Component for communication device

Abstract

The purpose of the present invention is to provide a member for a communication device, which has moderate surface smoothness, excellent antenna performance, and excellent antenna performance even at high temperatures or in wet conditions. The present invention provides a member for a communication device, the member comprising a resin molded body comprising a thermoplastic resin composition containing a polyphenylene ether resin and an LDS additive, and a conductive molded body provided with a conductive part formed on the surface of the resin molded body, the thermoplastic resin composition has a Vickers softening temperature and a water absorption rate within a predetermined range, and the conductive portion has a surface roughness Sa within a predetermined range.

Description

Technical Field

[0001] The present invention relates to components for communication devices. Specifically, the present invention relates to a component for a communication device composed of a conductive molded body, the conductive molded body including a resin molded body composed of a thermoplastic resin composition containing a laser direct structuring additive, and a conductive portion formed on the surface of the resin molded body. Background Art

[0002] In recent years, with the lightening and miniaturization of mobile communication devices such as mobile phones, the demand for lightening and miniaturization of each component used in communication devices such as dielectric antennas has also been increasing. Therefore, a manufacturing method for an antenna capable of three-dimensional design in a smartphone, wireless earphone, personal computer, etc. has been sought.

[0003] As one of the technologies for forming such a three-dimensional antenna, laser direct structuring (LDS) has attracted attention. Regarding the LDS technology, for example, as shown in Figure 1 (a) to Figure 1 (d), it is the following technology: irradiating the surface of a molded product composed of an LDS thermoplastic resin composition containing an LDS additive with a laser ( Figure 1 (a)), activating only the irradiated portion with the laser ( Figure 1 (b)), applying a metal to the activated portion ( Figure 1 (c)), and thereby forming a conductive portion (such as a plating layer) ( Figure 1 (d)). The feature of this technology is that it can directly manufacture a metal structure such as an antenna on the surface of a resin substrate without using an adhesive or the like, and can achieve miniaturization of components.

[0004] Here, Figure 2 is a schematic diagram for explaining the process of installing a circuit using the LDS technology. After designing a circuit ( Figure 2 (a)), a resin molded body is prepared ( Figure 2 (b)), a laser is irradiated along the shape of the designed circuit ( Figure 2 (c)), and then plating is performed, thereby obtaining a metal structure having a desired shape ( Figure 2 (d)).

[0005] For example, such LDS technology is disclosed in Patent Documents 1 to 3 and the like. LDS is one of the three-dimensional molded circuit component (3D-MID) technologies. As examples of the components used, examples of antennas for smartphones, antennas for wearable devices, and antennas for automotive applications are disclosed in Non-Patent Document 1. In addition, photographs of examples of antennas are disclosed in Non-Patent Document 2.

[0006] Prior Art Documents

[0007] Patent Documents

[0008] Patent Document 1: Japanese Patent Application Laid-Open No. 2000-503817

[0009] Patent Document 2: Japanese Patent Application Laid-Open No. 2004-534408

[0010] Patent Document 3: Pamphlet of International Publication WO2009 / 141800

[0011] Non-Patent Document

[0012] Non-Patent Document 1: Hiroyuki Uekami, MID Manufacturing Surface Technology by LPKF-LDS (Registered Trademark) Process, 2020, Vol. 71, No. 4, P. 268-272

[0013] Non-Patent Document 2: Toshiki Niino, MID: What the Metal-Resin Composite Aims at, Journal of the Institute of Electronics Packaging, 2017, Vol. 20, No. 6, P. 268-272 Summary of the Invention

[0014] Problems to be Solved by the Invention

[0015] In recent years, for the above-mentioned components for communication devices composed of a thermoplastic resin composition for LDS, it has been required to exhibit antenna characteristics in a high-frequency band of 1 GHz or higher, and thus a low dielectric property has been required. In addition, in recent years, with the popularization of 5th generation (5G) communication, communication base stations and smart devices capable of performing 5G communication have been needed. As communication speeds have increased, the heat generated by base stations and smart devices has increased day by day. Therefore, as antenna components, it has been required to exhibit these characteristics even in high-temperature or humid environments while maintaining the above various characteristics.

[0016] Therefore, an object of the present invention is to provide a component for a communication device, which is a component in which a thermoplastic resin for LDS is surface-processed with a laser and then plated to form a circuit, and which maintains excellent antenna performance even at high temperatures and in humid conditions.

[0017] Means for Solving the Problems

[0018] The inventors of the present invention conducted in-depth research to solve the above problems and found that by making the thermoplastic resin composition constituting the component for a communication device contain polyphenylene ether and adjusting the surface roughness of the conductive portion to an appropriate range, the component for a communication device can exhibit excellent antenna performance both at high temperatures and in humid conditions, thus achieving the present invention.

[0019] That is, the present invention is as follows.

[0020] [1] A component for a communication device, which is a component for a communication device composed of a conductive molded body. The conductive molded body includes a resin molded body made of a thermoplastic resin composition and a conductive portion formed on the surface of the resin molded body. Among them,

[0021] The above-mentioned thermoplastic resin composition contains a polyphenylene ether resin and a laser direct structuring (LDS) additive,

[0022] The above-mentioned thermoplastic resin composition has a Vickers softening temperature of 90 °C or higher and a water absorption rate of 1.5% or lower,

[0023] The above-mentioned conductive portion has a surface roughness Sa of 0.5 μm or more and 3 μm or less.

[0024] [2] The component for a communication device as described in the above [1], wherein the above-mentioned conductive portion is formed by laser direct structuring.

[0025] [3] The component for a communication device as described in the above [1] or [2], wherein the above-mentioned LDS additive contains:

[0026] (i) Copper chromate, or

[0027] (ii) A compound containing antimony and tin.

[0028] [4] The component for a communication device as described in any one of the above [1] to [3], wherein the above-mentioned thermoplastic resin composition further contains the following block copolymer and / or a hydride of the block copolymer. The block copolymer contains at least one block mainly composed of an aromatic vinyl monomer unit and at least one block mainly composed of a conjugated diene monomer unit.

[0029] [5] The component for a communication device as described in any one of the above [1] to [4], wherein the above-mentioned thermoplastic resin composition has a deflection temperature under load (DTUL) of 90 °C or higher.

[0030] [6] The component for a communication device as described in any one of the above [1] to [5], wherein the above-mentioned thermoplastic resin composition has a dielectric constant of 3.0 or lower and a dissipation factor of 0.008 or lower.

[0031] [7] The component for a communication device as described in any one of the above [1] to [6], wherein the dissipation factor after immersing the above-mentioned resin molded body in hot water at 80 °C for 144 hours is 0.03 or lower.

[0032] [8] The component for a communication device as described in any one of the above [1] to [7], which is a component for an antenna.

[0033] Effects of the invention

[0034] According to the present invention, a component for a communication device can be obtained, which can be obtained as a component in which a circuit is formed by subjecting a thermoplastic resin for LDS to surface processing with a laser and then performing plating, and the antenna performance is achieved even under high temperature and humidity conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 (a) to (d) of are diagrams for explaining the process of plating by laser direct structuring technology.

[0036] Figure 2 (a) to (e) of are diagrams for explaining the process of plating a resin molded body by laser direct structuring technology to form a circuit.

[0037] Figure 3 (a) and (b) of are diagrams for explaining the antenna used in the evaluation of the antenna performance during high-temperature molding of the examples. DETAILED DESCRIPTION OF THE INVENTION

[0038] The content of the present invention will be described in detail below.

[0039] The component for a communication device of the present embodiment is composed of a conductive molded body, and the conductive molded body includes a resin molded body composed of a thermoplastic resin composition and a conductive portion formed on the surface of the resin molded body.

[0040] [Thermoplastic resin composition, resin molded body]

[0041] The thermoplastic resin composition constituting the resin molded body includes (A) a base resin and (B) an LDS additive.

[0042] By using the thermoplastic resin composition, it is possible to easily satisfy that "the conductive portion has a surface roughness Sa of 0.5 μm or more and 3 μm or less".

[0043] [(A) Base resin]

[0044] The above-mentioned (A) base resin includes (A-a) a polyphenylene ether-based resin, and preferably further includes (A-b) a block copolymer and / or a hydride of the block copolymer, which includes at least one block mainly composed of an aromatic vinyl monomer unit and at least one block mainly composed of a conjugated diene monomer unit.

[0045] The above-mentioned (A) matrix resin refers to the resin component in the thermoplastic resin composition other than inorganic fillers, etc. It should be noted that the following (B) LDS additive is not included therein. As this resin component, it contains at least (A-a) polyphenylene ether resin, and in addition, various resins used for molding purposes can be further included, such as polyester resins, polyamide resins, polycarbonate resins, vinyl resins, olefin resins, acrylic resins, polyphenylene sulfide, aromatic resins, etc.

[0046] · (A-a) polyphenylene ether resin

[0047] As the above-mentioned (A-a) polyphenylene ether resin (hereinafter sometimes simply referred to as "the above-mentioned (A-a) component"), for example, a polyphenylene ether homopolymer formed of a repeating unit structure represented by the following formula (1) and a polyphenylene ether copolymer having a repeating unit structure represented by the following formula (1) can be cited.

[0048] [Chemical formula 1]

[0049]

[0050] In the above formula (1), R 1 , R 2 , R 3 and R 4 are each independently a monovalent group selected from the group consisting of a hydrogen atom, a halogen atom, a primary alkyl group having 1 to 7 carbon atoms, a secondary alkyl group having 1 to 7 carbon atoms, a phenyl group, a haloalkyl group, an aminoalkyl group, a hydrocarbonoxy group, and a haloalkoxy group in which at least 2 carbon atoms separate a halogen atom from an oxygen atom. Here, as the "halogen (atom)", fluorine (atom), chlorine (atom), bromine (atom), iodine (atom), etc. can be cited. "Haloalkyl group" refers to a group in which one or more hydrogen atoms in an alkyl group are replaced by a halogen atom. When there are a plurality of halogen atoms to be replaced, the halogen atoms can be one kind of atom or two or more kinds of atoms.

[0051] Specific examples of the (A-a) component include polyphenylene ether homopolymers such as poly(2,6-dimethyl-1,4-phenylene ether), poly(2-methyl-6-ethyl-1,4-phenylene ether), poly(2-methyl-6-phenyl-1,4-phenylene ether), poly(2,6-dichloro-1,4-phenylene ether). In addition, as specific examples of the (A-a) component, copolymers of 2,6-dimethylphenol and other phenols (for example, the copolymer of 2,6-dimethylphenol and 2,3,6-trimethylphenol, the copolymer of 2,6-dimethylphenol and 2-methyl-6-butylphenol described in Japanese Patent Publication No. 52-17880) can also be used.

[0052] Among these, as a particularly preferred component (A-a), it is poly(2,6-dimethyl-1,4-phenylene ether), a copolymer of 2,6-dimethylphenol and 2,3,6-trimethylphenol, or a mixture thereof.

[0053] It should be noted that the above component (A-a) can be used alone or in combination of two or more.

[0054] Regarding the manufacturing method of the above polyphenylene ether resin (A-a), there is no particular limitation as long as it is obtained by a known method. For example, it can be produced by oxidative polymerization of 2,6-xylenol using a complex of cuprous salt and amine as a catalyst, such as the method described in U.S. Patent No. 3306874, U.S. Patent No. 3306875, U.S. Patent No. 3257357, and U.S. Patent No. 3257358, the manufacturing methods described in Japanese Patent Laid-Open No. 50-51197, Japanese Patent Publication No. 52-17880, and Japanese Patent Publication No. 63-152628, etc.

[0055] The preferred range of the reduced viscosity (0.5 g / dL chloroform solution, 30 °C, measured using an Ubbelohde viscometer) of the above polyphenylene ether resin (A-a) is 0.30 dL / g or more, more preferably 0.35 dL / g or more, most preferably 0.38 dL / g or more, and 0.80 dL / g or less, more preferably 0.75 dL / g or less, most preferably 0.55 dL / g or less. If the reduced viscosity of the above polyphenylene ether resin (A-a) is within the above range, properties such as impact resistance and heat resistance are excellent.

[0056] In the above polyphenylene ether resin (A-a), blends obtained by blending two or more polyphenylene ethers with different reduced viscosities can also be preferably used.

[0057] In addition, for the stabilization of the above polyphenylene ether resin (A-a), various known stabilizers can also be appropriately used. Examples of stabilizers are metal-based stabilizers such as zinc oxide and zinc sulfide, organic stabilizers such as hindered phenol-based stabilizers, phosphorus-based stabilizers, and hindered amine-based stabilizers.

[0058] The preferred blending amount of these stabilizers is less than 5 parts by mass relative to 100 parts by mass of the above polyphenylene ether resin (A-a).

[0059] In addition, known additives that can be added to the polyphenylene ether resin (A-a) can also be added in an amount less than 10 parts by mass relative to 100 parts by mass of the polyphenylene ether resin (A-a).

[0060] The above (A-a) component may be a modified polyphenylene ether obtained by reacting the above polyphenylene ether homopolymer and / or the above polyphenylene ether copolymer with a styrene monomer or its derivative and / or an α,β-unsaturated carboxylic acid or its derivative.

[0061] Here, as the grafting amount or addition amount of the above styrene monomer or its derivative and / or α,β-unsaturated carboxylic acid or its derivative, it is preferably 0.01 to 10% by mass relative to 100% by mass of the above (A-a) component.

[0062] As a method for producing the above modified polyphenylene ether, for example, a method of reacting in a molten state, a solution state, or a slurry state at a temperature of 80 to 350 °C in the presence or absence of a radical initiator can be cited.

[0063] As the above polyphenylene ether, a mixture of any ratio of the above polyphenylene ether homopolymer and / or the above polyphenylene ether copolymer and the above modified polyphenylene ether can also be used.

[0064] From the aspect of balancing heat resistance with low dielectric constant and low dissipation factor, the content of the above (A-a) polyphenylene ether resin is preferably 30 parts by mass or more, preferably 40 parts by mass or more, and more preferably 50 parts by mass or more relative to 100 parts by mass of the above (A) matrix resin. In addition, from the aspect of moldability, the above content is preferably 95 parts by mass or less.

[0065] · (A-b) A block copolymer containing at least one block mainly composed of aromatic vinyl monomer units and at least one block mainly composed of conjugated diene monomer units and / or a hydrogenated product of the block copolymer

[0066] In the present embodiment, the above (A) matrix resin may further contain (A-b) a block copolymer containing at least one block mainly composed of aromatic vinyl monomer units (hereinafter sometimes simply referred to as "aromatic vinyl polymer block") and at least one block mainly composed of conjugated diene monomer units (hereinafter sometimes simply referred to as "conjugated diene polymer block") and / or a hydrogenated product of the block copolymer (hereinafter sometimes simply referred to as "(A-b) component"), and preferably contains the (A-b) component.

[0067] It should be noted that regarding the above aromatic vinyl polymer block, "mainly composed of aromatic vinyl monomer units" means that 50% by mass or more of the block is aromatic vinyl monomer units. More preferably, the aromatic vinyl monomer units are 70% by mass or more, further preferably 80% by mass or more, and most preferably 90% by mass or more.

[0068] In addition, with respect to the above-mentioned conjugated diene polymer block being "mainly composed of conjugated diene monomer units", it also means that the conjugated diene monomer units account for 50% by mass or more. More preferably, the conjugated diene monomer units account for 70% by mass or more, further preferably 80% by mass or more, and most preferably 90% by mass or more.

[0069] In addition, the above-mentioned aromatic vinyl polymer block can be, for example, a copolymer block in which a small amount of conjugated diene compounds are randomly bonded in the aromatic vinyl polymer block. Similarly, in the case of the above-mentioned conjugated diene polymer block, it can be, for example, a copolymer block in which a small amount of aromatic vinyl compounds are randomly bonded in the conjugated diene polymer block.

[0070] The aromatic vinyl compound used for forming the aromatic vinyl monomer unit is not particularly limited. For example, styrene, α-methylstyrene, vinyltoluene, etc. can be cited, and one or more compounds selected from them can be used. Among them, styrene is particularly preferred.

[0071] The conjugated diene compound used for forming the conjugated diene polymer block is not particularly limited. For example, butadiene, isoprene, piperylene, 1,3-pentadiene, etc. can be cited, and one or more compounds selected from them can be used. Among them, butadiene, isoprene, and their combination are preferred.

[0072] In the microstructure of the conjugated diene polymer block portion of the above-mentioned block copolymer, the 1,2-vinyl content or the total amount of the 1,2-vinyl content and the 3,4-vinyl content (total vinyl bonding amount) is preferably 5 to 80%, more preferably 10 to 70%.

[0073] It should be noted that the total vinyl bonding amount can be measured using an infrared spectrophotometer.

[0074] In the production of the above-mentioned hydride (hydrogenated block copolymer) of the block copolymer, the non-hydrogenated block copolymer used is preferably a block copolymer in which the aromatic vinyl polymer block (A) and the conjugated diene polymer block (B) have a bonding form selected from A-B type, A-B-A type, and A-B-A-B type. Among these, block copolymers having different bonding forms can also be used in combination.

[0075] Among these, those having a bonding form selected from A-B-A type and A-B-A-B type are more preferred, and those having an A-B-A type bonding form are further preferred.

[0076] In addition, the (A-b) component used in the present embodiment is preferably a partially hydrogenated block copolymer (partially hydrogenated block copolymer).

[0077] The above-mentioned partially hydrogenated block copolymer refers to a copolymer in which the aliphatic double bonds of the conjugated diene polymer block are controlled in a range greater than 0% and less than 100% by subjecting the above-mentioned non-hydrogenated block copolymer to a hydrogenation treatment. The preferred hydrogenation rate of the partially hydrogenated block copolymer is 50% or more and less than 100%, more preferably 80% or more and less than 100%, and most preferably 98% or more and less than 100%.

[0078] In addition, the number average molecular weight of the above-mentioned component (A-b) is preferably 30,000 or more and less than 300,000. When the number average molecular weight of the component (A-b) is within this range, a thermoplastic resin composition excellent in fluidity, impact strength, and flame retardancy can be obtained.

[0079] The evaluation method of the number average molecular weight of the component (A-b) in the thermoplastic resin composition is as follows.

[0080] That is, a solvent (such as chloroform) that shows good solubility in the component (A-b) and poor solubility in the (A-a) polyphenylene ether resin is used to extract the component (A-b) from the thermoplastic resin composition. Using a gel permeation chromatography measuring device [GPC SYSTEM21: manufactured by Showa Denko KK], the extracted component (A-b) is measured using an ultraviolet spectrophotometric detector [UV-41: manufactured by Showa Denko KK], and the number average molecular weight is calculated by conversion to standard polystyrene.

[0081] It should be noted that the measurement conditions can be as follows [solvent: chloroform, temperature: 40 °C, column: sample side (K-G, K-800RL, K-800R), reference side (K-805L × 2 pieces), flow rate 10 mL / minute, measurement wavelength: 254 nm, pressure 15 - 17 kg / cm 2 )].

[0082] In addition, when measuring the number average molecular weight, low molecular weight components may be detected due to the inactivation of the catalyst during polymerization. In this case, the low molecular weight components are not included in the molecular weight calculation. The low molecular weight components refer to components with a molecular weight of 3000 or less. Usually, the correctly calculated molecular weight distribution (weight average molecular weight / number average molecular weight) is in the range of 1.0 - 1.1.

[0083] Among these block copolymers that can be used as the component (A-b) in the present embodiment, as long as the purpose of the present embodiment is not violated, various substances such as substances with different bonding forms, substances with different types of aromatic vinyl compounds, substances with different types of conjugated diene compounds, substances with different 1,2-vinyl contents or different 1,2-vinyl and 3,4-vinyl contents, substances with different aromatic vinyl compound component contents, substances with different hydrogenation rates, etc. can also be used in combination of two or more.

[0084] In addition, these block copolymers that can be used as the component (A-b) in the present embodiment may also be block copolymers that have been modified in whole or in part.

[0085] The block copolymer modified as mentioned herein refers to a block copolymer modified with at least one modifying compound having at least one carbon-carbon double bond or triple bond, and at least one carboxyl group, acid anhydride group, amino group, hydroxyl group or glycidyl group in the molecular structure.

[0086] As a method for producing the modified block copolymer, there can be mentioned a method of melt-kneading and reacting with the modifying compound in a temperature range above the softening point temperature and below 250 °C of the block copolymer in the presence or absence of a radical initiator; (2) a method of reacting the block copolymer with the modifying compound in a solution at a temperature below the softening point of the block copolymer; (3) a method of reacting the block copolymer with the modifying compound in a non-molten state at a temperature below the softening point of the block copolymer; etc. Any of these methods can be used, and the method (1) is preferred, and further, in (1), the method carried out in the presence of a radical initiator is most preferred.

[0087] As the "at least one modifying compound having at least one carbon-carbon double bond or triple bond, and at least one acid group, acid anhydride group, amino group, hydroxyl group or glycidyl group in the molecular structure" mentioned herein, the same substances as those used in the modified polyphenylene ether can be used.

[0088] In addition, when the above-mentioned (A-a) polyphenylene ether resin is 100 parts by mass, the content of the above-mentioned (A-b) component is preferably 1 to 40 parts by mass, more preferably 2 to 35 parts by mass, and still more preferably 2 to 30 parts by mass.

[0089] In addition, with respect to 100 parts by mass of the above-mentioned (A) base resin, the total content of the above-mentioned (A-a) polyphenylene ether resin and the above-mentioned (A-b) component is preferably 30 parts by mass or more, more preferably 35 parts by mass or more. By making the total content of the above-mentioned (A-a) component and the above-mentioned (A-b) component within the above range, heat resistance, low dielectric constant, and low dissipation factor can be balanced, and the following (B) LDS additive can be in any dispersion form.

[0090] · (A-c) Polystyrene resin

[0091] The above-mentioned (A) base resin may further contain (A-c) polystyrene resin. Examples of the polystyrene resin include atactic polystyrene, rubber-reinforced polystyrene (high impact polystyrene, HIPS), styrene-acrylonitrile copolymer (SAN) with a styrene content of 50% by weight or more, and ABS resin obtained by rubber-reinforcing the styrene-acrylonitrile copolymer. Among these, atactic polystyrene and / or high impact polystyrene are preferably included.

[0092] It should be noted that the above-mentioned polystyrene resin may be used alone or in combination of two or more.

[0093] In the present embodiment, when the above-mentioned (A-a) polyphenylene ether resin is set to 100 parts by mass, the preferred content of the (A-c) polystyrene resin is 0 to 100 parts by mass, more preferably 0 to 90 parts by mass, and further preferably 0 to 80 parts by mass.

[0094] · Other resin components

[0095] Examples of other resin components in the (A) base resin of the present embodiment include polyesters, polyolefins such as polypropylene, polyamides, polyphenylene sulfide, and olefin-based thermoplastic elastomers.

[0096] Examples of the above-mentioned olefin-based thermoplastic elastomers include polyolefin homopolymers such as polyethylene and polypropylene; polyolefin copolymers such as ethylene-propylene copolymer, ethylene-butene copolymer, and ethylene-octene copolymer. In particular, as the polyethylene homopolymer, low-density polyethylene (LDPE) by high-pressure method, linear low-density polyethylene (LLDPE), high-density polyethylene (HDPE), etc. can be mentioned.

[0097] Regarding the specific preferred addition amounts of various other resin components, when the thermoplastic resin composition as a whole is set to 100% by mass, they are each 15% by mass or less, more preferably 13% by mass or less, and further preferably 10% by mass or less.

[0098] In addition, as the preferred addition amount of the overall other resin components, when the total thermoplastic resin composition is set to 100% by mass, it is preferably 30% by mass or less, more preferably 25% by mass or less, and still more preferably 20% by mass or less.

[0099] Especially from the aspect of achieving a low dielectric loss tangent and a low dielectric constant, with respect to 100 parts by mass of the (A) matrix resin, the total content of polyamide and polyphenylene sulfide is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, still more preferably 1 part by mass or less, and may also be 0 part by mass.

[0100] In addition, the above thermoplastic resin composition can use virgin materials or recycled materials. The types of recycled materials can be either PCR materials or PIR materials, and can be either material recycled materials or chemical recycled materials.

[0101] ((B) LDS additive)

[0102] In the thermoplastic resin composition of the resin molded body constituting the communication device component of the present embodiment, in addition to the above (A) matrix resin, it further contains (B) laser direct structuring (LDS) additive.

[0103] By including the above (B) LDS additive, a plating layer can be formed on the surface of the obtained resin molded product by LDS technology, and a conductive portion can be formed on the surface. At this time, the lower the dielectric constant and the dielectric loss tangent of the thermoplastic resin composition having a conductive portion formed on the surface, the better the characteristics as an antenna, and thus it is preferred.

[0104] In addition, in practical applications, plating deposition properties for forming a conductive portion and adhesion of the deposited plating layer are required. To meet these requirements, appropriate thermoplastic resins and LDS additives need to be selected.

[0105] It should be noted that the above LDS technology is the following technology: A resin molded body composed of a thermoplastic resin composition is irradiated with a laser, and then the resin molded body is plated, and a plating layer is selectively formed only on the laser irradiation portion on the surface of the resin molded body to obtain a conductive molded body. In the above LDS technology, for example, a laser such as a pulsed laser of near-infrared light with a wavelength of 1064 nm is irradiated onto the resin molded body composed of a thermoplastic resin composition under appropriate conditions such as an output power of 7 W, a frequency of 50 kHz, and a speed of 2000 mm / s. As the subsequent plating process, it can be carried out by immersion in an electroless plating bath to selectively form a plating layer only on the laser irradiation portion.

[0106] The above-mentioned (B) LDS additive refers to the following compound: By adding a specific amount (about 3 to 15 parts by mass relative to 100 parts by mass of the entire thermoplastic resin composition) of this compound, a conductive portion can be formed on the surface of the resin molded body by the above-mentioned LDS technique.

[0107] In the above-mentioned (B) LDS additive, from the aspect of improving plating properties, it preferably contains at least one of copper, antimony, tin, aluminum, and zinc, more preferably contains copper chromate and / or a compound containing antimony and tin (preferably an oxide), and further preferably contains an oxide containing at least antimony and tin.

[0108] More specifically, an embodiment of the above-mentioned (B) LDS additive is an oxide containing at least one of antimony and phosphorus and tin, preferably an oxide containing antimony and tin. This is because, compared with the above-mentioned copper chromate compound, the compound containing antimony and tin is easier to control the dispersion, so stable values of dielectric constant and dielectric loss tangent can be obtained.

[0109] In addition, the above-mentioned oxide containing antimony and tin is more preferably an oxide in which the content of tin is more than the content of antimony, and further preferably an oxide in which the amount of tin is 80% by mass or more relative to the total amount of tin and antimony.

[0110] More specifically, as the above-mentioned (B) LDS additive, tin oxide doped with antimony, tin oxide doped with antimony oxide, tin oxide doped with phosphorus, and tin oxide doped with phosphorus oxide can be cited, preferably tin oxide doped with antimony and tin oxide doped with antimony oxide, and more preferably tin oxide doped with antimony oxide.

[0111] The above-mentioned (B) LDS additive can be a synthetic product or a commercially available product. In addition, among commercially available products, as long as the conditions of the LDS additive in this embodiment can be satisfied, it can also be a substance sold for other uses.

[0112] It should be noted that the above-mentioned (B) LDS additive can be used alone or in combination of two or more.

[0113] In the above-mentioned (B) LDS additive, in addition to antimony and tin, trace amounts of other metals can also be contained. As other metals, copper, chromium, lead, indium, iron, cobalt, nickel, zinc, cadmium, silver, bismuth, arsenic, manganese, magnesium, and calcium can be exemplified. These metals can exist in the form of oxides.

[0114] Among them, the content of metal oxides other than antimony and tin is preferably 30% by mass or less, and in particular, copper chromate is preferably less than 5 parts by mass (excluding 5 parts by mass or more) relative to 100 parts by mass of the above-mentioned thermoplastic resin composition.

[0115] In addition, regarding the content of the above-mentioned (B) LDS additive in the above-mentioned thermoplastic resin composition, relative to 100 parts by mass of the total above-mentioned thermoplastic resin, it is preferably 1.0 part by mass or more, more preferably 2.0 parts by mass or more, further preferably 3.0 parts by mass or more, still more preferably 5.0 parts by mass or more, and even more preferably 6.0 parts by mass or more. By making the content of the above-mentioned (B) LDS additive 1.0 part by mass or more, there is a tendency for the plating property to be further improved. In addition, regarding the content of the above-mentioned (B) LDS additive in the above-mentioned thermoplastic resin composition, relative to 100 parts by mass of the above-mentioned thermoplastic resin, it is preferably 30.0 parts by mass or less, more preferably 25.0 parts by mass or less, further preferably 20.0 parts by mass or less, still more preferably 15.0 parts by mass or less, and even further preferably 12.0 parts by mass or less. By making the content of the above-mentioned (B) LDS additive 30.0 parts by mass or less, the resin composition has a tendency to more prominently exhibit a low dielectric constant and a low dissipation factor.

[0116] It should be noted that in the above-mentioned thermoplastic resin composition, the above-mentioned (B) LDS additive may contain only 1 type or may contain 2 or more types. In the case of containing 2 or more types, the total amount is preferably within the above-mentioned range.

[0117] ((F) Flame retardant)

[0118] The above-mentioned thermoplastic resin composition may further contain an (F) flame retardant.

[0119] Examples of the (F) flame retardant include: inorganic flame retardants such as magnesium hydroxide and aluminum hydroxide; nitrogen-containing cyclic compounds such as melamine, cyanuric acid, and their salts; organic phosphates such as triphenyl phosphate, triphenyl phosphate hydroxide, bisphenol A bis(diphenyl phosphate), and their derivatives; phosphorus-containing nitrogen compounds such as ammonium polyphosphate and melamine polyphosphate; phosphazene compounds described in Japanese Patent Laid-Open No. 11-181429; boric acid compounds such as zinc borate; silicone oils; red phosphorus; hypophosphites described in International Publication No. 2007 / 055147; mixtures thereof; and the like. Among them, nitrogen-containing cyclic compounds, organic phosphates, phosphorus-containing nitrogen compounds, phosphazene compounds, boric acid compounds, silicone oils, and hypophosphites are preferred, and bisphenol A bis(diphenyl phosphate) and its derivatives, hypophosphites, and mixtures thereof are more preferred.

[0120] Regarding the phosphate ester as the above-mentioned (F) flame retardant, there are substances represented by the following formula (I) or (II).

[0121] [Chemical formula 2]

[0122]

[0123] In the above formulae, Q1, Q2, Q3, and Q4 represent an alkyl group having 1 to 6 carbon atoms or hydrogen, and R1, R2, R3, and R4 represent a methyl group or hydrogen. n represents an integer of 1 or more, n1 and n2 represent integers of 0 to 2, and m1, m2, m3, and m4 represent integers of 1 to 3.

[0124] It should be noted that, compared with the condensed phosphate represented by formula (I), the dipole moment of the condensed phosphate represented by formula (II) is reduced, and thus the dielectric properties are excellent.

[0125] Among them, from the aspect of the dipole moment, a preferred condensed phosphate is a substance containing 50% or more of the following phosphate, wherein in the phosphate, Q1, Q2, Q3, and Q4 in formula (II) are hydrogen or methyl; R1 is hydrogen; and the range of n is 1 to 3, particularly n is 1.

[0126] It should be noted that the above flame retardants are usually commercially available products. For example, trade names such as CR-741, CR-747, CR733S, and PX-200 of Daihachi Chemical Industry Co., Ltd. can be cited.

[0127] The above hypophosphites include at least one selected from the group consisting of hypophosphites represented by the following formula (1), diphosphites represented by the following formula (2), and their condensates.

[0128] [Chemical formula 3]

[0129]

[0130] In the above formula (1), R 11 and R 12 are each independently a linear or branched alkyl group having 1 to 6 carbon atoms, an aryl group, or a phenyl group; M 1 is at least one selected from the group consisting of calcium ion, magnesium ion, aluminum ion, zinc ion, bismuth ion, manganese ion, sodium ion, potassium ion, and a protonated nitrogenous base; a is an integer of 1 to 3; m is an integer of 1 to 3; and a = m.

[0131] [Chemical formula 4]

[0132]

[0133] In the above formula (2), R 21 and R 22 are each independently a linear or branched alkyl group having 1 to 6 carbon atoms, an aryl group, or a phenyl group; R 23 is a linear or branched alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 10 carbon atoms, an alkarylene group having 6 to 10 carbon atoms, or an arylalkylene group having 6 to 10 carbon atoms; M 2is at least one selected from the group consisting of calcium ions, magnesium ions, aluminum ions, zinc ions, bismuth ions, manganese ions, sodium ions, potassium ions, and protonated nitrogenous bases; b is an integer from 1 to 3; j is 1 or 2; n is an integer from 1 to 3; b·j = 2n.

[0134] In addition, as the above-mentioned (F) flame retardant, an inorganic or organic flame retardant substantially free of halogen is preferred.

[0135] In this specification, being substantially free of halogen means that the halogen concentration in the resin composition containing the (F) flame retardant is less than 2% by mass. The halogen concentration in the resin composition containing the (F) flame retardant is preferably less than 1% by mass, more preferably less than 0.5% by mass.

[0136] Relative to 100 parts by mass of the above-mentioned (A) matrix resin, the content of the above-mentioned (F) flame retardant can be in the range of 1 to 40 parts by weight. When the content of the (F) flame retardant is 1 part by mass or more, a flame retardant effect can be obtained, and when it is 40 parts by mass or less, a reduction in mechanical strength and heat resistance can be reduced.

[0137] As a method for adding the above-mentioned (F) flame retardant, for example, a method of separately blending the (F) flame retardant in the dispersed-phase resin and the continuous-phase resin in the resin composition can be cited. Specifically, a method of blending one or more flame retardants selected from the group consisting of phosphate esters, nitrogen-containing cyclic compounds, phosphorus-containing nitrogen compounds, phosphazene compounds, boric acid compounds, silicone oils, and hypophosphites into the resin forming the dispersed phase and the resin forming the continuous phase can be cited.

[0138] Among them, it is preferred to separately blend different flame retardants in the dispersed phase and the continuous phase. Specifically, it is preferred to blend one or more selected from the group consisting of phosphate esters, phosphorus-containing nitrogen compounds, phosphazene compounds, and silicone oils in the dispersed phase, and blend one or more selected from the group consisting of nitrogen-containing cyclic compounds, phosphorus-containing nitrogen compounds, boric acid compounds, and hypophosphites in the continuous phase.

[0139] (Anti-dripping agent)

[0140] In addition, the above-mentioned thermoplastic resin composition may further contain an anti-dripping agent.

[0141] As the above-mentioned anti-dripping agent, fluorine-based polymers such as tetrafluoroethylene can be cited.

[0142] It should be noted that regarding the content of the above-mentioned anti-dripping agent, when the entire thermoplastic resin composition is set to 100% by mass, it is preferably an amount such that the halogen concentration becomes less than 2% by mass. In this case, the above-mentioned anti-dripping agent also functions as a flame retardant.

[0143] (Colorant)

[0144] In addition, the above thermoplastic resin composition may further contain a colorant.

[0145] There is no particular limitation on the coloring method of the above thermoplastic resin composition, and one or more colorants selected from known organic dyes / pigments and inorganic pigments can be used.

[0146] Examples of the organic dyes / pigments include azo lake pigments, benzimidazolone pigments, diarylide pigments, condensed azo pigments and other azo-based pigments, phthalocyanine-based pigments such as phthalocyanine blue and phthalocyanine green, isoindolinone pigments, quinophthalone pigments, quinacridone pigments, perylene pigments, anthraquinone pigments, violanthrone pigments, dioxazine violet and other fused polycyclic pigments, azine-based pigments, carbon black, etc.

[0147] Among them, as carbon black, the dibutyl phthalate (DBP) absorption amount is preferably less than 250 mL / 100 g, preferably less than 150 mL / 100 g, and the nitrogen adsorption specific surface area is less than 900 m 2 / g, more preferably less than 400 m 2 / g. When they are within this range, a composition with particularly excellent coloring property, mechanical strength and flame retardancy can be obtained.

[0148] The DBP absorption value and the nitrogen adsorption specific surface area mentioned here refer to the values measured by the methods specified in ASTM D2414 and JIS K6217, respectively.

[0149] Examples of the azine-based dyes include Solvent Black 5 (C.I. 50415, CAS No. 11099-03-9), Solvent Black 7 (C.I. 50415:1, CAS No. 8005-20-5 / 101357-15-7), Acid Black 2 (C.I. 50420, CAS No. 8005-03-6 / 68510-98-5) in the Color Index.

[0150] Examples of the inorganic pigments include metal oxides other than iron oxide such as zinc oxide and chromium oxide, and composite metal oxides such as titanium yellow, cobalt blue, and ultramarine blue.

[0151] Regarding the preferred addition amount of the above colorants, when the total resin composition is 100% by mass, carbon black is 2% by mass or less, azine-based dyes are 2% by mass or less, and inorganic pigments are 8% by mass or less. Regarding the more preferred amounts, carbon black is 1% by mass or less, azine-based dyes are 1% by mass or less, and inorganic pigments are 5% by mass or less.

[0152] By adding in the above-mentioned amounts, the balance between impact resistance and mechanical properties can be well maintained. Additionally, in applications where flame retardancy is required, the above-mentioned addition amounts are preferred from the perspective of flame retardancy.

[0153] (Inorganic filler)

[0154] In the above thermoplastic resin composition, in addition to the above-mentioned components, an inorganic filler can be added at any stage as needed within the range that does not impair the effects of this embodiment.

[0155] Examples of the above inorganic filler include fibrous, granular, plate-like or needle-like inorganic reinforcing materials such as glass fiber, potassium titanate fiber, gypsum fiber, brass fiber, ceramic fiber, boron whisker fiber, mica, talc, silica, calcium carbonate, kaolin, calcined kaolin, wollastonite, xonotlite, apatite, glass beads, glass flakes, and titanium oxide. These inorganic fillers can be used in combination of two or more. Among these, as more preferred inorganic fillers, glass fiber, carbon fiber, and glass beads can be mentioned. Additionally, as the inorganic filler, materials surface-treated with a surface treatment agent such as a silane coupling agent by a known method can also be used. Among them, natural ore-based fillers usually may contain trace amounts of iron elements, so it is necessary to select materials refined to remove iron elements for use.

[0156] When the total amount of the above thermoplastic resin composition is set to 100% by mass, the specific preferred addition amounts of the above various inorganic fillers are respectively 40% by mass or less, more preferably 35% by mass or less, and further preferably 30% by mass or less.

[0157] In addition, as the preferred addition amount of the above inorganic filler as a whole, when the total amount of the above thermoplastic resin composition is set to 100% by mass, it is preferably 50% by mass or less, more preferably 40% by mass or less, and further preferably 35% by mass or less.

[0158] The inorganic filler can be a surface-treated material, and known materials can be used. Fibrous fillers and plate-like fillers are preferred.

[0159] Examples of the above fibrous filler include, but are not limited to, for example, glass fiber, carbon fiber, whiskers such as potassium titanate whiskers, and calcium silicate (wollastonite).

[0160] Examples of the above plate-like filler include, but are not limited to, for example, glass flakes, mica, and talc.

[0161] They can be used alone or in combination of two or more. From the aspects of rigidity and water resistance, among the above fillers, glass fiber is most preferred.

[0162] The surface treatment for the above inorganic filler is not particularly limited. For example, surface treatments using various coupling agents such as silane-based and titanate-based coupling agents can be cited. In particular, from the aspects of improving the adhesion between the resin and the surface-treated inorganic filler, and improving the vibration fatigue characteristics and impact resistance of the resin composition, surface treatment using silane-based coupling agents such as amino silane and epoxy silane is preferred. In addition, if it is included in a surface treatment agent containing an acid functional group, it is preferred from the aspect of water resistance.

[0163] It should be noted that the judgment of whether the above acid functional group is included can be made by determining whether a peak from an acid is detected when the surface treatment agent of the glass fiber is extracted into chloroform and measured by PyGCMS. In particular, from the aspect of water resistance, glass fibers that can detect a peak from carboxylic acid are preferably used.

[0164] Regarding the acid that constitutes the above compound containing an acid functional group, as unsaturated carboxylic acids or their derivatives, unsaturated carboxylic acids such as maleic acid, fumaric acid, itaconic acid, acrylic acid, tetrahydrophthalic acid, citraconic acid, crotonic acid, isocrotonic acid, etc. can be cited. In addition, as its derivatives, for example, acid anhydrides, acyl halides, amides, imides, esters, etc. can be cited. Specifically, maleic anhydride, acetic anhydride, succinic anhydride, monomethyl maleate, dimethyl maleate, maleimide, glycidyl maleate, etc. can be exemplified.

[0165] The silane-based coupling agent (silane coupling agent) used in the above surface treatment is not particularly limited, and 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, N-2-(aminoethyl)-3-aminopropylmethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane are preferred.

[0166] As a method for surface-treating the above inorganic filler, for example, when the inorganic filler is glass fiber, a method can be cited in which a sizing agent and a silane coupling agent are coated on the surface together when the fibrous inorganic filler is spun and bundled, and then dried. When the inorganic filler is in the form of short fibers or powder, a method can be cited in which these fillers are impregnated into a silane coupling agent solution and then dried. Here, the temperature during drying is preferably 100 °C or higher.

[0167] The above-mentioned glass fiber is a fiber obtained by melt spinning glasses such as the commonly supplied E glass (Electrical glass), C glass (Chemical glass), A glass (Alkali glass), S glass (High strength glass), D glass, R glass, and alkali-resistant glass. A preferred example of the present embodiment is E glass. In addition, in order to achieve a lower dielectric, D glass is also preferred.

[0168] In order to further reduce the dielectric properties of the resin composition, the above-mentioned inorganic fiber is preferably an inorganic fiber with a low dielectric, and more preferably a glass fiber with a low dielectric. The inorganic fiber with a low dielectric refers to an inorganic fiber with a low dielectric constant and a low tangent of the dielectric loss angle. For example, an inorganic fiber with a dielectric constant of 7 or less can be exemplified. The dielectric constant here is the value measured according to ASTM D 150.

[0169] As such a glass fiber with a low dielectric, for example, a glass fiber containing 65 to 85% by mass of SiO 2 , 15 to 30% by mass of B 2 O 3 , 0 to 4% by mass of sodium oxide (Na 2 O) and / or potassium oxide (K 2 O), and 0 to 4% by mass of other components (the total amount here does not exceed 100% by mass, and preferably the total is 100% by mass). Such a glass fiber with a large amount of B 2 O 3 is known as a glass fiber with a low dielectric constant.

[0170] In the above-mentioned thermoplastic resin composition, 0.1 to 300.0 parts by mass of talc can be further included relative to 100 parts by mass of the laser direct molding additive. By including talc, dimensional stability and product appearance can be improved, and the plating growth rate can be made faster. In addition, by including talc, even if the content of the LDS additive is reduced, the plating property of the resin molded product can be made good.

[0171] Talc can be a substance surface-treated with at least one compound selected from polyorganohydrogensiloxanes and organopolysiloxanes. In this case, the attachment amount of the siloxane compound in the talc is preferably 0.1 to 5% by mass of the talc.

[0172] The number-average particle diameter of the above-mentioned talc is preferably 0.1 to 50 μm, more preferably 0.1 to 25 μm. Talc is usually scaly, and the length of the longest part is taken as the average particle diameter. Regarding the number-average particle diameter of talc, for the image obtained by observation using an electron microscope, talc whose particle diameter is to be measured is randomly extracted, the particle diameter is measured, and the number-average particle diameter is calculated based on the obtained measured values. The observation magnification is set to 1,000 times, and the number of measurements is set to 1,000 or more for the measurement.

[0173] It should be noted that in the above-mentioned thermoplastic resin composition, talc may contain only one kind or may contain two or more kinds.

[0174] In the component for a communication device of the present embodiment, in most cases, a material with a low dielectric constant is preferably used, but in order to achieve miniaturization, control of the dielectric constant is required, and sometimes a material with a high dielectric constant is required. In such a case, by adding an inorganic filler with a high dielectric constant, the dielectric constant can be controlled.

[0175] For example, titanium oxide, calcium carbonate, etc. can be cited as examples. Even when a high dielectric constant is required, it is preferable to maintain a low dielectric loss tangent, and a material that increases the dielectric loss tangent due to water absorption, etc. will deteriorate the performance as an antenna.

[0176] (Other components)

[0177] It should be noted that in the above-mentioned thermoplastic resin composition, in addition to the above components, plasticizers (low molecular weight polyolefins, polyethylene glycols, fatty acid esters, etc.), antistatic agents, nucleating agents, fluidity improvers, reinforcing agents, various peroxides, spreading agents, copper-based heat stabilizers, organic heat stabilizers represented by hindered phenol-based antioxidants against oxidation deterioration, antioxidants, ultraviolet absorbers, light stabilizers, lubricants such as ethylene bisstearamide, and modifying materials such as maleic anhydride can be included as other additive components.

[0178] Regarding the specific preferred addition amounts of various other components, when the above-mentioned thermoplastic resin composition as a whole is set to 100% by mass, they are respectively 15% by mass or less, more preferably 13% by mass or less, and further preferably 10% by mass or less.

[0179] In addition, regarding the preferred addition amount of other components as a whole, when the above-mentioned thermoplastic resin composition as a whole is set to 100% by mass, it is preferably 30% by mass or less, more preferably 25% by mass or less, and further preferably 20% by mass or less.

[0180] (Manufacturing method of the thermoplastic resin composition)

[0181] The above-mentioned thermoplastic resin composition can be produced by melt-kneading the above-mentioned components (A) constituting the matrix resin, (B) the LDS additive, and, if necessary, a colorant, an inorganic filler, and other components.

[0182] Examples of the melt-kneading machine for melt-kneading include, but are not limited to, for example, a single-screw extruder, a multi-screw extruder including a twin-screw extruder, a heating and melt-kneading machine based on a roll, a kneader, a Brabender plastograph, a Banbury mixer, etc. Particularly from the aspect of kneadability, a twin-screw extruder is preferred. Specifically, examples include the ZSK series manufactured by WERNER&PFLEIDERER, the TEM series manufactured by TOSHIBA MACHINE CO., LTD, and the TEX series manufactured by Japan Steel Works, Ltd.

[0183] Regarding the melt-kneading temperature at this time, in the case of a crystalline resin, a temperature at which heating and melting are carried out above the melting point temperature of the crystalline resin and processing can be smoothly carried out can be selected. In the case of an amorphous resin, a temperature at which heating and melting are carried out above its glass transition temperature and processing can be smoothly carried out can be selected. Generally, it can be arbitrarily selected from 200 to 370°C. It is particularly preferred to carry out processing at a processing temperature of 260°C or higher. By achieving a viscosity of a certain level or higher, the inter-particle distance can be controlled.

[0184] The following describes a preferred production method using an extruder.

[0185] The L / D (effective barrel length / barrel inner diameter) of the above-mentioned extruder is preferably 20 or more and 60 or less, more preferably 30 or more and 50 or less.

[0186] The configuration of the above-mentioned extruder is not particularly limited. For example, it is preferred to provide a first raw material supply port on the upstream side with respect to the flow direction of the raw material, a first vacuum exhaust port downstream of the first raw material supply port, a second raw material supply port downstream of the first vacuum exhaust port (if necessary, a third and a fourth raw material supply port can be further provided downstream of the second raw material supply port), and further a second vacuum exhaust port downstream of the second raw material supply port. In the case of using a liquid addition pump, from the aspect of showing flame retardancy, it is further preferred to have a liquid addition pump downstream of the second raw material supply port and a second vacuum exhaust port downstream of the liquid addition pump. In addition, the method of supplying raw materials to the second, third, and fourth raw material supply ports is not particularly limited. It can be a method of simply adding from the upper opening of the raw material supply port, or a method of adding from the side opening using a forced side feeder. Particularly from the aspect of stable supply, a method of adding from the side opening using a forced side feeder is preferred.

[0187] Particularly preferably, a kneading section is provided upstream of the first vacuum exhaust port, a kneading section is provided between the first vacuum exhaust port and the second raw material supply port, and a kneading section is provided between the second to fourth raw material supply ports and the second vacuum exhaust port.

[0188] In addition, the configuration of the screw provided in the barrel is not particularly limited, and it may be a configuration in which right-handed, left-handed, orthogonal (N-type), and reverse-feed (L-type) kneading disk members are appropriately provided. Particularly, the following configuration can control the dispersion state of the (B) LDS additive within a specific range, and is therefore preferred. In this configuration, at least one orthogonal (N-type) kneading disk member and at least one reverse-feed (L-type) kneading disk member are provided between the first raw material supply port and the second raw material supply port, and at least one orthogonal (N-type) kneading disk member is provided between the liquid addition pump and the vacuum exhaust port downstream of the liquid addition pump. Particularly preferably, it includes one or more reverse screws, which can control the distance between particles. However, if there are too many reverse screws, the kneading becomes excessive, which is not preferred. The number of reverse screws is preferably 2 or more and 5 or less. The reverse screws can be in any shape such as reverse-feed or reverse-kneading, and refer to screws in the direction opposite to the feed direction.

[0189] In the case of adding a liquid raw material, it can be added by directly feeding the liquid raw material into the barrel system using a liquid addition pump or the like in the barrel portion of the extruder. The liquid addition pump is not particularly limited, and examples thereof include a gear pump and a flange pump, and a gear pump is preferred. At this time, from the aspect of reducing the load applied to the liquid addition pump and improving the operability of the raw material, it is preferred to heat the tank for storing the liquid raw material, the piping between the tank and the liquid addition pump, the piping between the pump and the extruder barrel, etc., which are parts of the flow path of the liquid raw material, to reduce the viscosity of the liquid raw material.

[0190] The method of supplying the raw materials to the second to fourth raw material supply ports is not particularly limited. Compared with simply adding and supplying from the open ports of the second to fourth raw material supply ports of the extruder, the method of supplying from the open ports on the extruder side using a forced side feeder has a tendency to supply more stably, and is therefore preferred.

[0191] Particularly, in the case where the raw material contains powder and it is desired to reduce the generation of crosslinked products or carbides due to the thermal history of the resin, the method using a forced side feeder supplied from the side of the extruder is more preferred, and it is further preferred to provide a forced side feeder at the second to fourth raw material supply ports and supply these raw material powders separately. Particularly, the (B) LDS additive is preferably provided at the second to fourth raw material supply ports, which can control the distance between particles.

[0192] In addition, in the case of adding a liquid raw material, a method of adding it to the extruder using a plunger pump, a gear pump, etc. is preferred.

[0193] Further, the upper openings of the second to fourth raw material supply ports of the extruder can also be used as openings for discharging the air conveyed together.

[0194] There are no particular limitations on the melting and kneading temperature and the screw rotation speed in the melting and kneading process of the above-mentioned thermoplastic resin composition. For crystalline resins, a temperature can be selected that is above the melting point temperature of the crystalline resin and allows for smooth processing by heating and melting. For amorphous resins, a temperature can be selected that is above the glass transition temperature of the amorphous resin and allows for smooth processing by heating and melting. Generally, a temperature can be arbitrarily selected from 200 to 370°C, and the screw rotation speed can be 100 to 1200 rpm.

[0195] As one of the specific manufacturing methods of the above-mentioned thermoplastic resin composition using a twin-screw extruder, for example, the following method can be cited: Each component constituting the component (A) and the raw material titanium dioxide are supplied to the first raw material supply port of the twin-screw extruder, the heating and melting zone is set to the melting temperature of the thermoplastic resin, and melting and kneading are performed at a screw rotation speed of 100 to 1200 rpm, preferably 200 to 500 rpm. In addition, regarding the position where each component constituting the component (A) and the raw material titanium dioxide are supplied to the twin-screw extruder, they can be supplied together from the first raw material supply port of the extruder as described above, or a second raw material supply port, a third raw material supply port, and a fourth raw material supply port can be provided to supply each component separately.

[0196] In addition, in the case of reducing the generation of crosslinked products and carbides in the resin due to the thermal history in the presence of oxygen, it is preferable to maintain the oxygen concentration in each process pipeline in the addition path of each raw material added to the extruder at less than 1.0 vol%. There are no particular limitations on the above-mentioned addition path. As a specific example, a configuration can be cited that includes a pipe, a gravimetric feeder with a holding replenishment tank, a pipe, a hopper, and a twin-screw extruder in sequence starting from a storage tank. There are no particular limitations on the method for maintaining the above-mentioned low oxygen concentration, and the method of introducing an inert gas into each process pipeline with improved airtightness is effective. Generally, it is preferable to introduce nitrogen to maintain the oxygen concentration at less than 1.0 vol%.

[0197] Regarding the manufacturing method of the above-mentioned resin composition, when the thermoplastic resin in the component (A) contains a powdery component (volume average particle size less than 10 μm), when manufacturing the above-mentioned resin composition using a twin-screw extruder, it will bring the effect of further reducing the residue at the screw of the twin-screw extruder, and further bring the effect of reducing the generation of black spot foreign matters, carbides, etc. in the resin composition obtained by the above-mentioned manufacturing method.

[0198] As a specific manufacturing method of the above thermoplastic resin composition, an extruder that controls the oxygen concentration at each raw material supply port to less than 1.0 vol% is preferably used, and any one of the following methods 1 to 2 is implemented.

[0199] 1. A manufacturing method including the following steps: a step of melt-kneading a part of the component (A) contained in the resin composition of the present embodiment (first kneading step); and a step of supplying the total amount of the (B) LDS additive to the melt-kneaded product in the molten state obtained in the first kneading step, and then performing melt-kneading (second kneading step).

[0200] 2. A manufacturing method including the following steps: a step of melt-kneading a part of the component (A) contained in the resin composition of the present embodiment (first kneading step); a step of supplying a part of the (B) LDS additive to the melt-kneaded product in the molten state obtained in the first kneading step and performing melt-kneading (second kneading step); and a step of supplying the remaining amount of the (B) LDS additive and then performing melt-kneading (third kneading step).

[0201] [Properties of the thermoplastic resin composition]

[0202] Hereinafter, the properties of the resin molded body containing the above resin composition will be described.

[0203] As the Vicat softening temperature (°C) of the thermoplastic resin composition constituting the communication equipment component of the present embodiment, a larger value indicates an improvement in heat resistance, which is preferable.

[0204] It should be noted that the above Vicat softening temperature refers to the value measured by the method described in the examples below.

[0205] The heat generation of the high-frequency antenna component increases, and the higher the frequency, the greater the heat generation, and high heat resistance is required. In particular, high heat resistance is required for antenna components with a frequency of 1 GHz or more. From this aspect, a Vicat softening temperature of 90°C or higher is required, and the Vicat softening temperature is preferably 90°C or higher, more preferably 95°C or higher. The higher the Vicat softening temperature, the more preferable. In addition, from the aspect of being able to perform melt-kneading during manufacturing, the Vicat softening temperature is preferably not too high, preferably 350°C or lower, more preferably 330°C or lower, and further preferably 315°C or lower.

[0206] It should be noted that the Vicat softening temperature is measured based on JIS K 7206, and can be measured, for example, by the method described in the examples below.

[0207] In addition, as the heat distortion temperature (DTUL) (°C) of the above-mentioned thermoplastic resin composition, a larger value indicates an improvement in heat resistance and is preferred.

[0208] It should be noted that the heat distortion temperature (DTUL) refers to the value measured by the method described in the examples below.

[0209] The heat generation of the antenna component for high frequency increases, and the greater the frequency, the greater the heat generation. Resins with high heat resistance are required.

[0210] Especially in the antenna component with a frequency of 1 GHz or more, a resin molded body composed of a resin composition having a DTUL of 90°C or more is preferred. The DTUL is more preferably 92°C or more, and further preferably 95°C or more. The higher the heat resistance, the more preferred. In addition, from the aspect of being able to perform melt-kneading during manufacturing, the DTUL is preferably not too high, preferably 370°C or less, more preferably 350°C or less, and further preferably 330°C or less.

[0211] In the component for a communication device of the present embodiment, the water absorption rate of the above-mentioned thermoplastic resin composition is 1.5% or less.

[0212] Generally, most components for communication devices such as antennas are used in an open state. In the case of high water absorption, moisture in the atmosphere will be absorbed. Usually, if water is absorbed, the dielectric constant deterioration described below will occur, and the antenna performance will be significantly reduced. From such an aspect, the water absorption rate needs to be 1.5% or less, preferably 1.0% or less, and more preferably 0.5% or less. A smaller water absorption rate is preferred.

[0213] It should be noted that the water absorption rate is measured based on JIS K 7209, and can be measured, for example, by the method described in the examples below.

[0214] When the dielectric constant of the resin molded body (thermoplastic resin composition) constituting the component for a communication device of the present embodiment is a smaller value, it indicates an improvement in antenna performance and is preferred. The dielectric constant of the resin molded body (thermoplastic resin composition) is preferably 3.0 or less, more preferably 2.9 or less, and further preferably 2.8 or less.

[0215] It should be noted that the dielectric constant refers to the value measured by the method described in the examples below.

[0216] When the dielectric loss tangent of the resin molded body composed of the above thermoplastic resin composition is a smaller value, it indicates a reduction in the energy loss rate, which is preferable. In particular, the dielectric loss tangent is a parameter with a risk of water absorption. A thermoplastic resin composition is preferably such that the dielectric loss tangent after immersion in hot water at 80°C for 144 hours, which is preferably used as an index indicating the characteristics after long-term water absorption, does not increase. The more difficult it is for the dielectric loss tangent to increase after immersion, the more it can be said that the material is not easily water-absorbed even after long-term observation. The dielectric loss tangent of the resin molded body (thermoplastic resin composition) is preferably 0.008 or less, more preferably 0.007 or less, and further preferably 0.006 or less.

[0217] It should be noted that the dielectric loss tangent refers to the value measured by the method described in the following examples.

[0218] [Molded Body, Component for Communication Equipment]

[0219] The resin molded body constituting the component for communication equipment of the present embodiment is composed of the above thermoplastic resin composition. The manufacturing method of the above resin molded body is not particularly limited, and for example, it can be manufactured by injection molding.

[0220] In addition, it can also be used in a form in which a coating layer composed of a coating material, metal, or other types of polymers is formed on the surface of the molded body manufactured by such a method.

[0221] The component for communication equipment of the present embodiment has one or a plurality of the above molded bodies. The component for communication equipment may have a structure in which a plurality of molded bodies are fitted together.

[0222] The component for communication equipment of the present embodiment has a conductive portion on the surface of the above resin molded body. The conductive portion has conductivity and can be formed by coating or plating with metal ink.

[0223] Regarding the above conductive portion, it may have one or more selected from the group consisting of a metal circuit, a metal wiring, and a metal base.

[0224] And in the component for communication equipment of the present embodiment, the above conductive portion is formed by laser direct structuring (LDS). Regarding LDS, as described above, for example, it can be carried out as Figure 1 , Figure 2 shown.

[0225] Particularly after the laser irradiation, annealing treatment is performed at 80°C for 24 hours, and then ultrasonic treatment is performed for cleaning, whereby an appropriate surface roughness can be adjusted. The surface roughness refers to the value measured by the method described in the following examples. Even if the annealing treatment is not performed and the ultrasonic cleaning time is extended, an appropriate surface roughness can be adjusted. Or an appropriate surface roughness can be adjusted by adjusting the output power of the laser.

[0226] In addition, the surface roughness can also be adjusted by increasing the thickness of the plating layer. The thicker the plating layer thickness, the smoother the surface. From the aspect of productivity, the plating layer thickness is preferably 50 μm or less, more preferably 40 μm or less, and still more preferably 30 μm or less. In addition, if the surface is too smooth, it is not easy to exhibit the adhesion between the plating layer and the resin. From this aspect, the surface roughness Sa is preferably 0.5 μm to 30 μm, more preferably 0.6 to 28 μm, and still more preferably 0.7 to 28 μm.

[0227] Thermoplastic resins are more easily adjusted in surface roughness by adjusting conditions. For example, although thermosetting resins can also adjust the surface roughness Ra of the line by adjusting conditions, it is difficult to adjust the surface roughness Sa of the surface and it is difficult to exhibit characteristics.

[0228] It should be noted that the type of the plating layer applied to the above resin molded body is not particularly limited, and any of gold, silver, and copper can be used. Furthermore, a plating layer containing a plurality of types of metals can also be used.

[0229] It should be noted that for metal inks, any metal can be used.

[0230] In addition, in the present embodiment, the antenna performance can also be exhibited at high temperatures. Antenna components are usually used in high-temperature environments, and maintaining the antenna performance at high temperatures is emphasized.

[0231] One of the features of the communication device component of the present embodiment is its high copper resistance and the ability to reduce cracking after coating and plating of the above metal ink.

[0232] In addition, there is no particular limitation on the laser used, and it can be appropriately selected from known lasers such as YAG lasers, excimer lasers, and electromagnetic wires. In addition, there is no particular limitation on the wavelength of the laser.

[0233] When the above resin molded body is irradiated with a laser, only the part irradiated with the laser is activated. In this activated state, an electroplating solution is brought into contact with the above resin molded body. The electroplating solution is not particularly limited, and a publicly known electroplating solution can be widely used. As the metal component, an electroplating solution (especially an electroless electroplating solution) containing one or more of copper, nickel, silver, gold, and palladium is preferably used, an electroplating solution (especially an electroless electroplating solution) containing one or more of copper, nickel, silver, and gold is more preferably used, and an electroplating solution containing copper (especially an electroless electroplating solution) is further preferably used. That is, in the above coating, the metal component preferably contains at least one of the above metals.

[0234] In the method for forming a component for a communication device according to the present embodiment, a coating (circuit) having a spacing of 1 mm or less, and further 150 μm or less (the lower limit is not particularly limited, for example, 30 μm or more) can be formed. In order to suppress corrosion and deterioration of the formed coating (circuit), for example, nickel and gold can be used to further protect the above coating after electroless plating. Similarly, electrolytic plating can also be used after electroless plating to form a necessary film thickness in a short time.

[0235] In addition, when a metal ink is coated on the surface of the above resin molded body, there are methods of bonding to the resin by various methods. Even in methods that require heat resistance, such as methods of bonding using a laser, as long as it is a component for a communication device according to the present embodiment, it can be used.

[0236] For example, in a component for a communication device, an inkjet method can be adopted, and a circuit pattern of a wiring board is formed by depicting with a conductive metal paste. This circuit pattern forming method can use a publicly known method (for example, refer to Japanese Patent Laid-Open No. 2002-324966).

[0237] The conductive metal paste used is a conductive metal paste in which metal ultrafine particles with a fine average particle size are uniformly dispersed in a thermosetting resin composition containing an organic solvent. The average particle size of the metal ultrafine particles with a fine average particle size is selected in the range of 1 to 100 nm, and a material in which the surface of the metal ultrafine particles is coated with one or more compounds having a group containing nitrogen, oxygen, or sulfur atoms as a group capable of coordinating and bonding with the metal element contained in the metal ultrafine particles can be appropriately used.

[0238] Among the metal ultrafine particles with a fine average particle size contained in the above conductive metal paste, particles composed of one metal selected from the group consisting of gold, silver, copper, platinum, palladium, tungsten, nickel, tantalum, bismuth, lead, indium, tin, zinc, titanium, and aluminum can be appropriately used; or particles of an alloy composed of two or more metals.

[0239] The method for forming a circuit pattern includes the following steps: a step of forming minute droplets of the conductive metal paste and ejecting and coating them onto a substrate to depict a circuit pattern composed of a coating film of the conductive metal paste; and a step of heat-treating the depicted coating film of the conductive metal paste at a temperature at which at least the thermosetting resin undergoes thermal curing.

[0240] As a depiction means based on the inkjet method, there are a thermal depiction means that generates bubbles by heating and foaming to eject droplets, and a piezoelectric depiction means that ejects droplets by using compression of a piezoelectric element.

[0241] The component for a communication device of the present embodiment can be used for various applications such as electronic components (especially components for portable electronic devices, communication base stations, and peripheral devices for personal computers) such as sensors, connectors, switches, relays, conductive circuits, and antennas.

[0242] Examples

[0243] Hereinafter, the present embodiment will be further described in detail by way of examples and comparative examples, but the present embodiment is not limited to these examples.

[0244] The raw materials used in the examples and comparative examples are as follows.

[0245] [Raw materials]

[0246] (A-a) Polyphenylene ether

[0247] (A-a-1) A polyphenylene ether resin obtained by oxidative polymerization of 2,6-dimethylphenol

[0248] It should be noted that the inherent viscosity (measured at 0.5 g / dL, chloroform solution, 30 °C) of the polyphenylene ether resin (A-a-1) is 0.52 dL / g.

[0249] (A-a-2) A polyphenylene ether resin obtained by oxidative polymerization of 2,6-dimethylphenol

[0250] It should be noted that the inherent viscosity (measured at 0.5 g / dL, chloroform solution, 30 °C) of the polyphenylene ether resin (A-a-2) is 0.40 dL / g.

[0251] (A-a-3) A polyphenylene ether resin obtained by oxidative polymerization of 2,6-dimethylphenol

[0252] The inherent viscosity (measured at 0.5 g / dL, chloroform solution, 30 °C) of the polyphenylene ether resin (A-a-3) is 0.32 dL / g.

[0253] (B) LDS additive

[0254] (B-1) Antimony-doped tin oxide (manufactured by Keeling&Walker Limited, trade name "StanoStat CP05")

[0255] (B-2) Copper chromate (manufactured by Shepherd Color, trade name "LD14")

[0256] (A-b) Block copolymer containing at least one block mainly composed of aromatic vinyl monomer units and at least one block mainly composed of conjugated diene monomer units and / or a hydrogenated product of the block copolymer

[0257] Hydrogenated block copolymer (manufactured by Asahi Kasei Corporation, trade name "Tuftec (registered trademark) H1051")

[0258] (A-c) Polystyrene resin

[0259] (A-c-1) Polystyrene (manufactured by PS Japan Corporation, trade name "GPPS685")

[0260] (A-c-2) High-impact polystyrene (manufactured by PETRO-CHEMICALS, trade name "CT-60")

[0261] (A-d) Polyamide 6,6 (hereinafter referred to as PA66)

[0262] 2400 g of an equimolar salt of adipic acid and hexamethylenediamine, 100 g of adipic acid, and 2.5 liters of pure water were charged into a 5-liter autoclave and stirred well. After the atmosphere in the autoclave was thoroughly replaced with nitrogen, the temperature was raised from room temperature to 220 °C over about 1 hour with stirring. At this time, the gauge pressure in the autoclave was 1.76 MPa under the natural pressure based on water vapor. Then, heating was continued while removing water out of the reaction system so that the pressure would not exceed 1.76 MPa. Further, after 2 hours, when the internal temperature reached 260 °C, the internal pressure was reduced to 0.2 MPa over about 40 minutes by opening and closing the autoclave valve while continuing heating. Thereafter, it was cooled to room temperature over about 8 hours. After cooling, the autoclave was opened, and about 2 kg of the polymer was taken out and pulverized.

[0263] The obtained polyamide had Mw = 38700 and Mw / Mn = 2.1. It should be noted that Mw and Mn were determined using GPC (mobile phase: hexafluoroisopropanol, standard substance: PMMA (polymethyl methacrylate)).

[0264] In addition, the terminal amino group concentration was measured according to the measurement method described in the examples of Japanese Patent Laid-Open No. 7-228689, and as a result, the terminal amino group concentration was 38 μmol / g.

[0265] (A-e) Polypropylene homopolymer with MFR = 2 g / 10 min

[0266] (A-f) Polyethylene resin

[0267] (A-f-1) High-density polyethylene resin (manufactured by Asahi Kasei Corporation, "Suntec-HD B161")

[0268] (A-f-2) High-density polyethylene resin (manufactured by Asahi Kasei Corporation, "Suntec-HD J320")

[0269] (C~E) Other components

[0270] (C) Ethylene bisstearamide: manufactured by Kao Corporation, "KAO WAX EB-G"

[0271] (D) Maleic anhydride (manufactured by NOF Corporation, "Crystal MAN")

[0272] (E) Calcium carbonate (manufactured by Takehara Chemical Industry Co., Ltd., SL-2200)

[0273] (MF) Inorganic filler

[0274] (MF-1) Glass fiber (manufactured by Nippon Electric Glass Co., Ltd., ECS03-T249)

[0275] (MF-2) Glass flake (manufactured by Nippon Sheet Glass Co., Ltd., MEG160FY M06)

[0276] (MF-3) Talc (manufactured by Matsumura Sangyo Co., Ltd., Crown Talc PK-MMB)

[0277] (FR) Flame retardant

[0278] (FR-1) Manufactured by Daihachi Chemical Industry Co., Ltd., trade name E890

[0279] (FR-2) Manufactured by Daihachi Chemical Industry Co., Ltd., trade name PX-200

[0280] [Examples 1 to 18, Comparative Examples 1 to 10]

[0281] Mixing is carried out with the compositions shown in Table 1 and Table 2, and the resin composition is manufactured using a twin-screw extruder ZSK-40 (manufactured by COPERION WERNER&PFLEIDERER, Germany). In this twin-screw extruder, a first raw material supply port is provided on the upstream side with respect to the flow direction of the raw materials, a first vacuum exhaust port is provided downstream thereof, a second raw material supply port is provided downstream thereof, a third raw material supply port is provided downstream thereof, and a second vacuum exhaust port is further provided downstream thereof. In addition, as needed, a liquid addition pump and a vacuum exhaust port are further provided downstream of the first raw material supply port, and their positions are appropriately changed as needed.

[0282] Here, four kneading sections are provided (one is provided between the first supply port and the first vacuum exhaust port, one is provided between the first vacuum exhaust port and the second supply port, one is provided between the second supply port and the third supply port, and one is provided between the third supply port and the second vacuum exhaust port). The number of reverse-feed (L-type) kneading disk members recorded in the table is arranged in these four kneading sections.

[0283] Using the extruder set as described above, each component is added using the compositions and addition methods shown in Table 1 and Table 2, and melt mixing is carried out under the conditions of an extrusion temperature of 250 to 320 °C, a screw speed of 300 rpm, and a discharge rate of 100 kg / hour to manufacture pellets.

[0284] [Evaluation method]

[0285] The resin compositions obtained in the examples and comparative examples are used for the following evaluation. The evaluation results are shown in Table 1 and Table 2.

[0286] (1)(2) Dielectric constant · Dissipation factor

[0287] The pellets of the obtained resin composition are supplied to a small injection molding machine (trade name: EC75-SXII, manufactured by TOSHIBA MACHINE Co., Ltd.) whose barrel temperature is set to 250 to 290 °C, and a flat plate of 60 mm × 60 mm × 0.9 mm is produced under the conditions of a mold temperature of 70 to 130 °C, an injection pressure of 200 MPa, an injection time of 10 seconds, and a cooling time of 20 seconds. The dielectric constant and dissipation factor at 2.5 GHz are measured under the following conditions.

[0288] Measurement frequency: 2.5 GHz

[0289] Measurement device: 10 MHz to 43.5 GHz PNA network analyzer N5224B, 10 GHz split dielectric resonator N1501AE10

[0290] Measurement environmental conditions: room temperature 23 °C, humidity 50%

[0291] (3) Dielectric loss tangent during water absorption

[0292] The pellets of the obtained resin composition were supplied to a small injection molding machine (trade name: EC75-SXII, manufactured by TOSHIBA MACHINE Co., Ltd.) with the barrel temperature set at 340 °C, and a flat plate of 60 mm × 60 mm × 0.9 mm was produced under the conditions of a mold temperature of 70 - 130 °C, an injection pressure of 200 MPa, an injection time of 20 seconds, and a cooling time of 20 seconds. After being immersed in hot water at 80 °C for 144 hours, the dielectric loss tangent at 2.5 GHz was measured under the same conditions as in (1).

[0293] (4) Heat resistance

[0294] (4-1) Vicat softening temperature

[0295] The pellets of the obtained resin composition were supplied to a small injection molding machine (trade name: EC75-SXII, manufactured by TOSHIBA MACHINE Co., Ltd.) with the barrel temperature set at 340 °C, and a flat plate of 60 mm × 60 mm × 0.9 mm was produced under the conditions of a mold temperature of 70 - 130 °C, an injection pressure of 200 MPa, an injection time of 10 seconds, and a cooling time of 20 seconds. It was cut into arbitrary sizes, and using the obtained test pieces, measurements were carried out under the conditions of a test load: 50 N, indenter tip shape: cylindrical cross-sectional area 1 mm 2 , heating rate 50 °C / hr, and number of measurements n = 2.

[0296] As an evaluation criterion, the higher the value of the Vicat softening temperature, the better the heat resistance is judged to be, and the more favorable it is in terms of material design for this application.

[0297] (4-2) Deflection temperature under load (DTUL)

[0298] The pellets of the obtained resin composition were supplied to a small injection molding machine (trade name: EC75-SXII, manufactured by TOSHIBA MACHINE Co., Ltd.) with the barrel temperature set at 250 - 350 °C, and an ISO dumbbell-shaped specimen for evaluation was produced under the conditions of a mold temperature of 70 - 130 °C, an injection pressure of 200 MPa, an injection time of 20 seconds, and a cooling time of 15 seconds. And this ISO dumbbell-shaped specimen was machined to produce a specimen for measuring the deflection temperature under load (DTUL). Using the above-mentioned specimen for measuring the deflection temperature under load, the deflection temperature: DTUL (ISO 75: 1.80 MPa load) was measured.

[0299] The larger the value, the better the heat resistance is judged to be.

[0300] (5) Surface smoothness

[0301] The pellets of the obtained resin composition were supplied to a small injection molding machine (trade name: EC75-SXII, manufactured by TOSHIBA MACHINE CO., LTD.) with the barrel temperature set at 280 to 320°C, and a flat plate of 60 mm × 60 mm × 2.0 mm was produced under the conditions of a mold temperature of 80°C, an injection pressure of 100 MPa, an injection time of 15 seconds, and a cooling time of 20 seconds. The flat plate was activated using a laser irradiator (product name "Micro Line 3D16 0", manufactured by LPKF), and then plating was applied using an electroless copper plating bath (product name "MID copper 100B1", manufactured by McDermid) under plating conditions of 57°C / 45 minutes. Whether annealing at 80°C for 24 hours was performed after laser irradiation is described in the tables of the examples and comparative examples.

[0302] Thereafter, using a 3D microscope VR-6200 (manufactured by KEYENCE CORPORATION), for the circuit part subjected to the plating treatment, at a magnification of 25 times, the shooting mode of the texture image was set to normal, the height measurement mode was set to standard, the direction of the measurement illumination was set to both sides, and the surface roughness Sa was measured.

[0303] (6) Antenna performance

[0304] The simulation of the antenna efficiency was carried out under the following conditions.

[0305] · Antenna substrate: 60 × 7 × 1 mm 3 , entire surface solid GND, pattern width 1 mm, thickness 25 μm

[0306] · Copper + Ni plating

[0307] · Main substrate: 60 × 130 × 1 mm 3 , dielectric constant 4.0, dielectric loss 0.020

[0308] Thickness 35 μm, conductivity 5.8 × 10 7 S / m

[0309] · Simulation device: MW STUDIO of CST

[0310] It was adjusted so that the reflection coefficient was 6 dB or less in the operating frequency band.

[0311] The length of the antenna element and the value of the matching circuit were adjusted, and adjusted in the manner of the best matching at 3.5 GHz, and the antenna efficiency at this time was calculated. It should be noted that the shape and size of the antenna used are as shown in Figure 3 (a) and (b) of Figure 3 (a) shows the overall antennaFigure 3 The antenna element section is shown magnified in (b).

[0312] Regarding the dielectric properties (dielectric constant and dielectric loss tangent) of the material, pellets of the obtained resin composition were supplied to a small injection molding machine (trade name: EC75-SXII, manufactured by TOSHIBA MACHINE Co., Ltd.) with a barrel temperature set at 340 °C, and a flat plate of 60 mm × 60 mm × 0.9 mm was produced under the conditions of a mold temperature of 70 to 130 °C, an injection pressure of 200 MPa, an injection time of 20 seconds, and a cooling time of 20 seconds. The dielectric loss tangent at 5 GHz was measured under the following conditions.

[0313] · Measurement frequency: 5 GHz

[0314] · Measuring device: 10 MHz to 43.5 GHz PNA network analyzer N5224B, 5.2 GHz split dielectric resonator N1501AE10

[0315] · Measurement environmental conditions: room temperature 23 °C, humidity 50%

[0316] The surface smoothness of the above material was also input to perform the simulation.

[0317] The closer the value is to 0, the more excellent it is as an antenna. Since the plating property is not considered in this simulation, it is assumed that even a difficult-to-plate material functions as an antenna to perform the simulation.

[0318] (7) Conductivity detection at high temperature

[0319] After heating the test piece obtained when measuring the (5) surface smoothness in an oven at 100 °C for 3 hours, the oven was opened, and within 60 seconds, a conductivity test was performed on the left and right of the plated circuit using a resistance measuring device (manufactured by HIOKI E.E. CORPORATION, CARD HiTESTER). A case where a resistance value is shown is considered conductive and evaluated as OK (good), and a case where it shows 0 is evaluated as NG (bad). In the case of conductivity, it is evaluated that the antenna performance can also be exhibited at high temperature.

[0320] (8) Water absorption rate

[0321] The pellets of the obtained resin composition were fed into a small injection molding machine (trade name: EC75-SXII, manufactured by TOSHIBA MACHINE CO., LTD.) with the barrel temperature set at 280 - 320°C, and a flat plate of 60 mm × 60 mm × 2.0 mm was produced under the conditions of a mold temperature of 80°C, an injection pressure of 100 MPa, an injection time of 15 seconds, and a cooling time of 20 seconds. For the molded test piece, within 3 hours, it was immersed in pure water at 23°C for 24 hours, and the weight change degree after immersion was evaluated as the water absorption rate (%). A material with a low water absorption rate can be said to be excellent.

[0322] (9) Adhesion

[0323] The pellets of the obtained resin composition were fed into a small injection molding machine (trade name: EC75-SXII, manufactured by TOSHIBA MACHINE CO., LTD.) with the barrel temperature set at 280 - 320°C, and a flat plate of 60 mm × 60 mm × 2.0 mm was produced under the conditions of a mold temperature of 80°C, an injection pressure of 100 MPa, an injection time of 15 seconds, and a cooling time of 20 seconds. The flat plate was activated using a laser irradiator (product name "Micro Line 3D16 0", manufactured by LPKF), and then plating was applied under plating conditions of 57°C / 45 minutes using an electroless copper plating bath (product name "MID copper 100B1", manufactured by McDermid). Whether plating was carried out was judged visually. Then, a thermal shock test was conducted at -30 to 80°C for 40 cycles (1 hour per temperature).

[0324] Low temperature side: -30 ± 2°C, 1 hour

[0325] High temperature side: 80, 100 ± 2°C, 1 hour

[0326] ※ Starting from the low temperature side

[0327] After that, for the completed coating, a cut groove in the shape of an X was cut out using a cutter, a cellophane tape was pasted and peeled off, and the adhesion of the coating at this time was measured. The case where the coating was peeled off after being pasted on the cellophane tape was evaluated as poor adhesion.

[0328] OK (good): The coating adheres, and the coating adhesion is good

[0329] NG (bad): Any of the following evaluation results: The coating does not adhere at all; Only a part of the coating adheres; The coating adhesion is poor

[0330]

[0331]

[0332] Industrial Applicability

[0333] The components for communication devices of the present invention can be used in various applications such as electronic components (especially components for portable electronic devices, communication base stations, and peripheral devices of personal computers) such as sensors, connectors, switches, relays, conductive circuits, and antennas. In particular, it can exhibit high characteristics as an antenna even at high temperatures and in humid conditions, and can be suitably used.

Claims

1. A communication device component, comprising a conductive molded body, the conductive molded body comprising a resin molded body composed of a thermoplastic resin composition, and a conductive portion formed on a surface of the resin molded body, wherein: The thermoplastic resin composition comprises a polyphenylene ether resin and a laser direct structuring (LDS) additive. The thermoplastic resin composition has a Vickers softening temperature of 90° C. or higher and a water absorption rate of 1.5% or lower. The conductive portion has a surface roughness Sa of 0.5 μm or more and 3 μm or less.

2. The communication device component according to claim 1, wherein: The conductive portion is formed by laser direct forming.

3. The communication device component according to claim 1 or 2, wherein: The LDS additive comprises: (i) Copper chromate, or (ii) Compounds containing antimony and tin.

4. The communication device component according to claim 1 or 2, wherein: The thermoplastic resin composition further comprises a block copolymer and / or a hydrogenated product of the block copolymer, wherein the block copolymer comprises at least one block mainly composed of an aromatic vinyl monomer unit and at least one block mainly composed of a conjugated diene monomer unit.

5. The communication device component according to claim 1 or 2, wherein: The thermoplastic resin composition has a deflection temperature under load (DTUL) of 90° C. or higher.

6. The communication device component according to claim 1 or 2, wherein: The thermoplastic resin composition has a dielectric constant of 3.0 or less and a dielectric loss tangent of 0.008 or less.

7. The communication device component according to claim 1 or 2, wherein: The dielectric loss tangent of the resin molded body after being immersed in hot water at 80° C. for 144 hours is 0.03 or less.

8. The communication device component according to claim 1 or 2, which is an antenna component.

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