston rods with the two stoppers.

[0024] The beneficial effect of adopting the above further solution is that the structure is simple and reasonable in design. During assembly, one ends of the two piston rods are respectively inserted into the through holes on the two stoppers, so that the two through holes are respectively communicated with the two pairs of insertion holes, and then the two pins are respectively inserted into the two through holes and the two pairs of insertion holes to connect one ends of the two piston rods with the two stoppers. The operation is simple, time-saving and labor-saving.

[0025] Furthermore, the contraction assembly includes multiple pairs of contraction rods and springs. The multiple contraction rods are evenly spaced along the edge of the heat dissipation plate. They respectively penetrate through the pressing plate, and their two ends are respectively fixedly connected to the heat conductor and the heat dissipation plate; the multiple springs are slidably sleeved on the multiple contraction rods, and their two ends respectively abut against the pressing plate and the heat conductor.

[0026] The beneficial effect of adopting the above further solution is that the structure is simple and reasonable in design. When the pressing plate moves to fit with the heat dissipation plate, the springs ensure the stable operation of the pressing plate.

[0027] Furthermore, abutting blocks are respectively slidably sleeved on the multiple contraction rods, and two ends of the multiple abutting blocks are respectively fixedly connected to one ends of the multiple springs and the pressing plate.

[0028] The beneficial effect of adopting the above further solution is that the structure is simple and reasonable in design. The abutting blocks can prevent the direct contact between the springs and the pressing plate and protect the pressing plate. Description of the Drawings

[0029] Figure 1 is one of the overall structural schematic diagrams of the present invention;

[0030] Figure 2 is the other overall structural schematic diagram of the present invention;

[0031] Figure 3 is a half-sectional view of the present invention;

[0032] Figure 4 is a schematic diagram of a partial structure of the present invention;

[0033] Figure 5 is a front view of the thermal switch in the present invention;

[0034] Figure 6 is a half-sectional view of the thermal switch in the present invention;

[0035] Figure 7 is a schematic diagram of the internal structure of the thermal switch in the present invention;

[0036] Figure 8 is a schematic diagram of the structure during the heat dissipation process of the present invention;

[0037] Figure 9 is a schematic diagram of the structure during the heat preservation process of the present invention.

[0038] In the attached drawings, the list of components represented by each reference numeral is as follows:

[0039] 1. Heat preservation layer; 2. Heat dissipation circuit board; 3. Pressing plate; 4. Heat dissipation plate; 5. Heat conduction structure member; 6. Graphene film; 7. Thermal switch; 71. Outer shell; 72. Piston rod; 73. Liquid injection channel; 74. Liquid injection hole; 75. Liquid injection screw; 76. Stopper; 8. Shrinkage rod; 9. Spring; 10. Contact block; 11. Piston seal ring; 12. Housing seal ring. Specific embodiments

[0040] It should be noted that, without conflict, the embodiments in the present invention and the features in the embodiments can be combined with each other.

[0041] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the attached drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first", "second", etc. can explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0042] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with embodiments.

[0044] Embodiment 1

[0045] As Figures 1 to 9 shown, this embodiment provides an adaptive thermal switch temperature control device, which includes a heat insulation layer 1, a heat dissipation circuit board 2, a heat conductor, a pressing plate 3, and a heat dissipation plate 4. One side surface of the heat insulation layer 1 is provided with an opening that penetrates inside and outside; the heat dissipation circuit board 2 and the heat conductor are respectively fixedly installed in the heat insulation layer 1. The heat conductor is located between the heat dissipation circuit board 2 and the opening, and its upper side is attached to the heat dissipation circuit board 2.

[0046] The heat dissipation plate 4 is located on one side of the heat insulation layer 1 and is connected to the heat conductor through a contraction component; the pressing plate 3 is located between the heat dissipation plate 4 and the heat insulation layer 1 and is connected to the heat conductor through a heat expansion component. Under the action of the heat expansion component, the pressing plate 3 can move to be attached to the heat dissipation plate 4.

[0047] During use, the heating chip on the heat dissipation circuit board 2 transfers heat to the heat expansion component through the heat conductor. The heat expansion component is heated, causing the pressing plate 3 to move to be attached to the heat dissipation plate 4 for heat dissipation operation, which is convenient for heat dissipation.

[0048] Preferably, in this embodiment, the heat insulation layer 1 is preferably in the shape of a rectangular box.

[0049] Preferably, in this embodiment, the pressing plate 3 and the heat dissipation plate 4 are respectively preferably in the shape of a rectangular plate.

[0050] In addition, the pressing plate 3 and the heat dissipation plate 4 have the same size.

[0051] The structure of this embodiment is simple and reasonably designed, enabling the electronic device to meet both the heat dissipation conditions under high-temperature working conditions and the heat insulation conditions under low-temperature working conditions in the near space; this invention can also greatly save the power consumption required for device temperature control while meeting the required working temperature conditions of the electronic device, achieving the requirement of zero power consumption for the temperature control device.

[0052] Embodiment 2

[0053] Based on Embodiment 1, in this embodiment, the heat conductor includes a heat conduction structural member 5, the heat conduction structural member 5 is installed in the heat insulation layer 1, and one side thereof is attached to the heat dissipation circuit board 2; the contraction assembly and the heat expansion member are respectively connected to the heat conduction structural member 5.

[0054] During use, the heating chip on the heat dissipation circuit board 2 transfers heat to the heat expansion member through the heat conduction structural member 5. The heat expansion member is heated to cause the pressing plate 3 to move into contact with the heat dissipation plate 4 for heat dissipation operation, which is convenient for heat dissipation.

[0055] Embodiment 3

[0056] Based on Embodiment 2, in this embodiment, a plurality of bosses are evenly spaced on one side of the heat conduction structural member 5 close to the heat dissipation circuit board 2, and the plurality of bosses are respectively connected to the heat dissipation circuit board 2.

[0057] This solution has a simple structure and reasonable design. The heating chip on the heat dissipation circuit board 2 transfers heat to the heat expansion member through the plurality of bosses, which is convenient for heat conduction.

[0058] Embodiment 4

[0059] Based on any one of Embodiments 2 to 3, in this embodiment, the heat conductor further includes a graphene film 6, the graphene film 6 is fixedly installed at the opening, and it is attached to one side of the heat conduction structural member 5 away from the heat dissipation circuit board 2; the contraction assembly and the heat expansion member are respectively connected to the graphene film 6.

[0060] During use, the heating chip on the heat dissipation circuit board 2 transfers heat to the graphene film 6 through the heat conduction structural member 5, and the graphene film 6 then transfers the heat to the heat expansion member. The heat expansion member is heated to cause the pressing plate 3 to move into contact with the heat dissipation plate 4 for heat dissipation operation, which is convenient for heat dissipation.

[0061] Embodiment 5

[0062] Based on the above embodiments, in this embodiment, the heat expansion member includes at least one thermal switch 7, and each thermal switch 7 includes a housing 71 and a piston rod 72. One end of the housing 71 is fixedly connected to the heat conductor, and the other end is provided with a through hole; the piston rod 72 is installed at the through hole, and one end thereof is fixedly connected to the pressing plate 3; the housing 71 is filled with an expansion liquid, and the expansion liquid expands when heated to push the piston rod 72 to move.

[0063] During use, the heating chips on the heat dissipation circuit board 2 transfer heat to the graphene film 6 through the heat conduction structure 5, and the graphene film 6 then transfers the heat to the thermal switch 7. The expansion liquid in the thermal switch 7 expands when heated, causing the piston rod 72 to move. The piston rod 72 drives the pressing plate 3 to move into contact with the heat dissipation plate 4 for heat dissipation operation, which is convenient for heat dissipation.

[0064] Preferably, in this embodiment, the above-mentioned outer shell 71 is preferably in the shape of a shell with one end thick and the other end thin, and the piston rod 72 is located at the thin end of the outer shell 71.

[0065] In addition, the above-mentioned outer shell 71 includes a bottom plate and a shell. One end of the shell is open and is connected to the bottom plate by screws, and the through hole is located at the other end of the shell.

[0066] Preferably, in this embodiment, the above-mentioned expansion liquid uses liquid paraffin.

[0067] Embodiment 6

[0068] Based on Embodiment 5, in this embodiment, the piston rod 72 has a structure with one end thin and the other end thick, and a liquid injection channel 73 is provided inside the piston rod 72; a liquid injection hole 74 is provided at the other end of the piston rod 72, and a liquid injection screw 75 is installed at the liquid injection hole 74.

[0069] This solution has a simple structure, a reasonable shape design of the piston rod 72, is convenient for assembly, and can ensure that the piston rod 72 will not slip off the outer shell 71;

[0070] In addition, the expansion liquid can be injected into the outer shell 71 through the liquid injection hole 74 and the liquid injection channel 73.

[0071] Preferably, in this embodiment, a ring groove is provided at the other end of the piston rod 72, and a piston seal ring 11 is installed in the ring groove.

[0072] In addition, a shell seal ring 12 is installed between one end of the above-mentioned shell and the bottom plate.

[0073] Embodiment 7

[0074] Based on any one of Embodiments 5 to 6, in this embodiment, the heat expansion member includes two of the above-mentioned thermal switches 7, and two stoppers 76 are relatively fixedly installed on the pressing plate 3; one ends of the two piston rods 72 are respectively connected to the two stoppers 76.

[0075] This solution has a simple structure and a reasonable design. One ends of the two piston rods 72 are respectively connected to the pressing plate 3 by using the stoppers 76, which is convenient for assembly.

[0076] Preferably, in this embodiment, the two stoppers 76 are respectively preferably blocks with a circular cross-section.

[0077] Example 8

[0078] On the basis of Example 7, in this example, slots are respectively provided on two of the stoppers 76, and a pair of jacks are respectively provided in the two slots; one ends of the two piston rods 72 are respectively inserted into the two slots, and through holes are respectively provided thereon, and the two through holes are respectively communicated with the two pairs of jacks; two pins are respectively inserted into the two through holes and the two pairs of jacks to connect one ends of the two piston rods 72 with the two stoppers 76.

[0079] This solution has a simple structure and reasonable design. During assembly, one ends of the two piston rods 72 are respectively inserted into the through holes on the two stoppers 76, so that the two through holes are respectively communicated with the two pairs of jacks, and then the two pins are respectively inserted into the two through holes and the two pairs of jacks to connect one ends of the two piston rods 72 with the two stoppers 76, with simple operation, time-saving and labor-saving.

[0080] Example 9

[0081] On the basis of the above embodiments, in this example, the contraction assembly includes multiple pairs of contraction rods 8 and springs 9. The multiple contraction rods 8 are evenly spaced along the edge of the heat dissipation plate 4, and they respectively penetrate through the pressing plate 3, and their two ends are respectively fixedly connected to the heat conductor and the heat dissipation plate 4; the multiple springs 9 are slidably sleeved on the multiple contraction rods 8, and their two ends respectively abut against the pressing plate 3 and the heat conductor.

[0082] This solution has a simple structure and reasonable design. When the pressing plate 3 moves to fit with the heat dissipation plate 4, the spring 9 ensures the stable operation of the pressing plate 3.

[0083] Preferably, in this example, the number of the above-mentioned contraction rods 8 is preferably four, and the four contraction rods 8 are respectively distributed at the four corners of the heat dissipation plate 4.

[0084] Example 10

[0085] On the basis of Example 9, in this example, abutting blocks 10 are respectively slidably sleeved on the multiple contraction rods 8, and two ends of the multiple abutting blocks 10 are respectively fixedly connected to one ends of the multiple springs 9 and the pressing plate 3.

[0086] This solution has a simple structure and reasonable design. The abutting blocks 10 can prevent the direct contact between the spring 9 and the pressing plate 3 and protect the pressing plate 3.

[0087] Preferably, in this example, the multiple above-mentioned abutting blocks 10 are respectively preferably blocks with a circular cross-section.

[0088] It should be noted that the multiple above-mentioned springs 9 always pull the pressing plate 3 upward.

[0089] The working principle of the present invention is as follows:

[0090] (1) Heat dissipation operation process (heat dissipation in an external high-temperature environment, the thermal switch is in the extended state):

[0091] The heating chip on the heat dissipation circuit board 2 transfers heat to the graphene film 6 through the boss on the heat conduction structure member 5, and the graphene film 6 then transfers the heat to the graphene film at the pressing plate 3. The extended-state thermal switch makes the graphene film 6 on the pressing plate 3 contact the heat dissipation plate 4, and transfers the heat on the graphene film 6 to the outside through the heat dissipation plate 4, enabling the temperature control device to meet the heat dissipation function (refer to Figure 8 ).

[0092] (2) Heat preservation operation process (heat preservation in an external low-temperature environment, the thermal switch is in the retracted state):

[0093] The retracted-state thermal switch disconnects the graphene film 6 from the heat dissipation plate 4, so that the heat on the graphene film 6 is not transferred to the outside through the heat dissipation plate 4. At the same time, under the heat preservation effect of the heat preservation layer, the temperature control device meets the heat preservation function (refer to Figure 9 ).

[0094] The advantages of the self-adaptive thermal switch temperature control and heat dissipation device provided by the present invention are as follows:

[0095] (1) This invention utilizes the operating states of the thermal switch at different ambient temperatures to enable the temperature control device to not only meet the heat dissipation requirement at high temperatures but also the heat preservation requirement at low temperatures, greatly saving the power consumption required for device temperature control and achieving the requirement of zero power consumption for the temperature control device.

[0096] (2) This invention has a compact and simple structure. By adjusting the type or proportion of the liquid in the thermal switch, the device can be made suitable for temperature control requirements in different ambient temperatures, with high reliability and strong versatility.

[0097] (3) This invention is not only applicable to the near space but also to other harsh environments such as space, featuring a wide range of applications.

[0098] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above-described exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms. Therefore, from any perspective, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be encompassed within the present invention. Any reference signs in the claims should not be regarded as limiting the claims involved.

[0099] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative manner of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0100] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An adaptive thermal switch temperature control device, characterized in that: The invention comprises a heat-insulating layer (1), a heat-dissipating circuit board (2), a heat conductor, a pressing plate (3) and a heat-dissipating plate (4); a surface of one side of the heat-insulating layer (1) is provided with an opening penetrating inside and outside; the heat-dissipating circuit board (2) and the heat conductor are respectively fixedly mounted in the heat-insulating layer (1); the heat conductor is located between the heat-dissipating circuit board (2) and the opening, and its upper side is in contact with the heat-dissipating circuit board (2); The heat sink (4) is located on one side of the thermal insulation layer (1), and is connected to the heat conductor via a shrink assembly; the pressure plate (3) is located between the heat sink (4) and the thermal insulation layer (1), and is connected to the heat conductor via a heat-expanding component; the pressure plate (3) can be moved to fit the heat sink (4) under the action of the heat-expanding component.

2. The adaptive thermal switch temperature control device according to claim 1, characterized in that: The heat conductor comprises a heat-conducting structural component (5), the heat-conducting structural component (5) is installed in the thermal insulation layer (1), and one side of the heat-conducting structural component is in contact with the heat-dissipating circuit board (2); the shrinking component and the heat-expanding component are respectively connected to the heat-conducting structural component (5).

3. The adaptive thermal switch temperature control device according to claim 2, characterized in that: A plurality of bosses are evenly spaced apart on one side of the heat-conducting structural component (5) close to the heat-dissipating circuit board (2), and the plurality of bosses are respectively connected to the heat-dissipating circuit board (2).

4. The adaptive thermal switch temperature control device according to claim 2, characterized in that: The heat conductor also includes a graphene film (6), which is fixedly mounted at the opening and abuts against a side of the heat-conducting structural component (5) away from the heat dissipation circuit board (2); the shrinking component and the heat-expanding component are respectively connected to the graphene film (6).

5. The adaptive thermal switch temperature control device according to any one of claims 1 to 4, characterized in that: The heat-expandable component comprises at least one thermal switch (7), each of the thermal switches (7) comprising an outer shell (71) and a piston rod (72), one end of the outer shell (71) being fixedly connected to the heat conductor, and the other end being provided with a through hole; the piston rod (72) being installed at the through hole, and one end of the piston rod (72) being fixedly connected to the pressure plate (3); the outer shell (71) is filled with an expansion fluid, and the expansion fluid can push the piston rod (72) to move when it expands due to heat.

6. The adaptive thermal switch temperature control device according to claim 5, characterized in that: The piston rod (72) is thin at one end and thick at the other end, and a liquid injection channel (73) is provided inside the piston rod (72); a liquid injection hole (74) is provided inside the other end of the piston rod (72), and a liquid injection screw (75) is installed at the liquid injection hole (74).

7. The adaptive thermal switch temperature control device according to claim 5, characterized in that: The heat-expandable component comprises two thermal switches (7), and two stoppers (76) are relatively fixedly mounted on the pressure plate (3); one end of the two piston rods (72) is respectively connected to the two stoppers (76).

8. The adaptive thermal switch temperature control device according to claim 7, characterized in that: The two stoppers (76) are respectively provided with a slot, and a pair of insertion holes are respectively provided in the two slots; one end of the two piston rods (72) is respectively inserted into the two slots, and a through hole is respectively provided thereon, and the two through holes are respectively connected with the two pairs of insertion holes; two latches are respectively inserted into the two through holes and the two pairs of insertion holes to connect one end of the two piston rods (72) and the two stoppers (76).

9. The adaptive thermal switch temperature control device according to any one of claims 1 to 4, characterized in that: The shrinking assembly comprises a plurality of pairs of shrinking rods (8) and springs (9); the plurality of shrinking rods (8) are evenly spaced along the edge of the heat sink (4), respectively pass through the pressure plate (3), and have their two ends fixedly connected to the heat conductor and the heat sink (4); the plurality of springs (9) are slidably sleeved on the plurality of shrinking rods (8), and have their two ends abutting against the pressure plate (3) and the heat conductor respectively.

10. The adaptive thermal switch temperature control device according to claim 9, characterized in that: Abutment blocks (10) are slidably sleeved on the plurality of retractable rods (8), and two ends of the plurality of abutment blocks (10) are fixedly connected to one end of the plurality of springs (9) and the pressure plate (3).

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