Electroplating clamp, electroplating device and electroplating clamp detection method

Abstract

The embodiment of the invention provides an electroplating clamp, an electroplating device and an electroplating clamp detection method, the electroplating clamp comprises a clamping cylinder and a sealing ring, the inner wall of the clamping cylinder is provided with an annular boss, and the annular boss is used for bearing a wafer; the sealing ring wraps the annular boss and extends to the cylinder wall of the clamping cylinder from the annular boss; an air channel is formed in the cylinder wall of the clamping cylinder, an opening of the air channel is formed in the position, wrapped by the sealing ring, of the clamping cylinder, and whether the sealing ring is damaged or not is detected by exhausting air in the air channel. The electroplating clamp provided by the invention can be used for reliably electroplating the wafer.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and more particularly, to an electroplating fixture, an electroplating apparatus, and an electroplating method. Background Art

[0002] In the electroplating process of wafers, there are currently two types: vertical hanging plating and horizontal jet cup plating. Among them, in hanging plating, the wafers are vertically immersed in the plating solution, and multiple wafers can be electroplated simultaneously in one plating tank. Cup plating is to cover the wafers in a cup-shaped plating tank, and the electroplating process is carried out in a one-cup-one-wafer manner. Compared with hanging plating, the single-wafer process of cup plating is more controllable and is an important development direction for high-quality electroplating processes. In advanced cup plating processes, it is usually necessary to reliably seal the wafer edges with a sealing ring so that the plating solution does not contact the wafer edges and the back of the wafer surface to be electroplated.

[0003] However, as the electroplating operation progresses, the rubber sealing ring will age and gradually develop local damage. In particular, small damage to the rubber sealing ring is difficult to detect by the naked eye, resulting in electroplating failure. Summary of the Invention

[0004] Embodiments of the present application provide an electroplating fixture, an electroplating apparatus, and an electroplating method that can at least to some extent detect damage to the seal.

[0005] In a first aspect, the present application provides an electroplating fixture, including: a clamping cylinder, an inner wall of the clamping cylinder is provided with an annular boss for supporting a wafer; a sealing ring, wrapping the annular boss and extending from the annular boss to the cylinder wall of the clamping cylinder; an air duct is provided in the cylinder wall of the clamping cylinder, and an air duct opening of the air duct is arranged at a position of the clamping cylinder wrapped by the sealing ring, and whether the sealing ring is damaged is detected by pumping air into the air duct.

[0006] Specifically, a clamping cylinder opening groove is provided at a position of the clamping cylinder wrapped by the sealing ring, and the clamping cylinder opening groove communicates with the air duct through the air duct opening.

[0007] Specifically, the clamping cylinder opening groove is arranged around the clamping cylinder for one week.

[0008] Specifically, there are multiple air ducts, and the multiple air ducts communicate with different positions of the clamping cylinder opening groove.

[0009] Specifically, there are multiple clamping cylinder opening grooves and multiple air ducts. Each clamping cylinder opening groove communicates with at least one air duct, and the multiple clamping cylinder opening grooves are arranged at intervals.

[0010] Specifically, the sealing ring extends from the annular boss to the inner wall of the clamping cylinder. The electroplating fixture further includes an inner ring of the fixture, which is arranged inside the clamping cylinder and covers the first edge of the sealing ring located on the inner wall of the clamping cylinder.

[0011] Specifically, the inner wall of the clamping cylinder is provided with an internal stepped structure, the first edge is located at the internal stepped structure, and the inner ring of the fixture covers the first edge at the internal stepped structure.

[0012] Specifically, the sealing ring extends from the annular boss to the outer wall of the clamping cylinder. The electroplating fixture further includes a fixture cover, which is arranged outside the clamping cylinder and covers the second edge of the sealing ring located on the outer wall of the clamping cylinder.

[0013] Specifically, the outer wall of the clamping cylinder is provided with an external stepped structure, the second edge of the sealing ring is located at the external stepped structure, and the fixture cover covers the second edge at the external stepped structure.

[0014] Specifically, the electroplating fixture further includes a rotating circular plate provided with an air extraction device. The rotating circular plate is connected to the clamping cylinder through a fixture connecting piece, and the air duct is also arranged in the rotating circular plate and the fixture connecting piece.

[0015] In a second aspect, the present application provides an electroplating device, including: an electroplating tank; the electroplating fixture as described in any one of the above, and the electroplating fixture is used to make the surface to be electroplated of the wafer face the electroplating tank.

[0016] In a third aspect, the present application provides an electroplating fixture detection method, which is applied to the electroplating fixture as described in any one of the above, and includes: extracting air from the air duct arranged in the electroplating fixture and detecting the air extraction flow rate; according to the air extraction flow rate, counting the change in the gas flow rate at the air duct opening covered by the sealing ring; according to the change in the gas flow rate, judging whether the sealing ring is damaged.

[0017] In a fourth aspect, the present application provides an electroplating fixture detection method, which is applied to the electroplating fixture as described in any one of the above, and includes: extracting air from the air duct arranged in the electroplating fixture and detecting the air extraction air pressure; according to the air extraction air pressure, counting the change in the gas pressure at the air duct opening covered by the sealing ring; according to the change in the gas pressure, judging whether the sealing ring is damaged.

[0018] For the electroplating fixture of the present application, since the air duct opening is arranged at the position where the clamping cylinder is wrapped by the sealing ring, therefore, by extracting air from the air duct for detection, it can be detected whether the sealing ring is damaged.

[0019] Other characteristics and advantages of the present application will become obvious through the following detailed description, or be learned partially through the practice of the present application.

[0020] It should be understood that the above general description and the following detailed description are merely exemplary and explanatory, and do not limit this application. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings herein are incorporated into and constitute a part of this specification, showing embodiments consistent with this application, and are used together with the specification to explain the principles of this application. Obviously, the accompanying drawings in the following description are only some embodiments of this application, and those of ordinary skill in the art can obtain other drawings based on these drawings without creative efforts. In the drawings:

[0022] Figure 1 A schematic structural diagram of an electroplating fixture according to an embodiment of this application is shown;

[0023] Figure 2 A schematic structural diagram of a clamping cylinder and a fixture connecting member according to an embodiment of this application is shown;

[0024] Figure 3 A partial schematic structural diagram of a clamping cylinder and a fixture connecting member according to an embodiment of this application is shown;

[0025] Figure 4 A partial schematic structural diagram of a clamping cylinder and a fixture connecting member according to an embodiment of this application is shown;

[0026] Figure 5 A schematic structural diagram of a clamping cylinder and a fixture connecting member according to an embodiment of this application is shown;

[0027] Figure 6 A schematic structural diagram of an electroplating fixture according to an embodiment of this application is shown;

[0028] Figure 7 A schematic structural diagram of an electroplating device according to an embodiment of this application is shown;

[0029] Figure 8 A schematic flowchart of an electroplating method according to an embodiment of this application is shown;

[0030] Figure 9 A schematic flowchart of an electroplating method according to an embodiment of this application is shown. DETAILED DESCRIPTION

[0031] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more complete and comprehensive, and will fully convey the concept of the example embodiments to those skilled in the art.

[0032] In addition, the described features, structures, or characteristics may be combined in one or more embodiments in any suitable manner. In the following description, numerous specific details are provided to give a thorough understanding of the embodiments of the present application. However, those skilled in the art will realize that the technical solutions of the present application may be practiced without one or more of the specific details, or other methods, components, devices, steps, etc. may be adopted. In other cases, well-known methods, devices, implementations, or operations are not shown or described in detail to avoid obscuring aspects of the present application.

[0033] Please refer to Figures 1 to 4 , this embodiment provides an electroplating fixture 1, which can detect whether the sealing ring 15 inside the electroplating fixture 1 is damaged.

[0034] As Figure 1 shown, the electroplating fixture 1 includes a clamping cylinder 11, a power assembly 12 for driving the clamping cylinder 11 to rotate, a rotating circular plate 13, and a fixture connecting member 14. Among them, the clamping cylinder 11 is cylindrical and has two ends along its axial direction. An annular boss 111 protrudes from the inner wall of the lower end of the clamping cylinder 11 shown in Figure 1 . The wafer 2 is arranged inside the clamping cylinder 11, and the edge of the electroplating surface of the wafer 2 is supported by the annular boss 111. The power assembly 12 includes a rotation driving member. The power assembly 12 is arranged at the center of the rotating circular plate 13. The rotating circular plate 13 is connected to the other end of the clamping cylinder 11 through the fixture connecting member 14. The power assembly 12 drives the clamping cylinder 11 to rotate through the rotating circular plate 13 and the fixture connecting member 14, so that the wafer 2 rotates during electroplating, and the wafer 2 can be evenly electroplated. Specifically, the fixture connecting member 14 can be one or more. When there are multiple fixture connecting members 14, the multiple fixture connecting members 14 are evenly distributed along the circumference of the rotating circular plate 13, so that the rotating circular plate 13 and the clamping cylinder 11 are stably connected. For example, as Figure 2 shown, the fixture connecting member 14 can be at least two connecting rods, which are evenly distributed along the circumference of the rotating circular plate 13, or two connecting rods can be a group, and two groups of connecting rods are symmetrically arranged on both sides of the rotating circular plate 13. Each group of connecting rods can also form a connecting frame. The connecting frame has a larger connection area with the rotating circular plate 13 and a larger connection area with the clamping cylinder 11, which can increase the connection strength. In this embodiment, the fixture connecting member 14 can also be a connecting plate, a connecting block, or other structures.

[0035] Refer to again Figure 1, the clamping cylinder 11 is a cylindrical cylinder. The inner diameter of the lower end of the clamping cylinder 11 is equal to the diameter of the wafer 2. The diameter of the hole formed by the inner wall of the annular boss 111 is slightly smaller than the diameter of the wafer 2, so that the clamping cylinder 11 contacts the edge of the wafer to position the wafer 2. The annular boss 111 supports the edge of the surface of the wafer to be electroplated, so that the electroplating fixture 1 stably clamps the wafer 2. The diameter of the end of the clamping cylinder 11 away from the annular boss 111 is larger than the diameter of the wafer 2 to facilitate the insertion of the wafer 2 into the clamping cylinder 11. At least a section of the inner wall of the clamping cylinder can be inclined to provide a guiding function for the wafer 2. The annular boss 111 can be integrally provided with the clamping cylinder 11. In other embodiments of the embodiments of the present application, the annular boss 111 can be connected to the clamping cylinder 11 by welding, bonding or other means.

[0036] Referring to Figure 3 , the electroplating fixture 1 further includes a sealing ring 15. The sealing ring 15 wraps the annular boss 111 so that the annular boss 111 can contact the wafer 2 through the sealing ring 15. The electroplating fixture 1 further includes an inner ring 16 of the fixture, which is arranged inside the clamping cylinder, and a fixture cover 17, which is arranged outside the clamping cylinder. The sealing ring 15 extends from the annular boss 111 to the inner wall and the outer wall of the clamping cylinder. The first edge 151 of the sealing ring on the inner wall of the clamping cylinder is pressed by the inner ring 16 of the fixture, and the second edge 152 of the sealing ring on the outer wall of the clamping cylinder is pressed by the fixture cover 17 so that the position of the sealing ring 15 is fixed. Since the sealing ring 15 extends to the inner wall of the clamping cylinder, the inner wall of the clamping cylinder contacts the edge of the wafer through the sealing ring 15 to make the sealing effect of the wafer edge better. Further, an internal step structure is provided on the inner wall of the clamping cylinder. The first edge 151 of the sealing ring on the inner wall of the clamping cylinder extends to the internal step structure, and the first edge 151 of the sealing ring is pressed by the inner ring 16 of the fixture at the internal step structure so that the sealing ring 15 is better fixed. Similarly, an external step structure can be provided on the outer wall of the clamping cylinder. The second edge 152 of the sealing ring on the outer wall of the clamping cylinder is pressed by the fixture cover 17 at the external step structure so that the sealing ring 15 is better fixed.

[0037] As Figure 4 shown, further, the external step structure is provided with a plurality of annular grooves 112. The sealing ring 15 is made of an elastic material such as rubber. When the sealing ring 15 is pressed, it will be compressed into the annular grooves 112 so that the second edge 152 of the sealing ring is in a wavy shape, thereby better fixing the sealing ring 15. The annular grooves 112 can also be provided on the internal step structure, the inner ring 16 of the fixture and / or the fixture cover 17, and the number of the annular grooves 112 can also be one.

[0038] An air passage 113 is provided in the barrel wall of the clamping barrel 11, and an air passage opening 114 of the air passage 113 is arranged at the position where the clamping barrel 11 is wrapped by the sealing ring 15. The air passage 113 is also connected to an air extraction device (not shown). Thus, when the air extraction device is used to extract air from the air passage 113, it is possible to judge whether the sealing ring 15 at the position of the air passage opening 114 is damaged according to the change of the gas flow or air pressure in the air passage 113. The sealing ring 15 is arranged in contact with the clamping barrel 11, but the sealing ring 15 is made of an elastic material, and the elasticity of the sealing ring 15 may deteriorate due to aging or other reasons, resulting in a micron-level gap between the sealing ring 15 and the clamping barrel 11. Therefore, extracting air from the air passage 113 can not only judge whether the sealing ring 15 at the position of the air passage opening 114 is damaged, but also detect whether the entire sealing ring 15 is damaged through the gap. The air passage 113 also extends from the inner wall of the clamping barrel 11 to the fixture connecting member 14 and the rotating circular plate 13 until it is connected to the air extraction device in the power assembly 12. The air passage 113 in the clamping barrel 11 can be one or more. Correspondingly, the air passage 113 in the fixture connecting member 14 can also be one or more, and the air passage 113 in the rotating circular plate 13 can also be one or more. In a specific embodiment, referring to Figure 2 , if the fixture connecting member 14 is a connecting rod, the air passage 113 can be arranged in the connecting rod. In other embodiments of the embodiments of the present application, the air extraction device is arranged outside the electroplating fixture 1.

[0039] In other embodiments of the embodiments of the present application, the air passage 113 extends into the internal of the annular boss 111, and the air passage opening 114 is arranged at the position where the annular boss 111 is wrapped by the sealing ring 15. In other embodiments of the embodiments of the present application, there are multiple air passage openings 114, and the multiple air passage openings 114 are distributed on both sides of the supporting surface of the annular boss 111. When the annular boss 111 supports the wafer 2, the wafer 2 makes the sealing ring 15 closely adhere to the supporting surface under the action of gravity. The air passage openings 114 distributed on both sides of the supporting surface can respectively detect the sealing rings 15 located on both sides of the supporting surface, so as to better judge whether the sealing ring 15 is damaged. The multiple air passage openings 114 can also be arranged around the clamping barrel 11 or the annular boss 111 for one week, so as to detect whether the sealing ring 15 is damaged from more directions.

[0040] Specifically, when the sealing ring 15 is intact, the gas flow rate will be smaller than when it is damaged. For example, it may be less than 3 standard cubic centimeters per minute (sccm), and as the airway 113 sucks air, it will gradually decrease until the flow rate approaches 0; when the sealing ring 15 is damaged, the damage will cause gas to continuously enter the airway 113, and the gas flow rate will be larger than when it is intact, and there is no obvious change as the airway 113 sucks air. For example, it may be maintained at 5 sccm. In other embodiments of the embodiments of the present application, when the sealing ring 15 is intact, the gas pressure will be greater than when it is damaged, and as the airway 113 sucks air, the air pressure will gradually increase until air cannot be sucked; when the sealing ring 15 is damaged, the damage will cause gas to continuously enter the airway 113, and the air pressure will be smaller than when it is intact, and there is no obvious change as the airway 113 sucks air.

[0041] In yet another embodiment of the embodiments of the present application, as Figure 5 shown, at the position where the clamping cylinder 11 is wrapped by the sealing ring 15, there is a clamping cylinder opening groove 115 with a notch facing the sealing ring 15. The clamping cylinder opening groove 115 communicates with the airway 113 through the airway opening 114, that is, the airway opening 114 is arranged in the clamping cylinder opening groove 115, and the airway 113 sucks air through the notch of the clamping cylinder opening groove 115, which can increase the range of detecting the sealing ring 15. At the same time, when part of the notch is blocked by the sealing ring 15 or impurities, since the clamping cylinder opening groove 115 has a certain depth, gas can still flow inside the clamping cylinder opening groove 115, so as to achieve a better detection effect.

[0042] Furthermore, as Figure 5 shown, the clamping cylinder opening groove 115 is an annular opening groove arranged along the circumference of the clamping cylinder 11, so as to detect the sealing ring 15 from more directions. When there are multiple airways 113, each airway 113 communicates with different positions of the annular opening groove.

[0043] In one embodiment of the embodiments of the present application, as Figure 6 shown, when there are multiple airways 113, the clamping cylinder opening grooves 115 can also be multiple. Each clamping cylinder opening groove 115 communicates with at least one airway 113, and each airway 113 communicates with a suction device respectively. The suction device can control the on-off of each airway 113 respectively to detect the sealing ring 15 through each clamping cylinder opening groove 115 respectively. The multiple clamping cylinder opening grooves 115 are arranged at intervals to reduce the impact on the strength of the clamping cylinder 11, and the multiple clamping cylinder opening grooves 115 are arranged along the circumferential direction of the clamping cylinder 11. In other embodiments of the embodiments of the present application, the multiple clamping cylinder opening grooves 115 can be arranged along the axial direction of the clamping cylinder 11.

[0044] In other embodiments of the embodiments of the present application, a boss opening groove with a notch facing the sealing ring 15 is provided at the position where the annular boss 111 is wrapped by the sealing ring 15. The structure of the boss opening groove is similar to that of the clamping cylinder opening groove 115. For the specific structure, reference can be made to the clamping cylinder opening groove 115 and will not be elaborated here.

[0045] Refer again to Figure 1 , the electroplating fixture 1 further includes a wafer pressing block 18. The wafer pressing block 18 is arranged in the clamping cylinder 11 and is used to apply pressure to the back surface of the wafer 2 away from the surface to be electroplated, so that the edge of the wafer is closely attached to the annular boss 111 to achieve a better sealing effect. The end face size of the wafer pressing block 18 for pressing the wafer 2 is the same as the size of the wafer 2, so that the wafer 2 is uniformly stressed everywhere, improving the electroplating flatness. A protrusion is provided at the edge of one end of the wafer pressing block 18 away from the wafer 2 in a direction away from the wafer 2. The protrusion extends to one end of the clamping cylinder 11 away from the annular boss 111 and is provided with a bending structure towards the end face of the clamping cylinder 11 away from the annular boss 111. The bending structure is clamped on the end face of the clamping cylinder 11 away from the annular boss 111 to realize the limit of the wafer pressing block 18. The distance between the end face of the wafer pressing block 18 for pressing the wafer 2 and the annular boss 111 is the thickness of one wafer 2, that is, the difference between the distance between the clamping surface of the bending structure of the wafer pressing block 18 and the end face of the wafer pressing block 18 for pressing the wafer 2 minus the height of the clamping cylinder 11 is equal to the thickness of one wafer 2, so as to prevent the wafer pressing block 18 from excessively squeezing the wafer 2 and causing the wafer 2 to be damaged.

[0046] Please refer to Figure 7 , this embodiment also provides an electroplating device, including the electroplating fixture 1 as described above.

[0047] As Figure 7 shown, the electroplating device further includes an electroplating tank 3 filled with electroplating solution. When the electroplating fixture 1 clamps the edge of the wafer 2, the surface of the wafer to be electroplated faces the electroplating tank 3, so that when the electroplating fixture 1 clamps the wafer 2 and moves it into the electroplating tank 3, the surface of the wafer to be electroplated is immersed in the electroplating tank 3 for cup plating.

[0048] Please refer to Figure 8 , this embodiment also provides an electroplating fixture detection method, which is executed by the above-mentioned electroplating fixture 1 or electroplating device.

[0049] The electroplating fixture detection method at least includes steps S110 to S130, and the specific description is as follows:

[0050] S110: Exhaust the air passage 113 provided in the electroplating fixture 1 and detect the exhaust air flow rate.

[0051] S120: According to the exhaust air flow rate, count the gas flow rate change at the air passage opening 114 covered by the sealing ring 15.

[0052] The change in the extraction flow rate is the change in the gas flow rate at the airway opening 114 covered by the sealing ring 15.

[0053] S130: Determine whether the sealing ring 15 is damaged according to the change in gas flow rate.

[0054] When the sealing ring 15 is not damaged, the gas flow rate will be smaller than when it is damaged. For example, it may be less than 3 standard cubic centimeters per minute (sccm), and as the airway 113 is evacuated, it will gradually decrease until the flow rate approaches 0; when the sealing ring 15 is damaged, the damage will cause gas to continuously enter the airway 113, and the gas flow rate will be larger than when it is not damaged, and there is no obvious change as the airway 113 is evacuated. For example, it may be maintained at 5 sccm.

[0055] Step S110 can be executed before the electroplating fixture 1 holds the wafer 2, or it can be executed during the process of the electroplating fixture 1 holding the wafer 2.

[0056] In this electroplating method, by evacuating the airway 113, the change in the gas flow rate at the airway opening 114 covered by the sealing ring 15 is obtained to determine whether gas continuously enters, so as to determine whether the sealing ring 15 is damaged.

[0057] Please refer to Figure 9 , this embodiment also provides an electroplating fixture detection method, which is executed by the above electroplating fixture 1 or electroplating device.

[0058] The electroplating fixture detection method at least includes steps S210 to S230, which are specifically described as follows:

[0059] S210: Evacuate the airway 113 provided in the electroplating fixture 1 and detect the evacuation air pressure.

[0060] S220: According to the evacuation air pressure, count the change in the gas pressure at the airway opening 114 covered by the sealing ring 15.

[0061] According to the detected evacuation air pressure, count the change in the evacuation air pressure. The change in the evacuation air pressure is the change in the gas pressure at the airway opening 114 covered by the sealing ring 15.

[0062] S130: Determine whether the sealing ring 15 is damaged according to the change in gas pressure.

[0063] When the sealing ring 15 is not damaged, the gas pressure will be greater than when it is damaged, and as the airway 113 is evacuated, the air pressure will gradually increase until evacuation is impossible; when the sealing ring 15 is damaged, the damage will cause gas to continuously enter the airway 113, and the air pressure will be smaller than when it is not damaged, and there is no obvious change as the airway 113 is evacuated.

[0064] Step S210 can be executed before the electroplating fixture 1 holds the wafer 2, or can be executed during the process that the electroplating fixture 1 holds the wafer 2.

[0065] In this electroplating method, by evacuating the air duct 113, the gas pressure change at the air duct opening 114 covered by the sealing ring 15 is obtained to judge whether gas continuously enters, so as to judge whether the sealing ring 15 is damaged.

[0066] After considering the specification and practicing the disclosed embodiments herein, those skilled in the art will readily conceive of other embodiments of the present application. The present application is intended to cover any variations, uses, or adaptations of the present application, which follow the general principles of the present application and include known common general knowledge or conventional technical means in the technical field not disclosed in the present application.

[0067] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present application is only limited by the appended claims.

Claims

1. An electroplating fixture, characterized in that, it includes: a clamping cylinder, an annular boss is arranged on the inner wall of the clamping cylinder, and the annular boss is used to support the wafer; a sealing ring, which wraps the annular boss and extends from the annular boss to the barrel wall of the clamping cylinder; an air duct is arranged in the barrel wall of the clamping cylinder, and an air duct opening of the air duct is arranged at the position where the clamping cylinder is wrapped by the sealing ring, and whether the sealing ring is damaged is detected by pumping air into the air duct.

2. The electroplating fixture according to claim 1, characterized in that, a clamping cylinder opening groove is arranged at the position where the clamping cylinder is wrapped by the sealing ring, and the clamping cylinder opening groove communicates with the air duct through the air duct opening.

3. The electroplating fixture according to claim 2, characterized in that, the clamping cylinder opening groove is arranged around the clamping cylinder for one week.

4. The electroplating fixture according to claim 3, characterized in that, there are multiple air ducts, and the multiple air ducts communicate at different positions of the clamping cylinder opening groove.

5. The electroplating fixture according to claim 2, characterized in that, there are multiple clamping cylinder opening grooves and multiple air ducts, each clamping cylinder opening groove is at least communicated with one air duct, and the multiple clamping cylinder opening grooves are arranged at intervals.

6. The electroplating fixture according to claim 1, characterized in that, the sealing ring extends from the annular boss to the inner wall of the clamping cylinder, and the electroplating fixture further includes a fixture inner ring, and the fixture inner ring is arranged inside the clamping cylinder and covers the first edge of the sealing ring located on the inner wall of the clamping cylinder.

7. The electroplating fixture according to claim 6, characterized in that, an internal step structure is arranged on the inner wall of the clamping cylinder, the first edge is located at the internal step structure, and the fixture inner ring covers the first edge at the internal step structure.

8. The electroplating fixture according to claim 1, characterized in that, the sealing ring extends from the annular boss to the outer wall of the clamping cylinder, and the electroplating fixture further includes a fixture cover, and the fixture cover is arranged outside the clamping cylinder and covers the second edge of the sealing ring located on the outer wall of the clamping cylinder.

9. The electroplating fixture according to claim 8, characterized in that, an external step structure is arranged on the outer wall of the clamping cylinder, the second edge of the sealing ring is located at the external step structure, and the fixture cover covers the second edge at the external step structure.

10. The electroplating fixture according to claim 1, characterized in that, it further includes a rotating circular plate provided with an air extraction device, the rotating circular plate is connected to the clamping cylinder through a fixture connecting piece, and the air duct is also arranged in the rotating circular plate and the fixture connecting piece.

11. An electroplating device, characterized in that, it includes: an electroplating tank; the electroplating fixture according to any one of claims 1-10, and the electroplating fixture is used to make the surface to be electroplated of the wafer face the electroplating tank.

12. An electroplating fixture detection method, characterized in that, applied to the electroplating fixture according to any one of claims 1-10, including: pumping air into the air duct arranged in the electroplating fixture and detecting the air extraction flow rate; According to the air extraction flow rate, count the change in the gas flow rate at the airway opening covered by the sealing ring; Judge whether the sealing ring is damaged according to the change in the gas flow rate; 13. A method for detecting an electroplating fixture, characterized in that, applied to the electroplating fixture according to any one of claims 1-10, comprising: Extract air from the airway provided in the electroplating fixture and detect the air extraction pressure; According to the air extraction pressure, count the change in the gas pressure at the airway opening covered by the sealing ring; Judge whether the sealing ring is damaged according to the change in the gas pressure;

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