Thermally conductive pad and heat sink assembly

Abstract

The invention provides a heat-conducting pad and a radiator assembly, the heat-conducting pad comprises a wear-resistant layer and a heat-conducting layer which are connected, the wear-resistant layer and the heat-conducting layer are at least distributed along the thickness direction of the heat-conducting pad, and the thickness of the heat-conducting layer can be changed. The thickness of the heat conduction layer can be changed, so that the thickness of the heat conduction pad can be changed, and the size of the slot in the thickness direction of the heat conduction pad is further changed to adapt to different assembly gaps between the plugging module and the radiator, so that the plugging module can be always attached to the heat conduction pad, and the contact thermal resistance between the heat conduction pad and the plugging module is remarkably reduced; the heat-conducting effect of the heat-conducting pad is improved. The heat conduction layer can be suitable for different assembly gaps and gap tolerances, so that the applicability of the heat conduction pad is improved, and the heat dissipation effect of the radiator on an electronic device is improved.

Description

Technical Field

[0001] This application relates to the technical field of heat conduction, and particularly to a heat-conducting pad and a radiator assembly. Background Art

[0002] With the continuous evolution of electronic information technology, the integration degree of electronic devices has also increased, resulting in a significant increase in the power consumption of electronic devices and an increase in the heat generated during operation. If the heat generated by the electronic device cannot be discharged in time, the temperature of the electronic device will be too high, thereby affecting the power and service life of the electronic device. Electronic devices usually have a plug-in module that can be connected to a radiator. After the plug-in module is inserted into the slot, it contacts the heat dissipation surface of the radiator, thereby conducting the heat of the plug-in module to the radiator to achieve heat dissipation of the electronic device. However, in some scenarios, there is a floating tolerance in the gap between the plug-in module and the radiator, resulting in poor contact between the plug-in module and the interface thermal conductive material and poor heat dissipation effect. Summary of the Invention

[0003] In view of this, the embodiments of this application provide a heat-conducting pad and a radiator assembly to solve the technical problem in the prior art that there is a floating tolerance in the gap between the plug-in module of the electronic device and the radiator, resulting in poor contact between the plug-in module and the interface thermal conductive material and poor heat dissipation effect.

[0004] In the first aspect of this application, a heat-conducting pad is provided. The heat-conducting pad includes a wear-resistant layer and a heat-conducting layer connected to each other. The wear-resistant layer and the heat-conducting layer are at least distributed along the thickness direction of the heat-conducting pad, and the thickness of the heat-conducting layer can change.

[0005] In this embodiment, the heat-conducting pad includes a wear-resistant layer and a heat-conducting layer. The heat-conducting layer is configured such that the size of the heat-conducting layer along the thickness direction of the heat-conducting pad can change when the temperature and / or pressure change, that is, the physical thickness of the heat-conducting layer presented when the temperature and / or pressure change can change, so that the physical thickness of the heat-conducting pad changes when the temperature and / or pressure change. Since the thickness of the heat-conducting layer can be changed, the thickness of the heat-conducting pad can be changed, and further the size of the slot along the thickness direction of the heat-conducting pad can be changed to adapt to different assembly gaps between the plug-in module and the radiator, and at the same time, the gap floating tolerance can be absorbed, so that the plug-in module can always be in contact with the heat-conducting pad, significantly reducing the contact thermal resistance between the heat-conducting pad and the plug-in module and improving the heat dissipation effect of the heat-conducting pad.

[0006] In a specific embodiment, at least part of the phase state of the heat-conducting layer can change, or at least part of the heat-conducting layer can elastically deform, or at least part of the material of the heat-conducting layer can flow.

[0007] In this embodiment, the thickness of the heat-conducting layer can be changed in the following ways, including but not limited to: when the pressure and / or temperature change, the phase state of at least part of the material of the heat-conducting layer can change, that is, it can change from a solid state to a liquid state, so that the thickness of the heat-conducting layer changes; when the pressure and / or temperature change, at least part of the heat-conducting layer can elastically deform, so that the thickness of the heat-conducting layer changes; when the pressure and / or temperature change, at least part of the material of the heat-conducting layer can flow, for example, it can flow in a direction perpendicular to the thickness direction of the heat-conducting pad, so that the thickness of the heat-conducting layer changes.

[0008] In a specific embodiment, the heat-conducting layer at least includes a first heat-conducting layer, and the first heat-conducting layer is a material that can be liquefied or pasted.

[0009] In this embodiment, the heat-conducting layer can include one or more of the following materials: phase-change heat-conducting materials, heat-conducting gels, heat-conducting greases, liquid metals, low-melting-point metals, etc. Each of the above materials is a material that can be liquefied or pasted. The liquefiable or pastable material can change its thickness when the temperature and / or pressure change, and wet the interface, so that the thickness of the heat-conducting layer changes, and can fill the gap between the heat-conducting layer and other interfaces connected thereto, reduce the thermal resistance, and improve the heat-conducting effect of the heat-conducting pad.

[0010] Among them, the phase-change heat-conducting material is a heat-conducting interface material that can change from a solid state to a liquid state at a preset temperature, and has the advantages of small thermal resistance and strong interface wetting ability. The heat-conducting gel is a soft silicone resin-based heat-conducting gap-filling material, which has high thermal conductivity, low interface thermal resistance and good thixotropy. The heat-conducting grease is a high-thermal-conductivity insulating silicone material, which can maintain the paste state during long-term use within a preset temperature range. The liquid metal is an amorphous and flowable liquid metal, such as gallium-indium-tin alloy. The low-melting-point metal is a metal with a low melting point under normal pressure. For example, indium-tin alloy with a melting point below 60 °C under normal pressure, etc.

[0011] In a specific embodiment, the material of the first heat-conducting layer is one or more of phase-change heat-conducting materials, heat-conducting gels, heat-conducting greases, liquid metals, and low-melting-point metals.

[0012] In this embodiment, the heat-conducting layer can be one of phase-change heat-conducting materials, heat-conducting gels, heat-conducting greases, liquid metals, and low-melting-point metals, and the heat-conducting layer is formed by a liquefiable / pastable heat-conducting coating. When the above materials are used for the heat-conducting layer, it can make the heat-conducting layer have good heat conductivity and improve the heat-conducting effect of the heat-conducting pad. At the same time, the above materials all have good deformability, so that the heat-conducting layer can change its own thickness under the action of different pressures and temperatures to adapt to the gap between the pluggable module and the radiator, and can wet the interface and reduce the thermal resistance.

[0013] In a specific embodiment, the heat-conducting layer further includes a second heat-conducting layer connected to the first heat-conducting layer, and the second heat-conducting layer is one or more of heat-conducting foam, carbon fiber, graphite, and graphene heat-conducting materials.

[0014] In this embodiment, the first heat-conducting layer is a heat-conducting coating that can be liquefied or pasted (one or more of phase-change heat-conducting materials, heat-conducting gels, heat-conducting silicone greases, liquid metals, low-melting-point metals, etc.), and the second heat-conducting layer can be one or more of heat-conducting foam, carbon fiber, graphite, or graphene heat-conducting materials. For example, the second heat-conducting layer is carbon fiber and the first heat-conducting layer is composite heat-conducting silicone grease, or the second heat-conducting layer is carbon fiber and the first heat-conducting layer is liquid metal, or the second heat-conducting layer is graphene and the first heat-conducting layer is low-melting-point metal, or the second heat-conducting layer is graphene and the first heat-conducting layer is phase-change heat-conducting material. The first heat-conducting layer can change its thickness when the temperature and / or pressure change to wet the interface, thereby filling the gaps at the interface and reducing the thermal resistance. The second heat-conducting layer can undergo elastic deformation in the thickness direction, providing a certain supporting effect on the first heat-conducting layer, so that the heat-conducting layer maintains a certain shape. Therefore, the thicknesses of both the first heat-conducting layer and the second heat-conducting layer in the heat-conducting pad in this embodiment can change, causing the thickness of the heat-conducting pad to change.

[0015] In a specific embodiment, the first heat-conducting layer and the second heat-conducting layer are stacked along the thickness direction of the heat-conducting pad.

[0016] In this embodiment, the heat-conducting layer can include a first heat-conducting layer and a second heat-conducting layer. Along the thickness direction of the heat-conducting pad, the first heat-conducting layer is provided on both the upper and lower end faces of the second heat-conducting layer.

[0017] In a specific embodiment, the first heat-conducting layer surrounds the second heat-conducting layer.

[0018] In this embodiment, the heat-conducting layer of the heat-conducting pad includes a first heat-conducting layer and a second heat-conducting layer. Among them, the first heat-conducting layer surrounds the second heat-conducting layer, that is, the second heat-conducting layer is located in the cavity formed by the first heat-conducting layer. The first heat-conducting layer is a material that can be liquefied or pasted. For example, the first heat-conducting layer can be any one of phase-change heat-conducting materials, heat-conducting gels, heat-conducting silicone greases, liquid metals, and low-melting-point metals; the second heat-conducting layer can be one or more of heat-conducting foam, carbon fiber, graphite, or graphene heat-conducting materials. The first heat-conducting layer can change its thickness when the temperature and / or pressure change, has good interface wettability, can fill the gaps at the interface, and reduce the thermal resistance. The second heat-conducting layer can undergo elastic deformation in the thickness direction when the pressure changes to match different assembly gaps and gap tolerances between the plug-in module and the radiator. At the same time, it provides a certain supporting effect on the first heat-conducting layer, so that the heat-conducting layer maintains a certain shape.

[0019] In a specific embodiment, the heat-conducting layer includes a heat-conducting foam layer and a liquefiable or pasty layer disposed on the heat-conducting foam layer, or the heat-conducting layer includes a carbon-based heat-conducting material layer and a liquefiable or pasty layer disposed on the carbon-based heat-conducting material layer.

[0020] In this embodiment, the heat-conducting layer may further include one or more of heat-conducting foam, carbon fiber, graphite or graphene heat-conducting materials, and the heat-conducting layer may be a composite of one or more of phase-change heat-conducting materials, heat-conducting gels, heat-conducting silicone greases, liquid metals, low-melting-point metals, heat-conducting foams, carbon fibers, graphite or graphene heat-conducting materials. Compared with liquefiable or pasty materials such as phase-change heat-conducting materials, heat-conducting gels, heat-conducting silicone greases, liquid metals, low-melting-point metals, heat-conducting foam, carbon fiber, graphite or graphene heat-conducting materials can be cut and formed, and can undergo elastic deformation in the thickness direction, playing a certain supporting role for liquefiable or pasty materials.

[0021] In a specific embodiment, the heat-conducting layer includes a carbon fiber cushion layer and heat-conducting silicone grease layers disposed on both sides of the carbon fiber layer in the thickness direction, or the heat-conducting layer includes a carbon fiber cushion layer and liquid metal layers disposed on both sides of the carbon fiber layer in the thickness direction, or the heat-conducting layer includes a graphene layer and low-melting-point metal layers disposed on both sides of the graphene layer in the thickness direction, or the heat-conducting layer includes a graphene layer and phase-change heat-conducting material layers disposed on both sides of the graphene layer in the thickness direction.

[0022] In this embodiment, when the heat-conducting layer is composed of two or more heat-conducting materials, it can be a heat-conducting foam or a carbon-based heat-conducting material with other liquefiable / pasty heat-conducting coatings (one or more of materials such as phase-change heat-conducting materials, heat-conducting gels, heat-conducting silicone greases, liquid metals, low-melting-point metals) on one or both sides, or it can be a carbon fiber pad with heat-conducting silicone grease on both sides, a carbon fiber pad with liquid metal on both sides, a graphene pad with low-melting-point metal on both sides, a graphene pad with phase-change heat-conducting material on both sides, etc.

[0023] In a specific embodiment, the heat-conducting pad includes a wear-resistant layer and a heat-conducting layer connected to each other, and the wear-resistant layer and the heat-conducting layer are at least distributed along the thickness direction of the heat-conducting pad. The wear-resistant layer is a metal film, or the wear-resistant layer includes a metal layer and a non-metal layer.

[0024] In this embodiment, the wear-resistant layer can be one or more of a metal film or a metal / non-metal composite film. This wear-resistant layer has both excellent tear / penetration resistance and heat-conducting performance, enabling the heat-conducting pad to meet the requirement of not being damaged after multiple plugging and unplugging operations.

[0025] In a specific embodiment, the wear-resistant layer is one or more of a copper alloy film, a copper-nickel plated film, a copper alloy-nickel plated film, an aluminum alloy film, an aluminum-nickel plated film, an aluminum alloy-nickel plated film, a magnesium alloy film, a stainless steel film, and a tungsten alloy film.

[0026] In this embodiment, the wear-resistant layer may specifically be any one of flexible metal films such as a copper alloy film, a copper (alloy)-nickel plated film, an aluminum alloy film, an aluminum (alloy)-nickel plated film, a magnesium alloy film, a stainless steel film, and a tungsten alloy film. This flexible metal film has the advantages of high modulus, low static friction coefficient, and good thermal conductivity. Using this flexible metal film as the material of the wear-resistant layer enables the wear-resistant layer to have good wear resistance and thermal conductivity, improving the thermal conductivity and service life of the thermal conductive pad.

[0027] In a specific embodiment, the thickness of the wear-resistant layer is 5 μm - 50 μm.

[0028] In this embodiment, the thickness of the wear-resistant layer made of the flexible metal film material can be 5 μm - 50 μm.

[0029] In a specific embodiment, the wear-resistant layer is one or more of a metal / graphite composite film, a metal / graphene composite film, and a metal / carbon fiber composite film.

[0030] In this embodiment, the wear-resistant layer may be any one of metal / non-metal composite films such as a metal / graphite composite film, a metal / graphene composite film, and a metal / carbon fiber composite film. The metal / non-metal composite film has the advantages of high modulus, low static friction coefficient, and good thermal conductivity. Using this metal / non-metal composite film as the material of the wear-resistant layer enables the wear-resistant layer to have good wear resistance and thermal conductivity, improving the thermal conductivity and service life of the thermal conductive pad.

[0031] In a specific embodiment, the thickness of the wear-resistant layer is 10 μm - 500 μm.

[0032] In this embodiment, the thickness of the wear-resistant layer made of the metal and non-metal composite material is 10 μm - 500 μm.

[0033] In a specific embodiment, the thermal conductivity of the wear-resistant layer is greater than 15 W / m·K.

[0034] In this embodiment, the wear-resistant layer also has a relatively high thermal conductivity, enabling the heat in the plug-in module to be transferred more quickly through the wear-resistant layer, enhancing the thermal conductivity effect of the thermal conductive pad. The thermal conductivity of the wear-resistant layer can be greater than 15 W / m·K.

[0035] In a specific embodiment, the projection of the wear-resistant layer along the thickness direction of the thermal conductive pad covers the projection of the thermal conductive layer along the thickness direction of the thermal conductive pad.

[0036] In this embodiment, the area of the wear-resistant layer is larger than that of the heat-conducting layer. Along the thickness direction of the heat-conducting pad, the projection of the wear-resistant layer completely covers the heat-conducting layer. When connecting the heat-conducting pad to the convex platform of the radiator, the heat-conducting layer contacts the convex surface of the radiator. Along the thickness direction of the heat-conducting pad, the wear-resistant layer at the connection area can be bent around the convex platform of the radiator, so that the connection area is connected to the side wall of the convex platform of the radiator, thereby installing the heat-conducting pad on the radiator. When the plug-in module of the electronic device is inserted into the slot, the plug-in module can contact the wear-resistant layer, so that the heat generated by the operation of the plug-in module can be quickly conducted to the radiator through the heat-conducting layer.

[0037] In a specific embodiment, the heat-conducting pad further includes an adhesive layer connected to the wear-resistant layer.

[0038] In this embodiment, the heat-conducting pad may further include an adhesive layer. The adhesive layer is located in the connection area of the heat-conducting pad, that is, the adhesive layer is connected to the wear-resistant layer in the connection area, and is used to paste the heat-conducting pad at a preset position. Specifically, when the heat-conducting pad is used for a radiator, along the thickness direction of the heat-conducting pad, the adhesive layer is located between the wear-resistant layer at the connection area and the radiator, and connects the wear-resistant layer and the radiator, thereby pasting the heat-conducting pad on the radiator. The connection method of the heat-conducting pad and the radiator through the adhesive layer has the advantages of low cost and easy implementation.

[0039] In a specific embodiment, the heat-conducting pad includes a heat-conducting area and a connection area located on the outer periphery of the heat-conducting area. The heat-conducting layer is located in the heat-conducting area. The heat-conducting pad further includes a support layer located in the connection area. The support layer is connected to the wear-resistant layer and surrounds the heat-conducting layer along the circumferential direction.

[0040] In this embodiment, when the heat-conducting pad is pasted on the radiator, the wear-resistant layer and the adhesive layer in the connection area are bent towards the support layer, so that the adhesive layer is pasted on the side wall of the support layer and then pasted on the radiator. The support layer plays a supporting role for the wear-resistant layer, avoiding the situation of suspension when the wear-resistant layer is bent and resulting in plugging and breaking. At the same time, the support layer can play a further protective role for the heat-conducting layer. For example, when the heat-conducting layer is a heat-conducting material such as liquid metal, by providing a support layer surrounding the heat-conducting layer, it can prevent water vapor from invading the heat-conducting layer, slow down the aging speed of the liquid heat-conducting material, and extend the service life of the heat-conducting layer.

[0041] In a specific embodiment, the wear-resistant layer surrounds the heat-conducting layer. The heat-conducting pad further includes a support layer. The heat-conducting layer surrounds the support layer, or the support layer is located between the heat-conducting layer and the wear-resistant layer.

[0042] In this embodiment, the support layer can be located inside the heat-conducting layer, that is, the heat-conducting layer can surround the support layer. Alternatively, the support layer can also be located between the heat-conducting layer and the wear-resistant layer, that is, the support layer surrounds the heat-conducting layer and the wear-resistant layer surrounds the support layer. The support layer can play a role in supporting the wear-resistant layer and the heat-conducting layer.

[0043] In a specific embodiment, the support layer can elastically deform.

[0044] In this embodiment, the support layer has heat conductivity and can elastically deform. When the thickness of the heat-conducting layer changes due to temperature and / or pressure changes, the support layer can elastically deform to match the thickness change of the heat-conducting pad.

[0045] In the second aspect of the present application, a radiator assembly is provided. The radiator assembly includes a radiator and a heat-conducting pad. The heat-conducting pad is connected to the radiator, and the wear-resistant layer is located on the side of the heat-conducting layer facing away from the radiator.

[0046] In this embodiment, the heat-conducting pad is installed on the radiator and is used to enclose the above-mentioned slot. After installation, the wear-resistant layer of the heat-conducting pad faces outward and is used to contact the plug-in module of the electronic device. Since the thickness of the heat-conducting layer can change, the thickness of the heat-conducting pad can be changed, and further the size of the slot in the thickness direction of the heat-conducting pad can be changed to adapt to different assembly clearances between the plug-in module and the radiator, so that the plug-in module can always fit the heat-conducting pad, thereby significantly reducing the contact thermal resistance between the heat-conducting pad and the plug-in module and improving the heat-conducting effect of the heat-conducting pad. The heat-conducting layer can be applicable to different assembly clearances and clearance tolerances, thereby improving the applicability of the heat-conducting pad and enhancing the heat dissipation effect of the radiator on the electronic device. Description of the Drawings

[0047] Figure 1 Schematic structural diagram of the radiator, heat-conducting pad and plug-in module of the electronic device provided by the present application in a specific embodiment;

[0048] Figure 2 is Figure 1 Schematic structural diagram of the heat-conducting pad in a specific embodiment in;

[0049] Figure 3 is Figure 1 Schematic structural diagram of the heat-conducting pad in another specific embodiment in;

[0050] Figure 4 is Figure 1 Schematic structural diagram of the heat-conducting pad in yet another specific embodiment in;

[0051] Figure 5 is Figure 1 Schematic structural diagram of the heat-conducting pad in yet another specific embodiment in;

[0052] Figure 6 is Figure 1 A schematic structural view of the thermal pad in yet another specific embodiment;

[0053] Figure 7 is Figure 1 A schematic structural view of the thermal pad in yet another specific embodiment;

[0054] Figure 8 is Figure 1 A schematic structural view of the thermal pad in yet another specific embodiment;

[0055] Figure 9 is Figure 1 A schematic structural view of the thermal pad in yet another specific embodiment.

[0056] Description of reference numerals:

[0057] 1 - heat sink;

[0058] 11 - boss;

[0059] 12 - thermal pad;

[0060] 121 - wear - resistant layer;

[0061] 122 - thermal conductive layer;

[0062] 122a - first thermal conductive layer;

[0063] 122b - second thermal conductive layer;

[0064] 123 - adhesive layer;

[0065] 124 - support layer;

[0066] 125 - thermal conductive area;

[0067] 126 - connection area;

[0068] 13 - bracket;

[0069] 2 - plug - in module.

[0070] The accompanying drawings here are incorporated into the specification and form a part of this specification, showing embodiments consistent with the present application and, together with the specification, are used to explain the principles of the present application. Detailed description of the specific embodiments

[0071] To better understand the technical solutions of the present application, the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0072] In one specific embodiment, the present application will be further described in detail below through specific embodiments and with reference to the accompanying drawings.

[0073] The terms used in the embodiments of the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The singular forms "a", "the", and "said" used in the embodiments of the present application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0074] It should be understood that the term " / and" used herein is only a relationship describing associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the associated objects before and after.

[0075] It should be noted that the orientation terms such as "upper", "lower", "left", and "right" described in the embodiments of the present application are described from the angles shown in the drawings and should not be construed as limiting the embodiments of the present application. In addition, in the context, it should also be understood that when it is mentioned that an element is connected "above" or "below" another element, it can not only be directly connected "above" or "below" another element, but also be indirectly connected "above" or "below" another element through an intermediate element.

[0076] With the continuous evolution of electronic information technology, the integration degree of electronic devices is getting higher and higher, which significantly increases the power consumption of electronic devices. The increase in the power consumption of electronic devices will generate more heat when the electronic devices are working. If the generated heat cannot be discharged in time, the temperature of the electronic devices will gradually increase. When the temperature is too high, the resistance in the electronic devices will increase, which will reduce the working efficiency and service life of the electronic devices.

[0077] Figure 1 The partial structural schematic diagram of an electronic component in a specific embodiment is shown. As Figure 1 shown, the electronic component includes a heat sink 1 and an electronic device to be cooled. In a specific embodiment, there is a slot between the heat sink 1 and the bracket 13 of the electronic component. The electronic device to be cooled has a plug-in module 2, and the plug-in module 2 can be inserted into the slot. During the process of inserting the plug-in module 2 into the corresponding slot, if the surface of the plug-in module 2 is in direct contact with the surface of the heat sink 1, there is a risk of abrasion and chip removal due to direct scraping with the heat sink 1 during the plugging process. Moreover, the surface of the plug-in module 2 and the surface of the heat sink 1 are in hard contact, with a large interfacial contact thermal resistance, and the heat sink 1 cannot effectively transfer heat, resulting in too high an operating temperature of the electronic device and affecting the normal use of the electronic device.

[0078] To solve this technical problem, a thermal pad is provided between the radiator 1 and the plug-in module 2. During the plugging and unplugging process of the plug-in module 2, the plug-in module 2 comes into contact with the thermal pad, so that there is no need for direct contact between the plug-in module 2 and the radiator 1, reducing the risk of abrasion on the surfaces of the plug-in module 2 and the radiator 1 during the plugging and unplugging process, and improving the service life of the electronic device and the radiator 1. At the same time, this thermal pad can also conduct the heat in the electronic device to the radiator 1 faster, and discharge the heat through the radiator 1 to achieve heat dissipation of the electronic device. Usually, this thermal pad can be made of a thermal conductive material, but ordinary thermal pads have poor puncture resistance and tear resistance. During the repeated plugging and unplugging of the plug-in module 2 of the electronic device, the thermal pad is prone to breakage due to the shear force of the electronic device, affecting the heat dissipation effect.

[0079] To solve this technical problem, an embodiment of the present application provides a thermal pad 12 and a radiator assembly including the thermal pad 12. As Figure 1 shown, the radiator assembly includes a radiator 1. Along the thickness direction X of the thermal pad 12, the thermal pad 12 is located between the plug-in module 2 and the radiator 1. After the plug-in module 2 is connected to the radiator 1, both sides of the thermal pad 12 are respectively attached to the plug-in module 2 and the radiator 1, so that the heat generated when the plug-in module 2 works can be quickly conducted to the radiator 1 through the thermal pad 12 and discharged through the radiator 1 to complete the heat dissipation work of the plug-in module 2.

[0080] Referring to Figure 2 , Figure 2 For Figure 1 is a schematic structural diagram of the thermal pad 12 in a specific embodiment. The thermal pad 12 includes a wear-resistant layer 121 and a thermal conductive layer 122 connected to each other. The wear-resistant layer 121 and the thermal conductive layer 122 are at least distributed along the thickness direction X of the thermal pad 12, that is, along the thickness direction X of the thermal pad 12, the thermal pad 12 includes at least one wear-resistant layer 121 and one thermal conductive layer 122. Among them, the wear-resistant layer 121 has a high yield strength, tensile strength and elastic modulus, and a low surface static friction coefficient, and is not prone to puncture and tear under external forces. The wear-resistant layer 121 also has a high thermal conductivity coefficient, enhancing the heat dissipation effect of the thermal pad 12. The thermal conductive layer 122 is made of a thermal conductive material and has a high thermal conductivity coefficient, which can fill the tiny gaps between interfaces, reduce the interface contact thermal resistance, and make the thermal pad 12 have a good heat dissipation effect.

[0081] In a specific implementation, as Figure 1As shown, the thermal pad 12 is installed on the radiator 1, and the thermal pad 12 is used to enclose the above-mentioned slot. After installation, the wear-resistant layer 121 of the thermal pad 12 faces outward, and the wear-resistant layer 121 is used to contact the plug-in module 2 of the electronic device. During the repeated plugging and unplugging of the plug-in module 2, the plug-in module 2 contacts the wear-resistant layer 121 of the thermal pad 12. Since the elastic modulus, strength, and stiffness of the wear-resistant layer 121 are relatively high, it is not easily punctured and damaged under the action of the shear force during the plugging and unplugging process, thus extending the service life of the thermal pad 12. At the same time, the surface static friction coefficient of the wear-resistant layer 121 is low, resulting in a small frictional force between it and the plug-in module 2, which facilitates the plugging and unplugging of the plug-in module 2 of the electronic device. The wear-resistant layer 121 also has a relatively high thermal conductivity, which can quickly transfer the heat generated by the plug-in module to the inner thermal conductive layer 122. The thermal conductive layer 122 located inside the wear-resistant layer 121 has good thermal conductivity and can quickly conduct the heat generated in the plug-in module 2 to the radiator 1, improving the heat conduction effect of the thermal pad 12, and thus enhancing the heat dissipation effect of the radiator 1 on the plug-in module 2.

[0082] In a specific embodiment, the wear-resistant layer 121 can be one or more of a metal film or a metal / non-metal composite film. Specifically, the metal film can be a copper alloy film, a copper (or copper alloy) nickel-plated film, an aluminum alloy film, an aluminum (or aluminum alloy) nickel-plated film, a magnesium alloy film, a stainless steel film, a tungsten alloy film, etc., and the thickness can be 5μm - 50μm. The metal / non-metal composite film can be a metal / carbon material composite film, specifically a metal film / graphite composite film, a metal film / graphene composite film, a metal film / carbon fiber composite film, and the thickness can be 10μm - 500μm. Such metal / non-metal composite films can be obtained by in-situ orderly growing carbon materials on the metal film through physical / chemical methods in addition to ordinary physical coating preparation, and there is a better bonding force between the metal and the non-metal. The wear-resistant layer 121 has both excellent tear / penetration resistance and thermal conductivity, enabling the thermal pad 12 to withstand multiple pluggings and unplugging without damage.

[0083] In the above-mentioned electronic component, there is a floating tolerance in the gap between the plug-in module 2 and the radiator 1, resulting in the plug-in module 2 not being able to fully contact the thermal conductive layer 122 of the thermal pad 12, leading to a poor heat dissipation effect.

[0084] To solve this technical problem, the thermal conductive layer 122 of the thermal pad 12 in the embodiment of the present application is configured such that the size of the thermal conductive layer 122 along the thickness direction X of the thermal pad 12 can vary when the temperature and / or pressure changes, that is, the physical thickness presented by the thermal conductive layer 122 can change when the temperature and / or pressure changes, so that the physical thickness of the thermal pad 12 changes when the temperature and / or pressure changes.

[0085] Since the thickness of the heat-conducting layer 122 can be changed, the thickness of the heat-conducting pad 12 can be changed accordingly, and then the dimension of the slot along the thickness direction X of the heat-conducting pad 12 can be changed to adapt to different assembly clearances between the pluggable module 2 and the radiator 1. At the same time, the clearance floating tolerance can be absorbed, so that the pluggable module 2 can always be in contact with the heat-conducting pad 12, thereby significantly reducing the contact thermal resistance between the heat-conducting pad 12 and the pluggable module 2 and improving the heat-conducting effect of the heat-conducting pad 12.

[0086] In a specific embodiment, the change in the thickness of the heat-conducting layer 122 includes but is not limited to the following ways: when the pressure and / or temperature change, the phase state of at least part of the material of the heat-conducting layer 122 can change, that is, it can change from a solid state to a liquid state, so that the thickness of the heat-conducting layer 122 changes; when the pressure and / or temperature change, at least part of the heat-conducting layer 122 can elastically deform, so that the thickness of the heat-conducting layer 122 changes; when the pressure and / or temperature change, at least part of the material of the heat-conducting layer 122 can flow, for example, it can flow in a direction perpendicular to the thickness direction X of the heat-conducting pad 12, so that the thickness of the heat-conducting layer 122 changes.

[0087] In a specific embodiment, the heat-conducting layer 122 may include one or more of phase change heat-conducting materials, heat-conducting gels, heat-conducting greases, liquid metals, low-melting-point metals and other materials. The above-mentioned materials are all liquefiable or pasty materials. The liquefiable or pasty materials can change their thickness when the temperature and / or pressure change, and wet the interface, so that the thickness of the heat-conducting layer 122 changes, and can fill the gap between the heat-conducting layer 122 and other interfaces connected thereto, reduce the thermal resistance, and improve the heat-conducting effect of the heat-conducting pad 12. Among them, the phase change heat-conducting material is a heat-conducting interface material that can change from a solid state to a liquid state at a preset temperature, and has the advantages of small thermal resistance and strong interface wetting ability. The heat-conducting gel is a soft silicone-based heat-conducting gap filling material with high thermal conductivity, low interface thermal resistance and good thixotropy. The heat-conducting grease is a high heat-conducting insulating silicone material that can maintain the paste state during long-term use within a preset temperature range. The liquid metal is an amorphous and flowable liquid metal. The low-melting-point metal is a metal with a low melting point under normal pressure. For example, the indium-tin-bismuth alloy with a melting point below 60°C under normal pressure.

[0088] In a specific embodiment, the heat-conducting layer 122 may further include one or more of heat-conducting foam, carbon fiber, graphite or graphene heat-conducting materials. The heat-conducting layer 122 may be a composite of one or more of phase-change heat-conducting materials, heat-conducting gels, heat-conducting silicone greases, liquid metals, low-melting-point metals, heat-conducting foams, carbon fibers, graphite or graphene heat-conducting materials. Compared with materials such as phase-change heat-conducting materials, heat-conducting gels, heat-conducting silicone greases, liquid metals, and low-melting-point metals that can be liquefied or pasted, heat-conducting foams, carbon fibers, graphite or graphene heat-conducting materials can be cut and formed, can undergo elastic deformation in the thickness direction X, and also play a certain supporting role for liquefiable or pasty materials.

[0089] For example, when the heat-conducting layer 122 is composed of two or more heat-conducting materials in combination, it can be a heat-conducting foam or a carbon-based heat-conducting material with other liquefiable / pasty heat-conducting coatings (one or more of materials such as phase-change heat-conducting materials, heat-conducting gels, heat-conducting silicone greases, liquid metals, and low-melting-point metals) compounded on one or both sides. It can also be a carbon fiber pad with heat-conducting silicone grease compounded on both sides, a carbon fiber pad with liquid metal compounded on both sides, a graphene pad with low-melting-point metal compounded on both sides, a graphene pad with phase-change heat-conducting material compounded on both sides, etc.

[0090] The heat-conducting layer 122 can be processed specifically in the following ways: coating liquefiable / pasty heat-conducting materials on carbon-based heat-conducting materials or heat-conducting foams by physical spin coating, or in-situ compounding liquid metals / low-melting-point metals on carbon-based heat-conducting materials or heat-conducting foams by physical / chemical vapor deposition methods.

[0091] In a specific embodiment, the thickness of the heat-conducting layer 122 can be designed differently according to different assembly clearances. In this embodiment, the thickness of the heat-conducting layer 122 can be 20 μm - 2.5 mm, and the thickness change of the heat-conducting layer 122 with this thickness can adapt to the assembly clearance between the pluggable module 2 and the radiator 1 from the micron level to the millimeter level. For example, the thickness of the heat-conducting layer 122 can be 20 μm, 80 μm, 100 μm, 500 μm, 1 mm, 2 mm, 2.5 mm, etc.

[0092] In each of the above embodiments, the wear-resistant layer 121 also has a relatively high heat-conductivity coefficient, enabling the heat in the pluggable module 2 to be transferred more quickly through the wear-resistant layer 121, thereby enhancing the heat-conducting effect of the heat-conducting pad 12. For example, the heat-conductivity coefficient of the wear-resistant layer 121 can be greater than 15 W / (m·K). The heat-conductivity coefficient of the heat-conducting layer 122 is greater than that of the wear-resistant layer 121, playing a core heat-conducting role in the heat-conducting pad 12.

[0093] In a specific embodiment, referring to Figure 1 , the radiator 1 may be provided with a boss 11, and the heat-conducting pad 12 is connected to the boss 11. At the same time, please refer to Figure 2, the heat-conducting pad 12 includes a heat-conducting area 125 and a connecting area 126. The connecting area 126 is located on the outer periphery of the heat-conducting area 125. The heat-conducting layer 122 is located within the heat-conducting area 125, that is, the heat-conducting layer 122 is not provided in the connecting area 126, and the thickness of the connecting area 126 is less than the thickness of the heat-conducting area 125. Therefore, in this embodiment, the area of the wear-resistant layer 121 is larger than the area of the heat-conducting layer 122. Along the thickness direction X of the heat-conducting pad 12, the projection of the wear-resistant layer 121 completely covers the heat-conducting layer 122. When connecting the heat-conducting pad 12 to the boss 11, along the thickness direction X of the heat-conducting pad 12, the wear-resistant layer 121 at the connecting area 126 can be bent around the boss 11, so that the connecting area 126 is connected to the side wall of the boss 11, thereby installing the heat-conducting pad 12 on the radiator 1. At the same time, the heat-conducting area 125 is connected to the top wall of the boss 11. When the plug-in module 2 of the electronic device is inserted into the slot, the plug-in module 2 can contact the wear-resistant layer 121, so that the heat generated by the operation of the plug-in module 2 can be quickly conducted to the radiator 1 through the heat-conducting layer 122.

[0094] Among them, as Figure 2 shown, the heat-conducting pad 12 can be fixed on the side wall of the boss 11 of the radiator 1 by welding.

[0095] In another specific embodiment, as Figure 3 shown, Figure 3 is a schematic structural diagram of the heat-conducting pad 12 provided by the present application in another specific embodiment. The heat-conducting pad 12 may further include an adhesive layer 123. The adhesive layer 123 is located in the connecting area 126 of the heat-conducting pad 12, that is, the adhesive layer 123 is connected to the wear-resistant layer 121 in the connecting area 126, and is used to paste the heat-conducting pad 12 at a preset position.

[0096] Specifically, when the heat-conducting pad 12 is used for the radiator 1, along the thickness direction X of the heat-conducting pad 12, the adhesive layer 123 is located between the wear-resistant layer 121 at the connecting area 126 and the radiator 1, and connects the wear-resistant layer 121 and the radiator 1, thereby pasting the heat-conducting pad 12 on the radiator 1. The connection method between the heat-conducting pad 12 and the radiator 1 through the adhesive layer 123 has the advantages of low cost and easy implementation.

[0097] Among them, the adhesive layer 123 has good shear strength and peel strength, which can prevent the heat-conducting pad 12 from shifting in position during the repeated contact with the plug-in module 2, and improve the connection reliability between the heat-conducting pad 12 and the radiator 1. The adhesive layer 123 can be silicone double-sided tape, pressure-sensitive acrylic double-sided tape, pressure-sensitive silicone-based double-sided tape, pressure-sensitive heat-conducting adhesive.

[0098] In a specific embodiment, as Figure 3As shown, along the thickness direction X of the heat-conducting pad 12, the adhesive layer 123 is fixedly connected to the bottom surface of the wear-resistant layer 121 and is arranged around the heat-conducting layer 122. In this embodiment, the connection area 126 of the heat-conducting pad 12 includes the wear-resistant layer 121 and the adhesive layer 123 stacked along the thickness direction X, and the heat-conducting area 125 of the heat-conducting pad 12 includes the wear-resistant layer 121 and the heat-conducting layer 122 stacked along the thickness direction X. The thickness of the connection area 126 is less than the thickness of the heat-conducting area 125.

[0099] In this embodiment, when the heat-conducting pad 12 is a composite structure stacked up and down, along the thickness direction X of the heat-conducting pad 12, the adhesive layer 123 is connected to the bottom surface of the wear-resistant layer 121, so that the adhesive layer 123 is connected to the surface of the radiator 1, thereby fixedly connecting the heat-conducting pad 12 to the radiator 1. At the same time, the adhesive layer 123 is located in the connection area 126 and is arranged around the heat-conducting layer 122, so that the heat-conducting layer 122 can directly contact the radiator 1, thereby accelerating the heat conduction and improving the heat-conducting effect of the heat-conducting pad 12.

[0100] In a specific embodiment, as Figure 3 shown, the projection of the wear-resistant layer 121 along the thickness direction X covers the heat-conducting layer 122 and the adhesive layer 123, that is, the area of the wear-resistant layer 121 is larger than the area of the heat-conducting layer 122 and the area of the adhesive layer 123. The wear-resistant layer 121 can protect the heat-conducting layer 122 and the adhesive layer 123. At the same time, the heat-conducting layer 122 is in direct contact with the surface of the radiator 1, accelerating the heat conduction, so that the heat in the plug-in module 2 can be conducted to the heat-conducting layer 122 through the wear-resistant layer 121, and then quickly conducted to the radiator 1 through the heat-conducting layer 122, improving the heat-conducting effect of the heat-conducting pad 12.

[0101] In this embodiment, the wear-resistant layer 121 can be a flexible metal film or a metal / non-metal composite film. Specifically, the wear-resistant layer 121 can be any one of a flexible metal film such as a copper alloy film, a nickel-plated copper (alloy) film, an aluminum alloy film, a nickel-plated aluminum (alloy) film, a magnesium alloy film, a stainless steel film, and a tungsten alloy film. The flexible metal film has the advantages of high modulus, low static friction coefficient, and good heat conductivity. Using the flexible metal film as the material of the wear-resistant layer 121 makes the wear-resistant layer 121 have good wear resistance and heat conductivity, improving the heat-conducting ability and service life of the heat-conducting pad 12. Among them, the thickness of the wear-resistant layer 121 made of the flexible metal film material can be 5μm - 50μm.

[0102] In another specific embodiment, the wear-resistant layer 121 can be any one of a metal / graphite composite film, a metal / graphene composite film, and a metal / carbon fiber composite film, which are metal / non-metal composite films. The metal / non-metal composite film has the advantages of high modulus, low static friction coefficient, and good thermal conductivity. Using this metal / non-metal composite film as the material of the wear-resistant layer 121 makes the wear-resistant layer 121 have good wear resistance and thermal conductivity, improving the thermal conductivity and service life of the thermal pad 12. Among them, the thickness of the wear-resistant layer 121 made of the metal / non-metal composite material is 10μm - 500μm. The metal and non-metal composite film can be prepared by physical coating or by in-situ orderly growing carbon materials on the metal film by physical or chemical methods. The second method can make the combination between the metal material and the non-metal material more tightly and firmly.

[0103] In this embodiment, the heat-conducting layer 122 can be one of a phase-change heat-conducting material, a heat-conducting gel, a heat-conducting silicone grease, a liquid metal, and a low-melting-point metal, that is Figure 3 In the shown embodiment, the heat-conducting layer 122 is formed by a heat-conducting coating that can be liquefied / pasted. When the heat-conducting layer 122 uses the above materials, it can make the heat-conducting layer 122 have good thermal conductivity, improving the heat-conducting effect of the thermal pad 12. At the same time, the above materials all have good deformability, enabling the heat-conducting layer 122 to change its own thickness under the action of different pressures and temperatures to adapt to the gap between the plug-in module 2 and the radiator 1, and being able to wet the interface and reduce the thermal resistance.

[0104] In a specific embodiment, refer to Figure 4 , Figure 4 is Figure 1Schematic structural diagram of the middle thermal pad 12 in another specific embodiment. The thermal conductive layer 122 may include a first thermal conductive layer 122a and a second thermal conductive layer 122b. Along the thickness direction X of the thermal pad 12, the first thermal conductive layer 122a is provided on both the upper and lower end faces of the second thermal conductive layer 122b. Among them, the first thermal conductive layer 122a is a thermal conductive coating that can be liquefied or pasted (one or more of materials such as phase change thermal conductive materials, thermal conductive gels, thermal conductive silicone greases, liquid metals, low melting point metals, etc.), and the second thermal conductive layer 122b can be one or more of thermal conductive foams, carbon fibers, graphite or graphene thermal conductive materials. For example, the second thermal conductive layer 122b is a carbon fiber, and the first thermal conductive layer 122a is a composite thermal conductive silicone grease; or the second thermal conductive layer 122b is a carbon fiber, and the first thermal conductive layer 122a is a liquid metal; or the second thermal conductive layer 122b is graphene, and the first thermal conductive layer 122a is a low melting point metal; or the second thermal conductive layer 122b is graphene, and the first thermal conductive layer 122a is a phase change thermal conductive material. The first thermal conductive layer 122a can change its thickness when the temperature and / or pressure change to wet the interface, thereby filling the gaps in the interface and reducing the thermal resistance. The second thermal conductive layer 122b can undergo elastic deformation in the thickness direction X, providing a certain supporting effect on the first thermal conductive layer 122a, so as to keep the thermal conductive layer 122 in a certain shape. Therefore, the thicknesses of both the first thermal conductive layer 122a and the second thermal conductive layer 122b of the thermal pad 12 in this embodiment can change, resulting in a change in the thickness of the thermal pad 12.

[0105] When the thermal conductive layer 122 includes the first thermal conductive layer 122a and the second thermal conductive layer 122b, the first thermal conductive layer 122a has good deformability and wettability; the second thermal conductive layer 122b can be cut and formed, and can undergo elastic deformation in the thickness direction X, while providing a certain supporting effect on the first thermal conductive layer 122a, so that the thermal pad 12 adapts to the clearance tolerance between the plug-in module 2 and the radiator 1.

[0106] Example 1: Refer to Figure 4 , the wear-resistant layer 121 uses a 10-μm stainless steel film, the second thermal conductive layer 122b uses a graphene thermal pad with a thickness of 0.3 mm and a thermal conductivity of 90 W / m·K, the first thermal conductive layer 122a uses indium with a thickness of 5 μm, the first thermal conductive layer 122a and the second thermal conductive layer 122b are stacked along the thickness direction X of the thermal pad 12, and the adhesive layer 123 uses an organosilicon double-sided tape with a thickness of 50 μm and a shear strength greater than 1 MPa.

[0107] Example 2: Refer to Figure 4, the wear-resistant layer 121 is made of a beryllium copper (copper alloy) film with a thickness of 10 μm, the second heat-conducting layer 122b is made of a graphene heat-conducting pad with a thickness of 0.3 mm and a heat-conductivity coefficient of 90 W / m·K, the first heat-conducting layer 122a is made of an indium tin bismuth alloy with a thickness of 5 μm, and the first heat-conducting layer 122a and the second heat-conducting layer 122b are stacked along the thickness direction X of the heat-conducting pad 12. The bonding layer 123 is made of a silicone double-sided adhesive with a thickness of 50 μm and a shear strength greater than 1 MPa.

[0108] Example 3: Refer to Figure 3 , the wear-resistant layer 121 is made of a stainless steel film composite with a thickness of 10 μm, the heat-conducting layer 122 is a polyolefin-based phase-change heat-conducting material with a thickness of 0.15 mm and a heat-conductivity coefficient of 8 W / m·K, and the bonding layer 123 is made of a pressure-sensitive acrylate double-sided adhesive with a thickness of 50 μm and a shear strength greater than 1 MPa.

[0109] Example 4: Refer to Figure 3 , the wear-resistant layer 121 is made of a tungsten alloy film with a thickness of 10 μm, the heat-conducting layer 122 is an indium tin bismuth alloy with a thickness of 0.3 mm, a heat-conductivity coefficient greater than 12 W / m·K, and a melting point of 60 °C, and the bonding layer 123 is made of a pressure-sensitive silicone-based double-sided adhesive with a thickness of 50 μm and a shear strength greater than 1 MPa.

[0110] Example 5: Refer to Figure 3 , the wear-resistant layer 121 is made of a nickel-plated copper film with a thickness of 20 μm, the heat-conducting layer 122 is a liquid metal gallium indium tin alloy with a thickness of 0.15 mm, a heat-conductivity coefficient greater than 20 W / m·K, and a melting point at 10 °C, and the bonding layer 123 is made of a pressure-sensitive silicone-based double-sided adhesive with a thickness of 50 μm and a shear strength greater than 1 MPa.

[0111] The experimental results of plugging and unplugging heat dissipation for the above five examples are shown in Table 1.

[0112] Table 1

[0113]

[0114] As can be seen from the above table, by applying the heat-conducting pad 12 provided in the embodiments of the present application, the wear-resistant layer 121 can achieve more than 50 plugging and unplugging times without damage, and the heat-conducting layer 122 can achieve a temperature rise benefit of 6-10 °C for the plugging and unplugging module. That is, by using the heat-conducting pad 12 provided in the embodiments of the present application, the temperature rise of the plugging and unplugging module can be reduced by 6 °C - 10 °C compared with hard contact with the radiator.

[0115] In another specific embodiment, refer to Figure 5 , Figure 5 is Figure 1Schematic structural diagram of the middle thermal pad 12 in yet another specific embodiment. In addition to the wear-resistant layer 121, thermal conductive layer 122, and adhesive layer 123 described above, the thermal pad 12 may further include a support layer 124. The support layer 124 is located within the connection area 126. Along the thickness direction X of the thermal pad 12, the support layer 124 is connected to the bottom surface of the adhesive layer 123 and surrounds the thermal conductive layer 122. The support layer 124 can protect the thermal conductive layer 122 from the circumferential direction of the thermal conductive layer 122. The projections of the wear-resistant layer 121 and the adhesive layer 123 along the thickness direction X of the thermal pad 12 cover the projection of the support layer 124 along the thickness direction X of the thermal pad 12.

[0116] When the thermal pad 12 is pasted on the radiator 1, the wear-resistant layer 121 and the adhesive layer 123 located in the connection area 126 are bent towards the support layer 124, so that the adhesive layer 123 is pasted on the side wall of the support layer 124 and then adhered to the radiator 1. The support layer 124 is used to support the wear-resistant layer 121 to avoid the situation of suspension when the wear-resistant layer 121 is bent downward, resulting in plugging and unplugging damage. At the same time, the support layer 124 can further protect the thermal conductive layer 122. For example, when the thermal conductive layer 122 is a thermal conductive material such as liquid metal, by providing the support layer 124 surrounding the thermal conductive layer 122, it can prevent water vapor from invading the thermal conductive layer 122, slow down the aging speed of the liquid thermal conductive material, and extend the service life of the thermal conductive layer 122.

[0117] In a specific embodiment, as Figure 5 shown, the side wall of the support layer 124 can be inclined to reduce the stress concentration when the wear-resistant layer 121 and the adhesive layer 123 are adhered to the side wall of the support layer 124.

[0118] In a specific embodiment, the support layer 124 has thermal conductivity and can elastically deform. When the thickness of the thermal conductive layer 122 changes due to temperature and / or pressure changes, the support layer 124 can elastically deform to match the thickness change of the thermal conductive layer 122.

[0119] The support layer 124 can be an organic material or an organic / inorganic composite material, such as silicone foam material, polyurethane, polyethylene, polypropylene, or a composite of the above organic materials and inorganic fillers.

[0120] In a specific embodiment, referring to Figure 6 , Figure 6 is Figure 1 the schematic structural diagram of the middle thermal pad 12 in yet another specific embodiment. Figure 6In the illustrated embodiment, the thermal pad 12 includes a thermal conductive layer 122 and a wear-resistant layer 121, and the thermal conductive layer 122 is located within the cavity formed by the wear-resistant layer 121, that is, the wear-resistant layer 121 surrounds the thermal conductive layer 122. The wear-resistant layer 121 provides better protection for the thermal conductive layer 122 and extends the service life of the thermal pad 12. In this embodiment, along the thickness direction X of the thermal pad 12, the bottom surface of the wear-resistant layer 121 in the thermal pad 12 is connected to the radiator 1. For example, the bottom surface of the wear-resistant layer 121 can be welded to the radiator 1.

[0121] In this embodiment, the wear-resistant layer 121 can be a flexible metal film or a composite film of metal and non-metal. For example, the wear-resistant layer 121 can be any one of flexible metal films such as copper alloy film, nickel-plated copper (alloy) film, aluminum alloy film, nickel-plated aluminum (alloy) film, magnesium alloy film, stainless steel film and tungsten alloy film, or the wear-resistant layer 121 can be any one of composite films of metal / non-metal such as metal / graphite composite film, metal / graphene composite film, metal / carbon fiber composite film. The thermal conductive layer 122 can be a material that can be liquefied or pasted, such as one or more of phase change thermal conductive materials, thermal conductive gels, thermal conductive greases, liquid metals, and low melting point metals.

[0122] In a specific embodiment, Figure 7 For Figure 1 is a schematic structural diagram of the thermal pad 12 in another specific embodiment. Figure 7 In the illustrated embodiment, the thermal conductive layer 122 of the thermal pad 12 includes a first thermal conductive layer 122a and a second thermal conductive layer 122b. Among them, the first thermal conductive layer 122a surrounds the second thermal conductive layer 122b, that is, the second thermal conductive layer 122b is located within the cavity formed by the first thermal conductive layer 122a. The first thermal conductive layer 122a is a material that can be liquefied or pasted. For example, the first thermal conductive layer 122a can be any one of phase change thermal conductive materials, thermal conductive gels, thermal conductive greases, liquid metals, and low melting point metals; the second thermal conductive layer 122b can be one or more of thermal conductive foams, carbon fibers, graphite or graphene thermal conductive materials. The first thermal conductive layer 122a can change its thickness when the temperature and / or pressure changes, has good interfacial wettability, can fill the gaps at the interface, and reduce the thermal resistance. The second thermal conductive layer 122b can undergo elastic deformation in the thickness direction X when the pressure changes to match the different assembly gaps and gap tolerances between the plug-in module 2 and the radiator 1, and at the same time plays a certain supporting role for the first thermal conductive layer 122a, so as to keep the thermal conductive layer in a certain shape.

[0123] Figure 7In the illustrated embodiment, the wear-resistant layer 121 may be a flexible metal film or a metal / non-metal composite film. For example, the wear-resistant layer 121 may be any one of flexible metal films such as a copper alloy film, a copper (alloy) nickel-plated film, an aluminum alloy film, an aluminum (alloy) nickel-plated film, a magnesium alloy film, a stainless steel film, and a tungsten alloy film, or the wear-resistant layer 121 may be any one of metal / non-metal composite films such as a metal / graphite composite film, a metal / graphene composite film, and a metal / carbon fiber composite film. In this embodiment, along the thickness direction X of the heat-conducting pad 12, the bottom surface of the wear-resistant layer in the heat-conducting pad 12 is connected to the radiator. For example, the bottom surface of the wear-resistant layer 121 may be welded to the radiator 1.

[0124] In a specific embodiment, Figure 8 For Figure 1 is a schematic structural diagram of the heat-conducting pad 12 in yet another specific embodiment. Figure 8 In the illustrated embodiment, the heat-conducting layer 122 of the heat-conducting pad 12 is located within the cavity surrounded by the wear-resistant layer 121, that is, the wear-resistant layer 121 surrounds the heat-conducting layer 122. The heat-conducting pad 12 may further include an adhesive layer 123, which is connected to the side of the wear-resistant layer 121 facing away from the heat-conducting layer 122. The heat-conducting pad 12 may be adhered to the radiator 1 through the adhesive layer 123. In this embodiment, the structures of the heat-conducting layer 122 and the wear-resistant layer 121 may be the same as those in Figure 6 the illustrated embodiment and will not be elaborated here.

[0125] In a specific embodiment, referring to Figure 9 , Figure 9 is a schematic structural diagram of the heat-conducting pad 1 provided by the present application in yet another specific embodiment. In this embodiment, the heat-conducting layer 122 of the heat-conducting pad 12 includes a first heat-conducting layer 122a and a second heat-conducting layer 122b, wherein the first heat-conducting layer 122a surrounds the second heat-conducting layer 122b, that is, the second heat-conducting layer 122b is located within the cavity formed by the first heat-conducting layer 122a. The heat-conducting pad 12 may further include an adhesive layer 123, which is connected to the side of the wear-resistant layer 121 facing away from the heat-conducting layer 122. The heat-conducting pad 12 may be adhered to the radiator 1 through the adhesive layer 123. In this embodiment, the structures of the heat-conducting layer 122 and the wear-resistant layer 121 may be the same as those in Figure 7 the illustrated embodiment and will not be elaborated here.

[0126] As Figure 9 shown in the embodiment, when the heat-conducting layer 122 includes a first heat-conducting layer 122a and a second heat-conducting layer 122b, the heat-conducting layer 122 may be prepared by physically spin-coating a liquefiable or pasty heat-conducting material on a heat-conducting foam or a carbon-based heat-conducting material, or by physically or chemically vapor-depositing a liquefiable or pasty heat-conducting material in situ on a heat-conducting foam or a carbon-based heat-conducting material.

[0127] As Figure 9 shown in the embodiment, the heat-conducting pad 12 may further include a support layer 124 (not shown in the figure). The support layer 124 may be located inside the heat-conducting layer 122, that is, the heat-conducting layer 122 may surround the support layer 124. Or, the support layer 124 may also be located between the heat-conducting layer 122 and the wear-resistant layer 121, that is, the support layer 124 surrounds the heat-conducting layer 122, and the wear-resistant layer 121 surrounds the support layer 124. The support layer 124 can support the wear-resistant layer 121 and the heat-conducting layer 122.

[0128] Embodiment Six: Referring to Figure 5 , the wear-resistant layer 121 is a copper-nickel-plated film with a thickness of 20 μm, the second heat-conducting layer 122b is a graphene heat-conducting pad with a thickness of 1-2 mm and a heat-conductivity coefficient of 110 W / m·K, the first heat-conducting layer 122a is a liquid metal heat-conducting paste such as gallium alloy with a thickness of 5 μm. The first heat-conducting layer 122a and the second heat-conducting layer 122b are stacked along the thickness direction X of the heat-conducting pad 12. The adhesive layer 123 is an organosilicon double-sided adhesive with a thickness of 50 μm and a shear strength greater than 1 MPa. The support layer 124 is an organosilicon protective foam. The compression amount of the heat-conducting pad 12 in this embodiment is preferably 10% - 60%, meeting the design gap of 0.5 - 1.8 mm between the radiator 1 and the plug-in module 2.

[0129] Embodiment Seven: Referring to Figure 6 , the wear-resistant layer 121 is a copper (alloy) composite graphene film with a thickness of 50 μm, and the heat-conducting layer 122 is a heat-conducting gel with a thickness of 2.5 mm and a heat-conductivity coefficient ≥ 1 W / m·K. The heat-conducting pad 12 is fixedly connected to the radiator 1 by welding.

[0130] Embodiment Eight: Referring to Figure 7 , the wear-resistant layer 121 is a stainless-steel film with a thickness of 10 μm, the second heat-conducting layer 122b is a heat-conducting foam with a thickness of 2.5 mm and a heat-conductivity coefficient ≥ 1 W / m·K, the first heat-conducting layer 122a is a phase-change heat-conducting material, heat-conducting silicone grease or low-melting-point alloy with a thickness of 50 μm. The first heat-conducting layer 122a surrounds the second heat-conducting layer 122b. The heat-conducting pad 12 is fixedly connected to the radiator 1 by welding.

[0131] Embodiment Nine: Referring to Figure 8 , the wear-resistant layer 121 is a tungsten alloy composite graphene film with a thickness of 30 μm, the heat-conducting layer 122 is a heat-conducting foam with a thickness of 2.5 mm and a heat-conductivity coefficient ≥ 1 W / m·K, and the adhesive layer 123 is a pressure-sensitive heat-conducting adhesive. The heat-conducting pad 12 is fixedly connected to the radiator 1 through the adhesive layer 123.

[0132] It can be obtained through experiments that the thermal conductive pad 12 in Embodiments 7-9 of the present application can be applied to a floating gap of 0.8 to 2 mm. After 50 insertions and extractions (corresponding to 50 compressions and rebounds of the thermal conductive pad 12), the thermal conductive pad 12 is not damaged and the rebound rate is ≥ 60%.

[0133] In summary, the thermal conductive pad 12 described in the embodiments of the present application has excellent insertion and extraction resistance performance and heat dissipation performance, can meet different design gaps and gap tolerances, and is suitable for different types of insertion and extraction heat dissipation scenarios. Specifically, the thermal conductive pad 12 provided in the embodiments of the present application includes a thermal conductive layer 122 and a wear-resistant layer 121. The wear-resistant layer 121 includes a metal wear-resistant and heat-conductive layer and a metal / non-metal wear-resistant and heat-conductive layer, and the thermal conductivity is greater than 15 W / (m·K). The wear-resistant layer 121 has both excellent tear / puncture resistance and heat conduction performance, and the thermal conductive pad 12 applying the wear-resistant and heat-conductive layer meets the requirement of not being damaged after multiple insertions and extractions. The thickness of the thermal conductive layer 122 can change under the influence of pressure and / or temperature, meets the design gap range of 20 μm to 2 mm between the radiator 1 and the insertion and extraction module 2, and at the same time meets the scenario of partially absorbing the gap tolerance, thereby significantly reducing the interface contact thermal resistance.

[0134] It should be noted that the thermal conductive pad 12 described in the embodiments of the present application is not limited to being used for the radiator 1, and can also be used in other fields that require heat dissipation.

[0135] The above description is only the specific implementation manner of the embodiments of the present application, but the protection scope of the embodiments of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of the present application should be covered by the protection scope of the embodiments of the present application. Therefore, the protection scope of the embodiments of the present application should be subject to the protection scope of the claims.

Claims

1. A heat-conducting pad, characterized in that, the heat-conducting pad comprises a wear-resistant layer and a heat-conducting layer connected to each other, the wear-resistant layer and the heat-conducting layer are distributed at least along the thickness direction of the heat-conducting pad, and the thickness of the heat-conducting layer can be changed.

2. The heat-conducting pad according to claim 1, characterized in that, the phase state of at least part of the heat-conducting layer can be changed, or at least part of the heat-conducting layer can be elastically deformed, or at least part of the material of the heat-conducting layer can flow.

3. The heat-conducting pad according to claim 2, characterized in that, the heat-conducting layer at least comprises a first heat-conducting layer, and the first heat-conducting layer is a material that can be liquefied or pasted.

4. The heat-conducting pad according to claim 3, characterized in that, the material of the first heat-conducting layer is one or more of phase change heat-conducting materials, heat-conducting gels, heat-conducting silicone greases, liquid metals, and low-melting-point metals.

5. The heat-conducting pad according to claim 3, characterized in that, the heat-conducting layer further comprises a second heat-conducting layer connected to the first heat-conducting layer, and the second heat-conducting layer is one or more of heat-conducting foams, carbon fibers, graphite, and graphene heat-conducting materials.

6. The heat-conducting pad according to claim 5, characterized in that, the first heat-conducting layer and the second heat-conducting layer are stacked along the thickness direction of the heat-conducting pad.

7. The heat-conducting pad according to claim 5, characterized in that, the first heat-conducting layer surrounds the second heat-conducting layer.

8. The heat-conducting pad according to claim 1, characterized in that, the heat-conducting layer comprises a heat-conducting foam layer and a liquefiable or pastable layer provided on the heat-conducting foam layer, or the heat-conducting layer comprises a carbon-based heat-conducting material layer and a liquefiable or pastable layer provided on the carbon-based heat-conducting material layer.

9. The heat-conducting pad according to claim 1, characterized in that, the heat-conducting layer comprises a carbon fiber cushion layer and heat-conducting silicone grease layers provided on both sides of the carbon fiber layer along the thickness direction, or the heat-conducting layer comprises a carbon fiber cushion layer and liquid metal layers provided on both sides of the carbon fiber layer along the thickness direction, or the heat-conducting layer comprises a graphene layer and low-melting-point metal layers provided on both sides of the graphene layer along the thickness direction, or the heat-conducting layer comprises a graphene layer and phase change heat-conducting material layers provided on both sides of the graphene layer along the thickness direction.

10. A heat-conducting pad, characterized in that, the heat-conducting pad comprises a wear-resistant layer and a heat-conducting layer connected to each other, the wear-resistant layer and the heat-conducting layer are distributed at least along the thickness direction of the heat-conducting pad, the wear-resistant layer is a metal film, or the wear-resistant layer comprises a metal layer and a non-metal layer.

11. The heat-conducting pad according to any one of claims 1-10, characterized in that, the wear-resistant layer is one or more of a copper alloy film, a copper-nickel plated film, a copper alloy-nickel plated film, an aluminum alloy film, an aluminum-nickel plated film, an aluminum alloy-nickel plated film, a magnesium alloy film, a stainless steel film, and a tungsten alloy film.

12. The heat-conducting pad according to claim 11, characterized in that, the thickness of the wear-resistant layer is 5μm - 50μm.

13. The heat-conducting pad according to any one of claims 1-10, characterized in that, The wear-resistant layer is one or more of a metal and graphite composite film, a metal and graphene composite film, and a metal and carbon fiber composite film.

14. The thermal pad according to claim 13, It is characterized in that The thickness of the wear-resistant layer is 10 μm-500 μm.

15. The thermally conductive pad according to any one of claims 1 to 10, It is characterized in that The thermal conductivity of the wear-resistant layer is greater than 15 W / m·K.

16. The thermal pad according to any one of claims 1 to 10, It is characterized in that The projection of the wear-resistant layer along the thickness direction of the thermal pad covers the projection of the thermal conductive layer along the thickness direction of the thermal conductive pad.

17. The thermally conductive pad according to any one of claims 1 to 10, It is characterized in that The thermal conductive pad also includes an adhesive layer connected to the wear-resistant layer.

18. The thermally conductive pad according to any one of claims 1 to 10, It is characterized in that The thermal pad includes a thermal conductive area and a connecting area located at the periphery of the thermal conductive area. The thermal conductive layer is located in the thermal conductive area. The thermal pad also includes a supporting layer located in the connecting area. The supporting layer is connected to the wear-resistant layer and circumferentially surrounds the thermal conductive layer.

19. The thermally conductive pad according to any one of claims 1 to 10, It is characterized in that The wear-resistant layer surrounds the heat-conducting layer, and the thermal pad further comprises a supporting layer. The heat-conducting layer surrounds the supporting layer, or the supporting layer is located between the heat-conducting layer and the wear-resistant layer.

20. The thermally conductive pad according to claim 18 or 19, It is characterized in that The supporting layer is elastically deformable.

21. A radiator assembly, It is characterized in that The heat sink assembly comprises a heat sink and a thermal pad as claimed in any one of claims 1 to 20, wherein the thermal pad is connected to the heat sink, and the wear-resistant layer is located on a side of the thermal conductive layer away from the heat sink.

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