Tin dispensing device and tin dispensing method

Abstract

The invention provides a tin dispensing device and a tin dispensing method.The tin dispensing device comprises a needle cylinder, a needle head and a valve element assembly, the needle cylinder, the valve element assembly and the needle head are sequentially connected to form a tin dispensing runner, and tin paste provided by the needle cylinder is conveyed to the needle head along the tin dispensing runner so that the needle head can conduct tin dispensing; the valve element assembly comprises a hose, plugs and a sleeve, the hose is installed in the sleeve, the plugs are installed at the two ends of the hose and the two ends of the sleeve respectively, an inner cavity is formed in the hose, solder paste is stored in the inner cavity, and an outer cavity is formed in the sleeve. When the pressure intensity of the outer cavity is larger than the pressure intensity of the inner cavity, the inner cavity is extruded to be closed so that the tin dispensing runner can be closed, and when the pressure intensity of the inner cavity is larger than the pressure intensity of the outer cavity, the inner cavity expands so that the tin dispensing runner can be opened.

Description

Technical Field

[0001] This application relates to the manufacturing of camera modules, and more specifically to a solder dotting device and a solder dotting method. Background Art

[0002] With the increasing requirements for the precision of camera modules, the solder dotting accuracy in the manufacturing process of camera modules also needs to be greatly improved. The solder dotting diameter of precision components in camera modules is getting smaller and smaller, the number of solder dotting positions is increasing, and the solder dotting space is limited. Therefore, high solder dotting accuracy, high speed, and stable solder dotting are required. Current solder dotting devices are difficult to meet the requirements.

[0003] The technology of solder paste dotting has been applied in the industry for many years. The main types include: squeegee printing, piston moving solder dotting, piezoelectric valve moving solder dotting, screw valve moving solder dotting, etc. The squeegee printing solution utilizes the thixotropy and viscosity characteristics of the solder paste. By moving the squeegee, pressure is generated on the solder paste to inject the solder paste into the mesh holes or leakage holes. This solution requires the production of a stencil, and the size of the mesh holes or leakage holes of the stencil is relatively large, making it difficult to meet the requirements of high-precision solder dotting. The piston moving solder dotting solution is based on the relationship between the piston area and the piston moving stroke to achieve preset and precise volume distribution. The amount of glue dropped is determined by the distance of the piston's downward punch. This solution is prone to solder paste stratification, uneven solder dotting size, and easy blockage of the outlet channel. The piezoelectric valve solder dotting solution uses a piezoelectric stack as the driving source. After displacement amplification, the driving pin is driven to run, causing the driving pin to impact the nozzle to eject the glue liquid. This solution is prone to deformation of the solder powder due to impact, blockage of the outlet channel, and poor solder discharge. The screw valve moving solder dotting solution utilizes the principle of single-screw positive displacement conveying. The rotor and stator form a self-sealing structure, and the solder paste conveying function is achieved through the directional rotation of the rotor. This solution is prone to new powder entering the screw gap during the conveying process and being extruded and deformed, blocking the outlet channel.

[0004] In summary, the current conventional solder dotting process solutions all have defects, mainly manifested in needle clogging caused by solder paste stratification, solder powder deformation, etc., resulting in poor solder discharge, and prone to uneven size and unstable solder dotting.

[0005] Among them, in terms of the liquid form, the solder paste is a suspension, and the volume ratio of the alloy component is about 50%. These alloys of different sizes will slowly sink under the influence of gravity during use. As time increases, the flux with a smaller density will be in the upper layer, and the alloy with a larger density will be in the lower layer, resulting in uneven solder paste. Therefore, the state of the solder paste needs to be changed.

[0006] The main reason for the deformation of the solder powder is that the current valve body design will cause the solder powder to come into hard contact with the valve body mechanism, resulting in the solder powder being impacted or extruded and deformed, changing the size of the solder powder.

[0007] Therefore, a solution is needed to solve the above problems. Summary of the Invention

[0008] One advantage of the present application is to provide a solder - dotting device and a solder - dotting method, which avoid the hard contact between the solder - dotting device and the solder paste, so as to improve the accuracy and stability of solder - dotting.

[0009] One advantage of the present application is to provide a solder - dotting device and a solder - dotting method. The solder - dotting device adopts an air - bag valve design, and the hose for accommodating the solder paste is designed to be made of elastic material, avoiding the hard contact between the solder paste and the mechanism.

[0010] One advantage of the present application is to provide a solder - dotting device and a solder - dotting method. The solder paste is extruded by the hose body, avoiding the problem of solder ball deformation caused by hard contact, and further avoiding the problem of the solder ball deformation - caused blockage of the needle head due to deformation.

[0011] One advantage of the present application is to provide a solder - dotting device and a solder - dotting method. An outer cavity is arranged around the inner cavity for accommodating the solder paste, and the pressure difference between the outer cavity and the inner cavity is adjusted to control the deformation direction of the hose body forming the inner cavity, realizing the opening and closing of the solder - dotting flow channel.

[0012] One advantage of the present application is to provide a solder - dotting device and a solder - dotting method. When the pressure of the outer cavity is greater than that of the inner cavity, the inner cavity is squeezed to be closed, realizing the closing of the solder - dotting flow channel, blocking the flow of the solder paste to the needle head, and without the need to suck the solder paste back into the syringe, with simple operation.

[0013] One advantage of the present application is to provide a solder - dotting device and a solder - dotting method. When the solder paste needs to flow, the syringe is opened to transport the solder paste to the inner cavity, and at the same time, the pressure of the inner cavity is increased, causing the hose body to expand, the solder - dotting flow channel is opened, and the solder paste is allowed to flow to the needle head for solder - dotting.

[0014] One advantage of the present application is to provide a solder - dotting device and a solder - dotting method. By controlling the pressure difference between the outer cavity and the inner cavity, the opening degree of the solder - dotting flow channel can be controlled, and further the amount of solder - dotting can be controlled.

[0015] One advantage of the present application is to provide a solder - dotting device and a solder - dotting method. Before the solder - dotting operation, the pressure of the outer cavity is pre - controlled to be greater than that of the inner cavity, so that the hose body is stressed to extrude the internal solder paste, realizing the stirring of the solder paste, making the solder paste evenly stirred and avoiding stratification.

[0016] One advantage of the present application is to provide a solder - dotting device and a solder - dotting method. The solder paste is evenly stirred and has high fluidity, avoiding blocking the needle head and making the solder flow smoothly from the needle head.

[0017] One advantage of the present application is to provide a solder - dotting device and a solder - dotting method. After the solder paste is stirred, its fluidity is improved, so that even when the solder - dotting flow channel is opened to a very small degree, the solder paste can still flow through, realizing micro - amount solder - dotting.

[0018] According to one aspect of the present application, the present application provides a tin - dotting device, including:

[0019] A syringe, a needle, and a valve core assembly. The syringe, the valve core assembly, and the needle are connected in sequence to form a tin - dotting flow channel. The solder paste provided by the syringe is transported along the tin - dotting flow channel to the needle for tin - dotting by the needle;

[0020] The valve core assembly includes:

[0021] A hose, a plug, and a sleeve. The hose is installed inside the sleeve. The two ends of the hose and the sleeve are respectively installed with the plug, forming an inner cavity inside the hose to store the solder paste, and forming an outer cavity inside the sleeve; wherein,

[0022] When the pressure in the outer cavity is greater than the pressure in the inner cavity, the inner cavity is squeezed to be closed, so as to close the tin - dotting flow channel. When the pressure in the inner cavity is greater than the pressure in the outer cavity, the inner cavity expands, so as to open the tin - dotting flow channel.

[0023] According to an example of the present application, the plug has an integrally formed second part and a first part. The second part is located inside the inner cavity, and the first part is located outside the hose and inside the sleeve.

[0024] According to an example of the present application, the first part is provided with a groove, and an inner sealing ring is assembled in the groove to seal the gap between the tube wall of the sleeve and the first part.

[0025] According to an example of the present application, the tube wall of the sleeve and the first part are correspondingly provided with an outer mounting hole and an inner mounting hole, and further includes a pin. The outer mounting hole and the inner mounting hole are aligned, and the pin is inserted, so that the plug is fixed inside the sleeve.

[0026] According to an example of the present application, the hose is sleeved with a tightening member. The tightening member is located on the outer periphery of the second part and the corresponding hose to tighten the second part and the hose.

[0027] According to an example of the present application, the sleeve is provided with an air port. The outer cavity is communicated with the outside through the air port, and gas flows into and out of the outer cavity through the air port to change the pressure of the outer cavity.

[0028] According to an example of the present application, the syringe is communicated with the inner cavity of the hose to transport gas to the inner cavity to change the pressure of the inner cavity. Among them, the hose is made of an elastic material.

[0029] According to an example of the present application, it further includes a connecting component. One end of the connecting component is connected to the valve core component and the syringe, and the other end is connected to the valve core component and the needle. Wherein, the connecting component is provided with a ventilation port, and the ventilation port is communicated with the air port, and external gas flows in and out of the outer cavity through the ventilation port and the air port.

[0030] According to an example of the present application, the connecting component has an inlet channel and an outlet channel. The valve core component is installed inside the connecting component, between the inlet channel and the outlet channel. The syringe outlet of the syringe, the inlet channel and the inlet channel of the valve core component are sequentially communicated to form a feeding channel. The outlet channel of the valve core component, the outlet channel and the needle outlet of the needle are sequentially communicated to form a discharging channel. The inner cavity communicates with the feeding channel and the discharging channel to form the solder dispensing channel.

[0031] According to an example of the present application, the connecting component includes a first connecting piece and a second connecting piece. A part of the valve core component is installed inside the first connecting piece, and another part is installed inside the second connecting piece. One end of the first connecting piece is installed to the syringe, and the other end of the first connecting piece is connected to one end of the second connecting piece. The other end of the second connecting piece is installed with the needle.

[0032] According to an example of the present application, it further includes an installation mechanism. The installation mechanism has an air outlet, and the air outlet is communicated with the ventilation port.

[0033] According to an example of the present application, the installation mechanism includes a fixing component and an air conveying component. The fixing component fixes the connecting component and the air conveying component, so that the ventilation port and the air outlet are communicated.

[0034] According to another aspect of the present application, the present application also provides a solder dispensing method, including the following steps:

[0035] Adjust the pressure of the outer cavity of the valve core component to be greater than the pressure of the inner cavity to stir the solder paste in the inner cavity;

[0036] Start the syringe to convey the solder paste to the inner cavity, increase the pressure of the inner cavity, so that the solder dispensing channel is opened, and promote the solder paste to flow into the needle and be conveyed to the working object; and

[0037] Adjust the pressure of the outer cavity to be greater than the pressure of the inner cavity until the solder dispensing channel is closed to block the flow of the solder paste and end the solder dispensing.

[0038] According to an example of the present application, it further includes the steps:

[0039] Adjust the pressure difference between the outer cavity and the inner cavity according to the required amount of soldering tin to control the opening degree of the soldering tin flow channel, allowing a certain amount of solder paste to flow to the needle tip. Description of the Drawings

[0040] Figure 1A is a schematic diagram of the operating mechanism of a soldering tin device according to some examples of the present application.

[0041] Figure 1B is an exploded schematic diagram of the operating mechanism of a soldering tin device according to some examples of the present application.

[0042] Figure 2 is a schematic diagram of the valve core of the operating mechanism of a soldering tin device according to some examples of the present application.

[0043] Figure 3 is an exploded schematic diagram of the valve core of a soldering tin device according to some examples of the present application.

[0044] Figure 4 is a cross-sectional schematic diagram of the valve core of a soldering tin device according to some examples of the present application.

[0045] Figure 5 is a cross-sectional schematic diagram of the operating mechanism of a soldering tin device according to some examples of the present application.

[0046] Figure 6A is a schematic diagram of the installation mechanism of a soldering tin device according to some examples of the present application.

[0047] Figure 6B is a cross-sectional schematic diagram of the installation mechanism of a soldering tin device according to some examples of the present application.

[0048] Figure 7 is a schematic diagram of a soldering tin device according to some examples of the present application.

[0049] Figure 8 is a schematic diagram of the soldering tin operation of a soldering tin device according to some examples of the present application. Detailed Description of the Invention

[0050] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and other obvious variations can be envisioned by those skilled in the art. The basic principles defined in the following description can be applied to other embodiments, variations, improvements, equivalent schemes, and other technical schemes without departing from the spirit and scope of the present invention.

[0051] Those skilled in the art should understand that in the disclosure of the present invention, the orientation or positional relationship indicated by the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limiting the present invention.

[0052] It can be understood that the term "one" should be understood as "at least one" or "one or more". That is, in one embodiment, the number of an element can be one, while in other embodiments, the number of the element can be multiple. The term "one" should not be construed as limiting the quantity.

[0053] Referring to Figures 1A to 8 the schematic diagram, the present application provides a solder dotting device for performing solder dotting operations during the manufacturing process of a camera module. The solder dotting device conveys solder paste to the object to be operated on and performs solder dotting at the corresponding position of the object to be operated on. Further, the solder dotting device of the present application is applied to the soldering operation of the SMT process.

[0054] As Figure 1A and Figure 1B shown, the solder dotting device includes an operating mechanism 10, and the operating mechanism 10 conveys solder paste to the object to be operated on and performs solder dotting.

[0055] The operating mechanism 10 includes a syringe 11 and a needle 12. The solder paste enters the operating mechanism 10 through the syringe 11, and the needle 12 conveys the solder paste to the object to be operated on. The operating mechanism 10 further includes a valve core assembly 13, and the valve core assembly 13 controls the conveyance of the solder paste. The syringe 11, the valve core assembly 13, and the needle 12 are connected in sequence to form a solder dotting flow channel 100. The solder dotting flow channel 100 is opened to allow the solder paste in the syringe 11 to flow towards the needle 12, and the solder dotting flow channel 100 is closed to block the flow of the solder paste towards the needle 12.

[0056] The operating mechanism 10 further includes a connecting component, and the connecting component connects the valve core assembly 13 to the syringe 11 and the needle 12 to realize the assembly of the operating mechanism 10. Among them, the valve core assembly 13 has an inlet 1301 and an outlet 1302. The connecting component connects the inlet 1301 and the syringe 11 to form a feeding channel 101, and connects the outlet 1302 and the needle 12 to form a discharging channel 102.

[0057] Referring to Figures 2 to 4As shown in the figure, the valve core assembly 13 includes a hose 131 and a plug 132. The hose 131 is made of an elastic material and can undergo elastic deformation. The hose 131 is tubular, and plugs 132 are installed at both ends respectively. The plug 132 has a material conveying channel 1320, and the hose 131 has an inner cavity 1310. The two ends of the inner cavity 1310 are respectively communicated with the material conveying channel 1320 of the plug 132. Among them, the elastic material is preferably a rubber material.

[0058] The plug 132 has an integrally formed first part 1321 and a second part 1322. The first part 1321 is located outside the hose 131, and the second part 1322 is installed inside the hose 131 to block the inner cavity 1310.

[0059] The valve core assembly 13 further includes a sleeve 133. The sleeve 133 is sleeved outside the hose 131 and the plug 132. The plug 132 blocks the space between the sleeve 133 and the hose 131, so that the hose 131 is fixed inside the sleeve 133. The sleeve 133 has a tube wall 1331, and an outer cavity 1330 of the sleeve 133 is defined inside the tube wall 1331. The outer cavity 1330 surrounds the inner cavity 1310.

[0060] The plugs 132 at both ends seal the outer cavity 1330. Among them, the first part 1321 is installed inside the tube wall 1331 of the sleeve 133 to block the space between the hose 131 and the sleeve 133. An inner sealing ring 1323 is sleeved on the outer periphery of the first part 1321. The inner sealing ring 1323 is located between the first part 1321 and the tube wall 1331 of the sleeve 133 to seal the gap between the sleeve 133 and the peripheral wall of the first part 133, so that the outer cavity 1330 is sealed to prevent air pressure leakage.

[0061] Furthermore, the first part 1321 is provided with a groove 13210, and the inner sealing ring 1323 is located in the groove 13210 and between the first part 1321 and the tube wall 1331.

[0062] Furthermore, the sleeve 133 is made of a metal material and has a high yield strength to avoid deformation.

[0063] The inner cavity 1310 of the hose 131 is located inside the outer cavity 1330. Since the hose 131 is made of an elastic material and can undergo elastic deformation, the difference in pressure between the inner cavity 1310 and the outer cavity 1330 will cause deformation of the hose body 1311 of the hose 131. When the pressure in the outer cavity 1330 is greater than the pressure in the inner cavity 1310, the hose body 1311 is squeezed by the external gas. When the pressure in the outer cavity 1330 is less than the pressure in the inner cavity 1310, the hose body 1311 expands.

[0064] Furthermore, a fastener 135 is sleeved on the outer periphery of the hose body 1311 of the hose 131. The fastener 1135 is sleeved on the hose body 1311 on the outer side of the second part 1321 to hoop the hose body 1311 and the second part 1321, preventing the hose body 1311 from detaching from the plug 132 when the hose body 1311 expands, resulting in air pressure leakage, and also preventing the solder paste from flowing out of the inner cavity 1310.

[0065] Plugs 132 are respectively arranged at both ends of the hose 131 and both ends of the sleeve 133. The material conveying channels 1320 of the plugs 132 installed at both ends of the hose 131 are respectively communicated with the inner cavity 1310, and an inlet 1301 and an outlet 1302 are formed at both ends of the valve core assembly 13. The inlet 1301 and the outlet 1302 are respectively communicated with the material conveying channels 1320 at both ends, and further communicated with the inner cavity 1310.

[0066] The valve core assembly 13 is arranged inside the connecting assembly, and the syringe 11 and the needle 12 are installed at both ends of the connecting assembly. The connecting assembly has an inlet channel and an outlet channel. The inlet channel communicates the inlet 1301 and the syringe 11, and the outlet channel communicates the outlet 1302 and the needle 12, so that the syringe 11, the valve core assembly 13 and the needle 12 are sequentially communicated to form a dot tin flow channel 100.

[0067] Outer sealing rings 134 are correspondingly arranged on the outer peripheries of the inlet 1301 and the outlet 1302 to respectively seal the connection between the valve core assembly 13 and the inlet channel and the connection between the valve core assembly 13 and the outlet channel.

[0068] Furthermore, the outer sealing ring 134 is arranged at the end of the first part 1321 to seal the gap between the end of the first part 1321 and the end of the sleeve 133.

[0069] In addition, the sleeve 133 and the plug 132 are fixed by a pin 1324 to make the structure more stable. Specifically, outer mounting holes 13310 and inner mounting holes 13240 are correspondingly formed in the pipe wall 1331 and the first part 1321. The outer mounting hole 13310 and the inner mounting hole 13240 are aligned to insert the pin 1324, thereby fixing the sleeve 133 and the plug 132. Further, threads are provided on the inner walls of the outer mounting hole 13310 and the inner mounting hole 13240, that is, the pin 1324 is screwed to the sleeve 133 and the plug 132, so that the sleeve 133 and the plug 132 are detachably connected, facilitating subsequent maintenance, such as replacing the hose 131, or repairing and replacing other parts.

[0070] In some examples, two pins 1324 are symmetrically arranged at the positions of each plug 132 and the corresponding pipe wall 1331 for fixation. That is, two inner mounting holes 13240 are symmetrically arranged in the first part 1321 of the plug 132, and two outer mounting holes 13310 are symmetrically arranged in the pipe wall 133. The pins 1324 are correspondingly inserted to fix the plug 132 inside the sleeve 133; in some examples, three pins 1324 are arranged at the positions of each plug 132 and the corresponding pipe wall 1331 for fixation. The three pins 1324 form a triangular fixation structure to improve the fixation stability. That is, three inner mounting holes 13240 are arranged in the first part 1321 of the plug 132, and three outer mounting holes 13310 are arranged in the pipe wall 133. The pins 1324 are correspondingly inserted to fix the plug 132 inside the sleeve 133.

[0071] In summary, the valve core assembly 13 adopts an airbag valve design to avoid hard contact between the solder paste and the valve core assembly 13.

[0072] The valve core assembly 13 connects the syringe 11 and the needle 12 through a connecting assembly. Refer to Figure 1A , Figure 1B and Figure 5 As shown in the schematic diagrams of , the connecting assembly includes a first connecting member 14 and a second connecting member 15. A part of the valve core assembly 13 is installed in the first connecting member 14, and a part is installed inside the second connecting member 15. The syringe 11 is installed at one end of the first connecting member 14, and the needle 12 is installed at one end of the second connecting member 15. The first connecting member 14 and the second connecting member 15 are connected, so that the syringe 11, the valve core assembly 13, and the needle 12 are connected and communicated in sequence to form a dot soldering flow channel 100.

[0073] In this example, a part of the valve core assembly 13 is placed inside the first connecting member 14, and the other part is placed inside the second connecting member 15, so that the valve core assembly 13 is placed inside the connecting assembly, and the split structure of the connecting assembly reduces the difficulty of internal installation.

[0074] The valve core assembly 13 is connected to the syringe 11 through the first connecting member 14. Specifically, the syringe 11 has a receiving cavity 110 for receiving the solder paste. The syringe 11 includes a syringe end 111, and the first connecting member 14 includes a first connecting end 141. The syringe end 111 and the first connecting end 141 are connected. The syringe end 111 has a syringe discharge port 1101, and the syringe discharge port 1101 is communicated with the receiving cavity 110, so that the solder paste in the receiving cavity 110 leaves the syringe 11 through the syringe discharge port 1101.

[0075] The first connection end 141 has a first inlet channel 1401, and the first inlet channel 1401 communicates with the syringe discharge port 1101. The first connector 14 includes a first connection cavity 140, and the connection cavity 140 communicates with the first inlet channel 1401. A part of the valve core assembly 13 is received in the first connection cavity 140, and the inlet 1301 of the valve core assembly 13 communicates with the first inlet channel 1401. The syringe discharge port 1101, the first inlet channel 1401, and the inlet 1301 are sequentially communicated to form the feeding channel 101 of the working mechanism 10. The solder paste leaves the syringe 11 through the syringe discharge port 1101 and enters the inner cavity 1310 of the valve core assembly 13 through the first inlet channel 1401 and the inlet 1301. The inner cavity 1310 and the feeding channel 101 are communicated through the material conveying channel 1320.

[0076] Among them, the inlet 1301 is located inside the first inlet channel 1401, and the syringe discharge port 1101 is located outside the first inlet channel 1401.

[0077] In one embodiment, the first connection end 141 extends into the syringe end 111 and is nested with the syringe end 111 so that the syringe discharge port 1101 communicates with the first inlet channel 1401. Among them, the first connection end 141 and the syringe end 111 are detachably connected to facilitate the replacement of the syringe 11. In other embodiments, the first connection end 141 and the syringe end 111 are implemented as other detachable connection methods such as snap connection, buckle connection, magnetic attraction connection, etc.

[0078] The first connector 14 further includes a first mounting end 142. The first mounting end 142 is opposite to the first connection end 141 and forms two ends of the first connector 14 respectively. The first mounting end 142 is mounted on the second connector 15. A first main body portion 143 of the first connector 14 is formed between the first connection end 141 and the first mounting end 142.

[0079] The first connection cavity 140 is formed in the first main body portion 143. A part of the valve core assembly 13 extends into the first main body portion 142 and is located in the first connection cavity 140, and the other part is exposed from the first mounting end 142 for assembling the second connector 15. Or rather, the other part of the valve core assembly 13 is assembled to the second connector 15. The second connector 15 has a second connection cavity 150, and the other part of the valve core assembly 13 is located in the second connection cavity 150.

[0080] The second connector 15 includes a second mounting end 151 and a second connection end 152. The second mounting end 151 is connected to the first mounting end 142, so that the first connector 14 and the second connector 15 are assembled together. The needle 12 is mounted on the second connection end 152.

[0081] The end of the first connecting member 14 is connected to the end of the second connecting member 15. In Figure 5 the illustrated example, the ends of the first connecting member 14 and the second connecting member 15 are nested and fixed. In other examples, the two can be snap-fixed, screwed-fixed, magnetically connected, etc. Further, the ends of the first connecting member 14 and the second connecting member 15 are detachably connected for easy later maintenance.

[0082] The first mounting end 142 has a first outlet channel 1402, and the second mounting end 151 has a second inlet channel 1501. The first outlet channel 1401 and the second inlet channel 1501 are in communication. Further, a seal 136 is provided outside the valve core assembly 13. The seal 136 is located in the gap formed between the outer periphery of the first outlet channel 1402, the second inlet channel 1502, and the valve core assembly 13 to seal the gap between the first outlet channel 1402, the second outlet channel 1501, and the valve core assembly 13.

[0083] The second connection end 152 of the second connecting member 15 has a second outlet channel 1502. The outlet 1302 of the valve core assembly 13 is in communication with the second outlet channel 1502. The needle 12 is mounted on the second connection end 152 such that the needle 12 is in communication with the second outlet channel 1502. The solder paste exits the valve core assembly 13 through the outlet 1302, enters the needle 12 through the second outlet channel 1502, and the needle 12 transports the solder paste to the work object.

[0084] Among them, the outlet 1302 is located inside the second outlet channel 1502, and the needle 12 is located outside the second outlet channel 1502. The needle 12 has a soldering channel 120. The outlet 1302, the second outlet channel 1502, and the soldering channel 120 are connected in sequence to form the discharge channel 102 of the working mechanism 10. The needle 12 has a needle outlet 1201, and a certain amount of solder paste flows out from the needle outlet 1201 and is transported to the work object for soldering operation.

[0085] Further, a needle seal 121 is provided at the connection between the soldering channel 120 and the second outlet channel 1502 to prevent the solder paste from leaking.

[0086] The feeding channel 101, the inner cavity 1310, and the discharging channel 102 are connected in sequence to form the soldering flow channel 100. According to the foregoing embodiments of the valve core assembly 13, by adjusting the pressure difference between the inner cavity 1310 and the outer cavity 1330, the closing or opening of the inner cavity 1310 is realized, and further the closing or communication of the soldering flow channel 100 is controlled to operate the soldering operation.

[0087] The first connecting member 14 and the second connecting member 15 form a connecting assembly for connecting the valve core assembly 13 to the syringe 11 and the needle 12. The connecting assembly has an inflation cavity that surrounds the outer periphery of the valve core assembly 13 and communicates with the cavity inside the valve core assembly 13. Further, the inflation cavity communicates with the outer cavity 1330 of the valve core assembly 13 and is isolated from the inner cavity 1310. The outer cavity 1330 is filled with gas from the outside or discharges gas to the outside through the inflation cavity. The inner cavity 1310 communicates with the syringe 11, and gas is filled into the inner cavity 1310 through the syringe 11 to adjust the pressure of the inner cavity 1310.

[0088] In some examples, the first connecting member 14 is provided with an inflation cavity; in some examples, an inflation cavity is integrally provided in the first connecting member 14 and the second connecting member 15; in Figure 5 the illustrated example, the inflation cavity is formed in the second connecting member 15. The second connecting cavity 150 forms the inflation cavity.

[0089] The sleeve 133 has an air port 13301 which is opened on the pipe wall 1331 and communicates with the outer cavity 1330 and the second connecting cavity 150 respectively, so that the second connecting cavity 150 communicates with the outer cavity 1330.

[0090] Combined with Figure 6A the schematic illustration, the installation mechanism 20 of the soldering tin device has an air delivery port 201. The connecting assembly is provided with a ventilation port 1503. The air delivery port 201 communicates with the ventilation port 1503. The installation mechanism 20 delivers gas to the working mechanism 10. The gas flows out from the air delivery port 201 and flows into the second connecting cavity 150 of the working mechanism 10 through the ventilation port 1503. Further, it enters the outer cavity 1330 through the air port 13301. The installation mechanism 20 delivers gas to the working mechanism 10 to adjust the pressure of the outer cavity 1330 and change the pressure difference between the outer cavity 1330 and the inner cavity 1310.

[0091] Among them, the second connecting cavity 150 is sealed by a seal 136 and is only communicated with the air delivery port 201 through the ventilation port 1503.

[0092] In other examples of the present application, the air port 13301, the ventilation port 1503 and the air delivery port 201 are directly communicated so that the outer cavity 1330 can have gas flow with the outside.

[0093] The syringe 11 communicates with the inner cavity 1310, and the syringe 11 delivers solder paste to the inner cavity 1310. In addition, the syringe 11 delivers gas to the inner cavity 1310 to change the pressure of the inner cavity 1310.

[0094] Therefore, the pressures of the outer cavity 1330 and the inner cavity 1310 can be controlled to adjust the air pressure difference between the outer cavity 1330 and the inner cavity 1310. When the pressure of the outer cavity 1330 is greater than that of the inner cavity 1310, the inner cavity 1310 is squeezed, and the hose body 1311 of the hose 131 shrinks, squeezing the solder paste located in the inner cavity 1310 to stir the solder paste. When the pressure of the inner cavity 1310 is greater than that of the outer cavity 1330, the hose body 1311 expands, the inner cavity 1310 opens, and communicates with the outlet 1302, so that the solder paste leaves the valve core assembly 13 through the outlet 1302, enters the needle 12, and the needle 12 transports the solder paste to the object to be operated for soldering operation.

[0095] Among them, the solder paste is in the form of a thixotropic fluid. The pressure of the outer cavity 1330 is greater than that of the inner cavity 1310, so that the gas exerts pressure on the hose body 1311, and then exerts a lateral extrusion pressure on the solder paste in the inner cavity 1310, turning the solder paste into a viscous fluid. Adjust the pressure difference between the outer cavity 1330 and the inner cavity 1310 to squeeze the solder paste in the inner cavity 1310 multiple times, and then stir the solder paste to avoid solder paste stratification.

[0096] The hose body 1311 is in non-rigid contact with the solder paste, and will not damage the solder ball form of the solder paste, avoiding problems such as solder ball deformation and needle clogging caused by rigid contact.

[0097] Among them, when the pressure of the outer cavity 1330 is greater than that of the inner cavity 1310 to a certain extent, the hose body 1311 is squeezed to be closed, closing the channel between the hose bodies 1311, so that the soldering flow channel 100 is closed to block the flow of the solder paste to the outlet 1302, realizing the closing of the valve core assembly 13; when the pressure of the inner cavity 1310 is greater than that of the outer cavity 1330, the hose body 1311 expands, opening the channel between the hose bodies 1311, so that the soldering flow channel 100 is opened to allow the solder paste to flow to the outlet 1302, realizing the opening of the valve core assembly 13. Therefore, by adjusting the internal and external pressure difference, the valve core assembly 13 can be adjusted to be in an open state or a closed state. Further, the opening degree of the valve core assembly 13 can be adjusted, that is, the size of the channel between the hose bodies 1311 is adjusted, and the amount of the solder paste leaving the outlet 1302 and entering the needle 12 is controlled to control the soldering amount and accuracy.

[0098] After the solder paste is stirred evenly by the lateral extrusion pressure, the fluidity of the solder paste is improved. Even if the valve core assembly 13 is opened slightly, as long as the channel between the hose bodies 1311 is opened, the solder paste can flow into the needle 12 for the needle 12 to perform soldering operation, realizing precise and micro soldering. Therefore, adjusting the pressure of the outer cavity 1330 to be slightly less than that of the inner cavity 1310, so that the channel between the inner cavities 1310 is opened slightly, can also promote the solder paste to flow into the needle 12 for soldering.

[0099] After the tin - dotting operation is completed, it is necessary to block the flow of solder paste to the needle 12, deliver gas to the outer cavity 1330, increase the pressure of the outer cavity 1330, so that the hose body 1311 is squeezed until the hose body 1311 is closed, blocking the continuous flow of solder paste, without the need to suck the solder paste back into the syringe 11, and the operation is simple and efficient.

[0100] The installation mechanism 20 includes a fixing component 21, and the connecting component is installed on the fixing component 21 and fixedly connected to the fixing component 21. Figure 6A and Figure 6B In the example of, the second connecting piece 15 of the connecting component is installed on the fixing component 21 and fixedly connected to the fixing component 21. The gas - delivery port 201 is arranged on the fixing component 21 and communicated with the ventilation port 1502. The installation mechanism 20 further includes a gas - delivery part 22. One end of the gas - delivery part 22 is aligned with the gas - delivery port 201 and fixed to the fixing component 21 to form a gas - flow structure between the working mechanism 10 and the installation mechanism 20.

[0101] In one implementation, the fixing component 21 includes a fixing piece 211, a positioning piece 212 and a locking piece 213. The gas - delivery port 201 is arranged on the fixing piece 211, and the second connecting piece 15 and the gas - delivery part 22 are relatively arranged on both sides of the fixing piece 211. The positioning piece 212 is installed on the fixing piece 211, and an installation space 210 is formed between the fixing piece 211 and the positioning piece 212. The second connecting piece 15 is arranged in the installation space 210. The tightening piece 213 is installed on one of the fixing piece 211 or the positioning piece 212 to lock the second connecting piece 15, so that the second connecting piece 15 is fixedly installed on the fixing component 21, realizing the stable installation of the working mechanism 10.

[0102] Referring to Figure 7 As shown in the schematic diagram, the tin - dotting device further includes a heating mechanism 30. The heating mechanism 30 is installed on the installation mechanism 20 and thermally connected to the working mechanism 10 conductively. The heating mechanism 30 transfers heat to the working mechanism 10 to heat the solder paste in the working mechanism 10. Further, the heating mechanism 30 includes a heater 31 and a temperature controller 32. The temperature controller 32 controls the operation of the heater 31 to adjust the heating temperature. The tin - dotting device further includes an equipment installation component 40. The tin - dotting device is fixed to the equipment in the tin - dotting process through the equipment installation component 40.

[0103] Referring to Figure 8Schematic diagram of the solder dotting operation shown. The solder dotting device further includes a tray 50, and the object to be operated 500 is placed on the tray 50. The tray 50 is arranged along the XY plane, and the operating mechanism 10 is arranged along the X-axis perpendicular to the XY plane. The object to be operated 500 is provided with an operating area 501. The operating mechanism 10 needs to align the needle head 12 with the operating area 501, convey solder paste to the operating area 501, and perform solder dotting. Specifically, adjust the relative positional relationship between the tray 50 and the operating mechanism 10 along the XY plane so that the needle head 12 is aligned with the operating area 501; adjust the distance between the operating area 501 and the tray 50 along the Z-axis, that is, adjust the height of the needle head 12; control the operating mechanism 10 to convey solder paste to the operating area 501 and perform solder dotting.

[0104] Among them, before the solder dotting operation starts, gas is pre-fed into the outer cavity 1330 to increase the pressure of the outer cavity 1330, so that the pressure of the outer cavity 1330 is greater than the pressure of the inner cavity 1310. The hose body 1311 is subjected to a lateral extrusion force, so that the internal solder paste is extruded and stirred. After the solder paste is stirred evenly by the pre-applied extrusion force, the stratification of the solder paste during solder dotting is avoided, and the fluidity is improved. Before the solder dotting operation starts, a certain amount of solder paste can be pre-stored in the inner cavity 1310.

[0105] During the solder dotting operation, control the syringe 11 to convey solder paste to the inner cavity 1310. The pressure of the inner cavity 1310 increases, and the soft hose body 1311 expands, so that the solder dotting flow channel 100 is opened, allowing the solder paste to flow towards the needle head 12.

[0106] According to another aspect of the present application, in combination with Figures 1A to 8 schematic diagram, the present application also provides a solder dotting method for the solder dotting device to dot solder on the object to be operated. The solder dotting method includes the steps of: adjusting the pressure of the outer cavity 1330 of the valve core assembly 13 to be greater than the pressure of the inner cavity 1310 to stir the solder paste in the inner cavity 1310. Before the solder dotting operation starts, a certain amount of solder paste can be stored in the inner cavity 1310, and gas is pre-filled into the outer cavity 1330 to increase the pressure of the outer cavity 1330, so that the pressure of the outer cavity 1330 is greater than the cavity of the inner cavity 1310. The hose body 1311 deforms in the direction of the inner cavity 1310 under force, so that the solder paste in the inner cavity 1310 is squeezed and stirred by the shear force, and the solder paste can be stirred evenly and the fluidity is improved.

[0107] The tin - dotting method further includes the steps of: starting the syringe 11 to convey solder paste into the inner cavity 1310, increasing the pressure of the inner cavity 1310 so that the tin - dotting flow channel 100 is opened, prompting the solder paste to flow into the needle 12 and being conveyed by the needle 12 to the work object 500. When starting the tin - dotting operation, the syringe 11 conveys solder paste into the inner cavity 1310 and at the same time conveys gas into the inner cavity 1310, increasing the pressure of the inner cavity 1310, causing the hose body 1311 to expand, the tin - dotting flow channel 100 to be opened, the solder paste to flow to the needle 2, and being conveyed by the needle 12 to the working area 501 of the work object 500 for tin - dotting operation.

[0108] The tin - dotting method further includes the steps of: adjusting the pressure of the outer cavity 1330 to be greater than the pressure of the inner cavity 1310 until the tin - dotting flow channel 100 is closed to block the flow of the solder paste and end the tin - dotting. When it is necessary to end the tin - dotting operation, gas is filled into the outer cavity 1330, the pressure of the outer cavity 1330 is adjusted to be greater than the pressure of the inner cavity 1310, causing the hose body 1311 to be extruded and deformed towards the inner cavity 1310 direction until the hose body 1311 is closed, the tin - dotting flow channel 100 is closed, blocking the flow of the solder paste and ending the tin - dotting.

[0109] Further, the tin - dotting method further includes the steps of: adjusting the pressure difference between the outer cavity 1330 and the inner cavity 1310 according to the required tin - dotting amount to control the opening degree of the tin - dotting flow channel 100 and allow a certain amount of solder paste to flow to the needle 12. According to the tin - dotting amount required for the working area 501 of the work object 500, the pressure difference between the outer cavity 1330 and the inner cavity 1310 is adjusted to control the opening degree of the tin - dotting flow channel 100 to allow a corresponding amount of solder paste to flow to the needle 12, which is conveyed by the needle 12 to the working area 501 for tin - dotting operation.

[0110] Flexibly adjust the pressure difference between the outer cavity 1330 and the inner cavity 1310 according to the tin - dotting amount required for different working areas 501, control the gas conveyance between the gas - conveying part 21 and the outer cavity 1330, and between the syringe 12 and the inner cavity 1310, so as to adjust the pressures of the outer cavity 1330 and the inner cavity 1310, control the opening degree of the tin - dotting flow channel, achieve precise control and micro - tin - dotting, and improve the tin - dotting accuracy.

[0111] The above description is only the preferred embodiment of the present application and the explanation of the applied technical principles. Those skilled in the art should understand that the scope of the invention involved in the present application is not limited to the technical solutions formed by the specific combination of the above - mentioned technical features, but should also cover other technical solutions formed by any combination of the above - mentioned technical features or their equivalent features without departing from the inventive concept. For example, the technical solutions formed by mutually replacing the above - mentioned features with the (but not limited to) technical features with similar functions disclosed in the present application.

Claims

1. Solder dotting device, characterized in that, comprising: a syringe, a needle head and a valve core assembly, the syringe, the valve core assembly and the needle head are connected in sequence to form a solder dotting flow channel, and the solder paste provided by the syringe is transported along the solder dotting flow channel to the needle head for the needle head to perform solder dotting; The valve core assembly includes: a hose, a plug and a sleeve, the hose is installed inside the sleeve, both ends of the hose and the sleeve are installed with the plug, an inner cavity is formed inside the hose, the inner cavity stores solder paste, and an outer cavity is formed inside the sleeve; wherein, when the pressure of the outer cavity is greater than the pressure of the inner cavity, the inner cavity is squeezed to be closed so that the solder dotting flow channel is closed, and when the pressure of the inner cavity is greater than the pressure of the outer cavity, the inner cavity expands so that the solder dotting flow channel is opened.

2. The solder dotting device according to claim 1, wherein, the plug has an integrally formed second part and a first part, the second part is located inside the inner cavity, and the first part is located outside the hose and inside the sleeve.

3. The solder dotting device according to claim 2, wherein, the first part is provided with a groove, and an inner sealing ring is assembled in the groove, and the inner sealing ring seals the gap between the tube wall of the sleeve and the first part.

4. The solder dotting device according to claim 2, wherein, the tube wall of the sleeve and the first part are correspondingly provided with an outer mounting hole and an inner mounting hole, and further includes a pin, the outer mounting hole and the inner mounting hole are aligned, and the pin is inserted so that the plug is fixed inside the sleeve.

5. The solder dotting device according to claim 2, wherein, the hose is sleeved with a tightening member, the tightening member is located on the outer periphery of the second part and the corresponding hose, and tightens the second part and the hose.

6. The solder dotting device according to claim 1, wherein, the sleeve is provided with an air port, the outer cavity communicates with the outside through the air port, and gas flows into and out of the outer cavity through the air port to change the pressure of the outer cavity.

7. The solder dotting device according to claim 6, wherein, the syringe communicates with the inner cavity of the hose to transport gas to the inner cavity and change the pressure of the inner cavity, wherein the hose is made of an elastic material.

8. The solder dotting device according to claim 6, wherein, further includes a connection assembly, one end of the connection assembly connects the valve core assembly and the syringe, and the other end connects the valve core assembly and the needle head, wherein the connection assembly is provided with a ventilation port, the ventilation port communicates with the air port, and external gas flows into and out of the outer cavity through the ventilation port and the air port.

9. The solder dotting device according to claim 8, wherein, The connecting component has an inlet channel and an outlet channel. The valve core component is installed within the connecting component, between the inlet channel and the outlet channel. The syringe outlet of the syringe, the inlet channel, and the inlet channel of the valve core component are sequentially connected to form a feeding channel. The outlet channel of the valve core component, the outlet channel, and the needle outlet of the needle are sequentially connected to form a discharging channel. The inner cavity communicates with the feeding channel and the discharging channel to form the solder dotting channel.

10. The solder dotting device according to claim 9, wherein, the connecting component includes a first connecting piece and a second connecting piece. A part of the valve core component is installed within the first connecting piece, and another part is installed within the second connecting piece. One end of the first connecting piece is installed to the syringe, the other end of the first connecting piece is connected to one end of the second connecting piece, and the other end of the second connecting piece is installed with the needle.

11. The solder dotting device according to claim 8, wherein, it further includes an installation mechanism which has an air outlet, and the air outlet communicates with the air vent.

12. The solder dotting device according to claim 11, wherein, the installation mechanism includes a fixing component and an air conveying part. The fixing component fixes the connecting component and the air conveying part, so that the air vent and the air outlet communicate.

13. A solder dotting method, for a solder dotting device, characterized in that, it includes the following steps: Adjust the pressure of the outer cavity of the valve core component to be greater than the pressure of the inner cavity to stir the solder paste in the inner cavity; Start the syringe to convey the solder paste to the inner cavity, increase the pressure of the inner cavity, so that the solder dotting channel is opened, and promote the solder paste to flow into the needle and be conveyed to the working object; and Adjust the pressure of the outer cavity to be greater than the pressure of the inner cavity until the solder dotting channel is closed, blocking the flow of the solder paste, and ending the solder dotting.

14. The solder dotting method according to claim 13, wherein, it further includes the step of: Adjust the pressure difference between the outer cavity and the inner cavity according to the required amount of solder dots to control the opening degree of the solder dotting channel and allow a certain amount of solder paste to flow to the needle.

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