A flip mechanism for plate ink curing processing

By designing the flip mechanism for ink curing and processing of the flip anti-crack module and the conveying stability module, the problem of ink layer cracking during the flip is solved, and anti-crack clamping and stable transport during the flip process is achieved, improving the ink curing quality and flip effect.

CN120050865BActive Publication Date: 2025-08-15SHENZHEN TECHSTAR PRECISION IND CO LTD
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Patent Information

Application Number
CN202510512957.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-04-23
Publication Date
2025-08-15
Estimated Expiration
2045-04-23

AI Technical Summary

Technical Problem

When the PCB substrate changes from the vertical state to the horizontal state, the lateral force in the middle area causes the ink layer to crack, affecting the ink curing effect and quality.

Method used

A flip mechanism for curing and processing of plate ink is designed, including a flip anti-crack module and a conveying stability module. It clamps the outer walls of both sides of the PCB substrate by anti-crack to avoid lateral force in the middle area, and is conveyed stably after flip.

Benefits of technology

Effectively prevent the ink layer from cracking during the flip process of the PCB substrate, ensure the ink curing quality, and carry it stably after flip, avoid offset or tilt, and improve the flip operation effect.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application provides a flipping mechanism for plate ink curing processing, which relates to the field of circuit board manufacturing and includes a base frame, a conveying platform is provided on the top of the base frame, a conveying stabilization module is provided on the conveying platform, and the outer walls of both sides of the conveying platform are fixedly connected to mounting plate frames, and the outer walls of the two mounting plate frames on opposite sides are provided with flipping guides and guide rod frames, and both flipping guides are provided with flipping guide grooves, and flipping guide wheels are provided inside the two flipping guide grooves. The present application achieves the effect of preventing the surface ink layer from cracking when the PCB substrate is flipped. When flipping, the device can clamp the outer walls of both sides of the PCB substrate to prevent cracking, thereby preventing the central area of the PCB substrate from receiving a certain lateral force when the device flips, thereby preventing the PCB substrate from deforming during the flipping process, so that the ink layer of the PCB substrate will not crack due to deformation during the flipping process, thereby improving the flipping operation effect of the device.
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Description

Technical Field

[0001] The present invention relates to the field of circuit board manufacturing, and in particular to a turnover mechanism for ink curing processing of a board. Background Art

[0002] ‌PCB substrate‌ is the basic material of printed circuit boards, which carry electronic components and realize electrical connections between them.

[0003] The main materials of a PCB substrate include copper-clad laminate, prepreg, and copper foil. The copper-clad laminate is the core material of the PCB substrate, consisting of an insulating substrate and copper foil. The insulating substrate can be paper, glass cloth, or a composite material, while the copper foil is used to form the circuit.

[0004] UV curing technology uses medium- and short-wave ultraviolet light to irradiate liquid UV materials. Photoinitiators absorb photons to form free radicals or cations, which trigger the polymerization and crosslinking of polymer materials containing active functional groups, ultimately curing them into a film. This technology offers advantages such as instant curing, the absence of volatile solvents, and environmental friendliness.

[0005] When the PCB substrate is undergoing ink curing operation, it needs to be flipped over so that its A and B sides can be cured separately. During flipping, since the PCB substrate changes from a vertical state to a horizontal state, the central area of the PCB substrate will receive a certain lateral force when flipping, causing the PCB substrate to deform during flipping, thereby causing the ink layer to crack, affecting the ink curing effect and quality of the PCB board.

[0006] Therefore, we have made improvements to this problem and proposed a flipping mechanism for plate ink curing processing. Summary of the Invention

[0007] The purpose of the present invention is to address the existing problem that when a PCB substrate is flipped, its central area will receive a certain lateral force due to the change from a vertical state to a horizontal state, thereby causing the PCB substrate to deform during flipping, and further leading to cracking of the ink layer.

[0008] In order to achieve the above-mentioned purpose of the invention, the present invention provides a turning mechanism for plate ink curing processing to improve the above-mentioned problem.

[0009] The specific application is as follows:

[0010] The utility model comprises a base frame, a conveying platform is provided on the top of the base frame, a conveying stabilizing module is provided on the conveying platform, and the outer walls of both sides of the conveying platform are fixedly connected to the mounting plate frames, the outer walls of the two opposite sides of the mounting plate frames are provided with a turning guide plate and a guide rod frame, and the two turning guide plates are provided with a turning guide groove, and the interiors of the two turning guide grooves are provided with a turning guide wheel, the two turning guide wheels are provided with the same connecting rod member 1, and the two guide rod frames are provided with movable blocks, the two movable blocks are provided with the same connecting rod member 2, the connecting rod member 1 and the connecting rod member 2 are provided with the same turning frame, and the turning frame is provided with a turning anti-cracking module;

[0011] The flip anti-crack module includes two anti-crack splints, and both anti-crack splints are located below the flip frame;

[0012] The transport stabilization module includes two stabilization brackets and two stabilization arcs;

[0013] Material toggling mechanism, its both sides respectively have a cylinder pressure, and the cylinder pressure bar connects swing arm, and the swing arm end face has hook portion, and a bar passes position between the end of two swing arms and the hook portion. The swing arm ends up being rotated at the hook end of two swing arms and the hook portion.

[0014] As the preferred technical solution of the present application, the adjustment frame is fixedly connected to a fixing frame, and two return spring rods are fixedly connected to the inner wall of one side of the fixing frame, and one end of the two return spring rods is respectively fixedly connected to the inner wall of one side of the two connecting parts, and the bottoms of the two connecting parts are fixedly connected to the same mounting frame, and an air pump is fixedly connected to the outer wall of one side of the mounting frame, and the output end of the air pump is connected to two airflow sensors through a pipeline, and the output ends of the two airflow sensors are fixedly connected to delivery pipes, and the outer walls of the two delivery pipes are provided with control valves, and the output ends of the two delivery pipes are fixedly connected to pressurized air bags, and the two pressurized air bags are respectively fixedly connected to the top and bottom of the inner wall of the mounting frame, and the two anti-cracking plywood are respectively fixedly connected to the top and bottom of the two pressurized air bags.

[0015] As the preferred technical solution of the present application, both of the airflow sensors are provided with data circuits, one end of the two data circuits is fixedly connected to the controller, both controllers are provided with control circuits, one end of the two control circuits is respectively provided on the two control valves, and four through holes are opened on the top and bottom of the mounting frame, and the interiors of the multiple through holes are movably connected with guide columns, and one end of the multiple guide columns is respectively fixedly connected to the top and bottom of the two anti-cracking splints.

[0016] As the preferred technical solution of the present application, two movable connecting plates are provided on the two anti-cracking splints, and one end of the two movable connecting plates on the same anti-cracking splint is fixedly connected to the same anti-cracking auxiliary plate. Two mounting holes are provided on the two anti-cracking splints and the two anti-cracking auxiliary plates, and every two mounting holes are connected, and the inner walls of every two connected mounting holes are provided with the same telescopic airbag, and two connecting tubes are fixedly connected to the outer walls of one side of the two pressurized airbags, and the output ends of the four connecting tubes are respectively connected to the interiors of the four telescopic airbags.

[0017] As a preferred technical solution of the present application, two transmission wheels are provided on the two mounting plate frames, wherein the outer walls on the opposite sides of the two transmission wheels are fixedly connected to the same linkage rod, and the outer walls of the two transmission wheels on the same side are provided with the same drive belt, and the two movable blocks are provided with fixing openings, and the inner walls of the two fixing openings are respectively fixedly connected to the outer walls of the two drive belts, and the outer wall of one side of one of the mounting plate frames is fixedly connected to a flip motor, and the output shaft of the flip motor is fixedly connected to the outer wall of one of the transmission wheels through a coupling.

[0018] As the preferred technical solution of the present application, four substrate card frames are fixedly connected to the bottom of the flip frame, two elastic pads are provided on the inner walls on both sides of the four substrate card frames, rectangular slots are opened on the outer walls on one side of the four substrate card frames, and four electric telescopic rods are fixedly connected to the flip frame, and the output ends of the four electric telescopic rods are fixedly connected to push plates, and the four push plates are respectively located inside the four rectangular slots.

[0019] As the preferred technical solution of the present application, the conveying stabilization module also includes two fixed frames, both of which are fixedly connected to the conveying platform, and two movable openings are provided on one side outer wall of the two fixed frames, and the inner walls of the four movable openings are movably connected to the movable base, and the four stabilizing brackets are respectively fixedly connected to the one side outer wall of the four movable bases, and the four stabilizing brackets are respectively located inside the two fixed frames.

[0020] As a preferred technical solution of the present application, two mounting rods are provided on each of the four stabilizing brackets, the outer walls of the two mounting rods on the same stabilizing bracket are provided with the same stabilizing arc, and the four stabilizing brackets are fixedly connected with a fixing rod.

[0021] As the preferred technical solution of the present application, one side outer wall of the two fixed frames is movably connected to two shaft rods, one end of the four shaft rods is fixedly connected to an eccentric plate, the four eccentric plates are provided with connecting rods, one end of the four connecting rods is movably connected to a fixed rod, one end of the four fixed rods is respectively fixedly connected to the outer wall of one side of the four stable brackets, and the other end of the four shaft rods is fixedly connected to a linkage wheel, the outer walls of the two linkage wheels on the same side are provided with the same linkage belt, the outer walls of one side of the two fixed frames are fixedly connected to a servo motor, and the output shafts of the two servo motors are respectively fixedly connected to the outer wall of one side of two of the linkage wheels through couplings.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] In the scheme of this application:

[0024] 1. To address the problem in the prior art that, when a PCB substrate changes from a vertical state to a horizontal state, a certain lateral force is applied to the central region of the PCB substrate during flipping, thereby causing deformation of the PCB substrate during flipping and subsequently causing cracking of the ink layer, the present application provides a flipping anti-crack module to achieve the effect of preventing the surface ink layer from cracking during flipping of the PCB substrate. During flipping, the device can clamp the outer walls of the PCB substrate on both sides to prevent a certain lateral force from being applied to the central region of the PCB substrate during flipping, thereby preventing deformation of the PCB substrate during flipping. This prevents the ink layer from cracking due to deformation during flipping, thereby improving the flipping operation of the device and ensuring the quality and effect of the ink curing process on the PCB substrate. At the same time, during the anti-crack operation, the device can synchronously adjust the positions of the anti-crack clamps on both sides of the PCB substrate to prevent deformation of the PCB substrate due to clamping, further improving the use effect of the device.

[0025] 2. The conveying stabilization module ensures stable conveying of the PCB substrate fixture after flipping. After the device flips the PCB substrate fixture, it needs to be conveyed to the subsequent ink curing area. At this time, the conveying stabilization module can stably move the PCB substrate fixture from the flipping frame to the conveying device, thereby preventing the PCB substrate from deflecting or tilting when it falls on the conveying device, ensuring the subsequent conveying operation of the PCB substrate fixture, thereby improving the use effect of the device and solving the problem of PCB substrate fixtures being easily deflected or tilted when falling on the conveying device in the prior art.

[0026] 3. The electric telescopic rod, push plate, elastic pad and substrate clamping frame are set to achieve the automatic loading and clamping effect of the PCB substrate clamp and the subsequent automatic falling to the conveying equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic diagram of the structure of the flipping mechanism for plate ink curing processing provided in this application;

[0028] Figure 2 This is a schematic diagram of the overall bottom-up structure of the flip mechanism for plate ink curing processing provided by this application;

[0029] Figure 3 This is a schematic diagram of the combined structure of the flip frame and connecting rod of the flip mechanism for plate ink curing processing provided by this application;

[0030] Figure 4 This is a schematic diagram of the structure of the flipping and crack prevention module of the flipping mechanism for plate ink curing processing provided in this application;

[0031] Figure 5 This is a schematic cross-sectional view of the mounting frame of the flip mechanism for ink curing processing of sheet materials provided in this application;

[0032] Figure 6 This is a schematic cross-sectional view of the adjustment frame of the flip mechanism for plate ink curing processing provided in this application;

[0033] Figure 7 This is a schematic diagram of the combined structure of the transmission wheel and drive belt of the turning mechanism for plate ink curing processing provided by this application;

[0034] Figure 8 This is a schematic diagram of the combined structure of the conveying platform and conveying stabilization module of the turning mechanism for plate ink curing processing provided in this application;

[0035] Figure 9 This is a schematic diagram of the structure of the conveying stabilization module of the turning mechanism for plate ink curing processing provided in this application;

[0036] Figure 10 Provided for this application Figure 7 Schematic diagram of partial structural disassembly.

[0037] Indicated in the figure:

[0038] 1. Base frame; 2. Conveying platform; 3. Conveying stabilization module; 301. Fixed frame; 302. Movable opening; 303. Servo motor; 304. Linkage belt; 305. Movable base; 306. Stabilizing arc member; 307. Mounting rod; 308. Connecting rod; 309. Eccentric plate; 310. Linkage wheel; 311. Axis rod; 312. Fixed rod; 313. Stabilizing bracket; 4. Linkage rod; 5. Flipping motor; 6. Mounting plate frame; 7. Flipping guide plate; 8. Flipping anti-crack module; 801. Mounting frame; 802. Guide wheel member; 803. Rotating shaft rod; 804. Driving rod; 805. Winding wheel; 806. Fixed frame; 807. Anti-crack auxiliary plate; 808. Telescopic airbag; 809. Movable connecting plate; 810. Anti-crack splint ;811. Pressurized airbag;812. Guide column;813. Air pump;814. Air flow sensor;815. Data circuit;816. Controller;817. Control circuit;818. Control valve;819. Delivery pipe;820. Through hole;821. Connecting pipe;822. Adjustment frame;823. Moving guide port;824. Retraction spring rod;825. Connecting piece;826. Connecting wire belt;827. Fixed support plate;828. Universal motor;9. Flip guide groove;10. Flip guide wheel;11. Connecting rod one;12. Flip frame;13. Connecting rod two;14. Electric telescopic rod;15. Push plate;16. Elastic pad;17. Base plate clamp frame;18. Movable block;19. Transmission wheel;20. Drive belt;21. Guide rod frame. DETAILED DESCRIPTION

[0039] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0040] As described in the background art, the PCB substrate changes from a vertical state to a horizontal state. Therefore, when the PCB substrate is flipped, a certain lateral force is applied to the central area of the PCB substrate, causing deformation of the PCB substrate during flipping, thereby causing the ink layer to crack.

[0041] In order to solve this technical problem, the present invention provides a flipping mechanism for plate ink curing processing, which is applied to the curing and flipping of PCB substrates.

[0042] Specifically, please refer to Figures 1-10 The turning mechanism for plate ink curing processing specifically includes:

[0043] A base frame 1 is provided with a conveying platform 2 on the top of the base frame 1, a conveying stabilization module 3 is provided on the conveying platform 2, and the outer walls of both sides of the conveying platform 2 are fixedly connected with mounting plate frames 6, and the outer walls on the opposite sides of the two mounting plate frames 6 are provided with a flip guide plate 7 and a guide rod frame 21, and the two flip guide plates 7 are provided with a flip guide groove 9, and the inside of the two flip guide grooves 9 is provided with a flip guide wheel 10, the two flip guide wheels 10 are provided with the same connecting rod piece 11, and the two guide rod frames 21 are provided with a movable block 18, the two movable blocks 18 are provided with the same connecting rod piece 2 13, the connecting rod piece 11 and the connecting rod piece 2 13 are provided with the same flip frame 12, and the flip anti-cracking module 8 is provided on the flip frame 12;

[0044] The flipping anti-crack module 8 includes two anti-crack clamping plates 810 , and both anti-crack clamping plates 810 are located below the flipping frame 12 ;

[0045] The transport stabilization module 3 includes two stabilization brackets 313 and two stabilization arcs 306;

[0046] The flip anti-cracking module 8 also includes an adjustment frame 822, which is fixedly connected to the flip frame 12. Two fixed support plates 827 are fixedly connected to the adjustment frame 822. The outer walls of the two fixed support plates 827 on the opposite side are provided with a rotating shaft rod 803 and a driving rod 804. The outer walls of the rotating shaft rod 803 and the driving rod 804 are respectively fixedly connected to two guide wheel parts 802 and two winding wheels 805. The two winding wheels 805 are both provided with a connecting line 826. One end of the two connecting line belts 826 is fixedly connected to the connecting member 825. The outer walls of the connecting line belt 826 are in contact with the inner walls of the two guide wheel components 802 respectively, and two movable guide openings 823 are provided at the bottom of the adjustment frame 822. The two connecting components 825 are movably connected to the inner walls of the two movable guide openings 823 respectively. A universal motor 828 is fixedly connected to the outer wall of one side of one fixed support plate 827, and the output shaft of the universal motor 828 is connected to one end of the driving rod 804 through a coupling; the universal motor 828 can drive the driving rod 804 and the winding wheel 805 to rotate, thereby winding or loosening the connecting line belt 826.

[0047] The flipping mechanism for plate ink curing processing provided by the present invention achieves the effect of preventing the surface ink layer from cracking when the PCB substrate is flipped. During flipping, the device can clamp the outer walls of both sides of the PCB substrate to prevent cracking, thereby preventing the middle area of the PCB substrate from obtaining a certain lateral force during the flipping movement of the device, thereby preventing deformation of the PCB substrate during the flipping process, so that the ink layer of the PCB substrate will not crack due to deformation during the flipping process, thereby improving the flipping operation effect of the device; the conveying stabilization module 3 achieves the function of stable conveying after the PCB substrate clamp is flipped, and the conveying stabilization module 3 can stably move the PCB substrate clamp from the flipping frame 12 to the conveying equipment, thereby preventing the PCB substrate from being offset or tilted when it falls on the conveying equipment; the flipping guide plate 7, the flipping guide groove 9, the movable block 18 and the limit guide frame can cooperate with the connecting rod member 11 and the connecting rod member 2 13 to guide and limit the running trajectory of the flipping frame 12 when in use, so as to perform the flipping operation.

[0048] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0049] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions therein may be combined with each other.

[0050] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0051] Example 1, please refer to Figure 2-Figure 6 A turning mechanism for plate ink curing processing, wherein the adjusting frame 822 is fixedly connected to a fixing frame 806, and the inner wall of one side of the fixing frame 806 is fixedly connected to two return spring rods 824, one end of the two return spring rods 824 is fixedly connected to the inner wall of one side of two connecting members 825, and the bottom of the two connecting members 825 is fixedly connected to the same mounting frame 801, and the outer wall of one side of the mounting frame 801 is fixedly connected to an air pump 813, and the output end of the air pump 813 is connected to two air flow sensors 814 through a pipeline, and the output ends of the two air flow sensors 814 are fixedly connected to the output ends of the two air flow sensors 814. Both are fixedly connected with a delivery pipe 819, and the outer walls of the two delivery pipes 819 are provided with a control valve 818, and the output ends of the two delivery pipes 819 are fixedly connected with a pressurized airbag 811, and the two pressurized airbags 811 are respectively fixedly connected to the top and bottom of the inner wall of the mounting frame 801, and the two anti-cracking plywood 810 are respectively fixedly connected to the top and bottom of the two pressurized airbags 811; the air pump 813 can deliver gas to the inside of the pressurized airbag 811 through the delivery pipe 819, so that the pressurized airbag 811 expands to adjust the distance between the two anti-cracking plywood 810.

[0052] Please refer to Figure 4-Figure 6 , a turning mechanism for plate ink curing processing, wherein two air flow sensors 814 are provided with data circuits 815, one end of the two data circuits 815 is fixedly connected to a controller 816, and the two controllers 816 are provided with control circuits 817, one end of the two control circuits 817 is respectively provided on two control valves 818, and four through holes 820 are opened on the top and bottom of the mounting frame 801, and the interiors of the multiple through holes 820 are movably connected with guide columns 812, and one end of the multiple guide columns 812 is respectively fixedly connected to the top and bottom of the two anti-cracking splints 810; the air flow sensor 814 can detect the gas flow and transmit the data to the inside of the controller 816, so as to control the opening and closing of the control valve 818 through the controller 816 to ensure that the air flow inside the two delivery pipes 819 is consistent.

[0053] Please refer to Figure 4-Figure 6 , a turning mechanism for plate ink curing processing, wherein two anti-cracking splints 810 are each provided with two movable connecting plates 809, and one end of the two movable connecting plates 809 on the same anti-cracking splint 810 is fixedly connected to the same anti-cracking auxiliary plate 807, and two mounting holes are provided on the two anti-cracking splints 810 and the two anti-cracking auxiliary plates 807, and every two mounting holes are connected, and the inner wall of every two connected mounting holes is provided with the same telescopic airbag 808, and the outer wall of one side of the two pressurized airbags 811 is fixedly connected to two connecting tubes 821, and the output ends of the four connecting tubes 821 are respectively connected to the interior of the four telescopic airbags 808; after the telescopic airbag 808 is inflated, it will push the anti-cracking auxiliary plate 807, so that the anti-cracking auxiliary plate 807 and the movable connecting plate 809 move.

[0054] The effect of preventing the surface ink layer from cracking when the PCB substrate is flipped is achieved. When flipping, the device can perform anti-crack clamping on the outer walls of both sides of the PCB substrate, thereby preventing the middle area of the PCB substrate from obtaining a certain lateral force when the device flips, thereby preventing deformation of the PCB substrate during the flipping process, so that the ink layer of the PCB substrate will not crack due to deformation during the flipping process, thereby improving the flipping operation effect of the device and ensuring the quality and effect of the ink curing processing of the PCB substrate. At the same time, when performing the anti-cracking operation, the device can synchronously adjust the positions of the anti-crack clamps 810 on both sides of the PCB substrate to avoid deformation of the PCB substrate due to clamping, further improving the use effect of the device.

[0055] Example 2 further optimizes the turning mechanism for plate ink curing processing provided in Example 1. Specifically, Figure 1 、 Figure 4 and Figure 7As shown, two mounting plate frames 6 are each provided with two transmission wheels 19, wherein the outer walls on the opposite side of the two transmission wheels 19 are fixedly connected with the same linkage rod 4, and the outer walls of the two transmission wheels 19 on the same side are provided with the same drive belt 20, and the two movable blocks 18 are each provided with a fixing opening, and the inner walls of the two fixing openings are respectively fixedly connected to the outer walls of the two drive belts 20, and the outer wall of one side of one of the mounting plate frames 6 is fixedly connected with a flip motor 5, and the output shaft of the flip motor 5 is fixedly connected to the outer wall of one of the transmission wheels 19 through a coupling; the flip motor 5 can drive the transmission wheel 19 to rotate, and at the same time, the transmission wheel 19 can drive the linkage rod 4 to rotate, so as to cooperate with the drive belt 20 to drive the four transmission wheels 19 to operate synchronously.

[0056] Further, such as Figure 4 As shown, four substrate clamping frames 17 are fixedly connected to the bottom of the flip frame 12, and two elastic pads 16 are provided on the inner walls on both sides of the four substrate clamping frames 17. A rectangular slot is provided on the outer wall on one side of the four substrate clamping frames 17, and four electric telescopic rods 14 are fixedly connected to the flip frame 12. The output ends of the four electric telescopic rods 14 are fixedly connected to push plates 15, and the four push plates 15 are respectively located inside the four rectangular slots; the electric telescopic rods 14 can drive the push plates 15 to move to separate the PCB substrate clamp from the flip frame 12.

[0057] When in use, the flip motor 5 is used to cooperate with the transmission wheel 19, the drive belt 20 and the linkage rod 4 to perform flip driving; the electric telescopic rod 14, the push plate 15, the elastic pad 16 and the substrate clamping frame 17 realize the automatic loading and clamping effect of the PCB substrate clamp and the subsequent automatic falling to the conveying equipment.

[0058] Example 3 further optimizes the turning mechanism for plate ink curing processing provided in Example 1 or 2. Specifically, Figure 1 、 Figures 8-10 As shown, the conveying stabilization module 3 also includes two fixed frames 301, and the two fixed frames 301 are fixedly connected to the conveying platform 2. Two movable openings 302 are opened on the outer wall of one side of the two fixed frames 301, and the inner walls of the four movable openings 302 are movably connected to the movable base 305, and four stabilizing brackets 313 are respectively fixedly connected to the outer wall of one side of the four movable bases 305, and the four stabilizing brackets 313 are respectively located inside the two fixed frames 301.

[0059] Further, such as Figure 9 and Figure 10As shown, two mounting rods 307 are provided on each of the four stabilizing brackets 313, and the outer walls of the two mounting rods 307 on the same stabilizing bracket 313 are provided with the same stabilizing arc 306, and the four stabilizing brackets 313 are fixedly connected with a fixing rod 312; when the PCB substrate clamp falls to the conveying equipment, it can contact the stabilizing arc 306.

[0060] Further, such as Figure 9 and Figure 10 As shown, one side outer wall of the two fixed frames 301 is movably connected to two shaft members 311, one end of the four shaft members 311 is fixedly connected to the eccentric plate 309, and the four eccentric plates 309 are provided with connecting rods 308. One end of the four connecting rods 308 is movably connected to the fixed rod 312, and one end of the four fixed rods 312 is fixedly connected to the outer wall of one side of the four stable brackets 313 respectively, and the other end of the four shaft members 311 is fixedly connected to the linkage wheel 310. The two linkage wheels on the same side are fixedly connected to each other. The outer walls of the moving wheels 310 are all provided with the same linkage belt 304, and the outer walls of one side of the two fixed frames 301 are fixedly connected with a servo motor 303. The output shafts of the two servo motors 303 are respectively fixedly connected to the outer walls of one side of two of the linkage wheels 310 through a coupling; the servo motor 303 can drive the shaft member 311 to rotate, and then drive the eccentric plate member 309 and the connecting rod 308 to operate, thereby causing the stable bracket 313 to move up and down, so as to stably convey the PCB substrate clamp to the conveying equipment.

[0061] After the device flips the PCB substrate fixture, it needs to be transported to the subsequent ink curing area. At this time, the PCB substrate fixture can be stably moved from the flip frame 12 to the conveying device through the conveying stabilization module 3, thereby avoiding the PCB substrate from falling on the conveying device and causing deviation or tilt, etc., to ensure the subsequent conveying operation of the PCB substrate fixture, thereby improving the use effect of the device.

[0062] The use process of the turning mechanism for plate ink curing processing provided by the present invention is as follows:

[0063] When in use, the PCB substrate clamp is transported to the substrate clamp frame 17, which causes the elastic pad 16 to deform until the PCB substrate clamp is clamped into the substrate clamp frame 17 for subsequent flipping.

[0064] Before flipping, the universal motor 828 is running, and the universal motor 828 drives the driving rod 804 and the winding wheel 805 to rotate, thereby winding the connecting wire 826. As the connecting wire 826 is tightened, it can pull the connecting member 825 to move inside the movable guide 823, and stretch the return spring rod 824. At this time, as the connecting member 825 moves, it can drive the installation frame 801 to move, and move the installation frame 801 to the middle area of the PCB substrate. At this time, the air pump 813 is started, and the air pump 813 delivers gas through the delivery tube 819 to the pressurized air bag 811 (during this process, the air flow sensor 814 can detect the gas flow). and transmits the data to the controller 816 so as to control the opening and closing of the control valve 818 through the controller 816 to ensure that the air flow rate inside the two delivery pipes 819 is consistent). As the pressurized airbag 811 expands, it can drive the anti-crack splint 810 to move. At the same time, when performing this operation, the gas inside the pressurized airbag 811 can be transported to the inside of the telescopic airbag 808 through the connecting pipe 821, and the telescopic airbag 808 drives the anti-crack auxiliary plate 807 and the movable connecting plate 809 to move (to increase the clamping area and improve the anti-crack effect) until the two anti-crack splints 810 and the anti-crack auxiliary plate 807 clamp the PCB substrate for subsequent flipping.

[0065] During flipping, the flip motor 5 is started, which drives the transmission wheel 19 and the linkage rod 4 to rotate, and cooperates with the drive belt 20 so that the two drive belts 20 run synchronously, thereby driving the movable block 18 to rise and fall on the guide rod frame 21 through the drive belt 20. At this time, as the movable block 18 runs, it can drive the second connecting rod 13, and further drive the flip frame 12, the first connecting rod 11 and the flip guide wheel 10 to move. Since the first connecting rod 11 and the flip guide wheel 10 move under the guidance of the flip guide groove 9, the flip frame 12 can be flipped 90 degrees, thereby changing the PCB substrate from a vertical state to a horizontal state.

[0066] After flipping, the flip anti-crack module 8 is reset, and the electric telescopic rod 14 drives the push plate 15 to operate to push the PCB substrate clamp out of the substrate clamp frame 17 and make it fall;

[0067] During the falling operation, the servo motor 303 is started, and the servo motor 303 drives the linkage wheel 310 to rotate, and cooperates with the linkage belt 304 to drive multiple shafts to rotate synchronously, so that the eccentric plate 309 drives the connecting rod 308 and the fixed rod 312 to operate synchronously, so that the four stable brackets 313 and the movable base 305 rise under the guidance of the movable opening 302. After rising to a certain position, the stable bracket 313 drives the stable arc 306 to approach the PCB substrate clamp. At this time, the PCB substrate clamp falls, and the protruding part of the clamp falls into the inside of the stable arc 306. Then the servo motor 303 runs to drive the stable bracket 313 to descend, and the PCB substrate clamp falls on the conveying equipment and is conveyed to the subsequent ink curing operation area.

[0068] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0069] Obviously, the embodiments described above are only some embodiments of the present invention, rather than all embodiments. The preferred embodiments of the present invention are given in the accompanying drawings, but they do not limit the patent scope of the present invention. The present invention can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive. Although the present invention has been described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions described in the aforementioned specific embodiments, or to make equivalent replacements for some of the technical features therein. Any equivalent structure made using the contents of the present invention specification and drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the present invention.

Claims

1. A turning mechanism for plate ink curing processing, characterized in that: The utility model comprises a base frame (1), a conveying platform (2) is provided on the top of the base frame (1), a conveying stabilization module (3) is provided on the conveying platform (2), and the outer walls on both sides of the conveying platform (2) are fixedly connected with mounting plate frames (6), outer walls on opposite sides of the two mounting plate frames (6) are provided with a flip guide plate (7) and a guide rod frame (21), and the two flip guide plates (7) are provided with a flip guide groove (9), the interior of the two flip guide grooves (9) are provided with a flip guide wheel (10), the two flip guide wheels (10) are provided with the same connecting rod member 1 (11), and the two guide rod frames (21) are provided with a movable block (18), the two movable blocks (18) are provided with the same connecting rod member 2 (13), the connecting rod member 1 (11) and the connecting rod member 2 (13) are provided with the same flip frame (12), and the flip frame (12) is provided with a flip anti-cracking module (8); The flipping anti-crack module (8) comprises two anti-crack splints (810), and both anti-crack splints (810) are located below the flipping frame (12); The transport stabilization module (3) comprises two stabilization brackets (313) and two stabilization arcs (306); The flipping anti-cracking module (8) further comprises an adjusting frame (822), the adjusting frame (822) being fixedly connected to the flipping frame (12), two fixed support plates (827) being fixedly connected to the adjusting frame (822), a rotating shaft rod (803) and a driving rod (804) being provided on the outer walls on opposite sides of the two fixed support plates (827), two guide wheel members (802) and two reeling wheels (805) being fixedly connected to the outer walls of the rotating shaft rod (803) and the driving rod (804), respectively, and a connecting wire belt (826) being provided on each of the two reeling wheels (805). One end of each of the two connecting wires (826) is fixedly connected to a connecting piece (825), the outer walls of the two connecting wires (826) are in contact with the inner walls of the two guide wheel members (802), and two movable guide openings (823) are provided at the bottom of the adjustment frame (822), and the two connecting pieces (825) are movably connected to the inner walls of the two movable guide openings (823), respectively. A universal motor (828) is fixedly connected to the outer wall of one side of one of the fixed support plates (827), and the output shaft of the universal motor (828) is connected to one end of the driving rod member (804) through a coupling.

2. The turning mechanism for plate ink curing processing according to claim 1, characterized in that: The adjusting frame (822) is fixedly connected to a fixing frame (806), and one inner wall of the fixing frame (806) is fixedly connected to two pull-back spring rods (824), one end of the two pull-back spring rods (824) is fixedly connected to the inner wall of one side of two connecting members (825), and the bottoms of the two connecting members (825) are fixedly connected to the same mounting frame (801), and one outer wall of the mounting frame (801) is fixedly connected to an air pump (813), and the output end of the air pump (813) is connected to two air pumps through a pipeline. A flow sensor (814), the output ends of the two air flow sensors (814) are fixedly connected to a delivery pipe (819), the outer walls of the two delivery pipes (819) are provided with a control valve (818), and the output ends of the two delivery pipes (819) are fixedly connected to a pressurized air bag (811), the two pressurized air bags (811) are respectively fixedly connected to the top and bottom of the inner wall of the mounting frame (801), and the two anti-cracking splints (810) are respectively fixedly connected to the top and bottom of the two pressurized air bags (811).

3. The turning mechanism for plate ink curing processing according to claim 2, characterized in that: The two airflow sensors (814) are each provided with a data circuit (815), one end of each of the two data circuits (815) is fixedly connected to a controller (816), each of the two controllers (816) is provided with a control circuit (817), one end of each of the two control circuits (817) is respectively provided on two control valves (818), and four through holes (820) are respectively provided on the top and bottom of the mounting frame (801), the interiors of the plurality of through holes (820) are each movably connected to a guide column (812), and one end of each of the plurality of guide columns (812) is respectively fixedly connected to the top and bottom of the two anti-cracking splints (810).

4. The turning mechanism for plate ink curing processing according to claim 3, characterized in that: Two movable connecting plates (809) are provided on the two anti-cracking splints (810), and one end of the two movable connecting plates (809) on the same anti-cracking splint (810) is fixedly connected to the same anti-cracking auxiliary plate (807). Two mounting holes are provided on the two anti-cracking splints (810) and the two anti-cracking auxiliary plates (807), and every two mounting holes are connected, and the inner wall of every two connected mounting holes is provided with the same telescopic airbag (808). One side outer wall of the two pressurized airbags (811) is fixedly connected to two connecting pipes (821), and the output ends of the four connecting pipes (821) are respectively connected to the inside of the four telescopic airbags (808).

5. The turning mechanism for plate ink curing processing according to claim 1, characterized in that: Two transmission wheels (19) are provided on the two mounting plates (6), wherein the outer walls of the two transmission wheels (19) on the opposite side are fixedly connected to the same linkage rod (4), and the outer walls of the two transmission wheels (19) on the same side are provided with the same driving belt (20), and the two movable blocks (18) are provided with fixing openings, and the inner walls of the two fixing openings are fixedly connected to the outer walls of the two driving belts (20) respectively, and the outer wall of one side of one mounting plate (6) is fixedly connected to the flip motor (5), and the output shaft of the flip motor (5) is fixedly connected to the outer wall of one of the transmission wheels (19) through a coupling.

6. The turning mechanism for plate ink curing processing according to claim 1, characterized in that: Four substrate clamping frames (17) are fixedly connected to the bottom of the flip frame (12), two elastic pads (16) are provided on the inner walls on both sides of the four substrate clamping frames (17), and rectangular slots are provided on the outer walls on one side of the four substrate clamping frames (17). Four electric telescopic rods (14) are fixedly connected to the flip frame (12), and the output ends of the four electric telescopic rods (14) are fixedly connected to push plates (15), and the four push plates (15) are respectively located inside the four rectangular slots.

7. The turning mechanism for plate ink curing processing according to claim 1, characterized in that: The transport stabilization module (3) further comprises two fixed frames (301), both fixed frames (301) are fixedly connected to the transport platform (2), two movable openings (302) are respectively provided on one side outer wall of the two fixed frames (301), the inner walls of the four movable openings (302) are movably connected to a movable base (305), and four stabilization brackets (313) are respectively fixedly connected to one side outer wall of the four movable bases (305), and the four stabilization brackets (313) are respectively located inside the two fixed frames (301).

8. The turning mechanism for plate ink curing processing according to claim 7, characterized in that: Two mounting rods (307) are provided on each of the four stabilizing brackets (313), the outer walls of the two mounting rods (307) on the same stabilizing bracket (313) are provided with the same stabilizing arc (306), and the four stabilizing brackets (313) are fixedly connected with a fixing rod (312).

9. The turning mechanism for plate ink curing processing according to claim 8, characterized in that: One side outer wall of each of the two fixed frames (301) is movably connected to two shaft members (311), one end of each of the four shaft members (311) is fixedly connected to an eccentric plate member (309), each of the four eccentric plates (309) is provided with a connecting rod (308), one end of each of the four connecting rods (308) is movably connected to a fixing rod (312), one end of each of the four fixing rods (312) is fixedly connected to one side outer wall of each of the four stabilizing brackets (313), and the other end of each of the four shaft members (311) is fixedly connected to a linkage wheel (310), and the outer walls of the two linkage wheels (310) on the same side are provided with the same linkage belt (304), and one side outer wall of each of the two fixed frames (301) is fixedly connected to a servo motor (303), and the output shafts of the two servo motors (303) are fixedly connected to one side outer wall of each of the two linkage wheels (310) through a coupling.

Citation Information

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