Method for removing residual etching liquid on glass surface

Abstract

The invention discloses a method for removing residual etching liquid on the surface of glass and a glass etching production line adopting the method for removing the residual etching liquid on the surface of the glass. The method for removing the residual etching liquid on the glass surface is applied to a glass etching production line and comprises the steps that the plane size of a glass substrate entering an etching area is recognized, and the plane size comprises the length and the width of the glass substrate; according to the plane size, the inclination angle and the climbing time of the inclination angle adjusting device are adjusted; and when the glass substrate leaves the etching area and is on the inclination angle adjusting device, residual etching liquid on the glass substrate is filtered out. And the amount of residual etching liquid on the surface of the glass substrate is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of glass etching, and particularly to a method for removing residual etching solution on the glass surface and a glass etching production line adopting the method for removing residual etching solution on the glass surface. Background Art

[0002] In the wet etching process of glass, in order to ensure the surface quality, the surface of the component to be processed is cleaned with an acidic solution before etching to remove surface contaminants such as organic, inorganic or metal oxides, so as to ensure the quality of the subsequent surface processing. This process is called pickling and is a common practice in the surface treatment industry. However, a large amount of residues on the product surface after cleaning with the acidic solution have brought a series of problems to the subsequent processes: ① A large amount of acidic solution is carried away by the product, increasing the consumption of the chemical solution, raising the cost, and bringing greater pressure to the wastewater treatment; ② A large amount of acidic solution is carried to the subsequent clean water rinsing process section, polluting the water quality of the clean water rinsing process section after pickling and reducing the rinsing effect at the same time; ③ Since the water rinsing tank after pickling is a continuous production, the water rinsing section is acidified, and anti-acid materials must be used to manufacture the subsequent equipment, resulting in a great impact on the equipment cost and life.

[0003] How to solve the above technical problems has become an urgent technical problem in the industry. Summary of the Invention

[0004] In order to solve at least the above technical problems, the purpose of the present invention is to provide a method for removing residual etching solution on the glass surface, which is applied to a glass etching production line and reduces the amount of residual etching solution on the glass substrate surface.

[0005] In order to achieve the above purpose, the method for removing residual etching solution on the glass surface provided by the present invention, which is applied to a glass etching production line, includes:

[0006] Identifying the planar size of the glass substrate entering the etching area, where the planar size includes the length and width of the glass substrate;

[0007] Adjusting the tilt angle and climbing time of the tilt angle adjustment device according to the planar size;

[0008] When the glass substrate leaves the etching area and is on the tilt angle adjustment device, filtering the residual etching solution on the glass substrate.

[0009] Further, the step of adjusting the tilt angle and climbing time of the tilt angle adjustment device according to the planar size further includes: adjusting the tilt angle and climbing time of the tilt angle adjustment device according to the following formula:

[0010] Q = κL 2 W·cot(θ)e -ct

[0011] Among them, k and c are constants;

[0012] L is the length of the glass substrate, and W is the width of the glass substrate;

[0013] θ is the inclination angle of the glass substrate;

[0014] t is the residence time of the glass substrate at the inclination angle θ;

[0015] Q is the amount of residual etching solution on the surface of the glass substrate.

[0016] Furthermore, the inclination angle value is greater than 0°, and the climbing inclination angle value is not greater than 10°.

[0017] Furthermore, the inclination angle value is 3° to 7°.

[0018] Furthermore, the climbing time of the glass substrate on the inclination angle adjusting device is greater than 0 seconds and not greater than 60 seconds.

[0019] To achieve the above object, the present application also provides a glass etching production line, which adopts the above method for removing residual etching solution on the glass surface, including: an etching area, a cleaning area, and an inclination angle adjusting device arranged between the etching area and the cleaning area. The inclination angle adjusting device includes: a positioning wheel and a lifting wheel;

[0020] A conveyor belt is sleeved on the positioning wheel and the lifting wheel;

[0021] One end provided with the positioning wheel is close to the etching area of the glass substrate;

[0022] When the lifting wheel moves up and down, the inclination angle value of the glass substrate on the conveyor belt changes accordingly.

[0023] Furthermore,

[0024] One end provided with the lifting wheel is close to the cleaning area;

[0025] A guiding wheel is also arranged between the lifting wheel and the cleaning area, and the glass substrate enters the cleaning area through the guiding wheel.

[0026] Furthermore, a retracting wheel is also arranged between the lifting wheel and the guiding wheel;

[0027] The conveyor belt is sleeved on the retracting wheel.

[0028] Furthermore, when the lifting wheel rises relative to the positioning wheel, the retracting wheel moves towards the direction close to the positioning wheel;

[0029] When the lifting wheel descends relative to the positioning wheel, the retracting wheel moves towards the direction away from the positioning wheel.

[0030] Further, a cleaning area driving wheel is provided in the cleaning area;

[0031] The cleaning area further includes cleaning nozzles and a cleaning identification module;

[0032] Cleaning nozzles are provided on both the upper side and the lower side of the cleaning area driving wheel;

[0033] When the cleaning identification module identifies that there is a glass substrate on the cleaning area driving wheel, the cleaning nozzles clean the glass substrate on the cleaning area driving wheel.

[0034] The method for removing residual etching solution on the glass surface according to the embodiment of the present application is applied to a glass etching production line, and includes: identifying the planar size of the glass substrate entering the etching area, where the planar size includes the length and width of the glass substrate; adjusting the tilt angle and the climbing time of the tilt angle adjusting device according to the planar size; when the glass substrate leaves the etching area and is on the tilt angle adjusting device, filtering the residual etching solution on the glass substrate. By judging the planar size of the glass substrate and adjusting the tilt angle and the climbing time according to the size of the planar size, the purpose of reducing the residual etching solution on the glass substrate surface is achieved while taking into account the production efficiency; the amount of etching solution remaining on the glass substrate surface entering the cleaning area is reduced, the amount of pure water used in the cleaning area is reduced, resources are saved and environmental pollution is also reduced; the amount of etching solution used is reduced, and production costs are saved; the amount of etching solution entering the cleaning area is reduced, the cleaning efficiency is improved, and the process flow is shortened; the amount of etching solution entering the cleaning area is reduced, and the corrosion of the residual etching solution on subsequent processes is reduced. Description of the Drawings

[0035] The drawings are used to provide a further understanding of the present application, and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation to the present application. In the drawings:

[0036] Figure 1 is a flowchart of the method for removing residual etching solution on the glass surface according to the embodiment of the present application;

[0037] Figure 2 is a schematic structural diagram of the tilt angle adjusting device according to the embodiment of the present application;

[0038] Figure 3 is a schematic structural diagram of the tilt angle adjusting device according to another embodiment of the present application.

[0039] Description of the Reference Numerals:

[0040] 201 - positioning wheel; 202 - lifting wheel; 203 - glass substrate; 204 - guiding wheel; 205 - cleaning area driving wheel; 206 - retracting wheel. Detailed Embodiments

[0041] Embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although some embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Instead, these embodiments are provided to more thoroughly and completely understand the present application. It should be understood that the drawings and embodiments of the present application are only for exemplary purposes and are not used to limit the protection scope of the present application.

[0042] It should be understood that the various steps recorded in the method embodiments of the present application can be executed in different orders and / or executed in parallel. In addition, the method embodiments may include additional steps and / or omit the steps shown. The scope of the present application is not limited in this regard.

[0043] As used herein, the term "including" and its variants are open-ended, that is, "including but not limited to". The term "based on" is "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". The relevant definitions of other terms will be given in the following description.

[0044] It should be noted that the modifications of "one" and "multiple" mentioned in the present application are illustrative rather than restrictive. Those skilled in the art should understand that unless otherwise clearly specified in the context, it should be understood as "one or more". "Multiple" should be understood as two or more.

[0045] Embodiments of the present application will be described in detail below with reference to the drawings.

[0046] An embodiment of the present application provides a method for removing residual etching solution on the glass surface, which is applied to a glass etching production line and includes:

[0047] Identifying the planar size of the glass substrate entering the etching area, where the planar size includes the length and width of the glass substrate;

[0048] Adjusting the tilt angle and climbing time of the tilt angle adjustment device according to the planar size;

[0049] When the glass substrate leaves the etching area and is on the tilt angle adjustment device, filtering the residual etching solution on the glass substrate.

[0050] Embodiment 1

[0051] Figure 1 is a schematic flowchart of the method for removing residual etching solution on the glass surface according to the embodiment of the present application, Figure 2 is a schematic structural diagram of the tilt angle adjustment device according to the embodiment of the present application, Figure 3Schematic structural diagram of the tilt angle adjustment device according to another embodiment of the present application. The following will be combined with Figures 1-3 to describe in detail the method for removing the residual etching solution on the glass surface in the embodiments of the present application.

[0052] In an exemplary embodiment, the method for removing the residual etching solution on the glass surface in the embodiments of the present application is used to remove the residual etching solution on the surface of the glass substrate 203 after being etched by the etching solution, and reduce the residual etching solution carried on the surface of the glass substrate 203 entering the cleaning process.

[0053] First, in step 101, identify the planar dimensions of the glass substrate entering the etching area, where the planar dimensions include the length and width of the glass substrate.

[0054] In an exemplary embodiment, identify the planar dimensions of the glass substrate 203 entering the etching area, for example, obtain the length and width dimension data of the glass substrate 203 entering the etching area, that is, entering the pickling tank for pickling.

[0055] In step 102, according to the planar dimensions, adjust the tilt angle and climbing time of the tilt angle adjustment device.

[0056] In an exemplary embodiment, according to the obtained planar dimensions of the glass substrate 203, adjust the tilt angle and climbing time of the tilt angle adjustment device.

[0057] In an exemplary embodiment, the tilt angle adjustment device in the embodiments of the present application is arranged between the etching area and the cleaning area of the glass substrate 203. It can be understood that the tilt angle adjustment device in the embodiments of the present application is a device for transporting the pickled glass substrate 203 to the cleaning area.

[0058] In an exemplary embodiment, the tilt angle adjustment device in the embodiments of the present application includes: positioning wheels 201, lifting wheels 202, and a conveyor belt.

[0059] In an exemplary embodiment, the conveyor belt is sleeved on the positioning wheels 201 and the lifting wheels 202, and the conveyor belt is tensioned on the positioning wheels 201 and the lifting wheels 202.

[0060] In an exemplary embodiment, according to needs, both the positioning wheels 201 and the lifting wheels 202 can be driving wheels.

[0061] In an exemplary embodiment, one end provided with the positioning wheels 201 is close to the etching area of the glass substrate 203, that is, the positioning wheels 201 are close to the etching area, and the lifting wheels 202 are closer to the cleaning area relative to the positioning wheels 201.

[0062] In an exemplary embodiment, the lifting wheel 202 can move up and down in the vertical direction. The lifting wheel 202 is used to adjust the tilt angle of the glass substrate 203 on the conveyor belt. For example, when the lifting wheel 202 rises, the tilt angle of the glass substrate 203 located on the conveyor belt increases; when the lifting wheel 202 descends, the tilt angle of the glass substrate 203 located on the conveyor belt decreases.

[0063] In an exemplary embodiment, a guiding wheel 204 is further provided between the lifting wheel 202 and the cleaning area. The guiding wheel 204 is used to guide the glass substrate 203 on the conveyor belt into the cleaning area.

[0064] In an exemplary embodiment, when the tilt angle adjusting device is as Figure 2 shown in the structure, the lifting wheel 202 rises and the position of the positioning wheel 201 remains unchanged. At this time, the tilt angle of the glass substrate 203 on the conveyor belt is increased, which can accelerate the flow rate of the residual etching solution on the glass substrate 203 towards the positioning wheel 201, and thus achieve the purpose of reducing the amount of the residual etching solution on the glass substrate 203 entering the cleaning area.

[0065] In an exemplary embodiment, Figure 2 the arrow direction in is the conveyor belt transmission direction.

[0066] In an exemplary embodiment, the etching solution flowing down from the glass substrate 203 drips in the direction of the positioning wheel 201 of the conveyor belt. An etching solution recovery unit can be provided below the positioning wheel 201 as needed to recover the etching solution dripping at the lower end of the conveyor belt, that is, at the positioning wheel 201 end.

[0067] In an exemplary embodiment, when the tilt angle adjusting device of the embodiment of the present application is as Figure 3 shown in the structure, it further includes a retracting wheel 206.

[0068] In an exemplary embodiment, the conveyor belt is sleeved on the retracting wheel 206. According to needs, the tensioned state of the conveyor belt is a rhombus-like shape, that is, the conveyor belt further includes a descending stage from the lifting wheel 202 to the retracting wheel 206.

[0069] In an exemplary embodiment, Figure 3 when the lifting wheel 202 in rises, the retracting wheel 206 moves towards the direction close to the positioning wheel 201; when the lifting wheel 202 descends, the retracting wheel 206 moves away from the direction of the positioning wheel 201; that is, by the cooperation of the lifting wheel 202 and the retracting wheel 206, while adjusting the tilt angle between the positioning wheel 201 and the lifting wheel 202, the tensioned state of the conveyor belt is also ensured.

[0070] In an exemplary embodiment, the movement of the lifting wheel 202 is synchronized with the movement of the retracting wheel 206.

[0071] In an exemplary embodiment, if necessary, the movements of the lifting wheel 202 and the retracting wheel 206 can both be realized by a cylinder or a hydraulic cylinder.

[0072] Step 103: When the glass substrate leaves the etching area and is on the tilt angle adjustment device, remove the residual etching solution on the glass substrate.

[0073] In an exemplary embodiment, after the tilt angle adjustment device matches the tilt angle and the climbing time according to the planar size of the glass substrate, when the glass substrate 203 leaves the etching area and enters the tilt angle adjustment device, due to the existence of the tilt angle, the residual etching solution on the glass substrate 203 can be removed more quickly.

[0074] In an exemplary embodiment, the climbing time can be understood as the transmission speed of the matching conveyor belt, or the total duration from when a glass substrate 203 starts to enter the tilt angle adjustment device until it is completely on the tilt angle adjustment device. Of course, according to needs, this total duration can also include the pause time when the conveyor belt pauses while the glass substrate 203 is completely on the tilt angle adjustment device.

[0075] In an exemplary embodiment, a cleaning area drive wheel 205 is provided in the cleaning area. The cleaning area drive wheel 205 is arranged on the side of the guide wheel 204 away from the lifting wheel 202; that is, the glass substrate 203 on the conveyor belt enters the cleaning area drive wheel 205 through the guide wheel 204.

[0076] In an exemplary embodiment, the cleaning area further includes a cleaning spray head and a cleaning recognition module.

[0077] In an exemplary embodiment, there are multiple cleaning spray heads, and the multiple cleaning spray heads are evenly distributed on the upper and lower sides of the cleaning area drive wheel 205.

[0078] In an exemplary embodiment, the multiple cleaning spray heads are arranged alternately or symmetrically on the upper and lower sides of the cleaning area drive wheel 205.

[0079] In an exemplary embodiment, the cleaning recognition module can be arranged at the side rear of the guide wheel 204 as needed, that is, the cleaning recognition module is arranged on the side of the guide wheel 204 facing away from the conveyor belt.

[0080] In an exemplary embodiment, when the cleaning recognition module recognizes that there is a glass substrate 203 on the cleaning area drive wheel 205, the cleaning spray heads perform a cleaning action on the glass substrate 203 on the cleaning area drive wheel 205.

[0081] In an exemplary embodiment, as needed, the cleaning area further includes a cleaning pool, which is arranged at one end of the driving wheel 205 in the cleaning area away from the conveyor belt; it can be understood that when a cleaning pool needs to be set, the glass substrate 203 that has been cleaned by the driving wheel 205 in the cleaning area enters the cleaning pool again. At this time, the glass substrate 203 in the cleaning pool has very little oil content of the etching solution or basically no residue of the etching solution on its surface because it has been cleaned by the cleaning nozzles. The cleaning pool is set only to ensure more thorough removal of the etching solution. Moreover, since there is very little etching solution in the cleaning pool, it can be used for a long time, avoiding waste of resources.

[0082] In an exemplary embodiment, when the glass substrate 203 is on the conveyor belt of the tilt angle adjustment device, the tilt angle value of the tilt angle adjustment device is the tilt angle value of the glass substrate 203.

[0083] In an exemplary embodiment, the calculation formula for the amount of residual etching solution on the surface of the glass substrate 203, the tilt angle value of the glass substrate 203, and the climbing time is:

[0084] Q = κL 2 W·cot(θ)e -ct

[0085] where k and c are constants;

[0086] L is the length of the glass substrate 203, and W is the width of the glass substrate 203;

[0087] θ is the tilt angle of the glass substrate 203, and the range of θ is 0 - 20°;

[0088] t is the residence time of the glass substrate 203 at the tilt angle of θ;

[0089] Q is the amount of residual etching solution on the surface of the glass substrate 203.

[0090] In an exemplary embodiment, the tilt angle value not exceeding 20° is considered for the safety of the glass substrate during transmission on the conveyor belt, to avoid the glass substrate slipping off the conveyor belt and colliding with the glass substrate below, resulting in breakage.

[0091] In an exemplary embodiment, preferably, the tilt angle value is: 0° < θ ≤ 10°.

[0092] In an exemplary embodiment, more preferably, the tilt angle value is: 3° ≤ θ ≤ 7°.

[0093] In an exemplary embodiment, to improve work efficiency, the climbing time of the glass substrate 203 on the tilt angle adjustment device is greater than 0 seconds and not greater than 60 seconds, that is, it is better to control the climbing time within one minute.

[0094] In an exemplary embodiment, the climbing time can be achieved by adjusting the conveying speed of the conveyor belt.

[0095] In an exemplary embodiment, according to requirements, blocking plates are provided on both sides of the conveyor belt to prevent the glass substrate 203 from falling off from both sides of the conveyor belt.

[0096] In an exemplary embodiment, in order to further illustrate the specific implementation of the method for removing residual etching solution on the glass surface in the embodiments of the present application, Table 1 shows the specific data of the method for removing residual etching solution on the glass surface in the embodiments of the present application, taking the climb from 1° to 7° as an example;

[0097] Table 1

[0098]

[0099]

[0100] In an exemplary embodiment, as shown in Table 1, when the width dimension of the glass substrate 203 is constant, the larger the length dimension of the glass substrate 203, the greater the amount of etching solution attached to its surface; as the inclination angle increases and the climbing time increases, the residual amount of etching solution on the surface of the glass substrate 203 decreases.

[0101] In an exemplary embodiment, as shown in Table 1, in order to balance production efficiency, when the climbing time does not exceed 1 minute, as shown in Table 1, when the climbing time is 10 seconds - 30 seconds, the amount of residual etching solution on the glass substrate surface has significantly decreased. In order to improve production efficiency, the climbing time interval can be considered to be selected within 10 seconds - 30 seconds; of course, appropriately extending the climbing time also has a better effect, but the ratio of the amount of etching solution removed from the glass substrate surface to the required time efficiency is not as good as selecting the interval of 10 seconds - 30 seconds.

[0102] Although the disclosed embodiments of the present invention are as above, the content is only an embodiment adopted for the convenience of understanding the present invention and is not used to limit the present invention. Any person skilled in the art within the scope of the present invention can make any modifications and changes in the form and details of the implementation without departing from the spirit and scope disclosed by the present invention. However, the scope of patent protection of the present invention shall still be subject to the scope defined by the appended claims.

Claims

1. A method for removing residual etching liquid on a glass surface, characterized in that: Applied to glass etching production lines, including: Identifying the planar dimensions of the glass substrate entering the etching area, wherein the planar dimensions include the length and width of the glass substrate; According to the plane size, adjusting the tilt angle and climbing time of the tilt angle adjustment device; When the glass substrate leaves the etching area and is on the tilt angle adjustment device, the etching liquid remaining on the glass substrate is filtered out.

2. The method for removing residual etching solution from the glass surface according to claim 1, characterized in that: The step of adjusting the tilt angle and climbing time of the tilt angle adjusting device according to the plane size further includes: adjusting the tilt angle and climbing time of the tilt angle adjusting device according to the following formula: Q=kL 2 W·cot(θ)e -ct Wherein, said k and said c are constants; The L is the length of the glass substrate, and the W is the width of the glass substrate; The θ is the tilt angle of the glass substrate; The t is the residence time of the glass substrate at the tilt angle θ; The Q is the amount of residual etching liquid on the surface of the glass substrate.

3. The method for removing residual etching solution from the glass surface according to claim 1, characterized in that: The tilt angle value is greater than 0°, and the tilt angle value is not greater than 10°.

4. The method for removing residual etching solution from the glass surface according to claim 3, characterized in that: The inclination angle value is 3° to 7°.

5. The method for removing residual etching solution from the glass surface according to claim 1, characterized in that: The climbing time of the glass substrate on the tilt angle adjustment device is greater than 0 seconds and not greater than 60 seconds.

6. A glass etching production line for realizing the method for removing residual etching liquid from the glass surface according to any one of claims 1 to 5, It includes an etching area, a cleaning area, and an inclination angle adjustment device arranged between the etching area and the cleaning area, wherein the inclination angle adjustment device includes: a positioning wheel and a lifting wheel; A conveyor belt is sleeved on the positioning wheel and the lifting wheel; One end of the positioning wheel is provided close to the etching area of ​​the glass substrate; When the lifting wheel is lifted or lowered, the inclination angle value of the glass substrate on the conveyor belt changes accordingly.

7. The glass etching production line according to claim 6, characterized in that: One end of the lifting wheel is close to the cleaning area; A guide wheel is further provided between the lifting wheel and the cleaning area, and the glass substrate enters the cleaning area through the guide wheel.

8. The glass etching production line according to claim 7, characterized in that: A retracting wheel is also provided between the lifting wheel and the guide wheel; The conveyor belt is sleeved on the retracting wheel.

9. The glass etching production line according to claim 8, characterized in that: When the lifting wheel rises relative to the positioning wheel, the retracting wheel moves toward the direction close to the positioning wheel; When the lifting wheel descends relative to the positioning wheel, the retracting wheel moves in a direction away from the positioning wheel.

10. The glass etching production line according to claim 9, characterized in that: A cleaning zone transmission wheel is provided in the cleaning zone; The cleaning area also includes a cleaning nozzle and a cleaning identification module; The cleaning nozzles are provided on the upper and lower sides of the transmission wheel in the cleaning area; When the cleaning identification module identifies that the glass substrate is on the driving wheel of the cleaning area, the cleaning nozzle cleans the glass substrate on the driving wheel of the cleaning area.

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