A single crystal silicon sample etching device

Abstract

The present invention relates to the field of semiconductor manufacturing technology, and specifically to a single crystal silicon sample etching device, comprising a chemical reactor, a chemical reaction tank provided on one side of the chemical reactor, a fixture provided above the chemical reaction tank, a control mechanism provided on the chemical reactor for controlling the raising and lowering of the fixture, two rotating rods provided on the fixture for circumferential rotation or axial sliding, and a plurality of supports for placing crystals mounted on the outer surfaces of the two rotating rods. The beneficial effects of the present invention are as follows: utilizing the two rotating rods to control a plurality of crystals to simultaneously swing back and forth and slide back and forth, firstly, facilitating the accurate placement or removal of crystals, and secondly, greatly increasing the contact area and frequency between the crystal surface and the chemical etchant, thereby allowing two adjacent crystals to press liquid toward each other, accelerating the etching rate, and also promoting the automatic detachment of small bubbles attached to the crystal surface.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a single crystal silicon sample etching device. Background Art

[0002] Single-crystal silicon wet etching is a micro-nano processing technology widely used in fields such as semiconductor manufacturing. When in use, the crystals are placed in the crystal boat in a set order, and then the crystals are driven by the crystal boat to immerse in a chemical reaction tank. The cavitation effect generated by the ultrasound can then form microscopic strong shock waves and high-speed jets, acting on the surface of the material, causing the dirt to be quickly crushed and peeled off, accelerating the reaction between the chemical etchant and the material surface, and completing the etching.

[0003] Chinese Patent Publication No. CN112635356A discloses a wet etching cleaning device. This device immerses crystals in a chemical solution from top to bottom, rapidly crushing and stripping away contaminants and accelerating the reaction between the chemical etchant and the material surface to complete etching. However, compared to existing technologies in related fields, the device suffers from the following problems: firstly, because the crystals are densely distributed within a wafer boat, the chemical liquid cannot flow smoothly between the densely packed crystals, resulting in small changes in liquid pressure and weak scouring and penetration of the crystal surface. This slows the etching reaction and reduces production efficiency. Increasing the spacing between crystals also reduces production efficiency. Furthermore, it is difficult for operators to accurately place or remove crystals, increasing the difficulty and time of operation and the risk of damage to the crystals during placement and removal, thereby reducing work efficiency and product yield. Secondly, the dense distribution makes small bubbles generated on the crystal surface more easily attached and difficult to detach. These bubbles, which remain attached for a long time, form a localized barrier layer on the crystal surface, making it difficult for the etchant to reach the area covered by the bubbles, thereby changing the direction and path of etching. This can lead to etch pattern distortion, which can affect device performance and yield for high-precision etching processes such as microfabrication in semiconductor manufacturing. Summary of the Invention

[0004] The purpose of the present invention is to overcome the shortcomings of the prior art, solve the problems mentioned in the background art, and provide a single crystal silicon sample etching device.

[0005] The objectives of the present invention are achieved through the following technical solutions: A single crystal silicon sample etching device includes a chemical reactor, a chemical reaction tank is provided on one side of the chemical reactor, a fixing part is provided above the chemical reaction tank, and a control mechanism for controlling the lifting and lowering of the fixing part is provided on the chemical reactor, two rotating rods are provided on the fixing part for circumferential rotation or axial sliding, and a plurality of support parts for placing crystals are installed on the outer surfaces of the two rotating rods, and the support parts on the outer surfaces of the two rotating rods are staggered; a driving assembly and a guide assembly are provided inside the fixing part, and when the control mechanism controls the fixing part to move back and forth up and down inside the chemical reaction tank, the driving assembly is used to control the two rotating rods to rotate in opposite directions, and when the two rotating rods rotate in opposite directions, the guide assembly is used to control the two rotating rods to slide back and forth relative to each other.

[0006] Furthermore, the control mechanism includes a lifting rod arranged inside the chemical reactor, a support arm is fixedly mounted on the top end of the lifting rod, and the fixing member is fixedly mounted on the support arm.

[0007] Furthermore, the driving assembly includes a rack slidably arranged inside the fixing member, the rack having double-sided meshing teeth, and gears are fixedly provided at the positions of the two rotating rods corresponding to the racks, and the two gears are engaged with the racks.

[0008] Furthermore, the top end of the rack is connected to the top surface inside the fixing member through an elastic member.

[0009] Furthermore, the fixing member is provided with movable holes at positions corresponding to the two rotating rods, and the fixing member is provided with a sliding groove at a position corresponding to the rack at the bottom.

[0010] Furthermore, the guide assembly includes a fixing rod, the fixing parts are fixedly provided at the positions corresponding to the two gears, a rolling part is rotatably provided at one end of the fixing rod close to the gear, a guide groove is opened at the position of the gear corresponding to the rolling part, and a slot cover is fixedly installed at the opening of the guide groove.

[0011] Furthermore, the guide groove and the groove cover are both arc-shaped, the side of the guide groove facing the groove cover is an inclined surface, the side of the groove cover facing the guide groove is an inclined surface, and the inclined surface of the groove cover is opposite to the inclined surface of the guide groove.

[0012] Furthermore, the rolling element is a ball, and a rotation hole is provided on one side of the fixing rod. The fixing rod is connected to the rotation hole through a bearing.

[0013] Furthermore, the inclined surfaces of the guide grooves of the two gears are arranged in opposite directions, so that the adjacent rotating rods can slide back and forth relative to each other.

[0014] Furthermore, the support member includes a fixing plate, a crystal holder is fixedly provided on the top of the fixing plate, the crystal holder is arc-shaped, and a placement groove is formed on a side of the crystal holder away from the fixing plate.

[0015] The beneficial effects of the present invention are as follows: by arranging a rotating rod, a support, a driving assembly and a guiding assembly, two rotating rods are used to control a plurality of crystals to swing back and forth and slide back and forth at the same time, which, firstly, facilitates the accurate placement or removal of the crystals, and secondly, greatly improves the contact area and frequency between the crystal surface and the chemical etchant, thereby allowing the two adjacent crystals to press the liquid toward each other to accelerate the etching rate, and can also promote the automatic detachment of small bubbles attached to the crystal surface, avoiding problems such as uneven etching, change of etching direction, influence on surface roughness and material accumulation caused by long-term attachment of bubbles, thereby ensuring the smooth progress of the etching process and the stability of the etching quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 This is a schematic structural diagram of the chemical reactor on the first axis side when the fixing member of the present invention is separated from the chemical reaction tank;

[0018] Figure 2 This is a schematic diagram of the second-axis structure of the chemical reactor when the fixing member of the present invention is separated from the chemical reaction tank;

[0019] Figure 3 This is a schematic diagram of the state of the support member when the fixing member of the present invention is separated from the chemical reaction tank;

[0020] Figure 4 This is a schematic diagram of the state of the support arm when multiple support members overlap according to the present invention;

[0021] Figure 5 This is a schematic diagram of a state in which multiple supporting members of the present invention overlap;

[0022] Figure 6 This is a schematic diagram of the state of the support member after the rack is completely inserted into the fixing member of the present invention;

[0023] Figure 7 It is a structural schematic diagram of the fixing member of the present invention;

[0024] Figure 8 It is a structural schematic diagram of the drive assembly of the present invention;

[0025] Figure 9 It is a structural schematic diagram of the support member of the present invention;

[0026] Figure 10 For the present invention Figure 9 A schematic diagram of the structure at center A;

[0027] Figure 11 It is a structural schematic diagram of the guide component of the present invention.

[0028] In the figure: 1. Chemical reactor; 101. Chemical reaction tank; 2. Fixing part; 201. Movable hole; 202. Slide groove; 3. Control mechanism; 301. Lifting rod; 302. Support arm; 4. Rotating rod; 5. Support part; 501. Fixing plate; 502. Crystal holder; 503. Placement slot; 6. Driving assembly; 601. Rack; 602. Gear; 6021. Guide slot; 603. Elastic part; 7. Guide assembly; 701. Fixing rod; 702. Rolling part; 703. Slot cover. DETAILED DESCRIPTION

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] Additional aspects and advantages of the present invention will be further given in the following description in conjunction with the accompanying drawings, and in part will become apparent from the following description, or may be learned through practice of the present invention.

[0031] An embodiment of a single crystal silicon sample etching device of the present invention is as follows Figures 1 to 11As shown, it includes a chemical reactor 1, a chemical reaction tank 101 is provided on one side of the chemical reactor 1, a fixing member 2 is provided above the chemical reaction tank 101, and a control mechanism 3 for controlling the lifting of the fixing member 2 is provided on the chemical reactor 1. Two rotating rods 4 are provided on the fixing member 2 for circumferential rotation or axial sliding. The outer surfaces of the two rotating rods 4 are installed with multiple support members 5 for placing crystals. The support members 5 on the outer surfaces of the two rotating rods 4 are staggered. The support members 5 include a fixing plate 501, and a crystal holder 502 is fixed on the top of the fixing plate 501. The crystal holder 502 is in an arc shape, and a placement groove 503 is formed on the side of the crystal holder 502 away from the fixing plate 501; a driving component 6 and a guide component 7 are provided inside the fixing member 2. When the control mechanism 3 controls the fixing member 2 to move back and forth up and down inside the chemical reaction tank 101, the driving component 6 is used to control the two rotating rods 4 to rotate in opposite directions. When the two rotating rods 4 rotate in opposite directions, the guide component 7 is used to control the two rotating rods 4 to slide back and forth relative to each other.

[0032] like Figure 1 As shown, the control mechanism 3 includes a lifting rod 301 arranged inside the chemical reactor 1 , a support arm 302 is fixedly mounted on the top end of the lifting rod 301 , and the fixing member 2 is fixedly mounted on the support arm 302 .

[0033] like Figure 8 As shown, the driving assembly 6 includes a rack 601 slidably arranged inside the fixing member 2, the rack 601 has double-sided meshing teeth, and the positions of the two rotating rods 4 corresponding to the rack 601 are fixed with gears 602, and the two gears 602 are meshed with the rack 601. The top of the rack 601 is connected to the top surface of the fixing member 2 through an elastic member 603 (the elastic member 603 is a spring). The positions of the fixing member 2 corresponding to the two rotating rods 4 are each provided with a movable hole 201, and the bottom of the fixing member 2 is provided with a sliding groove 202 corresponding to the position of the rack 601. Figures 1 to 8 As shown, when the two rotating rods 4 drive several supporting members 5 into the chemical reaction tank 101, the rack 601 will contact the bottom of the chemical reaction tank 101, so that the rack 601 can be used to control the two gears 602 to rotate in opposite directions, and then the two gears 602 will drive the two rotating rods 4 to rotate in opposite directions. Then, when the lifting rod 301 controls the support arm 302 and the fixed member 2 to move back and forth, the two rotating rods 4 can drive the several supporting members 5 to swing back and forth (when the fixed member 2 moves downward, the rack 601 will shrink toward the inside of the fixed member 2 and compress the elastic member 603. When the fixed member 2 moves upward, the elastic force of the elastic member 603 gradually recovers, thereby prompting the rack 601 to slide downward). When the two rotating rods 4 can drive the several supporting members 5 to swing back and forth, the contact area and frequency between the crystal surface and the chemical etchant are greatly improved, which helps to carry out the etching reaction more evenly and fully, thereby improving the etching effect and etching uniformity, and reducing the etching differences caused by uneven contact.

[0034] like Figures 8 to 11 As shown, the guide assembly 7 includes a fixed rod 701, and the positions of the fixing member 2 corresponding to the two gears 602 are fixed with a fixed rod 701, and the end of the fixed rod 701 close to the gear 602 is rotatably provided with a rolling member 702, and the position of the gear 602 corresponding to the rolling member 702 is provided with a guide groove 6021, and a groove cover 703 is fixedly installed at the opening of the guide groove 6021. The shapes of the guide groove 6021 and the groove cover 703 are both arc-shaped, and the side of the guide groove 6021 facing the groove cover 703 is an inclined surface, and the side of the groove cover 703 facing the guide groove 6021 is an inclined surface, and the inclined surface of the groove cover 703 is opposite to the inclined surface of the guide groove 6021, as shown in FIG. Figure 11 As shown, the rolling element 702 is a ball, and the rolling element 702 is located on one side of the fixed rod 701 and has a rotation hole. The fixed rod 701 is connected to the rotation hole through a bearing. The inclined surfaces of the guide grooves 6021 of the two gears 602 are oppositely arranged, so that the adjacent rotating rods 4 can slide back and forth relative to each other. Figures 3 to 6 As shown, when the two gears 602 rotate in opposite directions, the position change of the rolling member 702 between the guide groove 6021 and the groove cover 703 is utilized to enable the two rotating rods 4 to drive the plurality of support members 5 to slide back and forth axially. Moreover, since the inclined surfaces of the guide grooves 6021 of the two gears 602 are oppositely arranged, the two adjacent crystals can press the liquid toward each other. Thus, this pressure change can not only enhance the flushing and penetration of the chemical liquid on the crystal surface, promote the etching reaction, accelerate the etching rate, and improve production efficiency, but also promote the automatic detachment of small bubbles attached to the crystal surface, thereby avoiding problems such as uneven etching, change of etching direction, influence on surface roughness, and material accumulation caused by long-term attachment of bubbles, thereby ensuring the smooth progress of the etching process and the stability of the etching quality.

[0035] The chemical reactor 1 is provided with a control system panel, which includes the following contents:

[0036] Reaction interface: liquid inlet and outlet rate and capacity, reaction liquid temperature and concentration, reaction working time;

[0037] Ultrasonic cleaning interface: ultrasonic time, frequency, temperature, ultrasonic liquid input capacity rate and output rate, etc.;

[0038] Cleaning and drying interface: drying gas blowing volume and blowing time.

[0039] The chemical reactor 1 and the control mechanism 3 described in this application are well-known technologies in the technical field, and therefore their specific structures and working principles are not described in detail.

[0040] The working process is as follows:

[0041] S1: If Figure 1、 Figure 2 and Figure 9 As shown, when in use, the lifting rod 301 controls the support arm 302 and the fixing member 2 to rise, so that the two rotating rods 4 drive the plurality of supporting members 5 to separate from the chemical reaction tank 101;

[0042] S2: If Figure 2 、 Figure 3 、 Figure 8 and Figure 9 As shown, after the two rotating rods 4 drive the plurality of supporting members 5 to separate from the chemical reaction tank 101, the elastic member 603 is no longer compressed, thereby causing the rack 601 to slide downward. The rack 601 then controls the two gears 602 to rotate in opposite directions. Subsequently, the two gears 602 drive the two rotating rods 4 to rotate in opposite directions, causing the adjacent supporting members 5 to be misaligned.

[0043] S3: If Figure 2 、 Figure 3 and Figure 9 As shown, when several support members 5 are misaligned, the operator can more conveniently and accurately place the crystal into the placement groove 503 of the crystal holder 502, or easily remove the crystal from the placement groove 503 of the crystal holder 502 after etching is completed, thereby reducing the difficulty and time of operation, improving work efficiency, and also reducing the risk of damage to the crystal during the placement process.

[0044] S4: As Figure 2 、 Figure 4 and Figure 9 As shown, after the crystal is placed, the lifting rod 301 controls the support arm 302 and the fixing member 2 to descend, so that the two rotating rods 4 drive the plurality of supporting members 5 into the chemical reaction tank 101;

[0045] S5: If Figure 4 and Figure 9 As shown, after the two rotating rods 4 drive the plurality of supporting members 5 into the chemical reaction tank 101, the ultrasonic function and the heating function of the chemical reactor 1 are turned on;

[0046] S6: As Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 、 Figure 8 and Figure 9 As shown, when the two rotating rods 4 drive the plurality of supporting members 5 into the chemical reaction tank 101, the rack 601 contacts the bottom of the chemical reaction tank 101, thereby controlling the two gears 602 to rotate in opposite directions. Subsequently, the two gears 602 drive the two rotating rods 4 to rotate in opposite directions. Then, when the lifting rod 301 controls the support arm 302 and the fixing member 2 to reciprocate, the two rotating rods 4 can drive the plurality of supporting members 5 to swing back and forth.

[0047] S7: As Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 、 Figure 8 and Figure 9 As shown, when the two rotating rods 4 can drive the plurality of supporting members 5 to swing back and forth, the contact area and frequency between the crystal surface and the chemical etchant are greatly increased, which helps to carry out the etching reaction more uniformly and fully, thereby improving the etching effect and etching uniformity, and reducing the etching difference caused by uneven contact;

[0048] S8: Figure 3 、 Figure 6 、 Figure 8 、 Figure 9 、 Figure 10 and Figure 11 As shown, when the two gears 602 rotate in opposite directions, the position change of the rolling element 702 between the guide groove 6021 and the groove cover 703 causes the two rotating rods 4 to drive the plurality of supporting elements 5 to slide back and forth axially. Moreover, since the inclined surfaces of the guide grooves 6021 of the two gears 602 are arranged in opposite directions, the two adjacent crystals can press the liquid toward each other. Thus, this pressure change can not only enhance the flushing and penetration of the chemical liquid on the crystal surface, promote the etching reaction, accelerate the etching rate, and improve production efficiency, but also promote the automatic detachment of small bubbles attached to the crystal surface, thereby avoiding problems such as uneven etching, change of etching direction, influence on surface roughness, and material accumulation caused by long-term bubble attachment, thereby ensuring the smooth progress of the etching process and the stability of etching quality.

[0049] S9: When the crystal is etched, the crystal can be easily removed from the placement groove 503 of the crystal holder 502 by repeating steps S1 to S3.

[0050] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A single crystal silicon sample etching device, characterized in that: The invention comprises a chemical reactor, wherein a chemical reaction tank is provided on one side of the chemical reactor, a fixing member is provided above the chemical reaction tank, a control mechanism for controlling the lifting and lowering of the fixing member is provided on the chemical reactor, two rotating rods are provided on the fixing member for circumferential rotation or axial sliding, and a plurality of supporting members for placing crystals are installed on the outer surfaces of the two rotating rods, and the supporting members on the outer surfaces of the two rotating rods are staggered. A driving assembly and a guiding assembly are provided inside the fixing member. The control mechanism controls the fixing member to move up and down reciprocatingly inside the chemical reaction tank. The driving assembly is used to control the two rotating rods to rotate in opposite directions. The two rotating rods rotate in opposite directions, and the guiding assembly is used to control the two rotating rods to slide back and forth relative to each other. The drive assembly includes a rack slidably arranged inside the fixed member, the rack having double-sided meshing teeth, and two rotating rods are fixed with gears at positions corresponding to the racks, both gears meshing with the racks; the top end of the rack is connected to the top surface of the fixed member via an elastic member; The guide assembly includes a fixed rod, and the fixed parts are fixedly provided with the fixed rods at the positions corresponding to the two gears. A rolling part is rotatably provided at one end of the fixed rod close to the gear, and the rolling part is a ball. A guide groove is provided at the position of the gear corresponding to the rolling part, and a slot cover is fixedly installed at the opening of the guide groove; the guide groove and the slot cover are both arc-shaped, the side of the guide groove facing the slot cover is a slope, and the side of the slot cover facing the guide groove is a slope, the slope of the slot cover is opposite to the slope of the guide groove, and the slopes of the guide grooves of the two gears are oppositely set, and the rolling part is provided with a rotating hole on one side of the fixed rod, and the fixed rod is connected to the rotating hole through a bearing, and the two gears rotate in opposite directions, and the position change of the rolling part between the guide groove and the slot cover is used to make the two rotating rods drive several supporting parts to slide back and forth axially, and because the slopes of the guide grooves of the two gears are oppositely set, the two adjacent crystals press the liquid towards each other.

2. The single crystal silicon sample etching device according to claim 1, characterized in that: The control mechanism comprises a lifting rod arranged inside the chemical reactor, a support arm is fixedly installed on the top end of the lifting rod, and a fixing piece is fixedly installed on the support arm.

3. The single crystal silicon sample etching device according to claim 1, characterized in that: The positions of the fixing piece corresponding to the two rotating rods are provided with movable holes, and the position of the bottom of the fixing piece corresponding to the rack is provided with a sliding groove.

4. The single crystal silicon sample etching device according to claim 1, characterized in that: The support member comprises a fixing plate, a top end of which is fixedly provided with a crystal holder, the crystal holder being in an arc shape, and a placement groove being formed on a side of the crystal holder away from the fixing plate.

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