Light-emitting assembly, preparation method thereof and display panel

Abstract

The invention discloses a light-emitting assembly, a preparation method thereof and a display panel, and relates to the technical field of display. The light-emitting assembly comprises a substrate, a driving unit, a light-emitting unit and a packaging structure. The target area of the substrate surrounds the orthographic projection of the driving unit on the substrate and the orthographic projection of the light-emitting unit on the substrate. The first part of the packaging structure is connected with the side, away from the substrate, of the light-emitting unit, and the second part surrounds the light-emitting unit and the driving unit and is connected with the target area of the substrate. Therefore, the light-emitting unit and the driving unit can be located in the sealed space jointly formed by the substrate and the packaging structure, the sealing effect on the light-emitting unit and the driving unit is guaranteed, the influence of the external environment on the light-emitting unit and the driving unit is avoided, and the reliability of the light-emitting assembly is improved.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and particularly relates to a light-emitting component, a preparation method thereof, and a display panel. Background Art

[0002] A display panel includes a display backplane and a plurality of light-emitting components connected to the display backplane. Among them, the display backplane can provide a driving signal for the light-emitting components so that the light-emitting components emit light, thereby realizing display.

[0003] In related technologies, a light-emitting component includes a substrate, a driving unit and a light-emitting unit located on the substrate. Among them, the light-emitting unit is connected to the driving unit, and the driving unit is used to drive the light-emitting unit to emit light.

[0004] However, since the sides of both the light-emitting unit and the driving unit are exposed, the light-emitting unit and the driving unit are easily affected by the external environment, and the reliability is poor. Summary of the Invention

[0005] The present application provides a light-emitting component, a preparation method thereof, and a display panel, which can solve the problem of poor reliability in related technologies. The technical solutions are as follows:

[0006] On the one hand, a light-emitting component is provided. The light-emitting component includes:

[0007] A substrate, a driving unit, and a light-emitting unit. The driving unit is located on one side of the substrate, the light-emitting unit is located on the side of the driving unit away from the substrate, and the light-emitting unit is electrically connected to the driving unit; the orthographic projection of the driving unit on the substrate and the orthographic projection of the light-emitting unit on the substrate are both located within the substrate, and the substrate has a target area that surrounds the orthographic projection of the driving unit on the substrate and the orthographic projection of the light-emitting unit on the substrate;

[0008] The light-emitting component further includes: an encapsulation structure. The encapsulation structure includes a first part and a second part connected to each other. The first part has a plate-like structure. The first part is located on the side of the light-emitting unit away from the substrate, and the side of the first part away from the second part is connected to the side of the light-emitting unit away from the substrate. The second part has a ring-like structure. The second part surrounds the light-emitting unit and the driving unit, and the side of the second part away from the first part is connected to the target area.

[0009] Optionally, the light-emitting component further includes: a first adhesive layer and a second adhesive layer;

[0010] The first adhesive layer is located between the first part and the light-emitting unit, and is used to bond the surface of the first part close to the substrate and the surface of the light-emitting unit far from the substrate;

[0011] The second adhesive layer is located between the second part and the target area of the substrate, and is used to bond the surface of the second part close to the substrate and the target area.

[0012] Optionally, the distance between the side of the target orthographic projection among the orthographic projection of the driving unit on the substrate and the orthographic projection of the light-emitting unit on the substrate and the side of the substrate is greater than 15 micrometers;

[0013] Wherein, the target orthographic projection is the orthographic projection with a smaller distance between the side and the side of the substrate among the orthographic projection of the driving unit on the substrate and the orthographic projection of the light-emitting unit on the substrate.

[0014] Optionally, the range of the distance between the surface of the second part close to the substrate and the surface of the first part close to the substrate is 5 micrometers to 8 micrometers.

[0015] Optionally, the distance between the boundary of the area surrounded by the annular structure of the second part and the boundary of the target unit among the light-emitting unit and the driving unit is greater than 5 micrometers;

[0016] Wherein, the target unit is the unit with a smaller distance between the boundary and the boundary of the area surrounded by the annular structure among the light-emitting unit and the driving unit.

[0017] Optionally, the first part and the second part are of an integral structure;

[0018] The material of the encapsulation structure is glass, sapphire or quartz.

[0019] Optionally, the light-emitting component further includes: a color conversion layer and a color conversion encapsulation layer;

[0020] The color conversion layer is located on the side of the first part close to the substrate, and the color conversion encapsulation layer is located on the side of the color conversion layer far from the first part; or,

[0021] The color conversion layer is located on the side of the light-emitting unit far from the substrate, and the color conversion encapsulation layer is located on the side of the color conversion layer far from the substrate.

[0022] Optionally, the light-emitting unit includes: a first electrode, a second electrode, and a light-emitting layer electrically connected to the first electrode and the second electrode respectively;

[0023] The driving unit includes a third electrode, a fourth electrode, and a driving circuit. The third electrode and the fourth electrode are both located on the side of the driving unit close to the light-emitting unit. The third electrode and the fourth electrode are respectively electrically connected to the driving circuit. The third electrode is electrically connected to the first electrode, and the fourth electrode is electrically connected to the second electrode.

[0024] On the other hand, a method for manufacturing a light-emitting component is provided. A substrate, a driving unit, and a light-emitting unit are obtained. The driving unit is located on one side of the substrate, the light-emitting unit is located on the side of the driving unit away from the substrate, and the light-emitting unit and the driving unit are electrically connected. The orthographic projection of the driving unit on the substrate and the orthographic projection of the light-emitting unit on the substrate are both located within the substrate, and the substrate has a target area that surrounds the orthographic projection of the driving unit on the substrate and the orthographic projection of the light-emitting unit on the substrate.

[0025] An encapsulation substrate is obtained, and the encapsulation substrate is etched to obtain an encapsulation structure. The encapsulation structure includes a connected first part and a second part. The first part has a plate-like structure, and the second part has a ring-like structure. The area surrounded by the second part is obtained by etching the encapsulation substrate.

[0026] The driving unit and the light-emitting unit are encapsulated using the encapsulation structure.

[0027] Wherein, after encapsulation, the driving unit and the light-emitting unit are located within the area surrounded by the second part, the substrate is located outside the area surrounded by the second part and on the side of the second part away from the first part. One side of the first part close to the second part is connected to the surface of the light-emitting unit away from the substrate, and one side of the second part away from the first part is connected to the target area.

[0028] In yet another aspect, a display panel is provided. The display panel includes a display backplane and a plurality of light-emitting components as described in the above aspects that are arranged in an array on one side of the display backplane.

[0029] Wherein, the display backplane is used to provide a driving signal for the driving unit in the light-emitting component, so that the driving unit drives the light-emitting unit to emit light.

[0030] The beneficial effects brought by the technical solution provided in this application at least include:

[0031] The present application provides a light-emitting component, a preparation method thereof, and a display panel. The light-emitting component includes a substrate, a driving unit, a light-emitting unit, and a packaging structure. The target area of the substrate surrounds the orthographic projection of the driving unit on the substrate and the orthographic projection of the light-emitting unit on the substrate. The first part of the packaging structure is connected to the side of the light-emitting unit away from the substrate, and the second part surrounds the light-emitting unit and the driving unit and is connected to the target area of the substrate. Thereby, both the light-emitting unit and the driving unit are located in the sealed space jointly formed by the substrate and the packaging structure, ensuring the sealing effect on the light-emitting unit and the driving unit, avoiding the influence of the external environment on the light-emitting unit and the driving unit, and improving the reliability of the light-emitting component. Description of the Drawings

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0033] Figure 1 is a schematic structural diagram of a light-emitting component provided by an embodiment of the present application;

[0034] Figure 2 is a schematic structural diagram of a packaging structure provided by an embodiment of the present application;

[0035] Figure 3 is a schematic structural diagram of an array of packaging structures provided by an embodiment of the present application;

[0036] Figure 4 is a schematic structural diagram of another light-emitting component provided by an embodiment of the present application;

[0037] Figure 5 is a schematic structural diagram of yet another light-emitting component provided by an embodiment of the present application;

[0038] Figure 6 is a schematic structural diagram of a light-emitting unit provided by an embodiment of the present application;

[0039] Figure 7 is a schematic structural diagram of still another light-emitting component provided by an embodiment of the present application;

[0040] Figure 8 is a flowchart of a preparation method of a light-emitting component provided by an embodiment of the present application;

[0041] Figure 9 is a schematic structural diagram of a substrate, a driving unit, and a light-emitting unit provided by an embodiment of the present application;

[0042] Figure 10It is a schematic structural diagram of a display panel provided by an embodiment of the present application. Detailed implementation manners

[0043] To make the objectives, technical solutions, and advantages of the present application clearer, the following will further describe the embodiments of the present application in detail with reference to the accompanying drawings.

[0044] A micro light emitting diode (Micro LED) display panel generally includes a display backplane, a driving unit integrally disposed on the display backplane, and a light-emitting chip bonded to the driving unit. When manufacturing the Micro LED display panel, in order to achieve color display, it is necessary to transfer and bond light-emitting chips of different colors to the display backplane integrated with the driving unit, and the light-emitting chips of the same color are transferred at the same time, and the light-emitting chips of different colors are transferred in batches. That is to say, the number of transfers is the number of colors of the light-emitting chips. Optionally, the light-emitting chips include light-emitting chips of three colors, such as red (R) light-emitting chips, green (G) light-emitting chips, and blue light-emitting chips, and thus three transfers are required. The number of transfers is relatively large and the process is relatively complex when preparing the Micro LED display panel by this solution.

[0045] Moreover, in order to reduce the manufacturing cost of the Micro LED display panel, the size of the display backplane is not designed too large (because if it is designed too large, if some of the light-emitting chips fail to emit light after transfer, the entire product will be scrapped and the cost will be relatively high). Therefore, if large-size display needs to be realized by this solution, it can only be achieved by splicing, and the display effect is relatively poor.

[0046] For red, green, and blue micro display chips (RGB Micro LED) bonded to a driving unit to form a new active-matrix light-emitting diode (AM-LED) chip with a built-in driving circuit. The AM-LED chip includes light-emitting chips of three colors, namely red, green, and blue, and a driving unit for driving the light-emitting chips. Furthermore, for the preparation of a display panel of a certain size, the corresponding number of AM-LED chips are transferred and bonded to the display backplane at one time to realize the preparation of a glass-based color light-emitting diode (LED) display panel component. At the same time, this solution only requires one transfer process, and the process is relatively simple. Moreover, large-size display can be realized without splicing, which can improve the glass utilization rate of the display backplane, thereby reducing the cost.

[0047] Moreover, through detection technology, the AM-LED chip can achieve dual electrical / optical detection to screen out chips that meet the requirements in terms of both optical performance and driving performance. Thus, compared with the solution of integrating the driving circuit on the display backplane to form a display panel, it is more conducive to improving the chip yield on the display panel and also facilitates the repair and replacement of defective chips.

[0048] However, in related technologies, the AM-LED chip is exposed and not protected by a corresponding protection structure, resulting in poor reliability.

[0049] Figure 1 It is a schematic structural diagram of a light-emitting component provided by an embodiment of the present application. Refer to Figure 1 , the light-emitting component 10 includes: a substrate 101, a driving unit 102, and a light-emitting unit 103. The driving unit 102 is located on one side of the substrate 101, the light-emitting unit 103 is located on the side of the driving unit 102 away from the substrate 101, and the light-emitting unit 103 is electrically connected to the driving unit 102. The driving unit 102 is configured to provide a driving signal for the light-emitting unit 103 to drive the light-emitting unit 103 to emit light.

[0050] The orthographic projection of the driving unit 102 on the substrate 101 and the orthographic projection of the light-emitting unit 103 on the substrate 101 are both located within the substrate 101. The substrate 101 has a target area 101a, and the target area 101a surrounds the orthographic projection of the driving unit 102 on the substrate 101 and the orthographic projection of the light-emitting unit 103 on the substrate 101. That is, the target area 101a is the area of the substrate 101 that extends beyond the driving unit 102 and the light-emitting unit 103 and surrounds the driving unit 102 and the light-emitting unit 103.

[0051] Refer to Figure 1 , the light-emitting component 10 further includes: a packaging structure 104. The packaging structure 104 includes a connected first part 1041 and a second part 1042. The first part 1041 has a plate-like structure. The first part 1041 is located on the side of the light-emitting unit 103 away from the substrate 101, and the side of the first part 1041 close to the second part 1042 is connected to the side of the light-emitting unit 103 away from the substrate 101. The second part 1042 has an annular structure. The second part 1042 surrounds the light-emitting unit 103 and the driving unit 102, and the side of the second part 1042 away from the first part 1041 is connected to the target area 101a.

[0052] In the embodiment of the present application, the first part 1041 of the encapsulation structure 104 can be used to encapsulate the side of the light-emitting unit 103 away from the substrate 101, and the second part 1042 of the encapsulation structure 104 can be used to encapsulate the side surfaces of the light-emitting unit 103 and the driving unit 102. Thus, the light-emitting unit 103 and the driving unit 102 can be wrapped in the sealed space jointly formed by the substrate 101 and the encapsulation structure 104, thereby avoiding the influence of the external environment on the light-emitting unit 103 and the driving unit 102, and having relatively high reliability.

[0053] In summary, the embodiment of the present application provides a light-emitting component, which includes a substrate, a driving unit, a light-emitting unit, and an encapsulation structure. The target area of the substrate surrounds the orthographic projection of the driving unit on the substrate and the orthographic projection of the light-emitting unit on the substrate. The first part of the encapsulation structure is connected to the side of the light-emitting unit away from the substrate, and the second part surrounds the light-emitting unit and the driving unit and is connected to the target area of the substrate. Thus, the light-emitting unit and the driving unit are both located in the sealed space jointly formed by the substrate and the encapsulation structure, ensuring the sealing effect on the light-emitting unit and the driving unit, avoiding the influence of the external environment on the light-emitting unit and the driving unit, and improving the reliability of the light-emitting component.

[0054] In the embodiment of the present application, the materials of the encapsulation structure 104 can all be transparent materials, so as to avoid affecting the light output of the light-emitting unit 103. For example, the light emitted by the light-emitting unit 103 can be emitted from the surface of the encapsulation structure 104 away from the substrate 101.

[0055] Optionally, the material of the encapsulation structure 104 can be glass, sapphire or quartz. Of course, the encapsulation structure 104 can also be other materials, as long as the rigidity requirements of the encapsulation structure 104 are met and the material is a transparent material.

[0056] As an optional implementation manner, the first part 1041 and the second part 1042 of the encapsulation structure 104 can be an integral structure. For example, the preparation method of the encapsulation structure 104 can be: obtaining an encapsulation substrate; etching the encapsulation substrate to obtain a groove. Wherein, the first part 1041 of the encapsulation structure 104 is the part of the encapsulation substrate that is not etched in the thickness direction, and the second part 1042 of the encapsulation structure 104 is the remaining part around the groove obtained by etching the encapsulation substrate. Thus, the thickness of the first part 1041 of the encapsulation structure 104 can be equal to the difference between the thickness of the encapsulation substrate and the depth of the groove. The height of the second part 1042 of the encapsulation structure 104 is equal to the depth of the groove. Wherein, the height of the second part 1042 of the encapsulation structure 104 is equal to the distance between the surface of the second part 1042 away from the first part 1041 and the surface of the second part 1042 close to the first part 1041.

[0057] Since the light-emitting unit 103 and the driving unit 102 need to be arranged in the sealed space jointly formed by the encapsulation structure 104 and the substrate 101, the height of the second part 1042 of the encapsulation structure 104 is related to the total height of the light-emitting unit 103 and the driving unit 102. The height of the second part 1042 (i.e., the depth of the groove) can be determined by the duration of the etching process. Therefore, for different light-emitting components, the total height of the light-emitting unit 103 and the driving unit 102 can be determined first, and then the encapsulation structure 104 required for different light-emitting components can be obtained by adjusting the etching duration of the encapsulation substrate.

[0058] Optionally, referring to Figure 2 , the range of the height h1 of the second part 1042 of the encapsulation structure 104 can be 5 μm to 8 μm. That is, the range of the distance between the surface of the second part 1042 far from the first part 1041 and the surface of the second part 1042 close to the first part 1041 is 5 μm to 8 μm.

[0059] In the embodiment of the present application, in order to achieve mass production, a relatively large-sized encapsulation substrate can be obtained; the relatively large-sized encapsulation substrate is etched to obtain an array of the encapsulation structures 104 as shown in Figure 3 ; the light-emitting unit 103 and the driving unit 102 are transferred and pressed into the encapsulation structure 104; the whole structure is cut by a cutting process to obtain a plurality of independent light-emitting components with the encapsulation structure 104.

[0060] As another optional implementation manner, the first part 1041 and the second part 1042 of the encapsulation structure 104 can also be a split structure. For example, the first part 1041 and the second part 1042 can be obtained separately, and then the first part 1041 and the second part 1042 are bonded together through an adhesive layer.

[0061] The embodiment of the present application does not make a specific limitation on whether the first part 1041 and the second part 1042 of the encapsulation structure 104 are an integral structure or a split structure, as long as the encapsulation effect of the encapsulation structure 104 on the light-emitting unit 103 and the driving unit 102 is ensured, and the encapsulation structure 104 meets the rigidity requirement.

[0062] Optionally, referring to Figure 2 , the width h2 of the second part 1042 of the encapsulation structure 104 can be greater than or equal to 5 μm to ensure the rigidity effect of the second part 1042 of the encapsulation structure 104. Since the installation accuracy is considered, a reserved space needs to be provided for the connection between the second part 1042 and the target area 101a. Optionally, at least 5 μm of installation accuracy reservation is provided on both sides of the second part 1042 and the target area 101a.

[0063] Therefore, the distance h3 between the side of the target orthographic projection in the orthographic projection of the driving unit 102 on the substrate 101 and the side of the substrate 101 is greater than or equal to 15 μm, that is, h3 ≥ 15 μm. The target orthographic projection is the orthographic projection with a smaller distance between the side and the side of the substrate 101 among the orthographic projection of the driving unit 102 on the substrate 101 and the orthographic projection of the light-emitting unit 103 on the substrate 101. Among them, the distance h3 (15 μm) = the width of the second part 1042 (5 μm) + the reserved width for installation accuracy (5 μm) × 2.

[0064] In the embodiment of the present application, since the light-emitting unit 103 and the driving unit 102 are located in the area surrounded by the second part 1042, in order to avoid hitting the light-emitting unit 103 or the driving unit 102 during the bonding process of the second part 1042 and the substrate, it is necessary to make the size of the area surrounded by the second part 1042 slightly larger than the size of the larger one of the light-emitting unit 103 and the driving unit 102.

[0065] Optionally, the distance h4 between the boundary of the second part 1042 close to the central area of the light-emitting component (i.e., the inner boundary) and the boundary of the target unit among the light-emitting unit 103 and the driving unit 102 is greater than or equal to 5 μm, that is, h4 ≥ 5 μm. Among them, the target unit is the unit with a smaller distance between the boundary and the boundary of the second part 1042 close to the central area of the light-emitting component among the light-emitting unit 103 and the driving unit 102. That is to say, the size of the annular area surrounded by the second part 1042 = the size of the target unit + at least 5 μm.

[0066] It can be understood that the second part 1042 is a ring structure. The distance between the boundary of the second part 1042 close to the central area of the light-emitting component and the boundary of the target unit being greater than or equal to 5 μm may mean that: at any angular position of the ring structure, the distance between the boundary of the second part 1042 close to the central area of the light-emitting component and the boundary of the target unit is greater than or equal to 5 μm.

[0067] Reference Figure 1 It can also be seen that the light-emitting component 10 may further include: a first bonding layer 105 and a second bonding layer 106. The first bonding layer 105 is located between the first part 1041 and the light-emitting unit 103, and is used to bond the surface of the first part 1041 close to the substrate 101 and the surface of the light-emitting unit 103 away from the substrate 101. The second bonding layer 106 is located between the second part 1042 and the target area 101a of the substrate 101, and is used to bond the surface of the second part 1042 close to the substrate 101 and the target area 101a.

[0068] Optionally, the materials of the first adhesive layer 105 and the second adhesive layer 106 may be transparent adhesive layers to avoid affecting the light emitted by the light-emitting units.

[0069] In the embodiment of the present application, the light-emitting assembly 10 may include a plurality of light-emitting units 103, and the colors of the light emitted by the plurality of light-emitting units 103 may be the same color. For example, the colors of the light emitted by the plurality of light-emitting units 103 are all blue. To achieve multi-color display, refer to Figure 4 , the light-emitting assembly 10 further includes: a color conversion layer 107. Wherein, the color conversion layer 107 includes: a first color conversion part, a second color conversion part and a transparent part.

[0070] The orthographic projection of the first color conversion part on the substrate 101 overlaps with the orthographic projection of the first light-emitting unit 103 on the substrate 101, and the first color conversion part is used to convert the light emitted by the first light-emitting unit 103 into the color corresponding to the first color conversion part. For example, the color of the first color conversion part is red, and the first color conversion part can convert the blue light emitted by the first light-emitting unit 103 into red light. That is, the blue light emitted by the first light-emitting unit 103 is converted into red light after passing through the first color conversion part.

[0071] The orthographic projection of the second color conversion part on the substrate 101 overlaps with the orthographic projection of the second light-emitting unit 103 on the substrate 101, and the second color conversion part is used to convert the light emitted by the second light-emitting unit 103 into the color corresponding to the second color conversion part. For example, the color of the second color conversion part is green, and the second color conversion part can convert the blue light emitted by the second light-emitting unit 103 into green light. That is, the blue light emitted by the second light-emitting unit 103 is converted into green light after passing through the second color conversion part.

[0072] The orthographic projection of the transparent part on the substrate 101 overlaps with the orthographic projection of the third light-emitting unit 103 on the substrate 101, and the transparent part is used to transmit the light emitted by the third light-emitting unit 103. For example, the blue light emitted by the third light-emitting unit 103 remains blue light after passing through the transparent part.

[0073] Further, refer to Figure 4 , the light-emitting unit 103 further includes: a color conversion encapsulation layer 108. The color conversion encapsulation layer 108 can be used to encapsulate the color conversion layer 107.

[0074] As an optional implementation manner, refer to Figure 4, the color conversion layer 107 and the color conversion encapsulation layer 108 are located between the first part 1041 of the encapsulation structure 104 and the light-emitting unit 103. For example, the color conversion layer 107 is located on the side of the first part 1041 close to the substrate 101, and the color conversion encapsulation layer 108 is located on the side of the color conversion layer 107 away from the first part 1041. That is to say, the color conversion layer 107 and the color conversion encapsulation layer 108 can be formed in the area enclosed by the first part 1041 and the second part 1042 of the encapsulation structure 104.

[0075] Further, the first adhesive layer 105 can be located between the color conversion encapsulation layer 108 and the light-emitting unit 103, and the first adhesive layer 105 is used to bond the color conversion encapsulation layer 108 and the light-emitting unit 103.

[0076] As another alternative implementation, refer to Figure 5 , the color conversion layer 107 and the color conversion encapsulation layer 108 can be integrally arranged on the light-emitting unit 103. That is to say, the color conversion layer 107 is located on the side of the light-emitting unit 103 away from the substrate 101, and the color conversion encapsulation layer 108 is located on the side of the color conversion layer 107 away from the light-emitting unit 103.

[0077] Further, the first adhesive layer 105 can be located between the color conversion encapsulation layer 108 and the first part 1041, and the first adhesive layer 105 is used to bond the color conversion encapsulation layer 108 and the first part 1041.

[0078] In addition, the light-emitting component 10 may not include the color conversion layer 107 and the color conversion encapsulation layer 108, and the colors of the light emitted by the plurality of light-emitting units 103 may also be different colors. For example, the plurality of light-emitting units 103 include a red light-emitting unit, a green light-emitting unit, and a blue light-emitting unit. The color of the light emitted by the red light-emitting unit is red, the color of the light emitted by the green light-emitting unit is green, and the color of the light emitted by the blue light-emitting unit is blue.

[0079] In the embodiment of the present application, refer to Figure 1 , the light-emitting unit 103 includes: a first electrode 1031, a second electrode 1032, and a light-emitting layer 1033 electrically connected to the first electrode 1031 and the second electrode 1032 respectively.

[0080] Optionally, refer to Figure 6 , the light-emitting layer 1033 includes a first doped layer 10331, a multi-quantum well layer 10332, and a second doped layer 10333 arranged in a stacked manner. Among them, the first doped layer 10331 is electrically connected to the first electrode 1031, and the second doped layer 10333 is electrically connected to the second electrode 1032.

[0081] Optionally, the first doping layer 10331 can be an N-type doping layer, and the second doping layer 10333 can be a P-type doping layer. Correspondingly, the first electrode 1031 can be referred to as an N-type electrode, and the second electrode 1032 can be referred to as a P-type electrode. Optionally, the material of the first doping layer 10331 can be N-type gallium nitride (GaN), and the first doping layer 10331 is denoted as N-GaN. The material of the second doping layer 10333 can be P-type gallium nitride (GaN), and the second doping layer 10333 is denoted as P-GaN.

[0082] Reference Figure 6 , the second doping layer 10333 and the multi-quantum well layer 10332 are used to expose the target part of the first doping layer 10331. The light-emitting layer 1033 further includes a pad electrode 10334, a conductive layer 10335, and an insulating layer 10336. Among them, the pad electrode 10334 is connected to the target part of the first doping layer 10331, the conductive layer 10335 is located on the side of the second doping layer 10333 away from the first doping layer 10331, and the insulating layer 10336 is located on the side of the pad electrode 10334 and the conductive layer 10335 away from the first doping layer 10331. The insulating layer 10336 has a first via hole (N-type via hole) and a second via hole (P-type via hole). The first via hole is used to expose the pad electrode 10334, and the pad electrode 10334 is connected to the first electrode 1031. The second via hole is used to expose the conductive layer 10335, and the conductive layer 10335 is connected to the second electrode 1032. Optionally, the material of the conductive layer 10335 can be indium tin oxide (ITO), and the insulating layer 10336 can be a passivation layer (PVX).

[0083] In the embodiment of the present application, reference Figure 1 , Figure 4 and Figure 5 , the driving unit 102 includes: a third electrode 1021, a fourth electrode 1022, and a driving circuit 1023. Both the third electrode 1021 and the fourth electrode 1022 are located on the side of the driving unit 102 facing the light-emitting unit 103, that is, the third electrode 1021 and the fourth electrode 1022 are closer to the light-emitting unit 103 than the driving circuit 1023. The third electrode 1021 and the fourth electrode 1022 are respectively electrically connected to the driving circuit 1023, the third electrode 1021 is electrically connected to the first electrode 1031, and the fourth electrode 1022 is electrically connected to the second electrode 10321.

[0084] Further, reference Figure 7, the light-emitting component 10 further includes: a pin 109 located on the side of the substrate 101 away from the driving unit 102. The pin 109 can be connected to the driving circuit 1023 in the driving unit 102 through a connection structure 110 in the substrate 101. Among them, the pin 109 can be used to receive the driving signal provided by the display backplane, and then the pin 109 can provide the driving signal for the driving unit 102, so that the driving unit 102 drives the light-emitting unit 103 to emit light.

[0085] In the embodiment of the present application, the driving circuit 1023 may include a plurality of thin-film transistors and at least one storage capacitor. Optionally, the driving circuit 1023 may include seven thin-film transistors and one storage capacitor, that is, the driving circuit 1023 is a 7T1C driving circuit 1023. Or, the driving circuit 1023 may include other numbers of thin-film transistors and other numbers of storage capacitors. The embodiment of the present application does not limit the number of thin-film transistors included in the driving circuit 1023 and the number of storage capacitors included.

[0086] Among them, each thin-film transistor includes a gate, a source, and a drain. The plurality of thin-film transistors included in the driving circuit 1023 are connected to each other to achieve the function of driving the light-emitting unit 103 to emit light.

[0087] Optionally, the plurality of thin-film transistors at least include a data writing transistor, and the source of the data writing transistor is used to connect to the data line of the display backplane in the display panel. The data line can transmit the data driving signal to the driving circuit 1023 through the data writing transistor.

[0088] In the embodiment of the present application, the pin 109 included in the light-emitting component is connected to the source of the data writing transistor in the driving circuit 1023, and the data writing transistor is connected to the third electrode 1021 of the driving unit 102 through other thin-film transistors, so that the data line included in the display backplane of the display panel sequentially transmits the data driving signal to the first electrode 1031 of the light-emitting unit 103 through the pin 109, the driving circuit 1023, and the third electrode 1021.

[0089] It should be noted that, in order to enable the driving unit 102 to drive the light-emitting unit 103 to emit light, in addition to the data driving signal provided for the first electrode 1031 of the light-emitting unit 103, a power supply signal (such as a VSS signal) also needs to be provided for the second electrode 1032 of the light-emitting unit 103. Optionally, the power supply signal provided by the display backplane for the plurality of light-emitting components included in the display panel can be the same signal. Therefore, the power supply signal can be provided for the second electrode 1032 of the light-emitting unit 103 in the plurality of light-emitting components through the pin 109 (not shown in the drawing) located in the peripheral area of the display panel.

[0090] ReferenceFigure 7 The driving circuit 1023 includes a buffer layer m1, an active layer m2, a first gate insulating layer m3, a first gate layer m4, a second gate insulating layer m5, a second gate layer m6, an interlayer dielectric layer m7, a source-drain layer m8, and a planarization layer m9 that are sequentially stacked on one side of the substrate 101. The third electrode 1021 and the fourth electrode 1022 included in the driving unit 102 are located on the side of the planarization layer m9 away from the substrate 101.

[0091] The active layer m2 includes a plurality of active patterns corresponding to a plurality of thin film transistors. Each active pattern includes a source region, a drain region, and a channel region. The source and drain of the thin film transistor are located in the source-drain layer, and the source of the thin film transistor is connected to the source region, and the drain is connected to the drain region.

[0092] The first gate layer m4 includes a plurality of gate patterns corresponding to a plurality of thin film transistors. The channel region is an overlapping region of the positive projection of the gate pattern on the substrate 101 and the positive projection of the active pattern on the substrate 101.

[0093] In the embodiment of the present application, before encapsulating the light-emitting unit 103 and the driving unit 102 with the encapsulation structure 104, pins 109 are prepared on the side of the driving unit 102 away from the light-emitting unit 103 through an electroplating process or an electroless plating process. Therefore, the entire component needs to be placed in a specific solution. In this case, the specific solution may invade between the light-emitting unit 103 and the driving unit 102, which may cause damage to the device.

[0094] Therefore, referring to Figure 7 , the light-emitting component 10 further includes: a separation part 111. The separation part 111 is located between the light-emitting unit 103 and the driving unit 102, and the separation part 111, the driving circuit 1023, and the light-emitting layer 1033 can form a sealed space. The first electrode 1031 and the second electrode 1032 of the light-emitting unit 103, and the third electrode 1021 and the fourth electrode 1022 of the driving unit 102 can be located in this sealed space. This can avoid the influence of subsequent processes on each electrode and ensure the reliability of the electrodes.

[0095] In summary, the embodiment of the present application provides a light-emitting component, which includes a substrate, a driving unit, a light-emitting unit, and an encapsulation structure. The target area of the substrate surrounds the positive projection of the driving unit on the substrate and the positive projection of the light-emitting unit on the substrate. The first part of the encapsulation structure is connected to the side of the light-emitting unit away from the substrate, and the second part surrounds the light-emitting unit and the driving unit and is connected to the target area of the substrate. This can make both the light-emitting unit and the driving unit located in the sealed space jointly formed by the substrate and the encapsulation structure, ensure the sealing effect on the light-emitting unit and the driving unit, avoid the influence of the external environment on the light-emitting unit and the driving unit, and improve the reliability of the light-emitting component.

[0096] Figure 8 It is a flowchart of a method for preparing a light-emitting component provided by an embodiment of the present application. Refer to Figure 8 , the method includes:

[0097] Step S101, obtain a substrate, a driving unit, and a light-emitting unit.

[0098] In the embodiment of the present application, refer to Figure 9 , the driving unit 102 is located on one side of the substrate 101, the light-emitting unit 103 is located on the side of the driving unit 102 away from the substrate 101, and the light-emitting unit 103 and the driving unit 102 are electrically connected.

[0099] The orthographic projection of the driving unit 102 on the substrate 101 and the orthographic projection of the light-emitting unit 103 on the substrate 101 are both located within the substrate 101, and the substrate 101 has a target area 101a, and the target area 101a surrounds the orthographic projection of the driving unit 102 on the substrate 101 and the orthographic projection of the light-emitting unit 103 on the substrate 101. That is to say, the target area 101a is the area of the substrate 101 that extends beyond the driving unit 102 and the light-emitting unit 103 and surrounds the driving unit 102 and the light-emitting unit 103.

[0100] Among them, the steps of obtaining the substrate, the driving unit, and the light-emitting unit include: forming the substrate and the driving unit on a glass substrate; forming the light-emitting unit on another glass substrate; bonding and connecting the light-emitting unit and the driving unit; using a Laser Lift-off (LLO) process to remove the glass substrate on one side of the substrate; forming pins on the side of the substrate away from the driving unit; thinning the glass substrate on one side of the light-emitting unit (this glass substrate is not shown in the drawings of the embodiment of the present application); and singulating to form individual light-emitting components.

[0101] Step S102, obtain a packaging substrate, and etch the packaging substrate to obtain a packaging structure.

[0102] In the embodiment of the present application, after obtaining the packaging substrate, a dry etching process or a wet etching process can be used to etch the packaging substrate to obtain a packaging structure 104. Among them, the packaging structure 104 includes a connected first part 1041 and a second part 1042. The first part 1041 has a plate-like structure, the second part 1042 has a ring-like structure, and the area surrounded by the second part 1042 is obtained by etching the packaging substrate. That is to say, the first part 1041 of the packaging structure 104 is the part of the packaging substrate that is not etched in the thickness direction, and the second part 1042 of the packaging structure 104 is the remaining part of the periphery of the groove obtained by etching the packaging substrate.

[0103] Step S103: Encapsulate the driving unit and the light-emitting unit using an encapsulation structure.

[0104] In the embodiment of the present application, after encapsulation, the driving unit 102 and the light-emitting unit 103 are located within the area surrounded by the second part 1042. The substrate 101 is located outside the area surrounded by the second part 1042 and on the side of the second part 1042 away from the first part 1041. One side of the first part 1041 close to the second part 1042 is connected to the surface of the light-emitting unit 103 away from the substrate, and one side of the second part 1042 away from the first part 1041 is connected to the target area 101a.

[0105] In summary, the embodiment of the present application provides a method for preparing a light-emitting component. The light-emitting component prepared by this method includes a substrate, a driving unit, a light-emitting unit, and an encapsulation structure. The target area of the substrate surrounds the orthographic projection of the driving unit on the substrate and the orthographic projection of the light-emitting unit on the substrate. The first part of the encapsulation structure is connected to the side of the light-emitting unit away from the substrate, and the second part surrounds the light-emitting unit and the driving unit and is connected to the target area of the substrate. This can enable both the light-emitting unit and the driving unit to be located within the sealed space jointly formed by the substrate and the encapsulation structure, ensuring the sealing effect on the light-emitting unit and the driving unit, avoiding the influence of the external environment on the light-emitting unit and the driving unit, and improving the reliability of the light-emitting component.

[0106] Figure 10 is a schematic structural diagram of a display panel provided by an embodiment of the present application. Refer to Figure 10 , the display panel 00 includes a display backplane 20 and a plurality of light-emitting components 10.

[0107] Refer to Figure 10 , a plurality of light-emitting components 10 are located in the display area 00a of the display panel 00, and the plurality of light-emitting components 10 are arranged in an array. The display backplane 20 is used to provide a driving signal for the driving unit 102 so that the driving unit 102 drives the light-emitting unit 103 to emit light.

[0108] Since the display panel can have substantially the same technical effects as the light-emitting component described in the previous embodiment, for the sake of brevity, the technical effects of the display panel are not described again here.

[0109] The terms used in the embodiment part of the present application are only used to explain the embodiments of the present application and are not intended to limit the present application. Unless otherwise defined, the technical terms or scientific terms used in the embodiment of the present application should have the ordinary meaning understood by those of ordinary skill in the field to which the present application belongs.

[0110] The terms used in the embodiments section of this application are only for explaining the embodiments of this application and are not intended to limit this application. Unless otherwise defined, the technical terms or scientific terms used in the embodiments of this application should have the ordinary meaning understood by those of ordinary skill in the art to which this application belongs. The terms "first", "second", "third" and similar words used in the patent application specification and claims of this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "a" or "an" do not indicate a quantity limitation, but mean that there is at least one. Words such as "comprising" or "including" mean that the elements or objects appearing before "comprising" or "including" cover the elements or objects listed after "comprising" or "including" and their equivalents, and do not exclude other elements or objects. Words such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0111] The above are only optional embodiments of this application and are not intended to limit this application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of this application shall be included in the protection scope of this application.

Claims

1. A light-emitting component, characterized in that, the light-emitting component includes: a substrate, a driving unit, and a light-emitting unit. The driving unit is located on one side of the substrate, the light-emitting unit is located on the side of the driving unit away from the substrate, and the light-emitting unit and the driving unit are electrically connected; the orthographic projection of the driving unit on the substrate and the orthographic projection of the light-emitting unit on the substrate are both located within the substrate, and the substrate has a target area that surrounds the orthographic projection of the driving unit on the substrate and the orthographic projection of the light-emitting unit on the substrate; the light-emitting component further includes: a packaging structure, the packaging structure includes a connected first part and a second part. The first part has a plate-like structure, the first part is located on the side of the light-emitting unit away from the substrate, and the side of the first part away from the second part is connected to the side of the light-emitting unit away from the substrate. The second part has a ring-like structure, the second part surrounds the light-emitting unit and the driving unit, and the side of the second part away from the first part is connected to the target area.

2. The light-emitting component according to claim 1, characterized in that, the light-emitting component further includes: a first adhesive layer and a second adhesive layer; the first adhesive layer is located between the first part and the light-emitting unit, and is used to bond the surface of the first part close to the substrate and the surface of the light-emitting unit away from the substrate; the second adhesive layer is located between the second part and the target area of the substrate, and is used to bond the surface of the second part close to the substrate and the target area.

3. The light-emitting component according to claim 1, characterized in that, the distance between the side of the target orthographic projection of the orthographic projection of the driving unit on the substrate and the orthographic projection of the light-emitting unit on the substrate and the side of the substrate is greater than 15 micrometers; wherein, the target orthographic projection is the orthographic projection with a smaller distance between the side and the side of the substrate among the orthographic projection of the driving unit on the substrate and the orthographic projection of the light-emitting unit on the substrate.

4. The light-emitting component according to claim 1, characterized in that, the distance between the surface of the second part close to the substrate and the surface of the first part close to the substrate ranges from 5 micrometers to 8 micrometers.

5. The light-emitting component according to claim 1, characterized in that, the distance between the boundary of the area surrounded by the ring-like structure of the second part and the boundary of the target unit among the light-emitting unit and the driving unit is greater than 5 micrometers; wherein, the target unit is the unit with a smaller distance between the boundary and the boundary of the area surrounded by the ring-like structure among the light-emitting unit and the driving unit.

6. The light-emitting component according to any one of claims 1 to 5, characterized in that, the first part and the second part are an integral structure; the material of the packaging structure is glass, sapphire or quartz.

7. The light-emitting component according to any one of claims 1 to 5, characterized in that, the light-emitting component further includes: a color conversion layer and a color conversion packaging layer; The color conversion layer is located on the side of the first part close to the substrate, and the color conversion encapsulation layer is located on the side of the color conversion layer away from the first part; or, The color conversion layer is located on the side of the light-emitting unit away from the substrate, and the color conversion encapsulation layer is located on the side of the color conversion layer away from the substrate.

8. The light-emitting component according to any one of claims 1 to 5, characterized in that the light-emitting unit includes: a first electrode, a second electrode, and a light-emitting layer electrically connected to the first electrode and the second electrode respectively; the driving unit includes a third electrode, a fourth electrode, and a driving circuit. The third electrode and the fourth electrode are both located on the side of the driving unit close to the light-emitting unit. The third electrode and the fourth electrode are respectively electrically connected to the driving circuit. The third electrode is electrically connected to the first electrode, and the fourth electrode is electrically connected to the second electrode.

9. A method for manufacturing a light-emitting component, characterized in that obtain a substrate, a driving unit, and a light-emitting unit. The driving unit is located on one side of the substrate, the light-emitting unit is located on the side of the driving unit away from the substrate, and the light-emitting unit and the driving unit are electrically connected; the orthographic projection of the driving unit on the substrate and the orthographic projection of the light-emitting unit on the substrate are both located within the substrate, and the substrate has a target area that surrounds the orthographic projection of the driving unit on the substrate and the orthographic projection of the light-emitting unit on the substrate; obtain a packaging substrate, and etch the packaging substrate to obtain a packaging structure. The packaging structure includes a connected first part and a second part. The first part has a plate-like structure, and the second part has a ring-like structure. The area surrounded by the second part is obtained by etching the packaging substrate; package the driving unit and the light-emitting unit with the packaging structure; wherein, after packaging, the driving unit and the light-emitting unit are located within the area surrounded by the second part, the substrate is located outside the area surrounded by the second part, and on the side of the second part away from the first part. The side of the first part close to the second part is connected to the surface of the light-emitting unit away from the substrate, and the side of the second part away from the first part is connected to the target area.

10. A display panel, characterized in that the display panel includes a display backplane, and a plurality of light-emitting components as described in any one of claims 1 to 8 arranged in an array on one side of the display backplane; wherein, the display backplane is used to provide a driving signal for the driving unit in the light-emitting component, so that the driving unit drives the light-emitting unit to emit light.

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