LED support, lamp bead, light-emitting unit module and device

Abstract

The invention provides an LED support, a lamp bead, a light-emitting unit module and a device, the LED support comprises a conductive base and a support shell, the conductive base comprises at least two metal sheets arranged in an insulated and isolated mode, the metal sheets are combined with colloid used for forming the support shell to form the LED support, the upper surface of at least one metal sheet is used for bearing an LED chip, and the lower surface of at least one metal sheet is used for bearing the LED chip. Heat generated by the LED chip during working can be directly transmitted to the metal sheet and is quickly dissipated outwards through the metal sheet. The lower surface and the first side surface of the metal sheet are exposed and are respectively provided with the first concave part and the second concave part which can be used as bonding pads for external electric connection, so that the metal sheet can be suitable for various application scenes and is convenient to weld, the arrangement of the first concave part and the second concave part can increase the welding area, the welding strength is further improved, and the service life of the metal sheet is prolonged. In addition, redundant welding flux can be contained in the concave part in the welding process, so that the welding smoothness and reliability are ensured.

Description

[0001] This application is a divisional application of the original Chinese patent application with the invention title of "LED Bracket, Lamp Bead, Conductive Base, Light Emitting Unit Module and Device". The application number of the original application is 202010893729.1; the filing date of the original application is August 31, 2020. Technical Field

[0002] The present invention relates to the field of LEDs (Light Emitting Diodes), and particularly to an LED bracket, a lamp bead, a light emitting unit module and a device. Background Art

[0003] Currently, the color gamut and brightness required by various display devices are getting higher and higher, and the thickness is getting thinner and thinner. The color gamut and brightness are in a negative correlation relationship. The higher the color gamut requirement, the lower the brightness. The brightness of the original single-chip package cannot meet the requirements. When a high color gamut is required, an ultra-thin side-emitting diode with higher brightness is needed. For this reason, the prior art provides a light emitting diode with higher brightness when having a high color gamut. Refer to Figure 1 As shown, it includes a plastic substrate 001, a circuit formed on the top surface of the plastic substrate 001 and electrically connected to the LED chip, and a pad 004 provided on the bottom surface of the plastic substrate 001. The circuit on the top surface of the plastic substrate 001 is electrically connected to the pad 004 through a conductive material in a through hole penetrating the bottom surface. A housing 002 is formed on the plastic substrate 001, a cavity for placing the LED chip 003 is formed inside the housing 002, and a fluorescent glue 005 is filled in the cavity. Although the light emitting diode with this structure can improve the brightness, its structure is relatively complex and the cost is high; in addition, since two LED chips are placed, compared with the light emitting diode with a single LED chip, the heat generated during its operation increases exponentially. The heat generated by the LED chip in this light emitting diode is mainly transferred to the pad 004 through the conductive material in the through hole penetrating the plastic substrate 001 for heat dissipation. The heat dissipation path is long and the heat dissipation area is small, resulting in poor heat dissipation effect. Summary of the Invention

[0004] An LED bracket, a lamp bead, a light emitting unit module and a device provided by the present invention solve the problems of the existing light emitting diode having a complex structure, high cost and poor heat dissipation.

[0005] To solve the above technical problems, an embodiment of the present invention provides an LED bracket, which includes a conductive base and a bracket housing. The conductive base includes at least two metal sheets that are insulated and isolated from each other. The metal sheets are combined with a colloid used to form the bracket housing to form the LED bracket. The upper surface of the metal sheet is located at the bottom of the bracket housing that encloses and forms a bowl cup for placing an LED chip, and at least part of it is exposed; the upper surface of at least one of the metal sheets is used to carry the LED chip, and the exposed area of the upper surface of each metal sheet is used to be electrically connected to the electrodes of the corresponding LED chip; At least part of the lower surface of the metal sheet is exposed outside the bracket housing. The lower surface is the surface opposite to the upper surface. At least part of the first side surface of at least one of the metal sheets between the upper surface and the lower surface is exposed outside the bracket housing. At least part of the second side surface of at least one of the metal sheets between the upper surface and the lower surface is not exposed outside the bracket housing. The first side surface and the second side surface are two opposite side surfaces. The area of the lower surface exposed outside the bracket housing is provided with a first recess for accommodating solder. The area of the first side surface exposed outside the bracket housing is provided with a second recess for accommodating solder. The opening of the first recess is located at a position away from the edge of the lower surface. The opening of the second recess is located at a position away from the edge of the first side surface. The first recess and the second recess communicate with each other inside the metal sheet.

[0006] Optionally, the first recess is a first groove or a first hole, and the second recess is a second groove or a second hole.

[0007] Optionally, on the upper surface of the metal sheet in the area combined with the bracket housing, there is a rough surface with an uneven structure for enhancing the bonding force with the bracket housing, and / or there are bonding holes for the colloid used to form the bracket housing to flow in.

[0008] Optionally, the bonding holes communicate with the first recess.

[0009] Optionally, the upper end of the bonding hole close to the upper surface is the upper end, and the lower end close to the lower surface is the lower end. The aperture of the upper end of the bonding hole is larger than the aperture of the lower end of the bonding hole.

[0010] Optionally, the conductive base includes three metal sheets arranged in sequence. The exposed areas of the upper surface of the middle metal sheet are respectively electrically connected to the electrodes corresponding to two LED chips.

[0011] Optionally, the lateral width of at least one of the metal sheets near the upper end of the upper surface is greater than the lateral width of the first side surface, and a part of the upper end of the metal sheet is embedded in the bracket housing; Or, At least one of the metal sheets is provided with a protruding portion extending outward between the upper surface and the lower surface, and at least a part of the protruding portion is embedded in the bracket housing.

[0012] Optionally, the conductive base includes three metal sheets arranged in sequence, and the bracket housing further includes a partition wall disposed on the upper surface of the middle metal sheet to form two separated bowl cups on the upper surfaces of the three metal sheets.

[0013] To solve the above technical problems, an embodiment of the present invention further provides an LED lamp bead, including the above-mentioned LED bracket, further including an LED chip disposed in the bowl cup, and a packaging layer disposed in the bowl cup to cover the LED chip, and electrodes of the LED chip are electrically connected to exposed areas on the upper surfaces of the corresponding metal sheets.

[0014] To solve the above technical problems, an embodiment of the present invention further provides a light-emitting unit module, including a substrate and a plurality of the above-mentioned LED lamp beads, and the plurality of LED lamp beads are electrically connected to the substrate.

[0015] To solve the above technical problems, an embodiment of the present invention further provides a display device, including the above-mentioned light-emitting unit module.

[0016] Beneficial effects

[0017] The present invention provides an LED bracket, a lamp bead, a light-emitting unit module and a device. The LED bracket includes a conductive base and a bracket housing. The conductive base includes at least two metal sheets that are insulated and isolated from each other. The metal sheets are combined with a colloid used to form the bracket housing to form the LED bracket. The upper surfaces of the metal sheets are located at the bottom of the bowl cups formed by the enclosure of the bracket housing for placing LED chips, and at least part of them are exposed; the upper surfaces of at least one metal sheet are used to carry the LED chips, and the exposed areas on the upper surfaces of the metal sheets are used to be electrically connected to the electrodes of the corresponding LED chips; at least part of the lower surfaces of the metal sheets are exposed outside the bracket housing. In this way, the heat generated by the LED chips during operation can be directly transferred to the metal sheets and quickly dissipated outward through the metal sheets, greatly shortening the heat dissipation path and at the same time greatly increasing the heat dissipation area, thereby significantly improving the heat dissipation effect and ensuring the performance of the LED lamp beads. In addition, at least one metal sheet is located between the upper surface and the lower surface, and at least part of the first side is exposed outside the bracket housing. At least one metal sheet is located between the upper surface and the lower surface, and the second side is not exposed outside the bracket housing. A first recess for accommodating solder is provided in the area where the lower surface is exposed outside the bracket housing, and a second recess for accommodating solder is provided in the area where the first side is exposed outside the bracket housing. Since the lower surface and the first side of the metal sheet are both exposed, both can be used as pads for external electrical connection. In the side light-emitting application scenario, the first side can be welded to the outside, or both the first side and the lower surface can be welded simultaneously. In the front light-emitting application scenario, the lower surface can be welded, or both the lower surface and the first side can be welded simultaneously. Therefore, it can be applied to various application scenarios, the welding is convenient, and welding can be performed on both surfaces according to requirements, which can improve the firmness of welding and thus enhance the reliability of the product. In addition, since a first recess for accommodating solder is provided in the area where the lower surface of the metal sheet is exposed outside the bracket housing, and a second recess for accommodating solder is provided in the area where the first side is exposed outside the bracket housing, the setting of the recess can increase the welding area and thus enhance the welding strength. Moreover, the setting of the first recess and the second recess can accommodate the excess solder during the welding process in the recesses, ensuring the flatness and reliability of the welding. In addition, the first recess on the lower surface of the metal sheet and the second recess on the first side of the metal sheet communicate with each other inside the metal sheet. When the lower surface of the metal sheet is placed as the main mounting surface on the welding surface provided with solder, due to the internal communication between the first recess and the second recess, and the opening of the first recess is located at a position far from the edge of the lower surface, and the opening of the second recess is located at a position far from the edge of the first side, the solder will preferentially fill the first recess in contact with the welding surface, and the excess solder will be squeezed out along the welding surface or flow out through the communicating position, making the solder in the first recess opposite to the welding surface filled and flat, and it is not easy to form voids inside the solder. The LED bracket is not easy to tilt when installed on the welding surface and the welding is firm. In addition, during heating, the excess solder will gather towards the second recess of the metal sheet that is not in contact with the welding surface, and the excess solder will be collected in the second recess or the first recess, which can further improve the stability of welding. The process of welding with the first side of the metal sheet as the main mounting surface on the welding surface provided with solder is similar to the process of welding with the lower surface of the metal sheet as the main mounting surface on the welding surface provided with solder, and will not be elaborated here.

[0018] The LED lamp bead is composed of an LED chip placed in a bowl cup inside the LED bracket and an encapsulation layer covering the LED chip. The structure of the LED lamp bead is relatively simpler than that of the existing lamp beads, easier to manufacture, and has a lower cost. Description of the Drawings

[0019] Figure 1Schematic diagram of an existing light-emitting diode structure; Figure 2 Schematic diagram of a conductive base in an example provided by an embodiment of the present invention; Figure 3-1 Stereoscopic schematic of an LED bracket in an example provided by an embodiment of the present invention Figure 1 ; Figure 3-2 Stereoscopic schematic of an LED bracket in an example provided by an embodiment of the present invention Figure 2 ; Figure 3-3 Schematic diagram of another conductive base in an example provided by an embodiment of the present invention; Figure 4 Schematic diagram of a conductive base in another example provided by an embodiment of the present invention; Figure 5 Schematic of an LED lamp bead in another example provided by an embodiment of the present invention Figure 1 ; Figure 6 Schematic diagram of a conductive base in yet another example provided by an embodiment of the present invention; Figure 7 Schematic diagram of an LED lamp bead in yet another example provided by an embodiment of the present invention; Figure 8 Schematic diagram of another conductive base in another example provided by an embodiment of the present invention; Figure 9 Schematic diagram of an LED lamp bead in another example provided by an embodiment of the present invention; Figure 10 Schematic of a conductive base in yet another example provided by an embodiment of the present invention Figure 1 ; Figure 11 Schematic of a conductive base in yet another example provided by an embodiment of the present invention Figure 2 ; Figure 12 Schematic diagram of a third conductive base in yet another example provided by an embodiment of the present invention; Figure 13 Schematic of an LED lamp bead in another example provided by an embodiment of the present invention Figure 1 ; Figure 14 Schematic of an LED lamp bead in another example provided by an embodiment of the present invention Figure 2 ; Figure 15 Schematic diagram of a third LED lamp bead in another example provided by an embodiment of the present invention; Figure 16 Schematic diagram of a light-emitting unit module in yet another example provided by an embodiment of the present invention; Figure 17Schematic diagram of a display device in another example provided by an embodiment of the present invention. Detailed implementation manners

[0020] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the embodiments of the present invention will be further described in detail below through specific implementation manners in combination with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0021] This embodiment provides a conductive base applied to an LED bracket and an LED lamp bead, which makes the structures of the LED bracket and the lamp bead simple, low in cost, good in heat dissipation performance, and simple and reliable in welding. The conductive base includes at least two metal sheets that are insulated and isolated from each other. The metal sheets are combined with a colloid used to form a bracket housing to form an LED bracket. The upper surface of the metal sheet is located at the bottom of the bracket housing that encloses and forms a bowl cup for placing an LED chip, and at least part of it is exposed; the upper surface of at least one metal sheet is used to carry an LED chip, and the exposed area of the upper surface of each metal sheet is used to be electrically connected to the electrodes of the corresponding LED chip; at least part of the lower surface of the metal sheet is exposed outside the bracket housing, and the lower surface is the surface opposite to the upper surface. At least part of the first side surface of at least one metal sheet located between the upper surface and the lower surface is exposed outside the bracket housing, and at least one metal sheet located between the upper surface and the lower surface has a second side surface that is not exposed outside the bracket housing. The first side surface and the second side surface are two opposite side surfaces. That is to say, in this embodiment, at least part of the upper surface, the lower surface and the first side surface of the metal sheet can be exposed outside the bracket housing, and other surfaces are covered by the bracket housing, so as to increase the bonding area between the bracket housing and the metal sheet, improve the bonding strength between the two, thereby improving the reliability of the LED bracket. At the same time, the LED bracket can also have better airtightness, thereby improving the safety and reliability of the LED product.

[0022] Since the LED chip can be directly arranged on the upper surface of the metal sheet, and the lower surface and the first side surface of the metal sheet are both exposed outside the bracket housing, the heat generated by the LED chip during operation can be directly transferred to the metal sheet and quickly dissipated outward through the metal sheet, greatly shortening the heat dissipation path and increasing the heat dissipation area, thereby greatly improving the heat dissipation effect and ensuring the performance of the LED lamp bead.

[0023] In this embodiment, a first recess for accommodating solder is provided in the area where the lower surface of the metal sheet is exposed outside the bracket housing, and a second recess for accommodating solder is provided in the area where the first side surface of the metal sheet is exposed outside the bracket housing. The provision of the first recess and the second recess can increase the welding area and thus improve the welding strength; and the provision of the first recess and the second recess can accommodate the excess solder during the welding process in the recess, ensuring the flatness and reliability of the welding.

[0024] Optionally, in this embodiment, in order to further improve the reliability of welding, a soldering aid layer for enhancing the welding force may be provided on the area of the metal sheet that is exposed outside the bracket housing and needs to be welded. The soldering aid layer may be a metal layer, such as a metal plating layer, or other layer structures that can enhance the welding force. For example, in some examples, a metal plating layer for enhancing the welding force may be provided on at least one side wall of the first groove and the second groove in the above examples. The metal plating layer may be, but is not limited to, a silver plating layer.

[0025] In this embodiment, the LED bracket can be directly composed of at least two metal sheets that are insulated and isolated from each other, and a colloid that is combined with the metal sheets to form the bracket housing. Compared with the structure of the existing LED bracket, it is greatly simplified. Therefore, the manufacturing process can be simplified, the manufacturing efficiency and the yield rate can be improved, and the cost can be reduced at the same time.

[0026] It should be understood that the number of metal sheets included in an LED bracket in this embodiment can be flexibly set according to specific application scenarios. For example, only two insulated and isolated metal sheets can be provided. The bracket housing can only enclose and form a bowl-shaped body. At least a part of the upper surfaces of the two insulated and isolated metal sheets are exposed at the bottom of the bowl-shaped body for carrying the LED chip and completing electrical connection with the electrodes of the LED chip. Moreover, the number of LED chips provided in the bowl-shaped body and the emitting color of the LED chips can be flexibly set according to requirements. For example, it can be set to one, or two or three, etc.

[0027] The LED chip in this embodiment can be a flip-chip LED chip. The two electrodes of the flip-chip LED chip can directly span across the exposed upper surfaces of two adjacent metal sheets to complete electrical connection while carrying the LED chip. The LED chip in this embodiment can also be a surface-mount LED chip. One surface-mount LED chip can be provided on the upper surface of any one of the metal sheets, or can also be simultaneously spanned across the upper surfaces of multiple metal sheets. The two electrodes of the surface-mount LED chip are respectively electrically connected to the exposed upper surfaces of the corresponding two metal sheets through leads.

[0028] In some application examples of this embodiment, the conductive base may include three metal sheets arranged in sequence. The exposed areas on the upper surface of the middle metal sheet are electrically connected to the corresponding electrodes of two LED chips respectively; the exposed areas on the upper surfaces of the metal sheets on both sides are electrically connected to the remaining corresponding electrodes of these two LED chips respectively, so as to realize the series connection of two LED chips. In this example, the three metal sheets may also be located at the bottom of the same bowl cup. In some other application scenarios of this example, the bracket housing may further include a partition wall provided on the upper surface of the middle metal sheet to form two separate bowl cups on the upper surfaces of the three metal sheets (or a large bowl cup may be formed on the three metal sheets without setting this partition wall). In this way, the middle metal sheet straddles the bottoms of two mutually separated bowl cups, and the two metal sheets are respectively located at the bottoms of two separate bowl cups. Which structure to adopt specifically can be flexibly set according to requirements. And in this application example, the number and color of LED chips arranged in one bowl cup, as well as whether to use a direct-mounted LED chip or a flip-chip LED chip specifically, can all be flexibly set according to requirements. In some application scenarios of this application example, the first side surface and / or the lower surface of the middle metal sheet may also not be exposed outside the bracket housing according to requirements. When the first side surface and / or the lower surface of the middle metal sheet can also be exposed outside the bracket housing according to requirements, during welding, the first side surface and / or the lower surface of the middle metal sheet can be selectively welded, or the first side surface and / or the lower surface of the middle metal sheet can be selectively not welded. Specifically, it can be flexibly selected according to the application scenario.

[0029] In this embodiment, the shape of the first recess provided in the area where the lower surface of the metal sheet is exposed outside the bracket housing can be flexibly set. For example, it can be set as but not limited to the first groove or the first hole. The shape of the second recess provided in the area where the first side surface is exposed outside the bracket housing for accommodating solder can also be flexibly set. For example, it can be set as but not limited to the second recess being the second groove or the second hole. For example, the first recess can be set as the first groove, the second recess can be set as the second groove or the second hole, or the first recess can be set as the first hole, and the second recess can be set as the second groove or the second hole. Specifically, it can be flexibly set according to requirements.

[0030] In this embodiment, the first recess provided on the lower surface of the metal sheet and the second recess provided on the first side surface may not communicate with each other. For example, in an application scenario of side light emission, when the first side surface is placed as the main mounting surface on the welding surface provided with solder, the first side surface presses the solder on the welding surface, and a part of the solder will overflow along the first side surface. When heating for welding, since the solder will gather towards the metal sheet when heated, the overflowed solder can be preferentially gathered into the first recess provided on the lower surface to complete bonding with the lower surface. At the same time, the solder located under the first side surface bonds with the first surface, thereby realizing the welding of the first side surface and the lower surface and improving the reliability of welding. At the same time, the setting of the first recess and the second recess can increase the welding area compared with the flat setting method, and the excess solder can be stored in the recess, which can further improve the stability of welding and the flatness of welding. In the application scenario of front light emission, the welding process when the lower surface of the metal sheet is placed as the main mounting surface on the welding surface provided with solder is similar to the welding process in the above-mentioned application scenario of side light emission, and will not be elaborated here.

[0031] In this embodiment, the first recess provided on the lower surface of the metal sheet and the second recess provided on the first side surface may be set to communicate with each other. This communicating structure can provide better drainage for the liquid solder and more reliably ensure that the excess solder is stored in the recess. In this embodiment, when the first recess and the second recess communicate with each other, they can communicate inside the metal sheet, or communicate on the outer surfaces of the lower surface and the first side surface of the metal sheet, and the structure of the communicating part between the two can be a groove, a hole or other structures. For example, in an application scenario of side light emission, when the first side surface is placed on the welding surface provided with solder, the first side surface presses the solder on the welding surface. Since the first recess and the second recess communicate with each other, a part of the solder squeezed into the second recess can directly flow into the first recess along the communicating position between the two. Therefore, it can be ensured as much as possible that there is solder in both the first recess and the second recess, so as to ensure that both the lower surface and the first side surface are welded. When a part of the solder overflows along the first side surface, during the heating process, since the solder will gather towards the metal sheet when heated, the overflowed solder can also be preferentially gathered into the first recess provided on the lower surface. It can be seen that the setting of the communication between the first recess and the second recess can better realize the welding of the first side surface and the lower surface and improve the reliability of welding. In the application scenario of front light emission, the welding process when the lower surface of the metal sheet is placed on the welding surface provided with solder is similar to the welding process in the above-mentioned application scenario of side light emission, and will not be elaborated here.

[0032] In this embodiment, the first concave portion provided on the lower surface of the metal sheet and the second concave portion provided on the first side surface can be arranged to be internally connected, the opening of the first concave portion is located at a position away from the edge of the lower surface of the metal sheet, and the opening of the second concave portion is located at a position away from the edge of the first side surface of the metal sheet. When the first side surface of the metal sheet is placed as the main mounting surface on the welding surface provided with solder in the side-emitting application scenario, since the first concave portion and the second concave portion are internally connected, when the first side surface squeezes the solder on the welding surface, the excess solder can overflow along the welding surface or flow into the first concave portion through the communicating position, and since the opening of the second concave portion is located at a position away from the edge of the first side surface, the solder will first fill the second concave portion and then flow into the first concave portion, so that the solder in the second concave portion opposite to the welding surface is filled fully and flat, and it is not easy to form a cavity inside the solder, and the LED bracket is installed on the welding surface by the solder filled in the second concave portion, which is not easy to tilt and is firmly welded. In addition, when heated, the excess solder will gather toward the first concave portion of the metal sheet that is not in contact with the welding surface, and the excess solder will be stored in the concave portion, which can further improve the stability of the welding. In the application scenario of front light output, the welding process of placing the lower surface of the metal sheet as the main mounting surface on the welding surface provided with solder is similar to the welding process in the application scenario of side light output mentioned above, and will not be repeated here.

[0033] It should be understood that in this embodiment, when the first recess is set as the first recess or the first hole, and the second recess is set as the second recess or the second hole, the specific shapes and sizes of the first recess and the second recess, and the specific shapes and sizes of the second hole and the first hole can be flexibly set according to needs. For ease of understanding, this example is described below in conjunction with several specific setting examples of the accompanying drawings.

[0034] See also Figures 2 to 3-2 A conductive base 1 and an LED bracket are shown, the conductive base 1 comprises a first metal sheet 11, a second metal sheet 12 and a third metal sheet 13 which are sequentially insulated and isolated, the first metal sheet 11, at least a portion of the upper surface a of the first metal sheet 11 and the third metal sheet 13 are exposed at the bottom of the bowl, and the upper surface a of the second metal sheet 12 is also at least partially exposed at the bottom of the bowl. The lower surface b is a surface opposite to the upper surface, and the first side surface c is a surface located between the upper surface a and the lower surface b. Figure 2 and Figure 3-2As shown, in this example, on the first side c of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 that is exposed in the area of the first side 22 of the bracket housing 2, there is a second recess c1 in the shape of a horseshoe-shaped groove. Optionally, the area of the first side c of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 that is exposed in the bracket housing 2 and where no second recess is provided is flush with the first side 22 of the bracket housing 2. On the lower surface b of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 that is exposed in the area of the lower surface 23 of the bracket housing 2, there is a first recess b1 in the shape of a square hole. In this example, the first recess b1 and the second recess c1 are not connected. Optionally, in this embodiment, the area of the lower surface b of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 that is exposed in the lower surface 23 of the bracket housing 2 and where no second recess is provided can also be flush with the lower surface 23 of the bracket housing 2. Figure 3-1 In 21 is the upper surface of the bracket housing, and it can be parallel to, but not limited to, the upper surface a of the metal sheet.

[0035] For example, still referring to Figures 2 - 3-2 As shown, in this example, on the left and right sides of the first metal sheet 11 and the third metal sheet 13, between the upper surface and the lower surface, there are outwardly protruding protrusions 3, and the shape, size, etc. of the protrusions 3 can be set flexibly. And in some examples, the protrusion 3 can also be provided only on one of the left and right sides of the first metal sheet 11 and the third metal sheet 13, or the protrusion 3 can be flexibly provided on at least one of the front, rear, left, and right sides of the first metal sheet 11 and the third metal sheet 13 according to requirements; specifically, it can be flexibly set according to requirements. Refer to Figure 3-1 and Figure 3-2 As shown, in this embodiment, after forming the LED bracket, the protrusion 3 provided on the metal sheet is embedded in the bracket housing, and at the bottom of the bowl cup, the colloid 20 forming the bracket housing is flush with the upper surface a of the metal sheet. Specifically refer to Figure 3-2 As shown, there is colloid 20 between the upper surface a of the metal sheet and the side wall of the bracket housing, and the colloid 20 is flush with the upper surface a. In this setting example, there is no limit to the setting of the side wall thickness of the bracket housing. Under the requirement of meeting the strength of the LED bracket, the side wall can be set thinner, so as to reduce the size of the LED bracket as a whole and be more conducive to its miniaturization. It should be understood that the second metal sheet 12 can be provided with the protrusion 3 in the same way as the first metal sheet 11 or the third metal sheet 13, or the protrusion 3 can not be provided, and it can be flexibly set according to requirements.

[0036] In some examples of this embodiment, in order to further improve the stability of the combination between the metal sheet and the bracket housing, the side surface of the protrusion 3 of at least one metal sheet can also be set as an inclined surface, and the inclination angle of the inclined surface can be set flexibly according to requirements. For example, please refer to Figure 3-3As shown, the side surface 31 of the upper protrusion 3 of the first metal sheet 11 and the second metal sheet 13 is an inclined surface. After being combined with the bracket housing, the structure of this inclined surface relative to the non-inclined surface can have a larger contact area with the bracket housing and can better withstand the pressure of the bracket housing on the metal sheet, thereby better improving the bonding force between the metal sheet and the bracket housing. Of course, the second metal sheet 12 can also be provided with a structure similar to the protrusion 3 on the first metal sheet 11 and the third metal sheet 13 according to requirements.

[0037] Please refer to Figures 4 to 5 Another conductive base 1 and an LED bracket as shown. The conductive base 1 also includes a first metal sheet 11, a second metal sheet 12, and a third metal sheet 13 that are sequentially insulated and isolated. At least a part of the upper surface a of the first metal sheet 11, the first metal sheet 11, and the third metal sheet 13 is exposed at the bottom of the bowl cup, and at least a part of the upper surface a of the second metal sheet 12 is also exposed at the bottom of the bowl cup. The lower surface b is the side opposite to the upper surface, and the first side surface c is a surface located between the upper surface a and the lower surface b. Refer to Figure 4 and Figure 5 As shown, in this example, a second recess c1 in the shape of a horseshoe groove is provided in the area where the first side surface c of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 is exposed to the first side surface 22 of the bracket housing 2. Optionally, the area where the first side surface c of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 is exposed to the bracket housing 2 and no second recess is provided is flush with the first side surface 22 of the bracket housing 2. A first recess b1 in the shape of a square hole is provided in the area where the lower surface b of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 is exposed to the lower surface 23 of the bracket housing 2. In this example, the first recess b1 communicates with the second recess c1. Optionally, in this embodiment, the area where the lower surface b of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 is exposed to the lower surface 23 of the bracket housing 2 and no second recess is provided can also be flush with the lower surface 23 of the bracket housing 2.

[0038] Please refer to Figures 6 to 7 Another conductive base 1 and an LED bracket as shown. The conductive base 1 also includes a first metal sheet 11, a second metal sheet 12, and a third metal sheet 13 that are sequentially insulated and isolated. At least a part of the upper surface a of the first metal sheet 11, the first metal sheet 11, and the third metal sheet 13 is exposed at the bottom of the bowl cup, and at least a part of the upper surface a of the second metal sheet 12 is also exposed at the bottom of the bowl cup. The lower surface b is the side opposite to the upper surface, and the first side surface c is a surface located between the upper surface a and the lower surface b. Refer to Figure 6 and Figure 7As shown, in this example, a second recess c1 in the shape of a circular hole is provided in the area where the first side c of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 is exposed in the area of the first side 22 of the bracket housing 2. Optionally, the area where the first side c of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 is exposed in the bracket housing 2 and where the second recess c1 is not provided is flush with the first side 22 of the bracket housing 2. A first recess b1 in the shape of a square hole is provided in the area where the lower surface b of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 is exposed in the lower surface 23 of the bracket housing 2. Optionally, in this embodiment, the area where the lower surface b of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 is exposed in the lower surface 23 of the bracket housing 2 and where the second recess is not provided may also be flush with the lower surface 23 of the bracket housing 2. In this example, the first recess b1 and the second recess c1 communicate with each other inside the metal sheet. In this example, the opening of the first recess b1 is located at a position away from the edge of the lower surface b, and the opening of the second recess c1 is located at a position away from the edge of the first side c. In the application scenario of side light emission, when the first side c of this example is placed as the main mounting surface on the soldering surface provided with solder, the solder will preferentially fill the second recess c1 opposite to the main mounting surface, and the excess solder will overflow along the soldering surface or be squeezed and flow into the first recess b1 along the position where the two communicate. Therefore, the solder in the second recess c1 can be filled more fully and smoothly, and it is not easy to form voids in the solder. The LED bracket is installed on the soldering surface through the solder filled in the second recess c1 and is not easy to tilt and is firmly soldered. In addition, when heated, the excess solder will gather towards the first recess b1 of the metal sheet that does not contact the soldering surface, and the excess solder is received in the first recess b1, which can further improve the stability of soldering. In the application scenario of front light emission, the soldering process when the lower surface b of the metal sheet is placed as the main mounting surface on the soldering surface provided with solder is similar to the soldering process in the above application scenario of side light emission, and will not be elaborated here Please refer to Figures 8 to 9 Another conductive base 1 and LED bracket as shown. The conductive base 1 also includes a first metal sheet 11, a second metal sheet 12, and a third metal sheet 13 that are sequentially insulated and isolated. At least a part of the upper surface a of the first metal sheet 11, the first metal sheet 11, and the third metal sheet 13 is exposed at the bottom of the bowl cup, and at least a part of the upper surface a of the second metal sheet 12 is also exposed at the bottom of the bowl cup. The lower surface b is the side opposite to the upper surface, and the first side c is a side located between the upper surface a and the lower surface b. Refer to Figure 8 and Figure 9As shown, in this example, a second recess c1 in the shape of a square groove is provided in the area where the first side c of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 is exposed in the area of the first side 22 of the bracket housing 2. Optionally, the area where the first side c of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 is exposed in the bracket housing 2 and where the second recess c1 is not provided is flush with the first side 22 of the bracket housing 2. A first recess b1 in the shape of a square groove is provided in the area where the lower surface b of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 is exposed in the area of the lower surface 23 of the bracket housing 2. Optionally, in this embodiment, the area where the lower surface b of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 is exposed in the lower surface 23 of the bracket housing 2 and where the second recess is not provided may also be flush with the lower surface 23 of the bracket housing 2. In this example, the first recess b1 and the second recess c1 communicate with each other on the outer surface of the metal sheet.

[0039] It should be understood that the shapes of the first recess and / or the second recess provided on each metal sheet in this embodiment may be the same or at least partially different, and can be flexibly set according to the application scenario. For example, for a conductive base, see Figure 10 As shown, the second recess c1 provided in the area where the first side c of the first metal sheet 11 is exposed in the bracket housing 2 is a circular hole, and the second recess c1 provided in the area where the first side c of the second metal sheet 12 and the third metal sheet 13 is exposed in the bracket housing 2 is a square groove. Similarly, the setting of the first recess b1 can also be flexibly set according to requirements.

[0040] Optionally, in an example of this example, the lateral width of at least one metal sheet near the upper end of the upper surface can be set to be greater than the lateral width near the first side. In this way, when forming the LED bracket, a part of the upper end of the conductive metal substrate is embedded in the colloid of the bracket housing, thereby improving the stability of the combination between the metal sheet and the bracket housing. For example, see Figure 6 the conductive base shown, the lateral width W1 of the upper end of the third metal sheet 13 is greater than the lateral width W2 of the first side. Similarly, the lateral width W1 of the upper ends of the first metal sheet 11 and the second metal sheet 12 can also be greater than the lateral width W2 of the first side.

[0041] In some examples of this embodiment, in order to further improve the stability of the combination between the metal sheet and the bracket housing, at least one side surface of the upper end of the metal sheet may be set as an inclined surface, and the inclination angle of the inclined surface can be flexibly set according to requirements. For example, the side surfaces of the upper ends of the first metal sheet 11 and the second metal sheet 13 are inclined surfaces. After being combined with the bracket housing, the structure of this inclined surface relative to the non-inclined surface can have a larger contact area with the bracket housing and can better withstand the pressure of the bracket housing on the metal sheet, thereby better improving the bonding force between the metal sheet and the bracket housing. Of course, the side surface of the upper end of the second metal sheet 12 can also be set as an inclined surface according to requirements.

[0042] Of course, in some application examples, the lateral width of the upper end of the metal sheet near the upper surface may also be the same or substantially the same as the lateral width of the lower end near the lower surface. At this time, the bonding between the two can be achieved through the adhesive force between the bracket housing and the bonding area of the metal sheet. Specifically, it is flexibly set according to requirements.

[0043] Optionally, in order to further improve the firmness of the combination between the metal sheet and the bracket housing. In the area where the upper surface of the metal sheet is combined with the bracket housing, a rough surface with a concavo-convex structure for enhancing the bonding force with the bracket housing can be set (of course, a rough surface with a concavo-convex structure for enhancing the bonding force with the bracket housing can also be set in other areas where the metal sheet contacts the bracket housing), and / or bonding holes for the colloid used to form the bracket housing to flow in are provided.

[0044] Optionally, in this embodiment, the bonding holes provided on the upper surface of the metal sheet may communicate with the first recess provided on the lower surface of the metal sheet or may communicate with the second recess provided on the first side surface.

[0045] Optionally, in this embodiment, one end of the bonding hole close to the upper surface is the upper end, and one end close to the lower surface is the lower end. The aperture of the upper end of the bonding hole is larger than the aperture of the lower end of the bonding hole, that is, there is at least one raised surface between the upper end and the lower end of the bonding hole. This can further increase the contact area between the bonding hole and the colloid used to form the bracket housing and further improve the bonding strength between the two.

[0046] For example, for a setting example, please refer to Figure 11 As shown, in the area of the upper surface a of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 that is used to contact the bracket housing, a rough surface a1 with a concavo-convex structure is provided. Another example, please refer to Figure 12As shown, bonding holes a2 with a raised structure are provided in the areas on the upper surfaces a of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 for contacting the bracket housing. Of course, in some other setting examples, a rough surface a1 with a concavo-convex structure and bonding holes a2 with a raised structure can also be simultaneously provided in the areas on the upper surfaces a of at least one of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 for contacting the bracket housing.

[0047] This embodiment also provides an LED lamp bead, including the LED bracket as shown above, and further including an LED chip disposed in the bowl cup. The LED chip can be a flip-chip LED chip or a top-emitting LED chip, and an encapsulation layer covering the LED chip is disposed in the bowl cup. The electrodes of the LED chip are electrically connected to the exposed areas on the upper surfaces of the corresponding metal sheets. The encapsulation layer in this embodiment can be a fluorescent glue layer, or a combination of a fluorescent glue layer and a transparent glue layer, or a quantum dot QD film, or a combination of a QD film and a transparent glue layer, or a combination of at least two of a fluorescent glue layer, a QD film, and a transparent glue layer.

[0048] The LED lamp bead provided in this embodiment is made using the above LED bracket. For ease of understanding, several lamp bead structure examples are described below.

[0049] Please refer to Figure 13 As shown, the figure shows a transverse cross-sectional view of an LED lamp bead made using the LED bracket in each of the above examples. It can be seen from this figure that the gaps between the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 are all filled with a colloid forming the bracket housing, and two separated bowl cups are formed on the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13. Each bowl cup is provided with an LED chip 4. The LED chip is a flip-chip LED chip, and each flip-chip LED chip is horizontally arranged across two adjacent metal sheets. The bowl cup is filled with an encapsulation layer 3.

[0050] Please refer to Figure 14 As shown, the figure shows a transverse cross-sectional view of another LED lamp bead made using the LED bracket in each of the above examples. The difference between it and the lamp bead shown in Figure 13 is that the LED chip 4 disposed in the bowl cup is a top-emitting LED chip, and the two top-emitting LED chips are both disposed on the upper surface of the second metal sheet 12. Of course, it can also be adjusted so that the two top-emitting LED chips are respectively disposed on the upper surfaces of the first metal sheet 11 and the third metal sheet 13, or one top-emitting LED chip is disposed on the upper surface of the first metal sheet 11 and the other is disposed on the upper surface of the second metal sheet 12, or one top-emitting LED chip is disposed on the upper surface of the third metal sheet 13 and the other is disposed on the upper surface of the second metal sheet 12.

[0051] Please refer to Figure 15 as shown in the figure. The difference between the LED lamp beads shown in this figure and Figure 13 the LED lamp beads shown in the figure is that the second metal sheet 12 is reduced. Of course, it should be understood that when more than three LED chips need to be connected in series, a fourth metal sheet, a fourth and fifth metal sheet, etc. can also be successively added on the basis of Figure 11 the figure shown. Specifically, they can be flexibly selected and set according to requirements. However, it should be understood that these setting ideas are all equivalent replacement settings based on the structure provided in this embodiment and are all within the scope of this embodiment.

[0052] The LED lamp beads shown in each of the above examples are composed of a conductive base and a bracket housing that wraps the conductive base. Their structure is greatly simplified compared with existing light-emitting diodes, and the cost is low.

[0053] The metal sheet can simultaneously realize the bearing of the LED chip, the electrical connection with the LED chip, and serve as a pad to realize the electrical connection with the outside. It has high integration and a simple structure; Since the LED chip is directly placed on the upper surface of the metal sheet, and the lower surface and the first side surface of the metal sheet are both exposed, the heat generated by the LED chip during operation can be directly transferred to the metal sheet and quickly dissipated outward through the metal sheet, improving the performance of the LED lamp bead. Since the lower surface and the first side surface of the metal sheet are both exposed, both can be used as pads for external electrical connection. In the side-emitting application scenario, the first side surface can be welded to the outside, or both the first side surface and the lower surface can be welded simultaneously; in the front-emitting application scenario, the lower surface can be welded, or both the lower surface and the first side surface can be welded simultaneously. And the settings of the first recess and the second recess can further improve the reliability and convenience of welding. Therefore, it can be applied to various application scenarios, and the welding is convenient. It can also be welded on two surfaces according to requirements, which can improve the firmness of welding and thus improve the reliability of the product.

[0054] Optionally, in some examples of this embodiment, only the upper surface, lower surface, and first side surface of the metal sheet can be exposed outside the enclosure, and other surfaces are covered by the bracket housing, so as to improve the reliability of the combination between the conductive metal plate and the enclosure.

[0055] In an application scenario of this embodiment, the metal sheet can be, but is not limited to, a copper substrate. The copper substrate has the advantages of low cost, easy processing, good electrical conductivity and thermal conductivity, etc.

[0056] Optionally, in some other application examples of this embodiment, a reflective layer for improving the light extraction efficiency may also be provided at least on the upper surface of the metal sheet in the exposed area, thereby improving the efficiency of the LED lamp beads. In this embodiment, the reflective layer may be, but is not limited to, a silver layer, and the silver layer may be formed on the copper substrate by, but is not limited to, electroplating, electroless silver plating, etc.

[0057] It should be understood that the overall shape of the LED bracket in this embodiment may be a long strip, a square, a hexagon, etc., and the overall shape of the LED bracket is not limited in this embodiment.

[0058] It should be understood that the metal sheet in this embodiment may be any metal plate that can achieve reliable electrical connection and whose support strength meets the requirements of the LED bracket; since the metal plate has good heat dissipation performance, the heat dissipation performance of the LED bracket can be improved. Of course, it can also be replaced with other boards made of other conductive materials that meet the above requirements. In this embodiment, the specific shape and size of the metal sheet can be flexibly set according to application requirements and are not limited in this embodiment.

[0059] The colloid material forming the bracket housing in this embodiment can also be flexibly selected according to requirements. For example, it can be, but is not limited to, thermosetting glue or thermoplastic glue, and white glue with better reflection performance is selected but not limited to. For example, in one example, the colloid can be, but is not limited to, epoxy or resin (such as epoxy glue, silica gel, resin, etc.) materials.

[0060] This embodiment also provides a light-emitting unit module, which can be used in, but is not limited to, various lighting scenarios and / or display scenarios. It includes a substrate and multiple LED lamp beads as described above, and the multiple LED lamp beads are electrically connected to the substrate. The LED lamp beads in this embodiment can be front-emitting LED lamp beads or side-emitting LED lamp beads. For an example of the light-emitting unit module, please refer to Figure 16 As shown, the light-emitting unit module 5 shown in this figure includes a substrate 52 and multiple side-emitting LED lamp beads 51 disposed on the substrate 52.

[0061] This embodiment also provides a display device, including the light-emitting unit module as described above. The display device can be used in, but is not limited to, various displays, mobile phones, PCs, advertising devices, etc. For an example of the display device, please refer to Figure 17 As shown, it includes an outer frame 6, a film sheet 701 assembled in the outer frame 6, a light guide plate 702, a reflective sheet 203 and a metal backplane 204, and a light-emitting unit module 5 correspondingly disposed with the film sheet 701, the light guide plate 702, the reflective sheet 703 and the metal backplane 704. It should be understood that Figure 17 What is shown is only an example of the display device, and the specific structure of the display device can be flexibly set and will not be elaborated here.

[0062] The above content is a further detailed description of the embodiments of the present invention in combination with specific implementation manners. It cannot be determined that the specific implementation of the present invention is only limited to these descriptions. For those of ordinary skill in the technical field to which the present invention pertains, without departing from the concept of the present invention, several simple deductions or substitutions can be made, and all should be regarded as belonging to the protection scope of the present invention.

Claims

1. An LED bracket, comprising a conductive base and a bracket housing, wherein, the conductive base includes at least two metal sheets that are insulated and separated from each other. The metal sheets are combined with a colloid used to form the bracket housing to form an LED bracket. The upper surface of the metal sheet is located at the bottom of the bracket housing enclosing the bowl cup for placing the LED chip, and at least part of it is exposed; the upper surface of at least one of the metal sheets is used to carry the LED chip, and the exposed area of the upper surface of each metal sheet is used to be electrically connected to the electrodes of the corresponding LED chip; at least part of the lower surface of the metal sheet is exposed outside the bracket housing. The lower surface is the surface opposite to the upper surface. At least part of the first side surface of at least one of the metal sheets between the upper surface and the lower surface is exposed outside the bracket housing. At least one of the metal sheets on the second side surface between the upper surface and the lower surface is not exposed outside the bracket housing. The first side surface and the second side surface are two opposite side surfaces. The area of the lower surface exposed outside the bracket housing is provided with a first recess for accommodating solder. The area of the first side surface exposed outside the bracket housing is provided with a second recess for accommodating solder. The opening of the first recess is located at a position on the lower surface far from the edge. The opening of the second recess is located at a position on the first side surface far from the edge. The first recess and the second recess communicate with each other inside the metal sheet.

2. The LED bracket according to claim 1, wherein, in the area where the upper surface of the metal sheet is combined with the bracket housing, there is a rough surface with an uneven structure for enhancing the bonding force with the bracket housing, and / or there are bonding holes for the colloid used to form the bracket housing to flow in.

3. The LED bracket according to claim 2, wherein, the bonding holes communicate with the first recess.

4. The LED bracket according to claim 3, wherein, one end of the bonding hole close to the upper surface is the upper end, and one end close to the lower surface is the lower end. The aperture of the upper end of the bonding hole is larger than the aperture of the lower end of the bonding hole.

5. The LED bracket according to claim 1, wherein, the conductive base includes three metal sheets arranged in sequence. The exposed areas of the upper surface of the middle metal sheet are respectively electrically connected to the electrodes corresponding to two LED chips.

6. The LED bracket according to claim 1, wherein, the lateral width of at least one of the metal sheets near the upper end of the upper surface is greater than the lateral width of the first side surface, and a part of the upper end of the metal sheet is embedded in the bracket housing; and / or, at least one of the metal sheets is provided with a protrusion extending outward between the upper surface and the lower surface, and at least part of the protrusion is embedded in the bracket housing.

7. The LED bracket according to claim 6, wherein, The conductive base includes three metal sheets arranged in sequence, and the bracket housing further includes a partition wall disposed on the upper surface of the middle metal sheet to form two isolated bowl cups on the upper surfaces of the three metal sheets.

8. An LED lamp bead, characterized in that it includes the LED bracket according to any one of claims 1 to 7, further includes an LED chip disposed in the bowl cup, and a packaging layer disposed in the bowl cup to cover the LED chip, and electrodes of the LED chip are electrically connected to exposed areas on the upper surfaces of the corresponding metal sheets.

9. A light-emitting unit module, characterized in that it includes a substrate and multiple LED lamp beads according to claim 8, and the multiple LED lamp beads are electrically connected to the substrate.

10. A display device, characterized in that it includes the light-emitting unit module according to claim 9.

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