An adaptive thermal switch temperature control device

Abstract

The application relates to a self-adaptive thermal switch temperature control device, which comprises a heat preservation layer, a heat dissipation circuit board, a heat conduction device, a pressing plate and a heat dissipation plate, the heat preservation layer is provided with an opening penetrating in and out on one side surface; the heat dissipation circuit board and the heat conduction device are fixedly installed in the heat preservation layer, the heat conduction device is located between the heat dissipation circuit board and the opening, and the upper side of the heat conduction device is attached to the heat dissipation circuit board; the heat dissipation plate is located on one side of the heat preservation layer, and is connected with the heat conduction device through a contraction assembly; the pressing plate is located between the heat dissipation plate and the heat preservation layer, and is connected with the heat conduction device through a heat expansion piece; and the pressing plate can be moved to be attached to the heat dissipation plate under the action of the heat expansion piece. The application has the advantages of simple structure, reasonable design, realization of the heat dissipation condition of the electronic equipment under the near space, satisfaction of the heat preservation condition under the low-temperature working condition, great saving of the power consumption required by the equipment temperature control under the condition of meeting the working temperature required by the electronic equipment, and realization of the requirement of zero power consumption of the temperature control device.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic equipment heat dissipation, in particular to a self-adaptive thermal switch temperature control device. BACKGROUND

[0002] The environment condition of electronic equipment working in near space is very bad, the temperature range can reach -90 DEG C ~ 55 DEG C, and the electronic equipment also faces the harsh power consumption limit. SUMMARY

[0003] The present application provides a self-adaptive thermal switch temperature control device, which aims at solving the problems in the prior art.

[0004] The technical scheme for solving the above technical problems is as follows:

[0005] A self-adaptive thermal switch temperature control device, comprising a heat preservation layer, a heat dissipation circuit board, a heat conduction device, a pressing plate and a heat dissipation plate, one side surface of the heat preservation layer is provided with an opening penetrating in and out; the heat dissipation circuit board and the heat conduction device are respectively fixedly installed in the heat preservation layer, the heat conduction device is located between the heat dissipation circuit board and the opening, and the upper side thereof is attached to the heat dissipation circuit board.

[0006] The heat dissipation plate is located on one side of the heat preservation layer, and is connected with the heat conduction device through a contraction assembly; the pressing plate is located between the heat dissipation plate and the heat preservation layer, and is connected with the heat conduction device through a heat expansion piece, and the pressing plate can be moved to be attached to the heat dissipation plate under the action of the heat expansion piece.

[0007] The present application has the advantages that: in the use process, the heat chips on the heat dissipation circuit board transmit heat to the heat expansion piece through the heat conduction device, the heat expansion piece is heated to move the pressing plate to be attached to the heat dissipation plate to perform heat dissipation operation, and heat dissipation is convenient.

[0008] The present application has the advantages that: in the use process, the heat chips on the heat dissipation circuit board transmit heat to the heat expansion piece through the heat conduction device, the heat expansion piece is heated to move the pressing plate to be attached to the heat dissipation plate to perform heat dissipation operation, and heat dissipation is convenient.

[0009] On the basis of the above technical scheme, the present application can also be improved as follows.

[0010] Further, the heat conduction device comprises a heat conduction structural piece, the heat conduction structural piece is installed in the heat preservation layer, and one side thereof is attached to the heat dissipation circuit board; the contraction assembly and the heat expansion piece are respectively connected with the heat conduction structural piece.

[0011] The beneficial effect of adopting the above-mentioned further solution is that during use, the heat-generating chip on the heat dissipation circuit board transfers heat to the heat-expanding component through the heat-conducting structure. The heat-expanding component is heated, causing the pressure plate to move to fit against the heat dissipation plate for heat dissipation, which is convenient.

[0012] Furthermore, the heat-conducting structural component has a plurality of protrusions evenly spaced on the side near the heat dissipation circuit board, and the plurality of protrusions are respectively connected to the heat dissipation circuit board.

[0013] The advantages of adopting the above-mentioned further solution are that the structure is simple and the design is reasonable. The heat-generating chip on the heat dissipation circuit board transfers heat to the thermal expansion component through multiple protrusions, which facilitates heat conduction.

[0014] Furthermore, the heat conductor also includes a graphene film, which is fixedly installed at the opening and is attached to the side of the heat-conducting structure away from the heat dissipation circuit board; the shrinkage component and the thermal expansion component are respectively connected to the graphene film.

[0015] The beneficial effect of adopting the above-mentioned further solution is that during use, the heat-generating chip on the heat dissipation circuit board transfers heat to the graphene film through the heat-conducting structure, and the graphene film then transfers heat to the thermal expansion component. The thermal expansion component is heated, causing the pressure plate to move to fit against the heat dissipation plate for heat dissipation, which is convenient.

[0016] Furthermore, the thermal expansion member includes at least one thermal switch, each of which includes a housing and a piston rod. One end of the housing is fixedly connected to the heat conductor, and the other end is provided with a through hole. The piston rod is installed at the through hole, and one end of it is fixedly connected to the pressure plate. The housing is filled with an expansion fluid, which expands when heated and can push the piston rod to move.

[0017] The beneficial effect of adopting the above-mentioned further solution is that during use, the heat-generating chip on the heat dissipation circuit board transfers heat to the graphene film through the heat-conducting structure, and the graphene film then transfers heat to the thermal switch. The expansion fluid in the thermal switch expands due to heat, causing the piston rod to move. The piston rod drives the pressure plate to move to fit against the heat dissipation plate for heat dissipation, which is convenient.

[0018] Furthermore, the piston rod has a structure that is thin at one end and thick at the other end, and the piston rod has an injection channel inside; the other end of the piston rod has an injection hole, and an injection screw is installed at the injection hole.

[0019] The advantages of adopting the above-mentioned further solution are that the structure is simple, the piston rod shape is reasonably designed, it is easy to assemble, and it can ensure that the piston rod will not slip off the outer shell;

[0020] In addition, the expansion fluid can be injected into the outer casing through the above-mentioned injection orifice.

[0021] Furthermore, the heated expansion member includes two thermal switches, and two stops are fixedly mounted on the pressure plate; one end of each of the two piston rods is connected to the two stops respectively.

[0022] The advantages of adopting the above-mentioned further solution are that the structure is simple and the design is reasonable. One end of each of the two piston rods is connected to the pressure plate by a stop block, which makes assembly convenient.

[0023] Furthermore, each of the two stops is provided with a slot, and each of the two slots is provided with a pair of insertion holes; one end of each of the two piston rods is inserted into the two slots, and each of the piston rods is provided with a through hole, which is connected to the two pairs of insertion holes; two pins are inserted into the two through holes and the two pairs of insertion holes to connect one end of each of the two piston rods to the two stops.

[0024] The advantages of adopting the above-mentioned further solution are that the structure is simple and the design is reasonable. During assembly, one end of the two piston rods is inserted into the through holes on the two stops, so that the two through holes are connected to the two pairs of insertion holes respectively. Then, the two pins are inserted into the two through holes and the two pairs of insertion holes respectively to connect one end of the two piston rods to the two stops. The operation is simple, time-saving and labor-saving.

[0025] Furthermore, the shrinking assembly includes multiple pairs of shrinking rods and springs. The multiple shrinking rods are evenly spaced along the edge of the heat dissipation plate, and they pass through the pressure plate respectively. Their two ends are fixedly connected to the heat conductor and the heat dissipation plate respectively. The multiple springs are slidably sleeved on the multiple shrinking rods, and their two ends abut against the pressure plate and the heat conductor respectively.

[0026] The advantages of adopting the above-mentioned further solution are that the structure is simple, the design is reasonable, and the spring ensures the stable operation of the pressure plate when it moves to fit with the heat sink.

[0027] Furthermore, abutment blocks are slidably sleeved on each of the multiple retractable rods, and the two ends of the multiple abutment blocks are respectively fixedly connected to one end of the multiple springs and the pressure plate.

[0028] The advantages of adopting the above-mentioned further solution are that the structure is simple, the design is reasonable, and the abutment block can avoid direct contact between the spring and the pressure plate, thus protecting the pressure plate. Attached Figure Description

[0029] Figure 1 This is one of the overall structural schematic diagrams of the present invention;

[0030] Figure 2 This is the second schematic diagram of the overall structure of the present invention;

[0031] Figure 3 This is a half-sectional view of the present invention;

[0032] Figure 4 This is a partial structural schematic diagram of the present invention;

[0033] Figure 5 This is a front view of the thermal switch in this invention;

[0034] Figure 6 This is a half-sectional view of the thermal switch in this invention;

[0035] Figure 7 This is a schematic diagram of the internal structure of the thermal switch in this invention;

[0036] Figure 8 This is a schematic diagram of the heat dissipation process of the present invention;

[0037] Figure 9 This is a schematic diagram of the structure during the heat preservation process of the present invention.

[0038] The attached diagram lists the components represented by each number as follows:

[0039] 1. Insulation layer; 2. Heat dissipation circuit board; 3. Pressure plate; 4. Heat dissipation plate; 5. Thermal conductive structural component; 6. Graphene film; 7. Thermal switch; 71. Outer shell; 72. Piston rod; 73. Liquid injection channel; 74. Liquid injection hole; 75. Liquid injection screw; 76. Stop block; 8. Retraction rod; 9. Spring; 10. Abutment block; 11. Piston sealing ring; 12. Shell sealing ring. Detailed Implementation

[0040] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other.

[0041] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0042] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0043] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0044] Example 1

[0045] like Figures 1 to 9 As shown, this embodiment provides an adaptive thermal switch temperature control device, including an insulation layer 1, a heat dissipation circuit board 2, a heat conductor, a pressure plate 3, and a heat dissipation plate 4. One side surface of the insulation layer 1 is provided with an opening that extends through both the inside and outside. The heat dissipation circuit board 2 and the heat conductor are respectively fixedly installed inside the insulation layer 1. The heat conductor is located between the heat dissipation circuit board 2 and the opening, and its upper side is in contact with the heat dissipation circuit board 2.

[0046] The heat dissipation plate 4 is located on one side of the insulation layer 1 and is connected to the heat conductor through a shrinkage component; the pressure plate 3 is located between the heat dissipation plate 4 and the insulation layer 1 and is connected to the heat conductor through a thermal expansion member. The pressure plate 3 can be moved to fit against the heat dissipation plate 4 under the action of the thermal expansion member.

[0047] During use, the heat-generating chip on the heat dissipation circuit board 2 transfers heat to the heat-expanding component through the heat conductor. The heat-expanding component heats up, causing the pressure plate 3 to move and fit against the heat dissipation plate 4 for heat dissipation, which is convenient.

[0048] Preferably, in this embodiment, the above-mentioned insulation layer 1 has a rectangular box-shaped structure.

[0049] Preferably, in this embodiment, the pressure plate 3 and the heat sink 4 are both rectangular plate structures.

[0050] In addition, the pressure plate 3 and the heat sink 4 are the same size.

[0051] This embodiment has a simple structure and reasonable design, enabling electronic devices to meet both high-temperature heat dissipation and low-temperature heat preservation conditions in near-space environments. This invention can also greatly save the power consumption required for temperature control while meeting the operating temperature requirements of electronic devices, achieving the requirement of zero power consumption for temperature control devices.

[0052] Example 2

[0053] Based on Embodiment 1, in this embodiment, the heat conductor includes a heat-conducting structural component 5, which is installed inside the insulation layer 1, with one side of it attached to the heat dissipation circuit board 2; the shrinkage component and the thermal expansion component are respectively connected to the heat-conducting structural component 5.

[0054] During use, the heat-generating chip on the heat dissipation circuit board 2 transfers heat to the heat-expanding component through the heat-conducting structure 5. The heat-expanding component is heated, causing the pressure plate 3 to move and fit against the heat dissipation plate 4 for heat dissipation, which is convenient.

[0055] Example 3

[0056] Based on Embodiment 2, in this embodiment, the heat-conducting structural component 5 is provided with a plurality of protrusions evenly spaced on the side near the heat dissipation circuit board 2, and the plurality of protrusions are respectively connected to the heat dissipation circuit board 2.

[0057] The solution has a simple structure and reasonable design. The heat-generating chip on the heat dissipation circuit board 2 transfers heat to the thermal expansion component through multiple protrusions, which facilitates heat conduction.

[0058] Example 4

[0059] Based on any one of Embodiments 2 to 3, in this embodiment, the heat conductor further includes a graphene film 6, which is fixedly installed at the opening and is attached to the side of the heat-conducting structure 5 away from the heat dissipation circuit board 2; the shrinkage component and the thermal expansion component are respectively connected to the graphene film 6.

[0060] During use, the heat-generating chip on the heat dissipation circuit board 2 transfers heat to the graphene film 6 through the heat-conducting structure 5. The graphene film 6 then transfers heat to the thermal expansion component. The thermal expansion component is heated, causing the pressure plate 3 to move and fit against the heat dissipation plate 4 for heat dissipation, which is convenient.

[0061] Example 5

[0062] Based on the above embodiments, in this embodiment, the thermal expansion member includes at least one thermal switch 7, each thermal switch 7 including a housing 71 and a piston rod 72. One end of the housing 71 is fixedly connected to the heat conductor, and the other end is provided with a through hole. The piston rod 72 is installed at the through hole, and one end of it is fixedly connected to the pressure plate 3. The housing 71 is filled with an expansion liquid, which expands when heated and can push the piston rod 72 to move.

[0063] During use, the heat-generating chip on the heat dissipation circuit board 2 transfers heat to the graphene film 6 through the heat-conducting structure 5. The graphene film 6 then transfers heat to the thermal switch 7. The expansion fluid in the thermal switch 7 expands due to heat, causing the piston rod 72 to move. The piston rod 72 drives the pressure plate 3 to move to fit against the heat dissipation plate 4 for heat dissipation, which is convenient.

[0064] Preferably, in this embodiment, the outer shell 71 is preferably a shell-like structure with one end thicker than the other, and the piston rod 72 is located at the thin end of the outer shell 71.

[0065] In addition, the aforementioned outer casing 71 includes a base plate and a housing, one end of which is open and connected to the base plate by screws, and a through hole is located at the other end of the housing.

[0066] Preferably, in this embodiment, the expansion fluid is liquid paraffin.

[0067] Example 6

[0068] Based on Embodiment 5, in this embodiment, the piston rod 72 has a structure that is thin at one end and thick at the other end, and the piston rod 72 is provided with an injection channel 73 inside; the other end of the piston rod 72 is provided with an injection hole 74, and an injection screw 75 is installed at the injection hole 74.

[0069] The design is simple, the piston rod 72 has a reasonable shape, which is easy to assemble and can ensure that the piston rod 72 will not slip off from the outer shell 71.

[0070] Alternatively, expansion fluid can be injected into the outer casing 71 through the injection hole 74 and the injection channel 73.

[0071] Preferably, in this embodiment, the other end of the piston rod 72 is provided with an annular groove, and a piston sealing ring 11 is installed in the annular groove.

[0072] In addition, a housing sealing ring 12 is installed between one end of the housing and the base plate.

[0073] Example 7

[0074] Based on any one of Embodiments 5 to 6, in this embodiment, the thermal expansion member includes two thermal switches 7, and two blocks 76 are fixedly installed on the pressure plate 3; one end of each of the two piston rods 72 is connected to the two blocks 76 respectively.

[0075] The scheme has a simple structure and reasonable design. One end of each of the two piston rods 72 is connected to the pressure plate 3 by a stop block 76, which makes assembly convenient.

[0076] Preferably, in this embodiment, the two blocks 76 are respectively circular in cross-section.

[0077] Example 8

[0078] Based on Embodiment 7, in this embodiment, each of the two stops 76 is provided with a slot, and each of the two slots is provided with a pair of insertion holes; one end of each of the two piston rods 72 is inserted into the two slots, and each of them is provided with a through hole, and the two through holes are respectively connected to the two pairs of insertion holes; two pins are inserted into the two through holes and the two pairs of insertion holes respectively to connect one end of each of the two piston rods 72 to the two stops 76.

[0079] The scheme has a simple structure and reasonable design. During assembly, one end of the two piston rods 72 is inserted into the through holes on the two stops 76 respectively, so that the two through holes are connected to the two pairs of insertion holes respectively. Then, the two pins are inserted into the two through holes and the two pairs of insertion holes respectively to connect one end of the two piston rods 72 to the two stops 76. The operation is simple, time-saving and labor-saving.

[0080] Example 9

[0081] Based on the above embodiments, in this embodiment, the shrinking assembly includes multiple pairs of shrinking rods 8 and springs 9. The multiple shrinking rods 8 are evenly spaced along the edge of the heat dissipation plate 4, and they respectively penetrate the pressure plate 3, and their two ends are respectively fixedly connected to the heat conductor and the heat dissipation plate 4; the multiple springs 9 are slidably sleeved on the multiple shrinking rods 8, and their two ends respectively abut against the pressure plate 3 and the heat conductor.

[0082] The scheme has a simple structure and reasonable design. When the pressure plate 3 moves to fit with the heat sink 4, the spring 9 ensures the stable operation of the pressure plate 3.

[0083] Preferably, in this embodiment, the number of the above-mentioned retraction rods 8 is four, and the four retraction rods 8 are respectively distributed at the four corners of the heat sink 4.

[0084] Example 10

[0085] Based on embodiment 9, in this embodiment, abutment blocks 10 are slidably sleeved on the plurality of retractable rods 8 respectively, and the two ends of the plurality of abutment blocks 10 are fixedly connected to one end of the plurality of springs 9 and the pressure plate 3 respectively.

[0086] The solution has a simple structure and a reasonable design. The abutment block 10 can prevent the spring 9 from directly contacting the pressure plate 3, thus protecting the pressure plate 3.

[0087] Preferably, in this embodiment, the plurality of abutting blocks 10 are each preferably blocks with a circular cross-section.

[0088] It should be noted that the aforementioned multiple springs 9 always pull the pressure plate 3 upwards.

[0089] The working principle of this invention is as follows:

[0090] (1) Heat dissipation process (heat dissipation under high external temperature environment, thermal switch is in the extended state):

[0091] The heat-generating chip on the heat dissipation circuit board 2 transfers heat to the graphene film 6 through the protrusions on the heat-conducting structure 5. The graphene film 6 then transfers the heat to the graphene film at the pressure plate 3. An extended thermal switch brings the graphene film 6 on the pressure plate 3 into contact with the heat sink 4, transferring the heat from the graphene film 6 to the outside environment through the heat sink 4, thus enabling the temperature control device to fulfill its heat dissipation function (see reference). Figure 8 ).

[0092] (2) Heat preservation process (heat preservation in a low ambient temperature environment, with the thermal switch in a retracted state):

[0093] The retracted thermal switch disconnects the graphene film 6 from the heat sink 4, preventing heat from the graphene film 6 from being transferred to the outside through the heat sink 4. Simultaneously, the insulation layer provides insulation, ensuring the temperature control device fulfills its insulation function (see reference). Figure 9 ).

[0094] The advantages of the adaptive thermal switch temperature control heat dissipation device provided by this invention are as follows:

[0095] (1) This invention utilizes the operating state of the thermal switch under different ambient temperatures to enable the temperature control device to satisfy both heat dissipation at high temperatures and heat preservation at low temperatures, thereby greatly saving the power consumption required for equipment temperature control and achieving the requirement of zero power consumption for the temperature control device.

[0096] (2) The invention has a compact and simple structure. By adjusting the type or proportion of liquid in the thermal switch, the device can meet the temperature control requirements of different ambient temperatures. It has high reliability and strong versatility.

[0097] (3) This invention is not only applicable to near space, but also to other demanding environments such as outer space, and has the characteristics of wide applicability.

[0098] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0099] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0100] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An adaptive thermal switch temperature control device, characterized in that: It includes an insulation layer (1), a heat dissipation circuit board (2), a heat conductor, a pressure plate (3), and a heat dissipation plate (4). One side surface of the insulation layer (1) is provided with an opening that penetrates both inside and outside. The heat dissipation circuit board (2) and the heat conductor are respectively fixedly installed inside the insulation layer (1). The heat conductor is located between the heat dissipation circuit board (2) and the opening, and its upper side is in contact with the heat dissipation circuit board (2). The heat dissipation plate (4) is located on one side of the insulation layer (1), and it is connected to the insulation layer (1) by a shrink-fit assembly. Heat conductor connection; the pressure plate (3) is located between the heat dissipation plate (4) and the insulation layer (1), and it is connected to the heat conductor through the heat expansion member. The pressure plate (3) can be moved to fit against the heat dissipation plate (4) under the action of the heat expansion member. The heat conductor includes a heat-conducting structural component (5), which is installed inside the insulation layer (1) and has one side attached to the heat dissipation circuit board (2); the shrinkage component and the thermal expansion component are respectively connected to the heat-conducting structural component (5); the heat-conducting structural component (5) has a plurality of protrusions evenly spaced on the side near the heat dissipation circuit board (2), and the plurality of protrusions are respectively connected to the heat dissipation circuit board (2). The heat-expanding component includes at least one thermal switch (7), each thermal switch (7) includes a housing (71) and a piston rod (72). One end of the housing (71) is fixedly connected to the heat conductor, and the other end is provided with a through hole. The piston rod (72) is installed at the through hole, and one end of it is fixedly connected to the pressure plate (3). The housing (71) is filled with an expansion liquid, which expands when heated and can push the piston rod (72) to move. The shrinking assembly includes multiple pairs of shrinking rods (8) and springs (9). The multiple shrinking rods (8) are evenly spaced along the edge of the heat sink (4), and they pass through the pressure plate (3) respectively. Their two ends are fixedly connected to the heat conductor and the heat sink (4) respectively. The multiple springs (9) are slidably sleeved on the multiple shrinking rods (8), and their two ends abut against the pressure plate (3) and the heat conductor respectively.

2. The adaptive thermal switch temperature control device according to claim 1, characterized in that: The heat conductor also includes a graphene film (6), which is fixedly installed at the opening and is attached to the side of the heat-conducting structure (5) away from the heat dissipation circuit board (2); the shrinkage component and the thermal expansion component are respectively connected to the graphene film (6).

3. The adaptive thermal switch temperature control device according to claim 1, characterized in that: The piston rod (72) has a structure that is thin at one end and thick at the other end, and the piston rod (72) has an injection channel (73) inside; the other end of the piston rod (72) has an injection hole (74), and an injection screw (75) is installed at the injection hole (74).

4. The adaptive thermal switch temperature control device according to claim 1, characterized in that: The heated expansion member includes two thermal switches (7), and two stops (76) are fixedly installed on the pressure plate (3); one end of each of the two piston rods (72) is connected to the two stops (76).

5. The adaptive thermal switch temperature control device according to claim 4, characterized in that: Each of the two stops (76) is provided with a slot, and each of the two slots is provided with a pair of insertion holes; one end of each of the two piston rods (72) is inserted into the two slots, and each of them is provided with a through hole, and the two through holes are respectively connected to the two pairs of insertion holes; two pins are inserted into the two through holes and the two pairs of insertion holes respectively to connect one end of each of the two piston rods (72) to the two stops (76).

6. The adaptive thermal switch temperature control device according to claim 1, characterized in that: Abutment blocks (10) are slidably sleeved on each of the multiple retractable rods (8), and the two ends of the multiple abutment blocks (10) are fixedly connected to one end of the multiple springs (9) and the pressure plate (3).

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