Variable-frequency refrigeration device and refrigeration suit

Abstract

The present invention relates to the field of refrigeration devices, and provides a variable-frequency refrigeration device and a refrigeration suit. The variable-frequency refrigeration device includes a plurality of refrigeration components. Each refrigeration component includes a central semiconductor refrigeration chip and a plurality of edge semiconductor refrigeration chips distributed around the central semiconductor refrigeration chip. The central semiconductor refrigeration chip is connected to at least two edge semiconductor refrigeration chips through connecting belts. The connecting belts are provided with bending portions at positions corresponding to the central semiconductor refrigeration chips, and a deformation space is formed between the bending portions and the central semiconductor refrigeration chips. The connecting belt includes a strip-shaped base material. At least one metal strip is embedded on the first side of the base material. A plurality of through holes evenly distributed along the length direction are formed on the second side of the base material, and a part of the metal strip is exposed through the through holes. The variable-frequency refrigeration device and the refrigeration suit provided by the present invention can flexibly change the spatial form of the refrigeration components. By adjusting all the refrigeration components, the whole variable-frequency refrigeration device can be adjusted into various forms.

Description

Technical Field

[0001] The present invention relates to the field of refrigeration devices, and more specifically, to a variable-frequency refrigeration device and a refrigeration suit. Background Art

[0002] A thermoelectric cooling module (TEC), also known as a thermoelectric refrigeration sheet, is an electronic device that uses the Peltier effect of semiconductor materials to achieve refrigeration or heating. Its core structure consists of N-type and P-type semiconductor materials, which are connected by electrodes and sandwiched between two ceramic substrates. The working principle of the thermoelectric cooling module is based on the Peltier effect: when a direct current passes through the electric couple composed of N-type and P-type semiconductor materials, the direction of the current determines the direction of heat transfer. Specifically, when the current flows from the N-type element to the P-type element, heat is absorbed at the joint to form a cold end; when the current flows from the P-type element to the N-type element, heat is released at the joint to form a hot end. By increasing the number of pairs of semiconductor elements, the refrigeration or heating effect can be enhanced.

[0003] The thermoelectric cooling module has many advantages, such as no pollution, no noise during operation, and easy implementation of variable-frequency refrigeration. Therefore, many refrigeration devices based on thermoelectric cooling modules have emerged in the prior art, mainly applied to some scenarios where large refrigeration equipment cannot be used. However, the existing refrigeration devices based on thermoelectric cooling modules also have deficiencies, mainly manifested in that the shape of the thermoelectric cooling module is fixed, and it is difficult to fully cover the surface of the target object if the surface of the target object is irregular. Summary of the Invention

[0004] In order to solve the deficiencies in the prior art, the present invention provides a variable-frequency refrigeration device and a refrigeration suit, which can flexibly change the spatial form of the refrigeration components. By adjusting all the refrigeration components, the variable-frequency refrigeration device as a whole can be adjusted into various forms.

[0005] In order to achieve the above purpose, the specific solution adopted by the present invention is as follows:

[0006] The present invention provides a variable-frequency refrigeration device, which includes a plurality of refrigeration components. Each refrigeration component includes a central semiconductor refrigeration chip and a plurality of edge semiconductor refrigeration chips distributed around the central semiconductor refrigeration chip. The central semiconductor refrigeration chip is connected to at least two of the edge semiconductor refrigeration chips through a connection belt. The connection belt is provided with a bending portion at a position corresponding to the central semiconductor refrigeration chip, and a deformation space is formed between the bending portion and the central semiconductor refrigeration chip. The connection belt includes a strip-shaped base material, at least one metal strip is embedded on the first side of the base material, and a plurality of through holes are evenly distributed along the length direction on the second side of the base material, and a part of the metal strip is exposed through the through holes.

[0007] Preferably, four edge semiconductor refrigeration chips are arranged around the circumference of each central semiconductor refrigeration chip. Two relatively arranged edge semiconductor refrigeration chips are connected to the central semiconductor refrigeration chip through the connection belt, and the two bending portions on the two metal strips are arranged staggeredly.

[0008] Preferably, the variable-frequency refrigeration device further includes at least one water supply pipe, and the water supply pipe can contact the central semiconductor refrigeration chip and pass through the deformation space.

[0009] Preferably, the water supply pipe is distributed in a broken line shape and forms two juxtaposed heat exchange sections in the deformation space. The two heat exchange sections are connected through a connection unit.

[0010] Preferably, the connection unit includes two fixing blocks. The fixing blocks are fixedly connected with two clamping pieces, and a clamping space capable of accommodating the heat exchange section is formed between the two clamping pieces. The two fixing blocks are fixedly connected through a connecting bar.

[0011] Preferably, the connecting bar is fixedly connected with two elastic pads parallel to the central semiconductor refrigeration chip, and the connecting bar is located between the two elastic pads.

[0012] Preferably, all the water supply pipes are commonly connected to a heat dissipation component. The heat dissipation component includes a first shell and a second shell fixedly connected, and the first shell and the second shell are separated by a partition plate. At least two liquid guide pipes for connecting the water supply pipes are penetrated on the first shell, and a heat exchange coil is communicated between the liquid guide pipes. A plurality of juxtaposed heat conduction fins are penetrated on the partition plate, and a fan is arranged in the second shell.

[0013] Preferably, a wind guide window is opened on the first shell, an air outlet hole and at least one air inlet hole are opened on the second shell, and filter nets are arranged in the wind guide window, the air outlet hole and the air inlet hole.

[0014] Preferably, a film is attached to the second side of the base material. The film is composed of a plurality of covering sheets distributed along a straight line. The covering sheets can close the through holes, and the through holes can be exposed when the covering sheets are removed.

[0015] The present invention also provides a refrigeration suit, which includes a first covering layer and a second covering layer, and the above-mentioned variable-frequency refrigeration device is arranged between the first covering layer and the second covering layer.

[0016] The present invention has the following beneficial effects: The present invention can flexibly change the spatial form of the refrigeration components. By adjusting all the refrigeration components, the variable-frequency refrigeration device can be adjusted into various forms as a whole, and the scope of application is wider; on the one hand, the connecting belt of the refrigeration components in the present invention can connect the central semiconductor refrigeration chip and the edge semiconductor refrigeration chip, and on the other hand, it can also be used as the main power supply line, thereby reducing the overall number of cables used, being easier to process, having a lower cost, and by setting a bending part on the connecting belt, when the central semiconductor refrigeration chip is impacted, the bending part can bear the impact and absorb the impact energy through deformation to prevent the central semiconductor refrigeration chip from being directly impacted, realizing the protection of the central semiconductor refrigeration chip; in addition, because the connecting belt body includes a metal belt, the metal belt can absorb a part of the heat emitted by the central semiconductor refrigeration chip and dissipate it outward through the metal belt, thereby accelerating the heat dissipation speed of the hot side of the central semiconductor refrigeration chip and ensuring the refrigeration efficiency of the central semiconductor refrigeration chip. Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0018] Figure 1 It is a schematic structural diagram of the refrigeration components.

[0019] Figure 2 It is a schematic diagram of the arrangement of multiple refrigeration components.

[0020] Figure 3 It is a schematic structural diagram of the connecting belt.

[0021] Figure 4 It is a schematic structural diagram of the connecting unit.

[0022] Figure 5 It is a schematic structural diagram of a refrigeration suit.

[0023] Figure 6 It is a schematic structural diagram of the heat dissipation components.

[0024] Reference numerals: 1 - Edge semiconductor refrigeration sheet, 2 - Central semiconductor refrigeration sheet, 3 - Connecting band, 4 - Bending part, 5 - Deformation space, 6 - Water supply pipe, 7 - First coating layer, 8 - Second coating layer, 9 - Base material, 10 - Metal strip, 11 - Through hole, 12 - Coating film, 13 - Clamping piece, 14 - Fixed block, 15 - Connecting bar, 16 - Elastic pad, 17 - Front piece, 18 - Shoulder strap, 19 - Rear piece, 20 - Air inlet hole, 21 - First housing, 22 - Partition board, 23 - Second housing, 24 - Liquid guide pipe, 25 - Air guide window, 26 - Heat exchange coil, 27 - Heat conducting sheet, 28 - Fan, 29 - Air outlet hole. Detailed implementation manners

[0025] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0026] As Figure 1 and Figure 2 shown, a variable-frequency refrigeration device includes a plurality of refrigeration components. The refrigeration components include a central semiconductor refrigeration sheet 2 and a plurality of edge semiconductor refrigeration sheets 1 distributed around the central semiconductor refrigeration sheet 2, and there is a distance between the edge semiconductor refrigeration sheet 1 and the central semiconductor refrigeration sheet 2. The central semiconductor refrigeration sheet 2 is connected to at least two edge semiconductor refrigeration sheets 1 through a connecting band 3. The connecting band 3 is provided with a bending part 4 at a position corresponding to the central semiconductor refrigeration sheet 2, and a deformation space 5 is formed between the bending part 4 and the central semiconductor refrigeration sheet 2. The connecting band 3 includes a strip-shaped base material 9. At least one metal strip 10 is embedded on the first side of the base material 9, and a plurality of through holes 11 are formed on the second side of the base material 9 and are evenly distributed along the length direction, and a part of the metal strip 10 is exposed through the through holes 11.

[0027] The main structure of the variable-frequency refrigeration device of the present invention includes a plurality of refrigeration components. In the refrigeration components, the central semiconductor refrigeration sheet 2 and the edge semiconductor refrigeration sheets 1 cooperate together to achieve refrigeration. Moreover, the semiconductor refrigeration sheet can achieve precise control of temperature by changing the input current, and the temperature can be flexibly controlled according to actual needs, making it more user-friendly. In addition, the central semiconductor refrigeration sheet 2 and the edge semiconductor refrigeration sheets 1 are connected through the connecting band 3, and the relative positions of the edge semiconductor refrigeration sheets 1 and the central semiconductor refrigeration sheet 2 can be flexibly changed, thereby changing the spatial form of the refrigeration components. By adjusting all the refrigeration components, the variable-frequency refrigeration device as a whole can be adjusted into various forms, with a wider application range and can be applied to more scenarios to achieve refrigeration.

[0028] Further, as Figure 3 shown, the connection strip 3 includes a metal strip 10. On the one hand, the metal strip 10 can be connected to the central semiconductor refrigeration chip 2 or the edge semiconductor refrigeration chip 1. On the other hand, a part of the metal strip 10 can be exposed through the through hole 11, and the exposed part of the metal strip 10 forms a connection point. On this basis, the metal strip 10 can be used as the main power supply line, and power is supplied to the central semiconductor refrigeration chip 2 and the edge semiconductor refrigeration chip 1 through branch wires. One end of the branch wire can be connected to the connection point of the main power supply line, and the other end of the branch wire can be connected to the electrode point of the central semiconductor refrigeration chip 2 or the edge semiconductor refrigeration chip 1. Based on this structure, the connection strip 3 can connect the central semiconductor refrigeration chip 2 and the edge semiconductor refrigeration chip 1 on the one hand, and can also be used as the main power supply line on the other hand, thereby reducing the overall number of cables used and being more easily processed. As Figure 2 shown, when multiple refrigeration components are arranged in parallel, the connection strips 3 in two adjacent refrigeration components can be made into an integral structure, so that more refrigeration components can be connected together with fewer connection strips 3.

[0029] In addition, by forming a bending part 4 on the side of the central semiconductor refrigeration chip 2 of the connection strip 3 and forming a deformation space 5 between the bending part 4 and the central semiconductor refrigeration chip 2, the bending part 4 can be used to protect the central semiconductor refrigeration chip 2. When the central semiconductor refrigeration chip 2 is impacted, the bending part 4 can bear the impact and absorb the impact energy through deformation to prevent the central semiconductor refrigeration chip 2 from being directly impacted, realizing the protection of the central semiconductor refrigeration chip 2.

[0030] Furthermore, the bending part 4 is located on the hot side of the central semiconductor refrigeration chip 2, that is, on the side where the central semiconductor refrigeration chip 2 dissipates heat. Since the main body of the connection strip 3 includes the metal strip 10, the metal strip 10 can absorb a part of the heat emitted by the central semiconductor refrigeration chip 2 and dissipate it outward through the metal strip 10, thereby accelerating the heat dissipation speed of the hot side of the central semiconductor refrigeration chip 2 and ensuring the refrigeration efficiency of the central semiconductor refrigeration chip 2. When there is an air flow in the environment where the variable-frequency refrigeration device is located, the air flow can also pass through the deformation space 5 to further accelerate the heat dissipation speed of the hot side of the central semiconductor refrigeration chip 2.

[0031] Considering that a plurality of through holes 11 are provided on the connecting belt 3, correspondingly, a plurality of connection points can be formed on the metal belt 10. However, in actual application, not all connection points may be needed. In order to protect the unused connection points and prevent the metal belt 10 from being damaged by environmental erosion, a coating film 12 is attached to the second side of the base material 9. The coating film 12 is composed of a plurality of covering pieces distributed in a straight line. The covering pieces can close the through holes 11, and the through holes 11 can be exposed when the covering pieces are removed. By providing the covering pieces, only the connection points that need to be used can be exposed, while the unused connection points are closed. Further, after the branch wire is connected to the connection point, glue can be applied at the connection position for sealing, thereby extending the service life of the metal belt 10.

[0032] In an embodiment of the present invention, as Figure 1 shown, four edge semiconductor refrigeration chips 1 are arranged around the circumference of each central semiconductor refrigeration chip 2. Two relatively arranged edge semiconductor refrigeration chips 1 are connected to the central semiconductor refrigeration chip 2 through a connecting belt 3. The two bending parts 4 on the two metal belts 10 are arranged in an alternating manner. Further, the central semiconductor refrigeration chip 2 is circular, and the edge semiconductor refrigeration chip 1 is rectangular. The distance between the central semiconductor refrigeration chip 2 and the edge semiconductor refrigeration chip 1 is larger, and there is a larger adjustment space when adjusting the shape of the refrigeration component, which is convenient for adjusting the refrigeration component to the required shape. The two bending parts 4 are arranged in an alternating manner, which can form a more stable support protection structure on the hot side of the central semiconductor refrigeration chip 2, thereby protecting the central semiconductor refrigeration chip 2 more effectively. In other embodiments of the present invention, the shape and number of the edge semiconductor refrigeration chips 1 can be flexibly adjusted according to actual needs.

[0033] Considering that the refrigeration efficiency of the central semiconductor refrigeration chip 2 and the edge semiconductor refrigeration chip 1 in the refrigeration component is greatly affected by the heat dissipation speed of the hot side, in order to further improve the refrigeration efficiency of the variable-frequency refrigeration device of the present invention, the variable-frequency refrigeration device further includes at least one water supply pipe 6. The water supply pipe 6 can contact the central semiconductor refrigeration chip 2 and pass through the deformation space 5. By providing the water supply pipe 6, cooling water can be transported by the water supply pipe 6. When the cooling water passes through the deformation space 5, it can absorb the heat emitted by the central semiconductor refrigeration chip 2 and take away this part of the heat, achieving the effect of accelerating heat dissipation and ensuring the refrigeration efficiency of the central semiconductor refrigeration chip 2. Similarly, the water supply pipe 6 can also pass by the side of the edge semiconductor refrigeration chip 1 and absorb the heat emitted by the edge semiconductor refrigeration chip 1, also ensuring the refrigeration efficiency of the edge semiconductor refrigeration chip 1.

[0034] In order to enable the water supply pipe 6 to absorb more heat from the refrigeration component, the water supply pipe 6 is distributed in a zigzag shape and forms two juxtaposed heat exchange sections in the deformation space 5, and the two heat exchange sections are connected by a connecting unit. The zigzag-distributed water supply pipe 6 can pass through more refrigeration components, thereby absorbing more heat and improving the heat conduction efficiency. Connecting the two heat exchange sections in the deformation space 5 through the connecting unit can stabilize the shape of the water supply pipe 6, thereby ensuring that the water supply pipe 6 can continuously and stably play its role.

[0035] As Figure 4 shown, the specific structure of the connecting unit is: the connecting unit includes two fixing blocks 14, the fixing blocks 14 are fixedly connected with two clamping pieces 13, and a clamping space capable of accommodating the heat exchange section is formed between the two clamping pieces 13, and the two fixing blocks 14 are fixedly connected through a connecting strip 15. The fixing blocks 14 and the two clamping pieces 13 cooperate to fix a heat exchange section, and then the two heat exchange sections can be stably connected together through the connecting strip 15, so as to achieve the effect of stabilizing the shape of the water supply pipe 6.

[0036] Furthermore, the connecting strip 15 is fixedly connected with two elastic pads 16 parallel to the central semiconductor refrigeration sheet 2, and the connecting strip 15 is located between the two elastic pads 16. On this basis, the connecting unit can be arranged in the deformation space. After the bending part 4 is deformed by impact, it can abut against the elastic pad 16, and a part of the impact energy can be absorbed by the elastic pad 16, so as to better protect the central semiconductor refrigeration sheet 2. In an embodiment of the present invention, the clamping pieces 13, the fixing blocks 14 and the connecting strip 15 can be made of silica gel material, and the elastic pads 16 can be made of sponge material, which are all conventional materials and will not be elaborated here.

[0037] In order to ensure that the water supply pipe 6 can continuously play its role, that is, it can continuously conduct the heat dissipated from the hot side of the refrigeration component to the surrounding environment, all the water supply pipes 6 are commonly connected with a heat dissipation component. As Figure 5As shown in the figure, the heat dissipation component includes a first housing 21 and a second housing 23 which are fixedly connected, and the first housing 21 and the second housing 23 are separated by a partition plate 22. At least two liquid guide pipes 24 for connecting a water supply pipe 6 are penetrated through the first housing 21, and a heat exchange coil 26 is communicated between the liquid guide pipes 24. A plurality of heat conducting fins 27 arranged in parallel are penetrated through the partition plate 22, and a fan 28 is arranged in the second housing 23. After the cooling water passes through the water supply pipe 6, it can enter the heat exchange coil 26 through the liquid guide pipe 24. Then, the fan 28 continuously blows air to all the heat conducting fins 27, and the heat conducting fins 27 transfer the heat emitted by the heat exchange coil 26 in the first housing 21 to the second housing 23, and then the heat is quickly conducted to the surrounding environment through the air flow. Repeating this process can quickly reduce the temperature of the cooling water, and the cooled cooling water can be reused, that is, absorb heat from the refrigeration component again. Further, a wind guiding window 25 is opened on the first housing 21, an air outlet hole 29 and at least one air inlet hole 20 are opened on the second housing 23, and filter nets are arranged in the wind guiding window 25, the air outlet hole 29 and the air inlet hole 20.

[0038] The present invention further provides a refrigeration suit, which includes a first covering layer 7 and a second covering layer 8, and the above-mentioned variable-frequency refrigeration device is arranged between the first covering layer 7 and the second covering layer 8. According to actual requirements, the refrigeration suit can be made into different forms. For example, in an embodiment of the present invention, the refrigeration suit is made into a vest. Correspondingly, the structure includes two front pieces 17, two shoulder straps 18 and a back piece 19, as Figure 5 shown. In Figure 5 , in order to more clearly show the distribution mode of the water supply pipe 6, the structure of the refrigeration component is omitted, and only a part of the water supply pipe 6 is retained.

[0039] In this specification, each embodiment is described in a progressive manner. The key point of each embodiment is to illustrate the differences from other embodiments. The same or similar parts among the embodiments can be referred to each other.

[0040] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A variable-frequency refrigeration device, characterized in that, The invention comprises a plurality of refrigeration components, wherein the refrigeration components include a central semiconductor refrigeration plate and a plurality of edge semiconductor refrigeration plates distributed around the central semiconductor refrigeration plate, wherein the central semiconductor refrigeration plate is connected to at least two of the edge semiconductor refrigeration plates by a connecting belt, wherein the connecting belt is provided with a bent portion at a position corresponding to the central semiconductor refrigeration plate, and a deformation space is formed between the bent portion and the central semiconductor refrigeration plate, and the connecting belt comprises a strip-shaped substrate, wherein at least one metal strip is embedded in a first side of the substrate, and a plurality of through holes uniformly distributed along the length direction are opened on a second side of the substrate, and the through holes expose a portion of the metal strip; a covering film is attached to the second side of the substrate, and the covering film is composed of a plurality of cover sheets distributed along a straight line, wherein the cover sheets can close the through holes, and when the cover sheets are removed, the through holes can be exposed; The device further includes at least one water supply pipe, which is capable of contacting the central semiconductor refrigeration plate and passing through the deformation space.

2. The variable-frequency refrigeration device according to claim 1, wherein, Four edge semiconductor refrigeration fins are arranged around the circumference of each central semiconductor refrigeration fin, two oppositely arranged edge semiconductor refrigeration fins are connected to the central semiconductor refrigeration fin through the connecting belt, and the two bent portions on the two metal belts are staggered.

3. The variable-frequency refrigeration device according to claim 2, wherein The water supply pipe is distributed in a broken line shape and forms two parallel heat exchange sections in the deformation space. The two heat exchange sections are connected via a connecting unit.

4. The variable-frequency refrigeration device according to claim 3, characterized in that, The connection unit includes two fixing blocks, the fixing blocks are fixedly connected to two clamping pieces, a clamping space capable of accommodating the heat exchange section is formed between the two clamping pieces, and the two fixing blocks are fixedly connected by a connecting strip.

5. The variable-frequency refrigeration device according to claim 4, wherein, The connecting strip is fixedly connected to two elastic pads parallel to the central semiconductor refrigeration plate, and the connecting strip is located between the two elastic pads.

6. The variable-frequency refrigeration device according to claim 2, wherein All the water supply pipes are commonly connected to a heat dissipation assembly, which includes a first shell and a second shell that are fixedly connected, and the first shell and the second shell are separated by a partition. At least two liquid guide tubes for connecting the water supply pipes are passed through the first shell, and a heat exchange coil is connected between the two liquid guide tubes. A plurality of parallel heat conducting plates are passed through the partition, and a fan is provided in the second shell.

7. The variable-frequency refrigeration device according to claim 6, characterized in that, An air guide window is provided on the first shell, and an air outlet and at least one air inlet are provided on the second shell. Filters are provided in the air guide window, the air outlet and the air inlet.

8. Cooling suit, characterized in that, The invention comprises a first cladding layer and a second cladding layer, wherein the variable frequency refrigeration device according to any one of claims 1 to 7 is arranged between the first cladding layer and the second cladding layer.

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