Micro-hemisphere batch polishing device and method

Abstract

The invention discloses a micro hemisphere batch polishing device and method.The device comprises polishing equipment, a connecting assembly and a mounting assembly, the mounting assembly comprises a mounting disc and a plurality of jigs, the mounting disc is arranged on an asphalt disc, and a plurality of mounting through holes corresponding to the jigs one to one are formed in the mounting disc; the jigs are arranged in the corresponding installation through holes and detachably connected with the installation disc, containing holes are formed in the bottom faces of the jigs, the lower portions of the micro hemispheres extend out of the containing holes and abut against the asphalt disc, the connecting assembly comprises a mandrel, a bearing sleeve and a ball bearing, the bearing sleeve is fixed to the center of the upper surface of the installation disc, and the ball bearing is fixed in the bearing sleeve. The upper end of the mandrel is detachably connected with the polishing equipment, the lower end of the mandrel is provided with a ball head, the ball head is suspended in a center hole of the ball bearing and is in small clearance fit with the ball bearing, and when the polishing equipment is started, the mandrel is driven to swing, and then the mounting disc is driven to rotate relative to the asphalt disc so that the lip edges of the multiple micro hemispheres can be ground with the asphalt disc. By means of the micro-hemisphere polishing device, efficient and high-quality batch polishing of micro-hemispheres can be achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of the preparation of hemispherical resonators, and particularly relates to a micro-hemisphere batch polishing device and method. Background Art

[0002] The micro-hemisphere belongs to the hemispherical resonator gyro, which is a solid wave gyro based on the Coriolis effect. It has the advantage of low cost and is an important direction for the future development of gyroscopes. Conventional micro-hemispheres are formed by blowing a planar quartz sheet. Before becoming a finished product for assembly, it is necessary to grind the excess skirt after forming to remove the excess mass and form a smooth, non-chipping, and uniform lip edge to ensure a high quality factor Q value.

[0003] The applicant achieved good results in the previous exploration of grinding the skirt of the micro-hemisphere. For details, see Chinese invention patent CN118559515B - "A Method for Grinding and Polishing the Lip of a Micro-Hemisphere". After grinding the lip of the micro-hemisphere, scratches and micro-cracks will remain on its surface, which need to be removed by mechanical + chemical polishing. In this patent, the mechanical polishing is completed by replacing the resin grinding wheel for on-line polishing after grinding. Due to the long polishing time and polishing for a single micro-hemisphere, the polishing efficiency is extremely low. Summary of the Invention

[0004] Aiming at the problems in the background art, the present invention proposes an efficient and high-quality micro-hemisphere batch polishing device and method.

[0005] The present invention adopts the following technical solutions:

[0006] A micro-hemisphere batch polishing device includes: a polishing device, a connection component, and a mounting component.

[0007] The mounting component includes a mounting plate and a plurality of fixtures. The mounting plate is placed on the asphalt plate of the polishing device. A plurality of vertically arranged mounting through holes are formed on the mounting plate, and the plurality of mounting through holes correspond to the plurality of fixtures one by one. The fixtures are placed in the corresponding mounting through holes and are detachably connected to the mounting plate.

[0008] A receiving hole is formed on the bottom surface of the fixture for receiving an inverted micro-hemisphere. The lower part of the micro-hemisphere extends out of the receiving hole and abuts against the asphalt plate.

[0009] The connection component includes a mandrel, a bearing sleeve, and a ball bearing. The bearing sleeve is fixed at the center of the upper surface of the mounting plate, and the ball bearing is fixed in the bearing sleeve. The upper end of the mandrel is detachably connected to the power mechanism of the polishing device, and its lower end has a ball head. The ball head is suspended in the central hole of the ball bearing and is in small clearance fit with it.

[0010] When the polishing device is started, it drives the mandrel to swing, and then drives the mounting plate to rotate relative to the asphalt plate, so that the lips of the plurality of micro-hemispheres and the asphalt plate are mutually ground.

[0011] Optionally, it further includes a leveling component, which is used to calibrate the coaxiality of the installation through-hole and the fixture therein during the detachable connection between the fixture and the installation disk before the installation disk is placed on the asphalt disk.

[0012] Optionally, the leveling component includes a leveling base and a plurality of equal-height blocks. The plurality of equal-height blocks are used to abut between the installation disk and the leveling base during the coaxiality calibration of the fixture. During the detachable connection between the fixture and the installation disk, the lip edge of the micro hemisphere in the fixture abuts against the upper surface of the leveling base.

[0013] Optionally, the fixture is detachably connected to the installation disk through a fastener.

[0014] Optionally, a plurality of threaded holes are formed on the side surface of the installation disk. The plurality of threaded holes correspond to the plurality of installation through-holes one by one, and the threaded holes communicate with the corresponding installation through-holes. After the fastener passes through the corresponding threaded hole, it abuts against the fixture.

[0015] Optionally, an annular groove for cooperating with the corresponding fastener is formed on the side surface of the fixture. After the fastener passes through the threaded hole, it is snapped into the annular groove.

[0016] Optionally, a positioning post that cooperates with the anchor post cavity of the micro hemisphere extends downward from the center of the bottom of the accommodation hole. When the inverted micro hemisphere is placed in the accommodation hole, the positioning post is snapped into the anchor post cavity of the micro hemisphere.

[0017] Optionally, a step for installing a protective cover is provided at the edge of the installation disk.

[0018] As a general inventive concept, the present invention also provides a method for batch polishing of micro hemispheres using the above device, including the following steps:

[0019] S1: Clamp a plurality of fixtures installed with micro hemispheres into the installation through-holes of the installation disk. After calibrating the coaxiality of the installation through-holes and the fixtures therein, detachably connect the installation disk and the plurality of fixtures;

[0020] S2: Place the installation disk on the asphalt disk of the polishing equipment, fix the bearing sleeve at the center of the upper surface of the installation disk, then suspend the ball head of the core shaft in the central hole of the ball bearing, and connect the upper end of the core shaft to the polishing equipment;

[0021] S3: Start the polishing equipment to drive the core shaft to swing, and then drive the installation disk to rotate relative to the asphalt disk, so that the lip edges of the plurality of micro hemispheres and the asphalt disk are mutually polished.

[0022] Optionally, in step S1, the calibration of the coaxiality of the installation through-hole and the fixture therein, and then the detachable connection of the installation disk and the plurality of fixtures specifically includes:

[0023] Place the installation disk on a leveling base, and arrange a plurality of equal-height blocks between the installation disk and the leveling base. Clamp the fixture with the micro hemispheres into the corresponding installation through-holes, and press down to make the lip edge of the micro hemisphere abut against the upper surface of the leveling base, and then firmly connect the installation disk and the fixture.

[0024] Optionally, before the step S1, it further includes: coating an adhesive in the accommodation hole of the fixture, placing the inverted micro hemisphere in the accommodation hole of the fixture and contacting the bonding material in the accommodation hole, and the lower part of the micro hemisphere extends out of the accommodation hole; after the adhesive is cured, then perform step S2.

[0025] Optionally, a plurality of threaded holes are opened on the side surface of the installation disk, the plurality of threaded holes correspond to the plurality of installation through-holes one by one, and the threaded holes communicate with the corresponding installation through-holes. Pass the fasteners through the corresponding threaded holes and abut against the fixture to firmly connect the installation disk and the fixture.

[0026] Optionally, the polishing time of the step S3 is 5 - 10 min.

[0027] Compared with the prior art, the advantages of the present invention are as follows:

[0028] The applicant's previous research shows that when using a conventional polishing machine to batch polish the lip edges of the ground micro hemispheres, due to the influence of clamping, etc., the micro hemispheres will inevitably be affected by external forces during the polishing process, and these external forces are extremely likely to cause chipping or grinding inclination of the lip edges of the micro hemispheres, thereby affecting the quality factor Q value of the micro hemispheres.

[0029] The present invention designs a connection component including a mandrel, a bearing sleeve and a ball bearing. The cylindrical end of the mandrel is detachably connected to the power mechanism of the polishing machine, and the ball head end of the mandrel is suspended in the inner hole of the ball bearing through a small clearance fit. The bearing sleeve for installing the ball bearing is fixed at the center of the upper surface of the micro hemisphere installation disk. This connection method can effectively isolate the vibration and vertical extrusion force brought by the operation of the polishing machine when the micro hemisphere is polished, and realize the mutual grinding method of the asphalt disk and the micro hemispheres leveled on the installation disk, that is, realize the self-weight polishing of the batch micro hemispheres by the micro hemisphere installation disk, so that the asphalt disk and the micro hemispheres are simultaneously polished for flatness. Practice shows that the present invention can finally polish the flatness of the lip edges of the batch micro hemispheres to within 0.005 um within 10 - 15 min. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more easily understand the present invention, the present invention will be described in more detail by referring to the specific embodiments shown in the drawings. These drawings only depict the typical embodiments of the present invention and should not be considered as limiting the protection scope of the present invention.

[0031] Figure 1 It is a schematic three-dimensional structure diagram of the micro hemisphere batch polishing device according to Embodiment 1 of the present invention.

[0032] Figure 2 Schematic three-dimensional structure diagram (excluding the frame) of the micro-hemisphere batch polishing device according to Embodiment 1 of the present invention.

[0033] Figure 3 Partial three-dimensional structure diagram of the micro-hemisphere batch polishing device according to Embodiment 1 of the present invention.

[0034] Figure 4 Partial three-dimensional exploded structure diagram of the micro-hemisphere batch polishing device according to Embodiment 1 of the present invention.

[0035] Figure 5 Partial sectional structure diagram of the micro-hemisphere batch polishing device according to Embodiment 1 of the present invention.

[0036] Figure 6 Schematic structure diagram for micro-hemisphere flatness calibration.

[0037] Figure 7 Sectional structure diagram of the micro-hemisphere fixed in the fixture.

[0038] Figure 8 is Figure 6 A-A sectional structure diagram of

[0039] Figure 9 Flowchart of the micro-hemisphere batch polishing method according to Embodiment 2 of the present invention.

[0040] Reference numerals:

[0041] 1. Connection assembly; 11. Core shaft; 111. Ball head; 12. Bearing sleeve; 13. Ball bearing; 2. Mounting assembly; 21. Mounting plate; 211. Mounting through hole; 212. Threaded hole; 213. Step; 22. Fixture; 221. Accommodating hole; 222. Annular groove; 223. Positioning post; 23. Fastener; 3. Polishing equipment; 31. Asphalt plate; 32. Power mechanism; 4. Leveling assembly; 41. Leveling base; 42. Equal-height block; 5. Micro-hemisphere; 51. Lip edge; 52. Anchor post cavity. Detailed implementation manners

[0042] The following describes the embodiments of the present invention with reference to the drawings, so that those skilled in the art can better understand the present invention and be able to implement it. However, the listed embodiments are not intended to limit the present invention. Without conflict, the following embodiments and the technical features in the embodiments can be combined with each other, and the same components are denoted by the same reference numerals.

[0043] Embodiment 1:

[0044] As Figures 1 - 5As shown in the figure, this embodiment provides a micro - hemisphere batch polishing device, including: a polishing device 3, a connection component 1, and a mounting component 2.

[0045] The mounting component 2 includes a mounting disk 21 and a plurality of fixtures 22. The mounting disk 21 is placed on the asphalt disk 31 of the polishing device 3. A plurality of vertically arranged mounting through - holes 211 are provided on the mounting disk 21. The plurality of mounting through - holes 211 correspond to the plurality of fixtures 22 one by one. The fixture 22 is placed in the corresponding mounting through - hole 211 and is detachably connected to the mounting disk 21.

[0046] A receiving hole 221 is provided on the bottom surface of the fixture 22 for receiving the inverted micro - hemisphere 5. The lower part of the micro - hemisphere 5 extends out of the receiving hole 221 and abuts against the asphalt disk 31.

[0047] The connection component 1 includes a core shaft 11, a bearing sleeve 12, and a ball bearing 13. The bearing sleeve 12 is fixed to the center of the upper surface of the mounting disk 21. The ball bearing 13 is fixed in the bearing sleeve 12. The upper end of the core shaft 11 is detachably connected to the power mechanism 32 of the polishing device 3, and its lower end has a ball head 111. The ball head 111 is suspended in the central hole of the ball bearing 13 and has a small clearance fit with it.

[0048] When the polishing device 3 is started, it drives the core shaft 11 to swing, and then drives the mounting disk 21 to rotate relative to the asphalt disk 31, so that the lips 51 of the plurality of micro - hemispheres 5 and the asphalt disk 31 are mutually ground.

[0049] Thus, the present invention designs a connection component including a core shaft, a bearing sleeve, and a ball bearing, detachably connecting the cylindrical end of the core shaft to the power mechanism of the polishing machine, and suspending the ball - head end of the core shaft in the inner hole of the ball bearing with a small clearance fit. The bearing sleeve for installing the ball bearing is fixed to the center of the upper surface of the micro - hemisphere mounting disk. This connection method can effectively isolate the vibration and vertical extrusion force brought during the operation of the polishing machine during the micro - hemisphere polishing process, realizing the mutual grinding between the asphalt disk and the micro - hemispheres leveled on the mounting disk, that is, realizing the self - weight polishing of the batch of micro - hemispheres by the micro - hemisphere mounting disk, so that the asphalt disk and the micro - hemispheres are polished for flatness at the same time. Practice shows that the present invention can finally achieve the flatness polishing of the lips of the batch of micro - hemispheres to within 0.005 um within 10 - 15 minutes.

[0050] As Figures 6 - 8 shown, in this embodiment, a leveling component 4 is further included, which is used to calibrate the coaxiality of the mounting through - hole 211 and the fixture 22 therein during the process of detachably connecting the fixture 22 to the mounting disk 21 before the mounting disk 21 is placed on the asphalt disk 31.

[0051] In this embodiment, the leveling assembly 4 includes a leveling base 41 and a plurality of contour blocks 42. The plurality of contour blocks 42 are used to abut between the mounting plate 21 and the leveling base 41 during the coaxiality calibration process of the jig 22. During the detachable connection between the jig 22 and the mounting plate 21, the lip edge 51 of the micro-hemispherical ball 5 in the jig 22 abuts against the upper surface of the leveling base 41.

[0052] After the micro-hemispherical ball has completed the skirt grinding, the jig that fixes the micro-hemispherical ball is removed from the grinding equipment and then installed on the mounting plate in batches. Specifically, the mounting plate is designed with several mounting through holes that match the small gap of the jig. After the jig is inserted into the mounting through holes, the jig and the mounting plate need to be fixed to prevent the jig from shaking relative to the mounting plate during the subsequent micro-hemispherical ball polishing process, thereby affecting the polishing quality of the micro-hemispherical ball. Since the jig and the mounting through holes match with a small gap, during the tightening process of the jig and the mounting plate, it is necessary to ensure that the inverted micro-hemispherical ball lip edge in the jig remains parallel to the horizontal plane to avoid the jig from being deflected during the tightening process, thereby affecting the flatness of the micro-hemispherical ball lip edge.

[0053] The present invention utilizes a leveling base with good flatness and 4-6 equal-height pads to suspend the micro-hemispherical mounting chassis, and then performs fixture installation, so that the micro-hemispherical bonded in the fixture can directly contact the leveling base (height 10mm-20mm), and then tightens the micro-hemispherical mounting fixture with threads to fix the micro-hemispherical mounting base to ensure the flatness of the micro-hemispherical installation before polishing.

[0054] The leveling assembly and fixture of the present invention are also applicable to the leveling and fixing of micro-hemispherical batch polishing that completes skirt grinding by other methods, and have a wide range of applications and are easy to promote. The specific leveling and fixing methods are as follows:

[0055] The micro-hemispherical mounting plate is designed with multiple through holes for mounting fixtures. At the same time, corresponding threaded holes are opened on the side of the chassis to connect with the corresponding through holes. After the fixture is installed, it is convenient to use screws to gently tighten it on the mounting plate. The screws are in contact with the upper and lower walls of the annular groove on the side of the fixture, so that the side wall of the fixture can better fit with the hole wall of the mounting through hole to ensure the flatness of the micro-hemispherical installation. Because the fixture in the centermost mounting through hole is controlled by the bearing movement and will not be offset, the centermost mounting through hole does not need to be designed with a corresponding threaded hole.

[0056] In this embodiment, the fixture 22 is detachably connected to the mounting plate 21 via a fastener 23 .

[0057] In this embodiment, a plurality of threaded holes 212 are provided on the side of the mounting plate 21 , and the plurality of threaded holes 212 correspond one-to-one to the plurality of mounting through holes 211 , and the threaded holes 212 are connected to the corresponding mounting through holes 211 , and the fasteners 23 pass through the corresponding threaded holes 212 and abut against the fixture 22 .

[0058] In this embodiment, an annular groove 222 adapted to a corresponding fastener 23 is formed on the side surface of the jig 22, and after passing through the threaded hole 212, the fastener 23 is snapped into the annular groove 222.

[0059] Threaded holes are formed on the side of the chassis, which facilitates the installation of the jig. After the installation of the jig is completed, it can be gently fastened to the chassis with screws. The screws contact the inner wall of the annular groove in the middle of the jig, so that the positioning surface of the side wall of the jig can better fit the inner hole surface of the chassis, ensuring the flatness of the installation of the micro hemisphere.

[0060] In this embodiment, to ensure the coaxiality of the micro hemisphere and the jig, a positioning post 223 is formed by extending downward from the center of the bottom of the accommodation hole 221 and is adapted to the anchor post cavity 52 of the micro hemisphere 5. When the inverted micro hemisphere is placed in the accommodation hole 221, the positioning post 223 is snapped into the anchor post cavity 52 of the micro hemisphere 5.

[0061] In this embodiment, a step 213 for installing a protective cover is provided at the edge of the mounting plate 21.

[0062] The remaining arc design on the side of the mounting plate and the step design above the mounting plate are for installing a waterproof cover to prevent environmental pollution caused by the splashing of polishing liquid everywhere and the immersion of polishing liquid into the mounting through hole, resulting in its blockage and affecting the loading and unloading of the tooling.

[0063] Embodiment 2:

[0064] As Figure 9 shown, this embodiment provides a method for batch polishing of micro hemispheres using the device of Embodiment 1, including the following steps:

[0065] S1: Snap a plurality of jigs 22 each mounted with a micro hemisphere into the mounting through holes 211 of the mounting plate 21. After calibrating the coaxiality of the mounting through holes 211 and the jigs 22 therein, detachably connect the mounting plate 21 and the plurality of jigs 22;

[0066] S2: Place the mounting plate 21 on the asphalt plate 31 of the polishing device 3, fix the bearing sleeve 12 at the center of the upper surface of the mounting plate 21, then suspend the ball head 111 of the core shaft 11 in the central hole of the ball bearing 13, and connect the upper end of the core shaft 11 to the polishing device 3;

[0067] S3: Start the polishing device 3 to drive the core shaft 11 to swing, and then drive the mounting plate 21 to rotate relative to the asphalt plate 31, so that the lips 51 of the plurality of micro hemispheres 5 and the asphalt plate 31 are mutually polished.

[0068] In this embodiment, in step S1, after calibrating the coaxiality of the mounting through holes 211 and the jigs 22 therein, then detachably connect the mounting plate 21 and the plurality of jigs 22, which specifically includes:

[0069] Place the mounting disc 21 on a leveling base 41, and arrange a plurality of equal-height blocks 42 between the mounting disc 21 and the leveling base 41. Snap the jig 22 with the micro hemisphere 5 installed into the corresponding mounting through-hole 211, and press down so that the lip edge 51 of the micro hemisphere 5 abuts against the upper surface of the leveling base 41, and fasten the mounting disc 21 and the jig 22 together.

[0070] In this embodiment, before step S1, it includes: coating an adhesive in the accommodation hole 221 of the jig 22, placing the inverted micro hemisphere in the accommodation hole 221 of the jig 22 and contacting the bonding material in the accommodation hole 221, and the lower part of the micro hemisphere extends out of the accommodation hole 221; after the adhesive is cured, then perform step S2.

[0071] In this embodiment, a plurality of threaded holes 212 are formed on the side surface of the mounting disc 21. The plurality of threaded holes 212 correspond to the plurality of mounting through-holes 211 one by one, and the threaded holes 212 communicate with the corresponding mounting through-holes 211. Pass the fastener 23 through the corresponding threaded hole 212 and abut against the jig 22, so as to fasten the mounting disc 21 and the jig 22 together.

[0072] In this embodiment, the polishing time of step S3 is 5 - 10 min.

[0073] In this embodiment, the preparation and installation process of the asphalt disc 31 is as follows:

[0074] 1) Machine a metal mold with appropriate dimensions. Square grid grooves are formed on the mold. The side length dimension of the square grid grooves is about 5 mm - 8 mm, with a draft angle of 0.5° - 1°.

[0075] 2) Heat the metal mold, evenly coat a layer of beeswax on the surface. After the beeswax cools, pour the softened asphalt into the metal mold to a specified height (20 mm - 30 mm), and let it stand naturally until it is completely cooled.

[0076] 3) Take out the cooled asphalt disc and install it on the chassis of the polishing equipment main body with the square grid facing up.

[0077] Making the asphalt disc by using a metal mold with a draft angle and fillet transition can effectively avoid the unevenness problem of the asphalt disc, and can prevent the micro hemisphere from being extruded by uneven external forces during polishing.

[0078] The above-described embodiments are only relatively preferred specific embodiments of the present invention. The present specification uses the phrases "in one embodiment", "in another embodiment", "in yet another embodiment" or "in other embodiments", which can all refer to one or more of the same or different embodiments according to the present disclosure. Ordinary variations and substitutions made by those skilled in the art within the scope of the technical solution of the present invention should be included in the protection scope of the present invention.

Claims

1. A micro-hemispherical batch polishing device, characterized in that: include: Polishing equipment (3), connecting assembly (1) and mounting assembly (2), The mounting assembly (2) comprises a mounting plate (21) and a plurality of jigs (22); the mounting plate (21) is placed on an asphalt plate (31) of a polishing device (3); a plurality of vertically arranged mounting through holes (211) are provided on the mounting plate (21); the plurality of mounting through holes (211) correspond one to one with the plurality of jigs (22); the jigs (22) are placed in corresponding mounting through holes (211) and are detachably connected to the mounting plate (21); The bottom surface of the fixture (22) is provided with a receiving hole (221) for receiving the inverted micro-hemispherical ball (5). The lower part of the micro-hemispherical ball (5) extends out of the receiving hole (221) and contacts the asphalt plate (31). The connecting assembly (1) comprises a core shaft (11), a bearing sleeve (12) and a ball bearing (13), wherein the bearing sleeve (12) is fixed to the center of the upper surface of the mounting plate (21), and the ball bearing (13) is fixed in the bearing sleeve (12). The upper end of the core shaft (11) is detachably connected to a power mechanism (32) of a polishing device (3), and the lower end thereof is provided with a ball head (111), wherein the ball head (111) is suspended in the center hole of the ball bearing (13) and is matched with the ball bearing (13) with a small clearance. When the polishing device (3) is started, it drives the core shaft (11) to swing, and then drives the mounting plate (21) to rotate relative to the asphalt plate (31), so that the lips (51) of the plurality of micro-hemispheres (5) and the asphalt plate (31) rub against each other.

2. The micro-hemispherical batch polishing device according to claim 1, characterized in that: It also includes a leveling component (4) for calibrating the coaxiality of the mounting through hole (211) and the jig (22) therein during the detachable connection between the jig (22) and the mounting plate (21) before the mounting plate (21) is placed on the asphalt plate (31).

3. The micro-hemispherical batch polishing device according to claim 2, characterized in that: The leveling assembly (4) comprises a leveling base (41) and a plurality of equal height blocks (42). The plurality of equal height blocks (42) are used to abut between the mounting plate (21) and the leveling base (41) during the coaxiality calibration process of the jig (22). During the detachable connection between the jig (22) and the mounting plate (21), the lip edge (51) of the micro-hemisphere (5) in the jig (22) abuts against the upper surface of the leveling base (41).

4. The micro-hemispherical batch polishing device according to any one of claims 1 to 3, characterized in that: The fixture (22) is detachably connected to the mounting plate (21) via a fastener (23); A plurality of threaded holes (212) are provided on the side of the mounting plate (21), the plurality of threaded holes (212) correspond to the plurality of mounting through holes (211) one by one, and the threaded holes (212) are connected to the corresponding mounting through holes (211), and the fasteners (23) pass through the corresponding threaded holes (212) and abut against the fixture (22).

5. The micro-hemispherical batch polishing device according to claim 4, characterized in that: An annular groove (222) cooperating with a corresponding fastener (23) is provided on the side surface of the fixture (22); the fastener (23) is inserted into the annular groove (222) after passing through the threaded hole (212).

6. The micro-hemispherical batch polishing device according to any one of claims 1 to 3, characterized in that: The center of the bottom of the receiving hole (221) extends downward to form a positioning column (223) that cooperates with the anchor column cavity (52) of the micro-hemispheric (5). When the inverted micro-hemispheric is placed in the receiving hole (221), the positioning column (223) is inserted into the anchor column cavity (52) of the micro-hemispheric (5).

7. A method for batch polishing of micro-hemispherical balls using the device according to any one of claims 1 to 6, characterized in that: The following steps are involved: S1: inserting a plurality of jigs (22) equipped with micro-hemispherical balls into the mounting through holes (211) of the mounting plate (21), calibrating the coaxiality between the mounting through holes (211) and the jigs (22) therein, and then detachably connecting the mounting plate (21) and the plurality of jigs (22); S2: placing the mounting plate (21) on the asphalt plate (31) of the polishing device (3), fixing the bearing sleeve (12) at the center of the upper surface of the mounting plate (21), suspending the ball head (111) of the mandrel (11) in the center hole of the ball bearing (13), and connecting the upper end of the mandrel (11) to the polishing device (3); S3: Start the polishing device (3) to drive the core shaft (11) to swing, and then drive the mounting plate (21) to rotate relative to the asphalt plate (31), so that the lips (51) of the plurality of micro-hemispheres (5) and the asphalt plate (31) rub against each other.

8. The method for batch polishing of micro-hemispherical balls according to claim 7, characterized in that: In the step S1, after calibrating the coaxiality of the mounting through hole (211) and the fixture (22) therein, the mounting plate (21) and the plurality of fixtures (22) are detachably connected, which specifically includes: The mounting plate (21) is placed on a leveling base (41), and a plurality of equal-height blocks (42) are arranged between the mounting plate (21) and the leveling base (41). The jig (22) on which the micro-hemispherical ball (5) is mounted is inserted into the corresponding mounting through hole (211), and is pressed downward so that the lip edge (51) of the micro-hemispherical ball (5) abuts against the upper surface of the leveling base (41), and then the mounting plate (21) and the jig (22) are fastened and connected.

9. The method for batch polishing of micro-hemispherical balls according to claim 7 or 8, characterized in that: Before step S1, the method further includes: coating an adhesive in the receiving hole (221) of the jig (22), placing the inverted micro-hemispherical ball in the receiving hole (221) of the jig (22) and contacting the micro-hemispherical ball with the adhesive material in the receiving hole (221), with the lower part of the micro-hemispherical ball extending out of the receiving hole (221); and executing step S2 after the adhesive is cured.

10. The method for batch polishing of micro-hemispherical balls according to claim 7 or 8, characterized in that: The polishing time of step S3 is 5-10 minutes.

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