Heat exchange system and household appliance
By adopting a combination technology of spray structure and tilt control parts in the heat exchange system, the problem of low heat or cold utilization of electric card refrigeration devices is solved, and more efficient heat or cold exchange is achieved.
Patent Information
- Application Number
- CN202311542585.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-17
- Publication Date
- 2025-05-30
AI Technical Summary
When applying the heat or cold amount generated by the electric card refrigeration device to the heat exchange system, the heat exchange system has a lower effect on the heat or cold amount generated by the electric card refrigeration device.
The heat exchange working fluid is sprayed with a spray structure, and the electric card refrigeration device is controlled to incline in different directions through the inclination control member to export the hot and cold working fluids generated after heat exchange respectively.
The heat exchange system has improved the utilization effect of the heat or cooling capacity generated by the electric card refrigeration device, and achieved more efficient heat or cooling capacity exchange.
Smart Images

Figure CN120062866A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of heat exchange, for example, to a heat exchange system and a household appliance. Background Art
[0002] Refrigeration is an essential thing in people's daily life, from refrigeration equipment that requires constant-temperature refrigeration to air conditioners of users. However, in traditional refrigeration technologies, the gas refrigerants used in gas compression refrigeration can damage the atmospheric ozone layer and cause the greenhouse effect. Therefore, exploring new pollution-free and environmentally friendly refrigeration technologies has become an urgent task.
[0003] When an electric field is applied to or removed from an electrocaloric material, the electrocaloric material will exhibit an endothermic or exothermic phenomenon, that is, the electrocaloric effect. Electrocaloric refrigeration devices are a new refrigeration technology based on the electrocaloric effect of electrocaloric materials. They do not need to use the compressors and refrigerants required by common refrigeration technologies, delaying the generation of the greenhouse effect and avoiding environmental pollution problems caused by refrigerant leakage.
[0004] In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related technologies:
[0005] When applying the heat or cold generated by an electrocaloric refrigeration device to a heat exchange system, the utilization effect of the heat or cold generated by the electrocaloric refrigeration device by the heat exchange system is relatively low.
[0006] It should be noted that the information disclosed in the above background art section is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute the prior art known to those of ordinary skill in the art. Summary of the Invention
[0007] To have a basic understanding of some aspects of the disclosed embodiments, a simple summary is given below. The summary is not a general review, nor is it intended to identify key / important constituent elements or delineate the protection scope of these embodiments, but rather serves as a preamble to the subsequent detailed description.
[0008] The embodiments of the present disclosure provide a heat exchange system and a household appliance.
[0009] In some embodiments, the heat exchange system includes a heat source component, a hot-end heat exchanger, and a cold-end heat exchanger. The heat source component includes a heat source tank and one or more electrocaloric spray heat exchange components disposed in the heat source tank. The heat source tank includes a hot working fluid outlet and a cold working fluid outlet. The hot-end heat exchanger is connected to the hot working fluid outlet through a first working fluid circulation pipeline, and the cold-end heat exchanger is connected to the cold working fluid outlet through a second working fluid circulation pipeline. Among them, the electrocaloric spray heat exchange component includes: an electrocaloric refrigeration device that alternately generates heat and cold; a spray component for spraying a heat exchange working fluid onto the surface of the electrocaloric refrigeration device to enable the heat exchange working fluid to exchange heat with the electrocaloric refrigeration device. When the electrocaloric refrigeration device generates heat, the heat-exchanged hot working fluid flows out from the hot working fluid outlet; when the electrocaloric refrigeration device generates cold, the heat-exchanged cold working fluid flows out from the cold working fluid outlet.
[0010] In some embodiments, the household electrical appliance includes the heat exchange system as described above.
[0011] The heat exchange system and the household electrical appliance provided by the embodiments of the present disclosure can achieve the following technical effects:
[0012] The heat source component includes a heat source tank and an electrocaloric spray heat exchange component. A spray structure is used to spray the heat exchange working fluid to exchange the heat or cold generated by the electrocaloric refrigeration device. At the same time, an inclination control member is used to control the electrocaloric refrigeration device to tilt in different directions to respectively discharge the hot working fluid and the cold working fluid generated after heat exchange, improving the utilization effect of the heat or cold generated by the electrocaloric refrigeration device by the heat exchange system.
[0013] The above general description and the following description are only exemplary and explanatory, and are not used to limit the present application. Description of the Drawings
[0014] One or more embodiments are exemplarily illustrated by corresponding drawings. These exemplary illustrations and the drawings do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements. The drawings do not constitute a scale limitation, and among them:
[0015] Figure 1 is a schematic structural diagram of a heat source component provided by an embodiment of the present disclosure;
[0016] Figure 2 is a schematic structural diagram of another heat source component provided by an embodiment of the present disclosure;
[0017] Figure 3 is a schematic structural diagram of another heat source component provided by an embodiment of the present disclosure;
[0018] Figure 4 is a schematic structural diagram of another heat source component provided by an embodiment of the present disclosure;
[0019] Figure 5 It is a schematic diagram of a heat exchange system provided by an embodiment of the present disclosure;
[0020] Figure 6 It is a schematic diagram of the structure of a piezoelectric functional film layer in an electrocaloric element provided by an embodiment of the present disclosure;
[0021] Figure 7 It is a schematic diagram of the structure of an electrocaloric element provided by an embodiment of the present disclosure;
[0022] Figure 8 It is a flowchart of a preparation method of an electrocaloric element provided by an embodiment of the present disclosure;
[0023] Figure 9 It is a schematic diagram of the structure of an electrocaloric refrigeration chip provided by an embodiment of the present disclosure;
[0024] Figure 10 It is a schematic diagram of an electrocaloric element in an electrocaloric refrigeration chip fitting to a heat receiving end provided by an embodiment of the present disclosure;
[0025] Figure 11 It is a schematic diagram of an electrocaloric element in an electrocaloric refrigeration chip fitting to a cold receiving end provided by an embodiment of the present disclosure.
[0026] Reference numerals:
[0027] 1: First electrode layer; 11: Electrocaloric refrigeration electrode region; 12: Piezoelectric drive electrode region; 13: Electrode gap;
[0028] 2: Second electrode layer;
[0029] 3: Third electrode layer;
[0030] 4: Piezoelectric functional film layer; 41: Piezoelectric displacement unit; 42: Piezoelectric refrigeration unit; 431: First through partition gap; 432: First through piezoelectric displacement unit; 433: Second through partition gap;
[0031] 5: Substrate layer;
[0032] 100: Electrocaloric element;
[0033] 201: First clamping skeleton; 202: Second clamping skeleton; 203: First bending gap; 204: Second bending gap; 205: Support skeleton;
[0034] 300: Heat receiving end;
[0035] 400: Cold receiving end;
[0036] 500: Heat source tank; 501: Hot working fluid outlet; 502: Cold working fluid outlet; 503: Working fluid inlet; 510: Spraying assembly; 511: Spraying pipe; 512: Nozzle; 520: Electrocaloric refrigeration device; 521: First end of the electrocaloric refrigeration device; 522: Second end of the electrocaloric refrigeration device; 530: Inclined support; 531: First diversion groove; 5311: First diversion bottom wall; 5312: First diversion side wall; 532: Second diversion groove; 5321: Second diversion bottom wall; 5322: Second diversion side wall; 540: Heat source tank inlet pipeline; 541: First pump body;
[0037] 600: Hot end heat exchanger; 610: First working fluid inlet pipeline; 620: First working fluid outlet pipeline; 621: First check valve;
[0038] 700: Cold end heat exchanger; 710: Second working fluid inlet pipeline; 720: Second working fluid outlet pipeline; 721: Second check valve. Detailed implementation manners
[0039] In order to be able to understand the features and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. The attached drawings are only for reference and explanation, and are not used to limit the embodiments of the present disclosure. In the following technical description, for the sake of convenience of explanation, multiple details are provided to provide a full understanding of the disclosed embodiments. However, one or more embodiments can still be implemented without these details. In other cases, well-known structures and devices can be shown in a simplified manner.
[0040] In the embodiments of the present disclosure, terms such as "first", "second", etc. in the specification and claims of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so as to describe the embodiments of the present disclosure here. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion.
[0041] In the embodiments of the present disclosure, the orientation or positional relationship indicated by terms such as "upper", "lower", "inner", "middle", "outer", "front", "rear", etc. is based on the orientation or positional relationship shown in the accompanying drawings. These terms are mainly used to better describe the embodiments of the present disclosure and their embodiments, and are not used to limit that the indicated devices, elements or components must have a specific orientation, or be constructed and operated in a specific orientation. And, in addition to being able to represent the orientation or positional relationship, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.
[0042] In addition, the terms "arranged", "connected", and "fixed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there can be internal communication between two devices, components, or parts. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to specific circumstances.
[0043] Unless otherwise specified, the term "plurality" means two or more.
[0044] The term "and / or" describes the associated relationship of an object, indicating that there can be three relationships. For example, A and / or B means: A or B, or, A and B these three relationships.
[0045] It should be noted that, without conflict, the embodiments in the embodiments of the present disclosure and the features in the embodiments can be combined with each other.
[0046] The embodiments of the present disclosure provide a heat source assembly. As Figures 1 to 4 shown.
[0047] The embodiments of the present disclosure provide a heat source assembly, including a heat source tank 500 and one or more electrocaloric spray heat exchange assemblies arranged in the heat source tank 500. The heat source tank 500 includes a hot working medium outlet 501 and a cold working medium outlet 502. The electrocaloric spray heat exchange assembly includes an electrocaloric refrigeration device 520, a spray assembly 510, and an inclination control member. The electrocaloric refrigeration device 520 alternately generates heat and cold. The electrocaloric refrigeration device 520 includes opposite first end 521 and second end 522; the spray assembly 510 is arranged above the electrocaloric refrigeration device 520 and is used to spray a heat exchange working medium onto the surface of the electrocaloric refrigeration device 520 to enable the heat exchange working medium to exchange heat with the electrocaloric refrigeration device 520; the inclination control member is used to control the inclination of the electrocaloric refrigeration device 520. Among them, when the electrocaloric refrigeration device 520 generates heat, the inclination control member controls the electrocaloric refrigeration device 520 to incline towards the hot working medium outlet 501, so that the heat exchange hot working medium flows out from the hot working medium outlet 501; when the electrocaloric refrigeration device 520 generates cold, the inclination control member controls the electrocaloric refrigeration device 520 to incline towards the cold working medium outlet 502, so that the heat exchange cold working medium flows out from the cold working medium outlet 502.
[0048] The electrocaloric effect is a thermal effect of ferroelectric materials under an electric field, where heat is released when an electric field is applied and heat is absorbed when the electric field is removed. The electrocaloric cooling device 520 is a cooling device based on the electrocaloric effect. When the electrocaloric cooling device 520 releases heat, the heat transfer working fluid is sprayed onto the surface of the electrocaloric cooling device 520, and the heat of the electrocaloric cooling device 520 is taken away by the evaporation and heat absorption of the heat transfer working fluid; similarly, when the electrocaloric cooling device 520 absorbs heat, that is, when cold is generated, the heat transfer working fluid is sprayed onto the surface of the electrocaloric cooling device 520, and the cold of the electrocaloric cooling device 520 is taken away by the condensation of the heat transfer working fluid.
[0049] The heat source assembly provided by the embodiments of the present disclosure uses a spraying assembly to spray the heat transfer working fluid onto the surface of the electrocaloric cooling device 520, so that the heat transfer working fluid exchanges heat and cold with the electrocaloric cooling device 520. The heat transfer working fluid can quickly take away the heat or cold generated by the electrocaloric cooling device 520 in a short time; moreover, the heat transfer working fluid is evenly distributed on the surface of the electrocaloric cooling device 520, avoiding the hot spot problem generated by the electrocaloric cooling device 520; at the same time, after the heat transfer working fluid is sprayed onto the surface of the electrocaloric cooling device 520, it can quickly absorb or release heat to quickly take away the heat or cold on the surface of the electrocaloric cooling device 520, thereby quickly adjusting the temperature of the electrocaloric cooling device 520 and preventing the electrocaloric cooling device 520 from overheating or overcooling, and improving the service life of the electrocaloric cooling device 520. It can be seen that the heat source assembly provided by the embodiments of the present disclosure can enable the heat transfer working fluid to effectively, quickly and fully exchange heat or cold with the electrocaloric cooling device 520, which is beneficial to the subsequent utilization of the exchanged heat or cold.
[0050] The spraying assembly 510 is arranged above the electrocaloric cooling device 520 to spray the heat transfer working fluid onto the surface of the electrocaloric cooling device 520 in a direction generally from top to bottom. Optionally, the surface of the electrocaloric cooling device 520 is coated with a hydrophilic coating to improve the heat exchange effect between the heat transfer working fluid and the electrocaloric cooling device 520. Optionally, the supporting surface of the electrocaloric cooling device 520 is coated with a hydrophobic coating to prevent the retention of heat transfer working fluid droplets and affect the next cycle.
[0051] Meanwhile, the heat source assembly provided by the embodiments of the present disclosure further includes an inclination control member for controlling the inclination of the electrocaloric refrigeration device 520. When the electrocaloric refrigeration device 520 generates heat, after the heat exchange working medium sprayed onto the surface of the electrocaloric refrigeration device 520 exchanges heat with the electrocaloric refrigeration device 520, the temperature rises and it becomes a hot working medium. At this time, the electrocaloric refrigeration device 520 is controlled to incline towards the hot working medium outlet 501 of the heat source tank 500, so that the hot working medium obtained after heat exchange flows towards the hot working medium outlet 501 of the heat source tank 500 and flows out from the hot working medium outlet 501, so as to utilize the heat exchanged by the heat exchange working medium subsequently; when the electrocaloric refrigeration device 520 generates cold, after the heat exchange working medium sprayed onto the surface of the electrocaloric refrigeration device 520 exchanges cold with the electrocaloric refrigeration device 520, the temperature drops and it becomes a cold working medium. At this time, the electrocaloric refrigeration device 520 is controlled to incline towards the cold working medium outlet 502 of the heat source tank 500, so that the cold working medium obtained after cold exchange flows towards the cold working medium outlet 502 of the heat source tank 500 and flows out from the cold working medium outlet 502, so as to utilize the cold exchanged by the heat exchange working medium subsequently.
[0052] Optionally, the electrocaloric refrigeration device 520 includes opposite first end 521 and second end 522. When the electrocaloric refrigeration device 520 inclines towards the hot working medium outlet 501, the inclination state of the electrocaloric refrigeration device 520 can be that the first end 521 descends while the second end 522 ascends, as Figure 4 shown. When the electrocaloric refrigeration device 520 inclines towards the cold working medium outlet 502, the inclination state of the electrocaloric refrigeration device 520 can be that the second end 522 descends while the first end 521 ascends, as Figures 1 to 3 shown.
[0053] Optionally, a length direction of the electrocaloric refrigeration device 520 is formed between the first end 521 and the second end 522 of the electrocaloric refrigeration device.
[0054] Optionally, the electrocaloric refrigeration device 520 includes opposite first end and second end, and further includes a first side and a second side between the first end and the second end. Side walls are provided on both the first side and the second side, so that the heat exchange working medium sprayed onto the surface of the electrocaloric refrigeration device 520 can stay on the surface of the electrocaloric refrigeration device for a certain period of time, so as to improve the heat exchange effect between the heat exchange working medium and the surface of the electrocaloric refrigeration device.
[0055] Optionally, the heat exchange method of the electrocaloric spray heat exchange component provided by the embodiments of the present disclosure may be as follows: When the electrocaloric refrigeration device 520 generates heat, control the spray component 510 to spray the heat exchange working medium on the surface of the electrocaloric refrigeration device 520, and control the electrocaloric refrigeration device 520 to maintain a horizontal state for a certain period of time. After the heat exchange between the heat exchange working medium and the electrocaloric refrigeration device 520 is completed, the tilt control member controls the first end of the electrocaloric refrigeration device 520 to lower and the second end to rise, so that the electrocaloric refrigeration device 520 tilts towards the heat working medium outlet 501, and the heat exchange heat working medium flows out from the heat working medium outlet 501 of the heat source tank 500; When the electrocaloric refrigeration device 520 generates cold, control the spray component 510 to spray the heat exchange working medium on the surface of the electrocaloric refrigeration device 520, and control the electrocaloric refrigeration device 520 to maintain a horizontal state for a certain period of time. After the heat exchange working medium completes the cold quantity exchange with the electrocaloric refrigeration device 520, the tilt control member controls the second end of the electrocaloric refrigeration device 520 to lower and the first end to rise, so that the electrocaloric refrigeration device 520 tilts towards the cold working medium outlet 502, and the cold working medium after the cold quantity exchange flows out from the cold working medium outlet 502 of the heat source tank 500.
[0056] Optionally, the number of electrocaloric spray heat exchange components in the heat source tank 500 may be multiple. When multiple electrocaloric spray heat exchange components are simultaneously provided in the heat source tank 500, the multiple spray components 510 in the heat source tank 500 can simultaneously perform spray heat exchange for their corresponding multiple electrocaloric refrigeration devices 520, improving the total amount of heat and cold generated by heat exchange in the heat source tank 500.
[0057] Optionally, the heat source tank 500 further includes a first diversion groove 531 and a second diversion groove 532.
[0058] The first diversion groove 531 conducts the first end 521 of the electrocaloric refrigeration device to the heat working medium outlet 501 of the heat source tank 500, and is used to divert the heat working medium to the heat working medium outlet 501. The second diversion groove 532 conducts the second end 522 of the electrocaloric refrigeration device to the cold working medium outlet 502 of the heat source tank 500, and is used to divert the cold working medium to the cold working medium outlet 502.
[0059] Optionally, the first diversion channel 531 includes a first diversion bottom wall 5311 and a first diversion side wall 5312. The first diversion bottom wall 5311 is in communication with the hot working fluid outlet 501. The first diversion side wall 5312 extends upward from the first diversion bottom wall 5311. Moreover, the first diversion side wall 5312 is disposed at the first end 521 of the electrocaloric refrigeration device, and is configured to divert the hot working fluid flowing out obliquely from the first end to the hot working fluid outlet 501. The second diversion channel 532 includes a second diversion bottom wall 5321 and a second diversion side wall 5322. The second diversion bottom wall 5321 is in communication with the cold working fluid outlet 502. The second diversion side wall 5322 extends upward from the second diversion bottom wall 5321. Moreover, the second diversion side wall 5322 is disposed at the second end 522 of the electrocaloric refrigeration device, and is configured to divert the cold working fluid flowing out obliquely from the second end to the cold working fluid outlet 502.
[0060] When the electrocaloric refrigeration device 520 generates heat, the tilting control member controls the first end 521 of the electrocaloric refrigeration device to lower and the second end 522 to rise. Moreover, the first end 521 of the electrocaloric refrigeration device abuts against the first diversion side wall 5312, so that the hot working fluid flowing out from the first end can smoothly flow into the first diversion channel 531, as Figure 4 shown. When the electrocaloric refrigeration device 520 generates cold, the tilting control member controls the second end 522 of the electrocaloric refrigeration device to lower and the first end 521 to rise. Moreover, the second end 522 of the electrocaloric refrigeration device abuts against the second diversion side wall 5322, so that the cold working fluid flowing out from the second end can smoothly flow into the second diversion channel 532, as Figures 1 to 3 shown.
[0061] When multiple electrocaloric spray heat exchange assemblies are provided in the heat source tank 500, the first diversion bottom walls 5311 of the multiple electrocaloric spray heat exchange assemblies converge at the bottom of the heat source tank 500, and converge the hot working fluid to the hot working fluid outlet 501; similarly, the second diversion bottom walls 5321 of the multiple electrocaloric spray heat exchange assemblies converge at the bottom of the heat source tank 500, and converge the cold working fluid to the cold working fluid outlet 502.
[0062] Optionally, the electrocaloric refrigeration device 520 includes a spray surface for spray heat exchange with the heat exchange working fluid, and a support surface opposite to the spray surface. Among them, the tilting control member includes a tilting support member 530, which is disposed on the support surface of the electrocaloric refrigeration device 520.
[0063] The tilting control member includes a tilting support member 530 disposed on the support surface of the electrocaloric refrigeration device 520 to support the electrocaloric refrigeration device 520 in an inclined state. Optionally, the shape of the tilting support member 530 is a triangular pyramid, as Figures 1 to 4As shown, a groove connected to the inclined support member 530 is provided on the support surface of the electrocaloric refrigeration device 520. Optionally, the inclined support member 530 is disposed in the middle of the support surface of the electrocaloric refrigeration device 520, that is, in the middle between the first end and the second end of the electrocaloric refrigeration device 520. This is beneficial for the inclined support member 530 to support the electrocaloric refrigeration device 520 to tilt towards the hot working fluid outlet 501 side, and is also beneficial for the inclined support member 530 to support the electrocaloric refrigeration device 520 to tilt towards the cold working fluid outlet 502 side.
[0064] Optionally, the setting height of the inclined support member 530 is higher than the heights of the first diversion sidewall 5312 and the second diversion sidewall 5322.
[0065] The setting height of the inclined support member 530 can be understood as the height of the inclined support member 530 at the place where it plays a supporting role with the electrocaloric refrigeration device 520. The height of the first diversion sidewall 5312 can be understood as the height of the topmost end of the first diversion sidewall 5312, and the height of the second diversion sidewall 5322 can be understood as the height of the topmost end of the second diversion sidewall 5322. In the embodiments of the present disclosure, the setting height of the inclined support member 530 is higher than the height of the first diversion sidewall 5312, and moreover, the setting height of the inclined support member 530 is higher than the height of the second diversion sidewall 5322, as Figures 1 to 4 shown, forming a structure similar to a seesaw. This is beneficial for the inclined support member 530 to support the electrocaloric refrigeration device 520 to tilt towards the hot working fluid outlet 501 side, and is also beneficial for the inclined support member 530 to support the electrocaloric refrigeration device 520 to tilt towards the cold working fluid outlet 502 side.
[0066] Optionally, the tilt control member further includes a first electromagnetic element and a second electromagnetic element. The first electromagnetic element is disposed on the first diversion sidewall 5312 and is used to attract the first end 521 of the electrocaloric refrigeration device; the second electromagnetic element is disposed on the second diversion sidewall 5322 and is used to attract the second end 522 of the electrocaloric refrigeration device.
[0067] Optionally, when the electrocaloric refrigeration device 520 generates heat, control the first electromagnetic element of the tilt control member to attract the first end 521 of the electrocaloric refrigeration device. At the same time, control the second electromagnetic element of the tilt control member to repel the second end 522 of the electrocaloric refrigeration device, so that the first end 521 of the electrocaloric refrigeration device is lowered and the second end 522 is raised, thereby causing the electrocaloric refrigeration device 520 to tilt towards the hot working fluid outlet 501 side. When the electrocaloric refrigeration device 520 generates cold, control the first electromagnetic element of the tilt control member to repel the first end 521 of the electrocaloric refrigeration device. At the same time, control the second electromagnetic element of the tilt control key to attract the second end 522 of the electrocaloric refrigeration device, so that the second end 522 of the electrocaloric refrigeration device is lowered and the first end 521 is raised, thereby causing the electrocaloric refrigeration device 520 to tilt towards the cold working fluid outlet 502 side.
[0068] Optionally, the electromagnetic force of the electromagnetic elements at both ends of the electrocaloric refrigeration device 520 can be periodically discharged and charged, and the inclination of the electrocaloric refrigeration device 520 can be synchronously controlled with the discharge and charge of the electrocaloric refrigeration device 520.
[0069] Optionally, the first electromagnetic element is arranged at the top of the first diversion side wall 5312, and the second electromagnetic element is arranged at the top of the second diversion side wall 5322.
[0070] Optionally, the spray assembly 510 includes a spray pipe 511 and a plurality of spray heads 512 arranged on the spray pipe 511. The plurality of spray heads 512 are sequentially arranged along the length direction of the electrocaloric refrigeration device 520.
[0071] As described above, the length direction is between the first end and the second end of the electrocaloric refrigeration device 520. The plurality of spray heads 512 of the spray assembly 510 are evenly arranged along the length direction, improving the uniformity of the spray assembly 510 spraying the heat exchange working medium onto the surface of the electrocaloric refrigeration device 520.
[0072] The embodiment of the present disclosure also provides a heat exchange system including the foregoing heat source assembly. As Figure 5 shown.
[0073] The heat exchange system provided by the embodiment of the present disclosure includes a heat source assembly, a hot end heat exchanger 600, and a cold end heat exchanger 700. The heat source assembly includes a heat source tank 500 and one or more electrocaloric spray heat exchange assemblies arranged in the heat source tank 500. The heat source tank 500 includes a hot working medium outlet 501 and a cold working medium outlet 502. The hot end heat exchanger 600 is connected to the hot working medium outlet 501 through a first working medium circulation pipeline, and the cold end heat exchanger 700 is connected to the cold working medium outlet 502 through a second working medium circulation pipeline. Among them, the electrocaloric spray heat exchange assembly includes an electrocaloric refrigeration device 520 and a spray assembly 510. The electrocaloric refrigeration device 520 alternately generates heat and cold; the spray assembly 510 is used to spray a heat exchange working medium onto the surface of the electrocaloric refrigeration device 520, so that the heat exchange working medium exchanges heat with the electrocaloric refrigeration device 520. When the electrocaloric refrigeration device 520 generates heat, the heat-exchanged hot working medium flows out from the hot working medium outlet 501; when the electrocaloric refrigeration device 520 generates cold, the heat-exchanged cold working medium flows out from the cold working medium outlet 502.
[0074] An embodiment of the present disclosure provides a heat exchange system including the foregoing heat source assembly. The heat exchange system includes a heat source assembly, and the heat source assembly includes a heat source tank 500, in which an electrocaloric spray heat exchange assembly is provided. The electrocaloric refrigeration device 520 in the electrocaloric spray heat exchange assembly can alternately generate heat and cold. When the electrocaloric refrigeration device 520 generates heat, the heat transfer working fluid in the heat source tank 500 exchanges heat with the electrocaloric refrigeration device 520. After the exchange, the hot working fluid carrying heat flows out from the hot working fluid outlet of the heat source tank and enters the hot end heat exchanger 600 through the first working fluid circulation pipeline, so that the heat can be utilized or dissipated in the hot end heat exchanger 600; similarly, when the electrocaloric refrigeration device 520 generates cold, the heat transfer working fluid in the heat source tank 500 exchanges cold with the electrocaloric refrigeration device 520. After the exchange, the cold working fluid carrying cold flows out from the cold working fluid outlet of the heat source tank and enters the cold end heat exchanger 700 through the second working fluid circulation pipeline, so that the cold can be utilized or dissipated in the cold end heat exchanger 700.
[0075] In the heat exchange system provided by the embodiment of the present disclosure, the heat source assembly and the hot end heat exchanger 600 form a closed internal heat circulation system through the first working fluid circulation pipeline, and the heat source assembly and the cold end heat exchanger 700 form a closed internal cold circulation system through the second working fluid circulation pipeline. It can be seen that the heat exchange system provided by the embodiment of the present disclosure includes both an internal heat circulation system and an internal cold circulation system, and can recycle the heat and cold alternately generated by the electrocaloric refrigeration device 520.
[0076] Optionally, the hot end heat exchanger 600 or the cold end heat exchanger 700 can be a heat exchanger commonly used in refrigeration equipment, air conditioners or other household electrical appliances such as a finned tube heat exchanger or a microchannel heat exchanger. The embodiment of the present disclosure does not limit the specific structural form of the hot end heat exchanger 600 or the cold end heat exchanger 700 too much.
[0077] Optionally, when multiple electrocaloric spray heat exchange assemblies are provided in the heat source tank 500 of the heat source assembly, after the heat transfer working fluid enters through the working fluid inlet 503 of the heat source tank 500, it is shunted to enter multiple spray assemblies 510 respectively.
[0078] Optionally, the heat exchange system further includes a heat source tank inlet pipeline 540, and the heat source tank inlet pipeline 540 is communicated with the working fluid inlet 503 of the heat source tank.
[0079] The heat exchange system includes a heat source tank inlet pipeline 540 disposed at the inlet of the working medium in the heat source tank, which can return the heat exchange working medium after heat exchange through the hot end heat exchanger 600 or the cold end heat exchanger 700 to the heat source tank for the next cycle. When the electrocaloric refrigeration device 520 generates heat, the heat exchange working medium after heat exchange carries heat and enters the first working medium circulation pipeline through the hot working medium outlet, and then enters the hot end heat exchanger 600. After releasing the heat in the hot end heat exchanger 600, it flows back to the heat source tank 500 through the heat source tank inlet pipeline 540, thus completing a heat cycle; when the electrocaloric refrigeration device 520 generates cold, the heat exchange working medium after heat exchange carries cold and enters the second working medium circulation pipeline through the cold working medium outlet, and then enters the cold end heat exchanger 700. After releasing the cold in the cold end heat exchanger 700, it flows back to the heat source tank 500 through the heat source tank inlet pipeline 540, thus completing a cold cycle.
[0080] Optionally, a first pump body 541 is provided on the heat source tank inlet pipeline 540. The first pump body 541 can be used to pressurize and pump the heat exchange working medium in the heat source tank inlet pipeline 540 into the heat source tank 500. In this way, the flow rate of the heat exchange working medium flowing into the heat source tank 500 is increased, and the heat exchange effect between the heat exchange working medium and the electrocaloric refrigeration device 520 is improved.
[0081] Optionally, the first working medium circulation pipeline includes a first working medium inlet pipeline 610 connected to the inlet of the hot end heat exchanger 600 and a first working medium outlet pipeline 620 connected to the outlet of the hot end heat exchanger 600. Among them, the first working medium inlet pipeline 610 is connected to the hot working medium outlet 501, and the first working medium outlet pipeline 620 is connected to the heat source tank inlet pipeline 540; the second working medium circulation pipeline includes a second working medium inlet pipeline 710 connected to the inlet of the cold end heat exchanger 700 and a second working medium outlet pipeline 720 connected to the outlet of the cold end heat exchanger 700. Among them, the second working medium inlet pipeline 710 is connected to the cold working medium outlet 502, and the second working medium outlet pipeline 720 is connected to the heat source tank inlet pipeline 540.
[0082] Optionally, divided by the hot-end heat exchanger 600, the first working fluid circulation pipeline includes a first working fluid inlet pipeline 610 and a first working fluid outlet pipeline 620. The heat-carrying heat exchange working fluid flowing out of the heat source tank 500 enters the hot-end heat exchanger 600 through the first working fluid inlet pipeline 610. After the heat exchange working fluid dissipates heat in the hot-end heat exchanger 600, it flows back into the heat source tank 500 through the first working fluid outlet pipeline 620 and the heat source tank inlet pipeline 540 in sequence; similarly, divided by the cold-end heat exchanger 700, the second working fluid circulation pipeline includes a second working fluid inlet pipeline 710 and a second working fluid outlet pipeline 720. The heat-carrying cold quantity heat exchange working fluid flowing out of the heat source tank 500 enters the cold-end heat exchanger 700 through the second working fluid outlet pipeline 720. After the heat exchange working fluid dissipates cold in the cold-end heat exchanger 700, it flows back into the heat source tank 500 through the second working fluid outlet pipeline 720 and the heat source tank inlet pipeline 540 in sequence.
[0083] Optionally, a first one-way valve 621 is provided on the first working fluid outlet pipeline 620, and the conduction direction of the first one-way valve 621 is from the outlet of the hot-end heat exchanger 600 to the heat source tank inlet pipeline 540; a second one-way valve 721 is provided on the second working fluid outlet pipeline 720, and the conduction direction of the second one-way valve 721 is from the outlet of the cold-end heat exchanger 700 to the heat source tank inlet pipeline 540.
[0084] In this way, the heat exchange working fluid after heat exchange in the hot-end heat exchanger 600 can flow back into the heat source tank 500 through the first one-way valve 621, and the heat exchange working fluid after heat exchange in the cold-end heat exchanger 700 can flow back into the heat source tank 500 through the second one-way valve 721, preventing the reverse flow of the heat exchange working fluid.
[0085] Optionally, the heat exchange system provided by the embodiments of the present disclosure further includes a control unit, configured to control the tilt control member to tilt the electrocaloric refrigeration device 520 toward the hot working fluid outlet 501 when the electrocaloric refrigeration device 520 generates heat, so that the heat exchange hot working fluid flows out from the hot working fluid outlet 501; when the electrocaloric refrigeration device 520 generates cold, control the tilt control member to tilt the electrocaloric refrigeration device 520 toward the cold working fluid outlet 502, so that the heat exchange cold working fluid flows out from the cold working fluid outlet 502.
[0086] When an electric field is applied, the electrocaloric refrigeration device 520 releases heat. The heat transfer working fluid sprayed into the heat source tank 500 exchanges heat with the electrocaloric refrigeration device 520 and then heats up to become the hot working fluid, which takes away the heat released by the electrocaloric refrigeration device 520. At this time, the tilt control member is controlled to tilt the electrocaloric refrigeration device towards the hot working fluid outlet, so that the heat-exchanged hot working fluid flows out from the hot working fluid outlet, and then the heated hot working fluid enters the hot-end heat exchanger 600 through the first working fluid circulation pipeline. When the electric field is released, the electrocaloric refrigeration device 520 releases cold. The heat transfer working fluid sprayed into the heat source tank 500 exchanges heat with the electrocaloric refrigeration device 520 and then cools down to become the cold working fluid, which takes away the cold released by the electrocaloric refrigeration device 520. At this time, the tilt control member is controlled to tilt the electrocaloric refrigeration device towards the cold working fluid outlet, so that the heat-exchanged cold working fluid flows out from the cold working fluid outlet, and then the cooled cold working fluid enters the cold-end heat exchanger 700 through the second working fluid circulation pipeline.
[0087] Optionally, the heat transfer working fluid is an insulating heat-conducting liquid, including single-phase fluorinated liquid, phase-changeable fluorinated cooling liquid, or transformer insulating heat-conducting oil, etc.
[0088] The embodiment of the present disclosure also provides a household electrical appliance including the foregoing heat exchange system. The household electrical appliance may include an air conditioner to heat the room by using the heat dissipated by the hot-end heat exchanger 600 of the heat exchange system, or may use the cold dissipated by the cold-end heat exchanger 700 of the heat exchange system to cool the room. Optionally, the household electrical appliance may also include refrigeration equipment such as a refrigerator, a freezer, a display cabinet, etc., to cool the inside of the refrigeration equipment by using the cold dissipated by the cold-end heat exchanger 700 of the heat exchange system.
[0089] The embodiment of the present disclosure also provides an electrocaloric refrigeration device that can be applied to any one of the foregoing electrocaloric spraying assemblies, heat exchange systems, or household electrical appliances.
[0090] The electrocaloric refrigeration device includes an electrocaloric refrigeration chip, and the electrocaloric refrigeration chip includes an electrocaloric element, a heat receiving end, and a cold receiving end. The electrocaloric element includes a first electrode layer, a second electrode layer, and a piezoelectric functional film layer. The piezoelectric functional film layer is disposed between the first electrode layer and the second electrode layer. The piezoelectric functional film layer includes a piezoelectric refrigeration region and a piezoelectric displacement region formed by partitioning the piezoelectric film layer. The piezoelectric displacement region is used to drive the piezoelectric refrigeration region to generate displacement; the heat receiving end is used to receive the heat of the electrocaloric element, and the cold receiving end is used to receive the cold of the electrocaloric element.
[0091] Currently, existing electrocaloric refrigeration systems need to design a movable heat transfer structure to move between the cold end and the hot end in cooperation with the application / release of the electric field, so as to achieve the separation of heat and cold. The heat transfer structure cannot be integrated with the electrocaloric refrigeration working fluid, has a large thermal resistance, and the heat exchange efficiency is low.
[0092] The embodiment of the present disclosure provides an electrocaloric element.
[0093] Embodiments of the present disclosure disclose an electrocaloric element 100. A piezoelectric displacement region is directly partitioned in the piezoelectric film layer of the electrocaloric element 100, and the electrocaloric element 100 is driven to move through the piezoelectric displacement region for heat transfer. The electrocaloric element 100 integrates a thermal switch form inside, and the heat exchange efficiency is improved.
[0094] Combined with Figure 6 And Figure 7 As shown, embodiments of the present disclosure provide an electrocaloric element 100, including a first electrode layer 1, a second electrode layer 2, and a piezoelectric functional film layer 4. The piezoelectric functional film layer 4 is disposed between the first electrode layer 1 and the second electrode layer 2. The piezoelectric functional film layer 4 includes a piezoelectric refrigeration region and a piezoelectric displacement region formed by partitioning the piezoelectric film layer. Among them, the piezoelectric displacement region is used to drive the piezoelectric refrigeration region to generate displacement.
[0095] The electrocaloric element 100 includes a first electrode layer 1, a second electrode layer 2, and a piezoelectric functional film layer 4 disposed between the first electrode layer 1 and the second electrode layer 2. The piezoelectric functional film layer 4 includes a piezoelectric refrigeration region and a piezoelectric displacement region. By applying a voltage to the first electrode layer 1 and the second electrode layer 2, an electric field is formed between the first electrode layer 1 and the second electrode layer 2, and different functional regions of the piezoelectric functional film layer 4 realize different functional effects correspondingly. When a positive electric field is applied to both the piezoelectric refrigeration region and the piezoelectric displacement region simultaneously, the piezoelectric functional film layer 4 synchronously excites the piezoelectric effect and the electrocaloric effect, resulting in a positive displacement and heat release; when the electric field applied to the piezoelectric refrigeration region is stopped and a reverse electric field is applied to the piezoelectric displacement region, the piezoelectric refrigeration region absorbs heat due to the electrocaloric effect, and the piezoelectric displacement region undergoes a reverse displacement due to the piezoelectric effect, thereby driving the piezoelectric functional film layer 4 to undergo a reverse displacement. Through different functional partitions of the piezoelectric functional film layer 4, opposite displacements occur during heat release and heat absorption of the electrocaloric effect, effectively realizing heat separation and improving the heat exchange efficiency. The piezoelectric functional film layer 4 of the electrocaloric element 100 is partitioned to include a piezoelectric displacement region, enabling the electrocaloric element 100 to integrate a thermal switch form and avoiding a large resistance caused by an externally provided movable heat transfer structure.
[0096] Optionally, a square-wave periodic electric field is applied to the piezoelectric displacement region.
[0097] Optionally, the first electrode layer 1 includes a platinum electrode, and / or the second electrode layer 2 includes a platinum electrode, and / or the third electrode layer 3 includes a platinum electrode.
[0098] Optionally, the piezoelectric refrigeration region includes one or more piezoelectric refrigeration units 42; the piezoelectric displacement region includes one or more piezoelectric displacement units 41.
[0099] When the piezoelectric refrigeration area includes a piezoelectric refrigeration unit 42 and the piezoelectric displacement area includes a piezoelectric displacement unit 41, the piezoelectric refrigeration unit 42 and the piezoelectric displacement unit 41 are arranged adjacent to each other. When the piezoelectric refrigeration area absorbs heat, the piezoelectric displacement area drives the piezoelectric refrigeration area to displace in the reverse direction. When the piezoelectric refrigeration area includes a plurality of piezoelectric refrigeration units 42 and the piezoelectric displacement area includes a plurality of piezoelectric displacement units 41, by setting the relative positions of the plurality of piezoelectric refrigeration units 42 and the piezoelectric displacement units 41, when the piezoelectric refrigeration area absorbs heat, the piezoelectric displacement area can better drive the piezoelectric functional film layer 4 to displace in the reverse direction, thereby realizing the separation of the heat release and heat absorption positions of the electrocaloric element 100.
[0100] Optionally, the piezoelectric refrigeration area includes a plurality of piezoelectric refrigeration units 42, and the plurality of piezoelectric refrigeration units 42 are arranged in an array. And / or, the piezoelectric displacement area includes a plurality of piezoelectric displacement units 41, and the plurality of piezoelectric displacement units 41 are arranged in an array.
[0101] The arrangement of the plurality of piezoelectric refrigeration units 42 in an array can make the heat release or heat absorption of each part of the electrocaloric element 100 balanced, which is convenient for heat dissipation when releasing heat or heat entry when absorbing heat. The arrangement of the plurality of piezoelectric displacement units 41 in an array can make the force for the piezoelectric displacement area to drive the electrocaloric element 100 to displace in the reverse direction be evenly applied to the electrocaloric element 100 when the piezoelectric refrigeration area of the electrocaloric element 100 absorbs heat, so that each part of the electrocaloric element 100 displaces in the reverse direction synchronously, which is convenient for the electrocaloric element 100 to contact the heat transfer medium.
[0102] Optionally, the piezoelectric refrigeration area includes a plurality of piezoelectric refrigeration units 42, and two adjacent piezoelectric refrigeration units 42 are arranged at intervals. The piezoelectric displacement area includes a plurality of piezoelectric displacement units 41, and two adjacent piezoelectric displacement units 41 are arranged at intervals.
[0103] The arrangement of two adjacent piezoelectric refrigeration units 42 among the plurality of piezoelectric refrigeration units 42 at intervals can balance the heat release or heat absorption of each part of the electrocaloric element 100, which is convenient for heat dissipation when releasing heat or heat entry when absorbing heat. On this basis, other functional modules, such as the piezoelectric displacement unit 41, can be arranged between two adjacent piezoelectric refrigeration units 42. Similarly, the arrangement of two adjacent piezoelectric displacement units 41 among the plurality of piezoelectric displacement units 41 at intervals can evenly apply the force for the piezoelectric displacement area to drive the electrocaloric element 100 to displace in the reverse direction to the electrocaloric element 100 when the piezoelectric refrigeration area of the electrocaloric element 100 absorbs heat. On this basis, other functional modules, such as the piezoelectric refrigeration unit 42, can be arranged between two adjacent piezoelectric displacement units 41.
[0104] Optionally, the piezoelectric refrigeration unit 42 and the piezoelectric displacement unit 41 are alternately arranged at intervals with each other.
[0105] A plurality of piezoelectric refrigeration units 42 and a plurality of piezoelectric displacement units 41 are alternately arranged at intervals with each other. When the piezoelectric refrigeration area absorbs heat due to the electrocaloric effect, the piezoelectric displacement unit 41 displaces in the reverse direction to drive the adjacent piezoelectric refrigeration unit 42 to displace in the reverse direction, thereby enabling the electrocaloric element 100 to displace in the reverse direction and having a high flatness after displacement, which is convenient for the electrocaloric element 100 to be attached to the heat transfer medium for heat transfer.
[0106] Optionally, the piezoelectric refrigeration area includes a first piezoelectric refrigeration unit 42, and the piezoelectric displacement area includes a first piezoelectric displacement unit 41 adjacent to the first piezoelectric refrigeration unit 42. Among them, the length of the first piezoelectric refrigeration unit 42 is greater than or equal to the length of the first piezoelectric displacement unit 41; or, the width of the first piezoelectric refrigeration unit 42 is greater than or equal to the width of the first piezoelectric displacement unit 41; or, the area of the first piezoelectric refrigeration unit 42 is greater than or equal to the area of the first piezoelectric displacement unit 41.
[0107] The piezoelectric functional film layer 4 is a thin film layer structure, and the length, width or area can be understood as dimensions. Therefore, it can be understood that the size of the adjacent first piezoelectric refrigeration unit 42 is larger than that of the first piezoelectric displacement unit 41, thereby increasing the heat release or absorption amount of the electrocaloric element 100.
[0108] Optionally, the piezoelectric functional film layer 4 includes a first piezoelectric functional surface and a second piezoelectric functional surface opposite to the first piezoelectric functional surface. Among them, the first piezoelectric functional surface includes a piezoelectric refrigeration area and a piezoelectric displacement area, and the second piezoelectric functional surface only includes a piezoelectric refrigeration area.
[0109] The piezoelectric functional film layer 4 is a thin film layer structure with a thickness. Taking the thin film layer including a first sub-film layer and a second sub-film layer that are bonded together as an example. The first piezoelectric functional surface corresponds to the first sub-film layer and includes a piezoelectric refrigeration area and a piezoelectric displacement area; the second piezoelectric functional surface corresponds to the second sub-film layer and only includes a piezoelectric refrigeration area without a piezoelectric displacement area. Understanding the first sub-film layer and the second sub-film layer as a whole, that is, the piezoelectric functional film layer 4 forms a piezoelectric displacement area embedded structure. The piezoelectric displacement area embedded structure increases the size of the piezoelectric refrigeration area in the piezoelectric functional film layer 4, thereby increasing the heat release or absorption amount of the electrocaloric element 100.
[0110] Optionally, a distinguishing gap for distinguishing between these two functional unit areas is provided between the adjacent piezoelectric refrigeration unit 42 and the piezoelectric displacement unit 41. Setting the distinguishing gap can partition the functional unit areas to realize the electrocaloric effect excited by the piezoelectric refrigeration unit 42 and the piezoelectric effect excited by the piezoelectric displacement unit 41 without mutual influence.
[0111] Optionally, the distinguishing gap is in a strip shape, a grid shape or an irregular shape. It can be understood that the shape of the distinguishing gap is not specifically limited, and it can be realized that the two functional units on both sides of the distinguishing gap are separated to achieve different functional unit partitions.
[0112] Optionally, the distinguishing gap is an air gap.
[0113] Optionally, the distinguishing gap includes a first distinguishing gap, a second distinguishing gap, and a third distinguishing gap arranged in sequence. Wherein, a first piezoelectric refrigeration unit 42 is arranged between the first distinguishing gap and the second distinguishing gap, and a first piezoelectric displacement unit 41 is arranged between the second distinguishing gap and the third distinguishing gap.
[0114] It can be understood that they are arranged in sequence as the first distinguishing gap, the first piezoelectric refrigeration unit 42, the second distinguishing gap, the first piezoelectric displacement unit 41, and the third distinguishing gap, that is, a distinguishing gap is provided between adjacent piezoelectric refrigeration units 42 and piezoelectric displacement units 41 to avoid mutual influence between different functional units.
[0115] Optionally, the distinguishing gap includes an etched distinguishing gap formed by etching. The distinguishing gap is formed by etching, with a simple process, and enables the electrocaloric element 100 to integrate different functional units of the electrocaloric effect and the piezoelectric effect simultaneously.
[0116] Optionally, the piezoelectric displacement region includes a through-type piezoelectric displacement unit 41. Wherein, the through-type piezoelectric displacement unit 41 includes a first through distinguishing gap 431 and a second through distinguishing gap 433, and both the first through distinguishing gap 431 and the second through distinguishing gap 433 penetrate the piezoelectric film layer; and, a first through piezoelectric displacement unit 432 is arranged between the first through distinguishing gap 431 and the second through distinguishing gap 433.
[0117] Figure 7 Shown is the electrocaloric element 100 including the through-type piezoelectric displacement unit 41. The through-type piezoelectric displacement unit 41 includes a first through distinguishing gap 431, a first through piezoelectric displacement unit 432, and a second through distinguishing gap 433 arranged in sequence, and Figure 7 as shown in, the first through distinguishing gap 431 and the second through distinguishing gap 433 have the same height as the first through piezoelectric displacement unit 432, that is, both the first through distinguishing gap 431 and the second through distinguishing gap 433 penetrate the piezoelectric film layer. Such a setting can avoid the mutual influence between the first through piezoelectric displacement unit 432 and the adjacent piezoelectric refrigeration units 42 on both sides. And, by setting the piezoelectric displacement region as the through-type piezoelectric displacement unit 41, the piezoelectric displacement region and the piezoelectric refrigeration region can share the second electrode layer 2, and in the preparation method, only the first electrode layer 1 needs to be etched for the preparation of the electrode layer, without secondary etching of the electrode layer.
[0118] Specifically, a positive voltage is applied to the first electrode layer 1 and the second electrode layer 2, and a positive electric field is formed between the first electrode layer 1 and the second electrode layer 2. At this time, the electrocaloric displacement region and the electrocaloric refrigeration region of the piezoelectric functional film layer 4 simultaneously excite the electrocaloric effect and the piezoelectric effect, and the electrocaloric element 100 displaces forward and releases heat. After that, the electrocaloric refrigeration electrode region 11 in the first electrode layer 1 is powered off, that is, the electric field corresponding to the electrocaloric refrigeration region is removed, and the electrocaloric refrigeration region excites the electrocaloric effect to absorb heat; a reverse voltage is applied to the piezoelectric drive electrode region 12 in the first electrode layer 1 and the second electrode layer 2, and a reverse electric field is formed between the first electrode layer 1 and the second electrode layer 2, and the piezoelectric displacement region excites the piezoelectric effect to displace reversely. The electrocaloric element 100 releases heat and displaces forward, absorbs heat and displaces reversely, realizing heat separation.
[0119] Optionally, the electrocaloric element 100 further includes a base layer 5. The base layer 5 is disposed below the second electrode layer 2.
[0120] The piezoelectric functional film layer 4, the first electrode layer 1 and the second electrode layer 2 are combined to form a thin film structure. A base layer 5 is disposed below the second electrode layer 2 of the electrocaloric element 100, which can support the thin film structure and provide an operation platform during preparation. The setting of the base layer 5 can also maintain the flatness of the electrocaloric element 100, so that the electrocaloric element 100 can be close to the heat transfer medium when transferring heat.
[0121] Optionally, the first electrode layer 1 is provided with an electrode gap 13, and the electrode gap 13 divides the first electrode layer 1 into an electrocaloric refrigeration electrode region 11 and a piezoelectric drive electrode region 12. Among them, the electrocaloric refrigeration electrode region 11 corresponds to the electrocaloric refrigeration region, and the piezoelectric drive electrode region 12 corresponds to the piezoelectric displacement region. A positive electric field is applied to the electrocaloric refrigeration electrode region 11 and the piezoelectric drive electrode region 12 to cause the piezoelectric displacement region and the electrocaloric refrigeration region to displace in the first direction; or, the electric field of the electrocaloric refrigeration motor region is removed, and the electrocaloric refrigeration region of the piezoelectric functional film layer 4 absorbs heat. At the same time, a reverse electric field is applied to the piezoelectric drive electrode region 12 to cause the piezoelectric displacement region to drive the heat-absorbing electrocaloric refrigeration region to displace in the second direction.
[0122] Corresponding to the two different functional units of the electrocaloric refrigeration region and the piezoelectric displacement region, different electric fields need to be applied to the electrodes to excite different functional effects. Therefore, the first electrode layer 1 is provided with an electrode gap 13, so that the first electrode layer 1 is separated into an electrocaloric refrigeration electrode region 11 corresponding to the electrocaloric refrigeration region and a piezoelectric drive electrode region 12 corresponding to the piezoelectric displacement region, and different electric fields are applied to the electrocaloric refrigeration electrode region 11 and the second electrode layer 2 and the piezoelectric drive electrode region 12 and the second electrode layer 2 to realize the excitation of different functional effects.
[0123] Optionally, the electrode gap 13 is correspondingly arranged with the distinguishing gap.
[0124] Optionally, the electrode gap 13 communicates with the distinguishing gap to form a through-type gap. The electrode gap 13 corresponds to the distinguishing gap. When different electric fields are applied to different regions of the first electrode layer 1, different functional effects can be excited in the functional regions corresponding to the electrode regions. Further, the communication between the electrode gap 13 and the distinguishing gap enables adjacent different functional units to be independent of each other.
[0125] The embodiments of the present disclosure provide a method for manufacturing an electrocaloric element.
[0126] In some embodiments, as shown in Figure 8 , the method for manufacturing the electrocaloric element 100 includes:
[0127] S301, depositing a second electrode layer 2 on the base layer 5;
[0128] S302, depositing a piezoelectric film layer on the second electrode layer 2;
[0129] S303, depositing a first electrode layer 1 on the piezoelectric film layer;
[0130] S304, etching the first electrode layer 1 and the piezoelectric film layer to obtain the electrocaloric element 100. Herein, the electrocaloric element 100 is the aforementioned electrocaloric element 100.
[0131] Optionally, the piezoelectric film layer includes a piezoelectric ceramic film layer.
[0132] The electrocaloric effect is a thermal effect of ferroelectric materials under an electric field, where heat is released when an electric field is applied and heat is absorbed when the electric field is removed. The ferroelectric thin film is excited by applying a high electric field through the electrodes on both sides to generate a periodic electrocaloric effect. The research on solid-state electrocaloric refrigeration materials can be divided into three categories: inorganic, organic, and inorganic-organic composite materials. Among them, inorganic materials mainly focus on the lead-containing reference system of lead zirconate titanate-based piezoelectric ceramics (PZT), and their geometric forms mainly include bulk ceramics, thin films, thick films, and multi-layer thick films. The piezoelectric film layer disclosed in the embodiments of the present disclosure includes a piezoelectric ceramic film layer, that is, an inorganic ferroelectric material.
[0133] On the one hand, compared with organic ferroelectric materials that require a high voltage (such as kilovolt-level voltage) to excite the electrocaloric effect, inorganic ferroelectric materials require a smaller voltage (such as hundred-volt-level voltage) to excite the electrocaloric effect. Moreover, a high voltage is likely to break down the thin film, resulting in a short service life of the electrocaloric element 100, while a low voltage extends the service life of the electrocaloric element 100.
[0134] On the other hand, inorganic thin-film ferroelectric materials have a large adiabatic temperature change and a wide ferroelectric phase transition temperature range, so refrigeration applications with a wide temperature range and a large temperature difference can be realized. At the same time, the synthesis process of low-temperature crystallized ferroelectric thin films can be compatible with semiconductor microelectromechanical (CMOS / MEMs) processes to realize the integration of the piezoelectric functional film layer 4 in the electrocaloric element 100 on the base layer 5 (such as a silicon wafer), and the substrate can be removed by means of lithography to achieve a larger self-temperature change.
[0135] Optionally, the piezoelectric ceramic film layer includes a lead zirconate titanate-based piezoelectric ceramic film layer.
[0136] Optionally, the piezoelectric ceramic film layer includes a lead lanthanum zirconate titanate ceramic film layer.
[0137] Ferroelectric dielectrics such as lead zirconate titanate-based piezoelectric ceramic film layers (PZT) or lead lanthanum zirconate titanate ceramic film layers (PLZT) have both piezoelectricity and electrocaloric effect at the same time. Therefore, the same material can be used in the piezoelectric displacement region and the piezoelectric refrigeration region and deposited on the same layer, and the functions can be distinguished only by controlling the different electric fields applied to the electrode layer.
[0138] Optionally, the thickness of the deposited piezoelectric film layer is greater than or equal to 8 μm and less than or equal to 20 μm.
[0139] Optionally, the etching of the first electrode layer 1 and the piezoelectric film layer includes: etching the first electrode layer to obtain an electrode gap 13; performing a through-etching on the piezoelectric film layer to obtain a through-separation gap, and a piezoelectric refrigeration unit 42 and a through-type piezoelectric displacement unit 41 located between the through-separation gaps.
[0140] Optionally, the base layer 5 includes a silicon wafer.
[0141] Optionally, before depositing the second electrode layer 2 on the base layer 5, it further includes: oxidizing the surface of the silicon wafer to obtain a silicon-on-insulator substrate; performing hydrogen implantation on the silicon-on-insulator substrate to reduce the thickness of the silicon-on-insulator substrate; bonding the oxide layer of the silicon-on-insulator substrate to the substrate silicon. The substrate silicon has a large thickness and serves to provide mechanical support for the silicon-on-insulator substrate, facilitating subsequent operations on the base layer 5.
[0142] Optionally, after etching the first electrode layer 1 and the piezoelectric film layer, it further includes: removing the substrate silicon and the oxide layer to thin the silicon wafer. Among them, the substrate silicon and the oxide layer are removed by mechanical thinning, and the thickness of the thinned silicon wafer is greater than or equal to 8 μm and less than or equal to 13 μm.
[0143] Optionally, the deposition of the piezoelectric film layer is realized by the sol-gel method.
[0144] The electrocaloric refrigeration chip disclosed in the embodiments of the present disclosure has a piezoelectric film layer of the electrocaloric element 100 directly partitioned to form a piezoelectric displacement region, and the electrocaloric element 100 is driven to move through the piezoelectric displacement region. The clamping framework clamps the electrocaloric element 100 so that the electrocaloric element 100 releases heat and fits to the heat receiving end 300, and absorbs heat and fits to the cold quantity receiving end 400. The electrocaloric refrigeration chip has a self-integrated hot and cold separation structure, enhancing stability.
[0145] Combined with Figures 9 to 11 As shown, the embodiments of the present disclosure provide an electrocaloric refrigeration chip, including an electrocaloric element 100, a clamping framework, a heat receiving end 300, and a cold quantity receiving end 400. The electrocaloric element 100 includes a first electrode layer 1, a second electrode layer 2, and a piezoelectric functional film layer 4. The piezoelectric functional film layer 4 is disposed between the first electrode layer 1 and the second electrode layer 2. The piezoelectric functional film layer 4 includes a piezoelectric refrigeration region and a piezoelectric displacement region formed by partitioning the piezoelectric film layer. Among them, the piezoelectric displacement region is used to drive the piezoelectric refrigeration region to generate displacement. The clamping framework includes a first clamping framework 201 clamped to the first side of the first end of the electrocaloric element 100, and a second clamping framework 202 clamped to the second side of the first end of the electrocaloric element 100. The heat receiving end 300 is disposed on the side of the first clamping framework 201 for receiving the heat of the electrocaloric element 100. The cold quantity receiving end 400 is disposed on the side of the second clamping framework 202 for receiving the cold quantity of the electrocaloric element 100.
[0146] The electrocaloric refrigeration chip includes an electrocaloric element 100. The piezoelectric film layer of the electrocaloric element 100 is directly partitioned to form a piezoelectric displacement region, and the electrocaloric element 100 is driven to move through the piezoelectric displacement region. At the same time, a heat receiving end 300 and a cold quantity receiving end 400 are respectively disposed on both sides of the electrocaloric element 100, and the first end of the electrocaloric element 100 is clamped by the clamping framework. When a positive electric field is simultaneously applied to the piezoelectric refrigeration region and the piezoelectric displacement region, the piezoelectric functional film layer 4 synchronously excites the piezoelectric effect and the electrocaloric effect, undergoes a positive displacement and releases heat, and the clamping framework clamps the electrocaloric element 100 so that the electrocaloric element 100 fits to the heat receiving end 300, as Figure 10 . When the application of the electric field to the piezoelectric refrigeration region stops and a reverse electric field is applied to the piezoelectric displacement region, the piezoelectric refrigeration region absorbs heat due to the electrocaloric effect, the piezoelectric displacement region undergoes a reverse displacement due to the piezoelectric effect, and further drives the piezoelectric functional film layer 4 to undergo a reverse displacement. The clamping framework clamps the electrocaloric element 100 so that the electrocaloric element 100 fits to the cold quantity receiving end 400, as Figure 11 . The electrocaloric refrigeration chip has a self-integrated hot and cold separation structure, enhancing stability.
[0147] It can be understood that the electrocaloric element 100 in the electrocaloric refrigeration chip is the electrocaloric element 100 in the form of an internally integrated thermal switch as described above.
[0148] Optionally, the electrocaloric element 100 further includes a base layer 5 disposed below the second electrode layer 2. Among them, the first clamping framework 201 is disposed on the first electrode layer 1 of the electrocaloric element 100, and the second clamping framework 202 is disposed on the base layer 5 of the electrocaloric element 100.
[0149] The piezoelectric functional film layer 4, the first electrode layer 1, and the second electrode layer 2 are combined to form a thin film structure. A base layer 5 is disposed below the second electrode layer 2 of the electrocaloric element 100 to support the thin film structure. The setting of the base layer 5 can also maintain the flatness of the electrocaloric element 100, enabling the electrocaloric element 100 to be close to the heat transfer medium during heat transfer. Correspondingly, the first clamping framework 201 is disposed above the first electrode layer 1 of the electrocaloric element 100, and the second clamping framework 202 is disposed below the base layer 5 of the electrocaloric element 100.
[0150] Optionally, a first bending gap 203 is provided between the first side of the electrocaloric element 100 and the heat receiving end 300. Among them, the first bending gap 203 is used for the first side of the electrocaloric element 100 to bend towards the heat receiving end 300 and fit with the heat receiving end 300. And / or, a second bending gap 204 is provided between the second side of the electrocaloric element 100 and the cold receiving end 400. Among them, the second bending gap 204 is used for the second side of the electrocaloric element 100 to bend towards the cold receiving end 400 and fit with the cold receiving end 400.
[0151] The settings of the first bending gap 203 and the second bending gap 204 increase the volume of the electrocaloric cooling chip. The thickness of the first bending gap 203, the thickness of the electrocaloric element 100, plus the thickness of the second bending gap 204 is the distance between the heat receiving end 300 and the cold receiving end 400, increasing the separation distance between the cold and heat of the electrocaloric element 100, which is convenient for the electrocaloric cooling chip to be actually applied to household electrical appliances.
[0152] Optionally, the first electrode layer 1 includes a first clamping portion disposed at the end and used for clamping with the first clamping framework 201, and a first fitting portion extending along the first clamping portion. Among them, the first bending gap 203 is provided between the first fitting portion and the heat receiving end 300. And / or, the base layer 5 includes a second clamping portion disposed at the end and used for clamping with the second clamping framework 202, and a second fitting portion extending along the second clamping portion. Among them, the second bending gap 204 is provided between the second fitting portion and the cold receiving end 400.
[0153] The first electrode layer 1 includes a first clamping portion and a first attaching portion extending along the first clamping portion. Among them, the first clamping portion is located at the end of the first electrode layer 1. The first clamping portion is used to fit with the first clamping skeleton 201. The position where the first clamping skeleton 201 is arranged is between the first clamping portion and the heat receiving end 300. The first clamping skeleton 201 not only plays a role in clamping the first side of the end portion of the electrocaloric element 100, but also plays a role in supporting the electrocaloric element 100 to construct the first bending gap 203. Similarly, the base layer 5 includes a second clamping portion and a second attaching portion extending along the second clamping portion. Among them, the second clamping portion is located at the end of the base layer 5. The second clamping portion is used to fit with the second clamping skeleton 202. The position where the second clamping skeleton 202 is arranged is between the second clamping portion and the cold receiving end 400. The second clamping skeleton 202 not only plays a role in clamping the second side of the end portion of the electrocaloric element 100, but also plays a role in supporting the electrocaloric element 100 to construct the second bending gap 204.
[0154] Optionally, the electrocaloric refrigeration chip further includes a support skeleton 205. The support skeleton 205 is supported between the heat receiving end 300 and the cold receiving end 400, and the support skeleton 205 is arranged at the second end of the electrocaloric element 100.
[0155] The first end of the electrocaloric element 100 is clamped by the first clamping skeleton 201 and the second clamping skeleton 202, and the first clamping skeleton 201 and the second clamping skeleton 202 simultaneously play a supporting role for the first end of the electrocaloric refrigeration chip. At the same time, a support skeleton for supporting needs to be arranged at the second end of the electrocaloric refrigeration chip. One end of the support skeleton 205 abuts against the heat receiving end 300, and the other end abuts against the cold receiving end 400, thereby supporting the second end of the electrocaloric refrigeration chip.
[0156] Optionally, the second end of the electrocaloric element 100 abuts against the support skeleton 205; or, there is a gap between the second end of the electrocaloric element 100 and the support skeleton 205.
[0157] The second end of the electrocaloric element 100 can abut against the support skeleton 205 or there can be a gap. Figure 10 and Figure 11 As shown in
[0158] Optionally, the heat receiving end 300 includes an insulating and heat-conducting layer, and / or the cold receiving end 400 includes an insulating and heat-conducting layer. The heat receiving end 300 and / or the cold receiving end 400 are insulated to prevent current leakage and loss of the first electrode layer 1 or the second electrode layer 2. The heat receiving end 300 and / or the cold receiving end 400 are heat-conducting to conduct the heat or cold of the electrocaloric element 100 out.
[0159] Optionally, the insulating and heat-conducting layer includes aluminum nitride / silicon carbide (AlN / SiC) composite ceramics.
[0160] Optionally, the first clamping skeleton 201, the second clamping skeleton 202, and / or the support skeleton 205 include insulating and heat-insulating skeletons. The heat insulation of each skeleton enables energy to be conducted out from the heat receiving end 300 or the cold receiving end 400, improving the heat and cold separation efficiency of the electrocaloric refrigeration chip.
[0161] Optionally, the insulating and heat-insulating skeleton includes an alumina skeleton.
[0162] In some embodiments, the electrocaloric refrigeration device 520 includes one or more of the aforementioned electrocaloric refrigeration chips. Multiple electrocaloric refrigeration chips can increase the heat or cold of the electrocaloric refrigeration device 520, facilitating the application of the electrocaloric refrigeration device 520 in large equipment.
[0163] When the electrocaloric refrigeration device 520 includes multiple electrocaloric refrigeration chips, the multiple electrocaloric refrigeration chips can be arranged in an array. This enables the electrocaloric refrigeration device 520 to release or absorb heat evenly in each part, and the electrocaloric refrigeration device 520 forms a square structure, facilitating the application of the electrocaloric refrigeration device 520 in large equipment.
[0164] Optionally, the first electrode layer 1 is provided with an electrode gap 13. The electrode gap 13 divides the first electrode layer 1 into an electrocaloric refrigeration electrode region 11 and a piezoelectric drive electrode region 12. Among them, the electrocaloric refrigeration electrode region 11 corresponds to the piezoelectric refrigeration region, and the piezoelectric drive electrode region 12 corresponds to the piezoelectric displacement region. The electrocaloric refrigeration device 520 further includes an external power supply, and the external power supply is used to: apply a positive electric field to the electrocaloric refrigeration electrode region 11 and the piezoelectric drive electrode region 12 to cause displacements in the first direction in the piezoelectric displacement region and the piezoelectric refrigeration region; or, remove the electric field in the electrocaloric refrigeration electrode region, the piezoelectric refrigeration region of the piezoelectric functional film layer 4 absorbs heat, and at the same time, apply a reverse electric field to the piezoelectric drive electrode region 12 to cause the piezoelectric displacement region to drive the heat-absorbing piezoelectric refrigeration region to generate a displacement in the second direction.
[0165] Corresponding to two different functional units, namely the piezoelectric refrigeration region and the piezoelectric displacement region, different electric fields need to be applied to the electrodes to stimulate different functional effects. Therefore, the first electrode layer 1 is provided with electrode gaps 13, so that the first electrode layer 1 is separated to form an electrocaloric refrigeration electrode region 11 corresponding to the piezoelectric refrigeration region and a piezoelectric drive electrode region 12 corresponding to the piezoelectric displacement region, and different electric fields are applied to the electrocaloric refrigeration electrode region 11 and the second electrode layer 2 and the piezoelectric drive electrode region 12 and the second electrode layer 2 to achieve the stimulation of different functional effects. Taking Figures 9 to 11 as an example, a positive electric field is applied to the electrocaloric refrigeration electrode region 11 and the piezoelectric drive electrode region 12, so that the piezoelectric displacement region and the piezoelectric refrigeration region generate displacements in the first direction, that is, Figure 10 move upward in the figure, the electrocaloric element 100 releases heat and adheres to the heat receiving end 300; the electric field of the electrocaloric refrigeration motor region is removed, the piezoelectric refrigeration region of the piezoelectric functional film layer 4 absorbs heat, and at the same time, a reverse electric field is applied to the piezoelectric drive electrode region 12, so that the piezoelectric displacement region drives the heat-absorbing piezoelectric refrigeration region to generate a displacement in the second direction, that is, Figure 11 move downward in the figure, and the electrocaloric element 100 absorbs heat and adheres to the cold receiving end 400.
[0166] The above description and the drawings fully illustrate the embodiments of the present disclosure so that those skilled in the art can practice them. Other embodiments may include structural and other changes. The embodiments only represent possible variations. Unless explicitly required, the individual components and functions are optional, and the order of operations can vary. Some parts and features of some embodiments may be included in or replace parts and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present disclosure is only limited by the appended claims.
Claims
1. A heat exchange system, characterized in that, it includes a heat source component, a hot-end heat exchanger and a cold-end heat exchanger. The heat source component includes a heat source tank and one or more electrocaloric spray heat exchange components arranged in the heat source tank. The heat source tank includes a hot working medium outlet and a cold working medium outlet. The hot-end heat exchanger is connected to the hot working medium outlet through a first working medium circulation pipeline, and the cold-end heat exchanger is connected to the cold working medium outlet through a second working medium circulation pipeline. Among them, the electrocaloric spray heat exchange component includes: an electrocaloric refrigeration device that alternately generates heat and cold; a spray component for spraying a heat exchange working medium onto the surface of the electrocaloric refrigeration device to enable the heat exchange working medium to exchange heat with the electrocaloric refrigeration device. When the electrocaloric refrigeration device generates heat, the heated working medium flows out from the hot working medium outlet; when the electrocaloric refrigeration device generates cold, the cooled working medium flows out from the cold working medium outlet.
2. The heat exchange system according to claim 1, characterized in that, it further includes: a heat source tank inlet pipeline connected to the working medium inlet of the heat source tank.
3. The heat exchange system according to claim 2, characterized in that, a first pump body is provided on the heat source tank inlet pipeline.
4. The heat exchange system according to claim 2, characterized in that, the first working medium circulation pipeline includes a first working medium inlet pipeline connected to the inlet of the hot-end heat exchanger and a first working medium outlet pipeline connected to the outlet of the hot-end heat exchanger. Among them, the first working medium inlet pipeline is connected to the hot working medium outlet, and the first working medium outlet pipeline is connected to the heat source tank inlet pipeline; the second working medium circulation pipeline includes a second working medium inlet pipeline connected to the inlet of the cold-end heat exchanger and a second working medium outlet pipeline connected to the outlet of the cold-end heat exchanger. Among them, the second working medium inlet pipeline is connected to the cold working medium outlet, and the second working medium outlet pipeline is connected to the heat source tank inlet pipeline.
5. The heat exchange system according to claim 4, characterized in that, a first one-way valve is provided on the first working medium outlet pipeline, and the conduction direction of the first one-way valve is from the outlet of the hot-end heat exchanger to the heat source tank inlet pipeline; a second one-way valve is provided on the second working medium outlet pipeline, and the conduction direction of the second one-way valve is from the outlet of the cold-end heat exchanger to the heat source tank inlet pipeline.
6. The heat exchange system according to claim 1, characterized in that, the electrocaloric spray heat exchange component further includes: an inclination control member for controlling the inclination of the electrocaloric refrigeration device, when the electrocaloric refrigeration device generates heat, the inclination control member controls the electrocaloric refrigeration device to incline towards the hot working medium outlet, so that the heated working medium flows out from the hot working medium outlet; when the electrocaloric refrigeration device generates cold, the inclination control member controls the electrocaloric refrigeration device to incline towards the cold working medium outlet, so that the cooled working medium flows out from the cold working medium outlet.
7. The heat exchange system according to claim 6, characterized in that, the electrocaloric refrigeration device includes opposite first and second ends. Among them, the inclination control member includes: an inclination support member for supporting the electrocaloric refrigeration device; a first electromagnetic element for attracting the first end of the electrocaloric refrigeration device; and, a second electromagnetic element for attracting the second end of the electrocaloric refrigeration device.
8. The heat exchange system according to claim 1, characterized in that, The electrocaloric refrigeration device includes an electrocaloric refrigeration chip, and the electrocaloric refrigeration chip includes: An electrocaloric element, including a first electrode layer, a second electrode layer, and a piezoelectric functional film layer. The piezoelectric functional film layer is disposed between the first electrode layer and the second electrode layer. The piezoelectric functional film layer includes a piezoelectric refrigeration region and a piezoelectric displacement region formed by partitioning the piezoelectric film layer. The piezoelectric displacement region is used to drive the piezoelectric refrigeration region to generate displacement; A heat receiving end, which is used to receive the heat of the electrocaloric element; and, A cold receiving end, which is used to receive the cold of the electrocaloric element.
9. The heat exchange system according to any one of claims 1 to 8, characterized in that it further includes: A control unit, configured to control the tilting control member to tilt the electrocaloric refrigeration device towards the hot working fluid outlet when the electrocaloric refrigeration device generates heat, so that the heat-exchanged hot working fluid flows out from the hot working fluid outlet; when the electrocaloric refrigeration device generates cold, control the tilting control member to tilt the electrocaloric refrigeration device towards the cold working fluid outlet, so that the heat-exchanged cold working fluid flows out from the cold working fluid outlet.
10. An appliance, characterized in that it includes the heat exchange system according to any one of claims 1 to 9.