A method and system for testing internal temperature rise of a display light panel

Abstract

The present invention provides a method and system for testing the internal temperature rise of a display light panel, relating to the field of temperature rise testing technology. The method divides the test points into a grid and collects the initial temperature distribution data and corresponding drive current of each test point after power is applied to establish a temperature-electric parameter correlation matrix. Based on the temperature-electric parameter correlation matrix, dynamic weights are assigned to the test points to generate an optimized scanning sequence. A closed-loop feedback mechanism is used to correct the drive current in real time, while simultaneously capturing temperature fluctuations in micro-regions outside the scanning path and dynamically inserting the coordinates of abnormal temperature rise areas into the optimized scanning sequence. The temperature-electric parameter correlation matrix is ​​updated based on real-time temperature rise data and drive current changes. Various data points during the test are analyzed to generate a test result report. The present invention can automatically adjust the scanning strategy based on real-time temperature changes, ensuring that areas with larger temperature fluctuations receive priority attention.

Description

Technical Field

[0001] The present invention relates to the technical field of temperature rise testing, and more particularly to a method and system for testing the internal temperature rise of a display screen light panel. Background Art

[0002] With the rapid development of display technology, particularly the widespread adoption of new display technologies such as liquid crystal displays (LCD), organic light-emitting diode displays (OLED), and quantum dot displays (QLED), display performance and quality have become a key concern for consumers. This is particularly true in large-screen displays, televisions, smartphones, and automotive displays, where the reliability and stability of displays directly impact the market competitiveness of products. As a crucial component of a display, the thermal management performance of the display light panel significantly impacts display quality, service life, and energy efficiency. Therefore, efficiently and accurately monitoring and regulating the temperature rise of the light panel under different operating conditions has become a pressing issue in the display technology field.

[0003] Currently, temperature testing technologies for display panel light boards mostly rely on traditional thermal imaging or single-point temperature sensors. While these methods can provide a certain degree of accuracy in measuring display temperature fluctuations, they still have many limitations. While thermal imaging technology can provide a relatively comprehensive view of the display surface temperature distribution, its accuracy is low and it cannot capture microscopic variations in local temperature changes in real time. Single-point temperature sensors often face the problem of a limited monitoring range, unable to effectively reflect temperature changes across the entire surface of the light board, making it even more difficult to detect potential local hot spots. With the continuous advancement of display technology, especially the rise of high-brightness, large-size displays, traditional temperature testing methods are increasingly unable to meet the needs of accurate testing. Summary of the Invention

[0004] In order to solve the above technical problems, the present invention provides a display screen light board internal temperature rise testing system and system.

[0005] According to one aspect of the present invention, a display screen lamp panel internal temperature rise test system is provided, which includes: a test point grid division module, which is used to divide the test point grid and collect the initial temperature distribution data and corresponding drive current of each test point after power is applied, and establish a temperature-electrical parameter correlation matrix; a dynamic weight allocation module, which performs dynamic weight allocation of the test points based on the temperature-electrical parameter correlation matrix and generates an optimized scanning sequence; a closed-loop feedback adjustment module, which is used to correct the driving current in real time through a closed-loop feedback mechanism, and at the same time capture the temperature mutation of the micro-area outside the scanning path, and dynamically insert the coordinates of the abnormal temperature rise area into the optimized scanning sequence; a matrix update and test report generation module, which is used to update the temperature-electrical parameter correlation matrix according to the real-time temperature rise data and the drive current change; and analyze the various data in the test process to generate a test result report.

[0006] Furthermore, the dynamic weight allocation module includes: a weight allocation unit, which is used to calculate the initial weight value of each test point based on the temperature change rate and its relationship with the current of the test point; an adjacent test point weight adjustment unit, which is used to adjust the weights of adjacent areas taking into account the temperature gradient and heat conduction effect between adjacent test points; and an optimized scanning path generation unit, which is used to generate an optimized scanning sequence based on the aforementioned dynamic weight allocation and the associated adjustment of adjacent test point weights.

[0007] Furthermore, the weight distribution unit includes: calculating the temperature change rate for each test point based on the temperature-electrical parameter correlation matrix; and adjusting the initial weight value of each test point according to the temperature change rate and the current value.

[0008] Furthermore, the adjacent test point weight adjustment unit includes: for each test point and its adjacent points calculate the temperature gradient influence factor; for each adjacent test point, accumulate the sum of the gradient influence factors of all adjacent test points; multiply the accumulated value by a preset heat conduction compensation coefficient to generate a weight adjustment increment value; add the increment value to the initial weight value to generate an adjusted weight value.

[0009] Furthermore, the optimized scanning path generation unit includes: after determining the weight of each test point, sorting all the test points from largest to smallest according to the weight value, and preferentially starting the scanning from the area with the largest weight; setting each row or each column in the test point grid as a scanning unit, and alternating the scanning path between rows, specifically operating as follows: scanning along the first row of the matrix, and after scanning, turning to the next row and scanning in the opposite direction; after completing the scanning of one row, turning to the next row, and repeating the above process to form a Z-shaped pattern;

[0010] When it is detected that the temperature difference between adjacent test points exceeds a preset threshold, the scanning order is dynamically adjusted.

[0011] Furthermore, the dynamic insertion of the coordinates of the abnormal temperature rise area into the optimized scanning sequence includes: obtaining global and local temperature data of the display screen light board, focusing on monitoring the area outside the scanning path, and detecting abnormal temperature mutations in real time; when the temperature change rate of the test point exceeds the preset maximum tolerance rate, the area where the test point is located is identified as an abnormal temperature rise area; according to the temperature rise rate of the abnormal temperature rise area, all abnormal temperature rise areas are sorted from high to low according to the temperature rise rate, and the abnormal temperature rise areas with high temperature rise rates will be preferentially inserted into the scanning path; for each abnormal temperature rise area detected, the coordinates of the abnormal temperature rise area are inserted into the current path scanning sequence, and the scanning path order is adjusted; the updated path sequence is fed back to the dynamic weight allocation module through the interface.

[0012] Furthermore, the dynamic insertion of the coordinates of the abnormal temperature rise area into the optimized scanning sequence also includes: designing a dual-thread parallel processing solution to avoid resource preemption between path generation and abnormal temperature rise area insertion: the task of thread 1 is to activate each test point in sequence according to the optimized path sequence and record the temperature rise curve data; the optimized path sequence will be dynamically adjusted based on the following: when thread 2 finds an abnormal temperature rise area with a temperature rise rate greater than a set threshold, thread 1 will insert the path of the abnormal temperature rise area into the scanning queue and reorder it according to the priority of the inserted area; the scanning path of thread 1 will sort the paths from high to low according to the temperature rise rate and adjust the scanning order; the scanning order after the path adjustment still maintains The scanning form of the Z-shaped structure; Thread 2 is responsible for capturing the abnormal temperature rise area in real time and inserting it into the scanning path. The specific steps are as follows: According to the real-time collected temperature data, the temperature rise rate of each test point is calculated. If the temperature rise rate is greater than the preset threshold, Thread 2 marks the area as an abnormal temperature rise area; All abnormal temperature rise areas are sorted from high to low according to the temperature rise rate, and the areas with high temperature rise rates are processed first; Thread 2 calculates the relative position of the abnormal temperature rise area in the original Z-shaped path and inserts it into the scanning path queue according to priority; When Thread 2 identifies the abnormal temperature rise area, it will preempt the execution right of Thread 1, give priority to inserting the path of the abnormal temperature rise area and update the scanning order.

[0013] Furthermore, the updated temperature-electrical parameter correlation matrix is ​​dynamically corrected using a convolution operation method.

[0014] According to another aspect of the present invention, a method for testing the internal temperature rise of a display screen lamp panel is provided, which includes: S1, dividing the test point grid, and collecting the initial temperature distribution data and the corresponding driving current of each test point after power is applied, and establishing a temperature-electrical parameter correlation matrix; S2, based on the temperature-electrical parameter correlation matrix, dynamically assigning weights to the test points and generating an optimized scanning sequence; S3, correcting the driving current in real time through a closed-loop feedback mechanism, and capturing temperature mutations in micro-regions outside the scanning path, and dynamically inserting the coordinates of the abnormal temperature rise area into the optimized scanning sequence; S4, updating the temperature-electrical parameter correlation matrix according to the real-time temperature rise data and the driving current changes; analyzing the various data during the test process and generating a test result report.

[0015] Compared with the prior art, the method and system for testing the internal temperature rise of the display screen lamp panel provided by the present invention can finely divide the surface of the lamp panel through the test point grid division module, and collect the temperature distribution data and the corresponding driving current of each test point to establish a temperature-electrical parameter correlation matrix. The matrix can accurately describe the relationship between the temperature change and the current in different areas, and provide an accurate basis for the subsequent dynamic weight allocation; according to the changes in the temperature change rate and the current demand, the scanning priority of each test point is dynamically adjusted, and an optimized scanning sequence is generated, thereby improving the scanning efficiency and detection accuracy. This dynamic adjustment mechanism not only solves the problems of inflexible scanning path and fixed scanning order in traditional methods, but also can automatically adjust the scanning strategy according to real-time temperature changes to ensure that areas with larger temperature changes receive priority attention. More importantly, the system also introduces a closed-loop feedback mechanism through closed-loop feedback regulation and matrix update, adjusts the driving current in real time and dynamically corrects the scanning path, further optimizes the testing process, and avoids measurement errors and temperature anomaly omissions that may exist in traditional technologies. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0017] Figure 1 4 is a system block diagram of a display screen light board internal temperature rise testing system according to an embodiment of the present invention.

[0018] Figure 2 4 is a block diagram of a dynamic weight allocation module in a display screen light board internal temperature rise testing system according to an embodiment of the present invention.

[0019] Figure 3 Flowchart of a method for testing the internal temperature rise of a display light panel according to an embodiment of the present invention. DETAILED DESCRIPTION

[0020] Below, the exemplary embodiments according to the present invention will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments of the present invention, and it should be understood that the present invention is not limited to the exemplary embodiments described herein.

[0021] As mentioned in the background technology above, with the rapid development of display technology, especially the popularization of new display technologies such as liquid crystal displays (LCDs), organic light-emitting diode displays (OLEDs), and quantum dot displays (QLEDs), the performance and quality of displays have gradually become a focus of consumer attention. This is especially true in areas such as large-screen displays, televisions, smartphones, and in-vehicle displays. The reliability and stability of displays directly impact the market competitiveness of products. As a crucial component of a display, the thermal management performance of the display light board has a significant impact on the display effect, service life, and energy efficiency. Therefore, how to efficiently and accurately monitor and adjust the temperature rise of the light board under different usage conditions has become a pressing issue in the field of display technology.

[0022] Currently, most temperature rise testing technologies for display panel lamps rely on traditional thermal imaging technology or single-point temperature sensors. While these methods can reflect the temperature changes of the display screen to a certain extent, they still have many limitations. While thermal imaging technology can provide a relatively comprehensive view of the surface temperature distribution of the display screen, its accuracy is low and it cannot capture microscopic differences in local temperature changes in real time. Single-point temperature sensors often face the problem of limited monitoring range and are unable to effectively reflect temperature changes across the entire surface of the lamp panel, making it even more difficult to detect potential local hot spots. With the continuous advancement of display technology, especially the rise of high-brightness, large-size displays, traditional temperature rise testing methods are increasingly unable to meet the needs of accurate testing. Our invention, the internal temperature rise testing system for display panel lamps, overcomes many of the shortcomings of traditional technologies.

[0023] Figure 1 This is a system block diagram of a display screen light board internal temperature rise test system according to an embodiment of the present invention. Figure 1 As shown, in the internal temperature rise test system of the display screen lamp board, it includes: a test point grid division module 100, which is used to divide the test point grid, and collect the initial temperature distribution data and the corresponding driving current of each test point after power is turned on, and establish a temperature-electrical parameter correlation matrix; a dynamic weight allocation module 200, which performs dynamic weight allocation of the test points based on the temperature-electrical parameter correlation matrix and generates an optimized scanning sequence; a closed-loop feedback adjustment module 300, which is used to correct the driving current in real time through a closed-loop feedback mechanism, and at the same time capture the temperature mutation of the micro-area outside the scanning path, and dynamically insert the coordinates of the abnormal temperature rise area into the optimized scanning sequence; a matrix update and test report generation module 400, which is used to update the temperature-electrical parameter correlation matrix according to the real-time temperature rise data and the driving current change; and analyze various data in the test process to generate a test result report.

[0024] In an embodiment of the present invention, the test point grid division module 100 is used to divide the surface of the display screen light board into equally spaced test point grids, collect the initial temperature distribution data and corresponding driving current of each test point after power is turned on, and establish a multidimensional matrix containing the mapping relationship between temperature gradient and current value.

[0025] Specifically, a high-precision scanner is first used to precisely measure the display panel's surface coordinates. Based on the display's size and display area, the surface is divided into multiple equally spaced test areas. The distribution of test points is optimized based on the panel's actual usage characteristics (e.g., the heat dissipation requirements of different areas, such as the screen edges and center), ensuring that the test points cover the entire panel surface, including areas where heat loads may be concentrated.

[0026] Optionally, the test point spacing is selected based on the physical characteristics of the light board and the expected temperature rise response to ensure sufficient accuracy of the temperature distribution.

[0027] After all test points are assigned, power on the light panels one by one, using a current source to provide a stable drive current to each test point. Simultaneously collect the initial temperature data and corresponding current value at each test point after power-on. The temperature sensor should ensure a measurement accuracy of at least 0.1°C to accurately capture temperature changes at each test point. Furthermore, to avoid external interference, temperature data should be collected after environmental conditions have stabilized to ensure reliable test data.

[0028] A multidimensional matrix, the temperature-electrical parameter correlation matrix, is constructed using the initial temperature and current data collected at all test points. Each element in the matrix contains the location of the test point, the initial temperature, the applied current value, and the temperature change rate at that location.

[0029] By associating temperature changes with current parameters, the temperature change rate of each test point can be directly associated with the current magnitude, thereby accurately reflecting the impact of current on temperature changes.

[0030] The construction of the temperature-electrical parameter correlation matrix should consider the thermal distribution characteristics of different display regions (e.g., edges and center) and incorporate local heating rate data for further data refinement. Specifically, the matrix should include a coordinate-based index to facilitate subsequent rapid search and optimization.

[0031] After the preliminary temperature and current value mapping relationship matrix is ​​constructed, the relationship between temperature gradient and current is further optimized through data analysis tools. For example, based on this temperature-electrical parameter correlation matrix, in future temperature rise tests, especially for areas with large local temperature differences, the temperature-current mapping relationship stored in the matrix can be used to automatically identify areas that require additional attention.

[0032] In the embodiment of the present invention, the dynamic weight allocation module 200 is used to perform dynamic weight allocation of test points based on the temperature-electrical parameter correlation matrix, preferentially traverse adjacent test points whose temperature change rate exceeds a set threshold, and generate an optimized scanning sequence including a cross-convolution path, such as Figure 2 As shown, it includes a weight allocation unit 201, which is used to calculate the initial weight value of each test point based on the temperature change rate and its relationship with the current of the test point; an adjacent test point weight adjustment unit 202, which is used to adjust the weights of adjacent areas taking into account the temperature gradient and heat conduction effect between adjacent test points; and an optimized scanning path generation unit 203, which is used to generate an optimized scanning sequence including a cross-convolution path based on the aforementioned dynamic weight allocation and the adjustment of the adjacent test point weight association.

[0033] In this embodiment of the present invention, the weight assignment unit 201 specifically includes the following steps: Based on the constructed temperature-electrical parameter correlation matrix, the temperature change rate (unit: °C / s) is first calculated for each test point. For each test point, areas where the temperature change rate exceeds a set threshold are assigned a higher weight. This means that areas with faster temperature changes have higher priority and receive more attention during subsequent scanning. The initial weight value of each test point is adjusted based on the temperature change rate and current value. The specific operation is as follows:

[0034] The initial weight value of each test point is obtained based on the temperature change rate and its current relationship with the adjacent test points. For each test point i, its temperature change rate is calculated. :

[0035] ,

[0036] in, and are the i-th test point at time t and The temperature of the moment, is the time interval.

[0037] The current value of each test point is obtained (measured by a current sensor). This current value is used together with the temperature change rate of the test point to construct an initial weight. This ensures that when the current is high, test points with more significant temperature changes receive higher weights, optimizing the detection priority of high-temperature sensitive areas during the scanning process.

[0038] By weighting the temperature change rate and current, the system considers not just a single temperature value but the rate of temperature change. This allows for more accurate identification of areas with rapidly rising temperatures, preventing low-temperature areas from consuming excessive scanning resources. Unlike existing methods that rely solely on the current-temperature relationship, this method incorporates the temperature change rate as a dynamic adjustment factor, making the test process adaptive.

[0039] In the embodiment of the present invention, the adjacent test point weight adjustment unit 202 specifically includes:

[0040] After calculating the initial weight of each test point, the weights of the test points adjacent to the test point will be dynamically adjusted based on the temperature gradient of the adjacent points. Specifically, for each test point The temperature gradient is calculated for adjacent test points. Since the temperature change between adjacent test points will affect the heat distribution of the entire area, the initial weights of adjacent test points are adjusted according to the size of the temperature gradient. The specific adjustment method is as follows:

[0041] For each adjacent test point of test point i , calculate its temperature gradient influence factor;

[0042] For each adjacent test point, the sum of the gradient influence factors of all adjacent test points is accumulated; the accumulated value is multiplied by a preset heat conduction compensation coefficient (range 0.1-0.3) to generate a weight adjustment increment value; the increment value is added to the initial weight calculated by unit 201 to generate an adjusted weight value.

[0043] It should be noted that if the temperature difference between adjacent test points is too large, the system will increase the scanning priority of these two points to ensure that they are scanned more intensively to reduce the test errors caused by temperature gradients. Conversely, if the temperature changes are gentle, the scanning interval between adjacent points can be appropriately increased.

[0044] In the embodiment of the present invention, the optimized scanning path generating unit 203 specifically includes:

[0045] After determining the weight of each test point, all test points are sorted from largest to smallest by weight. After sorting, areas with larger weights are scanned first, i.e., those with larger temperature variations or higher current demands, and a "zigzag" path planning strategy is adopted.

[0046] Specifically, each row or column in the test point grid is considered a scanning unit, and the scanning path alternates between rows. The specific operation is as follows:

[0047] Starting from the upper left corner, scan along the first row of the matrix. After completing the scan, turn to the next row and scan in the opposite direction. After completing one row, turn to the next row and repeat the above process, forming a "Z" shape. When generating the path, if a certain area in a row (such as an area with a large temperature change rate) is prioritized, the test points in this area will be scanned first to ensure that the temperature sudden change area is fully monitored.

[0048] During the scanning process, if the temperature difference between adjacent test points exceeds a preset threshold, the scanning order is dynamically adjusted, and the area with the larger temperature difference is selected as the target point for the next scan. In this way, the scanning path is not fixed, but can be adaptively adjusted according to real-time temperature changes.

[0049] For example, first perform a basic check on the display light board to ensure that the device is working properly. Record the initial temperature at each test point and ensure that the device is not running too hot before testing.

[0050] All test points were scanned one by one using the traditional sequential scanning method. During the scanning process, the current was maintained constant, and the temperature change at each point was recorded. Using the same equipment and test conditions, a spiral scanning method was used instead. This method starts from the center and gradually scans outward, passing through all test points in a spiral path. A zigzag path planning method was then used for testing. The weights of the test points were dynamically adjusted based on the temperature gradient to ensure that areas with sudden changes in high temperature were scanned first.

[0051] During this process, the temperature changes at each test point are recorded in real time, and the scanning strategy is adjusted based on the scanning sequence, especially areas with large temperature changes are scanned first. Temperature data, current values, scanning time, and other related data for each scanning method are transmitted in real time. After completing the full path scan, the system automatically records the temperature rise curve and final test accuracy of each test point. The data is as follows:

[0052] Test subjects Initial temperature (℃) Scan time (seconds) Temperature change rate (℃ / s) Traditional sequential scanning method 25 150 0.01 Spiral scanning method 25 140 0.015 Zigzag path planning 25 95 0.03

[0053] As can be seen, the scanning path planning of the present invention can dynamically adjust the scanning order, achieving a temperature change rate of 0.03°C / s. By prioritizing areas with large temperature changes, the zigzag path planning can capture sudden temperature rises more promptly, improving the response speed to temperature anomalies.

[0054] Better yet, an optimization algorithm is used to ensure the shortest scanning path time. For example, a greedy algorithm or a heuristic search algorithm is used to ensure that while scanning high-weight areas, invalid blank area scanning is reduced, thereby shortening the overall test time.

[0055] During the scanning process, the temperature rise curve of each test point is recorded in real time. Based on the changes in the temperature rise curve, if the temperature rise at certain locations is found to be abnormally large, the error can be corrected by adjusting the current or scanning sequence to ensure the accuracy of the final test results.

[0056] By introducing a "zigzag" path scanning and dynamic adjustment, scanning efficiency is optimized while prioritizing temperature changes within the area, thereby improving overall scanning accuracy and flexibility. This path planning not only effectively avoids scanning redundancy but also makes the testing process more adaptable through real-time dynamic adjustment.

[0057] In this embodiment of the present invention, the closed-loop feedback adjustment module 300 is used to modify the drive current in real time through a closed-loop feedback mechanism, while also capturing sudden temperature changes in micro-regions outside the scanning path and dynamically inserting the coordinates of areas with abnormal temperature rise into the optimized scanning sequence. Specifically, by monitoring temperature changes in real time, capturing areas with abnormal temperature rise, and dynamically inserting their coordinates into the path scanning sequence, this ensures that high-temperature areas are scanned first and the temperature rise rate is precisely controlled. The core goal is to optimize temperature rise control and path adjustment, avoid local overheating, and improve overall test accuracy.

[0058] The details are as follows: First, real-time temperature data is collected from each test point on the display panel, including the current temperature and the corresponding current value. Based on this temperature data, the temperature rise rate of each test point is calculated. Based on the temperature rise rate of each test point, the drive current is dynamically adjusted to ensure that the temperature rise rate is within the set range. If the temperature rise rate of a test point exceeds the preset maximum tolerance rate (for example, 0.5°C / s), the corresponding drive current is reduced; otherwise, the current may be increased.

[0059] Through this closed-loop feedback mechanism, the temperature rise of each test point can be controlled in real time to prevent local overheating.

[0060] Furthermore, the system acquires global and local temperature data from the display panel, focusing on areas outside the scanning path to detect sudden and abnormal temperature changes in real time. When the temperature change rate at a test point exceeds a preset maximum tolerance rate, the area in question is identified as experiencing an abnormal temperature rise. By comparing the current temperature with the temperature change rate of the surrounding area, the system determines whether a sudden temperature rise has occurred.

[0061] The coordinates, temperature, and rate of change of the abnormal temperature rise area are recorded.

[0062] Preferably, the coordinates of the abnormal temperature rise area are dynamically inserted into the path scanning sequence. The specific path dynamic insertion operation process is as follows:

[0063] Based on the temperature rise rate of the abnormally high-temperature-rise region, all abnormally high-temperature-rise regions are sorted from high to low. Abnormally high-temperature-rise regions with high temperature rise rates are prioritized for insertion into the scan path to ensure timely processing of high-temperature regions. For each detected abnormally high-temperature-rise region, the coordinates of that region are inserted into the current path scan sequence, and the scan path order is adjusted. The inserted path prioritizes high-temperature regions, ensuring that these regions are scanned first and overheating is avoided. The updated path sequence is fed back to the dynamic weight allocation module 200 via an interface to ensure that the path optimization and feedback mechanism work together.

[0064] To effectively avoid resource competition between path generation and abnormal temperature rise area insertion, a dual-threaded parallel processing solution is designed to ensure that the two can work together efficiently:

[0065] Thread 1's task is to activate each test point sequentially according to the optimized path sequence and record the temperature rise curve data. Unlike the traditional simple zigzag path, Thread 1 not only executes the preset scan path but also recalculates the current path sequence before each scan. The path sequence is dynamically adjusted based on the following factors:

[0066] When Thread 2 discovers an abnormally high temperature region with a temperature rise rate exceeding a set threshold, Thread 1 inserts the path for that region into the scan queue and reorders the paths based on the priority of the inserted regions. Specifically, abnormally high temperature rise regions with high temperature rise rates are prioritized in the zigzag scan path to ensure they are processed first. Thread 1's scan path sorts the paths from highest to lowest temperature rise rate and adjusts the scan order.

[0067] The scanning order after the path adjustment still maintains the zigzag structure, but the order of each row will be slightly adjusted. For example, if a certain area in a row is found to have a large temperature rise, the path will prioritize covering that area to reduce the excessive temperature in that area.

[0068] During each scan, Thread 1 dynamically updates the scan path. When Thread 2 inserts an abnormal temperature rise area, Thread 1 adjusts the subsequent scan path based on the priority of the inserted abnormal temperature rise area. For example, after inserting an abnormal temperature rise area, Thread 1 will gradually adjust the scan path priority through a short period of path updates.

[0069] Thread 2 is responsible for capturing abnormal temperature rise areas in real time and inserting them into the scan path. Thread 2 monitors temperature changes during the scan process. Once it finds that the temperature rise rate in a certain area exceeds the set threshold, it responds immediately and inserts the path according to the following steps:

[0070] Thread 2 calculates the temperature rise rate of each test point based on the real-time collected temperature data. If the temperature rise rate of a certain area is greater than the preset threshold, thread 2 marks the area as an abnormal temperature rise area.

[0071] All abnormal temperature rise areas are sorted by temperature rise rate from high to low, with areas with higher temperature rise rates being processed first. Thread 2 calculates the relative position of the abnormal temperature rise areas in the original Z-shaped path and inserts them into the scan path queue according to priority.

[0072] The inserted abnormal temperature rise area will be inserted into the scanning sequence based on its priority based on the zigzag path. If the existing order in the scanning path is relatively tight, thread 2 may adjust the path order to give priority to scanning the high temperature area.

[0073] To avoid resource contention or conflict between threads 1 and 2 during execution, a dual-thread parallel processing mechanism is adopted. Under this mechanism, threads 1 and 2 can work together efficiently, and preemptive scheduling ensures that abnormal temperature rise areas can be inserted into the scan path in a timely manner and receive priority processing, namely:

[0074] Thread 1 is responsible for executing the optimized scan path generated by module 200, activating test points sequentially in a zigzag scanning sequence and recording temperature rise curve data. Thread 1 periodically scans and updates the path sequence to ensure that all test points are covered. Thread 2 is responsible for detecting abnormal temperature rise areas in real time and inserting them into the scan path based on their temperature rise rate priority. If the temperature rise rate exceeds a set threshold, Thread 2 prioritizes insertion into the abnormal temperature rise area and adjusts the path based on the priority.

[0075] When Thread 2 identifies an abnormally high temperature area, it preempts Thread 1's execution, prioritizes insertion into the path leading to the abnormally high temperature area, and updates the scan order. The response time for Thread 2's insertion into the abnormally high temperature area is guaranteed to be within 5ms to avoid significant delays in Thread 1's execution.

[0076] Based on the Z-shaped scan path, after dynamic insertion of thread 2 and path priority sorting, the optimized scan path sequence can ultimately better cover the high-temperature area and ensure scanning accuracy. The optimized scan path sequence is as follows:

[0077] First, each test point is activated sequentially along a zigzag path, recording preliminary temperature rise data. Thread 2, upon detecting areas of abnormal temperature rise, sorts them by temperature rise rate from highest to lowest and inserts them into the appropriate position on the scan path. This path is fine-tuned based on the original zigzag path to prioritize high-temperature areas. Thread 1 dynamically updates the scan path order based on the areas inserted by Thread 2, ensuring that high-temperature areas are covered first. This adjusted path order maintains the characteristics of the zigzag scan, but prioritizes areas with higher temperature rise rates to avoid localized overheating.

[0078] Throughout the process, the scanning path is continuously optimized based on real-time data feedback, ensuring that each path update maximizes the accuracy of temperature rise monitoring.

[0079] Furthermore, threads 1 and 2 need to work in parallel, but they must avoid interruptions, delays, or data inconsistencies caused by thread switching. To this end, the following mechanism is used to coordinate the execution of the two:

[0080] A preemptive scheduling mechanism is used to ensure that thread 2 can insert a new scanning path in time when an exception is detected, and the scanning process of thread 1 will not be excessively interrupted. The specific approach is:

[0081] Thread 2's insertion requests are prioritized by temperature rise rate, prioritizing areas with higher temperature rise rates. Thread 2 preempts Thread 1's execution and inserts the path to the abnormal temperature rise area. Thread 1 then pauses the current test point activation, inserts the path to the abnormal temperature rise area, and immediately resumes scanning.

[0082] When processing abnormal temperature rise areas, thread 1 adjusts the scan order to include the abnormal temperature rise areas in the scan path. The path order after insertion will prioritize high temperature areas to ensure that these areas are fully tested.

[0083] To avoid scan interruption or data inconsistency caused by path adjustment, the following two strategies are adopted:

[0084] When thread 1 is adjusting the scan path, it locks the current scan path to ensure that data inconsistencies or path conflicts do not occur during the path adjustment process. During the path adjustment process, thread 1 will enter a temporary "sleep" state and resume scanning operations after the path adjustment is completed.

[0085] To prevent data loss or corruption, a buffer (or queue) mechanism is used to store temperature-rise data. During scanning, Thread 1 stores the temperature-rise data in the buffer and then passes it to Thread 2 for processing. Thread 2 then interpolates the coordinates of the abnormal temperature-rise area based on the new scanning path. After completing the path adjustment, Thread 2 returns the processed data to Thread 1, which then continues scanning the next test point.

[0086] During thread switching, Thread 1's scan path isn't completely interrupted. Instead, a "soft interrupt" is used to pause the current operation while processing the insertion of the abnormal temperature rise area. A short time window (e.g., within 5ms) is allocated for path adjustment. Thread 2's task completes the path insertion within this time window, and Thread 1 resumes path scanning.

[0087] Each time Thread 1 scans a test point, it saves the temperature rise data for the current point into a buffer. When a path adjustment occurs, Thread 2 reads the data from the buffer and performs the path adjustment, while Thread 1 continues scanning the next test point from the buffer. When Thread 1 resumes scanning, it follows the adjusted path and checks the validity of the new path. If a path adjustment causes the order of the test points to change, Thread 1 uses the cached data to supplement the order, ensuring data consistency throughout the scan.

[0088] To ensure data consistency after path adjustment, thread 1 uses a locking mechanism to prevent itself from modifying the path during path adjustment. After path insertion is complete, thread 1 releases the path adjustment lock, allowing thread 2 to proceed with the next round of path adjustment. Threads 1 and 2 synchronize data using semaphores. After each scan, thread 1 signals thread 2 that data is ready. Thread 2 then inserts and modifies the path based on the abnormal temperature rise area and, upon completion, notifies thread 1 to continue.

[0089] After thread 2 inserts the new path coordinates, thread 1 needs to perform a consistency check on the new scanning path. This check ensures that all data (including temperature rise data and path coordinates) are correct after the path adjustment. If data inconsistency is detected or path insertion fails, the system automatically rolls back to the last valid path and readjusts the path to ensure scanning accuracy.

[0090] It should be noted that by combining zigzag scan path planning with a dynamic insertion mechanism for abnormal temperature rise areas, this technical solution effectively optimizes the scan path for high efficiency. Parallel processing of Thread 1 and Thread 2, utilizing preemptive scheduling, ensures that areas with abnormal temperature rise are promptly inserted into the scan path, and adjusts the path order based on the priority of the temperature rise rate. Ultimately, the optimized scan path more accurately covers areas with large temperature rises, improving the accuracy and efficiency of the testing process.

[0091] In the embodiment of the present invention, the matrix update and test report generation module 400 is used to update the temperature-electrical parameter correlation matrix according to the real-time temperature rise data and the driving current change; analyze various data during the test process and generate a test result report.

[0092] Specifically, the temperature rise data comes from the temperature change data of each test point in the scanning path.

[0093] The matrix update process involves updating the relationship between the temperature response of each test point and its corresponding drive current in real time during testing. As the temperature-current relationship changes, a convolution operation helps propagate these changes to the matrix. The convolution operation takes into account the spatial relationship between test points and the temperature differences between adjacent points. Through the convolution operation, the current-temperature relationship between each test point and its neighbors is dynamically adjusted.

[0094] Specifically, the convolution kernel is used to perform a weighted update of the temperature of the current test point based on the temperature difference of the neighborhood. The design of the convolution kernel needs to consider the following factors:

[0095] Each element of the convolution kernel should be proportional to the temperature difference at the current test point. For example, when the temperature difference between neighboring test points is large, the convolution kernel should give it a greater weight; conversely, when the temperature difference is small, the weight should be smaller. The influence of neighboring points farther away from the current test point on the temperature update should gradually decrease. This can be achieved using a Gaussian decay function, where the weight decays according to an exponential or Gaussian function as the distance increases.

[0096] The convolution operation uses the convolution kernel to perform a weighted average on the temperature data, thereby updating the temperature value of the current test point. The steps of the convolution operation are as follows:

[0097] Based on the selected neighborhood size (e.g., 3x3, 5x5, etc.), a neighborhood area related to the current test point is selected to calculate the temperature difference between each point in the neighborhood and the temperature of the current point; the temperature of each neighborhood point is multiplied by its corresponding weight to obtain a weighted temperature value; the weighted temperature values ​​are summed and divided by the sum of the weights to obtain an updated temperature value; and the temperature-current response matrix is ​​updated based on the weighted temperature values.

[0098] The weight of the convolution kernel is associated with the temperature difference. Specifically, when the temperature difference between adjacent points is large, the weight of the corresponding position of the convolution kernel increases, which means that the temperature difference at this point has a greater impact on the current point and should be considered more. When the temperature difference of distant points is small, its impact on the current point is small, and the weight of the corresponding position of the convolution kernel decreases.

[0099] After the convolution operation is complete, the temperature-current response matrix is ​​updated. The specific update process is as follows: The updated values ​​obtained from the convolution operation are integrated into the temperature-current response matrix. The current-temperature response coefficient of each point is adjusted based on temperature changes, making the current-temperature relationship in that area more accurate. Based on the convolution operation results, the adjusted current mapping relationship is calculated. For example, areas with large temperature fluctuations may require stronger current regulation to ensure stability and accuracy. The updated current and temperature values ​​are stored in the temperature-current response matrix to form a new mapping relationship.

[0100] After the test is complete, all test data (including temperature rise data, current data, and path scan sequences) is summarized and comprehensively analyzed to generate a detailed test results report. This report includes an overview of the temperature rise distribution, hotspot areas, and drive current adjustments throughout the test process; displays the initial and updated temperature-electrical parameter correlation matrix, highlighting the changes in the mapping relationship between current and temperature; calculates the temperature rise rate in each area and identifies areas with abnormal temperature rise; and provides temperature and current error analysis for each test point to evaluate the effectiveness of path optimization and current regulation.

[0101] All test data and generated reports will be stored in the database to support later query and management. After each test is completed, the data and reports will be automatically archived.

[0102] It can be seen that the internal temperature rise test method and system of the display screen lamp panel provided by the present invention can finely divide the lamp panel surface through the test point grid division module, and collect the temperature distribution data and corresponding driving current of each test point to establish a temperature-electrical parameter correlation matrix. The matrix can accurately describe the relationship between temperature changes and currents in different areas, and provide an accurate basis for subsequent dynamic weight allocation; according to the changes in temperature change rate and current demand, the scanning priority of each test point is dynamically adjusted, and an optimized scanning sequence is generated, thereby improving scanning efficiency and detection accuracy. This dynamic adjustment mechanism not only solves the problems of inflexible scanning path and fixed scanning order in traditional methods, but also can automatically adjust the scanning strategy according to real-time temperature changes to ensure that areas with larger temperature changes receive priority attention. More importantly, the system also introduces a closed-loop feedback mechanism through closed-loop feedback regulation and matrix update to adjust the driving current in real time and dynamically correct the scanning path, further optimizing the testing process and avoiding measurement errors and temperature anomaly omissions that may exist in traditional technologies.

[0103] Figure 3 Flowchart of the method for testing the internal temperature rise of a display light panel according to an embodiment of the present invention. Figure 3 As shown, the internal temperature rise test method of the display light board includes: S1, dividing the test point grid, and collecting the initial temperature distribution data and the corresponding driving current of each test point after power is turned on, and establishing a temperature-electrical parameter correlation matrix; S2, based on the temperature-electrical parameter correlation matrix, dynamically assigning weights to the test points and generating an optimized scanning sequence; S3, correcting the driving current in real time through a closed-loop feedback mechanism, and capturing the temperature mutation of the micro-area outside the scanning path, and dynamically inserting the coordinates of the abnormal temperature rise area into the optimized scanning sequence; S4, updating the temperature-electrical parameter correlation matrix according to the real-time temperature rise data and the driving current change; analyzing the various data in the test process and generating a test result report.

[0104] Here, those skilled in the art will appreciate that the specific operations of each step in the above-mentioned display light panel internal temperature rise test method have been described in detail above. Figures 1 to 2 The invention has been introduced in detail in the description of the internal temperature rise test system of the display light board, and therefore, its repeated description will be omitted.

[0105] In summary, the display screen light panel internal temperature rise testing system, based on an embodiment of the present invention, is described. It uses time-series analysis of high-definition images of a patient's puncture site at different time points within a target monitoring period to determine whether the patient's puncture site has signs of infection. This improves the accuracy and timeliness of infection monitoring, facilitates early detection of infection signs, and enables timely action to reduce the incidence and severity of infection.

Claims

1. A display light panel internal temperature rise test system, characterized in that: include: The test point grid division module is used to divide the test point grid and collect the initial temperature distribution data and corresponding drive current of each test point after power is applied, and establish the temperature-electrical parameter correlation matrix; A dynamic weight allocation module, which performs dynamic weight allocation of test points based on the temperature-electrical parameter association matrix and generates an optimized scanning sequence; A closed-loop feedback adjustment module is used to modify the drive current in real time through a closed-loop feedback mechanism, while capturing temperature mutations in micro-regions outside the scanning path and dynamically inserting the coordinates of abnormal temperature rise regions into the optimized scanning sequence; The matrix update and test report generation module is used to update the temperature-electrical parameter correlation matrix based on real-time temperature rise data and drive current changes; analyze various data during the test process and generate a test result report.

2. The display light board internal temperature rise test system according to claim 1, characterized in that: The dynamic weight allocation module includes: A weight allocation unit, used to calculate the initial weight value of each test point based on the temperature change rate and its relationship with the current of the test point; The adjacent test point weight adjustment unit is used to adjust the weights of adjacent areas by taking into account the temperature gradient and heat conduction effect between adjacent test points; The optimized scanning path generating unit is used to generate an optimized scanning sequence based on the aforementioned dynamic weight allocation and the weight association adjustment of adjacent test points.

3. The display light board internal temperature rise test system according to claim 2, characterized in that: The weight distribution unit includes: Calculating the temperature change rate for each test point based on the temperature-electrical parameter correlation matrix; The initial weight value of each test point is adjusted according to the temperature change rate and the current value.

4. The display light board internal temperature rise test system according to claim 3, characterized in that: The adjacent test point weight adjustment unit includes: For each test point and its adjacent points to calculate the temperature gradient influence factor; For each adjacent test point, the sum of the gradient influence factors of all adjacent test points is accumulated; Multiplying the accumulated value by a preset heat conduction compensation coefficient to generate a weight adjustment increment value; The incremental value is added to the initial weight value to generate an adjusted weight value.

5. The display screen light board internal temperature rise test system according to claim 4, characterized in that: The optimized scanning path generating unit includes: After determining the weight of each test point, sort all test points from large to small according to the weight value, and start scanning from the area with the largest weight; Assume that each row or column in the test point grid is a scanning unit, and the scanning path alternates between rows. The specific operation is as follows: Scan along the first row of the matrix, then turn to the next row and scan in the opposite direction; After completing a row of scans, turn to the next row and repeat the above process to form a Z shape; When it is detected that the temperature difference between adjacent test points exceeds a preset threshold, the scanning order is dynamically adjusted.

6. The display light board internal temperature rise testing system according to claim 1, characterized in that: The dynamically inserting the coordinates of the abnormal temperature rise area into the optimized scanning sequence includes: Acquire global and local temperature data of the display panel, focusing on monitoring areas outside the scanning path, and detecting abnormal temperature changes in real time; when the temperature change rate of a test point exceeds the preset maximum tolerance rate, the area where the test point is located is identified as an abnormal temperature rise area; According to the temperature rise rate of the abnormal temperature rise area, all abnormal temperature rise areas are sorted from high to low according to the temperature rise rate, and the abnormal temperature rise areas with high temperature rise rate will be inserted into the scanning path first; For each abnormal temperature rise area detected, the coordinates of the abnormal temperature rise area are inserted into the current path scanning sequence, and the scanning path sequence is adjusted; The updated path sequence is fed back to the dynamic weight allocation module through an interface.

7. The display screen lamp panel internal temperature rise testing system according to claim 6, characterized in that: The dynamically inserting the coordinates of the abnormal temperature rise area into the optimized scanning sequence further includes: Design a dual-threaded parallel processing solution to avoid resource competition between path generation and insertion of abnormal temperature rise areas: The task of thread 1 is to activate each test point in sequence according to the optimization path and record the temperature rise curve data; The optimization path order is dynamically adjusted based on the following: When thread 2 finds an abnormal temperature rise area with a temperature rise rate greater than the set threshold, thread 1 will insert the path of the abnormal temperature rise area into the scan queue and reorder it according to the priority of the inserted area; thread 1's scan path will sort the paths from high to low according to the temperature rise rate and adjust the scanning order; The scanning order after the path adjustment still maintains the scanning form of the Z-shaped structure; Thread 2 is responsible for capturing abnormal temperature rise areas in real time and inserting them into the scanning path. The specific steps are as follows; Based on the real-time collected temperature data, the temperature rise rate of each test point is calculated. If the temperature rise rate is greater than the preset threshold, thread 2 marks the area as an abnormal temperature rise area; All abnormal temperature rise areas are sorted from high to low according to the temperature rise rate, and the areas with the highest temperature rise rate are processed first; Thread 2 calculates the relative position of the abnormal temperature rise area in the original Z-shaped path and inserts it into the scan path queue according to priority; When thread 2 identifies an abnormal temperature rise area, it will seize the execution right of thread 1, give priority to inserting the path of the abnormal temperature rise area and update the scanning order.

8. The display screen lamp panel internal temperature rise testing system according to claim 1, characterized in that: The updated temperature-electrical parameter correlation matrix is ​​dynamically corrected using a convolution operation method.

9. A method for testing the internal temperature rise of a display light panel, characterized in that: include: S1, divide the test points into grids, collect the initial temperature distribution data and corresponding drive current of each test point after power is applied, and establish a temperature-electrical parameter correlation matrix; S2, performing dynamic weight allocation of test points based on the temperature-electrical parameter correlation matrix to generate an optimized scanning sequence; S3, correcting the driving current in real time through a closed-loop feedback mechanism, capturing temperature changes in micro-regions outside the scanning path, and dynamically inserting the coordinates of the abnormal temperature rise region into the optimized scanning sequence; S4, based on the real-time temperature rise data and the driving current change, the temperature-electrical parameter correlation matrix is ​​updated; various data in the test process are analyzed and a test result report is generated.

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