Vibration device and manufacturing method of vibration device

Abstract

The invention provides a vibration device and a manufacturing method of the vibration device. The resonator device includes: a support substrate (500) having a frame portion (501); and a vibration element disposed on the support substrate (500) and having a base portion, the support substrate (500) having: a first beam (510) made of the same material as the frame portion (501), extending from the frame portion (501), and having a first end portion (511) in a region overlapping the base portion; and a second beam (520) made of the same material as the frame section (501), extending from the frame section (501), and having a second end section (521) in a region overlapping the base section, the base section and the first end section (511) being connected via a first joining member, and the base section and the second end section (521) being connected via a second joining member.

Description

Technical Field

[0001] The present invention relates to a vibration device and a method for manufacturing the vibration device. Background Art

[0002] The structure of a gyro sensor is disclosed in Patent Document 1. The gyro sensor includes: a gyro element having a drive arm for detecting an angular velocity; and a support portion for supporting the gyro element. The structure of a vibration device having a vibration element, a support substrate, and a circuit element is disclosed in Patent Document 2. Specifically, the vibration element is mounted on a base portion via a bonding member on an element mounting portion disposed at the center of the support substrate.

[0003] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2017-26336

[0004] Patent Document 2: Japanese Unexamined Patent Application Publication No. 2021-32841

[0005] However, in the existing structure, there is a problem that deformation and strain of the base portion generated when the drive arm vibrates are difficult to be alleviated, resulting in deterioration of vibration characteristics. Summary of the Invention

[0006] The vibration device includes: a support substrate having a frame portion; and a vibration element disposed on the support substrate and having a base portion. The support substrate includes: a first beam made of the same material as the frame portion, extending from the frame portion and having a first end portion in a region overlapping with the base portion; and a second beam made of the same material as the frame portion, extending from the frame portion and having a second end portion in a region overlapping with the base portion. The base portion is connected to the first end portion via a first bonding member, and the base portion is connected to the second end portion via a second bonding member.

[0007] Regarding the method for manufacturing the vibration device, the vibration device includes: a support substrate having a frame portion; and a vibration element disposed on the support substrate and having a base portion. The support substrate includes: a first beam made of the same material as the frame portion, extending from the frame portion and having a first end portion in a region overlapping with the base portion; and a second beam made of the same material as the frame portion, extending from the frame portion and having a second end portion in a region overlapping with the base portion. The base portion is connected to the first end portion via a first bonding member, and the base portion is connected to the second end portion via a second bonding member. The method for manufacturing the vibration device includes a step of simultaneously forming the frame portion, the first beam, and the second beam. Brief Description of the Drawings

[0008] Figure 1 It is a cross-sectional view showing the structure of the vibration device.

[0009] Figure 2 is a top view showing the structure of the vibration device.

[0010] Figure 3 is a top view showing the structure of the vibration element.

[0011] Figure 4 is Figure 3 a cross-sectional view of the shown vibration element along line D-D.

[0012] Figure 5 is Figure 3 a cross-sectional view of the shown vibration element along line E-E.

[0013] Figure 6 is a schematic diagram showing the driving state of the vibration element.

[0014] Figure 7 is a schematic diagram showing the driving state of the vibration element.

[0015] Figure 8 is a top view showing the structure of the support substrate.

[0016] Figure 9 is a flowchart showing the manufacturing method of the vibration device.

[0017] Figure 10 is a top view showing the structure of the support substrate of the modification example.

[0018] Figure 11 is a top view showing the structure of the support substrate of the modification example.

[0019] Reference Numeral Explanation

[0020] 1: Vibration device; 2: Package; 3: Circuit element; 6: Vibration element; 7: Vibration substrate; 8: Electrode; 21: Base; 22: Cover; 23: Joining member; 70: Base portion; 71, 72: Detection arms; 73, 74: Linking arms; 75 - 78: Driving arms; 81: Driving signal electrode; 82: Driving ground electrode; 83: First detection signal electrode; 84: First detection ground electrode; 85: Second detection signal electrode; 86: Second detection ground electrode; 211, 211a, 211b, 211c: Recesses; 241, 242: Internal terminals; 243: External terminal; 500, 500A, 500B: Support substrate; 501: Frame portion; 510, 510A, 510B: First beams; 511: First end portion; 511a: Wide portion; 520, 520A, 520B: Second beams; 521: Second end portion; 530: Third beam; 531: Third end portion; 540: Fourth beam; 541: Fourth end portion; 550: Fifth beam; 551: Fifth end portion; 560: Sixth beam; 561: Sixth end portion; 570A, 570B, 580A, 580B: Portions; 701 - 706: Terminals. Detailed implementation

[0021] In the following figures, three mutually perpendicular axes are described as the A-axis, B-axis, and C-axis. Additionally, the direction along the A-axis is the "A direction", the direction along the B-axis is the "B direction", the direction along the C-axis is the "C direction", the direction of the arrow is the + direction, and the direction opposite to the + direction is the - direction. Furthermore, the C-axis is an imaginary axis along the vertical direction, with the +C direction being upward and the -C direction being downward. The -C direction is the direction of gravity. Additionally, the top view from the thickness direction of the support substrate 500, i.e., the C-axis direction, is also simply referred to as the "top view".

[0022] Refer to Figures 1 to 5 The structure of the vibration device 1 will be described.

[0023] As Figure 1 shown, the vibration device 1 is a physical quantity sensor that detects the angular velocity ωc with the C-axis as the detection axis. In this way, by using the vibration device 1 as a physical quantity sensor, the vibration device 1 can be mounted on a wide range of electronic devices, becoming a vibration device 1 with high demand and high convenience. As a physical quantity sensor, for example, it is a gyro sensor. Hereinafter, an example of the vibration device 1 having a dual-T type gyro element will be described.

[0024] The vibration device 1 includes a package 2, a circuit element 3 housed in the package 2, a support substrate 500, and a vibration element 6.

[0025] The package 2 has: a base 21 having a recess 211 opening on the upper surface; and a lid 22 closing the opening of the recess 211 and joined to the upper surface of the base 21 via a joining member 23. An internal space S is formed inside the package 2 through the recess 211, and a circuit element 3, a support substrate 500, and a vibration element 6 are respectively housed in the internal space S.

[0026] The base 21 can be made of ceramics such as alumina, for example. The lid 22 can be made of a metal material such as a kovar alloy. However, there are no particular limitations on the constituent materials of the base 21 and the lid 22, respectively.

[0027] The internal space S is airtight and in a decompressed state, preferably in a state closer to a vacuum. Thereby, the viscous resistance is reduced and the vibration characteristics of the vibration element 6 are improved. However, the atmosphere in the internal space S is not particularly limited, and it can be, for example, in an atmospheric pressure state or a pressurized state.

[0028] The recess 211 is composed of a plurality of recesses, and has a recess 211a opening on the upper surface of the base 21, a recess 211b opening on the bottom surface of the recess 211a and having a smaller opening width than the recess 211a, and a recess 211c opening on the bottom surface of the recess 211b and having a smaller opening width than the recess 211b. The support substrate 500 is fixed to the bottom surface of the recess 211a in a state of supporting the vibration element 6, and the circuit element 3 is fixed to the bottom surface of the recess 211c.

[0029] As Figure 2 shown, in the internal space S, the vibration element 6, the support substrate 500, and the circuit element 3 are arranged to overlap each other in a top view. In other words, the vibration element 6, the support substrate 500, and the circuit element 3 are arranged along the C axis. Thereby, the planar expansion of the package 2 in the A-axis direction and the B-axis direction can be suppressed, and miniaturization of the vibration device 1 can be achieved. The support substrate 500 is located between the vibration element 6 and the circuit element 3 and supports the vibration element 6 from the lower side, i.e., the negative side of the C axis.

[0030] In addition, as Figure 1 and Figure 2 shown, a plurality of internal terminals 241 are arranged on the bottom surface of the recess 211a. A plurality of internal terminals 242 are arranged on the bottom surface of the recess 211b. A plurality of external terminals 243 are arranged on the lower surface of the base 21. These internal terminals 241, 242, and external terminals 243 are electrically connected via wiring (not shown) formed inside the base 21.

[0031] The internal terminal 241 is electrically connected to the vibration element 6 via conductive joining members B1, B2 and the support substrate 500. The internal terminal 242 is electrically connected to the circuit element 3 via a bonding wire BW.

[0032] The vibration element 6 is a physical quantity sensor element, which is an angular velocity sensor element capable of detecting the angular velocity ωc with the C-axis as the detection axis. As Figure 3 shown, the vibration element 6 has a vibration substrate 7 and electrodes 8 disposed on the surface of the vibration substrate 7. The vibration substrate 7 is composed of a Z-cut quartz substrate. The Z-cut quartz substrate extends on the X-Y plane defined by the X-axis, which is the electrical axis of quartz as a crystal axis, and the Y-axis, which is the mechanical axis, and has a thickness in the direction along the Z-axis, which is the optical axis.

[0033] The vibration substrate 7 has: a base portion 70 located at the central portion; a pair of detection arms 71 and 72 extending from the base portion 70 to both sides in the B-axis direction; a pair of connection arms 73 and 74 extending from the base portion 70 to both sides in the A-axis direction; a pair of drive arms 75 and 76 extending from the end portions of the connection arm 73 to both sides in the B-axis direction; and a pair of drive arms 77 and 78 extending from the end portions of the connection arm 74 to both sides in the B-axis direction. By using the vibration substrate 7 of this shape, the vibration element 6 having excellent vibration balance is formed.

[0034] In addition, as Figure 4 and Figure 5 shown, the drive arms 75 to 78 have a groove opening on the upper surface and a groove opening on the lower surface, and are formed in a substantially H-shaped cross-sectional shape. In addition, the detection arms 71 and 72 may also have a groove opening on the upper surface and a groove opening on the lower surface, and have a substantially H-shaped cross-sectional shape.

[0035] As Figure 3 shown, the electrodes 8 have a drive signal electrode 81, a drive ground electrode 82, a first detection signal electrode 83, a first detection ground electrode 84, a second detection signal electrode 85, and a second detection ground electrode 86.

[0036] The drive signal electrode 81 is disposed on both side surfaces of the drive arms 75 and 76, and on the upper surface and the lower surface of the drive arms 77 and 78. On the other hand, the drive ground electrode 82 is disposed on the upper surface and the lower surface of the drive arms 75 and 76, and on both side surfaces of the drive arms 77 and 78.

[0037] In addition, the first detection signal electrode 83 is disposed on the upper surface and the lower surface of the detection arm 71. The first detection ground electrode 84 is disposed on both side surfaces of the detection arm 71. On the other hand, the second detection signal electrode 85 is disposed on the upper surface and the lower surface of the detection arm 72. The second detection ground electrode 86 is disposed on both side surfaces of the detection arm 72.

[0038] These electrodes 81 to 86 are respectively wound around to the lower surface of the base portion 70. As Figure 3As shown, on the lower surface of the base 70, there are arranged a terminal 701 electrically connected to the drive signal electrode 81, a terminal 702 electrically connected to the drive ground electrode 82, a terminal 703 electrically connected to the first detection signal electrode 83, a terminal 704 electrically connected to the first detection ground electrode 84, a terminal 705 electrically connected to the second detection signal electrode 85, and a terminal 706 electrically connected to the second detection ground electrode 86.

[0039] As Figure 1 shown, the circuit element 3 is fixed to the bottom surface of the recess 211c. The circuit element 3 includes a drive circuit and a detection circuit that drive the vibration element 6 and detect the angular velocity ωc applied to the vibration element 6. However, there is no particular limitation on the circuit element 3, and for example, it may also include other circuits such as a temperature compensation circuit.

[0040] As Figure 1 shown, the support substrate 500 is interposed between the base 21 and the vibration element 6. The support substrate 500 mainly has the function of absorbing and mitigating the stress generated due to the deformation of the base 21 and making it difficult for the stress to be transmitted to the vibration element 6.

[0041] Next, with reference to Figure 6 and Figure 7 the method for detecting the angular velocity ωc of the vibration element 6 will be described.

[0042] As Figure 6 shown, when a drive signal is applied between the drive signal electrode 81 and the drive ground electrode 82, the drive arms 75 to 78 perform bending vibration. Hereinafter, this drive mode will be referred to as the drive vibration mode.

[0043] In a state where driving is performed in the drive vibration mode, when an angular velocity ωc is applied to the vibration element 6, as Figure 7 shown, the detection vibration mode is re-excited. In the detection vibration mode, the Coriolis force acts on the drive arms 75 to 78 to excite vibration in the direction shown by the arrow b. In response to this vibration, the detection arms 71 and 72 generate detection vibration based on bending vibration in the direction shown by the arrow a.

[0044] The charge generated in the detection arm 71 through such a detection vibration mode can be derived as a first detection signal between the first detection signal electrode 83 and the first detection ground electrode 84, and the charge generated in the detection arm 72 can be derived as a second detection signal between the second detection signal electrode 85 and the second detection ground electrode 86. The angular velocity ωc is detected based on these first and second detection signals.

[0045] Next, with reference to Figure 8 the structure of the support substrate 500 will be described.

[0046] When viewed from above in the C-axis direction, the support substrate 500 has: a rectangular frame-shaped portion 501 fixed to the base 21; a first beam 510 extending from the frame portion 501 in the +A direction as a first extension portion; and a second beam 520 extending from the frame portion 501 in the -A direction.

[0047] In addition, the support substrate 500 has a third beam 530 extending from the frame portion 501 in the -A direction and a fourth beam 540 extending from the frame portion 501 in the +A direction. In addition, the support substrate 500 has a fifth beam 550 extending from the frame portion 501 in the -A direction and a sixth beam 560 extending from the frame portion 501 in the +A direction. The first beam 510 to the sixth beam 560 are separately arranged without contact.

[0048] The first beam 510 has a first end portion 511 in a region that overlaps with the base portion 70 of the vibration element 6 when viewed from above. The second beam 520 has a second end portion 521 in a region that overlaps with the base portion 70 of the vibration element 6 when viewed from above. The third beam 530 has a third end portion 531 in a region that overlaps with the base portion 70 of the vibration element 6 when viewed from above. The fourth beam 540 has a fourth end portion 541 in a region that overlaps with the base portion 70 of the vibration element 6 when viewed from above. The fifth beam 550 has a fifth end portion 551 in a region that overlaps with the base portion 70 of the vibration element 6 when viewed from above. The sixth beam 560 has a sixth end portion 561 in a region that overlaps with the base portion 70 of the vibration element 6 when viewed from above.

[0049] The first beam 510 to the sixth beam 560 are made of the same material as the frame portion 501. As the material of the frame portion 501, for example, quartz can be cited. In addition, not limited to quartz, it can also be silicon.

[0050] In this way, by forming the frame portion 501 of the support substrate 500 and the first beam 510 to the sixth beam 560 from the same quartz, the thermal expansion coefficients of the frame portion 501 and the first beam 510 to the sixth beam 560 can be made equal. Therefore, substantially no thermal stress is generated due to the difference in thermal expansion coefficients between them, and it is not easily affected by stress.

[0051] Moreover, it is preferable that the first beam 510 and the second beam 520, that is, the support substrate 500 and the vibration element 6 are made of the same material. According to this structure, since they are made of the same material, even when temperature changes occur in the vibration element 6 and the support substrate 500, the influence of the thermal expansion coefficient can be suppressed, and the deterioration of the vibration characteristics can be suppressed.

[0052] The support substrate 500 is composed of a quartz substrate having the same cutting angle as the vibration substrate 7 of the vibration element 6. The orientation of the crystal axes of the support substrate 500 is the same as that of the vibration substrate 7. That is, in the support substrate 500 and the vibration substrate 7, the X-axis is the same, the Y-axis is the same, and the Z-axis is the same.

[0053] The thermal expansion coefficients of quartz are different in the X-axis direction, Y-axis direction, and Z-axis direction, respectively. Therefore, by making the support substrate 500 and the vibrating substrate 7 have the same cutting angle and aligning the orientations of their crystal axes with each other, it is less likely to generate thermal stress between the support substrate 500 and the vibrating substrate 7. As a result, the vibrating element 6 is less likely to be subjected to stress, and it is possible to more effectively suppress the degradation and variation of its vibration characteristics.

[0054] In addition, as the support substrate 500, not limited thereto, for example, it may have the same cutting angle as the vibrating substrate 7, but the direction of the crystal axis is different from that of the vibrating substrate 7. Also, the support substrate 500 may be formed of a quartz substrate having a cutting angle different from that of the vibrating substrate 7.

[0055] As Figures 1 to 3 shown, the support substrate 500 is electrically connected to the base portion 70 of the vibrating element 6 via the conductive bonding member B2.

[0056] Specifically, the first end portion 511 of the first beam 510 of the support substrate 500 is electrically connected to the base portion 70 via the first bonding member B2. The second end portion 521 of the second beam 520 is electrically connected to the base portion 70 via the second bonding member B2. Similarly, the third end portion 531 to the sixth end portion 561 are electrically connected to the base portion 70 via the bonding member B2. The support substrate 500 is fixed to the bottom surface of the recess 211a by means of the conductive bonding member B1.

[0057] In this way, the first beam 510, the second beam 520, etc. extend from the frame portion 501 of the support substrate 500, and the first beam 510 is connected to the base portion 70 via the first bonding member B2, and the second beam 520 is connected to the base portion 70 via the second bonding member B2. Therefore, when the vibrating element 6 vibrates, the first beam 510 and the second beam 520 are respectively flexibly deformed, whereby the strain generated in the base portion 70 can be absorbed, alleviated, and reduced. The same applies to the third beam 530 to the sixth beam 560. Thereby, it is possible to provide the vibrating device 1 in which the degradation of the vibration characteristics of the vibrating element 6 is suppressed.

[0058] Moreover, by interposing the support substrate 500 between the vibrating element 6 and the base 21, it is possible to use the support substrate 500 to absorb and alleviate the stress transmitted from the base 21, and the stress is less likely to be transmitted to the vibrating element 6. Therefore, it is possible to effectively suppress the degradation and variation of the vibration characteristics of the vibrating element 6.

[0059] As the bonding members B1 and B2, as long as they have both conductivity and bonding properties, there is no particular limitation. For example, various metal bumps such as gold bumps, silver bumps, copper bumps, solder bumps, etc., and conductive adhesives in which conductive fillers such as silver fillers are dispersed in various adhesives such as polyimide-based, epoxy-based, silicone-based, and acrylic-based adhesives can be used.

[0060] If metal bumps are used as the bonding components B1 and B2, generation of gas from the bonding components B1 and B2 can be suppressed, and environmental changes in the internal space S, particularly an increase in pressure, can be effectively suppressed. On the other hand, if a conductive adhesive is used as the bonding components B1 and B2, the bonding components B1 and B2 become relatively soft, and stress can also be absorbed and mitigated in the bonding components B1 and B2.

[0061] The first end portion 511 and the second end portion 521 have wide portions 511a and 521a with a width larger than that of the first beam 510 and the second beam 520. The third end portion 531 to the sixth end portion 561 also have the same wide portions 531a to 561a. Thus, due to the presence of the wide portions 511a to 561a, protrusion of the first bonding component B2, the second bonding component B2, etc. from the first beam 510 and the second beam 520 can be suppressed, and reliable electrical connection between the first beam 510, the second beam 520 and the base 70 can be achieved.

[0062] A wiring pattern (not shown) for electrically connecting the vibration element 6 and the internal terminal 241 is disposed on the support substrate 500. The wiring pattern is electrically connected to the internal terminals 241 corresponding to the respective terminals 701 to 706.

[0063] Next, refer to Figure 9 A method for manufacturing the vibration device 1 will be described. In addition, the method for manufacturing the support substrate 500 in the method for manufacturing the vibration device 1 will be mainly described.

[0064] As Figure 9 shown, in step S11, a substrate that will become the support substrate 500 is prepared. Specifically, for example, a quartz substrate is prepared.

[0065] In step S12, an etching process is performed on the quartz substrate. Specifically, for example, a metal film such as corrosion-resistant gold or chromium is formed on the quartz substrate, a resist pattern is formed on its upper surface, and the metal film is etched. The etched metal film pattern is used as a mask to perform an etching process on the quartz substrate. Thus, the support substrate 500 including the frame portion 501, the first beam 510 extending from the frame portion 501, and the second beam 520 extending from the frame portion 501 is completed.

[0066] In addition, the third beam 530 to the sixth beam 560 are also formed in the same manner. That is, the frame portion 501 and the first beam 510 to the sixth beam 560 of the same material are formed simultaneously. Then, the first end portion 511 of the first beam 510 is electrically connected to the base 70 via the first bonding component B2. The second end portion 521 of the second beam 520 is electrically connected to the base 70 via the second bonding component B2. Thus, the vibration device 1 is completed.

[0067] Thus, since the frame portion 501, the first beam 510, and the second beam 520 are formed simultaneously, the first beam 510 and the second beam 520 can extend from the frame portion 501 of the support substrate 500. Accordingly, the first beam 510 is connected to the base portion 70 via the first bonding member B2, and the second beam 520 is connected to the base portion 70 via the second bonding member B2. Therefore, when the vibration element 6 vibrates, the first beam 510 and the second beam 520 are flexibly deformed respectively, whereby the strain generated in the base portion 70 can be absorbed, alleviated, and reduced. As a result, the vibration device 1 in which the deterioration of the vibration characteristics of the vibration element 6 is suppressed can be manufactured.

[0068] As described above, the vibration device 1 of the present embodiment includes: a support substrate 500 having a frame portion 501; and a vibration element 6 disposed on the support substrate 500 and having a base portion 70. The support substrate 500 includes: a first beam 510 made of the same material as the frame portion 501, extending from the frame portion 501, and having a first end portion 511 in a region overlapping with the base portion 70; and a second beam 520 made of the same material as the frame portion 501, extending from the frame portion 501, and having a second end portion 521 in a region overlapping with the base portion 70. The base portion 70 is connected to the first end portion 511 via the first bonding member B2, and the base portion 70 is connected to the second end portion 521 via the second bonding member B2.

[0069] According to this structure, the first beam 510 and the second beam 520 extend from the frame portion 501 of the support substrate 500. The first beam 510 is connected to the base portion 70 via the first bonding member B2, and the second beam 520 is connected to the base portion 70 via the second bonding member B2. Therefore, when the vibration element 6 vibrates, the first beam 510 and the second beam 520 are flexibly deformed respectively, whereby the strain generated in the base portion 70 can be absorbed, alleviated, and reduced. Thereby, the vibration device 1 in which the deterioration of the vibration characteristics of the vibration element 6 is suppressed can be provided.

[0070] In addition, since wirings are formed in each of the beams 510 to 560 via the bonding member B2, the routing of the wirings in the support substrate 500 can be simplified. Further, compared with the case where the support substrate 500 and the beams 510 to 560 are disposed on different substrates, the relative position shift between the support substrate 500 and the beams 510 to 560 can be suppressed. Therefore, the deviation in the performance of the vibration device 1 can be suppressed.

[0071] Moreover, in the vibration device 1 of the present embodiment, it is preferable that the vibration element 6, the first beam 510, and the second beam 520 are made of the same material. According to this structure, since they are made of the same material, even when temperature changes occur in the vibration element 6, the first beam 510, and the second beam 520, the influence of the coefficient of thermal expansion can be suppressed, and the deterioration of the vibration characteristics can be suppressed.

[0072] Further, in the vibration device 1 of the present embodiment, it is preferable that at least one of the first end portion 511 and the second end portion 521 has wide-width portions 511a, 521a whose widths are larger than those of the first beam 510 and the second beam 520. According to this structure, since the wide-width portions 511a, 521a are provided, it is possible to suppress the first joining member B2 and the second joining member B2 from protruding from the first beam 510 and the second beam 520, and it is possible to reliably electrically connect the first beam 510 and the second beam 520 to the base portion 70.

[0073] Further, in the vibration device 1 of the present embodiment, it is preferable to have a circuit element 3 electrically connected to the vibration element 6. According to this structure, since the circuit element 3 is provided, for example, it can be used as a gyro sensor or an oscillator.

[0074] Further, in the vibration device 1 of the present embodiment, it is preferable to have a package 2 in which a support substrate 500 and a vibration element 6 are arranged. According to this structure, since the vibration element 6 and the like are housed in the package 2, it is possible to hermetically seal the vibration element 6 and suppress deterioration of vibration characteristics.

[0075] Moreover, regarding the manufacturing method of the vibration device 1 of the present embodiment, the vibration device 1 includes: a support substrate 500 having a frame portion 501; and a vibration element 6 arranged on the support substrate 500 and having a base portion 70. The support substrate 500 includes: a first beam 510 made of the same material as the frame portion 501, extending from the frame portion 501 and having a first end portion 511 in a region overlapping with the base portion 70; and a second beam 520 made of the same material as the frame portion 501, extending from the frame portion 501 and having a second end portion 521 in a region overlapping with the base portion 70. The base portion 70 is connected to the first end portion 511 via a first joining member B2, and the base portion 70 is connected to the second end portion 521 via a second joining member B2. The manufacturing method of the vibration device 1 includes a step of simultaneously forming the frame portion 501, the first beam 510, and the second beam 520.

[0076] According to this method, since the frame portion 501, the first beam 510, and the second beam 520 are simultaneously formed, the first beam 510 and the second beam 520 can extend from the frame portion 501 of the support substrate 500, and the first beam 510 is connected to the base portion 70 via the first joining member B2, and the second beam 520 is connected to the base portion 70 via the second joining member B2. Thus, when the vibration element 6 vibrates, the first beam 510 and the second beam 520 are respectively flexibly deformed, and thereby it is possible to absorb, mitigate, and reduce the strain generated in the base portion 70. Accordingly, it is possible to provide a manufacturing method of a vibration device 1 in which deterioration of the vibration characteristics of the vibration element 6 is suppressed.

[0077] Hereinafter, a modification example of the above-described embodiment will be described.

[0078] As described above, the first beam 510 of the support substrate 500 extends from the frame portion 501 in the +A direction, and the second beam 520 extends from the frame portion 501 in the -A direction. However, it is not limited thereto, and it may also be Figure 10 the structure of the support substrate 500A shown.

[0079] As Figure 10 shown, in addition to the first beam 510 and the second beam 520 of the support substrate 500A of the modified example extending in the +A direction and the -A direction as the first extension direction, it may also include portions extending in the +B direction and the -B direction as the second extension direction.

[0080] Specifically, in the middle of the first beam 510A, the fourth beam 540A, and the sixth beam 560A that extend from the frame portion 501 in the +A direction, there are provided leaf spring-like portions 570A that extend in the +B direction and the -B direction. In addition, in the middle of the second beam 520A, the third beam 530A, and the fifth beam 550A that extend from the frame portion 501 in the -A direction, there are provided leaf spring-like portions 580A that extend in the +B direction and the -B direction.

[0081] Thus, in the support substrate 500A of the modified example, at least one of the first beam 510 and the second beam 520 includes a first extension portion that extends in the first extension direction, namely the beams 510 and 520, and a second extension portion that extends in a second extension direction different from the first extension direction, namely the portions 570A and 580A. According to this structure, since it includes the first extension portion and the second extension portion, it is possible to absorb the displacement of the strain generated in the first extension direction, that is, the +A direction and the -A direction, through the leaf spring-like portions 570A and 580A, thereby being able to suppress the deterioration of the vibration characteristics.

[0082] As described above, the first beam 510 of the support substrate 500 extends from the frame portion 501 in the +A direction, and the second beam 520 extends from the frame portion 501 in the -A direction. However, it is not limited thereto, and it may also be Figure 11 the structure of the support substrate 500B shown.

[0083] As Figure 11 shown, in addition to the first beam 510 and the second beam 520 of the support substrate 500B of the modified example extending in the +A direction and the -A direction as the first extension direction, it may also include portions extending in the +B direction and the -B direction.

[0084] Specifically, in the middle of the first beam 510B that extends from the frame portion 501 in the +A direction, there is provided a leaf spring-like portion 570B that extends in the +B direction and the -B direction. In the middle of the fourth beam 540B, there is provided a portion that extends in the +B direction. In the middle of the sixth beam 560B, there is provided a portion that extends in the -B direction.

[0085] In addition, in the middle of the second beam 520B extending in the -A direction from the frame portion 501, a leaf spring-like portion 580B extending in the +B direction and the -B direction is provided. In the middle of the third beam 530B, a portion extending in the +B direction is provided. In the middle of the fifth beam 550B, a portion extending in the -B direction is provided.

[0086] Thus, in the support substrate 500B of the modified example, leaf spring-like portions 570B and 580B are provided only in the first beam 510B and the second beam 520B, so that it is possible to suppress the influence of minute differences in the operations of the adjacent beams 530B, 540B, 550B, and 560B on the leaf spring-like portions 570B and 580B.

[0087] Furthermore, the leaf spring-like portions 570B and 580B are provided only on the first beam 510B and the second beam 520B, which are the most easily deformable among the first beam 510B to the sixth beam 560B. Therefore, it is possible to absorb the displacement of the strain generated in the +A direction and the -A direction, and to suppress the deterioration of the vibration characteristics. Moreover, since no leaf spring-like portion is provided on the other third beam 530 to the sixth beam 560, the support substrate 500B can be miniaturized.

[0088] In addition, as described above, the double-T gyro element is cited as an example of the vibration element 6, but it is not limited thereto. It may also be an H-type gyro sensor element or a silicon MEMS gyro sensor element. Moreover, it is not limited to the gyro element. For example, it may also be a tuning fork type vibration element.

Claims

1. A vibration device, comprising: a supporting substrate having a frame portion; and a vibration element, which is arranged on the support substrate and has a base, The support substrate comprises: a first beam made of the same material as the frame portion, extending from the frame portion, and having a first terminal portion in a region overlapping the base portion; and a second beam made of the same material as the frame portion, extending from the frame portion and having a second terminal portion in a region overlapping the base portion, The base portion is connected to the first terminal portion via a first connecting member, The base portion and the second terminal portion are connected via a second connecting member.

2. The vibration device according to claim 1, wherein The vibration element, the first beam, and the second beam are made of the same material.

3. The vibration device according to claim 1, wherein At least one of the first beam and the second beam comprises: a first extending portion extending along a first extending direction; as well as The second extending portion extends along a second extending direction different from the first extending direction.

4. The vibration device according to claim 1, wherein At least one of the first terminal portion and the second terminal portion includes a wide portion having a width greater than that of the first beam and the second beam.

5. The vibration device according to claim 1, wherein The vibration device has a circuit element electrically connected to the vibration element.

6. The vibration device according to claim 1, wherein The vibration device has a package, The support substrate and the vibration element are arranged in the package.

7. A method for manufacturing a vibration device, The vibration device has: a supporting substrate having a frame portion; and a vibration element, which is arranged on the support substrate and has a base, The support substrate comprises: a first beam made of the same material as the frame portion, extending from the frame portion, and having a first terminal portion in a region overlapping the base portion; and a second beam made of the same material as the frame portion, extending from the frame portion and having a second terminal portion in a region overlapping the base portion, The base portion is connected to the first terminal portion via a first connecting member, The base portion and the second terminal portion are connected via a second connecting member, The method for manufacturing the vibration device includes a step of simultaneously forming the frame portion, the first beam, and the second beam.

Images