Polishing, cleaning and drying machine

Abstract

The present invention provides a polishing, cleaning and drying all-in-one machine, which relates to the field of polishing technology. The polishing, cleaning and drying all-in-one machine includes a rough polishing device, a fine polishing device, a cleaning and drying device, and a polishing drive device. The rough polishing device includes a plurality of coarse polishing discs distributed in sequence; the fine polishing device includes a plurality of fine polishing discs distributed in sequence, and the plurality of fine polishing discs are correspondingly arranged on the rear side of the plurality of coarse polishing discs; the cleaning and drying device is arranged on the rear side of the fine polishing device; the polishing drive device includes a driving mechanism and a plurality of polishing heads, and the driving mechanism is connected to the plurality of polishing heads; the plurality of polishing heads can place a plurality of wafers on the plurality of coarse polishing discs and the plurality of fine polishing discs for coarse polishing and fine polishing respectively, and the plurality of polishing heads also feed a plurality of wafers into the cleaning and drying device. Compared with the prior art, the polishing, cleaning and drying all-in-one machine provided in the embodiment of the present invention can realize multi-line polishing, has high polishing efficiency, and can realize the integration of polishing, cleaning and drying, thereby simplifying the manufacturing process.

Description

Technical Field

[0001] The present invention relates to the technical field of polishing, in particular to a polishing, cleaning and drying all-in-one machine. Background Art

[0002] Existing CMP polishing machines usually use a single-line process, that is, a single polishing head is used to absorb the wafer and polish it on the polishing pad during polishing, and then clean and dry it after polishing. This single-line polishing method is inefficient.

[0003] At the same time, the existing polishing equipment is independent of the cleaning and drying equipment, and the overall integration is poor. The polished wafers need to be temporarily stored and then transported to the cleaning and drying equipment again, which cannot achieve the integration of polishing, cleaning and drying, and the process is complicated. Summary of the Invention

[0004] The purpose of the present invention is to provide a polishing, cleaning and drying all-in-one machine, which can realize multi-line polishing with high polishing efficiency, and can realize the integration of polishing, cleaning and drying at the same time, thereby simplifying the manufacturing process.

[0005] In a first aspect, the present invention provides a polishing, cleaning and drying all-in-one machine, comprising:

[0006] A rough polishing device, comprising a plurality of sequentially distributed rough polishing discs, the rough polishing discs being used to perform rough polishing on the wafer;

[0007] A fine polishing device, comprising a plurality of fine polishing discs distributed in sequence, the plurality of fine polishing discs being correspondingly arranged on the rear side of the plurality of rough polishing discs, the fine polishing discs being used to perform fine polishing on the wafer;

[0008] A cleaning and drying device, the cleaning and drying device being arranged at the rear side of the fine polishing device and being used for cleaning and drying the wafer;

[0009] A polishing drive device, comprising a drive mechanism and a plurality of polishing heads, wherein the drive mechanism is connected to the plurality of polishing heads and is used to synchronously drive the plurality of polishing heads to move synchronously;

[0010] Among them, the multiple polishing heads are used to respectively adsorb the multiple wafers, and under the drive of the driving mechanism, the multiple wafers are placed on the multiple rough polishing disks for rough polishing and then placed on the multiple fine polishing disks for fine polishing. The multiple polishing heads are also used to send the multiple wafers after fine polishing into the cleaning and drying device under the drive of the driving mechanism.

[0011] In an optional embodiment, the plurality of rough polishing discs include a first rough polishing disc and a second rough polishing disc, the first rough polishing disc having a higher level than the second rough polishing disc, and a first drainage pipe is provided between the first rough polishing disc and the second rough polishing disc, the first drainage pipe being used to deliver polishing liquid after polishing by the first rough polishing disc to the second rough polishing disc;

[0012] The multiple fine polishing discs include a second fine polishing disc and a second fine polishing disc, the horizontal height of the first fine polishing disc is greater than the horizontal height of the second fine polishing disc, and a second drainage pipe is also provided between the first fine polishing disc and the second fine polishing disc, and the second drainage pipe is used to deliver the polishing liquid after polishing the second fine polishing disc into the second fine polishing disc.

[0013] In an optional embodiment, the rough polishing device further includes a rough polishing recovery barrel, which is arranged below the second rough polishing disk and is used to collect the polishing liquid after polishing by the second rough polishing disk, and the rough polishing recovery barrel is further provided with a first filter port, the first filter port is provided with a first delivery pump and is connected to a first circulation pipe, the first circulation pipe is connected to the first rough polishing disk, and is used to circulate the filtered polishing liquid to the first rough polishing disk;

[0014] The fine polishing device also includes a fine polishing recovery barrel, which is arranged below the second fine polishing disk and is used to collect the polishing liquid after polishing by the second fine polishing disk. The fine polishing recovery barrel is also provided with a second filter port, and the second filter port is provided with a second delivery pump and is connected to a second circulation pipe. The second circulation pipe is connected to the second rough polishing disk and is used to circulate the filtered polishing liquid to the second rough polishing disk.

[0015] In an optional embodiment, the driving mechanism includes a hanger and a driving assembly, the hanger extends from above the rough polishing device to above the cleaning and drying device, the driving assembly is arranged on the hanger, the multiple polishing heads include a first polishing head and a second polishing head, the driving assembly is simultaneously connected to the first polishing head and the second polishing head, the first polishing head is used to adsorb the first wafer, and under the drive of the driving assembly, the first wafer is respectively sent to the first rough polishing disk, the first fine polishing disk and the cleaning and drying device, the second polishing head is used to adsorb the second wafer, and under the drive of the driving assembly, the second wafer is respectively sent to the second rough polishing disk, the second fine polishing disk and the cleaning and drying device.

[0016] In an optional embodiment, the drive assembly includes a displacement drive member, a drive screw, a drive sleeve and a cross bar. The displacement drive member is arranged on the hanger and is transmission-connected to the drive screw for driving the drive screw to rotate. The drive sleeve is threadedly mounted on the drive screw and can move along the drive screw. The cross bar is connected to the drive sleeve. The first polishing head and the second polishing head are both connected to the cross bar and are respectively located on both sides of the drive sleeve. Slide blocks are provided at both ends of the cross bar, and the hanger is provided with slide rails. The sliders are slidably arranged on the slide rails.

[0017] In an optional embodiment, the first polishing head includes a first telescopic drive member, a first base body, a first rotating drive member and a first adsorption head body, one end of the first telescopic drive member is connected to the cross bar, and the other end is connected to the first base body, used to drive the first base body to rise or fall, the first rotating drive member is arranged on the first base body and connected to the first adsorption head body, used to drive the first adsorption head body to rotate, and the first adsorption head body is used to adsorb the first wafer.

[0018] In an optional embodiment, the cleaning and drying device includes a cleaning box, a cleaning platform, a lifting assembly and a lifting assembly. The cleaning box is filled with cleaning liquid and is provided with a hinged seat on one side of the bottom. The cleaning platform is arranged in the cleaning box, and one end of the cleaning platform is rotatably connected to the hinged seat, and the other end is provided with multiple chip placement positions, and the multiple chip placement positions are used to place multiple chips. The lifting assembly is transmission-connected to one end of the cleaning platform away from the hinged seat, and is used to drive the cleaning platform to rotate relative to the hinged seat to lift the chip placement position. The lifting assembly is at least partially arranged on the cleaning platform, and is used to drive the chip on the chip placement position to separate from the cleaning liquid for drying.

[0019] In an optional embodiment, a vacuum adsorption plate is provided on each of the chip placement positions, and the vacuum adsorption plate is used to adsorb the chip. The lifting assembly includes a lifting drive component, which is hinged to the bottom side of the cleaning platform and corresponds to the vacuum adsorption plate, and is used to lift the cleaning platform to a preset inclination angle.

[0020] In an optional embodiment, the lifting assembly includes a lifting drive, a guide block and a first suction block. The lifting drive is arranged on one end of the cleaning platform close to the hinged seat. The guide block is slidably arranged on the cleaning platform and is connected to the lifting drive. The guide block is used to slide along the cleaning platform under the drive of the lifting drive. The first suction block is connected to the guide block for adsorbing one side edge of the chip and moving the chip obliquely upward along the cleaning platform under the drive of the guide block.

[0021] In an optional embodiment, the lifting assembly further includes a second suction block and an auxiliary drive member. A support frame is further provided on the side of the cleaning box away from the hinged seat. The auxiliary drive member is provided on the support frame. The second suction block is connected to the auxiliary drive member for adsorbing the chip away from one side edge of the hinged seat and moving the chip obliquely upward along the cleaning platform under the drive of the auxiliary drive member.

[0022] The beneficial effects of the embodiments of the present invention are:

[0023] The polishing, cleaning and drying all-in-one machine provided by the embodiment of the present invention is respectively provided with a plurality of rough polishing discs and a plurality of fine polishing discs, and a plurality of polishing heads are used to form a plurality of polishing production lines. Each polishing production line is adsorbed by the corresponding polishing head to perform rough polishing and fine polishing on the corresponding wafer, and finally sent to the cleaning and drying device for cleaning and drying. Among them, the driving mechanism can realize the synchronous movement of the plurality of polishing heads, thereby realizing multi-line polishing, which greatly improves the polishing efficiency. Moreover, since the driving mechanism is used to drive the movement of the polishing head, the polishing head can move between the polishing station and the cleaning and drying station, so that polishing and cleaning and drying can be integrated in one process, and the degree of integration is higher. Compared with the prior art, the polishing, cleaning and drying all-in-one machine provided by the embodiment of the present invention can realize multi-line polishing with high polishing efficiency, and can realize the integration of polishing, cleaning and drying at the same time, thereby simplifying the manufacturing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 A schematic structural diagram of a polishing, cleaning, and drying machine provided in an embodiment of the present invention;

[0026] Figure 2 for Figure 1 Schematic diagram of the structure of the medium-coarse polishing device and the fine polishing device;

[0027] Figure 3 for Figure 1 Front view of the middle polishing drive;

[0028] Figure 4 for Figure 1 A top view of the polishing drive unit;

[0029] Figure 5 for Figure 4A schematic structural diagram of the first polishing head;

[0030] Figure 6 for Figure 1 Schematic diagram of the structure of the cleaning and drying device.

[0031] Icons: 100-Polishing, cleaning and drying machine; 110-Rough polishing device; 111-First rough polishing disc; 112-Second rough polishing disc; 113-First drainage pipe; 114-Rough polishing recovery barrel; 115-First delivery pump; 116-First circulation pipe; 120-Fine polishing device; 121-First fine polishing disc; 122-Second fine polishing disc; 123-Second drainage pipe; 124-Fine polishing recovery barrel; 125-Second delivery pump; 126-Second circulation pipe; 130-Cleaning and drying device; 131-Cleaning box; 132-Cleaning platform; 133-Hinged seat; 134-Vacuum adsorption plate; 135-Lift Lifting assembly; 136-support frame; 140-polishing drive device; 150-drive mechanism; 151-hanging bracket; 152-drive assembly; 153-displacement drive member; 154-drive screw; 155-drive sleeve; 156-cross bar; 157-slider; 158-slide rail; 160-first polishing head; 161-first telescopic drive member; 162-first seat; 163-first rotation drive member; 164-first adsorption head body; 170-second polishing head; 180-lifting assembly; 181-lifting drive member; 182-guide block; 183-first suction block; 184-second suction block; 185-auxiliary drive member. DETAILED DESCRIPTION

[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0033] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.

[0034] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0035] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, or is the orientation or position relationship in which the product of the invention is usually placed when in use. It is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be understood as a limitation on the present invention.

[0036] In addition, the terms "first", "second", etc., if used, are merely used to distinguish and describe, and should not be understood as indicating or implying relative importance.

[0037] As disclosed in the background art, the CMP polishing machine in the prior art usually uses a single polishing head to adsorb the wafer on the polishing pad for polishing, and adopts a single-line process, that is, only one wafer can be polished at a time. This single-line polishing method is inefficient. Furthermore, there is a multi-piece polishing technology in the prior art, that is, multi-piece ceramic disc polishing, which uses the same polishing pad to polish multiple wafers. However, this polishing method is difficult to match the disc, and the thickness difference of the polished wafers needs to be within 3μm, which has poor applicability and is not flexible. In addition, the conventional multi-piece ceramic polishing solution has limited polishing quality and high fragmentation cost. If a piece of debris is found, the entire disc will be scrapped, or if there is a problem with the polishing pad / polishing liquid, the entire batch of wafers will have problems, resulting in huge losses. At the same time, the conventional multi-piece ceramic polishing solution is difficult to control the temperature due to the simultaneous polishing of multiple wafers, and orange peel phenomenon is prone to occur during polishing.

[0038] Furthermore, in existing polishing equipment, since the polishing head usually uses a robotic arm to achieve displacement, and the displacement distance of the robotic arm is limited, the polishing action and the cleaning and drying action cannot be completed in one process. Therefore, conventional polishing equipment is usually independent of the cleaning and drying equipment, and the overall integration is poor. The polished wafers need to be temporarily stored and then transported back to the cleaning and drying equipment, which makes it impossible to achieve the integration of polishing, cleaning and drying. The process is complicated and inefficient. In addition, the existing polishing discs use a single disc structure, or multiple polishing discs are on the same horizontal plane, so it is difficult to recycle the polishing liquid, resulting in waste of the polishing liquid. Finally, the existing cleaning and drying equipment usually uses a robotic arm to place or grab the wafer, and when the wafer is immersed in the cleaning liquid, it will cause difficulty in grabbing, and it is difficult to quickly and safely remove the wafer for drying.

[0039] In order to solve the above problems, the embodiments of the present invention provide a novel polishing, cleaning and drying machine. It should be noted that the features in the embodiments of the present invention can be combined with each other if there is no conflict.

[0040] The purpose of the present invention is to provide a polishing, cleaning and drying all-in-one machine, which can realize multi-line polishing with high polishing efficiency, and can realize the integration of polishing, cleaning and drying at the same time, thereby simplifying the manufacturing process.

[0041] See also Figure 1 and Figure 2 The polishing, cleaning and drying all-in-one machine 100 provided by the embodiment of the present invention includes a rough polishing device 110, a fine polishing device 120, a cleaning and drying device 130 and a polishing drive device 140. The rough polishing device 110 includes a plurality of coarse polishing discs distributed in sequence, and the coarse polishing discs are used to perform rough polishing on the wafer; the fine polishing device 120 includes a plurality of fine polishing discs distributed in sequence, and the plurality of fine polishing discs are correspondingly arranged at the rear side of the plurality of coarse polishing discs, and the fine polishing discs are used to perform fine polishing on the wafer; the cleaning and drying device 130 is arranged at the rear side of the fine polishing device 120, and the cleaning and drying device 130 is used to clean and dry the wafers; the polishing drive device 140 includes a driving mechanism 150 and multiple polishing heads, and the driving mechanism 150 is connected to the multiple polishing heads for synchronously driving the multiple polishing heads to move synchronously; wherein, the multiple polishing heads are used to respectively adsorb multiple wafers, and under the drive of the driving mechanism 150, the multiple wafers are placed on multiple rough polishing disks for rough polishing and then placed on multiple fine polishing disks for fine polishing. The multiple polishing heads are also used to send the multiple wafers after fine polishing into the cleaning and drying device 130 under the drive of the driving mechanism 150.

[0042] In this embodiment, the multiple rough polishing discs include a first rough polishing disc 111 and a second rough polishing disc 112, the horizontal height of the first rough polishing disc 111 is greater than the horizontal height of the second rough polishing disc 112, and a first drainage pipe 113 is further provided between the first rough polishing disc 111 and the second rough polishing disc 112, the first drainage pipe 113 is used to send the polishing liquid after polishing the first rough polishing disc 111 into the second rough polishing disc 112; the multiple fine polishing discs include a second fine polishing disc 122 and a second fine polishing disc 122, the horizontal height of the first fine polishing disc 121 is greater than the horizontal height of the second fine polishing disc 122, and a second drainage pipe 123 is further provided between the first fine polishing disc 121 and the second fine polishing disc 122, the second drainage pipe 123 is used to send the polishing liquid after polishing the second fine polishing disc 122 into the second fine polishing disc 122.

[0043] It should be noted that the first rough polishing disc 111 and the second rough polishing disc 112 are arranged on the first machine platform, and the first fine polishing disc 121 and the second fine polishing disc 122 are arranged on the second machine platform. The first rough polishing disc 111 and the first fine polishing disc 121 are arranged in a corresponding manner along the front-to-back direction, and the first fine polishing disc 121 is located behind the first rough polishing disc 111. The second rough polishing disc 112 and the second fine polishing disc 122 are arranged in a corresponding manner along the front-to-back direction, and the second fine polishing disc 122 is located behind the second rough polishing disc 112. By providing the first drainage pipe 113 and the second drainage pipe 123, the rough polishing liquid and the fine polishing liquid can be recycled and reused, avoiding waste of polishing liquid.

[0044] Furthermore, the rough polishing device 110 further includes a rough polishing recovery barrel 114, which is disposed below the second rough polishing disk 112 and is used to collect the polishing liquid after polishing by the second rough polishing disk 112. The rough polishing recovery barrel 114 is further provided with a first filter port, which is provided with a first delivery pump 115 and is connected to a first circulation pipe 116. The first circulation pipe 116 is connected to the first rough polishing disk 111 and is used to circulate the filtered polishing liquid to the first rough polishing disk 111. The fine polishing device 120 further includes a fine polishing recovery barrel 124, which is disposed below the second fine polishing disk and is used to collect the polishing liquid after polishing by the second fine polishing disk 122. The fine polishing recovery barrel 124 is further provided with a second filter port, which is provided with a second delivery pump 125 and is connected to a second circulation pipe 126. The second circulation pipe 126 is connected to the second rough polishing disk 112 and is used to circulate the filtered polishing liquid to the second rough polishing disk 112.

[0045] It is worth noting that in this embodiment, the rough polishing recovery barrel 114 is arranged on the first machine and is located below the second rough polishing disc 112. The waste liquid generated after polishing the second rough polishing disc 112 is sent to the rough polishing recovery barrel 114 by the first drainage pipe 113. A filtering structure is provided at the first filter port, which can filter the waste liquid and re-pump it to the first rough polishing disc 111 for secondary use. Similarly, the fine polishing recovery barrel 124 is arranged on the second machine and is located below the second fine polishing disc 122. The waste liquid generated after polishing the second fine polishing disc 122 is sent to the fine polishing recovery barrel 124 by the second drainage pipe 123. Similarly, a filtering structure is provided at the second filter port, which can filter the waste liquid and re-pump it to the first fine polishing disc 121 for secondary use. The repeated use of the rough polishing liquid and the fine polishing liquid is realized.

[0046] See also Figures 3 to 5In some embodiments, the driving mechanism 150 includes a hanger 151 and a driving assembly 152. The hanger 151 extends from above the rough polishing device 110 to above the cleaning and drying device 130. The driving assembly 152 is set on the hanger 151. The multiple polishing heads include a first polishing head 160 and a second polishing head 170. The driving assembly 152 is simultaneously connected to the first polishing head 160 and the second polishing head 170. The first polishing head 160 is used to absorb the first wafer and, driven by the driving assembly 152, send the first wafer to the first rough polishing disk 111, the first fine polishing disk 121 and the cleaning and drying device 130 respectively. The second polishing head 170 is used to absorb the second wafer and, driven by the driving assembly 152, send the second wafer to the second rough polishing disk 112, the second fine polishing disk 122 and the cleaning and drying device 130 respectively. Specifically, the hanger 151 can be set on the top side of the external frame, so as to ensure that the hanger 151 is set above the rough polishing device 110, the fine polishing device 120 and the cleaning and drying device 130, making it convenient for the driving component 152 to drive the first polishing head 160 and the second polishing head 170 to move between the rough polishing device 110, the fine polishing device 120 and the cleaning and drying device 130.

[0047] It should be noted that the first polishing head 160 and the second polishing head 170 can realize two polishing, cleaning and drying production lines. Specifically, the first polishing head 160 and the second polishing head 170 respectively absorb the first and second wafers. At the same time, the first polishing head 160 and the second polishing head 170 are driven by the drive assembly 152 to move to the rough polishing device 110, the fine polishing device 120, and the cleaning and drying device 130 in sequence. Driven by the first polishing head 160, the first wafer is first pressed onto the first rough polishing disk 111 for rough polishing, then pressed onto the first fine polishing disk 121 for fine polishing, and finally, driven by the first polishing head 160, it is sent to the cleaning and drying device 130 for cleaning and drying. Simultaneously, the second wafer is pressed onto the second rough polishing disk 112, the second fine polishing disk 122, and the cleaning and drying device 130 in sequence.

[0048] It should be further explained that, in this embodiment, the first polishing head 160 and the second polishing head 170 are synchronous motion structures, and the first polishing head 160 and the second polishing head 170 have a vacuum wafer adsorption function to facilitate fixing the first wafer and the second wafer.

[0049] In some embodiments, the drive assembly 152 includes a displacement drive member 153, a drive screw 154, a drive sleeve 155 and a cross bar 156. The displacement drive member 153 is arranged on the hanger 151 and is transmission-connected to the drive screw 154 for driving the drive screw 154 to rotate. The drive sleeve 155 is threadedly sleeved on the drive screw 154 and can move along the drive screw 154. The cross bar 156 is connected to the drive sleeve 155. The first polishing head 160 and the second polishing head 170 are both connected to the cross bar 156 and are respectively located on both sides of the drive sleeve 155. Sliders 157 are provided at both ends of the cross bar 156. The hanger 151 is provided with a slide rail 158. The slider 157 is slidably set on the slide rail 158. Specifically, the two ends of the driving screw rod 154 can be connected to the hanger 151 through bearings. The slide rails 158 are parallel to the driving screw rod 154 and extend in the front-to-back direction. There are two slide rails 158, and the two slide rails 158 are respectively on both sides of the driving screw rod 154. The two sliders 157 are slidably set on the slide rails 158. Through the setting of the sliders 157 and the slide rails 158, the stability and reliability of the movement process of the first polishing head 160 and the second polishing head 170 can be guaranteed.

[0050] Furthermore, the displacement drive member 153 can be a drive motor, which can drive the drive screw 154 to rotate, and the drive sleeve 155 is provided with an internal thread. The rotation of the drive screw 154 can drive the drive sleeve 155 to move in the forward and backward directions, thereby enabling the first polishing head 160 and the second polishing head 170 on the cross bar 156 to move forward and backward synchronously.

[0051] In some embodiments, the first polishing head 160 includes a first telescopic drive member 161, a first base 162, a first rotary drive member 163, and a first suction head body 164. One end of the first telescopic drive member 161 is connected to the crossbar 156, and the other end is connected to the first base 162, and is used to drive the first base 162 to rise or fall. The first rotary drive member 163 is disposed on the first base 162 and connected to the first suction head body 164, and is used to drive the first suction head body 164 to rotate. The first suction head body 164 is used to absorb the first wafer. Specifically, the first telescopic drive member 161 can be a telescopic cylinder, and the first rotary drive member 163 can be a drive motor. The drive motor can drive the first suction head body 164 to rotate, thereby driving the first wafer to rotate on the first rough polishing plate 111 or the first fine polishing plate 121 to achieve polishing. The first telescopic drive member 161 can drive the first base 162 and the first suction head body 164 to move up and down, thereby ensuring that the first wafer can be pressed onto the first rough polishing plate 111 or the first fine polishing plate 121.

[0052] Specifically, the structure of the second polishing head 170 is consistent with that of the first polishing head 160 and will not be described in detail here. Specifically, the second polishing head 170 includes a second telescopic drive member, a second base, a second rotation drive member, and a second adsorption head body. One end of the second telescopic drive member is connected to the crossbar 156, and the other end is connected to the second base body, which is used to drive the second base body to rise or fall. The second rotation drive member is provided on the second base body and is connected to the second adsorption head body, which is used to drive the second adsorption head body to rotate. The second adsorption head body is used to adsorb the second wafer.

[0053] It should be noted that both the first adsorption head body 164 and the second adsorption head body have a vacuum adsorption function, which can stably achieve adsorption of the wafer.

[0054] It is worth noting that during polishing, the first adsorption head body 164 and the second adsorption head body can be used to adsorb the first wafer and the second wafer respectively. Then, the first telescopic drive member 161 and the second telescopic drive member are retracted upward, and the displacement drive member 153 is used to move the crossbar 156 and the first polishing head 160 body and the second polishing head 170 body below it to the rough polishing device 110. The first telescopic drive member 161 and the second telescopic drive member are expanded downward, driving the first polishing head 160 body and the second polishing head 170 body to move toward the first rough polishing disk 111 and the second rough polishing disk 112 respectively. At this time, the expanded extension length of the second telescopic drive member is greater than that of the first telescopic drive member 161, so that the first wafer and the second wafer can be pressed onto the first rough polishing disk 111 and the second rough polishing disk 112 respectively to complete the rough polishing. After the rough polishing is completed, the first telescopic drive member 161 and the second telescopic drive member are reset and again moved to the fine polishing device 120 under the drive of the displacement drive member 153. The above action is repeated, so that the first wafer and the second wafer can be pressed onto the first fine polishing disk 121 and the second fine polishing disk 122 to complete the fine polishing. Finally, it is sent to the cleaning and drying device 130.

[0055] See also Figure 6In some embodiments, the cleaning and drying apparatus 130 includes a cleaning box 131, a cleaning platform 132, a lifting assembly 135, and a lifting assembly 180. The cleaning box 131 is filled with cleaning liquid and has a hinged seat 133 disposed on one side of the bottom. The cleaning platform 132 is disposed within the cleaning box 131, and one end of the cleaning platform 132 is rotatably connected to the hinged seat 133. The other end is provided with multiple wafer placement positions for accommodating multiple wafers. The lifting assembly 135 is transmission-connected to the end of the cleaning platform 132 away from the hinged seat 133, and is used to drive the cleaning platform 132 to rotate relative to the hinged seat 133 to elevate the wafer placement positions. The lifting assembly 180 is at least partially disposed on the cleaning platform 132 and is used to drive the wafers on the wafer placement positions out of the cleaning liquid for drying. Specifically, the cleaning platform 132 is flat and has two wafer placement positions, one for accommodating a first wafer and the other for accommodating a second wafer. During actual placement, the first adsorption head body 164 and the second adsorption head body can be used to place the first chip and the second chip in the chip placement position and then release the adsorption, so that the first chip and the second chip can be placed in the chip placement position for cleaning.

[0056] It should be noted that the bottom of the cleaning chamber 131 is also equipped with a bubbling and ultrasonic device, which uses bubbling and ultrasonic cleaning methods in conjunction with rinsing with the cleaning fluid to clean the first and second wafers. After cleaning is completed, the cleaning platform 132 is raised using the lifting assembly 135, and the wafers are removed from the cleaning fluid using the lifting assembly 180 for drying. Preferably, the lifting assembly 135 can raise the cleaning platform 132 to a position with a 30° inclination from the horizontal, facilitating subsequent removal of the wafers.

[0057] Furthermore, a vacuum adsorption plate 134 is provided on each wafer placement position, and the vacuum adsorption plate 134 is used to adsorb the wafer. The lifting assembly 135 includes a lifting drive member, which is hinged to the bottom side of the cleaning platform 132 and corresponds to the vacuum adsorption plate 134, and is used to lift the cleaning platform 132 to a preset tilt angle. Specifically, the lifting drive member can be a cylinder or a servo motor, which can lift the cleaning platform 132 to a tilt, and the tilt angle can be adjusted, preferably 30°. The vacuum adsorption plate 134 can vacuum adsorb and fix the first wafer or the second wafer placed down, thereby avoiding displacement of the wafer during cleaning and lifting. When the lifting assembly 180 removes the wafer, the vacuum adsorption plate 134 can also be desorbed for easy removal. The setting position of the lifting drive member corresponds to the vacuum adsorption plate 134, which can accurately lift the vacuum adsorption plate 134 upward and make the cleaning platform 132 tilted.

[0058] The lifting assembly 180 includes a lifting drive 181, a guide block 182, a first suction block 183, a second suction block 184, and an auxiliary drive 185. The lifting drive 181 is disposed on one end of the cleaning platform 132 near the hinge seat 133. The guide block 182 is slidably disposed on the cleaning platform 132 and is connected to the lifting drive 181. The guide block 182 is configured to slide along the cleaning platform 132 under the drive of the lifting drive 181. The first suction block 183 is connected to the guide block 182 and is configured to attract a side edge of the wafer and, driven by the guide block 182, move the wafer upwardly and obliquely along the cleaning platform 132. A support frame 136 is also provided on the side of the cleaning box 131 away from the hinge seat 133. The auxiliary drive 185 is disposed on the support frame 136. The second suction block 184 is connected to the auxiliary drive 185 and is configured to attract a side edge of the wafer away from the hinge seat 133 and, driven by the auxiliary drive 185, move the wafer upwardly and obliquely along the cleaning platform 132. The lifting drive member 181 and the auxiliary drive member 185 can both adopt cylinders and can realize the pushing of the wafer.

[0059] It should be noted that two lifting assemblies 180 are provided, one for lifting the first wafer and the other for lifting the second wafer. This embodiment of the present invention utilizes a structure in which the articulated seat 133 is rotatably connected to the cleaning platform 132, allowing the cleaning platform 132 to be lifted only by the lifting drive until it is tilted. This reduces the lifting height, avoids the conventional process of requiring a long-stroke lifting cylinder, and reduces the stroke requirement of the lifting drive, thus saving space.

[0060] After the actual cleaning is completed, the lifting drive first raises the cleaning platform 132. The cleaning platform 132 drives the vacuum suction cup to rotate and lift around the hinge seat 133 until the cleaning platform 132 tilts 30 degrees and stops lifting. At this time, the lifting drive 181 first drives the guide block 182 and the first suction block 183 to move upward along the surface of the cleaning platform 132, so that the first suction block 183 can just contact the bottom edge of the wafer and absorb the wafer. The vacuum suction table is then released. At this time, the lifting drive 181 continues to lift, thereby sending the wafer from the vacuum suction table obliquely upward out of the liquid surface of the cleaning solution. After the wafer is released from the liquid surface, the auxiliary drive 185 drives the second suction block 184 to move downward obliquely and just contact the top edge of the wafer and absorb the wafer. At this time, the first suction block 183 is released. The auxiliary drive 185 resets and drives the second suction block 184 to continue moving upward, allowing the wafer to completely escape the liquid surface for drying.

[0061] It should be noted that the top side of the support frame 136 is also provided with a gas inlet, which can be fed with isopropyl alcohol (IPA) and N2 for drying. During drying, the Marangoni effect is utilized to pull liquid from areas of low surface tension (IPA) to areas of high surface tension (cleaning liquid). Liquid on the wafer surface is then pulled toward the water surface below, achieving a drying effect. N2 is used to assist in drying. At the same time, the IPA drying process can also remove particles adsorbed on the wafer surface, further improving the cleaning effect.

[0062] In summary, the polishing, cleaning and drying all-in-one machine 100 provided by the embodiment of the present invention is configured to correspond to a plurality of rough polishing discs and a plurality of fine polishing discs, and a plurality of polishing heads are used to form a plurality of polishing production lines. Each polishing production line is adsorbed by the corresponding polishing head to perform rough polishing and fine polishing on the corresponding wafer, and finally sent to the cleaning and drying device 130 for cleaning and drying. Among them, the driving mechanism 150 can realize the synchronous movement of multiple polishing heads, thereby realizing multi-line polishing, which greatly improves the polishing efficiency. Moreover, since the driving mechanism 150 is used to drive the movement of the polishing head, the polishing head can move between the polishing station and the cleaning and drying station, so that polishing and cleaning and drying can be integrated in one process, and the degree of integration is higher. It can realize multi-line polishing with high polishing efficiency, and can realize the integration of polishing, cleaning and drying at the same time, simplifying the manufacturing process. In addition, the embodiment of the present invention can realize the recycling of polishing liquid, save raw materials and reduce costs. And the cleaning and drying effects are better.

[0063] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A polishing, cleaning and drying all-in-one machine, characterized in that: include: A rough polishing device (110), the rough polishing device (110) comprising a plurality of sequentially distributed rough polishing discs, the rough polishing discs being used to perform rough polishing on the wafer; A fine polishing device (120), the fine polishing device (120) comprising a plurality of fine polishing discs distributed in sequence, the plurality of fine polishing discs being correspondingly arranged on the rear sides of the plurality of rough polishing discs, the fine polishing discs being used to achieve fine polishing of the wafer; A cleaning and drying device (130), the cleaning and drying device (130) is arranged on the rear side of the fine polishing device (120), and the cleaning and drying device (130) is used to clean and dry the wafer; A polishing drive device (140), the polishing drive device (140) comprising a drive mechanism (150) and a plurality of polishing heads, the drive mechanism (150) being connected to the plurality of polishing heads and being used to synchronously drive the plurality of polishing heads to move synchronously; The plurality of polishing heads are used to respectively absorb the plurality of wafers, and under the drive of the driving mechanism (150), the plurality of wafers are placed on the plurality of rough polishing discs for rough polishing and then placed on the plurality of fine polishing discs for fine polishing. The plurality of polishing heads are also used to send the plurality of finely polished wafers into the cleaning and drying device (130) under the drive of the driving mechanism (150); The cleaning and drying device (130) includes a cleaning box (131), a cleaning platform (132), a lifting assembly (135) and a lifting assembly (180), wherein the cleaning box (131) is filled with cleaning liquid and is provided with a hinge seat (133) on one side of the bottom, the cleaning platform (132) is provided in the cleaning box (131), and one end of the cleaning platform (132) is rotatably connected to the hinge seat (133), and the other end is provided with a plurality of wafer placement positions, and the plurality of wafer placement positions are used to place a plurality of wafers, the lifting assembly (135) is transmission-connected to one end of the cleaning platform (132) away from the hinge seat (133), and is used to drive the cleaning platform (132) to rotate relative to the hinge seat (133) to lift the wafer placement position and lift the cleaning platform (132) to a position with an inclination angle of 30° with respect to the horizontal direction, and the lifting assembly (180) is at least partially provided on the cleaning platform (132) and is used to drive the wafers on the wafer placement position to separate from the cleaning liquid for drying; The lifting assembly (180) includes a lifting drive member (181), a guide block (182), a first suction block (183), a second suction block (184) and an auxiliary driving member (185). The lifting drive member (181) is arranged on one end of the cleaning platform (132) close to the hinge seat (133). The guide block (182) is slidably arranged on the cleaning platform (132) and connected to the lifting drive member (181). The guide block (182) is used to slide along the cleaning platform (132) under the drive of the lifting drive member (181). The first suction block (183) and the guide block (182) is connected to the guide block (182) for adsorbing one side edge of the wafer and moving the wafer obliquely upward along the cleaning platform (132) driven by the guide block (182); a support frame (136) is further provided on the side of the cleaning box (131) away from the hinge seat (133), an auxiliary driving member (185) is provided on the support frame (136), and a second suction block (184) is connected to the auxiliary driving member (185) for adsorbing one side edge of the wafer away from the hinge seat (133) and moving the wafer obliquely upward along the cleaning platform (132) driven by the auxiliary driving member (185).

2. The polishing, cleaning and drying all-in-one machine according to claim 1, characterized in that: The plurality of rough polishing discs include a first rough polishing disc (111) and a second rough polishing disc (112), wherein the horizontal height of the first rough polishing disc (111) is greater than the horizontal height of the second rough polishing disc (112), and a first drainage pipe (113) is provided between the first rough polishing disc (111) and the second rough polishing disc (112), and the first drainage pipe (113) is used to deliver polishing liquid after polishing the first rough polishing disc (111) to the second rough polishing disc (112); The plurality of fine polishing discs include a first fine polishing disc (121) and a second fine polishing disc (122), wherein the horizontal height of the first fine polishing disc (121) is greater than the horizontal height of the second fine polishing disc (122), and a second liquid drainage pipe (123) is further provided between the first fine polishing disc (121) and the second fine polishing disc (122), and the second liquid drainage pipe (123) is used to deliver the polishing liquid after polishing the second fine polishing disc (122) into the second fine polishing disc (122).

3. The polishing, cleaning and drying all-in-one machine according to claim 2, characterized in that: The rough polishing device (110) further includes a rough polishing recovery barrel (114), which is arranged below the second rough polishing disc (112) and is used to collect polishing liquid after polishing by the second rough polishing disc (112), and a first filter port is also provided on the rough polishing recovery barrel (114), the first filter port is provided with a first delivery pump (115), and is connected to a first circulation pipe (116), which is connected to the first rough polishing disc (111) and is used to circulate the filtered polishing liquid to the first rough polishing disc (111); The fine polishing device (120) further includes a fine polishing recovery barrel (124), which is arranged below the second fine polishing disc (122) and is used to collect the polishing liquid after polishing by the second fine polishing disc (122), and a second filter port is also provided on the fine polishing recovery barrel (124), the second filter port is provided with a second delivery pump (125), and is connected to a second circulation pipe (126), which is connected to the first fine polishing disc (121) and is used to circulate the filtered polishing liquid to the first fine polishing disc (121).

4. The polishing, cleaning and drying all-in-one machine according to claim 2, characterized in that: The driving mechanism (150) includes a hanger (151) and a driving assembly (152). The hanger (151) extends from above the rough polishing device (110) to above the cleaning and drying device (130). The driving assembly (152) is arranged on the hanger (151). The multiple polishing heads include a first polishing head (160) and a second polishing head (170). The driving assembly (152) is simultaneously connected to the first polishing head (160) and the second polishing head (170). The first polishing head (160) is used to absorb the first wafer and, driven by the driving assembly (152), respectively deliver the first wafer to the first rough polishing disk (111), the first fine polishing disk (121) and the cleaning and drying device (130). The second polishing head (170) is used to absorb the second wafer and, driven by the driving assembly (152), respectively deliver the second wafer to the second rough polishing disk (112), the second fine polishing disk (122) and the cleaning and drying device (130).

5. The polishing, cleaning and drying all-in-one machine according to claim 4, characterized in that: The driving assembly (152) includes a displacement driving member (153), a driving screw (154), a driving sleeve (155) and a cross bar (156). The displacement driving member (153) is arranged on the hanger (151) and is in transmission connection with the driving screw (154) for driving the driving screw (154) to rotate. The driving sleeve (155) is threadedly sleeved on the driving screw (154) and can move along the driving screw (154). The cross bar (156) is connected to the driving sleeve (155). The first polishing head (160) and the second polishing head (170) are both connected to the cross bar (156) and are respectively located on both sides of the driving sleeve (155). Slide blocks (157) are provided at both ends of the cross bar (156). The hanger (151) is provided with a slide rail (158). The slide block (157) is slidably provided on the slide rail (158).

6. The polishing, cleaning and drying all-in-one machine according to claim 5, characterized in that: The first polishing head (160) includes a first telescopic driving member (161), a first base (162), a first rotating driving member (163) and a first adsorption head body (164). One end of the first telescopic driving member (161) is connected to the cross bar (156), and the other end is connected to the first base (162), and is used to drive the first base (162) to rise or fall. The first rotating driving member (163) is arranged on the first base (162) and is connected to the first adsorption head body (164), and is used to drive the first adsorption head body (164) to rotate. The first adsorption head body (164) is used to adsorb the first wafer.

7. The polishing, cleaning and drying all-in-one machine according to claim 1, characterized in that: A vacuum adsorption plate (134) is provided on each wafer placement position, and the vacuum adsorption plate (134) is used to adsorb the wafer. The lifting assembly (135) includes a lifting drive member, which is hinged to the bottom side of the cleaning platform (132) and corresponds to the vacuum adsorption plate (134) and is used to lift the cleaning platform (132) to a preset tilt angle.

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